JP2747639B2 - Method and apparatus for forming carrier tape - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for forming a carrier tape used for taping and shipping small electronic components and the like.

[0002]

2. Description of the Related Art Small electronic components such as chip resistors and chip capacitors are shipped with taping. As shown in FIG. 7, a carrier tape a for performing taping includes a tape body c in which a plurality of cavities b ′ are formed at equal intervals. After a product is loaded into each cavity, the opening of the cavity is performed. Is sealed with a top tape d. As the carrier tape body having the cavity b ', there is a carrier tape body in which a cavity is formed in a thin resin film in an embossed shape, and a carrier tape body having the following form is also available.

That is, as shown in FIGS. 8 to 10, on a lower surface of a carrier tape main body c in which window holes b for forming cavities are provided in a tape base made of paper or the like at regular intervals and penetrating therethrough. A bottom tape e for closing the lower opening of each window hole b is stuck so that a bottomed cavity is formed on the upper surface. On the side of the carrier tape body, a feed hole f is formed corresponding to the pitch of each cavity b '.

[0004] The method of loading electronic components into the carrier tape thus formed is the same as described above. That is, while the carrier tape is intermittently fed, the electronic components are dropped one by one into the cavity, and
The opening of the cavity is closed by the top tape d. Those in which the electronic components loaded in the respective cavities are prevented from falling off by attaching the top tape d to the upper surface, are wound in a roll shape and shipped. On the user side of the electronic component, the above-described carrier tape wound in a roll shape is loaded into an automatic mounter. The automatic mounter removes the top tape while pulling out the carrier tape, picks up the electronic components in the cavity one by one, and mounts them on a predetermined circuit board.

[0005]

The operation of attaching the bottom tape e to the lower surface of the carrier tape body c having the above-described window hole b is performed as follows.

First, as shown in detail in FIG. 10, a resin adhesive g mainly composed of polyethylene is applied to the upper surface of the bottom tape e. This resin adhesive g keeps a solid at normal temperature, and when heated (130 to 14)
0 ° C.) Those having fluidity and adhesive strength are employed. Then, on the surface of the solid adhesive layer g thus formed, a fine unevenness treatment h generally called mat treatment is applied.
Is applied.

The reason why the surface of the adhesive layer is matted as described above is as follows. That is, the formation of the resin adhesive layer g on the surface of the bottom tape e is performed on the entire upper surface thereof. When the bottom tape e is adhered to the lower surface of the carrier tape body c, the adhesive layer g is exposed in the window b. At this time, if no care is taken, the state in which the electronic component j loaded in the cavity b 'is in planar contact with the adhesive layer g may continue for a long time. Then, although the adhesive layer g keeps a solid form at normal temperature, it cannot be said that it has no tackiness. It may be adhered.

In this case, the user who picks up and loads the electronic component j from each cavity b 'of the carrier tape may not properly pick up the electronic component j from the cavity.

For this purpose, the matte treatment described above is performed to reduce the contact area between the adhesive layer g and the electronic component j, thereby making it difficult for the electronic component j to adhere to the adhesive layer g.

However, it has been found that even if the above-mentioned mat treatment is applied to the resin adhesive layer g formed on the surface of the bottom tape e, the following problem still occurs.

As shown in FIG. 11, the bottom tape e is adhered to the carrier tape body c by pressing the iron k from the back of the bottom tape e along the lower surface of the carrier tape body c. Is done. That is, heat is applied to the adhesive layer g by the iron k applied from the back surface of the bottom tape e, thereby imparting fluidity and adhesiveness to the adhesive layer, and then bonding to the carrier tape body c. -ing

Then, due to the change in the thermal conditions applied to the iron k, as shown in FIG. 12, the portion of the adhesive layer g exposed in the cavity b 'flows due to the heat from the iron k. As a result, the irregularities provided by the matting process may be reduced or disappear.

As a result, the purpose of the mat treatment is not sufficiently fulfilled depending on how the iron member gives the thermal condition, and as a result, the surface adhesive layer g of the bottom tape e exposed in the cavity b ' On the other hand, the electronic component j loaded in the cavity b 'may be inadvertently attached.

