JP2862956B2 - Substrate transfer device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial application field> The present invention takes out various substrates (hereinafter, referred to as substrates) for manufacturing electronic components such as a semiconductor substrate and a glass substrate one by one from a cassette containing multiple stages. Further, the present invention relates to a transport device for transporting and supplying the taken-out substrate to a predetermined substrate standby position or transporting and storing the substrate at the substrate standby position into a cassette, that is, a so-called indexer transport unit.

<Conventional technology> A conventional substrate processing apparatus can be roughly divided into a lifting platform that moves up and down with a plurality of cassettes containing substrates stored in multiple stages, and a horizontally movable movable along the lifting platform. A substrate take-out arm that can move forward and backward with respect to the cassette on the table, a plurality of processing units that perform various processes on the substrate,
A process transport unit that transports the substrate taken out of the cassette to each processing unit.

When removing a substrate to be processed from the cassette, first, the substrate removal arm is horizontally moved to a position facing a predetermined cassette. Subsequently, the elevating table is moved up and down so that the substrate to be processed stored in the cassette is at a height facing the substrate unloading arm. When the substrate and the substrate take-out arm face each other, the substrate take-out arm moves forward and enters below the substrate. After the arm has entered, the elevator will lower slightly. As a result, the substrate is transferred onto the substrate take-out arm. The substrate take-out arm retracts after holding the substrate by suction, and takes out the substrate from the cassette. The substrate taken out is further transferred to the process transport unit. The process transport unit transports the substrate to each processing unit. Then, a predetermined process is performed on the substrate in each processing unit. The substrates processed in each processing unit are returned to the cassette in the reverse order of the above-described substrate removal operation.

<Problems to be Solved by the Invention> However, the conventional device having such a configuration has the following problems.

That is, according to the conventional apparatus, the cassette vibrates when the cassette is moved up and down, so that the dust adhered in the cassette is separated and adheres to the substrate, or the inner wall of the substrate storage groove and the substrate end are separated. There is an inconvenience that dust is generated due to friction. Therefore, according to the conventional device, there is a problem that the substrate is easily contaminated by the influence of dust caused by vibration of the cassette.

By the way, in the substrate processing apparatus as described above, in order to carry out the substrate transfer by the process transfer unit without any trouble, or to store the processed substrate in the cassette without any trouble, the distance between the substrate take-out arm and the process transfer unit is reduced. It is desired that the substrate be aligned in the process of transferring the substrate. However, providing a substrate positioning mechanism increases the size of the substrate processing apparatus. In particular, in a semiconductor manufacturing process or the like where the installation space of the device is limited, it is strongly desired to reduce the size of the device. Therefore, it is an important issue to incorporate the substrate positioning mechanism in the device as compactly as possible.

The present invention has been made under such circumstances,
In transporting substrates between the cassette and a predetermined substrate standby position, a device for positioning the substrate is mounted, despite ensuring transport accuracy and transport stability by aligning the substrate to the standby position. It is an object of the present invention to provide a substrate transfer device that does not require a space for placing the substrate.

It is another object of the present invention to provide a substrate transfer apparatus which minimizes contamination of a substrate by dust when taking out a substrate from a cassette or storing a substrate in the cassette.

<Means for Solving the Problems> The present invention has the following configuration in order to achieve such an object.

That is, a first aspect of the present invention is directed to a first aspect of the present invention, wherein a substrate storage container for storing substrates in multiple stages while being mounted on a stationary base and a predetermined substrate standby position are provided. In the substrate transfer device for transferring, a moving means for moving between the substrate storage container and the substrate standby position, an arm mounted on the moving means, provided with a substrate holding mechanism, mounted on the moving means, Arm forward / backward drive means for driving the arm forward / backward with respect to the substrate storage container; mounted on the moving means, the upper end is located at a position lower than the lowermost substrate storage height of the substrate storage container, and the substrate is placed thereon. A plurality of abutting pieces mounted on the moving means and having an upper end positioned lower than the lowermost substrate storage height of the substrate storage container, and mounted on the substrate mounting tool; Contact and separate the outer edge of the board A substrate aligning means for aligning the mounting position of the substrate with respect to the mounting equipment; and a height at which the substrate mounting equipment mounts the substrate, based on at least a substrate storage height of the uppermost stage of the substrate storage container, which is mounted on the moving means. Arm driving means for driving the arm up and down within a range of up and down directions.

Further, the second invention according to claim (2) provides the first invention.
In each of the configurations of the invention, the moving means is configured to be capable of elevating and lowering instead of the arm elevating drive means, and the substrate mounting tool is used as a means for mounting the substrate held by the arm on the substrate mounting tool. A substrate mounting device lifting / lowering drive unit for raising / lowering between a retracted position lower than the transfer height and a substrate mounting position higher than the substrate transfer height of the arm is mounted on the moving unit, and a substrate mounted on the moving unit. A plurality of abutting pieces of the aligning means are moved from a retracted position outside the area where the substrate is transported by the arm to a position where the abutting piece contacts the outer edge of the substrate placed on the substrate placing tool, The position where the substrate is placed on the substrate placing device is adjusted.

