JP3262400B2 - Automatic chip feeder - Google Patents
Automatic chip feederInfo
- Publication number
- JP3262400B2 JP3262400B2 JP08274393A JP8274393A JP3262400B2 JP 3262400 B2 JP3262400 B2 JP 3262400B2 JP 08274393 A JP08274393 A JP 08274393A JP 8274393 A JP8274393 A JP 8274393A JP 3262400 B2 JP3262400 B2 JP 3262400B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- wheel
- tip
- suction
- defective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Specific Conveyance Elements (AREA)
- Sorting Of Articles (AREA)
- Feeding Of Articles To Conveyors (AREA)
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、主としてチップ（各種
小形電子部品）をテープのチップ装填孔に装填してチッ
プテープを製造するチップテーピングマシン、若しくは
チップをカセット（設定数のチップを収納する）に装填
してチップカセットを製造するチップカセット製造装置
の一部装置として使用するものであり、直線整列フィダ
ーから１列送給されてくるチップをチップ移乗制御部を
経て、間欠回転するホイールの各チップ支持部に１個宛
分離して吸着支持し、該チップをホイールの円周に沿っ
て備えた検測手段、不良チップの脱却手段で順次セレク
トして、残った良品チップのみを装填手段でチップテー
プ若しくはチップカセットに装填するようにした、チッ
プ自動分離送給装置に係るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to a chip taping machine for manufacturing a chip tape by loading chips (various small electronic components) into a chip mounting hole of the tape, or a cassette (for storing a predetermined number of chips). ) Is used as a part of a chip cassette manufacturing apparatus that manufactures a chip cassette by loading chips fed in a line from a linear alignment feeder through a chip transfer control unit to a wheel that rotates intermittently. One chip is separated and adsorbed and supported on each chip support part, and the chips are sequentially selected by a measuring means provided along the circumference of the wheel and a means for removing defective chips, and only the remaining good chips are loaded. The present invention relates to an automatic chip separating / feeding device which is loaded in a chip tape or a chip cassette.
【０００２】[0002]
【前提技術とその課題】本発明は、本願の発明者、出願
人が先に特許出願した、（イ）特願平１−９２３２６号
（特開平２−２７０７１７号）、発明の名称「チップ自
動分離送給装置」、（ロ）特願平１−１４２３６２号
（特開平３−８６１９号）、発明の名称「チップ自動分
離送給装置」の改良発明に係り、上記特許出願発明の課
題点を解決することを目的とするものである。[Prerequisite technology and its problems] The present invention relates to (a) Japanese Patent Application No. 1-92326 (Japanese Unexamined Patent Application Publication No. 2-270717), filed by the inventor of the present application, and the applicant of the present invention. (B) Japanese Patent Application No. 1-142362 (Japanese Unexamined Patent Publication No. 3-8619), which relates to an improved invention of the title "automatic chip separation and feeding device", It is intended to solve it.
【０００３】即ち、発明（イ）は、チップをホイールの
円周面に直立状態に支持して搬送する点で本発明と一致
しているが、チップをチップ移乗制御部からホイールの
チップ支持部へ吸気口の吸気力で吸引装填するとき、吸
気口がチップ支持部の下方部に開設されているだけなの
で、チップの装填がややスムーズにいかない難点があ
り、不完全装填を生じる恐れがあり、また、チップの下
方部だけを吸着するだけなので、回転搬送時の吸着支持
としては不十分であって、従来同様にチップの搬送途中
脱落を防止するカバー若しくはガイド等をホイールの内
周面に沿って設置する必要があるが、該カバー、ガイド
等を取付けると検測手段や不良チップ脱却手段の設置が
やり難くなる上に、検測や脱却装填の様子を外部から目
で直接監視できない（本発明はできる）欠点があった。That is, the invention (a) is identical to the present invention in that the chips are transported while being supported upright on the circumferential surface of the wheel, but the chips are transferred from the chip transfer control unit to the chip support unit of the wheel. When suction loading with the suction force of the suction port, since the suction port is only opened below the tip support, there is a problem that the loading of the chip does not go smoothly, which may cause incomplete loading. Also, since only the lower part of the chip is sucked, it is not sufficient as a suction support at the time of rotation transfer, and a cover or a guide for preventing the chip from dropping during the transfer as in the conventional case is provided on the inner peripheral surface of the wheel. It is necessary to install along the cover, but if the cover, guide, etc. are attached, it will be difficult to install the inspection means and the defective chip removal means, and the state of the inspection and removal loading cannot be directly monitored from the outside by eyes. The present invention can be) there is a problem.
