JP2021158203A - Electronic component mounting device - Google Patents

Abstract

To provide an electronic component mounting device that can be mounted accurately while suppressing generated dust.SOLUTION: In a mounting device 1, a mounting head 31 that holds an electronic component C includes a mounting mechanism 3 for mounting the electronic component C on a board S at a mounting position OA, a board support mechanism 2 that supports the board S on which the electronic component C is mounted, a supply unit 6 that supplies the electronic component C, and a transfer unit 7 that transfers the electronic component C from the supply unit 6 to the mounting position OA. The transfer unit 7 includes a transfer head 71 that picks up the electronic component C from the supply unit 6, performs the inversion, and passes the electronic component C to the mounting head 31, and a transfer mechanism 73 that moves the transfer head 71 to the space in which the board support mechanism 2 can retract the board S from the mounting position OA.SELECTED DRAWING: Figure 1

Description

The present invention relates to an electronic component mounting device.

There are face-up and face-down methods for mounting a semiconductor chip, which is an electronic component, on a substrate. The surface on which the semiconductor layer of the semiconductor chip is formed is called a face. Face-up is a method of mounting with the face side opposite to the substrate. For example, when a semiconductor chip is mounted on a lead frame or the like and a wire is wired between the electrodes and the frame, the mounting is face-up.

Face-down is a method of mounting with the face side facing the substrate. For example, in the case of flip-chip connection in which a bump electrode is provided on the surface of the semiconductor layer and the bump electrode is pressed against the wiring of the substrate to perform fixing and electrical connection, the mounting is performed by face-down.

When mounting an electronic component such as a semiconductor chip on a substrate, the electronic component must be precisely positioned with respect to the substrate. In order to deal with this, for example, a camera capable of simultaneously capturing images in both the upper and lower directions is inserted between the mounting tool that attracts and holds the electronic component and the substrate. Based on the image captured by this camera, the relative position of the substrate and the electronic component in the horizontal direction is recognized. Then, after correcting the position of the mounting tool based on the recognized relative position, the electronic component is mounted on the substrate.

JP-A-2010-129913

In recent years, in 3D packages and hybrid bonding in which the degree of integration is increased by arranging semiconductor chips in multiple layers, it is necessary to bond electrodes having a very narrow pitch. For this reason, higher accuracy, for example, submicron-order accuracy, is required when mounting electronic components on a substrate. Further, at the time of mounting, an error due to the operation of the mechanical portion for mounting and dust generated by the operation may cause a joint failure. Therefore, it is preferable to shorten the operating distance of the mechanical portion as much as possible.

However, the electronic component is picked up by the reversing tool or the like from the state of being attached to the wafer sheet, inverted, and then received by the mounting tool that has moved to the receiving position, and is transported to the mounting position. In this way, when the mounting tool moves between the receiving position where the mounting tool receives the electronic component and the mounting position where the electronic component is mounted on the board, the position of the electronic component at the mounting position cannot be maintained constant. , It is difficult to obtain high mounting accuracy. In addition, as the mounting tool moves, the amount of dust generated at the mounting position also increases.

The present invention has been proposed to solve the above-mentioned problems, and an object of the present invention is to provide a mounting device for electronic components that can be mounted accurately while suppressing the amount of dust generated.

The electronic component mounting device of the present invention includes a mounting mechanism in which a mounting head for holding an electronic component mounts the electronic component on a substrate at a mounting position, and a substrate support mechanism for supporting the substrate on which the electronic component is mounted. The transfer unit includes a supply unit that supplies the electronic component and a transfer unit that transfers the electronic component from the supply unit to the mounting position, and the transfer unit picks up the electronic component from the supply unit and reverses it. It has a transfer head to be passed to the mounting head, and a transfer mechanism in which the board support mechanism moves the transfer head to the mounting position in a space created by retracting the board from the mounting position.

The present invention can provide a mounting device for electronic components that can be mounted accurately while suppressing the amount of dust generated.

It is a front view which shows the schematic structure of the mounting apparatus of embodiment. It is a top view which shows an electronic component and a substrate. It is a plan view (A) of a mounting apparatus, and is an enlarged plan view (B) of a mounting place. It is an enlarged view which shows the reversing operation of an electronic component, the left side is a front view, and the right side is a plan view. It is explanatory drawing which shows the pickup operation of an electronic component. It is explanatory drawing which shows the delivery operation of an electronic component. It is explanatory drawing which shows the mounting operation of the mounting apparatus. It is a flowchart which shows the procedure of the pick-up operation and delivery operation of an electronic component. It is a flowchart which shows the mounting procedure of an electronic component.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, the present embodiment is a mounting device 1 for mounting the electronic component C on the substrate S. FIG. 1 is a front view showing a schematic configuration of the mounting device 1. FIG. 2 is a plan view showing the electronic component C and the substrate S. The drawings are schematic, and the size (hereinafter, also referred to as dimensions), shape, and mutual size ratio of each part may differ from the actual ones.

[Electronic components]
First, as the electronic component C to be mounted in this embodiment, for example, a semiconductor element such as an IC or an LSI can be mentioned.

In this embodiment, as shown in FIG. 2, a rectangular parallelepiped semiconductor chip is used as the electronic component C. Each semiconductor chip is a bare chip that is individualized by dicing that cuts a semiconductor wafer into a diced shape. The bare chip is mounted by a flip-chip connection in which a bump electrode is provided on a bare semiconductor and is bonded to a pad on the substrate S.

A plurality of marks m for positioning are formed on the electronic component C. In the present embodiment, two marks m are formed one by one at a pair of diagonal corners of the rectangular electronic component C. The mark m is formed on the surface on which the electrodes of the electronic component C are formed, that is, on the face. This embodiment is a device for face-down mounting in which the face side is mounted toward the substrate S.

[substrate]
As shown in FIG. 2, the substrate S on which the electronic component C as described above is mounted is a plate-shaped member made of resin or the like on which printed wiring or the like is formed, or a silicon substrate or the like on which a circuit pattern is formed. .. The board S is provided with a mounting area B, which is a region on which the board S is mounted, and a plurality of marks M for positioning are provided outside the mounting area B. In the present embodiment, the two marks M are formed at positions outside the mounting area B and corresponding to the marks m of the electronic component C.

