JP2013048131A - Resin coating device and resin coating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin coating device and a resin coating method in an LED package manufacturing system which allows for enhancement of production yield, by equalizing the emission characteristics of an LED package even when the emission wavelength of an LED element varies.SOLUTION: In the resin coating device used for manufacturing an LED package where an LED element is covered with a resin containing a phosphor, exciting light is irradiated toward a resin 8 applied to a trial coating material 43 for emission characteristics measurement. A deviation of the measurement results of emission characteristics of light reflected on the trial coating material 43 and passed through the resin 8, from prescribed emission characteristics is determined, and an appropriate coating amount of resin to be applied to the LED element for real production is derived based on the deviation.

Description

  The present invention relates to a resin coating apparatus and a resin coating method used in an LED package manufacturing system.

  In recent years, LEDs (light emitting diodes) having excellent characteristics of low power consumption and long life have been widely used as light sources for various lighting devices. Since the basic light emitted from the LED element is currently limited to three colors of red, green, and blue, in order to obtain white light suitable for general lighting applications, the above three basic lights are added. A method of obtaining white light by color mixing, a method of obtaining pseudo white light by combining a blue LED and a phosphor emitting yellow fluorescence having a complementary color relationship with blue are used. In recent years, the latter method has been widely used, and an illumination device using an LED package in which a blue LED and a YAG phosphor are combined has been used for a backlight of a liquid crystal panel (for example, a patent). Reference 1).

  In this patent document, after mounting an LED element on the bottom surface of a concave mounting portion having a reflecting surface on the side wall, YAG phosphor particles are dispersed in the mounting portion in which YAG phosphor particles are dispersed in the mounting portion. An LED package is configured by injecting a silicone resin, an epoxy resin, or the like to form a resin packaging portion. And, for the purpose of uniforming the height of the resin packaging part in the mounting part after the resin injection, a residual resin storage part for discharging and storing the surplus resin injected more than a specified amount from the mounting part is formed. An example is given. As a result, even when the discharge amount from the dispenser varies at the time of resin injection, a resin packaging portion having a certain resin amount and a specified height is formed on the LED element.

JP 2007-66969 A

  However, in the above-described prior art examples, there is a problem that the light emission characteristics of the LED package as a product vary due to variations in light emission wavelengths of individual LED elements. In other words, the LED element has undergone a manufacturing process in which a plurality of elements are formed on the wafer at the same time, and due to various error factors in this manufacturing process, such as non-uniform composition during film formation on the wafer, the wafer state Inevitably, variations in emission wavelength occur in the LED elements divided into individual pieces. And in the above-mentioned example, since the height of the resin wrapping part covering the LED element is set uniformly, the variation in the emission wavelength in the individual LED element is directly reflected in the variation in the emission characteristic of the LED package as a product. As a result, the number of defective products deviating from the acceptable quality range has been inevitably increased. As described above, the conventional LED package manufacturing technology has a problem in that the emission characteristics of the LED package as a product vary due to variations in the emission wavelength of the individual LED elements, leading to a decrease in production yield.

  Therefore, the present invention provides a resin coating apparatus and a resin coating method capable of making the light emission characteristics of the LED package uniform and improving the production yield even when the light emission wavelengths of the individual LED elements vary. Objective.

  The resin coating apparatus of the present invention includes: a resin coating unit that applies a resin containing a phosphor; and a first coating control unit that controls the resin coating unit and performs trial coating of the resin as a measurement coating process on a test coating material. A second coating control unit that controls the resin coating unit to apply the resin to the LED element as a production coating process, and a trial coating material on which the resin is trial-coated by the first coating control unit. The test application material placing part, the light source part arranged above the test application material placing part to emit excitation light for exciting the phosphor, and the excitation light trial applied to the test application material A light emission characteristic measuring unit that measures light emission characteristics of light that has passed through the resin that has been reflected by the test application material or the test application material mounting part and irradiated through the resin by irradiating the resin from above, and the light emission characteristics Measurement results from the measurement unit and pre-defined A deviation with respect to the light emission characteristic obtained is obtained, an application amount derivation processing unit for deriving an appropriate resin application amount of the resin to be applied to the LED element for production based on the deviation, and the appropriate resin application amount And a production execution processing unit for executing the production coating process for coating the LED element with the appropriate amount of resin applied to the LED element by instructing the second coating control unit.

  The resin coating method of the present invention is a resin coating method in which a resin containing a phosphor is applied to an LED element, and the resin is used as a test coating material for measuring light emission characteristics by a resin discharge unit that discharges a coating amount variably. The measurement coating step for coating, the trial coating material placement step for placing the trial coating material on which the resin has been trial-coated on the trial coating material placement portion, and the trial coating material placement portion are disposed above Excitation light emitting step for emitting excitation light for exciting the phosphor from the light source unit, and mounting the trial coating material or the trial coating material by irradiating the resin applied to the test coating material from above with the excitation light A light emission characteristic measuring step of measuring the light emission characteristic of the light reflected by the mounting portion and passing through the test-applied resin, and obtaining a deviation between the measurement result in the light emission characteristic measurement step and a predetermined light emission characteristic; Based on deviation An application amount deriving process for deriving an appropriate resin application amount of the resin to be applied to the LED element for actual production, and an application control unit for controlling the resin discharge unit with the derived appropriate resin application amount And a production execution step of executing a production coating process for coating the LED element with a resin having an appropriate resin coating amount by commanding.

  According to the present invention, the light emitted from the upper side of the resin applied to the test coating material is irradiated with excitation light and reflected by the test coating material or the test coating material mounting portion to measure the light emission characteristics of the light that has passed through the resin. Since the characteristic measuring unit is provided, the concentration of the phosphor contained in the resin can be measured well even with a small amount of resin. By obtaining a deviation between the measurement result and a predetermined light emission characteristic and deriving an appropriate resin application amount of the resin to be applied to the LED element for actual production based on the deviation, Even in the case where the emission wavelength varies, it is possible to make the emission characteristics of the LED package uniform and improve the production yield.

The block diagram of the LED package manufacturing system provided with the resin coating apparatus of one embodiment of this invention The block diagram of the LED package manufactured by the LED package manufacturing system of one embodiment of this invention Explanatory drawing of the supply form of LED element used in the LED package manufacturing system of one embodiment of this invention, and element characteristic information Explanatory drawing of the resin application information of one embodiment of the present invention Explanatory drawing of a structure and function of the component mounting apparatus of one embodiment of this invention Explanatory drawing of the map data used in the LED package manufacturing system of one embodiment of this invention Explanatory drawing of a structure and function of the resin coating apparatus of one embodiment of this invention Explanatory drawing of the light emission characteristic test | inspection function with which the resin coating apparatus of one embodiment of this invention was equipped 1 is a configuration diagram of a control system of an LED package manufacturing system according to an embodiment of the present invention. Flowchart of LED package manufacturing by LED package manufacturing system of one embodiment of the present invention Flow chart of threshold data creation processing for non-defective product determination in LED package manufacturing system of one embodiment of the present invention Explanatory drawing of the threshold value data for good quality determination in the LED package manufacturing system of one embodiment of the present invention Chromaticity diagram for explaining threshold data for non-defective product determination in the LED package manufacturing system of one embodiment of the present invention The flowchart of the resin application | coating operation process in the LED package manufacturing process by the LED package manufacturing system of one embodiment of this invention Explanatory drawing of the resin application | coating process in the LED package manufacturing process by the LED package manufacturing system of one embodiment of this invention Process explanatory drawing which shows the LED package manufacturing process by the LED package manufacturing system of one embodiment of this invention Process explanatory drawing which shows the LED package manufacturing process by the LED package manufacturing system of one embodiment of this invention Configuration diagram of light emission characteristic inspection unit of comparative example In one embodiment of the present invention, (a) a plan view of a path for collecting a tape-like test coating material, and (b) a plan view and a cross-sectional view of a path for collecting an embossed test coating material. Sectional drawing of the test coating material of another embodiment of this invention

First, an LED package manufacturing system 1 will be described with reference to FIG.
The LED package manufacturing system 1 has a function of manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor. In the present embodiment, as shown in FIG. 1, the component mounting apparatus M1, the curing apparatus M2, the wire bonding apparatus M3, the resin coating apparatus M4, the curing apparatus M5, and the piece cutting apparatus M6 are connected by the LAN system 2. These devices are connected and controlled by the management computer 3 in an integrated manner.