【０００４】また、発明（イ）の出願においては、検測
手段及び不良チップ脱却手段の存在の記載はあるが、手
段自体の内容は開示されていない。そこで、本発明は有
効な検測手段及び不良チップ脱却手段を新規に開発した
ものである。In the application of the invention (A), there is a description of the existence of the inspection means and the defective chip removing means, but the contents of the means themselves are not disclosed. Therefore, the present invention has newly developed effective inspection means and defective chip removing means.
【０００５】発明（ロ）は、チップ支持部がホイールの
円周部に水平に形成されており、チップを水平に支持搬
送するように備えたものであるが、このタイプには下記
のような課題点があった。即ち、チップを水平に支持す
るため、チップの厚味に合わせてホイールの厚さを極め
て薄くせざるを得ず、よって、ホイールが脆弱で破損、
損耗しやすく、反り、歪みを生じやすく、反面、製造加
工がしにくい。In the invention (b), the chip supporting portion is formed horizontally on the circumferential portion of the wheel and is provided so as to support and convey the chip horizontally. There were issues. In other words, to support the chip horizontally, the wheel must be made extremely thin according to the thickness of the chip, so the wheel is fragile and damaged,
It is easy to wear, warp and warp easily, but difficult to process.
【０００６】チップが回転搬送途中で脱落しないように
ホイールのチップ支持部をカバーすることを要し、よっ
てホイールの円周面及びチップ支持部の上下面を覆うカ
バーを取り付けねばならず、また、該カバーを取付けた
ために、検測手段、不良チップ脱却手段、装填手段等の
設置がやり難くなる上に、検測、脱却、装填の様子を外
部から目で直接監視できない欠点があった。[0006] It is necessary to cover the chip support portion of the wheel so that the chip does not fall off during the rotation and conveyance, so that a cover for covering the circumferential surface of the wheel and the upper and lower surfaces of the chip support portion must be attached. Since the cover is attached, it is difficult to install the detecting means, the defective chip removing means, the loading means, and the like, and further, the state of the measuring, removing, and loading cannot be directly monitored from outside by eyes.
【０００７】[0007]
【課題を解決する手段】本発明は上記の課題を下記の手
段により有効に解決したものである。即ち、本発明は、
ホイールの円周面に、チップを直立状態に吸着支持する
チップ支持部を垂直に等間隔に設け、各チップ支持部の
中央部に吸気口を開設し、ホイールのチップ支持部と対
設して直線整列フィダーの先端の間に、チップ支持部の
下方部に向って開口した吸気口と光センサーを備えたチ
ップ移乗制御部を設け、また、ホイールの円周に沿っ
て、チップの検測手段と不良チップの脱却手段と検測済
み良品チップの装填手段を備えた、チップ自動分離送給
装置によって課題を解決したものである。The present invention has effectively solved the above-mentioned problems by the following means. That is, the present invention
On the circumferential surface of the wheel, chip supports are provided vertically at equal intervals to adsorb and support the chips in an upright state, an air inlet is opened in the center of each chip support, and opposed to the chip support of the wheel. A tip transfer control section having an air inlet and an optical sensor opened toward the lower part of the tip support section is provided between the tips of the linear alignment feeders, and a tip detecting means is provided along the circumference of the wheel. An object of the present invention is to solve the problem by an automatic chip separation / feeding device including a means for removing defective chips and a means for loading a detected good chip.
