JP2013003177A - Photoelectric conversion module and manufacturing method for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photoelectric conversion module with excellent optical coupling efficiency capable of suppressing deterioration in light transmission characteristics and suppressing optical crosstalk, and a manufacturing method for the same.SOLUTION: A photoelectric conversion module comprises: a transparent substrate 12; an optical device 21 mounted on a mount plane 12a including one plane of the transparent substrate 12; and an electric device 31 mounted on the mount plane 12a of the transparent substrate 12 and driving the optical device 21. The transparent substrate 12 is provided with a waveguide 33 for optically coupling the optical device 21 with a glass fiber 45 disposed on an attachment plane 12b including the other plane.

Description

  The present invention relates to a photoelectric conversion module used for optical transmission and the like and a manufacturing method thereof.

  As the speed of signals between LSIs increases, it is becoming difficult to eliminate noise and increase in power consumption by electrical transmission. Therefore, in recent years, attempts have been made to transmit between LSIs by optical communication with almost no electromagnetic interference or frequency dependent loss.

  As an optical module used for this optical transmission, there is known an optical module in which a light transmitting member is provided on an upper portion of a package having an open top, and one or more optical elements are accommodated in the package and hermetically sealed (for example, , See Patent Document 1). In this optical module, a circuit pattern is formed on the back surface of a transparent substrate serving as a light transmitting member, one or more optical elements are mounted on the circuit pattern, and a package side electrode is formed on the upper edge surface of the package. A substrate-side electrode is formed on the back surface of the transparent substrate corresponding to the package-side electrode. On the other hand, a metal lid having a window serving as an optical path is provided on the surface of the transparent substrate, and the lid is stretched from the periphery of the transparent substrate. In the state where the package side electrode and the substrate side electrode are joined, the periphery of the lid is joined to the package and hermetically sealed.

JP 2007-300032 A

  However, in the optical module, light diffuses on the transparent substrate and the optical coupling efficiency is lowered. In addition, the light diffused by the transparent substrate may leak to other channels and the receiving side, resulting in degradation of optical transmission characteristics and optical crosstalk.

  An object of the present invention is to provide a photoelectric conversion module that is excellent in optical coupling efficiency and can suppress a decrease in optical transmission characteristics and optical crosstalk, and a manufacturing method thereof.

The photoelectric conversion module of the present invention capable of solving the above problems is mounted on the mounting surface of the transparent substrate, the optical device mounted on the mounting surface consisting of one surface of the transparent substrate, and the mounting surface of the transparent substrate. An electrical device for driving the optical device,
The transparent substrate is provided with a waveguide that optically couples the optical fiber and the optical device disposed on the mounting surface composed of the other surface.

  In the photoelectric conversion module of the present invention, it is preferable that the waveguide is formed by filling a waveguide forming hole formed in the transparent substrate with a transparent resin.

  In the photoelectric conversion module of the present invention, it is preferable that the transparent resin has a higher refractive index than the transparent substrate.

  In the photoelectric conversion module of the present invention, it is preferable that the transparent resin is made of the same material as an underfill material that fixes the optical device to the transparent substrate.

  In the photoelectric conversion module of the present invention, the transparent resin is preferably made of an ultraviolet curable resin.

  In the photoelectric conversion module of the present invention, the waveguide may be configured to include an inner space of a waveguide forming hole formed in the transparent substrate. In that case, it is preferable that the optical device is fixed to the transparent substrate by a side-fill material provided at a location not facing the waveguide.

  In the photoelectric conversion module of the present invention, it is preferable that the waveguide forming hole has a tapered shape in which the mounting surface side has a smaller diameter than the mounting surface side.

  In the photoelectric conversion module of the present invention, the waveguide forming hole constituting the waveguide may be non-penetrating with respect to the transparent substrate. In that case, it is preferable that the bottom part of the said waveguide formation hole in the said transparent substrate is formed in the concave curved surface shape.

In the photoelectric conversion module of the present invention, an optical connector for holding the optical fiber can be attached to and detached from the transparent substrate.
The transparent substrate and the optical connector are each provided with a positioning pin, and the other is formed with a positioning hole into which the positioning pin can be inserted.
It is preferable that the optical fiber of the optical connector is positioned in the waveguide of the transparent substrate by inserting the positioning pin into the positioning hole.

  The photoelectric conversion module of this invention WHEREIN: It is preferable that the heat radiating member is attached to the said optical device and the said electrical device.

The photoelectric conversion module manufacturing method of the present invention includes a component mounting step of mounting an optical device and an electrical device on a plurality of module formation regions provided on a transparent substrate,
A waveguide forming step of forming a waveguide in each module forming region in the transparent substrate;
A substrate dividing step of cutting the transparent substrate and dividing it into each module forming region to form a plurality of photoelectric conversion modules;
It is characterized by including.

  According to the present invention, since the optical device and the optical fiber are optically coupled via the waveguide of the transparent substrate, data communication can be performed with excellent optical coupling efficiency, and optical crosstalk is suppressed and good. Optical transmission characteristics can be obtained.

It is sectional drawing of the photoelectric composite module which concerns on the example embodiment of this invention. It is a perspective view of the photoelectric composite module which concerns on the example embodiment of this invention. It is sectional drawing which shows the example which mounted the optoelectric composite module of FIG. 1 on the host board. It is a figure which shows the manufacturing process of the photoelectric composite module of FIG. 1, Comprising: (a)-(c) is sectional drawing for every process. It is a schematic perspective view of the wafer with which several photoelectric conversion modules are produced. It is sectional drawing of the photoelectric composite module which concerns on the other embodiment example (waveguide formation hole is non-penetrating) of this invention. It is sectional drawing of the photoelectric composite module which concerns on the other embodiment example (waveguide formation hole is non-penetrating) of this invention. It is sectional drawing of the photoelectric composite module which concerns on the other embodiment example (a waveguide formation hole is a taper shape) of this invention. It is sectional drawing of the photoelectric composite module which concerns on the other embodiment example (underfill material non-use) of this invention. It is sectional drawing of the photoelectric composite module which concerns on the other embodiment example (underfill material non-use) of this invention. It is sectional drawing of the photoelectric composite module which concerns on the other embodiment of this invention. It is sectional drawing of the photoelectric composite module which concerns on the other embodiment of this invention.

Hereinafter, an example of an embodiment of a photoelectric conversion module and a manufacturing method thereof according to the present invention will be described with reference to the drawings.
As shown in FIGS. 1 and 2, the photoelectric conversion module 11 according to this embodiment has a transparent substrate 12. The transparent substrate 12 is made of a glass substrate formed of borosilicate glass or quartz glass. The transparent substrate 12 has one surface as a mounting surface 12a having a circuit pattern 13, and the other surface. Is the mounting surface 12b.
The transparent substrate 12 is formed with a plurality of waveguide formation holes 14 penetrating the front and back surfaces, and these waveguide formation holes 14 are arranged in a line.

  An optical device 21 is attached to the mounting surface 12 a of the transparent substrate 12 at a position facing the waveguide forming hole 14. The optical device 21 is, for example, a light emitting element or a light receiving element such as a VCSEL (Vertical Cavity Surface Emitting Laser) array or a PIN-PD (photodiode) array. The element part (not shown) of the optical device 21 is a light emitting part when the optical device 21 is a light emitting element, and is a light receiving part when the optical device 21 is a light receiving element. As described above, the optical device 21 attached to the transparent substrate 12 has an element portion disposed at a position facing the waveguide forming hole 14 in the transparent substrate 12.

  The optical device 21 has a terminal portion (not shown) electrically connected to the circuit pattern 13 by a bump 25 made of, for example, gold (Au). The connection by the bump 25 is performed by flip chip mounting in which the terminal portion and the circuit pattern 13 are connected via the bump 25 by ultrasonic vibration or heat. Alternatively, adhesion using an anisotropic conductive film (ACF) is also possible. As the optical device 21, there may be used an optical device whose half in the width direction is made of a light emitting element and the remaining half in the width direction is made of a light receiving element.

