JP2016060169A - Lamination molding device and lamination molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamination molding device capable of performing lamination molding using plural kinds of materials.SOLUTION: A lamination molding device comprises: a discharge part 41; a moving part 42; a control part; and a bond formation part. The discharge part 41 discharges plural kinds of powder-state materials 11C, the moving part 42 relatively moves the discharge part 41 and a supply area R facing the discharge part 41, for arranging the discharge part 41 on plural discharge positions facing plural zones S included in the supply area R, the control part causes the discharge part 41 arranged on the discharge position to discharge at least one kind of material 11C to the corresponding zone S, for forming a layer of the plural kinds of materials 11C on at least part of the supply area R, and the bond formation part bonds at least part of the plural kinds of materials 11C forming the layer.SELECTED DRAWING: Figure 2

Description

  Embodiments described herein relate generally to an additive manufacturing apparatus and an additive manufacturing method.

  The layered manufacturing apparatus performs layered modeling by, for example, forming a layer of a powdery material and combining a part of the material of each layer. Such a layered manufacturing apparatus forms a layer of material by supplying a material to a modeling tank in which layered modeling is performed and leveling the material with a roller or a squeezing blade, for example.

JP-A-10-226803

  According to the additive manufacturing apparatus capable of additive manufacturing using a plurality of types of materials, more types of additive manufacturing products can be manufactured. However, it is difficult for an additive manufacturing apparatus for leveling a material with a roller or a squeezing blade to supply a specific type of material to a specific position.

  An example of the problem to be solved by the present invention is to provide an additive manufacturing apparatus and additive manufacturing method capable of additive manufacturing using a plurality of types of materials.

  An additive manufacturing apparatus according to an embodiment includes a discharge unit, a moving unit, a control unit, and a bond forming unit. The discharge unit discharges a plurality of types of powdery materials. The moving unit relatively moves the discharge unit and a supply region facing the discharge unit, and arranges the discharge unit at a plurality of discharge positions facing a plurality of sections included in the supply region. The control unit causes the ejection unit disposed at the ejection position to eject at least one type of the material to the corresponding section, and forms a plurality of types of the material layers in at least a part of the supply region. Let The bond forming unit bonds at least a part of the plurality of types of the materials forming the layer.

FIG. 1 is a cross-sectional view schematically showing a three-dimensional printer according to the first embodiment. FIG. 2 is a perspective view illustrating a part of the stage and the supply device according to the first embodiment. FIG. 3 is a cross-sectional view showing a part of the stage and the supply device of the first embodiment. FIG. 4 is a flowchart illustrating a first example of a procedure for layered modeling of the modeled object of the first embodiment. FIG. 5 is a cross-sectional view showing a part of the stage and the supply device in which the nozzles of the first embodiment are arranged at the application position. FIG. 6 is a cross-sectional view illustrating a part of the stage and the supply apparatus in which the formation of the layers of the first embodiment is completed. FIG. 7 is a flowchart illustrating a second example of a procedure for layered modeling of the modeled object of the first embodiment. FIG. 8 is a perspective view showing a part of the stage and the supply device according to the second embodiment. FIG. 9 is a cross-sectional view showing a part of the stage and the supply apparatus according to the third embodiment. FIG. 10 is a cross-sectional view showing a part of the stage and the supply device according to the fourth embodiment. FIG. 11 is a cross-sectional view showing a part of the stage and the supply device according to the fifth embodiment. FIG. 12 is a cross-sectional view showing a part of the stage and the supply device according to the sixth embodiment.

  Hereinafter, a first embodiment will be described with reference to FIGS. 1 to 7. In the present specification, basically, a vertically downward direction is defined as a downward direction, and a vertically upward direction is defined as an upward direction. In addition, a plurality of expressions may be written together for the constituent elements according to the embodiment and the description of the elements. It is not precluded that other expressions not described in the component and description are made. Furthermore, it is not prevented that other expressions are given for the components and descriptions in which a plurality of expressions are not described.

  FIG. 1 is a cross-sectional view schematically showing a three-dimensional printer 10 according to the first embodiment. The three-dimensional printer 10 is an example of an additive manufacturing apparatus. The three-dimensional printer 10 forms a three-dimensional shaped object 13 by repeating the formation of the layer 12 using a plurality of types of powdered material 11 and the solidification of the material 11 forming the layer 12. FIG. 1 shows a shaped article 13 being formed. Further, FIG. 1 shows one layer 12 by a two-dot chain line.

  As shown in FIG. 1, the three-dimensional printer 10 includes a processing tank 21, a stage 22, a supply device 23, an optical device 24, and a control unit 25. The optical device 24 is an example of a bond forming unit. Note that when the three-dimensional printer 10 solidifies the material 11 by means other than the energy beam, the three-dimensional printer 10 may not have the optical device 24.

  The processing tank 21 can also be called a housing | casing, for example. The stage 22 may be referred to as a table, a modeling area, or a coating area, for example. The supply apparatus 23 may also be called a holding part, a throwing-down part, or a distribution part, for example. The optical device 24 may also be referred to as a forming unit or a solidifying unit, for example.

  The processing tank 21 is formed in a sealable box shape, for example. The processing tank 21 has a processing chamber 21a. The processing chamber 21a accommodates a stage 22, a supply device 23, and an optical device 24. The stage 22, the supply device 23, and the optical device 24 may be outside the processing chamber 21a.

  A supply port 31 and a discharge port 32 are provided in the processing chamber 21 a of the processing tank 21. For example, a gas supply device provided outside the processing tank 21 supplies an inert gas such as nitrogen and argon from the supply port 31 to the processing chamber 21a. For example, a gas discharge device provided outside the processing tank 21 discharges the inert gas in the processing chamber 21 a from the discharge port 32.

  The layer 12 of the powdery material 11 is formed on the stage 22, and the modeled product 13 is modeled. The stage 22 includes a mounting table 35, a peripheral wall 36, and an elevator 37.

  As shown in the drawings, in this specification, an X axis, a Y axis, and a Z axis are defined. The X axis, the Y axis, and the Z axis are orthogonal to each other. The X axis is along the width of the stage 22. The Y axis is along the depth (length) of the stage 22. The Z axis is along the height of the stage 22.