【０００８】次に、本発明の実施例を図面につき説明す
ると、ホイール１の円周面に、チップｔを直立状態に吸
着支持するチップ支持部２を垂直に等間隔に設け、各チ
ップ支持部２の中央部に吸気口３を開設し、ホイール１
のチップ支持部２と対設した直線整列フィダー４の先端
の間に、チップ支持部２の下方部に向って開口した吸気
口７と光センサー６を備えたチップ移乗制御部５を設
け、また、ホイール１の円周に沿って、チップｔの検測
手段８と不良チップの脱却手段９と検測済み良品チップ
の装填手段１０を備えてチップ自動分離送給装置Ａを構
成したものである。Next, an embodiment of the present invention will be described with reference to the drawings. Chip support portions 2 for vertically supporting a tip t by suction are provided on a circumferential surface of a wheel 1 at equal intervals. Open the intake 3 in the center of 2
A tip transfer control unit 5 provided with an air inlet 7 and an optical sensor 6 opened toward the lower part of the chip support unit 2 between the tip of the linear alignment feeder 4 opposed to the chip support unit 2; A chip automatic separating and feeding apparatus A is provided along the circumference of the wheel 1 with a chip t detecting means 8, a defective chip removing means 9 and a detected good chip loading means 10. .
【０００９】上記チップ自動分離送給装置Ａにおいて、
ホイール１は、その円周面にチップｔを直立状態に吸着
支持するコ形溝状のチップ支持部２を垂直に等間隔に形
成し、各チップ支持部２の背面中央部に吸気口３を開設
し、パルスモーター１１等でチップ支持部２の間隔毎に
間欠制御回転するように設けたものであり、該ホイール
１の下面に密接して各チップ支持部２の各吸気口３に連
通した欠円状の吸気溝１２を形成した固定部１３を備
え、該吸気溝１２を通して各チップ支持部２の吸気口３
から連続吸気するようにしたものである。In the above-mentioned automatic chip separating and feeding apparatus A,
The wheel 1 is provided with a U-shaped groove-shaped chip support portion 2 for vertically adsorbing and supporting the chip t in an upright state on the circumferential surface thereof at equal intervals vertically. It is provided so as to be intermittently controlled and rotated at intervals of the chip support portion 2 by a pulse motor 11 or the like, and communicates with each intake port 3 of each chip support portion 2 in close contact with the lower surface of the wheel 1. A fixed portion 13 having a cut-out intake groove 12 formed therein is provided.
It is designed to continuously inhale from
【００１０】チップ移乗制御部５は、振動式等の直線整
列フィダー４のチップ送給中心線上で、ホイール１のチ
ップ支持部２の略中央部に対面する位置に光センサー６
の光通過孔６ａをあけると共に、同チップ支持部２の下
方部に対面する位置に吸気口７を開設し、また、必要に
応じてチップ吸着口１４を光通過孔９ａと並べて、直線
整列フィダー４の先端との間に開設したものである。The chip transfer control unit 5 is provided with an optical sensor 6 at a position facing a substantially central portion of the chip support unit 2 of the wheel 1 on a chip feeding center line of the linear alignment feeder 4 of a vibration type or the like.
In addition to opening the light passage hole 6a, the air inlet 7 is opened at a position facing the lower part of the chip support portion 2, and the chip suction port 14 is arranged with the light passage hole 9a as necessary, so that the linear alignment feeder is formed. 4 and was established between them.
【００１１】なお、チップ移乗制御部５の上面におい
て、１５は直線整列フィダー４の先端とホイール１のチ
ップ支持部２の間でチップの進行を案内するガイド部で
あり、該ガイド部１５はチップ支持部２に近い側で略気
密構成の吸引部１５ａと、フィダー４の先端に近い側で
上面開放構成の無吸引部１５ｂからなり、吸引部１５ａ
に光センサー６の光通過孔６ａを設け、また、無吸引部
１５ｂに必要に応じてチップ吸着口１４を開設したもの
である。On the upper surface of the chip transfer controller 5, reference numeral 15 denotes a guide section for guiding the advance of the chip between the tip of the linear alignment feeder 4 and the chip support section 2 of the wheel 1. A suction portion 15a having a substantially airtight structure on the side close to the support portion 2 and a non-suction portion 15b having an open top surface on the side close to the tip of the feeder 4 are provided.
A light passage hole 6a of the optical sensor 6 is provided in the apparatus, and a chip suction port 14 is opened in the non-suction unit 15b as needed.
