JP3152091B2 - Electronic component mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for automatically mounting a flip chip on a substrate.

[0002]

2. Description of the Related Art As one type of electronic component, a flip chip in which a bump (projecting electrode) made of solder or the like is provided on a die is known. Here, the present applicant has previously proposed an electronic component mounting apparatus capable of automatically mounting a flip chip on a substrate (Japanese Patent Laid-Open No. 2-56946). Next, this conventional electronic component mounting apparatus will be described with reference to FIG.
In FIG. 5, A is a component supply unit that stocks the flip chip 1 in a posture in which the bumps 2 face up (hereinafter referred to as face-up), and B is a component supply unit in which the bumps 2 face down on the positioned substrate 3 (hereinafter, face-down). ) For mounting the flip chip 1. Here, it is necessary to mount the flip chip 1 face down so that the bumps 2 are electrically connected to the circuit pattern formed on the substrate 3.

[0003]

By the way, in the conventional electronic component mounting apparatus, the flip chip 1 is stocked in the component supply section A in a face-up state. And a reversing device C for reversing the flip chip 1 from a face-up state to a face-down state. More specifically, the flip chip 1 is inverted by driving the motor M to rotate the arm 5 provided with the holding head 4 for holding the flip chip 1 at the distal end in the direction of the arrow N1.

However, such a configuration has a problem that the time required for flip-chip inversion is indispensable, and the tact time of the entire mounting operation is prolonged.

Accordingly, an object of the present invention is to provide an electronic component mounting apparatus capable of mounting a flip chip in a shorter time.

[0006]

According to the present invention, there is provided an electronic component mounting apparatus comprising: a board positioning section for positioning a board; a component supply section for holding a flip chip in a face-down state; There is provided a delivery means for delivering to the receiving and mounting means in a down state, and a mounting means for mounting a flip chip received in a face down state from the delivery means on a substrate positioned in a substrate positioning portion in a face down state.

[0007]

According to the above construction, the flip chip is in a face-down state when it is located in any of the component supply section, the delivery means, the mounting means and the substrate, and there is no need to flip the flip chip. The time required for flip chip flipping in the electronic component mounting apparatus can be saved, and the tact time in the entire mounting can be reduced.

[0008]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a side view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a plan view of an electronic component mounting apparatus according to one embodiment of the present invention, and FIG. 3 is a chip according to one embodiment of the present invention. FIG. 4 is an enlarged view of a mounting position in an embodiment of the present invention. Note that the same components as those in FIG. 5 showing the conventional electronic component mounting apparatus are denoted by the same reference numerals and description thereof will be omitted.

In FIG. 1, reference numeral 10 denotes a base for supporting other components, and an adhesive sheet 12 to which the flip chip 1 is attached in a face-down state is attached to a lower surface 11 of the component supply section A. The adhesive sheet 1
Each flip chip 1 on the lower surface of 2 is positioned by a chip positioning portion D at a fixed pickup position (on the axis of an ejector 32 described later).

In the chip positioning portion D, 13 is the base 1
An X table 15 mounted on the X table and driven by the X motor 14, a Y table 15 mounted on the X table 13 and driven by the Y motor 16, and 17 standing on the Y table 15 and holding the holder 11 horizontally It is a bracket to support. Therefore, when the X motor 14 and the Y motor 16 are driven, the holder 11 moves horizontally in the XY directions.

Next, among the substrate positioning portions E, 18 is an X table mounted on the base 10 and driven by the X motor 19, and 20 is a Y motor 21 mounted on the X table 18 and
Is a .theta. Table that holds the upper surface of the substrate 3 by suction at the approximate center of the lower surface.

At the above-mentioned pickup position above the adhesive sheet 12, a chip take-out portion F is arranged.
Among them, reference numeral 30 denotes a cylinder integrated with the base 10 and the rod 31 is fixed so that the rod 31 faces downward. Reference numeral 32 denotes an ejector which is connected to the lower end of the rod 31 and supported so as to be able to move up and down. As shown in FIG. 3, the ejector 32 includes a rod 32 a
And a needle-like pin 32b fixed downward to the lower end of the rod 32a. When the rod 32a is lowered, the pins 32b penetrate the adhesive sheet 12 and push the bottom surface (the surface opposite to the bump 2) of the flip chip 1 attached to the adhesive sheet 12 in a face-down state. The flip chip 1 is detached from the adhesive sheet.

