JP3112794U - Radiator for light-emitting diode lamp - Google Patents

Abstract

A heat dissipation device for a light-emitting diode lamp in which heat generated when a light-emitting diode is energized is conducted to a heat sink by a heat-conducting liquid, and heat is diffused into the air by the heat sink.
The heat dissipation device includes a heat sink, the heat sink includes a lamp house, one end of the lamp house is sealed with a transparent lens, and the other end is bonded to the light emitting diode lamp. The heat sink also has a sealed chamber, and the chamber is filled with a heat conducting liquid, which enhances the heat dissipation effect of the heat sink, and the heat sink conducts heat into the air.
[Selection] Figure 2

Description

  The present invention relates to a kind of heat dissipation device, and more particularly to a heat dissipation device for a light emitting diode lamp.

  Light emitting diodes (LEDs) have many advantages such as high brightness, power saving, long life, low temperature, etc. Traditional incandescent bulbs emit high heat, have short life and consume power very much Has great progress. For example, when a light-emitting diode is applied to a flashlight, three AAA batteries can use three light-emitting diodes for more than 50 hours, and some manufacturers have also issued a guarantee of 70 hours. Can be seen to be outstanding.

  In order to increase the brightness, a light-emitting diode lamp is usually configured by combining several light-emitting diodes. However, although the light-emitting diodes have a low temperature advantage, when the quantity increases, a large amount of heat is generated in a finite space in the lamp. Will occur. Such heat is likely to cause aging or damage of other surrounding components, and therefore it is necessary to dissipate heat generated during light emission by a preferable design.

  In order to meet the demands of industrial benefits in the above-mentioned background, the present invention provides a kind of heat-dissipating device for light-emitting diode lamps to solve the problems that the above-mentioned traditional light-emitting diode lamps cannot achieve.

  An object of the present invention is to provide a heat dissipation device for a light emitting diode lamp, which includes a heat sink, a transparent lens, and a heat conducting liquid. The heat sink includes a lamp house, the lamp house includes first and second openings at both ends of the heat sink, and the heat sink is formed of a heat conducting material, and thereby radiates heat. In addition, there is a chamber in the heat sink, and the heat conducting liquid is filled in the chamber, thereby enhancing the heat conduction effect to the heat sink. Thereby, the heat generated when the light emitting diode is energized is conducted to the heat sink by the heat conducting liquid, and the heat diffuses into the air by the heat sink.

The invention of claim 1 is a heat dissipation device for a light emitting diode lamp,
A heat sink, the heat sink comprising a lamp house, the lamp house at both ends of the heat sink and having a first opening and a second opening; A heat sink comprising a chamber,
A transparent lens that seals the first opening;
A heat-conducting liquid filled into the chamber and conducting heat to the heat sink;
It is set as the heat radiating device for light emitting diode lamps characterized by including these.
The invention of claim 2 is a light-emitting diode lamp heat dissipation device according to claim 1, further comprising a light-emitting module, wherein the light-emitting module seals the second opening. Yes.
The invention of claim 3 is the light-emitting diode lamp heat dissipating device according to claim 2, comprising at least one light-emitting diode of the light-emitting module, and disposed on the surface of the light-emitting diode facing the lamp house. A heat dissipation device for a light emitting diode lamp is provided.
The invention of claim 4 is the light-emitting diode lamp heat dissipating device according to claim 3, further comprising a light guide material covering the light-emitting diode.
The invention of claim 5 is a light-emitting diode lamp heat dissipation device according to claim 4, wherein the light guide material is opaque.
The invention of claim 6 is the light-emitting diode lamp heat dissipating device according to claim 3, wherein the light-emitting module includes a plurality of terminals, and the plurality of terminals are disposed on a surface facing the lamp house of the light-emitting module, A plurality of terminals are used for connection to an external power source, and the light emitting diode is connected to an external power source through the plurality of terminals to emit light, thereby providing a light-emitting diode lamp heat dissipation device.
The invention of claim 7 is the light-emitting diode lamp heat dissipating device according to claim 1, characterized in that the heat conducting liquid is ultrapure water.
The invention of claim 8 is a light-emitting diode lamp heat dissipation device according to claim 1, wherein the heat conducting liquid is a mixed liquid.
The invention of claim 9 is the light-emitting diode lamp heat dissipating device of claim 6, further comprising a case having a base, the case being used for coupling with a heat sink, and the base providing an external power source The heat dissipation device for a light emitting diode lamp is characterized in that it is used for coupling with a socket.
The invention of claim 10 further includes a case having a plurality of external terminals, wherein the case is used for coupling to a heat sink, and each of the external terminals is one of them. The light-emitting diode lamp heat dissipating device is characterized by being extended from two terminals.
The invention of claim 11 is the light emitting diode lamp heat dissipating device according to claim 1, wherein the heat sink further includes a plurality of heat dissipating fins, the heat dissipating fins being arranged around the heat dissipating device, and the heat dissipating fins. Is formed of a heat conductive material to increase the surface area of heat dissipation of the heat sink, thereby providing a heat dissipation device for a light emitting diode lamp.

