JP2014146570A - Lamp and illumination device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamp having long life and in which a light distribution angle can be broadened.SOLUTION: By utilizing power received from a base 30, a plurality of LED light sources 51b mounted on a mounting substrate 51a are made to emit light, and heat of each of the LED light sources 51b at the time of light emission is radiated by a heat sink 10. The heat sink 10 is arranged along a lamp axis CL which coincides with a shaft center of the base 30, and at an end part on the opposite side of the base 30, a base part 11 having a mounting surface 11a on which the mounting substrate 51a is mounted is provided. The mounting surface 11a has: a first region on which the mounting substrate 51a is mounted; and a second region around the first region. In the second region, a light diffusion lens 53 having a function of diffusing light emitted from each of the LED light sources 51b is fitted.

Description

  The present invention relates to a lamp using a semiconductor light emitting element such as an LED (Light Emitting Diode) as a light source and an illumination device using the lamp.

As an alternative to widely used incandescent bulbs, lighting devices using semiconductor light emitting elements such as LEDs as light sources are becoming widespread. The bulb-shaped LED lamp is usually a rotationally symmetric shape around the lamp axis that matches the axis of the base so that it can be mounted on a conventional lighting device for an incandescent bulb, and has a shape similar to that of an incandescent bulb. It is configured.
Patent Document 1 discloses a light bulb-shaped LED lamp in which an LED module having an LED chip mounted on a substrate (mounting substrate) is attached to a metal outer member (heat sink) configured in a cylindrical shape. In the light bulb shaped LED lamp of Patent Document 1, a light source mounting portion to which the LED module is mounted is provided at one end portion in the axial direction of the heat sink. The LED module attached to the light source attachment portion is covered with a globe. A lighting circuit for supplying power to the LED chip is accommodated in the heat sink.

  In such a bulb-type LED lamp, since heat generated when the LED chip emits light can be released to the outside by the heat sink, it is possible to suppress the LED chip from reaching a high temperature. Thereby, the fall of the luminous efficiency of LED chip, the fall of a lifetime, etc. can be suppressed.

JP 2006-313717 A

  In the bulb-type LED lamp, the light from the LED chip mounted on the mounting board is emitted forward (in a direction away from the mounting board) along the lamp axis. For this reason, the light distribution angle of light emitted from the globe is small, and the amount of light around the heat sink to which the globe is attached is reduced. For this reason, there is a demand for a bulb-type LED lamp that emits light from a globe with a wide light distribution angle.

  In the light bulb-type LED lamp, a configuration in which an optical member that widens the light distribution angle of light emitted from the globe is proposed. The optical member is usually provided on the lamp shaft side (center side) with respect to a plurality of LED chips arranged around the lamp shaft. A part of the light emitted from each LED chip is refracted or reflected by the optical member toward the periphery of the heat sink located in the direction opposite to the light emitting direction (backward). With such a configuration, the light distribution angle of light emitted from the globe can be expanded.

In this case, in order to provide the optical member on the lamp shaft side with respect to the LED chip, it is necessary to secure a space for arranging the optical member on the mounting substrate on which the LED chip is mounted, which may increase the size of the mounting substrate. There is. Since a relatively expensive ceramic substrate or the like is generally used for the mounting substrate, the economy is impaired when the mounting substrate is enlarged.
In recent years, in order to increase the output of a bulb-type LED lamp, the brightness of the LED chip has been increased. However, since the heat generation amount of the LED chip increases due to the increase in luminance, deterioration of the optical member is promoted by heat generated from the LED chip, and there is a possibility that discoloration, deformation, or the like may occur.

  This invention is made | formed in view of such a problem, The objective is to provide the lamp | ramp and illuminating device which can obtain a wide light distribution angle stably over a long period of time.

  In order to achieve the above object, the lamp of the present invention is a lamp that emits light from a plurality of semiconductor light emitting elements mounted on a mounting substrate, and dissipates heat of each semiconductor light emitting element during light emission by a heat sink, The heat sink has a mounting surface having a first region on which the mounting substrate is mounted and a second region around the first region, and the semiconductor light emitting element is formed in the second region. An optical member having a function of diffusing emitted light is attached.

  Moreover, the illuminating device which concerns on this invention has the said lamp | ramp, It is characterized by the above-mentioned.

In the lamp according to one aspect of the present invention, since the optical member is attached to the second region around the mounting substrate on the mounting surface of the heat sink, a space for arranging the optical member on the mounting substrate is ensured. There is no need. Thereby, a low-cost small mounting board can be used, and economical efficiency can be improved.
Further, since the heat of the optical member is efficiently radiated by the heat sink, it is possible to suppress the temperature of the optical member from being increased by the heat generated from the semiconductor light emitting element. Thereby, it can suppress that an optical member deteriorates, and can use an optical member stably over a long period of time.

It is the schematic for demonstrating the structure of the illuminating device with which the LED lamp A which concerns on embodiment is mounted | worn. 2 is an exploded perspective view of a light bulb shaped LED lamp A. FIG. It is a side view of the light bulb shaped LED lamp A. It is a longitudinal cross-sectional view of the light bulb shaped LED lamp A. It is a disassembled perspective view for demonstrating in detail the structure of the lightbulb-type LED lamp A. FIG. It is a perspective view of the state which made the heat sink in the lightbulb-type LED lamp A the edge part by the side of a cap on the upper side. It is a top view of the heat sink shown in FIG. It is a perspective view which decomposes | disassembles and shows the circuit case provided in the lightbulb-type LED lamp A.

