JP2017092090A - Circuit structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit structure capable of enlarging a mounting area of a substrate.SOLUTION: A circuit structure 1 comprises: an electronic component 10 including a plurality of terminals 12, 13, and 14; a conductive member 20 which supports the electronic component 10 and to which the terminals 12 and 13 of the electronic component 10 are electrically connected; and a substrate 30 in which a conductive pattern 31 to which the terminal 14 of the electronic component 10 is electrically connected is formed. The substrate 30 is provided apart from the conductive member 20.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a circuit structure including a substrate and a conductive member.

  A circuit structure in which a plate-like conductive member (also referred to as a bus bar or the like) is fixed to the other surface side of a substrate having a conductive pattern formed on one surface is known (for example, Patent Document 1 below). reference).

JP 2003-164040 A

  In the circuit structure as described in Patent Document 1, since the substrate and the conductive member are fixed so as to be bonded together, one surface of the substrate (surface on the conductive member side) should be used as a mounting surface. I can't.

  The problem to be solved by the present invention is to provide a circuit structure capable of increasing the mounting area of a substrate.

  A circuit structure according to the present invention made to solve the above problems is an electronic component having a plurality of terminals, and a member that supports the electronic component, wherein some of the terminals of the electronic component are electrically A conductive member to be connected; and a substrate on which a conductive pattern to which other terminals of the electronic component are electrically connected is formed, the substrate being provided apart from the conductive member. It is characterized by that.

  In the circuit structure according to the present invention, since the substrate is provided apart from the conductive member, both one surface and the other surface of the substrate can be used as the mounting surface.

  The conductive member may be formed so as not to overlap at least a part of other terminals of the electronic component.

  Thus, if the conductive member is formed so as not to overlap at least a part of the other part of the terminal of the electronic component, the operation of connecting the terminal and the substrate becomes easy.

  It is good to provide the relay member which connects the other one part terminal of the said electronic component, and the conductive pattern of the said board | substrate.

  By using such a relay member, it is easy to make an electrical connection between another terminal of the electronic component and the conductive pattern of the board. Further, it becomes easy to keep the substrate away from the conductive member.

  The conductive member may be provided on one side of the electronic component, and the substrate may be provided on the other side of the electronic component.

  The substrate can be provided on the side opposite to the side on which the conductive member is located with reference to the position of the electronic component.

  It is good to provide the heat radiating member which contacts directly or indirectly the surface on the opposite side to the surface where the said electronic component in the said electrically-conductive member was supported.

  The heat radiating member may be fixed to the surface of the conductive member opposite to the surface on which the electronic component is supported. Since there is no substrate on the opposite side, there are not many restrictions on the shape and size of the heat dissipation member. Further, since the opposite surface is not a surface on which the electronic component is supported, the direct or indirect contact area between the conductive member and the heat radiating member can be increased. Therefore, heat dissipation efficiency can be increased.

  The conductive member and the substrate may be provided on one side of the electronic component.

  The substrate can be provided on the same side as the side on which the conductive member is located with reference to the position of the electronic component.

  It is good to provide the heat dissipation member which contacts the surface in which the said electronic component in the said electrically-conductive member was supported directly or indirectly.

  The heat dissipation member can be fixed to the surface of the conductive member on which the electronic component is supported. Since there is no substrate on the surface side, there are not many restrictions on the shape and size of the heat dissipation member. Therefore, heat dissipation efficiency can be increased.

  A housing space for housing the electronic component may be formed on the conductive member side of the heat radiating member.

  By doing in this way, interference with an electronic component and a heat radiating member can be prevented.

  The electronic component and the heat dissipation member may be in direct or indirect contact.

  By doing in this way, the heat which generate | occur | produced in the electronic component can be effectively radiated | emitted via a heat radiating member (it becomes a structure where the whole between an electronic component and a heat radiating member is not an air layer).

  ADVANTAGE OF THE INVENTION According to this invention, the expansion of the mounting area (area which can be mounted) of the board | substrate which comprises a circuit structure can be aimed at.

It is sectional drawing of the circuit structure concerning 1st embodiment of this invention. It is a partially cutaway perspective sectional view of a circuit composition object concerning a first embodiment of the present invention (a heat dissipation member is omitted). BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view (a plan view of a portion below a substrate) of a circuit configuration body according to a first embodiment of the present invention excluding a substrate. It is sectional drawing of a circuit structure body in 2nd embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Unless otherwise specified, the plane direction in the following description refers to the direction along the conductive member 20 and the substrate 30 that are plate-like members, and the height direction (vertical direction) is orthogonal to the plane direction. It shall be the direction. In addition, these directions are for description, Comprising: The installation direction of the circuit structure 1 is not limited.

