JP2013258137A - Low-voltage plasma generating electrode - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plasma generating electrode with a flexible electrode structure which increases the efficiency of contact between plasma active species and an object to be processed and thereby increases the processing efficiency of the object to be processed.SOLUTION: An electrode 10 for generating plasma at low voltage comprises: a flexible substrate 11; a first electrode 12 provided on one face of the substrate; and a second electrode 13 laminated on the one face or the opposite face of the substrate. A surface protective layer 14 is overlaid to cover and not to expose the first electrode. Accordingly, the plasma can be generated along the substrate from the first electrode.

Description

  The present invention relates to a low voltage plasma generating electrode used for sterilization of an object to be processed.

Plasma is used for sterilization of, for example, air. As such a plasma generating electrode, there are the following patent documents.
Patent Document 1 describes that plasma is generated at atmospheric pressure, a sterilization factor generated by the plasma is supplied from the plasma generator into the chamber, and the sheet to be processed is sterilized by being conveyed by a conveyance roll. ing. Patent Document 2 describes that a sheet is conveyed between a pair of discharge electrodes, and plasma is generated at atmospheric pressure to perform plasma processing on the sheet. Patent Document 3 discloses a plasma discharge electrode having a porous portion. Patent Document 4 describes a plasma generating electrode in which a plurality of slit-like gas supply holes are provided in a disk-like electrode, and a swirling flow is generated by jetting gas from the gas supply hole. Patent Document 5 describes that an induction electrode is provided inside a ceramic dielectric, a discharge electrode is provided on the surface of the dielectric, and creeping discharge is generated at the peripheral portion of the discharge electrode to generate positive ions and negative ions. Has been.

Japanese Patent Laid-Open No. 10-129627 JP-A-6-265864 JP 2003-334436 A Japanese Patent No. 3154058 Japanese Patent No. 3403723

However, the plasma generating electrodes described in Patent Documents 1 to 5 are fixed electrode structures that generate plasma at a high voltage, and are not flexible electrode types that generate plasma at a low voltage. For example, it is not suitable for sterilizing the surface of an object to be processed such as one having a curved surface. Then, if it is forced to bend into a shape corresponding to the shape of the object to be processed, the plasma electrode is cracked and damaged. In addition, there is a problem that it is difficult to process the shape corresponding to the shape of the object to be processed, and the conventional plasma electrode is difficult to use.
The present invention provides a flexible electrode structure in an apparatus for generating plasma at a low voltage to process an object to be processed, thereby improving the efficiency of contact with the plasma active species object to be processed. An object of the present invention is to provide a plasma generating electrode having a structure that improves the processing efficiency of an object.

(1) The present invention is an electrode for generating plasma at a low voltage,
A flexible substrate; a first electrode provided on one surface of the substrate; and a second electrode laminated on the same surface as the surface on the substrate or on the opposite surface.
A surface protective layer is provided on the first electrode so that the first electrode is not exposed, and plasma is generated along the substrate from the first electrode.
(2) The low-voltage plasma generating electrode of the present invention is the above (1),
The substrate is provided with a through-hole for supplying a plasma gas in a vertical direction, and plasma generated by creeping discharge generated along the substrate is drawn out from the first electrode.
(3) The electrode for generating low-voltage plasma of the present invention has a through hole formed around the first electrode in (1) or (2), and is generated at an edge portion of the first electrode. The plasma is drawn out in the vertical direction through the through hole.
(4) The low-voltage plasma generating electrode according to the present invention is characterized in that, in any one of the above (1) to (3), the first electrode has an island shape or a comb shape.
(5) The low-voltage plasma generating electrode of the present invention is characterized in that, in any one of the above (1) to (4), the first electrode has a cylindrical shape or a spiral shape.

According to the present invention, an electrode for generating low-voltage plasma is provided on a flexible substrate, creeping discharge is generated from the edge of the electrode along the substrate surface, and the gas is converted into plasma by the creeping discharge. Since it can do, plasma gas can be irradiated to a desired location according to the shape of a to-be-processed object.
As a result, the distance between the object to be processed and the active species of plasma generated on the substrate can be shortened, and the plasma processing efficiency can be increased.