The component mounting apparatus M1 mounts the LED element 5 on the substrate 4 (see FIG. 2) serving as the base of the LED package by bonding with a resin adhesive.
The curing device M2 cures the resin adhesive used for bonding at the time of mounting by heating the substrate 4 after the LED element 5 is mounted.

The wire bonding apparatus M3 connects the electrode of the substrate 4 and the electrode of the LED element 5 with a bonding wire.
The resin coating apparatus M4 applies a resin containing a phosphor for each LED element 5 on the substrate 4 after wire bonding.

The curing device M5 cures the resin applied so as to cover the LED elements 5 by heating the substrate 4 after the resin application.
The piece cutting device M6 cuts the substrate 4 after the resin is cured into each individual LED element 5 and divides it into individual LED packages. Thereby, the LED package divided | segmented into the piece is completed.

  1 shows an example in which a production line is configured by arranging the components mounting device M1 to the piece cutting device M6 in series, but the LED package manufacturing system 1 does not necessarily have such a line configuration. However, as long as the information transmission described in the following description is appropriately performed, each process work may be sequentially executed by each of the distributed devices.

  Also, a plasma processing apparatus that performs plasma treatment for electrode cleaning prior to wire bonding before and after the wire bonding apparatus M3, and a surface modification for improving resin adhesion before resin application after wire bonding. You may make it interpose the plasma processing apparatus which performs the plasma processing for the purpose of quality.

Here, with reference to FIG. 2, FIG. 3, the board | substrate 4, the LED element 5, and the LED package 50 as a finished product used as the work object in the LED package manufacturing system 1 are demonstrated.
As shown in FIG. 2A, the substrate 4 is a multiple-type substrate in which a plurality of individual substrates 4a serving as a base of one LED package 50 in a finished product are formed. Each individual substrate 4a includes Each LED mounting portion 4b on which the LED element 5 is mounted is formed. The LED element 5 is mounted in the LED mounting portion 4b for each individual substrate 4a, and then the resin 8 is applied to cover the LED element 5 in the LED mounting portion 4b. Is cut for each individual substrate 4a to complete the LED package 50 shown in FIG.

  The LED package 50 has a function of irradiating white light used as a light source of various lighting devices, and includes a phosphor that emits yellow fluorescence that is complementary to the blue LED element 5 and blue. By combining with the resin 8, pseudo white light is obtained. As shown in FIG. 2 (b), the individual substrate 4a is provided with a cavity-shaped reflecting portion 4c having, for example, a circular or elliptical annular bank that forms the LED mounting portion 4b. The N-type part electrode 6a and the P-type part electrode 6b of the LED element 5 mounted inside the reflecting part 4c are connected to the wiring layers 4e and 4d formed on the upper surface of the individual substrate 4a by bonding wires 7, respectively. The The resin 8 covers the LED element 5 in this state and is applied to the inside of the reflecting portion 4c with a predetermined thickness. In the process in which the blue light emitted from the LED element 5 is irradiated through the resin 8, the resin 8 The contained phosphor is mixed with yellow light to emit light, and is irradiated as white light.

  As shown in FIG. 3A, the LED element 5 is configured by stacking an N-type semiconductor 5b and a P-type semiconductor 5c on a sapphire substrate 5a, and further covering the surface of the P-type semiconductor 5c with a transparent electrode 5d. An N-type part electrode 6a and a P-type part electrode 6b for external connection are formed on the N-type semiconductor 5b and the P-type semiconductor 5c, respectively.

  As shown in FIG. 3B, the LED elements 5 are taken out from the LED wafer 10 that is stuck and held on the holding sheet 10a in a state where a plurality of LED elements 5 are formed in a lump and then divided into pieces. The LED element 5 is divided into individual pieces from the wafer state due to various error factors in the manufacturing process, for example, non-uniform composition during film formation on the wafer. It is inevitable that variations occur in the case. If such an LED element 5 is mounted on the substrate 4 as it is, the emission characteristics of the LED package 50 as a product will vary.

  In the present embodiment, in order to prevent such quality defects due to variations in light emission characteristics, the light emission characteristics of a plurality of LED elements 5 manufactured in the same manufacturing process are measured in advance, Element characteristic information corresponding to data indicating the light emission characteristics of the LED elements 5 is created, and an appropriate amount of the resin 8 corresponding to the light emission characteristics of each LED element 5 is applied in the application of the resin 8. . In order to apply an appropriate amount of the resin 8, resin application information to be described later is prepared in advance.

First, element characteristic information will be described.
As shown in FIG. 3C, the LED elements 5 taken out from the LED wafer 10 are individually identified by element IDs (in this case, the individual LED elements 5 with the serial number (i) in the LED wafer 10). Are given sequentially to the light emission characteristic measuring device 11.

  In addition, as element ID, if it is the information which can specify the LED element 5 separately, you may make it use the matrix coordinate which shows the arrangement | sequence of the LED element 5 in the other data format, for example, the LED wafer 10, as it is. By using the element ID of such a format, the LED element 5 can be supplied in the state of the LED wafer 10 in the component mounting apparatus M1 described later.

  In the light emission characteristic measuring device 11, electric power is actually supplied to each LED element 5 through a probe to emit light, and the light is spectrally analyzed to measure predetermined items such as a light emission wavelength and light emission intensity. For the LED element 5 to be measured, a standard distribution of emission wavelengths is prepared as reference data in advance, and the wavelength range corresponding to the standard range in the distribution is further divided into a plurality of wavelength ranges. The plurality of target LED elements 5 are ranked according to the emission wavelength.

  Here, Bin codes [1] [2] [3] [4] [5] are assigned in order from the low wavelength side corresponding to each of the ranks set by dividing the wavelength range into five. ing. Then, element characteristic information 12 having a data structure in which the Bin code 12b is associated with the element ID 12a is created.

  That is, the element characteristic information 12 is information obtained by individually measuring the light emission characteristics including the light emission wavelengths of the plurality of LED elements 5 in advance. The element characteristic information 12 is prepared in advance by an LED element manufacturer or the like and is used for the LED package manufacturing system 1. Is transmitted. The element characteristic information 12 may be transmitted in a form recorded on a single storage medium, or may be transmitted to the management computer 3 via the LAN system 2. In any case, the transmitted element characteristic information 12 is stored in the management computer 3 and provided to the component mounting apparatus M1 as necessary.

  The plurality of LED elements 5 for which the light emission characteristic measurement is completed in this way are sorted for each characteristic rank as shown in FIG. 3D, and are distributed into five types according to each characteristic rank. Attached individually to 13a. Thereby, three types of LED sheets 13A, 13B, 13C, 13D, in which the LED elements 5 corresponding to the Bin codes [1], [2], [3], [4], and [5] are adhered and held on the adhesive sheet 13a, respectively. When the LED elements 5 are mounted on the individual substrates 4a of the board 4 when the LED elements 5 are mounted, the LED elements 5 are in the form of LED sheets 13A, 13B, 13C, 13D, and 13E that have already been ranked in this manner. Is supplied to the component mounting apparatus M1. At this time, each of the LED sheets 13A, 13B, 13C, 13D, and 13E indicates which of the Bin codes [1] [2] [3] [4] [5] the LED element 5 corresponding to is held. The element characteristic information 12 is provided from the management computer 3 in the form shown.

Next, resin application information prepared in advance corresponding to the above-described element characteristic information 12 will be described with reference to FIG.
In the LED package 50 configured to obtain white light by combining a blue LED and a YAG phosphor, the blue light emitted from the LED element 5 and the yellow light emitted from the phosphor excited by the blue light are emitted. Since mixing is performed, the amount of the phosphor particles in the concave LED mounting portion 4b on which the LED element 5 is mounted is an important factor in securing the normal light emission characteristics of the LED package 50 of the product.

  As described above, since there are variations classified by the Bin codes [1] [2] [3] [4] [5] in the emission wavelengths of the plurality of LED elements 5 that are simultaneously operated, the LEDs The appropriate amount of phosphor particles in the resin 8 applied to cover the element 5 varies depending on the Bin code [1] [2] [3] [4] [5].

