JP2011040577A - Method of manufacturing light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that an internal stress is caused by a strain in concave portion fabrication of a glass lid or that in welding thereof and reliability is deteriorated by a connection failure of a LED element or a shielding failure in a light-emitting device in which the LED element is mounted on an inorganic material substrate and is shielded by welding the glass lid in which the fabrication of a concave portion is carried out to a plate glass. <P>SOLUTION: A method of manufacturing a light-emitting device includes the steps of: mounting the LED element on the inorganic material substrate, covering a periphery of a LED element mounting region on the inorganic material substrate with the glass lid in which the concave portion is formed on the plate glass, and shielding the light-emitting device by metal welding. In the method of manufacturing the light-emitting device, heat processing fabrication is carried out as stress relaxation processing for relaxing the stress generated by assembling the light-emitting device. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a light emitting device using an LED element, and more particularly to a method for manufacturing a light emitting device that achieves high reliability by an airtight sealing structure.

  In recent years, as light-emitting devices using LED elements have become widespread, demands for in-vehicle use, large-sized televisions, notebook PCs, and the like are rapidly expanding. Along with this, demands for long life, high reliability, energy saving, and the like for light emitting devices using LED elements have become strong, and new technology development for realizing this has been desired.

  Various new technical developments have been made to meet the above requirements. For example, Patent Document 1 discloses a submount substrate made of an inorganic material whose thermal expansion coefficient is close to that of an LED element in order to increase reliability against thermal expansion. A light emitting device is described in which the LED element mounted on is covered with a resin layer mixed with fluorescent particles, and a resinous lens is adhered and sealed around the resin layer.

  Hereinafter, the light emitting device described in Patent Document 1 will be described with reference to FIG. In FIG. 20, the light emitting device 100 includes an LED 110, a submount substrate 120 on which the LED 110 is flip-chip mounted, a resin layer 130 containing fluorescent particles formed around the LED 110, and a support on which the submount substrate 120 is further fixed. 140 and a lens 150 that covers the LED 110 and the submount substrate 120 on the upper surface of the support 140. The submount substrate 120 and the support 140 are fixed via a eutectic layer, and the lens 150 is fixed to the support 140 by an ultraviolet curable adhesive layer 170.

  The support 140 is provided with a through-hole electrode 141 penetrating therethrough. The submount substrate 120 is bonded to the through-hole electrode 141 with a wire 160 on the upper surface of the support 140 so that the submount substrate 120 is supported by the support 140. Are electrically connected to an output electrode 142 provided on the back surface of the substrate. The lens 150 has a curved surface in order to efficiently extract the light from the LED 110 to the outside.

  In the above configuration, when the light emitting device 100 uses, for example, a blue LED as the LED 110 and a wavelength conversion resin layer mixed with a YAG phosphor as the resin layer 130, the light emitting device 100 can be used as a pseudo white light emitting device.

  Further, in Patent Document 2, for the purpose of a thin package, an organic EL element mounted on a glass substrate is fixed to a flat glass with a glass lid formed by recessing by a sandblasting method or an etching method with an ultraviolet curable adhesive. A sealed organic EL panel is described.

Japanese Patent Laying-Open No. 2007-243076 (see FIG. 1) JP 2001-297878 A (see FIGS. 2 and 3)

  As described above, the light emitting device shown in Patent Document 1 is such that the LED element is flip-chip mounted on an inorganic material sub-mount substrate whose thermal expansion coefficient is close to that of the LED element, and a resin layer is provided around the LED element. It is true that it has excellent temperature characteristics such as heat dissipation and thermal strain, and has a long life and high reliability by hermetically sealing with a lens, but it is still not sufficient.

  First, the lens for hermetic sealing is made of resin, and this resin lens is fixed using an ultraviolet curable adhesive, but the sealing structure using a resin lens or adhesive is as follows. Since the airtightness is weak and the airtightness is lost for a long time, it is difficult to maintain the expected long life and high reliability. In addition, since the submount substrate on which the LED element is mounted is bonded to the support that is the second substrate and then sealed by the lens, the structure becomes large, and it cannot meet the expectation of miniaturization and thinning. is there.

