JP2013054144A - Alignment method, exposure method, method of manufacturing device, and method of manufacturing flat panel display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an alignment method enabling adoption of a substrate holding member on the assumption that a substrate is removed in the middle of exposing the substrate.SOLUTION: When a plurality of partitioned regions (SA1, SA2 or the like) are formed on a substrate P, the substrate P performs step movement in a plane parallel to a plane of the substrate P each time the partitioned regions are formed on the substrate P. Before and after the step movement, position information on the same detection object part (for example, edge) of the substrate P is detected, for example, using a plurality of sensors 122X, 122X, 122Y. Based on the detection result, the substrate P is positioned to an exposure area 1A when the partitioned regions are formed.

Description

  The present invention relates to an alignment method, an exposure method, a device manufacturing method, and a flat panel display manufacturing method, and in particular, to align a substrate at a predetermined position when forming a plurality of partitioned regions on the substrate. The present invention relates to a method, an exposure method including measurement for the alignment, a device manufacturing method using the exposure method, and a flat panel display manufacturing method.

  Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements, semiconductor elements (integrated circuits, etc.), a step-and-repeat type projection exposure apparatus (so-called stepper) or step-and- A scanning projection exposure apparatus (a so-called scanning stepper (also called a scanner)) or the like is used.

  In recent years, substrates that are exposure objects of exposure apparatuses, particularly substrates for liquid crystal display elements (rectangular glass substrates) tend to increase in size, and accordingly, the stage apparatus of the exposure apparatus also increases in size. Weight has also increased. The inventor previously proposed an exposure apparatus intended to deal with such an increase in the size of the stage (see, for example, Patent Document 1).

  In the exposure apparatus, a glass plate, a wafer or the like (hereinafter collectively referred to as a substrate) having a surface coated with a sensitive agent is placed on a substrate stage. However, for example, the glass substrate for liquid crystal tends to be further increased in size, such as a side of 3 meters or more in the latest 10th generation, and therefore, a new apparatus for realizing further downsizing of the substrate stage for holding the glass substrate. Development was desired.

US Patent Application Publication No. 2010/0018950

  As one method for realizing further downsizing of the substrate stage, the use of a substrate stage having a substrate holding surface that is much smaller than the substrate is being studied. In this case, the entire surface on one substrate is considered. When exposing a plurality of positioned areas, it is essential to remove the substrate from the substrate stage and hold it again on the substrate stage between the start and end of exposure of the plurality of areas. In this case, unlike the case where the second and subsequent layers are exposed to the substrate, when the first layer is exposed, the alignment mark does not normally exist on the substrate, so the substrate is aligned with the exposure position. Is a problem. The present invention has been made to improve such a problem, and employs the following configuration.

  According to the first aspect of the present invention, there is provided an alignment method for aligning the substrate at a predetermined position in forming a plurality of partitioned areas on the substrate, each time the partitioned areas are formed on the substrate. In addition, the substrate is step-moved in a plane parallel to the surface of the substrate, and before and after the step movement, the position information of the same detection target portion of the substrate is detected, and the position information of the detection target portion Based on the detection result, an alignment method is provided that includes aligning the substrate with respect to a predetermined position when forming the partitioned region.

  According to this, the step movement of the substrate is not limited to the case where the substrate is moved by the holding member holding the substrate, but only when the substrate is moved relative to the holding member, that is, from the holding member during the step movement. Even when the substrate is once removed, it is possible to accurately align the substrate with a predetermined position without any trouble when forming the partitioned region. Therefore, when exposing almost the entire surface of the substrate, it is possible to employ a holding member that is smaller than the substrate on the premise that the substrate is to be removed.

  According to a second aspect of the present invention, there is provided an exposure method for exposing a substrate with an energy beam to form a plurality of partitioned regions in which a plurality of layer patterns are superimposed on the substrate, wherein the exposure method comprises: In the exposure of the first layer for forming the plurality of partitioned regions, the alignment method of the present invention is used to align the substrate with respect to the exposure position, and the plurality of partitions formed on the substrate. In the exposure of the second and subsequent layers that form the pattern region superimposed on the region, the position of the mark formed on the substrate together with the pattern of each partition region is detected during the exposure before the previous layer. A first exposure method for aligning the substrate with an exposure position is provided.

  According to a third aspect of the present invention, there is provided an exposure method in which a substrate is exposed with an energy beam to form a plurality of partitioned regions in which a plurality of layer patterns are superimposed on the substrate. In the exposure of the first layer for forming the plurality of partitioned regions, the substrate is integrated with a substrate support member that adsorbs and supports at least a part of the outer peripheral edge portion thereof, and is attached to the substrate support member. The position of the substrate is measured by a substrate interferometer system that irradiates a measurement beam to the provided reflecting surface, and the substrate is aligned with the exposure position based on the measurement result, and formed on the substrate. In the second and subsequent exposures that form the pattern area by overlapping the plurality of divided areas, the marks formed on the substrate together with the patterns of the respective divided areas during the exposure before the previous layer are performed. The second exposure method for aligning the substrate relative to the exposure position by detecting a location is provided.

  According to the fourth aspect of the present invention, the substrate is driven in a first direction within a predetermined plane parallel to the surface of the substrate with respect to the exposure position, and a plurality of processing regions on the substrate are exposed by the energy beam. In the exposure method, the substrate is placed in a second direction orthogonal to the first direction within the predetermined plane at a position in the first direction corresponding to the arrangement of the processing target region on the substrate and the order of processing. Displacing and loading the substrate onto a moving body, and starting measurement for alignment of the substrate with respect to the exposure position at the position in the first direction where the substrate is loaded. A third exposure method is provided.

  According to a fifth aspect of the present invention, there is provided a device manufacturing method comprising: exposing a substrate by any one of the first to third exposure methods; and developing the exposed substrate. Is done.

  According to a sixth aspect of the present invention, exposing a substrate used for a flat panel display as the substrate by any one of the first to third exposure methods, and developing the exposed substrate A method of manufacturing a flat panel display is provided.

1 is a drawing schematically showing a configuration of an exposure apparatus 100 according to a first embodiment. FIG. 3 is a partially omitted plan view showing the exposure apparatus 100. FIG. 3 is a diagram for explaining the arrangement and the like of the alignment detection system shown in FIG. 2, in which some components are further omitted from FIG. 2. FIG. 2 is a side view of the exposure apparatus 100 viewed from the + X direction in FIG. FIG. 3 is a block diagram showing an input / output relationship of a main controller that mainly constitutes a control system of exposure apparatus 100. FIG. 10 is a diagram (No. 1) for describing a series of operations for substrate processing performed in exposure apparatus 100. It is FIG. (2) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. FIG. 11 is a diagram (No. 3) for describing a series of operations for substrate processing performed in exposure apparatus 100. It is FIG. (4) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (5) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (6) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (7) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (8) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (9) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (10) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (11) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (12) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (13) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (14) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (15) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (16) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (17) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (18) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (19) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (20) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is FIG. (21) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus 100. FIG. It is a figure for demonstrating the modification using a board | substrate support member. FIG. 5 is a partially omitted plan view schematically showing an exposure apparatus 200 according to a second embodiment. FIGS. 29A to 29F are views (No. 1 to No. 6) for explaining a series of operations for substrate processing performed in the exposure apparatus 200. FIG. FIGS. 30A to 30F are views (No. 7 to No. 12) for describing a series of operations for substrate processing performed in the exposure apparatus 200. FIG. 10 is a partially omitted plan view schematically showing an exposure apparatus 300 according to a third embodiment. 32A to 32F are views (No. 1 to No. 6) for explaining a series of operations for substrate processing performed in the exposure apparatus 300. FIG. 33A to 33F are views (No. 7 to No. 12) for describing a series of operations for substrate processing performed in the exposure apparatus 300.

<< First Embodiment >>
Hereinafter, a first embodiment will be described with reference to FIGS.

  FIG. 1 schematically shows a configuration of an exposure apparatus 100 according to the first embodiment, omitting an air levitation unit group described later, and FIG. 2 omits a part of the exposure apparatus 100. A plan view is shown. 2 corresponds to a plan view of a portion below the projection optical system PL in FIG. 1 (a portion below a lens barrel surface plate described later). The exposure apparatus 100 is used for manufacturing a flat panel display, a liquid crystal display device (liquid crystal panel), and the like, for example. The exposure apparatus 100 is a projection exposure apparatus that uses a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used for a display panel of a liquid crystal display device as an exposure object.

  The exposure apparatus 100 includes an illumination system IOP, a mask stage MST that holds a mask M, a projection optical system PL, a mask stage MST, a projection optical system PL, and the like mounted on a body BD (only a part thereof is shown in FIG. 1 and the like). A substrate stage apparatus PST including a fine movement stage 26 (substrate table) for holding the substrate P, and a control system thereof. In the following, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system PL at the time of exposure is defined as the X-axis direction (X direction), and the direction orthogonal to this in the horizontal plane is defined as the Y-axis direction (Y Direction), the direction orthogonal to the X axis and Y axis is the Z axis direction (Z direction), and the rotation (tilt) directions around the X axis, Y axis, and Z axis are the θx, θy, and θz directions, respectively. Do.

  The illumination system IOP is configured similarly to the illumination system disclosed in, for example, US Pat. No. 6,552,775. That is, the illumination system IOP emits light emitted from a light source (not shown) (for example, a mercury lamp) through exposure reflectors (not shown), dichroic mirrors, shutters, wavelength selection filters, various lenses, and the like. Irradiation light) is applied to the mask M as IL. As the illumination light IL, for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or the combined light of the i-line, g-line, and h-line is used. Further, the wavelength of the illumination light IL can be appropriately switched by a wavelength selection filter, for example, according to the required resolution.

  A mask M having a circuit pattern or the like formed on its pattern surface (the lower surface in FIG. 1) is fixed to the mask stage MST by, for example, vacuum suction (or electrostatic suction). Mask stage MST is supported in a non-contact state on a mask surface plate (not shown) constituting a part of body BD, for example, via an air bearing (not shown) fixed to the bottom surface thereof. The mask stage MST is driven with a predetermined stroke in the scanning direction (X-axis direction) by a mask stage drive system 12 (not shown in FIG. 1, see FIG. 5) including a linear motor, for example, And are slightly driven appropriately in the θz direction. Position information (including rotation information in the θz direction) of the mask stage MST in the XY plane includes a plurality of laser interferometers that irradiate a measuring beam onto a reflective surface provided (or formed) on the mask stage MST. It is measured by a mask laser interferometer system (hereinafter referred to as “mask interferometer system”) 14.

  Projection optical system PL is supported by lens barrel surface plate 16 which is a part of body BD, below mask stage MST in FIG. The projection optical system PL is configured similarly to the projection optical system disclosed in, for example, US Pat. No. 6,552,775. That is, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which the projection areas of the pattern image of the mask M are arranged in, for example, a staggered pattern, and a single direction whose longitudinal direction is the Y-axis direction. It functions in the same way as a projection optical system having a rectangular (band-like) image field. In the present embodiment, as each of the plurality of projection optical systems, for example, a bilateral telecentric equal magnification system that forms an erect image is used. Hereinafter, a plurality of projection areas arranged in a staggered pattern in the projection optical system PL are collectively referred to as an exposure area IA.

  For this reason, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system IOP, the illumination light IL that has passed through the mask M causes the circuit of the mask M in the illumination area to pass through the projection optical system PL. Irradiation region of illumination light IL conjugate to an illumination region on a substrate P on which a resist (sensitive agent) is coated, on which a projection image (partial upright image) of a pattern is arranged on the image plane side of projection optical system PL (Exposure area) formed in IA. Then, the mask M is relatively moved in the scanning direction (X-axis direction) with respect to the illumination area (illumination light IL) by synchronous driving of the mask stage MST and a substrate holder PH (fine movement stage 26) described later that holds the substrate P. In addition, scanning exposure of one shot area (partition area) on the substrate P is performed by moving the substrate P relative to the exposure area IA (illumination light IL) in the scanning direction (X-axis direction). The pattern of the mask M is transferred to the shot area. That is, in the exposure apparatus 100, the pattern of the mask M is generated on the substrate P by the illumination system IOP and the projection optical system PL, and the sensitive layer (resist layer) on the substrate P is exposed on the substrate P by the illumination light IL. A pattern is formed.

  The body BD is separated from each other by a predetermined distance on the floor F in the X-axis direction, as shown in FIG. 1 and FIG. 4 in which a schematic side view of the exposure apparatus 100 viewed from the + X direction is partially omitted. A pair of (two) substrate stage mounts (hereinafter abbreviated as mounts) 18 composed of rectangular parallelepiped members arranged in parallel and with the longitudinal direction as the Y-axis direction, and a pair of side frames 20 on the pair of mounts 18. And a lens barrel surface plate 16 supported horizontally and a mask surface plate (not shown). The number of the gantry 18 is not limited to two, but may be one or three or more.

  Each mount 18 is installed on the floor surface F via a plurality of vibration isolators 22 (see FIGS. 1 and 4). As shown in FIGS. 2 and 4, the pair of side frames 20 has lower ends connected to one end and the other end in the Y-axis direction on the upper surfaces of the pair of mounts 18. The lens barrel surface plate 16 is formed of a rectangular parallelepiped member that is arranged in parallel to the XY plane and whose longitudinal direction is the Y-axis direction, and both ends in the Y-axis direction are downward on the pair of mounts 18 by the pair of side frames 20. It is supported from.

  As shown in FIG. 1, the substrate stage apparatus PST includes a coarse movement stage section 24, a fine movement stage 26, a weight cancellation apparatus 28, and the like. As shown in FIGS. 1 and 4, the weight cancellation device 28 is disposed on an upper surface parallel to the XY plane of the X guide 82 disposed on the pair of mounts 18.

  As shown in FIG. 4, the coarse movement stage unit 24 is configured so that two (a pair) of X beams 30 </ b> A and 30 </ b> B, a coarse movement table 32, and two X beams 30 </ b> A and 30 </ b> B are placed on the floor surface F. And a plurality of legs 34 to support.

  Each of the X beams 30A and 30B is made of a hollow member having a rectangular frame shape in the YZ section extending in the X-axis direction, and is arranged in parallel with each other at a predetermined interval in the Y-axis direction (see FIGS. 1 to 4). As shown for the X beam 30A in FIG. 1, each of the X beams 30A and 30B has three legs 34 in the vicinity of both ends in the longitudinal direction (X-axis direction) and the central portion. On the surface F, it is supported without contact with the pair of mounts 18. As a result, the coarse movement stage portion 24 is vibrationally separated from the pair of mounts 18. The arrangement and number of legs 34 may be arbitrary. Further, the X beams 30A and 30B are not limited to hollow members, but may be solid members, or may be rod-shaped members having an I-shaped YZ cross section.

  As shown in FIG. 4, an X linear guide 36 extending in the X-axis direction is fixed to the upper surface of each of the X beams 30 </ b> A and 30 </ b> B at the center in the Y-axis direction. In the present embodiment, the X linear guide 36 has a magnet unit including a plurality of permanent magnets arranged at predetermined intervals in the X-axis direction, and also serves as an X stator. In addition to the X linear guide 36, an X stator having a magnet unit may be provided. Further, a plurality of, for example, two X linear guides may be provided on the X beams 30A and 30B.

  As shown in FIG. 4, the coarse motion table 32 is disposed on the X beams 30A and 30B. The coarse motion table 32 is made of a plate member having a rectangular shape in plan view and having an opening penetrating in the Z-axis direction at the center. In FIG. 4, the coarse motion table 32 is partially shown in a sectional view together with a weight cancellation device 28 described later. As shown in FIG. 4, an X linear guide 36 fixed to each of the X beams 30A and 30B is non-illustrated on the lower surface of the coarse motion table 32 via a gas static pressure bearing (for example, an air bearing) not shown. A plurality of sliders 44 that are engaged by contact (via a predetermined gap (gap, clearance)) are fixed. For example, four sliders 44 are provided at predetermined intervals in the X-axis direction with respect to each X linear guide 36 (see FIG. 1), and a total of eight sliders 44 are provided on the lower surface of the coarse motion table 32, for example. Is fixed. The coarse motion table 32 is guided linearly in the X-axis direction by a plurality of X linear guide devices including an X linear guide 36 and a slider 44.

  Further, in this case, each slider 44 includes a coil unit, and the coarse motion table 32 is driven with a predetermined stroke in the X-axis direction together with the above-described X stator by a total of eight coil units included in each slider 44. An X linear motor 42 (see FIG. 5) is configured.

  An X mover may be provided separately from the slider 44. In this case, the slider 44 includes rolling elements (for example, a plurality of balls) and is slidably engaged with each X linear guide 36. May be combined.

  Although not shown in FIGS. 1 to 4, an X scale having a periodic direction in the X-axis direction is fixed to a predetermined one of the X beams 30 </ b> A and 30 </ b> B, for example, the X beam 30 </ b> A. The encoder head constituting the X linear encoder system 46 (see FIG. 5) for obtaining the positional information in the X axis direction of the coarse motion table 32 using the X scale is fixed. The position of the coarse movement table 32 in the X-axis direction is controlled by the main controller 50 (see FIG. 5) based on the output of the encoder head.

  Similarly, although not shown in FIGS. 1 to 4, the coarse movement table 32 measures the relative movement amount (relative displacement amount) of the fine movement stage 26 with respect to the coarse movement table 32 in the X-axis and Y-axis directions. Gap sensors 48A and 48B (see FIG. 5) for attaching are attached. Main controller 50 immediately stops fine movement stage 26 and coarse movement table 32 when the relative movement amount measured by gap sensors 48A and 48B reaches a predetermined limit value. Instead of or in addition to the gap sensors 48A and 48B, a mechanical stopper member that mechanically limits the movable amount of the fine movement stage 26 with respect to the coarse movement table 32 may be provided.

