JP3460669B2 - Multilayer ceramic electronic components - Google Patents
Multilayer ceramic electronic componentsInfo
- Publication number
- JP3460669B2 JP3460669B2 JP2000091808A JP2000091808A JP3460669B2 JP 3460669 B2 JP3460669 B2 JP 3460669B2 JP 2000091808 A JP2000091808 A JP 2000091808A JP 2000091808 A JP2000091808 A JP 2000091808A JP 3460669 B2 JP3460669 B2 JP 3460669B2
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- JP
- Japan
- Prior art keywords
- sintered body
- ceramic sintered
- conductive paste
- ceramic
- external electrode
- Prior art date
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、積層コンデンサな
どの積層セラミック電子部品に関し、特に、導電ペース
トの塗布・焼付けにより形成された外部電極を有する積
層セラミック電子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a monolithic ceramic electronic component such as a monolithic capacitor, and more particularly to a monolithic ceramic electronic component having external electrodes formed by applying and baking a conductive paste.
【０００２】[0002]
【従来の技術】従来、積層コンデンサなどのセラミック
電子部品では、セラミック焼結体の外表面に金属粉末及
びガラスフリットを含有する導電ペーストを塗布し、焼
き付けることにより外部電極が形成されている。このセ
ラミック焼結体は、通常、直方体状の形状を有する。他
方、プリント回路基板などに表面実装するために、上記
外部電極は、セラミック焼結体の端面だけでなく、上
面、下面及び一対の側面に至るように形成される。とこ
ろが、導電ペーストを塗布した場合、端面と、上面、下
面及び一対の側面とのなすエッジ部において、導電ペー
ストの厚みが薄くなり、プリント回路基板に実装される
部分、すなわち下面上の導電ペーストと、端面上に付与
されている導電ペーストとの間で断線が生じがちである
という問題があった。2. Description of the Related Art Conventionally, in a ceramic electronic component such as a multilayer capacitor, an external electrode is formed by applying a conductive paste containing a metal powder and a glass frit to the outer surface of a ceramic sintered body and baking it. This ceramic sintered body usually has a rectangular parallelepiped shape. On the other hand, for surface mounting on a printed circuit board or the like, the external electrodes are formed not only on the end faces of the ceramic sintered body but also on the upper face, the lower face and a pair of side faces. However, when the conductive paste is applied, the thickness of the conductive paste becomes thin at the edge portion formed by the end face and the upper surface, the lower surface and the pair of side surfaces, and the portion mounted on the printed circuit board, that is, the conductive paste on the lower surface. However, there is a problem that disconnection tends to occur between the conductive paste applied on the end face.
【０００３】そして、外部電極の断線を防止するため
に、従来、導電ペーストを、セラミック焼結体の端面か
ら付与するに際し、端面上に付与される導電ペーストの
膜厚を制御することにより、コーナー部分にも確実に導
電ペーストが付与され、断線を防止するように試みられ
ていた。しかしながら、端面上の導電ペーストの膜厚を
制御するだけでは、断線を確実に防止することはできな
かった。In order to prevent the disconnection of the external electrodes, conventionally, when the conductive paste is applied from the end surface of the ceramic sintered body, the film thickness of the conductive paste applied on the end surface is controlled to control the corners. The conductive paste was surely applied to the portion as well, and attempts were made to prevent disconnection. However, disconnection could not be reliably prevented only by controlling the film thickness of the conductive paste on the end face.
【０００４】そこで、従来、図２に示すように、積層コ
ンデンサ５１のセラミック焼結体５２において、端面５
２ａと、上面５２ｂ及び下面５２ｃとのなすエッジ部を
丸めるように加工が施されていた。なお、この加工は、
セラミック焼結体５２をバレル研磨することにより行わ
れている。Therefore, conventionally, in the ceramic sintered body 52 of the multilayer capacitor 51, as shown in FIG.
Processing was performed so that the edge portion formed by 2a and the upper surface 52b and the lower surface 52c was rounded. In addition, this processing is
This is performed by barrel-polishing the ceramic sintered body 52.