  In addition, the organic EL panel described in Patent Document 2 is formed by subjecting an organic EL element mounted on a transparent glass substrate for seeing through the display of the organic EL element to recess processing by a sandblasting method or an etching method on a flat glass. The performed glass lid is sealed with an ultraviolet curable adhesive and sealed, so that it has a thin package structure.

  However, as described in Patent Document 2, a glass lid formed by recessing flat glass by a sandblasting method or an etching method generates an uneven shape on the entire glass lid by the recess processing, so that internal stress is generated. Warping and cracking. The warp generated in the glass lid creates a gap in the contact surface when the glass lid and the glass substrate are fixed, and causes a deterioration in airtightness at the fixing portion.

  This problem of airtightness is small when an ultraviolet curable organic adhesive is used as in Patent Document 2, because the adhesive has the effect of filling the gap, but the problem is small, but the sealing of LED elements that require higher airtightness is required. In the case of stopping, it is necessary to perform intermetallic bonding such as eutectic bonding for fixing the glass lid and the inorganic material substrate. In this case, poor adhesion due to warpage of the glass lid is a fatal problem. Become.

  An object of the present invention is to solve the above-mentioned problems and to provide a processing distortion of a light emitting device in which a glass lid and an inorganic material substrate are fixed by intermetallic bonding such as eutectic bonding, or a glass lid in which a flat plate glass is subjected to recess processing. A method of manufacturing a light-emitting device using an LED element that can reduce the warpage of a glass lid by relaxing internal stress, achieve a sufficiently long life and high reliability, and achieve a small size and a thin shape. It is to provide.

  In order to achieve the above object, the manufacturing method of the present invention includes mounting an LED element on an inorganic material substrate, and covering the LED element mounting region on the inorganic material substrate with a glass lid formed with a recess in a flat glass. In the method for manufacturing a light-emitting device that is sealed by welding, heat treatment is performed as stress relaxation treatment for relieving stress generated by assembly processing of the light-emitting device.

  According to the above manufacturing method, the processing distortion due to the concave processing of the glass lid and the metal welding between the inorganic material substrate and the glass lid is alleviated to increase the reliability of the light emitting device, and the manufacturing yield is reduced by increasing the product yield. It can be carried out.

  The stress relaxation treatment may be an overall stress relaxation treatment in which a heat treatment is performed at a temperature 30 to 50 ° C. lower than the melting temperature of the metal welding material after the inorganic material substrate is covered with a glass lid and subjected to metal welding.

  The stress relaxation treatment may be a glass stress relaxation treatment in which heat treatment is performed on the glass lid that has been subjected to the recess processing at a temperature that is 1 to 30 ° C. higher than the glass strain temperature of the glass lid.

  As described above, by performing the glass stress relaxation treatment and the total stress relaxation treatment, the stress relaxation of the glass lid alone and the total stress relaxation after metal-welding both are further performed, thereby further improving the reliability of the light emitting device. Can increase the sex.

  The glass stress relaxation treatment may be performed in a planarization state in which a flat metal or ceramic support substrate is applied under the glass lid subjected to the recess processing.

  The flattening process may be performed by placing a flat metal or ceramic pressure substrate on a glass cover that has been further processed into a recess.

  It is preferable to perform an in-recess etching process in which wet etching is performed in the recesses of the glass lid that has been subjected to recess processing before the glass stress relaxation process.

  The inorganic material substrate and the glass lid may be made of materials having approximate thermal expansion coefficients.

  As described above, in the light emitting device using the LED element in which the glass lid and the inorganic material substrate are fixed by intermetallic bonding such as eutectic bonding, the recess processing is performed on the intermetallic bonded light emitting device or flat glass. Reducing the warpage of the light emitting device and glass cover by reducing the internal stress on the glass cover that has been performed, achieving sufficient long life and high reliability through improved adhesion, and reducing size and thickness. Can be achieved.

