JP3263863B2 - Hybrid IC substrate and method of manufacturing hybrid IC using the same - Google Patents

Abstract

PURPOSE:To provide a substrate for hybrid ICs which can cope with a reduction in pitch and increase in the number of pins without manual aid and without consuming a large amount of man-hours and a hybrid IC manufacturing method using the substrate. CONSTITUTION:The substrate is composed of circuit boards 2 on which semiconductor elements and individual components 6 and 7 are mounted along conductor patterns and flexible printed boards 3 provided in the peripheries of the substrates 2 in a state where the boards 3 are electrically connected to conductor patterns on the bards 2. The outer leads of this substrate are formed by punching the wiring boards 3 provided in the peripheries of the substrate 2 with a punch and die and, at the same time, bending the remaining parts in prescribed shapes.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid IC substrate on which components of basically different types are mounted to form one electronic circuit function, and a method of manufacturing a hybrid IC using the same.

[0002]

2. Description of the Related Art In a conventional hybrid IC substrate, semiconductor elements and individual components are mounted on a circuit board on which a predetermined conductor pattern is formed, and components having different functions are electrically connected to each other via the above-described conductor pattern. Was connected. A plurality of such circuit boards are provided on one main board, and are divided one by one after component mounting is completed. Further, a plurality of lands are formed at a predetermined pitch on the periphery of each circuit board. After the board is divided, for example, F-type leads are fitted into these lands and soldered. External leads are provided on both sides of the.

[0003]

However, the above-mentioned conventional hybrid IC substrate has a structure in which the lands of the circuit board and the external leads are connected by soldering. As the number of solders increases, there has been a problem that soldering requires a lot of man-hours.

Conventionally, there has been another problem that the distance between terminals (land portions, external leads) cannot be set too small due to the occurrence of bridges due to soldering and difficulty in positioning the circuit board and external leads. . further,
Since the F-type leads serving as the external leads sandwich the circuit board from both sides, the external leads could not be provided in all four directions of the circuit board. For these reasons, it has been extremely difficult for the conventional hybrid IC substrate to cope with fine pitch and multiple pins accompanying digitization of circuits.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and is a hybrid IC capable of coping with fine pitch and multi-pin without requiring much labor and man-hours.
It is an object of the present invention to provide a substrate for use and a method for manufacturing a hybrid IC using the same.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above object, and has a circuit board on which a semiconductor element and an individual component are mounted on a conductor pattern; A flexible printed wiring board provided around the circuit board in an electrically connected state, and the flexible printed wiring board is sandwiched between the base material of the circuit board and the flexible printed wiring board. The board and the circuit board are integrally formed , and the through hole provided on the periphery of the circuit board
Plating and flexible printed wiring boards and circuit boards
Are electrically connected to each other to provide a hybrid IC substrate. The present invention is also a method of manufacturing a hybrid IC using the hybrid IC substrate, wherein the flexible printed wiring board provided around the circuit board is cut and bent into a predetermined shape to form external leads. is there.

[0007]

In the substrate for a hybrid IC of the present invention,
The parts formed as external leads are made of a flexible printed wiring board, and this flexible printed wiring board is electrically connected to the conductor pattern of the circuit board. The terminal spacing can be set smaller than that. Also, flexible printed wiring boards
Of the circuit board is sandwiched between the substrates of the circuit board
Flexible printed wiring with integrated structure
The electrical connection between the board and the circuit board becomes easy,
It is possible to secure large mechanical bonding strength of the substrate
Become. Furthermore, a through hole provided on the periphery of the circuit board
Plating and flexible printed wiring boards and circuit boards
Electrical connection between the substrates,
Around the circuit board (4
Place flexible printed wiring boards on each side)
be able to. Therefore, all four directions of the circuit board
It is necessary to provide external leads
It becomes possible. In the method for manufacturing a hybrid IC of the present invention, the flexible printed wiring board is cut and bent into a predetermined shape to form external leads.
This eliminates the need for soldering or the like for forming leads.

