JP2016072472A - Multilayer circuit board, and method for manufacturing multilayer circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer circuit board excellent in reflow heat resistance and a method for manufacturing the same.SOLUTION: A multilayer circuit board includes: a multilayer substrate 500 which has such a multilayer structure that an insulating layer 30 and a circuit layer 20 are alternately laminated, whose the outermost layer constituting at least one surface of the multilayer structure is the circuit layer 20; a plating film 40 provided on the surface of the circuit layer 20; and an insulating resin layer 200 which is provided on a surface in an opposite side to the circuit layer 20 of the plating film 40. The insulating resin layer 200 is formed of a resin composition containing a thermosetting resin, and a guanidine derivative having a guanidine structural unit in a molecular structure. The guanidine structural unit is a guanidine group represented by the following formula (1).SELECTED DRAWING: Figure 1

Description

  The present invention relates to a multilayer circuit board and a method for manufacturing the multilayer circuit board.

  In recent years, with the demand for higher functionality of electronic devices, etc., high-density integration of electronic components, and further high-density mounting, etc. are progressing. Compared to the conventional technology, miniaturization and high density are progressing. As a countermeasure for increasing the density of this printed wiring board, a multilayer printed wiring board by a build-up method is often employed (Patent Document 1 etc.).

  A thermosetting resin composition is usually used for the insulating layer of the multilayer printed wiring board by the build-up method. In consideration of reliability and the like, a resin composition having a low coefficient of thermal expansion and a high glass transition temperature is required for the insulating layer. And the said insulating layer is requested | required for the improvement of the reliability after moisture absorption with the further further miniaturization wiring and size reduction in the future.

  In order to satisfy these requirements, various studies have been made on resin compositions for forming an insulating layer (Patent Document 2, etc.).

Japanese Patent Application Laid-Open No. 07-106767 JP 2010-77262 A

  However, it has been found that conventional multilayer printed wiring boards including conventional insulating layers still have room for improvement in terms of adhesion between the circuit layer and the insulating layer. Specifically, the present inventors have peeled (delaminated) the insulating layer from the circuit layer when a plurality of solder reflow processes are performed using a multilayer printed wiring board including a conventional insulating layer. It was found that there is a possibility that. Thus, the conventional multilayer printed wiring board including the insulating layer has room for improvement in terms of heat resistance after the solder reflow process, that is, reflow heat resistance.

  Based on the above, an object of the present invention is to provide a multilayer circuit board excellent in reflow heat resistance and a method for manufacturing the same.

According to the present invention, the multilayer base material has a multilayer structure in which insulating layers and circuit layers are alternately stacked, and the outermost layer constituting at least one surface of the multilayer structure is a circuit layer;
A plating film provided on the surface of the circuit layer;
An insulating resin layer provided on a surface opposite to the circuit layer of the plating film,
The insulating resin layer is
A thermosetting resin;
A guanidine derivative having a guanidine structural unit in the molecular structure, and a resin composition comprising
There is provided a multilayer circuit board in which the guanidine structural unit is a guanidine group represented by the following formula (1).

Furthermore, according to the present invention, the multilayer base material has a multilayer structure in which insulating layers and circuit layers are alternately laminated, and the outermost layer constituting at least one surface of the multilayer structure is a circuit layer;
A plating film provided on the surface of the circuit layer;
An insulating resin layer provided on a surface opposite to the circuit layer of the plating film,
A multilayer circuit board is provided in which the insulating resin layer is formed of a resin composition containing a thermosetting resin and wollastonite.

Furthermore, according to the present invention, a step of preparing a multilayer base material having a multilayer structure in which insulating layers and circuit layers are alternately laminated, wherein the outermost layer constituting at least one surface of the multilayer structure is a circuit layer; ,
Forming a plating film on the surface of the circuit layer;
Forming an insulating resin layer on a surface of the plating film opposite to the circuit layer,
The insulating resin layer is
A thermosetting resin;
A guanidine derivative having a guanidine structural unit in the molecular structure, and a resin composition comprising
There is provided a method for producing a multilayer circuit board, wherein the guanidine structural unit is a guanidine group represented by the following formula (1).

