JP3201271B2 - Method of changing bonding tool in bonding equipment - Google Patents

Method of changing bonding tool in bonding equipment

Info

Publication number
JP3201271B2
JP3201271B2 JP22093096A JP22093096A JP3201271B2 JP 3201271 B2 JP3201271 B2 JP 3201271B2 JP 22093096 A JP22093096 A JP 22093096A JP 22093096 A JP22093096 A JP 22093096A JP 3201271 B2 JP3201271 B2 JP 3201271B2
Authority
JP
Japan
Prior art keywords
horn
bonding tool
bonding
tool
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP22093096A
Other languages
Japanese (ja)
Other versions
JPH1064939A (en
Inventor
隆幸 吉山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP22093096A priority Critical patent/JP3201271B2/en
Publication of JPH1064939A publication Critical patent/JPH1064939A/en
Application granted granted Critical
Publication of JP3201271B2 publication Critical patent/JP3201271B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78308—Removable capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、ボンディング装置
におけるボンディングツール交換方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for exchanging a bonding tool in a bonding apparatus.

【０００２】[0002]

【従来の技術】ワイヤボンディング用のキャピラリやシ
ングルポイントボンディング用の押圧ツール等のボンデ
ィングツールは、ボンディング対象物にくり返し多数押
し付けられ摩耗するので、適当な頻度で交換せねばなら
ない。2. Description of the Related Art A bonding tool such as a capillary for wire bonding or a pressing tool for single point bonding is repeatedly pressed against an object to be bonded and is worn, so that it must be replaced at an appropriate frequency.

【０００３】一方、このボンディングツールは、高さ方
向について高い精度が求められる。したがって、ボンデ
ィングツールの交換にあたっては、使用済のボンディン
グツールをホーンから取外し新ボンディングツールをホ
ーンに装着した後、新ボンディングツールの高さを調整
する必要がある。On the other hand, this bonding tool is required to have high accuracy in the height direction. Therefore, when replacing the bonding tool, it is necessary to remove the used bonding tool from the horn, mount the new bonding tool on the horn, and then adjust the height of the new bonding tool.

【０００４】[0004]

【発明が解決しようとする課題】このような調整は、従
来特別な治具を用いて行われていた（実開平２−７３７
３８号、特開平５−３４３４６２号、同４−３３８６５
４号など）。Such adjustment has heretofore been performed using a special jig (Japanese Utility Model Laid-Open No. 2-737).
No. 38, JP-A-5-343462 and JP-A-4-33865.
No. 4).

【０００５】しかしながら、このように特別な治具を用
いるのでは、作業に熟練を要するだけでなく、手間や時
間がかかるという問題点があった。[0005] However, using such a special jig has a problem that not only skill is required for work but also labor and time are required.

【０００６】そこで本発明は、手間や時間をかけること
なく簡単にボンディングツールを交換できる方法を提供
することを目的とする。Accordingly, an object of the present invention is to provide a method capable of easily changing a bonding tool without taking time and effort.

【０００７】[0007]

【課題を解決するための手段】本発明のボンディング装
置におけるボンディングツール交換方法は、ボンディン
グツールの下端部を基準面に着地させた際のホーンの高
さ又はその関数値を記憶するステップと、ホーンから使
用済のボンディングツールを取外しホーンに新ボンディ
ングツールを装着するステップと、ホーンを記憶した高
さ又はその関数値が示す状態にするステップと、この状
態を保持してホーンに装着された新ボンディングツール
の下端部を基準面に着地させ、新ボンディングツールを
ホーンに固定するステップとを含む。A method for replacing a bonding tool in a bonding apparatus according to the present invention comprises the steps of storing a height of a horn when a lower end portion of the bonding tool lands on a reference plane or a function value thereof, Removing the used bonding tool from the horn and mounting the new bonding tool on the horn; bringing the horn into a state indicated by the memorized height or its function value; and holding the state and mounting the new bonding tool on the horn. Landing the lower end of the tool on the reference surface and securing the new bonding tool to the horn.