  The mounting table 35 is, for example, a square plate material. In addition, the shape of the mounting table 35 is not limited to this, and may be a member that exhibits other shapes such as a rectangle (quadrangle) such as a rectangle, a polygon, a circle, and a geometric shape. The mounting table 35 has an upper surface 35a and four end surfaces 35b. The upper surface 35a is a rectangular substantially flat surface. The end surface 35b is a surface orthogonal to the upper surface 35a.

  The upper surface 35a of the mounting table 35 can form a supply region R where the material 11 is supplied and the layer 12 of the material 11 is formed. The supply region R is not limited to the upper surface 35 a of the mounting table 35, but can be formed by a base plate placed on the upper surface 35 a of the mounting table 35. Further, when the layer 12 of the material 11 is formed in the supply region R of the mounting table 35, the layer 12 forms the next supply region R. In this way, the supply region R is sequentially formed on the mounting table 35.

  The peripheral wall 36 extends in a direction along the Z axis and is formed in a rectangular tube shape surrounding the mounting table 35. The four end surfaces 35 b of the mounting table 35 are in contact with the inner surface of the peripheral wall 36. The peripheral wall 36 is formed in a rectangular frame shape and has an open upper end 36a.

  The elevator 37 is, for example, a hydraulic elevator. The elevator 37 can move the mounting table 35 in the direction along the Z axis inside the peripheral wall 36. When the mounting table 35 moves upward, the upper surface 35a of the mounting table 35 and the upper end 36a of the peripheral wall 36 form substantially the same plane.

  The supply region R is disposed, for example, 50 μm below the upper end 36a of the peripheral wall 36. When the layer 12 of the material 11 is formed in the supply region R, and the layer 12 forms the next supply region R, the elevator 37 lowers the mounting table 35 by 50 μm. Thereby, the distance between the supply area | region R and the upper end 36a of the surrounding wall 36 is maintained at 50 micrometers. In addition, the distance between the supply area | region R and the upper end 36a of the surrounding wall 36 is not restricted to this, For example, it can change arbitrarily.

  The supply device 23 supplies the material 11 to the supply region R and solidifies the supplied material 11. The supply device 23 includes a discharge device 41, a moving device 42, a storage device 43, and a collection device 44. The discharge device 41 is an example in the case of including a supply unit and a coupling formation unit. The moving device 42 is an example of a moving unit.

  FIG. 2 is a perspective view showing a part of the stage 22 and the supply device 23. FIG. 3 is a cross-sectional view showing a part of the stage 22 and the supply device 23. As shown in FIGS. 2 and 3, the discharge device 41 includes a holder 51, a plurality of nozzles 52A, 52B, 52C, and 52D, and a plurality of tanks 53A, 53B, 53C, 53D, and 53E.

  The holder 51 holds a plurality of tanks 53A, 53B, 53C, 53D, 53E. The tanks 53A, 53B, 53C, 53D, and 53E held by the holder 51 are arranged in a line in the direction along the Y axis. The holder 51 has a lower surface 51a facing downward. The lower surface 51a faces the supply region R.

  The nozzles 52 </ b> A, 52 </ b> B, 52 </ b> C, 52 </ b> D are respectively provided on the lower surface 51 a of the holder 51 and face the supply region R. The nozzles 52A, 52B, 52C, 52D are arranged in a line in the direction along the Y axis. The arrangement of the nozzles 52A, 52B, 52C, and 52D is not limited to this.

  The nozzle 52A is connected to the tank 53A. The nozzle 52B is connected to the tank 53B. The nozzle 52C is connected to the tank 53C. The nozzle 52D is connected to the tanks 53D and 53E, respectively.

  The tanks 53A, 53B, and 53C accommodate a plurality of types of materials 11, respectively. As shown in FIG. 3, in the following description, the material 11 may be individually described as materials 11A, 11B, and 11C for each type.

  The plurality of materials 11 used by the three-dimensional printer 10 are powdery metal materials having a center particle diameter of about 40 μm. The material 11 is not limited to this. For example, the material 11 may be other materials such as synthetic resin, ceramics, and biological material. Further, the materials 11A, 11B, and 11C are materials of the same component, and may have different center particle sizes. As described above, the plurality of types of materials 11 are not limited to materials having different components, and may be, for example, materials having different center particle sizes or materials having different shapes.

  The tank 53A accommodates the powdery material 11A. The material 11A is, for example, iron powder. The tank 53B stores the powdered material 11B. The material 11B is, for example, copper powder. The tank 53C stores the powdery material 11C. The material 11C is, for example, aluminum powder. In addition, material 11A, 11B, 11C is not restricted to this.

  The tank 53D accommodates the adhesive 56. The adhesive 56 is a type of adhesive that can solidify the materials 11A, 11B, and 11C. The tank 53E contains the solvent 57. The solvent 57 is a solvent contained in the adhesive 56, for example.

  The nozzle 52A discharges the material 11A accommodated in the tank 53A. The nozzle 52B discharges the material 11B accommodated in the tank 53B. The nozzle 52C discharges the material 11C accommodated in the tank 53C. Thus, the discharge device 41 can discharge a plurality of types of materials 11 from the nozzles 52A, 52B, and 52C.

  The nozzles 52A, 52B, and 52C, for example, are opened and closed by electromagnetic valves, thereby discharging the materials 11A, 11B, and 11C of the tanks 53A, 53B, and 53C by gravity. The nozzles 52A, 52B, and 52C are openings having a diameter that is 6 times or more the center particle diameter of the materials 11A, 11B, and 11C. For this reason, the materials 11A, 11B, and 11C are smoothly discharged from the nozzles 52A, 52B, and 52C by gravity.

  The nozzles 52A, 52B, and 52C may discharge the materials 11A, 11B, and 11C by other means. For example, the nozzles 52A, 52B, and 52C may extrude the materials 11A, 11B, and 11C by an actuator, and may eject the materials 11A, 11B, and 11C by a carrier gas.

  The nozzle 52D discharges the adhesive 56 accommodated in the tank 53D. The nozzle 52D can discharge the adhesive 56 mixed with the solvent 57 of the tank 53E. The nozzle 52 </ b> D can change the amount of the solvent 57 to be mixed with the adhesive 56. That is, the discharge device 41 can discharge adhesives 56 having a plurality of concentrations from the nozzle 52D. The adhesives 56 having a plurality of concentrations are examples of a plurality of types of adhesives.

  The discharge device 41 may include a plurality of tanks 53D for storing a plurality of components and color adhesives 56 and a plurality of nozzles 52D for discharging the plurality of components and colors adhesives 56. As described above, the plurality of types of adhesives 56 are not limited to adhesives having different concentrations, and may be adhesives having different components and colors, for example.