  The present invention provides a heat dissipation device for a light emitting diode lamp, which includes a heat sink, a transparent lens, and a heat conducting liquid. The heat sink includes a lamp house, the lamp house includes first and second openings at both ends of the heat sink, and the heat sink is formed of a heat conducting material, and thereby radiates heat. In addition, there is a chamber in the heat sink, and the heat conducting liquid is filled in the chamber, thereby enhancing the heat conduction effect to the heat sink. Thereby, the heat generated when the light emitting diode is energized is conducted to the heat sink by the heat conducting liquid, and the heat diffuses into the air by the heat sink.

  1 to 4 show the structure of a heat dissipating device for a light-emitting diode lamp according to the present invention. The heat dissipating device for a light emitting diode lamp of the present invention includes a heat sink 110, a transparent lens 120 and a light emitting module 130. The heat sink 110 is formed of a heat conductive material, and thereby radiates heat, and includes a plurality of radiating fins 112 protruding around the heat radiating surface, thereby increasing the surface area of heat radiating. In addition, the heat sink 110 includes a lamp house 122, and the lamp house 122 includes a first opening and a second opening at both ends of the heat sink 110. In addition, the transparent lens 120 is used to seal the first opening, and the light emitting module 130 is used to seal the second opening. In addition, a sealed chamber 118 is included in the heat sink 110, and the heat conducting liquid is filled in the sealed chamber 118, thereby enhancing the heat dissipation function of the heat sink 110. The chamber 118 surrounds the lamp house 122 in an annular shape, and heat energy is averaged and rapidly conducted to the heat radiating fins 112. According to a preferred legend of the present embodiment, the above-described heat conducting liquid is ultrapure water or other single liquid or mixed liquid having a high heat conduction coefficient.

  The light emitting module 130 includes at least one light emitting diode, and the light emitting diode is disposed on a surface of the light emitting module 130 facing the lamp house 122, and the light emitting diode is covered with a light guide material 132. 132 may be transparent or opaque. In addition, the light emitting module 130 includes a plurality of terminals 134, which are electrically connected to an external power source, and the above-described light emitting diode emits light when connected to the external power source using the terminal 134. The external power source described above is an AC or DC power source, and the external power source is selected according to the type of the light emitting module 130.

  In addition, as shown in FIGS. 2 and 3, the rear end of the heat sink 110 is connected to a case 160. The case 160 includes a base 162, and this case 160 is used for coupling with the heat sink 110. 162 is screwed and connected to a lamp socket that provides an external power source. The standard of the base 162 is E27, E39, or the like. The present invention does not limit the coupling method and standard of the case 160 and the heat sink 110. For example, a notch 113 is provided in the upper corner of the heat radiation fin 112 of the heat sink 110, and the case 160 is engaged with the case 160 by the notch 113. sell.

