JP2742170B2 - Semiconductor device manufacturing system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing system.

[0002]

2. Description of the Related Art A conventional manufacturing system will be described with reference to the drawings. FIG. 3 is a block diagram of a conventional technique as disclosed in Japanese Patent Application Laid-Open No. Hei 3-123051.

The process _m is a process for determining a dimension value and a characteristic value, and a condition value is given from a condition value update 14. Step _{m + o} is a step of measuring a dimension value or a characteristic value, and gives a measured value to the condition value updating means 11. The condition value updating means updates the condition value in accordance with the difference between the measured value given in the step _{m + o} and the standard value of the dimension value or characteristic value in manufacturing use.

[0004] In this manufacturing system, even if the dimensional value or characteristic value varies due to the difference in the processing machine in the process such as the process _{m + n} , the variation is reflected in the condition value as the variation caused by the manufacturing process before the process _{m + o.} Is done.

[0005]

With the advance of miniaturization and high functionality of semiconductor devices, various standards of semiconductor devices, such as pattern dimension values of silicon gates and the like and various film thickness values, are becoming increasingly strict. Accordingly, there is a demand for further improvement in accuracy of a control system that controls the standards.

In a conventional manufacturing system, even if a dimensional value or characteristic value varies due to a difference in a processing machine in a certain process, the condition value is determined only as a variation caused by the entire manufacturing process before the measuring process of the dimensional value or characteristic value. Can not be reflected in Therefore, it is possible to identify the process where the unit difference occurs,
In addition, even if a correction value of a condition value for absorbing a machine difference is obtained, the correction value cannot be reflected in control.

[0007] As a countermeasure for the occurrence of a machine difference, there is a method in which a machine is designated and a condition value dedicated to the machine is set for each product type in manufacturing use. In this method, it is necessary for a human to calculate the number of processes for each unit based on the number of inputs for each type, and to specify the number in consideration of the work-in-progress balance of each unit. For that purpose, a lot of man-hours are required.

In addition, when the input balance is complicatedly changed due to human work, it cannot be flexibly coped with the change.

[0009] If the judgment of the work-in-progress balance is wrong,
Excessive load and equipment vacancies occur, which greatly affects production.

[0010] As a second countermeasure for a case where a machine difference occurs, in the step of determining dimensional values and characteristic values,
There is a method in which a human determines the load amount of each unit in a process in which a unit difference occurs, and designates the unit and sets a condition value dedicated to the unit. In this method, the work in progress of a process in which a machine difference occurs is always grasped, and human judgment is required for each lot, so that a large number of man-hours are required.

[0011]

According to the semiconductor device manufacturing system of the present invention, the dimensional value and the characteristic value such as the current value and the dimension value such as the pattern dimension and the film thickness of the film formed on the semiconductor device are measured. Means for updating the condition value of the process for determining the characteristic value, means for designating the unit having the smallest load value as the processing unit from the load value of the work in process of each unit in the process that affects the dimension value and the characteristic value, Means for prohibiting processing when a process other than the designated unit is attempted in a process affecting the value or characteristic value, means for correcting the condition value according to the designated unit for the condition value updating unit, and Means for setting the correction value of the condition value of the unit, means for storing the correction value of the condition value of each unit, means for calculating and storing the total in-process amount from the number of work lots of each unit, and reference for each unit Means for setting work in process and each item It comprises a means for storing the reference amount of products in progress, and means for calculating a load value from the aggregate amount of products in progress and each car of the reference amount of products in progress.

[0012]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
FIG. 1 shows an embodiment of the present invention, in which a feedback format for updating a condition value of a process _m for determining a dimension value or a characteristic value from a measured value obtained in a process _{m + o} for measuring a dimension value or a characteristic value. It is an example implemented by the manufacturing system of FIG.

As one embodiment of the present invention, a process _{m + o} for measuring a pattern dimension value, a dimension value and a characteristic value of a silicon gate is referred to as a dimension measuring step and a step _m for determining a dimension value and a characteristic value. The following description will be made assuming that the exposure step, the condition value at that time is the exposure amount, and the step _{m + n in} which the difference between the devices occurs is the polysilicon etching step.