  The moving device 42 moves the discharge device 41 in the direction along the X axis and the Y axis. That is, the moving device 42 relatively moves the discharge device 41 and the supply region R. The moving device 42 moves the nozzles 52A, 52B, and 52C that discharge the materials 11A, 11B, and 11C and the nozzle 52D that discharges the adhesive 56 as one body. The moving device 42 includes a rail 61 and two transport units 62.

  The rail 61 is disposed above the stage 22 and extends in the direction along the Y axis. The length of the rail 61 is longer than the length of the stage 22 in the direction along the Y axis. The rail 61 is bridged over the supply region R.

  The holder 51 of the discharge device 41 is movably attached to the rail 61. The rail 61 moves the discharge device 41 along the rail 61 by driving a mechanism having various components such as a motor, a gear, and a belt. That is, the rail 61 moves the discharge device 41 in the direction along the Y axis. The nozzles 52 </ b> A, 52 </ b> B, 52 </ b> C, 52 </ b> D of the discharge device 41 face the supply region R, but may be separated from the supply region R when the discharge device 41 is positioned at the end of the rail 61, for example.

  The two transport parts 62 are respectively placed on the upper end 36 a of the peripheral wall 36 of the stage 22. The two conveyance units 62 are arranged side by side in the direction along the Y axis. The conveyance unit 62 supports the rail 61. The conveyance unit 62 moves in a direction along the X axis by driving a mechanism having various components such as a motor. That is, the transport unit 62 moves the discharge device 41 attached to the rail 61 in the direction along the X axis.

  The moving device 42 is not limited to the above description. For example, the moving device 42 may further move the discharge device 41 in the direction along the Z axis. Further, the moving device 42 may move the discharge device 41 and the supply region R relatively by moving the stage 22.

  As shown in FIG. 1, the storage device 43 is connected to a plurality of tanks 53A, 53B, 53C, 53D, and 53E through a plurality of supply pipes 65, respectively. The storage device 43 supplies the materials 11A, 11B, and 11C, the adhesive 56, and the solvent 57 to the corresponding tanks 53A, 53B, 53C, 53D, and 53E. The supply pipe 65 has, for example, flexibility and stretchability, and is separated from the stage 22 regardless of the position of the discharge device 41.

  The tanks 53A, 53B, 53C, 53D, and 53E may be cartridges. In this case, the storage device 43 and the tanks 53A, 53B, 53C, 53D, and 53E may not be connected.

  The collection device 44 is connected to the storage device 43 through the collection pipe 66. For example, the collection device 44 extends in the direction along the Y axis and is movable above the stage 22 in the direction along the X axis. The collection device 44 sucks the lower powdered material 11 and sends it to the storage device 43.

  The optical device 24 includes an oscillation element, a light source that emits laser light L, a conversion lens that converts the laser light L into parallel light, a converging lens that converges the laser light L, and an irradiation position of the laser light L. It has various parts such as galvanometer mirrors. FIG. 1 shows the laser beam L with a two-dot chain line. The laser beam L is an example of an energy beam and can melt a plurality of types of materials 11. The energy beam may be any material that can melt the material, such as the laser beam L, and may be an electron beam or an electromagnetic wave in the microwave to ultraviolet region.

  The optical device 24 can change the power density of the laser light L. Furthermore, the optical device 24 can selectively emit laser light L having a plurality of wavelengths. Thus, the optical device 24 emits a plurality of types of laser light L. The plurality of types of laser beams L are not limited to laser beams L having different wavelengths, but may be laser beams L having different power densities, for example.

  The optical device 24 is located above the stage 22. Note that the optical device 24 may be disposed in another location. The optical device 24 converts the laser light L emitted from the light source into parallel light by the conversion lens. The optical device 24 reflects the laser light L to the galvanometer mirror that can change the tilt angle, and converges the laser light L by the converging lens, thereby irradiating the laser light L to a desired position in the supply region R.

  The control unit 25 is electrically connected to the stage 22, the supply device 23, and the optical device 24. The control unit 25 includes various electronic components such as a CPU, a ROM, and a RAM, for example. The control unit 25 controls the stage 22, the supply device 23, and the optical device 24 by reading and executing a program stored in the ROM or other storage device. The three-dimensional printer 10 performs layered modeling of the modeled object 13 based on the control (program) of the control unit 25.

  Hereinafter, a first example of a procedure in which the three-dimensional printer 10 laminates a modeled object 13 from a plurality of types of materials 11 in powder form will be described. In addition, the method in which the three-dimensional printer 10 performs the layered modeling of the modeled object 13 is not limited to the one described below.

  FIG. 4 is a flowchart showing a first example of a procedure for layered modeling of the modeled article 13. First, data of the three-dimensional shape of the modeled object 13 is input to the control unit 25 of the three-dimensional printer 10 from, for example, an external personal computer (S11). The three-dimensional shape data is, for example, CAD data, but is not limited thereto.

  The data of the three-dimensional shape includes information about the material that forms each part of the shaped article 13. That is, the three-dimensional shape data includes a portion of the molded article 13 made of the material 11A (hereinafter referred to as the first portion 13a) and a portion of the molded article 13 made of the material 11B (hereinafter referred to as the second portion). And the portion 13b).

  The modeled object 13 in the present embodiment is made of the materials 11A and 11B. The material 11C is used as a support material for supporting the layer 12. The modeled object 13 may be made of the materials 11A, 11B, and 11C, or may be made of four or more kinds of materials 11.

  Next, the control unit 25 divides the acquired three-dimensional shape of the data into a plurality of layers (slices). The control unit 25 converts the sliced three-dimensional shape into, for example, a collection of a plurality of points and a rectangular parallelepiped (pixel) (rasterization, pixelization). Thus, the control part 25 produces | generates the data of the several layer of a two-dimensional shape from the data of the three-dimensional shape of the acquired modeling thing 13 (S12). The generated data is stored in a storage unit (not shown) of the control unit 25. The area of each of the plurality of pixels included in the data of the two-dimensional shape layer is larger than the opening area of the nozzles 52A, 52B, and 52C.

  Next, the control part 25 produces | generates the data of the some layer 12 from the data of the said some two-dimensional-shaped layer (S13). The data of the plurality of layers 12 is a collection of a plurality of pixels similarly to the data of the plurality of layers having a two-dimensional shape. The data of the layer 12 includes a portion (first portion 13a) to which the material 11A is supplied and solidified, a portion (second portion 13b) to which the material 11B is supplied and solidified, and a material 11C. Part information.