【０００８】[0008]

【発明の実施の形態】請求項１記載のボンディング装置
におけるボンディングツール交換方法は、ボンディング
ツールの下端部を基準面に着地させた際のホーンの高さ
又はその関数値を記憶するステップと、ホーンから使用
済のボンディングツールを取外しホーンに新ボンディン
グツールを装着するステップと、ホーンを記憶した高さ
又はその関数値が示す状態にするステップと、この状態
を保持してホーンに装着された新ボンディングツールの
下端部を基準面に着地させ、新ボンディングツールをホ
ーンに固定するステップとを含む。したがって、特別な
治具を用いずに、簡単迅速にボンディングツールを交換
できる。According to the first aspect of the present invention, there is provided a method for replacing a bonding tool in a bonding apparatus, comprising the steps of: storing a height of a horn when the lower end of the bonding tool lands on a reference surface or a function value thereof; Removing the used bonding tool from the horn and mounting the new bonding tool on the horn; bringing the horn into a state indicated by the memorized height or its function value; and holding the state and mounting the new bonding tool on the horn. Landing the lower end of the tool on the reference surface and securing the new bonding tool to the horn. Therefore, the bonding tool can be easily and quickly replaced without using a special jig.

【０００９】次に図面を参照しながら、本発明の実施の
形態を説明する。図１は、本発明の一実施の形態におけ
るワイヤボンディング装置の斜視図である。以下本形態
では、ワイヤボンディング装置を例にとって説明する
が、本発明は、シングルポイントボンディング装置の押
圧ツールの交換にも同様に適用できる。Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a wire bonding apparatus according to an embodiment of the present invention. Hereinafter, in the present embodiment, a wire bonding apparatus will be described as an example, but the present invention can be similarly applied to replacement of a pressing tool of a single point bonding apparatus.

【００１０】図１において、１は基板２をＸ方向に案内
しＹ方向に位置決めする搬送レール、３は基板２をＸ方
向に搬送すると共に位置決めする係合爪である。基板２
上には、リード４が形成されており、リード４の内端部
が臨むアイランドには、半導体チップ５が搭載されてい
る。そして、半導体チップ５の図示していない電極とリ
ード４がボンディング対象である。In FIG. 1, reference numeral 1 denotes a transfer rail for guiding the substrate 2 in the X direction and positioning the substrate 2 in the Y direction. Reference numeral 3 denotes an engagement claw for transferring and positioning the substrate 2 in the X direction. Substrate 2
The lead 4 is formed thereon, and a semiconductor chip 5 is mounted on an island facing the inner end of the lead 4. Then, an electrode (not shown) of the semiconductor chip 5 and the lead 4 are to be bonded.

【００１１】６は位置決めされた基板２を上方から押さ
え付ける基板押えであり、基板押え６の中央部には窓７
が開けられ、窓７を介して上述したボンディング対象が
外部に露呈するようになっている。また、基板押え６
は、シリンダ８によって基板２に押付力を作用させる。Reference numeral 6 denotes a substrate holder for pressing the positioned substrate 2 from above, and a window 7 is provided at the center of the substrate holder 6.
Is opened, and the above-mentioned bonding target is exposed to the outside through the window 7. In addition, substrate holder 6
Applies a pressing force to the substrate 2 by the cylinder 8.

【００１２】９は基板押え６と対面するように配置され
るＸＹテーブルであって、ＸＹテーブル９はＸモータ１
０、Ｙモータ１１が駆動されることで、ボンディングユ
ニット１２をＸＹ方向に移動させるものである。ボンデ
ィングユニット１２のうち、１３は昇降機構２４（図
３）によって矢印Ｎ１方向に揺動するホーンであり、ホ
ーン１３の先端部には下向きにボンディングツールとし
てのキャピラリ１４が装着されている。１５は、ワイヤ
１６を供給するスプールであり、スプール１５から供給
されたワイヤ１６は鉛直下方に延び、キャピラリ１４の
内部に貫通する。１７はホーン１３と一体的に揺動し、
ワイヤ１６を挟持して、キャピラリ１４から下方に延出
するワイヤ１６の先端部を切断するカットクランパであ
る。なおホーン１３の高さ方向の位置は、ボンディング
ユニット１２の高さ計測部２５（図３）で計測されてい
る。An XY table 9 is arranged so as to face the substrate holder 6, and the XY table 9 is an X motor 1
When the Y and Y motors 11 are driven, the bonding unit 12 is moved in the XY directions. In the bonding unit 12, 13 is a horn that swings in the direction of arrow N1 by an elevating mechanism 24 (FIG. 3), and a capillary 14 as a bonding tool is attached to the tip of the horn 13 downward. Reference numeral 15 denotes a spool for supplying a wire 16. The wire 16 supplied from the spool 15 extends vertically downward and penetrates into the capillary 14. 17 swings integrally with the horn 13,
This is a cut clamper for holding the wire 16 and cutting the distal end of the wire 16 extending downward from the capillary 14. The position of the horn 13 in the height direction is measured by the height measuring unit 25 (FIG. 3) of the bonding unit 12.