  An underfill material 31 is filled between the transparent substrate 12 and the optical device 21, and the optical device 21 is bonded and fixed to the transparent substrate 12 by the underfill material 31. The underfill material 31 is also filled in the waveguide forming hole 14 of the transparent substrate 12. As the underfill material 31, a transparent resin having a refractive index higher than that of light in the transparent substrate 12 is used. As a result, a waveguide 33 is formed on the transparent substrate 12 with the core having a portion where the waveguide forming hole 14 is filled with the underfill material 31 and the refractive index is increased. As the underfill material 31, a thermosetting resin can be used, but an ultraviolet curable resin is preferably used. Since the transparent substrate 12 can be irradiated with ultraviolet rays from the mounting surface 12b which is the back surface, if an ultraviolet curable resin is used as the underfill material 31 and ultraviolet rays are irradiated from the back surface of the transparent substrate 12, a thermosetting resin is used. As compared with the above, it is possible to increase the productivity by curing quickly.

  An optical connector 41 can be attached to and detached from the mounting surface 12b of the transparent substrate 12. By attaching the optical connector 41 to the transparent substrate 12, the optical device 21 and the optical connector 41 can be optically coupled. The optical connector 41 has an optical fiber ferrule 42 formed of a material containing any one of polyester resin, PPS resin, and epoxy resin, and a plurality of optical fiber cores 44 formed as a tape-shaped optical cable are provided. It is connected.

  The optical fiber core 44 is obtained by coating a glass fiber (optical fiber) 45 having a core 45a and a clad 45b with a resin, and the glass fiber 45 exposed from the coating at the end of the optical fiber core 44 is an optical fiber. It is held by the ferrule 42. And the end surface of each glass fiber 45 is exposed in the light entrance / exit surface 42a which is a surface facing the transparent substrate 12 in the optical fiber ferrule 42. FIG.

  The optical connector 41 is provided with positioning pins 46 that protrude toward the transparent substrate 12 on both sides of the light input / output surface 42a on the transparent substrate 12 side. These positioning pins 46 can be inserted into positioning holes 47 formed on both sides of the array of the plurality of waveguides 33 in the transparent substrate 12. In the optical connector 41, the distal end surface of the glass fiber 45 is guided to the waveguide of the transparent substrate 12 without optical alignment by inserting the positioning pins 46 into the positioning holes 47 and bringing them closer to the transparent substrate 12 side. 33 can be positioned and arranged with high accuracy at the optical coupling position facing 33. The transparent substrate 12 is provided with a latching means (not shown) such as a latch for locking the optical connector 41. The optical connector 41 is locked at a predetermined position of the transparent substrate 12 by the locking means. The Note that a positioning pin may be provided in the transparent substrate 12 and a positioning hole into which the positioning pin can be inserted may be formed in the optical connector 41.

  As described above, since the optical connector 41 can be attached to and detached from the transparent substrate 12 of the photoelectric conversion module 11, it is assumed that, for example, a problem has occurred on the optical fiber core wire 44 side after the optical connector 41 is connected. However, it is not necessary to replace the photoelectric conversion module 11, and the high cost due to the decrease in yield can be suppressed. In addition, as compared with a structure in which the optical fiber core wire 44 is connected in advance, good assembly workability can be ensured.

  An electric device 51 for driving the optical device 21 is mounted on the mounting surface 12a of the transparent substrate 12, and a terminal portion (not shown) of the electric device 51 is mounted via a bump 52 made of gold (Au). The circuit pattern 13 formed on 12a is connected to be conductive. The electrical device 51 is, for example, a VCSEL array driver IC for the optical device 21 made of VCSEL, and a TIA & LA array (Trans Impedance Amplifier & Limiting Amplifier) IC for the optical device 21 made of PIN-PD. Is used. By using an array element, it is possible to transmit a large amount of data in parallel. On the mounting surface 12 a of the transparent substrate 12, solder balls 55 for connection to a host board 61 described later are provided on the circuit pattern 13.