  Next, the control unit 25 moves the discharge device 41 by the moving device 42 (S14). For example, the discharge device 41 is disposed in advance at an initial position where the nozzle 52A faces the corner portion of the supply region R. The moving device 42 moves the discharge device 41 from the initial position, for example, in a direction along the Y axis.

  As shown in FIG. 3, the supply region R includes a plurality of sections S. In FIG. 3, the plurality of sections S are separated by a two-dot chain line. The plurality of sections S are rectangular regions corresponding to the plurality of pixels of the data of the layer 12.

  When the moving device 42 moves the discharge device 41, the nozzles 52 </ b> A, 52 </ b> B, 52 </ b> C, and 52 </ b> D of the discharge device 41 sequentially pass above the section S. That is, the moving unit 42 sequentially arranges the nozzles 52A, 52B, 52C, and 52D at positions facing the section S of the supply region R. Hereinafter, the positions where the nozzles 52A, 52B, 52C face the section S are referred to as discharge positions. The discharge position is an example of a supply position. The position where the nozzle 52D faces the section S is referred to as an application position. After the nozzles 52A, 52B, 52C face the section S, the nozzle 52D faces the section S.

  In FIG. 3, the layer 12 forms the supply region R. Initially, the upper surface 35 a of the mounting table 35 forms the supply region R. The supply region R may be formed by a base plate placed on the upper surface 35 a of the mounting table 35 or a layer 12 of the material 11 formed in advance on the upper surface 35 a of the mounting table 35.

  Next, the control unit 25 determines whether or not the corresponding nozzles 52A, 52B, and 52C face each section S (S15). That is, the control unit 25 determines whether or not the nozzles 52A, 52B, and 52C are arranged at the discharge positions facing the corresponding section S.

  For example, the control unit 25 detects the positions of the nozzles 52A, 52B, 52C, and 52D of the discharge device 41 by acquiring the rotation amount of the motor included in the rail 61 and the transport unit 62 with a sensor. The control unit 25 may detect the positions of the nozzles 52A, 52B, 52C, and 52D of the discharge device 41 by other means.

  When the nozzle 52A faces the section S corresponding to the pixel to which the data material 11A of the layer 12 is supplied, the control unit 25 determines that the nozzle 52A is disposed at the ejection position facing the corresponding section S ( S15: Yes). Similarly, when the nozzles 52B and 52C face the section S corresponding to the pixel to which the data materials 11B and 11C of the layer 12 are supplied, the control unit 25 faces the section S to which the nozzles 52B and 52C correspond. It is determined that it is arranged at the discharge position.

  When the control unit 25 determines that the nozzles 52A, 52B, and 52C are arranged at the discharge positions facing the corresponding section S, the control unit 25 supplies the materials 11A, 11B, and 11C to the corresponding section S to the nozzles 52A, 52B, and 52C. Discharge (S16). For example, as indicated by the one-dot chain arrow in FIG. 3, the control unit 25 causes the nozzle 52C to discharge the material 11C to the compartment S.

  The control unit 25 causes the nozzles 52A, 52B, and 52C to discharge the materials 11A, 11B, and 11C to the corresponding sections S, thereby forming layers of the materials 11A, 11B, and 11C in the sections S. That is, a layer of the material 11A, the material 11B, or the material 11C is selectively formed in each section S.

  When the control unit 25 determines that the nozzles 52A, 52B, and 52C are not arranged at the discharge positions facing the corresponding section S (S15: No), whether or not the corresponding nozzle 52D faces each section S. Is determined (S17A). That is, the control unit 25 determines whether or not the nozzle 52D is disposed at the application position facing the corresponding section S. The controller 25 also makes the same determination (S17A) when the material 11 is ejected to the compartment S by the nozzles 52A, 52B, 52C (S16).

  FIG. 5 is a cross-sectional view showing a part of the stage 22 and the supply device 23 arranged at the application position where the nozzle 52D faces the corresponding section S. FIG. As shown in FIG. 5, the nozzles 52A, 52B, and 52C discharge the materials 11A, 11B, and 11C to the supply region R, so that the first portion 12a, the second portion 12b, 3 portion 12c is formed. The first portion 12a is a part of the layer 12 formed of the material 11A in at least one section S. The second portion 12b is a part of the layer 12 formed of the material 11B in at least one section S. The third portion 12c is a part of the layer 12 formed of the material 11C in at least one section S.

  When the nozzle 52D faces the section S corresponding to the pixel on which the data materials 11A and 11B of the layer 12 are solidified, the control unit 25 determines that the nozzle 52D is disposed at the application position facing the corresponding section S. (S17A: Yes).

  When it is determined that the nozzle 52D is disposed at the application position facing the corresponding section S, the control unit 25 causes the nozzle 52D to discharge the adhesive 56 to the corresponding section S (S18A). For example, as indicated by an alternate long and short dash line arrow in FIG. 5, the control unit 25 causes the nozzle 52 </ b> D to discharge the adhesive 56 to the compartment S.

  The data for layer 12 further includes information about the concentration of adhesive 56 in the pixel where material 11A is solidified and the concentration of adhesive 56 in the pixel where material 11B is solidified. The control unit 25 causes the nozzle 52D to discharge the adhesive 56 having a concentration based on the data of the layer 12. When the ejection device 41 includes a plurality of nozzles 52D that eject adhesives 56 of a plurality of components, the control unit 25 causes the nozzles 52D to eject at least one type of adhesive 56 to the corresponding section S.

  In the section S facing the nozzle 52D, layers of materials 11A, 11B, 11C are already formed. The nozzle 52D applies the adhesive 56 to the material 11A or the material 11B of the section S by discharging the adhesive 56 to the section S where the layers of the materials 11A and 11B are formed.

  The adhesive 56 soaks into the material 11A or 11B that forms the layer in the compartment S. Thereby, the material 11A or the material 11B of the section S is bonded and solidified. The materials 11A and 11B to which the adhesive 56 is applied are also bonded to the adjacent solidified material 11A or 11B.