FIG. 2 is a computer configuration diagram of the embodiment. The work in each step is reported from the terminal 11 at the start of the work, such as the number of processed sheets, the number of processed units, and the like, and is stored in the storage device in the host computer 12. Also, at the end of the work, the processing result and the like are similarly reported from the terminal 11 and stored in the host computer 12.

In FIG. 1, condition value update 1 updates a condition value in accordance with a difference between a measured value and its standard value. In the unit designation determination 2, the unit with the smallest load value is determined as the processing unit from the in-process load value of each unit in the process _{m + n} in which the unit difference is obtained from the load calculation 10.

The monitoring of the processing unit 3 is performed in response to a report at the start of work from the terminal 11 when an attempt is made to execute processing at a unit other than the unit specified by the unit designation determination 2 in the process _{m + n} where the unit difference occurs. To prohibit the processing by displaying an error.

The machine difference correction 4 corrects the condition value in accordance with the machine specified in the machine designation determination 2 with respect to the update 1 of the condition value. The correction value setting 5 is means for a human to set a correction value of the condition value of each car, and corresponds to the data setting terminal 13 in FIG. The correction value storage 6 includes a correction value setting 5
This is a means for storing the correction value set by.

The total of work in progress 7 totals the work in progress of each machine in the process _{m + n in} which a machine difference occurs at a time interval designated by a human, and stores the value. Aggregate the work in progress of each unit of the aggregation _{m + n} , and store the value. Aggregation is from process _m to process
_The following (Equation 1) and (Equation 2) are calculated for all in-process lots up to _{m + n} .

[0019]

[0020]

The reference in-process setting 8 is means for a human to set the reference in-process amount of each car, and corresponds to the data setting terminal 13 in FIG. The reference in-process storage 9 is a means for storing the reference in-process amount of each machine.

The load calculation 10 calculates a load value based on the standard work in progress and the total work in progress of each unit. The load value is calculated according to the following (Equation 3).

[0023]

By changing the value of the standard work-in-progress, the work-in-progress of each car can be controlled.

[0025]

As described above, according to the present invention, if a process in which a machine difference occurs can be specified and a correction value of a condition value for absorbing the machine difference can be obtained, the correction value is reflected in control. Can do things. Also, in the process of determining the dimension values and characteristic values, the manufacturing system judges the load value of each unit in the process where the unit difference occurs and specifies the unit and sets the condition value dedicated to that unit by human operation Is unnecessary. Also,
Since the number of the machine is specified for each lot based on the current load value, even if the input balance changes, it is hardly affected by the change.

[Brief description of the drawings]

FIG. 1 is a block diagram of an embodiment of the present invention.

FIG. 2 is a computer configuration diagram of an embodiment.

FIG. 3 is a block diagram of a conventional technique.

[Explanation of symbols]

 1 Update of condition value 2 Determination of designated unit 3 Monitoring of processing unit 4 Unit difference correction 5 Setting of correction value 6 Storage of correction value 7 Total of work in progress 8 Setting of standard work in progress 9 Storage of standard work in progress 10 Load calculation 11 Terminal 12 Host computer 13 Data setting terminal 14 Update of condition value

Claims (2)

(57) [Claims] In a manufacturing process of a semiconductor device, a condition value of a process for determining a dimension value and a characteristic value is determined from a measurement result of a dimension value such as a pattern dimension and a film thickness of a formed film and a characteristic value such as a current amount. Means for updating, means for designating the equipment with the smallest load value as the processing unit based on the work in process of each equipment in the process that affects the dimension and characteristic values, and Means for prohibiting processing when processing is attempted by any other means, means for correcting the condition value according to the designated unit for the means for updating the condition value, and means for setting the correction value of the condition value for each unit Means for storing the correction value of the condition value of each unit, means for calculating and storing the total in-process amount from the number of work lots of each unit, means for setting the reference in-process amount for each unit, and reference for each unit Means for storing the amount of work in progress A means for calculating a load value from a reference in-process amount of the machine and a total in-process amount. 2. The semiconductor device manufacturing system according to claim 1, wherein each of said means is configured on a computer.