[Mounting device]
The mounting device 1 of the present embodiment is a mounting device 1 capable of realizing mounting with high accuracy, for example, mounting accuracy of ± 0.2 μm or less, and as shown in FIGS. 1 and 3, the substrate support mechanism 2 is mounted. It includes a mechanism 3, a first imaging unit 4, a second imaging unit 5, a supply unit 6, a transfer unit 7, and a control device 8. FIG. 3A is a plan view of the mounting device 1, and FIG. 3B is a plan view showing the mark M transmitted through the mounting head 31.

In the following description, the direction in which the mounting mechanism 3 moves the electronic component C to mount the electronic component C on the substrate S is defined as the Z axis, and the two axes orthogonal to each other in the plane orthogonal to the Z axis are defined as the X axis and the Y axis. In the present embodiment, the Z-axis is vertical, the direction following gravity is downward, the direction against gravity is upward, and the position on the Z-axis is referred to as height. Further, the X-axis and the Y-axis are on a horizontal plane, and when viewed from the front side of FIG. 1, the X-axis is in the left-right direction and the Y-axis is in the depth direction. However, the present invention is not limited to this installation direction. Regardless of the installation direction, the side on which the electronic component C is mounted is referred to as the upper side, and the opposite side is referred to as the lower side with reference to the substrate S or the substrate support mechanism 2.

The board support mechanism 2 is a mechanism for supporting the board S on which the electronic component C is mounted, and is a so-called board stage. The mounting mechanism 3 is a mechanism for mounting the electronic component C on the substrate S. The mounting mechanism 3 has a mounting head 31. As shown in FIG. 3B, the mounting head 31 has a transmissive portion that allows the mark M of the substrate S facing the electronic component C to be transmitted and recognized while holding the electronic component C.

In the first imaging unit 4, the mounting head 31 is arranged below the board support mechanism 2 at the mounting position OA for mounting the electronic component C on the board S, and the board S is mounted at the mounting position OA by the board support mechanism 2. The mark m of the electronic component C held by the mounting head 31 is imaged from a position facing the electronic component C, that is, from below in a state of being retracted from the mounting head 31. The mounting position OA is a position where the electronic component C is mounted on the substrate S, and is a direction along the Z axis passing through a point (for example, a center point) on the XY coordinates in the region of the electronic component C to be mounted in the drawing. It is indicated by a one-dot chain line. The mounting position OA coincides with the optical axes of the cameras of the first imaging unit 4 and the second imaging unit 5, as will be described later. The second imaging unit 5 is arranged above the mounting head 31 at the mounting position OA, and images the mark M of the substrate S through the transmissive portion of the mounting head 31 (hereinafter, this is referred to as “mounting head 31”. I will take an image through it. ") Based on the image captured in this way, the marks m and M can be detected, that is, the marks m and M can be recognized.

The substrate support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism is based on the positions of the substrate S and the electronic component C obtained from the images of the marks M and m imaged by the first imaging unit 4 and the second imaging unit 5, and the substrate S and the electronic component C. Perform positioning. Each part of the mounting device 1 as described above is mounted on a support 11 installed on the installation surface. The top surface of the support base 11 is a horizontal plane.

The supply unit 6 supplies the electronic component C. The transfer unit 7 transfers the electronic component C from the supply unit 6 to the mounting position ОA. The transfer unit 7 has a transfer head 71 and a transfer mechanism 73. The transfer head 71 picks up the electronic component C from the supply unit 6, inverts it, and passes it to the mounting head 31. The transfer mechanism 73 moves the transfer head 71 to the space created by the substrate support mechanism 2 retracting the substrate S from the mounting position ОA and positions it at the mounting position ОA.

The control device 8 controls the operation of the mounting device 1. The control device 8 is composed of, for example, a dedicated electronic circuit, a computer that operates with a predetermined program, or the like. That is, in the control device 8, a processing device such as a PLC or a CPU reads a program, data, or the like from the storage device, and executes control of the mounting device 1. Each part will be described in detail below.

(Board support mechanism)
As shown in FIGS. 1 and 3A, the substrate support mechanism 2 is arranged on the support base 11 and has a stage 21 and a drive mechanism 22. The stage 21 is a plate-shaped member on which the substrate S is placed. The drive mechanism 22 has, for example, a guide rail 22a in the X-axis direction and a guide rail 22b in the Y-axis direction, and is a two-axis movement mechanism that moves the stage 21 in a horizontal plane by a belt or a ball screw using a motor (not shown) as a drive source. Is. The drive mechanism 22 functions as a positioning mechanism for positioning the substrate S. Although not shown, the drive mechanism 22 includes a θ drive mechanism that rotationally moves the stage 21 in a horizontal plane.

The drive mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along the guide rail 22b. A through hole 23a is formed in the moving plate 23 so that the first imaging unit 4 can image the electronic component C.

Although not shown, a loader / for storing the substrate S in the stage 21 at one of the moving ends of the stage 21 of the substrate support mechanism 2 in the X-axis direction (specifically, the moving end on the right side of the drawing). An unloader is provided. Therefore, the substrate support mechanism 2 receives the supply of the substrate S from the loader or passes the substrate S to the unloader in a state where the stage 21 is moved to the moving end.

(Mounting mechanism)
The mounting mechanism 3 has a mounting head 31 and a driving mechanism 32. The mounting head 31 has a substantially rectangular parallelepiped shape, and has a hollow portion 31a and a holding portion 31b as transmission portions. The hollow portion 31a is a cylindrical through hole formed about the Z-axis direction. The holding portion 31b is a plate-shaped member capable of transmitting light for imaging, and is attached so as to close the opening of the hollow portion 31a on the side toward the substrate S. For example, a transparent glass plate is used as the holding portion 31b. The holding portion 31b is a so-called mounting tool and holds the electronic component C.

As shown in FIG. 3B, a suction region D for sucking and holding the electronic component C is provided in the center of the holding portion 31b. Although not shown, a suction hole is formed in the suction region D. A flow path for communicating the suction hole with the negative pressure source is formed inside the holding portion 31b, and the electronic component C is provided so as to be able to suck and hold the electronic component C by generating a negative pressure in the suction hole. The periphery of the suction region D of the holding portion 31b is a transmission region T that can pass through the mark M of the substrate S and take an image even when the electronic component C is sucked. That is, the mounting head 31 has a transparent portion so that the mark M of the substrate S can be imaged by the second imaging unit 5. The holding surface (adsorption surface) for holding the electronic component C of the holding portion 31b is referred to as a lower end surface.