Further, the third invention described in claim (3) is the first invention.
In each of the configurations of the invention, the operation of raising and lowering the arm to a desired substrate storage height when loading and unloading the substrate into and from the substrate storage container is performed by configuring the moving unit to be able to move up and down. The plurality of abutting pieces of the mounted substrate aligning means are moved from a retreat position outside the area where the substrate is transported by the arm to a position where the abutting piece contacts the outer edge of the substrate mounted on the substrate mounting tool. To move the substrate on the substrate mounting device so that the mounting position of the substrate is adjusted with respect to the substrate mounting device. As means for placing on the mounting device, the arm is provided with arm lifting and lowering driving means for driving the arm to move up and down from a position higher than the substrate mounting height of the substrate mounting device to a position lower than the substrate mounting height. Moving hand In which it is mounted on.

<Operation> The operation of the first invention is as follows.

When removing the substrate from the substrate storage container, the moving means moves to the vicinity of the substrate storage container, and the arm lifting drive means drives the arm up and down, so that the substrate to be removed in the substrate storage container is stored. Set the arm at the required height. The arm moves forward and backward by the arm advance / retreat drive means, the arm enters the substrate storage container, and the arm lifting / lowering drive means slightly raises the arm to hold the substrate on the arm. Thereafter, the substrate is taken out of the substrate storage container by driving the arm backward. At this time, since the upper end of the substrate mounting tool and the substrate alignment means is located at a position lower than the lowermost substrate storage height of the substrate storage container, the substrate held by the arm is
The path is taken out without obstruction by the substrate placing device or the substrate aligning means, and is brought to a position above the substrate placing device.

Next, the moving means moves to convey the substrate to the standby position, and during, before or after this movement, the arm is lowered by the arm lifting / lowering driving means to a height at which the substrate mounting tool mounts the substrate or less. Is driven downward, and the substrate held by the arm is transferred to the substrate mounting member. Thereafter, in a state where the substrate is mounted on the substrate mounting tool, the contact piece of the substrate alignment means is brought into contact with and separated from the outer edge of the substrate by
Positioning of the substrate with respect to the substrate mounting tool is performed. Since the substrate support has arrived at the substrate standby position by the moving means, by positioning the substrate with respect to the substrate support, the substrate is transported and positioned to the substrate standby position.

On the other hand, when carrying the substrate at the substrate standby position into the substrate storage container, the moving means is at the substrate standby position, the arm is below the substrate mounting height of the substrate mounting device, and the substrate mounting device is configured to transfer the substrate. It is in a mounted state. By means of substrate alignment,
After the positioning of the substrate, the arm is lifted, so that the arm receives the aligned substrate from the substrate mounting tool and holds it. After such alignment, the moving means moves to the vicinity of the substrate storage container, and during or after this movement, the arm is driven up and down to be set at a predetermined storage position of the substrate storage container. . Subsequently, the arm is driven forward to carry the substrate into the substrate storage container, transfer the substrate into a predetermined storage groove of the substrate storage container, and then drive the arm out of the substrate storage container.

 The operation of the second invention is as follows.

When removing a substrate from the substrate storage container, the moving means moves to the vicinity of the substrate storage container and moves up and down to set the arm to a height at which the substrate to be removed is stored in the substrate storage container. And the first
The substrate is taken out of the substrate storage container in the same manner as in the above invention.
At this time, the contact pieces of the substrate mounting tool and the substrate alignment means are:
Since the arm is at the retracted position outside the area where the substrate is transported, the substrate can be taken out without being disturbed by the substrate mounting tool or the contact piece, and brought above the substrate mounting tool.
After the substrate is taken out, after the moving means has moved to the substrate standby position, the substrate mounting device rises from a retracted position lower than the height at which the arm is transporting the substrate to a position higher than the transport height of the arm. The substrate is driven and the substrate on the arm is transferred to the substrate mounting device. Subsequently, the alignment of the substrate on the substrate mounting tool is performed by the substrate alignment means, and the substrate is conveyed and positioned to the substrate standby position.

When the substrate at the substrate standby position is carried into the substrate storage container, the moving unit is at the substrate standby position, and the substrate mounting tool is at a position higher than the arm. After aligning the substrate on the substrate mounting device by the substrate alignment means, the substrate mounting device is lowered and the aligned substrate is delivered to the arm. After such alignment, the moving means moves to the vicinity of the substrate storage container and moves up and down to set the arm to a predetermined storage position of the substrate storage container. Less than,
The substrate is carried into the substrate storage container in the same manner as in the first invention.

 The operation of the third invention is as follows.

When the substrate is taken out of the substrate storage container, the position of the arm is set by moving and moving up and down the moving means as in the second invention, and the predetermined substrate is taken out of the substrate storage container. At this time, the substrate mounting member is at a position lower than the substrate transfer height by the arm, and the contact piece of the substrate alignment means is at the retracted position outside the area where the substrate is transferred by the arm, so that the substrate The substrate is taken out without being disturbed by the mounting device or the contact piece, and is brought above the substrate mounting device. When the substrate is taken out, the moving means moves to the substrate standby position as in the first invention.
Thereafter, the substrate on the arm is delivered to the substrate mounting device by lowering the arm to a position lower than the upper end of the substrate mounting device. Subsequently, the substrate is aligned on the substrate mounting tool by the substrate alignment means. The substrate is conveyed and positioned to the substrate standby position.

On the other hand, when the substrate at the substrate standby position is carried into the substrate storage container, the moving unit is at the substrate standby position, and the arm is in a state below the substrate mounting member. After the substrate on the substrate mounting device is aligned by the substrate alignment means, the arm is raised and the aligned substrate is delivered to the arm. After such alignment, the moving means moves to the vicinity of the substrate storage container and moves up and down to set the arm to a predetermined storage position of the substrate storage container. Hereinafter, the substrate is carried into the substrate storage container in the same manner as in the first invention.