【００１２】チップｔの抵抗値等を検測するの検測手段
８は、ホイール１の円周に沿って、該ホイール１のチッ
プ支持部２の直上に固定検測端子８ａを、直下に可動検
測端子８ｂを設置し、可動検測端子８ｂを固定検測端子
８ａに向って設定寸法上下動するように備えたものであ
り、チップ支持部２に吸着支持されたチップｔの下端
（電極）を可動検測端子８ｂの上昇動で押動して上端
（電極）を固定検測端子８ａに圧接通電してチップｔの
検測を行うように備えたものである。A measuring means 8 for measuring the resistance value of the tip t is provided with a fixed measuring terminal 8a directly above the chip supporting portion 2 of the wheel 1 and movable directly below along the circumference of the wheel 1. The inspection terminal 8b is provided, and the movable inspection terminal 8b is provided so as to move up and down by a predetermined dimension toward the fixed inspection terminal 8a. ) Is pushed by the upward movement of the movable detection terminal 8b, and the upper end (electrode) is press-contacted to the fixed detection terminal 8a so as to detect the tip t.
【００１３】不良チップの脱却手段９は、ホイール１の
内周に沿って、該ホイール１のチップ支持部２の直上に
噴気ノズル９ａを備えると共に、同チップ支持部２の直
下に適宜の落下シュート９ｂを備えたものであり、前段
の検測手段８で検測された不良チップｔを、チップ支持
部２の吸気口３による吸着支持力よりも強力な噴気ノズ
ル９ａの噴気で落下シュート９ｂに向って脱却するよう
に備えたものである。The defective chip removing means 9 includes a blast nozzle 9a along the inner periphery of the wheel 1 directly above the chip supporting portion 2 of the wheel 1, and an appropriate drop chute just below the chip supporting portion 2. 9b, the defective chip t detected by the measuring means 8 in the preceding stage is transferred to the drop chute 9b by the blast of the blast nozzle 9a which is stronger than the suction supporting force of the suction port 3 of the chip supporting portion 2 by the blast. It was designed to escape towards you.
【００１４】そして、検測手段８及び不良チップの脱却
手段９を経て、チップ支持部２に吸着支持搬送されてき
た良品チップｔを、適宜の装填手段１０、例えば、ホイ
ール１の内周に沿って備えたサクションヘッド（図示せ
ず）若しくは噴気ノズル１０ａと落下シュートなどの装
填手段１０で、チップテープ若しくはチップカセット等
へ装填するように備えたものである。Then, the non-defective chip t which has been suction-supported and conveyed to the chip supporting portion 2 via the measuring means 8 and the defective chip removing means 9 is transferred along an appropriate loading means 10, for example, along the inner periphery of the wheel 1. A suction head (not shown) or a blast nozzle 10a and a loading means 10 such as a dropping chute are provided so as to be loaded onto a chip tape or a chip cassette.
【００１５】[0015]
【作用】直線整列フィダー４から順に押せ押せの状態
で、若しくは、ばらばらの状態で１列送給されてきたチ
ップｔ1 がチップ移乗制御部５に乗り、その先端が無吸
引部１５ｂを通り吸引部１５ａに進入した瞬間に、吸気
口３、７の吸気による吸引力が作用して、該チップｔ1
は１瞬の間にホイール１のチップ支持部２に装填吸着支
持される。The chip t 1, which has been fed in a row from the linear alignment feeder 4 in a pressing and pressing state or in a separated state, rides on the chip transfer control unit 5, and the tip thereof is suctioned through the non-suction unit 15 b. At the moment of entering the portion 15a, the suction force by the intake air of the intake ports 3 and 7 acts, and the chip t 1
Is instantaneously loaded and adsorbed on the chip supporting portion 2 of the wheel 1.
【００１６】この間、チップｔ1 は光通過孔６ａを通過
するので光センサーの光線を１瞬間遮断し、吸気口３、
７、特にチップ支持部２の下方部の吸気口７の吸引力で
先端から倒立するように９０°回転して直立状態に吸引
装填され、該直立状態を背面中央部の吸気口３の吸引力
で吸着支持される。During this time, since the chip t 1 passes through the light passage hole 6a, the light beam of the optical sensor is interrupted for one moment,
7, the suction force of the suction port 7 in the lower part of the chip supporting portion 2 is rotated by 90 ° so as to be inverted from the tip, and is loaded in the upright state. Is supported by adsorption.
【００１７】そして、上記光線の１瞬間遮断を光センサ
ー６が検知し、ホイール１を１駒回転して、チップｔ1
を次位へ送ると共に、次のチップｔ2 のための空のチッ
プ支持部２がガイド部１５の正面に到来して停止する。Then, the light sensor 6 detects the momentary interruption of the light beam, rotates the wheel 1 by one frame, and outputs the chip t 1.
