JP2812806B2 - Package for integrated circuit with test pad - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit package provided with a test pad to which a test probe is applied for conducting a continuity test between an integrated circuit mounted on an insulating container and external leads. .

[0002]

2. Description of the Related Art External leads for electrically connecting an integrated circuit mounted on an insulating container to the outside are connected by a frame at the time of manufacture. Then, after the integrated circuit is mounted on the insulating container, it is necessary to separate the frame body, make each external lead independent, and conduct a continuity test between the integrated circuit mounted on the insulating container and the external lead.

However, if the frame body is cut as it is, the external leads are separated, and the external leads are deformed and the external leads come into contact with each other.

Therefore, as shown in FIG.
A technique is known in which a reinforcing frame 102 made of an insulating material made of ceramic or the like is joined around 1 and then the frame body 103 is cut off, and each external lead 101 is reinforced while each external lead 101 is independent. I have.

[0005]

In recent years, as the density and density of integrated circuits have increased, the size of the insulating container 104 of the integrated circuit package 100 has been reduced. The number of external leads 101 has increased. Therefore, the distance between adjacent external leads 101 is reduced, and the line width of the external leads 101 is also reduced.
Specifically, the distance between adjacent external leads 101 is 0.025 mm
The width of the external lead 101 to which the probe abuts at
When the distance between the external leads 101 is 0.020 mm and the distance between the external leads 101 is 0.020 mm, the width of the external leads 101 to which the probe comes in contact is 0.015 mm, and when the distance between the external leads 101 is 0.015 mm, the width of the external leads 101 to which the probe comes in contact Was 0.010 mm.

As described above, when the distance between the external leads 101 is small, the line width of the external leads 101 is also small, and a probe for conducting a continuity test between the integrated circuit and the external leads 101 must be surely applied to the external leads 101. Becomes difficult.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a method for connecting an integrated circuit to external leads even when the distance between the external leads is small and the line width of the external leads is small. It is an object of the present invention to provide a package for an integrated circuit with a test pad which can easily conduct a probe for performing a test and an external lead.

[0008]

Means for Solving the Problems In order to achieve the above object, a package for an integrated circuit with a test pad according to the present invention employs the following technical means.

A package for an integrated circuit with a test pad is
An insulating container for mounting an integrated circuit, a number of external leads attached to the insulating container, and a number of metal layers insulated from each other, and the number of external leads are joined to the number of metal layers. And a flat, insulating reinforcing frame.

The reinforcing frame is provided on a surface different from the surface to which the external leads are joined and is insulated from each other extending in a plurality of rows in a direction perpendicular to a direction in which the external leads extend. And a test pad electrically connected to each of the metal layers. The test pad has a width in a vertical direction with respect to a direction in which the external leads extend, which is wider than an interval between adjacent external leads.

[0011]

The test pads provided on the surface of the reinforcing frame different from the surface to which the external leads are joined extend in a plurality of rows in a direction perpendicular to the direction in which the external leads extend.
For this reason, the width in the vertical direction with respect to the direction in which the external leads extend can be provided wider than the interval between adjacent external leads. As described above, since the test pads electrically connected to the respective metal layers are provided wide, the probe can be easily applied to the test pads.

[0012]

According to the package for an integrated circuit with a test pad of the present invention, as described above, the probe can be easily applied to the test pad, so that the conduction of the integrated circuit mounted on the insulating container can be improved. Testing can be performed easily and reliably.

[0013]

Next, an integrated circuit package with a test pad according to the present invention will be described with reference to an embodiment shown in the drawings.

1 to 3 show an embodiment of the present invention. FIG. 3 is a plan view of an integrated circuit package 1. FIG. The integrated circuit package 1 of this embodiment includes an insulating container 2, a large number of external leads 3, and a reinforcing frame 4 joined to the external leads 3, which will be described in the following order.

