JP3492467B2 - Single-sided circuit board for multilayer printed wiring board, multilayer printed wiring board and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [0001] The present invention relates to a multilayer printed wiring.
Single-sided circuit board for board, and multilayer printed wiring board and its manufacture
Fabrication methods, especially interstitial via holes
Efficient production of multilayer printed wiring boards with a high yield
Single-sided circuit boards for multilayer printed wiring boards that are effective for
And multilayer printed wiring composed of this single-sided circuit board
The board and its manufacturing method are proposed. [0002] 2. Description of the Related Art A conventional multilayer printed wiring board is a copper-clad laminate.
Laminates made by stacking plates and prepregs together and integrating them
It is composed of the body. This laminate has a surface on its surface
It has a wiring pattern and an inner wiring pattern between interlayer insulation layers.
Have. These wiring patterns are
Inner layer wiring through through holes
Between the patterns or between the inner wiring pattern and the surface wiring pattern
The turns are electrically connected. However, a through-hole structure as described above is used.
Multi-layer printed wiring board has a through hole
Need to secure an area for
It is difficult to reduce the size of portable electronic devices,
To fully meet the demands for commercialization of multi-package and MCM
There was a disadvantage that it could not be done. Therefore, recently,
Instead of a multilayer printed wiring board with a through-hole structure
In addition, an interface that can easily respond to the miniaturization and high density of electronic devices
Multi-layer with an axial via hole (IVH) structure
The development of printed wiring boards is underway. [0004] Multilayer printed wiring having this IVH structure
The board connects the conductor layers to the interlayer insulation layers that make up the laminate.
With a conductive via hole
It is a lint wiring board. In other words, this wiring board is
Inter-turn or inner layer wiring pattern and surface wiring pattern
Via holes that do not penetrate the wiring board (very
Via or via blind holes)
Are electrically connected. Therefore, the IVH structure
Multilayer printed wiring boards are used to form through holes.
There is no need to provide a special area, and the size and height of electronic equipment can be reduced.
Densification can be easily achieved. [0005] A multilayer printed wiring board having such an IVH structure
Regarding, for example, the 9th Circuit Packaging Conference Conference Proceedings
On page 57 of (March 2, 1995), all-layer IVH structure
Proposal on Development of Multilayer Printed Wiring Board with
Have been. The proposed multilayer printed wiring board is
High-speed micro via hole processing technology using laser
Composite material of aramid nonwoven fabric and epoxy resin
Adoption of conductive paste, interlayer connection technology,
It has been developed based on
(See FIG. 1). First, an aramid nonwoven fabric is used as a prepreg.
This prepreg is made of a material impregnated with epoxy resin.
Perforated by carbon dioxide laser, and thenThis
LikeFill the obtained hole with conductive paste
(See FIG. 1 (a)). Next, copper on both sides of the prepreg
The foils are stacked and heated and pressed by a hot press. This
Prepreg epoxy resin and conductive paste
After curing, the copper foils on both sides are electrically connected (Fig. 1
(b)). Then, the copper foil is patterned by etching.
By turning, both hard holes with via holes
A surface substrate is obtained (see FIG. 1 (c)). [0007] The double-sided substrate thus obtained is used as a core layer.
As a multilayer. Specifically, on both sides of the core layer,
A prepreg filled with the above conductive paste and a copper foil
Laminating sequentially while aligning and hot pressing again
Then, a four-layer substrate is obtained by etching the uppermost copper foil.
(See FIGS. 1 (d) and 1 (e)). If you want more layers,
The above steps are repeated to obtain a six-layer or eight-layer substrate. The IV according to the prior art as described above
H-structure multilayer printed wiring board is heated by hot press,
Pressing process and patterning process of copper foil by etching
Must be repeated many times, complicating the manufacturing process
However, there is a disadvantage that it takes a long time to manufacture. Only
Also, the IVH structure obtained by such a manufacturing method
Multilayer printed wiring boards produce poor copper foil patterning
Because it is difficult to correct it during the manufacturing process, one
In some places (even in one step), the patterning failure occurs
Then, the entire wiring board as a final product becomes defective. Toes
In the conventional manufacturing process, one of the lamination steps
If a defective product is put out in a place, it can be replaced by another good lamination process.
Must be disposed of to improve production efficiency or production yield.