<Example> Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

First Embodiment FIG. 1 shows a schematic configuration of a semiconductor manufacturing apparatus using a substrate transfer apparatus according to the present embodiment.

This semiconductor manufacturing apparatus is an apparatus for coating a semiconductor substrate with a photoresist or the like and performing a heat treatment, and is roughly divided into a portion for storing an unprocessed substrate and a portion for storing a processed substrate (hereinafter, referred to as an indexer module). )
10 and a process module 20 related to substrate processing.

On the stationary base 11 of the indexer module 10, a plurality (here, four) of cassettes C as a substrate storage container that stores semiconductor substrates (hereinafter, simply referred to as substrates) W such as silicon wafers in multiple stages. Are placed in a line. The indexer module 10 includes each cassette C
And an indexer transfer unit 30 for transferring the substrate W between the substrate transfer position P and a predetermined substrate transfer position P. Incidentally, the transfer position P, each processing unit 23 ₁ in the process module 20, 23 _2, 24 _2, 24 _2, 24 ₃ to the process transport unit 21 and the indexer transport unit 30 which transports the substrate W in a predetermined order This is a position where the substrate W is transferred between them.

Please refer to FIG. Figure 2 shows the indexer module
10 shows a plan view.

As described in detail later, the indexer transport unit 30 is configured to be movable between each cassette C and the substrate transfer position P, and an arm 31 that holds the substrate by sucking the lower surface of the substrate, Although not shown in FIG. 2, an arm moving mechanism for moving the arm 31 forward and backward with respect to the cassette C and an arm moving mechanism for moving the arm 31 up and down are mounted, and the substrate W is placed thereon. There are mounted three support pins 32 which can be moved up and down as substrate mounting tools for performing the operation, a substrate alignment mechanism for aligning the substrate W mounted on these support pins 32, and the like. The substrate alignment mechanism will be described later in detail, but an alignment plate slidably disposed on each side of the support pin 32.
34a and 34b, a plurality of convex contact pieces 33 are arranged in an arc shape so as to have substantially the same curvature as the substrate W.
The alignment plates 34a and 34b are reciprocally driven so that the substrate W comes into contact with and separates from the outer edge of the substrate W on the support pins 32, so that the position of the substrate W with respect to the support pins 32 is adjusted.

A U-shaped bracket 35 that can be moved up and down is provided so as to sandwich the front and rear of the cassette C mounted on the base 11, and a light projecting element 36 and a light receiving element 37 are provided at both ends of the bracket 35. Is attached. In the present embodiment, before the substrate W is taken out by the arm 31, the bracket 35 is moved up and down along the cassette C to determine whether the substrate W is stored in each storage groove of each cassette C by the optical sensor. The information on the presence or absence of the substrate for each storage groove of each cassette C obtained by the detection is stored in a memory of a control device (not shown), and when the substrate is taken out by the arm 31, the information in the memory is stored in the memory. The position of the arm 31 is set based on this.

Returning to FIG. 1, after being taken out of the cassette C by the indexer transport unit 30 and moved to the substrate transfer position P, the substrate W is positioned as described later, and the substrate is transferred to the process transport unit 21. W is delivered.

The process transfer unit 21 transfers the substrate W while the substrate W is mounted on the swivelable U-shaped substrate support arm 22, and the spinner units 23 ₁ and 23 ₂ provided in the process module 20 and heat treatment. turn continue to setting the substrate W to the unit 24 _{1-24 3.} The substrate W processed by the process module 20 is transferred from the process transfer unit 21 to the indexer transfer unit 30 at the substrate transfer position P, and then returned into the cassette C by the indexer transfer unit 30.

Hereinafter, the detailed configuration of the indexer transport unit 30 will be described with reference to FIGS.

FIG. 3 is an exploded perspective view showing the moving mechanism 40, the arm lifting / lowering mechanism 50, and the arm advance / retreat driving mechanism 60 provided in the indexer transport unit 30. In FIG. 3,
For easy understanding, the support pins 32 and the contact pieces 33 provided in the indexer transport unit 30 and a mechanism for driving them are not shown.

The movable base member 41 of the moving mechanism 40 includes a pair of guide rails arranged side by side on the cassette setting base 11 shown in FIG.
42 is slidably fitted to 42. Movable base member 41
Is screwed onto a screw shaft 43 arranged side by side on the guide rail 42, and is connected to one end of the screw shaft 43 by a motor (not shown).
Are horizontally driven along the base 11 by being driven to rotate in the forward and reverse directions. Note that the moving mechanism 40 corresponds to the “moving means” in the configuration of the first invention.

The moving mechanism 40 includes an arm elevating mechanism 50 having the following configuration.
Is installed.

That is, a gate-shaped frame 51 is erected on the movable base member 41, and a lifting member 53 is slidably fitted on a pair of guide shafts 52 that are erected on the gate-shaped frame 51 vertically. . The elevating member 53 is screwed to a screw shaft 54 provided in parallel with the guide shaft 52, and this screw shaft 54 is connected to the beam member 51.
The belt is driven in the forward and reverse directions by a motor 55 attached to a to ascend and descend. Lifting member 53
Is provided with a pair of brackets 56, and an arm advance / retreat drive mechanism 60 is disposed on the brackets 56. Note that the arm lifting / lowering mechanism 50 corresponds to “arm lifting / lowering driving means” in the configuration of the first invention.