  In the photoelectric conversion module 11 described above, optical transmission is performed between the optical device 21 and the glass fiber 45 of the optical connector 41 via the waveguide 33 of the transparent substrate 12. When light is transmitted from the optical device 21 made of a light emitting element to the glass fiber 45, the light emitted from the element portion of the optical device 21 enters the glass fiber 45 of the optical connector 41 through the waveguide 33. It becomes. When light transmission is performed from the glass fiber 45 of the optical connector 41 to the optical device 21 including the light receiving element, light emitted from the glass fiber 45 enters the element portion of the optical device 21 through the waveguide 33. It will be.

  As shown in FIG. 3, the photoelectric conversion module 11 having the above structure is mounted on a host board 61 provided in an electronic device such as a super computer, a personal computer, or a server, for example, by reflow mounting. The photoelectric conversion module 11 has sufficient heat resistance against heat (about 250 ° C.) during reflow mounting.

  The host board 61 is made of, for example, a glass epoxy board or the like, and a circuit pattern 62 is provided on the mounting surface. Various electronic components 63 such as IC and LSI are mounted on the mounting surface of the host board 61, and terminals (not shown) of the electronic components 63 are connected to the circuit pattern 62 via the solder balls 55. .

  The photoelectric conversion module 11 is mounted on the mounting surface of the host board 61 so that the mounting surface 12a of the transparent substrate 12 faces the mounting surface. The circuit patterns 13 and 62 are connected to each other through the solder balls 55. It is connected.

  Further, between the host board 61 and the photoelectric conversion module 11, for example, a heat dissipation block (heat dissipation member) 65 made of a material having excellent thermal conductivity such as aluminum is provided. The heat dissipation block 65 is adhesively fixed to the optical device 21 and the electric device 51 and is in close contact with the mounting surface of the host board 61. Thereby, the heat generated in the optical device 21 and the electric device 51 of the photoelectric conversion module 11 is transmitted to the host board 61 through the heat dissipation block 65, and the optical device 21 and the electric device 51 are cooled well.

  In the photoelectric conversion module 11 described above, optical transmission is performed between the optical device 21 and the glass fiber 45 of the optical connector 41 via the waveguide 33 of the transparent substrate 12. When light is transmitted from the optical device 21 made of a light emitting element to the glass fiber 45, the light emitted from the optical device 21 enters the glass fiber 45 of the optical connector 41 through the waveguide 33 of the transparent substrate 12. It will be. When light is transmitted from the glass fiber 45 of the optical connector 41 to the optical device 21 including the light receiving element, the light emitted from the glass fiber 45 is incident on the optical device 21 through the waveguide 33 of the transparent substrate 12. Will be.

According to the photoelectric conversion module according to the above embodiment, since the optical device 21 and the glass fiber 45 are optically coupled via the waveguide 33 of the transparent substrate 12, data communication can be performed with excellent optical coupling efficiency. In addition, good optical transmission characteristics can be obtained while suppressing optical crosstalk.
That is, a waveguide 33 having a high refractive index is provided in a portion of the transparent substrate 12 through which the communication light between the optical device 21 and the glass fiber 45 is transmitted. Coupling efficiency can be obtained.

  In recent years, the speed of electrical signals of the host board 61 in electronic devices such as supercomputers, personal computers, and servers has increased, and as a result, EMC and signal quality degradation have become a problem, and electrical wiring has been shortened as much as possible. There is a need to suppress EMC and signal quality degradation. If the photoelectric conversion module 11 according to the present embodiment is used, the photoelectric conversion module 11 can be mounted in the vicinity of the CPU in the electronic device to shorten the electrical wiring as much as possible, thereby reducing EMC and signal quality degradation. Data communication can be performed while suppressing the above.

  Next, a case where the photoelectric conversion module 11 is manufactured will be described for each process.

(Component mounting process)
As shown in FIG. 4A, a transparent substrate 12 having a mounting surface 12a on which a circuit pattern 13 is formed and made of a glass material on which a waveguide forming hole 14 and a positioning hole 47 are formed is prepared. Then, with respect to the transparent substrate 12, as shown in FIG. 4B, on the mounting surface 12a on which the circuit pattern 13 is formed, an optical device 21, an electric device 51, and passive elements such as chip resistors and capacitors (illustrated). (Omitted) is mounted by ultrasonic flip chip mounting or the like. A solder ball 55 for connection to the host board 61 is also mounted on the circuit pattern 13.

  As shown in FIG. 5, the transparent substrate 12 is composed of a wafer 71 formed of a large glass plate, and a plurality of module forming regions 72 are provided on the wafer 71. Then, the optical device 21, the electric device 51, the passive element, and the solder ball 55 are mounted on each module forming region 72 of the wafer 71.

(Waveguide forming process)
As shown in FIG. 4C, an ultraviolet curable underfill material 31 is injected between the optical device 21 and the transparent substrate 12 in each module formation region 72. The underfill material 31 is also injected into the waveguide forming hole 14. At this time, a sealing plate 74 is attached to the mounting surface 12b of the transparent substrate 12 to prevent leakage of the underfill material 31 injected into the waveguide forming hole 14 from the mounting surface 12b side. When ultraviolet rays are irradiated from the mounting surface 12b side of the transparent substrate 12 in this state, the underfill material 31 is cured, the optical device 21 is fixed to the transparent substrate 12, and the waveguide 33 is formed. When the underfill material 31 is cured, the sealing plate 74 is removed. Then, the underfill material 31 made of a transparent resin is filled in the waveguide forming hole 14 and cured, and the photoelectric conversion module 11 including the waveguide 33 having a core function during optical transmission is formed in each module forming region. 72. When a thermosetting resin is used as the underfill material 31, the underfill material 31 is injected into the waveguide formation hole 14, and then heated to thermally cure the underfill material 31.

(Substrate division process)
Thereafter, the wafer 71 is diced with a saw wire, a diamond cutter, or the like, so as to be divided into plate pieces of the respective module forming regions 72. Thereby, a plurality of photoelectric conversion modules 11 are obtained. As described above, if the plurality of photoelectric conversion modules 11 are manufactured and divided on the wafer 71, the plurality of photoelectric conversion modules 11 can be easily manufactured collectively by an automatic machine, and the productivity is greatly improved. Can be made. The wafer 71 made of a glass plate is not limited to a rectangular outer shape, and may be circular.

  According to the manufacturing method according to the above embodiment, the optical device 21 and the glass fiber 45 can perform data communication with excellent optical coupling efficiency via the waveguide 33 of the transparent substrate 12, and optical crosstalk. It is possible to easily manufacture the photoelectric conversion module 11 capable of suppressing the above and obtaining good optical transmission characteristics.

  In the above embodiment, the waveguide forming hole 14 penetrating the front and back is formed in the transparent substrate 12 and the waveguide 33 is formed by injecting the underfill material 31 into the waveguide forming hole 14. As shown in FIG. 5, the waveguide forming hole 14 may be non-penetrating while leaving the mounting surface 12b side of the transparent substrate 12.

  When the waveguide forming hole 14 is penetrated, the injected underfill 31 leaks to the mounting surface 12b side of the transparent substrate 12, the flatness of the joint surface joined to the optical connector 41 is lowered, and the optical coupling characteristic is changed. There is a risk of it. However, if the waveguide forming hole 14 is not penetrated as described above, leakage of the underfill material 31 to the mounting surface 12b side of the transparent substrate 12 can be prevented, and the bonding surface with the optical connector 41 is good. It is possible to obtain excellent optical coupling characteristics while maintaining flatness.

  Moreover, when making the waveguide formation hole 14 non-penetrating, as shown in FIG. 7, it is preferable to form the bottom part 14a of the waveguide formation hole 14 in a concave curved surface shape. As described above, when the bottom portion 14a of the waveguide forming hole 14 is formed in a concave curved surface shape, the bottom portion 14a can be used as a lens to produce a light collecting effect, and further excellent optical coupling characteristics can be obtained. In addition, when the transparent substrate 12 is sandblasted, the sandblasting process can be easily performed if the bottom portion 14a of the waveguide forming hole 14 is a concave curved surface.

  In the embodiment of FIG. 1, a waveguide forming hole 14 that penetrates the transparent substrate 12 with the same straight diameter is formed on the front and back surfaces to form a waveguide 33. However, as shown in FIG. The formation hole 14 may be formed in a tapered shape in which the mounting surface 12a side has a smaller diameter than the mounting surface 12b side, and this may be used as the waveguide 33. For example, the optical device 21 and the glass fiber 45 can be optically coupled by the tapered waveguide forming hole 14 having a diameter on the mounting surface 12b side of 50 μm and a diameter on the mounting surface 12a side of 10 μm. In addition, the direction which made the waveguide formation hole 14 into the taper shape is easier to cut to the transparent substrate 12 than the straight shape.

  In the above embodiment, the underfill material 31 is used. However, a configuration in which the underfill material 31 is not used can be employed. For example, when the underfill material 31 is not used in the configuration of the photoelectric conversion module 11 shown in FIG. 1, the inner space of the waveguide forming hole 14 formed in the transparent substrate 12 is the waveguide 33 as shown in FIG. It becomes. When the underfill material 31 is not used, light can be transmitted through the end face of the glass fiber 45 facing the waveguide forming hole 14 and guided. By not using the underfill material 31, the manufacturing cost can be reduced.

  However, if the underfill material 31 is not used, the fixing strength of the optical device 21 with respect to the mounting surface 12a may be insufficient. Therefore, as shown in FIG. 10, the fixing strength of the optical device 21 to the transparent substrate 12 can be increased by applying the side fill material 31 a to the optical device 21 and curing it. The part to which the side fill material 31a is applied is a part that does not oppose the waveguide 33 in the optical device 21 (a part that does not interfere with optical coupling), and is a plan view of the optical device 21 (as viewed from above in FIG. 10) To do. As the side fill material 31a, a resin material similar to that of the underfill material 31 may be used. However, since the side fill material 31a does not need to be transparent, an epoxy resin or the like may be used.

  Further, the waveguide 33 that does not use the underfill material 31 is not limited to the waveguide forming hole 14 that penetrates straight through the front and back with the same diameter as illustrated in FIGS. 9 and 10, but also the non-shown structure shown in FIGS. 6 and 7. The present invention can also be used for the through-hole waveguide forming hole 14 and the tapered waveguide forming hole 14.

  In the above embodiment, the optical connector 41 can be directly attached to and detached from the transparent substrate 12 of the photoelectric conversion module 11. However, as shown in FIG. 11, a lens is interposed between the transparent substrate 12 and the optical connector 41. A triangular prism 82 having 81 may be provided, and the optical device 21 and the optical connector 41 may be optically coupled via the triangular prism 82. As described above, when the triangular prism 82 is used, the direction of optical transmission can be changed by, for example, 90 °, and the optical connector 41 can be arranged at a position along the surface direction with respect to the transparent substrate 12. Thereby, the thickness dimension of the photoelectric conversion module 11 in the state where the optical connector 41 is joined can be suppressed as much as possible, and a sufficient tolerance in mounting can be ensured. Further, the optical coupling characteristics can be improved by the triangular prism 82 having the lens 81. In this case, the triangular prism 82 is provided with a guide pin, a guide hole into which the guide pin can be inserted is provided in either the transparent substrate 12 or the optical connector 41, and the guide pin is inserted into the guide hole, thereby obtaining a triangular shape. It is preferable that the prism 82 is positioned and fixed to at least one of the transparent substrate 12 and the optical connector 41.