  Here, although the description is mixed, the fine movement stage 26 will be described. As can be seen from FIGS. 1 and 4, fine movement stage 26 is made of a plate-shaped (or box-shaped) member having a rectangular shape in plan view, and a substrate holder PH (hereinafter abbreviated as a holder) is mounted on the upper surface thereof. As can be seen from FIG. 2, the holder PH has a length in the X-axis direction equivalent to that of the substrate P, and a width (length) in the Y-axis direction is about 1/3 of the substrate P. The holder PH adsorbs and holds a part of the substrate P (here, about one third of the substrate P in the Y-axis direction) by, for example, vacuum adsorption (or electrostatic adsorption), and a pressurized gas (for example, high pressure) Air) is ejected upward, and a part of the substrate P (about 1/3 of the substrate P) can be supported non-contacting (floating) from below by the ejection pressure. Switching between high-pressure air ejection and vacuum adsorption to the substrate P by the holder PH is performed via a holder intake / exhaust switching device 51 (see FIG. 5) that switches and connects the holder PH to a vacuum pump and a high-pressure air source (not shown). This is performed by the main controller 50.

  The fine movement stage 26 is moved in a direction of six degrees of freedom (X axis, Y axis, Z axis, θx) on the coarse movement table 32 by a fine movement stage drive system 52 (see FIG. 5) including a plurality of voice coil motors (or linear motors). , Θy, and θz).

  More specifically, as shown in FIG. 1, a stator 56 is provided on the upper surface of the + X side end of the coarse movement table 32 via a support member 33. A mover 58 that constitutes the X voice coil motor 54X together with the stator 56 is fixed to the side surface on the + X side. Here, in practice, a pair of X voice coil motors 54X having the same configuration is provided at a predetermined distance in the Y-axis direction.

  Although not shown, a Y voice coil motor stator is provided on the upper surface of the + Y side end of the coarse movement table 32 via a support member, and the + Y of the fine movement stage 26 is opposed to the stator. The mover of the Y voice coil motor is fixed to the side surface. Here, in practice, a pair of Y voice coil motors having the same configuration (hereinafter referred to as Y voice coil motor 54Y for convenience) are provided at a predetermined distance in the X-axis direction.

  The fine movement stage 26 is synchronously driven by the main control device 50 to the coarse movement table 32 using a pair of X voice coil motors 54X, which will be described later, and driven at the same speed in the same direction as the coarse movement table 32. ) To move along with the coarse motion table 32 in the X-axis direction with a predetermined stroke, and when driven using a pair of Y voice coil motors 54Y, the coarse motion table 32 is also moved in the Y-axis direction. Move with a small stroke.

  Further, the fine movement stage 26 causes the coarse movement by causing the main controller 50 to generate driving forces in opposite directions to each of the pair of X voice coil motors 54X or each of the pair of Y voice coil motors 54Y. It moves in the θz direction with respect to the table 32.

  In the present embodiment, the fine movement stage 26 is configured by the above-described X linear motor 42 and the pair of X voice coil motor 54X and Y voice coil motor 54Y of the fine movement stage drive system 52 so that the projection optical system PL (see FIG. 1). ) Can be moved (coarse movement) with a long stroke in the X-axis direction, and can be slightly moved (fine movement) in three degrees of freedom in the X-axis, Y-axis, and θz directions.

  Further, as shown in FIG. 1, the fine movement stage drive system 52 has a plurality of, for example, four, fine movement stages 26 for finely driving the fine movement stage 26 in the remaining three degrees of freedom (each direction of θx, θy, and Z axis). A Z voice coil motor 54Z is provided. Each of the plurality of Z voice coil motors 54 </ b> Z includes a stator 59 fixed to the upper surface of the coarse movement table 32 and a mover 57 fixed to the lower surface of the fine movement stage 26. (In FIG. 1, only two of the four Z voice coil motors 54Z are shown, and the other two are not shown. In FIG. 4, the four Z voice coil motors 54Z are arranged. Only one of them is shown, and the other three are not shown). The stators of the voice coil motors 54X, 54Y, 54Z are all attached to the coarse motion table 32. Each voice coil motor 54X, 54Y, 54Z may be either a moving magnet type or a moving coil type. A position measurement system for measuring the position of fine movement stage 26 will be described later.

  On the + Y side of the X beam 30A and the -Y side of the X beam 30B, as shown in FIG. 4, each of the pair of frames 110A and 110B is installed on the floor surface F so as not to contact the gantry 18. ing. Air levitation unit groups 84A and 84B are installed on the upper surfaces of the pair of frames 110A and 110B, respectively.

  As shown in FIGS. 2 and 4, the air levitation unit groups 84 </ b> A and 84 </ b> B are disposed on both sides of the holder PH in the Y-axis direction. As shown in FIG. 2, each of the air levitation unit groups 84A and 84B has the same width in the Y-axis direction as the width in the Y-axis direction of the substrate P, and the length in the X-axis direction causes the holder PH to scan and move. In a rectangular region having a length substantially equal to the moving range at the time, a plurality of air levitation units are dispersedly arranged at a predetermined interval in the X-axis direction with a slight gap in the Y-axis direction. . The X positions of the center of the exposure area IA and the centers of the air levitation unit groups 84A and 84B substantially coincide. The upper surface of each air levitation unit is set to be equal to or somewhat lower than the upper surface of the holder PH.

  The support surface (upper surface) of each air levitation unit constituting each of the air levitation unit groups 84A and 84B has a thrust type air bearing structure having a porous body or a plurality of mechanically minute holes. Each air levitation unit can float and support a part of the substrate P by supplying pressurized gas (for example, high-pressure air) from a gas supply device 85 (see FIG. 5). On / off of the supply of high-pressure air to each air levitation unit is controlled by the main controller 50 shown in FIG. Here, in FIG. 5, a single gas supply device 85 is illustrated for the convenience of drawing. However, the number is not limited to this, and the same number of air levitation units that supply high-pressure air individually to each air levitation unit. A gas supply device may be used, or two or more gas supply devices respectively connected to a plurality of air levitation units may be used. In FIG. 5, the single gas supply apparatus 85 is shown on behalf of all of these. In any case, on / off of the supply of high-pressure air from the gas supply device 85 to each air levitation unit is individually controlled by the main controller 50.

  As is clear from the above description, in the present embodiment, the entire substrate P can be supported by being floated by the holder PH and at least one of the air floating unit groups 84A and 84B on both sides (± Y side) of the holder PH. . Further, the entire substrate P can be levitated and supported by the air levitation unit group 84A or 84B on one side (+ Y side or -Y side) of the holder PH.

  The air levitation unit groups 84A and 84B each have the same width in the Y-axis direction as that of the substrate P in the Y-axis direction and the length in the X-axis direction when the holder PH is moved by scanning. As long as it has a total support area that is almost the same as a rectangular area that is almost the same length as the range, it can be replaced with a single large air levitation unit. Unlike the case of 2, it may be distributed in the rectangular area.

  In the rectangular area where a plurality of air levitation units constituting each of the air levitation unit groups 84A and 84B are arranged, as shown in FIG. Two substrate X step feeding devices 91 are disposed asymmetrically with respect to the X axis passing through the center of the exposure area IA (the center of the projection optical system PL). Each of the substrate Y step feeding device 88 and the substrate X step feeding device 91 is arranged in the rectangular area without interfering with the air floating unit. Here, the number of substrate Y step feeding devices 88 may be two, or four or more.

  The substrate Y step feeding device 88 is a device for holding (for example, sucking) the substrate P and moving it in the Y-axis direction. In the plan view, the substrate Y step feeding device 88 is arranged in the X-axis direction inside each of the air levitation unit groups 84A and 88B. Three are arranged at predetermined intervals. Each substrate Y step feeding device 88 is fixed on a frame 110A or 110B via a support member 89 (see FIG. 4).

  Each substrate Y step feeding device 88 picks up one of the −Y sides and, as shown in FIG. 4, attracts the back surface of the substrate P and is fixed to the movable portion 88a that moves in the Y-axis direction and the frame 110A or 110B. Fixed portion 88b. As an example, the movable portion 88a is driven by a driving device 90 (not shown in FIG. 4, refer to FIG. 5) configured by a linear motor including a mover provided in the movable portion 88a and a stator provided in the fixed portion 88b. , Driven in the Y-axis direction with respect to the frame 110A or 110B. The substrate Y step feeding device 88 is provided with a position reading device 92 (not shown in FIG. 4, refer to FIG. 5) such as an encoder for measuring the position of the movable portion 88a. The drive device 90 is not limited to a linear motor, and may be configured by a drive mechanism that uses a rotary motor using a ball screw or a belt as a drive source.

  The movement stroke in the Y-axis direction of the movable portion 88a of each substrate Y step feeding device 88 is about 2/3 (somewhat short) of the length of the substrate P in the Y-axis direction.

  Further, since the movable portion 88a (substrate adsorption surface) of each substrate Y step feeding device 88 needs to adsorb the back surface of the substrate P or release the adsorption and separate it from the substrate P, the drive device 90 performs Z It is configured so that it can be driven minutely in the axial direction. Actually, the movable portion 88a adsorbs the substrate P and moves in the Y-axis direction. However, in the following description, the substrate Y step feeding device 88 and the movable portion 88a Are used without distinction.

  The substrate X step feeding device 91 is a device for holding (for example, adsorbing) the substrate P and moving it in the X-axis direction, and one substrate X step feeding device 91 is disposed in each of the air levitation unit groups 84A and 88B in plan view. . Each substrate X step feeding device 91 is fixed on a frame 110A or 110B via a support member 93 (see FIG. 4).

  As shown in FIG. 4, each substrate X step feeding device 91 includes a movable portion 91a that sucks the back surface of the substrate P and moves in the X-axis direction, and a fixed portion 91b fixed to the frame 110A or 110B. ing. The movable portion 91a is driven in the X-axis direction with respect to the frame 110A or 110B by a drive device 95 (not shown in FIG. 4, see FIG. 5) configured by, for example, a linear motor. The substrate X step feeding device 91 is provided with a position reading device 97 (not shown in FIG. 4, see FIG. 5) such as an encoder for measuring the position of the movable portion 91a. The drive device 95 is not limited to a linear motor, and may be configured by a drive mechanism that uses a rotary motor using a ball screw or a belt as a drive source.

  The movement stroke in the X-axis direction of the movable portion 91a of each substrate X step feeding device 91 is about twice the length of the substrate P in the X-axis direction. The + X side end of each fixing portion 91b protrudes from the air levitation unit group 84A, 84B to the + X side by a predetermined length.

  Further, since the movable portion 91a (substrate adsorption surface) of each substrate X step feeding device 91 needs to adsorb the back surface of the substrate P or release the adsorption to separate it from the substrate P, the drive device 95 performs Z It is configured so that it can be driven minutely in the axial direction. Actually, the movable portion 91a adsorbs the substrate P and moves in the X-axis direction. However, in the following, the substrate X step feeding device 91 and the movable portion 91a Are used without distinction.

  In the above description, since the movable parts of the substrate Y step feeding device 88 and the substrate X step feeding device 91 need to be separated from and contacted with the substrate P, they can also move in the Z-axis direction. However, the present invention is not limited to this, and the fine movement stage 26 may move in the Z-axis direction for the adsorption of the substrate P by the movable portion (substrate adsorption surface) and the separation from the substrate P.

  As shown in FIGS. 1 and 4, the weight canceling device 28 is composed of a columnar member extending in the Z-axis direction, and is also referred to as a core column. The weight canceling device 28 supports the fine movement stage 26 from below via a device called a leveling device described later. The weight canceling device 28 is disposed in the opening of the coarse motion table 32, and its upper half is exposed above the coarse motion table 32 and its lower half is exposed below the coarse motion table 32. .

  As shown in FIG. 4, the weight cancellation device 28 includes a housing 64, an air spring 66, a Z slider 68, and the like. The housing 64 is formed of a bottomed cylindrical member that is open on the + Z side. A plurality of air bearings (hereinafter referred to as “base pads”) 70 whose bearing surfaces face the −Z side are attached to the lower surface of the housing 64. The air spring 66 is housed inside the housing 64. Pressurized gas (for example, high-pressure air) is supplied to the air spring 66 from the outside. The Z slider 68 is made of, for example, a low-profile columnar member extending in the Z-axis direction, is inserted into the housing 64, and is placed on the air spring 66. The Z slider 68 is provided with a guide (not shown) for restricting movement in directions other than the Z-axis direction. For example, an air bearing or a parallel leaf spring is used as the guide. For example, the parallel leaf springs are arranged radially at the upper end and the lower end of the Z slider 68, and have a thickness parallel to the XY plane of the upper and lower three sheets (6 in total) connecting the Z slider 68 and the housing 64. It is constituted by a leaf spring made of a thin spring steel plate or the like. By using a parallel leaf spring (because the stroke is determined by the amount of deflection of the leaf spring, it is not possible to handle a long stroke as in the case of forming a guide with an air bearing), the Z slider 68 is short in the Z-axis direction. That is, a structure with a low height can be obtained. Further, as shown in FIGS. 1 and 4, a plurality of arms (referred to as “feelers”) 71 are radially arranged and fixed around the housing 64. A target plate 72 used in each of a plurality of light reflection sensors (also referred to as leveling sensors) 74 attached to the lower surface of the fine movement stage 26 is installed on the upper surface of the tip of each feeler 71. The light reflection sensors 74 are actually arranged at three or more places that are not on a straight line. A plurality of these light reflection sensors 74 constitute a Z tilt measurement system 76 (see FIG. 5) that measures the position of the fine movement stage 26 in the Z-axis direction and the tilt amount (rotation amount in the θx and θy directions). Yes. In FIG. 4, only one light reflection sensor 74 is shown in order to avoid complication of the drawing.

  The leveling device 78 is a device that supports the fine movement stage 26 so as to be tiltable on the Z slider 68 (swingable in the θx and θy directions with respect to the XY plane). The leveling device 78 has a spherical bearing or a pseudo spherical bearing structure schematically shown as a spherical member in FIG.

  In this case, the leveling device 78 has, for example, an upper surface (the upper half of the spherical surface) fixed to the fine movement stage 26, and allows the rotation (tilt) of the leveling device 78 in the θx and θy directions on the upper surface of the Z slider 68. The recessed part to be formed can be formed. Alternatively, the leveling device 78 has a lower surface (lower half of the spherical surface) fixed to the Z slider 68, for example, and a recess that allows the fine movement stage 26 to tilt in the θx direction and the θy direction with respect to the leveling device 78 is finely moved. It may be formed on the stage 26. In any case, the leveling device 78 is supported by the Z slider 68 from below and allows the fine movement stage 26 to tilt within a minute angle range around an axis (for example, the X axis and the Y axis) in the horizontal plane.

  The weight canceling device 28 cancels (cancels) the weight of the system including the fine movement stage 26 (downward force in the gravity direction) via the Z slider 68 and the leveling device 78 by the upward force in the gravity direction generated by the air spring 66. This reduces the load on the plurality of Z voice coil motors 54Z described above.

  The weight canceling device 28 is connected to the coarse motion table 32 via a pair of connecting devices 80 (see FIG. 1). The Z position of the pair of coupling devices 80 substantially coincides with the position of the center of gravity of the weight cancellation device 28 in the Z-axis direction. Each coupling device 80 includes a thin steel plate having a thickness parallel to the XY plane, and is also referred to as a flexure device. Each of the pair of connecting devices 80 is disposed opposite to the + X side and the −X side of the weight cancellation device 28. Each connecting device 80 is disposed between the casing 64 of the weight canceling device 28 and the coarse motion table 32 in parallel to the X axis, and connects the two. Accordingly, the weight canceling device 28 and the upper constituent parts (the fine motion stage 26 and the holder PH) supported by the weight canceling device 28 via the leveling device 78 are connected to the coarse motion table 32 via one of the pair of connecting devices 80. As a result of being pulled by the movement table 32, it moves integrally with the coarse movement table 32 in the X-axis direction. At this time, since the traction force acts on the weight cancellation device 28 in a plane parallel to the XY plane including the center of gravity position in the Z-axis direction, the moment around the axis (Y-axis) orthogonal to the moving direction (X-axis). (Pitching moment) does not work.

  As described above, in the present embodiment, the moving body (hereinafter referred to as a substrate as appropriate) including the coarse movement table 32, the weight canceling device 28, the fine movement stage 26, the holder PH, and the like and moving in the X-axis direction integrally with the substrate P. Stages (denoted as 26, 28, 32, PH) are configured.

  An example of the detailed configuration of the weight cancellation device 28 of the present embodiment including the leveling device 78 and the coupling device 80 is disclosed in, for example, US Patent Application Publication No. 2010/0018950 (however, In this embodiment, since the weight cancellation device 28 does not move in the Y-axis direction, a connecting device in the Y-axis direction is unnecessary). In the above U.S. Patent Application Publication, an air bearing called a sealing pad is provided on the upper surface of the Z slider 68, and the leveling device is supported in a non-contact manner from below by the sealing pad. Of course, this configuration may also be adopted in this embodiment.

  As shown in FIGS. 1, 2, and 4, the X guide 82 has a rectangular parallelepiped shape with the X axis direction as the longitudinal direction. The X guide 82 is disposed and fixed on the upper surfaces (+ Z side surfaces) of the pair of mounts 18 described above so as to cross the pair of mounts 18. The length in the longitudinal direction (X-axis direction) of the X guide 82 is the X-axis direction dimension of each of the pair of mounts 18 arranged at predetermined intervals in the X-axis direction and the X-axis direction dimension of the gap between the pair of mounts 18. It is set somewhat longer (almost equal) than the sum of

  The upper surface (the surface on the + Z side) of the X guide 82 is parallel to the XY plane and finished with a very high flatness. As shown in FIGS. 1 and 4, a weight canceling device 28 is mounted on the X guide 82 and supported to float (supported in a non-contact state) via a base pad 70. The upper surface of the X guide 82 is adjusted to be substantially parallel to the horizontal plane (XY plane), and functions as a guide surface when the weight cancellation device 28 moves. The longitudinal dimension of the X guide 82 is set to be somewhat longer than the movable amount of the weight canceling device 28 (that is, the coarse motion table 32) in the X axis direction. The width direction dimension (Y-axis direction dimension) of the upper surface of the X guide 82 is set to a dimension that can face all the bearing surfaces of the plurality of base pads 70 (see FIG. 4). The material and manufacturing method of the X guide 82 are not particularly limited. For example, when the X guide 82 is formed by casting, such as cast iron, when it is formed by stone (for example, gabbro), ceramics, or CFRP (Carbon Fiver Reinforced Plastics) ) It may be formed of materials. The X guide 82 is a solid member or a hollow member having a rib inside, and the shape thereof is formed by a rectangular parallelepiped member. The X guide 82 is not limited to a rectangular parallelepiped member, but may be a rod-shaped member having an I-shaped YZ cross section.

