JP2018088460A - Module having shield layer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a module capable of improving a shield characteristic to an electronic component of a shield layer.SOLUTION: A module 1 comprises: a wiring substrate 2 having one main surface 2a and the other main surface 2b; an electronic component 3 mounted onto the one main surface 2a; a sealing resin layer 4 that seals the main surface 2a and the electronic component 3; an external terminal electrode 8; a first shield layer 5 that coats the wiring substrate 2 and a surface other than the arrangement surface of the external terminal electrode of the sealing resin layer; and a second shield layer 6 that coats an arrangement surface of the external terminal electrode 8 so as to separate the external terminal electrode 8.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a module having a shield layer that shields unnecessary electromagnetic waves with respect to electronic components mounted on a wiring board.

  In modules where electronic components such as semiconductor elements are mounted on the mounting surface of the wiring board, a shield layer that shields unnecessary electromagnetic waves may be provided to reduce the adverse effects of unnecessary electromagnetic waves emitted by external devices on the electronic components. is there. In this type of module, an electronic component mounted on the mounting surface of the wiring board is covered with a sealing resin layer, and a shield layer is provided so as to cover the upper surface and side surfaces of the sealing resin layer and the side surface of the wiring board. is there. As such a module, for example, there is a semiconductor device 100 described in Patent Document 1 as shown in FIG.

  The semiconductor device 100 includes a wiring substrate 101, a semiconductor chip 102 mounted on one main surface of the wiring substrate 101, a sealing resin layer 103 that seals the semiconductor chip 102, and a sealing resin layer 103. And a conductive shield layer 104 covering the upper and side surfaces and the side surface of the wiring substrate 101. The first main surface of the wiring substrate 101 is provided with a first wiring layer having an internal connection terminal 105 serving as an electrical connection portion with the semiconductor chip 102, and the other main surface is electrically connected to an external device or the like. A second wiring layer having an external connection terminal 106 and a ground terminal 107 to be a part is provided. On the first wiring layer and the second wiring layer, a first solder resist layer 108 and a second wiring layer are respectively formed as insulating layers. Two solder resist layers 109 are formed.

  The second solder resist layer 109 is provided with an opening 110 that exposes the external connection terminal 106, an opening 110 that exposes the ground terminal 107 toward the lower side of the wiring substrate 101, and the opening 110. An opening portion 111 is provided that is provided continuously and exposed toward the side surface of the wiring substrate 101. The conductive shield layer 104 is connected to the ground terminal 107 via a connection portion 112 provided in the open portion 111.

  In the semiconductor device 100 described above, the conductive shield layer 104 is provided so as to cover the upper surface and the side surface of the sealing resin layer 103 and the side surface of the wiring substrate 101, so that the electromagnetic wave radiated from the external device is transmitted to the semiconductor chip 102. Or the leakage of unnecessary electromagnetic waves radiated from the semiconductor chip 102 or the like to the outside.

Japanese Patent Laying-Open No. 2015-154032 (see paragraphs 0010 to 0012, FIG. 2)

  However, in the semiconductor device 100 described above, there is a possibility that electromagnetic waves may enter the inside from the other main surface side of the wiring substrate 101 or may leak from the other main surface side to the outside.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a module that can improve the shielding characteristics of an electronic component by a shield layer.

  In order to achieve the above object, the module of the present invention is mounted on at least one main surface of a wiring board having one main surface and the other main surface, and one main surface and the other main surface of the wiring substrate. Electronic component, sealing resin layer that seals at least one main surface and electronic component, external terminal electrode, surface other than arrangement surface of external wiring electrode and external terminal electrode of sealing resin layer And a second shield layer covering the surface of the external terminal electrode so as to isolate the external terminal electrode.

  According to this configuration, the surface of the external terminal electrode is covered with the first shield layer except for the surface of the external terminal electrode, and the surface of the external terminal electrode is covered with the second shield layer so as to isolate the external terminal electrode. For this reason, intrusion and leakage of electromagnetic waves from the region not covered by the first shield layer are reduced by the second shield layer while preventing the external terminal electrode from being electrically connected to the second shield layer. Thus, it is possible to improve the shielding characteristics for the electronic component by the shield layer.

  Further, no electronic component may be mounted on the other main surface. According to this configuration, it is possible to provide a module in which an electronic component is mounted on one main surface of a wiring board with improved shielding characteristics.

  Further, a ground electrode is further disposed on the external terminal electrode arrangement surface, and the second shield layer covers a part of the ground electrode arrangement region in the external terminal electrode arrangement surface. You may do it. According to this configuration, the contact area between the ground electrode and the second shield layer can be increased, and the contact failure between the ground electrode and the second shield layer can be reduced.

  In addition, a ground electrode and a dummy electrode are further disposed on the surface of the external terminal electrode, and the second shield layer covers a region of the dummy electrode on the surface of the external terminal electrode. In addition, a connection conductor for electrically connecting the ground electrode and the dummy electrode may be further provided without covering the arrangement region of the ground electrode and the peripheral region of the arrangement region. According to this configuration, the contact area between the ground electrode and the second shield layer can be adjusted by changing the size of the dummy electrode.

  Further, another electronic component is mounted on the at least one main surface on which the electronic component is mounted, and the sealing resin layer is opposite to the surface facing the at least one main surface of the wiring board. A trench for partitioning the electronic component and the other electronic component may be formed on the surface, and the trench may not reach the wiring board. According to this configuration, it is possible to reduce damage to the wiring board when forming the trench.

  Further, when the highest position of the electronic component is a first height and the highest position of the other electronic component is a second height with reference to the at least one main surface of the wiring board, the first height The trench may be formed on the wiring substrate side as compared with the lower one of the height and the second height. According to this configuration, it is possible to effectively realize shielding between the electronic component partitioned by the trench and another electronic component.

  According to the present invention, the surface of the external terminal electrode is covered with the first shield layer except for the surface of the external terminal electrode, and the surface of the external terminal electrode is covered with the second shield layer so as to isolate the external terminal electrode. For this reason, intrusion and leakage of electromagnetic waves from the region not covered by the first shield layer are reduced by the second shield layer while preventing the external terminal electrode from being electrically connected to the second shield layer. Thus, it is possible to improve the shielding characteristics for the electronic component by the shield layer.

It is a bottom view of the module concerning a 1st embodiment of the present invention. It is AA "sectional drawing of FIG. It is a bottom view before the shield of the module concerning a 2nd embodiment of the present invention. It is a bottom view after the shield of the module concerning a 2nd embodiment of the present invention. FIG. 5 is a cross-sectional view taken along the line BB ″ in FIG. 4. It is a bottom view before the shield of the module which concerns on 3rd Embodiment of this invention. It is a bottom view after the shield of the module concerning a 3rd embodiment of the present invention. It is CC "sectional drawing of FIG. It is sectional drawing of the module which concerns on 4th Embodiment of this invention. It is sectional drawing of the module which concerns on 5th Embodiment of this invention. It is sectional drawing of the conventional module.

<First Embodiment>
The module 1 which concerns on 1st Embodiment of this invention is demonstrated with reference to FIG. 1 and FIG. 1 is a bottom view of the module 1, and FIG. 2 is a cross-sectional view taken along the line AA "of FIG.

  2, the module 1 according to the first embodiment is mounted on a wiring board 2 and one main surface of the wiring board 2 (corresponding to “one main surface” on which the electronic component of the present invention is mounted) 2a. The plurality of electronic components 3, the one main surface 2 a of the wiring substrate 2, the sealing resin layer 4 that seals each electronic component 3 mounted on the one main surface 2 a, the upper surface of the sealing resin layer 4, and The first shield layer 5 that covers the side surface and the side surface of the wiring board 2 and the other main surface that is the surface opposite to the one main surface 2a of the wiring substrate 2 (corresponding to the “external terminal electrode arrangement surface” of the present invention) ) Including a second shield layer 6 provided so as to cover a partial region of 2b and the side surface of the first shield layer 5, for example, mounted on a mother substrate of an electronic device in which a high-frequency signal is used It is.

  The wiring board 2 is formed of, for example, low-temperature co-fired ceramics or glass epoxy resin, and a plurality of land electrodes 7 on which each electronic component 3 is mounted are formed on one main surface 2a, and the other main surface 2b. Are formed with a plurality of external terminal electrodes 8 for transmitting and receiving signals to and from an external device. As shown in FIG. 1, the external terminal electrodes 8 are arranged in a matrix of 5 rows and 5 columns. A plurality of ground electrodes (not shown), a plurality of types of wiring electrodes (not shown), and a plurality of via conductors (not shown) are formed inside the wiring board 2. Here, each ground electrode is formed, for example, so as to be exposed from the side surface of the wiring substrate 2, and is electrically connected to the first shield layer 5.

  Each land electrode 7, each external terminal electrode 8, each ground electrode, and each wiring electrode are each formed of a metal generally employed as a wiring electrode such as Cu or Al. Each via conductor is formed of a metal such as Ag or Cu. Each land electrode 7 and each external terminal electrode 8 may be plated with Ni / Au.

  Examples of each electronic component 3 include semiconductor elements formed of semiconductors such as Si and GaAs, and chip components such as chip inductors, chip capacitors, and chip resistors.

  The sealing resin layer 4 is provided so as to cover the one main surface 2 a of the wiring board 2 and each electronic component 3. Moreover, the sealing resin layer 4 can be formed with resin generally employ | adopted as sealing resin, such as an epoxy resin.

  The first shield layer 5 is provided so as to cover the upper surface and the side surface of the sealing resin layer 4 and the side surface of the wiring board 2, and unwanted electromagnetic waves radiated from an external device are generated in each electronic component 3 and each of the module 1. This is for reducing the arrival at the wiring electrode or the like, or reducing the leakage of unnecessary electromagnetic waves radiated from the electronic components 3 and the wiring electrodes of the module 1 to the outside. Moreover, the 1st shield layer 5 can be formed with electroconductive materials, such as Cu, Ag, Al, for example. The upper surface and side surfaces of the sealing resin layer 4 and the side surface of the wiring board 2 correspond to “a surface other than the surface on which the external terminal electrodes are arranged” in the present invention.

  The second shield layer 6 is provided so as to cover a partial region of the other main surface 2b of the wiring board 2 and the side surface of the first shield layer 5, and unnecessary electromagnetic waves radiated from external devices are generated from the module 1. To reduce arrival at each electronic component 3 and each wiring electrode, etc., or to reduce unnecessary leakage of electromagnetic waves radiated from each electronic component 3 and each wiring electrode of module 1 to the outside It is.

  Here, a partial region of the other main surface 2b of the wiring board 2 covered by the second shield layer 6 will be described. As shown in FIG. 1 and FIG. 2, the second shield layer 6 is a covered region that does not include the arrangement region of each external terminal electrode 8 and the peripheral region of the arrangement region on the other main surface 2 b of the wiring board 2. (Corresponding to a part of the other main surface 2b) is covered. In other words, the second shield layer 6 does not have a region overlapping with each external terminal electrode 8 when the back surface of the module 1 is viewed from a direction perpendicular to the back surface, and the periphery of each external terminal electrode 8 is Each opening 9 is formed so as not to overlap, and the other main surface 2b of the wiring board 2 is exposed between the second shield layer 6 and the external terminal electrode 8, as shown in FIGS. doing. That is, the second shield layer 6 covers the other main surface 2 b of the wiring board 2 so as to isolate the external terminal electrode 8. Thus, each external terminal electrode 8 and the second shield layer 6 are electrically insulated. The second shield layer 6 can be formed of a conductive material such as Cu, Ag, or Al.

  The second shield layer 6 and second shield layers 6a, 6b, 6d described later are surfaces that are not covered by the first shield layers 5, 5c, 5d from the side surfaces of the first shield layers 5, 5c, 5d. Is provided continuously.

(Module manufacturing method)
Next, a method for manufacturing the module 1 will be described.

  First, a plurality of land electrodes 7 are formed on one main surface 2a, a plurality of external terminal electrodes 8 are formed on the other main surface 2b, and a plurality of ground electrodes, a plurality of types of wiring electrodes, and a plurality of ground electrodes are provided therein. A wiring board 2 on which a plurality of via conductors and the like are formed is prepared. Each land electrode 7, each external terminal electrode 8, each ground electrode, and each wiring electrode can be formed by screen printing a conductive paste containing a metal such as Ag or Cu. Each via conductor can be formed by a well-known method after forming a via hole using a laser or the like.

  Next, a plurality of electronic components 3 are mounted on one main surface 2a of the wiring board 2 using a known surface mounting technique. Next, the sealing resin layer 4 is formed on the one main surface 2a of the wiring substrate 2 so as to cover the one main surface 2a of the wiring substrate 2 and each electronic component 3 mounted on the one main surface 2a. For example, a coating method, a printing method, a compression mold method, a transfer mold method, or the like can be used for forming the sealing resin layer 4. Furthermore, in order to planarize the surface of the sealing resin layer 4, the surface of the sealing resin layer 4 is polished or ground.

  Next, the first shield layer 5 is formed on the top and side surfaces of the sealing resin layer 4 and the side surface of the wiring substrate 2 so as to cover the top and side surfaces of the sealing resin layer 4 and the side surface of the wiring substrate 2. For the formation of the first shield layer 5, for example, a sputtering method, a vapor deposition method, a paste coating method, or the like can be used.

  Next, the covering region of the other main surface 2b of the wiring board 2 and the side surface of the first shield layer 5 are covered so as to cover the covering region of the other main surface 2b of the wiring substrate 2 and the side surface of the first shield layer 5. A second shield layer 6 is formed. For the formation of the second shield layer 6, for example, a sputtering method, a vapor deposition method, a paste coating method, or the like can be used. Each opening 9 can be formed in the second shield layer 6 by applying a mask to the region excluding the covered region of the other main surface 2b of the wiring board 2.

  Therefore, according to the first embodiment described above, in addition to the first shield layer 5 that covers the upper surface and side surface of the sealing resin layer 4 and the side surface of the wiring substrate 2, the other main surface 2 b of the wiring substrate 2 is covered. A second shield layer 6 covering the region and the side surface of the first shield layer 5 is provided. As a result, it is possible to reduce electromagnetic waves that enter the inside of the module 1 from the top and side surfaces of the module 1 and electromagnetic waves that leak to the outside of the module 1 from the top and side surfaces of the module 1, and also enter the inside of the module 1 from the bottom surface of the module 1. Electromagnetic waves that leak and electromagnetic waves that leak from the lower surface of the module 1 to the outside of the module 1 can be reduced. As described above, in the module 1, it is possible to improve the shielding characteristics for the electronic component by the first shield layer 5 and the second shield layer 6.

  Further, the thickness of the first shield layer 5 on the side surface of the module 1 tends to be thinner than the thickness on the upper surface, and the thickness of the second shield layer 6 on the side surface of the module 1 tends to be thinner than the thickness on the lower surface. is there. However, in the module 1, since the side surface of the module 1 is covered with the two layers of the first shield layer 5 and the second shield layer 6, the thickness of the shield layer on the side surface of the module 1 (the first shield layer 5). And the thickness of the second shield layer 6 can be increased. For this reason, the module 1 can effectively reduce electromagnetic waves that enter the inside of the module 1 from the side surface of the module 1 and electromagnetic waves that leak from the side surface of the module 1 to the outside of the module 1. When the shield layer (second shield layer 6) is not provided on the lower surface side of the module 1, the ratio of the thickness of the upper surface and the side surface of the shield layer of the module 1 is approximately 4: 1. By providing two shield layers (the first shield layer 5 and the second shield layer 6), the ratio of the thickness of the upper surface of the shield layer to the thickness of the side surface of the module 1 is approximately 2: 1. As described above, since the shield film having a sufficient thickness can be provided also on the side surface of the module 1, the shielding effect on the side surface can be improved.

Second Embodiment
A module according to a second embodiment of the present invention will be described with reference to FIGS. 3 is a bottom view of the module 1a before shielding, FIG. 4 is a bottom view of the module 1a after shielding, and FIG. 5 is a cross-sectional view taken along the line BB "of FIG.

