JP2790579B2 - IC card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card.

[0002]

2. Description of the Related Art FIG. 4 is a perspective view showing an example of a conventional IC card, and FIG. 5 is a plan view showing a state where a panel of the conventional IC card is removed. In FIG. 1, reference numeral 1 denotes an insulating resin such as PBT. A molded frame-shaped resin frame, 2 a panel mounted on the front and back of the resin frame 1, 3 a power supply lead electrode mounted on a part of the resin frame 1 by a caulking stop 4, 5 a battery, 6 Is a battery holder for holding the battery 5, and 7 is a contact spring which is inserted into a through hole formed in the resin frame 1 and electrically connects the panels 2 attached to the front and back sides.

In order to assemble the IC card constructed as described above, first, the power supply lead electrode 3 is fixed to the resin frame 1 by the swaging stopper 4. Next, although not shown, a circuit board on which electronic components such as ICs are mounted is attached to the resin frame 1. After that, the contact spring 7 is arranged, and the panel 2 is attached from the front and back of the resin frame 1. At this time, the front and back panels 2 are electrically connected via the contact spring 7. Then, the battery 5 is inserted between the power supply lead electrodes 3 by the battery holder 6 to assemble the IC card.

[0004]

As described above, in the conventional IC card, since the resin frame 1 is formed only of the insulating resin, sufficient strength cannot be obtained, and the heat of the insulating resin at the time of molding cannot be obtained. Due to the shrinkage, a part of the resin frame 1 is distorted as shown by a broken line portion 8 in FIG. 6, resulting in dimensional defects. Further, the contact spring 7 is arranged to electrically connect the front and back panels 2. Therefore, it is necessary to attach a contact spring 7, and furthermore, since the power supply lead electrode 3 is fixed to the resin frame 1 by the caulking stopper 4, the caulking of the caulking stopper 4 is reduced. However, there is a problem that the necessity arises and the assembling workability is reduced.

Further, the resin frame 1 is formed only of an insulating resin, so that external radio noise entering from the side surface of the resin frame 1 is not blocked, and electronic components such as ICs on a circuit board mounted inside the card are formed. There was also a problem that destruction and malfunction occurred.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide an IC card capable of reducing a defective rate, improving quality, and improving assembling workability. And

[0007]

In the IC card according to the present invention, panels are mounted on the front and back of a resin frame, and a circuit board on which a semiconductor element is mounted is housed and held therein. in the IC card, resin frame, its
Frame made of metal integrally molded with resin frame inside
It is provided with .

[0008] In addition, a metal bone is provided on a part of the resin frame.
An opening through which the set is exposed is provided, and the metal frame is exposed.
The presenting part and the panel are electrically connected . In addition, the exposed part of the metal frame has a spring property.
A contact portion electrically connected to the panel is formed;
Is what it is.

In addition, the height of the metal frame is a resin frame.
Is almost the same as the height . In addition, resin frame
With a power supply lead electrode molded integrally with the
It is.

[0010]

[Action] Oite to the inventions, the resin frame, among the
Metal frame that is integrally molded with the resin frame
Since Eteiru, strength of the resin frame is increased, there is no distortion due to thermal shrinkage during molding, dimensional accuracy is ensured, assembly workability is improved. Further, a metal frame in the resin frame shields external radio noise coming from the side surface, thereby preventing breakage and malfunction of electronic components such as ICs.

[0011] A metal frame is provided on a part of the resin frame.
An opening through which the set is exposed is provided, and the metal frame is exposed.
Since the panel and the panel are electrically connected to each other , mounting the panel on the front and back of the resin frame makes the panel and the contact electrically contact in the opening, and the metal frame between the front and back panels , The contact spring is not required, and the assembling workability is improved. Also, the metal frame is exposed
Parts that have spring properties and are electrically connected to the panel
Since the contact part is formed, the electrical connection with the panel
Contact can be taken more reliably.

Further, the height of the metal frame is a resin frame.
Is almost the same height as the
Wave noise is shielded by the metal framework. Also, resin
Equipped with power supply lead electrodes molded integrally with the frame
Therefore, it is not necessary to caulk the power supply lead electrode to the resin frame, and the workability in assembling is improved.

[0013]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. Embodiment 1 FIG. FIG. 1 is a plan view of a resin frame of an IC card showing a first embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are each integrally formed with a resin frame portion of the IC card showing the first embodiment of the present invention. FIGS. 4A and 4B are a plan view and a side view of a metal frame shown in FIG.
The same or corresponding parts as those of the C card are denoted by the same reference numerals, and description thereof will be omitted.

In the drawing, reference numeral 10 denotes a resin frame, 11 denotes an opening formed in a part of the front and back of the resin frame 10, 1
2 is a metal frame integrally formed with the resin frame 10,
Reference numeral 13 denotes a contact portion formed on the front and back portions of the metal frame 12 in a cross-sectional shape of “H”, and 14 denotes a resin frame 10.
This is a power supply lead electrode integrally formed with the power supply.

Here, a method of forming the resin frame 10 will be described. First, a metal frame 12 is formed from a thin plate of stainless steel or the like, having a contact portion 13 having a U-shaped cross section on a part of the front and back sides, and having a shape that substantially goes around the outer peripheral portion of the frame. Next, the metal frame 12 and the power supply lead electrode 14 are positioned in a molding die and an insulating resin is poured, and the metal frame 12 and the power supply lead electrode 14 are integrally formed with the insulating resin. To form the resin frame 10. At this time, the molded resin frame 10 is formed such that the contact portion 13 of the metal frame 12 is exposed in the opening 11.

