JP2537188B2 - Polyimide - Google Patents
PolyimideInfo
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- JP2537188B2 JP2537188B2 JP61046369A JP4636986A JP2537188B2 JP 2537188 B2 JP2537188 B2 JP 2537188B2 JP 61046369 A JP61046369 A JP 61046369A JP 4636986 A JP4636986 A JP 4636986A JP 2537188 B2 JP2537188 B2 JP 2537188B2
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- Prior art keywords
- polyimide
- polyamic acid
- polyimide powder
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- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は新規なポリイミドに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a novel polyimide.
従来から、テトラカルボン酸二無水物とジアミンの反
応により得られるポリイミドは、種々の優れた物性や良
好な耐熱性のために、今後も耐熱性が要求される分野に
広く用いられることが期待されている。Conventionally, polyimide obtained by the reaction of tetracarboxylic dianhydride and diamine, due to various excellent physical properties and good heat resistance, is expected to be widely used in the field where heat resistance is required in the future. ing.
従来開発されたポリイミドには優れた特性を示すもの
が多いが、優れた耐熱性を有するけれども加工性にはと
ぼしいとか、また加工性向上を目的として開発された樹
脂は耐熱性、耐溶剤性に劣るなど性能に一長一短があっ
た。Many of the conventionally developed polyimides show excellent properties, but they have excellent heat resistance but are not easy to process, and resins developed for the purpose of improving processability have heat resistance and solvent resistance. There were pros and cons in performance such as inferior
例えば式(III) で表わされる様な基本骨格からなるポリイミド(デュポ
ン社製;商品名Kapton,Vespel)は明瞭なガラス転移温
度を有せず、耐熱性に優れたポリイミドであるが、成形
材料として用いる場合に加工が難しく、焼結成形などの
手法を用いて加工しなければならない。また電気電子部
品の材料として用いる際に寸法安定性、絶縁性、はんだ
耐熱性に悪影響をおよぼす吸水率が高いという性質があ
る。For example, formula (III) Polyimide having a basic skeleton represented by (DuPont Co .; trade name Kapton, Vespel) is a polyimide that does not have a clear glass transition temperature and has excellent heat resistance, but it is processed when used as a molding material. Difficult and must be processed using techniques such as sintering. Also, when used as a material for electrical and electronic parts, it has a property of having a high water absorption that adversely affects dimensional stability, insulation properties, and solder heat resistance.
また式(IV) で表わされる様な基本骨格を有するポリエーテルイミド
(ゼネラル・エレクトリック社製;商品名ULTEM)は加
工性の優れた樹脂であるが、ガラス転移温度が217℃と
低く、またメチレンクロリドなどのハロゲン化炭化水素
に可溶で、耐熱性、耐溶剤性の面からは満足のゆく樹脂
ではない。Also formula (IV) Polyetherimide having a basic skeleton represented by is a resin excellent in processability, but has a low glass transition temperature of 217 ° C and halogenation such as methylene chloride. It is soluble in hydrocarbons and is not a satisfactory resin in terms of heat resistance and solvent resistance.
本発明の目的はポリイミドが本来有する優れた耐熱性
に加え、優れた加工性を有し、吸水率が低く、しかも耐
溶剤性、耐アルカリ性に優れた、多目的用途に使用可能
なポリイミドを得ることにある。In addition to the excellent heat resistance inherent in polyimide, the object of the present invention is to obtain a polyimide which has excellent processability, low water absorption, excellent solvent resistance, and excellent alkali resistance, and which can be used for multiple purposes. It is in.
本発明者らは前記目的を達成するために鋭意検討した
結果、新規なポリイミドを見出した。The present inventors have conducted extensive studies to achieve the above object, and as a result, found a novel polyimide.
すなわち、本発明は 式(I) で表される繰り返し単位からなり、その前駆体であり式
(II) で表される繰り返し単位からなるポリアミド酸の対数粘
度が0.1ないし4.0dl/gであるポリイミドである。That is, the present invention has the formula (I) It is composed of repeating units represented by the formula (II) Is a polyimide in which the polyamic acid having a repeating unit represented by is having an inherent viscosity of 0.1 to 4.0 dl / g.
ここに対数粘度は溶媒にN,N−ジメチルアセトアミド
を用い、その100mlに芳香族ポリアミド酸0.5gを溶かし
た溶液を35℃で測定した値である。Here, the logarithmic viscosity is a value measured at 35 ° C. in a solution in which 0.5 g of aromatic polyamic acid is dissolved in 100 ml of N, N-dimethylacetamide as a solvent.
本発明のポリイミドは、ジアミン成分として4,4′−
ビス(3−アミノフェノキシ)ビフェニルを、またテト
ラカルボン酸二無水物成分として無水ピロメリット酸を
用い、これらを重合させて得られるポリアミド酸を、さ
らに脱水環化させて得られる新規なポリイミドである。The polyimide of the present invention has 4,4′-diamine component.