Furthermore, according to the present invention, a step of preparing a multilayer base material having a multilayer structure in which insulating layers and circuit layers are alternately laminated, wherein the outermost layer constituting at least one surface of the multilayer structure is a circuit layer; ,
Providing a plating film on the surface of the circuit layer;
A step of forming an insulating resin layer on the surface of the plating film opposite to the circuit layer,
There is provided a method for producing a multilayer circuit board, wherein the insulating resin layer is formed of a resin composition containing a thermosetting resin and wollastonite.

  ADVANTAGE OF THE INVENTION According to this invention, the multilayer circuit board excellent in reflow heat resistance, and its manufacturing method can be provided.

It is a mimetic diagram showing an example of a multilayer circuit board concerning this embodiment. It is a schematic diagram which shows an example of the manufacturing method of the multilayer circuit board which concerns on this embodiment. It is a schematic diagram which shows an example of the manufacturing method of the multilayer circuit board which concerns on this embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

<Multilayer circuit board 1000>
FIG. 1 is a schematic diagram showing an example of a multilayer circuit board 1000 according to the present embodiment.
As shown in FIG. 1, a multilayer circuit board 1000 according to this embodiment has a multilayer structure in which insulating layers 30 and circuit layers 20 are alternately stacked, and the outermost layer constituting at least one surface of the multilayer structure is a circuit. A multilayer substrate 500 that is the layer 20, a plating film 40 provided on the surface of the circuit layer 20, and an insulating resin layer 200 provided on the surface of the plating film 40 opposite to the circuit layer 20 It is.

  As shown in FIG. 1, the multilayer circuit board 1000 according to the present embodiment is provided with a first through via 300 that penetrates the multilayer circuit board 1000, and a through hole is formed in the side wall of the first through via 300. A plating 50 is formed. As shown in FIG. 1, the plating film 40 is formed integrally with a through-hole plating 50 that covers the side wall of the first through via 300. Furthermore, the multilayer circuit board 1000 according to the present embodiment includes a metal layer 60 provided on the surface of the insulating resin layer 200 opposite to the circuit layer 20, and the multilayer substrate 500 includes the multilayer substrate 500. A second through via 100 is provided to penetrate therethrough. The second through via 100 is provided such that a part of the surface of the insulating resin layer 200 on the circuit layer 20 side is exposed when viewed from the second through via 100.

  Here, the surface of the plating film 40 or the through-hole plating 50 is formed by, for example, forming an uneven shape on the surface by etching, or further chemically surface-treating using a silane coupling agent, a silane compound, an amine compound, or the like. It is preferable that By doing so, the adhesion between the insulating resin layer 200 and the plating film 40 can be improved as compared with the conventional multilayer circuit board. Here, the material for forming the plating film 40 and the through-hole plating 50 is, for example, copper and / or a copper-based alloy, aluminum and / or an aluminum-based alloy, iron and / or an iron-based alloy, silver and / or a silver-based material. Metal foils such as alloys, gold and / or gold alloys, zinc and / or zinc alloys, nickel and / or nickel alloys, tin and / or tin alloys can be used.

  The thickness of the insulating resin layer 200 according to the present embodiment is preferably 5 μm or more and 300 μm or less, and more preferably 10 μm or more and 250 μm or less, from the viewpoint of improving the electrical connection reliability of the multilayer circuit board 1000. In addition, the detail of the resin composition which forms the insulating resin layer 200 which concerns on this embodiment is mentioned later.

  In the present embodiment, various factors such as dielectric characteristics, mechanical and electrical connection reliability under high temperature and high humidity are controlled by highly controlling various factors related to the composition of the resin composition forming the insulating resin layer 200. The characteristics can be further improved.

<Method for Manufacturing Multilayer Circuit Board 1000>
With reference to FIG. 2 and FIG. 3, the manufacturing method of the multilayer circuit board 1000 which concerns on this embodiment is demonstrated.
First, the core layer 10 shown in FIG. Next, as shown in FIG. 2B, the insulating layer 30 and the circuit layer 20 are alternately laminated on both surfaces of the prepared core layer 10, and a multilayer structure is formed by heating and pressing. At this time, the insulating layer 30 and the circuit layer 20 are laminated so that the outermost layer constituting at least one surface of the multilayer structure becomes the circuit layer 20. In the manufacturing method according to the present embodiment, the multilayer substrate 500 is manufactured in this manner.
In addition, as for the temperature heated when forming the multilayered structure mentioned above, it is preferable that the highest attained temperature is 165 degreeC or more and 250 degrees C or less, and it is further more preferable that the highest attained temperature is 175 degreeC or more and 200 degrees C or less. The pressure applied is preferably 0.5 MPa or more and 5 MPa or less, and more preferably 1 MPa or more and 4 MPa or less.

  The core layer 10 described above is formed, for example, by impregnating a base material with the resin composition that forms the insulating resin layer 200 described above. Thereby, the core layer 10 suitable for manufacturing a printed wiring board excellent in various characteristics such as dielectric properties, mechanical and electrical connection reliability under high temperature and high humidity can be obtained. Examples of the base material described above include glass fiber base materials such as glass woven fabric and glass nonwoven fabric, polyamide resin fibers, aromatic polyamide resin fibers, polyamide resin fibers such as wholly aromatic polyamide resin fibers, and polyester resin fibers. Synthetic fiber base materials composed of woven or non-woven fabrics mainly composed of polyester resin fibers such as aromatic polyester resin fibers and wholly aromatic polyester resin fibers, polyimide resin fibers and fluororesin fibers, kraft paper, cotton Examples thereof include organic fiber base materials such as paper base materials mainly composed of linter paper, mixed paper of linter and kraft pulp, and the like. Among these, a glass fiber base material is preferable. Thereby, the intensity | strength of the core layer 10 improves, a water absorption can be lowered | hung, and a thermal expansion coefficient can be made small.

  And as glass which comprises a glass fiber base material, E glass, C glass, A glass, S glass, D glass, NE glass, T glass, H glass etc. are mentioned, for example. Among these, E glass, T glass, or S glass is preferable. Thereby, the high elasticity of a glass fiber base material can be achieved and a thermal expansion coefficient can also be made small.

  In addition, the method of manufacturing the core layer 10 mentioned above prepares the resin varnish using an epoxy resin composition, for example, the method of immersing a base material in the resin varnish, the method of apply | coating with various coaters, the method of spraying by a spray, etc. Is mentioned. Among these, the method of immersing the base material in the resin varnish is preferable. Thereby, the impregnation property of the resin composition with respect to a base material can be improved. In addition, when a base material is immersed in a resin varnish, a normal impregnation coating equipment can be used. In addition, although it is desirable that the solvent used for the resin varnish exhibits good solubility with respect to the resin component in the resin composition, a poor solvent may be used as long as it does not have an adverse effect. Examples of the solvent exhibiting good solubility include acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, cyclopentanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, cellosolve, and carbitol. The solid content of the resin varnish is preferably 50 to 80% by weight, particularly preferably 60 to 78% by weight, based on the resin composition. Thereby, the impregnation property to the base material of a resin varnish can further be improved. The core layer 10 can be obtained by drying at a predetermined temperature for impregnating the substrate with the resin composition, for example, 90 to 220 ° C.

  Next, as illustrated in FIG. 2C, the second through via 100 is formed so as to penetrate the multilayer substrate 500 with respect to the multilayer substrate 500. Next, as shown in FIG. 2D, a plating film 40 is formed. And it is preferable that the surface of the formed plating film 40 is chemically surface-treated as mentioned above, for example. Here, in the second through via 100, when an insulating resin layer 200 described later is provided, a part of the surface of the insulating resin layer on the circuit layer side is exposed to the opening surface of the second through via. It is provided as follows. The material for forming the plating film 40 is, for example, copper and / or a copper-based alloy, aluminum and / or an aluminum-based alloy, iron and / or an iron-based alloy, silver and / or a silver-based alloy, gold and / or a gold-based material. Metal foils such as alloys, zinc and / or zinc-based alloys, nickel and / or nickel-based alloys, tin and / or tin-based alloys can be used. Moreover, it is preferable that the thickness of the plating film 40 shall be 10 micrometers or more and 200 micrometers or less from a viewpoint of making handleability favorable.