【０００５】上記のように、セラミック焼結体５２の端
面５２ａのエッジ部が丸められることにより、導電ペー
ストを塗布し、焼き付けてなる外部電極５３の断線が抑
制される。すなわち、外部電極５３の端面５２ａ上の部
分と、下面５２ｃ上の電極延長部５３ａとの間の断線が
生じ難くされている。As described above, by rounding the edge portion of the end surface 52a of the ceramic sintered body 52, disconnection of the external electrode 53 formed by applying and baking the conductive paste is suppressed. That is, disconnection between the portion on the end surface 52a of the external electrode 53 and the electrode extension 53a on the lower surface 52c is hard to occur.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、近年、
積層コンデンサなどの積層セラミック電子部品では小型
化が進んでいる。小型化が進むにつれて、溶融半田等に
よりプリント回路基板に実装される場合、半田の表面張
力によりセラミック電子部品が立ち上がるという現象、
すなわちツームストーン現象が生じがちとなっている。However, in recent years,
Miniaturization is progressing in multilayer ceramic electronic components such as multilayer capacitors. As miniaturization progresses, when it is mounted on a printed circuit board with molten solder, etc., the surface tension of the solder causes the ceramic electronic component to start up,
That is, the tombstone phenomenon tends to occur.
【０００７】他方、外部電極の連続性を確保するため
に、上記のようにエッジ部を丸めた場合、外部電極５３
の外表面もセラミック焼結体５２のエッジ部で丸みを帯
びるため、ツームストーン現象がより一層生じ易くなる
という問題があった。On the other hand, in order to secure the continuity of the external electrode, when the edge portion is rounded as described above, the external electrode 53
Since the outer surface of the ceramic is also rounded at the edge portion of the ceramic sintered body 52, there is a problem that the tombstone phenomenon is more likely to occur.
【０００８】また、上記のように、端面の導電ペースト
の膜厚を制御することにより、エッジ部における外部電
極の連続性を確保する方法では、エッジ部における断線
を防止することは困難であった。Further, as described above, it is difficult to prevent disconnection at the edge portion by the method of ensuring the continuity of the external electrode at the edge portion by controlling the film thickness of the conductive paste on the end face. .
【０００９】本発明の目的は、従来技術の欠点を解消
し、導電ペーストを塗布し、焼き付けてなる外部電極を
有する積層セラミック電子部品において、外部電極のエ
ッジ部における断線をより確実に防止し、かつツームス
トーン現象の発生を抑制し得る、信頼性に優れた積層セ
ラミック電子部品を提供することにある。The object of the present invention is to solve the drawbacks of the prior art, to more reliably prevent disconnection at the edge portion of the external electrode in a laminated ceramic electronic component having the external electrode formed by applying and baking a conductive paste, Another object of the present invention is to provide a highly reliable laminated ceramic electronic component capable of suppressing the occurrence of the tombstone phenomenon.
【００１０】[0010]
【課題を解決するための手段】本発明に係る積層セラミ
ック電子部品は、上面、下面、一対の側面及び一対の端
面を有するセラミック焼結体と、前記セラミック焼結体
内に形成されており、前記セラミック焼結体の一方の端
面に引き出された内部電極と、Ｃｕ粉末と、Ｂ−Ｓｉ−
Ｚｎ系またはＢａ−Ｓｉ−Ｂ系ガラスフリットとを含む
導電ペーストの塗布・焼付けにより形成されており、か
つセラミック焼結体の一方の端面を覆い、かつ上面、一
対の側面及び下面に至る電極延長部を有する外部電極と
を備え、前記セラミック焼結体の端面の外周のエッジ部
の曲率半径Ｒが３０〜７０μｍとなるように丸められて
おり、前記外部電極を構成している導電ペースト中のガ
ラスフリットの平均粒径が、前記曲率半径の５．７％未
満であることを特徴とする。A monolithic ceramic electronic component according to the present invention includes a ceramic sintered body having an upper surface, a lower surface, a pair of side surfaces and a pair of end surfaces, and the ceramic sintered body. An internal electrode drawn out to one end surface of the ceramic sintered body, Cu powder, B-Si-
It is formed by applying and baking a conductive paste containing a Zn-based or Ba-Si-B-based glass frit , covers one end surface of the ceramic sintered body, and has an upper surface, a pair of side surfaces and a lower surface. And an external electrode having an electrode extension portion extending to the outer peripheral edge portion of the end surface of the ceramic sintered body.
