JP2014001992A - Thermal type flowmeter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermal type flowmeter that includes a circuit package having an arrangement structure in which molding resin can be filled into every corner of a cavity while preventing resin leakage from occurring.SOLUTION: A thermal type flowmeter comprises a circuit package 400 in which a temperature detection element 518, a flow rate detection part 602, and circuit components 516, 604 are mounted on a lead frame 511 and are sealed with a molding resin. The circuit package 400 includes: a body part 404 on which the circuit components 516, 604 are mounted; a first package protrusion 401 on which the temperature detection element 518 is mounted; and a second package protrusion 402 on which the flow rate detection part 602 is mounted. The body part 404 is provided with an inlet part 405 into which a molding resin is filled, and the inlet part 405 is arranged in a position facing the first package protrusion 401 and the second package protrusion 402 through the circuit components 516, 604.

Description

  The present invention relates to a thermal flow meter.

  A thermal flow meter that measures the flow rate of gas includes a flow rate detection unit for measuring the flow rate, and performs heat transfer between the flow rate detection unit and the gas to be measured, thereby reducing the flow rate of the gas. It is configured to measure. The flow rate measured by the thermal flow meter is widely used as an important control parameter for various devices. A feature of the thermal flow meter is that it can measure a gas flow rate, for example, a mass flow rate, with relatively high accuracy compared to other types of flow meters.

  However, further improvement in gas flow rate measurement accuracy is desired. For example, a vehicle equipped with an internal combustion engine has a very high demand for fuel saving and exhaust gas purification. In order to meet these demands, it is required to measure the intake air amount, which is a main parameter of the internal combustion engine, with high accuracy. A thermal flow meter for measuring the amount of intake air led to an internal combustion engine includes a sub-passage that takes in a part of the intake air amount and a flow rate detector disposed in the sub-passage, and the flow rate detector is a gas to be measured. The state of the gas to be measured flowing through the sub-passage is measured by performing heat transfer between and the electric signal, and an electric signal representing the amount of intake air guided to the internal combustion engine is output. Such a technique is disclosed in, for example, Japanese Patent Application Laid-Open No. 2011-252796 (Patent Document 1).

  In Patent Document 2, when a semiconductor element having an air flow rate detection unit and a lead frame are installed in a mold and integrally molded with a mold resin, a metal element is used to expose the air flow rate detection unit of the semiconductor element from the mold resin. A technique for holding and molding an air flow rate detection portion of a semiconductor element with a mold is shown.

JP 2011-252796 A JP 2011-122984 A

  In the case of the technique shown in Patent Document 2, it is necessary to limit the holding force for holding the semiconductor element to a range that does not affect the semiconductor element. On the other hand, when the mold for resin molding is held, it is formed inside the mold. It is necessary to fill a hot mold resin with a filling pressure equal to or higher than a predetermined value in order to spread all the gaps (cavities). Therefore, when the filling pressure is larger than the holding force, mold resin may enter between the mold and the air flow rate detection unit, and there is a possibility that resin leakage may occur in the air flow rate detection unit. Since the detection accuracy of the air flow rate decreases due to resin leakage, it is necessary to prevent the occurrence.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a thermal type having a circuit package having an arrangement configuration capable of filling a mold resin to every corner of a cavity while preventing the occurrence of resin leakage. It is to provide a flow meter.

  The thermal flow meter of the present invention that solves the above-mentioned problems is a temperature detecting element, a flow detecting element, and a circuit component mounted on a lead and disposed in a cavity of a mold, and the mold resin is filled in the cavity. A thermal flow meter having a circuit package formed as described above, wherein the circuit package includes a main body portion on which the circuit component is disposed, and a first detector on which the temperature detection element is disposed so as to protrude from the main body portion. A package projecting portion; and a second package projecting portion that is spaced apart from the first package projecting portion and projects from the main body portion and on which the flow rate detecting unit is disposed, and is filled with the mold resin in the cavity The filling inlet portion is provided in the main body portion, and the filling inlet portion is disposed at a position facing the first package protruding portion and the second package protruding portion with the circuit component interposed therebetween. It is characterized by having the configurations.

  According to the thermal type flow meter of the present invention, it is possible to obtain a thermal type flow meter having a circuit package having an arrangement configuration in which mold resin can be filled to every corner of the cavity while preventing occurrence of resin leakage. Problems, configurations, and effects other than those described above will be clarified by the following description of the embodiments.

1 is a system diagram showing an embodiment in which a thermal flow meter according to the present invention is used in an internal combustion engine control system. It is a figure which shows the external appearance of a thermal type flow meter, FIG. 2 (A) is a left view, and FIG. 2 (B) is a front view. It is a figure which shows the external appearance of a thermal type flow meter, FIG. 3 (A) is a right view, and FIG. 3 (B) is a rear view. It is a figure which shows the external appearance of a thermal type flow meter, FIG. 4 (A) is a top view, FIG.4 (B) is a bottom view. It is a figure which shows the housing of a thermal type flow meter, FIG. 5 (A) is a left view of a housing, and FIG. 5 (B) is a front view of a housing. It is a figure which shows the housing of a thermal type flow meter, FIG. 6 (A) is a right view of a housing, and FIG. 6 (B) is a rear view of a housing. It is the elements on larger scale which show the state of the flow-path surface arrange | positioned at a subchannel | path. 8A and 8B are external views of a circuit package, in which FIG. 8A is a left side view, FIG. 8B is a front view, and FIG. 8C is a rear view. It is a figure which shows the state which mounted the circuit components on the lead frame of the circuit package. It is a figure which shows the specific example of the state which inject | poured 1st mold resin in the metal mold | die at the 1st resin mold process. It is a figure which shows the other specific example of the state which inject | poured 1st mold resin in the metal mold | die at the 1st resin mold process. It is a figure which shows the other specific example of the state which injected the 1st mold resin in the metal mold | die at the 1st resin mold process. It is explanatory drawing explaining the communicating path which connects the space | gap and opening inside a diaphragm and a diaphragm. It is a figure which shows the state of the circuit package after a 1st resin mold process. It is a figure which shows the outline | summary of the manufacturing process of a thermal type flow meter, and is a figure which shows the production process of a circuit package. It is a figure which shows the outline | summary of the manufacturing process of a thermal type flow meter, and is a figure which shows the production process of a thermal type flow meter. It is a circuit diagram which shows the flow volume detection circuit of a thermal type flow meter. It is explanatory drawing explaining the flow volume detection part of a flow volume detection circuit.

  The form for carrying out the invention described below (hereinafter referred to as an embodiment) solves various problems that are demanded as actual products, and particularly as a measuring device for measuring the intake air amount of a vehicle. It solves various problems that are desirable for use, and has various effects. One of the various problems solved by the following embodiment is the contents described in the column of the problem to be solved by the invention described above, and one of the various effects exhibited by the following embodiment is as follows. It is the effect described in the column of the effect of the invention. Various problems solved by the following embodiments, and various effects produced by the following embodiments will be described in the description of the following embodiments. Therefore, the problems and effects solved by the embodiments described in the following embodiments are also described in the contents other than the contents of the problem column to be solved by the invention and the effect column of the invention.

  In the following embodiments, the same reference numerals indicate the same configuration even when the figure numbers are different, and the same effects are achieved. For configurations that have already been described, only the reference numerals are attached to the drawings, and the description may be omitted.

FIG. 1 shows an embodiment in which the thermal flow meter according to the present invention is used in an internal combustion engine control system of an electronic fuel injection system. FIG. Based on the operation of the internal combustion engine 110 including the engine cylinder 112 and the engine piston 114, the intake air is sucked from the air cleaner 122 as the measurement target gas 30 and passes through the main passage 124 such as the intake body, the throttle body 126, and the intake manifold 128. Guided to the combustion chamber of the engine cylinder 112. The flow rate of the gas 30 to be measured, which is the intake air led to the combustion chamber, is measured by the thermal flow meter 300 according to the present invention, and fuel is supplied from the fuel injection valve 152 based on the measured flow rate. The gas to be measured is introduced into the combustion chamber together with a certain gas 30 to be measured. In this embodiment, the fuel injection valve 152 is provided at the intake port of the internal combustion engine, and the fuel injected into the intake port forms an air-fuel mixture together with the measured gas 30 that is the intake air, and passes through the intake valve 116. It is guided to the combustion chamber and burns to generate mechanical energy.

  In recent years, as a method excellent in exhaust gas purification and fuel consumption improvement in many vehicles, a method in which a fuel injection valve 152 is attached to a cylinder head of an internal combustion engine and fuel is directly injected into each combustion chamber from the fuel injection valve 152 has been adopted. . The thermal flow meter 300 can be used not only for the method of injecting fuel into the intake port of the internal combustion engine shown in FIG. 1 but also for the method of directly injecting fuel into each combustion chamber. In both types, the basic concept of the control parameter measurement method including the method of using the thermal flow meter 300 and the control method of the internal combustion engine including the fuel supply amount and ignition timing are substantially the same. A method of injecting fuel into the port is shown in FIG.

  The fuel and air guided to the combustion chamber are in a mixed state of fuel and air, and are burned explosively by spark ignition of the spark plug 154 to generate mechanical energy. The combusted gas is guided from the exhaust valve 118 to the exhaust pipe, and exhausted as exhaust 24 from the exhaust pipe to the outside of the vehicle. The flow rate of the gas 30 to be measured, which is the intake air led to the combustion chamber, is controlled by the throttle valve 132 whose opening degree changes based on the operation of the accelerator pedal. The fuel supply amount is controlled based on the flow rate of the intake air guided to the combustion chamber, and the driver controls the flow rate of the intake air guided to the combustion chamber by controlling the opening degree of the throttle valve 132, thereby The mechanical energy generated by the engine can be controlled.

1.1 Outline of Control of Internal Combustion Engine Control System The flow rate and temperature of the measurement target gas 30 that is the intake air that is taken in from the air cleaner 122 and flows through the main passage 124 are measured by the thermal flow meter 300, and An electric signal indicating the flow rate and temperature of the intake air is input to the control device 200. Further, the output of the throttle angle sensor 144 that measures the opening degree of the throttle valve 132 is input to the control device 200, and the positions and states of the engine piston 114, the intake valve 116, and the exhaust valve 118 of the internal combustion engine, and the rotation of the internal combustion engine. In order to measure the speed, the output of the rotation angle sensor 146 is input to the control device 200. The output of the oxygen sensor 148 is input to the control device 200 in order to measure the state of the mixture ratio between the fuel amount and the air amount from the state of the exhaust 24.

  The control device 200 calculates the fuel injection amount and the ignition timing based on the flow rate of intake air that is the output of the thermal flow meter 300 and the rotational speed of the internal combustion engine that is measured based on the output of the rotation angle sensor 146. Based on these calculation results, the amount of fuel supplied from the fuel injection valve 152 and the ignition timing ignited by the spark plug 154 are controlled. The fuel supply amount and ignition timing are actually based on the intake air temperature and throttle angle change state measured by the thermal flow meter 300, the engine rotational speed change state, and the air-fuel ratio state measured by the oxygen sensor 148. It is finely controlled. The control device 200 further controls the amount of air that bypasses the throttle valve 132 by the idle air control valve 156 in the idle operation state of the internal combustion engine, thereby controlling the rotational speed of the internal combustion engine in the idle operation state.

1.2 The importance of improving the measurement accuracy of the thermal flow meter and the installation environment of the thermal flow meter Both the fuel supply amount and ignition timing, which are the main controlled variables of the internal combustion engine, are the main parameters of the output of the thermal flow meter 300 Is calculated as Therefore, improvement in measurement accuracy of the thermal flow meter 300, suppression of changes over time, and improvement in reliability are important in terms of improvement in vehicle control accuracy and ensuring reliability. In particular, in recent years, there has been a very high demand for fuel efficiency of vehicles and a very high demand for exhaust gas purification. In order to meet these demands, it is extremely important to improve the measurement accuracy of the flow rate of the measurement target gas 30 that is the intake air measured by the thermal flow meter 300. It is also important that the thermal flow meter 300 maintains high reliability.

  The vehicle on which the thermal flow meter 300 is mounted is used in an environment with a large temperature change, and is used in wind and rain or snow. When a vehicle travels on a snowy road, it travels on a road on which an antifreezing agent is sprayed. It is desirable for the thermal flow meter 300 to take into account the response to temperature changes in the environment in which it is used and the response to dust and contaminants. Further, the thermal flow meter 300 is installed in an environment that receives vibrations of the internal combustion engine. It is required to maintain high reliability against vibration.

