JP2570336B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a hybrid integrated circuit device, in particular, a circuit board on which various circuit components are mounted and which has a wiring pattern, which is electrically and mechanically connected to a mother board. It relates to a hybrid integrated circuit device.

[Summary of the Invention]

According to the present invention, a circuit board having electronic components mounted on both front and rear surfaces is placed on a mother board via a rectangular frame-shaped connection receiving pedestal having a hollow portion, and is covered on the frame-shaped side wall of the connection receiving pedestal. The required terminal portions on the circuit board are electrically connected to the corresponding required wiring portions on the motherboard by the formed connection terminal conductive layer, and are mechanically held. Electrical connections between the circuit board's multiple terminals and the corresponding wiring sections on the motherboard can be made at the same time. By maintaining a space between them, and forming a space in the frame-shaped pedestal, the electronic components provided on the circuit board are accommodated here so that the electronic components can be mounted on both the front and back surfaces of the circuit board. In order to increase the density of the circuit configuration, And the connection with the mother board, to avoid complication of the assembly in the case of connecting the lead pins, so that it is possible to achieve automated mechanized assembly.

[Conventional technology]

A conventional ordinary hybrid integrated circuit device electrically and mechanically mounts a circuit board on which various components such as a semiconductor integrated circuit, a capacitor, and a resistor are mounted on another mother board on which a predetermined wiring circuit is formed. It is constituted by doing. In this case, the circuit board derives terminal portions to be electrically connected to the mother board, for example, on one side edge thereof or, for example, two opposite side edges thereof, and electrically connects to the connection wiring patterns at these side edges. For example, one end of each lead pin is soldered to the corresponding terminal portion of the circuit board, and the other end is inserted through a through hole provided in the corresponding wiring portion of the mother board. The electrical and mechanical attachment by soldering is disclosed in, for example, JP-A-60-189997, JP-A-57-175463 and JP-A-57-188272.

However, in such a method, since each lead pin is inserted through the mother board or the like, the alignment of the mother board and the circuit board with respect to the surface direction of the mother board and the mounting operation thereof become complicated, and the automatic mechanization of assembly is performed. There are various problems such as inhibition of

[Problems to be solved by the invention]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the complexity of assembly and manufacture due to the electrical and mechanical connection of the circuit board to the motherboard, and the problem of the inhibition of automation of assembly and manufacture.

[Means for solving the problem]

According to the present invention, as shown in FIGS. 1 to 3, an electronic component (2) is mounted on both front and back surfaces (1a) and (1b), and four outer edges (1A) (1B) (1C) (1D) A circuit board (4) provided with connection terminals (3) on at least the back surface (1b) in the vicinity
And a hollow portion (6) having four side walls (5A), (5B), (5C), and (5D), and surrounded by the four side walls (5A) to (5D).
And a connection base (7) in the form of a square or a rectangle having a rectangular shape and a mother board (8).

Then, the four side walls (5A) to (5D) of the connection receiver (7).
At least one of at least one of the inner side surface and the outer side surface has upper and lower end surfaces of the connection receiving base (7) corresponding to the position of the connection terminal portion (3) of the circuit board (4). (7a)
And (7b) (up and down as used herein means one above,
The opposite side is defined as the lower side, and does not represent the physical upper and lower sides. ), A connection terminal conductive layer (9) is attached, and upper and lower end faces of the connection terminal conductive layer (9) are connected to the terminal portion (3) of the circuit board (4) and the mother board (8). It is electrically connected to the corresponding wiring portion (10) by soldering with solder (25).

(Operation)

As described above, according to the configuration of the present invention, the circuit board (4)
Is mounted and connected to the mother board (8) through a frame-shaped connection stand (7), and is used for connection terminals provided on the connection stand (7). The conductive layer (9) is a connection terminal (3) of the circuit board (4) and the mother board (8).
The connection terminal portion (3) of the circuit board (4) of the connection terminal conductive layer (9) in the assembling and manufacturing of the circuit board (4). The soldering to the mother board (8) and the connection to the wiring portion (10) are performed by, for example, previously applying solder (25) such as cream solder to one or both of the portions to be soldered to each other. Can be performed simultaneously for all the soldered portions in the heating furnace. Therefore, assembly and manufacture are simplified, and automation of assembly and manufacture is promoted.

Further, as described above, the connection base (7) having a frame shape, that is, the hollow part (6) is interposed between the circuit board (4) and the mother board (8), so that the hollow part is formed. Electronic components (2) on the back of the circuit board (4) in (6)
The electronic component (2) can be arranged on both sides of the circuit board (4), and the electronic component (2) on the back side can be disposed on the mother board (8) of the circuit board (4).
It is possible to avoid inconveniences such as damage when mounting the device.