  In the resin application information 14 prepared in the present embodiment, as shown in FIG. 4, the appropriate resin application amount for each Bin classification of the resin 8 containing YAG-based phosphor particles in a silicone resin, an epoxy resin, or the like, It is defined in advance according to the Bin code section 17 in units of nl (nanoliter). That is, if the LED 8 is covered and the resin 8 is accurately applied by the appropriate resin application amount shown in the resin application information 14, the amount of the phosphor particles in the resin covering the LED element 5 is an appropriate amount of supplying phosphor particles. This ensures the normal emission wavelength required for the finished product after the resin is thermally cured.

  Here, as shown in the phosphor concentration column 16, there are a plurality of phosphor concentrations indicating the concentration of the phosphor particles in the resin 8 (here, D1 (5%), D2 (10%), D3 (15%)). The appropriate resin coating amount of the resin 8 is also set to an appropriate value (uncomfortable expression) according to the phosphor concentration of the resin 8 to be used.

  That is, when the resin having the phosphor concentration D1 is applied, the appropriate resin application amounts VA0, VB0, VC0, VD0, VE0 (for Bin codes [1] [2] [3] [4] [5], respectively ( The resin 8 having an appropriate resin application amount 15 (1)) is applied. Similarly, when a resin having a phosphor concentration D2 is applied, the appropriate resin application amounts VF0, VG0, VH0, VJ0, and VK0 for each of the Bin codes [1] [2] [3] [4] [5]. (Appropriate resin application amount 15 (2)) of resin 8 is applied. In addition, when the resin having the phosphor concentration D3 is applied, the appropriate resin application amounts VL0, VM0, VN0, VP0, VR0 (appropriate) for each of the Bin codes [1] [2] [3] [4] [5]. Resin 8 having a resin application amount of 15 (3)) is applied. The appropriate resin coating amount is set for each of a plurality of different phosphor concentrations as described above, in order to ensure quality by applying the resin 8 having the optimum phosphor concentration according to the degree of variation in the emission wavelength. This is because it is more preferable.

The configuration and function of the component mounting apparatus M1 will be described with reference to FIG.
As shown in the plan view of FIG. 5A, the component mounting apparatus M1 includes a substrate transport mechanism 21 that transports the work target substrate 4 supplied from the upstream side in the substrate transport direction (arrow a). The substrate transport mechanism 21 is provided with an adhesive application part A shown in section AA in FIG. 5B and a component mounting part B shown in section BB in FIG. It is installed.

  The adhesive application unit A is disposed on the side of the substrate transport mechanism 21 and supplies the resin adhesive 23 in the form of a coating film having a predetermined film thickness, and the substrate transport mechanism 21 and the adhesive supply unit 22. Is provided with an adhesive transfer mechanism 24 that is movable in the horizontal direction (arrow b).

  Further, the component mounting part B is disposed on the side of the board transport mechanism 21, and the parts supply mechanism 25 and the board transport mechanism 21 that hold the LED sheets 13A, 13B, 13C, 13D, and 13E shown in FIG. A component mounting mechanism 26 that is movable in the horizontal direction (arrow c) above the supply mechanism 25 is provided.

  As shown in FIG. 5B, the substrate 4 carried into the substrate transport mechanism 21 is positioned by the adhesive application portion A, and is bonded to the LED mounting portion 4b formed on each individual substrate 4a. The agent 23 is applied.

  That is, first, the adhesive transfer mechanism 24 is moved above the adhesive supply unit 22 so that the transfer pin 24a is brought into contact with the coating film of the resin adhesive 23 formed on the transfer surface 22a, and the resin adhesive 23 is adhered. Next, the adhesive transfer mechanism 24 is moved above the substrate 4 and the transfer pin 24a is lowered to the LED mounting portion 4b (arrow d), whereby the resin adhesive 23 attached to the transfer pin 24a is moved into the LED mounting portion 4b. Supplied by transfer to the element mounting position.

  Next, the substrate 4 after application of the adhesive is conveyed to the downstream side, positioned at the component mounting portion B as shown in FIG. 5 (c), and the LED elements are targeted for each LED mounting portion 4b after the adhesive is supplied. 5 is implemented.

  That is, first, the component mounting mechanism 26 is moved above the component supply mechanism 25 to lower the mounting nozzle 26a with respect to any of the LED sheets 13A, 13B, 13C, 13D, and 13E held by the component supply mechanism 25, The LED element 5 is held and taken out by the mounting nozzle 26a. Next, the component mounting mechanism 26 is moved above the LED mounting portion 4b of the substrate 4 to lower the mounting nozzle 26a (arrow e), whereby the LED element 5 held by the mounting nozzle 26a is bonded to the adhesive in the LED mounting portion 4b. It is mounted at the element mounting position where is applied.

  In mounting the LED element 5 on the board 4 by the component mounting apparatus M1, any one of the LED sheets 13A, 13B, 13C, 13D, and 13E in the element mounting program created in advance, that is, the individual mounting operation by the component mounting mechanism 26, is used. The order in which the LED elements 5 are taken out and mounted on the plurality of individual boards 4a of the board 4 is set in advance, and the component mounting work is executed according to this element mounting program.

  When the component mounting work is executed, mounting position information 71a (see FIG. 9) indicating which of the plurality of individual boards 4a of the board 4 is mounted from the work execution history is extracted. Record. The mounting position information 71a and the LED element 5 mounted on each individual substrate 4a correspond to any characteristic rank (Bin code [1] [2] [3] [4] [5]). Data associated with the element characteristic information 12 indicating the above is created as map data 18 shown in FIG. 6 by the map creation processing unit 74 (see FIG. 9).

  In FIG. 6, the individual positions of the plurality of individual substrates 4a of the substrate 4 are specified by combinations of matrix coordinates 19X and 19Y indicating the positions in the X direction and the Y direction, respectively. Then, by associating the Bin code to which the LED element 5 mounted at the position belongs to the individual cell of the matrix constituted by the matrix coordinates 19X and 19Y, the LED element 5 mounted by the component mounting apparatus M1 on the substrate 4 Map data 18 in which the mounting position information 71a indicating the position and the element characteristic information 12 about the LED element 5 are associated is created.

  That is, the component mounting apparatus M1 displays the map data 18 in which the mounting position information indicating the position of the LED element 5 mounted by the apparatus on the board 4 and the element characteristic information 12 on the LED element 5 are associated with the board 4 The map creation processing unit 74 is created every time. The created map data 18 is transmitted as feedforward data to the resin coating apparatus M4 described below via the LAN system 2.

Next, with reference to FIG. 7 and FIG. 8, the structure and function of the resin coating device M4 will be described.
The resin coating device M4 has a function of coating the resin 8 so as to cover the plurality of LED elements 5 mounted on the substrate 4 by the component mounting device M1. As shown in the plan view of FIG. 7A, the resin coating apparatus M4 transfers the work target substrate 4 supplied from the upstream side to the substrate transport mechanism 31 that transports the substrate 4 in the substrate transport direction (arrow f). ) Is provided with a resin coating portion C shown in a CC cross section. The resin application part C is provided with a resin discharge head 32 configured to discharge the resin 8 from the discharge nozzle 33a attached to the lower end.

  As shown in FIG. 7B, the resin discharge head 32 is driven by the nozzle moving mechanism 34, and the nozzle moving mechanism 34 is controlled by the application control unit 36, whereby the horizontal direction (arrow g shown in FIG. 7A). ) Move and lift operations. The resin discharge head 32 is supplied with the resin 8 stored in a syringe attached to the dispenser 33, and the resin discharge mechanism 35 discharges the resin 8 in the dispenser 33 by applying air pressure into the dispenser 33. It is discharged through the nozzle 33 a and applied to the LED mounting portion 4 b formed on the substrate 4. At this time, by controlling the resin discharge mechanism 35 by the application control unit 36, the discharge amount of the resin 8 can be arbitrarily controlled. That is, the resin application part C has a function of discharging the resin 8 in a variable amount and applying it to any application target position.

  In addition to the pneumatic dispenser 33, various liquid discharge methods such as a plunger method using a mechanical cylinder and a screw pump method can be employed for the resin discharge mechanism 35.

  At the side of the substrate transport mechanism 31, a test hitting / measuring unit 40 is disposed within the movement range of the resin discharge head 32. Prior to the actual production application operation for applying the resin 8 to the LED mounting portion 4b of the substrate 4, the test hitting / measurement unit 40 determines whether or not the application amount of the resin 8 is appropriate. It has a function of determining by measuring the light emission characteristics.