The present invention has been conceived in view of the above circumstances, and has been developed in which a bottom tape having a matt treated adhesive layer on the upper surface is replaced with a carrier tape body having window holes. In a method of forming a carrier tape to be stuck by heat given by an iron member on a lower surface, the object of the mat treatment is reliably achieved, and electronic components loaded in a cavity of the carrier tape are inadvertently formed on the upper surface of the bottom tape. It is an object of the present invention to prevent the adhesive from being attached to the adhesive layer.

[0015]

Means for Solving the Problems To solve the above problems, the present invention takes the following technical means.

That is, according to the first aspect of the present invention, a bottom for closing a lower opening of the window hole is provided on a lower surface of a carrier tape body in which window holes are provided at regular intervals in a tape base material having a predetermined thickness. a plurality of electronic components receiving cavity on the upper surface by attaching a tape to a method of forming a carrier tape provided at equal intervals, the surface on one side of the bottom tape
While continuously forming a resin adhesive layer subjected to a concavo-convex treatment (mat treatment), the bottom tape is attached to the lower surface of the carrier tape body so that the adhesive layer is in contact with the bottom surface, and the window hole is formed. And pressing an iron member having a recess corresponding to the ironing surface from the back surface of the bottom tape.

According to the invention described in claim 2 of the present application, the surface of the carrier tape main body, in which windows are provided at regular intervals in a tape base material having a predetermined thickness, is continuously recessed on one surface. An apparatus for forming a carrier tape in which a plurality of electronic component housing cavities are provided at equal intervals on the upper surface by adhering a bottom tape having a resin adhesive layer subjected to a convex treatment, wherein the carrier tape body A mechanism for transporting the carrier tape, a mechanism for attaching the bottom tape below the carrier tape body, and an iron member having an iron surface applied to the back surface of the bottom tape attached to the lower surface of the carrier tape body. The ironing surface of the iron member is provided with a concave portion corresponding to a window hole of the carrier tape body.

In a preferred embodiment of the present invention,
3. The carrier tape forming apparatus according to claim 2, wherein the transport mechanism intermittently feeds the carrier tape main body at regular intervals, and the iron member has an intermittent feed length of the transport mechanism. With a corresponding length, a pressing position for pressing the bottom tape attached to the lower surface of the carrier tape from the back, and a retracting position where the pressing is not performed, can be selected, while the carrier tape body is stopped, In addition to the pressing position, the retracting position can be set during the movement of the carrier tape body.

Further, in another preferred embodiment of the present invention, in the carrier tape forming apparatus according to the second aspect, the ironing member has a cylindrical shape, and the ironing surface is provided on a peripheral surface of the cylinder. And the ironing surface is configured to rotate while contacting the back surface of the bottom tape. In the apparatus according to the fourth aspect, the transport mechanism may be either an intermittent feed or a continuous feed of the carrier tape.

[0020]

The bottom tape having the matted resin adhesive layer on the upper surface is adhered to the lower surface of the carrier tape body by pressing an iron member from the back surface. In the present invention, a concave portion corresponding to the cavity of the carrier tape main body is formed on the ironing surface of the ironing member on which the back surface of the bottom tape is to be directly pressed. Therefore, when such an iron member is pressed from the back surface of the bottom tape, the back surface of the portion exposed inside the cavity is not pressed by the iron surface.

Therefore, according to the present invention, when the bottom tape on which the resinous adhesive layer is formed is adhered to the back surface of the carrier tape body by applying heat with an iron member, the portion exposed in the cavity is a mat. The surface morphology as processed will be maintained.

As a result, the electronic component loaded in the cavity comes into contact with the bottom tape that has been subjected to the mat treatment, and this electronic component inadvertently adheres to the adhesive layer of the bottom tape. The problem is effectively avoided.

Further, even if the thermal condition given by the iron member is rough, the surface of the matted resin adhesive layer is deformed so as to be flattened as before. No need to worry about the heat conditions of the iron.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the drawings.