The radius of curvature R of which is rounded so that 30 to 70 .mu.m, the average particle diameter of the glass frit in the conductive paste constituting the external electrodes is less than 5.7% of the radius of curvature Characterize.
【００１１】本発明の特定の局面では、前記セラミック
焼結体内に、複数の内部電極がセラミック焼結体層を介
して重なり合うように配置されており、前記複数の内部
電極がセラミック焼結体のいずれかの端面に引き出され
ており、前記一対の端面のそれぞれを覆うように第１，
第２の外部電極がそれぞれ形成されており、それによっ
て積層コンデンサが構成されている。In a particular aspect of the present invention, a plurality of internal electrodes are arranged in the ceramic sintered body so as to overlap with each other with a ceramic sintered body layer interposed therebetween, and the plurality of internal electrodes are made of a ceramic sintered body. It is drawn out to one of the end faces, and the first and
Second external electrodes are respectively formed, and thereby a multilayer capacitor is formed.
【００１２】[0012]
【発明の実施の形態】以下、図面を参照しつつ、本発明
に係る積層セラミック電子部品の具体的な実施例を説明
する。BEST MODE FOR CARRYING OUT THE INVENTION Specific embodiments of the laminated ceramic electronic component according to the present invention will be described below with reference to the drawings.
【００１３】本実施例では、図１に示す積層コンデンサ
１を作製した。積層コンデンサ１は、直方体状のセラミ
ック焼結体２と、セラミック焼結体２内に形成された内
部電極３ａ〜３ｆと、外部電極４，５とを有する。セラ
ミック焼結体２は、適宜の誘電体セラミックスにより構
成されるが、本実施例では、チタン酸バリウムにより構
成されている。In this example, the multilayer capacitor 1 shown in FIG. 1 was produced. The multilayer capacitor 1 has a rectangular parallelepiped ceramic sintered body 2, internal electrodes 3 a to 3 f formed in the ceramic sintered body 2, and external electrodes 4 and 5. The ceramic sintered body 2 is made of an appropriate dielectric ceramic, but in the present embodiment, it is made of barium titanate.
【００１４】内部電極３ａ〜３ｆは、セラミック焼結体
２内において、セラミック焼結体層を介して厚み方向に
重なり合うように配置されている。また、内部電極３ａ
〜３ｆは、厚み方向において、交互に、セラミック焼結
体２の第１の端面２ａと、第２の端面２ｂとに引き出さ
れている。The internal electrodes 3a to 3f are arranged in the ceramic sintered body 2 so as to overlap each other in the thickness direction with a ceramic sintered body layer interposed therebetween. Also, the internal electrode 3a
3 f are alternately drawn out to the first end surface 2 a and the second end surface 2 b of the ceramic sintered body 2 in the thickness direction.
【００１５】本実施例では、内部電極積層数が約３０で
あり、セラミック焼結体の外寸が、１．６×０．８×
０．８ｍｍのものを用意した。そして、上記のようにし
て用意されたセラミック焼結体２をバレル研磨し、エッ
ジ部２ｅ、すなわち端面２ａと上面２ｃ、下面２ｄ及び
一対の側面とのなす端縁を研磨した。この研磨量を種々
異ならせ、複数種のセラミック焼結体を用意した。In this example, the number of laminated internal electrodes was about 30, and the outer size of the ceramic sintered body was 1.6 × 0.8 ×.
The thing of 0.8 mm was prepared. Then, the ceramic sintered body 2 prepared as described above was barrel-polished to polish the edge portion 2e, that is, the edge formed by the end face 2a, the upper face 2c, the lower face 2d, and the pair of side faces. A plurality of types of ceramic sintered bodies were prepared by varying the polishing amount.