  The composition and properties of the resin 8 containing the phosphor particles are not necessarily stable, and even if an appropriate amount of resin is previously set in the resin application information 14, the concentration of the phosphor and the resin over time It is inevitable that the viscosity fluctuates.

  For this reason, even if the resin 8 is discharged with the discharge parameter corresponding to the preset appropriate application amount, the resin application amount itself varies from the preset appropriate value, or the application amount itself is appropriate. However, the amount of the phosphor particles to be originally supplied varies depending on the concentration change.

  In order to eliminate such inconveniences, in the present embodiment, trial coating for inspecting whether or not an appropriate supply amount of phosphor particles is supplied at a predetermined interval is executed by the resin coating apparatus M4. Further, by measuring the light emission characteristics of the test-applied resin, the supply amount of the phosphor particles is stabilized in accordance with the light emission characteristics that should originally exist.

  The resin coating unit C provided in the resin coating apparatus M4 shown in the present embodiment includes a measurement coating process for trial coating the resin 8 on the trial coating material 43 for measuring the above-described light emission characteristics, and a substrate for actual production. 4 has a function of executing a production coating process to be applied to the LED element 5 mounted in the state 4. Both the coating process for measurement and the coating process for production are executed when the coating control unit 36 controls the resin coating unit C. However, it may be controlled by using two different application control units for the measurement application process and the production application process.

With reference to FIG. 8, the detailed configuration of the trial hitting / measurement unit 40 will be described.
As shown in FIG. 8A, the test application material 43 is wound and supplied on the supply reel 47, and is fed along the upper surface of the test strike stage 40a. The sheet is wound around a collection reel 48 driven by a winding motor 49 via the gap.

  As a mechanism for collecting the test application material 43, various methods such as a method of feeding the test application material 43 into the collection box by a feeding mechanism in addition to a method of collecting the test application material 43 by winding it around the collection reel 48 are adopted. Can do.

  The irradiation unit 46 has a function of irradiating the test coating material 43 with the excitation light emitted from the light source unit 45, and the excitation light emitted by the LED that generates white light or blue light from the light source unit 45 is emitted. The light is guided into a light shielding box 46a having a simple dark box function via a light focusing tool 46b guided by a fiber cable.

  The light source unit 45 has a function of emitting excitation light that excites the phosphor contained in the resin 8. In the present embodiment, the light source unit 45 is disposed above the test application material mounting unit 41 to test the measurement light. The coating material 43 is irradiated from above via the light focusing tool 46b.

  Here, as the test application material 43, a flat sheet-like member made of a tape material having a predetermined width, or an emboss type in which an embossed portion 43a corresponding to the concave shape of the LED package 50 is provided on the lower surface of the same tape material. Or the like is used (see FIG. 8B).

  In the process in which the test application material 43 is fed on the test hitting / measurement unit 40, the resin 8 is test-applied to the test application material 43 by the resin discharge head 32. In this trial application, as shown in FIG. 8B, a predetermined amount of resin 8 is applied to the trial application material 43 by the discharge nozzle 33a with respect to the trial application material 43 supported on the lower surface side by the trial strike stage 40a. This is done by discharging.

  FIG. 8B shows a state in which the preset appropriate discharge amount of the resin 8 defined by the resin application information 14 is applied to the test application material 43 made of the tape material described above. The planar shape of the application of the resin 8 is a circle.

  (B) in FIG. 8B shows a state in which the resin 8 having the preset appropriate discharge amount is similarly applied to the embossed portion 43a of the above-described emboss type test application material 43. The planar shape of the opening of the embossed portion 43a is circular.

  In addition, as will be described later, the resin 8 applied in the test hitting stage 40a is a test application for empirically determining whether or not the phosphor supply amount is appropriate for the target LED element 5. Therefore, in the case where the resin 8 is continuously applied onto the test application material 43 at a plurality of points by the same test application operation by the resin discharge head 32, a known relationship indicating the correlation between the measured light emission characteristics and the application amount is known. Based on the data, the application amount is varied in stages and applied.

  In this way, the white light emitted from the light source unit 45 is irradiated from above through the light focusing tool 46b onto the test coating material 43 guided into the light shielding box 46a after the resin 8 is test-coated. .

  As the test coating material 43, a material that reflects on the surface the light emitted when the phosphor contained in the resin 8 is excited by excitation light is used. An integrating sphere 44 is disposed above the test application material 43.

  Specific examples of the trial coating material 43 include those in which a light-transmitting material is used as the base material, and the surface of the base material is coated with a reflective material coating or a diffusion material coating. In the case of a non-translucent base material, the base material itself may be surface-treated so as to be reflected or diffused, or the surface of the base material may be provided with a reflective material coating or a diffusion material coating. it can.

FIG. 8C shows the structure of the test application material placing portion 41 and the integrating sphere 44.
The test application material placing portion 41 has a structure in which an upper guide member 41 c having a function of guiding both end surfaces of the test application material 43 is mounted on the upper surface of the lower support member 41 b that supports the lower surface of the test application material 43. Yes.

  The test application material placement unit 41 guides the test application material 43 during conveyance in the test hitting / measurement unit 40, and places the test application material 43 on which the resin 8 has been applied by trial in the measurement application process to position the test application material 43. It has a function to hold.

  The integrating sphere 44 has a circular upper opening 63 and a circular lower opening 64. The excitation light h from the light focusing tool 46b is converted into parallel light by the collimator lens 65, and further narrowed down by the iris diaphragm 66 to be equivalent to the upper opening 63 of the integrating sphere 44, so that the upper opening 63 due to excess light and the lower light are reduced. The irregular reflection at the side opening 64 is suppressed. The excitation light h that has passed through the iris diaphragm 66 passes through the upper opening 63 and the lower opening 64 of the integrating sphere 44 and is irradiated onto the resin 8 from above. As a result, the excitation light and the light (arrow i) generated from the phosphor contained in the resin 8 enter the reflection space 44b of the integrating sphere 44 from the lower opening 64 and are totally reflected by the spherical reflecting surface 44c (arrow j). In the process of repeating, the measurement light (arrow k) is extracted from the output part 44d of the integrating sphere 44 and received by the spectroscope 42.

  In the above-described configuration, the excitation light emitted by the LED package used for the light source unit 45 is applied to the resin 8 that has been trial-coated on the trial coating material 43. In this process, the blue light component contained in the white light excites the phosphor in the resin 8 to emit yellow light. White light obtained by adding and mixing yellow light and blue light is irradiated upward from the resin 8 and is received by the spectroscope 42 via the integrating sphere 44 described above.

  The received white light is analyzed by the light emission characteristic measurement processing unit 39 to measure the light emission characteristics as shown in FIG. 7B. Here, the light emission characteristics such as the color tone rank of white light and the luminous flux are inspected, and a deviation from the prescribed light emission characteristics is detected as the inspection result. The integrating sphere 44, the spectroscope 42, and the light emission characteristic measurement processing unit 39 emit excitation light emitted from the light source unit 45 on the resin 8 applied to the test coating material 43 (here, white light emitted from the white LED). ) From above, the light emitted from the resin 8 is received by the spectroscope 42 via the integrating sphere 44, and a light emission characteristic measuring unit is configured to measure the light emission characteristic of the light emitted from the resin 8. .

(Comparative example)
FIG. 18 shows a comparative example.
In the light emission characteristic measuring unit of this comparative example, the excitation light h is applied to the resin 8 from above, and the light i generated from the phosphor mixed with the resin 8 passes through the test coating material 43 and passes downward. In order to detect this light, the integrating sphere 44 is arranged below the test coating material 43, which is different from the embodiment shown in FIG. Others are the same as the embodiment.

In the case of the embodiment shown in FIG. 8C where the emission characteristic measuring unit is shown, the following effects are obtained as compared with the comparative example.
In the case of the light emission characteristic measuring unit of the comparative example, yellow light is radiated from the resin 8 in all directions when the resin 8 is irradiated with excitation light. Therefore, the integrating sphere disposed below the test coating material 43. There is leakage light that cannot be received at 44. Therefore, compared to the case of the embodiment, when the amount of the trial coating of the resin 8 is the same, the detection sensitivity is low, and the detection sensitivity of the density fluctuation is low.