A guide rail 62 is provided on a base plate 61 of the arm advance / retreat drive mechanism 60 in a direction perpendicular to the moving direction of the movable base member 41, and an arm base 63 is slidably fitted on the guide rail 62. ing. Above the support rod 64 erected on the arm base 63, a thin plate-shaped arm 31 for holding the substrate W by suction is horizontally supported in a cantilever manner.
At the tip of the arm 31, there is a suction hole 31a for sucking the substrate W in vacuum.

An endless belt 65 is provided on the base plate 61 of the arm advance / retreat drive mechanism 60 in parallel with the guide rail 62 by a pair of driven pulleys.
The belt 65 is stretched between 66a and 66b, and a part of the belt 65 is connected to the arm base 63. Further, an endless belt 68 is stretched between the driven pulley 66b and the driven pulley 67, and the arm base 63 is moved to the guide rail 62 by driving the driven pulley 67 in the forward and reverse directions by a stepping motor 69. It reciprocates along. Note that the arm advance / retreat drive mechanism 60 corresponds to “arm advance / retreat drive means” in the configuration of the first invention.

An optical sensor 70 is attached to the base plate 61 to detect the origin position of the arm base 63.
The origin of the arm 31 is detected by detecting the L-shaped light shielding plate 71 extending horizontally from the arm base 63 by the arm 70.

Next, with reference to FIGS. 4 to 6, the support pins 32 and the contact pieces 33 provided in the indexer transport unit 30 and a mechanism for driving them will be described. Note that the support pins 32 correspond to the “substrate placing device” in the configuration of the first invention.

FIG. 4 shows a support pin 32, an abutment piece 33, and an indexer transport unit 30 with these drive mechanisms mounted.
3 is a partially cutaway view taken in the direction of arrow A in FIG. 3, FIG. 5 is a view of the indexer transport unit seen in the direction of arrow B in FIG. 4, and FIG. 6 is a substrate alignment mechanism mounted on the indexer transport unit 30. 3 is a partially broken plan view of FIG.

On the upper surface of the gate-shaped frame 51, the matching plate described in FIG.
A base plate 80 for slidably supporting the base plates 34a and 34b is mounted in a cantilever manner. At the center of the base plate 80, a support rod 64 of the arm 31 shown in FIG. 3 is led out, and a long hole 80a (FIG. 2 and FIG. (See the figure). As shown in FIG. 4, a pair of guide rails 81a is provided in a direction orthogonal to the elongated holes 80a, and a slide plate 82a is slidably mounted on the guide rails 81a. One matching plate 34a is supported by the sliding plate 82a via a support plate 83a. A similar pair of guide rails 81b is provided at a position facing the guide rail 81a with the long hole 80a interposed therebetween (see FIG. 5), and the other slide plate 82b slidably mounted on the guide rail 81b is provided on the other side. The matching plate 34b is supported via a support plate 83b.

As shown in FIG. 4, below each sliding plate 82a, 82b,
Link members 85 are provided, each of which is swingably attached to the base plate 80 via a support shaft 84. Each link member
85 is loosely connected to the sliding plates 82a, 82b via connecting pins 86, respectively. In addition, below each link member 85,
There is a U-shaped pusher plate 88 slidably fitted on a guide rail 87 provided on the base plate 80 (see FIGS. 6 and 7).
Are loosely coupled to the respective link members 85. Seventh
As shown in the figure, when the pusher plate 88 is pushed out in the direction of arrow C in the same figure by a cam mechanism described later, the acting force is transmitted to each link member 85 via a connecting pin 89, and each link member 85 Swings about the support shaft 84 in the direction of arrow D. As a result, the alignment plates 34a and 34b connected to the connection pins 86 of the link members 85 move in a direction approaching each other (the direction of arrow E), and the respective contact pieces 33 provided on the alignment plates 34a and 34b Touch the outer edge.

As shown in FIG. 6, three support pins 32 between the alignment plates 34a and 34b are supported by a U-shaped support plate 90. The base of the support plate 90 is connected to an elevating member 91, and the elevating member 91 is slidably fitted on a guide rail 92 attached to the portal frame 51 in the vertical direction. As shown in FIG. 5, the elevating member 91 is urged downward by a coil spring 93, and when the arm 31 moves the substrate W in and out of the cassette C, the lower limit shown in FIG. In position. Note that the arm 31 indicated by a chain line in the figure indicates the arm position when it is at the lower limit position.

The upper ends of the contact pieces 33 provided on the alignment plates 34a and 34b,
4 and 5, the upper end of the support pin 32 at the lower limit position is set to a position lower than the storage height of the substrate W 'at the lowermost stage of the cassette C, as shown in FIGS. When the arm 31 moves the substrate W in and out of the cassette C, the contact pieces 33 and the support pins 32 do not hinder the substrate transport.

Next, a mechanism for driving the contact piece 33 and the support pin 32 described above will be described.

As shown in FIGS. 4 and 6, a guide rail 94 is provided on one side wall of the gate-shaped frame 51 in a vertical direction, and a member 97c is slidably fitted on the guide rail 94. The member 97c is connected to the cam member 95 via the member 97b. An air cylinder 96 is attached inside the side wall of the portal frame 51 provided with the cam member 95, and the rod 96a of the air cylinder 96 and the cam member 95 are connected via connecting members 97a and 97b. ing. The operating curved surface of the cam groove 95a formed in the cam member 95 is:
The upper portion has a curved portion 95b that is convex in the sliding direction of the pusher plate 88 (leftward in FIG. 4), and the lower portion of the curved portion 95b extends vertically. This cam member 95
A cam follower 99 attached below the L-shaped driven member 98 is fitted into the driven member 98, and the other end of the driven member 98 is connected to the pusher plate 88.