  Next, as shown in FIG. 2E, the plated film 40 formed on the multilayer base material 500 in which the second through via 100 is filled with the hole filling material, the second through via 100 is provided and filled with the hole filling material is formed. An insulating resin layer 200 is formed so as to cover it. At the same time, a metal layer 60 is formed on the surface of the formed insulating resin layer 200 opposite to the plating film 40.

  Next, as shown in FIG. 3 (f), for example, a first drill is used so as to penetrate through the multilayer substrate 500, the plating film 40, the insulating resin layer 200, and the metal layer 60 formed in the outermost layer. The through via 300 is formed. Next, as illustrated in FIG. 3G, the through-hole plating 50 is formed so as to cover the metal layer 60 formed in the outermost layer and the side surfaces of the first through via 300. It is preferable that the surface of the formed through-hole plating 50 is chemically surface-treated as described above, for example. The through-hole plating 50 is formed integrally with a plating film 40 formed so as to cover the surface of the circuit layer 20 and the side surface of the second through via 100. And the material which forms the through-hole plating 50 can use the same material as the material which forms the plating film 40 mentioned above.

  Next, the via 400 is formed by a drill or the like. Next, a plating film is formed on the sidewall of the via 400 (not shown). By doing so, the multilayer circuit board 1000 according to the present embodiment shown in FIG. 1 can be obtained.

  Here, a considerable amount of water vapor is generated during the solder reflow process. The water vapor pressure generated during the solder reflow process is applied to the interface region between the insulating resin layer 200 and the plating film 40 in the multilayer circuit board 1000.

  In the conventional multilayer circuit board, it is considered that the water vapor pressure generated during the above-described solder reflow processing becomes a peeling driving force between the insulating layer and the plating film, and peeling (delamination) occurs. Also, in the conventional multilayer circuit board, the surface of the plating film may be chemically treated in order to improve the adhesion between the insulating resin layer and the plating film. However, even when the surface of the plating film is chemically treated, the adhesion strength between the insulating resin layer and the plating film in the conventional multilayer circuit board suppresses the peeling (delamination) caused by the peeling driving force described above. It was not enough to do.

  On the other hand, the multilayer circuit board 1000 according to the present embodiment includes an insulating resin layer 200, a thermosetting resin, a guanidine derivative having a guanidine group represented by the following formula (1) in the molecular structure as a guanidine structural unit, or silica ash It forms with the resin composition containing a stone. By doing so, the adhesion between the insulating resin layer 200 and the plating film 40 can be improved as compared with the conventional multilayer circuit board. Therefore, the adhesion between the insulating resin layer 200 and the plating film 40 can be sufficiently maintained even after a thermal history is applied in the manufacturing process of the multilayer circuit board 1000. That is, according to this embodiment, since the insulating resin layer 200 is formed from the resin composition containing the specific component described above together with the thermosetting resin, the multilayer circuit board 1000 having excellent reflow heat resistance is realized. be able to.

  Hereinafter, the resin composition (hereinafter referred to as “insulating layer composition”) that forms the insulating resin layer 200 according to the present embodiment will be described in detail.

  The insulating resin layer 200 is formed of a thermosetting resin and an insulating layer composition containing a guanidine derivative having a guanidine group represented by the following formula (1) as a guanidine structural unit in the molecular structure, or wollastonite. By doing so, the multilayer circuit board 1000 can be made excellent in reflow heat resistance. This is because the guanidine derivative having a guanidine group represented by the following formula (1) as a guanidine structural unit and wollastonite (wollastonite) in the above-described molecular structure both include a thermosetting resin. It is mentioned that it is a material which can improve the sclerosis | hardenability and adhesiveness of a layer composition.

  The guanidine derivative has a guanidine group represented by the above formula (1) in the molecular structure as a guanidine structural unit, and has a functional group represented by the following formula (2) as a guanidine structural unit. It is still more preferable that it is a compound represented by following General formula (3).

(In General Formula (3), A is a substituted or unsubstituted aromatic ring.)