1 is a cross-sectional view illustrating a configuration of a plasma generating electrode according to Example 1. FIG. It is the schematic of the electrode for plasma generation concerning Example 2, (a) is a top view, (b) is XX longitudinal cross-sectional view. It is the schematic of the electrode for plasma generation which concerns on Example 3, (a) is a top view, (b) is XX longitudinal cross-sectional view. 6 is a schematic cross-sectional view of a plasma generating electrode according to Example 4. FIG. It is the schematic of the electrode for plasma generation which concerns on Example 5, (a) is a top view, (b) is XX longitudinal cross-sectional view. It is the schematic of the electrode for plasma generation which concerns on Example 6, (a) is a top view, (b) is a longitudinal cross-sectional view. 9 is a schematic view of a plasma generating electrode according to Example 7. FIG. (A) is a top view, (b) is an AA longitudinal cross-sectional view. 10 is a schematic view of a plasma generating electrode according to Example 8. FIG. 10 is a schematic view of an electrode for plasma generation according to Example 9. FIG. (A) is a top view, (b) is an AA longitudinal cross-sectional view. FIG. 10 is a schematic view of a plasma generating electrode according to Example 10. (A) is a top view, (b) is an AA longitudinal cross-sectional view. 10 is a schematic view of an electrode for plasma generation according to Example 11. FIG. (A) is a top view, (b) is an AA longitudinal cross-sectional view. 14 is a schematic view of an electrode for plasma generation according to Example 12. FIG. 14 is a schematic perspective view of a plasma generating electrode according to Example 13. FIG. FIG. 16 is a schematic view of a plasma generating electrode according to Example 14.

<Board>
In a preferred embodiment, the first electrode and the second electrode are formed on a flexible substrate. Here, the substrate is only required to be non-conductive and flexible, and examples thereof include resin films such as PET, PEN, polyester, nylon, Teflon (registered trademark), polyethylene, and polystyrene. Further, fiber cloth, paper, flexible ceramics, and the like are also applicable. The thickness of the substrate is not specified, but it needs to be thick enough to withstand dielectric breakdown during plasma generation.

<First electrode, second electrode>
The planar patterns of the first electrode and the second electrode are not particularly limited, and can be appropriately determined depending on the type, life, and generation amount of active species. For example, the planar pattern of the electrodes can be circular or rectangular. Moreover, it can also be set as a comb-tooth shape or an island shape.
Moreover, the material of the first electrode and the second electrode is not particularly limited, and any material having a predetermined conductivity can be used. For example, carbon, copper, silver, iron, tungsten, molybdenum, manganese, titanium, chromium, zirconium, nickel, platinum, palladium, or an alloy thereof can be given. Conductive polymers, carbon nanotubes, and the like can also be used depending on the application. Furthermore, transparent electrodes such as ITO and IZO can be applied.

The first electrode and the second electrode can be formed by etching a metal foil laminated on a resin film that is a substrate. Moreover, it can also form by apply | coating a paste on the resin film which is a board | substrate. As a coating method in this case, any coating method such as screen printing, calendar roll printing, dipping method, vapor deposition, physical vapor deposition method and the like can be used.
When the electrode is formed by a coating method, the above-mentioned various metal or alloy powders are mixed with an organic binder and a solvent (such as terpineol) to prepare a conductor paste, and then this conductor paste is applied onto the substrate. And dry.

  When the planar pattern of the electrodes is comb-like or island-like, creeping discharge occurs at the edges of each comb-tooth portion and island portion, so the pitch of each comb-tooth portion and island portion is changed. Thus, the pitch of creeping discharge points can be changed as appropriate.

<Front protective layer, back protective layer>
The first electrode and the second electrode are covered with a front protective layer and a back protective layer made of a dielectric, respectively. Examples of the dielectric include inorganic materials such as ceramics and glass. Examples of the ceramic include silica, alumina, zirconia, magnesia, silicon oxide, mullite, spinel, cordierite, aluminum nitride, silicon nitride, titanium-barium oxide, barium-titanium-zinc oxide.
The front protective layer and the back protective layer can be covered by coating these dielectric powders on a resin film in which the second electrode and the first electrode are formed in a paste form. Two electrodes can be protected.
Moreover, since the electrode for plasma generation of this embodiment applies a low voltage of 500 V to 1.5 kV to the electrode as described later, not only the above inorganic materials but also epoxy, acrylic, polyamine, acrylic silicon, urethane Organic materials such as Teflon (registered trademark) and lacquer clear can be applied as a front protective layer or a back protective layer if the film thickness is 10 μm or more.
Further, a protective film for a touch panel formed on the surface of the ITO film can also be used. Examples thereof include an engineering plastic thin film such as polyamide having a thickness of 10 to 100 μm.
As described above, by protecting the first electrode and the second electrode, plasma can be generated even in a humid atmosphere, and a plasma generating electrode having excellent moisture resistance and weather resistance can be obtained. . The front protective layer and the back protective layer preferably have a thickness of about 5 to 100 μm from the viewpoint of electrode flexibility. Although it is possible to make it thicker than that, it is not desirable because it may hinder an increase in applied voltage and flexibility.
In addition, the phosphor material can be made to emit light by plasma by mixing the phosphor material in the protective layer.

<Through hole>
In the present embodiment, the presence or absence of the through hole is not specified. In addition, in the preferred embodiment, after forming the first electrode and the second electrode in a substrate shape, the substrate is subjected to laser processing, ultrasonic processing, cutting processing, press punching method, etc. Through holes can be formed.
Further, the arrangement density and arrangement pattern of the through holes are not particularly limited. For example, in consideration of the lifetime of the activation gas and the throughput of the object to be processed, the through hole can be provided only on the entrance side (upstream side) of the apparatus, or can be provided over the entire surface of the substrate.
In the case of an activated gas containing an activated species having a relatively long lifetime (for example, when the activated species is ozone gas), the treatment target can be processed for a sufficiently long period of time even if a through hole is formed in the substrate only on the upstream side of the apparatus. Objects can be brought into contact with the activation gas. However, when the lifetime of the active species is short, it is preferable to form a through hole on the entire surface of the substrate.

  The arrangement density (number) of through holes and the size of the through holes should be determined according to the reaction rate with the object to be processed, the amount of the object to be processed, or the density and number of the through holes according to the usage conditions. Can do. In a preferred embodiment, creeping discharge occurs along the substrate surface at the edge portion of the first electrode. When creeping discharge is generated along the substrate surface in this way, the distance between the plasma generation site and the object to be processed can be minimized, and the processing efficiency of the object to be processed is further increased.

  The planar shape of the through hole is not limited and can be changed according to the material and form of the object to be processed and the type of active species. For example, the planar shape of the through hole may be a circle, an ellipse, a triangle, a rectangle, a polygon such as a hexagon, an elongated slit, or the like.

The gas introduced from the through hole may be one type of gas or a plurality of types of gas may be supplied from the through hole depending on the intended reaction. In addition, when one kind of gas is supplied from the through hole, it may be a pure gas or a mixed gas.
In addition, the gas supplied from the through hole can be converted into plasma by the action of creeping discharge, but a plurality of types of gas supplied from the through hole react with each other under the action of the creeping discharge to generate active species. You can also.

The type of gas is not limited, but examples include rare gas (helium), argon, neon, etc.), nitrogen gas, oxygen gas, hydrogen, air (atmosphere), chlorine gas, ammonia gas, SF6, CF-based gas, and the like. In addition, a liquid such as hydrogen peroxide, peracetic acid, ethanol, methanol, water, or the like is sprayed or evaporated to form a mist (in this embodiment, it may be referred to as a mist liquid, and gas and mist liquid Are collectively referred to as gas). Moreover, gas (oxygen and hydrogen) generated by electrolysis can also be used.
The above gases and liquids can be used alone or as a mixture with other gases and liquids. As an example, oxygen can be activated using only oxygen gas to generate oxygen radicals and ozone gas, which can be used for sterilization applications, semiconductor wafers, removal of organic substances on glass, and surface modification.

Gas or mist liquid is normally supplied in the first electrode direction (through the through-hole), but is not limited thereto, and can be supplied along the first electrode (providing the through-hole). Etc.).
In addition, the gas pressure can be normally set near atmospheric pressure, and the supply flow rate of the original gas can be controlled by a mass flow meter or the like.
Further, by providing a plurality of gas chambers and supplying different types of gases for each gas chamber, a plurality of types of activated gases can be supplied to the discharge space.

The object to be treated (treatment target) according to the present invention is not particularly limited as long as it can be plasma-treated, and examples thereof include the following.
(I) Treatment process surface modification of the object to be treated (hydrophilic treatment: the surface of the object to be treated is hydrophilically treated before applying the adhesive or paint to the object to be treated, thereby improving the wettability and adhering the colorant or paint. , Sterilization or sterilization treatment, organic substance removal / decomposition treatment, gas modification treatment, purification of harmful gas components (ii) processing target resin (polyethylene, polypropylene, polystyrene, polyimide, tetrafluoro) Ethylene, etc.), ceramics, metal, glass medical instruments and medical materials (blister pack, blister pack sheet, syringe, syringe gasket, vial rubber stopper, injection needle, gauze, non-woven fabric, etc.)
Food packaging sheet Semiconductor wafer, liquid crystal glass substrate, plasma treatment of ceramics (iii) Low voltage treatment The applied voltage to the plasma electrode in the present invention is the plasma electrode applied voltage to ensure the insulation of the flexible substrate. Is preferably a low voltage of 200 V to 1.5 kV.
If the applied voltage is less than 200 V, it may be difficult to generate sufficient creeping discharge on the electrode surface depending on the gas conditions. On the other hand, if it exceeds 1.5 kV, dielectric breakdown of the substrate and the protective layer occurs, which is not preferable.

Embodiments of the present invention will be described below with reference to the drawings.
<Example 1>
FIG. 1 is a cross-sectional view showing the configuration of the plasma generating electrode of Example 1 of the present invention.
(A) is an example in which the substrate 11 is formed of TiO ₂ , the first electrode 12 is formed of an ITO film, and the second electrode 13 is formed of an Al foil.
(B) shows the configuration of the first electrode,
The substrate 11 is a PEN film having a thickness of 25 to 50 μm,
An ITO film having a thickness of 100 to 500 nm, a BTO (TiO ₂ ) having a thickness of 10 μm, and a protective layer having a thickness of 10 μm are sequentially formed thereon, and Ag is patterned on the outermost surface.
(C), the substrate 11 is a PEN film having a thickness of 25 to 50 μm,
As the first electrode, BTO (TiO ₂ ) having a thickness of 5 to 10 μm and an ITO film having a thickness of 100 to 500 nm formed thereon,
This is an example in which the second electrode 13 is formed of SUS.
(D) uses the substrate 11 as a 200 μm thick PET film,
In this example, Ag is used as the first electrode and the second electrode, and the first electrode is made not to interpose TiO ₂ having a thickness of 10 μm.
The result is shown in (e).
In the case where TiO ₂ was interposed, the discharge voltage was decreased, and it was found that about half the voltage was sufficient to generate the same positive ions.

<Example 2>
FIG. 2 is a schematic view of an electrode for plasma generation according to Example 2 of the present invention. (A) is a top view, (b) is a longitudinal cross-sectional view. In the plasma generating electrode 10 of Example 2, the substrate 11 is made of a circular PET resin film, and a first electrode 12 having a predetermined pattern is formed on the surface of the substrate 11, and the upper surface thereof is a surface protective layer. 14 is covering.
On the other hand, the second electrode 13 is formed on the back surface of the substrate 11 so as to face the first electrode 12, and the back protective layer 15 covers the upper part thereof. Furthermore, a through hole 16 that penetrates the substrate 11, the first electrode 12, and the second electrode 13 is formed.
By disposing the through holes 16 in this way, the plasma generated by the creeping discharge in each first electrode 12 is drawn out by the gas supplied from the through holes 16 to irradiate the object to be processed in close proximity. There is an effect that can be.
The protective layer may be provided on the inner surface of the through hole 16.
Then, creeping discharge is generated along the substrate surface as indicated by an arrow P from the edge of the first electrode 12 toward the through hole 16. As a result, the gas is turned into plasma by creeping discharge and then supplied toward the object to be processed as shown by an arrow B through the through hole 16.
The through hole 16 has the largest inner diameter of the through portion formed in the first electrode 12, and then the inner diameter of the through portion formed in the second electrode 13 and the inner diameter of the through portion formed in the substrate 11. It is in order. In this case, the inner diameter of the penetrating portion formed in the second electrode 13 and the inner diameter of the penetrating portion formed in the substrate 11 may be the same.
By providing a difference in diameter in this way, there is an effect that the creeping discharge generation range can be controlled.

<Example 3>
FIG. 3 is a schematic view of an electrode for plasma generation according to Example 3 of the present invention. (A) is a top view, (b) is a longitudinal cross-sectional view. The plasma generating electrode according to Example 3 is different from the plasma generating electrode of Example 2 in that the plasma generating electrode is rectangular, but the other points are the same.

<Example 4>
FIG. 4 is a schematic cross-sectional view of a plasma generating electrode according to Example 4 of the present invention. In the plasma generating electrode according to Example 4, the first electrode 12 and the second electrode 13 are formed by etching a copper foil. Moreover, the front protective layer and the back protective layer are not formed.
The through hole 16 has an inner diameter of a through portion formed in the first electrode 12 of 4.3 mm, an inner diameter of the through portion formed in the second electrode 13 of 3.3 mm, and the through hole formed in the substrate 11. The inner diameter of the part was set to 3.0 mm. The other points are the same as those of the plasma generating electrode of Example 1.
And the to-be-processed object was made into the PEN film, and the surface modification was performed. FIG. 4A shows a case where the second electrode 13 side is opposed to the PEN film of the object to be processed. FIG. 4B shows a case where the first electrode 12 side faces the PEN film of the object to be processed. It is.
The result is shown in FIG. A vertical axis | shaft is a value of a contact angle when a water droplet is dripped on the PEN film of a to-be-processed object. In FIG.4 (c), 1 mm and 0 mm show the distance of a to-be-processed object and a PEN film. Moreover, GND is a case where the second electrode side is opposed to the PEN film of the object to be processed, and HV is a case where the first electrode side is opposed to the PEN film of the object to be processed. The experimental conditions in this case are shown in Table.
As a result, a higher surface modification effect can be obtained when the first electrode side is opposed to the PEN film of the object to be processed.

<Example 5>
FIG. 5 is a schematic view of an electrode for plasma generation according to Example 5 of the present invention. (A) is a top view, (b) is a longitudinal cross-sectional view. In the plasma generating electrode 10 of Example 3, the substrate 11 is made of a PET resin film, and the first electrode 12 having a predetermined pattern is formed in an island shape on the surface of the substrate 11, and the upper surface thereof is a surface protective layer. 14 is covering.
On the other hand, a second electrode 13 is formed on the back surface of the substrate 11 so as to face the first electrode 12, and a back protective layer 15 covers the upper part of the second electrode 13.
In Example 5, the first electrode 12 has a shape (island shape) separated into a plurality,
The second electrode 13 is not separated but is a single sheet.
Further, each island (in a separated state in plan view) forming the first electrode 12 is, for example, a quadrilateral, and a circular through hole 16 is formed around the first electrode 12.
In Example 5, the through-hole 16 does not penetrate the first electrode 12 but penetrates the second electrode 13.
By arranging the through holes 16 in this way, the plasma generated by the creeping discharge in each first electrode 12 is drawn out by the gas supplied from the through hole 16 corresponding to each first electrode 12 and is brought into extremely close proximity. There is an effect that the object to be processed can be irradiated.
Then, creeping discharge is generated along the substrate surface as indicated by an arrow P from the edge of the first electrode 12 toward the through hole 16. As a result, the gas is turned into plasma by creeping discharge and then supplied toward the object to be processed as shown by an arrow B through the through hole 16.
As in the second embodiment, the through hole 16 has the largest inner diameter of the through portion formed in the first electrode 12, and is formed in the substrate 11, the inner diameter of the through portion formed in the second electrode 13 next. The inner diameters of the penetrating parts are in this order. In this case, the inner diameter of the penetrating portion formed in the second electrode 13 and the inner diameter of the penetrating portion formed in the substrate 11 may be the same.
By providing a difference in diameter in this way, there is an effect that the creeping discharge generation range can be controlled.

<Example 6>
FIG. 6 is a schematic view of an electrode for plasma generation according to Example 6 of the present invention. (A) is a top view, (b) is a longitudinal cross-sectional view. This example differs from the electrode of Example 5 in that an island-shaped second electrode is provided on the back surface of the substrate. In Example 6, the second electrode 13 on the back surface of the substrate also has an island shape that faces the electrode 12.
In this way, when the planar pattern of the electrodes is an island shape, the pitch of the creeping discharge points can be changed as appropriate by changing the pitch of each island (separation interval).
Therefore, when the lifetime of the active species is short, the number of creeping discharge points can be increased by reducing the island pitch. The pitch of such islands is not limited because it is designed according to the type of active species. For example, the pitch is preferably 100 μm (0.1 mm) or more, and more preferably 500 μm (0.5 mm) or more. .
From the viewpoint of generating active species uniformly over a wide range, the island pitch is preferably 20 mm or less, and more preferably 3 mm or less.

<Example 7>
FIG. 7 is a schematic view of an electrode for plasma generation according to Example 7 of the present invention. (A) is a top view, (b) is an AA longitudinal cross-sectional view. In the plasma generating electrode shown in Example 7, the comb-shaped first electrode 22 and the second electrode 23 are provided with the elongated common electrode 21 and a plurality of rows of elongated comb-tooth portions 22 protruding from the common electrode. Both the comb-shaped first electrode 22 and the second electrode 23 are formed on one side of the substrate 11.
An elongated gap 24 is formed between the adjacent comb-shaped first electrode 22 and second electrode 23.
In such an electrode of Example 7, creeping discharge is generated between the first electrode 22 and the second electrode 23, plasma is generated from the first electrode along the substrate, and the substrate 11 is made to flow. The gas can be turned into plasma.

<Example 8>
FIG. 8 is a schematic view of an electrode for plasma generation according to Example 8 of the present invention. In the plasma generating electrode according to Example 8, the first electrode and the second electrode were respectively formed in a comb shape on both sides of the PET film under the conditions shown in Table.

<Example 9>
FIG. 9 is a schematic view of an electrode for plasma generation according to Example 9 of the present invention. (A) is a top view, (b) is an AA longitudinal cross-sectional view. The electrode for plasma generation shown in Example 9 is the electrode for plasma generation of Example 9, and the second electrode 23 is provided on the opposite surface of the substrate 11 so as to face the first electrode 22.
In this case, the second electrode 23 is disposed so as to be between the first electrodes 22, and the through-hole 16 penetrates the second electrode 23 and the first electrode 12. Each one is provided.

<Example 10>
FIG. 10 is a schematic view of an electrode for plasma generation according to Example 10 of the present invention. (A) is a top view, (b) is an AA longitudinal cross-sectional view. The electrode for plasma generation shown in Example 10 is the electrode for plasma generation of Example 10, and the second electrode 23 is provided on the opposite surface of the substrate 11 so as to face the first electrode 22. In this case, the second electrode 23 does not have a comb-teeth shape but is a single one, and the through hole 16 penetrates the second electrode 23.

<Example 11>
FIG. 11 is a schematic view of an electrode for plasma generation according to Example 11 of the present invention. (A) is a top view, (b) is an AA longitudinal cross-sectional view. In the plasma generating electrode shown in Example 11, the second electrode 23, the intermediate protective layer 17, the first electrode 22, and the substrate 11 are sequentially laminated on the substrate 11. A back protective layer 15 is provided below the lower substrate 11, and a front protective layer 14 is provided below the upper substrate 11.
The second electrode 23 is provided on the opposite surface of the front protective layer 14 so as to face the first electrode 22. In this case, the second electrode 23 does not have a comb-teeth shape but is a single one, and the through hole 16 penetrates the second electrode 23.

<Example 12>
FIG. 12 is a schematic view of a plasma generating electrode according to Example 12 of the present invention. The electrode for plasma generation shown in Example 12 is obtained by housing the electrode for plasma generation of Example 2 in a cylindrical case 41. (A) is a schematic perspective view of the electrode for plasma generation which has a cylindrical electrode, (b) is the sectional drawing. In the plasma generating electrode having the cylindrical electrode shown in the twelfth embodiment, the gas introduced into the gap between the cylindrical case 41 and the plasma generating electrode 10 is introduced in the direction of the central axis of the cylindrical case 41 and the plasma generating electrode is used. Plasma is gasified by passing through the through-hole 16 of the electrode 10 and is drawn out from the tip of the cylindrical case 41.
Modifications of the plasma generating electrode according to Example 12 are shown in (c) and (d). (C) is a schematic perspective view of the electrode for plasma generation which has a spiral electrode, (d) is the sectional drawing.
The plasma generating electrode shown in the modified example is one in which the plasma generating electrode 10 of Example 2 is spirally wound and accommodated in a cylindrical case 41.
In the plasma generating electrode having the spiral electrode shown in the modification, the gas introduced into the gap between the cylindrical case 41 and the plasma generating electrode 10 is introduced in the central axis direction of the cylindrical case 41, and the plasma generating electrode 10 through holes 16 are converted into plasma gas and drawn from the tip of the cylindrical case 41.
The plasma generating electrode housed in the cylindrical case shown in Example 12 can be easily applied to, for example, sterilization in the human oral cavity.