Embodiments of the present invention will be described below.
In one embodiment according to the present invention, the optical member has a part of the light emitted from each of the semiconductor light emitting elements around the mounting surface located on the side opposite to the light emitting direction of the semiconductor light emitting elements. Irradiating.
In one embodiment according to the present invention, the mounting substrate is disposed inside the optical member, and an incident surface of light emitted from each of the semiconductor light emitting elements faces the mounting substrate. It is characterized by being provided.

In one form according to the present invention, an outer side edge portion of the surface of the mounting substrate on which the semiconductor light emitting element is mounted is pressed by the optical member, and the back surface of the mounting substrate is the first surface of the mounting surface. It is characterized by being in pressure contact with the region.
In an embodiment according to the present invention, the optical member is disposed on the front side of the incident surface so as to be irradiated with light that travels straight in a predetermined direction out of light incident from the incident surface. The front side end surface that emits the emitted light to the outside, and the light incident from the incident surface is inclined with respect to the front side end surface so that light traveling straight in a direction different from the predetermined direction is irradiated And a reflection surface that reflects the irradiated light toward the front end surface so as to reflect the light toward the periphery of the mounting surface at the front end surface. .

In an embodiment of the present invention, the optical member is arranged so that light that travels in a direction other than a direction that travels straight to the front end surface and the reflection surface out of the light incident from the incident surface is irradiated. It further has a refracting surface for emitting the irradiated light to the outside in a refracted state toward the front side.
In one form according to the present invention, the mounting surface has a circular shape, and the mounting substrate has a rectangular flat plate shape.

In one form according to the present invention, the heat sink has a plurality of fins arranged along a lamp axis, and each of the plurality of fins is in a radial direction around the lamp axis. It is characterized in that the lamp shaft is arranged at a distance.
In one form according to the present invention, the heat sink is attached with a circuit case containing a lighting circuit unit that adjusts the power supplied from the base, and the base is attached to the circuit case. Features.

<Lighting device>
FIG. 1 is a schematic diagram for explaining the configuration of the illumination device according to the present embodiment. This lighting device has a configuration in which a lighting fixture 70 is attached to a ceiling C, and a light bulb shaped LED lamp A is attached to the lighting fixture 70.
The luminaire 70 includes a cylindrical socket 71 in which the light bulb-shaped LED lamp A is mounted, and a cover 72 that covers the light bulb-shaped LED lamp A mounted in the socket 71. The socket 71 is directly attached to the ceiling C with the axis being vertical, and AC power is supplied to the socket 71 from a commercial AC power source.

  The cover 72 of the luminaire 70 has a hollow truncated cone shape, and is attached coaxially to the socket 71 with the small diameter portion on the upper side (large diameter portion on the lower side). The cover 72 is sized to accommodate the light bulb shaped LED lamp A attached to the socket 71 inside. The large-diameter portion on the lower side of the cover 72 opens downward so that the bulb-type LED lamp A can be mounted on the socket 71 from the lower side. On the inner peripheral surface of the cover 72, a reflection film 72a that reflects light emitted from the light bulb-shaped LED lamp A toward the lower opening is provided.

  The bulb-type LED lamp A has an outer shape similar to that of a conventional incandescent bulb so that it can be attached to the luminaire 70, and has a cylindrical base 30 attached coaxially to the socket 71. Yes. The bulb-type LED lamp A is configured to have a rotationally symmetrical shape around the lamp axis CL coinciding with the axis of the base 30, and the heat sink 10 is provided along the lamp axis CL.

The base 30 is attached to one end portion of the heat sink 10 in the axial direction of the lamp shaft CL via a circuit case 20 (see FIG. 4) covered with the case cover 40.
The base 30 has the same Edison type (screw-in type) shape and size as the base used in conventional incandescent bulbs, and the base 30 attached to the socket 71 is AC exchanged from a commercial power source via the socket 71. Power is supplied. In the present embodiment, the base 30 corresponds to the size and shape of an E25 type base used for an incandescent bulb.

A light emitting unit 50 that emits light from a plurality of LED light sources 51b (see FIG. 4) is provided at the end of the heat sink 10 opposite to the end on the base 30 side. The light emitting unit 50 is covered with a substantially hemispherical light diffusion globe 54, and when each LED light source 51b is in a light emitting state, light is irradiated from the entire circumferential surface of the light diffusion globe 54.
In the bulb-type LED lamp A in which the base 30 is mounted on the socket 71, the lamp axis CL is held in a vertical state with the light emitting unit 50 on the lower side.

In addition, the lighting fixture 70 is not restricted to such a structure, For example, the structure in which the cover 72 is not provided may be sufficient. Further, the cover 72 is not limited to the configuration opened downward, but may be a closed type with the lower closed.
Further, the lighting fixture 70 has a configuration in which the bulb-shaped LED lamp A is mounted on the socket 71 with the lamp axis CL in a horizontal state, a configuration in which the lamp shaft CL is mounted with the lamp shaft CL inclined with respect to the axis of the socket 71, It may be. The lighting fixture 70 is not limited to a configuration in which one socket 71 is provided, and may have a configuration in which two or more sockets 71 to which two or more bulb-type LED lamps A are respectively attached are provided.