  On the other hand, in the case of the embodiment shown in FIG. 8C, the integrating sphere 44 is disposed above the test coating material 43, and the diameter of the excitation light irradiated by the collimating lens 65 toward the integrating sphere 44. Is the same as the upper opening 63 of the integrating sphere 44. Further, in the case of (a) in FIG. 8B, when the test application material 43 is (a) in FIG. 8B, the excitation light is made the same or slightly smaller than the circular diameter of the resin 8 by the upper opening 63 of the integrating sphere 44. The resin 8 is irradiated through the lower opening 64 of the integrating sphere 44.

  When the test application material 43 is (b) in FIG. 8B, the integrating sphere is made after the excitation light is made the same or slightly smaller in diameter than the opening of the embossed portion 43a by the upper opening 63 of the integrating sphere 44. The resin 8 is irradiated through the lower opening 64 of 44.

  In any of the cases (a) and (b) of FIG. 8B, most of the yellow light generated from the phosphor contained in the resin 8 is incident on the integrating sphere 44, and therefore leaks as compared with the comparative example. When there is little light and the amount of trial coating of the resin 8 is the same as in the comparative example, the detection sensitivity is high and the detection sensitivity of density fluctuation is high.

  The yield of the LED package is improved by correcting the application amount of the resin 8 in the resin coating apparatus using the light emission characteristic measuring unit of this embodiment in the LED package manufacturing system. Further, when the amount of trial coating of the resin 8 is the same as in the comparative example, the detection sensitivity is high and the detection sensitivity of density fluctuation is high, so that the amount of trial coating is reduced to improve productivity. You can also.

  Further, as shown in FIG. 8A, the post-treatment of the used test coating material 43 is performed by providing a top tape supply unit 67 while being wound around the collection reel 48 through the irradiation unit 46. Can be improved. The top tape supply unit 67 is configured to affix a sealing material 68 a on the upper surface of the used test application material 43 where the test-coated resin 8 remains, so as to cover the test-coated resin 8. Thus, it is possible to avoid the situation where the uncured resin 8 is zeroed when the collection reel 48 is switched.

  FIG. 19A shows a sealing state by the sealing material 68a when a tape-like material having a flat surface is used as the test coating material 43. FIG. An arrow P46 indicates the position of the irradiation unit 46. An arrow 77 indicates the transfer direction of the test coating material 43.

  With respect to the trial coating material 43 on which the used resin 8 used for the measurement in the irradiation unit 46 is placed, on the lower side of the irradiation unit 46, the upper surface and the upper part of the trial coating material 43 from the notch 69 of the upper guide member 41c. A sealing material 68a is supplied between the guide members 41c. In this case, an embossed portion 75 is formed on the sealing material 68 a, and an adhesive 76 is applied to the surface to be attached to the test application material 43. Therefore, as the test application material 43 is wound around the collection reel 48, the seal material 68a is attached to the upper surface of the test application material 43, and the used resin 8 is embossed between the test application material 43 and the seal material 68a. Wrapped with part 75 and sealed.

  FIG. 19B shows a sealed state by the sealing material 68b when the trial coating material 43 on which the embossed portion 43a is formed is used. With respect to the trial coating material 43 on which the used resin 8 used for the measurement in the irradiation unit 46 is placed, on the lower side of the irradiation unit 46, the upper surface and the upper part of the trial coating material 43 from the notch 69 of the upper guide member 41c A sealing material 68b having a flat surface is supplied between the guide members 41c. In this case, an adhesive 76 is applied to the surface of the sealing material 68b attached to the test application material 43. Therefore, as the test application material 43 is wound around the collection reel 48, the seal material 68 b is attached to the upper surface of the test application material 43, and the used resin 8 is sealed with the embossed portion 43 a of the test application material 43. It is wrapped and sealed with a material 68b.

  As shown in FIG. 7B, the measurement result of the light emission characteristic measurement processing unit 39 is sent to the application amount derivation processing unit 38, and the application amount derivation processing unit 38 defines the measurement result of the light emission characteristic measurement processing unit 39 in advance. A deviation from the emitted light emission characteristic is obtained, and a process for deriving an appropriate resin application amount of the resin 8 to be applied to the LED element 5 for actual production is performed based on the deviation. The new appropriate discharge amount derived by the application amount derivation processing unit 38 is sent to the production execution processing unit 37, and the production execution processing unit 37 commands the newly derived appropriate resin application amount to the application control unit 36. Accordingly, the application control unit 36 controls the nozzle moving mechanism 34 and the resin discharge mechanism 35 to perform a production application process for applying an appropriate resin application amount of the resin 8 to the LED elements 5 mounted on the substrate 4. 32.

  In this production coating process, first, an appropriate amount of resin 8 specified by the resin coating information 14 is actually applied, and light emission characteristics are measured while the resin 8 is uncured. Then, based on the obtained measurement results, a non-defective range of emission characteristic measurement values when the emission characteristics are measured for the resin 8 applied in the production coating is set, and the non-defective range is determined for the quality determination in the production coating. It is used as a threshold value (see threshold value data 81a shown in FIG. 9).

  That is, in the resin coating method in the LED package manufacturing system shown in the present embodiment, a white LED is used as the light source unit 45 for measuring the light emission characteristics, and a pre-specified condition is used as a basis for setting a good / bad judgment threshold value in production coating. As the light emission characteristics, the normal light emission characteristics required for the finished product in which the resin 8 applied to the LED element 5 is cured are biased by the difference in the light emission characteristics due to the resin 8 being in an uncured state. Emission characteristics are used. Thereby, control of the resin application amount in the resin application process to the LED element 5 can be performed based on the normal light emission characteristics of the finished product.

  In the present embodiment, the LED package 50 that emits white light is used as the light source unit 45. Thereby, the light emission characteristic measurement of the resin 8 applied by trial can be performed by the light having the same characteristic as the excitation light emitted in the finished LED package 50, and a more reliable test result can be obtained. . It is not always necessary to use the same LED package 50 as that used for the finished product. For light emission characteristics measurement, a light source device that can stably emit blue light having a constant wavelength (for example, a blue LED that emits blue light or a blue laser light source) is used as a light source unit for inspection. be able to. However, by using the LED package 50 that emits white light using a blue LED, there is an advantage that a light source device with stable quality can be selected at low cost. Here, blue light having a predetermined wavelength may be extracted using a band-pass filter.

Next, the configuration of the control system of the LED package manufacturing system 1 will be described with reference to FIG.
Here, among the components of each device constituting the LED package manufacturing system 1, in the management computer 3, the component mounting device M1, and the resin coating device M4, the element characteristic information 12, the resin coating information 14, the map data 18, and the above-mentioned The components related to the transmission / reception and update processing of the threshold data 81a are shown.

  In FIG. 9, the management computer 3 includes a system control unit 60, a storage unit 61, and a communication unit 62. The system control unit 60 controls the LED package manufacturing work by the LED package manufacturing system 1 in an integrated manner. In addition to programs and data necessary for control processing by the system control unit 60, the storage unit 61 stores element characteristic information 12, resin application information 14, and map data 18 and threshold data 81a as necessary. ing. The communication unit 62 is connected to other devices via the LAN system 2 and exchanges control signals and data. The element characteristic information 12 and the resin application information 14 are transmitted from the outside via the LAN system 2 and the communication unit 62 or via a single storage medium such as a CD ROM, USB memory storage, SD card, and stored in the storage unit 61. Is done.

  The component mounting apparatus M1 includes a mounting control unit 70, a storage unit 71, a communication unit 72, a mechanism driving unit 73, and a map creation processing unit 74. The mounting control unit 70 controls each unit described below based on various programs and data stored in the storage unit 71 in order to execute a component mounting operation by the component mounting apparatus M1. The storage unit 71 stores mounting position information 71 a and element characteristic information 12 in addition to programs and data necessary for control processing by the mounting control unit 70. The mounting position information 71 a is created from execution history data of mounting operation control by the mounting control unit 70. The element characteristic information 12 is transmitted from the management computer 3 via the LAN system 2. The communication unit 72 is connected to other devices via the LAN system 2 and exchanges control signals and data.

The mechanism driving unit 73 is controlled by the mounting control unit 70 to drive the component supply mechanism 25 and the component mounting mechanism 26. As a result, the LED elements 5 are mounted on the individual substrates 4 a of the substrate 4. The map creation processing unit 74 (map data creation means) includes mounting position information 71a indicating the position of the LED element 5 on the substrate 4 stored in the storage unit 71 and mounted by the component mounting apparatus M1, and an element for the LED element 5 A process of creating the map data 18 associated with the characteristic information 12 for each substrate 4 is performed. That is, the map data creating means is provided in the component mounting apparatus M1, and the map data 18 is transmitted from the component mounting apparatus M1 to the resin coating apparatus M4. The map data 18 may be transmitted from the component mounting apparatus M1 to the resin coating apparatus M4 via the management computer 3. In this case, the map data 18 is also stored in the storage unit 61 of the management computer 3 as shown in FIG.

  The resin coating apparatus M4 includes a coating control unit 36, a storage unit 81, a communication unit 82, a production execution processing unit 37, a coating amount derivation processing unit 38, and a light emission characteristic measurement processing unit 39. The application control unit 36 controls the nozzle moving mechanism 34, the resin discharge mechanism 35, and the test hitting / measurement unit 40 that constitute the resin application unit C, so that the resin 8 is applied to the test application material 43 for light emission characteristic measurement. The measurement coating process to be performed and the production coating process to be applied to the LED element 5 for actual production are performed.

  The storage unit 81 stores the resin application information 14, the map data 18, the threshold data 81a, and the actual production application amount 81b, in addition to the programs and data necessary for the control processing by the application control unit 36. The resin application information 14 is transmitted from the management computer 3 via the LAN system 2, and the map data 18 is similarly transmitted from the component mounting apparatus M1 via the LAN system 2. The communication unit 82 is connected to other devices via the LAN system 2 and exchanges control signals and data.

  The light emission characteristic measurement processing unit 39 performs a process of measuring the light emission characteristic of light emitted by the resin by irradiating the resin 8 applied to the test coating material 43 with the excitation light emitted from the light source unit 45. The application amount derivation processing unit 38 obtains a deviation between the measurement result of the light emission characteristic measurement processing unit 39 and a predetermined light emission characteristic, and based on this deviation, the resin 8 to be applied to the LED element 5 for actual production. An arithmetic process for deriving an appropriate resin application amount is performed. Then, the production execution processing unit 37 instructs the application control unit 36 to specify the appropriate resin application amount derived by the application amount derivation processing unit 38, thereby applying the appropriate resin application amount of resin to the LED element 5. Execute the process.

  In the configuration shown in FIG. 9, the processing function other than the function for executing the operation operation unique to each apparatus, for example, the function of the map creation processing unit 74 provided in the component mounting apparatus M1, and the resin coating apparatus M4 are provided. The function of the applied amount derivation processing unit 38 is not necessarily attached to the apparatus. For example, the functions of the map creation processing unit 74 and the application amount derivation processing unit 38 are covered by the arithmetic processing function of the system control unit 60 of the management computer 3 and necessary signal exchange is performed via the LAN system 2. It may be configured.

  In the configuration of the LED package manufacturing system 1 described above, the component mounting apparatus M1 and the resin coating apparatus M4 are both connected to the LAN system 2. Then, the management computer 3 and the LAN system 2 in which the element characteristic information 12 is stored in the storage unit 61 uses the information obtained by separately measuring the emission characteristics including the emission wavelengths of the plurality of LED elements 5 in advance as the element characteristic information. 12 is element characteristic information providing means provided to the component mounting apparatus M1. Similarly, the management computer 3 and the LAN system 2 in which the resin application information 14 is stored in the storage unit 61, the appropriate resin application amount of the resin 8 and the element characteristic information for obtaining the LED package 50 having the prescribed light emission characteristics, This is resin information providing means for providing information corresponding to the information as resin coating information to the resin coating apparatus M4.

  That is, the element characteristic information providing means for providing the element characteristic information 12 to the component mounting apparatus M1 and the resin information providing means for providing the resin coating information 14 to the resin coating apparatus M4 are the storage unit 61 of the management computer 3 which is an external storage means. The element characteristic information and the resin application information read out are transmitted to the component mounting apparatus M1 and the resin application apparatus M4 via the LAN system 2, respectively.

  Next, the LED package manufacturing process executed by the LED package manufacturing system 1 will be described along the flow of FIG. 10 with reference to the drawings. First, element characteristic information 12 and resin application information 14 are acquired (ST1). That is, the proper resin application amount of the resin 8 for obtaining the LED package 50 having the element characteristic information 12 obtained by individually measuring the emission characteristics including the emission wavelengths of the plurality of LED elements 5 in advance and the prescribed emission characteristics. The resin application information 14 in which the element characteristic information 12 is associated is acquired from an external device via the LAN system 2 or via a storage medium.

Thereafter, the board 4 to be mounted is carried into the component mounting apparatus M1 (ST2). Then, as shown in FIG. 16A, the resin adhesive 23 is supplied to the element mounting position in the LED mounting portion 4b by raising and lowering the transfer pin 24a of the adhesive transfer mechanism 24 (arrow n). 16 (b), the LED element 5 held by the mounting nozzle 26a of the component mounting mechanism 26 is lowered (arrow o) and mounted in the LED mounting portion 4b of the substrate 4 via the resin adhesive 23 ( ST3). Then, the map creation processing unit 74 creates map data 18 that associates the mounting position information 71a with the element characteristic information 12 of each LED element 5 for the board 4 from the execution data of the component mounting work (ST4). ). Next, the map data 18 is transmitted from the component mounting apparatus M1 to the resin coating apparatus M4, and the resin coating information 14 is transmitted from the management computer 3 to the resin coating apparatus M4 (ST5). Thereby, it will be in the state which can perform the resin application | coating operation | work by the resin application | coating apparatus M4.

  Next, the substrate 4 after component mounting is sent to the curing device M2, where it is heated, whereby the resin adhesive 23 is thermally cured to become a resin adhesive 23a as shown in FIG. The element 5 is fixed to the individual substrate 4a. Next, the substrate 4 after resin curing is sent to the wire bonding apparatus M3, and as shown in FIG. 16D, the wiring layers 4e and 4d of the individual substrate 4a are respectively connected to the N-type portion electrodes 6a and P of the LED element 5. The mold part electrode 6 b is connected to the bonding wire 7.

  Next, threshold data creation processing for non-defective product determination is executed (ST6). This process is executed in order to set a pass / fail judgment threshold value in production application (see threshold value data 81a shown in FIG. 9). Bin codes [1] [2] [3] [ 4] Repeatedly for each of the production coatings corresponding to [5]. Details of the threshold data creation processing will be described with reference to FIGS. In FIG. 11, first, a resin 8 containing the phosphor specified in the resin application information 14 at a genuine concentration is prepared (ST11). Then, after setting the resin 8 on the resin discharge head 32, the resin discharge head 32 is moved to the test hitting stage 40 a of the test hitting / measurement unit 40, and the resin 8 is applied to the specified application amount (appropriate resin application) indicated in the resin application information 14. The amount is applied to the trial coating material 43 (ST12). Next, the resin 8 applied to the test application material 43 is moved onto the test application material mounting portion 41, the LED element 5 is caused to emit light, and the light emission characteristics in an uncured state of the resin 8 are measured by the light emission characteristic measurement section having the above-described configuration. Measure (ST13). Then, based on the light emission characteristic measurement value 39a which is the measurement result of the light emission characteristic measured by the light emission characteristic measurement unit, a non-defective product determination range of the measurement value for determining the light emission characteristic to be non-defective is set (ST14). The non-defective product determination range is stored as threshold data 81a in the storage unit 81, transferred to the management computer 3, and stored in the storage unit 61 (ST15).

  FIG. 12 shows that the threshold data created in this way, that is, the measured emission characteristics and emission characteristics obtained in the uncured state of the resin 8 after application of the resin 8 containing a phosphor with a genuine content is a non-defective product. The non-defective product judgment range (threshold value) of the measured value for judgment is shown. 12A, 12B, and 12C, the phosphor concentration in the resin 8 is 5%, respectively. The threshold values corresponding to the Bin codes [1] [2] [3] [4] [5] in the case of 10% and 15% are shown.

For example, as shown in FIG. 12 (a), when the phosphor concentration of the resin 8 is 5%, each of the Bin codes 12b corresponds to the application amount indicated by the appropriate resin application amount 15 (1). In addition, the measurement result obtained by measuring the light emission characteristics of the light emitted from the resin 8 by irradiating the resin 8 coated with the respective coating amounts with the blue light of the LED element 5 is the light emission characteristic measured value 39a (1 ). Then, threshold data 81a (1) is set based on the respective emission characteristic measurement values 39a (1). For example, the measurement result of measuring the light emission characteristics of the resin 8 applied with the appropriate resin application amount VA0 corresponding to the Bin code [1] is based on the chromaticity coordinates ZA0 (XA0, YA0) on the chromaticity table shown in FIG. expressed. With this chromaticity coordinate ZA0 as the center, a predetermined range (for example, ± 10%) for the X coordinate and Y coordinate on the chromaticity table is set as a non-defective product determination range (threshold value). Similarly, for the appropriate resin coating amounts corresponding to the other Bin codes [2] to [5], a non-defective product determination range (threshold value) is set based on the light emission characteristic measurement result (chromaticity table shown in FIG. 13). (See chromaticity coordinates ZB0-ZE0 above). Here, the predetermined range set as the threshold is appropriately set according to the accuracy level of the light emission characteristics required for the LED package 50 as a product.

  12B and 12C show the emission characteristic measurement values and the non-defective product determination range (threshold value) when the phosphor concentrations of the resin 8 are 10% and 15%, respectively. 12 (b) and 12 (c), the appropriate resin application amount 15 (2) and the appropriate resin application amount 15 (3) indicate the appropriate resin application amounts when the phosphor concentrations are 10% and 15%, respectively. The emission characteristic measurement value 39a (2) and the emission characteristic measurement value 39a (3) are emission specific measurement values when the phosphor concentrations are 10% and 15%, respectively, and threshold data 81a ( 2) The threshold value data 81a (3) indicates a non-defective product determination range (threshold value) in each case. The threshold data created in this way is selectively used according to the Bin code 12b to which the target LED element 5 belongs in the production application work. Note that the threshold data creation process shown in (ST6) is executed as an off-line operation by a single inspection apparatus provided separately from the LED package manufacturing system 1, and is stored in the management computer 3 as threshold data 81a in advance. It is also possible to transmit the received data to the resin coating apparatus M4 via the LAN system 2.

  Thereafter, the substrate 4 after wire bonding is transferred to the resin coating device M4 (ST7), and as shown in FIG. 17A, the resin is discharged from the discharge nozzle 33a into the LED mounting portion 4b surrounded by the reflecting portion 4c. 8 is discharged. Here, based on the map data 18, the threshold value data 81a, and the resin application information 14, an operation of covering the LED element 5 with the specified amount of resin 8 shown in FIG. 17B is performed (ST8). The details of this resin application work process will be described with reference to FIGS. First, at the start of the resin coating operation, the resin container is exchanged as necessary (ST21). That is, the dispenser 33 attached to the resin discharge head 32 is replaced with one containing a resin 8 having a phosphor concentration selected according to the characteristics of the LED element 5.

  Next, the resin application part C applies the resin 8 to the test application material 43 for light emission characteristic measurement (application process for measurement) (ST22). That is, the resin 8 of the appropriate resin application amount (VA0 to VE0) for each Bin code 12b defined in FIG. 4 is applied onto the test coating material 43 drawn to the test driving stage 40a by the test driving / measurement unit 40. Apply. At this time, even if the discharge operation parameter corresponding to the appropriate resin application amount (VA0 to VE0) is commanded to the resin discharge mechanism 35, the actual resin application amount discharged from the discharge nozzle 33a and applied to the test application material 43 is resin. The proper resin coating amount does not necessarily become the above-mentioned appropriate resin coating amount due to the change in the property of 8 over time, and the actual resin coating amount becomes VA1 to VE1 somewhat different from VA0 to VE0, as shown in FIG.

  Next, the test application material 43 is sent in the test hitting / measurement unit 40, so that the test application material 43 on which the resin 8 is applied is sent and placed on the test application material placing portion 41 (trial application material placement step). . And the excitation light which excites fluorescent substance is light-emitted from the light source part 45 arrange | positioned above the test application material mounting part 41 (excitation light emission process). Then, by irradiating the resin 8 applied to the test coating material 43 with this excitation light, the light emitted by the resin 8 is received by the spectroscope 42 via the integrating sphere 44, and this is measured by the emission characteristic measurement processing unit 39. The light emission characteristic is measured (light emission characteristic measurement step) (ST23).

  Thereby, as shown in FIG. 15B, a measured value of the light emission characteristic represented by the chromaticity coordinate Z (see FIG. 13) is obtained. This measurement result is not necessarily based on the above-described error in the coating amount and the change in the concentration of the phosphor particles in the resin 8, and the like, ie, the standard color at the time of proper resin coating shown in FIG. It does not coincide with the degree coordinates ZA0 to ZE0. For this reason, the deviation (ΔXA,) indicating the separation in the X and Y coordinates between the obtained chromaticity coordinates ZA1 to ZE1 and the standard chromaticity coordinates ZA0 to ZE0 at the time of proper resin application shown in FIG. [Delta] YA) to ([Delta] XE, [Delta] YE) are obtained, and the necessity of correction for obtaining desired light emission characteristics is determined.

  Here, it is determined whether or not the measurement result is within the threshold value (ST24), and as shown in FIG. 15C, the deviation obtained in (ST23) is compared with the threshold value. Thus, it is determined whether the deviations (ΔXA, ΔYA) to (ΔXE, ΔYE) are within a range of ± 10% with respect to ZA0 to ZE0. Here, if the deviation is within the threshold value, the discharge operation parameters corresponding to the preset appropriate resin application amounts VA0 to VE0 are maintained as they are. On the other hand, when the deviation exceeds the threshold value, the application amount is corrected (ST25). That is, the deviation between the measurement result in the light emission characteristic measurement step and the predetermined light emission characteristic is obtained, and as shown in FIG. 15 (d), the actual production to be applied to the LED element 5 based on the obtained deviation. The process of deriving the new appropriate resin application amount (VA2 to VE2) is executed by the application amount deriving processing unit 38 (application amount deriving process step).

Here, the corrected appropriate resin application amounts (VA2 to VE2) are updated values obtained by adding correction amounts corresponding to the respective deviations to the preset appropriate resin application amounts VA0 to VE0. The relationship between the deviation and the correction amount is recorded in the resin application information 14 as known accompanying data in advance. Then, based on the corrected appropriate resin coating amount (VA2 to VE2), the processes of (ST22), (ST23), (ST24), and (ST25) are repeatedly executed, and the measurement result is defined in advance in (ST24). When it is confirmed that the deviation from the light emission characteristic is within the threshold value, the proper resin coating amount for actual production is determined. That is, in the above-described resin coating method, the appropriate resin coating amount is determined by repeatedly executing the measurement coating step, the translucent member placement step, the excitation light emission step, the light emission characteristic measurement step, and the coating amount derivation step. I try to derive. The determined proper resin application amount is stored in the storage unit 81 as the actual production application amount 81b.

  After that, the process moves to the next step, and discarding is executed (ST26). Here, by discharging a predetermined amount of the resin 8 from the discharge nozzle 33a, the resin flow state in the resin discharge path is improved, and the operations of the dispenser 33 and the resin discharge mechanism 35 are stabilized. The processes of (ST27), (ST28), (ST29), and (ST30) indicated by broken line frames in FIG. 14 are the same as the processes shown in (ST22), (ST23), (ST24), and (ST25), and desired light emission characteristics. This is executed when it is necessary to carefully check that the data has been completely secured, and is not necessarily an essential action item.

  In this way, when the appropriate resin coating amount that gives the desired light emission characteristics is determined, the production coating is executed (ST31). That is, when the production execution processing unit 37 instructs the application control unit 36 that controls the resin discharge mechanism 35, the appropriate resin application amount derived by the application amount derivation processing unit 38 and stored as the actual production application amount 81b. Then, a production coating process is performed in which the appropriate amount of resin 8 is applied to the LED element 5 mounted on the substrate 4 (production execution step).

  In the process of repeatedly executing the production coating process, the number of coatings by the dispenser 33 is counted, and it is monitored whether or not the number of coatings has passed a predetermined number of times (ST32). That is, until the predetermined number of times is reached, it is determined that there is little change in the properties of the resin 8 and the phosphor concentration, and the production coating execution (ST31) is repeated while maintaining the same actual production coating amount 81b. If the predetermined number of times has been confirmed in (ST32), it is determined that there is a possibility that the property of the resin 8 or the phosphor concentration has changed, and the process returns to (ST22). And the coating amount correction process based on the measurement result is repeatedly executed.