There was a fatal drawback that deterioration was likely to occur. On the other hand, the inventor has previously described the IVH structure.
To efficiently manufacture multilayer printed wiring boards with high yield
-Sided circuit board for multilayer printed wiring board effectively used for
As opposed to the insulating hard substrate, one side of this substrate
Conductive circuit and adhesive layer on the other side
And the substrate and the adhesive layer
A hole penetrating these layers and making contact with the conductor is
With a via hole filled with
To propose a single-sided circuit board for multilayer printed wiring boards
As a multi-layer printed wiring board with an H structure,
At least one of the pneumatically connected circuit boards,
Providing a multilayer printed wiring board composed of the single-sided circuit board
I thought. Then, an IVH structure is formed using the single-sided circuit board.
As a method of manufacturing a multilayer printed wiring board, . Etching the metal foil stuck on one side of the insulating hard substrate
Forming a conductor circuit by performing . Opposite to the conductor circuit formed on one side of the board
Forming an adhesive layer on the surface of the . Conductor penetrating the insulating hard substrate and the adhesive layer
Hole, and fill this hole with conductive paste.
Manufacturing a single-sided circuit board, . Overlap two or more single-sided circuit boards or
Superimposed with a circuit board, and then the
By using the adhesive layer, one press molding
Multi-layer integration process,
A manufacturing method of layer printed wiring board was proposed. The single-sided circuit board according to this proposal has an insulating property.
Positioning the through hole of the hard substrate and the through hole of the adhesive layer
Difficult, usually on the opposite side of the conductor circuit
After forming an adhesive layer on the surface of the insulating hard substrate of
Drilling of the board and adhesive layer at the same time to make a hole in contact with the conductor
Formed and filled with conductive paste in these holes.
Manufactured. However, the conductive paper filled in the hole is
In order to clean the conductor circuit surface that the strike contacts,
When the circuit board is desmeared, the uncured adhesive layer
However, there is a new problem that erosion is also easily caused. [0012] The present invention is based on the prior art.
This was done to solve the above problem.
The main purpose of this is to cause defects due to desmear processing
And high yield of multilayer printed wiring board with IVH structure
Multi-layer print layout effectively used for efficient manufacturing
A single-sided circuit board for a wire plate is manufactured in advance, and the single-sided circuit board is
High pressure by laminating and integrating by one press molding
Multi-layer pudding with IVH structure with high positional accuracy and good flatness
Propose a method for efficiently manufacturing wiring boards with high yield.
It is to be. [0013] SUMMARY OF THE INVENTION The inventor has set forth the above object.
As a result of intensive research to achieve
The invention, which has a gist configuration as its contents, has been completed. Sand
Chi (1) Efficient multi-layer printed wiring board with IVH structure with high yield
Multilayer printed wiring effectively used for efficient production
The present invention, as a single-sided circuit board for a board,Single-sided copper-clad laminate
When a conductor circuit is provided on one surface of an insulating hard substrate made of
In both cases, an adhesive layer covering this conductor circuit was provided,
On the other side of the board, penetrate the board and
And a hole that is closed at one end
Filling with a conductive paste protruding from the surface of the substrate
Via holeA multilayer press characterized by having
To provide a single-sided circuit board for a printed wiring board,
Body circuit is formed by etching copper foil of single-sided copper-clad laminate
It is desirable that it be done. (2) A multilayer printed wiring board having an IVH structure
In the present invention, the laminated material of the circuit board is an interstitial
They must not be electrically connected to each other via via holes.
Excluding the core substrate in multilayer printed wiring boards
At least one of the inner circuit boards is described in (1) above.
Characterized by comprising a single-sided circuit board
Provide a layer printed wiring board. (3) Using the single-sided circuit board described in (1) above
Efficient multi-layer printed wiring board with IVH structure at high yield
The present invention provides . One side of insulated rigid substrate made of single-sided copper-clad laminate
Conductor circuit by etching the copper foil attached to
Forming, . From the other surface of the insulating hard substrate, penetrate the substrate
Through the hole that is in contact with the conductor circuit and that is closed at one end.Les
By laser irradiationFormingFor conductor circuits at the bottom of holesDesmear treatment
After that, a conductive paste is filled into the holes on the surface of the substrate.
Filling in a protruding stateTo form via holesWork
About . An adhesive layer is formed on the conductive circuit forming surface of the insulating hard substrate.