According to the present invention, as shown in FIGS. 8 to 10, a lower surface of a carrier tape body c having a predetermined thickness and having window holes b formed therethrough at equal intervals, and a matte treatment h is applied to the upper surface. This is a method in which a bottom tape e having an adhesive layer g is adhered by applying heat from the back surface to form a carrier tape a having a cavity b '.

The carrier tape body c is made of a paper material having a predetermined thickness and a predetermined width in a strip shape, and usually has rectangular window holes b formed therethrough at equal intervals. In the side of the carrier tape main body c, feed holes f for feeding the carrier tape are formed at regular intervals corresponding to the pitch for forming the window holes b.

On the other hand, as the bottom tape e, an adhesive layer g formed by applying an adhesive mainly composed of polyethylene to the upper surface of a base material e 'made of paper or a polyester film is used. As the adhesive layer g, one that maintains a solid form at normal temperature and becomes in a fluid state when heated to a predetermined temperature to increase tackiness is used. Also,
On the surface of the adhesive layer g, as shown in detail in FIG.
A so-called matting process h in which fine irregularities are formed is performed. The width of the bottom tape e is large enough to close each window b of the carrier tape body c. However, it is needless to say that the width is set so that even the above-mentioned feed hole f formed in the carrier tape main body c is not closed.

As shown in FIG. 1, the carrier tape main body c unwound from the roll state is intermittently fed by an intermittent feed mechanism 10.
Is intermittently fed every fixed dimension. The feed hole f of the carrier tape main body c is engaged with a feed sprocket 11 disposed at an appropriate position in the transport path, and the above-described intermittent feed is achieved by intermittently rotating the feed sprocket 11. .

On the other hand, the bottom tape e similarly fed out from the roll state has the resin adhesive layer g attached to the back surface of the carrier tape body c. For this purpose, a plurality of guide rollers 12 are used.

The carrier tape body c and the bottom tape e attached thereto are bonded to each other by a thermocompression bonding mechanism 13.

The thermocompression bonding mechanism 13 includes a backup member 1 for backing up the upper surface of the carrier tape body c.
4 and an iron member 15 which is reciprocally driven so as to sandwich the carrier tape body c and the bottom tape e between the backup member 14 and the backup member 14.

The iron member 15 is shown in FIGS.
As shown in FIG. 1, an iron plate 17 is attached to the upper surface of a base 16 in which a sheathed heater (not shown) is incorporated. In the present invention, the ironing plate 17 has a flat ironing surface 17a and a recess 18 corresponding to each window hole b of the carrier tape main body c. More specifically, as shown in FIG. 2, the ironing surface 17a of the ironing member 15 used in the present invention has a ladder shape substantially corresponding to the planar shape of the carrier tape body c.

The iron surface 17a of the iron member 15
The length in the longitudinal direction corresponds to the feed pitch of the intermittent feed mechanism 10. The iron member 15 is
For example, a reciprocating actuator such as an air cylinder 19 can take a pressing position at which the ironing surface 17a is pressed against the back surface of the bottom tape e, and a retreat position for retreating from the pressing position.

The base 16 of the iron member 15
Are provided with positioning pins 20 at a pitch corresponding to the feed holes f of the carrier tape body c. As shown in detail in FIG. 3, the positioning pin 20 is supported by a spring 23 so as to be able to reciprocate while being constantly urged in a protruding direction.
0, as shown in FIG.
a is further protruded from the “a” by a predetermined length.

The base end of the positioning pin 20 protrudes from the back surface of the base plate 16. By detecting the position of the positioning pin 20, the positioning pin 20 correctly projects into the feed hole f of the carrier tape body c. In other words, it is possible to detect whether or not the ironing board 17 is in the correct longitudinal position with respect to the carrier tape c.