【００１６】そして、エッジ部２ｅが丸められた各セラ
ミック焼結体に、平均粒径１μｍのＣｕ粉末と、Ｂ−Ｓ
ｉ−Ｚｎ系ガラスフリット（ガラス転移点５００℃）
と、アクリル系樹脂を有機溶剤に溶解させた有機ビヒク
ルとを、重量比で９５：５：２５の割合で混練してな
り、固形分７５重量％である導電ペーストを、端面２ａ
上における膜厚が５０μｍとなるように塗布し、８００
℃の温度で６０分間焼き付け、外部電極３，４を形成し
た。Then, Cu powder having an average particle size of 1 μm and B--S were added to each ceramic sintered body having the rounded edge portion 2e.
i-Zn based glass frit (glass transition point 500 ° C)
And an organic vehicle in which an acrylic resin is dissolved in an organic solvent are kneaded at a weight ratio of 95: 5: 25, and a conductive paste having a solid content of 75% by weight is mixed with the end surface 2a.
Apply it so that the film thickness on the top is 50 μm, and
The external electrodes 3 and 4 were formed by baking for 60 minutes at a temperature of ° C.
【００１７】なお、使用した導電ペーストにおいて、ガ
ラス粉末の平均粒径を、０．５μｍ、１．０μｍ、１．
５μｍ、２．０μｍ、３．０μｍ、４．０μｍ及び５．
０μｍと変化させ、種々の積層コンデンサを作製した。In the conductive paste used, the average particle diameter of the glass powder was 0.5 μm, 1.0 μm, 1.
5 μm, 2.0 μm, 3.0 μm, 4.0 μm and 5.
By changing the thickness to 0 μm, various laminated capacitors were manufactured.
【００１８】上記のようにして得られた各積層コンデン
サを、セラミック焼結体２の厚み方向と平行な方向に切
断し、断面を顕微鏡により観察した。より具体的には、
外部電極４，５がエッジ部、特に端面と上面及び下面と
のエッジ部で断線しているか否か、すなわちエッジ部で
セラミック焼結体２が露出しているか否かを確認した。
また、外部電極４５が断線し、セラミック焼結体がエッ
ジ部で露出しているものを不良品と判定した。各積層コ
ンデンサ５００個につきこの連続性評価を行い、５００
個あたりの連続性不良品の発生割合を求めた。結果を下
記の表１〜表３に示す。Each of the multilayer capacitors obtained as described above was cut in a direction parallel to the thickness direction of the ceramic sintered body 2, and the cross section was observed with a microscope. More specifically,
It was confirmed whether or not the external electrodes 4, 5 were broken at the edge portion, particularly at the edge portion between the end face and the upper surface and the lower surface, that is, whether the ceramic sintered body 2 was exposed at the edge portion.
In addition, the external electrode 45 was broken and the ceramic sintered body exposed at the edge was determined to be a defective product. This continuity evaluation was performed for each 500 multilayer capacitors, and
The rate of occurrence of defective continuous products per piece was determined. The results are shown in Tables 1 to 3 below.
【００１９】また、導電ペーストの塗布・焼き付けて外
部電極４，５を形成した後に、外部電極３，４の表面
に、第一層がＮｉ、第二層がＳｎからなるメッキ膜を湿
式メッキ法により形成し、メッキ前後の絶縁抵抗を測定
した。メッキ後に絶縁抵抗が１０％以上低下しているも
のを不良品と判断した。そして、各積層コンデンサ５０
０個につきメッキによる上記特性劣化評価を行い、５０
０個あたりの不良品発生割合を求めた。結果を下記の表
１〜表３に示す。After forming the external electrodes 4 and 5 by applying and baking a conductive paste, a plating film having Ni as the first layer and Sn as the second layer is formed on the surfaces of the external electrodes 3 and 4 by the wet plating method. And the insulation resistance before and after plating was measured. A product whose insulation resistance was reduced by 10% or more after plating was judged as a defective product. Then, each multilayer capacitor 50
The above-mentioned characteristic deterioration evaluation due to plating was performed for 0
The defective product generation rate per 0 pieces was obtained. The results are shown in Tables 1 to 3 below.
