JP2018054669A - Method for manufacturing photoelectric wiring board, method for manufacturing electronic equipment, and photoelectric wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the loss of an optical signal.SOLUTION: A method for manufacturing a photoelectric wiring board according to one embodiment comprises first to fourth steps. The first step prepares a first substrate including a first surface and an optical waveguide and an alignment mark on the first surface. The second step forms a mirror part in the optical waveguide with reference to the alignment mark. The third step forms an insulating layer on the optical waveguide and the mirror part. The fourth step forms a through hole in a portion located above the mirror part of the insulating layer with reference to the alignment mark.SELECTED DRAWING: Figure 2

Description

  The present disclosure relates to an opto-electric wiring board including an optical waveguide and a wiring conductor, and an electronic device using the same.

  In recent years, it has been studied to perform signal transmission between electronic devices using light for the purpose of improving information processing capability. Therefore, an optoelectric wiring board has been developed in which an optical waveguide for transmitting an optical signal by converting an electrical signal of an electronic device into an optical signal is formed.

  Such an opto-electric wiring board is described in Patent Document 1, for example. This optoelectric wiring board has a build-up layer with a built-in optical waveguide. The buildup layer located on the optical waveguide is provided with a light passage. An electronic device is mounted by mounting a light emitting element or a light receiving element on the build-up layer of the photoelectric wiring board, and optically coupling the light emitting element or the light receiving element and the optical waveguide through the light passage. Become.

JP 2006-39045 A

  In an optoelectric wiring board and an electronic device using the same, it is desired to further reduce the loss of an optical signal. The present disclosure has been devised in view of such circumstances, and an object thereof is to provide an optoelectric wiring board and an electronic device that can reduce loss of an optical signal.

  The method for manufacturing an optoelectric wiring board according to an embodiment of the present invention includes first to fourth steps. The first step is a step of preparing a first substrate having a first surface and having an optical waveguide and an alignment mark on the first surface. The second step is a step of forming a mirror portion in the optical waveguide with reference to the alignment mark. The third step is a step of forming an insulating layer on the optical waveguide and the mirror part. The fourth step is a step of forming a through hole in a portion located above the mirror portion of the insulating layer with reference to the alignment mark.

  The method for manufacturing an optoelectric wiring board according to an embodiment of the present invention includes first to fourth steps. The first step is a step of preparing a first substrate having a first surface and having an optical waveguide, a first wiring conductor, and an alignment mark on the first surface. The second step is a step of forming a mirror portion in the optical waveguide with reference to the alignment mark. The third step is a step of placing the wiring board having the second wiring conductor on the surface on the first wiring conductor and the mirror portion and electrically connecting the first wiring conductor and the second wiring conductor. The fourth step is a step of forming a through hole in a portion located above the mirror portion of the wiring board with the alignment mark as a reference.

  A method of manufacturing an electronic device according to an embodiment of the present invention includes a light receiving element or a light emitting element so that a light receiving unit or a light emitting unit faces a mirror unit after an optoelectric wiring board is manufactured by any one of the above manufacturing methods. Is disposed on the photoelectric wiring board.

An opto-electric wiring board according to an embodiment of the present invention includes a first substrate, a cladding portion, a core portion,
The mirror part, the wiring board, and the metal bump are provided. The first substrate has a first surface and a first wiring conductor on the first surface. The clad portion is located on the first substrate and has a through hole at a portion above the first wiring conductor. The core part is located inside the clad part and extends along the first surface. The mirror part is located on the extension of the core part. The wiring board has the second wiring conductor on the surface and is located on the clad portion. The metal bump is located in the through hole, and electrically connects the first wiring conductor and the second wiring conductor.

  According to each of the embodiments described above, loss of optical signals can be reduced in the photoelectric circuit board and the electronic device.