【００１３】また、シリンダ８、Ｘモータ１０、Ｙモー
タ１１及びボンディングユニット１２は、制御部１８に
よりコントロールされている。１９は制御部１８に動作
命令等を支持するための入力部である。The cylinder 8, the X motor 10, the Y motor 11 and the bonding unit 12 are controlled by a control unit 18. Reference numeral 19 denotes an input unit for supporting an operation command or the like in the control unit 18.

【００１４】さて、キャピラリ１４は、図２に示すよう
にホーン１３の先端部に装着されている。即ち、ホーン
１３の先端部には、ホーン１３の軸方向に沿って、縦長
の割溝２０が形成され、割溝２０の中央部には、ホーン
１３を垂直に貫通し、キャピラリ１４が挿通される貫通
孔２１が形成されている。そして、割溝２０の側部に開
けられたネジ孔２２に、止ビス２３を締め込むことによ
り、キャピラリ１４はホーン１３に固定されるものであ
る。The capillary 14 is mounted on the tip of the horn 13 as shown in FIG. That is, a vertically long split groove 20 is formed at the tip of the horn 13 along the axial direction of the horn 13, and the center of the split groove 20 penetrates the horn 13 vertically, and the capillary 14 is inserted therethrough. Through holes 21 are formed. The capillary 14 is fixed to the horn 13 by tightening a stop screw 23 into a screw hole 22 formed on the side of the split groove 20.

【００１５】次に、図４を参照しながら、本形態のボン
ディング装置におけるボンディングツール交換方法の各
プロセスを説明する。なお、図３に示すように、高さ計
測部２５が計測するホーン１３の上端部の高さ情報は、
制御部２６が読み書きする記憶部２７に随時格納できる
ようになっている。また図４において、１４ｘは、使用
済のボンディングツールとしての、摩耗した使用済キャ
ピラリ、１４ｙは新ボンディングツールとしての新キャ
ピラリである。Next, each process of the bonding tool exchange method in the bonding apparatus of this embodiment will be described with reference to FIG. As shown in FIG. 3, the height information of the upper end of the horn 13 measured by the height measuring unit 25 is:
The control unit 26 can store the data in the storage unit 27 for reading and writing at any time. In FIG. 4, reference numeral 14x denotes a worn capillary used as a used bonding tool, and 14y denotes a new capillary used as a new bonding tool.

【００１６】さてまず、図４（ａ）に示すように、一定
の高さにある基準面Ｌを選ぶ。この基準面Ｌは一定の高
さであればどの面でもよく、例えば、基板２を押さえる
ために下降した基板押え６の上面などでよい。First, as shown in FIG. 4A, a reference plane L at a certain height is selected. The reference plane L may be any plane as long as it has a fixed height. For example, the reference plane L may be the upper surface of the substrate presser 6 lowered to press the substrate 2.

【００１７】そして、この基準面Ｌに使用済キャピラリ
１４ｘの下端部を着地させ、このときのホーン１３の上
端部の高さを高さ計測部２５で求めて記憶部２７に格納
する。The lower end of the used capillary 14x lands on the reference plane L. The height of the upper end of the horn 13 at this time is obtained by the height measuring unit 25 and stored in the storage unit 27.

【００１８】次に、図４（ｂ）に示すように、ホーン１
３を大きく上に傾ける。そして、止ビス２３をゆるめ
て、矢印Ｎ２で示すように、使用済キャピラリ１４ｘを
貫通孔２１から抜き取り、矢印Ｎ３で示すように新キャ
ピラリ１４ｙを貫通孔２１へ挿入する。要するに、キャ
ピラリの新旧交換を行う。Next, as shown in FIG.
Tilt 3 upwards. Then, the set screw 23 is loosened, the used capillary 14x is pulled out from the through hole 21 as shown by the arrow N2, and the new capillary 14y is inserted into the through hole 21 as shown by the arrow N3. In short, the old and new capillaries are exchanged.

【００１９】ここで、この例では、キャピラリの新旧交
換を行いやすくするために、ホーン１３を上に振ってい
るが、ホーン１３の下部に広い空間があいている場合に
は、ことさらにホーン１３を上に振らず、図４（ａ）の
ようにホーン１３を水平にしたまま交換してもよい。Here, in this example, the horn 13 is swung upward to facilitate the replacement of the old and new capillaries. However, if there is a wide space below the horn 13, the horn 13 is further increased. May be replaced with the horn 13 kept horizontal as shown in FIG.