  A circuit structure 1 according to a first embodiment of the present invention will be described with reference to FIGS. The circuit configuration body 1 according to the present embodiment includes an electronic component 10, a conductive member 20, and a substrate 30.

  The electronic component 10 is an element supported on the upper surface of the conductive member 20 (hereinafter also referred to as a support surface 20a), and has a main body 11 and a plurality of terminals. The terminals of the electronic component 10 in this embodiment can be classified into those that are electrically connected to the conductive member 20 and those that are electrically connected to the conductive pattern 31 (wiring pattern) formed on the substrate 30. More specifically, one that is electrically connected to the first conductor 21 of the conductive member 20, which will be described in detail later, one that is electrically connected to the second conductor 22 of the conductive member 20, and the substrate 30. It can be divided into those that are electrically connected to the conductive pattern 31 formed in the above. Hereinafter, the first terminal 12 is electrically connected to the first conductor 21, the second terminal 13 is electrically connected to the second conductor 22, and the conductive pattern formed on the substrate 30. What is electrically connected to 31 is referred to as a third terminal 14.

  An example of the electronic component 10 is an FET (transistor). In this case, the source terminal corresponds to the first terminal 12, the drain terminal corresponds to the second terminal 13, and the gate terminal corresponds to the third terminal 14. In the FET (transistor) which is the electronic component 10 in the present embodiment, the source terminal which is the first terminal 12 and the gate terminal which is the third terminal 14 are located on one side, and the drain which is the second terminal 13 on the opposite side. The terminal is located. Each terminal is located below the main body 11. Specifically, a part of the terminal is exposed on the bottom surface of the main body 11.

  In addition, the electronic component 10 in the following description has the 1st terminal 12, the 2nd terminal 13, and the 3rd terminal 14 one each in order to make description easy to understand. However, the number of terminals included in the electronic component 10 may not be one. Also, a plurality of such electronic components 10 may be provided.

  The conductive member 20 is a plate-like member that supports the electronic component 10. The conductive member 20 is formed into a predetermined shape by press working or the like. The conductive member 20 is also referred to as a bus bar (bus bar plate) or the like. The conductive member 20 is a circuit that is different (electrically independent) from a circuit configured by the conductive pattern 31 formed on the substrate 30. In the present embodiment, the conductive member 20 constructs a power line, and the conductive pattern 31 formed on the substrate 30 constructs a signal line. That is, by controlling ON / OFF of the FET that is the electronic component 10 through the conductive pattern 31, energization to the power line constructed by the conductive member 20 is controlled.

  The conductive member 20 in the present embodiment includes a first conductor 21 and a second conductor 22 that are fixed to the substrate 30 in a state of being separated from each other. That is, the first conductor 21 and the second conductor 22 are not directly electrically connected. The first conductor 21 and the second conductor 22 are kept in a predetermined positional relationship (a state separated from each other) by a heat radiating member 50 described later, a case (not shown) for housing the circuit component 1, or the like. Is maintained. As described above, the first conductor 21 is one to which the first terminal 12 of the electronic component 10 is electrically connected. The second conductor 22 is one to which the second terminal 13 of the electronic component 10 is electrically connected. A plurality of first conductors 21 and second conductors 22 may be used depending on the number of electronic components 10.

  The electronic component 10 is mounted so as to straddle the first conductor 21 and the second conductor 22 existing with a gap therebetween. The first terminal 12 is connected to the first conductor 21, and the second terminal 13 is connected to the second conductor 22. The third terminal 14 of the electronic component 10 is located on the same side as the first terminal 12. In the present embodiment, the first conductor 21 of the conductive member 20 is formed with a notch 211 that is partially cut away, and the notch 211 and the third terminal 14 are in the height direction. Overlap. Specifically, the first conductor 21 and the second conductor 22 are arranged such that the side edges facing each other are positioned substantially parallel to each other, but a part of the first conductor 21 is separated from the second conductor 22. The notch 211 is cut away so as to move away (having a concave shape in plan view), and the notch 211 that is the notched portion and the third terminal 14 overlap (see FIG. 3). That is, the conductive member 20 (first conductor 21) has a shape that does not overlap the third terminal 14 in the height direction, and the third terminal 14 is exposed without being covered by the conductive member 20. In the present embodiment, the conductive member 20 (first conductor 21) has a shape that does not overlap the entire third terminal 14, but overlaps a part of the third terminal 14 and does not overlap the other part. It may be a shape. As will be described later, since the third terminal 14 is connected to the relay member 40, it is preferable that at least the relay member 40 side of the third terminal 14 does not overlap the conductive member 20. In the case of such a configuration, a part of the third terminal 14 and the conductive member 20 (first conductor 21) overlapping therewith are insulated from each other so as not to be short-circuited.