  The thermal flow meter 300 is attached to an intake pipe that is affected by heat generated from the internal combustion engine. Therefore, heat generated by the internal combustion engine is transmitted to the thermal flow meter 300 via the intake pipe which is the main passage 124. Since the thermal flow meter 300 measures the flow rate of the gas to be measured by performing heat transfer with the gas to be measured, it is important to suppress the influence of heat from the outside as much as possible.

  As described below, the thermal flow meter 300 mounted on the vehicle simply solves the problem described in the column of the problem to be solved by the invention, and exhibits the effect described in the column of the effect of the invention. In addition, as will be described below, the above-described various problems are fully considered, and various problems required as products are solved, and various effects are produced. Specific problems to be solved by the thermal flow meter 300 and specific effects achieved will be described in the description of the following examples.

2. Configuration of Thermal Flow Meter 300 2.1 External Structure of Thermal Flow Meter 300 FIGS. 2, 3, and 4 are views showing the external appearance of the thermal flow meter 300, and FIG. 2B is a front view, FIG. 3A is a right side view, FIG. 3B is a rear view, FIG. 4A is a plan view, and FIG. ) Is a bottom view. The thermal flow meter 300 includes a housing 302, a front cover 303, and a back cover 304. The housing 302 includes a flange 312 for fixing the thermal flow meter 300 to the intake body that is the main passage 124, an external connection portion 305 having an external terminal 306 for electrical connection with an external device, and a flow rate. Etc., a measuring unit 310 is provided. A sub-passage groove for creating a sub-passage is provided inside the measuring unit 310, and a flow rate detection for measuring the flow rate of the gas 30 to be measured flowing through the main passage 124 is provided inside the measuring unit 310. A circuit package 400 including a temperature detection unit 452 for measuring the temperature of the measurement target gas 30 flowing in the unit 602 (see FIG. 16) and the main passage 124 is provided.

2.2 Effects based on the external structure of the thermal flow meter 300 Since the inlet 350 of the thermal flow meter 300 is provided on the distal end side of the measuring unit 310 extending from the flange 312 toward the center of the main passage 124, A portion of the gas that is not near the inner wall surface of the main passage 124 but near the center away from the inner wall surface can be taken into the sub-passage. For this reason, the thermal type flow meter 300 can measure the flow rate and temperature of the gas in the part away from the inner wall surface of the main passage 124, and can suppress a decrease in measurement accuracy due to the influence of heat or the like. In the vicinity of the inner wall surface of the main passage 124, the temperature of the measurement target gas 30 is easily affected by the temperature of the main passage 124 and is different from the original temperature of the gas. It will be different from the state. In particular, when the main passage 124 is an intake body of an engine, it is often maintained at a high temperature under the influence of heat from the engine. For this reason, the gas in the vicinity of the inner wall surface of the main passage 124 is often higher than the original temperature of the main passage 124, which causes a reduction in measurement accuracy.

  In the vicinity of the inner wall surface of the main passage 124, the fluid resistance is large, and the flow velocity is lower than the average flow velocity of the main passage 124. For this reason, if the gas in the vicinity of the inner wall surface of the main passage 124 is taken into the sub passage as the gas to be measured 30, a decrease in the flow velocity with respect to the average flow velocity in the main passage 124 may lead to a measurement error. In the thermal flow meter 300 shown in FIGS. 2 to 4, the inlet 350 is provided at the tip of the thin and long measuring unit 310 extending from the flange 312 toward the center of the main passage 124, so that the flow velocity in the vicinity of the inner wall surface is provided. Measurement errors related to the reduction can be reduced. In addition, in the thermal type flow meter 300 shown in FIGS. 2 to 4, not only the inlet 350 is provided at the distal end portion of the measuring unit 310 extending from the flange 312 toward the center of the main passage 124, but also the outlet of the sub passage. Is also provided at the tip of the measurement unit 310, so that measurement errors can be further reduced.

  The measurement unit 310 of the thermal flow meter 300 has a shape that extends long from the flange 312 toward the center of the main passage 124, and a portion of the gas to be measured 30 such as intake air is taken into the sub-passage at the tip. There are provided an inlet 350 and an outlet 352 for returning the gas 30 to be measured from the auxiliary passage to the main passage 124. The measuring section 310 has a shape that extends long along the axis from the outer wall of the main passage 124 toward the center, but the width has a narrow shape as shown in FIGS. 2 (A) and 3 (A). doing. That is, the measurement unit 310 of the thermal flow meter 300 has a side surface with a thin width and a substantially rectangular front surface. Thereby, the thermal flow meter 300 can be provided with a sufficiently long sub-passage, and the fluid resistance of the measurement target gas 30 can be suppressed to a small value. For this reason, the thermal type flow meter 300 can measure the flow rate of the measurement target gas 30 with high accuracy while suppressing the fluid resistance to a small value.

2.3 Structure of Temperature Detection Unit 452 As shown in FIGS. 2 and 3, the flow of the measurement target gas 30 is positioned closer to the flange 312 side than the auxiliary passage provided on the distal end side of the measurement unit 310. An inlet 343 opening toward the upstream side is formed, and a temperature detector 452 for measuring the temperature of the measurement target gas 30 is disposed inside the inlet 343. In the central part of the measurement unit 310 where the inlet 343 is provided, the upstream outer wall in the measurement unit 310 constituting the housing 302 is recessed toward the downstream side, and the temperature detection unit 452 extends from the depression-shaped upstream outer wall. Has a shape protruding toward the upstream side. Further, a front cover 303 and a back cover 304 are provided on both side portions of the hollow outer wall, and upstream ends of the front cover 303 and the rear cover 304 are directed upstream from the hollow outer wall. It has a protruding shape. Therefore, an inlet 343 for taking in the measurement target gas 30 is formed by the hollow outer wall and the front cover 303 and the back cover 304 on both sides thereof. The gas 30 to be measured taken from the inlet 343 comes into contact with the temperature detector 452 provided inside the inlet 343, and the temperature is measured by the temperature detector 452. Further, the gas to be measured 30 flows along a portion supporting the temperature detection unit 452 protruding upstream from the outer wall of the housing 302 having a hollow shape, and the front side outlet 344 and the back side outlet 345 provided in the front cover 303 and the back cover 304. To the main passage 124.

2.4 Effects related to the temperature detection unit 452 The temperature of the gas flowing into the inlet 343 from the upstream side in the direction along the flow of the gas to be measured 30 is measured by the temperature detection unit 452, and the gas further passes through the temperature detection unit 452. By flowing toward the base portion of the temperature detection unit 452 that is the supporting portion, the temperature of the portion that supports the temperature detection portion 452 is cooled in a direction approaching the temperature of the measurement target gas 30. The temperature of the intake pipe, which is the main passage 124, is normally high, and heat is transmitted from the flange 312 or the heat insulating portion 315 to the portion supporting the temperature detecting portion 452 through the upstream outer wall in the measuring portion 310, and the temperature measurement accuracy There is a risk of affecting. As described above, after the gas to be measured 30 is measured by the temperature detection unit 452, the support portion is cooled by flowing along the support portion of the temperature detection unit 452. Therefore, it is possible to suppress the heat from being transmitted from the flange 312 or the heat insulating portion 315 to the portion supporting the temperature detecting portion 452 through the upstream outer wall in the measuring portion 310.

  In particular, the support portion of the temperature detection unit 452 has a shape in which the upstream outer wall in the measurement unit 310 is recessed toward the downstream side (described below with reference to FIGS. 5 and 6). The distance between the upstream outer wall in 310 and the temperature detector 452 can be increased. As the heat conduction distance becomes longer, the distance of the cooling portion by the measurement target gas 30 becomes longer. Accordingly, it is possible to reduce the influence of heat generated from the flange 312 or the heat insulating portion 315. As a result, the measurement accuracy is improved. Since the upstream outer wall has a shape recessed toward the downstream side (described below with reference to FIGS. 5 and 6), the circuit package 400 described below (see FIGS. 5 and 6) is fixed. Becomes easy.

3. Overall structure of the housing 302 and its effect 3.1 Structure and effect of the sub-passage and the flow rate detection unit The state of the housing 302 with the front cover 303 and the back cover 304 removed from the thermal flow meter 300 is shown in FIGS. Show. 5A is a left side view of the housing 302, FIG. 5B is a front view of the housing 302, FIG. 6A is a right side view of the housing 302, and FIG. 4 is a rear view of the housing 302. FIG. The housing 302 has a structure in which the measuring unit 310 extends from the flange 312 toward the center of the main passage 124, and a sub-passage groove for forming the sub-passage is provided on the tip side thereof. In this embodiment, the sub-passage grooves are provided on both the front and back surfaces of the housing 302. FIG. 5B shows the front-side sub-passage groove 332, and FIG. 6B shows the back-side sub-passage groove 334. An inlet groove 351 for forming the inlet 350 of the sub-passage and an outlet groove 353 for forming the outlet 352 are provided at the distal end portion of the housing 302, so that the gas in a portion away from the inner wall surface of the main passage 124 In other words, the gas flowing in the portion close to the central portion of the main passage 124 can be taken in from the inlet 350 as the gas 30 to be measured. The gas flowing in the vicinity of the inner wall surface of the main passage 124 is affected by the wall surface temperature of the main passage 124 and often has a temperature different from the average temperature of the gas flowing through the main passage 124 such as intake air. Further, the gas flowing in the vicinity of the inner wall surface of the main passage 124 often exhibits a flow rate that is slower than the average flow velocity of the gas flowing through the main passage 124. Since the thermal flow meter 300 of the embodiment is not easily affected by this, it is possible to suppress a decrease in measurement accuracy.

  The sub passages formed by the front side sub passage groove 332 and the back side sub passage groove 334 described above are connected to the heat insulating portion 315 by the outer wall recess 366, the upstream outer wall 335, and the downstream outer wall 336. The upstream outer wall 335 is provided with an upstream protrusion 317, and the downstream outer wall 336 is provided with a downstream protrusion 318. With such a structure, the thermal flow meter 300 is fixed to the main passage 124 by the flange 312, whereby the measuring unit 310 having the circuit package 400 is fixed to the main passage 124 with high reliability.

  In this embodiment, the sub-passage groove for forming the sub-passage is formed in the housing 302, and the sub-passage is completed by the sub-passage groove and the cover by covering the cover with the front and back surfaces of the housing 302. . With such a structure, all the sub-passage grooves can be formed as a part of the housing 302 in the resin molding process of the housing 302. In addition, since molds are provided on both sides of the housing 302 when the housing 302 is molded, by using both molds, both the front side sub-passage groove 332 and the back side sub-passage groove 334 are all part of the housing 302. It becomes possible to mold. By providing the front cover 303 and the back cover 304 on both sides of the housing 302, the secondary passages on both sides of the housing 302 can be completed. By forming the front side secondary passage groove 332 and the back side secondary passage groove 334 on both surfaces of the housing 302 using a mold, the secondary passage can be formed with high accuracy. Moreover, high productivity is obtained.

  In FIG. 6B, a part of the measurement target gas 30 flowing through the main passage 124 is taken into the back side sub passage groove 334 from the inlet groove 351 that forms the inlet 350 and flows through the back side sub passage groove 334. The back side sub-passage groove 334 has a shape that becomes deeper as it advances, and as the gas flows along the groove, the measured gas 30 gradually moves in the front side direction. In particular, the rear side sub-passage groove 334 is provided with a steeply inclined portion 347 that becomes deeper and deeper in the upstream portion 342 of the circuit package 400, and a part of the air having a small mass moves along the steeply inclined portion 347. The upstream portion 342 flows through the measurement flow path surface 430 shown in FIG. On the other hand, since a foreign substance having a large mass is difficult to change its course rapidly due to inertial force, the foreign substance moves on the measurement channel surface rear surface 431 shown in FIG. Thereafter, it passes through the downstream portion 341 of the circuit package 400 and flows through the measurement channel surface 430 shown in FIG.

  The flow of the measurement target gas 30 in the vicinity of the heat transfer surface exposed portion 436 will be described with reference to FIG. In the front side sub-passage groove 332 illustrated in FIG. 5B, the air that is the measurement target gas 30 that has moved from the upstream portion 342 of the circuit package 400 to the front side sub-passage groove 332 is along the measurement channel surface 430. Then, heat is transferred to and from the flow rate detection unit 602 for measuring the flow rate via the heat transfer surface exposed portion 436 provided on the measurement flow path surface 430, and the flow rate is measured. Both the gas 30 to be measured that has passed through the measurement flow path surface 430 and the air that has flowed from the downstream portion 341 of the circuit package 400 to the front side sub-passage groove 332 flow along the front side sub-passage groove 332 to form the outlet 352. It is discharged from the exit groove 353 to the main passage 124.