  Furthermore, the data of the layer 12 may further include information on other conditions of the adhesive 56 for the pixels on which the materials 11A and 11B are solidified. For example, the data for layer 12 may include information on the amount of adhesive 56 for each pixel. In this case, the control unit 25 causes the nozzle 52 </ b> D to eject an amount of the adhesive 56 based on the data of the layer 12. As described above, the control unit 25 causes the nozzle 52D to discharge the adhesive 56 under the conditions corresponding to the section S.

  When it is determined that the nozzle 52D is not disposed at the application position facing the corresponding section S (S17A: No), the control unit 25 determines whether the formation of the layer 12 is completed (S19). The controller 25 also makes the same determination (S19) when the adhesive agent 56 is discharged to the section S by the nozzle 52D (S18A).

  When the formation of the layer 12 is not completed (S19: No), the control unit 25 moves the ejection device 41 to the moving device 42 again (S14). The control unit 25 forms the layers 12 of a plurality of types of materials 11 in the supply region R by repeating the discharge (S16) of the material 11 to the compartment S. Further, the control unit 25 repeats the solidification of the materials 11A and 11B (S18A), thereby binding and solidifying the materials 11A and 11B which are a part of the plurality of types of materials 11 forming the layer 12, and the shaped article 13 Part of the first portion 13a and the second portion 13b. When the layer 12 is formed of only the materials 11A and 11B, the control unit 25 bonds and solidifies all of the material 11 forming the layer 12.

  The moving device 42 moves the discharge device 41 from one end portion of the supply region R in the direction along the Y axis toward the other end portion. When the discharge device 41 reaches the other end of the supply region R in the direction along the Y axis, the moving device 42 returns the discharge device 41 to one end of the supply region R in the direction along the Y axis. 41 is moved in the direction along the X-axis. The distance that the moving device 42 moves the discharge device 41 in the direction along the X axis is approximately equal to the length of one side of the section S. When the movement device 42 moves the ejection device 41 in the direction along the X axis, the movement device 42 again moves the ejection device 41 in the direction along the Y axis. The nozzles 52A, 52B, 52C, and 52D pass over all the sections S of the supply region R by the movement device 42 repeating such movement of the discharge device 41.

  FIG. 6 is a cross-sectional view showing a part of the stage 22 and the supply device 23 in which the formation of the layer 12 is completed. When the formation of the layer 12 is completed (S19: Yes), the control unit 25 determines whether the formation of all the layers 12 is completed (S20). When the formation of all the layers 12 is not completed (S20: No), the control unit 25 causes the elevator 37 to lower the mounting table 35 (S21). Thereby, the formed layer 12 of the material 11 forms the next supply region R below the upper end 36 a of the peripheral wall 36 by 50 μm.

  The controller 25 forms the shaped article 13 by repeating the formation of the layer 12 of the material 11 (S14 to S21). When it is determined that the formation of all the layers 12 has been completed (S20: Yes), the control unit 25 ends the layered modeling of the modeled article 13.

  When the layered modeling of the modeled article 13 is completed, the control unit 25 moves the collection device 44 above the supply region R. The collection device 44 sucks and collects the material 11 </ b> C remaining in powder form and sends it to the storage device 43.

  As described above, the control unit 25 causes the nozzle 52D to apply the adhesive 56 only to the materials 11A and 11B. That is, the control unit 25 causes the nozzle 52D to leave the material 11C in a powder state, and bonds and solidifies the other materials 11A and 11B. For this reason, the collection device 44 can collect only the material 11C, and the material 11C can be reused in the storage device 43 without separating the sucked material 11.

  The collection device 44 collects the material 11 </ b> C, so that the shaped article 13 made of the materials 11 </ b> A and 11 </ b> B remains on the mounting table 35 of the stage 22. Thereby, the user of the three-dimensional printer 10 can take out the molded article 13 from the processing tank 21. The shaped article 13 may be carried out of the processing chamber 21a of the processing tank 21 by a transport mechanism such as an arm or a belt.

  In the above description, the control unit 25 couples the materials 11A and 11B by applying the adhesive 56. However, the control unit 25 may couple the materials 11A and 11B by irradiating the optical device 24 with the laser light L. . Hereinafter, an example in which the control unit 25 couples the materials 11A and 11B with the laser light L will be described.

  FIG. 7 is a flowchart showing a second example of the procedure for layered modeling of the modeled article 13. Similarly to the first example, the three-dimensional printer 10 generates data of the layer 12 from the three-dimensional shape data of the modeled object 13 (S11 to S13), and moves the ejection device 41 to correspond to the section S. 11 is discharged (S14 to S16).

  When the control unit 25 determines that the nozzles 52A, 52B, and 52C are not disposed at the discharge positions facing the corresponding section S (S15: No), from above the section S to which the materials 11A and 11B are supplied, It is determined whether or not the discharge device 41 has moved (S17B). The control unit 25 also makes the same determination (S17B) when the material 11 is discharged to the section S by the nozzles 52A, 52B, and 52C (S16).

  When the control unit 25 determines that the ejection device 41 has moved from above the section S to which the materials 11A and 11B are supplied (S17B: Yes), the optical device 24 irradiates the section S with the laser light L (S18B). ).

  The data of the layer 12 further includes information of the laser beam L corresponding to the pixel on which the material 11A is solidified and the laser beam L corresponding to the pixel on which the material 11B is solidified. The control unit 25 causes the optical device 24 to emit laser light L having a power density and a wavelength based on the data of the layer 12. That is, the control unit 25 causes the optical device 24 to irradiate the material 11A or the material 11B of the section S with the type of laser light L corresponding to the section S.

  The optical device 24 melts the materials 11A and 11B by irradiating the material 11A or the material 11B of the section S with the laser light L. Thereby, the material 11A or the material 11B of the section S is bonded and solidified.

  As in the first example, the three-dimensional printer 10 repeats the formation of the layer 12 of the material 11 (S14 to S21), thereby forming the shaped article 13. When it is determined that the formation of all the layers 12 has been completed (S20: Yes), the control unit 25 ends the layered modeling of the modeled article 13.

  In the three-dimensional printer 10 according to the first embodiment, the control unit 25 causes the nozzles 52A, 52B, and 52C to eject the materials 11A, 11B, and 11C, and forms the layers 12 of the plurality of types of materials 11 in the supply region R. Let it form. The nozzle 52D or the optical device 24 bonds the materials 11A and 11B forming the layer 12 together. Thereby, the three-dimensional printer 10 can perform additive manufacturing using a plurality of types of materials 11A and 11B.