【００２０】さて、新キャピラリ１４ｙを挿入するに
は、図４（ｃ）で示すように、新キャピラリ１４ｙの上
端部がホーン１３の上端部よりも小距離ｔだけ突出する
ようにしておくことが望ましい。Now, in order to insert the new capillary 14y, as shown in FIG. 4C, the upper end of the new capillary 14y should project from the upper end of the horn 13 by a small distance t. desirable.

【００２１】次に、ホーン１３を図４（ａ）と同じ位置
にする。即ち、ホーン１３の上端部の高さが、基準面Ｌ
よりも記憶部２７に格納した高さだけ上にあるようにす
る。このとき、新キャピラリ１４ｙの上端部を上述のよ
うに突出させておくと、新キャピラリ１４ｙの下端部
は、基準面Ｌよりも上方にあり、新キャピラリ１４ｙの
下端部が基準面Ｌに衝突して新キャピラリ１４ｙが損傷
を受けるようなおそれがなく、好都合である。Next, the horn 13 is set at the same position as in FIG. That is, the height of the upper end of the horn 13 is
Than the height stored in the storage unit 27. At this time, if the upper end of the new capillary 14y is protruded as described above, the lower end of the new capillary 14y is above the reference plane L, and the lower end of the new capillary 14y collides with the reference plane L. Therefore, there is no possibility that the new capillary 14y is damaged, which is convenient.

【００２２】そして、図４（ｅ）に示すように、ホーン
１３の高さを図４（ｄ）のまま保持しておき、新キャピ
ラリ１４ｙの下端部を基準面Ｌに着地させる。このと
き、図４（ａ）の使用済キャピラリ１４ｘの下端部の高
さと図４（ｅ）の新キャピラリ１４ｙの下端部の高さと
は、いずれも基準面Ｌの高さに一致する。したがって、
交換の前後で、キャピラリの下端部とホーンの位置関係
が全く同一となり、例えば交換後に高さの補正等を行う
必要がない。そして、新キャピラリ１４ｙの下端部を基
準面Ｌに着地させたら、再び止ビス２３を締め付けて、
新キャピラリ１４ｙをホーン１３に固定する。Then, as shown in FIG. 4E, the height of the horn 13 is kept as it is in FIG. 4D, and the lower end of the new capillary 14y is landed on the reference plane L. At this time, the height of the lower end of the used capillary 14x in FIG. 4A and the height of the lower end of the new capillary 14y in FIG. 4E both match the height of the reference plane L. Therefore,
Before and after the replacement, the positional relationship between the lower end of the capillary and the horn becomes completely the same, and for example, it is not necessary to correct the height after the replacement. When the lower end of the new capillary 14y lands on the reference plane L, the stop screw 23 is tightened again.
The new capillary 14y is fixed to the horn 13.

【００２３】[0023]

【発明の効果】本発明は、以上のように構成したので、
特別な治具などを用いた手間をかけることなく、簡単・
迅速にボンディングツールの交換を行うことができる。
しかも、ボンディングツールの交換前後において、ホー
ンとボンディングツールの下端部の位置関係は全く同一
になり、位置の再現性が高いだけでなく、ボンディング
ツールの高さ制御における補正量を特に設ける必要がな
く、正確かつ簡潔な制御を行うことができる。The present invention has been configured as described above.
Simple and easy without the need for special jigs
The exchange of the bonding tool can be performed quickly.
Moreover, before and after the replacement of the bonding tool, the positional relationship between the horn and the lower end of the bonding tool becomes completely the same, which not only has a high reproducibility of the position, but also does not require a special correction amount in the height control of the bonding tool. , Accurate and simple control can be performed.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施の形態におけるワイヤボンディ
ング装置の斜視図FIG. 1 is a perspective view of a wire bonding apparatus according to an embodiment of the present invention.

【図２】本発明の一実施の形態におけるホーンの先端部
の拡大図FIG. 2 is an enlarged view of a tip of a horn according to an embodiment of the present invention.

【図３】本発明の一実施の形態におけるワイヤボンディ
ング装置のブロック図FIG. 3 is a block diagram of a wire bonding apparatus according to an embodiment of the present invention.