Providing a single-sided circuit board, . One or more single-sided circuit boards weigh one or more
Laminate or overlap with other circuit boards, then
Utilizing the adhesive layer provided on the single-sided circuit board
Therefore, the process of integrating into multiple layers by one press molding
Manufacturing a multilayer printed wiring board characterized by passing through
Suggest a method. [0016] DETAILED DESCRIPTION OF THE INVENTION A first embodiment of the present invention
Many IVH structures can be used without incurring the
To efficiently produce multilayer printed wiring boards with high yield
To provide single-sided circuit boards for multilayer printed wiring boards required for
That is. That is,Used in the production method of the present inventionMany
Single-sided circuit boards for printed wiring boards
On the other hand, a conductor circuit is provided on one side of this board.
Is provided with an adhesive layer covering the conductor circuit,
On the other side of, penetrate the board and contact the conductor circuit,
In addition, a hole with one end closed is provided.
And filling it in a state protruding from the surface of the substrate.
The via holes are formed. Here, in the present invention, the single-sided circuit board is
The adhesive layer to be formed is a multilayer printed circuit having an IVH structure.
In manufacturing the wire plate, the single-sided circuit boards are
Or when bonding with other circuit boards to be laminated to form multiple layers
It plays the role of bonding. In the present invention, a single-sided circuit board is formed.
The conductor circuit comprises a multilayer printed wiring board having an IVH structure.
Surface wiring pattern or inner layer wiring pattern
You. Such a conductor circuit is attached to one side of an insulating hard substrate.
Formed by etching the attached metal foil,
Preferably, copper foil is not formed on one side of the insulating hard substrate.
By etching the copper foil of the single-sided copper-clad laminate
It is formed. In the present invention, a single-sided circuit board is formed.
The via hole is a multilayer printed wiring board having an IVH structure.
In manufacturing the conductor circuit of the single-sided circuit board,
Electrical connection with conductive circuits on other circuit boards to be laminated
Play a role. That is, through the insulating hard substrate from one side
Through the hole that reaches the conductor circuit through the board surface
A conductive paste filled so as to protrude from the substrate surface
However, heat and conductive circuits on other circuit boards
Adhesion by curing, electrically connecting each conductor circuit
You do it. In particular, the single-sided circuit boards are
When bonding with other circuit boards to be laminated to form a multilayer,
In order to improve the adhesion strength of the laminate and the connection reliability,
The adhesive layer provided on the conductor circuit forming surface of the surface circuit board
Adhesive coated on the surface of insulating hard substrate including circuit part
On the other hand, the conductive paper of the single-sided circuit board
The conductor is covered on the conductive circuit part of the other circuit board to be connected.
Be able to break through the overlying adhesive layer and make surface contact
The hole must be filled in such a way that it protrudes from the board surface.
desirable. If this conductive paste protrudes from the substrate surface
The height of the adhesive layer formed on the conductor circuit portion.
Is desirably 0.5 to 5 μm larger than the film thickness. A single-sided circuit according to the configuration described above
By using a substrate, a multilayer printed wiring board with an IVH structure
It can be manufactured efficiently at a high yield. less than,
A multilayer printed wiring board is manufactured using the single-sided circuit board.
The method of the present invention will be described. That is, the method of the present invention
Each of the above steps, . One side of insulated rigid substrate made of single-sided copper-clad laminate
Conductor circuit by etching the copper foil attached to
Forming, . From the other surface of the insulating hard substrate, penetrate the substrate
Through the hole that is in contact with the conductor circuit and that is closed at one end.Les
By laser irradiationFormingFor conductor circuits at the bottom of holesDesmear treatment
After that, a conductive paste is filled into the holes on the surface of the substrate.
Filling in a protruding stateTo form via holesWork
About . An adhesive layer is formed on the conductive circuit forming surface of the insulating hard substrate.
Providing a single-sided circuit board, . One or more single-sided circuit boards weigh one or more
Laminate or overlap with other circuit boards, then
Utilizing the adhesive layer provided on the single-sided circuit board
Therefore, the process of integrating into multiple layers by one press molding
It is characterized by passing through. The multilayer printed wiring board according to the present invention
The manufacturing method consists of forming holes for via holes and then removing
This is particularly advantageous when a smear treatment is performed. That
Is the surface on the opposite side of the conductive circuit from the insulating hard substrate
Provided with an adhesive layer, and the substrate and the adhesive layer
Make a hole that penetrates and contacts the conductor circuit and apply conductive paste.