[0008]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows a hybrid IC according to the present invention.
FIG. 2 is a plan view showing an embodiment of the substrate for use, and FIG. 2 is a sectional view of a main part of FIG. As shown in the figure, the hybrid IC substrate 1 of this embodiment is mainly composed of a circuit board 2 and a flexible printed wiring board 3, and these circuit boards 2 and the flexible printed wiring board 3 are mounted on the main board 4. A plurality (four in the illustrated example) are juxtaposed.

A conductor pattern (not shown) is formed on each of the upper and lower surfaces of the circuit board 2, and the semiconductor element 5 (see FIGS. 3 and 4) and the individual components 6, 7 are mounted on the conductor pattern. It has become. The semiconductor element 5 and the individual components 6 and 7 are electrically connected to each other via the above-described conductor pattern, whereby a predetermined electronic circuit function is formed on the circuit board 2.

The flexible printed wiring board 3 is made of a thin film having an insulating property such as polyimide or polyester as a base material, and has a predetermined wiring pattern formed on one surface thereof. The flexible printed wiring board 3 is, as viewed in plan, as shown in FIG.
And is electrically connected to the conductor pattern of the circuit board 2 by means described later.

Here, the internal structure of the hybrid IC substrate 1 will be described with reference to FIG. In the present embodiment, has a sandwiched structure in a sandwich-like at the substrate of the circuit board 2 comprising the upper and lower surfaces of the flexible printed circuit board 3 for example a glass epoxy substrate 2a, depending on which
Flexible printed wiring board 3 and circuit board 2 are integrated
It is structured. Further, the conductor pattern of the circuit board 2 and the wiring pattern 3a of the flexible printed wiring board 3 are electrically connected as follows. That is, a through hole 8 connected to the conductor pattern is provided on the periphery of the circuit board 2.
An electrical connection can be obtained between the through-hole plating 8a provided on the flexible printed wiring board 3 and the through-hole plating 8a provided on the flexible printed wiring board 3. The wiring pattern 3a of the flexible printed wiring board 3 is formed so as to be interrupted at a position slightly entering the circuit board 2 side.
Thereby, insulation between the patterns is maintained.

Next, a method of manufacturing a hybrid IC using the hybrid IC substrate 1 having the above configuration will be described. First, the semiconductor element 5 and the individual components 6 and 7 are mounted on the conductor pattern of each circuit board 2. At this time, the semiconductor element 5 is sealed with the potting resin 9 after the wire bonding. In addition, the flexible printed wiring board 3
The wiring pattern 3a is preferably pre-plated with gold so that the pattern is not oxidized when the potting resin 9 is cured.

Subsequently, when the components are completely mounted on all the circuit boards 2, the hybrid IC board 1 is set in a magazine of a dedicated processing machine. This dedicated processing machine is provided with an upper die 10 and a lower die 11 for lead processing, and the hybrid IC substrate 1 set in the magazine is transferred to the upper die 10 and the lower die by a transport mechanism (not shown). It is transported between the molds 11.

When the hybrid IC substrate 1 is transported to a predetermined position, the upper mold 10 and the lower mold 11 move up and down. Thereby, the circuit board 2 and the flexible printed wiring board 3 are separated from the main board 4, and the flexible printed wiring board 3 is bent into a predetermined shape. In this embodiment, the flexible printed wiring board 3 provided around the circuit board 2 is bent into a crank shape to form external leads (3) as shown in FIG. Thereafter, the circuit board 2 and the flexible printed wiring board 3 are sequentially sent while the hybrid IC substrate 1 is sent at a predetermined pitch.
And cutting and bending. Thus, hybrid ICs 12 as shown in FIG. 4 are manufactured one after another.

In the hybrid IC substrate 1 of the present embodiment, the external leads of the hybrid IC 12 are formed by the flexible printed wiring board 3 electrically connected to the conductor pattern of the circuit board 2. Of course, there is no risk of occurrence of bridges, and the ease of patterning the flexible printed wiring board 3 makes it possible to set the terminal interval to be much smaller than in the past.

Incidentally, according to the experimental results of the present inventors,
Conventionally, the terminal interval could only be set to be as small as about 1.2 mm.
It has been confirmed that the terminal spacing can be set as small as about 0.5 mm.