  Furthermore, the lighting fixture 70 is not limited to the configuration in which the socket 71 is provided on the ceiling C, but may be a configuration provided on a wall surface. Further, the socket 71 may be configured to be embedded in a ceiling, a wall or the like (embedded type). Further, the socket 71 is not limited to a configuration (direct attachment type) that is directly attached to a ceiling, a wall surface, or the like, but may be a configuration that is suspended from the ceiling by an electric cable (suspending type).

<Bulb LED lamp>
FIG. 2 is a perspective view showing the light bulb shaped LED lamp A according to the embodiment of the present invention in a state in which the light diffusion globe 54 is disassembled. FIG. 3 is a side view of the light bulb shaped LED lamp A. FIG. FIG. 4 is a longitudinal sectional view of the light bulb shaped LED lamp A. As shown in FIG. FIG. 5 is an exploded perspective view of the light bulb shaped LED lamp A. FIG.

  As shown in FIGS. 2 to 5, the heat sink 10 has a plurality of flat fins 12 each disposed along the lamp axis CL, and a disc-shaped base 11 on which the light emitting unit 50 is mounted. doing. The base 11 is provided integrally with the fins 12 at the end opposite to the end provided with the base 30 in the axial direction of the lamp shaft CL and coaxial with the lamp shaft CL. As shown in FIG. 5, the surface of the base 11 on the side opposite to the base 30 is a mounting surface 11 a on which the light emitting unit 50 is mounted.

  As shown in FIGS. 4 and 5, a wiring passage hole 11 c that penetrates the base 11 along the lamp axis CL is formed around the lamp axis CL in the base 11. As shown in FIG. 4, a wiring 64 for supplying power to the light emitting module 51 passes through the wiring passage hole 11c. On the back surface 11b of the base portion 11, an annular central hole portion 11f is provided around the entire circumference of the wiring passage hole 11c. An end portion of a small-diameter cylindrical portion 23 of the circuit case 20 described later is fitted in the central hole portion 11f.

As shown in FIG. 5, the base 11 is provided with a screw hole 11 d for attaching a light diffusion lens 53 described later. Each screw hole 11d is provided at two positions symmetrical with respect to the lamp axis CL along the lamp axis CL.
An annular groove 11e is provided on the outer peripheral edge of the mounting surface 11a in the base 11 over the entire periphery, and the peripheral edge of the opening in the light diffusion globe 54 is inserted.

  FIG. 6 is a perspective view of the heat sink 10 with the end on the base 30 side facing upward. FIG. 7 is a plan view of the heat sink 10 shown in FIG. As shown in FIGS. 6 and 7, each of the fins 12 is provided along the radial direction with respect to the lamp axis CL except for two positions that are axially symmetric with respect to the lamp axis CL. On the outer peripheral portion of the back surface 11b of the base portion 11 where the fins 12 are not provided, rod-like case mounting portions 13 that extend along the lamp axis CL toward the base 30 are provided.

  Each case attachment portion 13 has the same configuration, and has a rectangular attachment main body portion 13 a whose transverse section is along the tangential direction of the base portion 11. On each side surface located on both sides in the circumferential direction of each attachment main body portion 13a, a heat radiating plate 13b protruding outward from each attachment main body portion 13a is provided over the entire length of each side surface. The outer side surface of each heat sink 13b has the same shape as the outer peripheral side portion of each fin 12 described later.

The front end surface (front end surface on the base side) 13d away from the base 11 in each case mounting portion 13 is a flat surface orthogonal to the lamp axis CL, and each is located on the same plane. As shown in FIGS. 4 and 5, a circuit case 20 is attached to each tip surface 13 d of each attachment main body 13 a.
Screw holes 13e for attaching the circuit case 20 are formed along the lamp axis CL at the distal end of the attachment main body 13a. Each screw hole 13e is opened in the front end surface 13d of the attachment main body 13a. As will be described later, a screw 24 (see FIGS. 4 and 5) for attaching the circuit case 20 is screwed to each screw hole 13e.

  In the present embodiment, 14 fins 12 are provided, and the seven fins 12 are set as one set, and the seven fins 12 of each set are arranged at a certain angle in the circumferential direction. Each case attachment portion 13 is sandwiched between seven pairs of fins. The side surfaces located on the inner peripheral side of the adjacent fins 12 are separated from each other, and a gap is formed between them.

  A side surface (inner peripheral side surface) located on the lamp axis CL side in each fin 12 is arranged in parallel to the lamp axis CL at a predetermined interval from the lamp axis CL. Therefore, the inner peripheral side surface 12m adjacent to the lamp axis CL in each fin 12 surrounds a cylindrical space 14 (hereinafter referred to as an axial space) 14 having a constant diameter with the lamp axis CL as an axis. It has become. The shaft space 14 communicates with a gap formed between adjacent fins 12.

As shown in FIG. 6, the front end surface of each fin 12 on the base 30 side is a flat surface 12b orthogonal to the lamp axis CL, and is located on the same plane as the front end surface 13d of each mounting body 13a. Yes.
The outer peripheral side surface of each fin 12 is an outer surface 12x located on the same peripheral surface as the outer peripheral surface of the base 11 from the respective base end portions to the middle in the axial direction. Further, from the outer surface 12x to the vicinity of the flat surface 12b at the tip, a first inclined surface 12y inclined inward is formed so that the outer diameter gradually decreases as the flat surface 12b is approached. Between the 1st inclined surface 12y and the flat surface 12b located in the front-end | tip, the 2nd inclined surface 12z in which the inclination to the inner side was larger than the 1st inclined part 12y was provided.