In the previous proposal of forming via holes by filling
In such a configuration, the connection reliability of the via hole is improved.
Removes the smear to remove uncured adhesive
The adhesive layer is damaged and cannot function as an adhesive layer
There was a problem. In this regard, according to the present invention, the adhesive
The layer is provided on the same side as the conductor circuit with respect to the substrate,
Forming via holes before forming the adhesive layer
To solve the above-mentioned problems caused by desmear processing.
A stable single-sided circuit board with excellent connection reliability
This is because it can be provided. Note that the adhesive layer
Even with a configuration provided on the opposite side of the body circuit, an adhesive layer is formed
Via holes can be formed before. But ba
Effective in that it is difficult to drill the adhesive layer to fit the ear holes
Disadvantage, not a rational method. According to the method of the present invention, the predetermined wiring
Single-sided circuit boards with patterned conductor circuits are expected
Since it is manufactured individually, in addition to the above effects,
Before laminating the board for defects such as conductive circuits
Can be confirmed. As a result, during the lamination stage,
Only a single-sided circuit board having no good parts will be used. Subordinate
Therefore, according to the method of the present invention, a defect occurs at the manufacturing stage.
Less, and a multilayer printed wiring board with an IVH structure
It can be manufactured with a high yield. Further, the multilayer printed wiring according to the present invention
According to the plate manufacturing method, prepregs are stacked and heated
It is not necessary to repeat the process of
A) Overlap one or more circuit boards or
Laminated together, the adhesive layer provided on the single-sided circuit board
By using it, the lamination
Can be embodied. In addition, the multilayer press according to the present invention
Lint wiring boards are used except for the process of drilling via holes.
Manufactured in the same manner as subtractive mass-produced substrates
Can be. That is, according to the method of the present invention, the IVH structure
Shorten the multilayer printed wiring board without repeating complicated processes
It can be manufactured efficiently in a short time. Here, in the method of the present invention, the metal foil is etched.
It is metal that forms a conductive circuit by
According to the etching of the foil, a very thin conductor circuit pattern,
This is because it can be formed with a uniform thickness and high density.
You. In the method of the present invention, the insulating hard substrate is penetrated.
The above hole that contacts the conductor through is formed by laser irradiation
It is desirable to do. The reason is that the single-sided circuit board
Holes for forming holes should be as small as possible.
It is advantageous to form at high density,
Small holes can be easily and
This is because they can be formed at a high density. Also laser
The drilling process by
Can make holes through insulating hard substrates
You. As a result, it penetrates through the prepreg substrate as in the prior art.
One end is closed by a conductor circuit instead of a hole to make
Hole is formed in the hole, and a conductive pace
Filling the via holes and conductive circuits
Because of the contact, reliable conduction is obtained. In the method of the present invention, desmearing is performed
Remove resin residue remaining on the conductor circuit surface at the bottom of the ear hole
For example, with potassium permanganate solution, chromic acid and
This is a process of dipping in a mixed solution of sulfuric acid. According to the present invention
If the desmear treatment is performed before forming the adhesive layer,
To the earlier proposal that the adhesive layer in the cured state is easily melted
It does not lead to the problems with such technology. In the present invention, the core substrate is a conventional substrate.
Known products can be used, and the manufacturing method is particularly limited.
It is not specified. In the present invention, the outermost layer
It is not necessary to form an adhesive layer on the circuit board. According to the present invention thus manufactured,
The multilayer printed wiring board of the IVH structure is a laminated material of a circuit board.
Are electrically connected via an IVH, respectively.
In the multilayer printed wiring board of
At least one layer of the circuit board is a single-sided circuit board of the present invention.
It is characterized by being constituted by a plate. Here, the multilayer printed wiring board of the present invention is constructed.
A single-sided circuit board is formed on another circuit board via an adhesive layer.
And is glued. As such other circuit boards,
Single-sided circuit board of the present invention and conventionally known printed wiring board
Can be used. The multilayer printed wiring board of the present invention
Various types of processing commonly performed on lint wiring boards
For example, formation of solder resist on the surface, surface wiring
Nickel / gold plating, soldering and drilling on patterns
Processing, cavity processing, through-hole plating, etc.