A novel polyimide obtained by further dehydrating and cyclizing a polyamic acid obtained by polymerizing bis (3-aminophenoxy) biphenyl and pyromellitic dianhydride as a tetracarboxylic dianhydride component. .
かつまた本発明のポリイミドは、従来のポリイミドと
同様な耐熱性を有していながら、しかも熱可塑性である
という特色を有し、そのために溶融成形可能な、加工性
に優れた高耐熱性ポリイミドである。And also the polyimide of the present invention, while having the same heat resistance as conventional polyimide, has a characteristic that it is also thermoplastic, therefore it is melt moldable, it is a high heat resistant polyimide excellent in processability. is there.
さらにまた本発明のポリイミドは、低吸水性で、かつ
耐溶剤性、耐アルカリ性に優れ、しかも可撓性にも優れ
たポリイミドである。Furthermore, the polyimide of the present invention is a polyimide having low water absorption, excellent solvent resistance and alkali resistance, and excellent flexibility.
したがって本発明のポリイミドは宇宙・航空機用基
材、電気電子部品用基材として極めて有用なポリイミド
である。Therefore, the polyimide of the present invention is a very useful polyimide as a base material for space / aircraft and a base material for electric / electronic parts.
本発明のポリイミドは次のごとき方法で得られる。 The polyimide of the present invention can be obtained by the following method.
すなわちまず4,4′−ビス(3−アミノフェノキシ)
ビフェニルと無水ピロメリット酸とを有機溶媒中で重合
させてポリアミド酸を得る。That is, first, 4,4'-bis (3-aminophenoxy)
Biphenyl and pyromellitic dianhydride are polymerized in an organic solvent to obtain a polyamic acid.
このポリアミド酸の生成反応は通常、有機溶媒中で実
施する。この反応に用いる有機溶媒としては、例えばN,
N−ジメチルホルムアミド、N,N−ジメチルアセトアミ
ド、N,N−ジエチルアセトアミド、N,N−ジメチルメトキ
シアセトアミド、N−メチル−2−ピロリドン、1,3−
ジメチル−2−イミダゾリジノン、N−メチルカプロラ
クタム、1,2−ジメトキシエタン、ビス(2−メトキシ
エチル)エーテル、1,2−ビス(2−メトキシエトキ
シ)エタン、ビス{2−(2−メトキシエトキシ)エチ
ル}エーテル、テトラヒドロフラン、1,3−ジオキサ
ン、1,4−ジオキサン、ピリジン、ピコリン、ジメチル
スルホキシド、ジメチルスルホン、テトラメチル尿素、
ヘキサメチルホスホルアミド、m−クレゾール、P−ク
ロロフェノール、アニソールなどが挙げられる。またこ
れらの有機溶剤は単独でも或いは2種以上混合して用い
ても差し支えない。The reaction for producing this polyamic acid is usually carried out in an organic solvent. Examples of the organic solvent used in this reaction include N,
N-dimethylformamide, N, N-dimethylacetamide, N, N-diethylacetamide, N, N-dimethylmethoxyacetamide, N-methyl-2-pyrrolidone, 1,3-
Dimethyl-2-imidazolidinone, N-methylcaprolactam, 1,2-dimethoxyethane, bis (2-methoxyethyl) ether, 1,2-bis (2-methoxyethoxy) ethane, bis {2- (2-methoxy Ethoxy) ethyl} ether, tetrahydrofuran, 1,3-dioxane, 1,4-dioxane, pyridine, picoline, dimethyl sulfoxide, dimethyl sulfone, tetramethylurea,
Hexamethylphosphoramide, m-cresol, P-chlorophenol, anisole and the like can be mentioned. These organic solvents may be used alone or in combination of two or more.
反応温度は通常200℃以下、好ましくは50℃以下であ
る。The reaction temperature is usually 200 ° C or lower, preferably 50 ° C or lower.
反応圧力は特に限定されず、常圧で十分実施できる。 The reaction pressure is not particularly limited and can be carried out at normal pressure.
反応時間は溶剤の種類および反応温度により異なり、
通常、下記式(II)で表わされるポリアミド酸の生成が
完了するに十分な時間反応させる。通常4〜24時間で十
分である。The reaction time depends on the type of solvent and the reaction temperature,
Usually, the reaction is carried out for a sufficient time to complete the production of the polyamic acid represented by the following formula (II). 4-24 hours is usually sufficient.
このような反応により、下記式(II)の繰り返し単位
からなるポリアミド酸が得られる。By such a reaction, a polyamic acid having a repeating unit of the following formula (II) is obtained.
本発明においては、ポリイミドの前駆体であるポリア
ミド酸の対数粘度は0.1ないし4.0dl/gであることが必要
で、好ましくは0.3ないし2.5dl/gである。 In the present invention, the polyamic acid, which is a polyimide precursor, has an inherent viscosity of 0.1 to 4.0 dl / g, preferably 0.3 to 2.5 dl / g.
さらに得られたポリアミド酸を100〜400℃に加熱して
イミド化するか、または無水酢酸などのイミド化剤を用
いて化学イミド化することにより下記式(I)の繰り返
し単位からなる対応するポリイミドが得られる。Further, the obtained polyamic acid is heated to 100 to 400 ° C. for imidization, or is chemically imidized by using an imidizing agent such as acetic anhydride to obtain a corresponding polyimide having a repeating unit of the following formula (I). Is obtained.
また、4,4′−ビス(3−アミノフェノキシ)ビフェ
ニルと無水ピロメリット酸とを有機溶媒中に懸濁または
溶解させた後加熱し、ポリイミドの前駆体であるポリア
ミド酸の生成と脱水イミド化とを同時に行なうことによ
り上記式(I)の繰り返し単位からなるポリイミドを得
ることも可能である。すなわち、従来公知の手法を用い
てフィルム状もしくは粉体状の上記式(I)の繰り返し
単位からなるポリイミドを得ることができる。 In addition, 4,4′-bis (3-aminophenoxy) biphenyl and pyromellitic dianhydride are suspended or dissolved in an organic solvent and then heated to generate polyamic acid as a precursor of polyimide and dehydration imidization. It is also possible to obtain a polyimide comprising a repeating unit of the above formula (I) by simultaneously performing the above. That is, it is possible to obtain a film-like or powder-like polyimide comprising the repeating unit of the above formula (I) by using a conventionally known method.
本発明を実施例、比較例および合成例により具体的に
説明する。The present invention will be specifically described with reference to Examples, Comparative Examples and Synthesis Examples.
合成例 3ガラス製反応容器に4,4′−ジヒドロキシビフェ
ニル186g(1.0モル)、m−ジニトロベンゼン438g(2.6
モル)、炭酸カリウム363gおよびN,N−ジメチルホルム
アミド2000mlを装入し145〜150℃で16時間反応させる。
反応終了後、冷却、無機塩をろ別し、次にろ液の溶剤を
減圧蒸留により留去したのち65℃に冷却し、メタノール
2000mlを装入し1時間かきまぜる。結晶をろ別、水洗、
メタノール洗浄、乾燥して4,4′−ビス(3−ニトロフ
ェノキシ)ビフェニルの茶褐色結晶を得た。収量426g
(収率99.5%)。ついで、1のガラス製密閉容器に、
得られた粗4,4′−ビス(3−ニトロフェノキシ)ビフ
ェニル100g(0.23モル)を5%Pd/C(日本エンゲルハル
ト社製)1g、メチルセロソルブ350mlとともに装入し
た。60〜65℃で激しくかきまぜながら水素を導入すると
8時間でそれ以上水素を吸収しなくなり反応が完了し
た。冷却後、ろ過して触媒を除去し、これを水500mlに
排出し、結晶をろ別する。これに35%塩酸48gと50%イ
ソプロパノール540mlを加えて加熱溶解し、放冷すると
4,4′−ビス(3−アミノフェノキシ)ビフェニルの塩
酸塩が析出した。これをろ過後、50%イソプロパノール
540mlを加えて加熱溶解し、活性炭5gを加えてろ過後、
アンモニア水で中和し、結晶をろ別、水洗、乾燥して4,
4′−ビス(3−アミノフェノキシ)ビフェニルを得
た。収量72.0g(収率85%)、無色結晶、融点144〜146
℃、純度99.6%(高速液体クロマトグラフィーによ
る)。Synthesis Example 3 In a glass reaction vessel, 186 g (1.0 mol) of 4,4'-dihydroxybiphenyl and 438 g (2.6 g of m-dinitrobenzene) were used.
Mol), 363 g of potassium carbonate and 2000 ml of N, N-dimethylformamide are charged and reacted at 145 to 150 ° C for 16 hours.
After completion of the reaction, cooling, the inorganic salt is filtered off, then the solvent of the filtrate is distilled off under reduced pressure, and then cooled to 65 ° C., and methanol is added.
Charge 2000 ml and stir for 1 hour. The crystals are filtered off, washed with water,
The crystals were washed with methanol and dried to obtain brown crystals of 4,4'-bis (3-nitrophenoxy) biphenyl. Yield 426g
(Yield 99.5%). Then, in the glass closed container of 1,
100 g (0.23 mol) of the obtained crude 4,4'-bis (3-nitrophenoxy) biphenyl was charged together with 1 g of 5% Pd / C (manufactured by Nippon Engelhardt) and 350 ml of methyl cellosolve. When hydrogen was introduced with vigorous stirring at 60 to 65 ° C, the reaction was completed after 8 hours without absorbing any more hydrogen. After cooling, the catalyst is removed by filtration, this is discharged into 500 ml of water and the crystals are filtered off. To this, add 48g of 35% hydrochloric acid and 540ml of 50% isopropanol, heat to dissolve, and let cool.
4,4'-bis (3-aminophenoxy) biphenyl hydrochloride was precipitated. After filtering this, 50% isopropanol
Add 540 ml and heat to dissolve, add 5 g of activated carbon and filter,
Neutralize with aqueous ammonia, filter the crystals, wash with water and dry 4,
4'-Bis (3-aminophenoxy) biphenyl was obtained. Yield 72.0g (85% yield), colorless crystals, melting point 144-146
C, purity 99.6% (by high performance liquid chromatography).
MS:368(M+)、340、184 IR(KBr、cm-1:3400と3310(NH2基)、1240(エーテル
結合) 実施例−1 かきまぜ機、還流冷却器および窒素導入管を備えた容
器に、4,4′−ビス(3−アミノフェノキシ)ビフェニ
ル36.8g(0.1モル)と、N,N−ジメチルアセトアミド17
5.8gを装入し、室温で窒素雰囲気下に、無水ピロメリッ
ト酸21.8g(0.1モル)を溶液温度の上昇に注意しながら
分割して加え室温で約20時間かきまぜた。かくして得ら
れたポリアミド酸の対数粘度は2.47dl/gであった。 MS: 368 (M + ), 340, 184 IR (KBr, cm −1 : 3400 and 3310 (NH 2 group), 1240 (ether bond) Example 1 equipped with a stirrer, reflux condenser and nitrogen inlet pipe In a container, 4,4'-bis (3-aminophenoxy) biphenyl 36.8 g (0.1 mol) and N, N-dimethylacetamide 17
After charging 5.8 g, 21.8 g (0.1 mol) of pyromellitic dianhydride was added in portions at room temperature under a nitrogen atmosphere while paying attention to increase in solution temperature, and the mixture was stirred at room temperature for about 20 hours. The polyamic acid thus obtained had an inherent viscosity of 2.47 dl / g.
このポリアミド酸溶液の一部を取り、ガラス板上にキ
ャストした後、100℃、200℃、300℃で各々1時間加熱
して淡黄色透明、フィルム厚25μのポリイミドフィルム
を得た。このポリイミドフィルムの引張り強さは14.8kg
/mm2、引張り伸び率は70%であった。(測定方法は、と
もにASTM D−882に拠る。以下同様。)またこのポリイ
ミドフィルムのガラス転移温度は271℃(TMA針入法で測
定。以下同様。)、空気中での5%重量減少温度は545
℃(DTA−TGで測定。以下同様。)であった。A part of this polyamic acid solution was taken, cast on a glass plate, and then heated at 100 ° C., 200 ° C., and 300 ° C. for 1 hour to obtain a pale yellow transparent polyimide film having a film thickness of 25 μm. The tensile strength of this polyimide film is 14.8kg
/ mm 2 , Tensile elongation was 70%. (The measuring method is based on ASTM D-882. The same applies to the following.) The glass transition temperature of this polyimide film is 271 ° C (measured by the TMA penetration method. The same applies below), and the temperature at which 5% weight loss occurs in air. Is 545
C (measured by DTA-TG. The same applies hereinafter).
またこのフィルムを23.5℃下において24時間水に浸せ
きした際の吸水率は0.52%であった。(測定方法はASTM
D−570−63に拠る。以下同様。) さらにまたこのフィルムを70℃に加熱した30重量%カ
セイソーダ水溶液に浸せきしたが全く変化しなかった。The water absorption of this film when immersed in water at 23.5 ° C for 24 hours was 0.52%. (Measurement method is ASTM
According to D-570-63. The same applies below. Further, the film was immersed in a 30 wt% caustic soda aqueous solution heated to 70 ° C., but no change was observed.
また上記ポリアミド酸溶液150gに、N,N−ジメチルア
セトアミド337.5gを加え、かきまぜながら窒素雰囲気下
に、70℃まで加熱した後26.1g(0.26モル)の無水酢酸
および9.05g(0.09モル)のトリエチルアミンを滴下し
たところ、滴下終了後約10分間で黄色のポリイミド粉が
析出しはじめるが、さらに加熱下で2時間かきまぜた後
ろ過してポリイミド粉を得た。このポリイミド粉をメタ
ノールで洗浄した後150℃で5時間減圧乾燥して34.5g
(収率98%)のポリイミド粉を得た。このポリイミド粉
のX線分析を行なったところ21%の結晶化度を有してい
た。To 150 g of the above polyamic acid solution, 337.5 g of N, N-dimethylacetamide was added and heated to 70 ° C. under stirring in a nitrogen atmosphere, and then 26.1 g (0.26 mol) of acetic anhydride and 9.05 g (0.09 mol) of triethylamine. When, was added dropwise, yellow polyimide powder began to precipitate in about 10 minutes after the completion of the addition, but the mixture was further stirred under heating for 2 hours and then filtered to obtain a polyimide powder. This polyimide powder was washed with methanol and dried under reduced pressure at 150 ° C for 5 hours to yield 34.5g.
Polyimide powder (yield 98%) was obtained. An X-ray analysis of this polyimide powder showed that it had a crystallinity of 21%.
このポリイミド粉の赤外吸収スペクトル図を第1図に
示す。このスペクトル図では、イミドの特性吸収帯であ
る1780cm-1付近と1720cm-1付近、およびエーテル結合の
特性吸収帯である1240cm-1付近の吸収が顕著に認められ
た。The infrared absorption spectrum of this polyimide powder is shown in FIG. This spectrum diagram, around 1780 cm -1 and near 1720 cm -1 which is the characteristic absorption band of imide, and absorption at around 1240 cm -1 which is the characteristic absorption band of ether linkage was clearly observed.
このポリイミド粉はメチレンクロリド、クロロホルム
などのハロゲン化炭化水素溶剤には全く不溶であった。This polyimide powder was completely insoluble in halogenated hydrocarbon solvents such as methylene chloride and chloroform.
またこのポリイミド粉のガラス転移温度は260℃、融
点は367℃であった。(DSC法により測定)。またこのポ
リイミド粉を400℃、300kg/cm2で30分間圧縮成形して得
た圧縮成形物のノッチ付アイゾット強度は18kg・cm/cm
であった。(測定方法はASTM D−256に拠る。以下同
様。) 比較例−1 前記式(III)で表されるポリイミドであって、市販
されているカプトン100H(Kapton100H;デュポン社商品
名)を用いて実施例−1と同様な方法で吸水率を測定し
たところ2.9%であった。また、このカプトンフィルム
を、70℃に加熱した30重量%カセイソーダ溶液に浸せき
したところ、完全に溶解してしまった。The glass transition temperature of this polyimide powder was 260 ° C, and the melting point was 367 ° C. (Measured by DSC method). The notched Izod strength of the compression molded product obtained by compression molding this polyimide powder at 400 ° C and 300 kg / cm 2 for 30 minutes is 18 kgcm / cm.
Met. (The measuring method is based on ASTM D-256. The same applies to the following.) Comparative Example-1 Using a commercially available Kapton 100H (Kapton 100H; trade name of DuPont) which is a polyimide represented by the formula (III). The water absorption measured in the same manner as in Example-1 was 2.9%. Also, when this Kapton film was immersed in a 30 wt% caustic soda solution heated to 70 ° C., it completely dissolved.
比較例−2 前記式(IV)で表されるポリイミドであって、市販さ
れているウルテム1000ULTEM1000;ゼネラルエレクトリッ
ク社商品名)のペレットをメチレンクロリドに溶解させ
たところ20重量%以上も溶解した。Comparative Example-2 A polyimide represented by the above formula (IV), which was a commercially available pellet of Ultem 1000 ULTEM1000; trade name of General Electric Co.) was dissolved in methylene chloride, and 20% by weight or more was dissolved.
実施例−2 かきまぜ機、還流冷却器および窒素導入管を備えた容
器に、4,4′−ビス(3−アミノフェノキシ)ビフェニ
ル368g(1.0モル)と、N,N−ジメチルアセトアミド5215
gを装入し、室温で窒素雰囲気下に、無水ピロメリット
酸211.46g(0.97モル)を溶液温度の上昇に注意しなが
ら分割して加え、室温で約20時間かきまぜた。かくして
得られたポリアミド酸の対数粘度は0.52dl/gであった。
このポリアミド酸溶液に、室温で窒素雰囲気下に404g
(4モル)のトリエチルアミンおよび612g(6モル)の
無水酢酸を滴下した。滴下終了後約1時間で黄色のポリ
イミド粉が析出しはじめた。さらに室温で約20時間かき
まぜた後ろ過してポリイミド粉を得た。このポリイミド
粉をメタノールでスラッジングした後ろ別し、180℃で2
4時間乾燥して529g(収率97.3%)のポリイミド粉を得
た。Example-2 In a container equipped with a stirrer, a reflux condenser and a nitrogen inlet tube, 368 g (1.0 mol) of 4,4'-bis (3-aminophenoxy) biphenyl and 5215 N, N-dimethylacetamide were added.
Into a nitrogen atmosphere at room temperature, 211.46 g (0.97 mol) of pyromellitic dianhydride was added in portions while paying attention to the rise in solution temperature, and the mixture was stirred at room temperature for about 20 hours. The polyamic acid thus obtained had an inherent viscosity of 0.52 dl / g.
In this polyamic acid solution, at room temperature under a nitrogen atmosphere 404 g
(4 mol) triethylamine and 612 g (6 mol) acetic anhydride were added dropwise. Approximately 1 hour after completion of dropping, yellow polyimide powder began to precipitate. Further, the mixture was stirred at room temperature for about 20 hours and then filtered to obtain a polyimide powder. This polyimide powder was sludged with methanol, separated and separated at 180 ℃.
After drying for 4 hours, 529 g (yield 97.3%) of polyimide powder was obtained.
こゝに得られたポリイミド粉の赤外吸収スペクトル図
は第1図と同様であった。またこのポリイミド粉のX線
分析を行ったところ9.3%の結晶化度を有していた。The infrared absorption spectrum of the polyimide powder thus obtained was the same as in FIG. The X-ray analysis of this polyimide powder showed that it had a crystallinity of 9.3%.
また本実施例で得られたポリイミド粉末を用い高化式
フローテスター(島津製作所製、CFT−500)で溶融粘度
の測定を行った。オリフィスは直径0.1cm、長さ1cmであ
る。温度を変化させて得られたせん断速度と溶融粘度の
関係を第2図に示す。Further, the polyimide powder obtained in this example was used to measure the melt viscosity using a Koka type flow tester (CFT-500 manufactured by Shimadzu Corporation). The orifice is 0.1 cm in diameter and 1 cm in length. The relationship between the shear rate and the melt viscosity obtained by changing the temperature is shown in FIG.
得られたストランドは淡褐色透明で非常に可撓性に富
んだものであった。The obtained strand was light brown, transparent and very flexible.
さらに、このポリイミド粉を、390℃において押し出
したところ褐色透明な強じんなストランドを得た。この
ストランドをペレット化した後390℃、500kg/cm2で射出
成形し、褐色透明な成形物を得た。この成形物の引張り
降伏強度(測定方法はASTM D−638に拠る。以下同
様。)は1240kg/cm2、引張り破断強度(測定方法はASTM
D−638に拠る。以下同様。)は1110kg/cm2、破断伸度
(測定方法はASTM D−638に拠る。以下同様。)は40
%、ノッチ付アイゾット強度は18.2kg・cm/cm、熱変形
温度(測定方法はASTM D−648に拠る。以下同様。)は2
50℃であった。Further, when this polyimide powder was extruded at 390 ° C., a brown transparent tough strand was obtained. This strand was pelletized and injection-molded at 390 ° C. and 500 kg / cm 2 to obtain a brown transparent molded product. The tensile yield strength (measurement method is based on ASTM D-638. The same applies hereinafter) of this molded product is 1240 kg / cm 2 , and the tensile breaking strength (measurement method is ASTM
According to D-638. The same applies below. ) Is 1110 kg / cm 2 , and elongation at break (measurement method is based on ASTM D-638. The same applies hereinafter) is 40.
%, Izod strength with notch is 18.2 kgcm / cm, heat distortion temperature (measurement method is based on ASTM D-648. The same applies below) is 2.
It was 50 ° C.
比較例−3 実施例−2の同条件で市販のウルテム1000を射出成形
し、得られた成形物の物性を測定したところ、引張り降
伏強度は1090kg/cm2、引張り破断強度は1090kg/cm2、破
断伸度は81%、ノッチ付アイゾット強度は4.7kg・cm/c
m、熱変形温度は200℃であった。Comparative Example-3 A commercially available Ultem 1000 was injection-molded under the same conditions as in Example-2, and the physical properties of the obtained molded product were measured.The tensile yield strength was 1090 kg / cm 2 , and the tensile breaking strength was 1090 kg / cm 2. , Breaking elongation 81%, notched Izod strength 4.7 kg ・ cm / c
m, heat distortion temperature was 200 ℃.
実施例−3 かきまぜ機、還流冷却器および窒素導入管を備えた容
器に、4,4′−ビス(3−アミノフェノキシ)ビフェニ
ル36.8g(0.1モル)と、N,N−ジメチルアセトアミド17
2.5gを装入し、室温で窒素雰囲気下に、無水ピロメリッ
ト酸20.71g(0.095モル)を溶液温度の上昇に注意しな
がら分割して加え、室温で約20時間かきまぜた。かくし
て得られたポリアミド酸の対数粘度は0.58dl/gであっ
た。Example-3 In a container equipped with a stirrer, a reflux condenser and a nitrogen inlet tube, 36.8 g (0.1 mol) of 4,4'-bis (3-aminophenoxy) biphenyl and 17 N, N-dimethylacetamide were added.
After charging 2.5 g, 20.71 g (0.095 mol) of pyromellitic dianhydride was added in portions at room temperature under a nitrogen atmosphere while paying attention to the rise in solution temperature, and the mixture was stirred at room temperature for about 20 hours. The polyamic acid thus obtained had an inherent viscosity of 0.58 dl / g.
このポリアミド酸溶液に、N,N−ジメチルアセトアミ
ド345.1gを加え、かきまぜながら窒素雰囲気下に、150
℃まで加熱し、同温度で約1時間かきまぜると黄色のポ
リイミド粉が析出しはじめた。さらに同温度で2時間か
きまぜた後、ろ過して、ポリイミド粉を得た。このポリ
イミド粉をメタノールでスラッジングした後、180℃で2
4時間減圧乾燥して43.1g(収率80%)のポリイミド粉を
得た。To this polyamic acid solution, 345.1 g of N, N-dimethylacetamide was added, and while stirring, under a nitrogen atmosphere,
When heated to 0 ° C. and stirred at the same temperature for about 1 hour, yellow polyimide powder began to precipitate. Further, the mixture was stirred at the same temperature for 2 hours and then filtered to obtain a polyimide powder. After sludging this polyimide powder with methanol,
It was dried under reduced pressure for 4 hours to obtain 43.1 g (yield 80%) of polyimide powder.
かくして得たポリイミドは100kgの荷重および0.1cmの
オリフィスを用いて400℃で4×103ポイズの溶融粘度を
有していた。The polyimide thus obtained had a melt viscosity of 4 × 10 3 poise at 400 ° C. using a load of 100 kg and an orifice of 0.1 cm.
実施例−4 かきまぜ機、還流冷却器および窒素導入管を備えた容
器に、4,4′−ビス(3−アミノフェノキシ)ビフェニ
ル3.68g(0.01モル)、無水ピロメリット酸2.11g(0.00
97モル)とm−クレゾール52.1gを装入し、窒素雰囲気
下に、かきまぜながら加熱昇温した。135℃付近で褐色
透明の均一溶液となった。150℃まで加熱し、かきまぜ
をつづけると約10分間で黄色のポリイミド粉が析出しは
じめた。さらに加熱下で2時間かきまぜをつづけた後、
ろ過してポリイミド粉を得た。このポリイミド粉をメタ
ノールおよびアセトンで洗浄した後、180℃で24時間減
圧乾燥して4.62g(収率85.1%)のポリイミド粉を得
た。ここに得られたポリイミド粉の赤外吸収スペクトル
は第1図と同様なものであった。Example-4 In a container equipped with a stirrer, a reflux condenser and a nitrogen introducing tube, 4,4'-bis (3-aminophenoxy) biphenyl 3.68 g (0.01 mol) and pyromellitic anhydride 2.11 g (0.00
(97 mol) and m-cresol (52.1 g) were charged, and the mixture was heated in a nitrogen atmosphere while stirring and heated. At 135 ° C, a brown transparent homogeneous solution was formed. After heating to 150 ℃ and stirring, yellow polyimide powder began to precipitate in about 10 minutes. After stirring for 2 hours under heating,
Filtration gave a polyimide powder. The polyimide powder was washed with methanol and acetone and then dried under reduced pressure at 180 ° C. for 24 hours to obtain 4.62 g (yield 85.1%) of polyimide powder. The infrared absorption spectrum of the polyimide powder obtained here was similar to that shown in FIG.
本発明はポリイミドが本来有する優れた耐熱性に加
え、優れた加工性を有し、吸水率が低く、しかも耐溶剤
性、耐アルカリ性に優れ、多目的用途に使用できる全く
新規なポリイミドを提供するものである。The present invention, in addition to the excellent heat resistance inherent in polyimide, has excellent processability, has a low water absorption rate, and also has excellent solvent resistance and alkali resistance, and provides a completely novel polyimide that can be used for multiple purposes. Is.
第1図は本発明のポリイミド粉末の赤外吸収スペクトル
図の一例であり、第2図は本発明のポリイミド粉末の溶
融粘度とせん断速度の関係を示す図である。FIG. 1 is an example of an infrared absorption spectrum diagram of the polyimide powder of the present invention, and FIG. 2 is a diagram showing the relationship between the melt viscosity and the shear rate of the polyimide powder of the present invention.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山口 彰宏 鎌倉市材木座1−13−24 (56)参考文献 特開 昭55−166622(JP,A) 特開 昭61−143433(JP,A) 特開 昭61−143435(JP,A) 特開 昭61−143478(JP,A) 特開 昭61−273953(JP,A) 特開 昭61−277921(JP,A) 特開 昭61−277923(JP,A) 高分子論文集42(7)第443頁−第451 頁 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Akihiro Yamaguchi 1-13-24 Sasaki, Kamakura City (56) References JP-A-55-166622 (JP, A) JP-A-61-143433 (JP, A) JP-A-61-143435 (JP, A) JP-A-61-143478 (JP, A) JP-A-61-273953 (JP, A) JP-A-61-277921 (JP, A) JP-A-61-277923 (JP, A) Journal of Polymer Science 42 (7) pp.443-451.