【００２０】[0020]
【表１】 [Table 1]
【００２１】[0021]
【表２】 [Table 2]
【００２２】[0022]
【表３】 [Table 3]
【００２３】表１〜表３から明らかなように、セラミッ
ク焼結体のエッジ部の研磨量としての曲率半径が３０μ
ｍ、５０μｍ及び７０μｍのいずれの場合でも、導電ペ
ースト中のガラスフリットの粒径の上記曲率半径に対す
る比が０．０５７未満では、外部電極の連続性不良及び
メッキ後の特性劣化不良が皆無であったのに対し、０．
０５７以上の場合には、外部電極の連続性不良やメッキ
後の絶縁抵抗不良が生じた。従って、表１〜表３の結果
から、導電ペーストに用いるガラスフリットの平均粒径
のセラミック焼結体のエッジ部の研磨量である曲率半径
Ｒに対する比を５．７％未満とすれば、外部電極の連続
性を確実に確保し得ることがわかる。As is apparent from Tables 1 to 3, the radius of curvature as the polishing amount of the edge portion of the ceramic sintered body is 30 μm.
When the ratio of the particle size of the glass frit in the conductive paste to the radius of curvature is less than 0.057, the continuity of the external electrodes and the deterioration of the characteristics after plating are not present in any of the cases of m, 50 μm and 70 μm. On the other hand, 0.
In the case of 057 or more, the continuity failure of the external electrode and the insulation resistance failure after plating occurred. Therefore, from the results of Tables 1 to 3, if the ratio of the average particle diameter of the glass frit used for the conductive paste to the radius of curvature R which is the polishing amount of the edge portion of the ceramic sintered body is less than 5.7%, It can be seen that the continuity of the electrodes can be reliably ensured.
【００２４】なお、上記エッジ部の曲率半径が７０μｍ
を超えると、エッジ部における外部電極の連続性不良
は、導電ペースト中のガラスフリットの粒径にあまり依
存しなくなる。これは、エッジ部における外部電極の厚
みが十分となり、エッジ部に金属粉末が確実に存在する
ことになるための思われる。従って、本発明は、エッジ
部の曲率半径Ｒが７０μｍの場合に、好適に利用され
る。The radius of curvature of the edge portion is 70 μm.
When it exceeds, the continuity failure of the external electrode at the edge portion becomes less dependent on the particle size of the glass frit in the conductive paste. This seems to be because the thickness of the external electrode at the edge portion becomes sufficient and the metal powder is surely present at the edge portion. Therefore, the present invention is preferably used when the radius of curvature R of the edge portion is 70 μm.
【００２５】なお、上記実験例では、ガラスフリットと
して上記Ｂ−Ｓｉ−Ｚｎ系ガラス粉末を用いたが、これ
に限定されず、例えばＢａ−Ｓｉ−Ｂ系ガラス（ガラス
転移点６４０℃）等を用いた場合も同様の効果が得られ
た。 In the above experimental example, the B-Si-Zn type glass powder was used as the glass frit, but the glass frit is not limited to this, and for example, Ba-Si-B type glass (glass transition point 640 ° C) or the like may be used. Similar effects were obtained when used .
【００２６】さらに、上記実験例では、積層コンデンサ
に適用した例を示したが、本発明は、内部電極を有し、
セラミック焼結体の外表面に内部電極と電気的に接続さ
れる外部電極を有する適宜の積層セラミック電子部品に
適用することができる。[0026] is found in the above experimental examples, the example of applying the multilayer capacitor, the present invention includes an internal electrode,
It can be applied to an appropriate multilayer ceramic electronic component having an external electrode electrically connected to the internal electrode on the outer surface of the ceramic sintered body.
【００２７】[0027]
【発明の効果】本発明に係る積層セラミック電子部品で
は、セラミック焼結体の端面のエッジ部の曲率半径Ｒが
３０〜７０μｍとなるように丸められており、外部電極
を構成しているＣｕ粉末含有導電ペースト中のＢ−Ｓｉ
−Ｚｎ系またはＢａ−Ｓｉ−Ｂ系ガラスフリットの平均
粒径が上記曲率半径の５．７％未満とされているので、
セラミック焼結体のエッジ部における外部電極の連続性
が確保され、積層セラミック電子部品の信頼性を高める
ことができる。特に、積層セラミック電子部品の小型化
を進め、ツームストーン現象が生じ易くなった場合であ
っても、上記曲率半径Ｒを小さくし、しかも、本発明に
従って外部電極を形成することにより、ツームストーン
現象の抑制と、外部電極の連続性の確保を両立すること
が可能となる。In the laminated ceramic electronic component according to the present invention, the radius of curvature R of the edge portion of the end surface of the ceramic sintered body is
B-Si in the Cu powder-containing conductive paste which is rounded to have a thickness of 30 to 70 μm and constitutes an external electrode
Since the average particle size of the -Zn-based or Ba-Si-B-based glass frit is less than 5.7% of the radius of curvature,
The continuity of the external electrodes at the edge of the ceramic sintered body is ensured, and the reliability of the monolithic ceramic electronic component can be improved. In particular, even when the miniaturization of the monolithic ceramic electronic component is promoted and the tombstone phenomenon is likely to occur, the tombstone phenomenon is reduced by reducing the radius of curvature R and forming the external electrode according to the present invention. It is possible to achieve both suppression of the above and ensuring continuity of the external electrodes.