It is sectional drawing of the light-emitting device in 1st Embodiment of this invention. It is process drawing which shows the manufacturing process of the light-emitting device shown in FIG. It is process drawing which shows the process process of the glass cover used for the light-emitting device shown in FIG. It is process drawing which shows the process process of the glass cover used for the light-emitting device shown in FIG. It is process drawing which shows the manufacturing process of the light-emitting device shown in FIG. 1, and has shown the cross section of each element. It is a characteristic view which shows the conditions of the heat processing in an integrated stress relaxation process. It is a characteristic view which shows the conditions of the heat processing which performs a glass lid | cover joining process and a comprehensive stress relaxation process continuously. It is process drawing which shows the manufacturing process of the light-emitting device in 2nd Embodiment of this invention. FIG. 8 is a detailed process diagram of the glass lid manufacturing process shown in FIG. 7. It is process drawing which shows the process process of the glass cover used for the light-emitting device shown in FIG. It is a characteristic view which shows the conditions of the heat processing in a glass stress relaxation process. It is a detailed process drawing of the glass lid manufacturing process in 3rd Embodiment of this invention. It is process drawing which shows the process process of the glass cover in 3rd Embodiment of this invention. It is a characteristic table | surface which shows the characteristic and combination of the inorganic material board | substrate and glass cover in this invention. It is a perspective view of the large format flat glass for producing a plurality of glass lids simultaneously in 4th Embodiment of this invention. It is a perspective view of the large format board | substrate for producing several inorganic material board | substrates simultaneously in 4th Embodiment of this invention. It is a perspective view which shows the planarization process of the large flat glass shown in FIG. It is sectional drawing which shows the glass stress relaxation process of the flat glass shown in FIG. It is a perspective view of the large format light-emitting device in 4th Embodiment of this invention. FIG. 19 is a perspective view of a completed light emitting device by cutting and separating the large light emitting device shown in FIG. 18. It is sectional drawing of the light-emitting device in a prior art.

  Hereinafter, a method for manufacturing a light-emitting device according to an embodiment of the present invention will be described with reference to the drawings. 1 to 6 show a method for manufacturing a light-emitting device according to a first embodiment of the present invention. FIG. 1 is a cross-sectional view of the light-emitting device, and FIG. 2 is a process chart showing manufacturing steps of the light-emitting device shown in FIG. 3a and 3b are process diagrams showing the processing steps of the glass lid used in the light emitting device shown in FIG. 1, FIG. 4 is a process diagram showing the processing steps of the light emitting device shown in FIG. 1, and FIG. It is a characteristic view which shows the conditions of the heat processing in FIG.

  FIG. 1 is a cross-sectional view of a light emitting device 10, in which a wiring pattern 2 a is formed on the upper surface side of the inorganic material substrate 2, and an output electrode 2 b is formed on the back surface, and the wiring pattern 2 a on the upper surface side and the output electrode 2 b on the back surface are formed. Are connected by a through hole 2c. The LED 1 is flip-chip mounted (hereinafter abbreviated as FC mounting) on the wiring pattern 2 a of the inorganic material substrate 2, and the wavelength conversion layer 3 made of a resin layer mixed with fluorescent particles is coated around the LED 1. Yes. Furthermore, the light emitting device 10 is completed by bonding and sealing the glass lid 5 with the adhesive layer 4 formed around the mounting area of the LED element 1 on the upper surface side of the inorganic material substrate 2.

  Note that the adhesive layer 4 for joining the inorganic material substrate 2 and the glass lid 5 in the present embodiment includes a welding base layer 4 a (Au) formed on the inorganic material substrate 2 and a welding base layer 4 b ( AuSn) and a molten layer 4c formed by performing eutectic bonding of Au—Sn under a pressure condition of 300 ° C., and the inorganic material substrate 2 and the glass lid 5 are welded and sealed by this eutectic bonding. Stopped.