The drive mechanism 32 includes moving bodies 33, 34, and 35, and is a mechanism for driving the mounting head 31. The moving body 33 is provided so as to be movable along a guide rail 33a in the Y-axis direction provided on the support base 11. The moving body 34 is provided so as to be movable along a guide rail 34a in the X-axis direction provided on the top surface of the moving body 33. The moving body 35 is provided so as to be movable along a guide rail 35a in the Z-axis direction provided in front of the moving body 34. The moving body 35 is formed in a substantially concave shape in a plan view. These moving bodies 33, 34, and 35 are driven by a ball screw, a linear motor, a cylinder, or the like whose drive source is a motor.

The mounting head 31 is provided below the moving body 35 that moves in the Z-axis direction. Therefore, the moving body 35 performs an operation for mounting the electronic component C held by the holding portion 31b of the mounting head 31 on the substrate S. Further, the moving body 35 provided with the mounting head 31 moves in the X-axis direction and the Y-axis direction due to the movement of the moving bodies 33 and 34. Therefore, the drive mechanism 32 functions as a positioning mechanism for positioning the electronic component C held by the mounting head 31. Although not shown, the drive mechanism 32 includes a θ drive mechanism that rotationally moves the mounting head 31 in a horizontal plane.

In the present embodiment, the amount of movement in the X-axis direction, the Y-axis direction, and the Z-axis direction by the drive mechanism 32 is preferably set as short as possible from the viewpoint of preventing movement errors. For example, the amount of movement in the X-axis direction and the Y-axis direction by the moving bodies 33 and 34 is set to several mm to a dozen mm, respectively. Further, the amount of movement in the Z-axis direction by the moving body 35 is also set to about several mm to a dozen mm. That is, the mounting head 31 has a height at which the lower end surface of the holding portion 31b is several mm, for example, 1 to 2 mm opposite to the upper surface of the substrate S mounted on the stage 21 (separation distance in the vertical direction). At this position, the electronic component C is received and the mark m of the received electronic component C is imaged. Therefore, regarding the amount of movement of the moving body 35 in the Z-axis direction, at least from this height position, the electronic component C held by the holding portion 31b can be mounted on the substrate S by pressurizing it with a predetermined pressing force. It suffices if the amount can be secured.

(First imaging unit)
The first imaging unit 4 has a camera, a lens, a lens barrel, a light source, and the like, and is fixed to an accommodation hole 11a provided in the support base 11. In the first imaging unit 4, the optical axis of the camera is arranged in a direction in which the mark m of the electronic component C held by the mounting head 31 can be imaged. Specifically, they are arranged so that the optical axis is in the vertical direction. The first imaging unit 4 is immovable with respect to the mounting position OA of the electronic component C. In the present embodiment, the first imaging unit 4 faces upward in a state where the optical axis of the camera is aligned with the mounting position OA in the accommodating hole 11a of the support base 11 which is the lower position of the substrate support mechanism 2. It is arranged in. The first imaging unit 4 is fixed to the support 11 in a size and positional relationship in which the two marks m do not deviate from the imaging field of view even if the electronic component C moves to the maximum for positioning. That is, the imaging field of view of the first imaging unit 4 takes into consideration the range in which the two marks m of the electronic component C can move to the maximum for positioning while the optical axis is aligned with the mounting position OA and fixed. Is set.

Here, immobility means that the first imaging unit 4 (the same applies to the second imaging unit 5 described later) does not move when imaging the marks m and M. For example, the image pickup units 4 and 5 are provided with a drive device in the X and Y axis directions (horizontal direction) and a drive device in the Z axis direction (vertical direction), and the image pickup unit 4 is prepared for operation of the device by these drive devices. The configuration in which the horizontal position of 5 and the vertical position are adjusted and the device is not moved during the subsequent operation is immovably included.

(Second imaging unit)
The second imaging unit 5 has a camera, a lens, a lens barrel, a light source, and the like, and is supported by a frame or the like (not shown) above the support base 11, more specifically, above the mounting head 31. It is fixed. The second imaging unit 5 is arranged in a direction in which the optical axis of the camera passes through the holding unit 31b of the mounting head 31 and the mark M around the mounting region B of the substrate S can be imaged. That is, in the present embodiment, the second imaging unit 5 is arranged downward at a position directly above the mounting head 31 with the optical axis of the camera aligned with the mounting position OA. Like the first imaging unit 4, the second imaging unit 5 is immovable with respect to the mounting position OA of the electronic component C. That is, the imaging field of view of the second imaging unit 5 is set in consideration of the range in which the two marks attached to the mounting region B of the substrate S can be moved to the maximum for positioning. Therefore, the size of the transmissive portion of the mounting head 31 is set according to the imaging field of view of the second imaging unit 5.

Here, the arrangement of the first imaging unit 4 and the second imaging unit 5 of the present embodiment will be described. The mounting device 1 of the present embodiment preferably obtains a mounting accuracy of 0.2 μm or less. For that purpose, the first imaging unit 4 and the second imaging unit 5 need to have a performance capable of high-magnification and high-definition imaging commensurate with the accuracy.

In general, it is known that in order to capture a high-definition image, it is necessary to arrange the imaging unit at a position close to the electronic component C or the substrate S to be imaged. Therefore, it is preferable that the first imaging unit 4 and the second imaging unit 5 are also arranged as close to the electronic component C and the substrate S as possible, that is, the imaging distance is shortened.

However, in the mounting device 1 of the present embodiment, in order to minimize the amount of downward movement of the electronic component C during mounting, the electronic component C is positioned close to the height of the upper surface of the substrate S, and the electronic component C is positioned. The mark m of C and the mark M of the substrate S are imaged. Therefore, the moving plate 23 of the stage 21 and the drive mechanism 22 exists between the first imaging unit 4 and the electronic component C, and the mounting head 31 is located between the second imaging unit 5 and the substrate S. Exists. Then, since it is necessary to avoid interference between the moving plate 23 and the mounting head 31, the distance between the first imaging unit 4 and the electronic component C should be shortened, and the distance between the second imaging unit 5 and the substrate S should be reduced. There is a limit to shortening it.

Therefore, the inventor of the present application has examined the maximum value of the imaging distance that can capture an image that can realize the above mounting accuracy. As a result, it was derived that the size is about 100 mm. From this result, in the present embodiment, the first imaging unit 4 is immovably arranged at a height position where the distance from the electronic component C is within 100 mm, and the second imaging unit 5 is immovably arranged at a distance from the substrate S. It was immovably placed at a height position within 100 mm.