To the next position, and the empty chip support portion 2 for the next chip t 2 arrives at the front of the guide portion 15 and stops.
【００１８】上記のようにｔ1 の先端が無吸引部１５ｂ
から吸引部１５ａに進入した瞬間にチップ支持部２に吸
引装填されるため、次のチップｔ2 との間に空きが生じ
るが、その時チップｔ2 の先端は無吸引部１５ｂにあ
り、吸気口３、７の吸引力が全く作用しないため、チッ
プｔ2 はその先端が吸引部１５ａに進入しない限り吸引
装填されることがなく、よって、先のチップｔ1 の装填
時にチップｔ2 が一緒に吸引されてしまうトラブルを生
じる恐れが全くない。As described above, the tip of t 1 is the non-suction portion 15b.
Since sucked loaded into the chip supporting portion 2 at the moment of entering the suction part 15a from but free between the next chip t 2 occurs, the tip of that time the chip t 2 is in the non-suction portion 15b, inlet since the suction force of 3,7 does not act at all, the chip t 2 is without its leading end is sucked loaded unless enters the suction unit 15a, therefore, together chip t 2 during loading of the previous chip t 1 There is no danger of causing a trouble of being sucked.
【００１９】なお、直線整列フィダーの１列送給チップ
が押せ押せの状態で高速送給されてくるために、先の装
填チップｔ1 と次のチップｔ2 の間の距離及び時間がと
り難いような場合には、ガイド部１５の光通過孔６ａの
前段にチップ吸着口１４（または図示しない出没ストッ
パーピン）を設けて、光センサー６の検知と連携してチ
ップｔ2 を一瞬吸引停止するようにする。即ち、チップ
吸気口１４（または出没ストッパーピン）は、通常の場
合は必要ないが、チップの種類や送給、装填速度等との
関係で必要とされる場合に設けるものである。Since the single-row feed chips of the linear alignment feeder are fed at a high speed in a press-down state, it is difficult to take the distance and time between the preceding chip t 1 and the next chip t 2. If such is in front of the light passing hole 6a of the guide portion 15 provided with a chip suction port 14 (or not shown infested stopper pin), sucking stops momentarily and tip t 2 in conjunction with detection of the optical sensor 6 To do. That is, the chip intake port 14 (or the retractable stopper pin) is not necessary in a normal case, but is provided when it is required in relation to the type of chip, feeding, loading speed, and the like.
【００２０】上記のようにして、各チップ支持部２にチ
ップｔを吸着支持したホイールが回転して（第１）検測
手段８の位置にくると、可動検測端子８ｂが上昇してチ
ップ支持部２内のチップｔの下端（電極）に当接して押
し上げチップｔの上端（電極）を固定検測端子８ａに圧
接し通電して、抵抗値等の検測を行う。As described above, when the wheel having the chip t suction-supported by each chip supporting portion 2 rotates and comes to the position of the (first) inspection means 8, the movable inspection terminal 8b rises and the chip The upper end (electrode) of the tip t is brought into contact with the lower end (electrode) of the tip t in the support portion 2 by pressing the upper end (electrode) of the tip t against the fixed measurement terminal 8a to conduct current, thereby measuring the resistance value or the like.
【００２１】更にホイール１が回転して不良チップの
（第１）脱却手段９の位置にくると、チップ支持部２の
チップｔが、先の検測手段８で不良チップと検測された
場合は、噴気ノズル９ａから圧力空気が噴出して、吸気
口３で吸着支持されているチップｔを、下方の落下シュ
ート９ｂに向けて吹き落し脱却する。チップｔが良品チ
ップと検測された場合は、上記脱却作用は行われず、チ
ップはチップ支持部２に吸着支持されたまま回転搬送さ
れる。When the wheel 1 further rotates and comes to the position of the (first) detaching means 9 for the defective chip, the chip t of the chip supporting portion 2 is detected as a defective chip by the inspection means 8 described above. Pressurized air is blown out from the blast nozzle 9a, and the tip t sucked and supported by the intake port 3 is blown down toward the lower drop chute 9b to escape. When the chip t is detected as a non-defective chip, the above-described detachment operation is not performed, and the chip is rotationally conveyed while being suction-supported by the chip support portion 2.