  As shown in FIGS. 1 and 2, the fine movement stage 26 has reflection surfaces orthogonal to the X-axis in the vicinity of the center in the X-axis direction on both sides in the Y-axis direction via movable mirror support parts (not shown). A pair of X movable mirrors 94X made up of plane mirrors (or corner cubes) are attached. The pair of X movable mirrors 94X is provided at a position lower than the upper surface (front surface) of the substrate P on the + X side than the −X side end surface of the holder PH, specifically, a position slightly lower than the lower surface of the holder PH. .

As shown in FIG. 4, on the side surface on the −Y side of fine movement stage 26, Y movable mirror 94Y composed of a long plane mirror having a reflecting surface orthogonal to the Y axis via a mirror holding part (not shown). Is fixed. Position information in the XY plane of fine movement stage 26 (holder PH) is a laser interferometer system (hereinafter referred to as a substrate stage interferometer system) 98 using a pair of X moving mirror 94X and Y moving mirror 94Y (see FIG. 5). ), For example, is always detected with a resolution of about 0.5 to 1 nm. Actually, the substrate stage interferometer system 98 includes a pair of X laser interferometers (hereinafter abbreviated as X interferometers) corresponding to the pair of X movable mirrors 94X as shown in FIGS. 98X ₁ , 98X ₂ , and a pair of Y laser interferometers (hereinafter abbreviated as Y interferometers) 98Y ₁ and 98Y ₂ corresponding to the Y moving mirror 94Y are provided. The measurement results of the X interferometers 98X ₁ and 98X ₂ and the Y interferometers 98Y ₁ and 98Y ₂ are supplied to the main controller 50 (see FIG. 5).

As shown in FIG. 4, each of the pair of X interferometers 98X ₁ and 98X ₂ has an L-shape when viewed from the + X direction in which one end portion (lower end portion) is fixed to the −X side frame 18. Are individually fixed to the other ends (upper ends) of the frames (X interferometer frames) 102A and 102B. Here, since L-shaped frames are used as the frames 102A and 102B, avoid interference between the frames 102A and 102B and the above-described frames 110A and 110B and the coarse motion table 32 moving in the X-axis direction. be able to.

The pair of X interferometers 98X ₁ and 98X ₂ are opposed to the pair of X moving mirrors 94X, and are positioned between the holder PH and the air levitation unit group 84A or 84B in the Y axis direction at a position lower than the upper surface of the substrate P. It is arranged at a position that fits in the gap. Thereby, in the substrate stage apparatus PST according to the present embodiment, the pair of X interferometers 98X ₁ and 98X ₂ is a base on the −X side as compared with the case where the pair of X interferometers 98X ₁ and 98X ₂ is installed outside the X axis direction movement range of the holder PH. It can be arranged at a position close to 18.

Further, a predetermined _{one of} the X interferometers 98X ₁ and 98X ₂ , for example, the X interferometer 98X _2, as shown in FIG. 1, two interferometer beams (measurement beams) separated in the Z-axis direction. Is used to irradiate the X moving mirror 94X. The reason for this will be described later.

The X interferometer is not limited to the pair of X interferometers 98X ₁ and 98X ₂ that individually irradiate the interferometer beam (measurement beam) to each of the pair of X movable mirrors 94X. It is also possible to use a multi-axis interferometer that emits a plurality of measurement beams including at least one measurement beam irradiated to each.

As shown in FIG. 2, the pair of Y interferometers 98Y ₁ and 98Y ₂ includes an air levitation unit row in the first row closest to the holder PH that constitutes the air levitation unit group 84B, and a second adjacent to the air levitation unit row. Arranged at a position facing two gaps between adjacent air levitation units between the air levitation unit rows in the row and in the vicinity of the center in the X-axis direction constituting the first air levitation unit row Has been. These two gaps are symmetrical with respect to the Y axis passing through the center of the exposure area IA. As shown in FIG. 4, the pair of Y interferometers 98Y ₁ and 98Y ₂ are arranged on the upper surface of the support member 104 installed on the upper surface of the frame 110B, facing the Y moving mirror 94Y, and an air floating unit group. The air levitation unit constituting 84B is separated and fixed (without contact). In the present embodiment, the Y moving mirror 94Y is irradiated with the measurement beam (length measurement beam) from the pair of Y interferometers 98Y ₁ and 98Y ₂ through the above-mentioned two gaps.

The Y interferometer is not limited to the pair of Y interferometers 98Y ₁ and 98Y ₂ that individually irradiate the Y moving mirror 94Y with the interferometer beam (measurement beam), and the Y moving mirror 94Y is irradiated with two measurement beams. A multi-axis interferometer can also be used.

In the present embodiment, the X interferometers 98X ₁ and 98X ₂ are arranged such that the surface of the substrate P in the Z-axis direction (the focus of the substrate P is such that this surface coincides with the image plane of the projection optical system PL during exposure). Since the position is lower than the position where leveling control is performed), the X position measurement result includes an Abbe error due to the attitude change (pitching) of the fine movement stage 26 when moving in the X-axis direction. The main controller 50 detects the pitching amount of the fine movement stage 26 by X interferometer 98x ₂ consisting of multi-axis interferometer described above, based on the detection result, the measurement of the X-position by X interferometer _98x 1, 98x ₂ The Abbe error included in the result is corrected. That is, such for Abbe error correction, as X interferometer 98x _2, irradiates two interferometer beams spaced in the Z-axis direction (measurement beam) to the X movable mirror 94X, i.e. detecting the pitching amount of the fine movement stage 26 Possible multi-axis interferometers are used.

Further, the positional information regarding the θx, θy, and the Z-axis direction of the fine movement stage 26 is the Z tilt measurement system 76 described above (three or more light reflection sensors 74 that are not on a straight line fixed to the lower surface of the fine movement stage 26). Thus, it is obtained using the target plate 72 at the tip of the feeler 71 described above. The configuration of the position measurement system of the fine movement stage 26 including the Z tilt measurement system 76 is disclosed in, for example, US Patent Application Publication No. 2010/0018950. Accordingly, when using an interferometer that does not detect the pitching amount of the fine movement stage 26 as the X interferometers 98X ₁ and 98X ₂ , the main controller 50 determines the fine movement stage 26 determined by the Z tilt measurement system 76. The Abbe error included in the measurement result of the X position by the X interferometers 98X ₁ and 98X ₂ may be corrected based on the position information (pitching amount) in the θx direction.

  In addition to this, a member (a part of the body, for example, the lens barrel surface plate 16) above the fine movement stage 26 that can be regarded as being integral with the projection optical system PL without measuring positional information regarding the θx, θy, and Z-axis directions of the fine movement stage 26 alone. The position information regarding the θx, θy, and Z-axis directions of the substrate P may be directly measured from above by a not-illustrated multi-point focus position detection system (focus sensor) fixed to (). Of course, position information regarding θx, θy, and the Z-axis direction between the substrate P and the fine movement stage 26 may be measured.

  As shown in FIGS. 1 and 2, and FIG. 3 from which a part of FIG. 2 is taken out, a plurality of, for example, eight alignment detection systems AL1 are provided at the lower end of the lens barrel surface plate 16 located above the holder PH. ~ AL8 is provided. The eight alignment detection systems AL1 to AL8 have, for example, the Y-axis direction and the X-axis direction as the row direction and the column direction, respectively, as indicated by the black circles in FIG. In two rows and four columns, four each are arranged on the + X side and the −X side of the projection optical system PL. In this case, alignment detection systems AL1 to AL4 belong to the first row on the -Y side, and alignment detection systems AL5 to AL8 belong to the second row on the + Y side. In addition, the alignment detection systems ALi and AL (i + 4) (i = 1, 2, 3, 4) belong to the i-th column (see FIG. 3).

  The holder PH can pass under the eight alignment detection systems AL1 to AL8 by the movement of the fine movement stage 26 in the X-axis direction. At least a part of the alignment detection systems AL1 to AL8 may be configured to change the position in the XY direction according to the arrangement (number of shots, number of chamfers) of the pattern area on the substrate P.

  Each of the alignment detection systems AL1 to AL8 has, for example, a microscope equipped with a CCD camera. When a mark previously provided at a predetermined position on the substrate P enters the field of view of the microscope, alignment measurement is performed by image processing. The mark position information (position displacement information in the XY plane) is sent to the main controller 50 that controls the position of the movable part of the substrate stage apparatus PST.

  FIG. 5 is a block diagram showing the input / output relationship of the main control device 50 that centrally configures the control system of the exposure apparatus 100 and controls the various components. In FIG. 5, each component related to the substrate stage system is shown. The main controller 50 includes a workstation (or a microcomputer) and the like, and comprehensively controls each part of the exposure apparatus 100.

  Next, a series of operations for substrate processing performed by the exposure apparatus 100 according to the present embodiment configured as described above will be described. Here, as an example, a case where the first and subsequent layers of the substrate P are exposed will be described with reference to FIGS. The exposure area IA shown in FIGS. 6 to 26 is an illumination area where the illumination light IL is irradiated through the projection optical system PL during exposure, and is not actually formed except during exposure. Is always shown in order to clarify the positional relationship between the substrate P and the projection optical system PL.

First, under the management of the main controller 50, the mask M is loaded onto the mask stage MST by a mask transfer device (mask loader) (not shown), and the substrate stage device PST is loaded by a substrate carry-in device (not shown). The substrate P is loaded (introduced) upward. Prior to exposure, a plurality of, for example, four marks in the X-axis direction and four in the Y-axis direction, for example, a total of 16 marks M ₁₁ , M are formed on the substrate P by, for example, a titler prior to exposure, as shown in FIG. ₁₂ ,..., M ₄₄ are marked (provided). These marks are marks M _j1 , M _j2 , M _j3 , M _j4 , M _{j + 1 1} , M _{j + 1 2} , M _{j + 1 3} , M _{j + 1 4} (j = 1, 2, 3). On the substrate P in an arrangement corresponding to the positional relationship in the horizontal plane of the detection visual field (hereinafter abbreviated as visual field) of the alignment detection systems AL1, AL2, AL3, AL4, AL5, AL6, AL7, AL8. It is marked. Accordingly, a total of eight marks in the j and j + 1 rows can be detected simultaneously and individually by the eight alignment detection systems AL1 to AL8.

  As shown in FIG. 6, the main controller 50 floats and supports the substrate P carried above the −Y side air floating unit group 84B by the substrate carry-in device using the air floating unit group 84B. The substrate is sucked and held by using the substrate X step feeding device 91 on the −Y side, and is conveyed in the −X direction as indicated by the black arrow in FIG.

  Next, the main controller 50 sucks and holds the substrate P levitated and supported by the air levitation unit group 84 </ b> B using the −Y side most + X side substrate Y step feeding device 88, and the substrate X with respect to the substrate P The suction by the step feeding device 91 is released. Then, main controller 50 transports substrate P in the + Y direction as shown by the dashed arrow in FIG.

Thereby, as shown in FIG. 7, the substrate P is placed across the holder PH and a part of the air floating unit group 84B on the −Y side of the holder PH. At this time, the substrate P is levitated and supported by the holder PH and a part of the air levitation unit group 84B. Then, the main controller 50 switches the holder PH from exhaust to suction. As a result, a part of the substrate P (about ３ of the entire substrate P) is sucked and fixed by the holder PH, and a part of the substrate P (the remaining approximately 2/2 of the entire substrate P is absorbed by a part of the air floating unit group 84B). 3) is in a state where it is supported by levitation. At this time, the substrate P is part of the holder PH and part of the air levitation unit group 84B so that at least two marks on the substrate P are in the field of view of any alignment detection system and on the holder PH. It is placed across. In FIG. 7, four marks M ₃₃ , M ₃₄ , M ₄₃ , and M ₄₄ are in the visual field of alignment detection systems AL1, AL2, AL5, and AL6, respectively.

  Immediately after the start of the suction operation of the substrate P by the holder PH, the main controller 50 releases the suction of the substrate P by the substrate Y step feeding device 88, and the substrate Y step feeding device 88 (movable portion 88a) It is returned to the standby position which is the movement limit position on the -Y side shown in FIG. At this time, the substrate X step feeding device 91 (movable portion 91a) is also returned to the standby position, which is the movement limit position on the -Y side shown in FIG.

  Thereafter, the position of fine movement stage 26 (holder PH) relative to projection optical system PL is obtained by main controller 50 by the same alignment measurement method as in the prior art. Here, the alignment measurement of the fine movement stage 26 with respect to the projection optical system PL is a measurement of a reference index (not shown) provided on the fine movement stage 26 by the alignment detection system AL, and alignment detection different from the alignment detection system. A system may be used.

Then, main controller 50 drives fine movement stage 26 via coarse movement table 32 based on the result of the above measurement (such as alignment measurement of fine movement stage 26 with respect to projection optical system PL), and at least on substrate P. Two marks are moved into the field of view of one of the alignment detection systems (in this case, the four marks M ₃₃ , M ₃₄ , M ₄₃ , and M ₄₄ are transferred to the alignment detection systems AL1, AL2, AL5, and AL6, respectively. The position is moved into the field of view of the detection system), the alignment measurement of the substrate P with respect to the projection optical system PL is performed, and the scan start position for the exposure of the first region on the substrate P is obtained based on the result. Here, since the scan for exposure includes an acceleration section and a deceleration section before and after the constant speed movement section during scanning exposure, the scan start position is strictly an acceleration start position. Then, main controller 50 drives coarse movement table 32 and finely moves fine movement stage 26 to position substrate P at its scan start position (acceleration start position). At this time, precise fine positioning drive in the X-axis, Y-axis, and θz directions (or 6-degree-of-freedom directions) is performed on the coarse movement table 32 of the fine movement stage 26 (holder PH). FIG. 8 shows a state immediately after the substrate P is positioned at the scan start position (acceleration start position) for exposure of the first region on the substrate P in this way.

  After that, a step-and-scan exposure operation is performed.

  In the step-and-scan type exposure operation, a plurality of regions on the substrate P are sequentially exposed. During the scanning operation, the substrate P is accelerated in the X-axis direction for a predetermined acceleration time, and then driven at a constant speed for a predetermined time (exposure (scan exposure) is performed during this constant speed driving), and then the same time as the acceleration time. (Hereinafter, a series of operations of the substrate P is referred to as an X scan operation). Further, the substrate is appropriately driven in the X-axis or Y-axis direction during the step operation (moving between shot areas) (hereinafter referred to as X-step operation and Y-step operation, respectively). In the present embodiment, the maximum exposure width (width in the Y-axis direction) of each shot area SAn (n = 1, 2, 3, 4, 5, 6) described later is about ３ of the substrate P.

  Specifically, the exposure operation is performed as follows.

  From the state of FIG. 8, the substrate stage (26, 28, 32, PH) is driven in the −X direction as indicated by the white arrow in FIG. At this time, the mask M (mask stage MST) is driven in the −X direction in synchronization with the substrate P (fine movement stage 26), and the first region (exposure target region) is the mask M formed by the projection optical system PL. In this case, scanning exposure is performed on the first area. The scanning exposure is performed by irradiating the substrate P with the illumination light IL through the mask M and the projection optical system PL while the fine movement stage 26 (holder PH) is moving in the −X direction at a constant speed.

  During the above-described X scan operation, main controller 50 adsorbs and fixes a part of substrate P (about 1/3 of the entire substrate P) to holder PH mounted on fine movement stage 26 and places it on air floating unit group 84B. The substrate stage (26, 28, 32, PH) is driven in a state where a part of the substrate P (about 2/3 of the entire substrate P) is levitated and supported. At this time, the main controller 50 drives the coarse movement table 32 in the X-axis direction via the X linear motor 42 based on the measurement result of the X linear encoder system 46, and the substrate stage interferometer system 98, Z tilt Based on the measurement result of measurement system 76, fine movement stage drive system 52 (each voice coil motor 54X, 54Y, 54Z) is driven. Thereby, the substrate P is integrated with the fine movement stage 26 and is lifted and supported on the weight canceling device 28 and is pulled by the coarse movement table 32 to move in the X-axis direction. With relative driving, the position is precisely controlled in each of the X-axis, Y-axis, Z-axis, θx, θy, and θz directions (6 degrees of freedom direction). Further, in the X-scan operation, main controller 50 synchronizes with fine movement stage 26 (holder PH), and sets mask stage MST holding mask M in the X-axis direction based on the measurement result of mask interferometer system 14. And is finely driven in the Y-axis direction and the θz direction. FIG. 9 shows a state in which the scanning exposure for the first region is completed and the substrate stage (26, 28, 32, PH) holding a part of the substrate P is stopped. By this exposure, a shot area SA1 in which the sensitive layer is exposed is formed on the substrate P.

  Next, a Y-step operation for moving the unexposed area of the substrate P onto the holder PH is performed. The Y step operation of the substrate P is performed by the main controller 50 in the state shown in FIG. 9 by the substrate Y step feeding device 88 (movable part 88a) located on the −Y side and in the middle of the X axis direction. The state in which the back surface of the P is sucked and held, the suction of the holder PH to the substrate P is released, and then the substrate P is levitated by the exhaust of high pressure air from the holder PH and the subsequent high pressure air exhaust by the air levitation unit group 84B Then, as shown by the black arrow in FIG. 9, the substrate P is fed by the substrate Y step feeding device 88 in the + Y direction. As a result, only the substrate P moves in the + Y direction with respect to the holder PH. As shown in FIG. 10, the substrate P is exposed to the unexposed second region (exposure) adjacent to the shot region SA1 on the −Y side. (Target area) (and the area adjacent to the + X side) are opposed to the holder PH, and are placed across the holder PH, a part of the air levitation unit group 84A, and a part of the air levitation unit group 84B. It becomes. At this time, the substrate P is levitated and supported by the holder PH, a part of the air levitation unit group 84A, and a part of the air levitation unit group 84B. Then, the main controller 50 switches the holder PH from exhaust to intake (suction). Thereby, a part of the substrate P (about 1/3 of the whole substrate P) is sucked and fixed by the holder PH, and a part of the substrate P is formed by a part of the air levitation unit group 84A and a part of the air levitation unit group 84B. (The remaining approximately 2/3 of the entire substrate P) is supported in a floating state.