  A substance having a large mass such as dust mixed in the measurement target gas 30 has a large inertial force, and along the surface of the portion of the steeply inclined portion 347 shown in FIG. It is difficult to change the course rapidly in the deep direction of the groove. For this reason, the foreign matter having a large mass moves toward the measurement channel surface rear surface 431, and the foreign matter can be prevented from passing near the heat transfer surface exposed portion 436. In this embodiment, since many foreign substances having a large mass other than gas pass through the measurement channel surface rear surface 431 which is the back surface of the measurement channel surface 430, they are caused by foreign matters such as oil, carbon, and dust. The influence of dirt can be reduced, and the decrease in measurement accuracy can be suppressed. That is, since it has a shape in which the path of the gas to be measured 30 is suddenly changed along an axis that crosses the flow axis of the main passage 124, the influence of foreign matter mixed in the gas to be measured 30 can be reduced.

  In this embodiment, the flow path formed by the back side sub-passage groove 334 draws a curve from the front end of the housing 302 toward the flange, and the gas flowing through the sub-passage flows into the main passage 124 at the position closest to the flange. On the other hand, the flow is in the reverse direction, and the sub-passage on the back surface, which is one side in the flow portion in the reverse direction, is connected to the sub-passage formed on the surface side, which is the other side. By doing so, it becomes easy to fix the heat transfer surface exposed portion 436 of the circuit package 400 to the sub-passage, and further, it becomes easy to take in the gas 30 to be measured at a position close to the central portion of the main passage 124.

  In this embodiment, the flow passage surface 430 for measuring the flow rate has a structure that penetrates the back side sub-passage groove 334 and the front side sub-passage groove 332 in the front-rear direction in the flow direction, and the front end side of the circuit package 400 is the housing. In this configuration, the cavity 382 is provided instead of the configuration supported by 302, and the space of the upstream portion 342 of the circuit package 400 and the space of the downstream portion 341 of the circuit package 400 are connected. As a configuration that penetrates the upstream portion 342 of the circuit package 400 and the downstream portion 341 of the circuit package 400, the front side sub passage groove 332 formed on the other surface of the housing 302 from the back side sub passage groove 334 formed on one surface of the housing 302. The sub passage is formed in a shape in which the gas 30 to be measured moves. With such a configuration, the sub-passage grooves can be formed on both surfaces of the housing 302 in a single resin molding step, and the structure connecting the sub-passage grooves on both surfaces can be formed together.

  When molding the housing 302, a structure is formed that penetrates the upstream portion 342 of the circuit package 400 and the downstream portion 341 of the circuit package 400 by clamping both sides of the measurement flow path surface 430 formed in the circuit package 400 with a molding die. In addition, the circuit package 400 can be mounted on the housing 302 simultaneously with resin molding of the housing 302. Thus, by forming the circuit package 400 by inserting it into the molding die of the housing 302, the circuit package 400 and the heat transfer surface exposed portion 436 can be mounted with high accuracy in the sub-passage.

  A back side sub-passage inner peripheral wall 391 and a back side sub-passage outer peripheral wall 392 are provided on both sides of the back side sub-passage groove 334, and the height direction ends of the back side sub-passage inner peripheral wall 391 and the back side sub-passage outer peripheral wall 392 are respectively provided. The back side sub-passage of the housing 302 is formed by the close contact between the portion and the inner surface of the back cover 304. Further, a front side sub-passage inner peripheral wall 393 and a front side sub-passage outer peripheral wall 394 are provided on both sides of the front side sub-passage groove 332. The front side sub-passage inner peripheral wall 393 and the front-side sub-passage outer peripheral wall 394 and the front end portion in the height direction and the front side. When the inner surface of the cover 303 is in close contact, the front side sub-passage of the housing 302 is formed.

  5 and 6, the upstream outer wall 335 includes an outer wall recess 366 that has a shape that is recessed downstream at the root of the temperature detector 452. The outer wall recess 366 increases the distance between the temperature detection unit 452 and the outer wall recess 366, thereby reducing the influence of heat transmitted through the upstream outer wall 335.

3.2 Structure and Effect of Sub-Flow-Flow Detection Unit FIG. 7 is a partially enlarged view showing a state in which the measurement channel surface 430 of the circuit package 400 is arranged inside the sub-passage groove. It is -A sectional drawing. Note that this figure is a conceptual diagram, and the details shown in FIGS. 5 and 6 are omitted and simplified in detail in FIG. 7, and the details are slightly modified. The left portion in FIG. 7 is the end portion of the back side auxiliary passage groove 334, and the right side portion is the starting end portion of the front side auxiliary passage groove 332. Although not clearly shown in FIG. 7, penetrating portions are provided on the left and right sides of the circuit package 400 having the measurement channel surface 430, and the back sides are provided on the left and right sides of the circuit package 400 having the measurement channel surface 430. The sub passage groove 334 and the front side sub passage groove 332 are connected.

  The gas to be measured 30 taken from the inlet 350 and flowing through the back side sub-passage formed by the back side sub-passage groove 334 is guided from the left side of FIG. 342 flows through the surface of the measurement channel surface 430 of the circuit package 400 and the channel 386 formed by the protrusion 356 provided on the front cover 303 via the through-hole 342, and the other gas to be measured 30 is used for measurement. It flows in the direction of the flow path 387 formed by the flow path surface back surface 431 and the back cover 304. Thereafter, the gas to be measured 30 that has flowed through the flow path 387 moves toward the front side sub-passage groove 332 through the penetration portion of the downstream portion 341 of the circuit package 400, and merges with the gas to be measured 30 that is flowing through the flow path 386. Then, it flows through the front side auxiliary passage groove 332 and is discharged from the outlet 352 to the main passage 124.

  The measured gas 30 led to the flow path 386 from the back side sub-passage groove 334 through the penetration part of the upstream part 342 of the circuit package 400 is bent more than the flow path guided to the flow path 387. Since the sub-passage groove is formed, a substance having a large mass such as dust contained in the gas to be measured 30 gathers in the flow path 387 having a small bend. For this reason, almost no foreign substance flows into the flow path 386.

  In the flow path 386, a structure is formed in which the throttle is formed by the protrusion 356 provided on the front cover 303 projecting gradually toward the measurement flow path surface 430 continuously from the most distal portion of the front side sub-passage groove 332. Is made. A flow path surface for measurement 430 is arranged on one side of the throttle part of the flow path 386, and a heat transfer surface exposed part for allowing the flow rate detection unit 602 to transfer heat to the measurement target gas 30 on the flow path surface for measurement 430. 436 is provided. In order to measure the flow rate detection unit 602 with high accuracy, it is desirable that the measurement target gas 30 is a laminar flow with few vortices in the heat transfer surface exposed portion 436. In addition, the measurement accuracy is improved when the flow velocity is high. For this purpose, the diaphragm is formed by the projection 356 provided on the front cover 303 facing the measurement channel surface 430 smoothly projecting toward the measurement channel surface 430. This restriction acts to reduce the vortex of the measured gas 30 and bring it closer to the laminar flow. Further, the flow velocity is increased in the throttle portion, and since the heat transfer surface exposed portion 436 for measuring the flow rate is arranged in the throttle portion, the flow rate measurement accuracy is improved.

  A projection is formed by projecting the protrusion 356 into the sub-passage groove so as to face the heat transfer surface exposed portion 436 provided on the measurement flow path surface 430, so that the measurement accuracy can be improved. The protrusion 356 for forming the aperture is provided on the cover facing the heat transfer surface exposed portion 436 provided on the measurement flow path surface 430. In FIG. 7, since the cover facing the heat transfer surface exposed portion 436 provided on the measurement flow path surface 430 is the front cover 303, the front cover 303 is provided with a protrusion 356, but the front cover 303 or the back cover 304 is provided. Of these, it may be provided on the cover facing the heat transfer surface exposed portion 436 provided on the measurement flow path surface 430. Depending on which of the measurement flow path surface 430 and the surface on which the heat transfer surface exposed portion 436 is provided in the circuit package 400, which of the covers facing the heat transfer surface exposed portion 436 is changed.

  In FIG. 5 and FIG. 6, the trace of the mold used in the resin molding process of the circuit package 400 is applied to the measurement channel surface rear surface 431 which is the back surface of the heat transfer surface exposed portion 436 provided on the measurement channel surface 430. 442 remains. The press mark 442 does not particularly hinder measurement of the flow rate, and there is no problem even if the press mark 442 remains as it is. As will be described later, when the circuit package 400 is molded with a resin mold, it is important to protect the semiconductor diaphragm of the flow rate detection unit 602. For this reason, it is important to hold the back surface of the heat transfer surface exposed portion 436. It is also important that the resin that covers the circuit package 400 does not flow into the heat transfer surface exposed portion 436. From this point of view, the measurement flow path surface 430 including the heat transfer surface exposed portion 436 is surrounded by a mold, and the back surface of the heat transfer surface exposed portion 436 is pressed by another mold to prevent the inflow of resin. Since the circuit package 400 is made by transfer molding, the pressure of the resin is high, and it is important to press the heat transfer surface exposed portion 436 from the back surface. Further, a semiconductor diaphragm is used for the flow rate detection unit 602, and it is desirable to form a ventilation passage formed by the semiconductor diaphragm. In order to hold and fix a plate or the like for forming the ventilation passage, it is important to press the heat transfer surface exposed portion 436 from the back surface.

3.3 Fixing Structure and Effect of Circuit Package 400 by Housing 302 Next, referring to FIGS. 5 and 6 again, fixing of the circuit package 400 to the housing 302 by a resin molding process will be described. In the embodiment shown in FIGS. 5 and 6, for example, in the embodiment shown in FIG. 5 and FIG. 6, the surface of the circuit package 400 is formed on the connecting portion of the front side sub passage groove 332 and the back side sub passage groove 334. The circuit package 400 is arranged and fixed to the housing 302 so that the measurement flow path surface 430 is arranged. A portion for embedding and fixing the circuit package 400 in the housing 302 with a resin mold is provided as a fixing portion 372 for embedding and fixing the circuit package 400 in the housing 302 on the flange 312 side slightly from the sub-passage groove. The fixing portion 372 is embedded so as to cover the outer periphery of the circuit package 400 formed by the first resin molding process.

  As shown in FIG. 5B, the circuit package 400 is fixed by a fixing portion 372. The fixing portion 372 includes the circuit package 400 by a surface having a height in contact with the front cover 303 and a thin portion 376. By reducing the thickness of the resin covering the portion 376, the shrinkage when the temperature of the resin cools when the fixing portion 372 is molded can be reduced, and the concentration of stress applied to the circuit package 400 can be reduced. is there. As shown in FIG. 6B, when the back side of the circuit package 400 is also shaped as described above, more effects can be obtained.

  Further, the entire surface of the circuit package 400 is not covered with the resin for molding the housing 302, but a portion where the outer wall of the circuit package 400 is exposed is provided on the flange 312 side of the fixing portion 372. 5 and 6, the area of the outer peripheral surface of the circuit package 400 that is included in the resin of the housing 302 is exposed from the resin of the housing 302 without being included in the resin of the housing 302. The area is wider. Further, the part of the measurement flow path surface 430 of the circuit package 400 is also exposed from the resin forming the housing 302.

  By thinning a part of the fixing portion 372 that covers the outer wall of the circuit package 400 in a strip shape over the entire circumference, the periphery of the circuit package 400 is included in the second resin molding step for molding the housing 302. Thus, excessive stress concentration due to volume shrinkage in the process of hardening the fixing portion 372 is reduced. Excessive stress concentration may also adversely affect the circuit package 400.

  In addition, in order to more securely fix the circuit package 400 with a small area by reducing the area of the outer surface of the circuit package 400 included in the resin of the housing 302, the circuit package 400 in the fixing portion 372 can be fixed more firmly. It is desirable to improve the adhesion with the outer wall of the. When a thermoplastic resin is used for the purpose of molding the housing 302, the thermoplastic resin enters the fine irregularities of the outer wall of the circuit package 400 in a state where the viscosity of the thermoplastic resin is low, and the thermoplastic resin enters the fine irregularities of the outer wall. It is desirable for the resin to cure. In the resin molding process for molding the housing 302, it is desirable to provide an inlet for the thermoplastic resin at or near the fixed portion 372. The thermoplastic resin increases in viscosity based on a decrease in temperature and hardens. Accordingly, by pouring the high temperature thermoplastic resin into or from the fixing portion 372, the low viscosity thermoplastic resin can be brought into close contact with the outer wall of the circuit package 400 and cured. This suppresses the temperature drop of the thermoplastic resin, prolongs the low-viscosity state, and improves the adhesion between the circuit package 400 and the fixing portion 372.