In the above configuration, when the carrier tape main body c and the bottom tape e attached thereto are stopped, the iron member 15 moves forward, and FIG.
As shown in FIG.
For a predetermined time. At this time, the heat from the iron surface is applied to the adhesive layer g of the bottom tape e, and this adhesive layer is fluidized and acts to adhere to the carrier tape body c. At this time, in the present invention, a recess 18 corresponding to the window hole b of the carrier tape body c is formed in the ironing surface 17a, and the ironing surface is pressed against the back surface of the bottom tape e corresponding to the window hole b. Therefore, no heat is applied to the resin adhesive layer g exposed in the window hole b. Therefore, the thermal adhesive layer g in this portion is fluidized and the unevenness formed by the matting process disappears or becomes smaller. It will not be lost.

Bottom tape e for a certain period of time as described above
The iron member 15 pressed against the back surface of the carrier tape takes the retracted position, during which the intermittent feeding mechanism 10 applies the carrier tape body c and the bottom tape e adhered to the back surface thereof.
(Ie, the carrier tape a with the bottomed cavity b 'formed) is forwarded by a predetermined distance, and thereafter, the above operation is repeated.

In the present embodiment, the positioning pins 20 are attached to the base 16 of the iron member 15 as described above.
Is provided so as to be able to protrude and retract, it is possible to detect whether or not the longitudinal relationship between the iron member 15 and the carrier tape body c is correct. That is,
If the feed hole f of the carrier tape main body c and the positioning pin 20 on the iron member side are displaced in the feed direction due to the slackness or the like occurring in the carrier tape main body c, the positioning when pressing the iron member 15 is performed. The pin 20 cannot enter the feed hole f. Then, the positioning pin 20 is forcibly retracted,
The position on the base end side of the positioning pin 20 can be detected by, for example, the switch 24.

When such a state is detected by a signal from the switch, for example, the entire apparatus is temporarily stopped and an inspection is performed.

FIGS. 5 and 6 show a second embodiment of the apparatus for carrying out the method of the present invention. In the above embodiment, the carrier tape body and the bottom tape attached thereto are intermittently fed, and the iron member having a fixed length is intermittently sandwiched between the carrier tape and the bottom tape with the backup member. In this second embodiment, the iron member 15 is formed in a cylindrical shape that can rotate about the shaft 21 in this second embodiment.

That is, as shown in detail in FIG. 6, an ironing surface 17a having a constant width is formed in an annular shape on the outer periphery of the cylindrical member 22, and the ironing surface 17a is provided on the carrier similarly to the above-described embodiment. A concave portion 18 corresponding to each window hole b of the tape main body c is formed.

Further, a positioning pin 20 to be engaged with the feed hole f of the carrier tape body c is formed on the outer periphery of the cylindrical member 22 so as to be adjacent to the ironing surface 17a having the predetermined width. Of course, this cylindrical member 2
A heater (not shown) for transmitting heat to the ironing surface 17a is built in the inside of 2.

The cylindrical iron member 15 sandwiches the carrier tape body c and the bottom tape e between itself and the peripheral surface of the roller-shaped backup member 14. At the same time, the positioning pins 20 formed on the outer periphery of the cylindrical member 22 are engaged with the feed holes f of the carrier tape main body c.

In this case, the feed mechanism 10 continuously feeds the carrier tape body c and the bottom tape e at a constant speed. Then, the backup member 14 and the cylindrical iron member 15 are attached to the carrier tape body c.
It rotates to follow the movement of. However, the relationship between the iron member 15 and the carrier tape body c is always regulated as prescribed by the engagement between the positioning pin 20 and the feed hole f. That is, each recess 18 provided on the ironing surface 17a of the ironing member 15 is regulated so as to be correctly positioned corresponding to each window hole b of the carrier tape body c.

The operation and effect of this embodiment are the same as those of the first embodiment. That is, the heat transmitted from the iron member 15 is applied only to the portion of the carrier tape body c except for the window hole b, and the resin adhesive on the bottom tape in that portion is fluidized to perform an adhesive action. The heat from the iron member 15 is not transmitted to the resin adhesive g in the portion of the carrier tape facing the window hole b. Therefore, although the bottom tape e facing the window hole b is coated with the resin adhesive, the matted uneven shape is not deformed or lost by the heat from the iron member described above. It is.