  Moreover, as shown in FIG. 12, it is preferable to cover the outer periphery of the photoelectric conversion module 11 with a shield shell 85 made of metal such as aluminum. By providing the shield shell 85, it is possible to take countermeasures against electromagnetic noise in the photoelectric conversion module 11. Alternatively, the optical connector 41 in which the triangular prism 82 including the lens 81 is integrated may be used. Also in this case, the optical transmission direction can be changed by, for example, 90 °, and the optical connector 41 can be arranged at a position along the plane direction with respect to the transparent substrate 12. And the thickness dimension of the photoelectric conversion module 11 in the state where the optical connector 41 is joined can be suppressed as much as possible to achieve miniaturization, and the optical connector 41 itself can be miniaturized. In this case, a guide pin is provided in the triangular prism 82 of the optical connector 41, a guide hole into which the guide pin can be inserted is provided in the transparent substrate 12, and the optical connector 41 is made transparent by inserting the guide pin into the guide hole. A structure in which the substrate 12 is positioned and fixed is preferable.

11: photoelectric conversion module, 12: transparent substrate, 12a: mounting surface, 12b: mounting surface, 14: waveguide formation hole, 14a: bottom, 21: optical device, 31: underfill material (transparent resin), 33: Waveguide, 41: optical connector, 45: glass fiber (optical fiber), 46: positioning pin, 47: positioning hole, 51: electrical device, 65: heat dissipation block (heat dissipation member)

Claims (13)

A transparent substrate, an optical device mounted on a mounting surface composed of one surface of the transparent substrate, and an electric device mounted on the mounting surface of the transparent substrate to drive the optical device,
2. The photoelectric conversion module according to claim 1, wherein the transparent substrate is provided with a waveguide for optically coupling the optical device and the optical device disposed on the mounting surface comprising the other surface. The photoelectric conversion module according to claim 1,
The photoelectric conversion module, wherein the waveguide is formed by filling a waveguide forming hole formed in the transparent substrate with a transparent resin. The photoelectric conversion module according to claim 2,
The photoelectric conversion module, wherein the transparent resin has a higher refractive index than the transparent substrate. The photoelectric conversion module according to claim 2 or 3,
The photoelectric conversion module, wherein the transparent resin is made of the same material as an underfill material for fixing the optical device to the transparent substrate. The photoelectric conversion module according to any one of claims 2 to 4,
The photoelectric conversion module, wherein the transparent resin is made of an ultraviolet curable resin. The photoelectric conversion module according to claim 1,
2. The photoelectric conversion module according to claim 1, wherein the waveguide includes an inner space of a waveguide forming hole formed in the transparent substrate. The photoelectric conversion module according to claim 6,
The photoelectric conversion module according to claim 1, wherein the optical device is fixed to the transparent substrate by a side fill material provided at a location not facing the waveguide. The photoelectric conversion module according to any one of claims 2 to 7,
The photoelectric conversion module according to claim 1, wherein the waveguide forming hole has a tapered shape in which the mounting surface side has a smaller diameter than the mounting surface side. The photoelectric conversion module according to any one of claims 2 to 8,
The photoelectric conversion module according to claim 1, wherein the waveguide forming hole constituting the waveguide is non-penetrating with respect to the transparent substrate. The photoelectric conversion module according to claim 9,
The photoelectric conversion module according to claim 1, wherein a bottom portion of the waveguide forming hole in the transparent substrate is formed in a concave curved surface shape. The photoelectric conversion module according to any one of claims 1 to 10,
An optical connector that holds the optical fiber can be attached to and detached from the transparent substrate.
The transparent substrate and the optical connector are each provided with a positioning pin, and the other is formed with a positioning hole into which the positioning pin can be inserted.
The photoelectric conversion module according to claim 1, wherein the optical fiber of the optical connector is positioned in the waveguide of the transparent substrate by inserting the positioning pin into the positioning hole. The photoelectric conversion module according to any one of claims 1 to 11,
A photoelectric conversion module, wherein a heat radiating member is attached to the optical device and the electrical device. A component mounting process for mounting an optical device and an electric device on a plurality of module forming regions provided on a transparent substrate;
A waveguide forming step of forming a waveguide in each module forming region in the transparent substrate;
A substrate dividing step of cutting the transparent substrate and dividing it into each module forming region to form a plurality of photoelectric conversion modules;
The manufacturing method of the photoelectric conversion module characterized by including.

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