  Next, a manufacturing process of the light emitting device 10 will be described with reference to FIG. First, in the substrate process, an inorganic material substrate such as AIN (aluminum nitride), Al2O3 (aluminum oxide), Si (silicon) or the like is used as the inorganic material substrate 2, and the LED element 1 is FC mounted on the inorganic material substrate 2. An Au layer is formed as a welding underlayer 4a for bonding the AuSn electrode and the glass lid 5 for the purpose. Moreover, as an LED element process, Au bump 1a for FC mounting to LED element 1 is formed. In the FC mounting process, the wiring pattern 2a of the inorganic material substrate 2 and the Au bump 1a of the LED element 1 are positioned, and FC mounting is performed by Au—Sn eutectic bonding under a pressure condition of 300 ° C. In the wavelength conversion layer covering step, the phosphor cap formed by the phosphor resin-mixed silicon resin formed in the phosphor molding step is placed on the LED element 1 or the phosphor resin-mixed silicon resin is applied by a dispenser or squeegee. The wavelength conversion layer 3 is formed by directly covering the element 1.

  The glass lid manufacturing process includes a glass lid processing step for forming a concave portion on a flat glass by sandblasting or the like, and a welding base layer forming step for forming an AuSn welding base layer around the concave portion of the concave glass cover. In the glass lid bonding step, the Au—Sn co-bonding is performed under a pressure condition of 300 ° C. by the welding underlayer 4a (Au) formed on the inorganic material substrate 2 and the welding underlayer 4b (AuSn) formed on the glass lid 5. The inorganic material substrate 2 and the glass lid 5 are welded together by crystal bonding. In addition, the glass lid bonding step was performed in vacuum or in an inert gas, whereby the sealed case was made in a vacuum or an inert gas atmosphere, and the LED element 1 and the organic resin silicon resin were formed. The deterioration of the wavelength conversion layer 3 can be prevented.

  Finally, in the overall stress relaxation step, stress strain generated in the glass lid by the glass lid processing step and stress strain generated in the inorganic material substrate 2 and the glass lid 5 and in the bonded portion by the glass lid bonding step are alleviated. After the heat treatment, the electrical characteristics and chromaticity of the light-emitting device 10 completed in the characteristic measurement process are measured, and ranking is performed according to the result.

  The reason why the stress relaxation process is necessary in the method for manufacturing the light emitting device will be described. First, when the concave portion is formed in the flat glass in the glass lid processing step, the shape of the glass lid 5 has a large area of the concave portion and the area of the upper plane becomes narrow. Stress is generated in the wall of the recess that forms the recess during cooling or the base of the wall. In addition, when sand blasting is used to cut the recesses, there is an advantage that the cutting speed is faster and the processing time is shorter than other cutting methods. Since microcracks are likely to occur, the need for stress relaxation treatment is high.

  Further, stress relaxation processing is necessary to alleviate the difference in thermal expansion coefficient between the glass lid 5 and the inorganic material substrate 2 and the difference in accumulated stress of each member, and the bonding between the glass lid 5 and the inorganic material substrate 2 is also necessary. Stress relaxation treatment is necessary for problems such as adverse effects on the light emitting element due to warping of the inorganic material substrate 2 that occurs sometimes, that is, unstable connection between the light emitting element and the inorganic material substrate 2, and deterioration due to stress of the light emitting element. There is sex.

  Next, the manufacturing process of the glass lid 5 will be described with reference to FIGS. 3A and 3B with reference to the process chart of the glass lid manufacturing shown in FIG. The figure shows the cross section of the element in each process of glass lid manufacture, FIG. 3a shows the glass lid processing process, and FIG. 3b shows each process after the welding underlayer forming process. Steps A and B in FIG. 3 a correspond to the glass lid processing step in FIG. 2, and step A attaches a mask 15 having an opening 15 a corresponding to the recess 5 a of the glass lid 5 to the flat glass 50. Next, in the process B, the recess 5a is formed by sandblasting in which the sand particles 25 are jetted at a high pressure. In addition, as for the internal shape of the recessed part 5a formed by the injection | emission of the sand particle 25, a roundness is formed in a corner and the satin pattern by an unevenness | corrugation is formed in the whole inner surface.