The mounting head 31 located between the second imaging unit 5 and the substrate S is a member having a relatively large height dimension (Z-axis direction dimension) for the convenience of ensuring rigidity and the like. Therefore, it is conceivable that interference will occur in a normal configuration. Therefore, as a result of diligent studies, the inventor of the present application has succeeded in minimizing the height dimension while maintaining the functions and rigidity required for the mounting head 31. Specifically, the height dimension of the mounting head 31 (the dimension from the lower end of the holding portion 31b to the upper opening of the hollow portion 31a) is set to about 70 mm. This makes it possible to arrange the second imaging unit 5 at a height position of 100 mm or less with respect to the substrate S.

(Supply section)
The supply unit 6 has a support mechanism 61 and a drive mechanism 62. The support mechanism 61 is a device that supports the wafer sheet WS to which the electronic component C is attached. The drive mechanism 62 moves the support mechanism 61 along the X-axis direction and the Y-axis direction. The electronic component C is divided into individual pieces by dicing. In the supply unit 6, the surface on which the electronic component C is mounted is referred to as a mounting surface F. In the present embodiment, the surface to which the electronic component C of the wafer sheet WS is attached is the mounting surface F. The wafer sheet WS is attached to a wafer ring (not shown). The support mechanism 61 has a ring holder 61a for mounting a wafer ring. That is, the surface of the support mechanism 61 that supports the wafer sheet WS can be said to be the mounting surface F.

Although not shown, one of the moving ends of the support mechanism 61 in the Y-axis direction (specifically, the moving end on the front side in the drawing) has a loader / unloader for supplying / storing the wafer ring to the ring holder 61a. It is provided. The support mechanism 61 receives the supply of the wafer ring from the loader or passes the wafer ring to the unloader in a state of being moved to the moving end.

Further, although not shown, the support mechanism 61 extends the wafer sheet WS to individually push up the electronic component C with an expanding mechanism for opening a gap between the electronic components C and the extended wafer sheet WS. It has a rush mechanism that separates by. Further, the support mechanism 61 includes a θ drive mechanism that rotationally moves the ring holder 61a in a horizontal plane. The thrust mechanism is fixedly arranged on the support base 11, and the transfer unit 7 receives the electronic component C from the supply unit 6, that is, the pickup is performed at this position (pickup position).

The drive mechanism 62 moves the support mechanism 61 in a predetermined direction. For example, the drive mechanism 62 has a guide rail 62a in the X-axis direction and a guide rail 62b in the Y-axis direction, and the support mechanism 61 is supported by a belt or a ball screw in a horizontal plane using a motor (not shown) as a drive source. It is a mechanism that moves in the direction. The drive mechanism 62 functions as a positioning mechanism for positioning the electronic component C with respect to the transfer head 71. The drive mechanism 62 is arranged at a position lower than the height position L (see FIG. 5) of the mounting surface F.

(Transfer section)
The transfer unit 7 has a transfer head 71, an arm unit 72, and a transfer mechanism 73. As shown in the enlarged view of FIG. 4, the transfer head 71 has a suction nozzle 71a and a reversing drive unit 71b. The suction nozzle 71a is connected to a pneumatic circuit (not shown) via a tube, sucks the electronic component C at the tip by a negative pressure, and releases the electronic component C by releasing the negative pressure or releasing the positive pressure. As shown in FIGS. 4A and 4B, the reversing drive unit 71b reverses the electronic component C sucked by the suction nozzle 71a in the vertical direction. That is, the suction nozzle 71a is rotatably provided by the reversing drive unit 71b between the direction toward the wafer sheet WS and the direction toward the mounting head 31. The reversing drive unit 71b is, for example, a motor.

Although not shown, the transfer head 71 drives the suction nozzle 71a in the vertical direction, and when the tip of the suction nozzle 71a comes into contact with the electronic component C, applies an appropriate load to absorb an excessive load. It has a cushioning member. As the shock absorber, for example, a voice coil motor is used.

The arm portion 72 is a member provided with a transfer head 71 at one end. As shown in FIG. 3A, the arm portion 72 has an extending portion 72a and a base portion 72b. The extending portion 72a is L-shaped by a rectangular parallelepiped-shaped member extending linearly in the Y-axis direction toward the front and a rectangular parallelepiped-shaped member extending linearly in the X-axis direction toward the mounting mechanism 3. It is a formed member. At one end of the extending portion 72a toward the mounting mechanism 3, a reversing driving portion 71b is provided so that the rotation axis is in the Y-axis direction. By attaching the suction nozzle 71a to the rotation shaft of the reversing drive unit 71b, the suction nozzle 71a is rotatably provided. The base portion 72b is a plate-like body parallel to the X-axis direction, and is fixed to the other end of the extending portion 72a (see FIG. 5).

The tube for supplying negative pressure connected to the suction nozzle 71a, the reversing drive unit 71b, and the cable for electrical connection connected to the cushioning member are built in the arm unit 72. "Built-in" means that it is not exposed to the outside by being covered with the exterior of the arm portion 72. In the present embodiment, the tube and the cable are inserted into the hollow portion formed inside the arm portion 72.

The transfer mechanism 73 moves the transfer head 71 between the supply unit 6 and the mounting position OA by driving the arm unit 72. The transfer mechanism 73 has a sliding portion provided at a position where it does not overlap the mounting surface F in a plan view. In other words, the sliding portion of the transfer mechanism 73 is provided outside the moving range of the support mechanism 61. The transfer mechanism 73 drives the arm portion 72 according to the sliding of the sliding portion. The sliding portion referred to here refers to a component portion that moves while the members are in contact with each other. Such a sliding portion becomes a source of dust. As shown in FIG. 5, the sliding portion of the present embodiment includes a first sliding portion 732b and a second sliding portion 734b, which will be described later. The first sliding portion 732b and the second sliding portion 734b are provided at positions (lower) lower than the height position L of the mounting surface F.

As shown in FIG. 5, the transfer mechanism 73 has a fixed body 731, a first drive unit 732, a moving body 733, and a second drive unit 734. As shown in FIGS. 1 and 3A, the fixed body 731 is a rectangular parallelepiped member fixed to the support 11 and extending in the X-axis direction. The position of the fixed body 731 is fixed with respect to the mounting position OA.

The first drive unit 732 drives the arm unit 72 in the X-axis direction. The first drive unit 732 has a first drive source 732a and a first sliding unit 732b. The first drive source 732a is a linear motor extending in the X-axis direction, and is provided along the upper surface of the fixed body 731. The first sliding portion 732b is a linear guide extending in the X-axis direction, and is provided in front of the fixed body 731. The linear motor does not have a sliding portion because the mover moves without contacting the stator.

The moving body 733 is a rectangular parallelepiped block, and the mover of the first drive source 732a is attached, and the slider of the first sliding portion 732b is attached, so that the moving body 733 follows the operation of the first drive source 732a. , Is provided so that it can be slidably moved in the X-axis direction.

The second drive unit 734 drives the arm unit 72 in the Z-axis direction. The second drive unit 734 has a second drive source 734a and a second sliding unit 734b. The second drive source 734a is a linear motor extending in the Z-axis direction, and is provided on the moving body 733. The second sliding portion 734b is a linear guide extending in the Z-axis direction, and is provided on the moving body 733.

The base portion 72b of the arm portion 72 is provided so as to be slidable in the Z-axis direction by attaching the mover of the second drive source 734a and attaching the slider of the second sliding portion 734b. .. As described above, the sliding portion of the present embodiment has a first sliding portion 732b and a second sliding portion 734b that slide and move linearly along two orthogonal axes. The first sliding portion 732b and the second sliding portion 734b are arranged in a positional relationship in which they overlap in the height direction on two side surfaces facing each other on the front and back surfaces of the common moving body 733. That is, the positions of the two orthogonal axes are close to each other. Further, it is preferable that the distance between the two side surfaces of the moving body 733 is short, that is, the moving body 733 is thin.

(Relationship between the facing distance between the board and mounting head on the stage and the dimensions of the transfer head)
In the present embodiment, as shown in FIG. 1, the substrate S at the mounting position OA and the mounting head 31 face each other so that the substrate S needs to be retracted in order for the transfer head 71 to move to the mounting position OA. The interval is set. In other words, the mounting position OA is so close to the height position of the upper surface of the board S supported by the board support mechanism 2 that the board S needs to be retracted in order for the transfer head 71 to move to the mounting position OA. The height position of the mounting head 31 when receiving the electronic component C is set in. More specifically, the height position of the upper surface of the substrate S mounted on the stage 21 of the board support mechanism 2 at the mounting position OA and the lower end surface of the mounting head 31 when receiving the electronic component C face each other. The time interval h is shorter than the height dimension H of the transfer head 71 at the tip of the arm portion 72 (h <H). Here, as described above, the distance from the lower end surface of the holding portion 31b to the height position of the upper surface of the substrate S is, for example, several mm.

(Dimensions of the arm)
As shown in FIGS. 1, 3 (A), and 4 (A), the extending portion 72a of the arm portion 72 has a width w of a member linearly extending in the Y-axis direction and a linear shape in the X-axis direction. The width d of the extended members is longer than the thickness t in the Z-axis direction (w> t, d> t). As a result, it is possible to secure the rigidity of the arm portion 72, which is relatively long, while suppressing the expansion of the dimension of the arm portion 72 in the height direction, and to stabilize the position of the electronic component C transferred by the transfer head 71. .. By suppressing the expansion of the dimension of the arm portion 72 in the height direction, it is not necessary to raise the receiving position of the mounting head 31.

(Control device)
The control device 8 controls the positioning mechanism so that the substrate S and the electronic component C are positioned based on the marks m and M imaged by the first imaging unit 4 and the second imaging unit 5. That is, in the control device 8, the position of the mark m of the electronic component C on the XY coordinates and the position of the mark M of the substrate S on the XY coordinates correspond to the positions where the electronic component C should be accurately mounted. It is stored in the storage device as a reference position.

This reference position can be the position of the marks m and M when the electronic component C is mounted accurately on the substrate S as a result of trying to mount the electronic component C in advance. The control device 8 obtains the deviation between the mark m imaged by the first imaging unit 4 and the mark M imaged by the second imaging unit 5 and the reference position, and the direction and the amount of movement for which the deviation is corrected. The positioning mechanism (drive mechanism 22 and drive mechanism 32) is controlled so that the electronic component C and the substrate S move.

Further, the control device 8 controls the transfer mechanism 73 of the transfer unit 7 and the drive mechanism 62 of the supply unit 6 based on the map information indicating the position coordinates of the electronic component C on the wafer sheet WS, thereby being picked up. The electronic component C to be used is sequentially positioned at the pickup position. The pickup referred to here means that the electronic component C is detached from the member on which the electronic component C is placed, for example, the wafer sheet WS, and received. Further, the control device 8 holds the electronic component C by the suction nozzle 71a of the transfer head 71, reverses the suction nozzle 71a by the reversing drive unit 71b, moves the transfer head 71 to the mounting head 31 by the transfer mechanism 73, and sucks the nozzle 71a. Controls the delivery of the electronic component C to the mounting head 31 and the like.

[motion]
The operation of the present embodiment as described above will be described with reference to the explanatory views of FIGS. 4 to 7 and the flowcharts of FIGS. 8 and 9. In the initial state, the board S is passed from the loader to the stage 21 of the board support mechanism 2, but is retracted together with the stage 21 from the position facing the mounting head 31, that is, the mounting position OA.

[Transfer of electronic components]
The transfer operation of the electronic component C will be described with reference to the explanatory views of FIGS. 4 to 6 and the flowchart of FIG. A wafer ring to which a wafer sheet WS is attached is attached to the ring holder 61a of the support mechanism 61 in the supply unit 6 by an autoloader. An electronic component C divided into individual pieces by dicing is attached to the wafer sheet WS. In FIG. 5, the illustration is omitted except for the electronic component C to be picked up.

First, as shown in FIGS. 5A and 3A, the support mechanism 61 moves in the X-axis and Y-axis directions, and positions the electronic component C to be mounted at the pickup position. Further, by moving the arm portion 72 in the X-axis direction, the tip of the suction nozzle 71a of the transfer head 71 is positioned directly above the electronic component C to be mounted, that is, at the pickup position (step S101).

The movement of the wafer sheet WS in the X-axis and Y-axis directions at this time is performed by the drive mechanism 62 of the supply unit 6. The movement of the arm portion 72 in the X-axis direction is performed by operating the first drive source 732a of the first drive portion 732 and moving the moving body 733 along the first sliding portion 732b. ..

As shown in FIG. 5B, the thrust mechanism pushes up the electronic component C to be mounted. Then, the suction nozzle 71a of the transfer head 71 picks up the electronic component C (step S102). That is, the arm portion 72 and the cushioning member move in the direction approaching the wafer sheet WS, attract and hold the electronic component C, and then move in the direction away from the wafer sheet WS to move the electronic component C away from the wafer sheet WS. Withdraw from.

The movement of the arm portion 72 at this time is performed by operating the second drive source 734a of the second drive portion 734 and moving the base portion 72b along the second sliding portion 734b. Then, as shown in FIGS. 4 (A), 4 (B), 5 (C), and (D), the reversing drive unit 71b rotates the suction nozzle 71a by 180 ° to reverse the electronic component C ( Step S103).

Next, as shown in FIGS. 6A and 6B, the transfer head 71 is positioned at the mounting position OA by moving the arm portion 72 in the X-axis direction (step S104). That is, the electronic component C held by the suction nozzle 71a of the transfer head 71 comes to a position facing the holding portion 31b of the mounting head 31 in the mounting mechanism 3. At this time, the movement of the arm portion 72 in the X-axis direction is performed from the pickup position to the mounting position ОA along the first sliding portion 732b by operating the first drive source 732a of the first drive portion 732. This is done by moving the moving body 733 to the distance to. At this time, the mounting head 31 stands by at a height position where the facing distance between the lower end surface of the holding portion 31b and the upper surface of the substrate S is several mm. Further, this height position is maintained until just before the positioning of the electronic component C and the substrate S, which will be described later, is completed and the mounting head 31 is driven toward the substrate S.

As shown in FIG. 6C, the arm portion 72 moves in a direction approaching the holding portion 31b and presses the electronic component C against the holding portion 31b. As shown in FIG. 6D, the holding portion 31b of the mounting head 31 sucks and holds the electronic component C by negative pressure and receives it (step S105). At the same time, the suction nozzle 71a releases the negative pressure, and the arm portion 72 moves in the direction away from the holding portion 31b to release the electronic component C. The movement of the arm portion 72 at this time is performed by operating the second drive source 734a of the second drive portion 734 and moving the base portion 72b along the second sliding portion 734b.

Further, as shown in FIG. 6E, the arm portion 72 moves toward the supply portion 6, so that the transfer head 71 retracts from directly below the holding portion 31b. The movement of the arm portion 72 at this time is that the moving body 733 moves in the X-axis direction along the first sliding portion 732b by operating the first drive source 732a of the first drive portion 732. Is done by. Since the transfer unit 7 transfers the electronic component C to the holding unit 31b at the mounting position OA, the stage 21 remains reserved in order to avoid interference with the transfer mechanism 73 during the transfer.

[Mounting of electronic components]
Next, the mounting operation of the electronic component C will be described with reference to the explanatory diagram of FIG. 7 and the flowchart of FIG. Here, as shown in FIG. 7A, the holding portion 31b of the mounting head 31 holding the electronic component C as described above is located directly below the second imaging unit 5. The first imaging unit 4 images the mark m of the electronic component C held by the mounting head 31 (step S201). The control device 8 obtains the amount of deviation between the position of the mark m imaged by the first imaging unit 4 and the reference position, and operates the drive mechanism 32 so that the amount of deviation is eliminated. Position the electronic component C (step S202).

Next, as shown in FIG. 7B, the board support mechanism 2 has an electronic component in which the mounting area B of the board S (the mounting area B on which the electronic component C is mounted this time) is held by the mounting head 31. The stage 21 is moved so that the position facing C, that is, the center of the mounting area B comes to the mounting position OA (step S203). Then, as shown in FIG. 3B, the second imaging unit 5 images the mark M of the substrate S visible in the transmission region T around the electronic component C through the mounting head 31 (step S204).

The control device 8 obtains the amount of deviation between the position of the mark M imaged by the second imaging unit 5 and the reference position, and operates the drive mechanism 22 so that the amount of deviation is eliminated. Position the substrate S (step S205). Further, as shown in FIG. 7C, the mounting head 31 is driven toward the substrate S by the drive mechanism 32, and the electronic component C held by the mounting head 31 is mounted on the substrate S (step S206). ..

In this way, by repeating the transfer of the electronic component C from the wafer sheet WS, the delivery of the electronic component C to the mounting head 31, the positioning of the electronic component C and the substrate S, and the mounting operation, each mounting region B of the substrate S is B. Electronic components C are sequentially mounted on the. The substrate S on which a predetermined number of electronic components C are mounted is conveyed by the substrate support mechanism 2 and stored in the unloader.

[Action effect]
(1) In the mounting device 1 of the electronic component C of the present embodiment, the mounting head 31 holding the electronic component C mounts the electronic component C on the substrate S at the mounting position OA, and the electronic component C mounts the mounting mechanism 3. It has a substrate support mechanism 2 for supporting the substrate S to be mounted, a supply unit 6 for supplying the electronic component C, and a transfer unit 7 for transferring the electronic component C from the supply unit 6 to the mounting position OA.

Then, the transfer unit 7 picks up the electronic component C from the supply unit 6, inverts it, and passes it to the mounting head 31, and the board support mechanism 2 retracts the board S (stage 21) from the mounting position OA. It has a transfer mechanism 73 for moving the transfer head 71 into the space created by the above.

Therefore, the mounting head 31 does not need to move in order to receive the electronic component C from the transfer mechanism 73, the position of the electronic component C at the mounting position ОA can be kept constant, and the upper surface of the substrate S is topped. The electronic component C can be received at a height position close to the height position, and high mounting accuracy can be obtained. In this way, since the amount of movement of the mounting head 31 can be reduced, the amount of dust generated at the mounting position ОA can also be reduced.

(2) The distance between the board S at the mounting position ОA and the mounting head 31 is set so that the board S needs to be retracted in order for the transfer head 71 to move to the mounting position ОA. Therefore, the position of the mounting head 31 when receiving the electronic component C can be set to a position close to the substrate S at the time of mounting. As a result, the distance that the mounting head 31 moves for mounting after receiving the electronic component C can be made very short, and the displacement due to the movement of the mounting head 31 can be prevented, and the mounting accuracy can be prevented. Can be improved.

(3) The transfer unit 7 has a transfer head 71 that picks up the electronic component C from the mounting surface F of the electronic component C in the supply unit 6 and delivers it to the mounting head 31, and an arm unit 72 provided with the transfer head 71 at one end. The supply unit 6 is provided by having sliding portions (732b, 734b) provided at positions that do not overlap the above-mentioned mounting surface F in a plan view, and driving the arm portion 72 according to the sliding of the sliding portion. It has a transfer mechanism 73 for moving the transfer head 71 between the and the mounting position ОA.

As described above, since the sliding portion is located at a position where it does not overlap the mounting surface F of the electronic component C in a plan view, dust generated from the sliding portion when the arm portion 72 moves according to the sliding of the sliding portion. Is less likely to fall on the mounting surface F, and poor bonding due to dust adhering to the electronic component C can be suppressed.

(4) The sliding portion is provided at a position lower than the height position of the mounting surface F. For this reason, the dust generated from the sliding portion falls below the mounting surface F, so that the dust hardly reaches the mounting surface F, and poor joining can be further suppressed.

(5) The transfer head 71 has a suction nozzle 71a that sucks the electronic component C by a negative pressure, and a tube that supplies a negative pressure to the suction nozzle 71a is built in the arm portion 72. Therefore, even if dust is generated from the tube that is deformed as the arm portion 72 moves, it does not go out to the outside of the arm portion 72 and does not affect the surroundings.

(6) The transfer head 71 is a reversing head driven by a motor which is a reversing drive unit 71b to reverse the electronic component C, and a cable for supplying electric power to the motor is built in the arm unit 72. Therefore, even if dust is generated from the tube that is deformed as the arm portion 72 moves, it does not go out to the outside of the arm portion 72 and does not affect the surroundings.

(7) The sliding portion has a first sliding portion 732b and a second sliding portion 734b that slide and move linearly along two orthogonal axes, and the first sliding portion 732b and the first sliding portion. The sliding portion 734b of No. 2 is arranged in a positional relationship so as to overlap in the height direction on two side surfaces facing the front and back surfaces of the common moving body 733.

Therefore, the two axes of the first sliding portion 732b and the second sliding portion 734b are arranged at close positions via a common member, and the first sliding portion 732b and the second sliding portion 732b and the second. It is possible to prevent the misalignment of the transfer head 71 caused by the rattling of the sliding portion 734b of the above from increasing. Therefore, by providing the sliding portion at a position where it does not overlap with the above-described mounting surface F in a plan view, accurate positioning and transfer with respect to the electronic component C can be performed even if the arm portion 72 is long.

(8) The mounting head 31 has a transmissive portion that allows the mark M of the substrate S to be transmitted and recognized while holding the electronic component C, and is arranged below the substrate support mechanism 2 at the mounting position OA. In the state where the substrate S is retracted from the mounting position OA, the first imaging unit 4 that images the mark m of the electronic component C held by the mounting head 31 and the mounting position OA above the mounting head 31. It was obtained from the images of the second imaging unit 5 which is arranged and images the mark M of the substrate S through the transmission unit, and the marks m and M imaged by the first imaging unit 4 and the second imaging unit 5. It has a positioning mechanism for positioning the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C.

According to such an embodiment, the electronic component C held by the mounting head 31 is arranged below the board support mechanism 2 at the mounting position OA in a state where the board S is retracted from the mounting position OA. The substrate S, which is imaged by the first imaging unit 4 and supported by the substrate support mechanism 2, is passed through the transmission portion of the mounting head 31 by the second imaging unit 5 arranged above the mounting head 31 at the mounting position OA. Since the image is taken, the mark m of the electronic component C and the mark M of the substrate S can be imaged with the electronic component C and the substrate S as close to each other as possible.

Therefore, the amount of movement of the electronic component C (mounting head 31) and the substrate S (board support mechanism 2) when imaging the marks m and M, and the electronic component C (mounting head 31) after imaging the marks m and M. ) And the substrate S (board support mechanism 2) can be shortened as much as possible. Therefore, it is possible to suppress an increase in error due to moving the mounting head 31 and the substrate support mechanism 2 over a long distance. Further, the longer the moving distance of the mechanism is, the more dust is generated. However, in the present embodiment, since the moving distance can be suppressed, it is possible to prevent the cleanliness from being lowered by the dust and the joint failure from occurring.

Here, when the mark M is not imaged through the mounting head 31 but is imaged by a camera provided adjacent to the mounting head 31, it is a reality to realize high required accuracy by using a high-magnification camera. Is impossible. That is, the area where the mark M is attached to the substrate S is only a range larger than the area where the electronic component C is mounted by about several millimeters, and the diameter of the mounting head 31 is also larger than the area where the mark M is attached. The diameter is only about a millimeter larger. Therefore, even if the lens barrel of the camera is arranged adjacent to the mounting head 31, the plurality of marks M are not included in the field of view of the camera, and the plurality of marks M cannot be simultaneously imaged by the camera.

Then, in order to image a plurality of (two) marks M on the substrate S, it is necessary to move the camera (mounting head 31) so that the mounting head 31 is larger than the separation distance between the two marks M. In some cases, an error will occur. That is, after recognizing and aligning the mark m of the electronic component C, the camera must be moved together with the mounting head 31 in order to recognize the mark M of the substrate S, and then returned to the original position. However, there is a possibility that the position of the electronic component C may be displaced.

In order to deal with this, if the mark M of the substrate S is recognized and aligned first, the position of the electronic component C cannot be recognized when the substrate S is in the position where it should be mounted. Therefore, the substrate after the alignment is performed. The S must be moved, and the substrate S is misaligned.

Further, a template with a mark corresponding to the mark M of the board S is prepared at a position different from the position to be mounted, and positioning is performed based on the relative position between the mark of this template and the mark M of the board S. It is also possible to do it. However, in this case, each time the electronic component C is mounted, the mounting head 31 and the camera must be moved in order to recognize the mark of the template. Then, the time required for recognizing the mark of the template and the time required for positioning are extra, so that the productivity is lowered. In addition, since the moving distance of the mechanism increases, the amount of dust generated also increases.

In the present embodiment, after the marks m and M are imaged, the moving distances of the electronic component C and the substrate S can be suppressed, so that all of the misalignment, the decrease in productivity, and the amount of dust generated can be suppressed.

(9) The transparent portion has a transparent plate-shaped member. Therefore, it is possible to secure the holding of the electronic component C and the transparent imaging of the mark M of the substrate S in a narrow region corresponding to the size of the minute electronic component C.

