JP2528326B2 - How to attach a capacitor to a circuit board - Google Patents
How to attach a capacitor to a circuit boardInfo
- Publication number
- JP2528326B2 JP2528326B2 JP62191200A JP19120087A JP2528326B2 JP 2528326 B2 JP2528326 B2 JP 2528326B2 JP 62191200 A JP62191200 A JP 62191200A JP 19120087 A JP19120087 A JP 19120087A JP 2528326 B2 JP2528326 B2 JP 2528326B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- circuit board
- cylindrical
- terminal
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Ceramic Capacitors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は回路基板に対するチップ状コンデンサの取付
方法に関する。TECHNICAL FIELD The present invention relates to a method for mounting a chip-shaped capacitor on a circuit board.
［従来の技術］ 回路基板に対する円筒型コンデンサの従来の取付け方
法は、円筒型コンデンサの一対の電極に対する一対のラ
ンドを有する回路基板を用意する工程と、円筒型コンデ
ンサの一対の電極をクリーム半田、半田ディップ等でラ
ンドに半田付けする工程とから成る。[Prior Art] A conventional method of mounting a cylindrical capacitor on a circuit board is to prepare a circuit board having a pair of lands for a pair of electrodes of the cylindrical capacitor, and to solder a pair of electrodes of the cylindrical capacitor with cream solder. The process consists of soldering to the land with a solder dip or the like.
［発明が解決しようとする問題点］ ところで、回路基板の配線パターンの高密度化、チッ
プ状コンデンサの小型化に伴い、一対のコンデンサ電極
及び一対のランドの相互間隔が狭くなると、一対のラン
ドに対して一対のコンデンサ電極が僅かに位置ずれして
も、半田による短絡が生じることがある。この種の短絡
が生じたものは当然不良品であるので、除外しなければ
ならないが、ランド相互間が狭いと電極の半田付け状態
を目視で検査することが非常に困難であった。[Problems to be Solved by the Invention] By the way, when the distance between the pair of capacitor electrodes and the pair of lands becomes narrower as the wiring pattern of the circuit board becomes higher in density and the chip-shaped capacitor becomes smaller, On the other hand, even if the pair of capacitor electrodes are slightly displaced, a short circuit due to solder may occur. Naturally, a short circuit of this type is a defective product and must be excluded. However, if the lands are narrow, it is very difficult to visually inspect the soldering state of the electrodes.
そこで、本発明の目的は上述の如き欠点を除去するこ
とができる回路基板に対するチップ状コンデンサの取付
け方法を提供することにある。Therefore, an object of the present invention is to provide a method for mounting a chip-shaped capacitor on a circuit board, which can eliminate the above-mentioned drawbacks.
［問題点を解決するための手段］ 上記問題点を解決し、上記目的を達成するための本発
明は、円筒状部とこの円筒状部の一端を閉塞する部分と
を有する金属キャップから成る第１及び第２の端子電極
を有し且つ前記第１及び第２の端子電極が互いに対向配
置されている円筒型コンデンサを、前記第１及び第２の
端子電極の中心を相互に結ぶ中心線が回路基板の主面に
対して平行になるような方向性を有して前記回路基板に
取付ける方法であって、前記回路基板に前記コンデンサ
の前記第１の端子電極の円筒状部を半田付けするための
平坦なランドと前記第２の端子電極を接続するためのワ
イヤボンディング部分とを設けたものを用意する工程
と、前記中心線が前記回路基板の主面に対して平行にな
るように前記コンデンサを配置して前記コンデンサの一
部を絶縁性接着剤によって前記回路基板に固着する工程
と、前記ランドに前記コンデンサの前記第１の端子電極
の円筒状部を半田付けする工程と、前記コンデンサの前
記第２の端子電極の円筒状部と前記ワイヤボンディング
部分との間をワイヤで接続する工程とを有することを特
徴とする回路基板に対するコンデンサの取付け方法に係
わるものである。[Means for Solving the Problems] The present invention for solving the above problems and achieving the above objects includes a metal cap having a cylindrical portion and a portion closing one end of the cylindrical portion. A center line connecting the centers of the first and second terminal electrodes to each other is a cylindrical capacitor having first and second terminal electrodes and in which the first and second terminal electrodes are arranged to face each other. A method of attaching to a circuit board having directivity parallel to a main surface of the circuit board, wherein the cylindrical portion of the first terminal electrode of the capacitor is soldered to the circuit board. For providing a flat land for connecting the second terminal electrode and a wire bonding portion for connecting the second terminal electrode, and the center line is parallel to the main surface of the circuit board. Place a capacitor to Fixing a part of the capacitor to the circuit board with an insulating adhesive; soldering the cylindrical portion of the first terminal electrode of the capacitor to the land; and the second terminal of the capacitor. And a step of connecting a wire between the cylindrical portion of the electrode and the wire bonding portion, which relates to a method for mounting a capacitor on a circuit board.
［発明の作用及び効果］ 本発明は次の作用効果を有する。[Operation and Effect of the Invention] The present invention has the following operation and effect.
（イ） 円筒型コンデンサであるにも拘らず、第１及び
第２の端子電極に対応させて一対のランドを設けず、一
対の端子電極のみに対応させたランドを設け、ここに第
１の端子電極を半田付けし、第２の端子電極は半田付け
せずにワイヤボンディングで接続する。第２の端子電極
を接続するためのワイヤボンディング部分の位置は第２
の端子電極の位置によってさほど制限されない。従っ
て、第１の端子電極を接続するための半田のはみだしが
あってもこの半田がワイヤボンディング部分に至らない
ようにワイヤボンディング部分の位置を決定することが
でき、半田による短絡を防ぐことができる。(A) Despite being a cylindrical capacitor, a pair of lands is not provided corresponding to the first and second terminal electrodes, and a land corresponding to only a pair of terminal electrodes is provided. The terminal electrodes are soldered and the second terminal electrodes are connected by wire bonding without soldering. The position of the wire bonding portion for connecting the second terminal electrode is the second
It is not so limited by the position of the terminal electrode of. Therefore, the position of the wire bonding portion can be determined so that the solder does not reach the wire bonding portion even if the solder for connecting the first terminal electrode is exposed, and a short circuit due to the solder can be prevented. .
（ロ） 円筒型コンデンサを接続するための平坦なラン
ドは、円筒状部の接線方向に延びた状態になるので、ラ
ンドの幅をさほど大きくしないで第１の端子電極を半田
付けすることができ、回路基板の主面におけるランドの
占有面積を小さくすることができる。(B) Since the flat land for connecting the cylindrical capacitor extends in the tangential direction of the cylindrical portion, the first terminal electrode can be soldered without increasing the width of the land so much. The area occupied by the land on the main surface of the circuit board can be reduced.
（ハ） コンデンサを絶縁性接着剤によって回路基板に
固着するので、第２の端子電極をランドに半田付けしな
いにも拘らず、コンデンサを安定的に回路基板に取付け
ることができる。(C) Since the capacitor is fixed to the circuit board with the insulating adhesive, the capacitor can be stably attached to the circuit board even though the second terminal electrode is not soldered to the land.
［実施例］ 次に、本発明の実施例に係わる回路基板に対する円筒
型コンデンサの取付け方法を説明する。図面に示す円筒
型磁器コンデンサ12は、円筒型誘電体磁器13と第１及び
第２のコンデンサ電極14、15と、金属キャップから成る
第１及び第２の端子電極16、17と、絶縁層18とから成
る。第１及び第２の端子電極16、17は円筒状部とこの一
端を閉塞する部分とを有し、第１及び第２のコンデンサ
電極14、15に覆せられ、互いに対向している。[Embodiment] Next, a method for mounting a cylindrical capacitor on a circuit board according to an embodiment of the present invention will be described. A cylindrical porcelain capacitor 12 shown in the drawing comprises a cylindrical dielectric porcelain 13, first and second capacitor electrodes 14 and 15, first and second terminal electrodes 16 and 17 made of a metal cap, and an insulating layer 18. It consists of and. The first and second terminal electrodes 16 and 17 have a cylindrical portion and a portion that closes one end thereof, are covered by the first and second capacitor electrodes 14 and 15, and face each other.
回路基板19上には第１の端子電極16を固着するための
ランド20と、ワイヤボンディング部分21とが設けられて
いる。A land 20 for fixing the first terminal electrode 16 and a wire bonding portion 21 are provided on the circuit board 19.
磁器コンンサ12を回路基板19上に取り付ける場合に
は、ランド20及び他の必要箇所にクリーム半田を印刷で
塗布する。When mounting the porcelain capacitor 12 on the circuit board 19, cream solder is applied to the land 20 and other necessary portions by printing.
次に絶縁性接着剤22を回路基板19上に塗布し、これに
より磁器コンデンサ12を固着し、しかる後半田リフロー
によって第１の端子電極16をランド20に半田23で固着す
る。Next, an insulating adhesive 22 is applied on the circuit board 19, whereby the porcelain capacitor 12 is fixed, and then the first terminal electrode 16 is fixed to the land 20 with the solder 23 by solder reflow.
なお、円筒型磁器コンデンサ12を回路基板19の主面に
対して平行に配置する。即ち、第１及び第２の端子電極
16、17の中心を相互に結ぶ中心線が回路基板19の主面に
対して平行になるように円筒型磁器コンデンサ12を配置
する。The cylindrical porcelain capacitor 12 is arranged parallel to the main surface of the circuit board 19. That is, the first and second terminal electrodes
The cylindrical ceramic capacitor 12 is arranged so that the center line connecting the centers of 16 and 17 to each other is parallel to the main surface of the circuit board 19.
次に、ワイヤボンディング装置によってワイヤ24を第
１の端子電極17とワイヤボンディング部分21とにボンデ
ィングし、磁器コンデンサ12の電気的接続を達成する。Next, the wire 24 is bonded to the first terminal electrode 17 and the wire bonding portion 21 by the wire bonding device to achieve the electrical connection of the porcelain capacitor 12.
上述のように製造することによって発明の作用効果の
欄で既に説明した作用効果を得ることができる。By manufacturing as described above, it is possible to obtain the operation and effect already described in the section of the operation and effect of the invention.
第１図は本発明の実施例に係わるコンデンサを含む回路
装置を示す断面図である。 12……円筒型磁器コンデンサ 16、17……第１及び第２の端子電極 23……半田 24……ワイヤFIG. 1 is a sectional view showing a circuit device including a capacitor according to an embodiment of the present invention. 12 …… Cylindrical porcelain capacitor 16, 17 …… First and second terminal electrodes 23 …… Solder 24 …… Wire
Claims (1)
部分とを有する金属キャップから成る第１及び第２の端
子電極を有し且つ前記第１及び第２の端子電極が互いに
対向配置されている円筒型コンデンサを、前記第１及び
第２の端子電極の中心を相互に結ぶ中心線が回路基板の
主面に対して平行になるような方向性を有して前記回路
基板に取付ける方法であって、 前記回路基板に前記コンデンサの前記第１の端子電極の
円筒状部を半田付けするための平坦なランドと前記第２
の端子電極を接続するためのワイヤボンディング部分と
を設けたものを用意する工程と、 前記中心線が前記回路基板の主面に対して平行になるよ
うに前記コンデンサを配置して前記コンデンサの一部を
絶縁性接着剤によって前記回路基板に固着する工程と、 前記ランドに前記コンデンサの前記第１の端子電極の円
筒状部を半田付けする工程と、 前記コンデンサの前記第２の端子電極の円筒状部と前記
ワイヤボンディング部分との間をワイヤで接続する工程
と、 を有することを特徴とする回路基板に対するコンデンサ
の取付け方法。1. A first and a second terminal electrodes, each of which is composed of a metal cap having a cylindrical portion and a portion closing one end of the cylindrical portion, and the first and second terminal electrodes are opposed to each other. The arranged cylindrical capacitor is arranged on the circuit board with directivity such that a center line connecting the centers of the first and second terminal electrodes to each other is parallel to the main surface of the circuit board. A flat land for soldering a cylindrical portion of the first terminal electrode of the capacitor to the circuit board;
And a wire bonding portion for connecting the terminal electrodes of the capacitor, and the capacitor is arranged such that the center line is parallel to the main surface of the circuit board. A part of the capacitor to the circuit board with an insulating adhesive, soldering the cylindrical part of the first terminal electrode of the capacitor to the land, and a cylinder of the second terminal electrode of the capacitor. A step of connecting a wire between the strip portion and the wire bonding portion, and a method for mounting a capacitor on a circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62191200A JP2528326B2 (en) | 1987-07-30 | 1987-07-30 | How to attach a capacitor to a circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62191200A JP2528326B2 (en) | 1987-07-30 | 1987-07-30 | How to attach a capacitor to a circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6435905A JPS6435905A (en) | 1989-02-07 |
| JP2528326B2 true JP2528326B2 (en) | 1996-08-28 |
Family
ID=16270573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62191200A Expired - Lifetime JP2528326B2 (en) | 1987-07-30 | 1987-07-30 | How to attach a capacitor to a circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2528326B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007220751A (en) * | 2006-02-14 | 2007-08-30 | Tdk Corp | Ceramic capacitor and mounting structure thereof |
| JP2014027255A (en) * | 2012-06-22 | 2014-02-06 | Murata Mfg Co Ltd | Ceramic electronic component and ceramic electronic device |
| JP6520610B2 (en) * | 2015-09-25 | 2019-05-29 | Tdk株式会社 | Electronic parts |
| JP2017126715A (en) * | 2016-01-15 | 2017-07-20 | 株式会社村田製作所 | Electronic component, mounted electronic component, and electronic component mounting method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54131946U (en) * | 1978-03-06 | 1979-09-12 |
-
1987
- 1987-07-30 JP JP62191200A patent/JP2528326B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6435905A (en) | 1989-02-07 |
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