  In general, guanidine is considered to be a raw material for resin compositions having excellent flexibility and thermal stability. Therefore, when a guanidine derivative having a specific guanidine structural unit as in this embodiment is included in the insulating layer composition together with the thermosetting resin, the crosslink density is increased and the glass transition temperature is increased. Insulating resin layer 200 having excellent properties, heat resistance and heat insulation can be formed. Thereby, the multilayer circuit board 1000 provided with the insulating resin layer 200 including a guanidine derivative having a specific guanidine structural unit together with the thermosetting resin can be excellent in reflow heat resistance.

  Examples of the guanidine derivative include 1-o-tolylbiguanide and dicyandiamide. Among these, 1-o-tolylbiguanide represented by the general formula (3) is preferable.

  Wollastonite (wollastonite) is a mineral containing calcium silicate as a main component. The shape is needle-like, plate-like or fibrous. And wollastonite (wollastonite) is a material that hardly has crystal water and is difficult to be thermally decomposed. That is, wollastonite (wollastonite) is a mineral having almost no thermal decomposability. Wollastonite is also a material with excellent heat resistance. Furthermore, when wollastonite (wollastonite) is included in the insulating layer composition, the durability of the insulating layer composition can be improved. Therefore, when the wollastonite (wollastonite) is included in the insulating layer composition together with the thermosetting resin as in this embodiment, the insulating resin layer 200 having excellent durability, heat resistance, and heat insulating properties is formed. can do. Thereby, the multilayer circuit board 1000 provided with the insulating resin layer 200 containing wollastonite (wollastonite) together with the thermosetting resin can be excellent in reflow heat resistance.

  The content of the guanidine derivative having a guanidine group represented by the following formula (1) in the molecular structure as a guanidine structural unit is 0.03% by mass or more and 10% by mass when the total solid content of the insulating layer composition is 100% by mass. The content is preferably not more than mass%, more preferably not less than 0.03 mass% and not more than 5 mass%. By doing so, the reflow heat resistance of the insulating resin layer 200 can be further improved.

  The content of wollastonite (wollastonite) is preferably 1% by mass or more and 40% by mass or less, preferably 2% by mass or more and 20% by mass or less, when the total solid content of the insulating layer composition is 100% by mass. Is more preferable. By doing so, the reflow heat resistance of the insulating resin layer 200 can be further improved.

  The content of the thermosetting resin is preferably 10% by mass or more and 70% by mass or less, and 20% by mass or more and 50% by mass or less, when the total solid content of the insulating layer composition is 100% by mass. Further preferred. By doing so, the adhesion between the insulating resin layer 200 and the plating film 40 can be further improved.

  The insulating layer composition forming the insulating resin layer 200 preferably contains a bisphenol A type novolak compound from the viewpoint of further improving the reflow heat resistance at 260 ° C.

  The content of the bisphenol A type novolak compound is preferably 2% by mass or more and 40% by mass or less, preferably 5% by mass or more and 20% by mass or less, when the total solid content of the insulating layer composition is 100% by mass. And more preferred. By doing so, the insulating resin layer 200 having excellent reflow heat resistance can be realized.

  Examples of the thermosetting resin contained in the insulating layer composition that forms the insulating resin layer 200 include an epoxy resin. As this epoxy resin, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol E type epoxy resin, bisphenol M type epoxy resin, bisphenol P type epoxy resin, bisphenol Z type epoxy resin, etc. Bisphenol type epoxy resin, phenol novolac type epoxy resin, novolac type epoxy resin such as cresol novolak type epoxy resin, arylalkylene type epoxy resin such as biphenyl type epoxy resin and biphenyl aralkyl type epoxy resin, naphthalene type epoxy resin, anthracene type epoxy Resin, phenoxy type epoxy resin, brominated epoxy resin, dicyclopentadiene type epoxy resin, norbornene type epoxy resin, adamant Emission type epoxy resins, tetraphenol group ethane novolak type epoxy resins, such as epoxy resins and fluorene type epoxy resins. One of these can be used alone, or two or more can be used in combination.