In the heat sink 10 having such a configuration, the base 11, all the fins 12, and the pair of case mounting portions 13 are integrally formed by die casting of aluminum having excellent heat dissipation.
The heat sink 10 is not limited to aluminum, and may be composed of other metal materials or synthetic resin materials. The heat sink 10 may be composed of a plurality of types of metal materials or a plurality of types of synthetic resin materials. Furthermore, the heat sink 10 can also be constituted by a composite material in which a metal material is coated with a synthetic resin material.

  The base 11 of the heat sink 10 is formed in a disk shape having a relatively large diameter in order to increase the contact area with air. Each of the flat fins 12 is arranged in the radial direction around the lamp axis CL in the width direction with the longitudinal direction along the lamp axis CL. With such a configuration, the heat sink 10 has a large contact area with air, and can efficiently dissipate heat.

FIG. 8 is an exploded perspective view of the case body 21 and the case cover 40 as well as an exploded view of the case body 21 and the case cover 40.
As shown in FIGS. 4, 5, and 8, the circuit case 20 attached to the tip of the heat sink 10 has a hollow case body 21. The circuit case 20 has a case lid 22 provided at an end of the case main body 21 on the heat sink 10 side. Further, the circuit case 20 has a small-diameter cylindrical portion 23 that extends from the case lid 22 to the opposite side of the case main body 21. The small-diameter cylindrical portion 23 is formed integrally with the case lid 22 and is disposed in a shaft space 14 formed around the lamp shaft CL in the heat sink 10.

  The case main body 21 has a cylindrical accommodating portion 21a in which the lighting circuit unit 60 is accommodated. The accommodating portion 21a is arranged coaxially with the lamp axis CL. A flange portion 21b is provided at the end of the accommodating portion 21a opposite to the base 30. Moreover, the coupling | bond part 21c couple | bonded with the nozzle | cap | die 30 is provided in the edge part by the side of the nozzle | cap | die 30 in the accommodating part 21a.

  The coupling portion 21 c has a smaller diameter than the housing portion 21 a so as to be fitted into the base 30. The coupling portion 21c is inserted into the end portion of the base 30 on the heat sink 10 side, and is integrally coupled to the base 30 by caulking. In addition, the coupling | bonding of the coupling | bond part 21c and the nozzle | cap | die 30 is not restricted to such a structure, For example, you may couple | bond by screw coupling | bonding, adhesion | attachment by an adhesive agent, etc.

A flange portion 21b provided at an end portion of the housing portion 21a opposite to the base 30 is in an annular shape that is orthogonal to the lamp shaft CL and extends to the outside of the housing portion 21a with a certain length. Yes. The flange portion 21 b is disposed so as to face the distal end surface 13 d of the attachment main body portion 13 a in each case attachment portion 13 provided in the heat sink 10.
The flange portion 21b is provided with screw through holes 21g through which screws 24 for attaching the flange portions 21b to the respective case attaching portions 13 pass, at two positions symmetrical with respect to the lamp axis CL.

As shown in FIGS. 4 and 5, the inner peripheral surface of the accommodating portion 21 a has a constant inner diameter except for the end portion on the opposite side to the base 30, but the end portion on the opposite side to the base 30. The inner diameter is large, and a step portion 21d is formed at the boundary between the portions having different inner diameters.
The lighting circuit unit 60 accommodated in the case body 21 of the circuit case 20 includes a square circuit board 61 and a lighting circuit 62 provided on one surface of the circuit board 61. The lighting circuit 62 is composed of various electronic components (a capacitor, a choke coil, a resistor, etc.), and these electronic components are mounted on one surface of the circuit board 61.

The length of the diagonal line of the circuit board 61 is smaller than the inner diameter of the end portion of the housing portion 21a opposite to the base 30 and larger than the inner diameter of the portion other than the end portion. Thereby, the circuit board 61 is inserted in a state where the mounting surface on which the lighting circuit 62 is mounted in the housing portion 21a is directed to the base 30 side, and on the stepped portion 21d formed on the inner peripheral surface of the housing portion 21a. Is held in.
The lighting circuit 62 adjusts the AC power supplied from the commercial power supply from the socket 71 of the lighting fixture 70 through the base 30 and supplies the AC power to each LED light source 51 b in the light emitting unit 50. The lighting circuit 62 rectifies the alternating current, and then performs processing such as amplification and filtering to adjust the voltage to a predetermined voltage. The output of the lighting circuit 62 is supplied to each LED light source 51b by the wiring 64 that passes through the inside of the small diameter cylindrical portion 23.

  As shown in FIG. 8, the case lid 22 has a disc-shaped lid portion 22 a that is abutted against an end surface on the heat sink 10 side in the housing portion 21 a of the case body 21 and covers the end surface. As shown in FIG. 8, the lid portion 22 a is provided with a fitting portion 22 b that protrudes toward the base 30 in a coaxial state with the lid portion 22 a. The fitting portion 22b has a cylindrical shape with an outer diameter smaller than that of the lid portion 22a, and is fitted into the end portion of the accommodating portion 21a.