  Then, new alignment measurement of the substrate P with respect to the projection optical system PL, that is, measurement of a mark for the next shot area provided in advance on the substrate P is performed. In this alignment measurement, the X step operation of the substrate P is performed as necessary so that the mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 10). In the X step operation of the substrate P, the main controller 50 drives the substrate stage (26, 28, 32, PH) in the same state as the X scan operation (however, the positional deviation during movement is as strict as the scan operation). Do not regulate).

In alignment measurement, as shown in FIG. 11, main controller 50 uses marks M ₂₃ , M ₂₄ , M ₃₃ , and M ₃₄ simultaneously using alignment detection systems AL3, AL4, AL7, and AL8, respectively. Detect individually. Here, a portion of the plurality of marks to be measured, prior to alignment detection system AL1, marks _M 33 whose position is detected by _AL2, includes a _{M 34,} and the two marks _{M 33, M 34} Are detected by other alignment detection systems AL7 and AL8 whose positional relationship with the alignment detection systems AL1 and AL2 is known. Therefore, even if the substrate P is once removed from the holder PH, new alignment measurement for exposure of the second region can be performed with high accuracy without any trouble.

  Then, when the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50 determines the scan start position (acceleration start) for exposure of the second region on the substrate P based on the result. To the coarse movement table 32 of the fine movement stage 26 is performed in the X axis, the Y axis, and the θz direction (or the direction of 6 degrees of freedom). FIG. 12 shows a state in which the holder PH (fine movement stage 26) is positioned at the scan start position in this way.

  The main controller 50 then accelerates the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) in the + X direction, as indicated by white arrows in FIG. Then, scan exposure is performed in the same manner as described above. FIG. 13 shows a state in which the scanning exposure for the second region is completed and the substrate stage (26, 28, 32, PH) is stopped. By this exposure, a shot area SA2 in which the sensitive layer is exposed is formed on the substrate P.

  Next, a Y-step operation for moving the unexposed area of the substrate P onto the holder PH is performed. This Y step operation of the substrate P is performed by the main controller 50 on the back side of the substrate P in the state shown in FIG. 13 by the substrate Y step feeding device 88 (movable portion 88a) positioned on the −Y side and in the + X direction. Is released and the substrate P is lifted by releasing high-pressure air from the holder PH and continuing high-pressure air exhaust by the air levitation unit groups 84B and 84A. Thus, as shown by black arrows in FIGS. 13 and 14, the substrate P is transferred by the substrate Y step feeding device 88 in the + Y direction. At this time, when the stroke of the −Y side substrate Y step feeding device 88 is short, the main controller 50 may take over the feeding of the substrate P using the + Y side substrate Y step feeding device 88. Good (see black arrow in FIG. 15). In preparation for this takeover, the main controller 50 may drive the + Y-side substrate Y step feeding device 88 (movable portion 88a) in the −Y direction in advance and wait in the vicinity of the holder PH (see FIG. 13, see FIG.

  By the Y step operation of the substrate P, only the substrate P moves in the + Y direction with respect to the holder PH. As shown in FIG. 15, the substrate P is unexposed adjacent to the shot area SA2 on the −Y side. The third region (exposure target region) (and the region adjacent to the + X side) faces the holder PH, and is placed across the holder PH and a part of the air levitation unit group 84A. . At this time, the substrate P is levitated and supported by the holder PH and a part of the air levitation unit group 84A.

  Then, the main controller 50 switches the holder PH from exhaust to intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is sucked and fixed by the holder PH, and a part of the substrate P (the remaining approximately 2/2 of the entire substrate P is absorbed by a part of the air floating unit group 84A). 3) is in a state where it is supported by levitation.

  Then, new alignment measurement of the substrate P with respect to the projection optical system PL, that is, measurement of a mark for the next region provided in advance on the substrate P is performed. In this alignment measurement, the X step operation of the substrate P is performed as necessary so that the mark to be measured is positioned within the detection visual field of the alignment detection system.

In alignment measurement, as shown in FIG. 15, main controller 50 uses marks M ₁₃ , M ₁₄ , M ₂₃ , and M ₂₄ simultaneously using alignment detection systems AL1, AL2, AL5, and AL6, respectively. Detect individually. Here, a portion of the plurality of marks to be measured, prior to alignment detection system AL3, positions are included marks _{M 23, M 24} detected by AL4, and the two marks _{M 23, M 24} Are detected by the other alignment detection systems AL5 and AL6 whose positional relationship with the alignment detection systems AL3 and AL4 is known. Therefore, even if the substrate P is once removed from the holder PH, new alignment measurement for exposure of the third region can be performed with high accuracy without any trouble.

  Then, when the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50 determines the scan start position (the acceleration start) for the exposure of the first region on the substrate P based on the result. Position), and as shown by the white arrow in FIG. 15, the −X direction of the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) Acceleration is started, and scan exposure is performed in the same manner as described above. FIG. 16 shows a state in which the scanning exposure for the third region is completed and the substrate stage (26, 28, 32, PH) is stopped. By this exposure, a shot area SA3 where the sensitive layer is exposed is formed on the substrate P.

Next, in preparation for acceleration for the next exposure, main controller 50 performs the X step operation of substrate P that slightly drives substrate P in the + X direction, as indicated by the white arrow in FIG. In the middle, as shown in FIG. 17, marks M ₁₁ , M ₁₂ , M ₁₃ , M 3, M ₈ , AL 8, AL 5, AL 6, AL 7, AL 8 are detected in the detection field of view. M ₁₄ , M ₂₁ , M ₂₂ , M ₂₃ , M ₂₄ are positioned, and for example, four marks, for example, marks M ₁₃ , M ₂₁ , M ₂₂ , M ₂₃ are aligned with alignment detection systems AL3, AL5, AL6, AL7. To detect simultaneously and individually. In this case, since the substrate P is not detached from the holder PH after the exposure of the shot area SA3, the substrate may be positioned for the next exposure based on the previous alignment result. However, once the substrate P is once removed from the holder PH, alignment of the next substrate becomes difficult. Therefore, in order to prevent such a situation from occurring, the positions of a plurality of marks including the marks M ₂₁ and M ₂₂ are detected by the alignment measurement described above. In this case, in addition, the marks M ₁₃ and M ₂₃ whose positions have been previously detected by the alignment detection systems AL1 and AL5 are included in some of the plurality of marks to be measured, and the two marks M ₁₃ , the M _23, the positional relationship between the alignment detection system AL1, AL5 is detected at a known different alignment detection system AL3, AL7. Therefore, even if the substrate P is once removed from the holder PH after exposure of the shot area SA3, new alignment measurement for exposure of the fourth area can be performed with high accuracy without any trouble.

  Based on the alignment result, main controller 50 positions holder PH (fine movement stage 26) at the acceleration start position for the fourth exposure, and ends the X step. Main controller 50 returns mask stage MST to the acceleration start position in parallel with the X-step operation of substrate P.

  Then, main controller 50 starts acceleration in the −X direction of substrate P (substrate stage (26, 28, 32, PH)) and mask M (mask stage MST), and scan exposure in the same manner as described above. To do. FIG. 18 shows a state where the scanning exposure for the fourth region on the substrate P is completed and the substrate stage (26, 28, 32, PH) is stopped. By this exposure, a shot area SA4 where the sensitive layer is exposed is formed on the substrate P.

  Next, a Y-step operation for moving the unexposed area of the substrate P onto the holder PH is performed. In the Y step operation of the substrate P, the main controller 50 moves the back surface of the substrate P in the state shown in FIG. 18 by the + Y side and the most -X side substrate Y step feeding device 88 (movable part 88a). In the state where the substrate P is lifted and held by releasing the suction of the holder PH to the substrate P, and then the substrate P is floated by exhausting the high-pressure air from the holder PH and continuing high-pressure air exhaust by the air levitation unit group 84A. As indicated by a black arrow in FIG. 18, the substrate P is transferred by the substrate Y step feeding device 88 in the −Y direction. At this time, if the stroke of the + Y side substrate Y step feeding device 88 is short, the main controller 50 may take over the feeding of the substrate P using the −Y side substrate Y step feeding device 88. Good (see black arrow in FIG. 19). In preparation for this takeover, the main controller 50 may drive the + Y-side substrate Y step feeding device 88 (movable portion 88a) in the −Y direction in advance and wait in the vicinity of the holder PH (see FIG. 18). As a result, only the substrate P moves in the −Y direction with respect to the holder PH, and as shown in FIG. 19, the fifth region adjacent to the shot region SA2 on the substrate P and the shot region SA2 on the + X side. Faces the holder PH, and the substrate P is placed across the holder PH, part of the air levitation unit group 84A, and part of the air levitation unit group 84B. At this time, the substrate P is levitated and supported by the holder PH, a part of the air levitation unit group 84A, and a part of the air levitation unit group 84B. Then, the main controller 50 switches the holder PH from exhaust to intake (suction). Thereby, a part of the substrate P (about 1/3 of the whole substrate P) is sucked and fixed by the holder PH, and a part of the substrate P is formed by a part of the air levitation unit group 84A and a part of the air levitation unit group 84B. (The remaining approximately 2/3 of the entire substrate P) is supported in a floating state.

  Then, new alignment measurement of the substrate P with respect to the projection optical system PL, that is, measurement of a mark for the next region provided in advance on the substrate P is performed. In this alignment measurement, an X-step operation is performed as necessary so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system.

In alignment measurement, as shown in FIG. 20, main controller 50 uses marks M ₂₁ , M ₂₂ , M ₃₁ , and M ₃₂ simultaneously using alignment detection systems AL3, AL4, AL7, and AL8, respectively. Detect individually. Here, a portion of the plurality of marks to be measured, a mark position alignment detection system AL5, AL6 previously is detected M21, M22 are included, and the two marks _{M 21, M 22} is, It is detected by another alignment detection system AL3, AL4 whose positional relationship with the alignment detection systems AL5, AL6 is known. Therefore, even if the substrate P is once removed from the holder PH, new alignment measurement for exposure of the fifth region can be performed with high accuracy without any trouble.

  Then, when the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50 determines, based on the result, the X-axis, Y-axis, and θz directions (or the z-axis direction relative to the coarse movement table 32 of the fine movement stage 26 (or Precise fine positioning drive in the direction of 6 degrees of freedom is performed.

  Next, as indicated by a white arrow in FIG. 20, the main controller 50 starts acceleration in the + X direction of the substrate P and the mask M, and scan exposure similar to that described above is performed. FIG. 21 shows a state in which the scan exposure for the fifth region on the substrate P is completed and the substrate stage (26, 28, 32, PH) is stopped. By this exposure, a shot area SA5 where the sensitive layer is exposed is formed on the substrate P.

  Next, a Y-step operation for moving the last unexposed area of the substrate P onto the holder PH is performed. In the Y step operation of the substrate P, the main controller 50 moves the substrate Y step feeding device 88 (movable part) in which the back surface of the substrate P in the state shown in FIG. 88a), the substrate PH is lifted by releasing high-pressure air from the holder PH and continuing high-pressure air exhausting by the air levitation unit groups 84A and 84B. In this state, the substrate P is transported in the −Y direction by the substrate Y step feeding device 88 as indicated by a black arrow in FIG. Thereby, only the board | substrate P moves to a Y-axis direction with respect to the holder PH (refer FIG. 22).

  The substrate P, which is driven in the −Y direction by the substrate Y step feeding device 88 and the last unexposed shot region and the shot region SA1 adjacent thereto moved onto the holder PH, is a part of the substrate P (the entire substrate P). About 1/3) is fixed to the holder PH again by suction by the holder PH, and a part (the remaining about 2/3 of the entire substrate P) is levitated and supported by a part of the air levitation unit group 84B. Then, new alignment measurement of the substrate P with respect to the projection optical system PL, that is, measurement of a mark for the next region provided in advance on the substrate P is performed. In this alignment measurement, the X-step operation of the substrate P described above is performed as necessary so that the measurement target mark is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 22).

In alignment measurement, as shown in FIG. 23, main controller 50 uses marks M ₃₁ , M ₃₂ , M ₄₁ , and M ₄₂ simultaneously using alignment detection systems AL1, AL2, AL5, and AL6, respectively. Detect individually. Here, a portion of the plurality of marks to be measured, includes a mark _{M 31, M 32} to the position in alignment detection system AL7, AL8 above is detected, and the two marks _{M 31, M 32} Are detected by other alignment detection systems AL1 and AL2 whose positional relationship with the alignment detection systems AL7 and AL8 is known. Therefore, even when the substrate P is once removed from the holder PH, new alignment measurement for exposure of the sixth region can be performed with high accuracy without any trouble.

  Then, when the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50 determines, based on the result, the scan start position (acceleration start) for the exposure of the sixth region on the substrate P. 24) (including precise fine positioning in the X-axis, Y-axis, and θz directions (or 6-degree-of-freedom directions) with respect to the coarse movement table 32 of the fine movement stage 26). As shown in FIG. 2, acceleration in the −X direction of the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) is started, and scan exposure is performed in the same manner as described above. . FIG. 25 shows a state in which the scan exposure for the sixth region on the substrate P is completed and the substrate stage (26, 28, 32, PH) is stopped. By this exposure, a shot area SA6 where the sensitive layer is exposed is formed on the substrate P.

  On the other hand, immediately before the new alignment measurement of the substrate P is started, as shown in FIG. 23, a new substrate P is carried (introduced) onto the air levitation unit group 84A by a substrate carry-in device (not shown). ing. At this time, the movable portion 91a of the + Y side substrate X step feeding device 91 moves to a position near the + X side movement limit position, that is, a position below the newly loaded substrate P, and waits at that position. ing.

  In parallel with the exposure for the shot area SA6, the newly introduced substrate P is sucked and held by the main controller 50 at the −Y side substrate X step feeding device 91 and conveyed to the −X side. (See FIG. 24).

  On the other hand, the substrate P for which all the shot areas SA1 to SA6 have been exposed is indicated by a dotted line in FIG. 25 by the main controller 50 using the substrate Y step feeding device 88 on the -Y side and the most -X side. As indicated by the white arrow, it is conveyed to the -Y side, completely retracted from the holder PH, and carried onto the air levitation unit group 84B (see FIG. 26). At almost the same time, the newly introduced substrate P is blacked out by the main controller 50 using the + Y side and the most -X side substrate Y step feed device 88 in FIG. 25 and FIG. As indicated by the arrow, it is conveyed to the -Y side, a part (1/3 part) on the -Y side is positioned on the holder PH, and a part thereof is adsorbed (fixed) by the holder PH. (See FIG. 26).

  The exposed substrate P carried on the air levitation unit group 84 </ b> B is used by the main controller 50 using the −Y side substrate X step feeder 91 as shown by the black arrow in FIG. 26. , In the + X direction, and unloaded in the + X direction by a substrate unloading device (not shown).

  In parallel with the unloading of the exposed substrate P, the substrate P partially fixed to the holder PH is subjected to the same alignment operation as described above, and then + X between the substrate P and the mask M. The acceleration in the direction is started, and scan exposure is performed on the first area (the area on the most -Y side and + X side) in the same manner as described above. Thereafter, in the same procedure as the exposure for the first substrate P described above, the alignment (X step, Y step) for the remaining region on the second substrate P, the exposure operation, etc. Operations such as alignment (X step, Y step) and exposure with respect to the third and subsequent substrates are repeated.

  However, for the second substrate P, the region on the most -Y side and + X side on the substrate that has been exposed fourth on the first substrate is exposed first. As can be seen from the description, in this embodiment, the exposure order of the shot areas is different between the first (odd-numbered) substrate P and the second (even-numbered) substrate P. In the first (odd-numbered) substrate P, the exposure order is the shot areas SA1, SA2, SA3, SA4, SA5, and SA6, whereas in the second (even-numbered) substrate P, the exposure order. Are in the order of shot areas SA4, SA5, SA6, SA1, SA2, and SA3. In this case, the first (odd-numbered) substrate P is carried into the holder PH from the -Y side and is carried out from the holder PH to the -Y side. On the other hand, the second (even-numbered) substrate P is carried into the holder PH from the + Y side, and is carried out from the holder PH to the + Y side. However, the order of exposure and the loading / unloading direction of the substrate P with respect to the holder PH are not limited to this.

  As described above, according to the exposure apparatus 100 according to the present embodiment, the main controller 50 moves the substrate P in the XY plane stepwise (Y step or X) every time a shot region is formed on the substrate P. Step position), and before and after the step movement, position information of a plurality of marks including at least two identical marks (marked marks) on the substrate P is detected using a part of the alignment detection systems AL1 to AL8. Based on the detection result of the position information of these marks, that is, the result of the alignment measurement, the substrate P is brought to the exposure position (exposure area IA) when the processing area on the substrate P is exposed (formation of the shot area). Align with respect to. For this reason, not only when performing the X step operation of the substrate P that moves the substrate P integrally with the holder PH in the X-axis direction, only the substrate P is transferred to the holder PH by using the substrate Y step feeding device 88. When performing a Y step operation for moving in the axial direction, that is, when the substrate P is once removed from the holder PH during the step movement, the substrate P can be moved to the exposure position (exposure area IA) without any trouble when forming the shot area. On the other hand, it is possible to align with high accuracy. Therefore, when exposing almost the entire surface of the substrate P, there is no particular problem even if a holder PH having a holding surface smaller than the substrate P, which is premised on removal of the substrate P in the middle, is employed.

  Further, according to the exposure apparatus 100 according to the present embodiment, the holder PH mounted on the fine movement stage 26 holds a part of the surface of the substrate P opposite to the exposure surface (processing surface). That is, the substrate holding surface of the holder PH is smaller than the substrate P, specifically, is set to about 1/3. Therefore, based on the instruction from the main controller 50, when the substrate Y step feeding device 88 carries the substrate P out of the fine movement stage 26 (holder PH), the substrate P is moved in the XY plane so as to be displaced in the Y axis direction. In this case, the substrate Y step feeding device 88 is a distance smaller than the size (width or length) of the substrate P in the Y-axis direction, that is, about 1/3 of the size of the substrate P in the Y-axis direction. By simply displacing the substrate P in the Y-axis direction by the same distance as the width of the holder PH in the Y-axis direction, the unloading of the substrate P is completed (see, for example, FIGS. 25 and 26). Thus, in this embodiment, since the movement distance (carrying distance) of the board | substrate at the time of carrying out the board | substrate P is smaller than the size of a board | substrate, it becomes possible to shorten board | substrate carrying-out time compared with the past. .

  Further, according to the exposure apparatus 100 according to the present embodiment, the fine movement stage 26 (holder PH) is located at one position in the X-axis direction at the time when the scanning exposure for the final shot area on the substrate P is completed, and one side in the Y-axis direction. Then, the exposed substrate P is slid and carried out (retracted) from the holder PH, and in parallel (almost simultaneously), the substrate P before exposure is slid from the other side in the Y-axis direction and carried onto the holder PH. (See FIG. 25 and FIG. 26).

  Further, when the substrate P before exposure is carried into the fine movement stage 26 (holder PH), the substrate P is moved by the substrate Y step feeding device 88 based on the instruction of the main controller 50 so that the substrate P is displaced in the Y-axis direction. The substrate Y step feeding device 88 is transported in the XY plane at that time, and the substrate Y step feeding device 88 has a distance smaller than the size (width or length) of the substrate P in the Y axis direction, that is, the width of the holder PH in the Y axis direction (substrate). The loading of the substrate P is completed simply by displacing the substrate P in the Y-axis direction by the same distance as about 1/3 of the size of P in the Y-axis direction. Therefore, in addition to the substrate carry-out time, the substrate carry-in time can be shortened compared to the conventional case, and as a result, the substrate exchange time can be shortened.

  In the exposure apparatus 100, the main controller 50 controls the Y axis from the holder PH of the substrate P at the position in the X axis direction of the holder PH according to the arrangement of the shot areas to be formed on the substrate P and the order of exposure. Slide out in one direction is performed. Further, the main controller 50 determines the position of the shot region to be formed on the substrate P and the position of the holder PH in the X-axis direction according to the exposure order from the other side in the Y-axis direction on the holder PH of the substrate P. Slide loading is performed. Further, the main controller 50 starts measurement for alignment with respect to the exposure position of the substrate P at the position in the X-axis direction of the substrate P loaded in the slide, that is, measurement of the aforementioned mark. That is, the alignment detection system used for mark measurement after the substrate P is carried in is determined so that the alignment measurement is started in the shortest time according to the arrangement of the shot areas to be formed on the substrate P and the exposure order. ing.

  Therefore, according to the exposure apparatus 100 according to the present embodiment, the holder PH needs to move to a predetermined substrate replacement position (for example, a position near the movement limit position in the + X direction) as in the conventional substrate replacement. Thus, the substrate replacement time can be further shortened. In addition, the alignment measurement can always be started in the shortest time regardless of the position of the holder PH where the substrate is exchanged, and in this respect also, the throughput can be improved.

  In the above embodiment, the first (odd-numbered) substrate P is carried into the holder PH from the -Y side and carried out from the holder PH to the -Y side. On the other hand, the second (even-numbered) substrate P is carried into the holder PH from the + Y side, and is carried out from the holder PH to the + Y side. As a result, it is possible to carry out the substrate P from the holder PH in the shortest time for both the odd-numbered substrates P and the even-numbered substrates P.

  Here, in the description of the above embodiment, the case where the exposed substrate P is carried out from the holder PH in the opposite direction between the odd-numbered substrate and the even-numbered substrate is exemplified. Depending on the arrangement of the shot regions to be formed and the order of exposure, the substrate may be unloaded from the holder PH in the −Y direction (or + Y direction) on both the even and odd substrates. Of course this is possible. That is, in the present embodiment, the main controller 50 determines the position of the shot region to be formed on the substrate P and the position of the holder PH in the X-axis direction according to the exposure order so that the substrate replacement time is minimized. Then, the substrate P is unloaded in a direction corresponding to the arrangement of shot areas to be formed on the substrate P and the order of exposure. Therefore, regardless of the arrangement of shot areas (processed areas) to be formed on the substrate and the order of processing, the substrate replacement time can be shortened compared to the case of always carrying out at the constant X position in the same direction. It is.

  In the exposure apparatus 100, the alignment mark is transferred together with the mask pattern for each shot region on the substrate P during the exposure of the first layer. For this reason, in the exposure apparatus 100, when performing exposure on the substrate P from the second layer onward, the alignment measurement similar to the conventional one is performed using those alignment marks, and based on the measurement result. Then, the position control of the substrate P during the exposure (including the X scan, the X step, and the Y step) is performed.

  In the exposure apparatus 100 according to this embodiment, the substrate holding surface (substrate mounting surface) of the holder PH on which the substrate P is placed and sucked and held in a state where the flatness of the substrate P is ensured is a conventional holder. Since the area of about 1/3 is sufficient, the holder PH can be reduced in size and weight. Further, the fine movement stage 26 that supports the lighter holder PH is also reduced in size and weight, and the high speed, high acceleration / deceleration drive, and position controllability of the fine movement stage 26 by the voice coil motors 54X, 54Y, and 54Z can be improved. It becomes. Further, by reducing the size of the holder PH, the processing time for flatness of the substrate holding portion is shortened, and the processing accuracy is improved. In the present embodiment, the fine movement stage 26 does not move stepwise in the Y-axis direction, is pulled by the coarse movement table 32 and moves with a long stroke in the X-axis direction, and has six degrees of freedom with respect to the coarse movement table 32. Is driven slightly. Therefore, the coarse motion table 32 only needs rough driving accuracy, and the structure thereof is simple, and can be reduced in size, weight, and cost. Further, during the Y step operation of the substrate P, the substrate Y step feeding device 88 moves only the substrate P in the Y-axis direction with rough accuracy. Therefore, the structure of the substrate Y step feeding device 88 may be simple, and can be reduced in size, weight, and cost.

  Further, the substrate stage apparatus PST provided in the exposure apparatus 100 according to the present embodiment is effective for a multi-planar layout in which a plurality of shot areas are arranged on the substrate P in the cross scan direction (Y-axis direction).

  Further, the size in the Y-axis direction of the support surfaces of the air levitation unit groups 84A and 84B on both sides in the Y-axis direction of the holder PH is not limited to the size in the Y-axis direction of the substrate P, and may be larger than that. It may be slightly smaller.

  In the above-described embodiment, a case where marks used for alignment of the substrate P are formed in a portion other than a region where a shot region is formed after exposure corresponding to the arrangement of the visual fields of the alignment detection systems AL1 to AL8 is illustrated. However, the present invention is not limited to this. For example, when the field of view of a plurality of alignment detection systems is fixed, the plurality of alignment detection systems can detect the outer periphery of a region where a plurality of shot regions are formed. In the arrangement, the mark may be formed by a titler. Alternatively, marks may be provided on the back surface of the substrate P in an arrangement that allows detection with a plurality of alignment detection systems. In this case, the plurality of alignment detection systems are provided, for example, inside the holder PH.

  Further, in the above embodiment, in order to prevent the occurrence of alignment errors due to the rotation of the substrate P, at least two identical marks are detected by different alignment detection systems with known positional relationships before and after the stepping of the substrate P. However, the present invention is not limited to this. For example, when the rotation of the substrate P hardly occurs or the rotation of the substrate P can be ignored, at least one same mark is placed before and after the stepping of the substrate P. It may be detected by a different alignment detection system having a known relationship.

  In the above-described embodiment, the case where the weight canceling device (the core column) is integrated with the fine movement stage is described. However, the present invention is not limited to this and may be separated from the fine movement stage. There is no need for a target feeler for the leveling sensor. Further, the leveling mechanism and the weight cancellation mechanism may be arranged upside down. Thus, the structure of the weight cancellation device is not limited to the above-described embodiment.

<Modification>
In the exposure apparatus of the above embodiment, a frame-like substrate support member that can hold the substrate P integrally and can be floated integrally with the substrate P by an air floating unit may be used. As an example, a case where this substrate support member is applied to an exposure apparatus having the same configuration as the exposure apparatus 100 according to the first embodiment will be described with reference to FIG.

  As shown in FIG. 27, the substrate support member 69 has a rectangular (substantially square) outline in plan view, and has a rectangular opening in plan view penetrating in the Z-axis direction at the center. It consists of a frame-shaped member with small dimensions (thin). The substrate support member 69 has a pair of X frame members 61x, which are flat members parallel to the XY plane with the X axis direction as the longitudinal direction, at a predetermined interval in the Y axis direction. Each of the + X side and −X side ends is connected by a Y frame member 61y which is a flat plate member parallel to the XY plane whose longitudinal direction is the Y-axis direction. Each of the pair of X frame members 61x and the pair of Y frame members 61y is made of, for example, a fiber reinforced synthetic resin material such as GFRP (Glass Fiber Reinforced Plastics), or ceramics to ensure rigidity and reduce weight. From the viewpoint of

  On the upper surface of the −Y side X frame member 61x, a Y movable mirror 194Y composed of a plane mirror having a reflective surface on the −Y side surface is fixed. Further, an X movable mirror 194X composed of a plane mirror having a reflecting surface on the −X side surface is fixed to the upper surface of the −X side Y frame member 61y. In this case, neither the holder PH nor the fine movement stage 26 may be provided with the X moving mirror and the Y moving mirror.

Position information (including rotation information in the θz direction) of the substrate support member 69 (that is, the substrate P) in the XY plane is a pair of X interferometers 98X ₁ and 98X that irradiate a measuring beam onto the reflection surface of the X movable mirror 194X. ₂ and the above-described substrate stage interferometer system 98 including a pair of Y interferometers 98Y ₁ and 98Y ₂ that irradiate a measuring beam onto the reflecting surface of the Y moving mirror 194Y, and is always detected with a resolution of about 0.5 nm, for example. The In this modification, the Y interferometers 98Y ₁ and 98Y ₂ are attached to the side frame 20 on the −Y side of the air levitation unit group 84B, and the space above the optical path of the Y interferometer of the first embodiment is used. Then, a length measuring beam parallel to the Y axis is irradiated onto the Y moving mirror 194Y.

  Note that the number of X interferometers and / or Y interferometers is such that at least one length measuring beam is irradiated to the corresponding movable mirror within the movable range of the substrate support member 69. The number of optical axes or the interval is set. Therefore, the number of interferometers (number of optical axes) is not limited to two, and depending on the movement stroke of the substrate support member, for example, only one (one axis), or three (three axes) or more good.

  The substrate support member 69 has a plurality of, for example, four holding units 65 that hold the end portion (outer peripheral edge portion) of the substrate P by vacuum suction from below. The four holding units 65 are attached to the opposing surfaces of each of the pair of X frame members 61x so as to be separated from each other in the X axis direction. Note that the number and arrangement of the holding units are not limited to this, and may be appropriately added according to the size of the substrate, the ease of bending, and the like. The holding unit may be attached to the Y frame member. The holding unit 65 has, for example, an L-shaped substrate mounting member provided with a suction pad for vacuum suction of the substrate P on its upper surface, and a parallel connecting the substrate mounting member to the X frame member 61x. A plate spring, the position of the substrate mounting member with respect to the X frame member 61x in the X-axis direction and the Y-axis direction is constrained by the rigidity of the parallel leaf springs, and the elasticity of the leaf springs It is configured to be displaced (moved up and down) in the Z-axis direction without rotating in the θx direction. A substrate holding frame having the same configuration as the holding unit 65 and the substrate support member 69 provided with the holding unit 65 is disclosed in detail in, for example, US Patent Application Publication No. 2011/0042874.

  In the modification of FIG. 27, when the substrate P is moved in and out of the substrate stage apparatus PST, the main controller 50 moves the movable part 91a or the substrate Y of the substrate X step feed apparatus 91. Any X frame member 61x or any Y frame member 61y of the substrate support member 69 may be sucked and held, or the substrate P may be sucked and held by the movable portion 88a of the step feeding device 88.

  In the modification of FIG. 27, the position of the substrate P can be measured by the substrate stage interferometer system 98 via the X moving mirror 194X and the Y moving mirror 194Y fixed to the substrate supporting member 69. Even when the exposure of the first layer on the substrate P is performed by using the exposure apparatus according to the example, the substrate according to the design value based on the position information of the substrate P measured by the substrate stage interferometer system 98 Positioning to the acceleration start position for exposure of each shot area of P can be performed with sufficient accuracy. Therefore, according to this modification, it is not necessary to previously form a mark on the substrate P using a titler or the like when the first layer is exposed to the substrate P.

  In addition, if the reflective surface equivalent to the reflective surface of X movable mirror 94X and Y movable mirror 94Y can be formed in Y frame member 61y and X frame member 61x of substrate support member 69, X movable mirror 94X is not necessarily required. It is not necessary to provide the Y moving mirror 94Y. In this case, the substrate support member 69 can be reduced in weight accordingly.

  The substrate support member may be used only when the first layer is exposed to the substrate P, or may be used when the second and subsequent layers are exposed. In the former case, since the position of the fine movement stage 26 needs to be measured by the substrate stage interferometer system 98 during the exposure of the second and subsequent layers, for example, the pair of X movable mirrors 94X composed of the above-described corner cubes, and It is necessary to attach the Y movable mirror 94Y made of a long mirror at the same position as in the first embodiment. In this case, the substrate stage interferometer system 98 is used to measure positional information of the substrate support member 96 (substrate P) at the time of exposure of the first layer and the fine movement stage 26 at the time of exposure of the second layer. Although not limited to this, a substrate interferometer system that measures the position of the substrate support member 96 (substrate P) may be provided separately from the substrate stage interferometer system 98.

  The substrate support member is not limited to a frame-shaped member, and a substrate support member having a shape in which a part of the frame is missing may be used. For example, a U-shaped substrate holding frame as disclosed in the eighth embodiment of the above-mentioned US Patent Application Publication No. 2011/0042874 may be used. In addition, a drive mechanism that assists driving in the XY plane of the substrate support member 69, for example, long stroke driving in the X-axis direction, may be newly provided as long as the configuration does not adversely affect the operation during scanning exposure of the substrate. .

<< Second Embodiment >>
Next, a second embodiment will be described based on FIG. 28 to FIG. Here, the same or similar components as those in the first embodiment described above are denoted by the same or similar reference numerals, and the description thereof is simplified or omitted. The exposure apparatus according to the second embodiment is different from the exposure apparatus 100 according to the first embodiment described above in the components related to the alignment of the substrate P during the exposure of the first layer. About the part, it is the same as that of 1st Embodiment.

  FIG. 28 is a simplified plan view of the exposure apparatus 200 according to the second embodiment. In FIG. 28, illustrations of portions other than the air levitation unit groups 84A and 84B, the holder PH, the exposure area IA, and an edge sensor described later are omitted.

In addition to the same components as those of exposure apparatus 100 according to the first embodiment described above, exposure apparatus 200 has a pair of edge sensors for X position measurement (hereinafter abbreviated as X sensors) shown in FIG. 122X ₁ , 122X ₂ and three edge sensors for Y position measurement (hereinafter abbreviated as Y sensors) 122Y ₁ , 122Y ₂ , 122Y ₃ are provided.

The pair of X sensors 122X ₁ and 122X ₂ are provided on the holder PH. Each of the pair of X sensors 122X ₁ and 122X ₂ irradiates a measurement beam to a scale 120X having a grating having a Y-axis direction as a periodic direction and arranged in the holder PH with the Y-axis direction as a longitudinal direction. Thus, they are integrally fixed to the + Z side surfaces of a pair of encoder heads (not shown) that measure the position in the Y-axis direction (Y position) at the irradiation point of each measurement beam. The X each sensor 122X ₁ and X sensor 122X _2, does not interfere with the adsorption of the substrate P by the holder PH, and are attached to the holder PH so as to be movable in the Y-axis direction integrally with the encoder head. In the present embodiment, the pair of X sensors 122X ₁ and 122X ₂ are used to detect the X position of the −X side edge of the substrate P (the X position of the substrate P with respect to the holder PH) and the rotation in the θz direction. The measurement values of the pair of encoder heads to which the X sensors 122X ₁ and 122X ₂ are fixed are used, for example, when detecting the rotation of the substrate P in the θz direction.

The Y sensors 122Y ₁ , 122Y ₂ , 122Y ₃ are provided on the lower surface of the lens barrel surface plate 16 above the air levitation unit group 84B. Each of the Y sensors 122Y ₁ , 122Y ₂ , 122Y ₃ is attached to the lens barrel surface plate 16 and has a lattice having the Y-axis direction as a periodic direction and a scale (not shown) having the Y-axis direction as a longitudinal direction. The measurement beams are individually irradiated and fixed to the −Z side surfaces of the three encoder heads that measure the positions in the Y-axis direction at the irradiation points of the measurement beams. Each of the Y sensors 122Y ₁ , 122Y ₂ , 122Y ₃ can move integrally with the encoder head along Y guides 121a, 121b, 121c whose longitudinal direction is the Y-axis direction. Each of the Y guides 121a, 121b, and 121c is driven in the Y-axis direction by, for example, a linear motor. In the present embodiment, each of the Y sensors 122Y ₁ , 122Y ₂ , 122Y ₃ is used to detect the Y position of the −Y side edge of the substrate P.

The measurement results of the pair of X sensors 122X ₁ , 122X ₂ and the three Y sensors 122Y ₁ , 122Y ₂ , 122Y ₃ are supplied to the main controller 50. The measurement results of the five encoder heads to which the X sensors 122X ₁ , 122X ₂ and the three Y sensors 122Y ₁ , 122Y ₂ , 122Y ₃ are fixed are also supplied to the main controller 50. The main controller 50 includes a measurement result by the X sensor 122X _1, 122X _2, they are based on the measurement result of the pair of the encoder head fixed, at each of the detection points of the pair of X sensors 122X _1, 122X ₂ The X position and the θz rotation of the measurement target edge (−X side edge) of the substrate P are obtained, and the measurement target edge (−Y side) of the substrate P at each detection point of the Y sensors 122Y ₁ , 122Y ₂ , 122Y ₃ is obtained. Edge) Y position is obtained.

  In the exposure apparatus 200 according to the second embodiment, the substrate alignment method at the time of exposure of the first layer to the substrate P is different from that of the first embodiment described above. The same operation is performed in the same procedure as the exposure apparatus 100 according to the embodiment. In the following, the case where the first layer exposure is performed on the substrate P will be described based on FIGS. 29A to 30F and with reference to other drawings as appropriate, focusing on the differences. To do. Note that the exposure area IA shown in FIGS. 29A to 30F is an illumination area where the illumination light IL is irradiated through the projection optical system PL at the time of exposure. Although not formed, it is always shown in order to clarify the positional relationship between the substrate P and the projection optical system PL. In FIGS. 29A to 30F, the air levitation unit groups 84A and 84B are partially omitted.

  Here, the case where the six shot areas SA1 to SA6 shown in FIG.

First, as described above, under the control of the main controller 50, the mask M is loaded onto the mask stage MST by a mask transfer device (mask loader) (not shown), and the substrate carry-in device (not shown) is used. Then, the substrate P is carried (injected) onto the substrate stage apparatus PST, and the substrate P is placed across the holder PH and a part of the air levitation unit group 84B (see FIG. 29A). . At this time, the substrate P is levitated and supported by the holder PH and a part of the air levitation unit group 84B. Then, the main controller 50 switches the holder PH from exhaust to suction. As a result, a part of the substrate P (about ３ of the entire substrate P) is sucked and fixed by the holder PH, and a part of the substrate P (the remaining approximately 2/2 of the entire substrate P is absorbed by a part of the air floating unit group 84B). 3) is in a state where it is supported by levitation. At this time, as shown in FIG. 29A, the pair of X sensors 122X ₁ and 122X ₂ is connected to one end in the Y-axis direction of the first region of the substrate P (region where the shot region SA1 is formed). It is set by the main controller 50 at the position of the −X side edge corresponding to the other end. Here, the interval between the X sensors 122X ₁ and 122X ₂ is set to be substantially the same distance as the moving distance of the substrate P during the Y step.

Thereafter, main controller 50 obtains the position of fine movement stage 26 (holder PH) with respect to projection optical system PL by the same alignment measurement method as in the prior art. Next, the main controller 50 uses the pair of X sensors 122X ₁ and 122X ₂ to measure the X position and θz rotation at two positions on the −X side edge of the substrate P, and the most + X side Y sensor 122Y. ₁ is used to measure the alignment of the substrate P with respect to the projection optical system PL, which measures the Y position of the −Y side edge of the substrate P. Then, main controller 50 drives coarse movement table 32 and finely moves fine movement stage 26 based on the measurement result of each edge position and the result of alignment measurement of fine movement stage 26 with respect to projection optical system PL. Then, the substrate P is positioned at the scan start position (acceleration start position). At this time, precise fine positioning drive in the X-axis, Y-axis, and θz directions (or 6-degree-of-freedom directions) is performed on the coarse movement table 32 of the fine movement stage 26 (holder PH). FIG. 29A shows a state immediately after the substrate P is positioned at the scan start position (acceleration start position) for exposure of the first region on the substrate P in this way. .

  Thereafter, a step-and-scan exposure operation is performed. In the step-and-scan type exposure operation, a plurality of regions on the substrate P are sequentially exposed. In the second embodiment, the maximum exposure width (width in the Y-axis direction) of each shot area SAn (n = 1, 2, 3, 4, 5, 6) described later is about 1/3 of the substrate P. .

  From the state of FIG. 29A, the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) are indicated by white arrows in FIG. 29A. , Driven in the −X direction, and the X scan operation of the substrate P is performed as described above. By this exposure, a shot area SA1 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 29B).

  Next, the Y step operation in the + Y direction for moving the unexposed area of the substrate P onto the holder PH is performed in the same manner as in the first embodiment. As a result, the substrate P has an unexposed second area (exposure target area) adjacent to the shot area SA1 on the −Y side (and an area adjacent to the + X side) opposed to the holder PH. And part of the air levitation unit group 84A and part of the air levitation unit group 84B (see FIG. 29C). At this time, the substrate P is levitated and supported by the holder PH, a part of the air levitation unit group 84A, and a part of the air levitation unit group 84B. Then, the main controller 50 switches the holder PH from exhaust to intake (suction). Thereby, a part of the substrate P (about 1/3 of the whole substrate P) is sucked and fixed by the holder PH, and a part of the substrate P is formed by a part of the air levitation unit group 84A and a part of the air levitation unit group 84B. (The remaining approximately 2/3 of the entire substrate P) is supported in a floating state.

The main controller 50 measures the X position and θz rotation of the two positions on the −X side edge of the substrate P using the pair of X sensors 122X ₁ and 122X ₂ , and the most + X side Y sensor 122Y. ₁ is used to measure the Y position of the edge on the −Y side of the substrate P.

In the position measurement (alignment measurement) of the substrate P with respect to the projection optical system PL using the three edge sensors described above, the main control device 50 first has one of the exposures before the exposure of the previous shot area (in this case, the shot area SA1). substantially the same position as the position on the edge of the -X side of the substrate P measured by using the edge sensor 122X ₂ (measurement point) is measured using the other edge sensor 122X _1. Therefore, the main controller 50 can measure the amount of change (displacement) in the X-axis direction of the same measurement target position (measurement point) on the −X side edge of the substrate P. The main control unit 50, previously before the shot area (in this case, the shot area SA1) using an edge sensor 122Y ₁ of measuring the Y position of the -Y side of the edge of the substrate P before the exposure of the substrate P The Y position of the same edge is measured. That is, main controller 50 measures the amount of displacement in the Y-axis direction of the −Y side edge of substrate P. Therefore, even if the substrate P is once removed from the holder PH, new alignment measurement for exposure of the second region can be performed with high accuracy without any trouble.

  When the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50 determines the scan start position (acceleration for exposure of the second region on the substrate P based on the measurement result. Positioning of the substrate P to the start position) and precise fine positioning drive in the X-axis, Y-axis and θz directions (or 6-degree-of-freedom directions) with respect to the coarse movement table 32 of the fine movement stage 26 are performed. FIG. 29C shows a state in which the substrate P (holder PH (fine movement stage 26)) is positioned at the scan start position in this manner.

  Then, main controller 50 determines + X between substrate P (substrate stage (26, 28, 32, PH)) and mask M (mask stage MST), as indicated by a hollow arrow in FIG. Direction acceleration is started and scan exposure is performed in the same manner as described above. By this exposure, a shot area SA2 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 29D).

  Next, the Y step operation in the + Y direction for moving the unexposed area of the substrate P onto the holder PH is performed in the same manner as described above. As a result, as shown in FIG. 29E, the substrate P is adjacent to the shot area SA2 on the −Y side on the unexposed third area (exposure target area) (and on the + X side). The region) faces the holder PH, and is placed across the holder PH and a part of the air levitation unit group 84A. At this time, the substrate P is levitated and supported by the holder PH and a part of the air levitation unit group 84A. Then, the main controller 50 switches the holder PH from exhaust to intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is sucked and fixed by the holder PH, and a part of the substrate P (the remaining approximately 2/2 of the entire substrate P is absorbed by a part of the air floating unit group 84A). 3) is in a state where it is supported by levitation.

The main controller 50 measures the _two X positions of the −X side edge of the substrate P using the pair of X sensors 122X ₁ and 122X ₂ and uses the Y sensor 122Y ₁ to measure the substrate P. Measure the Y position of the −Y side edge. In this case, in the same manner as described above, substantially the same position as the position on the edge of the -X side of one of the edge sensors 122X substrate P measured by using the ₂ prior to exposure before the shot area (measurement point), while edge sensor 122X ₁ measured using the previous shot area (in this case, the shot area SA1) using an edge sensor 122Y ₁ of measuring the Y position of the -Y side of the edge of the substrate P before the exposure of the substrate P Measure the Y position of the same edge. For this reason, although the substrate P is once removed from the holder PH, new alignment measurement for exposure of the third region can be accurately performed without any trouble.

  The main controller 50 positions the substrate P at the scan start position (acceleration start position) for exposure of the third region on the substrate P based on the alignment measurement result. 29 (E), the acceleration in the −X direction of the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) is started, as indicated by the white arrow. Scan exposure is performed in the same manner as described above. FIG. 29F shows a state in which the scan exposure for the third region on the substrate P is completed and the substrate P (substrate stages (26, 28, 32, PH)) is stopped. By this exposure, a shot area SA3 where the sensitive layer is exposed is formed on the substrate P.

Next, in preparation for acceleration for the next exposure, main controller 50 drives substrate P slightly in the + X direction as indicated by a white arrow in FIG. 29F. While performing the step operation. in this case, as shown in FIG. 29 (F), by performing simultaneous measurement by the Y sensor 122Y ₁ and 122Y _3, previously prior to the formation of shot areas SA3, the substrate P the measurement values of the Y sensor 122Y ₁ of measuring the Y position of the -Y side edge, the measurement of the Y sensor 122Y ₃ used for measuring the Y position of the -Y side edge of the substrate P before the exposure of the next region A relationship with the value is obtained (calibration between the Y sensors 122Y ₁ and 122Y ₃ is performed). In the calibration, it is desirable to adjust so that the rotation of the substrate P becomes almost zero. In this case, since the substrate P is not detached from the holder PH after the exposure of the shot area SA3, the substrate may be positioned for the next exposure based on the previous alignment result. However, once the substrate P is then removed from the holder PH, subsequent alignment of the substrate becomes difficult. Therefore, simultaneous measurement by the Y sensors 122Y ₁ and 122Y ₃ and calibration between the Y sensors 122Y ₁ and 122Y ₃ are performed so that such a situation does not occur. Therefore, even if the substrate P is once removed from the holder PH after the exposure of the shot area SA3, a new alignment measurement (exposure of the substrate P with respect to the projection optical system PL) for exposure of the fourth area is possible without any problem. Position measurement) can be performed with high accuracy. Incidentally, depending on the arrangement of the shot areas on the substrate P, when X step, if simultaneous measurement is difficult also contemplated by the Y sensor 122Y ₁ and 122Y _3. In such a case, with the movement of the substrate, simultaneous measurement by the Y sensor 122Y ₁ and 122Y _2, and subsequent to this, by performing simultaneous measurement by the Y sensor 122Y ₂ and 122Y _3, both at the same time the measurement result of the Based on this, calibration between the Y sensors 122Y ₁ and 122Y ₃ may be performed.

  Based on the measurement result, main controller 50 positions substrate P (holder PH (fine movement stage 26)) at the acceleration start position for exposure in the fourth region, and ends the X step. FIG. 30A shows a state where the holder PH (fine movement stage 26) is positioned at the scan start position. Main controller 50 returns mask stage MST to the acceleration start position in parallel with the X-step operation of substrate P.

  Then, as indicated by the white arrow in FIG. 30A, main controller 50 determines whether the substrate P (substrate stage (26, 28, 32, PH)) and mask M (mask stage MST) are negative. Acceleration in the X direction is started and scan exposure is performed in the same manner as described above. By this exposure, a shot area SA4 where the sensitive layer is exposed is formed on the substrate P (see FIG. 30B).

  Next, a Y-step operation in the −Y direction for moving the unexposed area of the substrate P onto the holder PH is performed as described above. Thereby, the substrate P has the shot area SA2 and the fifth area adjacent to the shot area SA2 on the + X side facing the holder PH, and the holder PH, a part of the air levitation unit group 84A, and the air levitation unit group. 84B is placed across a part of 84B (see FIG. 30C). At this time, the substrate P is levitated and supported by the holder PH, a part of the air levitation unit group 84A, and a part of the air levitation unit group 84B. Then, the main controller 50 switches the holder PH from exhaust to intake (suction). Thereby, a part of the substrate P (about 1/3 of the whole substrate P) is sucked and fixed by the holder PH, and a part of the substrate P is formed by a part of the air levitation unit group 84A and a part of the air levitation unit group 84B. (The remaining approximately 2/3 of the entire substrate P) is supported in a floating state.

The main controller 50 measures the _two X positions of the −X side edge of the substrate P using the pair of X sensors 122X ₁ and 122X ₂ and uses the Y sensor 122Y ₃ to measure the substrate P. Measure the Y position of the −Y side edge. Also in this case, as described above, the position (measurement point) substantially the same as the position on the −X side edge of the substrate P measured by using _one edge sensor 122X1 before the exposure of the previous shot area, edge sensors 122X ₂ measured using the previous shot area (in this case, the shot area SA1) using an edge sensor 122Y ₃ of measuring the Y position of the -Y side of the edge of the substrate P before the exposure of the substrate P Measure the Y position of the same edge. For this reason, although the substrate P is once removed from the holder PH, new alignment measurement for exposure of the fifth region can be performed with high accuracy without any trouble.

  The main controller 50 positions the substrate P at the scan start position (acceleration start position) for exposure of the fifth region on the substrate P based on the alignment measurement result. As indicated by the white arrow in 30 (C), acceleration of the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) in the −X direction is started, Scan exposure is performed in the same manner as described above. By this exposure, a shot area SA5 where the sensitive layer is exposed is formed on the substrate P (see FIG. 30D).

Next, the Y step operation in the −Y direction for moving the last unexposed area of the substrate P onto the holder PH is performed in the same manner as described above. As a result, the substrate P was placed with the last unexposed shot area and the adjacent shot area SA1 facing the holder PH and straddling the holder PH and part of the air levitation unit group 84B. A state is reached (see FIG. 30E). At this time, the substrate P is levitated and supported by the holder PH and a part of the air levitation unit group 84B. Then, the main controller 50 switches the holder PH from exhaust to intake (suction). Thereby, a part of the substrate P (about 1/3 of the whole substrate P) is sucked and fixed by the holder PH, and a part of the substrate P (the remaining about 2/2 of the whole substrate P is absorbed by a part of the air floating unit group 84B). 3) is in a state where it is supported by levitation. Then, the main controller 50 uses the pair of X sensors 122X ₁ and 122X ₂ to measure the X position of the two positions on the −X side edge of the substrate P, the rotation in the θz direction, and the Y sensor 122Y ₃ . The Y position of the edge on the −Y side of the substrate P is measured. Also in this case, as described above, the position (measurement point) substantially the same as the position on the −X side edge of the substrate P measured by using _one edge sensor 122X1 before the exposure of the previous shot area, edge sensors 122X ₂ measured using the previous shot area (in this case, the shot area SA1) using an edge sensor 122Y ₃ of measuring the Y position of the -Y side of the edge of the substrate P before the exposure of the substrate P Measure the Y position of the same edge. Therefore, even when the substrate P is once removed from the holder PH, new alignment measurement for exposure of the sixth region can be performed with high accuracy without any trouble.

  Then, the main controller 50 positions the substrate P at the scan start position (acceleration start position) for exposure of the sixth region on the substrate P based on the alignment measurement result (of the fine movement stage 26). As shown by the white arrow in FIG. 30 (E), the coarse movement table 32 is subjected to precise positioning in the X-axis, Y-axis, and θz directions (or 6-degree-of-freedom directions). The acceleration in the −X direction of P (substrate stage (26, 28, 32, PH)) and mask M (mask stage MST) is started, and scan exposure is performed in the same manner as described above. By this exposure, a shot area SA6 where the sensitive layer is exposed is formed on the substrate P (see FIG. 30F).

  On the other hand, immediately before the new alignment measurement of the substrate P is started, a new substrate P is loaded (introduced) onto the air levitation unit group 84A by a substrate carry-in device (not shown), and exposure to the shot area SA6 is performed. In parallel, the newly loaded substrate P is transported. On the other hand, the substrate P that has been exposed to all the shot areas SA1 to SA6 is carried by the main controller 50 from the holder PH onto the air levitation unit group 84B, and unloaded in the + X direction by a substrate unloader (not shown). Is done.

  Substantially simultaneously with the slide conveyance of the exposed substrate P onto the air levitation unit group 84B, the newly loaded substrate P is transferred by the main controller 50 to a part on the -Y side (part 1/3). ) Is positioned on the holder PH, and a part thereof is adsorbed (fixed) by the holder PH. Then, in parallel with carrying out the exposed substrate P, the substrate P partially fixed to the holder PH is subjected to the same alignment operation as described above, and then the substrate P, the mask M, The acceleration in the + X direction is started, and scan exposure is performed on the first area (the area on the most -Y side and + X side) in the same manner as described above. Thereafter, in the same procedure as the exposure for the first substrate P described above, the alignment (X step, Y step) for the remaining region on the second substrate P, the exposure operation, etc. Operations such as alignment (X step, Y step) and exposure with respect to the third and subsequent substrates are repeated.

  As described above, the exposure apparatus 200 according to the second embodiment can obtain the same effects as those of the exposure apparatus 100 according to the first embodiment described above. In addition, according to the exposure apparatus 200, it is not necessary to form a mark on the substrate P using a titler or the like in advance when the first layer is exposed to the substrate P.

Incidentally, in the second embodiment, the X sensor 122X _1, 122X ₂ has been illustrated for the case provided in the holder PH, if not provided in the holder PH, for example, the aforementioned Y sensor 122Y ₁ ~122Y ₃ may be provided outside the fine movement stage 26.

<< Third Embodiment >>
Next, the exposure apparatus 300 which concerns on 3rd Embodiment is demonstrated based on FIGS. 31-33 (F). Here, the same or similar components as those in the first embodiment described above are denoted by the same or similar reference numerals, and the description thereof is simplified or omitted. The exposure apparatus according to the third embodiment is different from the exposure apparatus 100 according to the first embodiment described above, except for the components related to the alignment of the substrate P during the exposure of the first layer. About the part, it is the same as that of 1st Embodiment.

  FIG. 31 shows a simplified plan view of an exposure apparatus 300 according to the third embodiment. In FIG. 31, illustrations of portions other than the air levitation unit groups 84A and 84B, the holder PH, the exposure area IA, the detection unit described later, and the interferometer are omitted.

In addition to the same components as those of the exposure apparatus 100 according to the first embodiment, the exposure apparatus 300 includes a pair of X position measurement detection units (hereinafter abbreviated as X detection units) shown in FIG. ) 124X ₁ , 124X ₂ , and three Y position measurement detection units (hereinafter abbreviated as Y detection units) 124Y ₁ , 124Y ₂ , 124Y ₃ .

Each of the pair of X detection units 124X ₁ and 124X ₂ is made of a member having an L-shaped XZ cross section, and is movable along guides 126a and 126b arranged in the holder PH with the X-axis direction as a longitudinal direction. ing. Each of the pair of X detection units 124X ₁ and 124X ₂ is mounted on the holder PH so as not to interfere with the adsorption of the substrate P by the holder PH and is movable in the X-axis direction. Is driven in the X-axis direction.

Each of the pair of X detection units 124X ₁ and 124X ₂ is provided with a reflective surface on the −X side surface, and can be adsorbed and fixed to the side surface and the back surface of the −X side end of the substrate P. In this case, each of the X detection units 124X ₁ and 124X ₂ is attracted to the substrate P and released, that is, attached and detached by the main control device 50. Each of the pair of X detection units 124X ₁ and 124X ₂ is provided with a stepped portion on the surface facing the back surface of the substrate P, and the presence of this stepped portion causes the reflecting surface and the substrate P to extend in the X-axis direction. It is fixed to the substrate P by suction so that the positional relationship is constant.

In the exposure apparatus 300 according to the third embodiment, a pair of X interferometers 130X ₁ and 130X that measure the X position of the substrate P by irradiating each of the pair of X detection units 124X ₁ and 124X _{2 with} a measurement beam. ₂ is provided. The X interferometers 130X ₁ and 130X ₂ irradiate a measurement beam parallel to the X axis to a position substantially the same height as the side surface (end surface) of the substrate P on the reflection surface of each of the X detection units 124X ₁ and 124X ₂ . The smaller the distance ΔZ in the Z-axis direction between the measurement beam and the upper surface of the substrate P, the more desirable, for example, 1 mm or less. When ΔZ exceeds 1 mm, it is desirable that at least one of the X interferometers 130X ₁ and 130X ₂ is a multi-axis interferometer capable of measuring the pitching (θy rotation) of the X detection unit 124X ₁ or 124X ₂ .

The Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ are provided on the lower surface of the lens barrel surface plate 16 above the air floating unit group 84B. Each of the Y detection units 124Y ₁ , 124Y ₂ , and 124Y ₃ is made of a member having a U-shaped YZ cross section, and is attached to guides 121a, 121b, and 121c that are attached to the lens barrel surface plate 16 and have the Y-axis direction as a longitudinal direction. Can be moved. Each of the Y detection units 124Y ₁ , 124Y ₂ , and 124Y ₃ has a YZ cross-section L-shaped suction portion that can be suction-fixed to the side surface and the back surface of the −Y side end portion of the substrate P at its lower end portion. A reflecting surface is provided on the surface on the Y side. In this case, each of the Y detection units 124Y ₁ , 124Y ₂ , and 124Y ₃ is suctioned to the substrate P and released, that is, attached and detached by the main controller 50. Each of the Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ is driven in the Y-axis direction by a linear motor, for example.

Each of the Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ is adsorbed and fixed to the substrate P so that the positional relationship between the reflecting surface and the substrate P is constant in the Y-axis direction.

In the exposure apparatus 300 according to the third embodiment, three Y interferometers 130Y ₁ that measure the Y position of the substrate P by irradiating the Y detection units 124Y ₁ , 124Y ₂ , and 124Y ₃ with measurement beams, respectively. 130Y ₂ and 130Y ₃ are provided. Y interferometers 130Y ₁ , 130Y ₂ , and 130Y ₃ pass measurement beams parallel to the Y axis through the space above air levitation unit group 84B on the reflection surfaces of Y detection units 124Y ₁ , 124Y ₂ , and 124Y ₃ , respectively. Irradiation is performed at a position substantially the same height as the side surface (end surface) of the substrate P. The smaller the distance in the Z-axis direction between the measurement beam and the upper surface of the substrate P, the more desirable, for example, 1 mm or less. Here, when there is a risk that the movement of the Y detection unit 124Y _1, 124Y _2, 124Y ₃ is prevented, the movement of the Y detection unit 124Y _1, 124Y _2, 124Y ₃ a part of the upper surface of the air floating unit group 84B A recess (not shown) is formed along the path.

The measurement results of the pair of X interferometers 130X ₁ and 130X ₂ and the three Y interferometers 130Y ₁ , 130Y ₂ , and 130Y ₃ are supplied to the main controller 50. Based on the measurement results of X interferometers 130X ₁ and 130X ₂ , main controller 50 determines the X position of substrate P at the measurement beam irradiation point of each of the pair of X interferometers 130X ₁ and 130X ₂ , and The θz rotation is obtained, and the Y position of the substrate P at the irradiation point of each measurement beam is obtained based on the measurement results of the Y interferometers 130Y ₁ , 130Y ₂ , and 130Y ₃ .

  In the exposure apparatus 300 according to the third embodiment, the alignment method of the substrate when the first layer is exposed to the substrate P is different from that of the first embodiment described above. The same operation is performed in the same procedure as the exposure apparatus 100 according to the embodiment. In the following, the case where the first layer exposure is performed on the substrate P will be described based on FIG. 32A to FIG. 33F with reference to other drawings as appropriate, focusing on the differences. To do. Note that the exposure area IA shown in FIGS. 32A to 33F is an illumination area where the illumination light IL is irradiated through the projection optical system PL at the time of exposure. Although not formed, it is always shown in order to clarify the positional relationship between the substrate P and the projection optical system PL. 32A to 33F, the air levitation unit groups 84A and 84B are partially omitted.

  Here, the case where the six shot areas SA1 to SA6 shown in FIG. 31 are formed on the substrate P will be described.

First, as described above, under the control of the main controller 50, the mask M is loaded onto the mask stage MST by a mask transfer device (mask loader) (not shown), and the substrate carry-in device (not shown) is used. Then, the substrate P is carried (injected) onto the substrate stage apparatus PST, and the substrate P is placed across the holder PH and a part of the air levitation unit group 84B (see FIG. 32A). . At this time, the substrate P is levitated and supported by the holder PH and a part of the air levitation unit group 84B. Then, the main controller 50 switches the holder PH from exhaust to suction. As a result, a part of the substrate P (about ３ of the entire substrate P) is sucked and fixed by the holder PH, and a part of the substrate P (the remaining approximately 2/2 of the entire substrate P is absorbed by a part of the air floating unit group 84B). 3) is in a state where it is supported by levitation. At this time, as shown in FIG. 32A, the pair of X detection units 124X ₁ , 124X ₂ is controlled by the main controller 50 in the first region of the substrate P (region where the shot region SA1 is formed). Are attached to the positions of the −X side edges corresponding to one end and the other end in the Y-axis direction. The + X side Y detection unit 124 </ b> Y ₁ is attached to the −Y side end of the substrate P by the main controller 50.

  Thereafter, the position of fine movement stage 26 (holder PH) relative to projection optical system PL is obtained by main controller 50 by the same alignment measurement method as in the prior art.

Then, main controller 50 uses a pair of X interferometers 130X _1, 130X _2, X position of the X detection unit 124x _1, 124x _2, i.e. the X position of the two positions of end faces of the -X side of the substrate P and with measuring the θz rotation, with Y interferometer 130Y ₁ the most + X side, Y position of the Y detection unit 124Y _1, i.e. (the end surface on the -Y side) of the substrate P to measure the Y position (FIG. 32 ( A)). At this time, the interval between the X interferometers 130X ₁ and 130X ₂ is set to be substantially the same distance as the moving distance of the substrate P during the Y step.

Then, main controller 50 drives coarse movement table 32 based on the measurement result of the position of substrate P in the XY plane in the three-degree-of-freedom direction and the result of alignment measurement of fine movement stage 26 with respect to projection optical system PL. At the same time, the fine movement stage 26 is finely driven to position the substrate P at the scan start position (acceleration start position). This positioning, first, in a state where the Y detection unit 124Y ₁ is attached to the substrate P, for coarse table 32 of the fine movement stage 26 (holder PH) on the basis of the measurement results Y interferometer 130Y _1, Y-axis direction After the direction is positioned and the suction to the substrate P is released, the X-axis and θz directions (or the X-axis, θz, Z-axis, θx, θy) with respect to the coarse movement table 32 of the fine movement stage 26 (holder PH) Precise micro positioning in each direction) is performed. In the following description, in the third embodiment, when all of the Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ are not attached to the substrate P, such as during scan exposure described later, that is, Y interference. The measurement of the Y position of the substrate P when the Y position of the substrate P cannot be measured by any of the totals 130Y ₁ , 130Y ₂ , and 130Y ₃ is performed when the substrate P is adsorbed to the holder PH. Performed by Y interferometers 98Y ₁ , 98Y _{2 of} system 98.

  FIG. 32A shows a state immediately after the substrate P is positioned at the scan start position (acceleration start position) for exposure of the first region on the substrate P as described above. Yes.

  Thereafter, in a step-and-scan exposure operation in which a step-and-scan exposure operation is performed, a plurality of regions on the substrate P are sequentially exposed. In the third embodiment, the maximum exposure width (width in the Y-axis direction) of each shot area SAn (n = 1, 2, 3, 4, 5, 6) is about ３ of the substrate P.

From the state of FIG. 32A, the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) are indicated by white arrows in FIG. , Driven in the −X direction, the substrate P is subjected to scan exposure in the same manner as described above. By this exposure, a shot area SA1 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 32B). In the third embodiment, the X position and θz rotation of the substrate P during scan exposure are controlled by the main controller 50 by the measurement results of the X interferometers 130X ₁ and 130X ₂ and / or the substrate stage interferometer system. This is performed based on the measurement results of 98 X interferometers 98X ₁ and 98X ₂ .

Next, the main controller 50 removes the X detection units 124X ₁ and 124X ₂ from the substrate P, and the Y step operation in the + Y direction for moving the unexposed area of the substrate P onto the holder PH is performed as described above. This is performed using the substrate Y step feeding device 88 as in the first embodiment (see the white arrow in FIG. 32B). The main control unit 50, the Y detection unit 124Y _1, attached to the end portion of the -Y side of the substrate P, during the Y step operation, while monitoring the change in the Y position using the Y interferometer 130Y _1, the substrate P Is driven in the + Y direction. As a result, the substrate P has an unexposed second area (exposure target area) adjacent to the shot area SA1 on the −Y side (and an area adjacent to the + X side) opposed to the holder PH. And part of the air levitation unit group 84A and part of the air levitation unit group 84B (see FIG. 32C). That is, in this way, rough positioning of the Y step and the Y position of the substrate P is performed. At this time, the substrate P is levitated and supported by the holder PH, a part of the air levitation unit group 84A, and a part of the air levitation unit group 84B. Then, the main controller 50 switches the holder PH from exhaust to intake (suction). Thereby, a part of the substrate P (about 1/3 of the whole substrate P) is sucked and fixed by the holder PH, and a part of the substrate P is formed by a part of the air levitation unit group 84A and a part of the air levitation unit group 84B. (The remaining approximately 2/3 of the entire substrate P) is supported in a floating state.

Then, main controller 50 attaches a pair of X detection units 124X ₁ and 124X ₂ to two positions on the −X side end of substrate P, and uses X interferometers 130X ₁ and 130X ₂ to detect X detection unit 124X _1. , with measures the and θz rotation (X two positions on the -X side edge of the substrate P) X position of 124x _2, measure the Y position of the substrate P by using the Y interferometer 130Y _1.

In the position measurement (alignment measurement) of the substrate P with respect to the projection optical system PL using the above three interferometers 130X ₁ , 130X ₂ , and 130Y ₁ , the main controller 50 first determines the previous shot area (in this case, the shot). substantially the same position as the position on the -X side edge of the substrate P measured using one of the X interferometer 130X ₂ before the exposure area SA1) (measurement points), with the other of X interferometer 130X ₁ To measure. Therefore, the main controller 50 can measure the amount of change (displacement) in the X-axis direction of the same measurement target position (measurement point) on the −X side edge of the substrate P. The main control unit 50, previously before the shot area (in this case, the shot area SA1) using Y interferometer 130Y ₁ of measuring the Y position of the substrate P before exposure, to measure the Y position of the substrate P . That is, main controller 50 measures the displacement amount of substrate P in the Y-axis direction. Therefore, even if the substrate P is once removed from the holder PH, new alignment measurement for exposure of the second region can be performed with high accuracy without any trouble.

  When the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50 performs exposure of the second region on the substrate P in the same procedure as described above based on the alignment measurement result. Positioning to the scan start position (acceleration start position) for fine movement and precise fine positioning of the fine movement stage 26 with respect to the coarse movement table 32 in the Y-axis, X-axis, and θz directions (or directions of six degrees of freedom). FIG. 32C shows a state where the holder PH (fine movement stage 26) is positioned at the scan start position in this way.

  Then, main controller 50 determines + X between substrate P (substrate stage (26, 28, 32, PH)) and mask M (mask stage MST), as indicated by a hollow arrow in FIG. Direction acceleration is started and scan exposure is performed in the same manner as described above. By this exposure, a shot area SA2 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 32D).

Next, the main controller 50 removes the X detection units 124X ₁ and 124X ₂ from the substrate P, and the Y step operation in the + Y direction for moving the unexposed area of the substrate P onto the holder PH is the same as described above. Is performed (see the white arrow in FIG. 32D). The main control unit 50, the Y detection unit 124Y _1, attached to the end portion of the -Y side of the substrate P, during the Y step operation, while monitoring the change in the Y position using the Y interferometer 130Y _1, the substrate P Is driven in the + Y direction. Accordingly, as shown in FIG. 32E, the substrate P is adjacent to the shot area SA2 on the −Y side, which is adjacent to the unexposed third area (exposure target area) (and to the + X side). The region) faces the holder PH, and is placed across the holder PH and a part of the air levitation unit group 84A. At this time, the substrate P is levitated and supported by the holder PH and a part of the air levitation unit group 84A. Then, the main controller 50 switches the holder PH from exhaust to intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is sucked and fixed by the holder PH, and a part of the substrate P (the remaining approximately 2/2 of the entire substrate P is absorbed by a part of the air floating unit group 84A). 3) is in a state where it is supported by levitation.

Then, main controller 50 attaches a pair of X detection units 124X ₁ and 124X ₂ to two positions on the −X side end of substrate P, respectively, and uses X interferometers 130X ₁ and 130X ₂ to detect X detection unit 124X. ₁ and X position of 124X ₂ ( _two X positions on the −X side edge of the substrate P) and θz rotation are measured, and the Y position of the substrate P is measured using the Y interferometer 130Y ₁ . In this case, in the same manner as described above, substantially the same position as the position on the edge of the -X side of the substrate P measured using one of the X interferometer 130X ₂ prior to exposure before the shot area (measurement point), measured using the other of X interferometers 130X _1, before shot area (in this case, the shot area SA2) using Y interferometer 130Y ₁ of measuring the Y position of the substrate P before exposure, Y position of the substrate P Measure. For this reason, although the substrate P is once removed from the holder PH, new alignment measurement for exposure of the third region can be accurately performed without any trouble.

  When the new alignment measurement of the substrate P is completed, the main controller 50 starts scanning for exposure of the third region on the substrate P in the same procedure as described above based on the alignment measurement result. The substrate P is positioned at the position (acceleration start position), and the substrate P (substrate stage (26, 28, 32, PH)) and the mask M are indicated by the white arrows in FIG. The acceleration in the −X direction with (mask stage MST) is started, and scan exposure is performed in the same manner as described above. FIG. 32 (F) shows a state in which the scan exposure for the third region on the substrate P is completed and the substrate stage (26, 28, 32, PH) is stopped. By this exposure, a shot area SA3 where the sensitive layer is exposed is formed on the substrate P.

Next, in preparation for acceleration for the next exposure, main controller 50 drives substrate P slightly in the + X direction as indicated by a white arrow in FIG. Step operation is performed. Prior to the X-step operation, the main controller 50, the Y detection unit 124Y _3, removed from the substrate P. In this case, since the substrate P is not detached from the holder PH after the exposure of the shot area SA3, the main controller 50 can position the substrate for the next exposure based on the previous alignment result. . The X-step operation of the substrate P is performed for its positioning. Main controller 50 performs the above-described X-step operation of substrate P while monitoring the θz rotation together with the X position of substrate P based on the measured values of X interferometers 130X ₁ and 130X ₂ .

The main controller 50, after X steps the substrate P, as shown in FIG. 33 (A), the Y detection unit 124Y ₃ in a state attached to an end portion of the -Y side of the substrate P, Y interferometer 130Y ₃ Is used to measure the Y position of the substrate P and finely adjust the Y position of the substrate P. Thereby, the positioning to the acceleration start position for the exposure of the fourth region of the substrate P is completed. FIG. 33A shows a state where the substrate P (holder PH (fine movement stage 26)) is positioned at the scan start position. In this case, main controller 50 returns mask stage MST to the acceleration start position in parallel with the X-step operation of substrate P described above. Here, in the third embodiment, any one of the pair of X detection units 124X ₁ and 124X ₂ and the Y detection units 124Y _{1 to} 124Y ₃ , for example, the Y detection unit 124Y ₃ is attached to the substrate P, and the X interferometer 130X ₁ , 130 X ₂ is used to detect the X position of the X detection units 124 X ₁ , 124 X ₂ , and the Y position of the Y detection unit 124 Y ₃ is detected using the Y interferometer 130 Y _3. The position, for example, the position of the substrate center in the X, Y, and θz directions can be obtained. Therefore, after the exposure of the shot area SA3, the substrate P can be positioned at the acceleration start position for the fourth exposure without any problem even if the substrate P is temporarily removed from the holder PH.