In FIG. 1, G is a delivery means for receiving the flip chip 1 removed from the adhesive sheet 12 in a face-down state and transferring it to the adjacent mounting means H. As shown in FIG. 2, the delivery means G has a plurality of radially provided arms 33 each having a delivery head 35 at a tip end thereof, and an upper end of the delivery head 35 having an upwardly extending bump 2 of the flip chip 1. A suction nozzle 36 for sucking the surface on which is formed is provided. Reference numeral 34 denotes an index mechanism for rotating the arm 33 by an index around the shaft 34a, and moves the suction nozzle 36 sucking the flip chip 1 below the suction nozzle 43 waiting at the delivery position Q.
Reference numeral 40 denotes a plurality of arms provided radially around a shaft 41a, reference numeral 41 denotes an index mechanism for rotating the arm 40 by an index around the shaft 41a, and reference numeral 42 denotes a mounting provided with a suction nozzle 43 at the lower end for sucking a flip chip. The head is attached to the tip of the arm 40. At the delivery position Q where the delivery means G and the mounting means H intersect, the lower surface (the surface on which the bumps 2 are formed) of the flip chip 1 is held by the suction nozzle 36 of the delivery means G. Reference numeral 43 denotes a downward opening, which sucks the upper surface of the flip chip 1 (the surface opposite to the bump 2). 50 is a chip recognition camera provided at the pickup position for recognizing the position of the flip chip 1 and the bad mark attached to the flip chip 1.
Reference numeral 51 denotes a mounting monitoring camera for observing the mounting position of the substrate 3 from below and acquiring information such as a positional shift amount between the bump 2 of the flip chip 1 and the electrode 3a of the glass substrate 3. In addition, a board supporting portion I for supporting the lower surface of the mounting position of the board 3 is provided at an end of the Y table 20. As shown in FIG.
And a cylinder 62 fixed to the upper end of a rod 61 and horizontally moving a pressing portion 63 pressing against the lower surface of the substrate 3 in the Y direction so that the upward direction is directed upward. .

Next, the operation of the electronic component mounting apparatus of the present invention will be described. First, the cylinder 30 is driven in advance to bring the ejector 32 into contact with the adhesive sheet 12. Next, the chip recognition camera 50 captures an image of the flip chip 1 to be picked up, and recognizes the presence or absence of a bad mark and the flip position. If there is no bad mark, the chip positioning section D is driven to position the flip chip 1 directly below the ejector 32. Note that the chip recognition camera 50
When imaging the flip chip 1 by using the transfer head 35
Is retracted to a position where it does not hinder imaging. Next, the delivery head 35 is moved to a position directly below the flip chip 1 positioned below the ejector 32, and the suction nozzle 36 is raised to suction the flip chip 1. When lowering the suction nozzle 36, the pin 3 of the ejector 32
2b is lowered so that the flip chip 1 is
And held by the suction nozzle 36. Next, the indexing mechanism 34 is driven to move the delivery head 35 to the delivery position Q, and the suction nozzle 43 of the mounting head 42 waiting at the delivery position Q is lowered, so that the suction head 36
The upper flip chip 1 is sucked. Next, the index mechanism 41 is driven to move the mounting head 42 holding the flip chip 1 above the substrate 3, and the mounting monitoring camera 51 uses the bump 2 of the flip chip 1 and the electrode 3 a of the substrate 3.
Is recognized, and the substrate positioning unit E is driven to align the two. When the alignment is completed, the cylinder 60 and the cylinder 62 are driven to
The pressing portion 63 is brought into contact with the lower surface of the substrate 3 to receive the substrate 3 underneath. Thereafter, the suction nozzle 43 is lowered to mount the flip chip 1 on the substrate 3.

[0016]

According to the electronic component mounting apparatus of the present invention, a board positioning section for positioning a board, a component supply section for holding a flip chip face down, and a flip chip from the component supply section face down. Since it has a delivery means for delivering to the receiving and mounting means and a mounting means for mounting the flip chip received face down from the delivery means on the board positioned in the board positioning portion in a face down state, the flip chip is always provided. It is transported face down and mounted on a board. Therefore, the tact time can be shortened by omitting the time required for flip-chip inversion, which is conventionally required.

[Brief description of the drawings]

FIG. 1 is a side view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 3 is an enlarged view of a chip take-out part in one embodiment of the present invention.

FIG. 4 is an enlarged view of a mounting position in one embodiment of the present invention.

FIG. 5 is an operation explanatory view of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Flip chip 3 Substrate A Component supply part E Substrate positioning part G Delivery means H Mounting means

Claims (3)

(57) [Claims] 1. A board positioning unit for positioning a board, a component supply unit for holding a flip chip in a face-down state, and a delivery unit for receiving and transferring a flip chip from the component supply unit in a face-down state to a mounting unit. And a mounting means for mounting the flip chip received face down from the delivery means on the board positioned by the board positioning section in a face down state. 2. The delivery means includes: a plurality of arms provided radially; delivery heads provided at respective ends of the arms; and an index mechanism for rotating the arms in an index on a horizontal plane. The electronic component mounting apparatus according to claim 1, wherein: 3. The mounting means includes: a plurality of radially provided arms; mounting heads provided at respective distal ends of the arms; and an index mechanism for rotating the arms in a horizontal plane by an index. The electronic component mounting apparatus according to claim 1, wherein: