JP2024056159A - Peeling device and peeling method - Google Patents

Abstract

To provide a peeling device and a peeling method that peel and separate a composite substrate while preventing surface scratch.SOLUTION: A peeling device 200 that peels a composite substrate W at the boundary and separates it into a first substrate W1 and a second substrate W2 includes an aperture module 30, and a separation module 40, and the separation module 40 includes a pair of second wedges 44 that bite into the boundary from both sides of the composite substrate W which is open at one end in a second direction, and separate the composite substrate W into the fixed first substrate W1 and the second substrate W2.SELECTED DRAWING: Figure 2

Description

The present invention relates to a peeling device and a peeling method for a composite substrate, and more specifically, to a peeling device and a peeling method for peeling a composite substrate at its boundary to separate it into two substrates.

As one type of substrate for semiconductor devices, a composite substrate made of gallium nitride (GaN) or silicon carbide (SiC) that can be separated into an upper substrate and a lower substrate is known. Patent Document 1 (JP 2021-170594 A) discloses a method for peeling and separating an upper substrate from a lower substrate at a wafer alteration layer of a predetermined depth as a boundary in a gallium nitride wafer having an epitaxial film formed on the upper portion. In the method disclosed in Patent Document 1, element components are also formed in the chip formation region on the epitaxial film. The method is briefly described as follows.

First, a bulk gallium nitride wafer is prepared. Next, an epitaxial film is formed on one surface of the wafer. Next, device components are formed in the chip configuration regions on the epitaxial film using a typical semiconductor process. Next, a wafer alteration layer that can be divided into each chip configuration region and a wafer alteration layer that can be separated into a lower substrate and an upper substrate at a predetermined depth are formed using laser light. The lower substrate is then fixed with an auxiliary member, a holding member is attached to the device configuration portion of the upper substrate, and the holding member is pulled up to peel and separate the upper substrate from the lower substrate.

According to Patent Document 2 (JP Patent Publication 2009-214485), high-pressure air is injected into the gaps in the composite substrate to peel it off. Also, Patent Document 3 (JP Patent Publication 2014-110387) discloses a method in which a sharp member is inserted into the boundary of the composite substrate to open it, and multiple suction pads are used to sequentially suck the substrate from the opening side, gradually lifting (peeling) one of the substrates.

JP 2021-170594 A JP 2009-214485 A JP 2014-110387 A

However, the methods disclosed in Patent Documents 1 and 3 have the problem that when the composite substrate is peeled and separated only by pulling, the substrates rub against each other due to vibration caused by adhesion, etc., and the surface of the substrate is damaged. Also, the method disclosed in Patent Document 2 has the problem that minute fragments of the composite substrate generated during peeling damage the surface of the composite substrate when high-pressure air is introduced.

The present invention has been made in consideration of the above circumstances, and aims to provide a peeling device and peeling method that peels a composite substrate at the boundary and separates it into two substrates (a first substrate and a second substrate), and that can easily separate the composite substrate without causing scratches on the surfaces of the first substrate and the second substrate.

The present invention solves the above problems by the solution described below as one embodiment.

A peeling device that peels a composite substrate at a boundary portion to separate the composite substrate into a first substrate and a second substrate, the peeling device comprising an opening module and a separation module, the opening module having at least one of a push-up member that pushes up a first surface of the second substrate that faces the first substrate to open one end of the composite substrate, and a pull-up member that pulls up a second surface of the second substrate opposite the first substrate to open one end of the composite substrate, and the separation module has a pair of second wedges that bite into the boundary portion from both sides of the composite substrate with one end open in a second direction to separate the composite substrate into the fixed first substrate and the second substrate.

In this way, one end of the composite substrate is opened by at least one of the pushing member and the pulling member, and then the second wedge is inserted from both sides of the composite substrate during the subsequent peeling and separation, which makes it possible to prevent damage to the composite substrate during peeling, compared to conventional peeling devices.

The opening module further has a fixing portion for fixing the composite substrate, and the push-up member is preferably a first wedge that bites into the boundary portion of the composite substrate in a first direction and opens one end side of the composite substrate. Even when opening one end of the composite substrate, there is no adhesion to the composite substrate or air flow between the first substrate and the second substrate, which further prevents the surface of the composite substrate from being scratched.

It is preferable that the second wedge has a wedge piece that protrudes in the second direction.

It is preferable that the wedge piece has a base and an inclined portion, the base is formed to a constant thickness, and the inclined portion is formed in an inclined shape so as to become gradually thinner in the second direction.

It is preferable that the inclined portion is formed so that its width gradually narrows in the first direction.

The method for peeling off a composite substrate includes a first peeling step having at least one of a step of pushing up a first surface of a second substrate facing the first substrate to open one end of the composite substrate and a step of pulling up a second surface of the second substrate opposite the first substrate to open one end of the composite substrate, and a second peeling step of inserting a pair of second wedges into the boundary of the composite substrate from both sides of the composite substrate in a second direction to separate the composite substrate into the first substrate and the second substrate.

Accordingly, the first peeling process, which involves at least one of pushing up and pulling up, opens one end of the composite substrate, and in the subsequent peeling and separation, the second peeling process, which involves inserting second wedges from both sides of the composite substrate, makes it possible to prevent damage to the composite substrate during peeling, compared to conventional peeling devices.

The first peeling step preferably includes a step of opening one end of the composite substrate by inserting a first wedge into the boundary of the composite substrate in a first direction. Even when opening one end of the composite substrate, the composite substrate is not adhered to the substrate or air does not flow between the first substrate and the second substrate, so that the surface of the composite substrate can be further prevented from being scratched.

The process following the second peeling process may include an alignment process in which the second substrate is placed on a base portion of the second wedge having a constant thickness, thereby aligning the second substrate in a horizontal state.

By inserting the second wedge from both sides of the composite substrate with one end open, damage to the composite substrate during peeling can be prevented compared to conventional peeling devices and methods.

1 is a plan view (schematic view) of an entire peeling device according to an embodiment of the present invention. 2A is a side view of an opening module and a separation module (part) of the peeling device of FIG. 1, and FIG. 2B is a perspective view of the opening module and the separation module (part) of the peeling device of FIG. FIG. 2 is a schematic cross-sectional view taken along line III-III in FIG. 4A is a side view of the separation module of FIG. 1, FIG. 4B is another side view of the separation module of FIG. 1, FIG. 4C is an upper oblique view of the separation module of FIG. 1, FIG. 4D is another upper oblique view of the separation module of FIG. 1, and FIG. 4E is a lower oblique view of the separation module of FIG. 1. FIG. 2 is a block diagram of a control unit according to the embodiment of the present invention. 6A is an enlarged view of the front of the second wedge of FIG. 3, FIG. 6B is an enlarged view of a perspective of the second wedge of FIG. 3, and FIG. 6C is an enlarged view of another perspective of the second wedge of FIG. 7A is a top perspective view of the rotary chuck of FIG. 3, FIG. 7B is another top perspective view of the rotary chuck of FIG. 3, and FIG. 7C is a bottom perspective view of the rotary chuck of FIG. FIG. 2 is a top perspective view of the temporary placement table according to the embodiment of the present invention. FIG. 9A is an explanatory diagram (plan view) showing the aperture module according to the first embodiment of the present invention, and FIG. 9B is an explanatory diagram (side view) showing the aperture module according to the first embodiment of the present invention. FIG. 10A is an explanatory diagram (plan view) showing an aperture module according to a second embodiment of the present invention, and FIG. 10B is an explanatory diagram (side view) showing an aperture module according to the second embodiment of the present invention. FIG. 11A is an explanatory diagram (plan view) showing an aperture module according to a third embodiment of the present invention, and FIG. 11B is an explanatory diagram (side view) showing an aperture module according to the third embodiment of the present invention. FIG. 12A is an explanatory diagram (plan view) showing an aperture module according to a fourth embodiment of the present invention, and FIG. 12B is an explanatory diagram (side view) showing an aperture module according to the fourth embodiment of the present invention. FIG. 13A is an explanatory diagram (plan view) showing an aperture module according to a fifth embodiment of the present invention, and FIG. 13B is an explanatory diagram (side view) showing an aperture module according to the fifth embodiment of the present invention. FIG. 14A is an explanatory diagram (plan view) showing an aperture module according to a sixth embodiment of the present invention, and FIG. 14B is an explanatory diagram (side view) showing an aperture module according to the sixth embodiment of the present invention. FIG. 15A is an explanatory diagram (plan view) showing an aperture module according to a seventh embodiment of the present invention, and FIG. 15B is an explanatory diagram (side view) showing an aperture module according to the seventh embodiment of the present invention.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view (schematic diagram) of a peeling apparatus 200 according to an embodiment of the present invention. FIG. 2A is a side view of the opening module 30 and the separation module 40 (part) of the peeling apparatus 200 of FIG. 1, and FIG. 2B is a perspective view of the opening module 30 and the separation module 40 (part) of the peeling apparatus 200 of FIG. 1. In particular, FIG. 2 shows the arrangement of the opening module 30 and the separation module 40 (part) in the first embodiment in a state in which the composite substrate W has been peeled and not separated. FIG. 3 is a cross-sectional view along line III-III of FIG. 1, and is a cross-sectional view (schematic diagram) showing the separation module 40, the rotary chuck 61, and the temporary placement table 69. 4A is a side view of the separation module 40 of FIG. 1, FIG. 4B is another side view of the separation module 40 of FIG. 1, FIG. 4C is an upper perspective view of the separation module 40 of FIG. 1, FIG. 4D is another upper perspective view of the separation module 40 of FIG. 1, and FIG. 4E is a lower perspective view of the separation module 40 of FIG. 1. FIG. 5 is a block diagram of the control unit 102 according to an embodiment of the present invention. FIG. 6A is an enlarged front view of the second wedge 44 of FIG. 2, FIG. 6B is an enlarged perspective view of the second wedge 44 of FIG. 2, and FIG. 6C is an enlarged perspective view of the second wedge 44 of FIG. 2. FIG. 7A is an upper perspective view of the rotary chuck 61 of FIG. 3, FIG. 7B is another upper perspective view of the rotary chuck 61 of FIG. 3, and FIG. 7C is a lower perspective view of the rotary chuck 61 of FIG. 3. FIG. 8 is an upper perspective view of the temporary placement tables 69 and 70 according to an embodiment of the present invention. In each figure except for FIG. 5, the X, Y, and Z directions are illustrated. In all figures for explaining each embodiment, the same reference numerals are used for components having the same functions, and repeated explanations may be omitted.

First Embodiment
(Peeling device)
First, the overall configuration of the peeling device 200 according to the present embodiment will be described. As shown in Fig. 1 and Fig. 3, the peeling device 200 includes a substrate placement section 10 in which a composite substrate W is stored, a first robot hand 20 having an opening module 30 at its tip, a separation module 40, a rotary chuck 61, a temporary placement table 69, 70, an air blow mechanism 80, a second robot hand 90, and a cassette 100. When the composite substrate W is transported from the substrate placement section 10 to the separation module 40 by the first robot hand 20, one end of the composite substrate W is opened (i.e., peeled). Next, the composite substrate W with one end opened is peeled and separated into a first substrate W1 and a second substrate W2 in the separation module 40. Next, the first substrate W1 is transferred to the temporary placement table 70 by the first robot hand 20. Next, the opening module 30 is transported by the first robot hand 20 to the air blow mechanism 80 without holding the first substrate W1 or the second substrate W2, and fine debris adhering to the opening module 30 and the first robot hand 20 is collected. The second substrate W2 is held by the rotary chuck 61, turned upside down so that the product surface faces vertically upward, temporarily placed on the temporary placement table 69, and transported by the second robot hand 90 to the cassette 100. The first substrate W1 on the temporary placement table 70 is also transported to the cassette 100 by the second robot hand 90, similar to the second substrate W2. The first substrate W1 or the second substrate W2 may also be transported by the first robot hand 20 to the air blow mechanism 80, and fine debris may be collected.

The composite substrate W according to the present embodiment is, for example, a compound substrate made of gallium nitride (GaN) or silicon carbide (SiC). More specifically, an epitaxial film is formed on one surface of the gallium nitride substrate, and a boundary is formed at a predetermined depth by, for example, laser light. In order to clarify the positional relationship between the separated substrates, for example, the first substrate W1 is the lower substrate W1, and the second substrate W2 is the upper substrate W2. In addition, the surface of the second substrate W2 facing the first substrate W1 is the first surface, and the back surface of the first surface is the second surface. The predetermined depth of the boundary is not particularly limited, and the upper substrate W2 may be a substrate formed only of an epitaxial film, or may be a substrate formed of an epitaxial film and gallium nitride. The composite substrate W has a diameter of several tens to several hundreds of mm, and is, for example, a disk-shaped substrate with a diameter of φ150 mm. Furthermore, the composite substrate W may have an orientation flat at a predetermined location.

The substrate placement part 10 according to this embodiment has multiple composite substrates W placed vertically and arranged in parallel. As an example, the substrate placement part 10 is configured to be inclined so that its height gradually decreases in the Y-axis direction. As an example, a cassette may be used as the substrate placement part 10.

Next, the first robot hand 20 according to this embodiment is a known first robot hand 20 having an opening module 30 at its tip. The first robot hand 20 is, as an example, a vertical articulated robot (six axes). The first robot hand 20 can vertically lift the composite substrate W placed vertically on the substrate placement unit 10 and transport it to each of the separation module 40, temporary placement table 69, and air blow mechanism 80.

Next, the opening module 30 according to this embodiment has a mounting table 36, as shown in FIG. 2. The mounting table 36 is provided with a push-up member 32 and two fixing parts 34, and the composite substrate W can be placed on the mounting table 36 and held by the push-up member 32 and the fixing parts 34. Note that, in this embodiment, mounting on the mounting table 36 includes not only mounting the composite substrate W in a horizontal state, but also mounting the composite substrate W and mounting table 36 in an inclined state and a vertical state.

In addition, the push-up member 32 according to this embodiment is, as an example, a first wedge 32. As shown in FIG. 2 and FIG. 9, the first wedge 32 is a sharp member that faces the composite substrate W in a side view so as to bite into the boundary portion of the composite substrate W. The first wedge 32 is connected to a slide portion 38 and is configured to be slid toward the composite substrate W side (the X-axis direction, which may be referred to as the "first direction" hereinafter) by a slide mechanism (not shown; as an example, an air slide). More specifically, the first wedge 32 is slid from an initial state in which the composite substrate W is not held to a position in which the composite substrate W is held, and is further slid in the first direction to peel and separate the composite substrate W. The first wedge 32 can push up the first surface of the second substrate W2 to peel the second substrate W2 from the first substrate W1. That is, one end of the composite substrate W can be opened. In addition, since the first wedge 32 comes into contact with the composite substrate W, it is preferable to use a material with a low coefficient of friction. Examples include Teflon (registered trademark), polyacetal, PEEK, PPS, ceramics, etc.

2B, the fixing parts 34 are provided at two locations on the mounting table 36 and are configured to hold the composite substrate W by contacting it at a point or a line. The first wedge 32 is slidably driven, while the position of the fixing parts 34 remains unchanged. As an example, the side of one of the fixing parts 34 is formed in a shape that follows the circumference of the composite substrate W, and the other fixing part 34 is formed in a shape that follows the orientation flat of the composite substrate W. Since the fixing parts 34 come into contact with the composite substrate W, it is preferable to use a material with a low friction coefficient. Examples include Teflon (registered trademark), polyacetal, PEEK, PPS, ceramics, etc. The fixing parts 34 allow the composite substrate W to be placed in an accurate position on the opening module 30.

Next, the separation module 40 according to this embodiment will be described. As shown in FIG. 3 and FIG. 4, the separation module 40 includes a second wedge 44, a dustproof top plate 50, a suction mechanism 51 provided at the bottom of the dustproof top plate 50, a movable stopper 53 provided at the bottom of the dustproof top plate 50, and sensors 55 to 60 provided at predetermined positions on the dustproof top plate 50. In addition, a rotary chuck 61 and a temporary placement table 69 are provided in this order below the separation module 40. Furthermore, below the dustproof top plate 50, at a position surrounded by the pair of second wedges 44 and the suction mechanism 51, there is a predetermined space for carrying in the opening module 30 on which the composite substrate W is fixed and placed. FIG. 2 also shows a state in which the composite substrate W is transported by the first robot hand 20 to a predetermined space in the frame 41 of the separation module 40, and the second substrate W2 is peeled off from the first substrate W1 by the push-up member (first wedge) 32. In FIG. 2, for convenience of explanation, the second wedge 44 is shown only on one side, but in reality, it is arranged on both sides of the composite substrate W. Also, the dustproof top plate 50, the suction mechanism 51, the sensors 55 to 60, the rotary chuck 61, etc. are not shown. The second wedge 44 is arranged at a height that does not contact the first substrate W1 when it enters (bites into) the gap between the first substrate W1 and the second substrate W2. In other words, the first robot hand 20 transports the opening module 30 to a height at which the first substrate W1 does not contact the second wedge 44.

The separation module 40 according to this embodiment is provided with a first sensor 55, a second sensor 56, a third sensor 57, a fourth sensor 58, a fifth sensor 59, and a sixth sensor 60. Each of the sensors 55-60 is configured to measure the distance to each position of the opening module 30 by laser light, for example, by itself. In addition, by combining the measured values of the multiple sensors 55-60, the attitude of the opening module 30 (rotation angles roll, pitch, yaw about each axis) can be measured. Furthermore, each of the sensors 55-60 is connected to the control unit 102 (however, for convenience of explanation, only the first sensor 55 is shown in FIG. 3). Specifically, the first sensor 55 can measure the distance (X-axis direction distance) to the tip side (movable stopper 53 side) of the opening module 30. The second sensor 56 and the third sensor 57 can measure the distance (Y-axis direction distance) to the side (second wedge 44 side) of the opening module 30. The fourth sensor 58, the fifth sensor 59, and the sixth sensor 60 can measure the distance (Z-axis direction distance) of the opening module 30 to the mounting table 36. Note that the positions of the opening module 30 to which the sensors 55 to 60 measure the distance are not limited to these.

As shown in FIG. 5, each measurement value is input to the input unit 103 of the control unit 102. Next, the rotation calculation unit 107 of the calculation unit 106 calculates the rotation angle (yaw) of the aperture module 30 about the Z-axis direction based on the measurement values of the second sensor 56 and the third sensor 57. The rotation calculation unit 107 also calculates the rotation angle (pitch) of the aperture module 30 about the Y-axis direction based on the measurement values of the fourth sensor 58 and the fifth sensor 59. Furthermore, the rotation calculation unit 107 calculates the rotation angle (roll) about the X-axis direction based on the measurement values of the fifth sensor 59 and the sixth sensor 60.

The memory unit 105 stores thresholds XTS, YTS, ZTS, RTS, PTS, and YWTS for each measured value and each calculated value. The judgment unit 108 compares each measured value and calculated value with each threshold XYS, YTS, ZTS, RTS, PTS, and YWTS, and if any measured value or calculated value exceeds the threshold, the second wedge control unit 109 outputs a signal from the output unit 104 to stop the slide drive unit 48 described below.

The calculation unit 106 may be equipped with a first robot hand control unit (not shown) that feedback controls the posture of the first robot hand 20 when each measured value and each calculated value exceeds each threshold value.

In addition, instead of measuring each distance to the aperture module 30, each sensor 55-60 may directly measure the distance to the composite substrate W (i.e., the first substrate W1 and the second substrate W2), and the rotation calculation unit 107 may be configured to calculate each rotation of the composite substrate W.

The control unit 102 is composed of a CPU and a memory, and operates based on a preset operation program and a setting signal input from the operation unit. The calculation unit 106 (rotation calculation unit 107, judgment unit 108, second wedge control unit 109) corresponds to the CPU, and the storage unit 105 corresponds to the memory.

The pair of second wedges 44 according to this embodiment are connected to the rods 48a of the slide drive unit (air cylinder, for example) 48 provided on the upper part of the dustproof top plate 50 via the slide unit 42 extending in the Z-axis direction with the suction mechanism 51 sandwiched between them. The slide drive unit 48 drives each rod 48a in a linear reciprocating manner, so that the slide unit 42 and the second wedge 44 are driven in a linear reciprocating manner in the Y-axis direction. That is, after the second substrate W2 is peeled off from the first substrate W1 (i.e., one end of the composite substrate W is opened), the second wedges 44 enter (bite into) the gap between the first substrate W1 and the second substrate W2 from both sides of the composite substrate W in a direction perpendicular to the first direction (the Y-axis direction, which may be referred to as the "second direction" hereinafter).

In FIG. 4, one slide portion 42 is inserted into a through hole in the dustproof top plate 50, and the other slide portion 42 is arranged to surround the dustproof top plate 50 from the outside, but this is not limited to this.

In addition, the slide drive unit 48 may be configured with a screw drive or a rack and pinion instead of an air cylinder. In addition, although one slide drive unit 48 (common) is provided for the pair of second wedges 44, one may be provided for each second wedge 44.

In addition, a movable stopper 53 is provided on the lower side of the separation module 40 according to this embodiment. The movable stopper 53 is connected to a slide drive unit 54 provided on the upper part of the dustproof top plate 50, and is configured to be able to move linearly back and forth in the first direction. In addition, the side surface of the abutment portion 53a of the movable stopper 53 has the same shape as the peripheral shape of the composite substrate W, as an example. Furthermore, when the second wedge 44 enters (bites into) the gaps on both sides of the composite substrate W, the abutment portion 53a abuts against one end of the composite substrate W opposite to the side where the opening is made. When the second substrate W2 is peeled off and separated from the first substrate W1, each substrate W1, W2 is displaced relative to the opening module 30, so that the abutment portion 53a abuts against each substrate W1, W2 and is driven to move linearly back and forth in the first direction in conjunction with the positional displacement. This allows the second substrate W2 to be gradually peeled off and separated from the first substrate W1. In addition, since the movable stopper 53 comes into contact with the composite substrate W, it is preferable to use a material with a low coefficient of friction. Examples include Teflon (registered trademark), polyacetal, PEEK, PPS, ceramics, etc.

Next, the second wedge 44 according to this embodiment will be described in detail. FIG. 6 is an enlarged view of the second wedge 44 shown in FIG. 2. As shown in FIGS. 6B and 6C, the second wedge 44 has a wedge piece 45 that protrudes in the second direction. The wedge piece 45 penetrates (bites into) the gap between the first substrate W1 and the second substrate W2, thereby gradually separating the second substrate W2 from the first substrate W1.

The dimensions of the wedge piece 45 are not particularly limited, but the smaller the penetration rate into the gap between the first substrate W1 and the second substrate W2, the better. As an example, the protruding length (length in the Y-axis direction) D1 is about 5 mm to 50 mm, and the width (length in the X-axis direction) D2 is about 30 mm to 100 mm. More preferably, the protruding length D1 is about 10 mm to 15 mm, and the width D2 is about 40 mm to 60 mm. However, the diameter of the composite substrate W is not limited to φ150 mm.

As another example, the protrusion length D1 is approximately 5% to 50% of the radius of the composite substrate W, and the width D2 is approximately 30% to 100% of the radius of the composite substrate W. More preferably, the protrusion length D1 is approximately 10% to 15% of the radius of the composite substrate W, and the width D2 is approximately 40% to 60% of the radius of the composite substrate W. However, the diameter of the composite substrate W is not limited to φ150 mm.

The wedge piece 45 has a base 47, which may be formed to a constant thickness d3. With this, when the second substrate W2 is completely separated from the first substrate W1, the second substrate W2 can be placed parallel to the base 47, and for example, the second substrate W2 can be separated parallel to the first substrate W1 or horizontal to the ground. In other words, as described below, when the first substrate W1 and the second substrate W2 are transported separately after separation, the substrates W1 and W2 can be prevented from coming into contact with each other and being damaged.

The dimensions of the base 47 are not particularly limited, but the smaller the contact area with the second substrate W2, the more preferable. As an example, d1 is approximately 20 mm to 80 mm, d2 is approximately 0.5 mm to 8 mm, and the thickness d3 of the base 47 is approximately 2 mm to 20 mm. More preferably, d1 is approximately 30 mm to 40 mm, d2 is approximately 1 mm to 2 mm, and the thickness d3 of the base 47 is approximately 4 mm to 6 mm. However, the diameter of the composite substrate W is not limited to φ150 mm.

As another example, d1 is approximately 20% to 80% of the radius of the composite substrate W, d2 is approximately 0.5% to 8% of the radius of the composite substrate W, and the base thickness d3 is approximately 2% to 20% of the radius of the composite substrate W. More preferably, d1 is approximately 30% to 40% of the radius of the composite substrate W, d2 is approximately 1% to 2% of the radius of the composite substrate W, and d3 is approximately 4% to 6% of the radius of the composite substrate W. However, the diameter of the composite substrate W is not limited to φ150 mm.

Furthermore, the peripheral shape of the base 47 in this embodiment is, as an example, an arc shape (arc surface) of approximately the same shape as the composite substrate W, but it may also be a straight line shape (flat surface) or a curved shape (curved surface). Furthermore, the base 47 in this embodiment is located at the center of the second wedge 44 in the X-axis direction, but may also be located at a position offset to one side.

The wedge piece 45 may also have an inclined portion 46 that is gradually thinner in the second direction. This allows the second substrate W2 to be separated from the first substrate W1 as the second wedge 44 enters the gap between the first substrate W1 and the second substrate W2. The second substrate W2 is in point or line contact with the inclined portion 46, which prevents the peeled surface (first surface) of the second substrate W2 from being scratched.

The inclination angle θ1 of the inclined portion 46 is, for example, 2° to 35°. More preferably, the inclination angle θ1 is 10° to 20°. However, the diameter of the composite substrate W is not limited to φ150 mm.

Furthermore, the inclined portion 46 may be formed in a shape that gradually narrows in the first direction. That is, the inclined portion 46 may be formed in a so-called "escape" shape with respect to the second substrate W2 in the first direction. As shown in FIG. 2A, the gap between the first substrate W1 and the second substrate W2 gradually narrows in the first direction in the separation stage. That is, the second wedge 44 and the second substrate W2 are more likely to come into contact with each other toward the first direction. By adopting the narrow shape as described above, the penetration ratio of the second wedge 44 into the gap between the first substrate W1 and the second substrate W2 can be reduced toward the first direction, and the composite substrate W can be further prevented from being scratched.

In addition, since the second wedge 44 comes into contact with the composite substrate W, it is preferable to use a material with a low coefficient of friction. Examples include Teflon (registered trademark), polyacetal, PEEK, PPS, ceramics, etc.

Next, the suction mechanism 51 according to this embodiment will be described. The suction mechanism 51 is provided on the lower part of the dustproof top plate 50. The suction mechanism 51 is, for example, a suction pad 51, and is configured to suction and hold the second substrate W2 by vacuum suction. The suction pad 51 is connected to the pressure adjustment mechanism 101 via the flow path 52. The control unit 102 controls the pressure adjustment mechanism 101, which then draws a vacuum inside the flow path 52. This allows the suction pad 51 to suction and hold the second substrate W2. Furthermore, the suction pad 51 has, for example, a bellows structure, and is provided on the dustproof top plate 50 so as to be tiltable in all directions. This allows the second substrate W2 to be reliably suctioned even when the second substrate W2 is not in a horizontal state. After the second substrate W2 is completely separated from the first substrate W1, it is suctioned and held by the suction mechanism 51.

Next, the rotary chuck 61 according to this embodiment will be described. As shown in FIG. 3 and FIG. 7, the rotary chuck 61 has an inversion table 62, a pair of bearings 63, a lifting table 65, a connecting portion 66, a ball screw 67, and a vertical movement drive device 68. The inversion table 62 is connected to the lifting table 65 via an inversion shaft (not shown) fitted into each bearing 63, and an inversion mechanism (as an example, a servo motor) 64 is connected to one of the inversion shafts. The inversion table 62 is configured to be inverted up and down by the inversion mechanism 64 with the inversion shaft as the axis. The lifting table 65 is also connected to the ball screw 67 via the connecting portion 66, and is configured to be driven to move up and down within the frame 41 by the ball screw 67 being rotated by the vertical movement drive device 68. Note that FIG. 3 shows the inversion table 62 facing upward, and FIG. 7 shows the inversion table 62 facing downward.

On one side of the inversion table 62, two gripping sections (for example, gripping claws) 62a capable of gripping the composite substrate W and four work guides 62b on which the composite substrate W can be placed are provided. Each gripping claw 62a is connected to a slide drive section 62c provided on the other side of the inversion table 62 through a through hole that penetrates the inversion table 62. The slide drive section 62c drives each gripping claw 62a to slide in the radial direction of the composite substrate W. The work guide 62b has a curved shape that allows it to make point or line contact with the outer periphery of the second substrate W2. Each gripping claw 62a can grip the composite substrate W placed on each work guide 62b.

That is, the rotary chuck 61 has an inversion table 62 that can be inverted up and down, and a lifting table 65 that can move up and down. When the lifting table 65 is raised to the top and one surface of the inversion table 62 is in a position facing the second substrate W2 (facing upward), the second substrate W2 adsorbed and held by the suction mechanism 51 can be held by the gripping claws 62a and the work guide 62b. After holding the second substrate W2, the lifting table 65 is lowered to the bottom and the inversion table 62 is inverted up and down. Then, the gripping by the gripping claws 62a is released, and the second substrate W2 can be placed on the temporary placement table 69 described below.

The lift platform 65 is not limited to a configuration in which the connecting portion 66 engages with the ball screw 67 and is driven to move up and down within the frame body 41. As another example, the lift platform 65 may be configured to be driven to move up and down by an electric cylinder or an air cylinder (neither of which are shown).

As shown in Figs. 3 and 8, the temporary placement table 69 according to this embodiment has four support columns 69a on a base, each having a work guide 69b on the upper portion. As an example, the work guide 69b has a curved shape that allows it to make point or line contact with the outer periphery of the second substrate W2.

Next, reference numeral 70 denotes a temporary placement table. The temporary placement table 70 has the same configuration as the temporary placement table 69, so a description thereof will be omitted.

Next, reference numeral 80 denotes an air blow mechanism. The air blow mechanism 80 is formed as a housing having a predetermined space in which the opening module 30 is transported by the first robot hand 20. The air blow mechanism 80 is configured to transport the opening module 30, which is not holding either the first substrate W1 or the second substrate W2, into the air blow mechanism 80, and then remove fine debris from the surfaces of the opening module 30 and the first robot hand 20 using an air blow nozzle 82, and collect the fine debris using a suction port 84. Note that the air blow mechanism 80 may be configured to remove fine debris from the surfaces of the first substrate W1 or the second substrate W2.

Next, reference numeral 90 denotes a second robot hand. As an example, the second robot hand 90 is a SCARA type robot (three or four axes). The second robot hand 90 can transport the first substrate W1 placed on the temporary placement table 70 to the cassette 100. The second robot hand 90 can also transport the second substrate W2 placed on the temporary placement table 69 to the cassette 100.

(Removal method)
The above has described the configuration of the delamination apparatus 200 according to the present embodiment. Meanwhile, the delamination method according to the present embodiment can also be carried out using the delamination apparatus 200. The delamination method will be described below.

First, the first robot hand 20 is operated to hold the composite substrate W placed vertically on the substrate placement section 10 by the first wedge 32 and the two fixing sections 34 of the opening module 30, and place it on the placement table 36.

Next, the first surface of the second substrate W2 is pushed up by the first wedge 32 to open one end of the composite substrate W. That is, the first wedge 32 is caused to bite into the boundary of the composite substrate W in the first direction by the slide portion 38, and one end of the composite substrate W is peeled off (opened) (first peeling process). This causes the second substrate W2 to be peeled off from the first substrate W1. Note that in the first peeling process, the slide portion 38 can be stopped when the gap between the first substrate W1 and the second substrate W2 is opened to an extent that the second wedge 44 can enter (i.e., greater than or equal to the thickness of the tip of the wedge piece 45).

Next, the opening module 30 (i.e., the composite substrate W) is transported to a predetermined space in the separation module 40 by the first robot hand 20 while changing its position horizontally (first transport step). More specifically, the composite substrate W is transported by the first robot hand 20 to the height of the wedge piece 45 of the second wedge 44.

Next, the slide drive unit 48 provided on the dustproof top plate 50 causes the wedge pieces 45 of the pair of second wedges 44 to advance (bite into) the boundary portion of the composite substrate W from both sides of the composite substrate W in the second direction (second peeling process). This allows the second substrate W2 to be separated from the first substrate W1.

Next, the wedge piece 45 is further inserted (bite) into the boundary of the composite substrate W, and the second substrate W2 is placed on the base 47 of the second wedge 44, which has a constant thickness, to align the second substrate W2 horizontally (alignment process). This makes the first substrate W1 and the second substrate W2 parallel to each other, and when the first substrate W1 and the second substrate W2 are transported separately, the substrates W1 and W2 do not come into contact with each other, preventing scratches on the surfaces of the substrates W1 and W2. After separation, the second substrate W2 is suction-held by the suction pad 51.

Next, the first substrate W1 is transported to the temporary placement table 70 by the first robot hand 20 and placed on the four work guides 70b provided on the temporary placement table 70 (second transport process).

Next, the second robot hand 90 transports the first substrate W1 placed on the temporary placement table 70 to the cassette 100 (third transport process).

After or simultaneously with the second transport step, the lifting platform 65 is raised to a predetermined position, the reversing platform 62 is turned upside down by 180°, and then it is further raised to the substrate receiving position, the suction mechanism 51 releases the second substrate W2 from suction and holds it on the work guide 62b. The second substrate W2 is then held on the reversing platform 62 by the gripping claws 62a and the work guide 62b, and the lifting platform 65 is then lowered to a predetermined position (fourth transport step).

Next, the reversal table 62 is inverted 180° up and down, the lift table 65 is lowered to the substrate transfer position, the second substrate W2 is released, and the inverted second substrate W2 is placed on the four work guides 69b provided on the temporary placement table 69 (reversal process).

Next, the second robot hand 90 transports the second substrate W2 placed on the temporary placement table 69 to the cassette 100 (fifth transport process).

After the second transport process, the air blowing mechanism 80 collects minute debris from the surface of the opening module 30 and the first robot hand 20 when they are not holding either the first substrate W1 or the second substrate W2 (first air blowing process).

In addition, as a process before the first air blowing process, a process may be included in which the first robot hand 20 transports the first substrate W1 to a predetermined space in the air blowing mechanism 80, and the air blowing mechanism 80 collects fine debris on the surface of the first substrate W1 (second air blowing process). In addition, as a process after the inversion process, a process may be included in which the first robot hand 20 transports the second substrate W2 to a predetermined space in the air blowing mechanism 80, and the air blowing mechanism 80 collects fine debris on the surface of the second substrate W2 (third air blowing process).

By using the peeling method including each of the above steps, the composite substrate W can be separated into the first substrate W1 and the second substrate W2 while preventing damage to the surfaces of the first substrate W1 and the second substrate W2.

The second to seventh embodiments will be described below, focusing on the differences from the configuration of the opening module 30 of the first embodiment and the configuration of the first peeling process of the first embodiment. Note that the configuration other than the opening module 30 and the first peeling process is the same as that of the first embodiment.

Second Embodiment
(Peeling device)
As shown in FIG. 10, the opening module 30 according to the second embodiment has a plurality of lifting members (in this embodiment, suction members) 110. As an example, the suction members 110 are configured to suction and hold the upper surface of the composite substrate W (i.e., the second surface of the second substrate W2) with two suction pads 110a by vacuum suction. The inside of the flow path 110b is evacuated by a pressure adjustment mechanism (not shown), and the upper surface of the second substrate W2 can be suctioned by the suction pads 110a communicating with the flow path 110b. In addition, the suction pads 110a are connected to a lifting mechanism (not shown; as an example, an electric cylinder). The electric cylinder can lift up one suction pad 110a that is suctioned to one end side (opening side) of the composite substrate W to open one end of the composite substrate W.

(Removal method)
The first peeling step according to the second embodiment is a step of lifting the second surface of the second substrate W2 by the suction member 110 to open one end of the composite substrate W. More specifically, the suction pad 110a is brought into contact with the second surface of the second substrate W2, and the inside of the flow path 110b is evacuated by the pressure adjustment mechanism (not shown) to allow the suction pad 110a to adsorb the second surface. Then, the suction pad 110a is lifted by the electric cylinder (not shown) to open one end of the composite substrate W. Note that, in the first peeling step, when the gap between the first substrate W1 and the second substrate W2 is opened to an extent that the second wedge 44 can enter or thereafter, the operation (i.e., lifting and suction) by the vertical movement drive device and the pressure adjustment mechanism may be released.

Third Embodiment
(Peeling device)
11, the opening module 30 according to the third embodiment has a nozzle 120 capable of ejecting a fluid (a liquid flow in this embodiment). The nozzle 120 is connected to a pump and a liquid source (neither of which are shown), and the nozzle 120 ejects a liquid flow onto the boundary portion of the composite substrate W, thereby further pushing up the first surface of the second substrate W2, thereby opening one end of the composite substrate W.

(Removal method)
The first peeling step according to the third embodiment is a step of pushing up the first surface of the second substrate W2 by an opening module 30 having a nozzle 120 to open one end of the composite substrate W. More specifically, a pump (not shown) is operated to eject a liquid flow from a liquid source (not shown) from the nozzle, and the liquid flow is caused to collide with the boundary portion of the composite substrate W to open one end of the composite substrate W. Note that, in the first peeling step, ejection of the liquid flow from the nozzle 120 may be stopped when the gap between the first substrate W1 and the second substrate W2 is opened to an extent that the second wedge 44 can enter or thereafter.

Fourth Embodiment
(Peeling device)
As shown in Fig. 12, the opening module 30 according to the fourth embodiment has a push-up member (bending member in this embodiment) 130. Furthermore, holding members 132, 134 are attached (adhesive, for example) to the front and back surfaces of the composite substrate W. Furthermore, the holding members 132, 134 are configured to extend from one end side of the composite substrate W that is opened. That is, there is a predetermined gap between the holding members 132, 134 at one end side. The bending member 130 is inserted into the predetermined gap, and a bending moment is applied by a rotation drive mechanism (not shown) with a bending moment with the abutment point between the bending member 130 and the holding member 132 as a fulcrum, thereby pushing up the holding member 134 (i.e., the first surface of the second substrate W2), thereby opening one end of the composite substrate W.

(Removal method)
The first peeling step according to the fourth embodiment is a step of pushing up the holding member 134 (i.e., the first surface of the second substrate W2) by the opening module 30 having the bending member 130 to open one end of the composite substrate W. The peeling method according to the present embodiment also has a step of attaching (adhering) the holding members 132, 134 to the surface of the composite substrate W (holding member attachment step) as a pre-step of the first peeling step. More specifically, the bending member 130 is inserted into the gap between the holding members 132, 134, and the tip of the bending member 130 is abutted at a predetermined position of the holding member 132. Then, the bending member 130 is rotated by a rotation drive mechanism (not shown) with the predetermined position as a fulcrum, thereby applying a bending moment and opening one end of the composite substrate W. Note that, in the first peeling step, the bending moment load of the bending member 130 may be released when the gap between the first substrate W1 and the second substrate W2 is opened to an extent that the second wedge 44 can enter or thereafter.

Fifth Embodiment
(Peeling device)
13, the opening module 30 according to the fifth embodiment has a push-up member (first wedge in this embodiment) 32 and a lift-up member (suction member in this embodiment) 110. The configurations of the first wedge 32 and the suction member 110 are similar to those of the opening module 30 described in the first and second embodiments, respectively. That is, the opening module 30 shown in the first embodiment has a suction member 110 that can be sucked by a pressure adjustment mechanism (not shown) and can be pulled up by a vertical movement drive device (not shown). The opening module 30 according to this embodiment can open one end of the composite substrate W by combining the pushing up of the first surface of the second substrate W2 by the first wedge 32 and the lifting up of the second surface of the second substrate W2 by the suction member 110.

(Peeling process)
The first peeling step according to the fifth embodiment is a step of opening one end of the composite substrate W by combining the pushing up of the first surface of the second substrate W2 and the lifting of the second surface by the first wedge 32 and the suction member 110. More specifically, the suction pad 110a is brought into contact with the second surface of the second substrate W2, and the inside of the flow path 110b is evacuated by the pressure adjustment mechanism (not shown), so that the second surface is adsorbed to the suction pad 110a. Then, the suction pad 110a is lifted by the electric cylinder (not shown). At the same time, the first wedge 32 is caused to enter (bite into) the boundary portion of the composite substrate W, so that one end of the composite substrate W is opened. In the first peeling step, when the gap between the first substrate W1 and the second substrate W2 is opened to an extent that the second wedge 44 can enter, or thereafter, the slide portion 38, the pressure adjustment mechanism, and the lifting mechanism may be stopped.

Sixth Embodiment
(Peeling device)
As shown in FIG. 14, the opening module 30 according to the sixth embodiment has a push-up member (a nozzle in this embodiment) 120 and a lift-up member (a suction member in this embodiment) 110. The configurations of the nozzle 120 and the suction member 110 are the same as those of the opening module 30 described in the third and second embodiments, respectively. That is, the opening module 30 according to this embodiment has a nozzle 120 connected to a pump and a liquid source, and a suction member 110 connected to a pressure adjustment mechanism and a lift-up mechanism. The opening module 30 according to this embodiment can open one end of the composite substrate W by combining the pushing up of the first surface of the second substrate W2 by the nozzle 120 (i.e., the liquid flow) and the lifting up of the second surface of the second substrate W2 by the suction member 110. Note that the opening module 30 according to this embodiment can be configured to eject air from the nozzle 120 since the suction member 110 can lift the second substrate W2.

(Removal method)
The first peeling step according to the sixth embodiment is a step of opening one end of the composite substrate W by combining the pushing up of the first surface of the second substrate W2 and the lifting up of the second surface by the nozzle 120 and the suction member 110. More specifically, the suction pad 110a is brought into contact with the second surface of the second substrate W2, and the inside of the flow path 110b is evacuated by the pressure adjustment mechanism (not shown), so that the second surface is adsorbed to the suction pad 110a. Then, the suction pad 110a is lifted by the electric cylinder (not shown). At the same time, the pump (not shown) is operated to eject the liquid flow of the liquid source (not shown) from the nozzle, and the liquid flow is caused to collide with the boundary of the composite substrate W, thereby opening one end of the composite substrate W. Note that, in the first peeling step, the pump, the pressure adjustment mechanism, and the lifting mechanism may be stopped when or after the gap between the first substrate W1 and the second substrate W2 is opened to an extent that the second wedge 44 can enter.

Seventh Embodiment
(Peeling device)
As shown in FIG. 15, the opening module 30 according to the seventh embodiment has a push-up member (bending member in this embodiment) 130 and a lift-up member (suction member in this embodiment) 110. Holding members 132, 134 are attached (adhered) to the front and back surfaces of the composite substrate W. The configurations of the bending member 130 and the suction member 110 are similar to those of the opening module 30 described in the fourth and second embodiments, respectively. That is, the opening module 30 according to this embodiment has a bending member 130 connected to a rotation drive device (not shown) and a suction member 110 connected to a pressure adjustment mechanism and a lift-up mechanism. The opening module 30 according to this embodiment can open one end of the composite substrate W by combining the pushing up of the holding member 134 (i.e., the first surface of the second substrate W2) by the bending member 130 and the lifting up of the holding member 134 (i.e., the second surface of the second substrate W2) by the suction member 110.

(Removal method)
The first peeling step according to the seventh embodiment is a step of opening one end of the composite substrate W by combining the pushing up of the first surface of the second substrate W2 and the lifting of the second surface by the bending member 130 and the suction member 110. The peeling method according to the present embodiment also has a holding member attachment step as a pre-step of the first peeling step, as in the fourth embodiment. Furthermore, the peeling method according to the present embodiment also has a removal step of removing the holding members 132 and 134 from the substrates W1 and W2 as a post-step of the first peeling step. More specifically, the suction pad 110a is brought into contact with the surface of the holding member 134, and the inside of the flow path 110b is evacuated by a pressure adjustment mechanism (not shown), so that the surface of the holding member 134 is suctioned by the suction pad 110a. Then, the suction pad 110a is lifted by an electric cylinder (not shown). The bending member 130 is inserted into the gap between the holding members 132 and 134, and the tip of the bending member 130 is brought into contact with a predetermined position of the holding member 132. Then, the bending member 130 is rotated around the predetermined position by a rotation drive mechanism (not shown) to apply a bending moment and open one end of the composite substrate W. Note that, in the first peeling step, when the gap between the first substrate W1 and the second substrate W2 is opened to an extent that the second wedge 44 can enter, the rotation drive mechanism, the pressure adjustment mechanism, and the lifting mechanism may be stopped.

As described above, according to the peeling device 200 of the present invention, in the opening module 30, one end side of the composite substrate W can be opened by at least one of the push-up member 32 and the lift-up member 110, and the second wedge 44 can be inserted (bite) into the composite substrate W in the opened state from both sides, so that the composite substrate W (the first substrate W1 and the second substrate W2) can be prevented from being damaged during peeling and separation, compared to the conventional peeling device. Also, in the peeling method of the present invention, one end side of the composite substrate W can be opened by at least one of the push-up member 32 and the lift-up member 110, and the second wedge 44 can be inserted (bite) into the composite substrate W in the opened state from both sides, so that the composite substrate W (the first substrate W1 and the second substrate W2) can be prevented from being damaged during peeling and separation, compared to the conventional peeling method.

The present invention is not limited to the above-described embodiments, and various modifications are possible without departing from the scope of the present invention. In the fifth to seventh embodiments, the peeling device 200 and peeling method are described in which a push-up member and a lifting member are combined, but the peeling device 200 and peeling method may be a peeling device with another combination of the first to fourth embodiments. Also, the peeling device 200 and peeling method may open one end of the composite substrate W using two types of push-up members (for example, the first wedge 32 and the nozzle 120). As another example, the second wedge 44 in the peeling device 200 may be configured to be driven not only in the second direction, but also in the first direction or a direction perpendicular to the composite substrate W.

30 Aperture module 32 Push-up member (first wedge)
40 Separation module 44 Second wedge 45 Wedge piece 46 Inclined portion 47 Base portion 110 Lifting member (suction member)
120 Push-up member (nozzle)
130 Push-up member (bending member)
200 Peeling device W Composite substrate W1 First substrate W2 Second substrate

A peeling device that peels a composite substrate at a boundary portion to separate it into a first substrate and a second substrate includes an opening module and a separation module, the opening module having at least one of a push-up member that pushes up a first surface of the second substrate that faces the first substrate to open one end side of the composite substrate, and a pull-up member that pulls up a second surface of the second substrate opposite to the first substrate to open one end side of the composite substrate, and the separation module has a push-up member that pushes up a first surface of the second substrate that faces the first substrate to open one end side of the composite substrate, the separation module has at least one of a push-up member that pushes up a first surface of the second substrate that faces the first substrate to open one end side of the composite substrate, and a pull-up member that pulls up a second surface of the second substrate opposite to the first substrate to open one end side of the composite substrate. The composite substrate has a pair of second wedges that bite into the boundary portion from both sides of the substrate toward a second direction perpendicular to the first direction in a plane parallel to the second substrate , and separate the composite substrate into the first substrate to which the composite substrate is fixed and the second substrate, and each of the second wedges has a wedge piece that protrudes toward the second direction, and the wedge piece has a base and a sloping portion, the base is formed to a constant thickness, and the sloping portion is formed in a sloping shape so as to gradually become thinner at an angle of 2° to 35° toward the second direction, and is formed in a shape that gradually becomes narrower toward the first direction .

Claims (9)

A peeling apparatus that peels a composite substrate at a boundary portion to separate the composite substrate into a first substrate and a second substrate, comprising:
an aperture module and a separation module,
The aperture module includes:
a push-up member that pushes up a first surface of the second substrate that faces the first substrate, thereby opening one end side of the composite substrate;
and a lifting member that lifts up a second surface of the second substrate opposite to the first substrate to open one end of the composite substrate,
The separation module is characterized in that it has a pair of second wedges that bite into the boundary portion from both sides of the composite substrate, which has an opening at one end, in a second direction, and separates the composite substrate into the fixed first substrate and the second substrate. The aperture module further includes a fixing portion for fixing the composite substrate,
2. The peeling device according to claim 1, wherein the push-up member is a first wedge that bites into the boundary portion of the composite substrate in a first direction and opens one end side of the composite substrate. 2. The peeling device according to claim 1, wherein the second wedge has a wedge piece protruding in the second direction. The wedge piece has a base portion and an inclined portion,
The base is formed to a constant thickness,
4. The peeling apparatus according to claim 3, wherein the inclined portion is formed in an inclined shape so as to become gradually thinner in the second direction. 5. The peeling device according to claim 4, wherein the inclined portion is formed in a shape that gradually narrows in the first direction. The separation module includes a plurality of sensors;
2. The peeling apparatus according to claim 1, wherein the position and angle of the composite substrate are detected by a plurality of the sensors. A method for peeling off a composite substrate, comprising the steps of:
a step of lifting up a first surface of the second substrate facing the first substrate to open one end side of the composite substrate;
and a step of lifting up a second surface of the second substrate opposite to the first substrate to open one end of the composite substrate.
and then a second peeling step of inserting a pair of second wedges into a boundary portion of the composite substrate from both sides of the composite substrate in a second direction to separate the composite substrate into the first substrate and the second substrate. 8. The peeling method according to claim 7, wherein the first peeling step includes a step of inserting a first wedge into a boundary portion of the composite substrate in a first direction to open one end side of the composite substrate. 9. The peeling method according to claim 7, further comprising, as a step subsequent to the second peeling step, an alignment step of aligning the second substrate in a horizontal state by placing the second substrate on a base portion of the second wedge having a constant thickness.

Images