  In the first example, the nozzle 52D couples the materials 11A and 11B forming the layer 12 by applying the adhesive 56 to the materials 11A and 11B. Thereby, the nozzle 52D can bind the material 11 easily.

  The control unit 25 causes the nozzle 52D arranged at the application position to discharge the adhesive 56 to the corresponding section S and apply the adhesive 56 to the materials 11A and 11B of the section S. This facilitates bonding of the materials 11A and 11B forming the layer 12.

  The control unit 25 causes the nozzles 52D to discharge the adhesives 56 having a plurality of concentrations to the corresponding sections S. Thereby, the adhesive agent 56 of the density | concentration according to material 11A, 11B discharged to the division S is apply | coated, and the material 11A, 11B of the said division S is combined more reliably.

  The moving device 42 moves the nozzles 52A, 52B, 52C and the nozzle 52D together. Thereby, the structure of the moving device 42 is simplified, the manufacturing cost of the three-dimensional printer 10 is reduced, and the processing chamber 21a of the processing tank 21 can be used more widely.

  In the second example, the optical device 24 couples at least a part of the materials 11A and 11B forming the layer 12 by irradiating the materials 11A and 11B with the laser light L. In other words, the optical device 24 combines the materials 11A and 11B by melting the materials 11A and 11B. Thereby, material 11A, 11B is couple | bonded more firmly. The optical device 24 may sinter and bond the materials 11A and 11B.

  The control unit 25 causes the optical device 24 to irradiate the materials 11A and 11B of the section S with the type of laser light L corresponding to the section S. Thereby, the type of laser light L corresponding to the materials 11A and 11B discharged to the section S is irradiated, and the materials 11A and 11B of the section S are more reliably coupled.

  The control unit 25 causes the nozzle 52D to leave the material 11C in a powder state and to combine the other materials 11A and 11B. For this reason, when recovering the material 11 remaining in powder form after the layered modeling, only one type of material 11C is recovered, and the material 11C can be easily reused.

  Hereinafter, a second embodiment will be described with reference to FIG. In the following description of the plurality of embodiments, components having the same functions as the components already described are denoted by the same reference numerals as those described above, and further description may be omitted. . In addition, a plurality of components to which the same reference numerals are attached do not necessarily have the same functions and properties, and may have different functions and properties according to each embodiment.

  FIG. 8 is a perspective view showing a part of the stage 22 and the supply device 23 according to the second embodiment. As illustrated in FIG. 8, the supply device 23 according to the second embodiment includes two discharge devices 41 </ b> A and 42 </ b> B, two moving devices 42 </ b> A and 42 </ b> B, and a frame 71.

  The discharge device 41A includes a holder 51A, nozzles 52A, 52B, and 52C, and tanks 53A, 53B, and 53C. The holder 51A holds the tanks 53A, 53B, and 53C, similarly to the holder 51 of the first embodiment. The nozzles 52A, 52B, and 52C are provided in the holder 51A. That is, the discharge device 41A discharges a plurality of types of materials 11A, 11B, and 11C.

  The discharge device 41B includes a holder 51B, a nozzle 52D, and tanks 53D and 53E. The holder 51B holds the tanks 53D and 53E, similarly to the holder 51 of the first embodiment. The nozzle 52D is provided in the holder 51B. That is, the discharge device 41B discharges adhesives 56 having a plurality of concentrations.

  The moving device 42A includes a rail 61A and a transport unit 62A. The rail 61A moves the ejection device 41A in the direction along the Y axis, as in the first embodiment. The transport unit 62A moves the ejection device 41A in the direction along the X axis, as in the first embodiment.

  The moving device 42B is arranged side by side with the moving device 42A in the direction along the X axis. The moving device 42B includes a rail 61B and a transport unit 62B. The rail 61B moves the ejection device 41B in the direction along the Y axis, as in the first embodiment. The transport unit 62B moves the ejection device 41B in the direction along the X axis, as in the first embodiment.

  The frame 71 is formed in a substantially rectangular frame shape. The frame 71 is placed on the upper end 36 a of the peripheral wall 36. The length of the frame 71 along the Y axis is approximately equal to the length of the peripheral wall 36 along the Y axis. The length of the frame 71 in the direction along the X axis is longer than the length of the peripheral wall 36 in the direction along the X axis. The conveyance units 62 </ b> A and 62 </ b> B are placed on the upper end 71 a of the frame 71.

  The frame 71 extends the movable range of the ejection devices 41A and 41B in the direction along the X axis. Thereby, both the discharge devices 41A and 41B can pass over all the sections S of the supply region R.

  The moving devices 42A and 42B move the discharge devices 41A and 41B individually. The moving device 42B moves the discharge device 41B after the discharge device 41A is separated from the discharge device 41B by a predetermined distance in the direction along the X axis.

  When the nozzle 52D is disposed at the application position facing the corresponding section S, any layer of the materials 11A, 11B, and 11C is already formed in the section S adjacent to the section S. For this reason, when the adhesive agent 56 is applied to the material 11A or 11B of the section S to which the nozzle 52D corresponds, the material 11A or 11B of the section is prevented from collapsing.

  A third embodiment will be described below with reference to FIG. FIG. 9 is a cross-sectional view showing a part of the stage 22 and the supply device 23 according to the third embodiment. As shown in FIG. 9, the holder 51 of the third embodiment has a common chamber 81 and a common nozzle 82. The common nozzle 82 is an example of a discharge unit in the third embodiment.

  In the third embodiment, the nozzles 52A, 52B, and 52C are provided in the tanks 53A, 53B, and 53C, respectively. The nozzles 52A, 52B, and 52C each open to the common chamber 81.

  The common chamber 81 is provided inside the holder 51. When the nozzles 52A, 52B, and 52C discharge the materials 11A, 11B, and 11C, the materials 11A, 11B, and 11C are supplied to the common chamber 81.

  The common nozzle 82 is provided on the lower surface 51 a of the holder 51 and faces the supply region R. The common nozzle 82 opens into the common chamber 81. The common nozzle 82 discharges the materials 11A, 11B, and 11C supplied to the common chamber 81 by, for example, gravity.

  When the common nozzle 82 is disposed at a discharge position facing the corresponding section S, the control unit 25 discharges the materials 11A, 11B, and 11C from the nozzles 52A, 52B, and 52C corresponding to the section S. At least one material 11A, 11B, 11C supplied to the common chamber 81 is discharged from the common nozzle 82 to the corresponding section S.