The advantage of the second embodiment is that the reciprocating mechanism for the iron member as in the first embodiment is not necessary, and the bottom tape e can be properly transferred while the carrier tape is continuously conveyed. It is possible to stick it.

As described above, according to the present invention, the bottom tape e having the resin adhesive layer g applied to the entire upper surface is adhered to the back surface of the carrier tape main body c having the window hole b. However, it is possible to maintain the matte treatment form (fine irregularities) on the surface of the resin adhesive layer facing the window hole without worrying about the thermal conditions to be applied to the iron member 15.

As a result, the window b in the carrier tape body c
When the electronic component j is mounted in the cavity b ′ formed by the bottom tape e that seals it on the lower surface, the contact area between the electronic component j and the resin adhesive layer g is kept small, It is possible to reliably avoid a situation in which the electronic component is inadvertently attached to the resin adhesive layer of the bottom tape.

On the carrier tape a formed as described above, the electronic components j are loaded one by one into the cavities b 'opened on the upper surface thereof, and the cavities b'
Is sealed by a top tape d, and the carrier tape a in which the electronic components are loaded in the respective cavities b 'is wound into a roll and shipped.

Of course, the scope of the present invention is not limited to the embodiments described above. The material of the carrier tape body and the base material of the bottom tape is not limited at all. Further, the electronic components to be held on the carrier tape are not limited at all.

Further, the material of the top tape and the method of attaching the top tape are not essential parts of the present invention, and therefore, such points are not limited.

[Brief description of the drawings]

FIG. 1 is a side view of a first embodiment of the present invention.

FIG. 2 is a plan view of an iron member according to the first embodiment.

FIG. 3 is a sectional view taken along line III-III in FIG. 2;

FIG. 4 is an enlarged sectional view taken along line IV-IV in FIG. 2;

FIG. 5 is a side view of a second embodiment of the present invention.

FIG. 6 is a partial perspective view of an iron member according to a second embodiment.

FIG. 7 is a perspective view of a general carrier tape.

8 is a cross-sectional view of a carrier tape to be formed according to the present invention, corresponding to a cross section taken along line VIII-VIII of FIG.

FIG. 9 is a plan view of a carrier tape to be formed according to the present invention.

FIG. 10 is a sectional view showing details of a resin adhesive layer of the bottom tape.

FIG. 11 is a side view of a conventional carrier tape forming apparatus.

FIG. 12 is an explanatory diagram of a conventional problem.

[Explanation of symbols]

 Reference Signs List 13 thermocompression bonding mechanism 14 backup member 15 iron member 17 ironing plate 18 concave portion a carrier tape b window hole b 'cavity c carrier tape body e bottom tape f feed hole g resin adhesive layer h unevenness processing (mat processing) part j electronic component

Claims (2)

(57) [Claims] 1. A bottom tape for closing a lower opening of a window hole is adhered to a lower surface of a carrier tape body in which window holes are provided at equal intervals in a tape base material having a predetermined thickness, and a plurality of tapes are attached to an upper surface thereof. A method for forming a carrier tape in which electronic component housing cavities are provided at equal intervals, wherein a resin adhesive layer whose surface is continuously processed to be uneven is formed on one surface of the bottom tape, The adhesive layer is attached to the lower surface of the carrier tape body so as to be in contact therewith, and an iron member having a recess corresponding to the window hole on the iron surface is pressed from the back surface of the bottom tape. A method for forming a carrier tape, comprising: The lower surface of 2. A carrier tape body formed by providing a window hole at regular intervals in the tape base having a predetermined thickness, the surface on one side
An apparatus for forming a carrier tape in which a plurality of electronic component housing cavities are provided at equal intervals on an upper surface by adhering a bottom tape having a resin adhesive layer which has been continuously subjected to unevenness treatment. A transport mechanism for transporting the tape body, a mechanism for attaching the bottom tape below the carrier tape body, and an iron member having an iron surface applied to the back surface of the bottom tape attached to the lower surface of the carrier tape body, An apparatus for forming a carrier tape, wherein the ironing surface of the ironing member includes a recess corresponding to a window hole of the carrier tape body.