The lid portion 22a has an outer diameter that is approximately the same as the outer diameter of the flange portion 21b provided in the case body 21. The lid portion 22a is sandwiched between the attachment main body portion 13a of the heat sink 10 and the flange portion 21b of the case main body 21. The cover 22a is provided with screw through holes 22e at two positions that are axisymmetric with respect to the lamp axis CL.
Each of the screw through holes 22e is arranged in alignment with the screw hole 13e formed at the distal end portion of the mounting main body portion 13a, and the screws 24 penetrating through the screw through holes 21g of the flange portion 21b are respectively passed therethrough. Yes. Each of the screws 24 is screwed to the screw hole 13e of the attachment main body 13a. Thereby, the accommodating part 21a and the cover part 22a of the case main body 21 are integrally attached to the attachment main body part 13a.

  The fitting portion 22b has an outer diameter slightly smaller than the inner diameter of the end portion so that the fitting portion 22b is inserted into the end portion of the housing portion 21a on the heat sink 10 side. Has been inserted. When the lid 22a comes into contact with the flange portion 21b, the fitting portion 22b comes into contact with the circuit board 61 of the lighting circuit unit 60 in a state where the tip is abutted against the stepped portion 21d. Thereby, the circuit board 61 is fixedly held on the step portion 21d.

  The small diameter cylindrical portion 23 has an outer diameter smaller than that of the fitting portion 22b, and is provided around the lamp shaft CL in the lid portion 22a in a coaxial state with the lamp shaft CL. The small diameter cylinder portion 23 communicates with a through hole 22g (see FIG. 8) provided around the lamp shaft CL in the case main body 21. The small-diameter cylindrical part 23 passes through the shaft part space 14 in a state where a fixed gap is formed with the side surface 12 m on the inner peripheral side of each fin 12. As shown in FIG. 4, the end portion (tip portion) opposite to the case lid 22 in the small diameter cylindrical portion 23 is fitted in a recess 11 f provided on the back surface 11 b of the base portion 11 in the heat sink 10.

Each of the case main body 21, the case lid 22 and the small diameter cylindrical portion 23 of the circuit case 20 is made of an insulating resin material such as polybutylene terephthalate (PBT).
As shown in FIGS. 4 and 8, the circuit case 20 is covered with a hollow frustoconical case cover 40. The case cover 40 has an end surface on the base 30 side that has a smaller diameter than an end surface on the heat sink 10 side, and each end surface is open. The case cover 40 is made of an insulating resin material such as polybutylene terephthalate (PBT).

  As shown in FIG. 4, the end of the case cover 40 on the base 30 side is integrally fitted with the end of the base 30 in the case body 21 of the circuit case 20, and is integrated with the end of the base 30. Is retained. The end surface of the case cover 40 on the heat sink 10 side is in contact with the front end surface 13 d of each case mounting portion 13 and the flat surface 12 b of each fin 12 on the base 30 side.

As shown in FIG. 4, the base 30 has a shell 31 configured in a cylindrical shape. A screw portion for mounting the shell 31 in the socket 71 of the lighting fixture 70 is provided on the peripheral surface of the shell 31. This threaded portion is coupled to a threaded portion formed on the inner peripheral surface of the socket 71.
An insulating connection body 32 is provided in the end portion of the shell 31 on the insertion side into the socket 71. Further, an eyelet 33 is attached to the outside of the central portion of the insulating connecting body 32. When the eyelet 33 is attached to the socket 71, the eyelet 33 becomes conductive with the terminal of the socket 71, and the AC power supplied from the terminal of the socket 71 is supplied to the lighting circuit 62 of the lighting circuit unit 60 by wiring not shown. To do.

  As shown in FIGS. 4 and 5, the light emitting unit 50 provided at the end opposite to the end on the base 30 side of the heat sink 10 is a light emitting module attached to the mounting surface 11 a of the base 11 in the heat sink 10. 51. The light emitting module 51 is covered with a light diffusion lens 53. The light diffusing lens 53 is covered with a light diffusing globe 54 configured in a hollow hemispherical shape.

The light emitting module 51 includes a flat mounting substrate 51a that is square in plan view, and a plurality of light emitting modules 51 arranged in two rows along each side edge on the outer peripheral side on one surface (mounting surface) of the mounting substrate 51a. LED light source 51b. The LED light sources 51b constituting each row are arranged with a certain interval.
The mounting substrate 51a is made of, for example, an alumina substrate (ceramic substrate), and is mounted on the mounting surface 11a of the base 11 of the heat sink 10 in a coaxial state.

A wiring passage hole 51c through which a wiring 64 for supplying power from the lighting circuit 62 of the lighting circuit unit 60 to the LED light source 51b passes is formed at the center of the mounting substrate 51a.
The length of the diagonal line of the mounting surface in the mounting substrate 51a is shorter than the diameter of the mounting surface 11a in the base 11, and the area of the mounting surface is smaller than the mounting surface 11a. For this reason, on the mounting surface 11a of the mounting surface 11a, a region where the mounting substrate 51a is not mounted exists around the entire periphery of the region where the mounting substrate 51a is mounted in a coaxial state.

Each of the plurality of LED light sources 51b has a configuration (COB type) in which an LED chip that emits blue light is sealed with a resin sealing body and mounted on a mounting substrate 51a. The resin sealing body is configured by mixing a phosphor that converts blue light into white into a resin material (silicone resin).
The LED chip of each LED light source 51b is mounted on the mounting substrate 51a so that each optical axis is parallel to the lamp axis CL, and white light is transmitted to the base 11 side at a predetermined spread angle centered on the optical axis. It emits in the opposite direction. In the following, the direction in which light is emitted from each LED light source 51b is defined as the front, and the opposite direction is defined as the rear.