  The control unit 25 may cause the nozzles 52 </ b> A, 52 </ b> B, 52 </ b> C to discharge a plurality of types of materials 11 </ b> A, 11 </ b> B, 11 </ b> C to the common chamber 81. That is, the common nozzle 82 may discharge two or more kinds of materials 11A, 11B, and 11C mixed in the common chamber 81.

  In the three-dimensional printer 10 of the third embodiment, the control unit 25 causes the common nozzle 82 disposed at the discharge position to discharge a plurality of types of materials 11A, 11B, and 11C to the corresponding section S. Thereby, the three-dimensional printer 10 can perform additive manufacturing using a plurality of types of mixed materials 11A, 11B, and 11C.

  Hereinafter, a fourth embodiment will be described with reference to FIG. FIG. 10 is a cross-sectional view showing a part of the stage 22 and the supply device 23 according to the fourth embodiment. The tanks 53A, 53B, 53C of the fourth embodiment contain the materials 11A, 11B, 11C and the dispersant D, respectively.

  The material 11 of the fourth embodiment is a so-called nanoparticle having a particle diameter of less than 100 nm. The material 11A of the fourth embodiment is, for example, gold (Au) powder. The material 11A is not limited to this.

  The melting point of the metal nanoparticles is lower than the melting point of the metal (bulk material) bonded larger than the nanoparticles. For example, the melting point of gold nanoparticles is several hundred degrees C lower than the original melting point of gold (about 1064 C). That is, the material 11 accommodated in the tanks 53A, 53B, and 53C has a particle size such that the melting point of the material 11 is lower than the melting point of the combined material 11.

  The dispersant D is, for example, pure water or ethanol. The dispersant D is not limited to this. Nanoparticles aggregate to raise the melting point. Dispersant D disperses the nanoparticles of material 11. Thereby, the dispersing agent D suppresses that the nanoparticles of the material 11 aggregate and the melting point of the material 11 rises.

  A base plate 91 is placed on the upper surface 35 a of the mounting table 35. The base plate 91 is, for example, a gold plate material. That is, the base plate 91 is made of the same material as the material 11A. The base plate 91 is not limited to this. The base plate 91 first forms the supply region R.

  The mounting table 35 includes a heater 35c. The heater 35c is an example of a bond forming unit. The heater 35 c heats the mounting table 35 and the base plate 91 mounted on the mounting table 35. That is, the heater 35c heats the supply region R.

  In the fourth embodiment, the discharge port 32 discharges the air in the processing chamber 21a and evacuates the processing chamber 21a. For this reason, it is suppressed that the mounting base 35 and the baseplate 91 are cooled by gas. The processing chamber 21 a is not limited to this, and the supply port 31 may be filled with, for example, nitrogen.

  The control unit 25 causes the temperature of the supply region R to be higher than the melting point of the nanoparticles of the material 11 and lower than the melting point of the combined material 11 by the heater 35c. For this reason, the base plate 91 heated by the heater 35c is kept in a solid state without melting.

  When the nozzle 52A is disposed at the discharge position, the control unit 25 causes the nozzle 52A to discharge the dispersant D containing the nanoparticles of the material 11A. For example, the nozzle 52A discharges the dispersant D by pressurizing it with an actuator.

  Dispersant D containing nanoparticles of material 11A discharged from nozzle 52A is directed to supply region R formed by base plate 91. Since the processing chamber 21a is in a vacuum, the dispersant D evaporates before reaching the supply region R. For this reason, only the nanoparticles of the material 11A reach the supply region R.

  The temperature of the supply region R is higher than the melting point of the nanoparticles of the material 11A. For this reason, the nanoparticles of the material 11 </ b> A reaching the supply region R are melted and bonded to the base plate 91. By bonding to the base plate 91, the melting point of the material 11A becomes higher than the temperature of the supply region R. Therefore, the material 11A bonded to the base plate 91 is solidified to return to a solid.

  The material 11A bonded to the base plate 91 is heated by the heater 35c. For this reason, when the nanoparticles of the material 11A discharged from the nozzle 52A reach the material 11A, the nanoparticles of the material 11A melt. Thereby, the materials 11A are bonded to each other.

  Thus, the heater 35c binds the nanoparticles of the material 11A to be laminated. Similarly, the heater 35c melts and solidifies the nanoparticles of the materials 11B and 11C. That is, immediately after the layer of the material 11 is formed in the supply region R, the heater 35 c bonds the material 11. By repeating the lamination of the nanoparticles of the material 11, the melting of the nanoparticles of the material 11, and the bonding and solidification of the material 11, the modeled object 13 is modeled.

  The dispersant D may reach the supply region R without evaporating. For example, the dispersant R may be a gel solvent that has a viscosity capable of adhering to the supply region R and evaporates over a longer time than ethanol or pure water. Such a dispersant D adheres to the supply region R while containing the nanoparticles of the material 11 and gradually evaporates. When the dispersant D evaporates, the nanoparticles of the material 11 reach the supply region R by gravity. Thereby, scattering of the material 11 by the evaporated dispersing agent D is suppressed.

  In the three-dimensional printer 10 of the fourth embodiment, the powdered material 11 has a particle size such that the melting point of the material 11 is lower than the melting point of the bonded material 11. The heater 35 c makes the temperature of the supply region R higher than the melting point of the powdered material 11 and lower than the melting point of the combined material 11. As a result, the discharged powdered material 11 is melted and bonded when it reaches the supply region R. Since the melting point of the bonded material 11 is higher than the temperature set by the heater 35c, the bonded material 11 is solidified. Thereby, the three-dimensional printer 10 can perform layered modeling without the adhesive 56 and the laser beam L.

  Furthermore, additive manufacturing can be performed without a support material such as the material 11C. For this reason, the control unit 25 causes the nozzles 52A, 52B, and 52C to discharge a plurality of types of materials 11, and forms a layer 12 of the plurality of types of materials 11 in a part of the supply region R.

  Hereinafter, a fifth embodiment will be described with reference to FIG. FIG. 11 is a cross-sectional view showing a part of the stage 22 and the supply device 23 according to the fifth embodiment. As shown in FIG. 11, the supply device 23 of the fifth embodiment includes a mask forming device 100.

  The mask forming apparatus 100 includes a holder 101, a nozzle 102, and a tank 103. The mask forming apparatus 100 forms a mask 105 in the supply region R. The mask 105 has an opening 106 that opens the section S to which the materials 11A and 11B are supplied.