(10) The first imaging unit 4 and the second imaging unit 5 are immovably provided with respect to the mounting position OA. Therefore, the imaging region of the first imaging unit 4 and the imaging region of the second imaging unit 5 do not shift, and dust generation due to movement can be prevented.

[Modification example]
The supply unit 6 is not limited to the device that supplies the electronic component C attached to the wafer sheet WS. For example, it may be a device that supplies the electronic components C arranged on the tray. Further, as for the configuration of the transfer mechanism 73, it is sufficient that the electronic component C can be individually picked up and transferred from the supply unit 6. Therefore, the arm portion 72 may be configured to move in the X-axis and Y-axis directions, or the support mechanism 61 may be configured to move in the X-axis and Y-axis directions.

In the transfer mechanism 73, the drive unit that drives the arm unit 72 is not limited to a mechanism that uses a linear motor as a drive source. It may be a mechanism using a ball screw or a belt whose drive source is a motor whose shaft rotates. In the case of such a mechanism, since the sliding portion is included, it is preferable to provide the mechanism at a position where the mounting surface F does not overlap in a plan view. Further, it is preferable to provide the sliding portion at a position lower than the height position of the mounting surface F. When there are a plurality of sliding portions, some of the sliding portions may not be provided at positions where they do not overlap the mounting surface F in a plan view. Further, some sliding portions may not be provided at a position lower than the height position of the mounting surface F. In such a case, it is preferable to provide a shield such as an exterior, a wall, and other constituent parts between the sliding portion and the mounting surface F. Further, it is preferable to increase the distance between the sliding portion and the mounting surface F.

The mounting head 31 may have a configuration in which the second imaging unit 5 can image the mark M on the substrate S. Therefore, a through hole may be formed at a portion corresponding to the mark M without being formed of a transparent material. More specifically, the holding portion 31b may be formed of an opaque member and a through hole may be formed at a portion corresponding to the mark M, the hollow portion 31a does not exist, and the holding portion 31b May be formed of an opaque member, and a through hole may be formed at a position corresponding to the mark M of the mounting head 31 and the holding portion 31b. Further, the mounting head 31 may be moved for delivery of the electronic component C.

The first imaging unit 4 and the second imaging unit 5 may be provided so as to be movable with respect to the position where the electronic component C is mounted (mounting position OA). That is, when it is not possible to collectively image the plurality of marks m of the electronic component C and the plurality of marks M of the substrate S, the first imaging unit 4 and the second imaging unit 5 are located between the marks m or between the marks. It may be configured to move between M and take an image. That is, the first imaging unit 4 may be provided with a moving device for moving between the marks m, or the second imaging unit 5 may be provided with a moving device for moving between the marks M. Even in this case, since the moving distance remains within the size range of the mounting area B of the electronic component C or the substrate S and is short, errors and dust generation can be suppressed.

Further, the position of the mark m of the electronic component C and the position of the mark M of the mounting area B of the substrate S are respectively aligned with the reference positions, but the present invention is not limited to this, and the mounting is not limited to this, and the mounting is performed at the position of the electronic component C. The position of the area B may be aligned, or the position of the electronic component C may be aligned with the position of the mounting area B. In short, it suffices if the position of the mounting area B of the substrate S and the position of the electronic component C can be aligned.

Further, the transfer of the substrate S to the stage 21 of the substrate support mechanism 2 may be performed at the mounting position OA. In this case, after the substrate S is supplied to the stage 21, the substrate S may be retracted from the mounting position OA prior to the imaging of the mark m of the electronic component C by the first imaging unit 4.

[Other Embodiments]
Although the embodiment of the present invention and the modification of each part have been described above, the embodiment and the modification of each part are presented as an example, and the scope of the invention is not intended to be limited. These novel embodiments described above can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the invention described in the claims.

1 Mounting device 2 Board support mechanism 3 Mounting mechanism 4 First imaging unit 5 Second imaging unit 6 Supply unit 7 Transfer unit 8 Control device 11 Support base 11a Accommodating hole 21 Stage 22 Drive mechanism 22a, 22b, 33a, 34a, 35a, 62a, 62b Guide rail 23 Moving plate 23a Through hole 31 Mounting head 31a Hollow part 31b Holding part 32 Drive mechanism 33, 34, 35 Moving body 61 Support mechanism 61a Ring holder 62 Drive mechanism 71 Transfer head 71a Suction nozzle 71b Reverse drive Part 72 Arm part 72a Extension part 72b Base part 73 Transfer mechanism 731 Fixed body 732 First drive part 732a First drive source 732b First sliding part 733 Moving body 734 Second drive part 734a Second drive Source 734b Second sliding part

Claims (5)

A mounting mechanism that mounts the electronic component on the board at the mounting position by the mounting head that holds the electronic component,
A board support mechanism that supports the board on which the electronic components are mounted,
The supply unit that supplies the electronic components and
A transfer unit that transfers the electronic component from the supply unit to the mounting position, and a transfer unit.
Have,
The transfer unit
A transfer head that picks up the electronic component from the supply unit, inverts it, and passes it to the mounting head.
A transfer mechanism that moves the transfer head to the mounting position in a space created by retracting the board from the mounting position by the board support mechanism.
An electronic component mounting device characterized by having. The claim is characterized in that the facing distance between the board at the mounting position and the mounting head is set so that the board needs to be retracted in order for the transfer head to move to the mounting position. Item 1. The electronic component mounting device according to item 1. The mounting head has a transmissive portion that allows the mark on the substrate to be transmitted and recognized while holding the electronic component.
A first imaging unit that is arranged below the substrate support mechanism at the mounting position and that images the mark of the electronic component held by the mounting head in a state where the substrate is retracted from the mounting position. ,
A second imaging unit, which is arranged above the mounting head at the mounting position and images a mark on the substrate through the transmissive unit,
A positioning mechanism for positioning the substrate and the electronic component based on the positions of the substrate and the electronic component obtained from the images of the marks captured by the first imaging unit and the second imaging unit. ,
The electronic component mounting device according to claim 1 or 2, wherein the electronic component mounting device according to claim 1 or 2. The electronic component mounting device according to claim 3, wherein the transmissive portion has a transparent plate-shaped member. The electronic component mounting device according to claim 3 or 4, wherein the first imaging unit and the second imaging unit are immovably provided with respect to the mounting position.

Images