【００２２】続いて、更にホイール１が回転して（第
２）検測手段８でチップを検測し、（第２）脱却手段９
で不良チップを脱却し、Subsequently, the wheel 1 is further rotated and the chip is detected by the (second) inspection means 8, and the (second) release means 9
Withdraw the bad chip with
【００２３】上記２段階の検測手段と不良チップ脱却手
段を通ってセレクトされたチップｔだけが最後の装填手
段１０の位置に到達し、ここで、チップカセット（図示
せず）に装填する場合は噴気ノズル１０ａの噴気でチッ
プ支持部２から脱却され、落下シュートを経てカセット
内に装填され、また、チップテープ（図示せず）に装填
する場合はサクションヘッド等でチップ支持部２からテ
ープのチップ装填凹部に装填されるものである。In the case where only the chip t selected through the two-stage inspection means and the defective chip removing means reaches the position of the last loading means 10 and is loaded in a chip cassette (not shown) here. Is released from the chip support 2 by the fumarole of the fumarole nozzle 10a, is loaded into the cassette via a drop chute, and when loaded on a chip tape (not shown), the tape is transferred from the chip support 2 by a suction head or the like. It is loaded in the chip loading recess.
【００２４】[0024]
【効果】ホイールのチップ支持部にチップを直立状態に
吸着支持するようにしたので、チップを水平に支持する
場合と異なり、ホイールを格段に肉厚に強固に構成でき
て耐久性に秀れ製造加工が容易となり、チップ支持部の
背面中央に吸気口を設けてチップを極めて安定的に吸着
支持し得るようにしたので、チップがホイールの回転中
に脱落する恐れがなく、よって、従来ホイールの円周に
沿って設置せねばならなかったカバーやガイドプレート
等が不要となり、その結果、ホイールの円周に検測手
段、脱却手段、装填手段、その他の付属機構を設置しや
すくなると共に、ホイールの円周部分が露出するため、
検測手段、脱却手段、その他の位置において搬送中のチ
ップを外部から直接監視し得て、トラブル発生の予防、
処理等を容易に行える極めて秀れた特長がある。[Effect] Since the chip is supported by the chip supporting portion of the wheel in an upright state, unlike the case where the chip is supported horizontally, the wheel can be configured to be extremely thick and strong, and excellent in durability can be manufactured. Processing is facilitated, and the suction port is provided in the center of the back of the chip support so that the chip can be absorbed and supported extremely stably.Therefore, there is no risk that the chip will fall off during rotation of the wheel. Covers and guide plates, which had to be installed along the circumference, are no longer required.As a result, it is easier to install inspection means, release means, loading means, and other attached mechanisms on the circumference of the wheel. Because the circumference of is exposed,
The chip being transported at the inspection means, escape means, and other positions can be directly monitored from the outside to prevent trouble occurrence,
It has extremely excellent features that can easily perform processing and the like.
【００２５】チップ移乗制御部からホイールのチップ支
持部にチップを直立装填するとき、特にチップ保持部の
下方部に対面した位置に吸気口７を開設したので、該吸
気口７の吸引力がチップの先端部を倒立回転するように
作用すると共に、正確な直立状態に吸引し得て、チップ
の装填、吸着支持を正しい姿勢で確実に行い得るように
した多大の効果がある。When the chips are loaded upright from the chip transfer control section to the chip support section of the wheel, the suction port 7 is opened particularly at a position facing the lower portion of the chip holding section. In addition to acting to invert the tip of the tip, the tip can be sucked in an accurate upright state, and there is a great effect that the loading and suction support of the chip can be reliably performed in a correct posture.
【図１】本発明の実施例の縦断正面図。FIG. 1 is a vertical sectional front view of an embodiment of the present invention.
【図２】図１の平面図。FIG. 2 is a plan view of FIG. 1;
【図３】（イ）、（ロ）はチップの１個分離、移乗、装
填及び吸着支持の作用説明図。FIGS. 3 (a) and 3 (b) are diagrams for explaining the operation of separating, transferring, loading and adsorbing one chip.
【図４】検測手段の実施例の一部拡大正面図。FIG. 4 is a partially enlarged front view of the embodiment of the inspection means.