  Although content of an epoxy resin is not specifically limited, It is preferable that they are 15 mass% or more and 80 mass% or less of the whole insulating layer composition. More preferably, it is 25 mass% or more and 50 mass% or less.

  The insulating layer composition may contain a thermosetting resin other than an epoxy resin such as a melamine resin, a urea resin, or a cyanate ester resin. Although it does not specifically limit as a kind of cyanate resin, For example, bisphenol-type cyanate resin, such as a novolak-type cyanate resin, a bisphenol A-type cyanate resin, a bisphenol E-type cyanate resin, a tetramethylbisphenol F-type cyanate resin, etc. can be mentioned.

  The insulating layer composition preferably contains an inorganic filler. Examples of the inorganic filler include silicates such as talc, fired clay, unfired clay, mica, and glass, oxides such as titanium oxide, alumina, silicon dioxide, silica, and fused silica, calcium carbonate, magnesium carbonate, hydro Carbonates such as talcite, hydroxides such as aluminum hydroxide, magnesium hydroxide, calcium hydroxide, sulfates or sulfites such as barium sulfate, calcium sulfate, calcium sulfite, zinc borate, barium metaborate, boric acid Examples thereof include borates such as aluminum, calcium borate and sodium borate, nitrides such as aluminum nitride, boron nitride, silicon nitride and carbon nitride, titanates such as strontium titanate and barium titanate. One of these can be used alone, or two or more can be used in combination. Among these, aluminum hydroxide is particularly preferable.

  The inorganic filler is not particularly limited, and an inorganic filler having a monodispersed average particle diameter can be used, and an inorganic filler having a polydispersed average particle diameter can also be used. Furthermore, one or two or more inorganic fillers having an average particle size of monodisperse and / or polydisperse can be used in combination.

  Although content of an inorganic filler is not specifically limited, 2 mass% or more and 70 mass% or less of the whole insulating layer composition are preferable, and 5 mass% or more and 60 mass% or less are especially preferable. When the content is within the above range, particularly low thermal expansion and low water absorption can be achieved.

  The insulating layer composition may further contain a coupling agent. By blending a coupling agent with the insulating layer composition, the wettability of the interface between the thermosetting resin and the inorganic filler can be improved. Thereby, heat resistance, especially solder heat resistance after moisture absorption can be improved.

Examples of the coupling agent include epoxy silane coupling agents, amino silane coupling agents, cationic silane coupling agents, silane coupling agents such as vinyl silane coupling agents, titanate coupling agents, silicone oil type coupling agents, and the like. Is mentioned. These can be used alone or in combination of two or more.
Thereby, the wettability with the interface of an inorganic filler can be made high, and thereby heat resistance can be improved more.

  The insulating layer composition can further use a phenolic curing agent. As the phenolic curing agent, known or commonly used phenol novolac resins, alkylphenol novolac resins, dicyclopentadiene type phenol resins, zylock type phenol resins, terpene modified phenol resins, polyvinylphenols, etc. may be used alone or in combination. Can do.

  A curing catalyst may be used for the insulating layer composition as necessary. A well-known thing can be used as a curing catalyst. For example, organic metal salts such as zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), trisacetylacetonate cobalt (III), triethylamine, tributylamine, diazabicyclo [2.2 .2] Tertiary amines such as octane, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 2,4-diethylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4 -Imidazoles such as methyl-5-hydroxyimidazole and 2-phenyl-4,5-dihydroxyimidazole, phenol compounds such as phenol, bisphenol A and nonylphenol, acetic acid, benzoic acid, salicylic acid, p-toluenesulfonic acid, etc. Such as an acid, or a mixture thereof. As the curing catalyst, one kind including these derivatives can be used alone, or two or more kinds including these derivatives can be used in combination.