〔Example〕

An embodiment of the present invention will be described in detail with reference to the drawings. The circuit board (4) is formed, for example, by applying a copper foil on both sides (1a) and (1b) of the insulating substrate (11) and forming the wiring pattern or the printed pattern by photolithography in a predetermined pattern. A wiring pattern (23) made of a conductive layer is formed, and electronic components (2) such as a semiconductor chip and a resistance capacitor are mounted on predetermined portions of the wiring pattern (23), and each electrode portion is directly or directly connected via a lead wire (13). Bonding is performed, and a resin mold (12) for protecting, for example, a semiconductor chip such as an integrated circuit chip is applied thereon. Also, for example, connection terminal portions (3) for connection to the mother board (8) are provided on at least the back surface (1b) near the outer edges (1A) to (1D) of the four sides of the circuit board (4). They are arranged in islands. The connection from the wiring pattern (23) formed on the surface (1a) side of the substrate (4) to the connection terminal portion (3) is performed by connecting the outer edges (1A) to (4A) of each of the four sides of the insulating substrate (11). 1D) by connecting a conductive layer along the outer end face, or by drilling a through hole (24) near the outer edge and through the conductive layer formed in this through hole (24). Do it.

The connection pedestal (7) is formed of an insulator, for example, a resin mold, which is a rectangular frame having four side walls (5A) to (5D). Each of the side walls (5A) to (5D) has, for example, A plurality of grooves (14) are respectively extended on both ends (7a) and (7b) of the cradle (7) along the axial direction of the frame portion on the outer surface.
Are arranged in parallel, and a conductive material is applied to the groove (14) to form a connection terminal conductive layer (9).

On the other hand, on the mother board (8), a wiring section (10) to which the connection terminal section (3) of the circuit board (4) is to be electrically connected.
Are arranged corresponding to the connection terminal section (3). Then, cream solder or the like is previously applied to the wiring portion (10) of the mother board (8) and the connection terminal portion (3) of the circuit board (4), respectively, and in this state, the circuit board (4) is connected. The connecting terminal portions (3) corresponding to each other are abutted and mounted on the mother board (8) via the pedestal (7) on the upper end of the connecting terminal conductive layer (9). ) Are pressed against each other in a state where the lower ends of the mother board (8) are in contact with the corresponding soldered portions of the wiring portions (10) of the mother board (8), and are heated. (3) The connection terminal conductive layer (9) and the wiring part (10) are soldered to each connection terminal part (3) and the corresponding wiring part (1).
0) are electrically connected to each other by a connection terminal conductive layer (9) of a connection support (7), and the circuit board (4) is connected to the mother board (8) via the connection support (7). Maintain the required spacing to ensure mechanical attachment.

〔The invention's effect〕

As described above, according to the hybrid integrated circuit device of the present invention, the electrical and mechanical attachment of the circuit board (4) to the motherboard (8) is simply performed by avoiding the connection by the terminal pins and simply by the connection pedestal ( By adopting the mode of mounting and soldering via 7), even when a large number of connection terminal portions (3) are arranged at a small pitch, the connection to the mother board can be reliably performed. Therefore, the arrangement interval, that is, the pitch, of the connection terminal portions can be sufficiently small, for example, 1.8 mm pitch or less, and can be simultaneously performed on all the connection terminal portions (3). And automation.

In addition, since the connection receiving base (7) is formed in a frame shape and the hollow portion (6) is provided, the electronic component (2) on the circuit board (4) is formed in the hollow portion (6). )
Is accommodated, the pedestal (7) has a function of a spacer between the circuit board (4) and the mother board (8),
This makes it possible to attach the circuit board (4) to the mother board (8) without causing damage to the electronic components provided on the back surface of the circuit board (4), and thus to both sides of the circuit board (4). Since the electronic component (2) can be arranged, it is possible to increase the density of the circuit, and to further reduce the size as a whole.

[Brief description of the drawings]

FIG. 1 is a side view of an example of the apparatus of the present invention, FIG. 2 is a sectional view thereof, FIG. 3 is an exploded perspective view thereof, and FIG. 4 is a rear view of a circuit board. (4) a circuit board, (3) a connection terminal, (2) an electronic component, (7) a connection pedestal, (6) a hollow portion thereof,
(9) is a connection terminal conductive layer, (8) is a mother board, (1)
0) is the wiring portion.

Claims (1)

(57) [Claims] An electronic component is mounted on both front and back surfaces, and a circuit board provided with connection terminals on at least the back surface near the outer edge of the four sides, and a four side wall portion, which is surrounded by the four side walls. A rectangular frame-shaped connection receiving base having a hollow portion, and a mother board, wherein the circuit board is in contact with the mother board, and both end faces of the receiving board are in contact with the respective surfaces of the circuit board and the mother board. The at least one of the four side walls of the connection pedestal is attached to at least one of the inner surface or the outer surface of the connection pedestal. A connection terminal conductive layer is attached across the both end surfaces of the receiving base corresponding to the arrangement position of the connection terminal portion, and the connection terminal conductive layer is a corresponding terminal of the circuit board and the mother board. Or electrically connected to the wiring section. Hybrid integrated circuit device.