Ａ 本発明装置 ｔ チップ １ ホイール ２ チップ支持部 ３ 吸気口 ４ 直線整列フィダー ５ チップ移乗制御部 ６ 光センサー ６ａ 光通過孔 ７ 吸気口 ８ 検測手段 ８ａ 固定検測端子 ８ｂ 可動検測端子 ９ 不良チップの脱却手段 ９ａ 噴気ノズル ９ｂ 落下シュート １０ 装填手段 １０ａ 噴気ノズル １１ パルスモーター １２ 吸気溝 １３ 固定部 １４ チップ吸着口 １５ ガイド部 １５ａ 吸引部 １５ｂ 無吸引部 A Device of the present invention t Chip 1 Wheel 2 Chip support 3 Inlet 4 Linear alignment feeder 5 Chip transfer controller 6 Optical sensor 6a Light passage hole 7 Inlet 8 Inspection means 8a Fixed inspection terminal 8b Movable inspection terminal 9 Defective Chip removing means 9a Fume nozzle 9b Drop chute 10 Loading means 10a Fume nozzle 11 Pulse motor 12 Intake groove 13 Fixed part 14 Chip suction port 15 Guide part 15a Suction part 15b No suction part
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) B07C 5/00 - 5/38 B65G 47/86 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) B07C 5/00-5/38 B65G 47/86
Claims (6)
吸着支持するチップ支持部を垂直に等間隔に設け、各チ
ップ支持部の中央部に吸気口を開設し、ホイールのチッ
プ支持部と対設した直線整列フィダーの先端の間に、チ
ップ支持部の下方部に向って開口した吸気口と光センサ
ーを備えたチップ移乗制御部を設け、また、ホイールの
円周に沿って、チップの検測手段と不良チップの脱却手
段と検測済み良品チップの装填手段を備えた、チップ自
動分離送給装置。1. A chip supporting portion for vertically supporting a chip in an upright state is provided at equal intervals on a circumferential surface of a wheel, and an air inlet is opened at a central portion of each chip supporting portion. A tip transfer control unit having an air inlet and an optical sensor opened toward the lower part of the tip support unit is provided between the tip of the linear alignment feeder opposed to the tip and the tip, along the circumference of the wheel. Automatic chip separation and feeding device, comprising: means for detecting a defective chip, means for removing a defective chip, and means for loading a detected good chip.
態に吸着支持するコ形溝状のチップ支持部を垂直に等間
隔に形成し、各チップ支持部の背面中央部に吸気口を開
設し、パルスモーター等で間欠制御回転するように設け
たものであり、 該ホイールの下面に密接して各チップ支持部の各吸気口
に連通した欠円状の吸気溝を形成した固定部を備え、該
吸気溝を通して各チップ支持部の吸気口から連続吸気す
るようにしたものである、請求項１のチップ自動分離送
給装置。2. The wheel has a U-shaped groove-shaped chip supporting portion for vertically adsorbing and supporting the chip in an upright state on the circumferential surface thereof at equal intervals vertically, and an intake port is provided at a central portion on the rear surface of each chip supporting portion. The fixed portion is provided so as to be intermittently controlled and rotated by a pulse motor or the like, and has a closed circular intake groove formed in close contact with the lower surface of the wheel and communicating with each intake port of each chip support portion. 2. The automatic chip separating / feeding device according to claim 1, wherein said device is provided so as to continuously suck air from said suction port of each chip supporting portion through said suction groove.
フィダーのチップ送給中心線上で、ホイールのチップ支
持部の略中央部に対面する位置に光センサーの光通過孔
をあけると共に、同チップ支持部の下方部に対面する位
置に吸気口を開設し、また、必要に応じてチップ吸着口
を光通過孔と並べて開設したものである、請求項１のチ
ップ自動分離送給装置。3. A chip transfer control section, wherein a light passage hole of an optical sensor is formed at a position facing a substantially center portion of a chip support section of a wheel on a chip feeding center line of a linear alignment feeder such as a vibration type, 2. The automatic chip separation / feeding device according to claim 1, wherein an air inlet is opened at a position facing a lower portion of the chip supporter, and a chip suction port is opened along with a light passage hole as needed.