  By roughening the outer wall surface of the circuit package 400, the adhesion between the circuit package 400 and the fixing portion 372 can be improved. As a method for roughening the outer wall surface of the circuit package 400, a roughening method for forming fine irregularities on the surface of the circuit package 400 after the circuit package 400 is formed in the first resin molding step, for example, a treatment method called matte treatment. There is. As a roughening method for applying fine irregularities to the surface of the circuit package 400, for example, it can be roughened by sandblasting. Further, it can be roughened by laser processing.

  There is a difference in the thermal expansion coefficient between the thermosetting resin that forms the circuit package 400 and the thermoplastic resin that forms the housing 302 including the fixing portion 372, and an excessive stress generated based on the difference in the thermal expansion coefficient causes the circuit package. It is desirable not to join 400.

  Furthermore, by making the shape of the fixing portion 372 including the outer periphery of the circuit package 400 into a band shape and narrowing the width of the band, the stress due to the difference in thermal expansion coefficient applied to the circuit package 400 can be reduced. It is desirable that the width of the band of the fixing portion 372 is 10 mm or less, preferably 8 mm or less. In the present embodiment, not only the fixing portion 372 but also the outer wall recess 366 that is a part of the upstream outer wall 335 of the housing 302 includes the circuit package 400 and fixes the circuit package 400. The width of the band 372 can be further reduced. For example, if there is a width of 3 mm or more, the circuit package 400 can be fixed.

  The surface of the circuit package 400 is provided with a portion covered with the resin for molding the housing 302 and a portion exposed without being covered for the purpose of reducing stress due to the difference in thermal expansion coefficient. A plurality of portions where the surface of the circuit package 400 is exposed from the resin of the housing 302 are provided, one of which is the measurement flow path surface 430 having the heat transfer surface exposed portion 436 described above. A portion exposed to the flange 312 side from the fixing portion 372 is provided. Further, an outer wall recess 366 is formed, and a portion upstream of the outer wall recess 366 is exposed, and this exposed portion is used as a support for supporting the temperature detector 452. The portion of the outer surface of the circuit package 400 closer to the flange 312 than the fixing portion 372 extends from the outer periphery, particularly from the downstream side of the circuit package 400 to the side facing the flange 312, and further to the upstream side of the portion close to the terminal of the circuit package 400. The air gap is formed so as to surround the circuit package 400. Since the gap is formed around the portion where the surface of the circuit package 400 is exposed in this way, the amount of heat transferred from the main passage 124 to the circuit package 400 via the flange 312 can be reduced, and measurement due to the influence of heat. The decrease in accuracy is suppressed.

  A gap is formed between the circuit package 400 and the flange 312, and this gap portion functions as the terminal connection portion 320. At the terminal connection portion 320, the connection terminal 412 of the circuit package 400 and the external terminal inner end 361 located on the housing 302 side of the external terminal 306 are electrically connected by spot welding or laser welding, respectively. As described above, the gap of the terminal connection portion 320 has an effect of suppressing heat transfer from the housing 302 to the circuit package 400, and the connection work between the connection terminal 412 of the circuit package 400 and the external terminal inner end 361 of the external terminal 306. Is reserved as usable space for.

3.4 Housing 302 Molding and Effects by Second Resin Molding Process In the housing 302 shown in FIGS. 5 and 6, the circuit package 400 including the flow rate detection unit 602 and the processing unit 604 is manufactured by the first resin molding process. Next, the housing 302 having, for example, the front side sub-passage groove 332 and the back side sub-passage groove 334 for forming the sub-passage through which the measurement target gas 30 flows is manufactured in the second resin molding process. In the second resin molding step, the circuit package 400 is built in the resin of the housing 302 and fixed in the housing 302 by a resin mold. By doing so, the heat transfer surface exposed portion 436 and the sub-passage, for example, the front-side sub-passage groove 332 and the back-side sub-passage for the heat-flow detecting unit 602 to perform heat transfer with the measurement target gas 30 to measure the flow rate It becomes possible to maintain the relationship with the shape of the passage groove 334, for example, the positional relationship and the direction relationship, with extremely high accuracy. It is possible to suppress errors and variations occurring in each circuit package 400 to a very small value. As a result, the measurement accuracy of the circuit package 400 can be greatly improved. For example, the measurement accuracy can be improved by a factor of two or more compared to a conventional method of fixing using an adhesive. The thermal flow meter 300 is often produced by mass production, and the method of adhering with an adhesive while strictly measuring here has a limit in improving measurement accuracy. However, as in the present embodiment, the circuit package 400 is manufactured by the first resin molding process, and then the sub-passage is formed in the second resin molding process in which the sub-passage for flowing the measurement target gas 30 is formed. By fixing the auxiliary passage, variation in measurement accuracy can be greatly reduced, and the measurement accuracy of each thermal flow meter 300 can be greatly improved. This applies not only to the embodiment shown in FIGS. 5 and 6, but also to the embodiment shown in FIG.

  For example, in the embodiment shown in FIG. 5 and FIG. 6, the relationship among the front side sub-passage groove 332, the back side sub-passage groove 334, and the heat transfer surface exposed portion 436 is set with high accuracy so as to be a prescribed relationship. The circuit package 400 can be fixed to the housing 302. As a result, in the mass production type thermal flow meter 300, the positional relationship between the heat transfer surface exposed portion 436 of each circuit package 400 and the sub-passage, such as the positional relationship and shape, are constantly obtained with very high accuracy. It becomes possible. Since the sub-passage groove, for example, the front-side sub-passage groove 332 and the back-side sub-passage groove 334, to which the heat transfer surface exposed portion 436 of the circuit package 400 is fixed can be formed with very high accuracy, the sub-passage is formed from the sub-passage groove. The work is a work of covering both surfaces of the housing 302 with the front cover 303 and the back cover 304. This work is very simple and is a work process with few factors that reduce the measurement accuracy. The front cover 303 and the back cover 304 are produced by a resin molding process with high molding accuracy. Accordingly, it is possible to complete the sub-passage provided in a defined relationship with the heat transfer surface exposed portion 436 of the circuit package 400 with high accuracy. By such a method, in addition to improvement of measurement accuracy, high productivity can be obtained.

  On the other hand, in the past, a thermal flow meter was produced by manufacturing a sub-passage and then adhering a measuring unit to the sub-passage with an adhesive. As described above, the method of using the adhesive has a large variation in the thickness of the adhesive, and the bonding position and the bonding angle vary from product to product. For this reason, there was a limit to increasing the measurement accuracy. Furthermore, when performing these operations in a mass production process, it is very difficult to improve measurement accuracy.

  In the embodiment according to the present invention, first, the circuit package 400 including the flow rate detecting unit 602 is produced by the first resin mold, and then the circuit package 400 is fixed by the resin mold and at the same time, the auxiliary passage is formed by the resin mold. For this purpose, a secondary passage groove is formed by the second resin mold. By doing in this way, the flow volume detection part 602 can be fixed to the shape of the sub passage groove and the sub passage groove with extremely high accuracy.

  A portion related to the measurement of the flow rate, for example, the measurement flow path surface 430 to which the heat transfer surface exposed portion 436 and the heat transfer surface exposed portion 436 of the flow rate detection unit 602 are attached is formed on the surface of the circuit package 400. Thereafter, the measurement channel surface 430 and the heat transfer surface exposed portion 436 are exposed from the resin for molding the housing 302. That is, the heat transfer surface exposed portion 436 and the measurement flow path surface 430 around the heat transfer surface exposed portion 436 are not covered with the resin for molding the housing 302. The flow passage surface 430 for measurement and the heat transfer surface exposed portion 436 formed by the resin mold of the circuit package 400 or the temperature detection portion 452 are also used as they are after the resin molding of the housing 302 to measure the flow rate of the thermal flow meter 300. Used for temperature measurement. By doing so, the measurement accuracy is improved.

  In the embodiment according to the present invention, the circuit package 400 is fixed to the housing 302 with a small fixed area because the circuit package 400 is fixed to the housing 302 having the sub passage by integrally forming the circuit package 400 with the housing 302. it can. That is, the surface area of the circuit package 400 that is not in contact with the housing 302 can be increased. The surface of the circuit package 400 that is not in contact with the housing 302 is exposed to a gap, for example. The heat of the intake pipe is transmitted to the housing 302 and is transmitted from the housing 302 to the circuit package 400. The housing 302 does not include the entire surface or most of the circuit package 400, but the circuit package 400 can be maintained with high accuracy and high reliability even when the contact area between the housing 302 and the circuit package 400 is reduced. It can be fixed to the housing 302. For this reason, heat transfer from the housing 302 to the circuit package 400 can be suppressed to a low level, and a decrease in measurement accuracy can be suppressed.

  In the embodiment shown in FIGS. 5 and 6, the area A of the exposed surface of the circuit package 400 may be equal to the area B covered with the molding material of the housing 302 or the area A may be larger than the area B. Is possible. In the embodiment, the area A is larger than the area B. By doing so, heat transfer from the housing 302 to the circuit package 400 can be suppressed. Further, the stress due to the difference between the thermal expansion coefficient of the thermosetting resin forming the circuit package 400 and the expansion coefficient of the thermoplastic resin forming the housing 302 can be reduced.

4. Appearance of the circuit package 400 4.1 Molding of the measurement flow path surface 430 including the heat transfer surface exposed portion 436 FIG. 8 shows the appearance of the circuit package 400 produced in the first resin molding step. The hatched portion described on the exterior of the circuit package 400 is used in the second resin molding process when the housing 302 is molded in the second resin molding process after the circuit package 400 is manufactured in the first resin molding process. The fixing surface 432 where the circuit package 400 is covered with the resin to be shown is shown. 8A is a left side view of the circuit package 400, FIG. 8B is a front view of the circuit package 400, and FIG. 8C is a rear view of the circuit package 400. The circuit package 400 incorporates a flow rate detection unit 602 and a processing unit 604, which will be described later, and these are molded with a thermosetting resin and integrally molded.

  On the surface of the circuit package 400 shown in FIG. 8B, a measurement channel surface 430 that acts as a surface for flowing the measurement target gas 30 is formed in a shape that extends long in the flow direction of the measurement target gas 30. In this embodiment, the measurement channel surface 430 has a rectangular shape extending in the flow direction of the measurement target gas 30. As shown in FIG. 8A, the measurement channel surface 430 is made thinner than other portions, and a heat transfer surface exposed portion 436 is provided in a part thereof. The built-in flow rate detection unit 602 performs heat transfer with the measurement target gas 30 via the heat transfer surface exposure unit 436, measures the state of the measurement target gas 30, for example, the flow velocity of the measurement target gas 30, and the main passage 124. An electric signal representing the flow rate flowing through the is output.

  In order for the built-in flow rate detection unit 602 (see FIG. 16) to measure the state of the gas 30 to be measured with high accuracy, the gas flowing in the vicinity of the heat transfer surface exposed portion 436 is laminar and less disturbed. desirable. For this reason, it is preferable that there is no step between the side surface of the heat transfer surface exposed portion 436 and the surface of the measurement channel surface 430 that guides the gas. With such a configuration, it is possible to suppress uneven stress and distortion from acting on the flow rate detection unit 602 while maintaining high accuracy in flow rate measurement. The step may be provided as long as it does not affect the flow rate measurement accuracy.

  As shown in FIG. 8 (C), on the back surface of the measurement flow path surface 430 having the heat transfer surface exposed portion 436, a pressing mark 442 for pressing the mold that supports the internal substrate or plate when the circuit package 400 is molded with resin. Remains. The heat transfer surface exposed part 436 is a place used for exchanging heat with the gas to be measured 30. In order to accurately measure the state of the gas to be measured 30, the flow detection part 602 and the object to be measured are used. It is desirable that heat transfer with the measurement gas 30 be performed satisfactorily. For this reason, it is necessary to avoid that the heat transfer surface exposed portion 436 is covered with the resin in the first resin molding step. A mold is applied to both the heat transfer surface exposed portion 436 and the measurement flow path surface back surface 431 which is the back surface thereof, and the mold prevents the resin from flowing into the heat transfer surface exposed portion 436. A recessed trace 442 is formed on the back surface of the heat transfer surface exposed portion 436. In this portion, elements constituting the flow rate detection unit 602 and the like are arranged close to each other, and it is desirable to dissipate heat generated by these elements to the outside as much as possible. The molded recess has an effect of being easy to dissipate heat with little influence of the resin.