<Example 13>
FIG. 13 is a schematic perspective view of a plasma generating electrode according to Example 13 of the present invention. In the plasma generating electrode 10 shown in Example 13, the plasma generating electrode of Example 2 is formed into a cylindrical shape, gas is introduced into one end of the cylinder, and the through hole 16 of the plasma generating electrode 10 is passed through. Plasma gas is drawn out radially outward of the cylindrical plasma generating electrode.
The cylindrical plasma generating electrode configured as in the thirteenth embodiment can be applied to sterilization of, for example, human skin by rotating on a curved surface.

<Example 14>
FIG. 14 is a schematic view of an electrode for plasma generation according to Example 14 of the present invention. The electrode for plasma generation shown in Example 14 is one in which the electrode for plasma generation of Example 7 is housed in a cylindrical case 41.
(A) is a schematic perspective view of the electrode for plasma generation which has a cylindrical electrode, (b) is the sectional drawing.
In the plasma generating electrode having the cylindrical electrode shown in Example 14, the comb-shaped first electrode 22 and second electrode 23 are directed in the axial direction of the cylinder, and the space between the first electrode 22 and the second electrode 23 is set. Then, a creeping discharge is generated, and a gas is introduced along the creeping discharge to form plasma gas, which is drawn out from the tip of the cylindrical case 41.
Moreover, the modification of the electrode for plasma generation which concerns on Example 14 is shown to (c), (d). (C) has the 1st electrode 22 and the 2nd electrode 23 orient | assigned to the outer side of a cylinder.
In the plasma generating electrode shown in the modification, the gas introduced into the gap between the cylindrical case 41 and the plasma generating electrode 10 is introduced in the direction of the central axis of the cylindrical case 41 to be converted into plasma gas, and the tip of the cylindrical case 41 is I try to pull it out from the department.

The electrode for generating plasma of the present invention is provided with an electrode for generating low-voltage plasma on a flexible substrate, generating creeping discharge along the substrate surface from the edge of this electrode, and gas is converted into plasma by this creeping discharge. Therefore, it is possible to irradiate a desired portion with plasma gas in accordance with the shape of the object to be processed, and to increase the efficiency of the plasma processing for various objects to be processed.
Further, by installing the plasma generating electrode of the present invention on the exterior of the vehicle, it can be used as a plasma actuator. That is, the wind resistance can be reduced by installing the plasma electrode on the exterior of the vehicle body.

DESCRIPTION OF SYMBOLS 10 Plasma generating electrode 11 Board | substrate 12 1st electrode 13 2nd electrode 14 Front protective layer 15 Back protective layer 16 Through-hole 17 Intermediate protective layer 21 Common electrode 22 Comb part 23 Gap part B Gas flow P Creeping discharge

Claims (5)

An electrode for generating plasma at a low voltage,
A flexible substrate;
A first electrode provided on one surface of the substrate;
A second electrode laminated on the same or opposite surface as the surface on the substrate;
With
Covering the surface protective layer thereon so that the first electrode is not exposed,
An electrode for generating low voltage plasma, characterized in that plasma is generated along a substrate from a first electrode. The substrate is provided with a through hole for supplying a plasma gas in a vertical direction,
2. The low-voltage plasma generating electrode according to claim 1, wherein plasma generated by creeping discharge generated along the substrate is extracted from the first electrode. A through hole is formed around the first electrode;
Plasma generated at the edge portion of the first electrode,
3. The electrode for generating a low-voltage plasma according to claim 1, wherein the electrode is pulled out vertically through the through hole. The low-voltage plasma generating electrode according to any one of claims 1 to 3, wherein the first electrode has an island shape or a comb-like shape. The low-voltage plasma generating electrode according to claim 1, wherein the first electrode has a cylindrical shape or a spiral shape.