As shown in FIG. 5, the member 97 connected to the cam member 95
Below the b, a push-up member 100 is attached so as to be separated from the lower end of the elevating member 91, and the push-up member 100 abuts on the lower end of the elevating member 91 while the cam member 95 is being driven up. By contact, the subsequent cam member 95
The lifting member 100 is configured to push up the elevating member 91 against the urging force of the coil spring 93 and to raise the support pin 32 with the rise. Note that reference numeral 10 shown in FIG.
Reference numeral 1 denotes a stopper that contacts the lower end of the push-up member 100 and restricts the downward movement of the cam member 95.

Next, the operation of the indexer transport unit 30 having the above-described configuration will be described with reference to FIG.

The operation for taking out a predetermined substrate W from the cassette C is as follows.

First, when the screw shaft 43 of the moving mechanism 40 shown in FIG. 3 is driven to rotate, the movable base member 41 moves horizontally,
It reaches a position facing a predetermined cassette C. During the above-mentioned movement or after the movement, the motor 55 of the arm lifting mechanism 50
Is driven to move the arm 31 up and down.
31 is the substrate W from which the cassette C is to be taken out.
Set to the height corresponding to the storage groove position. Next, when the stepping motor 69 of the arm advancing / retracting drive mechanism 60 is driven to rotate forward, the arm 31 is advanced below the substrate W to be taken out from the cassette C. Then, the substrate W is moved upward by slightly raising the arm 31.
The substrate W is moved upward, and the arm 31 holds the substrate W by suction. Substrate W
, The stepping motor 69 is driven to rotate in the reverse direction, and the arm 31 is retracted to the original position (the position shown in the second diagram).
At the time of such a substrate taking-out operation, the support pins 32 are lowered to the lower limit position.

When the arm 31 returns to the home position while holding the substrate W by suction, the movable base member 41 of the moving mechanism 40 moves horizontally,
The substrate W is transported to the substrate transfer position P shown in FIG. During or after this horizontal movement, the motor 55 of the arm elevating mechanism 50 is driven to lower the arm 31 to the lower limit position. Since the lower limit position of the arm 31 is set lower than the upper end of the support pin 32 at the retracted position,
When the suction is released when the arm 31 is lowered, the substrate W on the arm 31 is transferred onto the support pin 32 at the standby position as shown in FIGS. 8 (A1) and (B1). You. At this time, since the rod 96a of the air cylinder 96 shown in FIG. 4 is retracted (the state shown in FIG. 4), the cam member 95 is at the lower limit position. Therefore, as shown in FIG. 9, since the cam follower 99 provided on the driven member 98 is at the upper limit position of the cam groove 95a, the alignment plates 34a and 34b are in an open state.

When the arm 31 reaches the lower limit position, the air cylinder 96 is driven, the rod 96a is extended, and the cam member 95 moves upward. With the rise of the cam member 95, as shown in FIG. 9, the cam follower 99 moves along the curved portion 95b of the cam groove 95a,
Since the driven member 98 is displaced in the left direction in the drawing, the driven member 98 is displaced in the same direction, and as a result, the alignment plates 34a and 34b move closer to each other. When the cam follower 99 has come to the vertex P ₁ of the curved portion 95b, i.e., the aligning plates 34a, when 34b is closest to each other, the alignment plate as the inscribed circle of each contact member 33 is about the same as the substrate diameter Since the positional relationship between 34a and 34b is adjusted in advance, even if the substrate W is placed on the support pins 32 in a state where the substrate is displaced, the alignment plate 34
During the movement of the a and b, the contact piece 33 contacts the outer edge of the substrate W to horizontally displace the substrate W, so that the substrate W
(See FIGS. 8 (A2) and (B2)).

When the cam member 95 further rises, the cam follower 99 moves to the ninth position.
Gradually return to the right direction from the P ₁ position of the figure, where advanced to the P ₂ position, returns to the original position. Thereby, the matching plates 34a, 34
b returns to the original open state. Cam follower 99 until the P ₂ position, when the cam member 95 is raised, the push-up member 100 connected to the cam member 95 comes into contact with the lower end of the elevating member 91, thereafter, with increasing cam member 95 And elevating members
91 rises. As a result, the support pins 32 are raised in a state where the aligned substrate W is placed thereon, and the height set in advance so that the substrate W is transferred between the indexer transport unit 30 and the process transport unit 21 ( The substrate W is lifted up to the “substrate delivery height” (see FIGS. 8 (A3) and 8 (B3)). The substrate transfer height corresponds to P ₃ position of the cam follower 99 shown in Figure 9.

When the moving mechanism 40 reaches the substrate transfer position P and the positioning of the substrate is completed, the process transport unit that has come to this position
The substrate support arm 22 of 21 enters below the substrate W placed on the support pins 32, as shown in FIGS. 8 (A4) and 8 (B4). Thereafter, the substrate support arm 22 is raised,
The substrate W is transferred onto the substrate support arm 22, and the substrate support arm 22 transfers the substrate W to each processing unit of the process module 20, as described above.

Next, an operation when the substrate W is carried into the cassette C will be described.

The loading of the substrate W is performed in substantially the reverse order of the above-described unloading operation of the substrate W. That is, the indexer transport unit
Numeral 30 denotes a substrate transfer position P, in which the arm 31 is lowered and the support pins 32 are raised and waiting. Thereafter, the substrate W processed by the process module 20 is transferred to the substrate transfer position P while being placed on the substrate support arm 22. Thereafter, the substrate W is transferred to the support pins 32 by lowering the substrate support arm 22 of the process transfer unit 21.