  A semiconductor diaphragm corresponding to the heat transfer surface exposed portion 436 is formed in the flow rate detection unit (flow rate detection element) 602 formed of a semiconductor element, and the semiconductor diaphragm forms a gap on the back surface of the flow rate detection unit 602. Can be obtained. When the gap is sealed, the semiconductor diaphragm is deformed due to a change in pressure in the gap due to a temperature change, and the measurement accuracy is lowered. Therefore, in this embodiment, an opening 438 communicating with the gap on the back surface of the semiconductor diaphragm is provided on the surface of the circuit package 400, and a communication path connecting the gap on the back surface of the semiconductor diaphragm and the opening 438 is provided inside the circuit package 400. Note that the opening 438 is provided in a portion where the hatched lines shown in FIG. 8 are not described so that the opening 438 is not blocked by the resin in the second resin molding step.

  It is necessary to mold the opening 438 in the first resin molding step. A mold is applied to the opening 438 and the back surface thereof, and both the front and back surfaces are pressed with the mold, so that the resin to the opening 438 can be formed. Inflow is blocked and opening 438 is formed. The formation of the communication path that connects the opening 438 and the gap on the back surface of the semiconductor diaphragm and the opening 438 will be described later.

4.2 Molding and Effect of Temperature Detection Unit 452 and Projection 424 The temperature detection unit 452 provided in the circuit package 400 is a projection that extends in the upstream direction of the gas to be measured 30 to support the temperature detection unit 452. It is provided at the tip of 424 and has a function of detecting the temperature of the gas 30 to be measured. In order to detect the temperature of the gas to be measured 30 with high accuracy, it is desirable to reduce the heat transfer with the portion other than the gas to be measured 30 as much as possible. The protrusion 424 that supports the temperature detection unit 452 has a tip that is narrower than the base, and the temperature detection unit 452 is provided at the tip. With such a shape, the influence of heat from the base portion of the protruding portion 424 on the temperature detecting portion 452 is reduced.

  In addition, after the temperature of the measurement target gas 30 is detected by the temperature detection unit 452, the measurement target gas 30 flows along the protrusion 424, and acts to bring the temperature of the protrusion 424 close to the temperature of the measurement target gas 30. As a result, the influence of the temperature of the base portion of the protrusion 424 on the temperature detection unit 452 is suppressed. In particular, in this embodiment, the vicinity of the protruding portion 424 including the temperature detecting portion 452 is thin, and becomes thicker toward the root of the protruding portion 424. For this reason, the measurement target gas 30 flows along the shape of the protruding portion 424, and the protruding portion 424 is efficiently cooled.

  A hatched portion at the base portion of the protruding portion 424 is a fixed surface 432 covered with a resin for forming the housing 302 in the second resin molding step. A depression is provided in the shaded portion at the base of the protrusion 424. This indicates that a hollow portion that is not covered with the resin of the housing 302 is provided. In this way, by forming a hollow-shaped portion that is not covered with the resin of the housing 302 at the base of the protrusion 424, the protrusion 424 is further easily cooled by the measurement target gas 30.

4.3 Terminals of the circuit package 400 The circuit package 400 is connected to supply power for operating the built-in flow rate detection unit 602 and processing unit 604, and to output flow rate measurement values and temperature measurement values. A terminal 412 is provided. Further, a terminal 414 is provided to inspect whether the circuit package 400 operates correctly and whether an abnormality has occurred in the circuit components or their connections. In this embodiment, the circuit package 400 is made by transfer molding the flow rate detection unit 602 and the processing unit 604 using a thermosetting resin in the first resin molding step. By performing transfer molding, the dimensional accuracy of the circuit package 400 can be improved. However, in the transfer molding process, a high-temperature pressure is applied to the inside of the sealed mold containing the flow rate detection unit 602 and the processing unit 604. Since the resin is injected, it is desirable to inspect the completed circuit package 400 for damage to the flow rate detection unit 602, the processing unit 604, and their wiring relationship. In this embodiment, a terminal 414 for inspection is provided, and each circuit package 400 produced is inspected. Since the inspection terminal 414 is not used for measurement, the terminal 414 is not connected to the external terminal inner end 361 as described above. Each connection terminal 412 is provided with a bending portion 416 in order to increase mechanical elastic force. By giving each connection terminal 412 a mechanical elastic force, it is possible to absorb stress generated due to a difference in thermal expansion coefficient between the resin in the first resin molding process and the resin in the second resin molding process. That is, each connection terminal 412 is affected by thermal expansion due to the first resin molding process, and the external terminal inner end 361 connected to each connection terminal 412 is affected by resin due to the second resin molding process. Generation | occurrence | production of the stress resulting from these resin differences can be absorbed.

4.4 Fixing of Circuit Package 400 by Second Resin Molding Process and Its Effect In FIG. 8, the hatched portion is the second resin molding process in order to fix circuit package 400 to housing 302 in the second resin molding process. The fixing surface 432 for covering the circuit package 400 with the thermoplastic resin to be used is shown. As described with reference to FIG. 5 and FIG. 6, the relationship between the measurement channel surface 430 and the heat transfer surface exposed portion 436 provided on the measurement channel surface 430 and the shape of the sub-passage is a prescribed relationship. As such, it is important to be maintained with high accuracy. In the second resin molding step, since the circuit package 400 is fixed to the housing 302 that simultaneously molds the sub-passage and molds the sub-passage, the relationship between the sub-passage, the measurement flow path surface 430 and the heat transfer surface exposed portion 436 It can be maintained with extremely high accuracy. That is, since the circuit package 400 is fixed to the housing 302 in the second resin molding step, the circuit package 400 can be positioned and fixed with high accuracy in a mold for forming the housing 302 having the sub-passage. It becomes possible. By injecting a high-temperature thermoplastic resin into the mold, the sub-passage is molded with high accuracy, and the circuit package 400 is fixed with high accuracy.

  In this embodiment, the entire surface of the circuit package 400 is not the fixing surface 432 that is covered with the resin for molding the housing 302, but the surface is exposed to the connection terminal 412 side of the circuit package 400, that is, the housing is covered with the resin for the housing 302. The part which is not broken is provided. In the embodiment shown in FIG. 8, the area of the surface of the circuit package 400 that is not included in the resin of the housing 302 and exposed from the resin for the housing 302 is larger than the area of the fixing surface 432 included in the resin for the housing 302. Is wider.

  There is a difference in the thermal expansion coefficient between the thermosetting resin that forms the circuit package 400 and the thermoplastic resin that forms the housing 302 including the fixing portion 372, and stress based on this difference in thermal expansion coefficient is not applied to the circuit package 400 as much as possible. It is desirable to do so. By reducing the fixed surface 432 on the surface of the circuit package 400, the influence based on the difference in thermal expansion coefficient can be reduced. For example, the fixed surface 432 on the surface of the circuit package 400 can be reduced by forming a belt with a width L.

  Further, by providing the fixing surface 432 at the base of the protruding portion 424, the mechanical strength of the protruding portion 424 can be increased. On the surface of the circuit package 400, by providing a band-shaped fixed surface in a direction along the axis through which the measured gas 30 flows, and further providing a fixed surface in a direction intersecting with the axis through which the measured gas 30 flows, the circuit package is more firmly provided 400 and the housing 302 can be fixed to each other. In the fixed surface 432, a portion surrounding the circuit package 400 in a band shape with a width L along the measurement flow path surface 430 is a fixed surface in the direction along the flow axis of the measurement target gas 30 described above, and the root of the protrusion 424. The portion that covers is a fixed surface in the direction crossing the flow axis of the measurement target gas 30.

5. Mounting of circuit components on circuit package 5.1 Circuit package lead frame 511
FIG. 9 shows the lead frame 511 of the circuit package 400 and the mounting state of the circuit components mounted on the lead frame 511. A broken line portion 508 indicates a resin sealing region that is covered with a mold used when the circuit package 400 is molded and sealed with resin. Dashed lines 509 and 510 indicate overflow regions where mold resin that has passed through the overflow gate and overflowed from the cavity flows.

  The lead frame 511 has a plurality of leads and a support frame 512 that is mechanically connected to the plurality of leads. In the center of the lead frame 511, a mounting portion on which the plate 532 is mounted is provided. Mounted on the plate 532 are a chip-shaped flow rate detection unit 602 and a processing unit 604 made as an LSI, which are circuit components. The flow rate detection unit 602 is provided with a diaphragm 672, which corresponds to the heat transfer surface exposed portion 436 described above by the molding described above. Further, each terminal of the flow rate detection unit 602 described below and the processing unit 604 are electrically connected by wires 542. Further, each terminal of the processing unit 604 and the corresponding lead 514 are connected by a wire 543. Further, the lead 514 located between the portion serving as the connection terminal of the circuit package 400 and the plate 532 is connected to the chip component 516 which is a circuit component therebetween.

  In this way, when the circuit package 400 is completed, the flow rate detection unit 602 having the diaphragm 672 is disposed at the most distal end side, and the processing unit 604 is in an LSI state to be a connection terminal with respect to the flow rate detection unit 602. Further, a connection wire 543 is disposed on the terminal side of the processing unit 604. In this way, by arranging the flow rate detection unit 602, the processing unit 604, the wire 543, the chip component 516, and the connection lead 514 in order from the front end side of the circuit package 400 to the connection terminal, the whole is simplified, and the whole Is a concise arrangement.

  A mounting portion is provided to support the plate 532, and this mounting portion is supported and fixed to the support frame 512 by leads 556 and leads 558. The mounting portion has a lead surface (not shown) having an area equivalent to that of the plate 532 connected to the lower surface of the plate 532, and the plate 532 is mounted on the lead surface of the mounting portion. The lead surfaces of these mounting parts are grounded. Thus, noise can be suppressed by performing grounding in the circuits of the flow rate detection unit 602 and the processing unit 604 via the lead surface in common, and the measurement accuracy of the measurement target gas 30 is improved. Further, a lead 544 is provided so as to protrude from the plate 532 toward the upstream side of the flow path, that is, along the X axis in a direction crossing the arrangement direction of the flow rate detection unit 602, the processing unit 604, and the chip component 516 described above. It has been. A temperature detection element 518, for example, a chip-like thermistor is connected to the lead 544. Furthermore, a lead 548 is provided near the processing portion 604 that is the base of the protruding portion, and the lead 544 and the lead 548 are electrically connected by a thin wire 546 such as an Au wire. When the lead 548 and the lead 544 are directly connected, heat is transmitted to the temperature detection element 518 through the lead 548 and the lead 544, and the temperature of the measurement target gas 30 cannot be measured accurately. For this reason, the thermal resistance between the lead 548 and the lead 544 can be increased by connecting with a line having a small cross-sectional area and a large thermal resistance. Thereby, the influence of heat does not reach the temperature detection element 518, and the measurement accuracy of the temperature of the measurement target gas 30 is improved.

  The lead 548 is fixed to the support frame 512 by a lead 552 and a lead 554. The connecting portion between the lead 552 and the lead 554 and the support frame 512 is fixed to the support frame 512 in an inclined state with respect to the protruding direction of the protruding temperature detecting element 518, and the mold is also inclined at this portion. It becomes arrangement of. As the molding resin flows along this oblique state in the first resin molding step, the molding resin in the first resin molding step flows smoothly to the tip portion where the temperature detection element 518 is provided, and reliability is improved. improves.

  FIG. 9 shows an arrow 592 indicating the resin press-fitting direction. A resin in which circuit components such as a temperature detection element 518, a flow rate detection unit 602, a processing unit 604, and a chip component 516 are mounted on a lead frame 511, the lead frame 511 is covered with a mold, and the mold is provided at a circled position. A thermosetting resin is injected into the cavity of the mold in the direction of the arrow 592 from the injection press-fitting hole (filling inlet portion) 598. The press-fitting hole 598 is provided at a position facing the flow rate detection unit 602 and the temperature detection element 518 of the circuit package 400. In other words, the temperature detection element 518 and the flow rate detection unit 602 are arranged at a front position in the direction in which the thermosetting resin is injected from the press-fitting hole 598 (the direction of the arrow 592). The temperature detection element 518 is mounted on the lead 544. Circuit components such as a plate 532, a processing unit 604, and a chip component 516 are provided at a position closer to the press-fitting hole 598 than the temperature detection element 518 and the flow rate detection unit 602. By arranging in this way, the resin flows smoothly in the first resin molding step. In the first resin molding step, a thermosetting resin is used, and it is important to spread the resin throughout before curing. For this reason, the relationship between the arrangement of circuit components and wiring in the lead 514 and the press-fitting hole 598 and the press-fitting direction is very important.

FIG. 10 is a diagram showing an example in which a first mold resin is filled in a mold in the first resin molding step.
The circuit package 400 is separated from the main body 404 where the circuit components are arranged, the first package protrusion 401 protruding from the main body 404 and the temperature detecting element 518 being arranged, and the first package protrusion 401. It has a second package protrusion 402 that protrudes from the main body 404 and on which the flow rate detector 602 is disposed. The main body 404 is provided with a filling inlet 405 serving as an inlet when the mold resin is filled into the mold cavity. The filling inlet 405 is disposed at a position facing the first package protrusion 401 and the second package protrusion 402 with the circuit components therebetween.

  The main body portion 404 has a substantially rectangular flat plate shape in plan view, and is disposed on the upstream side portion (first side portion) having the first package projecting portion 401 and one end side of the upstream side portion. A tip side portion (second side portion) having the package protruding portion 402, a downstream side portion (third side portion) disposed on one end side of the tip side portion and facing the upstream side portion, and one end of the downstream side portion And a base end side portion (fourth side portion) which is disposed between the side and the other end side of the upstream side portion and faces the tip end side portion and from which the lead protrudes.

  The main body portion 404 has a convex portion 403A protruding from the downstream side portion at the corner portion 403 between the downstream side portion and the base end side portion, and the filling inlet portion 405 is disposed on the convex portion 403A. Has been.

  The cavity of the mold for molding the circuit package 400 is provided with a press-fitting hole 598 at a position corresponding to the filling inlet 405 of the corner 403 of the circuit package 400, and an inlet gate 599A is connected thereto. The inlet gate 599A is a branch passage for supplying mold resin into the cavity from the resin filling passage 597, and extends on a diagonal extension passing through the corner portion 403 of the main body 404 and continues to the press-fitting hole 598. .

  The resin filling passage 597 extends in parallel to the downstream side portion along the Y-axis direction connecting the base end side portion and the tip end side portion of the circuit package 400 at a spaced position on the same plane as the circuit package 400. Is provided. The inlet gate 599A branches at a midpoint of the resin filling passage 597, extends obliquely with respect to the Y-axis direction along the diagonal line of the circuit package 400, and is connected to the press-fitting hole 598.

  A resin outlet portion from which excess mold resin flows out from the cavity is located at a position corresponding to the tip of the first package protrusion 401 of the circuit package 400 and a position corresponding to the tip of the second package protrusion 402. 509A and 510A are provided and connected to overflow areas 509 and 510, respectively.

  In the circuit package 400, a filling inlet 405 is provided at a convex portion 403A protruding from the corner 403 of the main body 404 and on the downstream side. The circuit package 400 passes through the corner 403 of the main body 404 and extends a diagonal line. It is formed by filling a mold resin into a cavity from a press-fitting hole 598 forming a filling inlet portion 405 via an inlet gate 599A extending on a line.

  Since the entrance gate 599A is connected obliquely with respect to the Y-axis direction of the main body 404, when the mold resin is filled into the cavity from the entrance gate 599A, the entrance gate 599A can flow along the diagonal line of the circuit package 400. The resin can flow smoothly to the first package protrusion 401 and the second package protrusion 402 that are arranged opposite to each other on the diagonal line from the corner 403, and before the resin is cured. The mold resin can be spread over the entire cavity.

  Since circuit parts such as the processing part 604 and the chip part 516 are arranged between the corner part 403 and the first package protrusion part 401 and the second package protrusion part 402, from the entrance gate 599A. The mold resin injected at high temperature and high pressure into the cavity spreads in the cavity so as to abut circuit components and bypass them. Accordingly, it is possible to prevent the high temperature / high pressure mold resin from directly colliding with the flow rate detection unit 602 and the temperature detection element 518, and to suppress thermal damage to the flow rate detection unit 602 and the temperature detection element 518 due to the mold resin.

In addition, the flow rate detection unit 602 has molds on both sides of the heat transfer surface exposed portion 436 and the measurement channel surface back surface 431 which is the back surface thereof in order to prevent the heat transfer surface exposed portion 436 from being covered with the mold resin. Since the heat transfer surface exposed portion 436 is held and the inflow of resin to the heat transfer surface exposed portion 436 is prevented, the mold resin directly collides with the contact portion of the mold. By avoiding this, it is possible to prevent the resin from flowing into the heat transfer surface exposed portion 436 without increasing the holding force held by the mold, and the resin leakage into the heat transfer surface exposed portion 436 (resin fogging) ) Can be prevented.
The circuit package 400 after the resin is cured is used by cutting the resin in the resin filling passage 597 and the entrance gate 599A. The resin surface state of the circuit package 400 at the cut location is rougher than the other peripheral surface states, and it is easy to specify the position of the entrance gate after cutting.

FIG. 11 is a view showing another embodiment in which the first molding resin is injected into the mold in the first resin molding step.
In this embodiment, the circuit package 400 is formed by filling the mold resin into the cavity via the inlet gate 599B, which is provided with a filling inlet 405 at the corner 403 of the main body 404 and at the base end. It has the structure which was made. The entrance gate 599B branches at a midpoint of the resin filling passage 597, extends in the same direction as the downstream side along the Y-axis direction of the main body 404, and is provided at the corner 403 and at the base end side. The press-fitting hole 598 is connected. The lead 514 protruding from the base end side portion of the main body portion 404 has a bent shape so as to be displaced toward the upstream side portion by the amount provided with the entrance gate 599B.

  Since the entrance gate 599B extends along the Y-axis direction of the main body 404, when the mold resin is filled into the cavity from the entrance gate 599B, the entrance gate 599B can be caused to flow so as to expand on a diagonal line of the circuit package 400. The resin can flow smoothly to the first package protrusion 401 and the second package protrusion 402 that are arranged opposite to each other on the diagonal line from the corner 403, and before the resin is cured. The mold resin can be spread over the entire cavity.

  As in the above-described embodiment, the high temperature and high pressure mold resin is prevented from directly colliding with the flow rate detection unit 602 and the temperature detection element 518, and thermal damage to the flow rate detection unit 602 and the temperature detection element 518 due to the mold resin. In addition, it is possible to prevent the resin from flowing into the heat transfer surface exposed portion 436 without increasing the holding force held by the mold, and to prevent the resin leakage to the heat transfer surface exposed portion 436. Can be prevented.

  In this embodiment, since the entrance gate 599B extends in parallel with the resin filling passage 597, it is not necessary to provide the convex portion 403A at the corner portion 403 of the circuit package 400 as compared with the embodiment shown in FIG. . Therefore, the outer shape of the circuit package 400 can be made a simpler shape, and the position of the resin filling passage 597 can be made closer to the circuit package 400 by the omitted portion d1 of the convex portion 403A. The lead frame 511 can be reduced in size.

FIG. 12 is a view showing another embodiment in which the first molding resin is injected into the mold in the first resin molding step.
In this embodiment, the circuit package 400 is formed by filling the mold resin into the cavity via the inlet gate 599C, which is provided with a filling inlet 405 at the corner 403 of the main body 404 and at the downstream side. It has a configuration. The inlet gate 599C branches near the tip of the resin filling passage 597, extends in the same direction as the base side along the X-axis direction of the main body 404, and is provided at the corner 403 and on the downstream side. The press-fitting hole 598 is connected.

  Since the entrance gate 599C extends along the X-axis direction of the main body portion 404, when the cavity is filled with mold resin from the entrance gate 599C, the entrance gate 599C can be caused to flow so as to expand on a diagonal line of the circuit package 400. The resin can flow smoothly to the first package protrusion 401 and the second package protrusion 402 that are arranged opposite to each other on the diagonal line from the corner 403, and before the resin is cured. The mold resin can be spread over the entire cavity.

  As in the above-described embodiment, the high temperature and high pressure mold resin is prevented from directly colliding with the flow rate detection unit 602 and the temperature detection element 518, and thermal damage to the flow rate detection unit 602 and the temperature detection element 518 due to the mold resin. In addition, it is possible to prevent the resin from flowing into the heat transfer surface exposed portion 436 without increasing the holding force held by the mold, and to prevent the resin leakage to the heat transfer surface exposed portion 436. Can be prevented.

  In this embodiment, since the entrance gate 599C extends in a direction orthogonal to the resin filling passage 597, it is necessary to provide a convex portion 403A at the corner portion 403 of the circuit package 400 as compared with the embodiment shown in FIG. In addition, it is not necessary to change the shape of the lead 514 as compared with the embodiment shown in FIG. Accordingly, the shape of the circuit package 400 and the lead 514 can be made simpler, and the position of the resin filling passage 597 can be brought closer to the circuit package 400 by the omission d1 of the convex portion 403A. The mold and the lead frame 511 can be reduced in size.

5.2 Structure for Connecting the Gap and Opening on the Back of the Diaphragm FIG. 13 is a view showing a part of the CC cross section of FIG. 9 and is provided inside the diaphragm 672 and the flow rate detection unit (flow rate detection element) 602. It is explanatory drawing explaining the communicating hole 676 which connects the gap | interval 674 and the hole 520. FIG.

  As will be described later, a diaphragm 672 is provided in the flow rate detection unit 602 that measures the flow rate of the gas 30 to be measured, and a gap 674 is provided on the back surface of the diaphragm 672. Although not shown in the drawing, the diaphragm 672 is provided with an element for exchanging heat with the measurement target gas 30 and thereby measuring the flow rate. If heat is transmitted between the elements via the diaphragm 672 separately from the exchange of heat with the gas to be measured 30 between the elements formed in the diaphragm 672, it is difficult to accurately measure the flow rate. For this reason, the diaphragm 672 needs to increase the thermal resistance, and the diaphragm 672 is made as thin as possible.

  The flow rate detection unit (flow rate detection element) 602 is embedded and fixed in the first resin of the circuit package 400 formed by the first resin molding process so that the heat transfer surface 672 of the diaphragm 672 is exposed. The surface of the diaphragm 672 is provided with the above-described elements (the heating element 608 shown in FIG. 17, the resistor 652 that is the upstream resistance temperature detector, the resistor 654 and the resistor 656 that is the downstream resistance temperature detector, the resistor 658, etc.). . The element transmits heat to the measurement target gas 30 (not shown) through the heat transfer surface 437 on the element surface in the heat transfer surface exposed portion 436 corresponding to the diaphragm 672. The heat transfer surface 437 may be constituted by the surface of each element, or a thin protective film may be provided thereon. It is desirable that the heat transfer between the element and the measurement target gas 30 is performed smoothly, while the direct heat transfer between the elements is as small as possible.

  The portion of the flow rate detection unit (flow rate detection element) 602 where the element is provided is disposed in the heat transfer surface exposed portion 436 of the measurement flow channel surface 430, and the heat transfer surface 437 forms the measurement flow channel surface 430. Exposed from the resin. The outer peripheral portion of the flow rate detection unit 602 is covered with the thermosetting resin used in the first resin molding process for forming the measurement flow path surface 430. If only the side surface of the flow rate detection unit 602 is covered with the thermosetting resin, and the surface side of the outer peripheral portion of the flow rate detection unit 602 (that is, the region around the diaphragm 672) is not covered with the thermosetting resin, The stress generated in the resin forming the measurement flow path surface 430 is received only by the side surface of the flow rate detection unit 602, and the diaphragm 672 may be distorted to deteriorate the characteristics. As shown in FIG. 13, the distortion of the diaphragm 672 is reduced by setting the front outer peripheral portion of the flow rate detection unit 602 to be covered with the thermosetting resin. On the other hand, if the level difference between the heat transfer surface 437 and the measurement flow path surface 430 through which the measurement target gas 30 flows is large, the flow of the measurement target gas 30 is disturbed, and the measurement accuracy decreases. Therefore, it is desirable that the step W between the heat transfer surface 437 and the measurement flow path surface 430 through which the measurement target gas 30 flows is small.

  The diaphragm 672 is made extremely thin in order to suppress heat transfer between the elements, and the thickness is reduced by forming a gap 674 on the back surface of the flow rate detection unit 602. When the gap 674 is sealed, the pressure of the gap 674 formed on the back surface of the diaphragm 672 changes based on the temperature due to a temperature change. When the pressure difference between the gap 674 and the surface of the diaphragm 672 becomes large, the diaphragm 672 receives a pressure to cause distortion, and high-precision measurement becomes difficult. For this reason, the plate 532 is provided with a hole 520 that is connected to the opening 438 that opens to the outside, and a communication hole 676 that connects the hole 520 and the gap 674. The communication hole 676 is made of two plates, for example, a first plate 532 and a second plate 536. The first plate 532 is provided with a hole 520 and a hole 521, and further a groove for forming a communication hole 676. The communication hole 676 is formed by closing the groove and the hole 520 and the hole 521 with the second plate 536. By the communication hole 676 and the hole 520, the air pressure acting on the front surface and the back surface of the diaphragm 672 becomes substantially equal, and the measurement accuracy is improved.

  As described above, the communication hole 676 can be formed by closing the groove and the hole 520 and the hole 521 with the second plate 536. Alternatively, the lead frame can be used as the second plate 536. As illustrated in FIG. 16, an LSI that operates as a diaphragm 672 and a processing unit 604 is provided on the plate 532. A lead frame for supporting a plate 532 on which the diaphragm 672 and the processing unit 604 are mounted is provided below these. Therefore, the structure becomes simpler by using this lead frame. The lead frame can be used as a ground electrode. In this way, the lead frame has the role of the second plate 536, and the lead frame is used to close the hole 520 and the hole 521 formed in the first plate 532 and to form the groove formed in the first plate 532. By forming the communication hole 676 by covering the lead frame so as to cover the lead frame, the entire structure is simplified, and the lead frame acts as a ground electrode, so that the diaphragm 672 and the processing unit 604 are externally connected. The influence of noise can be reduced.

  In the circuit package 400, the pressing trace 442 remains on the back surface of the circuit package 400 where the heat transfer surface exposed portion 436 is formed. In the first resin molding step, in order to prevent the resin from flowing into the heat transfer surface exposed portion 436, a mold, for example, a insert piece is applied to the heat transfer surface exposed portion 436, and the pressing trace 442 on the opposite surface is further formed. A mold is applied to the portion, and both molds prevent the resin from flowing into the heat transfer surface exposed portion 436. By forming the heat transfer surface exposed portion 436 in this manner, the flow rate of the measurement target gas 30 can be measured with extremely high accuracy.

  FIG. 14 shows a state in which the lead frame shown in FIG. 9 is molded with a thermosetting resin and covered with the thermosetting resin in the first resin molding step. By this molding, the measurement flow path surface 430 is formed on the surface of the circuit package 400, and the heat transfer surface exposed portion 436 is provided on the measurement flow path surface 430. Further, a gap 674 on the back surface of the diaphragm 672 corresponding to the heat transfer surface exposed portion 436 is configured to be connected to the opening 438. A temperature detection unit 452 for measuring the temperature of the measurement target gas 30 is provided at the tip of the protrusion 424, and a temperature detection element 518 is incorporated therein. Inside the protruding portion 424, in order to suppress heat transfer, a lead for taking out an electric signal of the temperature detection element 518 is divided, and a connection line 546 having a large thermal resistance is disposed. Thereby, the heat transfer from the base of the protrusion part 424 to the temperature detection part 452 is suppressed, and the influence by heat is suppressed.

  Further, an inclined portion 594 and an inclined portion 596 are formed at the base of the protruding portion 424. While the flow of the resin in the first resin molding step is smooth, the measurement target gas 30 measured by the temperature detection unit 452 is measured by the inclined portion 594 and the inclined portion 596 in a state where the resin is mounted on the vehicle and operating. The projection flows smoothly from the protrusion 424 toward the root, and the root of the protrusion 424 is cooled, so that the effect of heat on the temperature detection unit 452 can be reduced. After the state shown in FIG. 14, the lead 514 is disconnected for each terminal to become the connection terminal 412 and the terminal 414.

  In the first resin molding step, it is necessary to prevent the resin from flowing into the heat transfer surface exposed portion 436 and the opening 438. For this reason, in the first resin molding step, the resin flow is blocked at the position of the heat transfer surface exposed portion 436 and the opening 438, for example, a piece larger than the diaphragm 672 is applied, and the back surface is pressed and sandwiched from both sides. . As shown in FIG. 8C, the heat transfer surface exposed portion 436 and the opening 438 in FIG. 14 or the back surface corresponding to the heat transfer surface exposed portion 436 and the opening 438 in FIG. A trace 441 remains.

  In FIG. 14, the cut surface of the lead cut from the support frame 512 of the lead frame 511 is exposed from the resin surface, so that moisture or the like may enter from the cut surface of the lead during use. It is important to prevent this from the viewpoint of improving durability and improving reliability. For example, the lead cutting portions of the inclined portion 594 and the inclined portion 596 are covered with resin in the second resin molding step, and the cutting surfaces of the leads 552 and the leads 554 shown in FIG. 9 and the support frame 512 are covered with the resin. This prevents corrosion of the cut surfaces of the lead 552 and the lead 554 and intrusion of water from the cut portion. The cut surfaces of the lead 552 and the lead 554 are close to an important lead portion that transmits an electrical signal of the temperature detection unit 452. Therefore, it is desirable to cover the cut surface with the second resin molding process.

6. Production Process of Thermal Flow Meter 300 6.1 Production Process of Circuit Package 400 FIGS. 15A and 15B show the production process of thermal flow meter 300, FIG. 15A shows the production process of circuit package 400, and FIG. Indicates the production process of the thermal flow meter. In FIG. 15A, Step 1 shows a process of producing the lead frame shown in FIG. This lead frame is made by, for example, press working.

  In step 2, the plate 532 is first mounted on the lead frame produced in step 1, and the flow rate detection unit 602 and the processing unit 604 are further mounted on the plate 532, and circuit components such as a temperature detection element 518 and a chip capacitor are further mounted. Mount. In step 2, electrical wiring is performed between circuit components, between circuit components and leads, and between leads. In step 2, the lead 544 and the lead 548 are connected by a connection line 546 for increasing the thermal resistance. In step 2, the circuit component shown in FIG. 9 is mounted on the lead frame 511, and an electric circuit is further formed in which electrical connection is made.

  Next, in step 3, it is molded with a thermosetting resin by a first resin molding process. This state is shown in FIG. In step 3, the connected leads are separated from the support frame 512 of the lead frame 511, and the leads are also separated, thereby completing the circuit package 400 shown in FIG. In the circuit package 400, as shown in FIG. 8, a measurement flow path surface 430 and a heat transfer surface exposed portion 436 are formed.

  In step 4, the appearance inspection and operation inspection of the completed circuit package 400 are performed. In the first resin molding process of Step 3, the electric circuit made in Step 2 is fixed in the mold, and high temperature resin is injected into the mold at a high pressure. It is desirable to check for this. For this inspection, a terminal 414 is used in addition to the connection terminal 412 shown in FIG. Since the terminal 414 is not used thereafter, the terminal 414 may be cut from the root after this inspection.

6.2 Production Process of Thermal Flow Meter 300 and Correction of Characteristics In the process shown in FIG. 15B, the circuit package 400 and the external terminal 306 produced according to FIG. 15A are used. 302 is created. The housing 302 is formed with a resin-made sub-passage groove, a flange 312 and an external connection portion 305, and the hatched portion of the circuit package 400 shown in FIG. 8 is covered with the resin in the second resin molding process. 302 is fixed. The combination of the production of the circuit package 400 by the first resin molding process (step 3) and the molding of the housing 302 of the thermal flow meter 300 by the second resin molding process significantly improves the flow rate detection accuracy. In step 6, each internal terminal inner end 361 is disconnected, and connection terminal 412 and external terminal inner end 361 are connected in step 7.

  When the housing 302 is completed in step 7, next, in step 8, the front cover 303 and the back cover 304 are attached to the housing 302, the inside of the housing 302 is sealed with the front cover 303 and the back cover 304, and the measured gas 30 A sub-passage for the flow is completed. Further, the diaphragm structure described with reference to FIG. 7 is formed by the protrusions 356 provided on the front cover 303 or the back cover 304. The front cover 303 is made by molding in step 10, and the back cover 304 is made by molding in step 11. Further, the front cover 303 and the back cover 304 are made in different processes, and are made by molding with different molds.

  In step 9, the gas is actually introduced into the sub-passage and the characteristics are tested. As described above, since the relationship between the sub passage and the flow rate detection unit is maintained with high accuracy, very high measurement accuracy can be obtained by performing characteristic correction by a characteristic test. In addition, since the positioning and shape-related molding that affects the relationship between the sub-passage and the flow rate detection unit are performed in the first resin molding process and the second resin molding process, there is little change in characteristics even with long-term use, and high accuracy. In addition, high reliability is ensured.

7. Circuit Configuration of Thermal Flow Meter 300 7.1 Overall Circuit Configuration of Thermal Flow Meter 300 FIG. 16 is a circuit diagram showing a flow rate detection circuit 601 of the thermal flow meter 300. Note that a measurement circuit related to the temperature detection unit 452 described in the embodiment is also provided in the thermal flow meter 300, but is omitted in FIG. The flow rate detection circuit 601 of the thermal type flow meter 300 includes a flow rate detection unit 602 having a heating element 608 and a processing unit 604. The processing unit 604 controls the amount of heat generated by the heating element 608 of the flow rate detection unit 602 and outputs a signal indicating the flow rate based on the output of the flow rate detection unit 602 via the terminal 662. In order to perform the processing, the processing unit 604 includes a central processing unit (hereinafter referred to as a CPU) 612, an input circuit 614, an output circuit 616, a memory 618 that holds data representing a relationship between a correction value, a measured value, and a flow rate, A power supply circuit 622 is provided to supply a constant voltage to each necessary circuit. The power supply circuit 622 is supplied with DC power from an external power source such as an in-vehicle battery via a terminal 664 and a ground terminal (not shown).

  The flow rate detector 602 is provided with a heating element 608 for heating the measurement target gas 30. The voltage V1 is supplied from the power supply circuit 622 to the collector of the transistor 606 constituting the current supply circuit of the heating element 608, and a control signal is applied from the CPU 612 to the base of the transistor 606 via the output circuit 616. Accordingly, a current is supplied from the transistor 606 to the heating element 608 through the terminal 624. The amount of current supplied to the heating element 608 is controlled by a control signal applied from the CPU 612 to the transistor 606 constituting the current supply circuit of the heating element 608 via the output circuit 616. The processing unit 604 controls the amount of heat generated by the heating element 608 so that the temperature of the measurement target gas 30 is higher than the initial temperature by a predetermined temperature, for example, 100 ° C., when heated by the heating element 608.

  The flow rate detection unit 602 includes a heat generation control bridge 640 for controlling the amount of heat generated by the heating element 608 and a flow rate detection bridge 650 for measuring the flow rate. One end of the heat generation control bridge 640 is supplied with a constant voltage V3 from the power supply circuit 622 via a terminal 626, and the other end of the heat generation control bridge 640 is connected to the ground terminal 630. A constant voltage V2 is supplied from one end of the flow rate detection bridge 650 from the power supply circuit 622 via a terminal 625, and the other end of the flow rate detection bridge 650 is connected to the ground terminal 630.

  The heat generation control bridge 640 includes a resistor 642 that is a resistance temperature detector whose resistance value changes based on the temperature of the heated measurement target gas 30. The resistor 642, the resistor 644, the resistor 646, and the resistor 648 are bridges. The circuit is configured. The potential difference between the intersection A of the resistor 642 and the resistor 646 and the potential B at the intersection B of the resistor 644 and 648 is input to the input circuit 614 via the terminal 627 and the terminal 628, and the CPU 612 has a predetermined potential difference between the intersection A and the intersection B. In this embodiment, the amount of heat generated by the heating element 608 is controlled by controlling the current supplied from the transistor 606 so as to be zero volts. The flow rate detection circuit 601 illustrated in FIG. 16 heats the measurement gas 30 with the heating element 608 so as to be higher than the original temperature of the measurement gas 30 by a constant temperature, for example, 100 ° C. at all times. In order to perform this heating control with high accuracy, the intersection point A and the intersection point A when the temperature of the gas 30 to be measured heated by the heating element 608 becomes a constant temperature, for example, 100 ° C., always higher than the initial temperature. The resistance value of each resistor constituting the heat generation control bridge 640 is set so that the potential difference between B becomes zero volts. Therefore, in the flow rate detection circuit 601 shown in FIG. 16, the CPU 612 controls the current supplied to the heating element 608 so that the potential difference between the intersection A and the intersection B becomes zero volts.