Also, in the conventional case using F-type leads, external leads can be provided only on both sides (two directions) of the circuit board.
In the circuit board 1, external leads (3) can be provided in all four directions of the circuit board 2.

In addition, in the method of manufacturing a hybrid IC using the hybrid IC substrate 1, the external leads are formed around the circuit board 2 at the same time as the substrate is divided. Compared with the conventional method of soldering, the method requires less labor and can significantly reduce the number of steps, and does not increase the number of steps as the number of terminals increases. Further, the main substrate 4
If the plurality of circuit boards 2 and the flexible printed wiring board 3 provided above are punched at once by the upper die 10 and the lower die 11 of a dedicated processing machine, a further reduction in man-hours can be expected.

The hybrid IC 12 punched by the upper and lower molds 10 and 11 is further transported as it is, and for example, as shown in FIG. Automatic mounting using the crimping tool 15 is also possible. Note that the hybrid IC 12
Is not limited to the thermocompression bonding method described above, but may be a laser method, for example.

[0020]

As described above, according to the hybrid IC substrate of the present invention, by providing the flexible printed wiring board formed as the external lead around the circuit board, the terminal interval can be reduced. Since the number of terminals can be increased at the same time, it is possible to sufficiently cope with the fine pitch and the increase in the number of pins accompanying the digitization of the circuit. Ma
In addition, since the flexible printed wiring board base material is sandwiched between the circuit board base materials in an integrated configuration, the electrical connection between the flexible printed wiring board and the circuit board becomes easy, and the mechanical Large joint strength can be ensured. In addition, the circuit board
Flexible through-hole plating provided on the periphery of the plate
Electrical connection between the printed circuit board and the circuit board.
Causes positional interference with the electrical connection between the substrates
Without flexily around the circuit board (4 sides)
Bull printed wiring boards can be arranged. This
And flexible printed wiring in all four directions of the circuit board
Since it is possible to provide external leads made of a plate,
It is even easier to respond to fine pitch and multiple pins
It becomes

Further , the production of the hybrid IC according to the present invention
According to the manufacturing method, since a series of manual operations such as fitting and soldering the external leads after dividing the substrate is not required at all, the number of man-hours can be greatly reduced as compared with the related art. Furthermore, even in the case of a fine pitch and multi-pin configuration, the circuit board and the flexible printed wiring board are electrically connected by predetermined means, and the flexible printed wiring board becomes external leads by cutting and bending. This does not cause an increase in man-hours.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a hybrid IC substrate according to the present invention.

FIG. 2 is a sectional view of a main part of FIG.

FIG. 3 is an explanatory diagram of a manufacturing method according to the present invention.

FIG. 4 is a schematic side view of a hybrid IC according to the present invention.

FIG. 5 is a schematic side view illustrating a mounting example of a hybrid IC.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Hybrid IC board 2 Circuit board 3 Flexible printed wiring board 4 Main board 5 Semiconductor element 6, 7 Individual component 10 Upper mold 11 Lower mold

Claims (3)

(57) [Claims] 1. A circuit board on which a semiconductor element and an individual component are mounted on a conductor pattern, and a flexible printed wiring provided around the circuit board in a state of being electrically connected to the conductor pattern of the circuit board. Board, and the flexible printed wiring board and the circuit board are integrally formed by sandwiching the base material of the flexible printed wiring board between the base material of the circuit board and the circuit board. Through the peripheral edge of the
The flexible printed wiring board and the
A substrate for a hybrid IC, wherein the substrate is electrically connected to a circuit substrate. 2. A circuit board on which a semiconductor element and an individual component are mounted on a conductor pattern, and a flexible printed wiring provided around the circuit board while being electrically connected to the conductor pattern of the circuit board. A board for a hybrid IC, comprising: a board; and a plurality of the circuit boards and the flexible printed wiring boards arranged in parallel on a main board. 3. A method of manufacturing a hybrid IC using the hybrid IC substrate according to claim 1 or 2, wherein the flexible printed wiring board provided around the circuit board is cut and a predetermined number is cut. A method for manufacturing a hybrid IC, comprising bending the shape into an external lead.