【００２８】[0028]
【００２９】また、本発明の特定の局面では、セラミッ
ク焼結体内に複数の内部電極が形成されており、複数の
内部電極がセラミック焼結体の厚み方向において交互に
第１，第２の端面に引き出されており、第１，第２の端
面を覆うように第１，第２の外部電極が形成されて積層
コンデンサが構成される。従って、本発明により、外部
電極のセラミック焼結体のエッジ部における連続性が確
保された、信頼性に優れた積層コンデンサを提供するこ
とができる。Further, according to a specific aspect of the present invention, a plurality of internal electrodes are formed in the ceramic sintered body, and the plurality of internal electrodes are alternately arranged in the thickness direction of the ceramic sintered body. And the first and second external electrodes are formed so as to cover the first and second end faces to form a multilayer capacitor. Therefore, according to the present invention, it is possible to provide a highly reliable multilayer capacitor in which continuity is secured in the edge portion of the ceramic sintered body of the external electrode.
【図１】本発明の一実施例に係る積層セラミック電子部
品としての積層コンデンサを示す断面図。FIG. 1 is a sectional view showing a monolithic capacitor as a monolithic ceramic electronic component according to an embodiment of the present invention.
【図２】従来の積層コンデンサの問題点を説明するため
の部分切欠拡大断面図。FIG. 2 is a partially cutaway enlarged cross-sectional view for explaining a problem of a conventional multilayer capacitor.
１…積層コンデンサ ２…セラミック焼結体 ２ａ，２ｂ…第１，第２の端面 ２ｃ…上面 ２ｄ…下面 ２ｅ…エッジ部 ３ａ〜３ｆ…内部電極 ４，５…外部電極 1. Multilayer capacitor 2 ... Ceramic sintered body 2a, 2b ... First and second end faces 2c ... top surface 2d ... bottom surface 2e ... Edge part 3a to 3f ... internal electrodes 4, 5 ... External electrodes
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平９−7877（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01G 4/00 - 17/00 ─────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-9-7877 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01G 4/00-17/00
Claims (2)
を有するセラミック焼結体と、 前記セラミック焼結体内に形成されており、前記セラミ
ック焼結体の一方の端面に引き出された内部電極と、Ｃｕ粉末と、Ｂ−Ｓｉ−Ｚｎ系またはＢａ−Ｓｉ−Ｂ系
ガラスフリットとを含む 導電ペーストの塗布・焼付けに
より形成されており、かつセラミック焼結体の一方の端
面を覆い、かつ上面、一対の側面及び下面に至る電極延
長部を有する外部電極とを備え、 前記セラミック焼結体の端面の外周のエッジ部の曲率半
径Ｒが３０〜７０μｍとなるように丸められており、前
記外部電極を構成している導電ペースト中のガラスフリ
ットの平均粒径が、前記曲率半径の５．７％未満である
ことを特徴とする、積層セラミック電子部品。1. A ceramic sintered body having an upper surface, a lower surface, a pair of side surfaces, and a pair of end surfaces, and an internal electrode formed in the ceramic sintered body and extended to one end surface of the ceramic sintered body. And Cu powder and B-Si-Zn system or Ba-Si-B system
An external electrode that is formed by applying and baking a conductive paste including a glass frit , covers one end surface of the ceramic sintered body, and has an upper surface, a pair of side surfaces, and an external electrode having an electrode extension portion reaching the lower surface, The radius of curvature R of the outer edge of the end face of the ceramic sintered body is rounded to be 30 to 70 μm, and the average particle size of the glass frit in the conductive paste forming the external electrode is A monolithic ceramic electronic component having a curvature radius of less than 5.7%.