In the present embodiment, since each of the LED light sources 51b can emit light with high luminance, the amount of heat generated during each light emission is relatively large.
Note that the number of LED light sources 51b, the size of the mounting substrate 51a, the diameter of the mounting surface 11a in the base 11, and the like are set according to the output of the bulb-type LED lamp A, the amount of heat generated by the LED light source 51b, and the like.

For example, the diameter (outer diameter) of the mounting surface 11a in the base 11 is 70 mm, and the length of one side of the mounting board 51a having a square flat plate shape is 35 mm.
The light diffusing lens 53 is configured in a cylindrical shape in which a space having a predetermined shape is formed inside by a plastic which is a light transmissive material. The light diffusing lens 53 is mounted on the mounting surface 11a of the base 11 on a region where the mounting substrate 51a is not mounted, so as to be coaxial with the lamp axis CL. The outer peripheral surface of the light diffusing lens 53 has a constant outer diameter (for example, 52 mm) except for the flange portion 53 z provided on the mounting surface 11 a side of the base 11. It is an emission surface 53t that emits a part of the light incident on the outside.

As shown in FIG. 4, a fitting space 53a into which the mounting substrate 51a is fitted is formed in the end portion of the light diffusing lens 53 on the base 11 side. The fitting space 53a is formed in a shape and size substantially the same as those of the mounting substrate 51a.
Inside the light diffusion lens 53, a light passage space 53b through which light emitted from each LED light source 51b of the mounting substrate 51a passes is formed in front of the fitting space 53a. The light passing space 53b is open at the end on the fitting space 53a side. The opening of the light passage space 53b is slightly smaller than the mounting surface of the mounting substrate 51a, and is formed in a square shape that can accommodate all the LED light sources 51b disposed on the mounting substrate 51a. Around the opening of the light passage space 53b, an abutment surface 53c is formed that abuts on each side edge on the outer circumference side of the mounting surface of the mounting substrate 51a over the entire circumference.

  The light diffusion lens 53 is provided with an incident surface 53d that faces the mounting substrate 51a with the light passage space 53b interposed therebetween except for the central portion around the lamp axis CL. The incident surface 53d is parallel to the mounting board 51a and faces all the LED light sources 51b mounted on the mounting board 51a. The light emitted from each LED light source 51b mounted on the mounting substrate 51a passes through the light passage space 53b, and then is irradiated to the incident surface 53d, so that the inside of the light diffusing lens 53 (lens portion of the light transmitting material). Is incident on.

In the light diffusion lens 53, a square communication port 53e is formed around the lamp axis CL surrounded by the incident surface 53d. The communication port 53e is formed coaxially with the lamp axis CL, and has a square shape smaller than the square portion exposed in the light passage space 53b on the mounting surface of the mounting substrate 51a.
A front space 53f is formed coaxially with the lamp axis CL around the lamp axis CL at the end (front end) opposite to the base 11 of the light diffusion lens 53. The front space portion 53f is formed in a quadrangular pyramid shape that sequentially expands forward, and the front end of the light diffusion lens 53 is a front end opening 53g that is open in a square shape. A periphery of the front end opening 53g in the light diffusion lens 53 is a front side end surface 53k parallel to the incident surface 53d.

  The light diffusing lens 53 includes four pieces extending from the side edges of the communication ports 53e formed in the central portion of the entrance surface 53d toward the outer side of the front space 53f around the base 11 side portion. A refracting surface 53s is provided. Each refracting surface 53s is recessed in a concave shape so as to protrude outward while being inclined outward as it goes away from each side edge of the communication portion 53e. The front side edge of each refracting surface 53s is located in the middle of the front space 53f in the axial direction.

In addition, the light diffusion lens 53 is provided with four reflecting surfaces 53r extending from the respective side edges around the front end opening 53g toward the rear outer side around the front side portion in the front space 53f. Yes. Each reflecting surface 53r is a flat surface that inclines inward as it moves rearward from each side edge of the front end opening 53g.
The rear side edge of each reflecting surface 53r is located behind the front side edge of each refracting surface 53s. Accordingly, a groove 53y is formed between the front side edge portion in the middle of the axial direction of each refracting surface 53s and the rear side edge portion of each reflective surface 53r.

  On the outer peripheral surface of the end portion on the base 11 side where the fitting space 53a in the light diffusion lens 53 is provided, a flange portion 53z is provided over the entire circumference. The flange portion 53z is formed in an annular shape having a constant outer diameter (for example, 58.4 mm), and has a constant outer diameter slightly smaller than the diameter of the mounting surface 11a in the base portion 11. The flange portion 53z is mounted on an area where the mounting substrate 51a is not mounted on the outer peripheral portion of the mounting surface 11a of the base portion 11.

  In the flange portion 53z, screw passage holes 53m penetrating the flange portion 53z along the axial direction are formed at two positions symmetrical with respect to the lamp axis CL. Each screw passage hole 53m faces the screw hole 11d provided in the base portion 11 in a coaxial state. A screw 55 for attaching the light diffusion lens 53 to the base 11 is inserted into each screw passage hole 53m, and is screwed to the screw hole 11d of the base 11.