  The substrate 30 is formed with a conductive pattern 31 (only part of which is shown in FIGS. 1 and 2 and omitted in other figures for easy understanding). The conductive pattern 31 is connected to the third terminal 14 that is the gate terminal of the FET that is the switching element.

  In the present embodiment, the substrate 30 is provided apart from the conductive member 20. Specifically, the conductive member 20 is positioned on one side of the electronic component 10 and the substrate 30 is positioned on the other side of the electronic component 10. That is, the electronic component 10 is positioned between the substrate 30 and the conductive member 20. The substrate 30 is also provided away from the electronic component 10.

  The conductive pattern 31 formed on the third terminal 14 of the electronic component 10 and the substrate 30 is electrically connected via the relay member 40. The relay member 40 in the present embodiment is a linear member provided so as to be orthogonal to the third terminal 14 extending along the planar direction (extending in the height direction). One end of the relay member 40 is connected to the third terminal 14, and the other end is passed through a through hole 32 formed in the substrate 30. The conductive pattern 31 to be connected to the third terminal 14 may be formed on either one surface or the other surface of the substrate 30 (may be formed on both surfaces). The other end side of the relay member 40 passed through 32 is connected to the conductive pattern 31 via a conductive material such as solder.

  In this way, the substrate 30 is in a state of floating away from the conductive member 20. The substrate 30 is supported so as to maintain the state by a case or the like that accommodates the circuit structure 1.

  As described above, the conductive member 20 has a shape that does not overlap the third terminal 14. Therefore, the connection work between the third terminal 14 and the relay member 40 is easy. If it is a previous stage which fixes the heat radiating member 50 mentioned later to the electrically-conductive member 20, it is possible to connect the 3rd terminal 14 and the relay member 40 with solder etc. from the lower side of the electrically-conductive member 20. FIG.

  The heat radiating member 50 is in direct or indirect contact with the lower surface of the conductive member 20 (the surface on the opposite side of the support surface 20a, hereinafter also referred to as the opposite surface 20b). In the present embodiment, in order to prevent a short circuit through the heat radiating member 50, the heat radiating member 50 is indirectly in contact with the conductive member 20 through the insulating material 51 (insulating layer). As long as the short circuit through the heat radiating member 50 can be prevented by other configurations, the heat radiating member 50 may be in direct contact with the conductive member 20. Since the heat dissipation member 50 is a member for increasing the heat dissipation efficiency of heat generated by the electronic component 10 and other components, the insulating material 51 is preferably formed of a material having high thermal conductivity. The shape of the heat dissipation member 50 itself may be any shape. The outer surface may be provided with irregularities or the like for increasing the heat radiation area.

  In this way, the heat radiating member 50 may be brought into direct or indirect contact with the opposite surface 20b, which is the opposite surface of the support surface 20a on which the electronic component 10 is supported in the conductive member 20. Since the substrate 30 does not exist on the opposite side, there are not many restrictions on the shape and size of the heat dissipation member 50. Moreover, since the opposite surface 20b is not a surface on which the electronic component 10 is supported, the direct or indirect contact area between the conductive member 20 and the heat dissipation member 50 can be increased. Therefore, heat dissipation efficiency can be increased.

  In addition, it is good also as a structure in which the thermal radiation member 50 (and insulating material 51) is not provided. Even with such a configuration, a certain degree of heat radiation performance through the conductive member 20 can be ensured.

  As described above, in the circuit structure 1 according to the present embodiment, since the substrate 30 is provided away from the conductive member 20, both the one surface 30a and the other surface 30b of the substrate 30 are used as mounting surfaces. Can be used.

  Hereinafter, the circuit structure 2 according to the second embodiment of the present invention will be described focusing on differences from the circuit structure 1 according to the first embodiment.

  The circuit structure 2 according to the present embodiment shown in FIG. 4 is common to the circuit structure 1 according to the first embodiment in that the substrate 30 is provided away from the conductive member 20. Is different from the circuit configuration body 1 according to the first embodiment. In the present embodiment, not only the conductive member 20 but also the substrate 30 is located on one side of the electronic component 10. Considering the conductive member 20 as a reference, the substrate 30 is located on the opposite surface 20b side, which is the opposite side of the support surface 20a on the conductive member 20 on which the electronic component 10 is supported.

  Even with such a configuration, both the one surface 30a and the other surface 30b of the substrate 30 can be used as mounting surfaces.