1 is a plan view of an electronic device according to a first embodiment. It is sectional drawing in the II-II line of the electronic device of FIG. (A) is a top view which shows the state in the middle of the manufacturing process of the optoelectronic wiring board which concerns on 1st Embodiment, (b) is sectional drawing in the IIIb-IIIb line | wire of (a). (A) is a top view which shows the state in the middle of the manufacturing process of the optoelectric wiring board which concerns on 1st Embodiment, (b) is sectional drawing in the IVb-IVb line | wire of (a). (A) is a top view which shows the state in the middle of the manufacturing process of the optoelectric wiring board which concerns on 1st Embodiment, (b) is sectional drawing in the Vb-Vb line | wire of (a). (A) is a top view which shows the state in the middle of the manufacturing process of the optoelectronic wiring board which concerns on 1st Embodiment, (b) is sectional drawing in the VIb-VIb line | wire of (a). (A) is a top view which shows the state in the middle of the manufacturing process of the optoelectric wiring board which concerns on 1st Embodiment, (b) is sectional drawing in the VIIb-VIIb line | wire of (a). It is a top view of the electronic device which concerns on 2nd Embodiment. It is sectional drawing in the IX-IX line of the electronic device of FIG. (A) is a top view which shows the state in the middle of the manufacturing process of the optoelectric wiring board which concerns on 2nd Embodiment, (b) is sectional drawing in the Xb-Xb line | wire of (a). (A) is a top view which shows the state in the middle of the manufacturing process of the optoelectric wiring board which concerns on 2nd Embodiment, (b) is sectional drawing in the XIb-XIb line | wire of (a). (A) is a top view which shows the state in the middle of the manufacturing process of the optoelectric wiring board which concerns on 2nd Embodiment, (b) is sectional drawing in the XIIb-XIIb line | wire of (a). It is sectional drawing which shows the state in the middle of the manufacturing process of the optoelectric wiring board which concerns on 2nd Embodiment. (A) is a top view which shows the state in the middle of the manufacturing process of the optoelectric wiring board which concerns on 2nd Embodiment, (b) is sectional drawing in the XIVb-XIVb line | wire of (a). (A) is a top view which shows the state in the middle of the manufacturing process of the optoelectric wiring board which concerns on 2nd Embodiment, (b) is sectional drawing in the XVb-XVb line | wire of (a).

  The optoelectric wiring board and the electronic device of the present disclosure will be described with reference to the drawings. In addition, in the present disclosure, for the sake of convenience, an orthogonal coordinate system (X, Y, Z) is defined, and the positive side in the Z-axis direction is set upward. Use words such as the top.

  1 and 2 show a photoelectric wiring board 100 of the first embodiment. An electronic device 101 is obtained by mounting the photoelectric conversion element 8 on the optoelectric wiring board 100. The electronic device 101 is mounted on a product such as an optical transceiver, a server, or a router, for example.

  The photoelectric conversion element 8 may be a light emitting element that converts an electric signal into an optical signal, or may be a light receiving element that converts an optical signal into an electric signal. The photoelectric conversion element 8 is electrically connected to the wiring conductor 7 of the photoelectric circuit board 100 via a bonding member such as gold, silver, copper, or solder. As a specific example, the photoelectric conversion element 8 may be flip-chip mounted on the wiring conductor 7 of the photoelectric wiring substrate 100.

  Various light emitting elements or light receiving elements can be applied to the photoelectric conversion element 8. As the light emitting element, for example, a vertical cavity surface emitting laser (VCSEL) can be used. Moreover, as a light receiving element, a photodiode (PD: Photo Diode) etc. can be used, for example. Alternatively, the photoelectric conversion element 8 may be a light receiving / emitting element having both a light emitting part and a light receiving part.

  The optoelectric wiring board 100 has a function of transmitting optical signals and electrical signals. The optoelectric wiring board 100 includes a first substrate 1, an optical waveguide 2, an alignment mark 3, a mirror part 4, and an insulating layer 6.

  The first substrate 1 supports the photoelectric conversion element 8 and the optical waveguide 2. The first substrate 1 includes, for example, a plurality of insulating layers (not shown), a plurality of metal layers (not shown), and via conductors (not shown). The plurality of insulating layers and the plurality of metal layers are alternately stacked. The via conductor is provided so as to penetrate through one insulating layer, and the metal layers adjacent in the vertical direction are electrically connected to each other via the via conductor. The metal layer functions as a wiring conductor of the first substrate 1. The first substrate 1 can be manufactured by a conventionally known method.

  The first substrate 1 is not limited to having a plurality of insulating layers and a plurality of metal layers. The first substrate 1 may have, for example, one insulating layer and a metal layer disposed on the upper surface of the one insulating layer. Moreover, the 1st board | substrate 1 may have the laminated body which consists of a some insulating layer, and the metal layer distribute | arranged to the upper surface of the laminated body, for example. Moreover, the 1st board | substrate 1 may mix and laminate | stack the insulating layer and the laminated body which consists of a several insulating layer, for example.

  For the insulating layer of the first substrate 1, for example, a resin material such as an epoxy resin, or a ceramic material such as silica, alumina, or zirconia is used. The metal layer and via conductor of the first substrate 1 are made of a metal material such as copper or aluminum, for example.

  The alignment mark 3 is disposed on the upper surface (first surface) of the first substrate 1. The alignment mark 3 serves as a reference for specifying the position of the mirror unit 4. For example, the shape in plan view may be a figure such as a circle or a polygon, and these figures are combined. There may be. The alignment mark 3 is provided in a state where the boundary with the upper surface of the first substrate 1 becomes clear when viewed in plan. For example, the alignment mark 3 and the upper surface of the first substrate 1 may have different colors and may have different light reflectivities. Such an alignment mark 3 may be a metal layer or an insulating layer disposed on the upper surface of the first substrate 1. Alternatively, the alignment mark 3 may be a protrusion protruding from the upper surface of the first substrate 1 or a recess recessed from the upper surface of the first substrate 1.

  The optical waveguide 2 has a function of transmitting an optical signal. The thickness of the optical waveguide 2 is set to, for example, 50 μm or more and 110 μm or less. The optical waveguide 2 has a layered clad part 2a and at least one strip-shaped core part 2b located inside the clad part 2a. Since the refractive index of the core part 2b is set larger than the refractive index of the cladding part 2a, the light entering the core part 2b is repeatedly reflected at the interface between the core part 2b and the cladding part 2a, It will proceed in the part 2b. As a result, the optical waveguide 2 can transmit an optical signal.

  For example, an epoxy resin or the like can be used for the core portion 2b. For example, an epoxy resin, a polyimide resin, a phenol resin, an acrylic resin, or the like can be used for the clad portion 2a. In addition, the refractive index of the core part 2b is set to 1.5 or more and 1.6 or less, for example. Moreover, the refractive index of the clad part 2a is set to 1.45 or more and 1.55 or less, for example. The refractive index of the core part 2b is set larger than the refractive index of the cladding part 2a, for example, in the range of 0.1% to 0.5% with respect to the refractive index of the cladding part 2a.

  The clad part 2a of the optical waveguide 2 has, for example, a first clad part and a second clad part. The first clad portion is formed in a layer shape, and is laminated on the upper surface of the first substrate 1. The core portion 2b is formed in a band shape and is disposed on the upper surface of the first cladding portion. The second cladding part is arranged so as to cover the upper surface and the side surface of the core part 2b.

  The optical waveguide 2 can be manufactured as follows, for example. First, a resin film serving as a first cladding portion is laminated on the upper surface of the first substrate 1. Next, the resin film used as the core part 2b is laminated | stacked on the upper surface of a 1st clad part, and the strip | belt-shaped core part 2b is formed by performing exposure and image development of this resin film suitably. Next, a resin film to be the second cladding part is laminated on the upper surface of the first cladding part so as to cover the upper surface and side surfaces of the core part 2b.

  The clad 2a of the optical waveguide 2 may cover the upper surface of the alignment mark 3 as long as it is translucent. Even in such a configuration, the alignment mark 3 can be recognized through the cladding 2a if the cladding 2a is translucent.

  The mirror part 4 is arranged in a part of the optical waveguide 2 and is for optically connecting the photoelectric conversion element 8 and the core part 2b. The mirror part 4 is inclined with respect to the extending direction of the core part 2b (X-axis direction), and the inclined surface is a light reflecting surface. That is, the mirror part 4 can guide the light into the core part 2b by reflecting the light emitted downward (−Z direction) from the photoelectric conversion element 8 in the plane direction (+ X direction). Alternatively, the mirror unit 4 guides the light to the photoelectric conversion element 8 by reflecting the light emitted in the plane direction (−X direction) from the core unit 2 b upward (+ Z direction) by the inclined mirror unit 4. Can do. The mirror part 4 can be formed by cutting out a part of the optical waveguide 2 using dicing, laser processing or the like.

  In addition, between the mirror part 4 and the core part 2b, the translucent resin which has a light transmittance with respect to the light transmitted between these may be filled. As such a translucent resin, for example, an epoxy resin or a silicone resin can be used. The refractive index of the translucent resin may be smaller than the refractive index of the core portion 2b. With such a configuration, an optical signal can be transmitted favorably between the mirror unit 4 and the core unit 2b. In addition, the refractive index of translucent resin is set to 1.45 or more and 1.55 or less, for example.

  The insulating layer 6 is located on the optical waveguide 2 and is for mounting the photoelectric conversion element 8. For the insulating layer 6, for example, an epoxy resin, a polyimide resin, a phenol resin, an acrylic resin, or the like can be used.

  On the mirror part 4 of the insulating layer 6, a through hole 6 a is provided in the thickness direction (Z-axis direction). The through hole 6 a is a light path for satisfactorily optically coupling the photoelectric conversion element 8 and the mirror unit 4. The through-hole 6a can be produced by using a photosensitive resin as the insulating layer 6 and performing exposure and development. The through-hole 6a may be filled with a translucent resin having light transmissivity with respect to light transmitted between the photoelectric conversion element 8 and the mirror unit 4. As such a translucent resin, for example, an epoxy resin or a silicone resin can be used.

  The insulating layer 6 may extend to the outside of the optical waveguide 2 when viewed in plan in the Z-axis direction. In that case, outside the optical waveguide 2, as shown in FIG. 2, an insulating layer 6 may be disposed on the first substrate 1 via another insulating layer 5. If the thickness of the other insulating layer 5 is the same as the thickness of the optical waveguide 2, the upper surface of the other insulating layer 5 and the upper surface of the optical waveguide 2 have the same height, and the insulating layer 6 can be easily formed well. For the other insulating layer 5, for example, an epoxy resin, a polyimide resin, a phenol resin, an acrylic resin, or the like can be used. Instead of the other insulating layer 5 described above, an extension of the clad portion 2a may be used.

  The insulating layer 6 may include a wiring conductor 7. The wiring conductor 7 is for inputting an electric signal to the photoelectric conversion element 8 or for outputting an electric signal from the photoelectric conversion element 8. As shown in FIG. 2, the photoelectric conversion element 8 may be flip-chip mounted on the wiring conductor 7 using solder or the like, or the photoelectric conversion element 8 and the wiring conductor 7 may be connected by wire bonding. Good.

  As shown in FIG. 2, the wiring conductor 7 may be electrically connected to a semiconductor element 9 for driving the photoelectric conversion element 8. Further, as shown in FIG. 2, the wiring conductor 7 may be electrically connected to the wiring conductor 1 b disposed on the first substrate 1 through the insulating layer 6 and the other insulating layer 5. The wiring conductor 7 is made of a metal material such as copper, aluminum, or solder.

  The photoelectric conversion element 8 is mounted on the insulating layer 6 so that the light emitting part or the light receiving part thereof faces the mirror part 4 through the through hole 6a of the insulating layer 6. With such a configuration, the photoelectric conversion element 8 and the mirror unit 4 can be brought close to each other, and the optical waveguide 2 and the photoelectric conversion element 8 can be optically coupled with low loss.

  A method for manufacturing the optoelectric wiring board 100 of the first embodiment will be described below.

  First, as shown in FIG. 3, a metal layer is processed on the upper surface (first surface) of the first substrate 1 using a photolithographic technique or the like, thereby producing the wiring conductor 1 b and the alignment mark 3. Thereafter, the optical waveguide 2 is formed on the upper surface of the first substrate 1. The optical waveguide 2 may be formed with the alignment mark 3 as a reference. That is, when the core portion 2b of the optical waveguide 2 is formed, the core portion 2b is produced in a desired shape at a desired position with the alignment mark 3 as a reference. Thereby, the mirror part 4 and the optical waveguide 2 which will be described later can be optically connected favorably.

  Next, as shown in FIG. 4, a part of the optical waveguide 2 is cut out with the alignment mark 3 as a reference to form a mirror portion 4 having an inclined surface. On the inclined surface of the mirror part 4, a metal layer may be deposited by plating or the like to increase the light reflectance.

  Next, as shown in FIG. 5, another insulating layer 5 and an insulating layer 6 are laminated on the insulating substrate 1 and the optical waveguide 2. The other insulating layer 5 may be formed by extending the clad portion 2 a of the optical waveguide 2.

Next, as shown in FIG. 6, a through hole 6 a is formed in a portion of the insulating layer 6 located above the mirror portion 4. The through hole 6a may be a groove that divides the insulating layer 6 as shown in FIG. In addition, another through hole for forming the wiring conductor 7 is formed in the insulating layer 6 and the other insulating layer 5. Such through holes 6a and other through holes can be produced by performing exposure and development using a photosensitive resin as the insulating layer 6 and the other insulating layer 5, or by laser processing. When a photosensitive resin is used as the insulating layer 6, when the through-hole 6 a is formed in the insulating layer 6, damage to the surface of the mirror part 4 can be reduced and the light reflection efficiency of the mirror part 4 can be maintained high. .

  As described above, after forming the mirror portion 4 in the optical waveguide 2 with the alignment 3 as a reference, the process of forming the through hole 6a in the insulating layer 6 with the alignment 3 as a reference again is provided. It becomes possible to reduce the loss of the optical signal in the substrate 100. That is, by providing the above steps, the positional accuracy of the photoelectric conversion element 8 mounted on the optoelectric wiring substrate 100, the through hole 6a of the insulating layer 6, the mirror part 4 and the core part 2b of the optical waveguide 2 is increased. It becomes possible.

  After producing the optoelectric wiring board 100 as described above, the light receiving part or the light emitting part of the photoelectric conversion element 8 (that is, the light receiving part of the light receiving element or the light emitting part of the light emitting element) is opposed to the mirror part 4. The photoelectric conversion element 8 is disposed on the insulating layer 6. As a result, the electronic device 101 shown in FIGS. 1 and 2 is obtained.

  When the photoelectric conversion element 8 is disposed on the insulating layer 6, the photoelectric conversion element 8 may be disposed on the insulating layer 6 with the alignment mark 3 as a reference. In this case, the positional accuracy between the photoelectric conversion element 8 and the mirror unit 4 is further improved, and the optical loss of the electronic device 101 can be further reduced.

<Modification>
8 and 9 show an optoelectric wiring board 200 according to the second embodiment. An electronic device 201 is formed by mounting the photoelectric conversion element 28 on the optoelectric wiring board 200.

  The optoelectric wiring board 200 includes a first substrate 21, a cladding part 22 a, a core part 22 b, an alignment mark 23, a mirror part 24, and a wiring board 26.

  The first substrate 21 has a first wiring conductor 21b on the upper surface (first surface). For the first substrate 21 and the first wiring conductor 21b, the same material and configuration as those of the first substrate 11 and the metal layer provided on the first substrate 11 described in the above-described optoelectric wiring substrate 100 can be used.

  The alignment mark 23 is disposed on the upper surface (first surface) of the first substrate 1. The alignment mark 23 serves as a reference for specifying the position of the mirror portion 24. The alignment mark 24 may be made of the same material and configuration as the alignment mark 3 described in the photoelectric wiring board 100 described above.

  The clad portion 22a is located on the first substrate 21 and has a through hole in a portion above the first wiring conductor 21b. A core portion 22b extending along the upper surface of the first substrate 21 is located inside the cladding portion 22a, and the cladding portion 22a and the core portion 22b constitute the optical waveguide 22. The clad portion 22a and the core portion 22b can be made of the same material and configuration as the clad portion 2a and the core portion 2b described in the optoelectric wiring board 100.

  The mirror part 24 is arranged on the extension of the core part 22b, and is for optically connecting the photoelectric conversion element 28 and the core part 22b. Moreover, between the mirror part 24 and the core part 22b, the translucent resin which has a light transmittance with respect to the light transmitted between these may be filled. The mirror part 24 and translucent resin can use the material and structure similar to the mirror part 4 and translucent resin which were demonstrated by said optoelectric wiring board 100. FIG.

  The wiring board 26 is located on the cladding part 22a so as to cover the through hole of the cladding part 22a and the mirror part 24 from above. The wiring board 26 has a second wiring conductor 27 on the surface. The wiring board 26 may be bonded to the upper surface of the clad portion 22a via an adhesive or the like.

  For the wiring board 26, for example, epoxy resin, polyimide resin, phenol resin, acrylic resin, or the like can be used. The second wiring conductor 27 is made of a metal material such as copper, aluminum, or solder.

  A metal bump 22c is located in the through hole of the clad portion 22a, and the metal bump 22c electrically connects the second wiring conductor 27 and the first wiring conductor 21b. With such a configuration, the first wiring conductor 21b and the second wiring conductor 27 can be connected in a state having high connection reliability so as to penetrate the cladding portion 22a. As a result, it is possible to easily manufacture the opto-electrical wiring board 200 having excellent optical signal and electric signal transmission properties. That is, when the optical waveguide 22 is formed on the first substrate 21, the step of separately forming the insulating layer is simplified by using the cladding portion 22a as the insulating layer even in the region where the first wiring conductor 21b is disposed. The However, since the cladding portion 22a is made of a material suitable for optical transmission together with the core portion 22b, the adhesion to the wiring conductor is often low. Therefore, by using the metal bump 22c, the connection reliability between the first wiring conductor 21b and the second wiring conductor 27 can be improved.

  The metal bump 24 is formed of a metal material such as gold, silver, copper, or solder. Further, the metal bump 24 has a spherical or columnar shape. For example, solder balls or stud bumps are applied as the metal bumps 24.

  In addition, the wiring board 26 has a through hole 26 a at a position located above the mirror portion 24. The photoelectric conversion element 28 mounted on the wiring board 26 and the mirror part 24 are optically connected through the through hole 26a. With such a configuration, the photoelectric conversion element 28 and the mirror unit 24 can be brought close to each other, and the optical waveguide 22 and the photoelectric conversion element 28 can be optically coupled with low loss. Further, the through hole 26 a may be filled with a translucent resin having light transmissivity with respect to light transmitted between the photoelectric conversion element 28 and the mirror portion 24. As such a translucent resin, for example, an epoxy resin or a silicone resin can be used.

  The through hole 26 a may be formed by laser processing or the like after the wiring board 26 is disposed on the optical waveguide 22. Alternatively, the through hole 26 a may be formed in the wiring substrate 26 in advance, and the wiring substrate 26 may be disposed on the optical waveguide 22 so that the through hole 26 a and the mirror portion 24 face each other.

  Further, as shown in FIG. 9, the second wiring conductor 27 may be electrically connected to a semiconductor element 29 for driving the photoelectric conversion element 28.

  A method for manufacturing the optoelectric wiring board 200 of the second embodiment will be described below.

  First, as shown in FIG. 10, a metal layer is processed on the upper surface (first surface) of the first substrate 21 by using a photolithography technique or the like to produce the first wiring conductor 21 b and the alignment mark 23. Thereafter, an optical waveguide 22 having a layered clad portion 22a and a strip-shaped core portion 22b disposed therein is formed on the upper surface of the first substrate 21. The optical waveguide 22 may be formed with the alignment mark 23 as a reference. That is, when the core portion 22b of the optical waveguide 22 is formed, the core portion 22b is formed in a desired position at a desired position with the alignment mark 23 as a reference. Thereby, the mirror part 24 and the optical waveguide 22 which will be described later can be favorably optically connected.

  In the example of FIG. 10, the clad portion 22 a is disposed on the alignment mark 23, but the clad portion 22 a may not cover the alignment mark 23.

  Next, as shown in FIG. 11, a part of the optical waveguide 22 is cut out with the alignment mark 23 as a reference to form a mirror portion 24 having an inclined surface. The light reflectivity may be increased by depositing a metal layer on the inclined surface of the mirror portion 24 by plating or the like.

  Further, a through hole is formed in a portion of the clad portion 22a located above the first wiring conductor 21a. Such a through hole can be produced by performing exposure and development using a photosensitive resin as the cladding 22a, or by laser processing.

  Next, as shown in FIG. 12, the metal bump 22c is placed on the first wiring conductor 21a in the through hole of the clad portion 22a. Then, as shown in FIG. 14, the wiring board 26 having the second wiring conductor 27 on the surface is placed on the metal bump 22 c and the mirror part 24, and the first wiring conductor 21 a and the second wiring conductor 27 are connected. The metal bumps 22c are electrically connected.

  Alternatively, after the step shown in FIG. 11, the step shown in FIG. 13 may be performed instead of the step shown in FIG. In this case, as shown in FIG. 13, a wiring board 26 having a second wiring conductor 27 on the surface is prepared, and metal bumps 22 c are connected on the second wiring conductor 27. Then, as shown in FIG. 14, the wiring board 26 is placed on the clad portion 22a and the mirror portion 24, and the metal bump 22c is inserted into the through hole of the clad portion 22a. Then, the inserted metal bump 22c and the first wiring conductor 21a are connected.

  After the steps of FIGS. 12 and 14, or after the steps of FIGS. 13 and 14, as shown in FIG. 15, a through hole 26a is formed in a portion located above the mirror portion 24 of the wiring board 26. The through hole 26a may be a groove that divides the wiring board 26a as shown in FIG. Such a through hole 26a is produced by performing exposure and development using a photosensitive resin as the wiring substrate 26, or by laser processing. When a photosensitive resin is used as the wiring board 26, when the through hole 26a is formed in the wiring board 26, damage to the surface of the mirror part 24 can be reduced, and the light reflection efficiency of the mirror part 24 can be maintained high. .

  As described above, after the mirror portion 24 is formed in the optical waveguide 22 with the alignment 23 as a reference, the through-hole 26a is formed in the wiring board 26 with the alignment 23 as a reference again. It becomes possible to reduce the loss of the optical signal in the substrate 200. That is, by providing the above steps, the positional accuracy of the photoelectric conversion element 28 mounted on the optoelectric wiring board 200, the through hole 26a of the wiring board 26, the mirror part 24, and the core part 22b of the optical waveguide 22 is increased. It becomes possible.