The insulating container 2 is an integrated circuit (not shown).
Is a so-called package substrate. An example of a method for manufacturing the insulating container 2 will be briefly described. Tungsten or green sheet, which is an unsintered ceramic material
Screen printing of conductive paste such as molybdenum.
Then, several green sheets on which the conductor paste is printed are laminated and pressed, and then fired at a high temperature in a hydrogen furnace in a humid atmosphere. A number of metallized layers (not shown) to which a number of external leads 3 are joined are formed on the outermost periphery of the surface of the insulating container 2.

A large number of external leads 3 are used to electrically connect the integrated circuit and the printed wiring of the electric board when the integrated circuit package 1 is mounted on an electric board (not shown). The large number of external leads 3 can be formed by increasing the density of the integrated circuit and reducing the size of the package 1 for the integrated circuit.
The intervals between the external leads 3 are narrow, and the external leads 3 are provided thin. The large number of external leads 3 are provided from a single metal plate together with a connecting member 6 for connecting the insulating bar 5 of the reinforcing frame 4 and the surrounding frame 7.
It is formed by pressing or etching a thin metal plate made of 42 alloy, Kovar, which is a nickel-based alloy. The frame 7 provided around the external lead 3 is cut after brazing the insulating container 2, the external lead 3, and the reinforcing frame 4 to each other, performing plating, and then cutting.

The reinforcing frame 4 shown in this embodiment comprises four ceramic insulating bars 5 joined to each external lead 3.
Each corner is joined by a connecting member 6 of a thin metal plate. In addition, the connecting member 6 makes the movement of each insulating bar 5 independent, and absorbs a difference in thermal expansion generated at the time of joining by the hole 8 provided in the connecting member 6 to prevent deformation of the external lead 3. Things. The insulative bar 5 is a long and thin plate-shaped ceramic brazed from the tip of the external lead 3 and has a metal layer 9 bonded to each external lead 3 as shown in FIG. Are formed on the insulating bar 5 while being insulated from each other. A surface different from the surface on which the metal layer 9 is formed,
That is, as shown in FIG. 1, two rows are formed on a surface different from the surface to which the external leads 3 are joined, in a direction perpendicular to the direction in which the external leads 3 extend to the insulating bar 5. The test pad 10 extends. This test pad 10 has a width in the vertical direction with respect to the direction in which the external leads 3 extend, approximately twice as large as the interval between adjacent external leads 3. The test pads 10 are insulated from each other, , Respectively, are electrically connected to the metal layers 9 on the opposite surfaces. An example of a method for manufacturing the insulating bar 5 will be briefly described. A through hole is formed by punching in a green sheet which is an unsintered ceramic material.
Subsequently, the through holes are filled with a conductive paste, and a metal layer and a test pad are screen-printed on both surfaces of the green sheet with the conductive paste. Then, high-temperature firing is performed in a hydrogen furnace in a humid atmosphere.

The package 1 for an integrated circuit according to the present embodiment.
When the distance between adjacent external leads 3 is 0.025 mm, the width of the test pad 10 with which the probe comes into contact (the width in the vertical direction with respect to the direction in which the external leads extend) is 0.045 mm, and the distance between the external leads 3 is 0.020 mm. At this time, the width of the test pad 10 to which the probe abuts was 0.035 mm, and when the interval between the external leads 3 was 0.015 mm, the width of the test pad 10 to which the probe abuted was 0.025 mm.

[Operation of Embodiment] Next, the operation of the above embodiment will be briefly described. The insulating container 2, the external lead 3 and the reinforcing frame 4 are joined by brazing,
After plating, the frame 7 is cut, and the integrated circuit package 1 on which the integrated circuit is mounted is mounted on a jig (not shown), and a test of an electrical connection state between the external lead 3 and the integrated circuit is performed. Done. This test is performed by applying a probe to a test pad 10 provided on the reinforcing frame 4. The test pad 10 according to the present embodiment has an abutment compared to a conventional method in which a probe is directly applied to an external lead. Since the area is large, the probe can be easily applied to the test pad 10.