  In addition, this embodiment further includes an AC / DC conversion module 150, which converts AC power of an external power source into DC power, outputs DC power, and is electrically connected to the terminal 134.

  Further, the case of the present embodiment can be as shown in FIG. 4, and the present invention does not limit the coupling method of the case 170 and the heat sink 110, and the case 170 includes a plurality of external terminals 172. Are each extended from one of the terminals 134.

  Thereby, when the light emitting diode is energized, the generated heat is rapidly conducted to the heat sink fins of the heat sink by the heat conducting liquid, and the heat is diffused into the air by the heat sink fins of the heat sink. In addition, the light emitting module of the present invention can also emit light by adopting another light emitting device, and is not limited to the light emitting diode, and for example, a traditional incandescent bulb can be used.

  The above embodiments do not limit the scope of the present invention, and any modification or alteration of details that can be made based on the present invention shall fall within the scope of the claims of the present invention.

It is a local solid sectional view of an embodiment of the present invention. It is a three-dimensional exploded view of an embodiment of the present invention. It is a solid combination figure of the Example of this invention. It is a solid combination figure of the Example of this invention.

Explanation of symbols

110 heat sink 112 heat radiating fin 113 notch 118 chamber 120 transparent lens 122 lamp house 130 light emitting module 132 light guide material 134 terminal 150 AC / DC conversion module 160 case 162 base 170 case 172 external terminal

Claims (11)

In a heat dissipation device for a light emitting diode lamp,
A heat sink, the heat sink comprising a lamp house, the lamp house having a first opening and a second opening at both ends of the heat sink, the heat sink being formed of a heat conducting material to dissipate heat, and the heat sink being hermetically sealed A heat sink comprising a chamber,
A transparent lens that seals the first opening;
A heat-conducting liquid filled into the chamber and conducting heat to the heat sink;
A heat dissipating device for a light emitting diode lamp, comprising:   The heat dissipation device for a light emitting diode lamp according to claim 1, further comprising a light emitting module, wherein the light emitting module seals the second opening.   3. The light-emitting diode lamp heat radiation device according to claim 2, wherein the light-emitting diode lamp includes at least one light-emitting diode and is disposed on a surface of the light-emitting diode facing the lamp house. Heat dissipation device.   4. The heat dissipation device for a light emitting diode lamp according to claim 3, further comprising a light guide material for covering the light emitting diode.   The light-emitting diode lamp heat dissipating device according to claim 4, wherein the light guide material is opaque.   The heat dissipation device for a light emitting diode lamp according to claim 3, wherein the light emitting module includes a plurality of terminals, the plurality of terminals are disposed on a surface facing the lamp house of the light emitting module, and the plurality of terminals are connected to an external power source. A light-emitting diode lamp heat dissipation device, wherein the light-emitting diode is connected to an external power source through the plurality of terminals and emits light.   The heat dissipation device for a light emitting diode lamp according to claim 1, wherein the heat conducting liquid is ultrapure water.   The heat dissipation device for a light emitting diode lamp according to claim 1, wherein the heat conducting liquid is a mixed liquid.   7. The heat dissipating device for a light emitting diode lamp according to claim 6, further comprising a case having a base, wherein the case is used for coupling with a heat sink, and the base is used for coupling with a lamp socket for providing an external power source. A heat dissipating device for a light-emitting diode lamp.   The heat dissipation device for a light emitting diode lamp according to claim 6, further comprising a case having a plurality of external terminals, wherein the case is used for coupling with a heat sink, and each external terminal is extended from one of the terminals. A heat dissipating device for a light emitting diode lamp. The heat dissipation device for a light-emitting diode lamp according to claim 1, wherein the heat sink further includes a plurality of heat radiation fins, the plurality of heat radiation fins are disposed around the heat radiation device, and the plurality of heat radiation fins are formed of a heat conductive material. A heat dissipating device for a light emitting diode lamp, characterized by increasing a heat dissipating surface area of the heat sink.

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