【図４】（ａ）本発明の一実施の形態におけるワイヤボ
ンディング装置におけるボンディングツール交換方法の
工程説明図 （ｂ）本発明の一実施の形態におけるワイヤボンディン
グ装置におけるボンディングツール交換方法の工程説明
図 （ｃ）本発明の一実施の形態におけるワイヤボンディン
グ装置におけるボンディングツール交換方法の工程説明
図 （ｄ）本発明の一実施の形態におけるワイヤボンディン
グ装置におけるボンディングツール交換方法の工程説明
図 （ｅ）本発明の一実施の形態におけるワイヤボンディン
グ装置におけるボンディングツール交換方法の工程説明
図FIGS. 4A and 4B are process explanatory views of a bonding tool exchange method in a wire bonding apparatus according to an embodiment of the present invention; FIG. 4B are process explanatory views of a bonding tool exchange method in a wire bonding apparatus according to an embodiment of the present invention; (C) Process explanatory diagram of a bonding tool exchange method in a wire bonding apparatus according to an embodiment of the present invention (d) Process illustrative diagram of a bonding tool exchange method in a wire bonding device according to an embodiment of the present invention (e) Book Process explanatory drawing of the bonding tool exchange method in the wire bonding apparatus in one embodiment of the present invention

【符号の説明】[Explanation of symbols]

１３ ホーン １４ キャピラリ １４ｘ 使用済キャピラリ １４ｙ 新キャピラリ Ｌ 基準面 13 Horn 14 Capillary 14x Used capillary 14y New capillary L Reference surface

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】ボンディングツールの下端部を基準面に着
地させた際のホーンの高さ又はその関数値を記憶するス
テップと、前記ホーンから使用済のボンディングツール
を取外し前記ホーンに新ボンディングツールを装着する
ステップと、前記ホーンを記憶した高さ又はその関数値
が示す状態にするステップと、この状態を保持して前記
ホーンに装着された前記新ボンディングツールの下端部
を前記基準面に着地させ、前記新ボンディングツールを
前記ホーンに固定するステップとを含むことを特徴とす
るボンディング装置におけるボンディングツール交換方
法。A step of storing a height of the horn when the lower end of the bonding tool lands on a reference surface or a function value thereof; removing a used bonding tool from the horn and attaching a new bonding tool to the horn; Mounting the horn, setting the horn to a state indicated by a stored height or a function value thereof, and holding this state to land the lower end of the new bonding tool mounted on the horn on the reference surface. Fixing the new bonding tool to the horn. 【請求項２】前記ボンディングツールは、ワイヤボンデ
ィング用のキャピラリであることを特徴とする請求項１
記載のボンディング装置におけるボンディングツール交
換方法。2. The bonding tool according to claim 1, wherein the bonding tool is a capillary for wire bonding.
A method for exchanging a bonding tool in the bonding apparatus described in the above. 【請求項３】前記ボンディングツールは、シングルポイ
ントボンディング用の押圧ツールであることを特徴とす
る請求項１記載のボンディング装置におけるボンディン
グツール交換方法。3. The method according to claim 1, wherein the bonding tool is a pressing tool for single point bonding.
JP22093096A 1996-08-22 1996-08-22 Method of changing bonding tool in bonding equipment Expired - Fee Related JP3201271B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22093096A JP3201271B2 (en) 1996-08-22 1996-08-22 Method of changing bonding tool in bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22093096A JP3201271B2 (en) 1996-08-22 1996-08-22 Method of changing bonding tool in bonding equipment

Publications (2)

Publication Number Publication Date
JPH1064939A JPH1064939A (en) 1998-03-06
JP3201271B2 true JP3201271B2 (en) 2001-08-20

Family

ID=16758790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22093096A Expired - Fee Related JP3201271B2 (en) 1996-08-22 1996-08-22 Method of changing bonding tool in bonding equipment

Country Status (1)

Country Link
JP (1) JP3201271B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4700595B2 (en) 2006-12-04 2011-06-15 株式会社新川 Wire bonding apparatus, bonding tool exchange method and program for wire bonding apparatus
KR101352586B1 (en) * 2011-11-10 2014-01-20 주식회사 일원 A system for exchanging capillary automatically
KR20130098635A (en) * 2012-02-28 2013-09-05 삼성전자주식회사 Capillary exchange system of semiconductor wire bond
JPWO2023026430A1 (en) * 2021-08-26 2023-03-02

Also Published As

Publication number Publication date
JPH1064939A (en) 1998-03-06

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