Can be applied. Also, the multilayer printed wiring board of the present invention
Means electronic components such as IC packages, bare chips, chip components, etc.
Used to mount components. [0032] FIG. 2 shows a multilayer pudding according to an embodiment of the present invention.
It is a longitudinal cross-sectional view of a wiring board. In this figure,
The printed wiring board 1 is composed of insulating hard substrates 2a and 2b and
Conductor formed by etching metal foil attached to one side
Circuits 3a and 3b and adhesive layer 4 provided on the conductor circuit forming surface
a, 4b, and penetrate through the insulating hard substrates 2a, 2b.
Holes in contact with body circuits 3a and 3b are filled with conductive paste 5
-Sided circuit boards 7a, 7b having via holes 6a, 6b
Are laminated on both sides of the core substrate 8, respectively, and further bonded.
The single-sided circuit boards 7c and 7d without the agent layer
An adhesive layer provided on the core substrate 8 and the piece
According to the adhesive layers 4a and 4b provided on the surface circuit boards 7a and 7b, respectively.
Thus, it is a four-layer substrate bonded to each other. Here, the conductor circuit 3a and the conductor circuit 3a of the single-sided circuit board 7a
The conductor circuit 3b of the single-sided circuit board 7b is
It is formed in a pattern shape and is applied to the multilayer printed wiring board 1.
Inner layer wiring pattern on the upper surface or the lower surface of the core substrate 8
Are arranged as Also, the conductor circuit of the single-sided circuit board 7c
Path 3c and the conductor circuit 3d of the single-sided circuit board 7d
Formed in a fixed wiring pattern shape, multilayer printed wiring board
1 as a surface wiring pattern on the upper or lower surface
Be placed. Further, the core substrate 8 is made of, for example, an insulating hard disk.
After making a through hole in the porous substrate and filling the conductive paste 5
Then, it is obtained by forming the conductor circuit 3e on both sides.
The conductor circuits 3a, 3b, 3c, 3d are made of, for example, an insulating hard disk.
One side formed with copper foil on one side of the quality substrate 2a, 2b, 2c, 2d
Formed by etching the copper foil of the copper clad laminate
Are preferred. The via holes 6a and 6b are made of insulating hard material.
It is formed to penetrate the substrates 2a and 2b in the thickness direction,
Aholes 6c and 6d are used to connect insulating hard substrates 2b and 2d in the thickness direction.
And the conductive paste 5
Is filled. Of these via holes, 6a is the inner layer
Electrical connection between conductor circuits 3a and 3e as a line pattern
Buried via hole, and via hole 6b
Electrical connection between conductor circuits 3b and 3e as layer wiring pattern
Bleed via hole to connect, via hole 6c
Indicates the conductor circuit 3c as the surface wiring pattern and the inner layer wiring pattern.
Blind bar that electrically connects between 3a
It is an ear hole, and the via hole 6d is a surface wiring pattern
Of the conductor circuit 3d as the inner layer wiring pattern 3b
It is a blind via hole that electrically connects between,
Each of them constitutes an interstitial via hole. The above-mentioned insulating hard substrates 2a, 2b, 2c, 2d, 2e
As, for example, glass cloth epoxy resin or glass non-woven
Epoxy resin cloth, bismaleimide triazine glass cloth
Fat, aramid nonwoven epoxy resin, etc. cured into a plate
A substrate can be used. The above-mentioned adhesive layers 4a, 4b and 4e are, for example,
For example, epoxy type, polyimide type, bismaleimide tria
Resin bonding of gin, acrylate, phenol, etc.
Agent. As the conductive paste, for example,
Use conductive paste such as copper, silver, gold, carbon, etc.
Can be. The multilayer printed wiring board of the present invention can
Child parts can be mounted, for example, as shown in FIG.
As shown by, chips such as IC packages and bare chips
The component 9 is mounted on a predetermined portion of the surface wiring pattern 3c, and
It can be fixed with 10. Next, according to the embodiment of the present invention shown in FIG.
A method for manufacturing a multilayer printed wiring board will be described. (1) First, the present invention constituting the multilayer printed wiring board 1 of FIG.
A light single-sided circuit board 7a (17a) is manufactured. Specifics below
Next, a description will be given with reference to FIG. . A metal foil 13 as shown in FIG.