Then, main controller 50, remove the Y detection unit 124Y ₃ from the substrate P, as shown by a white arrow in FIG. 33 (A), the substrate P (substrate stage (26,28,32, PH)) Acceleration in the −X direction with the mask M (mask stage MST) is started, and scan exposure is performed in the same manner as described above. By this exposure, a shot area SA4 where the sensitive layer is exposed is formed on the substrate P (see FIG. 33B).

Next, the main controller 50 removes the X detection units 124X ₁ and 124X ₂ from the substrate P, and the Y step operation in the −Y direction for moving the unexposed area of the substrate P onto the holder PH is as described above. The same is done (see the white arrow in FIG. 33B). The main control unit 50, the Y detection unit 124Y _3, attached to the end portion of the -Y side of the substrate P, during the Y step operation, while monitoring the change in the Y position using the Y interferometer 130Y _3, the substrate P Is driven in the -Y direction. Accordingly, the shot area SA2 on the substrate P and the fifth area adjacent to the shot area SA2 on the + X side face the holder PH, and the holder PH, a part of the air levitation unit group 84A, and the air levitation unit group 84B is placed across a part of 84B (see FIG. 33C). At this time, the substrate P is levitated and supported by the holder PH, a part of the air levitation unit group 84A, and a part of the air levitation unit group 84B. Then, the main controller 50 switches the holder PH from exhaust to intake (suction). Thereby, a part of the substrate P (about 1/3 of the whole substrate P) is sucked and fixed by the holder PH, and a part of the substrate P is formed by a part of the air levitation unit group 84A and a part of the air levitation unit group 84B. (The remaining approximately 2/3 of the entire substrate P) is supported in a floating state.

Then, main controller 50 attaches a pair of X detection units 124X ₁ and 124X ₂ to two positions on the −X side end of substrate P, respectively, and uses X interferometers 130X ₁ and 130X ₂ to detect X detection unit 124X. ₁ and X position of 124X ₂ ( _two X positions on the −X side edge of the substrate P) and θz rotation are measured, and the Y position of the substrate P is measured using the Y interferometer 130Y ₁ . Also in this case, as described above, the position (measurement point) substantially the same as the position on the −X side edge of the substrate P measured by using _one edge sensor 122X1 before the exposure of the previous shot area, edge sensors 122X ₂ measured using the previous shot area (in this case, the shot area SA1) using an edge sensor 122Y ₃ of measuring the Y position of the -Y side of the edge of the substrate P before the exposure of the substrate P Measure the Y position of the same edge. For this reason, although the substrate P is once removed from the holder PH, new alignment measurement for exposure of the fifth region can be performed with high accuracy without any trouble.

  When the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50 exposes the fifth region on the substrate P in the same procedure as described above based on the alignment measurement result. The substrate P is positioned at the scan start position (acceleration start position) for the substrate P, and as shown by the white arrow in FIG. 30C, the substrate P (substrate stage (26, 28, 32, PH) )) And the mask M (mask stage MST) are accelerated in the −X direction, and scan exposure is performed in the same manner as described above. By this exposure, a shot area SA5 where the sensitive layer is exposed is formed on the substrate P (see FIG. 33D).

Next, the main controller 50 removes the X detection units 124X ₁ and 124X ₂ from the substrate P, and a Y step operation in the −Y direction for moving the last unexposed area of the substrate P onto the holder PH is performed. This is performed in the same manner as described above (see the white arrow in FIG. 33D). The main control unit 50, the Y detection unit 124Y _3, attached to the end portion of the -Y side of the substrate P, during the Y step operation, while monitoring the change in the Y position using the Y interferometer 130Y _3, the substrate P Is driven in the -Y direction. Thus, as shown in FIG. 33E, the substrate P has the last unexposed area and the shot area SA1 adjacent thereto facing the holder PH, and the holder PH and the air levitation unit group 84B. It is in a state of being placed across a part. At this time, the substrate P is levitated and supported by the holder PH and a part of the air levitation unit group 84B. Then, the main controller 50 switches the holder PH from exhaust to intake (suction). Thereby, a part of the substrate P (about 1/3 of the whole substrate P) is sucked and fixed by the holder PH, and a part of the substrate P (the remaining about 2/2 of the whole substrate P is absorbed by a part of the air floating unit group 84B). 3) is in a state where it is supported by levitation.

Then, main controller 50 attaches a pair of X detection units 124X ₁ and 124X ₂ to two positions on the −X side end of substrate P, respectively, and uses X interferometers 130X ₁ and 130X ₂ to detect X detection unit 124X. _1, X position of 124x ₂ (2 places of the X position of the -X side edge of the substrate P), and with measuring the θz rotation of the substrate P, measure the Y position of the substrate P by using the Y interferometer 130Y ₃ To do. In this case as well, as described above, a position (measurement point) substantially the same as the position on the −X side edge of the substrate P measured using _one X interferometer 130X1 before the exposure of the previous shot area is measured using the other of X interferometer 130X _2, before the shot area (in this case, the shot area SA5) using Y interferometer 130Y ₃ of measuring the Y position of the substrate P before exposure, Y position of the substrate P Measure. Therefore, even when the substrate P is once removed from the holder PH, new alignment measurement for exposure of the sixth region can be performed with high accuracy without any trouble.

  When the new alignment measurement of the substrate P is completed, the main controller 50 starts scanning for exposure of the sixth region on the substrate P in the same procedure as described above based on the alignment measurement result. Positioning of the substrate P at the position (acceleration start position) is performed, and the substrate P (substrate stage (26, 28, 32, PH)) and the mask M are indicated by the white arrows in FIG. The acceleration in the −X direction with (mask stage MST) is started, and scan exposure is performed in the same manner as described above. By this exposure, a shot area SA6 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 32F).

  On the other hand, immediately before the new alignment measurement of the substrate P is started, a new substrate P is loaded (introduced) onto the air levitation unit group 84A by a substrate carry-in device (not shown), and exposure to the shot area SA6 is performed. In parallel, the newly loaded substrate P is transported. On the other hand, the substrate P that has been exposed to all the shot areas SA1 to SA6 is carried by the main controller 50 from the holder PH onto the air levitation unit group 84B, and unloaded in the + X direction by a substrate unloader (not shown). Is done.

  Substantially simultaneously with the slide conveyance of the exposed substrate P onto the air levitation unit group 84B, the newly loaded substrate P is transferred by the main controller 50 to a part on the -Y side (part 1/3). ) Is positioned on the holder PH, and a part thereof is adsorbed (fixed) by the holder PH. Then, in parallel with carrying out the exposed substrate P, the substrate P partially fixed to the holder PH is subjected to the same alignment operation as described above, and then the substrate P, the mask M, The acceleration in the + X direction is started, and scan exposure is performed on the first area (the area on the most -Y side and + X side) in the same manner as described above. Thereafter, in the same procedure as the exposure for the first substrate P described above, the alignment (X step, Y step) for the remaining region on the second substrate P, the exposure operation, etc. Operations such as alignment (X step, Y step) and exposure with respect to the third and subsequent substrates are repeated.

  As described above, the exposure apparatus 300 according to the third embodiment can obtain the same effects as those of the exposure apparatus 100 according to the first embodiment described above. In addition, according to the exposure apparatus 300, it is not necessary to form a mark on the substrate P using a titler or the like in advance when the first layer is exposed to the substrate P.

In the third embodiment, the case where the X detection units 124X ₁ and 124X ₂ are provided in the holder PH is illustrated. However, in the case where the X is not provided in the holder PH, for example, the Y detection unit 124Y described above is used. a pair of Y detection unit having the same constitution as _{1 ~124Y 3} may be provided outside of the fine moving stage 26.

In the third embodiment, the Y detection units 124Y ₁ , 124Y ₂ , and 124Y ₃ are provided on the lower surface of the lens barrel surface plate 16 above the air levitation unit group 84B. A space in which the guides 121a, 121b, 121c can be arranged is provided in a part of one air levitation unit group 84B, and the Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ are installed in the space together with the guides 121a, 121b, 121c, etc. It may be arranged.

In the third embodiment, the X detection units 124X ₁ and 124X ₂ and the Y detection units 124Y _{1 to} 124Y ₃ are used by using the X interferometers 130X ₁ and 130X ₂ and the Y interferometers 130Y _{1 to} 130Y ₃ , respectively. The case of detecting the position of is illustrated. However, the present invention is not limited to this, and the position of at least one detection unit may be measured by an encoder.

  In each of the above embodiments, the size of the substrate holding surface of the holder PH in the Y-axis direction is not limited to 1/3 of the size of the substrate P in the Y-axis direction, and may be 1/2, 1/4, or the like. In short, the size of the substrate holding surface of the holder PH in the Y-axis direction may be smaller than the size of the substrate P in the Y-axis direction to some extent. Actually, it is set to be the same (slightly larger) as the size of the shot area formed on the substrate P.

  In each of the above embodiments, the air levitation unit groups 84A and 84B are installed on the frame arranged separately from the coarse movement table 32, the fine movement stage 26, and the like, on one side and the other side of the holder PH in the Y-axis direction. However, at least one of the air levitation unit groups 84A and 84B may be mounted on the coarse motion table 32 so as to be movable in the X-axis direction, or follow the coarse motion table. Another moving body that moves may be provided, and an air levitation unit group may be mounted on the other moving body so as to be movable in the X-axis direction. In this case, the above-described substrate Y step feeding device 88 disposed inside the air levitation unit group on the coarse movement table 32 on which the air levitation unit group is mounted or another moving body that moves following the coarse movement table. May be provided.

  In each of the above embodiments, the case where the air levitation unit groups 84A and 84B are used for the purpose of preventing the substrate P from being bent is described. However, the present invention is not limited to this, and a contact-type rolling bearing using a roller or a ball is used. The apparatus for preventing the substrate from hanging down may be replaced with at least a part of the air levitation unit of each of the above embodiments. For the purpose of preventing the substrate P from being bent, a substrate drooping prevention device including a bearing member other than the air floating unit and the rolling bearing may be used.

  In each of the above embodiments, the case where the holder PH is mounted on the fine movement stage 26 has been described. However, the present invention is not limited to this, and when ceramics or the like is used as the material of the fine movement stage, an etching process or the like is performed on the upper part. In addition, a holding unit having a function equivalent to that of the holder PH for holding the substrate may be configured integrally with the fine movement stage.

  In addition, some of the components provided in common in each of the above embodiments may not necessarily be provided in the exposure apparatus. For example, a weight cancellation device is not essential. In this case, a moving stage for moving the holder is required, but the moving stage may be a so-called coarse / fine moving stage or a single 6DOF stage. In short, the moving stage only needs to be able to drive the holder in the XY plane (at least in the X-axis direction), and it is more desirable if it can be driven in the direction of six degrees of freedom.

  In each of the above-described embodiments, the case where the exposure apparatus is a projection exposure apparatus that performs scanning exposure with a step-and-scan operation of the substrate P has been described. However, the present invention is not limited to this, and the step-and-stitch method The above-described embodiments can also be applied to a proximity exposure apparatus that does not use a projection optical system.

In the exposure apparatus of each of the above embodiments, the illumination light is ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). It may be. As the illumination light, for example, a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium). In addition, harmonics converted into ultraviolet light using a nonlinear optical crystal may be used. A solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

  In each of the above-described embodiments, the case where the projection optical system PL is a multi-lens projection optical system including a plurality of projection optical systems (projection optical units) has been described. Not limited to one or more. The projection optical system is not limited to a multi-lens type projection optical system, and may be a projection optical system using an Offner type large mirror, for example.

  In each of the above-described embodiments, the case where the projection optical system PL has the same magnification is described. However, the present invention is not limited to this, and the projection optical system may be either a reduction system or an enlargement system.

  In each of the above embodiments, a light transmissive mask in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive mask substrate is used. As disclosed in Japanese Patent No. 6,778,257, an electronic mask (variable molding mask) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed, for example, Alternatively, a variable shaping mask using DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (also referred to as a spatial light modulator) may be used.

  The exposure apparatus according to each of the above embodiments is a substrate having a size (including at least one of an outer diameter, a diagonal line, and one side) of 500 mm or more, for example, a large substrate for a flat panel display (FPD) such as a liquid crystal display element. It is particularly effective to apply to an exposure apparatus that performs exposure. This is because the present invention has been made to cope with an increase in the size of the substrate.

  In addition, a liquid crystal display element as a micro device can be manufactured using the exposure apparatus according to each of the above embodiments. First, a so-called photolithography process is performed in which a pattern image is formed on a photosensitive substrate (such as a glass substrate coated with a resist). A predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate using the exposure apparatus of each of the above embodiments in this photolithography process. Thereafter, the exposed substrate is subjected to various processes such as a developing process, an etching process, and a resist stripping process, whereby a predetermined pattern is formed on the substrate. By repeating this pattern formation step a plurality of times, a plurality of layers of patterns are superimposed on the substrate. The alignment in each of the first layer exposure and the second and subsequent layer exposures is performed as described above. Thereafter, a liquid crystal display element as a micro device can be obtained through a color filter forming process, a cell assembling process, a module assembling process, and the like.

  The alignment method of the present invention is suitable for alignment of the substrate when the first layer is exposed to the substrate. The exposure method of the present invention is suitable for forming a plurality of partitioned regions in which a plurality of layer patterns are superimposed on a substrate. The device manufacturing method and the flat panel display manufacturing method of the present invention are suitable for manufacturing liquid crystal display elements and the like.

69 ... Substrate support member, 98 ... Substrate stage interferometer system, 122X ₁ , 122X ₂ ... X sensor, 122Y _{1 to} 122Y ₃ ... Y sensor, 124X ₁ , 124X ₂ ... X detection unit, 124Y _{1 to} 124Y ₃ ... Y detection _unit, 130X _1, 130X ₂ ... X _{interferometer,} 130Y 1 _{~130Y 3} ... Y interferometer, P ... substrate, SA1 to SA6 ... shot _{area, M} 11 ~M _{44 ...} mark, AL1~AL8 ... alignment detection system, IL ... illumination light.

Claims (15)

In forming a plurality of partitioned areas on a substrate, an alignment method for aligning the substrate at a predetermined position,
Each time a partition area is formed on the substrate, the substrate is moved stepwise in a plane parallel to the surface of the substrate, and position information of the same detection target portion of the substrate is detected before and after the step movement. To do
An alignment method comprising: aligning the substrate with respect to a predetermined position when forming the partition region based on a detection result of position information of the detection target portion.   The position alignment method according to claim 1, wherein the position information of the detection target part before the step movement is detected before the partition area is formed.   The detection target portion is a mark formed on the substrate prior to the partition region, and detection of positional information of the detection target portion before and after step movement of the substrate is performed by a plurality of known positional relationships. The alignment method according to claim 1, further comprising detecting the mark with each of mark detection systems.   The position alignment method according to claim 3, wherein the detection of the position information of the detection target portion before and after the step movement of the substrate includes detecting the same mark by the plurality of mark detection systems.   The detection target portion is an edge of the substrate, and the detection of the position information of the detection target portion before and after step movement of the substrate is performed by detecting the position of the edge using the same edge detection system. The alignment method according to claim 1 or 2 including.   The detection target part is an edge of the substrate, and the detection of the position information of the detection target part before and after step movement of the substrate detects different positions of the same edge using a plurality of edge detection systems. And a calibration method of detection results of a plurality of edge detection systems.   The detection target unit is a detection unit that is attached to and detached from the substrate, and detection of position information of the detection target unit before and after step movement of the substrate is performed by detecting the position of the detection unit attached to the substrate. The alignment method according to claim 1, comprising detecting using a system. An exposure method for exposing a substrate with an energy beam to form a plurality of partitioned regions in which a plurality of patterns are superimposed on the substrate,
In the first layer exposure for forming the plurality of partitioned regions on the substrate, the position of the substrate with respect to the exposure position using the alignment method according to any one of claims 1 to 7. Together
In the exposure of the second and subsequent layers that form the pattern region by superimposing the plurality of partition regions formed on the substrate, the pattern is formed on the substrate together with the pattern of each partition region during the exposure before the previous layer. An exposure method for aligning the substrate with respect to the exposure position by detecting the position of the mark. An exposure method for exposing a substrate with an energy beam to form a plurality of partitioned regions in which a plurality of layers of patterns are superimposed on the substrate, wherein the plurality of partitioned regions are formed on the substrate. In the exposure of the first layer, the substrate is integrated with a substrate support member that adsorbs and supports at least a part of the outer peripheral edge of the substrate, and irradiates a measurement surface onto a reflective surface provided on the substrate support member. The substrate interferometer system measures the position of the substrate, and based on the measurement result, aligns the substrate with the exposure position,
Marks formed on the substrate together with the pattern of the partition area at the time of the exposure before the previous layer in the exposure after the second layer that forms the pattern area overlapping the plurality of partition areas formed on the substrate An exposure method for aligning the substrate with respect to the exposure position by detecting the position of the substrate. An exposure method for driving a substrate in a first direction within a predetermined plane parallel to the surface of the substrate with respect to an exposure position and exposing a plurality of processing regions on the substrate with an energy beam,
Displace the substrate in the second direction perpendicular to the first direction within the predetermined plane at the position in the first direction according to the arrangement of the region to be processed on the substrate and the order of processing, and move it on the moving body. Carrying in the substrate;
And starting measurement for alignment of the substrate with respect to the exposure position at the position in the first direction where the substrate is carried.   In carrying in the substrate, the substrate is moved onto the movable body by displacing the substrate in one direction of the second direction in accordance with the arrangement of processing regions on the substrate and the order of processing. Item 11. The exposure method according to Item 10.   The method further includes displacing the substrate in the second direction at a position in the first direction according to the arrangement of the processing target region on the substrate and the order of processing, and unloading the substrate from the movable body. The exposure method according to claim 10 or 11.   13. The unloading includes displacing the substrate in one direction of the second direction according to the arrangement of processing target regions on the substrate and the order of processing, and unloading the substrate from the movable body. An exposure method according to 1. Exposing the substrate by the exposure method according to any one of claims 8 to 13,
Developing the exposed substrate. A device manufacturing method. Exposing a substrate used for a flat panel display as the substrate by the exposure method according to any one of claims 8 to 13,
Developing the exposed substrate. A method of manufacturing a flat panel display.

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