[Effects of the Embodiment] In the present embodiment, as described above, the probe can be easily applied to the test pad 10, so that the continuity test of the integrated circuit mounted on the insulating container 2 can be easily performed. And reliably.

Second Embodiment FIG. 4 is an enlarged view of a main part of the insulating bar 5 shown in the second embodiment. The test pad 10 of the embodiment is provided so as to coincide with the extending direction of the external lead 3 joined to the insulating bar 5.

Third Embodiment FIGS. 5 and 6 are enlarged views of a main part of an insulating bar 5 according to a third embodiment. The test pad 10 of the embodiment is electrically connected to the metal layer 9 on the opposite surface by the groove 12 formed on the side extending in the longitudinal direction of the insulating bar 5.
The groove 12 is coated with a conductive ink to electrically connect the metal layer 9 and the test pad 10.

Fourth Embodiment FIG. 7 is an enlarged view of a main part of an insulating bar 5 according to a fourth embodiment. In this embodiment, three rows of test pads 10 are provided in a direction perpendicular to the direction in which the external leads 3 joined to the insulating bar 5 extend. In the integrated circuit package 1 of this embodiment, the distance between adjacent external leads 3 is 0.02.
When the probe is 5 mm, the width of the test pad 10 with which the probe comes into contact (the width in the direction perpendicular to the direction in which the external leads extend) is 0.
When the distance between the external leads 3 is 0.020 mm, the width of the test pad 10 to which the probe contacts is 0.055 mm, and when the distance between the external leads 3 is 0.015 mm, the width of the test pad 10 to which the probe contacts. Was 0.040 mm.

[Modification] In the above embodiment, an example was shown in which a reinforcing frame was provided by joining a ceramic insulating bar and a connecting member. However, a reinforcing frame may be provided integrally with ceramic.

In the above embodiment, ceramic is shown as an example of the insulating material of the reinforcing frame. However, other insulating materials such as resin and glass may be used. In addition, as an example of using a resin, plating around the resin with copper or the like, forming a metal layer and a test pad by etching, and electrically connecting the metal layer and the test pad to form a conductive layer. The metal layer and the external lead are connected using an adhesive or the like.

[Brief description of the drawings]

FIG. 1 shows a first embodiment, and is an enlarged view of a main part of a reinforcing frame provided with a test pad.

FIG. 2 shows the first embodiment, and is an enlarged view of a main part of a reinforcing frame provided with a metal layer.

FIG. 3 shows the first embodiment and is a plan view of an integrated circuit package.

FIG. 4 shows a second embodiment and is an enlarged view of a main part of a reinforcing frame provided with a test pad.

FIG. 5 shows a third embodiment and is an enlarged view of a main part of a reinforcing frame provided with a test pad.

FIG. 6 is an enlarged view of a main part of a reinforcing frame provided with a metal layer, showing a third embodiment.

FIG. 7 is an enlarged view of a main part of a reinforcing frame provided with a test pad, showing a fourth embodiment.

FIG. 8 is a plan view of an integrated circuit package for explaining a conventional technique.

[Description of Signs] 1 Package for integrated circuit 2 Insulating container 3 External lead 4 Reinforcement frame 9 Metal layer 10 Test pad

Claims (1)

(57) [Claims] 1. An insulating container for mounting an integrated circuit, a number of external leads attached to the insulating container, and a number of metal layers insulated from each other, wherein the number of metal layers is A flat and insulating reinforcing frame to which the external leads are bonded, wherein the reinforcing frame extends on a surface different from a surface to which the external leads are bonded. A plurality of test pads extending in a direction perpendicular to the direction and insulated from each other and electrically connected to the plurality of metal layers, the test pads being perpendicular to the direction in which the external leads extend. An integrated circuit package with a test pad, wherein a width in a direction is provided to be wider than an interval between adjacent external leads.