  The holder 101 holds the tank 103 and is attached to the rail 61. Thereby, the mask forming apparatus 100 is moved by the moving device 42. The nozzle 102 is provided in the holder 101 and faces the supply region R. The tank 103 stores the material of the mask 105.

  The mask forming apparatus 100 discharges the material of the mask 105 from the nozzle 102 to the section S to which the material 11C as the support material is supplied. Thereby, the mask 105 in which the section S to which the materials 11A and 11B are supplied is opened.

  The nozzles 52 </ b> A and 52 </ b> B of the discharge device 41 discharge the materials 11 </ b> A and 11 </ b> B into the section S opened by the opening 106. Thereby, the layers of the materials 11A and 11B are formed in the compartment S more accurately.

  The materials 11 </ b> A and 11 </ b> B supplied to the compartment S opened by the opening 106 are bonded and solidified by an adhesive 56, for example. When the materials 11A and 11B are solidified, the powdery materials 11A and 11B remaining on the surface of the mask 105 are removed, and the mask 105 is removed by, for example, etching. The ejection device 41 supplies the material 11C as the support material to the section S where the mask 105 has been removed.

  Note that after the mask 105 is formed, the materials 11A and 11B are not limited to the ejection device 41, and may be supplied to the section S by a roller or a cloth. The adhesive 56 may also be supplied to the compartment S by spreading.

  Hereinafter, a sixth embodiment will be described with reference to FIG. FIG. 12 is a cross-sectional view showing part of the stage 22 and the supply device 23 according to the sixth embodiment. As shown in FIG. 12, the discharge device 41 of the sixth embodiment has a heater 110.

  The holder 51 accommodates the heater 110. The heater 110 accommodates the tanks 53A and 53B. The heater 110 heats the tanks 53A and 53B to a temperature higher than the melting point of the materials 11A and 11B. Thereby, at least a part of the materials 11A and 11B accommodated in the tanks 53A and 53B is melted.

  The nozzles 52A and 52B discharge the materials 11A and 11B that are at least partially melted. The materials 11A and 11B are cooled by contacting the supply region R. As a result, the materials 11A and 11B are solidified and bonded.

  Immediately after being stacked in the supply region R, the materials 11A and 11B are solidified and bonded. For this reason, the three-dimensional printer 10 can perform layered modeling without the adhesive 56 and the laser beam L. Furthermore, additive manufacturing can be performed without a support material such as the material 11C.

  According to at least one embodiment described above, the control unit causes the ejection unit to eject at least one type of material, and forms a plurality of types of material layers in at least a part of the supply region. The bond forming unit bonds at least a part of a plurality of types of materials forming the layer. Thereby, the additive manufacturing apparatus can perform additive manufacturing using a plurality of types of materials.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  For example, in the first embodiment, the material 11C is left in powder form, but all of the materials 11A, 11B, and 11C may be combined. The combined material 11C may be removed by etching, for example.

  DESCRIPTION OF SYMBOLS 10 ... Three-dimensional printer, 11, 11A, 11B, 11C ... Material, 12 ... Layer, 24 ... Optical apparatus, 25 ... Control part, 35 ... Mounting stand, 41, 41A, 41B ... Discharge device, 42, 42A, 42B ... Moving device, 52A, 52B, 52C, 52D ... Nozzle, 56 ... Adhesive, 57 ... Solvent, 82 ... Common nozzle, 110 ... Heater, R ... Supply area, S ... Section, L ... Laser light, D ... Dispersant.

Claims (10)

A supply section capable of supplying a plurality of types of powdered materials to the supply area;
A moving unit that relatively moves the supply unit and the supply region and arranges the supply unit at a plurality of supply positions facing the supply region;
At least one type of the material is supplied to the supply region by the supply unit arranged at the plurality of supply positions, and a first portion formed by at least one type of the material is different from the first portion. A second portion formed of at least one kind of material, and a control unit for forming a layer of the material having the first portion and the second portion in the supply region. And
A coupling forming unit coupling at least a part of the first part and coupling at least a part of the second part;
An additive manufacturing apparatus comprising:   2. The additive manufacturing method according to claim 1, wherein the bonding forming unit bonds at least a part of the first part and bonds at least a part of the second part by applying an adhesive to the material. apparatus. The bond forming part discharges the adhesive,
The moving part relatively moves the bond forming part and the supply region, and arranges the bond forming part at a plurality of application positions facing the first part or the second part,
The control unit causes the bond forming unit disposed at the application position to discharge the adhesive to the first part or the second part facing the bond forming part, and Applying the adhesive to at least a portion of the material and at least a portion of the material of the second portion;
The additive manufacturing apparatus according to claim 2. The bond forming portion can discharge a plurality of types of the adhesive,
The control unit causes the bond forming unit disposed at the application position to discharge different types of the adhesive to the first part and the second part,
The additive manufacturing apparatus according to claim 3.   The additive manufacturing apparatus according to claim 3 or 4, wherein the moving unit moves the discharge unit and the coupling forming unit as a unit.   2. The additive manufacturing method according to claim 1, wherein the bond forming unit bonds at least a part of the first part and bonds at least a part of the second part by irradiating the material with energy rays. apparatus. The bond forming part can emit a plurality of types of energy rays,
The control unit causes the bond forming unit to irradiate the first part and the second part with different types of the energy rays,
The additive manufacturing apparatus according to claim 6. The control unit causes the supply unit to form a third part formed of one kind of the material in the supply region, and to combine the first part, the second part, and the third part. Forming the layer of the material with the supply region;
The bond forming portion leaves the material of the third portion in powder form;
The additive manufacturing apparatus according to any one of claims 1 to 7. The powdered material has a particle size such that the melting point of the material is lower than the melting point of the bonded material,
The bond forming unit makes the temperature of the supply region higher than the melting point of the powdered material and lower than the melting point of the bonded material.
The additive manufacturing apparatus according to claim 1. Arranging a supply unit capable of supplying a plurality of types of powdery materials at a plurality of supply positions facing the supply region;
At least one type of the material is supplied to the supply region by the supply unit arranged at the plurality of supply positions, and a first portion formed by at least one type of the material is different from the first portion. Forming a second portion formed of at least one kind of the material in the supply region, and forming a layer of the material having the first portion and the second portion in the supply region. When,
Combining at least a portion of the first portion;
Combining at least a portion of the second portion;
An additive manufacturing method having

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