In order to assemble the IC card configured as described above, first, a circuit board on which electronic components such as ICs are mounted is mounted on the resin frame 10. Next, the panel 2 is attached to the resin frame 10 from the front and back. At this time, in the opening 11 of the resin frame 10, (a) of FIG.
As shown in (b), the contact portion 13 is pressed against the panel 2 by a spring force, and the panel 2 and the contact portion 13 are pressed.
And are in electrical contact. Further, the battery 5 is inserted between the power supply lead electrodes 14 by the battery holder 6, and I
I am assembling a C card.

According to the above-described first embodiment, since the resin frame 10 is integrally formed with the metal frame 12 and the insulating resin, the strength is increased, and the insulating resin at the time of molding is increased. The occurrence of distortion of the resin frame due to thermal shrinkage can be suppressed, dimensional accuracy can be ensured, the defective rate can be reduced, and assemblability can be improved.

Further, an opening 11 is provided in a part of the front and back of the resin frame 10, and the contact portion 13 of the metal frame 12 is exposed in the opening 11, so that the resin frame 1
The panel 2 and the contact portion 13 are electrically contacted by attaching the panel 2 to the front and rear panels via the metal frame 12 without disposing the contact springs 7 unlike a conventional IC card. The two can be electrically connected to each other, and assembling workability can be improved.

Further, the cross section of the contact portion 13 is "heavy".
Since the contact portions 13 are formed in a U-shape, the contact portions 13 have a spring property, so that electrical contact with the panel 2 can be more reliably obtained, and the reliability can be improved.

Further, since the power supply lead electrode 14 is formed integrally with the resin frame 10, the power supply lead electrode 3 in the conventional IC card does not need to be caulked, and the assembling workability can be improved. .

Embodiment 2 FIG. In the first embodiment, the insulating resin and the metal frame 12 are integrally molded to form the resin frame 10.
In the second embodiment, the metal frame 12 integrally formed with the resin frame 10 is formed so as to have substantially the same height as the thickness of the frame and to make substantially one round of the outer peripheral portion of the frame. It is assumed.

According to the second embodiment, in addition to the effects of the first embodiment, the external radio noise coming from the side surface of the resin frame 10 is shielded by the metal frame 12, and the circuit board due to the penetration of the external radio noise is provided. Electronic components, such as ICs, mounted thereon can be prevented from being broken or malfunctioning.

[0023]

Since the present invention is configured as described above, it has the following effects.

[0024] According to the inventions, resin frame, the
A metal frame that is integrally molded with the resin frame inside
As a result, the occurrence of distortion due to thermal shrinkage of the insulating resin during molding is suppressed, dimensional accuracy can be ensured, the defect rate can be reduced, and assemblability can be improved, and the resin frame It is possible to shield external radio noise coming from the side surface, thereby preventing destruction and malfunction of electronic components such as ICs mounted on the circuit board due to invasion of external radio noise.

Further , a metal bone is provided on a part of the resin frame.
An opening through which the set is exposed is provided, and the metal frame is exposed.
Since the exposed portion and the panel are electrically connected , the contact portion and the panel come into electrical contact with each other at the opening, so that the panel can be connected via the metal frame without using a part such as a contact spring. And electrical continuity is obtained, and assembling workability can be improved. Also metal bones
The exposed part of the set has spring properties and is electrically connected to the panel.
Since the contact part to connect is formed,
Electrical contact of the
Can be improved.

In addition, the height of the metal frame is a resin frame.
Is almost the same height as the
Wave noise is shielded by the metal frame,
To prevent destruction and malfunction of electronic components due to intrusion of noise
Can be. In addition, a power supply integrally molded with the resin frame
Since the supply lead electrode is provided , the power supply lead electrode is not caulked to the resin frame, and the assembly workability can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view of a resin frame of an IC card according to a first embodiment of the present invention.

FIGS. 2 (a) and (b) each show Embodiment 1 of the present invention.
3A and 3B are a plan view and a side view of a metal skeleton integrally formed with a resin frame portion of the IC card.

FIG. 3 is an explanatory diagram of a connection state of a contact portion in an IC card according to an embodiment of the present invention.

FIG. 4 is a perspective view showing an example of a conventional IC card.

FIG. 5 is a plan view showing a state where a panel of a conventional IC card is removed.

FIG. 6 is a plan view for explaining a problem of a resin frame in a conventional IC card.

[Explanation of symbols]

 2 Panel 5 Battery 10 Resin frame 11 Opening 12 Metal frame 13 Contact part 14 Lead electrode for power supply

Claims (5)

(57) [Claims] 1. An IC card in which a panel is mounted on the front and back of a resin frame and a circuit board on which a semiconductor element is mounted is housed and held therein, wherein the resin frame is integrally formed with the resin frame therein. Money
An IC card comprising a skeleton made of metal . 2. A metal frame is provided on a part of the resin frame.
An opening is provided for exposing the metal skeleton.
2. The IC card according to claim 1 , wherein the panel and the panel are electrically connected . 3. A spring is provided on an exposed portion of the metal frame.
Contacts that are electrically connected to the panel
3. The IC car according to claim 2, wherein
De. 4. The height of the metal frame is equal to the height of the resin frame.
Claims 1 to 3 which are substantially the same as
Item 7. The IC card according to any one of Items 3. 5. A power supply unit formed integrally with a resin frame.
A supply lead electrode is provided.
The IC card according to claim 4.