って、該ホイールのチップ支持部の直上（または直下）
に固定検測端子を、直下（または直上）に可動検測端子
を設置し、可動検測端子を固定検測端子に向って設定寸
法上下動するように備えたものであり、チップ支持部に
吸着支持されたチップの一端（電極）を可動検測端子の
上（下）動で押動して他端（電極）を固定検測端子に圧
接通電してチップの検測を行うように備えたものであ
る、請求項１のチップ自動分離送給装置。4. A tip measuring means is provided directly above (or immediately below) a tip supporting portion of the wheel along the circumference of the wheel.
The fixed test terminal is installed directly below (or directly above) the movable test terminal, and the movable test terminal is provided so that it moves up and down the set dimension toward the fixed test terminal. One end (electrode) of the chip supported by suction is pushed upward (downward) by moving the movable test terminal, and the other end (electrode) is pressed into the fixed test terminal to conduct the chip test. 2. The automatic chip separating and feeding device according to claim 1, wherein:
に沿って、該ホイールのチップ支持部の直上に噴気ノズ
ルを備えると共に、同チップ支持部の直下に適宜の落下
シュートを備えたものであり、前段の検測手段で検測さ
れた不良チップを、チップ支持部の吸気口による吸着支
持力よりも強力な噴気ノズルの噴気で落下シュートに向
って脱却するように備えたものである、請求項１のチッ
プ自動分離送給装置。5. The means for removing defective chips comprises a blast nozzle just above the chip support portion of the wheel along the inner periphery of the wheel, and an appropriate drop chute just below the chip support portion. And the defective chip detected by the measuring means at the preceding stage is provided so as to escape to the drop chute by the blast of the blast nozzle which is stronger than the suction supporting force by the suction port of the chip supporting portion. 2. The automatic chip separating and feeding apparatus according to claim 1.
チップ支持部に吸着支持搬送されてきた良品チップを、
ホイールの内周に沿って備えたサクションヘッド若しく
は噴気ノズルと落下シュートなどの適宜の装填手段でチ
ップテープ若しくはチップカセット等へ装填するように
備えた、請求項１のチップ自動分離送給装置。6. A measuring device and a defective chip removing device,
Non-defective chips adsorbed and transported to the chip support section
2. The automatic chip separation / feeding device according to claim 1, wherein the device is mounted on a chip tape or a chip cassette or the like by a suction head or a blast nozzle provided along an inner periphery of the wheel and a suitable mounting means such as a dropping chute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08274393A JP3262400B2 (en) | 1993-03-17 | 1993-03-17 | Automatic chip feeder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08274393A JP3262400B2 (en) | 1993-03-17 | 1993-03-17 | Automatic chip feeder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06269744A JPH06269744A (en) | 1994-09-27 |
| JP3262400B2 true JP3262400B2 (en) | 2002-03-04 |
Family
ID=13782909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08274393A Expired - Lifetime JP3262400B2 (en) | 1993-03-17 | 1993-03-17 | Automatic chip feeder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3262400B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001163435A (en) * | 1999-12-14 | 2001-06-19 | Nitto Kogyo Co Ltd | Setting surface arranging carrying device of chip |
| JP4785245B2 (en) * | 2000-08-02 | 2011-10-05 | 株式会社ヒューブレイン | Micro object inspection system |
| JP3690257B2 (en) * | 2000-08-28 | 2005-08-31 | 株式会社村田製作所 | Chip parts transfer device |
| JP5011605B2 (en) * | 2001-03-26 | 2012-08-29 | シンフォニアテクノロジー株式会社 | Parts orientation sorting device |
| JP2004226101A (en) | 2003-01-20 | 2004-08-12 | Tokyo Weld Co Ltd | Work inspection system |
| JP4906058B2 (en) * | 2006-02-27 | 2012-03-28 | 株式会社 東京ウエルズ | Work transfer system |
| JP5679195B2 (en) * | 2011-05-27 | 2015-03-04 | 株式会社 東京ウエルズ | Workpiece conveyance inspection device and workpiece conveyance inspection method |
| CN107394559B (en) * | 2017-07-21 | 2023-05-23 | 信华科技（厦门）有限公司 | Continuous cutting and collecting equipment for product with terminal |
| JP7031850B2 (en) * | 2017-12-25 | 2022-03-08 | 株式会社菊水製作所 | Molded product transfer device |
-
1993
- 1993-03-17 JP JP08274393A patent/JP3262400B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06269744A (en) | 1994-09-27 |
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