An insulative hard substrate 12a is prepared. This metal foil 13 is on one side
As the attached insulating hard substrate 12a, for example, one side
It is advantageous to use copper-clad laminates. . Next, the metal foil 13 is etched, as shown in FIG.
In such a manner, it is processed into a predetermined pattern shape. This
The conductor circuit 13a is formed. Note that the etching method
For this purpose, known general means can be employed. This
Conductor circuit 13a is arranged as an inner layer wiring pattern.
But to improve the adhesion between layers,
For example, micro-etching or roughening
Surface roughening using known means such as the application of copper foil with double-sided roughening
It is advantageous to do so. . Next, as shown in FIG.
A hole 16 that penetrates the conductor in the thickness direction and contacts the conductor is formed.
Desmear processing to clean the conductive circuit surface 18 at the bottom of the
Apply. The hole 16 is used for forming the conductor of the insulating hard substrate 12a.
Formed by irradiating a laser from the side opposite to the surface
Is preferred. A drilling machine that irradiates this laser
For example, a pulse oscillation type carbon dioxide laser machine
Can be used. Such carbon dioxide laser processing
By using a machine tool, a hole with a small diameter of 60 to 200 μmφ can be formed.
It can be formed with high precision. As a result,
Can be formed at high density, compact and high density
A multilayer printed wiring board can be manufactured. This
According to the drilling method of irradiating laser,
Part of the insulating hard substrate 12a without damaging the path 13a
Can be drilled in the hole 16
Indicates that only the side on which the conductor circuit 13a is not formed is open, and the other end is a conductor.
Closed by a circuit. This allows
And the conductor circuit 13a can be securely connected electrically.
it can. Note that the desmear treatment is performed by using the conductor
By completely removing the resin residue remaining in
Electrical connection between body circuit and conductive paste
For the purpose, for example, potassium permanganate solution,
Immersion in a mixture of humic and sulfuric acids
You. . Next, the contact formed on the conductor circuit portion of the other substrate
The hole 16 is inserted so that the surface of the adhesive layer
Then, as shown in FIG.
The conductive paste 5 is filled. Filling of this conductive paste 5
As a filling method, for example, a screen using a metal mask
Printing method can be adopted. When filling,
Protection around hole 16 to form holes with high precision
It is advantageous to form a mask. Protective mask
Laminates film or paper on the insulating hard substrate 12a
By drilling together during drilling,
Can be achieved. In particular, conductive paste
Connectivity with the conductor circuit that forms the inner layer of other circuit boards
Project through hole 16 to achieve a good via hole
It is advantageous to fill it in a state where it is not. In addition,
The conductive paste is used to improve the workability of subsequent processes.
It is advantageous to cure and the protective mask is
Peeled off. . Next, the conductor circuit 13a is formed on the insulating hard substrate 12a.
An adhesive layer 14a is formed on the surface as shown in FIG.
A single-sided circuit board 17a is manufactured. This adhesive layer 14a is
Apply a fixed resin adhesive to a roll coater, curtain coater,
Apply by means of a recoater, screen printing, etc.
Cure. At this time, the thickness of the adhesive layer
On the circuit, a range of 1 to 15 μm is advantageous. (2) In the same process, the insulating hard substrate 12b
On the other hand, the conductor circuit 13b and the adhesive
Layers 14b, respectively, and the insulating hard base
A conductive paste is provided by providing a hole 16 that penetrates the board and contacts the conductor.
As shown in FIG. 4, a via hole filled with No. 5 was formed.
A single-sided circuit board 17b is manufactured. (3) Similarly, the insulating hard substrates 12c, 12c
d, conductor circuits 13c and 13d are provided on one surface of this substrate.
And penetrates through the insulating hard substrate.
A hole filled with conductive paste 5 by providing a hole 16 in contact with the body
Single-sided circuit board as shown in FIG.
17c and 17d are manufactured. (4) Further, a laser is applied to the insulating hard substrate 12e.
Drill through holes by machining or drilling
After filling the paste 5, the conductor circuits 13e are formed on both sides.
Then, the core substrate 8 is manufactured by forming the adhesive layer 14e. (5) Next, the single-sided circuit boards 17a, 17
b, 17c, 17d and the core substrate 8 in a predetermined order,
Guide holes provided around circuit board and core board
And superimposition while using guide pins
You. (6) In this manner, each single-sided circuit board is
After superimposing on the substrate, using a hot press
By heating and pressing in the temperature range of ℃, each single-sided circuit
Substrate and core substrate are integrated into a multilayer by one press molding
Is done. Note that a vacuum hot press is used as the hot press.