In this state, the cam follower 99 is, as shown in FIG.
In P ₃ position of the cam member 95. When the substrate W is delivery, the rod 96a of the air cylinder 96 retracts, the cam member 95 is lowered, cam follower 99 moves toward the P ₂ position from the P ₃ position. During this time, as the cam member 95 descends,
When the elevating member 91 is lowered, the support pins 32 are lowered, and the substrate W is set at the lower limit position. Cam member 95
There was further lowered, by the cam follower 99 moves from P ₂ located in P ₁ position, the abutment piece 33 is similarly described above, it is driven so as to contact the outer edge of the substrate W, the position of the substrate W Matching is performed. When the cam member 95 is lowered to the home position, cam follower 99 returns to P ₀ position. With this, the contact piece
33 returns to the initial state away from the substrate W.

After the above-described alignment, the arm 31 is raised and the support pin
The substrate W aligned on 32 is placed on the arm 31 and held by suction. Subsequently, the moving mechanism 40 is horizontally driven to a position facing the original cassette C, and
The substrate W is moved up and down to the height of the storage groove in which the substrate W is stored.

When the movement of the moving mechanism 40 and the setting of the height of the arm 31 are completed, the arm advance / retreat drive mechanism 60 is driven, the arm 31 enters the cassette C, and the substrate W is carried into the predetermined storage groove. Thereafter, the substrate W is transferred to the storage groove by slightly descending in a state where the arm 31 has released the suction of the substrate W. When the delivery of the substrate W is completed, the arm
31 is driven out and returns to the origin position.

As described above, when the transfer of the substrate W is completed, the indexer transport unit 30 waits for the next substrate W removal operation.

Second Embodiment In the first embodiment, the arm 31 is moved up and down to a height facing a predetermined storage groove of the cassette C by the arm elevating mechanism 50 mounted on the moving mechanism 40 to carry out the loading / unloading of the substrate W. The moving mechanism (the first
(Equivalent to the moving mechanism 40 of the embodiment) is mounted on the elevating mechanism so that the moving mechanism can be moved up and down, and the arm is set to a predetermined storage groove height by moving the moving mechanism itself up and down. Is also good.

The arm mounted on the moving mechanism has a substrate holding mechanism by suction or the like, and is driven forward and backward with respect to the cassette by the same arm forward and backward driving mechanism as in the first embodiment.

In the second embodiment, the moving mechanism itself is configured to move up and down, and the arm itself does not move up and down independently as in the first embodiment. Therefore, the arm and the substrate mounting device (the support pins 32 in the first embodiment) are used. ) Is provided with the following substrate placement device lifting / lowering drive mechanism for the transfer of the substrate. That is, in the substrate mounting device lifting / lowering drive mechanism of the second embodiment, the upper end of the substrate mounting device has a retracted position lower than the substrate transfer height by the arm;
The substrate mounting device is configured to be driven to move up and down so as to move between the substrate mounting height higher than the substrate transfer height.

Further, in the second embodiment, when the substrate is taken in and out of the cassette by the arm, the abutment piece for aligning the substrate does not hinder the taking in and out of the substrate because the arm is configured not to move up and down independently. To a different position. In other words, the substrate alignment means of the present embodiment (for example, the alignment plates 34a and 34b in the first embodiment) is provided with a plurality of abutting pieces provided when the substrate is transported by the arm. The substrate is retracted to a retreat position outside the area where the substrate is transported (that is, in the first embodiment, the contact piece 33 does not contact the substrate when the substrate is carried out / in.
(It is retracted to a position where the space between the matching plates 34a and 34b is wider than the outer diameter of the substrate W). When aligning the substrate placed on the substrate mounting device, the contact piece is moved from the retracted position to a position in contact with the outer edge of the substrate so that the substrate is aligned. ing.

According to the second embodiment, after the arm is set to the height facing the predetermined storage groove of the cassette by the horizontal movement and the vertical movement by the moving means, the arm enters the cassette by the arm advance / retreat drive mechanism. When driven, it receives the substrate in the cassette and holds the substrate. After that, the arm withdraws from the cassette and takes out the substrate above the substrate placing device. Next, the movement of the moving mechanism horizontally to transfer the substrate to the substrate delivery position is the same as in the first embodiment. Thereafter, the substrate on the arm is transferred to the substrate mounting tool by raising the substrate mounting tool to a position higher than the substrate transfer height by the arm. Then, the substrate alignment mechanism is driven to perform substrate alignment.

When loading a substrate into the cassette, the substrate transfer device according to the present invention is kept at the substrate transfer position in a state where the substrate mounting member is raised to a position higher than the substrate transfer height by the arm, and The substrate is transferred from the process transfer unit 21 shown in FIG. next,
After the substrate aligning means is driven and the substrate is aligned, the substrate mounting tool is lowered, whereby the substrate on the substrate mounting tool is mounted on the arm and held. After the above-described substrate alignment, the moving mechanism moves up and down together with the horizontal movement, transports the substrate to a position facing the original storage groove of the cassette, and drives the arm to enter the cassette, thereby moving the substrate. Is stored in a predetermined groove in the cassette.

With this configuration as well, as in the first embodiment, the loading / unloading of the substrate to / from the cassette and the alignment of the substrate can be performed in the same substrate transport apparatus.