  Insulating layer composition is made of thermoplastic resin such as phenoxy resin, polyimide resin, polyamideimide resin, polyamide resin, polyphenylene oxide resin, polyethersulfone resin, polyester resin, polyethylene resin, polystyrene resin, styrene-butadiene copolymer, styrene -Polystyrene thermoplastic elastomers such as isoprene copolymers, thermoplastic elastomers such as polyolefin thermoplastic elastomers, polyamide elastomers, and polyester elastomers, and diene elastomers such as polybutadiene, epoxy-modified polybutadiene, acrylic-modified polybutadiene, and methacryl-modified polybutadiene. May be used in combination. Among these, heat-resistant polymer resins such as phenoxy resin, polyimide resin, polyamideimide resin, polyamide resin, polyphenylene oxide resin, and polyethersulfone resin are preferable. Thereby, the thickness uniformity of the build-up material is excellent, and as a wiring board, the heat resistance and the insulating property of fine wiring are excellent. In addition, if necessary, additives other than the above components such as pigments, dyes, antifoaming agents, leveling agents, ultraviolet absorbers, foaming agents, antioxidants, flame retardants, and ion scavengers may be added to the insulating layer composition. Things may be added.

  It should be noted that the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention. The present invention is not limited to this, and each part of the multilayer circuit board 1000 can be replaced with any structure that can exhibit the same function. Moreover, arbitrary components may be added.

As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.
In the above embodiment, the case where the first through via 300 penetrating the multilayer circuit board 1000 is used as an example has been described, but the insulating layers 30 and the circuit layers 20 are alternately stacked. A multilayer substrate 500 having a multilayer structure, and the outermost layer constituting at least one surface of the multilayer structure is the circuit layer 20, a plating film 40 provided on the surface of the circuit layer 20, and a circuit layer of the plating film 40 20 is provided with an insulating resin layer 200 provided on the opposite side of the surface,
Insulating layers 30 and circuit layers 20 are alternately stacked on one side or both sides of core layer 10, and the layers are electrically connected by, for example, plating a non-penetrating via formed using a laser. The multilayer circuit board 1000 may be a build-up board. Even in this case, the same effect as the above embodiment can be obtained.

  Next, examples of the present invention will be described.

  The raw material components used in each example and comparative example are shown below. Unless otherwise specified, “%” described below indicates “mass%”.

(Thermosetting resin (A))
・ Bisphenol A type epoxy resin (Mitsubishi Chemical Corporation, jER828)
・ Brominated epoxy resin (Der Chemical Co., DER530)

(Guanidine derivative (B))
1-o-tolyl biguanide (Ouchi Shinsei Chemical Co., Ltd., Noxeller BG)

(Wollastonite (C))
・ Wollastonite (manufactured by Kinsei Matec, FPW series)

(Other additives)
Phenol novolac resin (Sumitomo Bakelite, PR-51470)
・ Bisphenol A type novolak compound (manufactured by DIC, LF-4871)
Catalyst: 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., 2P4MZ)
Silane coupling agent: 3-glycidoxypropyltrimethoxysilane (Momentive Performance Materials Japan, SILQUEST A-187)
・ Aluminum hydroxide

(Examples and Comparative Examples)
A multilayer circuit board shown in FIG. 1 including the insulating resin layers formed using the insulating layer compositions of Examples 1 to 4 and Comparative Examples 1 and 2 in which the respective components are blended according to the blending amounts shown in Table 1 below is prepared. did. The thickness of each insulating resin layer was 80 μm.

  Each multilayer circuit board obtained was evaluated as follows.

(Evaluation item)
Moisture absorption reflow: The obtained multilayer circuit board was pretreated at a temperature of 40 ° C. and a humidity of 90% for 96 hours in accordance with IPC / JEDEC J-STD-20, and then passed through a 260 ° C. reflow furnace to obtain a multilayer circuit board. The presence or absence of blistering was evaluated. The symbols described in Table 1 below are as follows.
◯: No swelling of the multilayer circuit board occurred even when repeated 5 times or more.
X: Swelling of the multilayer circuit board occurred before repeating 5 times.

  The multilayer circuit boards obtained in each example were all excellent in reflow heat resistance. On the other hand, the multilayer circuit board of the comparative example could not obtain good results in terms of reflow heat resistance.