  When the resin application for one substrate 4 is thus completed, the substrate 4 is sent to the curing device M5, and the resin 8 is cured by heating by the curing device M5 (ST9). As a result, as shown in FIG. 17C, the resin 8 applied so as to cover the LED element 5 is thermally cured to become the resin 8a, and is fixed in the LED mounting portion 4b. Next, the substrate 4 after the resin curing is sent to the individual piece cutting device M6, where the substrate 4 is cut into individual piece substrates 4a, and as shown in FIG. (ST10). Thereby, the LED package 50 is completed.

  As described above, the LED package manufacturing system 1 shown in the embodiment described above separately measures the component mounting apparatus M1 for mounting the plurality of LED elements 5 on the substrate 4 and the emission wavelengths of the plurality of LED elements 5 in advance. The element characteristic information providing means for providing the obtained information as element characteristic information 12 is associated with the appropriate resin application amount of the resin 8 for obtaining the LED package 50 having the prescribed light emission characteristic and the element characteristic information 12. Resin information providing means for providing the information as resin coating information 14, mounting position information 71a indicating the position of the LED element 5 mounted on the substrate 4 by the component mounting apparatus M1, and element characteristic information 12 on the LED element 5; , Based on the map data creation means for creating the map data 18 for each substrate 4, the map data 18 and the resin application information 14, The appropriate resin coating amount of the resin 8 for having a constant emission characteristics, has a configuration that includes a resin coating device M4 to be applied to each LED element mounted on the substrate 4.

  The resin coating device M4 discharges the coating amount variably and controls the resin coating unit C to apply the resin 8 to an arbitrary coating target position, and the resin coating unit C, whereby the resin 8 is used for measuring the light emission characteristics. It includes a coating control unit 36 that executes a coating process for measurement for trial coating on the trial coating material 43 and a production coating process for coating the LED element 5 for actual production, and a light source unit that emits excitation light for exciting the phosphor. In the measurement application process, the test application material placement unit 41 on which the test application material 43 on which the resin 8 is applied by trial application is placed, and the excitation light emitted from the light source unit is applied to the resin 8 applied to the test application material 43. A light emission characteristic measuring unit that measures the light emission characteristic of the light emitted from the resin 8 by irradiation, and obtaining a deviation between a measurement result of the light emission characteristic measuring part and a predetermined light emission characteristic, and applying an appropriate resin based on this deviation Supplement quantity By instructing the application control unit 36 to apply the derived appropriate resin application amount to the application amount derivation processing unit 38 for deriving the appropriate resin application amount for actual production to be applied to the LED element 5, It has a configuration including a production execution processing unit 37 that executes a production application process for applying an appropriate resin application amount of resin to the LED element 5.

  Among the specific examples of the test coating material 43 in the above embodiment, the vertical cross-sectional shape of the embossed portion 43a shown in (b) of FIG. 8B is inclined in the direction in which the inner diameter decreases toward the bottom. However, as shown in FIG. 20, the vertical cross-sectional shape of the embossed portion 43b of the test coating material 43 is formed in an arc shape, more specifically, a hemisphere. Others are the same as the above embodiment.

  In this way, when the test coating material 43 is formed in the vertical cross-sectional shape hemisphere of the embossed portion 43b, the light emitted from the phosphor excited by the excitation light effectively repeats reflection inside the embossed portion 43a. Thus, since the light beam is uniformly distributed to the resin 8 and then radiated out of the resin 8, the chromaticity measurement is performed as compared with the embossed portion 43a of the linear side wall inclined in the direction in which the inner diameter decreases toward the bottom. Can reduce the amount of resin required. Further, when the embossed portion 43b of the test application material 43 is formed in the vertical cross-sectional hemisphere, the optical path length passing through the resin 8 is averaged by the diffusion of light, so that the collimator lens 65, the iris diaphragm Even when the optical axis of the optical system constituted by 66 and the integrating sphere 44 is inclined with respect to the test coating material 43, the detection error of chromaticity can be reduced.

  In the above-described embodiment, the case where the light emission characteristic measurement unit 39 measures the light emission characteristic of the light reflected upward by the test application material 43 and passed through the test-applied resin has been described as an example. In addition, the surface of the lower support member 41b of the test application material mounting portion 41 may be processed so as to reflect light or diffuse so that the light transmitted through the test application material 43 is reflected upward.

  The present invention can be used in the field of manufacturing an LED package in which an LED element is covered with a resin containing a phosphor.

DESCRIPTION OF SYMBOLS 1 LED package manufacturing system 2 LAN system 4 Board | substrate 4a Single piece board 4b LED mounting part 4c Reflection part 5 LED element 8 Resin 12 Element characteristic information 13A, 13B, 13C, 13D, 13E LED sheet 14 Resin application information 18 Map data 23 Resin Adhesive 24 Adhesive transfer mechanism 25 Component supply mechanism 26 Component mounting mechanism 32 Resin discharge head 33 Dispenser 33a Discharge nozzle 40 Test hitting / measurement unit 40a Test hitting stage 41 Test application material mounting portion 42 Spectroscope 43 Test coating material 43a Emboss Unit 44 Integrating sphere 46 Irradiation unit 50 LED package 63 Upper opening 64 Lower opening 65 Collimator lens 66 Illumination diaphragm 67 Top tape supply unit 68a, 68b Sealing material

Claims (8)

A resin application part for applying a resin containing a phosphor;
A first application control unit that controls the resin application unit and applies the resin to the test application material as a measurement application process;
A second application control unit that controls the resin application unit and applies the resin as a production application process to the LED element;
A trial coating material placement unit on which a trial coating material on which the resin is trial-coated by the first coating control unit is placed;
A light source unit that emits excitation light that is disposed above the test coating material mounting unit and excites the phosphor;
By irradiating the excitation light to the resin that has been trial-applied to the test application material from above, the light reflected by the test application material or the test application material mounting portion and passed through the test-applied resin A light emission characteristic measuring unit for measuring light emission characteristics;
Determining the amount of application for deriving the appropriate resin application amount of the resin to be applied to the LED element for production based on this deviation by obtaining the deviation between the measurement result of the light emission characteristic measuring unit and the predetermined light emission characteristic A processing unit;
A production execution processing unit for executing the production application process for applying the appropriate resin application amount of resin to the LED element by instructing the appropriate resin application amount to the second application control unit; Characteristic resin coating device. The resin coating apparatus according to claim 1, wherein an LED package that emits white light is used as the light source unit. The said light emission characteristic measurement part arrange | positions an integrating sphere above the said test application | coating material, and receives the light which the said resin emits through the opening of the said integrating sphere. A resin coating apparatus according to claim 1. A resin application method for applying a resin containing a phosphor to an LED element,
A measurement application step of applying the resin to the test application material for light emission characteristic measurement by a resin discharge unit that discharges the application amount variably;
A trial coating material placement step of placing the trial coating material on which the resin has been trial coated on the trial coating material placement section;
An excitation light emitting step of emitting excitation light for exciting the phosphor from a light source unit disposed above the test coating material mounting unit;
By irradiating the resin applied to the test application material from above with the excitation light, the light emission characteristics of light that has passed through the test application material reflected by the test application material or the test application material mounting portion are reflected. A light emission characteristic measuring step to be measured;
A deviation between the measurement result in the light emission characteristic measurement step and a predetermined light emission characteristic is obtained, and an application amount for deriving an appropriate resin application amount of the resin to be applied to the LED element for actual production based on the deviation Derivation process,
A production execution step of executing a production application process for applying the resin of the appropriate resin application amount to the LED element by commanding the derived appropriate resin application amount to an application control unit that controls the resin discharge unit. A resin coating method comprising: An LED package that emits white light is used as the light source unit, and the predetermined light emission characteristic is a normal light emission characteristic required for a finished product in a state where the resin applied to the LED element is cured. The resin coating method according to claim 4, wherein the resin application method has a light emission characteristic that is biased by a difference in light emission characteristic due to being in a cured state. 6. The light emission characteristic measuring step, wherein the light emitted from the resin is received through an opening of the integrating sphere with an integrating sphere disposed above the test coating material. The resin coating method as described in 4. above. 7. The appropriate resin application amount is deterministically derived by repeatedly executing the measurement application step, the test application material placement step, the light emission characteristic measurement step, and the application amount derivation step. The resin coating method according to any one of the above. The resin coating apparatus according to claim 1, wherein the trial coating material has a recess formed on the surface where the resin is trial coated.

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