Third Embodiment Similarly to the second embodiment, the third embodiment is configured such that a moving mechanism can be moved up and down as a mechanism for moving the arm up and down to a height facing a predetermined storage groove of the cassette, The arm is set to a predetermined storage groove height by raising and lowering the moving mechanism itself.

The arm mounted on the moving mechanism has a substrate holding mechanism by suction or the like, and is driven forward and backward with respect to the cassette by the same arm forward and backward driving mechanism as in the first embodiment.

The substrate mounting device mounted on the moving mechanism for mounting the substrate is provided at a position lower than the substrate transfer height so as not to hinder the transfer of the substrate by the arm.

Further, a plurality of contact pieces provided in the substrate aligning means for aligning the substrate placed on the substrate placing device are configured in the same manner as in the second embodiment.

Further, an arm lifting / lowering drive mechanism similar to the arm lifting / lowering mechanism 50 of the first embodiment is mounted on the moving mechanism as a means for transferring the substrate between the arm and the substrate mounting tool. However, since the arm lifting / lowering drive mechanism of the present embodiment is provided for transferring the substrate between the arm and the substrate mounting device, the driving range of the arm is limited to the substrate mounting of the substrate mounting device. It is between a position higher than the height and a position lower than the substrate mounting height.

According to the present embodiment, as in the second embodiment, after the moving mechanism is driven, the substrate in the cassette is taken out by the arm. After the arm withdraws from the cassette, the moving mechanism moves horizontally to transfer the substrate to the substrate transfer position, as in the first embodiment. Next, when the arm is lowered by the arm lifting / lowering drive mechanism, the substrate is delivered to the substrate mounting tool, and the substrate alignment mechanism is driven to perform the alignment of the substrate.

When loading the substrate into the cassette, the substrate transfer device according to the present invention is kept at the substrate transfer position in a state where the arm is retracted to a position lower than the substrate mount, and the first
The substrate is transferred from the process transfer unit 21 or the like shown in FIG. Next, the substrate alignment means is driven, and after the substrate is aligned, the arm is driven up to a position higher than the substrate mounting height, so that the substrate on the substrate mounting tool is placed on the arm. It is placed and held. After the above-described substrate alignment, the moving mechanism moves horizontally and vertically, transports the substrate to a position facing the original storage groove of the cassette, and drives the arm into the cassette to move the substrate. It is stored in a predetermined groove in the cassette.

Further, any of the first to third inventions can be configured as follows.

(1) In the first embodiment, four cassettes are mounted on the stationary base. However, the number of cassettes may be one or five or more.

(2) In the first embodiment, the reason why the support pins 32 are moved up and down is that the wafer support arm 22 of the wafer transfer mechanism 21 is constituted by a U-shaped arm that supports the substrate W from outside the support pins 32. Therefore, when the substrate W is transferred at the lower limit position of the support pins 32, the alignment plates 34a and 34b are in the
This is because the wafer support arm 22 cannot enter below the space. Therefore, the wafer support arm (for example, the substrate W) having a structure that does not interfere with the alignment plates 34a and 34b.
Arm that sucks and holds the substrate from above), the substrate W
It is not always necessary to raise and lower the support pin 32 for the delivery of the product.

(3) As an example of a substrate processing apparatus in which the substrate transfer apparatus according to the present invention is used, a semiconductor manufacturing apparatus that coats a substrate with a photoresist or the like has been described as an example. It can be applied to various substrate processing apparatuses such as a diffusion processing apparatus. In particular, as a substrate storage container when applied to a heat treatment apparatus such as a diffusion furnace or an oxidation furnace, instead of the cassette of the embodiment, a large number of semiconductor substrates are arranged at regular intervals in a quartz tube of a semiconductor heat treatment furnace. It is also possible to use a boat that is inserted into and extracted from the boat.

(4) The substrate to be transported is not limited to the semiconductor substrate as in the embodiment, but may be various substrates such as a glass substrate for a liquid crystal display and a metal plate.

(5) The substrate holding mechanism provided on the arm is not limited to the one by suction, and may be configured by a support pin or the like for mounting the substrate.

(6) Further, the substrate mounting device is not necessarily limited to the pin structure.
The plate-shaped member may be a plate-shaped member, and the contact piece of the substrate aligning means is not limited to the pin-shaped one, and the plate-shaped member whose end side is formed in a concave shape having a curvature similar to the outer diameter of the substrate may be used. The substrate may be aligned by contacting and separating from the outer edge.
When the substrate is rectangular, it goes without saying that the contact pieces are arranged and formed according to the shape.

(7) The substrate transfer device according to the present invention is not limited to being mounted on an apparatus that performs processing on a substrate such as the process module 20, but may be mounted on various measuring devices, for example. Good. Further, the substrate transfer position P in each of the embodiments corresponds to the “substrate standby position” in the configuration of the first to third inventions. The substrate standby position is not limited to the substrate transfer position P with the substrate transfer means such as the process transfer unit 21, and may be, for example, a measurement stage of various measurement devices for the substrate.

As described above, each part of the present invention can be variously modified and implemented, and these modified embodiments are also included in the present invention without departing from the gist of the present invention.

<Effects of the Invention> As is apparent from the above description, the substrate transfer device according to any one of the first to third aspects of the present invention also moves between the substrate storage container and the substrate standby position. Conventionally, the moving means mounted with the arm for carrying out and carrying in the substrate, a substrate mounting device for mounting the substrate, and a substrate aligning device for aligning the substrate mounted on the substrate mounting device. Unlike the apparatus, there is no need to provide a substrate positioning mechanism separate from the substrate transport apparatus, and the substrate processing apparatus using this type of substrate transport apparatus can be downsized accordingly.