Claims (1)
(II) で表される繰り返し単位からなるポリアミド酸の対数粘
度(N,N−ジメチルアセトアミド溶媒、濃度0.5g/100ml
溶媒、35℃で測定)が0.1ないし4.0dl/gであるポリイミ
ド。1. A formula (I) Of the repeating unit represented by the formula (II) which is a precursor thereof. The logarithmic viscosity of polyamic acid consisting of repeating units represented by (N, N-dimethylacetamide solvent, concentration 0.5 g / 100 ml
Polyimide whose solvent, measured at 35 ° C) is 0.1 to 4.0 dl / g.
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61046369A JP2537188B2 (en) | 1986-03-05 | 1986-03-05 | Polyimide |
PCT/JP1986/000335 WO1987001378A1 (en) | 1985-08-27 | 1986-06-30 | Polyimides and heat-resistant adhesives comprising the same |
KR1019870700370A KR910000868B1 (en) | 1985-08-27 | 1986-06-30 | Process for the preparation of polyimides for heat-resistant adhesive |
EP86904359A EP0235294B1 (en) | 1985-08-27 | 1986-06-30 | Polyimides and heat-resistant adhesives comprising the same |
DE3650656T DE3650656T2 (en) | 1985-08-27 | 1986-06-30 | POLYIMIDES AND THESE HEAT-RESISTANT ADHESIVES |
EP96101394A EP0729995A1 (en) | 1985-08-27 | 1986-06-30 | Polyimide and high-temperature adhesive of polyimide |
US07/044,028 US4847349A (en) | 1985-08-27 | 1986-06-30 | Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines |
AU61222/86A AU580183B2 (en) | 1985-08-27 | 1986-06-30 | Polyimide |
CA000515976A CA1268592A (en) | 1985-08-27 | 1986-08-14 | Polyimide and high-temperature adhesive of polyimide |
US07/611,471 US5087689A (en) | 1985-08-27 | 1990-11-09 | Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines |
US07/724,548 US5205894A (en) | 1985-08-27 | 1991-06-17 | Polyimide and high-temperature adhesive of polyimide |
US08/009,091 US5278276A (en) | 1985-08-27 | 1993-01-26 | Polyimide and high-temperature adhesive of polyimide |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61046369A JP2537188B2 (en) | 1986-03-05 | 1986-03-05 | Polyimide |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62205124A JPS62205124A (en) | 1987-09-09 |
JP2537188B2 true JP2537188B2 (en) | 1996-09-25 |
Family
ID=12745237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61046369A Expired - Lifetime JP2537188B2 (en) | 1985-08-27 | 1986-03-05 | Polyimide |
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JP (1) | JP2537188B2 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5288843A (en) * | 1987-05-20 | 1994-02-22 | Mitsui Toatsu Chemicals, Inc. | Polyimides, process for the preparation thereof and polyimide resin compositions |
JPH01188555A (en) * | 1988-01-22 | 1989-07-27 | Mitsui Toatsu Chem Inc | Resin composition |
JPH01223150A (en) * | 1988-03-03 | 1989-09-06 | Yobea Rulon Kogyo Kk | Tetrafluoroethylene resin composition |
JPH0794555B2 (en) * | 1988-10-20 | 1995-10-11 | 三井東圧化学株式会社 | Method for manufacturing polyimide sheet |
US5206339A (en) * | 1989-04-05 | 1993-04-27 | Mitsui Toatsu Chemicals, Inc. | Extrusion process of polyimide and polyimide pellet used for the process |
US5037587A (en) * | 1989-07-17 | 1991-08-06 | Mitsui Toatsu Chemicals, Inc. | Preparation process of polyimide film |
KR920701318A (en) * | 1989-12-22 | 1992-08-11 | 사와무라 하루오 | Polyimide molded product |
US5494996A (en) * | 1993-01-21 | 1996-02-27 | Mitsui Toatsu Chemicals Inc. | Polyimide resin composition |
JPH069936A (en) * | 1993-04-30 | 1994-01-18 | Mitsui Toatsu Chem Inc | Heat-resistant adhesive |
US5508377A (en) * | 1993-12-21 | 1996-04-16 | Mitsui Toatsu Chemicals, Inc. | Polyimide |
US5484880A (en) * | 1993-12-21 | 1996-01-16 | Mitsui Toatsu Chemicals, Inc. | Polyimide |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5950691A (en) * | 1982-09-16 | 1984-03-23 | Yamatake Honeywell Co Ltd | Motor driven actuator |
JP2533841B2 (en) * | 1984-12-18 | 1996-09-11 | 三井東圧化学株式会社 | Heat resistant adhesive |
JP2537179B2 (en) * | 1985-09-19 | 1996-09-25 | 三井東圧化学株式会社 | Polyimide and heat-resistant adhesive made of polyimide |
-
1986
- 1986-03-05 JP JP61046369A patent/JP2537188B2/en not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
---|
高分子論文集42(7)第443頁−第451頁 |
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