  The flow rate detection bridge 650 includes four resistance temperature detectors, a resistor 652, a resistor 654, a resistor 656, and a resistor 658. These four resistance temperature detectors are arranged along the flow of the gas to be measured 30, and the resistor 652 and the resistor 654 are arranged upstream of the heating element 608 in the flow path of the gas to be measured 30, and the resistor 656. And the resistor 658 are arranged on the downstream side in the flow path of the measurement target gas 30 with respect to the heating element 608. In order to increase the measurement accuracy, the resistor 652 and the resistor 654 are arranged so that the distance to the heating element 608 is substantially the same, and the resistor 656 and the resistor 658 are substantially the same distance to the heating element 608. Has been placed.

  A potential difference between an intersection C of the resistor 652 and the resistor 656 and an intersection D of the resistor 654 and the resistor 658 is input to the input circuit 614 through the terminal 631 and the terminal 632. In order to improve the measurement accuracy, for example, each resistance of the flow rate detection bridge 650 is set so that the potential difference between the intersection C and the intersection D becomes zero when the flow of the measurement target gas 30 is zero. Therefore, when the potential difference between the intersection point C and the intersection point D is, for example, zero volts, the CPU 612 generates an electric signal indicating that the flow rate of the main passage 124 is zero based on the measurement result that the flow rate of the measurement target gas 30 is zero. Output from the terminal 662.

  When the gas to be measured 30 flows in the direction of the arrow in FIG. 16, the resistor 652 and the resistor 654 arranged on the upstream side are cooled by the gas to be measured 30 and arranged downstream of the gas to be measured 30. The resistors 656 and 658 are heated by the measurement target gas 30 heated by the heating element 608, and the temperatures of the resistors 656 and 658 are increased. Therefore, a potential difference is generated between the intersection C and the intersection D of the flow rate detection bridge 650, and this potential difference is input to the input circuit 614 via the terminal 631 and the terminal 632. The CPU 612 retrieves data representing the relationship between the potential difference stored in the memory 618 and the flow rate of the main passage 124 based on the potential difference between the intersection C and the intersection D of the flow rate detection bridge 650, and Find the flow rate. An electrical signal representing the flow rate of the main passage 124 obtained in this way is output via the terminal 662. Note that the terminal 664 and the terminal 662 illustrated in FIG. 16 are newly described with reference numerals, but are included in the connection terminal 412 illustrated in FIGS. 5 and 6 described above.

  The memory 618 stores data representing the relationship between the potential difference between the intersection C and the intersection D and the flow rate of the main passage 124, and is obtained based on the actual measured value of gas after the circuit package 400 is produced. In addition, correction data for reducing measurement errors such as variations is stored. Note that the actual measurement of the gas after production of the circuit package 400 and the writing of the correction value based on it into the memory 618 are performed using the external terminal 306 and the correction terminal 307 shown in FIG. In the present embodiment, the arrangement relationship between the sub-passage through which the measurement target gas 30 flows and the measurement flow path surface 430 and the arrangement relationship between the sub-passage through which the measurement target gas 30 flows and the heat transfer surface exposed portion 436 are highly accurate. Since the circuit package 400 is produced in a state where there is little variation, the measurement result with extremely high accuracy can be obtained by the correction using the correction value.

7.2 Configuration of Flow Rate Detection Circuit 601 FIG. 17 is a circuit configuration diagram showing a circuit arrangement of the flow rate detection circuit 601 of FIG. 16 described above. The flow rate detection circuit 601 is made as a rectangular semiconductor chip, and the measured gas 30 flows in the direction of the arrow from the left side to the right side of the flow rate detection circuit 601 shown in FIG.

  A rectangular diaphragm 672 in which the thickness of the semiconductor chip is reduced is formed in the flow rate detection unit (flow rate detection element) 602 formed of a semiconductor chip. The diaphragm 672 includes a thin region (that is, the above-described thin area). Heat transfer surface) 603 is provided. The above-described gap is formed on the back surface side of the thin region 603, the gap communicates with the opening 438 shown in FIGS. 8 and 5, and the pressure in the gap depends on the pressure introduced from the opening 438. .

  By reducing the thickness of the diaphragm 672, the thermal conductivity is lowered, and the diaphragm 672 to the resistor 652, the resistor 654, the resistor 658, and the resistor 656 provided in the thin region (heat transfer surface) 603 of the diaphragm 672 is reduced. The heat transfer through is suppressed, and the temperature of these resistors is substantially determined by the heat transfer with the gas 30 to be measured.

  A heating element 608 is provided at the center of the thin region 603 of the diaphragm 672, and a resistor 642 constituting the heating control bridge 640 is provided around the heating element 608. Resistors 644, 646, and 648 constituting the heat generation control bridge 640 are provided outside the thin region 603. The resistors 642, 644, 646, and 648 formed in this way constitute a heat generation control bridge 640.

  In addition, a resistor 652 and a resistor 654 which are upstream temperature measuring resistors and a resistor 656 and a resistor 658 which are downstream temperature measuring resistors are arranged so as to sandwich the heating element 608, and the gas to be measured is placed on the heating element 608. An upstream resistance temperature detector 652 and a resistance 654 are arranged on the upstream side in the direction of the arrow through which 30 flows, and a downstream resistance temperature detector on the downstream side in the direction of the arrow in which the measured gas 30 flows with respect to the heating element 608. A certain resistor 656 and resistor 658 are arranged. In this manner, the flow rate detection bridge 650 is formed by the resistor 652, the resistor 654, the resistor 656, and the resistor 658 arranged in the thin region 603.

  Further, both end portions of the heating element 608 are connected to terminals 624 and 629 described at the lower side of FIG. Here, as shown in FIG. 16, a current supplied from the transistor 606 to the heating element 608 is applied to the terminal 624, and the terminal 629 is grounded.

  The resistor 642, the resistor 644, the resistor 646, and the resistor 648 that constitute the heat generation control bridge 640 are connected to the terminals 626 and 630, respectively. As shown in FIG. 16, a constant voltage V3 is supplied to the terminal 626 from the power supply circuit 622, and the terminal 630 is grounded as a ground. A connection point between the resistor 642 and the resistor 646 and between the resistor 646 and the resistor 648 is connected to a terminal 627 and a terminal 628. As illustrated in FIG. 17, the terminal 627 outputs the potential at the intersection A between the resistor 642 and the resistor 646, and the terminal 627 outputs the potential at the intersection B between the resistor 644 and the resistor 648. As shown in FIG. 16, a constant voltage V2 is supplied to the terminal 625 from the power supply circuit 622, and the terminal 630 is grounded as a ground terminal. The connection point between the resistor 654 and the resistor 658 is connected to the terminal 631, and the terminal 631 outputs the potential at the point B in FIG. A connection point between the resistor 652 and the resistor 656 is connected to a terminal 632, and the terminal 632 outputs a potential at the intersection C shown in FIG.

  As shown in FIG. 17, the resistor 642 constituting the heat generation control bridge 640 is formed in the vicinity of the heating element 608, so that the temperature of the gas warmed by the heat generated from the heating element 608 can be accurately measured. it can. On the other hand, the resistors 644, 646, and 648 constituting the heat generation control bridge 640 are arranged away from the heat generating body 608, and thus are configured not to be affected by heat generated from the heat generating body 608. The resistor 642 is configured to react sensitively to the temperature of the gas heated by the heating element 608, and the resistor 644, the resistance 646, and the resistance 648 are configured not to be affected by the heating element 608. For this reason, the detection accuracy of the measurement target gas 30 by the heat generation control bridge 640 is high, and the control for increasing the measurement target gas 30 by a predetermined temperature with respect to the initial temperature can be performed with high accuracy.

  In this embodiment, an air gap is formed on the back surface side of the diaphragm 672, and this air space communicates with the opening 438 shown in FIGS. 8 and 5. The pressure on the back surface side air gap of the diaphragm 672 and the front side of the diaphragm 672 The difference from the pressure is not increased. Distortion of the diaphragm 672 due to this pressure difference can be suppressed. This leads to an improvement in flow rate measurement accuracy.

  As described above, the diaphragm 672 is formed with the thin region 603, and the thickness of the portion including the thin region 603 is very thin, and heat conduction through the diaphragm 672 is suppressed as much as possible. Therefore, the flow rate detection bridge 650 and the heat generation control bridge 640 are less affected by heat conduction through the diaphragm 672, and the tendency to operate depending on the temperature of the measurement target gas 30 is further increased, and the measurement operation is improved. For this reason, high measurement accuracy is obtained.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various designs can be made without departing from the spirit of the present invention described in the claims. It can be changed. For example, the above-described embodiment has been described in detail for easy understanding of the present invention, and is not necessarily limited to one having all the configurations described. Further, a part of the configuration of an embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of an embodiment. Furthermore, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

  The present invention can be applied to the above-described measuring device for measuring the gas flow rate.

DESCRIPTION OF SYMBOLS 300 ... Thermal flow meter 302 ... Housing 303 ... Front cover 304 ... Back cover 305 ... External connection part 306 ... External terminal 307 ... Correction terminal 310 ... Measurement part 320 ... Terminal connection part 332 ... Front side auxiliary passage groove 334 ... Back side auxiliary Passage groove 356 ... Projection 359 ... Resin 361 ... External terminal inner end 372 ... Fixed part 400 ... Circuit package 401 ... First package protrusion 402 ... Second package protrusion 403 ... Corner 403A ... Projection 404 ... Main body 405 ... Filling inlet 412 ... Connection terminal 414 ... Terminal 424 ... Projection 430 ... Measurement flow path surface 432 ... Fixed surface 436 ... Heat transfer surface exposed part 438 ... Opening 452 ... Temperature detection part 511 ... Lead frame 516 ... Chip Parts (circuit parts)
518 ... Temperature detecting element 597 ... Resin filling passage 598 ... Press-fit hole 599A, 599B, 599C ... Inlet gate 594 ... Inclined portion 596 ... Inclined portion 601 ... Flow rate detecting circuit 602 ... Flow rate detecting portion 604 ... Processing portion (circuit parts)
608 ... Heating element 640 ... Heat generation control bridge 650 ... Flow rate detection bridge 672 ... Diaphragm

Claims (6)

A thermal flow meter having a circuit package formed by mounting a temperature detection element, a flow rate detection element, and a circuit component on a lead and placing the lead in a mold and filling the mold with mold resin. And
The circuit package includes a main body portion on which the circuit component is disposed, a first package protrusion portion that protrudes from the main body portion and on which the temperature detection element is disposed, and is spaced apart from the first package protrusion portion. A second package projecting portion that projects from the main body portion and the flow rate detecting portion is disposed, and a filling inlet portion that fills the mold with the mold resin is provided in the main body portion, A thermal flow meter, wherein a filling inlet portion is arranged at a position facing the first package protrusion and the second package protrusion with the circuit component interposed therebetween. The main body includes a first side having the first package protrusion, a second side having the second package protrusion disposed on one end side of the first side, and the second side. A third side portion disposed on one end side of the side portion and facing the first side portion; and disposed between one end side of the third side portion and the other end side of the first side portion. A fourth side part facing the two side parts and projecting the lead,
2. The thermal flow meter according to claim 1, wherein the filling inlet portion is disposed at a corner portion between the third side portion and the fourth side portion.   In the circuit package, the filling inlet portion is provided at a convex portion protruding from the corner portion of the main body portion and the third side portion, and an extension of a diagonal line passing through the corner portion of the main body portion. The mold resin is formed by filling the mold resin through an inlet gate of the mold that extends on a line and continues to the filling inlet portion. 2. The thermal flow meter according to 2.   The circuit package is provided with the filling inlet portion at the corner portion of the main body portion and at the fourth side portion, and extends in the same direction as the third side portion and is continuous with the filling inlet portion. The thermal flowmeter according to claim 2, wherein the mold is filled with the mold resin through an entrance gate of the mold.   The circuit package is provided with the filling inlet portion at the corner portion of the main body portion and at the third side portion, and extends in the same direction as the fourth side portion and continues to the filling inlet portion. The thermal flowmeter according to claim 2, wherein the mold is filled with the mold resin through an entrance gate of the mold.   The circuit package has a configuration in which a resin outlet portion from which excess of the mold resin flows is arranged at a tip position of the first package protrusion and a tip position of the second package protrusion. The thermal type flow meter according to any one of claims 1 to 5.

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