  As the mask at this time, a resin resist or a metal mask is used, and the shape of the recess 5a can be arbitrarily formed by adjusting the sand particle size, the spraying speed, and the spraying time. The recess processing in the step B is not limited to the sand blast processing method shown in the embodiment, and other methods can be performed by a sputter etching method, an ion etching method, a wet etching method using a hydrofluoric acid aqueous solution, or the like.

  Next, process X in FIG. 3B corresponds to the welding underlayer forming process in FIG. 2, and process Y and process Z are separation and singulation processes used as necessary. In step X, an AuSn layer is formed as a welded underlayer 4b after a base treatment of a metal such as Ti, Pt, or Au is performed around the recess 5a of the glass lid 5 using a mask etching technique. Next, in the process Y, it cut | disconnects using the cutting | disconnection means 39, such as a diamond blade and a laser scriber, and it isolate | separates into each glass cover 5 as shown to the process Z. In addition, in the next glass lid joining process, it may supply with the glass cover of the aggregate | assembly of the process X as needed, and may supply with the single glass cover of the process Z.

  Next, a method for manufacturing the light emitting device 10 will be described. FIG. 4 shows a manufacturing process of the light emitting device 10 and shows a cross section of each element. That is, the substrate process A corresponds to the substrate manufacturing process of FIG. 2, and the wiring pattern 2 a, the through hole 2 c, the output electrode 2 b on the inorganic material substrate 2, and Au as a welding base layer 4 a for bonding to the glass lid 5. A layer is formed. The element mounting process B corresponds to the FC mounting process and the wavelength conversion layer coating process of FIG. 2, the LED 1 is FC mounted on the wiring pattern 2 a of the inorganic material substrate 2 by the Au bump 1 a, and the wavelength conversion layer 3 is surrounded around the LED 1. As described above, the light emitting portion 10a is configured by covering and covering a phosphor cap created by silicon resin molding.

The glass lid bonding step C corresponds to the glass lid bonding step of FIG. 2, the inorganic material substrate 2 and the glass lid 5 shown in FIG. 3 b are overlapped, and the upper and lower sides are sandwiched between two heater substrates 37 and 38, Welding and joining are performed by pressure firing. That is, Au—Sn eutectic bonding using the AuSn welding underlayer 4b formed on the bonding surface 5b of the glass lid 5 created in FIG. 3b and the Au welding underlayer 4a formed on the inorganic material substrate 2. As a result, the light-emitting device 10 is sealed.
In addition, as shown in FIG. 4, after laminating | stacking the one inorganic material board | substrate 2 which mounted several LED1 and the one flat glass 50 in which the several glass cover 5 was formed, it divided | segmented and divided | segmented the several light-emitting device 10. FIG. When cutting using a cutting means 39 such as a diamond blade or a laser scriber as shown in FIG. 3b, if a metal member is present in the cut portion, metal cutting powder is generated during the cutting, resulting in failure. Cause. In order to prevent this as much as possible, the width between the output electrodes 2b is sufficiently larger than the width of the cut portion between the adjacent light emitting devices 10, and the width between the adhesive layers 4 (welding base layers 4a and 4b) is set to be large. It is almost equal. This is to ensure a wide welding area between the inorganic material substrate 2 and the glass lid 5 as much as possible.

  The formation of the welding base layer in the glass lid bonding step will be described. As the welding base layer formed to weld and bond the inorganic material substrate 2 and the glass lid 5, the Au layer of the welding base layer 4 a and the AuSn layer of the welding base layer 4 b are attached to the inorganic material substrate 2 and the glass lid 5. On the other hand, eutectic bonding is performed regardless of which one is formed. However, in the present invention, considering obtaining better bonding conditions, the following is obtained. That is, since the inorganic material substrate 2 has the function of a circuit board, it has a concavo-convex shape such as a wiring pattern, and further has a structure in which temperature distribution is likely to occur because there are interspersed members having different thermal conductivities such as circuit components. ing. On the other hand, the glass lid 5 has a flat structure with little temperature distribution by performing a glass stress relaxation process or a flattening process. Therefore, in the embodiment of the present invention, AuSn is formed on the glass lid 5 and Au is formed on the inorganic material substrate 2 as a welding base layer in order to easily melt AuSn uniformly in eutectic bonding.