DESCRIPTION OF SYMBOLS 10 Core layer 20 Circuit layer 30 Insulating layer 40 Plating film 50 Through-hole plating 60 Metal layer 100 2nd through-via 200 Insulating resin layer 300 1st through-via 400 Via 500 Multilayer base material 1000 Multilayer circuit board

Claims (14)

A multilayer base material having a multilayer structure in which insulating layers and circuit layers are alternately laminated, and an outermost layer constituting at least one surface of the multilayer structure is a circuit layer;
A plating film provided on the surface of the circuit layer;
An insulating resin layer provided on a surface opposite to the circuit layer of the plating film,
The insulating resin layer is
A thermosetting resin;
A guanidine derivative having a guanidine structural unit in the molecular structure, and a resin composition comprising
The multilayer circuit board whose said guanidine structural unit is a guanidine group shown by following formula (1).

The multilayer circuit board according to claim 1,
The multilayer circuit board whose said guanidine structural unit is a functional group shown by following formula (2).

The multilayer circuit board according to claim 1 or 2,
A multilayer circuit board, wherein the guanidine derivative is a compound represented by the following general formula (3).

(In General Formula (3), A is a substituted or unsubstituted aromatic ring.) A multilayer circuit board according to any one of claims 1 to 3,
The multilayer circuit board in which the said insulating resin layer was further formed with the said resin composition containing a bisphenol A type novolak compound. A multilayer base material having a multilayer structure in which insulating layers and circuit layers are alternately laminated, and an outermost layer constituting at least one surface of the multilayer structure is a circuit layer;
A plating film provided on the surface of the circuit layer;
An insulating resin layer provided on a surface opposite to the circuit layer of the plating film,
A multilayer circuit board in which the insulating resin layer is formed of a resin composition containing a thermosetting resin and wollastonite. A multilayer circuit board according to any one of claims 1 to 5,
The multilayer circuit board is provided with a first through via that penetrates the multilayer circuit board,
A multilayer circuit board, wherein through-hole plating is formed on a side wall of the first through via. The multilayer circuit board according to claim 6, wherein
The multi-layer circuit board, wherein the plating film is formed integrally with the through-hole plating that covers the side wall of the first through via. A multilayer circuit board according to any one of claims 1 to 7,
A metal layer provided on the surface of the insulating resin layer opposite to the circuit layer,
The multilayer circuit board, wherein the multilayer substrate is provided with a second through via penetrating the multilayer substrate. A multilayer circuit board according to any one of claims 1 to 8,
A multilayer circuit board, wherein a part of the surface on the circuit layer side of the insulating resin layer is in contact with an opening peripheral edge of the second through via. A step of preparing a multilayer base material having a multilayer structure in which insulating layers and circuit layers are alternately laminated, and wherein an outermost layer constituting at least one surface of the multilayer structure is a circuit layer;
Forming a plating film on the surface of the circuit layer;
Forming an insulating resin layer on a surface of the plating film opposite to the circuit layer,
The insulating resin layer is
A thermosetting resin;
A guanidine derivative having a guanidine structural unit in the molecular structure, and a resin composition comprising
The manufacturing method of a multilayer circuit board whose said guanidine structural unit is a guanidine group shown by following formula (1).

A method of manufacturing a multilayer circuit board according to claim 10,
The manufacturing method of a multilayer circuit board whose said guanidine structural unit is a functional group shown by following formula (2).

A method for producing a multilayer circuit board according to claim 10 or 11,
The manufacturing method of a multilayer circuit board whose said guanidine derivative is a compound represented by following General formula (3).

(In General Formula (3), A is a substituted or unsubstituted aromatic ring.) A method for manufacturing a multilayer circuit board according to any one of claims 10 to 12,
The method for manufacturing a multilayer circuit board, wherein the insulating resin layer is further formed of the resin composition containing a bisphenol A type novolak compound. A step of preparing a multilayer base material having a multilayer structure in which insulating layers and circuit layers are alternately laminated, and wherein an outermost layer constituting at least one surface of the multilayer structure is a circuit layer;
Providing a plating film on the surface of the circuit layer;
A step of forming an insulating resin layer on the surface of the plating film opposite to the circuit layer,
A method for producing a multilayer circuit board, wherein the insulating resin layer is formed of a resin composition containing a thermosetting resin and wollastonite.

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