JP2011066198A - Grinding processing device - Google Patents

Grinding processing device Download PDF

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JP2011066198A
JP2011066198A JP2009215500A JP2009215500A JP2011066198A JP 2011066198 A JP2011066198 A JP 2011066198A JP 2009215500 A JP2009215500 A JP 2009215500A JP 2009215500 A JP2009215500 A JP 2009215500A JP 2011066198 A JP2011066198 A JP 2011066198A
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ground
cleaning
held
grinding
brush
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Shinji Yoshida
真司 吉田
Yoshiteru Nishida
吉輝 西田
Masashi Hamabuchi
雅史 濱淵
Tomoaki Sato
友亮 佐藤
Katsutaka Inoue
雄貴 井上
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Disco Corp
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Disco Abrasive Systems Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a grinding processing device having a mechanism, providing a cleaning capable of removing microparticles that cannot been cleaned up by the conventional spin cleaning mechanism to a surface to be ground and a surface to be held of the object to be ground. <P>SOLUTION: A grinding processing device 1 grinds the surface to be ground by grinding processing means 3, 4 with the object to be ground and the surface to be held, held on a holding table 2, and cleans the surface to be ground and the surface to be held of the object to be ground by a cleaning means 5. The cleaning means 5 holds the object to be ground with a plurality of pulleys 510 fitted in an outer peripheral border of the object to be ground and with the surface to be held and the surface to be ground exposed, and rotates the object to be ground by turning one or more pulleys 510 to supply two fluidic cleaning liquids to the surface to be held and the surface to be ground from a two fluidic cleaning liquid supplying mechanism 57, for cleaning. The microparticles on the surface to be ground and the surface to be held are removed by supplying the cleaning liquid from brush cleaning liquid supplying mechanisms 55, 56 to the surface to be held and the surface to be ground to clean by cleaning brush mechanisms 53, 54. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、半導体ウェーハ等の被研削物を研削加工する研削加工装置におけるウェーハの洗浄機構に関する。   The present invention relates to a wafer cleaning mechanism in a grinding apparatus that grinds an object to be ground such as a semiconductor wafer.

半導体デバイス製造工程においては、IC、LSI等の回路が複数個形成されたウェーハは、個々のチップに分割される前に、その裏面が研削装置によって研削されて所定の厚さに形成されている。ウェーハの裏面を研削する研削装置は、被加工物を保持するチャックテーブルと、チャックテーブルに保持された被加工物を研削する研削ホイールを備えた研削手段と、研削後のウェーハを洗浄する洗浄手段とを具備している。チャックテーブルは、ターンテーブルによって自転及び公転可能に支持されており、ターンテーブルの回転により、実際の研削が行われる研削域と、チャックテーブルに対する被加工物の着脱が行われる被研削物着脱域との間を移動可能となっている(例えば特許文献1参照)。一般的な洗浄手段には、被加工物を回転させながら洗浄液及びエアーを吹きつけて洗浄を行うスピン洗浄機構が用いられている(例えば特許文献2参照)。   In a semiconductor device manufacturing process, a wafer on which a plurality of circuits such as ICs and LSIs are formed is ground to a predetermined thickness by grinding the back surface of the wafer before it is divided into individual chips. . A grinding apparatus for grinding a back surface of a wafer includes a chuck table for holding a workpiece, a grinding means including a grinding wheel for grinding the workpiece held on the chuck table, and a cleaning means for cleaning the wafer after grinding. It is equipped with. The chuck table is supported by the turntable so as to be capable of rotating and revolving. A grinding area in which actual grinding is performed by rotation of the turntable, and a workpiece attachment / detachment area in which the workpiece is attached to and detached from the chuck table. (See, for example, Patent Document 1). A general cleaning means uses a spin cleaning mechanism that performs cleaning by spraying a cleaning liquid and air while rotating a workpiece (see, for example, Patent Document 2).

特開平10−086048号公報Japanese Patent Laid-Open No. 10-086048 特開2008−198709号公報JP 2008-198709 A

しかし、近年、研削加工後のウェーハの洗浄に関する要求基準が高度化しており、微小パーティクルを除去することも求められているが、従来のスピン洗浄機構では、かかる要求基準に達する洗浄が出来ないという問題がある。また、研削加工後に再びウェーハに蒸着等を行う前工程に被研削物を戻すプロセスもあるため、被加工物の被研削面だけでなく被保持面の洗浄も必要とされる場合があるが、従来のスピン洗浄機構は、被加工物の被研削面及び被保持面を洗浄する機能は有していない。   However, in recent years, the requirements for cleaning wafers after grinding have become more sophisticated, and it is also required to remove fine particles. However, conventional spin cleaning mechanisms cannot perform cleaning that meets these requirements. There's a problem. In addition, since there is also a process of returning the object to be ground to the previous step of performing vapor deposition etc. on the wafer after grinding, cleaning of the surface to be held as well as the surface to be ground may be required, A conventional spin cleaning mechanism does not have a function of cleaning a ground surface and a retained surface of a workpiece.

本発明は、これらの事実に鑑みて成されたものであって、その主な技術的課題は、従来のスピン洗浄機構では洗浄しきれない微小パーティクルの除去が可能な洗浄を、被研削面と被保持面とに施すことが出来る機構を有した研削加工装置を提供することにある。   The present invention has been made in view of these facts, and the main technical problem thereof is that the surface to be ground can be cleaned by removing fine particles that cannot be cleaned by a conventional spin cleaning mechanism. An object of the present invention is to provide a grinding apparatus having a mechanism that can be applied to a held surface.

本発明は、被研削物の被保持面を保持する保持テーブルと、保持テーブルに保持された被研削物の被研削面を研削加工する研削加工手段と、保持テーブル上で研削加工された被研削物の被保持面と被研削面とを洗浄する洗浄手段とを有する研削加工装置に関するもので、洗浄手段は、複数のプーリーを含みプーリーがそれぞれ被研削物の外周縁の少なくとも三箇所に係合することによって被保持面と被研削面とが露出した状態で被研削物を保持する保持機構と、少なくとも一つ以上のプーリーを自転させることによってプーリーに係合した被研削物を鉛直方向を回転軸としてプーリーの自転方向とは逆の回転方向へ回転させる回転機構と、保持機構に保持されて回転機構によって回転させられている被研削物の被保持面と被研削面とに気体と液体とからなる二流体洗浄液を供給する二流体洗浄液供給機構と、隣り合うプーリーの間に配設され保持機構に保持されて回転機構によって回転させられている被研削物の被保持面と被研削面とに当接する作用位置と、被研削物の被保持面と被研削面とに当接しない待機位置とに選択的に位置付けられる洗浄ブラシ機構と、洗浄ブラシ機構が被研削物の被保持面と被研削面とに当接している際に被研削物の被保持面と被研削面とに洗浄液を供給するブラシ洗浄液供給機構とを有する。   The present invention relates to a holding table that holds a held surface of an object to be ground, a grinding means that grinds the surface to be ground of the object to be ground held on the holding table, and a workpiece to be ground that is ground on the holding table. The present invention relates to a grinding apparatus having a surface to be held and a cleaning means for cleaning the surface to be ground. The cleaning means includes a plurality of pulleys, and each of the pulleys engages with at least three outer peripheral edges of the object to be ground. The holding mechanism that holds the object to be ground with the surface to be held and the surface to be ground exposed, and the object to be ground engaged with the pulley by rotating at least one pulley in the vertical direction. A rotating mechanism that rotates in the direction opposite to the direction of rotation of the pulley as a shaft, and a gas that is held by the holding mechanism and rotated by the rotating mechanism, A two-fluid cleaning liquid supply mechanism for supplying a two-fluid cleaning liquid composed of a body, a held surface of a workpiece to be ground and a grinding object which are disposed between adjacent pulleys and held by a holding mechanism and rotated by a rotating mechanism A cleaning brush mechanism that is selectively positioned at a working position that contacts the surface and a standby position that does not contact the held surface of the object to be ground and the surface to be ground, and the cleaning brush mechanism that holds the surface of the object to be ground And a brush cleaning liquid supply mechanism for supplying a cleaning liquid to the held surface of the object to be ground and the surface to be ground.

本発明に係る研削加工装置は、二流体洗浄の機能とブラシ洗浄の機能とを併せ持つため、二流体洗浄によって直径数十μm程のパーティクルを除去し、ブラシ洗浄によって直径数百nm程のパーティクルを除去することができる。したがって、従来のスピン洗浄機構では対応できなかった微小パーティクル除去という高度な要求に応えることができる。しかも、二流体洗浄及びブラシ洗浄は、被研削面と被保持面の双方について同時に行うことができるため、研削加工後に再びウェーハに蒸着等を行う前工程に被研削物を戻すプロセスがある場合には、被保持面についても高度な要求基準に対応することができる。   Since the grinding apparatus according to the present invention has both a two-fluid cleaning function and a brush cleaning function, particles having a diameter of about several tens of μm are removed by two-fluid cleaning, and particles having a diameter of several hundreds of nm are removed by brush cleaning. Can be removed. Therefore, it is possible to meet a high level of demand for removing fine particles that cannot be handled by the conventional spin cleaning mechanism. Moreover, since the two-fluid cleaning and the brush cleaning can be performed on both the ground surface and the surface to be held at the same time, there is a process of returning the object to be ground to the previous step of vapor deposition or the like again after the grinding process. Can meet high requirements for the surface to be held.

研削加工装置及び洗浄手段の一例を示す斜視図である。It is a perspective view which shows an example of a grinding process apparatus and a washing | cleaning means. 保持工程の状態を示す斜視図である。It is a perspective view which shows the state of a holding process. 二流体洗浄工程の状態を示す斜視図である。It is a perspective view which shows the state of a two-fluid washing process. ブラシ洗浄工程の状態を示す斜視図である。It is a perspective view which shows the state of a brush washing process.

図1に示す研削加工装置1は、被研削物の被保持面を保持する複数(図1の例では3つ)の保持テーブル2と、保持テーブル2に保持された被研削物の被研削面を研削加工する第一の研削加工手段3及び第二の研削加工手段4と、保持テーブル2上で研削加工された被研削物の被保持面及び被研削面を洗浄する洗浄手段5とを備えている。なお、図1の研削加工装置1では2つの研削加工手段3、4を備えているが、研削加工手段は1つだけでもよい。   A grinding apparatus 1 shown in FIG. 1 includes a plurality of (three in the example of FIG. 1) holding tables 2 that hold a holding surface of an object to be ground, and a surface to be ground of the object that is held by the holding table 2. The first grinding means 3 and the second grinding means 4 for grinding the workpiece, and the to-be-ground surface and the to-be-ground surface of the workpiece to be ground that have been ground on the holding table 2 are provided. ing. In addition, although the grinding apparatus 1 of FIG. 1 is provided with the two grinding means 3 and 4, only one grinding means may be sufficient.

研削加工装置1の最前部には、研削加工前の被研削物を複数収容可能な第一のカセット6aと、研削加工及び洗浄後の被研削物を収容可能な第二のカセット6bとが載置されている。第一のカセット6a及び第二のカセット6bの近傍には、両カセット6a、6bに対する被研削物の搬出入を行う搬出入手段7が配設されている。搬出入手段7は、被研削物を吸着する保持部70と、保持部70が先端に連結され屈曲及び回動自在なアーム部71とを有している。   A first cassette 6a capable of accommodating a plurality of workpieces before grinding and a second cassette 6b capable of accommodating workpieces after grinding and cleaning are mounted on the foremost part of the grinding apparatus 1. Is placed. In the vicinity of the first cassette 6a and the second cassette 6b, loading / unloading means 7 for loading / unloading the workpiece to / from both cassettes 6a, 6b is provided. The carry-in / out means 7 has a holding part 70 that adsorbs an object to be ground, and an arm part 71 that is connected to the tip of the holding part 70 and can be bent and rotated.

搬出入手段7の後部側には、搬出入手段7が第一のカセット6aから搬出した被研削物の中心位置を一定の位置に位置合わせする中心合わせ手段8が配設されている。中心合わせ手段8には、被研削物が載置される載置台80と、載置台80から上方に突出した状態で円弧状に配置され互いに近づく方向に移動可能な複数の突起部81とを備えている。   On the rear side of the unloading / unloading means 7, a centering means 8 is provided for aligning the center position of the workpiece to be ground unloaded by the unloading / unloading means 7 from the first cassette 6a. The centering means 8 includes a mounting table 80 on which an object to be ground is mounted, and a plurality of protrusions 81 that are arranged in an arc shape in a state of protruding upward from the mounting table 80 and are movable toward each other. ing.

中心合わせ手段8の近傍には、中心合わせ手段8から保持テーブル2への被研削物の搬送を行う第一の搬送手段9aと、保持テーブル2から洗浄手段5への被研削物の搬送を行う第二の搬送手段9bとが配設されている。第一の搬送手段9aは、旋回動及び昇降するアーム部90aと、被研削物を吸着する吸着部91aとを備えている。第二の搬送手段9bも同様に、旋回動及び昇降するアーム部90bと、被研削物を吸着する吸着部91bとを備えている。   In the vicinity of the centering means 8, a first conveying means 9 a that conveys the object to be ground from the centering means 8 to the holding table 2, and an object to be ground that is conveyed from the holding table 2 to the cleaning means 5 are conveyed. Second conveying means 9b is provided. The first transport means 9a includes an arm portion 90a that swings and moves up and down, and an adsorption portion 91a that adsorbs an object to be ground. Similarly, the second transport means 9b includes an arm portion 90b that swivels and moves up and down, and an adsorption portion 91b that adsorbs the workpiece.

3つの保持テーブル2は、ターンテーブル20によって自転及び公転可能に支持されている。保持テーブル2の公転による移動経路の上方には、第一の研削加工手段3及び第二の研削加工手段4が配設されている。   The three holding tables 2 are supported by the turntable 20 so as to be able to rotate and revolve. A first grinding means 3 and a second grinding means 4 are disposed above the movement path by the revolution of the holding table 2.

第一の研削加工手段3は、鉛直方向の軸心を有するスピンドル(図示せず)を回転可能に支持するハウジング30と、そのスピンドルの下端に形成され回転可能なホイールマウント31と、ホイールマウント31を回転駆動するモータ32と、ホイールマウント31に装着された研削ホイール33とから構成され、研削ホイール33の下面には円弧状に複数の粗研削砥石34が固着されている。   The first grinding means 3 includes a housing 30 that rotatably supports a spindle (not shown) having a vertical axis, a wheel mount 31 that is formed at the lower end of the spindle and is rotatable, and the wheel mount 31. A grinding wheel 33 mounted on the wheel mount 31 and a plurality of coarse grinding wheels 34 are fixed to the lower surface of the grinding wheel 33 in an arc shape.

第一の研削加工手段3は、第一の研削送り手段10によって駆動されて昇降可能となっている。第一の研削送り手段10は、鉛直方向の軸心を有し回転可能なボールスクリュー100と、ボールスクリュー100と平行に配設された一対のガイドレール101と、ボールスクリュー100を正逆回転させるパルスモータ102と、ボールスクリュー100に螺合する図示しないナットを内部に有するとともに側部がガイドレール101に摺接する基台103と、基台103に固定され第一の研削加工手段3を固定支持する支持部104とから構成されている。第一の研削送り手段10は、パルスモータ102の駆動によってボールスクリュー100が回転することにより基台103がガイドレール101に案内されて昇降し、これに伴い第一の研削加工手段3を昇降させる。   The first grinding means 3 is driven by the first grinding feed means 10 and can be moved up and down. The first grinding feed means 10 has a vertically rotating ball screw 100 having a vertical axis, a pair of guide rails 101 arranged in parallel to the ball screw 100, and a forward and reverse rotation of the ball screw 100. A pulse motor 102, a nut 103 (not shown) that is screwed into the ball screw 100, a base 103 whose side is in sliding contact with the guide rail 101, and a first grinding means 3 fixed to the base 103 are fixedly supported. The supporting part 104 is configured to be configured. The first grinding feed means 10 moves up and down as the base 103 is guided by the guide rail 101 by the rotation of the ball screw 100 driven by the pulse motor 102, and the first grinding means 3 is raised and lowered accordingly. .

第二の研削加工手段4は、鉛直方向の軸心を有するスピンドル(図示せず)を回転可能に支持するハウジング40と、そのスピンドルの下端に形成され回転可能なホイールマウント41と、ホイールマウント41を回転駆動するモータ42と、ホイールマウント41に装着された研削ホイール43とから構成され、研削ホイール43の下面には円弧状に複数の仕上げ研削砥石44が固着されている。   The second grinding means 4 includes a housing 40 that rotatably supports a spindle (not shown) having a vertical axis, a rotatable wheel mount 41 formed at the lower end of the spindle, and a wheel mount 41. The grinding wheel 43 is mounted on the wheel mount 41, and a plurality of finish grinding wheels 44 are fixed to the lower surface of the grinding wheel 43 in an arc shape.

第二の研削加工手段4は、第二の研削送り手段11によって駆動されて昇降可能となっている。第二の研削送り手段11は、鉛直方向の軸心を有し回転可能なボールスクリュー110と、ボールスクリュー110と平行に配設された一対のガイドレール111と、ボールスクリュー110を正逆回転させるパルスモータ112と、ボールスクリュー110に螺合する図示しないナットを内部に有するとともに側部がガイドレール111に摺動する基台113と、基台113に固定され第二の研削加工手段4を固定支持する支持部114とから構成されている。第二の研削送り手段11は、パルスモータ112の駆動によってボールスクリュー110が回転することにより基台113がガイドレール111に案内されて昇降し、これに伴い第二の研削加工手段4を昇降させる。   The second grinding means 4 is driven by the second grinding feed means 11 and can be moved up and down. The second grinding feed means 11 has a vertical axis and a rotatable ball screw 110, a pair of guide rails 111 arranged in parallel to the ball screw 110, and the ball screw 110 rotating forward and backward. A base 113 having a pulse motor 112 and a nut (not shown) that is screwed into the ball screw 110 and having a side portion sliding on the guide rail 111 and a second grinding means 4 fixed to the base 113 are fixed. It is comprised from the support part 114 to support. The second grinding feed means 11 moves up and down as the base 113 is guided by the guide rail 111 by the rotation of the ball screw 110 driven by the pulse motor 112, and the second grinding means 4 is raised and lowered accordingly. .

洗浄手段5は、図1において拡大して示すように、装置上面から窪んだ凹部50に配設されている。洗浄手段5は、凹部50の底部500から起立する複数のプーリー510を含む保持機構51を備えている。各プーリ510は、それぞれが水平方向に移動可能であるとともに、底部500の下方において図示しないモータと連結され鉛直方向を回転軸として自転可能となっている。各プーリー510には、被研削物の外周縁に係合して被研削物を支持する係合部510aが形成されている。係合部510aは、被研削物の外周縁に当接する部分が小径の薄い円柱状に形成され、その上下が徐々に当該当接部分より大径となっていく形状に形成されている。複数のプーリー510は、係合部510aに被研削物が係合した状態で少なくとも1つのプーリー510が回転することにより、プーリー510の自転方向とは逆の方向に被研削物を回転させることができ、保持機構51が回転機構としても機能する構成となっている。図示の例におけるプーリー510は4つあるが、少なくとも3つあれば、3つの係合部510aが被研削物の3箇所に係合して保持し、回転させることができる。   As shown in an enlarged view in FIG. 1, the cleaning means 5 is disposed in a recess 50 that is recessed from the upper surface of the apparatus. The cleaning means 5 includes a holding mechanism 51 including a plurality of pulleys 510 that stand from the bottom 500 of the recess 50. Each pulley 510 is movable in the horizontal direction, and is connected to a motor (not shown) below the bottom portion 500 so as to be rotatable about the vertical direction as a rotation axis. Each pulley 510 is formed with an engaging portion 510a that engages with the outer peripheral edge of the workpiece and supports the workpiece. The engaging portion 510a is formed in a shape in which a portion that comes into contact with the outer peripheral edge of the object to be ground is formed in a thin cylindrical shape with a small diameter, and the upper and lower portions gradually become larger in diameter than the contacting portion. The plurality of pulleys 510 can rotate the workpiece in a direction opposite to the rotation direction of the pulley 510 by rotating at least one pulley 510 in a state where the workpiece is engaged with the engaging portion 510a. The holding mechanism 51 also functions as a rotation mechanism. Although there are four pulleys 510 in the illustrated example, if there are at least three pulleys 510, the three engaging portions 510a can be engaged with and held at three locations of the workpiece and rotated.

4つのプーリー510の側方には、底部500から起立しかつ水平方向に移動可能なブラシ基部52が配設されており、ブラシ基部52からは、第一の洗浄ブラシ機構53及び第二の洗浄ブラシ機構54が、4つのプーリー510側に向けて水平方向にのびた状態で配設されている。第一、第二の洗浄ブラシ機構53、54は、隣り合うプーリー510の間に配設されており、独立して昇降可能であり、それぞれが水平方向の回転軸530、540を有しており、その回転軸530、540にそれぞれ第一のブラシ部531及び第二のブラシ部541が固定されている。第一の洗浄ブラシ機構53及び第二の洗浄ブラシ機構54は、水平方向の移動及び昇降により、保持機構51によって保持されて回転させられている被加工物の被保持面と被研削面とにそれぞれ当接する作用位置と、被加工物の被保持面と被研削面とに当接しない待機位置とに選択的に位置付けられる。   On the sides of the four pulleys 510, a brush base 52 is provided that stands up from the bottom 500 and is movable in the horizontal direction. From the brush base 52, a first cleaning brush mechanism 53 and a second cleaning brush are disposed. The brush mechanism 54 is disposed in a state of extending horizontally toward the four pulleys 510 side. The first and second cleaning brush mechanisms 53 and 54 are disposed between adjacent pulleys 510 and can be moved up and down independently, and each has a horizontal rotation shaft 530 or 540. The first brush portion 531 and the second brush portion 541 are fixed to the rotation shafts 530 and 540, respectively. The first cleaning brush mechanism 53 and the second cleaning brush mechanism 54 are moved to the held surface and the ground surface of the workpiece that are held and rotated by the holding mechanism 51 by horizontal movement and elevation. Each of the contact positions is selectively positioned at the contact position and the standby position where the workpiece does not contact the held surface and the ground surface.

ブラシ基部52からは、第一のブラシ洗浄液供給機構55及び第二のブラシ洗浄液供給機構56が、第一の洗浄ブラシ機構53及び第二の洗浄ブラシ機構54と同一方向にのびた状態で配設されている。第一のブラシ洗浄液供給機構55は、第一の洗浄ブラシ機構53の上方に位置しており、その先端の液噴出口550は、第一の洗浄ブラシ機構53を構成する第一のブラシ部531に向けられている。一方、第二のブラシ洗浄液供給機構56は、第二の洗浄ブラシ機構54の下方に位置し、その先端の液噴出口560は、第二の洗浄ブラシ機構54を構成する第二のブラシ部541に向けられている。第一のブラシ洗浄液供給機構55は、第一の洗浄ブラシ機構53が作用位置にあって被研削物の被研削面に当接しているときに当該被研削面に対して洗浄液を供給し、第二のブラシ洗浄液供給機構56は、第二の洗浄ブラシ機構54が作用位置にあって被研削物の被保持面に当接しているときに当該被保持面に対して洗浄液を供給する。   From the brush base 52, a first brush cleaning liquid supply mechanism 55 and a second brush cleaning liquid supply mechanism 56 are arranged in a state extending in the same direction as the first cleaning brush mechanism 53 and the second cleaning brush mechanism 54. ing. The first brush cleaning liquid supply mechanism 55 is located above the first cleaning brush mechanism 53, and the liquid jet outlet 550 at the tip of the first brush cleaning liquid supply mechanism 55 is a first brush portion 531 constituting the first cleaning brush mechanism 53. Is directed to. On the other hand, the second brush cleaning liquid supply mechanism 56 is positioned below the second cleaning brush mechanism 54, and the liquid jet outlet 560 at the tip thereof is a second brush portion 541 that constitutes the second cleaning brush mechanism 54. Is directed to. The first brush cleaning liquid supply mechanism 55 supplies the cleaning liquid to the surface to be ground when the first cleaning brush mechanism 53 is in the operating position and is in contact with the surface to be ground. The second brush cleaning liquid supply mechanism 56 supplies the cleaning liquid to the held surface when the second cleaning brush mechanism 54 is in the operating position and is in contact with the held surface of the object to be ground.

ブラシ基部52、第一、第二の洗浄ブラシ機構53、54及び第一、第二のブラシ洗浄液供給機構55、56と衝突しない位置には、水平方向に移動可能な二流体洗浄液供給機構57が配設されている。二流体洗浄液供給機構57は、保持機構51によって保持され回転させられている被研削物の被保持面と被研削面とに気体と液体とからなる二流体洗浄液を供給する機能を有しており、底部500から起立し鉛直方向の軸心を中心として回転可能であり気体と液体とからなる二流体洗浄液の流通路を備える二流体基部570と、二流体基部570の内部の流通路と連通し水平方向にのびる第一のノズル571及び第二のノズル572とから構成される。第一のノズル571の先端の第一の二流体噴出口571aは下方に向けて開口し、第二のノズル572の先端の第二の二流体噴出口572aは上方に向けて開口している。   At a position where it does not collide with the brush base 52, the first and second cleaning brush mechanisms 53 and 54, and the first and second brush cleaning liquid supply mechanisms 55 and 56, a two-fluid cleaning liquid supply mechanism 57 that can move in the horizontal direction is provided. It is arranged. The two-fluid cleaning liquid supply mechanism 57 has a function of supplying a two-fluid cleaning liquid composed of a gas and a liquid to the held surface and the ground surface of the object to be ground that is held and rotated by the holding mechanism 51. A two-fluid base 570 that stands up from the bottom 500 and is rotatable about a vertical axis, and that has a two-fluid cleaning liquid flow passage composed of gas and liquid, and communicates with a flow passage inside the two-fluid base portion 570 The first nozzle 571 and the second nozzle 572 extend in the horizontal direction. The first two-fluid outlet 571a at the tip of the first nozzle 571 opens downward, and the second two-fluid outlet 572a at the tip of the second nozzle 572 opens upward.

以下では、図1の研削加工装置1を用いて被研削物を研削し洗浄する方法について、図1〜図4を参照して説明する。被研削物は特に限定はされないが、例えばシリコンウェーハやGaAs等の半導体ウェーハ、セラミックス、ガラス、サファイア(Al2O3)系の無機材料基板、板状金属や樹脂の延性材料、さらには、ミクロンオーダーからサブミクロンオーダーの平坦度(TTV:total thickness variation:被研削面を基準面として厚み方向に測定した高さの被研削面の全面における最大値と最小値の差)が要求される各種加工材料が挙げられる。 Hereinafter, a method of grinding and cleaning an object to be ground using the grinding apparatus 1 of FIG. 1 will be described with reference to FIGS. The object to be ground is not particularly limited. For example, silicon wafers, semiconductor wafers such as GaAs, ceramics, glass, sapphire (Al 2 O 3 ) based inorganic material substrates, sheet metal and resin ductile materials, and micron Various processes requiring flatness (TTV: total thickness variation: difference between the maximum value and the minimum value of the entire surface to be ground measured in the thickness direction with the surface to be ground as the reference surface) Materials.

最初に、搬出入手段7を構成するアーム部71の旋回及び前進によって保持部70が第一のカセット6aの内部に進入し、第一のカセット6aに収容された被研削物を保持部70が吸着する。そして、アーム部71が後退及び旋回することにより、吸着した被研削物を第一のカセット6aから取り出し、中心あわせ手段8に搬送する。中心合わせ手段8では、保持部70による被研削物の吸着が解除されることにより被研削物が載置台80に載置され、その後、複数の突起部81を互いに近づく方向に移動させることにより、被研削物の中心を一定の位置に位置合わせする。   First, the holding part 70 enters the inside of the first cassette 6a by turning and advancing of the arm part 71 constituting the loading / unloading means 7, and the holding part 70 holds the object to be ground accommodated in the first cassette 6a. Adsorb. Then, as the arm portion 71 moves backward and turns, the attracted workpiece is taken out from the first cassette 6a and conveyed to the centering means 8. In the centering means 8, the object to be ground is released on the mounting table 80 by releasing the adsorption of the object to be ground by the holding unit 70, and then the plurality of protrusions 81 are moved in a direction approaching each other, The center of the workpiece is aligned at a certain position.

次に、第一の搬送手段9aを構成するアーム部90aの旋回および下降により中心合わせされた被研削物を吸着部91aが吸着し、吸着後にアーム部90aが上昇し被研削物を保持テーブル2の上方に移動させ、そこで被研削物を下降させ吸着部91aによる吸着を解除することにより、着脱領域1Aに位置する保持テーブル2によって被研削物が保持される。このとき、研削される面である被研削面が上を向いて露出し、その裏面である被保持面が保持テーブル2によって保持された状態となる。   Next, the object to be ground centered by turning and lowering of the arm part 90a constituting the first conveying means 9a is adsorbed by the adsorbing part 91a, and after adsorbing, the arm part 90a is raised to hold the object to be ground. Then, the object to be ground is lowered and the suction by the suction part 91a is released, whereby the object to be ground is held by the holding table 2 located in the attaching / detaching region 1A. At this time, the surface to be ground which is the surface to be ground is exposed upward, and the surface to be held which is the back surface is held by the holding table 2.

保持テーブル2によって保持された被研削物は、ターンテーブル20の時計回り方向(図1における矢印A方向)の回転により研削領域1Bに進入し、第一の研削加工手段3の直下に位置づけされる。そして、保持テーブル2が自転することにより被研削物を回転させるとともに、研削ホイール33を回転させた状態で第一の研削送り手段10によって駆動されて第一の研削加工手段3が下降し、回転する粗研削砥石34が回転する被研削物の被研削面に接触し、粗研削が行われる。   The object to be ground held by the holding table 2 enters the grinding region 1B by the rotation of the turntable 20 in the clockwise direction (arrow A direction in FIG. 1), and is positioned directly below the first grinding means 3. . Then, while the holding table 2 rotates, the object to be ground is rotated, and the first grinding means 3 is lowered and driven by the first grinding feed means 10 while the grinding wheel 33 is rotated. The rough grinding wheel 34 is brought into contact with the surface to be ground of the object to be rotated, and rough grinding is performed.

粗研削終了後の被研削物は、ターンテーブル20の時計回り方向の回転により第二の研削加工手段4の直下に位置づけされる。そして、保持テーブル2が自転することにより被研削物を回転させるとともに、研削ホイール43を回転させた状態で第二の研削送り手段11によって駆動されて第二の研削加工手段4が下降し、回転する仕上げ研削砥石44が回転する被研削物の粗研削後の被研削面に接触し、仕上げ研削が行われる。   The object to be ground after the rough grinding is positioned immediately below the second grinding means 4 by the rotation of the turntable 20 in the clockwise direction. Then, while the holding table 2 rotates, the object to be ground is rotated, and the second grinding processing means 4 is lowered and rotated by being driven by the second grinding feed means 11 while the grinding wheel 43 is rotated. The finish grinding wheel 44 to be brought into contact with the surface to be ground after the rough grinding of the workpiece to be rotated is subjected to finish grinding.

こうして仕上げ研削が終了すると、ターンテーブル20の時計回り方向の回転により被研削物が着脱領域1Aに戻る。そして、第二の搬送手段9bを構成する吸着部91bによって被研削物が吸着され、アーム部90bの旋回によって被研削物が洗浄手段5に搬送される。   When finish grinding is completed in this manner, the object to be ground returns to the attachment / detachment region 1A by the clockwise rotation of the turntable 20. Then, the object to be ground is adsorbed by the adsorbing part 91b constituting the second conveying means 9b, and the object to be ground is conveyed to the cleaning means 5 by turning of the arm part 90b.

第二の搬送手段9bは、洗浄手段5を構成する4つのプーリー510が互いに離れたポジションに位置した状態において、被研削物をプーリー間の空間に下降させて一定の高さまで搬送する。そして、図2に示すように、プーリー510を互いに近づく方向(図2における矢印B1方向)に移動させることにより係合部510aを被研削物Wの外周縁に係合させ、被研削物Wを4つのプーリー510によって保持する。このとき、図2の例では、被研削物Wの被研削面W1が上方に向けて露出し、被保持面W2が下方に向けて露出しているが、被保持面W2が上方に向けて露出し、被研削面W1が下方に向けて露出していてもよい。なお、第二の搬送手段9bは、その後、吸着部91bによる被研削物Wの吸着を解除し、アーム部90bを上昇及び旋回させて元の位置に戻る(保持工程)。   In a state where the four pulleys 510 constituting the cleaning unit 5 are located at positions separated from each other, the second transport unit 9b moves the workpiece to be lowered to the space between the pulleys and transports the workpiece to a certain height. Then, as shown in FIG. 2, the pulley 510 is moved in a direction approaching each other (in the direction of arrow B1 in FIG. 2) to engage the engaging portion 510a with the outer peripheral edge of the workpiece W. It is held by four pulleys 510. At this time, in the example of FIG. 2, the surface to be ground W1 of the workpiece W is exposed upward and the surface to be held W2 is exposed downward, but the surface to be held W2 faces upward. It may be exposed and the to-be-ground surface W1 may be exposed downward. In addition, the 2nd conveyance means 9b cancels | releases adsorption | suction of the to-be-ground material W by the adsorption | suction part 91b after that, raises and rotates the arm part 90b, and returns to the original position (holding process).

洗浄手段5を構成する回転機構51は、図3に示すように、少なくとも1つ以上のプーリー510を例えば時計回り方向(図3における矢印C方向)に自転させることにより、プーリー510に係合した被研削物Wを、鉛直方向を回転軸としてプーリー510の回転方向とは逆の回転方向(図3における矢印D方向)に回転させる。また、二流体洗浄液供給機構57を被研削物Wに近づく方向に移動させ、第一の二流体噴出口571aを被研削面W1の中心部に対面させるとともに、第二の二流体噴出口572aを被保持面W2の中心部に対面させる。そして、回転機構51が被研削物Wを例えば300[rpm]の回転速度で回転させながら、第一の二流体噴出口571a及び第二の二流体噴出口572aからそれぞれ気体と液体とからなる二流体洗浄液を噴出し、被研削物の被研削面W1と被保持面W2とに二流体洗浄液を供給して両面の洗浄を行う。気体としては、例えば0.3〜0.5[MPa]程度のエアーが使用され、液体としては、例えば0.2[MPa]程度の純水が使用される。また、洗浄液供給機構57の二流体基部570を所定範囲で正逆双方向に交互に回転させて第一のノズル571及び第二のノズル572を揺動させることにより、第一の二流体噴出口571a及び第二の二流体噴出口572aから噴出される二流体を、被研削物Wの中心から周縁部にまで万遍なく供給し、一様な洗浄を行う。かかる洗浄によって、少なくとも直径が数十μm程度のパーティクルを除去することができる(二流体洗浄工程)。   As shown in FIG. 3, the rotating mechanism 51 constituting the cleaning means 5 is engaged with the pulley 510 by rotating at least one pulley 510 in the clockwise direction (arrow C direction in FIG. 3), for example. The workpiece W is rotated in the rotation direction (arrow D direction in FIG. 3) opposite to the rotation direction of the pulley 510 with the vertical direction as the rotation axis. Further, the two-fluid cleaning liquid supply mechanism 57 is moved in a direction approaching the object to be ground W so that the first two-fluid ejection port 571a faces the center of the surface to be ground W1, and the second two-fluid ejection port 572a is It is made to face the center part of the to-be-held surface W2. Then, while the rotating mechanism 51 rotates the workpiece W at a rotational speed of, for example, 300 [rpm], the first two-fluid jet port 571a and the second two-fluid jet port 572a are respectively composed of gas and liquid. The fluid cleaning liquid is ejected, and the two-fluid cleaning liquid is supplied to the surface to be ground W1 and the surface to be held W2 of the workpiece to be cleaned. For example, air of about 0.3 to 0.5 [MPa] is used as the gas, and pure water of, for example, about 0.2 [MPa] is used as the liquid. Further, the first two-fluid jet port is made by swinging the first nozzle 571 and the second nozzle 572 by alternately rotating the two-fluid base 570 of the cleaning liquid supply mechanism 57 in the forward and reverse directions within a predetermined range. The two fluids ejected from 571a and the second two-fluid ejection port 572a are uniformly supplied from the center to the peripheral portion of the workpiece W to perform uniform cleaning. By such cleaning, particles having a diameter of about several tens of μm can be removed (two-fluid cleaning step).

次に、図4に示すように、二流体洗浄液供給機構57を元の位置に退避させ、ブラシ基部52を被研削物Wに近づく方向に移動させ、第一のブラシ部531を被研削物Wの上方(被研削面W1側)に位置させ、第二のブラシ部541を被研削物Wの下方(被保持面W2側)に位置させる。そして、保持機構を兼ねる回転機構51がプーリー510を時計回り方向(図4における矢印C方向)に自転させて被研削物Wをその逆の方向(図4における矢印D方向)に回転させるとともに、第一の洗浄ブラシ機構53及び第二の洗浄ブラシ機構54を回転させながら第一の洗浄ブラシ機構53を下降させるとともに第二の洗浄ブラシ機構54を上昇させ、回転する第一のブラシ部531を被研削面W1に当接させるとともに、回転する第二のブラシ部541を被保持面W2に当接させ、両者を作用位置に位置付けた状態で両面を洗浄する。このとき、第一のブラシ部531及び第二のブラシ部541の先端を被研削物Wの中心部において接触させることにより、両ブラシ部531,541が被研削物Wの半径相当部分に当接するようにして、被研削面及び被保持面の全面にブラシが接触するようにする。また、第一の洗浄ブラシ機構53及び第二の洗浄ブラシ機構54の回転速度は、例えば1000[rpm]とし、被研削物Wの回転速度は、例えば、100[rpm]とする。さらに、第一のブラシ洗浄液供給機構55の液噴出口550から被研削面W1に対して洗浄液を噴出し、第二のブラシ洗浄液供給機構56の液噴出口560から被保持面W2に対して洗浄液を噴出する。第一のブラシ洗浄液供給機構55及び第二のブラシ洗浄液供給機構56から被研削物Wに対して供給される洗浄液としては、例えば、オゾン水、アンモニア水、界面活性剤等がある(ブラシ洗浄工程)。   Next, as shown in FIG. 4, the two-fluid cleaning liquid supply mechanism 57 is retracted to the original position, the brush base 52 is moved in a direction approaching the workpiece W, and the first brush portion 531 is moved to the workpiece W. The second brush portion 541 is positioned below the object to be ground W (on the held surface W2 side). Then, the rotation mechanism 51 that also serves as a holding mechanism rotates the pulley 510 in the clockwise direction (arrow C direction in FIG. 4) to rotate the workpiece W in the opposite direction (arrow D direction in FIG. 4), While rotating the first cleaning brush mechanism 53 and the second cleaning brush mechanism 54, the first cleaning brush mechanism 53 is lowered and the second cleaning brush mechanism 54 is raised to rotate the first brush portion 531 rotating. While being brought into contact with the surface to be ground W1, the rotating second brush portion 541 is brought into contact with the surface to be held W2, and both surfaces are cleaned in a state where both are positioned at the operating position. At this time, by bringing the tips of the first brush portion 531 and the second brush portion 541 into contact with the center portion of the workpiece W, both brush portions 531 and 541 come into contact with the radius equivalent portion of the workpiece W. In this way, the brush is brought into contact with the entire surface to be ground and the surface to be held. The rotation speed of the first cleaning brush mechanism 53 and the second cleaning brush mechanism 54 is, for example, 1000 [rpm], and the rotation speed of the workpiece W is, for example, 100 [rpm]. Further, the cleaning liquid is jetted from the liquid jet outlet 550 of the first brush cleaning liquid supply mechanism 55 to the ground surface W1, and the cleaning liquid is jetted from the liquid jet outlet 560 of the second brush cleaning liquid supply mechanism 56 to the held surface W2. Erupt. Examples of the cleaning liquid supplied from the first brush cleaning liquid supply mechanism 55 and the second brush cleaning liquid supply mechanism 56 to the workpiece W include ozone water, ammonia water, and a surfactant (brush cleaning step). ).

こうして第一の洗浄ブラシ機構53及び第二の洗浄ブラシ機構54並びに第一のブラシ洗浄液供給機構55及び第二のブラシ洗浄液供給機構56により洗浄が行われると、二流体洗浄液供給工程においては除去できなかった直径が数百nmのパーティクルを除去することができる。また、上記説明した二流体洗浄工程及びブラシ洗浄工程は、被研削物Wの被研削面W1及び被保持面W2の双方に対して行われるため、その後に再びウェーハに蒸着等を行う前工程に被研削物を戻すこともできる。   Thus, when cleaning is performed by the first cleaning brush mechanism 53 and the second cleaning brush mechanism 54 and the first brush cleaning liquid supply mechanism 55 and the second brush cleaning liquid supply mechanism 56, they can be removed in the two-fluid cleaning liquid supply process. The particles having a diameter of several hundreds of nanometers can be removed. In addition, since the two-fluid cleaning process and the brush cleaning process described above are performed on both the ground surface W1 and the retained surface W2 of the workpiece W, the pre-process for performing deposition or the like again on the wafer thereafter. The workpiece can be returned.

二流体洗浄工程のみでは、直径数十μmのパーティクルを除去することはできるが、直径数百nmのパーティクルを除去することはできない。一方、ブラシ洗浄工程のみでは、直径数百μmのパーティクルを除去することはできるが、洗浄時に直径数十μmのパーティクルによる引っかきによって被研削物に幅数μm程の傷が入るという問題がある。したがって、二流体洗浄工程を実施した後にブラシ洗浄工程を実施し、直径数十μmのパーティクル除去後に直径数百μmのパーティクルを除去するようにすると、被研削物に傷をつけることなく、直径数十μm及び直径数百nmのパーティクルを除去することができる。   Only the two-fluid cleaning process can remove particles with a diameter of several tens of micrometers, but cannot remove particles with a diameter of several hundreds of nanometers. On the other hand, particles having a diameter of several hundreds of μm can be removed only by the brush cleaning process, but there is a problem that scratches with a width of several μm are formed on the object to be ground by scratching with particles having a diameter of several tens of μm during cleaning. Therefore, when the brush cleaning process is performed after the two-fluid cleaning process is performed, and the particles having a diameter of several hundreds of micrometers are removed after the particles having a diameter of several tens of micrometers are removed, the number of diameters is reduced without damaging the workpiece. Particles having a diameter of 10 μm and a diameter of several hundred nm can be removed.

このようにして二流体洗浄及びブラシ洗浄が施された被研削物Wは、図1に示した搬出入手段7の保持部70に吸着され、プーリー510が互いに離れる方向(図2における矢印B2方向)に移動して保持機構51による保持が解除された後、搬出入手段7によって洗浄手段5から搬出される。そして、搬出入手段7は、保持部70を第二のカセット6bの内部の所望のスロットに進入させて吸着を解除し、研削及び洗浄後の被研削物を収容する。   The workpiece W that has been subjected to the two-fluid cleaning and the brush cleaning in this manner is adsorbed by the holding portion 70 of the carry-in / out means 7 shown in FIG. 1, and the pulleys 510 are separated from each other (in the direction of arrow B2 in FIG. 2). ) To be released from the cleaning means 5 by the carry-in / out means 7. The carry-in / out means 7 moves the holding portion 70 into a desired slot inside the second cassette 6b to release the suction, and accommodates the object to be ground after grinding and cleaning.

なお、二流体洗浄工程及びブラシ洗浄工程の終了後には、以下のようにしてオゾン水洗浄工程を実施してもよい。すなわち、例えば、回転機構51が被研削物Wを300[rpm]の回転速度で回転させ、図示しない第一のオゾン水ノズル及び第二のオゾン水ノズルを揺動させながら両ノズルからオゾン水を噴出し、被研削物Wの中心から周縁部にまで万遍なくオゾン水を供給して洗浄を行う。このようにしてオゾン水による洗浄を行うと、被研削物Wの被研削面W1及び被保持面W2に付着した有機物を除去することができる。   In addition, after the end of the two-fluid cleaning process and the brush cleaning process, the ozone water cleaning process may be performed as follows. That is, for example, the rotating mechanism 51 rotates the workpiece W at a rotation speed of 300 [rpm], and the ozone water is supplied from both nozzles while swinging the first ozone water nozzle and the second ozone water nozzle (not shown). Cleaning is performed by supplying ozone water uniformly from the center of the workpiece W to the peripheral edge. When cleaning with ozone water is performed in this manner, organic substances attached to the ground surface W1 and the retained surface W2 of the workpiece W can be removed.

また、二流体洗浄工程及びブラシ洗浄工程の終了後に、薬液によって残留物を除去するエッチング工程を実施してもよい。エッチング工程は、例えば、回転機構51が被研削物Wを10[rpm]の回転速度で回転させ、図示しないエッチング液ノズルから被研削物に対してエッチング液を供給することにより行う。かかるエッチング工程により、かりに被研削物Wの被研削面W1及び被保持面W2に残留物があったとしても、残留物を完全に除去することができる。   Moreover, you may implement the etching process which removes a residue with a chemical | medical solution after completion | finish of a 2 fluid washing | cleaning process and a brush washing | cleaning process. The etching step is performed, for example, by the rotating mechanism 51 rotating the workpiece W at a rotation speed of 10 [rpm] and supplying the etching solution to the workpiece from an etching solution nozzle (not shown). By such an etching process, even if there are residues on the surface to be ground W1 and the surface to be held W2 of the object to be ground W, the residues can be completely removed.

1:研削加工装置
2:保持テーブル 20:ターンテーブル
3:第一の研削加工手段
30:ハウジング 31:ホイールマウント 32:モータ 33:研削ホイール
34:粗研削砥石
4:第二の研削加工手段
40:ハウジング 41:ホイールマウント 42:モータ 43:研削ホイール
44:仕上げ研削砥石
5:洗浄手段
50:凹部 500:底部
51:保持機構(回転機構) 510:プーリー 510a:係合部
52:ブラシ基部
53:第一の洗浄ブラシ機構 530:回転軸 531:第一のブラシ部
54:第二の洗浄ブラシ機構 540:回転軸 541:第二のブラシ部
55:第一のブラシ洗浄液供給機構 550:液噴出口
56:第二のブラシ洗浄液供給機構 560:液噴出口
57:ニ流体洗浄液供給機構 570:二流体基部
571:第一のノズル 571a:第一の二流体噴出口
572:第二のノズル 572a:第二の二流体噴出口
6a:第一のカセット 6b:第二のカセット
7:搬出入手段 70:保持部 71:アーム部
8:中心合わせ手段 80:載置台 81:突起部
9a:第一の搬送手段 90a:アーム部 91a:吸着部
9b:第二の搬送手段 90b:アーム部 91b:吸着部
10:第一の研削送り手段
100:ボールスクリュー 101:ガイドレール 102:パルスモータ
103:基台 104:支持部
11:第二の研削送り手段
110:ボールスクリュー 111:ガイドレール 112:パルスモータ
113:基台 114:支持部
1: Grinding device 2: Holding table 20: Turntable 3: First grinding means 30: Housing 31: Wheel mount 32: Motor 33: Grinding wheel 34: Rough grinding wheel 4: Second grinding means 40: Housing 41: Wheel mount 42: Motor 43: Grinding wheel 44: Finish grinding wheel 5: Cleaning means 50: Recess 500: Bottom 51: Holding mechanism (rotating mechanism) 510: Pulley 510a: Engaging portion 52: Brush base 53: No. One cleaning brush mechanism 530: Rotating shaft 531: First brush portion 54: Second cleaning brush mechanism 540: Rotating shaft 541: Second brush portion 55: First brush cleaning liquid supply mechanism 550: Liquid ejection port 56 : Second brush cleaning liquid supply mechanism 560: liquid outlet 57: dual fluid cleaning liquid supply mechanism 570: two-fluid base 571: first Slurry 571a: First two-fluid jet 572: Second nozzle 572a: Second two-fluid jet 6a: First cassette 6b: Second cassette 7: Loading / unloading means 70: Holding section 71: Arm section 8: Centering means 80: Mounting table 81: Protruding part 9a: First conveying means 90a: Arm part 91a: Suction part 9b: Second conveying means 90b: Arm part 91b: Suction part 10: First grinding feed Means 100: Ball screw 101: Guide rail 102: Pulse motor 103: Base 104: Support part 11: Second grinding feed means 110: Ball screw 111: Guide rail 112: Pulse motor 113: Base 114: Support part

Claims (1)

被研削物の被保持面を保持する保持テーブルと、該保持テーブルに保持された被研削物の被研削面を研削加工する研削加工手段と、該保持テーブル上で研削加工された被研削物の該被保持面と該被研削面とを洗浄する洗浄手段と、を有する研削加工装置であって、
該洗浄手段は、
複数のプーリーを含み、各プーリーがそれぞれ該被研削物の外周縁の少なくとも三箇所に係合することによって該被保持面と該被研削面とが露出した状態で被研削物を保持する保持機構と、
少なくとも一つ以上のプーリーを自転させることによってプーリーに係合した被研削物を鉛直方向を回転軸として該プーリーの自転方向とは逆の回転方向へ回転させる回転機構と、
該保持機構に保持されて該回転機構によって回転させられている被研削物の該被保持面と該被研削面とに気体と液体とからなる二流体洗浄液を供給する二流体洗浄液供給機構と、
隣り合うプーリーの間に配設され、該保持機構に保持されて該回転機構によって回転させられている被研削物の該被保持面と該被研削面とに当接する作用位置と、被研削物の該被保持面と該被研削面とに当接しない待機位置とに選択的に位置付けられる洗浄ブラシ機構と、
該洗浄ブラシ機構が被研削物の該被保持面と該被研削面とに当接している際に被研削物の該被保持面と該被研削面とに洗浄液を供給するブラシ洗浄液供給機構と、
を有する研削加工装置。
A holding table that holds a surface to be ground of the object to be ground, a grinding means for grinding a surface to be ground of the object to be ground held on the holding table, and an object to be ground that has been ground on the holding table. A grinding device having a cleaning means for cleaning the held surface and the ground surface,
The cleaning means includes
A holding mechanism that includes a plurality of pulleys and holds the object to be ground in a state in which the surface to be held and the surface to be ground are exposed by engaging each pulley with at least three positions on the outer peripheral edge of the object to be ground. When,
A rotation mechanism for rotating at least one pulley to rotate a workpiece engaged with the pulley in a rotation direction opposite to the rotation direction of the pulley with the vertical direction as a rotation axis;
A two-fluid cleaning liquid supply mechanism for supplying a two-fluid cleaning liquid composed of a gas and a liquid to the held surface of the object to be ground and the ground surface held by the holding mechanism and rotated by the rotating mechanism;
An operation position that is disposed between adjacent pulleys, is held by the holding mechanism and is rotated by the rotation mechanism, and abuts the held surface and the ground surface; A cleaning brush mechanism that is selectively positioned at a standby position that does not contact the held surface and the ground surface;
A brush cleaning liquid supply mechanism for supplying a cleaning liquid to the held surface of the object to be ground and the ground surface when the cleaning brush mechanism is in contact with the held surface of the object to be ground and the surface to be ground; ,
Grinding apparatus having
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