  In this manner, the flange portion 53z is attached to the base portion 11 with the screw 55 in a state where the mounting substrate 51a is fitted in the fitting space 53a. In this case, the contact surface 53c of the light diffusing lens 53 is in contact with each side edge on the outer peripheral side of the mounting surface of the mounting substrate 51a over the entire periphery, pressing the mounting substrate 51a against the mounting surface 11a of the base 11. . Thereby, the back surface of the mounting substrate 51a is pressed against the mounting surface 11a of the base portion 11, and the mounting substrate 51a is fixedly held on the mounting surface 11a of the base portion 11 in a coaxial state.

  The wiring 64 for supplying power to all the LED light sources 51b on the mounting substrate 51a is connected to the lighting circuit 62 of the lighting circuit unit 60 accommodated in the circuit case 20. In this state, the wiring 64 passes through the small-diameter cylindrical portion 23 integrated with the case lid 22 of the circuit case 20, and passes through the wiring passage hole 51c of the mounting substrate 51a and the wiring passage hole 11c of the base portion 11. And connected to the mounting substrate 51a.

  The light diffusing globe 54 covering the light diffusing lens 53 is made of a translucent material such as a glass material, and a circular opening is provided in a portion facing the base 11. The inner peripheral surface 54a of the light diffusion globe 54 is subjected to a light diffusion process so that the light emitted from the light diffusion lens 53 is irradiated to the outside in a diffused state. Examples of the light diffusion treatment include a surface treatment for attaching silica, a white pigment or the like to the inner peripheral surface 54a.

  The peripheral edge of the opening in the light diffusing globe 54 is inserted into a groove 11 e provided on the mounting surface 11 a of the base 11 and bonded by an adhesive 57. Thereby, the light diffusion globe 54 is fixed to the base 11. The light applied to the inner peripheral surface 54 a of the light diffusing globe 54 is transmitted through the light diffusing globe 54 in a state of being diffused by the inner peripheral surface 54 a and is irradiated to the outside of the light diffusing globe 54.

  In the light bulb shaped LED lamp A having such a configuration, the base 30 is attached to the socket 71 of the lighting fixture 70, and AC power is supplied to the base 30. The AC power supplied to the base 30 is adjusted to a predetermined voltage by the lighting circuit 62 of the lighting circuit unit 60 housed in the circuit case 20 and supplied to each LED light source 51 b of the light emitting module 51. Thereby, each LED light source 51b emits light, and the light bulb-shaped LED lamp A is turned on.

The light emitted from each LED light source 51 b enters the inside of the light diffusion lens 53 from the incident surface 53 d of the light diffusion lens 53. As shown in FIG. 4, the light is emitted from each LED light source 51b and enters the light diffusing lens 53 from the incident surface 53d in a diffuse state.
In this case, when the light L1 around the optical axis emitted from each LED light source 51b along the optical axis enters the light diffusion lens 53 from the incident surface 53d, the light diffuses toward the reflecting surface 53r in the inclined state. Go straight through the lens 53. The light L1 is applied to the reflecting surface 53r in an inclined state, and is reflected by the reflecting surface 53r toward the front side end surface 53k.

Thereafter, the light L1 is reflected by the front end face 53k, is refracted by the emission surface 53t that is the outer peripheral surface of the light diffusion lens 53, and is emitted to the outside of the light diffusion lens 53. The light L <b> 1 emitted from the light diffusing lens 53 is irradiated around the base 11 outside the light diffusing globe 54 while being diffused by the light diffusing globe 54.
As described above, the light L1 around the optical axis emitted from each LED light source 51b is reflected and refracted by the light diffusion lens 53, and is irradiated from the light diffusion globe 54 around the base 11 in the heat sink 10. Thereby, the illuminance around the base 11 increases.

  Of the light diffused inside the light diffusing lens 53 on the incident surface 53d, a part of the light (light L2) other than the light L1 around the optical axis is reflected on the refracting surface 53s provided around the lamp axis CL. Go straight ahead. The light L2 is applied to a refracting surface 53s provided around the lamp axis CL, is refracted by the refracting surface 53s, and is emitted into the front space 53f. The light L2 further travels straight inside the front space 53f, irradiates the light diffusing globe 54 through the front end opening 53g, and is irradiated from the light diffusing globe 54 to the front of the light diffusing globe 54.

  Of the light diffused inside the light diffusion lens 53 on the incident surface 53d, a part of the light other than the light L1 and L2 (light L3) is flat around the front end opening 53g in the light diffusion lens 53. It goes straight toward the front side end face 53k. The light L3 is emitted from the front side end face 53k to the outside of the light diffusion lens 53, and is irradiated on the light diffusion globe 54. The light irradiated to the light diffusion globe 54 is emitted from the light diffusion globe 54 to the front of the light diffusion globe 54.

  As described above, since the lights L2 and L3 other than the light L1 around the optical axis are irradiated in a diffused state from the light diffusion globe 54 toward the front, the light diffusion globe 54 is emitted by the light 2 and L3. Illuminance in front of can be secured. In addition, among the light emitted from each LED light source 51b with high brightness, the light L1 around the optical axis is irradiated around the base 11 on the rear side, and thus the distribution of the light emitted from the light diffusion globe 54 is reduced. The light angle becomes wider.

  Furthermore, when each LED light source 51b having such high brightness is turned on, heat generated in each LED light source 51b is transmitted from the mounting substrate 51a to the base 11 of the heat sink 10. In this case, the heat transmitted to the base 11 is efficiently radiated by the base 11 and the fins 12. Thereby, it can suppress that each high-brightness LED light source 51b becomes a high temperature state, and it becomes possible to extend the lifetime of the LED light source 51b.