  The module 1 a according to the second embodiment is different from the module 1 according to the first embodiment described with reference to FIGS. 1 and 2 as shown in FIGS. 3 to 5, as shown in FIGS. 3 to 5. A plurality of ground electrodes 21 are formed together with the plurality of external terminal electrodes 8 and overlap each external terminal electrode 8 when viewed from the direction perpendicular to the back surface of the module 1a. The difference is that the second shield layer 6 a is provided so as to overlap a part of the electrode 21. Each ground electrode (not shown) in the wiring board 2 is connected to the second shield layer 6 a via each ground electrode 21. Since other configurations are the same as those of the module 1 according to the first embodiment, the description thereof is omitted by giving the same reference numerals.

  As shown in FIGS. 3 and 5, a plurality of external terminal electrodes 8 and a plurality of ground electrodes 21 are formed on the other main surface 2 b of the substrate 2. As shown in FIG. 3, the plurality of external terminal electrodes 8 are arranged on a rectangular side, and five external terminal electrodes 8 are provided on each side. In addition, four ground electrodes 21 are provided inside a rectangle in which the plurality of external terminal electrodes 8 are arranged. Each ground electrode 21 is formed of a metal generally employed as a wiring electrode such as Cu or Al, and each ground electrode 21 may be subjected to Ni / Au plating.

  As shown in FIGS. 4 and 5, the second shield layer 6 a is provided so as to cover a partial region of the other main surface 2 b of the wiring board 2 and the side surface of the first shield layer 5.

  Here, a partial region of the other main surface 2b of the wiring board 2 covered by the second shield layer 6a will be described. As shown in FIGS. 4 and 5, the second shield layer 6 a does not include the arrangement region of each external terminal electrode 8 and the peripheral region of the arrangement region on the other main surface 2 b of the wiring board 2. The covering region (corresponding to a partial region of the other main surface 2b) including a part of the arrangement region of each ground electrode 21 is covered. In other words, the second shield layer 6a does not have a region overlapping with each external terminal electrode 8 when the back surface of the module 1a is viewed from a direction perpendicular to the back surface, and the periphery of each external terminal electrode 8 is Each opening 9 is formed so as not to overlap, and each opening 9a is formed so as to overlap with each ground electrode 21 only in a region not including the central region of the ground electrode 21, as shown in FIG. 4 and FIG. The other main surface 2b of the wiring board 2 is exposed between the second shield layer 6a and the external terminal electrode 8. Thus, each external terminal electrode 8 and the second shield layer 6a are electrically insulated, and each ground electrode 21 and the second shield layer 6a are electrically connected.

  Therefore, according to the second embodiment described above, in addition to the effects of the first embodiment, the region except for the central region of each ground electrode 21 is covered with the second shield layer 6a. The contact area with the second shield layer 6a can be increased, and the contact failure between each ground electrode 21 and the second shield layer 6a can be reduced. In addition, the area of the ground electrode in the wiring board 2 can be reduced, and the degree of freedom in designing the layout of the wiring electrodes in the wiring board 2 is increased.

  In addition, when the back surface of the module 1a is viewed from a direction perpendicular to the back surface, each ground electrode 21 and the second shield layer 6a overlap each other in a part of the ground electrode 21, but at least one ground The electrode 21 and the second shield layer 6a may be overlapped at a part of the ground electrode 21, and the remaining ground electrode 21 and the second shield layer 6a may be overlapped at the entire ground electrode 21. According to this configuration, since the opening 9 is reduced, the shield effect can be further improved.

<Third Embodiment>
A module according to a third embodiment of the present invention will be described with reference to FIGS. 6 is a bottom view of the module 1b before shielding, FIG. 7 is a bottom view of the module 1b after shielding, and FIG. 8 is a cross-sectional view taken along the line CC ′ of FIG.

  The module 1b according to the third embodiment is different from the module 1 according to the first embodiment described with reference to FIGS. 1 and 2 as shown in FIGS. 6 to 8 as shown in FIG. 6 to FIG. A plurality of ground electrodes 21 and a plurality of dummy electrodes 31 are formed together with the plurality of external terminal electrodes 8, and overlap each external terminal electrode 8 and each ground electrode 21 when viewed from a direction perpendicular to the back surface of the module 1b. The second shield layer 6 b is provided so as not to be slightly in contact with each other and to overlap the entire dummy electrodes 31, and each ground electrode 21 is electrically connected to each dummy electrode 31 by a connection conductor 32. In point. Since other configurations are the same as those of the module 1 according to the first embodiment, the description thereof is omitted by giving the same reference numerals.

  As shown in FIGS. 6 and 8, a plurality of external terminal electrodes 8, a plurality of ground electrodes 21, and a plurality of dummy electrodes 31 are formed on the other main surface 2 b of the substrate 2. As shown in FIG. 6, the plurality of external terminal electrodes 8 are arranged in a second row, first column, second row, second column, second row, fourth column, second row, fifth row in a matrix of 5 rows and 5 columns. It is provided in the corresponding region excluding the column, the fourth row, the first column, the fourth row, the second column, the fourth row, the fourth column, and the fourth row, the fifth column. In addition, as shown in FIG. 6, the plurality of ground electrodes 21 are arranged in a second row, second column, second row, fourth column, fourth row, second column, and fourth row in a 5 × 5 matrix. It is provided in the corresponding region of the fourth column. In addition, as shown in FIG. 6, the plurality of dummy electrodes 31 includes a second row, first column, a second row, a fifth column, a fourth row, a first column, and a fourth row in a matrix of 5 rows and 5 columns. It is provided in the corresponding area of the fifth column. Each dummy electrode 31 is formed of a metal generally employed as a wiring electrode such as Cu or Al, and each dummy electrode 31 may be subjected to Ni / Au plating.

  As shown in FIGS. 7 and 8, the second shield layer 6 b is provided so as to cover a partial region of the other main surface 2 b of the wiring board 2 and the side surface of the first shield layer 5.

  Here, a partial region of the other main surface 2b of the wiring board 2 covered by the second shield layer 6b will be described. As shown in FIGS. 7 and 8, the second shield layer 6b does not include the arrangement region of each external terminal electrode 8 and the peripheral region of the arrangement region on the other main surface 2b of the wiring board 2. A covering region (corresponding to a partial region of the other main surface 2b) not including the arrangement region of the arrangement region of each ground electrode 21 and the peripheral region of the arrangement region is covered. In other words, the second shield layer 6b does not have a region overlapping with each external terminal electrode 8 when the back surface of the module 1b is viewed from a direction perpendicular to the back surface, and the periphery of each external terminal electrode 8 is Each opening 9 is formed so as not to overlap with each other, and there is no region overlapping with each ground electrode 21, and each opening 9 b is formed so as not to overlap with the periphery of each ground electrode 21. The covering area includes the entire arrangement area of each dummy electrode 31.

  As shown in FIG. 8, a plurality of connection conductors 32 that electrically connect each ground electrode 21 to each dummy electrode 31 are provided inside the wiring board 2 of the module 1 b. Each connection conductor 32 is formed of a metal such as Ag or Cu.

  As shown in FIG. 8, each external terminal electrode 8 is electrically insulated from the second shield layer 6b, and each ground electrode 21 is connected to each dummy electrode 31 electrically connected to the second shield layer 6b. By being electrically connected via each connection conductor 32, it is electrically connected to the second shield layer 6b.

  Therefore, according to the third embodiment described above, in addition to the effect of the first embodiment, the contact area between each ground electrode 21 and the second shield layer 6b is adjusted by changing the size of each dummy electrode 31. can do.

<Fourth embodiment>
A module according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a cross-sectional view of the module 1c.

  The module 1c according to the fourth embodiment is different from the module 1b according to the third embodiment described with reference to FIGS. 6 to 8 as shown in FIG. 9, in which one electronic component is provided in the sealing resin layer 4a. The difference is that a trench 41 is formed for partitioning the wiring board 2 and other electronic components, and the first shield layer 5c is provided so as to cover the side surface of the wiring board 2 and the sealing resin layer 4c. Since the other configuration is the same as that of the module 1b according to the third embodiment, the description thereof is omitted by giving the same reference numerals.

  The sealing resin layer 4c is provided so as to cover the one main surface 2a of the wiring board 2 and the respective electronic components 3-1, 3-2 and 3-3 mounted on the one main surface 2a. The sealing resin layer 4c includes a trench 41 that divides a portion where the electronic component 3-1 is present and a portion where the electronic components 3-2 and 3-3 are present in the sealing resin layer 4c. 4c from the upper surface of 4c (corresponding to “the surface of the sealing resin layer opposite to the surface facing at least one main surface of the wiring substrate” in the present invention) toward the wiring substrate 2 and reaching the wiring substrate 2 It is formed so as not to.

  The first shield layer 5 c is provided so as to cover the upper surface and side surfaces of the sealing resin layer 4 c, the trench 41, and the side surfaces of the wiring substrate 2.

  Therefore, according to the fourth embodiment, in addition to the effects of the third embodiment, the electronic component 3-1 and the electronic component 3-2 partitioned by the trench 41 from the first shield layer 5 c in the trench 41 portion. Shielding between 3-3 can be realized. Further, by making the trench 41 not reach the wiring substrate 2, damage to the wiring substrate 2 due to the laser when forming the trench 41 can be reduced.

  When a trench separates an electronic component from another electronic component, the electronic component of the wiring board and one main surface on which the other electronic component is mounted are used as a reference, and the highest position of the electronic component is defined as the first height. When the highest position of the electronic component is the second height, the trench is formed on the wiring board side as compared with the lower one of the first height and the second height, and the wiring board The sealing resin layer may be formed from a surface opposite to the surface facing the one main surface of the wiring substrate so as not to reach the one main surface. If it does in this way, shielding between the electronic parts in one part and the electronic parts in the other part divided by the trench can be realized effectively.

<Fifth Embodiment>
A module according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 10 is a cross-sectional view of the module 1d.

  The module 1d according to the fifth embodiment differs from the module 1 according to the first embodiment described with reference to FIGS. 1 and 2 as shown in FIG. 10 on one main surface of the wiring board 2d (the present invention). The electronic component 3 is mounted on 2 da and the other main surface 2 db (corresponding to “the other main surface” on which the electronic component of the present invention is mounted). An electronic component 3d is mounted, a sealing resin layer 51 is provided so as to cover the other main surface 2db and the electronic component 3d, and one side of a metal pillar (corresponding to the “external terminal electrode” of the present invention) 8d is sealed It is formed so as to be substantially flush with the lower surface of the resin layer 51 (corresponding to the “external terminal electrode arrangement surface” of the present invention), and the upper and side surfaces of the sealing resin layer 4, the side surface of the wiring substrate 2 d, and the sealing The first shield layer so as to cover the side surface of the resin layer 51 d is formed, in that the second shield layer 6d so as to cover a portion of the lower surface of the first side of the shield layer 5d and the sealing resin layer 51 is formed, different. Since other configurations are the same as those of the module 1 according to the first embodiment, the description thereof is omitted by giving the same reference numerals.

  A plurality of electronic components 3 are mounted on one main surface 2da of the wiring board 2d, and an electronic component 3d is mounted on the other main surface 2db. A plurality of land electrodes 7 on which the respective electronic components 3 are mounted are formed on one main surface 2da of the wiring board 2d, and a plurality of land electrodes 7d on which the electronic components 3d are mounted on the other main surface 2db, A plurality of electrodes 52 to which the other surfaces of the plurality of metal pillars 8d are connected are formed. The plurality of metal pillars 8d are made of a conductive material, and are formed double along the inner edge of the other main surface 2db of the wiring board 2d when the back surface of the module 1 is viewed from a direction perpendicular to the back surface. . Each electrode 52 and each metal pillar 8d are for transmitting and receiving signals to and from an external device. The sealing resin layer 51 is provided so as to cover the other main surface 2db of the wiring board 2 and the electronic component 3d, and one surface of each metal pillar 8d is substantially flush with the lower surface of the sealing resin layer 5. Yes, and exposed from the sealing resin layer 51.