電極がセラミック焼結体層を介して重なり合うように配
置されており、 前記複数の内部電極がセラミック焼結体のいずれかの端
面に引き出されており、 前記一対の端面のそれぞれを覆うように第１，第２の外
部電極がそれぞれ形成されており、それによって積層コ
ンデンサが構成されている、請求項１に記載の積層セラ
ミック電子部品。2. A plurality of internal electrodes are arranged in the ceramic sintered body so as to overlap each other with a ceramic sintered body layer interposed therebetween, and the plurality of internal electrodes are drawn out to one end surface of the ceramic sintered body. are are first to cover each of the pair of end faces, and the second external electrodes are formed respectively, whereby the multilayer capacitor is configured, laminated ceramic electronic component according to claim 1.
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| JP2000091808A JP3460669B2 (en) | 2000-03-29 | 2000-03-29 | Multilayer ceramic electronic components |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000091808A JP3460669B2 (en) | 2000-03-29 | 2000-03-29 | Multilayer ceramic electronic components |
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| JP2001284157A JP2001284157A (en) | 2001-10-12 |
| JP3460669B2 true JP3460669B2 (en) | 2003-10-27 |
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|---|---|---|---|
| JP2000091808A Expired - Fee Related JP3460669B2 (en) | 2000-03-29 | 2000-03-29 | Multilayer ceramic electronic components |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7156310B2 (en) | 1990-09-17 | 2007-01-02 | Metrologic Instruments, Inc. | Automatically-activated hand-supportable laser scanning bar code symbol reading system with data transmission activation switch |
| US7252238B2 (en) | 1990-09-10 | 2007-08-07 | Metrologic Instruments, Inc. | Automatically-activated hand-supportable laser scanning bar code symbol reading system with data transmission activation switch |
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|---|---|---|---|---|
| JP4433909B2 (en) * | 2004-07-07 | 2010-03-17 | Ｔｄｋ株式会社 | Surface mount electronic components |
| US7133274B2 (en) | 2005-01-20 | 2006-11-07 | Matsushita Electric Industrial Co., Ltd. | Multilayer capacitor and mold capacitor |
| KR100616677B1 (en) | 2005-04-11 | 2006-08-28 | 삼성전기주식회사 | Glass frit for dielectric ceramic composition, dielectric ceramic composition, multilayer laminated ceramic capacitor and method for manufacturing the same |
| JP4654854B2 (en) | 2005-09-13 | 2011-03-23 | パナソニック株式会社 | Multilayer capacitors and molded capacitors |
| JP4767001B2 (en) * | 2005-11-28 | 2011-09-07 | 京セラ株式会社 | Electronic components and circuit modules |
| KR101188032B1 (en) | 2011-03-09 | 2012-10-08 | 삼성전기주식회사 | A multilayer ceramic capacitor and a method for manufacturing the same |
| JP2015111655A (en) * | 2013-10-29 | 2015-06-18 | 株式会社村田製作所 | Ceramic electronic component |
| US9714921B2 (en) * | 2014-06-25 | 2017-07-25 | Murata Manufacturing Co., Ltd. | Method of identifying direction of multilayer ceramic capacitor, apparatus identifying direction of multilayer ceramic capacitor, and method of manufacturing multilayer ceramic capacitor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH097877A (en) * | 1995-04-18 | 1997-01-10 | Rohm Co Ltd | Multilayered ceramic chip capacitor and manufacture thereof |
-
2000
- 2000-03-29 JP JP2000091808A patent/JP3460669B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7252238B2 (en) | 1990-09-10 | 2007-08-07 | Metrologic Instruments, Inc. | Automatically-activated hand-supportable laser scanning bar code symbol reading system with data transmission activation switch |
| US7156310B2 (en) | 1990-09-17 | 2007-01-02 | Metrologic Instruments, Inc. | Automatically-activated hand-supportable laser scanning bar code symbol reading system with data transmission activation switch |
| US7611063B2 (en) | 1990-09-17 | 2009-11-03 | Metrologic Instruments, Inc. | Automatically-activated code symbol reading system |
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| Publication number | Publication date |
|---|---|
| JP2001284157A (en) | 2001-10-12 |
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