  Further, the light diffusion lens 53 is directly attached to a region around the mounting substrate 51 a on the mounting surface 11 a of the base 11. For this reason, even if the heat of each LED light source 51b is transmitted to the light diffusion lens 53, the heat of the light diffusion lens 53 is transmitted to the base 11, and is efficiently radiated to the outside by the base 11 and each fin 12. Accordingly, it is possible to suppress the light diffusing lens 53 from being in a high temperature state, and it is possible to suppress deterioration of the light diffusing lens 53 such as discoloration and deformation. As a result, the light diffusion lens 53 can be used stably over a long period of time.

Further, the light diffusion lens 53 is not attached on the mounting substrate 51a, but is attached to a region around the mounting substrate 51a on the mounting surface 11a of the base 11. Therefore, it is not necessary to secure a space for mounting the light diffusion lens 53 on the mounting substrate 51a. Thereby, the low-cost small mounting board 51a can be used.
In addition, since the mounting board 51a having a square flat plate shape can be manufactured from the mother board with a high yield, the cost of the mounting board 51a can be further reduced. Thereby, economic efficiency can further be improved.

  Further, since the mounting substrate 51a is pressed and fixed to the base 11 by the light diffusion lens 53, it is not necessary to attach the mounting substrate 51a to the base 11 with screws. Thereby, the space for providing the through-hole for penetrating the screw in the mounting substrate 51a and the processing for forming the through-hole are not required, and thereby the economy can be further improved.

[Modification]
In said embodiment, the light emitting module 51 was the structure which mounts several LED light source 51b along each side edge of an outer peripheral side on the square flat board-shaped mounting board 51a. However, it is not limited to such a configuration. For example, the mounting substrate 51a of the light emitting module 51 may have a disc shape, and a plurality of LED light sources 51b may be arranged in an annular shape with a certain interval from the mounting substrate 51a.

  In this case, in the light diffusion lens 53, the fitting space 53a and the light passage space 53b are each formed in a cylindrical shape. The front space 53f is also formed in a truncated cone shape, and each of the reflecting surface 53r and the refracting surface 53s is formed in a circumferential surface shape. By setting it as such a structure, the light distribution angle of the light irradiated from the light-diffusion glove 54 can be expanded similarly to said embodiment.

Each of the plurality of LED light sources 51b provided in the light emitting module 51 is not limited to the COB type in which the LED chip that emits blue light is sealed with the resin sealing body and mounted on the mounting substrate 51a, but also the SMD type. It may be.
Moreover, although LED was demonstrated as the light source of the light emission part 50 in the said embodiment, you may use semiconductor light emitting elements, such as a semiconductor laser.

A bulb-type LED lamp 10 heat sink 11 base 12 fin 13 case mounting portion 14 shaft space 20 circuit case 21 case body 22 case lid 23 small diameter cylindrical portion 30 base 50 light emitting portion 51 light emitting module 51a mounting substrate 51b LED light source 53 light diffusion lens

Claims (10)

A lamp that emits light from a plurality of semiconductor light-emitting elements mounted on a mounting substrate and dissipates heat of each semiconductor light-emitting element during light emission by a heat sink,
The heat sink has a mounting surface including a first region on which the mounting substrate is mounted and a second region around the first region,
An optical member having a function of diffusing light emitted from each semiconductor light emitting element is attached to the second region.   The optical member irradiates a part of light emitted from each of the semiconductor light emitting elements around the mounting surface located on a side opposite to a light emitting direction of the semiconductor light emitting elements. Item 2. The lamp according to item 1. The mounting substrate is disposed inside the optical member,
The lamp according to claim 2, wherein an incident surface of light emitted from each of the semiconductor light emitting elements is provided on the optical member so as to face the mounting substrate.   A side edge portion on the outer side of the front surface of the mounting substrate on which the semiconductor light emitting element is mounted is pressed by the optical member, and the rear surface of the mounting substrate is in pressure contact with the first region of the mounting surface. The lamp according to claim 3. The optical member is
The front side end surface that is arranged so as to be irradiated with light traveling straight in a predetermined direction among the light incident from the incident surface on the front side of the incident surface, and for emitting the irradiated light to the outside,
The light incident from the incident surface is disposed in an inclined state with respect to the front side end surface so that light traveling straight in a direction different from the predetermined direction is irradiated. A reflective surface that reflects toward the front side end surface so as to reflect toward the periphery of the mounting surface at the front side end surface;
The lamp according to claim 3 or 4, characterized by comprising:   The optical member is arranged so that light that travels in a direction other than a direction that travels straight to the front end surface and the reflection surface among the light incident from the incident surface is irradiated. The lamp according to claim 5, further comprising a refracting surface that emits the light toward the front side in a refractive state. The mounting surface has a circular shape,
The lamp according to claim 1, wherein the mounting substrate has a rectangular flat plate shape.   The heat sink has a plurality of fins arranged along a lamp axis, and each of the plurality of fins is in a radial direction around the lamp axis and spaced from the lamp axis. The lamp according to any one of claims 1 to 7, wherein the lamp is arranged.   9. A circuit case containing a lighting circuit unit for adjusting power supplied from a base is attached to the heat sink, and the base is attached to the circuit case. The lamp according to any one of the above.   An illumination device comprising the lamp according to any one of claims 1 to 9.

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