  The first shield layer 5 d is provided so as to cover the upper surface and side surface of the sealing resin layer 4, the side surface of the wiring substrate 2, and the side surface of the sealing resin layer 51.

  The second shield layer 6d is provided so as to cover a partial region of the lower surface of the sealing resin layer 51 and the side surface of the first shield layer 5d.

  Here, a partial region of the lower surface of the sealing resin layer 51 covered by the second shield layer 6d will be described. As shown in FIG. 10, the second shield layer 6 d includes a covering region (not including a region on one side of each metal pillar 8 d and a peripheral region on the one side of the lower surface of the sealing resin layer 51. (Corresponding to a partial region of the lower surface of the sealing resin layer 51). In other words, the second shield layer 6d does not have a region overlapping with one surface of each metal pillar 8d when the back surface of the module 1d is viewed from a direction perpendicular to the back surface, and one of the metal pillars 8d. Each opening 9d is formed so as not to overlap with the periphery of the direction, and as shown in FIG. 10, the sealing resin layer 51 is exposed between the second shield layer 6d and one surface of the metal pillar 8d. doing. That is, the second shield layer 6d covers the lower surface of the sealing resin layer 51 so as to isolate one surface of the metal pillar 8d. Thus, each metal pillar 8d and the second shield layer 6d are electrically insulated.

  Therefore, according to the fifth embodiment described above, similarly to the first embodiment, in the module 1d, the first shield layer 5d and the second shield layer 6d cause the electromagnetic wave to enter the module 1d and the module 1d. Leakage to the outside can be suppressed.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention. For example, the contents of the above-described embodiments may be combined. In the fifth embodiment, the plurality of metal pillars 8d are doubled along the inner edge of the other main surface 2db of the wiring board 2d when the back surface of the module 1 is viewed from a direction perpendicular to the back surface. However, the present invention is not limited to this, and the plurality of metal pillars may be single or triple when the back surface of the module is viewed from a direction perpendicular to the back surface. Not necessarily.

  Further, the present invention can be applied to a module having a component mounted on a wiring board and a shield layer that shields unnecessary electromagnetic waves.

  1, 1a, 1b, 1c, 1d module, 2, 2d wiring board, 3, 3d electronic component, 4, 4c, 51 sealing resin layer, 5, 5d first shield layer, 6, 6a, 6b, 6d first 2 shield layers, 8, 8d external terminal electrode, 21 ground electrode, 31 dummy electrode, 32 connecting conductor, 41 trench

Claims (6)

A wiring board having one main surface and the other main surface;
Of the one main surface and the other main surface of the wiring board, at least an electronic component mounted on one main surface,
A sealing resin layer for sealing the at least one main surface and the electronic component;
An external terminal electrode;
A first shield layer that covers a surface of the wiring board and the sealing resin layer other than a surface on which the external terminal electrode is disposed;
And a second shield layer covering a surface on which the external terminal electrode is arranged so as to isolate the external terminal electrode.   The module according to claim 1, wherein no electronic component is mounted on the other main surface. A ground electrode is further arranged on the arrangement surface of the external terminal electrode,
3. The module according to claim 1, wherein the second shield layer covers a part of an arrangement region of the ground electrode in an arrangement surface of the external terminal electrode. A ground electrode and a dummy electrode are further arranged on the arrangement surface of the external terminal electrode,
The second shield layer covers the placement area of the dummy electrode in the placement surface of the external terminal electrode, does not cover the placement area of the ground electrode and the peripheral area of the placement area,
The module according to claim 1, further comprising a connection conductor that electrically connects the ground electrode and the dummy electrode. Still another electronic component is mounted on the at least one main surface on which the electronic component is mounted,
A trench for partitioning the electronic component and the another electronic component is formed on a surface of the sealing resin layer opposite to the surface facing the at least one main surface of the wiring board, and the trench is formed on the wiring. The module according to any one of claims 1 to 4, wherein the module does not reach the substrate. When the highest position of the electronic component is a first height and the highest position of the other electronic component is a second height with reference to the at least one main surface of the wiring board, the first height 6. The module according to claim 5, wherein the trench is formed on the wiring board side as compared with a lower one of the second heights.

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