It is advantageous to do so. In this step, the adhesive layer 14a,
Each single-sided circuit board 17 superimposed via 14b, 14e
a, 17b, 17c, 17d and the core substrate 8
a, 14b, and 14e adhere to each other and thermoset to form a multilayer
Integrated into a shape. At the same time, the conductive paste 5
By being in close contact with the corresponding conductor circuit and thermosetting,
Via holes are formed, and multilayer printed wiring board 1 is obtained.
You. [Other Embodiments] (1) In the above embodiment, the four-layer single-sided circuit board is used as the core board.
Explained superimposed multilayer printed wiring board
However, the same applies to the case of three or five or more layers.
Can be implemented, and a one-sided
Board, double-sided printed board, double-sided through-hole printing
Single-sided circuit board of the present invention on a substrate or multilayer printed circuit board
Can be laminated to produce multilayer printed wiring boards
You. (2) In the above embodiment, holes for forming via holes
Opening was performed by means of laser irradiation.
It is also possible to apply mechanical means such as
Wear. (3) In the multilayer printed wiring board of the present invention, the surface wiring
The pattern is a pad shape for mounting chip electronic components
It can also be formed only. [0046] As described above, the multilayer according to the present invention is
According to single-sided circuit board for printed wiring board, desmear processing
Can be performed in a single press
By integrating them in layers, a high
Efficient production of high-density multilayer printed wiring boards with high yield
can do. Further, the multilayer print distribution according to the present invention is provided.
According to the method of manufacturing a wire plate, only a single-sided circuit board without a defect
Are bonded by the adhesive layer of the substrate.
So, a complicated manufacturing method with many repetitive processes like the conventional technology
Has an IVH structure efficiently at high yield without taking
Can produce high density multilayer printed wiring boards.
You. Further, the multilayer printed wiring board according to the present invention is characterized in that
Circuit board is bonded by an adhesive layer
High density multilayer printed wiring board having IVH structure
As a complex product with many repetitive processes
It can be easily provided without depending on the law.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a longitudinal sectional view showing one manufacturing process of a multilayer printed wiring board according to a conventional technique. FIG. 2 is a longitudinal sectional view showing one embodiment of the multilayer printed wiring board according to the present invention. FIG. 3 is a longitudinal sectional view illustrating an example of a manufacturing process of a single-sided circuit board used for manufacturing the multilayer printed wiring board. FIG. 4 is a longitudinal sectional view showing an example of a process of assembling a single-sided circuit board when manufacturing the multilayer printed wiring board. [Description of Signs] 1 Multilayer printed wiring board 2a, 2b, 2c, 2d, 2e Insulating hard substrate 3a, 3b, 3c, 3d, 3e Conductive circuit 4a, 4b, 4e Adhesive layer 5 Conductive paste 6a, 6b, 6c, 6d, 6e Via holes 7a, 7b, 7c, 7d Single-sided circuit board 8 Core board 9 Chip component 10 Solder 12a, 12b, 12c, 12d, 12e Insulating hard board 13 Metal foil 13a, 13b, 13c, 13d, 13e Conductor circuits 14a, 14b, 14e Adhesive layer 16 Holes 17a, 17b, 17c, 17d Single-sided circuit board 18 Conductor circuit surface at bottom of hole

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 3/46 H05K 3/40 H05K 1/11

Claims (1)

(57) [Claims] [Claim 1]. Forming a conductive circuit by etching a copper foil adhered to one surface of an insulating hard substrate made of a single-sided copper-clad laminate; From the other surface of the insulative hard substrate, penetrate the substrate and contact the conductor circuit, and form a hole having one end closed by laser irradiation ,
Forming a via hole by subjecting the conductor circuit at the bottom of the hole to desmearing and filling the hole with a conductive paste so as to protrude from the surface of the substrate; Forming a single-sided circuit board by providing an adhesive layer on the conductive circuit forming surface of the insulating hard board; By laminating one or more of the single-sided circuit boards on the core board or with another circuit board, and then using the adhesive layer provided on the single-sided circuit board, a single-layer circuit board can be formed in a single press molding to form a multilayer. A method for manufacturing a multilayer printed wiring board, comprising: