JP2017119345A - Combined processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve acceleration of processing by performing laser processing and mechanical processing continuously or in parallel.SOLUTION: A combined processing process comprises: a laser processing process in which an irradiation position of laser beam at which a work-piece including at least CFRP, GFRP or GMT is processed and a processing position of a tool for processing the work-piece are moved according to a prescribed movement reference, and the work-piece is processed with laser beam; and a mechanical processing process in which a position of the work-piece processed with laser beam is processed by the tool subsequently to the laser processing process. In the laser processing process, cutting of the work-piece and boring of a hole are roughly processed with laser beam, and in the mechanical processing process, a cut surface of the work-piece and an opening edge of the hole, which are processed with laser beam, are finished.SELECTED DRAWING: Figure 9

Description

  The present invention relates to a combined processing method for performing combined processing using both a laser processing head and a machining head.

  Conventionally, for example, a combined processing apparatus (combined processing machine) described in Patent Document 1 selectively performs laser processing or machining on a workpiece. Specifically, this combined processing apparatus includes a laser processing head that irradiates a laser beam that processes a workpiece using a side pump type fiber laser that excites the laser by entering a laser from the side surface of the optical fiber, and a workpiece. Alternatively, the machining head having a spindle for mounting a tool for grinding, the optical axis of the laser beam of the laser machining head, and the spindle of the machining head are parallel to each other, and the relative movement between the two heads is prevented. A headstock for fixing both heads to the head, a work table, a table provided so as to move relative to the headstock, a laser beam focusing position of the laser processing head, and measurement of the work geometry A measuring means, a current position detecting device for detecting a current position of relative movement of the headstock and the table in the X, Y, and Z axes; Measuring means having a CCD camera for capturing reflected light from the work surface of the measuring beam projected through the same condenser lens as the laser beam of the laser beam, and attaching a tool to the spindle of the machining head The laser processing and the machining can be switched depending on whether the laser beam output of the laser processing head is turned off or the tool is removed from the spindle and the laser beam output is turned on.

  The combined machining apparatus described in Patent Document 1 achieves the following effects. Switching between laser machining and machining can be performed quickly by attaching / detaching a tool to / from the spindle of the machining head or turning on / off the laser beam output of the laser machining head. Further, since the optical axis does not fluctuate without performing the centering of the optical axis of the laser beam at the time of switching, laser processing can be started immediately, and the operating rate of the machine increases. In addition, the absence of shake of the optical axis means that highly accurate processing can be performed, and is particularly suitable for fine processing. In addition, by appropriately setting the positional relationship between the laser processing head and the machining head in the Z-axis direction and the positional relationship in the XY plane, the workpiece and the laser processing head or the machining head can be moved during laser processing or machining. There is no collision.

Japanese Patent No. 4721844

  The composite processing apparatus described in Patent Document 1 described above is premised on switching between laser processing and machining, and speeds up the processing by quickly performing this switching. However, in recent years, further speeding-up of processing has been demanded, and it is anxious to perform laser processing and machining continuously or in parallel without switching between laser processing and machining.

  The present invention solves the above-described problems, and an object of the present invention is to provide a composite processing method capable of increasing the processing speed by continuously or concurrently performing laser processing and machining.

  In order to achieve the above-described object, a composite machining method according to a first invention includes a laser irradiation position for machining a workpiece including at least CFRP, GFRP, or GMT, and a machining position of a tool for machining the workpiece. Are moved in accordance with a predetermined movement reference, and the workpiece is machined by the laser, and the position of the workpiece machined by the laser is machined by the tool following the laser machining step. A machining step, wherein the laser machining step roughly cuts the workpiece or penetrates a hole by the laser, and the machining step comprises the step of machining the workpiece processed by the laser. The cutting surface portion or the opening edge of the hole is finished with the tool.

  According to this combined machining method, machining time is required for machining by performing the machining process following the laser machining process while moving the laser irradiation position and the machining position of the tool based on a predetermined movement reference. Processing is performed by laser processing, and each process of performing machining as the finishing is continuously performed based on a predetermined movement reference. For this reason, it is possible to increase the processing speed. Especially in machining of composite materials, the tool is consumed heavily and the running cost is high in machining. However, since laser machining is performed first and machining is performed as the finishing, the tool life is extended and the running cost is increased. Can be reduced. Moreover, in the processing of composite materials, the processing surface becomes rough only by laser processing, but since rough processing is first performed by laser and machining is performed as the finishing, high-quality processing can be performed at high speed. .

  In order to achieve the above-described object, a composite machining method according to a second invention includes a laser irradiation position for machining a workpiece including at least CFRP, GFRP, or GMT, and a machining position of a tool for machining the workpiece. Are moved in accordance with a predetermined movement reference, and the workpiece is machined by the laser, and the position of the workpiece machined by the laser is machined by the tool following the laser machining step. The laser processing step includes heat that is obtained by thermally altering the workpiece by the laser in a pulse oscillation mode having a peak power of 1 kW to 30 kW and a pulse width of 10 microseconds to 100 milliseconds. A deteriorated layer is formed, and the machining step is characterized in that the position of the workpiece that has been thermally altered by the laser is processed by the tool.

  According to this combined machining method, machining time is required for machining by performing the machining process following the laser machining process while moving the laser irradiation position and the machining position of the tool based on a predetermined movement reference. Processing is performed by laser processing, and each process of performing machining as the finishing is continuously performed based on a predetermined movement reference. For this reason, it is possible to increase the processing speed. Especially in machining of composite materials, the tool is consumed heavily and the running cost is high in machining. However, since laser machining is performed first and machining is performed as the finishing, the tool life is extended and the running cost is increased. Can be reduced. Moreover, by machining the workpiece after it has been thermally altered by laser heating, the machining resistance of machining can be lowered, the tool life of machining can be extended, the cost of the tool can be reduced, and The time required for tool change can be reduced, which can contribute to reduction of running cost and improvement of processing capacity per unit time.

  According to the present invention, laser processing and machining can be performed continuously or in parallel to increase the processing speed.

FIG. 1 is a configuration diagram of a combined machining apparatus according to Embodiment 1 of the present invention. FIG. 2 is a flowchart showing a processing procedure of the combined machining method according to the first embodiment of the present invention. FIG. 3 is a configuration diagram of the combined machining apparatus according to the second embodiment of the present invention. FIG. 4 is a configuration diagram of a laser processing head of the combined processing apparatus according to the second embodiment of the present invention. FIG. 5 is an explanatory diagram for explaining the operation of the laser machining head of the combined machining apparatus according to the second embodiment of the present invention. FIG. 6 is an explanatory diagram for explaining the operation of the laser machining head of the combined machining apparatus according to the second embodiment of the present invention. FIG. 7 is a process diagram showing a processing procedure of the combined machining method according to the second embodiment of the present invention. FIG. 8 is a process diagram showing a processing procedure of the combined machining method according to the second embodiment of the present invention. FIG. 9 is a process diagram showing a processing procedure of the combined machining method according to the second embodiment of the present invention. FIG. 10 is a process diagram showing a processing procedure of the combined machining method according to the second embodiment of the present invention. FIG. 11 is a process diagram illustrating a processing procedure of the combined machining method according to the second embodiment of the present invention. FIG. 12 is a process diagram showing a processing procedure of the combined machining method according to the second embodiment of the present invention. FIG. 13 is a process diagram illustrating a processing procedure of the combined machining method according to the second embodiment of the present invention. FIG. 14 is a process diagram showing a processing procedure of the combined machining method according to the second embodiment of the present invention. FIG. 15 is a configuration diagram of a combined machining apparatus according to Embodiment 3 of the present invention. FIG. 16 is a process diagram showing a processing procedure of the combined machining method according to the third embodiment of the present invention. FIG. 17 is a process diagram showing the processing procedure of the combined machining method according to the third embodiment of the present invention. FIG. 18 is a process diagram showing a processing procedure of the combined machining method according to the third embodiment of the present invention. FIG. 19 is a process diagram showing a processing procedure of the combined machining method according to the third embodiment of the present invention. FIG. 20 is a process diagram showing the processing procedure of the combined machining method according to the fourth embodiment of the present invention.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the constituent elements described below can be appropriately combined.

[Embodiment 1]
FIG. 1 is a configuration diagram of a combined machining apparatus according to the present embodiment, and FIG. 2 is a flowchart showing a processing procedure of a combined machining method according to the present embodiment.

  As shown in FIG. 1, the combined machining apparatus 1 includes a workpiece support mechanism 2 and a head support mechanism 3.

  The workpiece support mechanism 2 supports the workpiece W with respect to the fixed frame 1 a of the composite processing apparatus 1. In the present embodiment, the workpiece support mechanism 2 includes, for example, a chuck portion 2a that fastens and fixes the periphery of the workpiece W placed on a mounting table that is a fixed frame 1a.

  Here, as the workpiece W of the present embodiment, CFRP (Carbon Fiber Reinforced Plastics), GFRP (Glass Fiber Reinforced Plastic), GMT (Glass Long Fiber Reinforced Plastic), etc., fiber reinforced plastic, steel plate Various metals such as iron alloys and aluminum alloys can be used, and in particular, composite materials including CFRP and GFRP are applied. Further, the workpiece W may be a member made of Inconel, Hastelloy, stainless steel, ceramic, steel, carbon steel, ceramics, silicon, titanium, tungsten, resin, plastics, glass, or the like.

  The head support mechanism 3 supports the laser processing head H and the machining head M with respect to the fixed frame 1 a of the composite processing apparatus 1. In this embodiment, for example, the head support mechanism 3 supports the laser beam machining head H and the machining head M so as to be movable with respect to the horizontal beam that is the fixed frame 1a. The laser processing head H and the machining head M are supported.

  The moving mechanism 31 includes, for example, an X-axis moving mechanism, a Y-axis moving mechanism, and a Z-axis moving mechanism. In the X-axis moving mechanism of the moving mechanism 31, a pair of X-axis rails 31a extending in the X-axis direction (left-right direction in FIG. 1) are fixed in parallel to the lower part of the horizontal beam that is the fixed frame 1a. . In the X-axis moving mechanism, the Y-axis rail 31b extending in the Y-axis direction (depth direction in FIG. 1) orthogonal to the pair of X-axis rails 31a is extended from the pair of X-axis rails 31a. It is provided to be movable in the X-axis direction along the direction.

  The Y-axis moving mechanism of the moving mechanism 31 is provided such that the Y-axis moving member 31c is movable in the Y-axis direction along the extending direction of the pair of Y-axis rails 31b.

  The Z-axis moving mechanism of the moving mechanism 31 includes a Y-axis moving member 31c provided with a Z-axis support member 31d, and the Z-axis extending in the Z-axis direction (vertical direction in FIG. 1) with respect to the Z-axis support member 31d. A pair of rails 31e are fixed in parallel. The Z-axis moving mechanism is provided such that the Z-axis moving member 31f is movable in the Z-axis direction along the extending direction of the pair of Z-axis rails 31e. And the laser processing head H and the machining head M are installed with respect to this Z-axis moving member 31f.

  That is, the moving mechanism 31 moves the laser machining head H and the machining head M in the X-axis direction by the X-axis movement mechanism, and moves the laser machining head H and the machining head M in the Y-axis direction by the Y-axis movement mechanism. The laser processing head H and the machining head M are moved in the Z-axis direction by the Z-axis moving mechanism.

  The laser processing head H irradiates the laser L output by the laser processing head drive unit (laser output device). Since this laser processing head H is installed with respect to the Z-axis moving member 31f together with the machining head M, cooling is performed in order to suppress heat transfer from the machining head M (for example, about 50 [° C.]). Means 4 are provided. In the present embodiment, the cooling means 4 is configured as a water-cooled type in which a cooling water pipe for supplying cooling water is arranged inside the laser processing head H as shown in FIG. Further, when using a composite material as the workpiece W, the laser processing head H includes an assist gas supply unit 5 in order to suppress combustion of the composite material. For example, as shown in FIG. 1, the assist gas supply means 5 supplies an assist gas (for example, nitrogen or argon) coaxially with the laser L from a gas supply pipe arranged on the side of the laser processing head H, Although not clearly shown in the figure, there is one that injects assist gas to a portion of the workpiece W irradiated with the laser L.

  In the present embodiment, the machining head M performs finishing by laser cutting after laser processing, and an end mill E as a cutting tool is applied. The machining head M includes a drive source such as a motor that rotates the end mill E. Further, in the machining head M, when the workpiece W is a composite material, the composite material is altered by the oil on the spindle or sliding surface being transmitted to the tool (end mill E) and adhering to the workpiece W. In order to prevent the situation, a seal structure is provided as appropriate.

  The combined machining apparatus 1 according to the present embodiment includes a laser L irradiation position for machining the workpiece W and a workpiece W for the laser machining head H and the machining head M installed on the Z-axis moving member 31f. The processing position of the tool (end mill E) for processing is arranged in accordance with a predetermined movement reference. Specifically, in the present embodiment, the irradiation position of the laser L that processes the workpiece W and the processing position of the tool that processes the workpiece W are matched with the X-axis direction that is a linear movement reference. The laser processing head H and the machining head M are installed with respect to the Z-axis moving member 31f. For this reason, the laser processing head H and the machining head M are moved by the X-axis moving mechanism of the moving mechanism 31 in advance, for example, in the direction of arrow A in FIG. Subsequently, the machining head M moves in the X-axis direction.

  Moreover, the composite processing apparatus 1 of this embodiment cuts the plate-shaped workpiece W by moving the laser processing head H in the X-axis direction. In this case, there is a possibility that the machining will be hindered by coming into contact with a cut piece of the workpiece W after the tool of the machining head M has been cut. Therefore, in the combined machining apparatus 1 of the present embodiment, the workpiece W cut by the laser L in the laser machining head H is interposed between the laser machining head H and the machining head M with respect to the Z-axis moving member 31f. It has the contact part 6 which can press-contact with a cut piece. The contact portion 6 is configured as a roller, and a pressing force is applied below the laser L processing position of the laser processing head H so as to press the cut piece in the Z-axis direction (lower side in FIG. 1). It is attached to the Z-axis moving member 31f in the form.

  Moreover, since the machining head M is accompanied by vibration when the machining head M rotates or processes the workpiece W, the combined machining apparatus 1 of the present embodiment has a laser beam to suppress transmission of the vibration to the laser machining head H. A vibration isolating member 7 made of a rubber material or the like is disposed between the processing head H and the machining head M. FIG. 1 shows a form in which the vibration isolating member 7 is arranged between the Z-axis moving member 31 f where the laser processing head H and the machining head M are arranged and the laser processing head H. In addition, the vibration isolating member 7 may be disposed between the Z-axis moving member 31f and the machining head M. When the laser processing head H is attached to the machining head M arranged on the Z-axis moving member 31f, the vibration isolating member 7 is interposed at the attachment portion between the machining head M and the laser processing head H.

  Further, in the combined machining apparatus 1 of the present embodiment, machining waste is generated in machining by the machining head M, and when the machining waste adheres to the tool of the machining head M, the tool is damaged and the durability of the tool is lowered. If there is a possibility that the processing waste adheres to the lens of the laser processing head H, the optical system of the laser L may be damaged and the durability of the optical system may be reduced. For this reason, in the combined machining apparatus 1 of the present embodiment, a blower (for example, a nozzle for injecting air or gas and an air supply source (not shown)) 8a for blowing air toward the machining position of the tool in the machining head M, the machine A suction portion (for example, a suction fan) 8b that sucks toward the processing position of the tool in the processing head M is provided. For this reason, the processing waste generated in the processing by the machining head M is not blown off by the blower 8a and attached to the tool of the machining head M or the lens of the laser processing head H. Further, machining waste generated in machining by the machining head M or machining waste blown by the blower 8a is not sucked by the suction portion 8b and attached to the tool of the machining head M or the lens of the laser machining head H. . Although not clearly shown in the figure, the suction part 8b is preferably connected to a filter via a duct on the downstream side of the suction and configured to collect the processing waste. Further, only one of the air blowing part 8a and the suction part 8b may be provided.

  Further, the combined machining apparatus 1 includes a control device 9. The control device 9 controls the driving of the laser processing head H, the driving of the machining head M, and the movement by the moving mechanism 31, and includes a control unit 91, a storage unit 92, an input unit 93, a display unit 94, A laser processing head driving unit (laser output device) 95, a machining head driving unit 96, and a head moving unit 97 are included.

  The control unit 91 is, for example, a CPU (Central Processing Unit), receives an input from the input unit 93 and an input of data from the storage unit 92, and in response to the input, the laser processing head driving unit 95, the machine Commands are output to the machining head drive unit 96 and the head moving unit 97. The storage unit 92 is, for example, a hard disk device or a semiconductor storage device. The storage unit 92 includes a workpiece database 92a. The workpiece database 92a stores design information (for example, the shape and material of the workpiece W) based on the machining of the workpiece W. The storage unit 92 may be connected to the control unit 91 through a communication line (for example, a data server). The input unit 93 includes a keyboard and a mouse. The display unit 94 has a screen. The content input from the input unit 93 to the screen, the content input from the storage unit 92, the driving status of the laser processing head H by the laser processing head driving unit 95, the machine The driving status of the machining head M by the machining head drive unit 96 and the movement status of the laser machining head H and the machining head M by the head moving unit 97 are displayed.

  The laser processing head drive unit 95 is a device that outputs a laser L. The laser processing head driving unit 95 can use a fiber laser output device that outputs a laser L using an optical fiber as a medium or a short pulse laser output device that outputs a short pulse laser L. As the fiber laser output device, a Fabry-Perot fiber laser output device or a ring type fiber laser output device is excited. The fiber laser output device may use either a continuous wave operation or a pulsed oscillation (plused operation) method. As the fiber of the fiber laser output device, for example, silica glass added with rare earth elements (Er, Nd, Yb) can be used. A short pulse is a pulse having a pulse width of 100 picoseconds or less. As a generation source of the laser L of the short pulse laser output device, for example, a titanium sapphire laser can be used. The laser processing head drive unit 95 controls the output of the laser L based on a command from the control unit 91. In the present embodiment, the thickness of the workpiece W, which is a plate-shaped composite material, is 1 [in] or less (preferably 1/2 [in] or less), and the wavelength of the laser L is 1.0 [μm] to An infrared light of 1.1 [μm] (which may be visible light or ultraviolet light) is applied, and the output of the laser L is set to 100 [W] to 50 [kW]. In this case, the assist gas pressure is preferably 0.1 [MPa] to 1.0 [MPa].

  The machining head drive unit 96 controls the rotation speed of the tool based on a command from the control unit 91.

  The head moving unit 97 controls the movement of the laser processing head H based on a command from the control unit 91. In the present embodiment, the thickness of the workpiece W, which is a plate-shaped composite material, is 1 [in] or less (preferably 1/2 [in] or less), and the spindle taper of the machining head M (attachment for attaching a tool) The size of the tool (arbor) is 40 or more, and the spindle output is 15 [kW] or more.

  Hereinafter, the processing procedure of the combined machining method according to the present embodiment will be described with reference to FIG. As shown in FIG. 2, the control unit 91 acquires design information of the workpiece W to be machined from the workpiece database 92a of the storage unit 92 according to the input from the input unit 93 (step S1). Next, the control unit 91 determines, from the design information of the workpiece W, the position of the workpiece W to be processed, the output of the laser L by the laser processing head H, the rotational speed of the tool by the machining head M, the laser Processing conditions such as the moving speed (processing time) of the processing head H and the machining head M are determined (step S2). Next, the control unit 91 outputs a command to the laser processing head driving unit 95, the machining head driving unit 96, and the head moving unit 97 based on the determined processing conditions to perform processing (step S3).

  In step S2, the control unit 91 sets the laser processing head H to the front side in the movement direction as shown in FIG. 1, and moves the laser processing head H and the machine in the X-axis direction (arrow A direction in FIG. 1) as a linear movement reference. Processing conditions are determined so that the processing head M is moved. For this reason, in step S3, the irradiation position of the laser L for processing the workpiece W and the processing position of the tool for processing the workpiece W are slid in accordance with a linear movement reference, and laser processing is continued. The position of the workpiece W processed by the laser L is processed by a tool. Thereby, the workpiece W is continuously cut by the laser L while the cut portion is finished by the tool.

  As described above, the combined machining method of the present embodiment moves the irradiation position of the laser L for machining the workpiece W and the machining position of the tool for machining the workpiece W according to a predetermined movement reference, A laser processing step of processing the workpiece W by the laser L, and a machining step of processing the position of the workpiece W processed by the laser L with a tool following the laser processing step.

  According to this combined machining method, machining time is reduced in machining by performing the machining process following the laser machining process while the irradiation position of the laser L and the machining position of the tool move based on a predetermined movement reference. Such processing is performed by laser processing, and each step of performing machining as the finishing is continuously performed based on a predetermined movement reference. For this reason, it is possible to increase the processing speed. Especially in machining of composite materials, the tool is consumed heavily and the running cost is high in machining. However, since laser machining is performed first and machining is performed as the finishing, the tool life is extended and the running cost is increased. Can be reduced.

  In the combined machining method of the present embodiment, the laser L irradiation position for machining the workpiece W and the machining position of the tool for machining the workpiece W are slid in accordance with a linear movement reference.

  According to the combined machining method, the workpiece W is cut by performing a machining process while performing a laser machining process. For this reason, the workpiece W can be cut at a high speed.

  In the combined machining method of the present embodiment, the laser machining step roughly processes the workpiece W with the laser L, and the machining step finishes the position of the workpiece W machined with the laser L with a tool. .

  According to this composite processing method, the processing surface of the composite material is roughened only by laser processing, but the rough processing is first performed by the laser L, and the machining is performed as the finishing, so that high quality processing is performed. Can be performed at high speed.

  Further, the combined machining apparatus 1 of the present embodiment includes a laser machining head H that irradiates a laser L for machining the workpiece W, a machining head M having a tool for machining the workpiece W, and a laser machining head H. The laser processing head H and the machining head M are integrally supported by matching the irradiation position of the laser L and the machining position of the tool in the machining head M with a predetermined movement reference, and based on the movement reference H And a moving mechanism 31 for moving the machining head M.

  According to this combined machining apparatus 1, the irradiation position of the laser L for machining the workpiece W and the machining position of the tool for machining the workpiece W are moved in accordance with a predetermined movement reference, and the laser L applies the workpiece. Implementing the combined machining method of the present embodiment in which a laser machining process for machining the workpiece W and a machining process for machining the position of the workpiece W machined by the laser L using a tool following the laser machining process. Is possible. In other words, by performing the machining process following the laser machining process, machining that takes a long time in machining is performed by laser machining, and each process that performs machining as its finishing is continuously performed according to a predetermined movement reference. Do it. For this reason, it is possible to increase the processing speed. Especially in machining of composite materials, the tool is consumed heavily and the running cost is high in machining. However, since laser machining is performed first and machining is performed as the finishing, the tool life is extended and the running cost is increased. Can be reduced.

  Further, in the combined machining apparatus 1 of the present embodiment, the moving mechanism 31 is configured so that the laser machining head H and the laser L irradiation position in the laser machining head H and the machining position of the tool in the machining head M are matched with a linear movement reference. The machining head M is supported integrally, and the laser machining head H and the machining head M are slid along the linear movement reference.

  According to the composite processing apparatus 1, the workpiece W is cut by performing machining while performing laser processing. For this reason, the workpiece W can be cut at a high speed.

  In the combined machining apparatus 1 of the present embodiment, the laser machining head H is disposed on the front side in the moving direction during machining, and the laser L in the laser machining head H is interposed between the laser machining head H and the machining head M. It has the contact part 6 which can press-contact with the cut piece of the cut workpiece W. As shown in FIG.

  According to this combined processing apparatus 1, the workpiece W cut by the laser L and then cut by the tool of the machining head M is pressed by pressing the cut piece cut by the laser L by the contact portion 6. It is possible to prevent a situation in which the cutting piece is touched and hinders machining.

  In the combined machining apparatus 1 of the present embodiment, the vibration isolation member 7 is disposed between the laser machining head H and the machining head M.

  According to this combined machining apparatus 1, in order to suppress the situation where the vibration of the machining head M is transmitted to the laser machining head H, the influence of the laser machining due to the vibration (for example, the accuracy of the irradiation position of the laser L is reduced) is suppressed. It becomes possible to do.

  Moreover, the combined machining apparatus 1 of the present embodiment includes a blower unit 8a that blows air toward the machining position of the tool in the machining head M.

  According to the combined machining apparatus 1, machining dust generated in machining by the machining head M is blown off by the blower 8a, thereby preventing a situation where the machining dust is attached to the tool of the machining head M or the lens of the laser machining head H. For this reason, the processing waste adheres to the tool of the machining head M and damages the tool to reduce the durability of the tool, or the processing waste adheres to the lens of the laser processing head H and damages the optical system of the laser L. It is possible to prevent a situation in which the durability of the battery deteriorates.

  Further, the combined machining apparatus 1 of the present embodiment includes a suction portion 8b that sucks toward the machining position of the tool in the machining head M.

  According to this combined machining apparatus 1, machining dust generated in machining by the machining head M is sucked by the suction portion 8b, thereby preventing a situation where the scrap is attached to the tool of the machining head M or the lens of the laser machining head H. . For this reason, the processing waste adheres to the tool of the machining head M and damages the tool to reduce the durability of the tool, or the processing waste adheres to the lens of the laser processing head H and damages the optical system of the laser L. It is possible to prevent a situation in which the durability of the battery deteriorates.

[Embodiment 2]
FIG. 3 is a block diagram of the combined machining apparatus according to the present embodiment, FIG. 4 is a block diagram of a laser machining head of the combined machining apparatus according to the present embodiment, and FIGS. 5 and 6 illustrate the embodiment. FIG. 7 to FIG. 14 are process diagrams showing a processing procedure of the composite processing method according to the present embodiment.

  As shown in FIG. 3, the combined machining apparatus 1 includes a workpiece support mechanism 2 (see FIG. 7) and a head support mechanism 3.

  The workpiece support mechanism 2 supports the workpiece W with respect to the fixed frame 1 a of the composite processing apparatus 1. In the present embodiment, the workpiece support mechanism 2 is, for example, as shown in FIG. 7, a chuck portion 2 a that tightens and fixes the periphery of the workpiece W placed on a mounting table that is a fixed frame 1 a. Have

  Here, as the workpiece W of the present embodiment, CFRP (Carbon Fiber Reinforced Plastics), GFRP (Glass Fiber Reinforced Plastic), GMT (Glass Long Fiber Reinforced Plastic), etc., fiber reinforced plastic, steel plate Various metals such as iron alloys and aluminum alloys can be used, and in particular, composite materials including CFRP and GFRP are applied. Further, the workpiece W may be a member made of Inconel, Hastelloy, stainless steel, ceramic, steel, carbon steel, ceramics, silicon, titanium, tungsten, resin, plastics, glass, or the like.

  The head support mechanism 3 supports the laser processing head H and the machining head M with respect to the fixed frame 1 a of the composite processing apparatus 1. In this embodiment, for example, the head support mechanism 3 supports the laser beam machining head H and the machining head M so as to be movable with respect to the horizontal beam that is the fixed frame 1a. The laser processing head H and the machining head M are supported.

  The moving mechanism 31 includes, for example, an X-axis moving mechanism, a Y-axis moving mechanism, and a Z-axis moving mechanism. In the X-axis moving mechanism of the moving mechanism 31, a pair of X-axis rails 31a extending in the X-axis direction (left-right direction in FIG. 3) are fixed in parallel to the lower part of the horizontal beam that is the fixed frame 1a. . In the X-axis moving mechanism, the Y-axis rail 31b extending in the Y-axis direction (the depth direction in FIG. 3) orthogonal to the pair of X-axis rails 31a extends from the pair of X-axis rails 31a. It is provided to be movable in the X-axis direction along the direction.

  The Y-axis moving mechanism of the moving mechanism 31 is provided such that the Y-axis moving member 31c is movable in the Y-axis direction along the extending direction of the pair of Y-axis rails 31b.

  The Z-axis moving mechanism of the moving mechanism 31 includes a Y-axis moving member 31c provided with a Z-axis support member 31d, and a Z-axis direction (the vertical center in FIG. A pair of Z-axis rails 31e extending in the extending direction S is fixed in parallel. The Z-axis moving mechanism is provided such that the Z-axis moving member 31f is movable in the Z-axis direction along the extending direction of the pair of Z-axis rails 31e. And the laser processing head H and the machining head M are installed with respect to this Z-axis moving member 31f.

  That is, the moving mechanism 31 moves the laser machining head H and the machining head M in the X-axis direction by the X-axis movement mechanism, and moves the laser machining head H and the machining head M in the Y-axis direction by the Y-axis movement mechanism. The laser processing head H and the machining head M are moved in the Z-axis direction by the Z-axis moving mechanism.

  The laser processing head H irradiates the laser L output by the laser processing head drive unit (laser output device). Here, the configuration of the laser processing head H of the present embodiment will be described with reference to FIGS.

  The laser processing head H irradiates the workpiece W with a laser L output from an after-mentioned laser processing head drive unit 95 via an optical fiber F. The laser processing head H rotates the irradiation position on the workpiece W by rotating the optical axis of the optical path of the laser L about the axis S. That is, the laser processing head H moves the irradiation position of the laser L so as to draw a circle as shown in FIG.

  Specifically, the laser processing head H is formed in a cylindrical shape as a whole, and forms an optical system unit that guides the laser L output from the optical fiber F as shown in FIGS. In the optical system unit, a collimating optical system 101, a polarizing optical system 102, and a condensing optical system 103 are arranged on the optical path of the laser L in order from the optical fiber F side. That is, the laser L output from the optical fiber F passes through the collimating optical system 101, then passes through the polarizing optical system 102, passes through the condensing optical system 103, and is irradiated onto the workpiece W.

  The collimating optical system 101 includes a collimator lens and the like, and the laser L output from the optical fiber F is converted into parallel light. The polarization optical system 102 is an optical unit that shifts (polarizes) the optical path of the laser L by a certain distance from the center, and includes a first prism 102a and a second prism 102b. The first prism 102a refracts the laser L and tilts it with respect to the optical axis (axial center S). The second prism 102b controls the position where the laser L refracted by the first prism 102a is refracted again and condensed. As a result, as shown in FIG. 5, the laser L that has passed through the polarization optical system 102 is output in an optical path that is shifted from the optical path of the laser L before passing. The condensing optical system 103 includes a lens that condenses the laser L shifted from the optical axis (axial center S) by the polarizing optical system 102.

  The lenses of the collimating optical system 101 and the condensing optical system 103 are fixed lenses of the optical system unit, and are supported by the optical system support unit 104. The optical system support unit 104 also supports a fixing unit 105a of a rotation mechanism 105 described later.

  The rotation mechanism 105 is included in the moving mechanism 31 of the present embodiment, and is a mechanism that rotates the polarization optical system 102 around the optical path of the laser L before passing through the polarization optical system 102 as a rotation center. The rotation mechanism 105 includes a fixed portion 105a, a rotation portion 105b, and a bearing 105c. The fixing unit 105 a is fixed to the collimating optical system 101 and the condensing optical system 103. The rotating part 105b is supported so as to be rotatable around the optical axis (axis S) via a bearing 105c with respect to the fixed part 105a. The rotating part 105b is an aerial cylindrical member in which a part corresponding to the optical path of the laser L is a space. The rotating unit 105b supports the first prism 102a and the second prism 102b of the polarization optical system 102.

  In the rotation mechanism 105, the fixed portion 105a and the rotation portion 105b are provided so as to be relatively rotatable around the optical axis (axis S) with the above-described configuration. And the polarization optical system 102 can be rotated by rotating the rotation part 105b in the direction of arrow B in FIG. The rotation center of the rotation mechanism 105 overlaps with the optical axis (axial center S) of the optical path of the laser L before being polarized.

  The rotation mechanism 105 rotates the polarization optical system 102 around the optical axis (axial center S) of the optical path of the laser L before being polarized, so that the laser L on the workpiece W is shown in FIG. The irradiation position is moved in a circular shape with the optical axis (axial center S) of the optical path of the laser L before being polarized as the center and the distance polarized by the polarization optical system 102 as the radius from the center. it can. That is, the rotation mechanism 105 rotates the rotation unit 105b in the direction of arrow B in FIG. 4 to rotate the polarization optical system 102, thereby rotating the optical axis (axial center S) as shown in FIGS. The irradiation position i can be rotated in the direction of arrow B on the virtual circle V as the center.

  Further, the laser processing head H has an encoder 106. The encoder 106 is a rotation sensor that detects the rotation of the rotation unit 105 b of the rotation mechanism 105. The encoder 106 includes a detection unit 106a and a moving unit 106b. The detection unit 106 a is fixed to the fixing unit 105 a of the rotation mechanism 105. The moving unit 106b is fixed to the rotating unit 105b of the rotating mechanism 105 and rotates together with the rotating unit 105b. The moving unit 106b is provided with an identifier serving as a mark at a position in the rotation direction. The detecting unit 106a can detect the rotation of the moving unit 106b by detecting the identifier of the moving unit 106b, and thus the rotation mechanism 105 can detect the rotation of the rotating unit 105b relative to the fixed unit 105a. .

  Such a laser processing head H is supported by a frame 100 as shown in FIG. The frame 100 is formed in a cylindrical shape so as to accommodate the columnar laser processing head H. The frame 100 is fixed to the Z-axis moving member 31 f of the moving mechanism 31. The laser machining head H has a collimating optical system 101 and a condensing optical system 103 fixed to the frame 100, and a fixing part 105 a of a rotating mechanism 105 is also attached to the frame 100 in accordance with the collimating optical system 101 and the condensing optical system 103. It is fixed. The rotating portion 105b of the rotating mechanism 105 is supported between the frame 100 and the frame 100 via a bearing 100a so as to be rotatable about the optical axis (axial center S). That is, in the laser processing head H, the rotating portion 105 b of the rotating mechanism 105 is supported so as to be rotatable with respect to the frame 100, and other portions are fixed to the frame 100.

  Further, the laser processing head H includes a motor 107 that rotates the rotating portion 105 b in the rotating mechanism 105 that is the moving mechanism 31. As shown in FIG. 3, the motor 107 is provided on the collimating optical system 101 side of the laser processing head H, and is fixed to the frame 100. The output axis of the motor 107 is formed in a cylindrical shape centering on the optical axis (axial center S) of the optical path of the laser L, and is connected to the rotating part 105b of the rotating mechanism 105 while the collimating optical system 101 is disposed inside. ing. Therefore, the rotation of the output shaft of the motor 107 is transmitted to the rotating unit 105 b of the rotating mechanism 105 excluding the collimating optical system 101. Note that the drive source for rotating the rotating unit 105b of the rotating mechanism 105 is not limited to the motor 107. For example, although not explicitly shown in the drawing, the bearing 105c is a static pressure bearing (fluid bearing) and is rotated with the fixed unit 105a by a pump. The structure which rotates the rotation part 105b by supplying air to the closed space between the parts 105b may be sufficient. In addition, for example, although not explicitly shown in the drawing, the rotating portion 105b is a rotor, a stator fixed to the frame 100 is arranged around the rotor, and the rotor or the stator is a permanent magnet, while the stator or the rotor is wound with a coil and magnetized. By doing so, you may comprise so that the rotation part 105b may be rotated.

  Further, since the laser processing head H is installed with respect to the Z-axis moving member 31f together with the machining head M, in order to suppress heat transfer from the machining head M (for example, about 50 [° C.]), Cooling means 108 is provided. The cooling means 108 has a pump 108a and a connecting pipe 108b. The pump 108a supplies air to the inflow portion of the connecting pipe 108b. The connecting pipe 108b is a pipe that connects a closed space between the optical member and the optical member in the optical system unit to the closed space. The connection pipe 108b has an opening connected to the space in the vicinity of the optical member. Further, when the connecting pipe 108b is connected to the other space from the same space, each opening is formed at a position away from the same space (for example, the opposite side across the optical axis). The cooling means 108 can supply air to the connection pipe 108b with the pump 108a, thereby allowing the air to flow in a closed space between the optical member and cooling the optical member. The connecting pipe 108b is connected so as to form one flow path through a space closed by the entire optical system unit, and the air is supplied to the entire optical system unit by supplying air from one place by the pump 108a. Can flow.

  Further, when using a composite material as the workpiece W, the laser processing head H has an assist gas supply means 109 for suppressing the combustion of the composite material. For example, as shown in FIG. 4, the assist gas supply means 109 is coaxial with the laser L for assist gas (for example, nitrogen or argon) from a gas supply pipe disposed on the side of the condensing optical system 103 of the laser processing head H. Although not shown in the figure, there are those that inject assist gas into the portion of the workpiece W that is irradiated with the laser L.

  In the present embodiment, the machining head M performs a finishing process by cutting a laser machined part while performing laser machining, and a drill D and a chamfering cutter C as cutting tools are applied. And the machining head M has the rotation mechanism 110 which rotates the drill D and the chamfering cutter C, as shown in FIG. The rotation mechanism 110 is included in the movement mechanism 31 of this embodiment, and has a rotation part 110a. The rotating part 110a is formed in a cylindrical shape so as to cover the outside of the frame 100, and is supported between the frame 100 and the frame 100 via a bearing 100b so as to be rotatable about the optical axis (axial center S). A drill D is fixed to the rotating part 110a along the extending direction of the optical axis (axial center S). The drill D is formed in a cylindrical shape so that the laser L of the laser processing head H passes through the drill D. Further, a chamfering cutter C is fixed to a base portion of the drill D. The rotation mechanism 110 includes a motor 110b that rotates the rotation unit 110a. The motor 110 b is fixed to the Z-axis moving member 31 f of the moving mechanism 31 together with the frame 100. In the motor 110b, a gear 110c provided on an output shaft thereof meshes with a gear 110d provided on the rotating unit 110a. For this reason, rotation of the output shaft of the motor 110b is transmitted to the rotating unit 110a.

  Further, when the workpiece W is a composite material, the machining head M is combined with the bearing 100b of the rotating portion 110a of the rotating mechanism 110 and the oil on the sliding surface transmitted to the tool and adhered to the workpiece W. In order to prevent the material from deteriorating, a seal structure is provided as appropriate.

  The combined machining apparatus 1 according to the present embodiment includes an irradiation position of a laser L for machining a workpiece W with respect to a laser machining head H and a machining head M installed on a Z-axis moving member 31f via a frame 100. The processing positions of the tools (drill D and chamfering cutter C) for processing the workpiece W are arranged in accordance with a predetermined movement reference. Specifically, in the present embodiment, the laser L is applied so that the irradiation position of the laser L for processing the workpiece W and the processing position of the tool for processing the workpiece W meet the movement reference of the same axis S. A machining head H and a machining head M are installed with respect to the frame 100. For this reason, the laser processing head H and the machining head M are rotated about the axis S by the rotation mechanisms 105 and 110 which are the movement mechanisms 31, respectively.

  Moreover, since the machining head M is accompanied by vibration when the machining head M rotates or processes the workpiece W, the combined machining apparatus 1 of the present embodiment has a laser beam to suppress transmission of the vibration to the laser machining head H. A vibration isolating member 111 made of a rubber material or the like is disposed between the processing head H and the machining head M. FIG. 3 shows a form in which a vibration isolation member 111 is disposed between the frame 100 supporting the laser processing head H and the machining head M and the bearing 100a and between the bearing 100a and the laser processing head H. In addition, the vibration isolation member 111 may be disposed between the frame 100 and the bearing 100b and between the bearing 100b and the machining head M.

  Further, in the combined machining apparatus 1 of the present embodiment, machining waste is generated in machining by the machining head M, and when the machining waste adheres to the tool of the machining head M, the tool is damaged and the durability of the tool is lowered. If there is a possibility that the processing waste adheres to the lens of the laser processing head H, the optical system of the laser L may be damaged and the durability of the optical system may be reduced. For this reason, in the combined machining apparatus 1 of the present embodiment, a blower (for example, a nozzle for injecting air or gas and an air supply source (not shown)) 8a for blowing air toward the machining position of the tool in the machining head M, the machine A suction portion (for example, a suction fan) 8b that sucks toward the processing position of the tool in the processing head M is provided. For this reason, the processing waste generated in the processing by the machining head M is not blown off by the blower 8a and attached to the tool of the machining head M or the lens of the laser processing head H. Further, machining waste generated in machining by the machining head M or machining waste blown by the blower 8a is not sucked by the suction portion 8b and attached to the tool of the machining head M or the lens of the laser machining head H. . Although not clearly shown in the figure, the suction part 8b is preferably connected to a filter via a duct on the downstream side of the suction and configured to collect the processing waste. Further, only one of the air blowing part 8a and the suction part 8b may be provided.

  Further, the combined machining apparatus 1 includes a control device 9. The control device 9 controls the driving of the laser processing head H, the driving of the machining head M, and the movement by the moving mechanism 31, and includes a control unit 91, a storage unit 92, an input unit 93, a display unit 94, A laser processing head driving unit (laser output device) 95, a machining head driving unit 96, and a head moving unit 97 are included.

  The control unit 91 is, for example, a CPU (Central Processing Unit), receives an input from the input unit 93 and an input of data from the storage unit 92, and in response to the input, the laser processing head driving unit 95, the machine Commands are output to the machining head drive unit 96 and the head moving unit 97. The storage unit 92 is, for example, a hard disk device or a semiconductor storage device. The storage unit 92 includes a workpiece database 92a. The workpiece database 92a stores design information (for example, the shape and material of the workpiece W) based on the machining of the workpiece W. The storage unit 92 may be connected to the control unit 91 through a communication line (for example, a data server). The input unit 93 includes a keyboard and a mouse. The display unit 94 has a screen. The content input from the input unit 93 to the screen, the content input from the storage unit 92, the driving status of the laser processing head H by the laser processing head driving unit 95, the machine The driving status of the machining head M by the machining head drive unit 96 and the movement status of the laser machining head H and the machining head M by the head moving unit 97 are displayed.

  The laser processing head drive unit 95 is a device that outputs a laser L. The laser processing head driving unit 95 can use a fiber laser output device that outputs a laser L using an optical fiber as a medium or a short pulse laser output device that outputs a short pulse laser L. As the fiber laser output device, a Fabry-Perot fiber laser output device or a ring type fiber laser output device is excited. The fiber laser output device may use either a continuous wave operation or a pulsed oscillation (plused operation) method. As the fiber of the fiber laser output device, for example, silica glass added with rare earth elements (Er, Nd, Yb) can be used. A short pulse is a pulse having a pulse width of 100 picoseconds or less. As a generation source of the laser L of the short pulse laser output device, for example, a titanium sapphire laser can be used. The laser processing head drive unit 95 controls the output of the laser L based on a command from the control unit 91. In this embodiment, the thickness of the workpiece W, which is a composite material, is set to 1/4 [in] to 1 [in], and the wavelength of the laser L is 1.0 [μm] to 1.1 [μm] red. External light (which may be visible light or ultraviolet light) is applied, and the output of the laser L is set to 100 [W] to 50 [kW]. In this case, the assist gas pressure is preferably 0.1 [MPa] to 1.0 [MPa]. Further, the laser processing head drive unit 95 controls the rotation speed of the motor 107 (rotation speed of the laser L) that rotates the rotation unit 105b of the rotation mechanism 105 in the laser processing head H based on a command from the control unit 91. .

  The machining head drive unit 96 controls the rotation speed (tool rotation speed) of the motor 110 b of the rotation mechanism 110 in the machining head M based on a command from the control unit 91.

  The head moving unit 97 controls the movement of the laser processing head H based on a command from the control unit 91. In this embodiment, the thickness of the workpiece W, which is a composite material, is set to 1/4 [in] to 1 [in], and the spindle output is set to 15 [kW] or more.

  Hereinafter, the processing procedure of the combined machining method according to the present embodiment will be described with reference to FIGS. 2 and 7 to 14. Here, FIG. 7, FIG. 9, FIG. 11 and FIG. 13 show the operation of the combined machining apparatus 1, FIG. 8 is in FIG. 7, FIG. 10 is in FIG. 14 shows the processing state of the workpiece W in FIG.

  As shown in FIG. 2, the control unit 91 acquires design information of the workpiece W to be machined from the workpiece database 92a of the storage unit 92 according to the input from the input unit 93 (step S1). Next, the control unit 91 determines, from the design information of the workpiece W, the position of the workpiece W to be processed, the output of the laser L by the laser processing head H, the rotational speed of the tool by the machining head M, the laser Processing conditions such as the moving speed (processing time) of the processing head H and the machining head M are determined (step S2). Next, the control unit 91 outputs a command to the laser processing head driving unit 95, the machining head driving unit 96, and the head moving unit 97 based on the determined processing conditions to perform processing (step S3).

  In step S2, the control unit 91 irradiates the laser L from the laser processing head H as shown in FIG. 7, rotates the rotating unit 105b of the rotating mechanism 105 in accordance with the reference position of the axis S, and performs processing. The laser processing head H is linearly moved (down) along the axis S in the Z-axis direction so as to approach the object W. Accordingly, the irradiation position of the laser L with respect to the workpiece W moves in a circle around the axis S, and a hole W1 is formed in the workpiece W as shown in FIG. At this time, the inner wall surface (processed surface) of the hole W1 is in a dense state due to heat input of the laser L in the predetermined range W2.

  In step S2, the control unit 91 next irradiates the laser L from the laser processing head H as shown in FIG. 9, rotates the rotating unit 105b of the rotating mechanism 105 in accordance with the reference position of the axis S, In addition, while rotating the rotating part 110a of the rotating mechanism 110 of the machining head M in accordance with the reference position of the axis S, the laser processing head H is moved along the axis S in the Z-axis direction so as to approach the workpiece W. Move straight down (down). As a result, the irradiation position of the laser L with respect to the workpiece W moves circularly around the axis S, and the hole W1 penetrates further downward on the workpiece W as shown in FIG. It is formed. At this time, the inner wall surface (processed surface) of the lower hole W1 is in a coarse state due to heat input of the laser L in the predetermined range W2. In addition, the drill D of the machining head M rotates around the axis S with respect to the workpiece W, and the portion where the inner wall surface of the hole W1 has been heat input first by the drill D as shown in FIG. The hole W3 is formed by cutting. Moreover, the control part 91 stops irradiation of the laser L, when the hole W1 is penetrated and formed in the to-be-processed object W. FIG.

  In step S2, the control unit 91 next rotates and rotates the rotating unit 110a of the rotating mechanism 110 of the machining head M in accordance with the reference position of the axis S as shown in FIG. The laser processing head H is linearly moved (lowered) along the axis S in the Z-axis direction so as to approach. As a result, the drill D of the machining head M rotates about the axis W with respect to the workpiece W, and as shown in FIG. 12, the inner wall surface of the previously penetrated hole W1 (see FIG. 10) enters. The heated portion is cut by the drill D, and the hole W3 is formed through.

  In step S2, the control unit 91 next rotates the rotating unit 110a of the rotating mechanism 110 of the machining head M according to the reference position of the axis S as shown in FIG. The laser processing head H is linearly moved (lowered) along the axis S in the Z-axis direction so as to approach. As a result, the chamfering cutter C of the machining head M rotates with respect to the workpiece W around the axis S, and the upper opening edge of the hole W3 that has penetrated first is chamfered as shown in FIG. The chamfered portion W4 is formed by cutting with the cutter C.

  As described above, the combined machining method of the present embodiment moves the irradiation position of the laser L for machining the workpiece W and the machining position of the tool for machining the workpiece W according to a predetermined movement reference, A laser processing step of processing the workpiece W by the laser L, and a machining step of processing the position of the workpiece W processed by the laser L with a tool following the laser processing step.

  According to this combined machining method, machining time is reduced in machining by performing the machining process following the laser machining process while the irradiation position of the laser L and the machining position of the tool move based on a predetermined movement reference. Such processing is performed by laser processing, and each step of performing machining as the finishing is continuously performed based on a predetermined movement reference. For this reason, it is possible to increase the processing speed. Especially in machining of composite materials, the tool is consumed heavily and the running cost is high in machining. However, since laser machining is performed first and machining is performed as the finishing, the tool life is extended and the running cost is increased. Can be reduced.

  In the combined machining method of the present embodiment, the irradiation position of the laser L for machining the workpiece W and the machining position of the tool for machining the workpiece W are rotated according to the movement reference of the same axis S. And move linearly along the axis S.

  According to this combined machining method, the machining process is performed while the laser machining process is performed, and the hole W3 is formed in the workpiece W. For this reason, it becomes possible to perform the penetration process of the hole W3 to the workpiece W at high speed.

  In the combined machining method of the present embodiment, the laser machining step roughly processes the workpiece W with the laser L, and the machining step finishes the position of the workpiece W machined with the laser L with a tool. .

  According to this composite processing method, the processing surface of the composite material is roughened only by laser processing, but the rough processing is first performed by the laser L, and the machining is performed as the finishing, so that high quality processing is performed. Can be performed at high speed.

  Further, the combined machining apparatus 1 of the present embodiment includes a laser machining head H that irradiates a laser L for machining the workpiece W, a machining head M having a tool for machining the workpiece W, and a laser machining head H. The laser processing head H and the machining head M are integrally supported so that the laser L irradiation position and the machining position of the tool on the machining head M meet a predetermined movement reference, and the laser processing head is based on the movement reference. H and a moving mechanism 31 that moves the machining head M.

  According to this combined machining apparatus 1, the irradiation position of the laser L for machining the workpiece W and the machining position of the tool for machining the workpiece W are moved in accordance with a predetermined movement reference, and the laser L applies the workpiece. Implementing the combined machining method of the present embodiment in which a laser machining process for machining the workpiece W and a machining process for machining the position of the workpiece W machined by the laser L using a tool following the laser machining process. Is possible. In other words, by performing the machining process following the laser machining process, machining that takes a long time in machining is performed by laser machining, and each process that performs machining as its finishing is continuously performed according to a predetermined movement reference. Do it. For this reason, it is possible to increase the processing speed. Especially in machining of composite materials, the tool is consumed heavily and the running cost is high in machining. However, since laser machining is performed first and machining is performed as the finishing, the tool life is extended and the running cost is increased. Can be reduced.

  In the combined machining apparatus 1 of the present embodiment, the moving mechanism 31 performs laser machining so that the irradiation position of the laser L in the laser machining head H and the machining position of the tool in the machining head M match the movement reference of the same axis S. The head H and the machining head M are integrally supported, and the irradiation position of the laser L and the machining position of the tool are rotated around the axis S, respectively, and the laser machining head H and the machine are moved along the axis S. The machining head M is moved linearly.

  According to the combined machining apparatus 1, machining is performed while laser machining is performed, and the hole W3 is provided in the workpiece W. For this reason, it becomes possible to perform the penetration process of the hole W3 to the workpiece W at high speed.

  In the combined machining apparatus 1 of the present embodiment, the vibration isolation member 111 is disposed between the laser machining head H and the machining head M.

  According to this combined machining apparatus 1, in order to suppress the situation where the vibration of the machining head M is transmitted to the laser machining head H, the influence of the laser machining due to the vibration (for example, the accuracy of the irradiation position of the laser L is reduced) is suppressed. It becomes possible to do.

  Moreover, the combined machining apparatus 1 of the present embodiment includes a blower unit 8a that blows air toward the machining position of the tool in the machining head M.

  According to the combined machining apparatus 1, machining dust generated in machining by the machining head M is blown off by the blower 8a, thereby preventing a situation where the machining dust is attached to the tool of the machining head M or the lens of the laser machining head H. For this reason, the processing waste adheres to the tool of the machining head M and damages the tool to reduce the durability of the tool, or the processing waste adheres to the lens of the laser processing head H and damages the optical system of the laser L. It is possible to prevent a situation in which the durability of the battery deteriorates.

  Further, the combined machining apparatus 1 of the present embodiment includes a suction portion 8b that sucks toward the machining position of the tool in the machining head M.

  According to this combined machining apparatus 1, machining dust generated in machining by the machining head M is sucked by the suction portion 8b, thereby preventing a situation where the scrap is attached to the tool of the machining head M or the lens of the laser machining head H. . For this reason, the processing waste adheres to the tool of the machining head M and damages the tool to reduce the durability of the tool, or the processing waste adheres to the lens of the laser processing head H and damages the optical system of the laser L. It is possible to prevent a situation in which the durability of the battery deteriorates.

[Embodiment 3]
FIG. 15 is a configuration diagram of the combined machining apparatus according to the present embodiment, and FIGS. 16 to 19 are process diagrams illustrating a processing procedure of the combined machining method according to the present embodiment.

  As shown in FIG. 15, the combined machining apparatus 1 includes a workpiece support mechanism 2 (see FIG. 16) and a head support mechanism 3.

  The workpiece support mechanism 2 supports the workpiece W with respect to the fixed frame 1 a of the composite processing apparatus 1. In the present embodiment, the workpiece support mechanism 2 is, for example, as shown in FIG. 16, a chuck portion 2 a that fastens and fixes the periphery of the workpiece W placed on a mounting table that is a fixed frame 1 a. Have

  Here, as the workpiece W of the present embodiment, CFRP (Carbon Fiber Reinforced Plastics), GFRP (Glass Fiber Reinforced Plastic), GMT (Glass Long Fiber Reinforced Plastic), etc., fiber reinforced plastic, steel plate Various metals such as iron alloys and aluminum alloys can be used, and in particular, composite materials including CFRP and GFRP are applied. Further, the workpiece W may be a member made of Inconel, Hastelloy, stainless steel, ceramic, steel, carbon steel, ceramics, silicon, titanium, tungsten, resin, plastics, glass, or the like.

  The head support mechanism 3 supports the laser processing head H and the machining head M with respect to the fixed frame 1 a of the composite processing apparatus 1. In this embodiment, for example, the head support mechanism 3 supports the laser beam machining head H and the machining head M so as to be movable with respect to the horizontal beam that is the fixed frame 1a. The laser processing head H and the machining head M are supported.

  The moving mechanism 31 includes, for example, an X-axis moving mechanism, a Y-axis moving mechanism, and a Z-axis moving mechanism. In the X-axis moving mechanism of the moving mechanism 31, a pair of X-axis rails 31a extending in the X-axis direction (left-right direction in FIG. 15) are fixed in parallel to the lower part of the horizontal beam that is the fixed frame 1a. . In the X-axis moving mechanism, the Y-axis rail 31b extending in the Y-axis direction (depth direction in FIG. 15) perpendicular to the pair of X-axis rails 31a is extended from the pair of X-axis rails 31a. It is provided to be movable in the X-axis direction along the direction.

  The Y-axis moving mechanism of the moving mechanism 31 is provided such that the Y-axis moving member 31c is movable in the Y-axis direction along the extending direction of the pair of Y-axis rails 31b.

  The Z-axis moving mechanism of the moving mechanism 31 includes a Y-axis moving member 31c provided with a Z-axis support member 31d, and a Z-axis direction relative to the Z-axis support member 31d (vertical direction in FIG. A pair of Z-axis rails 31e extending in the extending direction S is fixed in parallel. The Z-axis moving mechanism is provided such that the Z-axis moving member 31f is movable in the Z-axis direction along the extending direction of the pair of Z-axis rails 31e. And the laser processing head H and the machining head M are installed with respect to this Z-axis moving member 31f.

  That is, the moving mechanism 31 moves the laser machining head H and the machining head M in the X-axis direction by the X-axis movement mechanism, and moves the laser machining head H and the machining head M in the Y-axis direction by the Y-axis movement mechanism. The laser processing head H and the machining head M are moved in the Z-axis direction by the Z-axis moving mechanism.

  The laser processing head H irradiates the laser L output by the laser processing head drive unit (laser output device). Here, the configuration of the laser processing head H of the present embodiment will be described with reference to FIGS. 15 and 4 to 6.

  The laser processing head H irradiates the workpiece W with a laser L output from an after-mentioned laser processing head drive unit 95 via an optical fiber F. The laser processing head H rotates the irradiation position on the workpiece W by rotating the optical axis of the optical path of the laser L about the axis S. That is, the laser processing head H moves the irradiation position of the laser L so as to draw a circle as shown in FIG.

  Specifically, the laser processing head H is formed in a columnar shape as a whole, and forms an optical system unit that guides the laser L output from the optical fiber F as shown in FIGS. In the optical system unit, a collimating optical system 101, a polarizing optical system 102, and a condensing optical system 103 are arranged on the optical path of the laser L in order from the optical fiber F side. That is, the laser L output from the optical fiber F passes through the collimating optical system 101, then passes through the polarizing optical system 102, passes through the condensing optical system 103, and is irradiated onto the workpiece W.

  The collimating optical system 101 includes a collimator lens and the like, and the laser L output from the optical fiber F is converted into parallel light. The polarization optical system 102 is an optical unit that shifts (polarizes) the optical path of the laser L by a certain distance from the center, and includes a first prism 102a and a second prism 102b. The first prism 102a refracts the laser L and tilts it with respect to the optical axis (axial center S). The second prism 102b controls the position where the laser L refracted by the first prism 102a is refracted again and condensed. As a result, as shown in FIG. 5, the laser L that has passed through the polarization optical system 102 is output in an optical path that is shifted from the optical path of the laser L before passing. The condensing optical system 103 includes a lens that condenses the laser L shifted from the optical axis (axial center S) by the polarizing optical system 102.

  The lenses of the collimating optical system 101 and the condensing optical system 103 are fixed lenses of the optical system unit, and are supported by the optical system support unit 104. The optical system support unit 104 also supports a fixing unit 105a of a rotation mechanism 105 described later.

  The rotation mechanism 105 is included in the moving mechanism 31 of the present embodiment, and is a mechanism that rotates the polarization optical system 102 around the optical path of the laser L before passing through the polarization optical system 102 as a rotation center. The rotation mechanism 105 includes a fixed portion 105a, a rotation portion 105b, and a bearing 105c. The fixing unit 105 a is fixed to the collimating optical system 101 and the condensing optical system 103. The rotating part 105b is supported so as to be rotatable around the optical axis (axis S) via a bearing 105c with respect to the fixed part 105a. The rotating part 105b is an aerial cylindrical member in which a part corresponding to the optical path of the laser L is a space. The rotating unit 105b supports the first prism 102a and the second prism 102b of the polarization optical system 102.

  In the rotation mechanism 105, the fixed portion 105a and the rotation portion 105b are provided so as to be relatively rotatable around the optical axis (axis S) with the above-described configuration. And the polarization optical system 102 can be rotated by rotating the rotation part 105b in the direction of arrow B in FIG. The rotation center of the rotation mechanism 105 overlaps with the optical axis (axial center S) of the optical path of the laser L before being polarized.

  The rotation mechanism 105 rotates the polarization optical system 102 around the optical axis (axial center S) of the optical path of the laser L before being polarized, so that the laser L on the workpiece W is shown in FIG. The irradiation position is moved in a circular shape with the optical axis (axial center S) of the optical path of the laser L before being polarized as the center and the distance polarized by the polarization optical system 102 as the radius from the center. it can. That is, the rotation mechanism 105 rotates the rotation unit 105b in the direction of arrow B in FIG. 4 to rotate the polarization optical system 102, thereby rotating the optical axis (axial center S) as shown in FIGS. The irradiation position i can be rotated in the direction of arrow B on the virtual circle V as the center.

  Further, the laser processing head H has an encoder 106. The encoder 106 is a rotation sensor that detects the rotation of the rotation unit 105 b of the rotation mechanism 105. The encoder 106 includes a detection unit 106a and a moving unit 106b. The detection unit 106 a is fixed to the fixing unit 105 a of the rotation mechanism 105. The moving unit 106b is fixed to the rotating unit 105b of the rotating mechanism 105 and rotates together with the rotating unit 105b. The moving unit 106b is provided with an identifier serving as a mark at a position in the rotation direction. The detecting unit 106a can detect the rotation of the moving unit 106b by detecting the identifier of the moving unit 106b, and thus the rotation mechanism 105 can detect the rotation of the rotating unit 105b relative to the fixed unit 105a. .

  Such a laser processing head H is supported by a frame 100 as shown in FIG. The frame 100 is formed in a cylindrical shape so as to accommodate the columnar laser processing head H. The frame 100 is fixed to the Z-axis moving member 31 f of the moving mechanism 31. The laser machining head H has a collimating optical system 101 and a condensing optical system 103 fixed to the frame 100, and a fixing part 105 a of a rotating mechanism 105 is also attached to the frame 100 in accordance with the collimating optical system 101 and the condensing optical system 103. It is fixed. The rotating portion 105b of the rotating mechanism 105 is supported between the frame 100 and the frame 100 via a bearing 100a so as to be rotatable about the optical axis (axial center S). That is, in the laser processing head H, the rotating portion 105 b of the rotating mechanism 105 is supported so as to be rotatable with respect to the frame 100, and other portions are fixed to the frame 100.

  Further, the laser processing head H includes a motor 107 that rotates the rotating portion 105 b in the rotating mechanism 105 that is the moving mechanism 31. As shown in FIG. 15, the motor 107 is provided on the collimating optical system 101 side of the laser processing head H and is fixed to the frame 100. The output axis of the motor 107 is formed in a cylindrical shape centering on the optical axis (axial center S) of the optical path of the laser L, and is connected to the rotating part 105b of the rotating mechanism 105 while the collimating optical system 101 is disposed inside. ing. Therefore, the rotation of the output shaft of the motor 107 is transmitted to the rotating unit 105 b of the rotating mechanism 105 excluding the collimating optical system 101. Note that the drive source for rotating the rotating unit 105b of the rotating mechanism 105 is not limited to the motor 107. For example, although not explicitly shown in the drawing, the bearing 105c is a static pressure bearing (fluid bearing) and is rotated with the fixed unit 105a by a pump. The structure which rotates the rotation part 105b by supplying air to the closed space between the parts 105b may be sufficient. In addition, for example, although not explicitly shown in the drawing, the rotating portion 105b is a rotor, a stator fixed to the frame 100 is arranged around the rotor, and the rotor or the stator is a permanent magnet, while the stator or the rotor is wound with a coil and magnetized. By doing so, you may comprise so that the rotation part 105b may be rotated.

  Further, since the laser processing head H is installed with respect to the Z-axis moving member 31f together with the machining head M, in order to suppress heat transfer from the machining head M (for example, about 50 [° C.]), Cooling means 108 is provided. The cooling means 108 has a pump 108a and a connecting pipe 108b. The pump 108a supplies air to the inflow portion of the connecting pipe 108b. The connecting pipe 108b is a pipe that connects a closed space between the optical member and the optical member in the optical system unit to the closed space. The connection pipe 108b has an opening connected to the space in the vicinity of the optical member. Further, when the connecting pipe 108b is connected to the other space from the same space, each opening is formed at a position away from the same space (for example, the opposite side across the optical axis). The cooling means 108 can supply air to the connection pipe 108b with the pump 108a, thereby allowing the air to flow in a closed space between the optical member and cooling the optical member. The connecting pipe 108b is connected so as to form one flow path through a space closed by the entire optical system unit, and the air is supplied to the entire optical system unit by supplying air from one place by the pump 108a. Can flow.

  Further, when using a composite material as the workpiece W, the laser processing head H has an assist gas supply means 109 for suppressing the combustion of the composite material. For example, as shown in FIG. 4, the assist gas supply means 109 is coaxial with the laser L for assist gas (for example, nitrogen or argon) from a gas supply pipe disposed on the side of the condensing optical system 103 of the laser processing head H. Although not shown in the figure, there are those that inject assist gas into the portion of the workpiece W that is irradiated with the laser L.

  In the present embodiment, the machining head M performs a finishing process by cutting a laser machined part while performing laser machining, and a chamfering cutter C as a cutting tool is applied. And the machining head M has the rotation mechanism 110 which rotates the chamfering cutter C, as shown in FIG. The rotation mechanism 110 is included in the movement mechanism 31 of this embodiment, and has a rotation part 110a. The rotating part 110a is formed in a cylindrical shape so as to cover the outside of the frame 100, and is supported between the frame 100 and the frame 100 via a bearing 100b so as to be rotatable about the optical axis (axial center S). A chamfering cutter C is fixed to the rotating portion 110a via a cutter mounting portion. The cutter mounting portion is formed in a cylindrical shape so that the laser L of the laser processing head H passes through the inside of the cutter mounting portion. The rotation mechanism 110 includes a motor 110b that rotates the rotation unit 110a. The motor 110 b is fixed to the Z-axis moving member 31 f of the moving mechanism 31 together with the frame 100. In the motor 110b, a gear 110c provided on an output shaft thereof meshes with a gear 110d provided on the rotating unit 110a. For this reason, rotation of the output shaft of the motor 110b is transmitted to the rotating unit 110a.

  Further, when the workpiece W is a composite material, the machining head M is combined with the bearing 100b of the rotating portion 110a of the rotating mechanism 110 and the oil on the sliding surface transmitted to the tool and adhered to the workpiece W. In order to prevent the material from deteriorating, a seal structure is provided as appropriate.

  The combined machining apparatus 1 according to the present embodiment includes an irradiation position of a laser L for machining a workpiece W with respect to a laser machining head H and a machining head M installed on a Z-axis moving member 31f via a frame 100. The processing position of the tool (chamfering cutter C) for processing the workpiece W is arranged in accordance with a predetermined movement reference. Specifically, in the present embodiment, the laser L is applied so that the irradiation position of the laser L for processing the workpiece W and the processing position of the tool for processing the workpiece W meet the movement reference of the same axis S. A machining head H and a machining head M are installed with respect to the frame 100. For this reason, the laser processing head H and the machining head M are rotated about the axis S by the rotation mechanisms 105 and 110 which are the movement mechanisms 31, respectively.

  Moreover, since the machining head M is accompanied by vibration when the machining head M rotates or processes the workpiece W, the combined machining apparatus 1 of the present embodiment has a laser beam to suppress transmission of the vibration to the laser machining head H. A vibration isolating member 111 made of a rubber material or the like is disposed between the processing head H and the machining head M. FIG. 15 shows a form in which a vibration isolating member 111 is disposed between the frame 100 supporting the laser processing head H and the machining head M and the bearing 100a and between the bearing 100a and the laser processing head H. In addition, the vibration isolation member 111 may be disposed between the frame 100 and the bearing 100b and between the bearing 100b and the machining head M.

  Further, in the combined machining apparatus 1 of the present embodiment, machining waste is generated in machining by the machining head M, and when the machining waste adheres to the tool of the machining head M, the tool is damaged and the durability of the tool is lowered. If there is a possibility that the processing waste adheres to the lens of the laser processing head H, the optical system of the laser L may be damaged and the durability of the optical system may be reduced. For this reason, in the combined machining apparatus 1 of the present embodiment, a blower (for example, a nozzle for injecting air or gas and an air supply source (not shown)) 8a for blowing air toward the machining position of the tool in the machining head M, the machine A suction portion (for example, a suction fan) 8b that sucks toward the processing position of the tool in the processing head M is provided. For this reason, the processing waste generated in the processing by the machining head M is not blown off by the blower 8a and attached to the tool of the machining head M or the lens of the laser processing head H. Further, machining waste generated in machining by the machining head M or machining waste blown by the blower 8a is not sucked by the suction portion 8b and attached to the tool of the machining head M or the lens of the laser machining head H. . Although not clearly shown in the figure, the suction part 8b is preferably connected to a filter via a duct on the downstream side of the suction and configured to collect the processing waste. Further, only one of the air blowing part 8a and the suction part 8b may be provided.

  Further, the combined machining apparatus 1 includes a control device 9. The control device 9 controls the driving of the laser processing head H, the driving of the machining head M, and the movement by the moving mechanism 31, and includes a control unit 91, a storage unit 92, an input unit 93, a display unit 94, A laser processing head driving unit (laser output device) 95, a machining head driving unit 96, and a head moving unit 97 are included.

  The control unit 91 is, for example, a CPU (Central Processing Unit), receives an input from the input unit 93 and an input of data from the storage unit 92, and in response to the input, the laser processing head driving unit 95, the machine Commands are output to the machining head drive unit 96 and the head moving unit 97. The storage unit 92 is, for example, a hard disk device or a semiconductor storage device. The storage unit 92 includes a workpiece database 92a. The workpiece database 92a stores design information (for example, the shape and material of the workpiece W) based on the machining of the workpiece W. The storage unit 92 may be connected to the control unit 91 through a communication line (for example, a data server). The input unit 93 includes a keyboard and a mouse. The display unit 94 has a screen. The content input from the input unit 93 to the screen, the content input from the storage unit 92, the driving status of the laser processing head H by the laser processing head driving unit 95, the machine The driving status of the machining head M by the machining head drive unit 96 and the movement status of the laser machining head H and the machining head M by the head moving unit 97 are displayed.

  The laser processing head drive unit 95 is a device that outputs a laser L. The laser processing head driving unit 95 can use a fiber laser output device that outputs a laser L using an optical fiber as a medium or a short pulse laser output device that outputs a short pulse laser L. As the fiber laser output device, a Fabry-Perot fiber laser output device or a ring type fiber laser output device is excited. The fiber laser output device may use either a continuous wave operation or a pulsed oscillation (plused operation) method. As the fiber of the fiber laser output device, for example, silica glass added with rare earth elements (Er, Nd, Yb) can be used. A short pulse is a pulse having a pulse width of 100 picoseconds or less. As a generation source of the laser L of the short pulse laser output device, for example, a titanium sapphire laser can be used. The laser processing head drive unit 95 controls the output of the laser L based on a command from the control unit 91. In the present embodiment, the thickness of the workpiece W, which is a plate-shaped composite material, is set to 1/2 [in] or less, and the wavelength of the laser L is set to 1.0 [μm] to 1.1 [μm] infrared. Light (which may be visible light or ultraviolet light) is applied, and the output of the laser L is set to 100 [W] to 50 [kW]. In this case, the assist gas pressure is preferably 0.1 [MPa] to 1.0 [MPa]. Further, the laser processing head drive unit 95 controls the rotation speed of the motor 107 (rotation speed of the laser L) that rotates the rotation unit 105b of the rotation mechanism 105 in the laser processing head H based on a command from the control unit 91. .

  The machining head drive unit 96 controls the rotation speed (tool rotation speed) of the motor 110 b of the rotation mechanism 110 in the machining head M based on a command from the control unit 91.

  The head moving unit 97 controls the movement of the laser processing head H based on a command from the control unit 91. In the present embodiment, the thickness of the workpiece W that is a plate-shaped composite material is set to 1/2 [in] or less, and the spindle output is set to 15 [kW] or more.

  Hereinafter, the processing procedure of the combined machining method according to the present embodiment will be described with reference to FIGS. 2 and 16 to 19. 16 and 18 show the operation of the combined machining apparatus 1, FIG. 17 shows the machining state of the workpiece W in FIG. 16, and FIG. 19 shows the machining state of the workpiece W in FIG.

  As shown in FIG. 2, the control unit 91 acquires design information of the workpiece W to be machined from the workpiece database 92a of the storage unit 92 according to the input from the input unit 93 (step S1). Next, the control unit 91 determines, from the design information of the workpiece W, the position of the workpiece W to be processed, the output of the laser L by the laser processing head H, the rotational speed of the tool by the machining head M, the laser Processing conditions such as the moving speed (processing time) of the processing head H and the machining head M are determined (step S2). Next, the control unit 91 outputs a command to the laser processing head driving unit 95, the machining head driving unit 96, and the head moving unit 97 based on the determined processing conditions to perform processing (step S3).

  In step S2, the control unit 91 irradiates the laser L from the laser processing head H as shown in FIG. 16, rotates the rotating unit 105b of the rotating mechanism 105 in accordance with the reference position of the axis S, and The laser processing head H is linearly moved (down) along the axis S in the Z-axis direction so as to approach the object W. As a result, the irradiation position of the laser L with respect to the workpiece W moves in a circle around the axis S, and a hole W5 is formed through the workpiece W as shown in FIG. Moreover, the control part 91 stops irradiation of the laser L, when the hole W5 is penetrated and formed in the to-be-processed object W. As shown in FIG.

  In step S2, the control unit 91 subsequently rotates and rotates the rotating unit 110a of the rotating mechanism 110 of the machining head M in accordance with the reference position of the axis S as shown in FIG. The laser processing head H is linearly moved (lowered) along the axis S in the Z-axis direction so as to approach. As a result, the chamfering cutter C of the machining head M rotates with respect to the workpiece W around the axis S, and as shown in FIG. 19, the upper opening edge of the previously penetrated hole W5 is chamfered. The chamfered portion W6 is formed by cutting with the cutter C.

  As described above, the combined machining method of the present embodiment moves the irradiation position of the laser L for machining the workpiece W and the machining position of the tool for machining the workpiece W according to a predetermined movement reference, A laser processing step of processing the workpiece W by the laser L, and a machining step of processing the position of the workpiece W processed by the laser L with a tool following the laser processing step.

  According to this combined machining method, machining time is reduced in machining by performing the machining process following the laser machining process while the irradiation position of the laser L and the machining position of the tool move based on a predetermined movement reference. Such processing is performed by laser processing, and each step of performing machining as the finishing is continuously performed based on a predetermined movement reference. For this reason, it is possible to increase the processing speed. Especially in machining of composite materials, the tool is consumed heavily and the running cost is high in machining. However, since laser machining is performed first and machining is performed as the finishing, the tool life is extended and the running cost is increased. Can be reduced.

  In the combined machining method of the present embodiment, the irradiation position of the laser L for machining the workpiece W and the machining position of the tool for machining the workpiece W are rotated according to the movement reference of the same axis S. And move linearly along the axis S.

  According to this combined machining method, while performing the laser machining process, the machining process is performed to penetrate the workpiece W through the hole W5 and to form the chamfered portion W6. For this reason, it becomes possible to perform the penetration process of the hole W5 to the workpiece W, and the chamfering process of the chamfered part W6 at high speed.

  In the combined machining method of the present embodiment, the laser machining step roughly processes the workpiece W with the laser L, and the machining step finishes the position of the workpiece W machined with the laser L with a tool. .

  According to this composite processing method, the processing surface of the composite material is roughened only by laser processing, but the rough processing is first performed by the laser L, and the machining is performed as the finishing, so that high quality processing is performed. Can be performed at high speed.

  Further, the combined machining apparatus 1 of the present embodiment includes a laser machining head H that irradiates a laser L for machining the workpiece W, a machining head M having a tool for machining the workpiece W, and a laser machining head H. The laser processing head H and the machining head M are integrally supported so that the laser L irradiation position and the machining position of the tool on the machining head M meet a predetermined movement reference, and the laser processing head is based on the movement reference. H and a moving mechanism 31 that moves the machining head M.

  According to this combined machining apparatus 1, the irradiation position of the laser L for machining the workpiece W and the machining position of the tool for machining the workpiece W are moved in accordance with a predetermined movement reference, and the laser L applies the workpiece. Implementing the combined machining method of the present embodiment in which a laser machining process for machining the workpiece W and a machining process for machining the position of the workpiece W machined by the laser L using a tool following the laser machining process. Is possible. In other words, by performing the machining process following the laser machining process, machining that takes a long time in machining is performed by laser machining, and each process that performs machining as its finishing is continuously performed according to a predetermined movement reference. Do it. For this reason, it is possible to increase the processing speed. Especially in machining of composite materials, the tool is consumed heavily and the running cost is high in machining. However, since laser machining is performed first and machining is performed as the finishing, the tool life is extended and the running cost is increased. Can be reduced.

  In the combined machining apparatus 1 of the present embodiment, the moving mechanism 31 performs laser machining so that the irradiation position of the laser L in the laser machining head H and the machining position of the tool in the machining head M match the movement reference of the same axis S. The head H and the machining head M are integrally supported, and the irradiation position of the laser L and the machining position of the tool are rotated around the axis S, respectively, and the laser machining head H and the machine are moved along the axis S. The machining head M is moved linearly.

  According to the combined machining apparatus 1, machining is performed while laser machining is performed, the hole W5 is penetrated through the workpiece W, and the chamfered portion W6 is formed. For this reason, it becomes possible to perform the penetration process of the hole W5 to the workpiece W, and the chamfering process of the chamfered part W6 at high speed.

  In the combined machining apparatus 1 of the present embodiment, the vibration isolation member 111 is disposed between the laser machining head H and the machining head M.

  According to this combined machining apparatus 1, in order to suppress the situation where the vibration of the machining head M is transmitted to the laser machining head H, the influence of the laser machining due to the vibration (for example, the accuracy of the irradiation position of the laser L is reduced) is suppressed. It becomes possible to do.

  Moreover, the combined machining apparatus 1 of the present embodiment includes a blower unit 8a that blows air toward the machining position of the tool in the machining head M.

  According to the combined machining apparatus 1, machining dust generated in machining by the machining head M is blown off by the blower 8a, thereby preventing a situation where the machining dust is attached to the tool of the machining head M or the lens of the laser machining head H. For this reason, the processing waste adheres to the tool of the machining head M and damages the tool to reduce the durability of the tool, or the processing waste adheres to the lens of the laser processing head H and damages the optical system of the laser L. It is possible to prevent a situation in which the durability of the battery deteriorates.

  Further, the combined machining apparatus 1 of the present embodiment includes a suction portion 8b that sucks toward the machining position of the tool in the machining head M.

  According to this combined machining apparatus 1, machining dust generated in machining by the machining head M is sucked by the suction portion 8b, thereby preventing a situation where the scrap is attached to the tool of the machining head M or the lens of the laser machining head H. . For this reason, the processing waste adheres to the tool of the machining head M and damages the tool to reduce the durability of the tool, or the processing waste adheres to the lens of the laser processing head H and damages the optical system of the laser L. It is possible to prevent a situation in which the durability of the battery deteriorates.

[Embodiment 4]
FIG. 20 is a process diagram illustrating a processing procedure of the combined processing method according to the present embodiment. The combined processing method of the present embodiment corresponds to the second embodiment described above. In this composite processing method, as shown in FIG. 20A, first, a laser processing head is irradiated with a laser L by a laser processing head to thermally change the position to be machined. In this case, the machining hole may be penetrated, or the machined position of the workpiece W may be thermally altered without being penetrated. Thereafter, as shown in FIG. 20B, the workpiece W is machined with a tool by a machining head.

  The output of the laser L is preferably 100 [W] to 50 [kW], more preferably 1 [kW] to 30 [kW]. The pulse oscillation mode is desirable for applications that do not unnecessarily spread the thermally altered layer by laser heating outside the processing area. A high peak power and a narrow pulse width are suitable, and a peak power of 1 [kW] to 30 [kW] and a pulse width of 10 microseconds to 100 milliseconds are desirable.

  By making a laser processing hole under the above conditions or by causing a thermal alteration, it is possible to reduce the thrust force when performing machining with a machining head thereafter. This means that the cutting speed of machining can be improved or the tool life can be extended. Furthermore, reducing the thrust force can suppress chipping of the workpiece W in drilling the workpiece W, and can also improve the quality after processing.

DESCRIPTION OF SYMBOLS 1 Combined processing apparatus 1a Fixed frame 2 Workpiece support mechanism 2a Chuck part 3 Head support mechanism 31 Movement mechanism 31a X axis rail 31b Y axis rail 31c Y axis movement member 31d Z axis support member 31e Z axis rail 31f Z axis movement member DESCRIPTION OF SYMBOLS 4 Cooling means 5 Assist gas supply means 6 Contact part 7 Anti-vibration member 8a Air blower part 8b Suction part 9 Control apparatus 91 Control part 92 Memory | storage part 92a Workpiece database 93 Input part 94 Display part 95 Laser processing head drive part 96 Machining Head drive unit 97 Head moving unit 100 Frame 100a, 100b Bearing 101 Collimating optical system 102 Polarizing optical system 102a First prism 102b Second prism 103 Condensing optical system 104 Optical system support unit 105 Rotating mechanism (moving mechanism)
105a Fixed portion 105b Rotating portion 105c Bearing 106 Encoder 106a Detection portion 106b Moving portion 107 Motor 108 Cooling means 108a Pump 108b Connecting pipe 109 Assist gas supply means 110 Rotating mechanism (moving mechanism)
110a Rotating part 110b Motor 110c, 110d Gear 111 Anti-vibration member C Chamfering cutter (tool)
D Drill (tool)
E End mill (tool)
F Optical fiber H Laser processing head i Irradiation position L Laser M Machining head S Axis center V Virtual circle W Workpiece W1 Hole W2 Predetermined range W3 Hole W4 Chamfered portion W5 Hole W6 Chamfered portion

Claims (2)

Moving a laser irradiation position for processing a workpiece including at least CFRP, GFRP, or GMT, and a processing position of a tool for processing the workpiece in accordance with a predetermined movement reference;
A laser processing step of processing the workpiece by the laser;
A machining step of machining the position of the workpiece machined by the laser with the tool following the laser machining step;
Including
The laser machining step roughly cuts the workpiece or penetrates the hole with the laser, and the machining step opens the cut surface portion or the hole of the workpiece machined by the laser. A combined machining method, wherein an edge is finished with the tool. Moving a laser irradiation position for processing a workpiece including at least CFRP, GFRP, or GMT, and a processing position of a tool for processing the workpiece in accordance with a predetermined movement reference;
A laser processing step of processing the workpiece by the laser;
A machining step of machining the position of the workpiece machined by the laser with the tool following the laser machining step;
Including
The laser processing step forms a thermally altered layer in which the workpiece is thermally altered by the laser in a pulse oscillation mode with a peak power of 1 kW to 30 kW and a pulse width of 10 microseconds to 100 milliseconds, and the machining The process comprises processing the position of the workpiece thermally altered by the laser with the tool.

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