  Also in the present embodiment, the third terminal 14 of the electronic component 10 and the conductive pattern 31 formed on the substrate 30 are connected by the relay member 40 extending in the height direction. Specifically, since the conductive member 20 has a shape that does not overlap the third terminal 14 by the notch 211, the relay member 40 penetrates the conductive member 20 in the thickness direction through the notch 211. Are arranged as follows. Thus, if the shape is such that the conductive member 20 does not overlap the third terminal 14, the connection work between the relay member 40 and the third terminal 14 is easy.

  In this embodiment, since the board | substrate 30 is located in the opposite surface 20b side of the electrically-conductive member 20, it is difficult to provide the heat radiating member 50 in the said opposite surface 20b side. Therefore, the heat dissipation member 50 in this embodiment is in direct or indirect contact with the support surface 20a of the conductive member 20. Specifically, the heat dissipation member 50 is joined directly or indirectly within a range where the electronic component 10 does not overlap on the support surface 20a of the conductive member 20. Similar to the above embodiment, an insulating material 51 having excellent thermal conductivity may be interposed between the two.

  Thus, since the heat radiating member 50 is provided on the same side as the electronic component 10 with the conductive member 20 as a reference, it is necessary to prevent interference between the heat radiating member 50 and the electronic component 10. In the heat dissipation member 50 in the present embodiment, a housing space 52 that is a recess that is recessed from the bottom to the top (opened on the lower side) is formed, and the electronic component 10 (the main body 11) is formed in the housing space 52. Is in a state where at least a part of it enters. And since the part in which the accommodation space 52 in the heat radiating member 50 is not formed is directly or indirectly connected to the support surface 20a of the conductive member 20, the heat generated by the electronic component 10 or other components is 20 radiates heat from the heat radiating member 50.

  The electronic component 10 and the heat dissipation member 50 may be in direct or indirect contact. This is because the heat generated by the electronic component 10 is transmitted to the heat dissipation member 50 without passing through the conductive member 20. That is, the electronic component 10 (main body portion 11) and the inner wall surface of the housing space 52 formed in the heat dissipation member 50 may be in direct or indirect contact with each other. Rather than having a structure in which the electronic component 10 and the heat dissipation member 50 are in direct contact with each other, it is preferable to have a structure in which both are in indirect contact with each other through some material. Since it is an air layer that inhibits heat conduction between the two, it is preferable that a transmission material 60 having excellent heat conductivity be interposed between the two as shown in FIG. This is because even if the two are in direct contact with each other, a minute air layer is present, and therefore the heat dissipation efficiency is enhanced when the transmission material 60 is interposed.

  As mentioned above, although embodiment of this invention was described in detail, this invention is not limited to the said embodiment at all, A various change is possible in the range which does not deviate from the summary of this invention.

1, 2 Circuit component 10 Electronic component 11 Body 12 First terminal (source terminal)
13 Second terminal (drain terminal)
14 Third terminal (gate terminal)
20 Conductive member 20a Support surface 20b Opposite surface 21 First conductor 211 Notch 22 Second conductor 30 Substrate 30a One surface 30b The other surface 31 Conductive pattern 32 Through hole 40 Relay member 50 Heat dissipation member 51 Insulating material 52 Housing space 60 Transmission material

Claims (9)

An electronic component having a plurality of terminals;
A member that supports the electronic component, and a conductive member to which some terminals of the electronic component are electrically connected; and
A substrate on which a conductive pattern to which other terminals of the electronic component are electrically connected is formed;
With
The circuit structure according to claim 1, wherein the substrate is provided apart from the conductive member.   The circuit structure according to claim 1, wherein the conductive member is formed so as not to overlap at least a part of another part of the terminal of the electronic component.   The circuit structure according to claim 1, further comprising a relay member that connects another terminal of the electronic component and the conductive pattern of the substrate.   4. The circuit configuration according to claim 1, wherein the conductive member is provided on one side of the electronic component, and the substrate is provided on the other side of the electronic component. 5. body.   The circuit structure according to claim 4, further comprising a heat dissipation member that directly or indirectly contacts a surface of the conductive member opposite to a surface on which the electronic component is supported.   The circuit structure according to claim 1, wherein the conductive member and the substrate are provided on one side of the electronic component.   The circuit structure according to claim 6, further comprising a heat dissipation member that directly or indirectly contacts a surface of the conductive member on which the electronic component is supported.   The circuit structure according to claim 7, wherein an accommodation space for accommodating the electronic component is formed on the conductive member side of the heat radiating member. The circuit component according to claim 7 or 8, wherein the electronic component and the heat dissipation member are in direct or indirect contact.

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