In addition, each invention of claims (1) to (3) is:
Since the cassette does not move up and down when removing substrates from the cassette or storing substrates in the cassette, dust generated due to vibration of the cassette is eliminated, and the problem of substrate contamination during the substrate transport process is minimized. Can be reduced.

[Brief description of the drawings]

FIGS. 1 to 9 relate to a first embodiment of the present invention.
FIG. 2 is a perspective view of an external appearance of a substrate processing apparatus using the substrate transport apparatus according to the embodiment, FIG. 2 is a plan view of an indexer transport unit, and FIG. 3 is a moving mechanism, an arm elevating mechanism, FIG. 4 is an exploded perspective view showing an arm advance / retreat drive mechanism, FIG. 4 is a view taken in the direction of arrow A in FIG. 3, and FIG. 5 is a view showing the configuration of a substrate mounting mechanism and a substrate alignment mechanism provided in the indexer transport unit. FIG. 4 is a view in the direction of arrow B in FIG. 4, FIG. 6 is a partially cutaway view of the substrate mounting mechanism and the substrate alignment mechanism in plan view, FIG. 7 is an explanatory view of the substrate alignment mechanism, and FIG. FIG. 9 is an explanatory view of the position of a cam follower as the cam member moves up and down. W: semiconductor substrate (substrate) C: cassette (substrate storage container), 11: base 30: indexer transport unit 32: support pin (substrate mounting tool) 40: moving mechanism (moving means) 60: arm advance / retract driving mechanism ( Arm advance / retreat drive means) 33 ... Contact piece (board alignment means) 34a, 34b ... Alignment plate (board alignment means) 95 ... Cam member, 99 ... Cam follower 96 ... Air cylinder

Continued on the front page (72) Inventor Takeo Okamoto 322 Hazushishi Furukawacho, Fushimi-ku, Kyoto-shi, Kyoto Prefecture Dainippon Screen Mfg. Co., Ltd.Narasai Plant No. 322 Dainippon Screen Mfg. Co., Ltd. Rakusai Plant (56) References JP-A-2-211650 (JP, A) JP-A-3-211749 (JP, A) JP-A-3-290946 (JP, A) ) Patent 2552017 (JP, B2) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 21/68 B65G 49/07

Claims (3)

(57) [Claims] 1. A substrate transport apparatus for transporting a substrate between a substrate storage container for storing substrates in multiple stages while being mounted on a stationary base and a predetermined substrate standby position, wherein: Moving means for moving between a container and the substrate standby position; an arm mounted on the moving means and having a substrate holding mechanism; and an arm mounted on the moving means for driving the arm forward and backward with respect to the substrate storage container. An arm reciprocating drive unit that is mounted on the moving unit, an upper end is located at a position lower than a lowermost substrate storage height of the substrate storage container, and a substrate mounting tool for mounting a substrate; A plurality of abutting pieces whose upper ends are lower than the lowermost substrate storage height of the substrate storage container are in contact with and separated from the outer edge of the substrate placed on the substrate mounting tool, Adjust the mounting position of the substrate with respect to the mounting And a substrate aligning means to be mounted on the moving means, at least in a vertical range from the uppermost substrate storage height of the substrate storage container to a height at which the substrate mounting tool mounts the substrate. A substrate transport device, comprising: an arm raising / lowering drive unit that drives an arm up / down. 2. A substrate transport apparatus for transporting a substrate between a substrate storage container for storing substrates in multiple stages while being mounted on a stationary base and a predetermined substrate standby position, wherein Moving between the container and the substrate standby position,
A moving means capable of moving up and down, an arm mounted on the moving means and provided with a substrate holding mechanism, an arm moving means mounted on the moving means and driving the arm forward and backward with respect to the substrate storage container, A substrate mounting device mounted on a moving unit and mounting a substrate, an upper end of the substrate mounting device mounted on the moving unit, a retreat position lower than the substrate transfer height of the arm, and a substrate transfer height of the arm. A substrate mounting tool elevating drive means for driving the substrate mounting tool up and down so as to move between a substrate mounting position higher than the arm and a plurality of abutting pieces mounted on the moving means; From the retreat position, which is outside the area where the substrate is transported, to a position where it abuts on the outer edge of the substrate mounted on the substrate mounting device, and aligns the mounting position of the substrate with respect to the substrate mounting device. Substrate alignment means for Substrate transfer apparatus characterized by comprising. 3. A substrate transport apparatus for transporting a substrate between a substrate storage container that stores substrates in multiple stages while being mounted on a stationary base and a predetermined substrate standby position, wherein Moving between the container and the substrate standby position,
A moving means capable of moving up and down, an arm mounted on the moving means and provided with a substrate holding mechanism, an arm moving means mounted on the moving means and driving the arm forward and backward with respect to the substrate storage container, The upper end is located at a position lower than the substrate transfer height by the arm, and a substrate mounting tool for mounting the substrate, and a plurality of contact pieces mounted on the moving unit, By moving the arm from the retracted position outside the area where the substrate is transported to the position where the arm is in contact with the outer edge of the substrate mounted on the substrate mounting tool, the mounting position of the substrate relative to the substrate mounting tool is changed. A substrate aligning means for aligning, and an arm lifting / lowering drive mounted on the moving means for driving the arm up and down from a position higher than the substrate mounting height of the substrate mounting tool to a position lower than the substrate mounting height. Substrate transfer apparatus comprising: the means.