  After producing the optoelectronic wiring board 200 as described above, the light receiving part or the light emitting part of the photoelectric conversion element 28 (that is, the light receiving part of the light receiving element or the light emitting part of the light emitting element) is opposed to the mirror part 24. The photoelectric conversion element 28 is disposed on the wiring board 26. As a result, the electronic device 201 shown in FIGS. 8 and 9 is obtained.

  When the photoelectric conversion element 28 is arranged on the wiring board 26, the photoelectric conversion element 28 may be arranged on the wiring board 26 with the alignment mark 23 as a reference. In this case, the positional accuracy between the photoelectric conversion element 28 and the mirror unit 24 is further improved, and the optical loss of the electronic device 201 can be further reduced.

  Note that the present invention is not limited to the present embodiment, and various modifications and improvements can be made without departing from the spirit of the present invention.

Reference numerals 1, 2: 1: First substrate 2, 22: Optical waveguide 2a, 22a: Clad portion 2b, 22b: Core portion 3, 23: Alignment mark 4, 24: Mirror portion 6: Insulating layer 7: Wiring conductor 21b: First wiring Conductor 26: Wiring substrate 27: Second wiring conductor 8, 28: Photoelectric conversion element (light receiving element or light emitting element)
100, 200: Optoelectric wiring board 101, 201: Electronic device

Claims (10)

Preparing a first substrate having a first surface and having an optical waveguide and an alignment mark on the first surface;
A second step of forming a mirror portion in the optical waveguide with reference to the alignment mark;
A third step of forming an insulating layer on the optical waveguide and the mirror part;
And a fourth step of forming a through hole in a portion of the insulating layer located above the mirror portion with reference to the alignment mark.   The said 1st process is a process of producing the said 1st board | substrate by forming the said optical waveguide on the basis of the said alignment mark after forming the said alignment mark in the said 1st surface. Manufacturing method of the optoelectric wiring board.   The method of manufacturing an optoelectric wiring board according to claim 1, further comprising a step of forming a wiring conductor on the insulating layer after the third step or after the fourth step.   The method of manufacturing an optoelectric wiring board according to claim 3, wherein the step of forming the wiring conductor is a step of forming the wiring conductor based on the alignment.   The method for manufacturing an optoelectronic wiring board according to claim 1, wherein a photosensitive resin is used as the insulating layer. Preparing a first substrate having a first surface and having an optical waveguide, a first wiring conductor and an alignment mark on the first surface;
A second step of forming a mirror portion in the optical waveguide with reference to the alignment mark;
A third step of placing a wiring board having a second wiring conductor on a surface thereof on the first wiring conductor and the mirror portion and electrically connecting the first wiring conductor and the second wiring conductor;
And a fourth step of forming a through hole in a portion of the wiring board located above the mirror portion with reference to the alignment mark.   The said 1st process is a process of producing the said 1st board | substrate by forming the said optical waveguide on the basis of the said alignment mark after forming the said alignment mark in the said 1st surface. Manufacturing method of the optoelectric wiring board.   8. The light receiving element or the light emitting element so that a light receiving part of the light receiving element or a light emitting part of the light emitting element faces the mirror part after the optoelectric wiring board is manufactured by the manufacturing method according to claim 1. A method of manufacturing an electronic device, comprising a disposing step of disposing a substrate on the photoelectric wiring board.   The method of manufacturing an electronic device according to claim 8, wherein the arranging step is a step of arranging the light receiving element or the light emitting element on the photoelectric wiring board with the alignment mark as a reference. A first substrate having a first surface and having a first wiring conductor on the first surface;
A clad portion that is located on the first substrate and has a through hole in a portion above the first wiring conductor;
A core portion located inside the cladding portion and extending along the first surface;
A mirror part located on an extension of the core part;
A wiring board having a second wiring conductor on the surface and positioned on the clad portion;
An optoelectric wiring board that is located in the through hole and includes a metal bump that electrically connects the first wiring conductor and the second wiring conductor.