  The glass lid bonding step C is performed by heating for about 1 minute at a temperature (Ty + 30 ° C.) slightly higher than the welding temperature Ty (300 to 320 ° C.) of the adhesive layer (AuSn). Further, as described above, the reliability by the hermetic sealing is further increased by performing the glass lid bonding step C in a vacuum or in an inert gas atmosphere.

  Next, the total stress relaxation process D corresponds to the total stress relaxation process of FIG. 2, and the light emitting device 10 hermetically sealed in the glass lid bonding process C is put in an electric furnace, and the temperature of the electric furnace is increased and bonded. By performing heat treatment at an overall stress relaxation temperature Ts (Ty-30 to -50 ° C.) slightly lower than the layer welding temperature Ty, the concave portion processing distortion of the glass lid 5 and the eutectic bonding of Au—Sn cause the glass lid 5 to A comprehensive stress relaxation process is performed to alleviate processing distortions and the like generated inside the inorganic material substrate 2.

It should be noted that the total stress relaxation treatment is preferably performed simultaneously with the planarization treatment in order to further enhance the effect. That is, as shown in FIG. 4, the flattening process is performed by placing a flat metal or ceramic support substrate 35 on the lower side, and placing a pressurization substrate 36 having a relatively large weight on the upper side, which is also the same flat metal or ceramic. The above is the flattening process, and the purpose of the support substrate 35 and the pressure substrate 36 is to perform the flattening process forcing the undulation (unevenness) and warpage generated in the light emitting device 10 assembled by the glass lid 5 and the inorganic material substrate 2. In order to obtain a flattening effect, a certain amount of weight is required in addition to good flatness.
In addition, only the support substrate 35 may be used for the planarization process. That is, the light-emitting device 10 is flattened by placing the light-emitting device 10 on the flat support substrate 35 and performing a heat treatment so that the light-emitting device 10 adjusts to the flatness of the support substrate 35 by its own weight.

  Next, referring to FIG. 5, conditions for the comprehensive stress relaxation process will be described. FIG. 5 is a characteristic diagram showing conditions for heat treatment in the overall stress relaxation treatment, with the horizontal axis representing time and the vertical axis representing temperature. The hermetically sealed light emitting device 10 is put into an electric furnace, the temperature of the electric furnace is increased, and the total stress relaxation temperature Ts (which is lower by Δts than the welding temperature Ty (300 to 320 ° C.) of the adhesive layer at the point t1. Ty−Δts) is reached, and heat treatment is performed for about 100 minutes up to the point t2 at this temperature Ts. Then, the temperature is lowered at a rate of 5 ° C./minute from the point t2, and a slow cooling treatment is performed for about 50 minutes. Furthermore, it returns to normal temperature from the point t3. The total stress relaxation temperature Ts is a temperature at which the weld layer after Au—Sn eutectic does not melt, and the temperature difference Δts with respect to the weld temperature Ty is preferably −30 ° C. to −50 ° C.

  The above is the heat treatment step for the overall stress relaxation processing, and internal distortion due to processing generated in the light emitting device 10 is relaxed by the overall stress relaxation processing, and each component of the light emitting device 10 is further combined with the planarization treatment. It is possible to improve the undulation (unevenness) and warpage generated in the element. Further, although not shown in the figure, by cutting and separating the light emitting device that has been subjected to the overall stress relaxation process in step D of FIG. 4 using a cutting means such as a diamond blade or a laser scriber, a single unit shown in FIG. The light emitting device 10 is completed.

  Next, a method for continuously performing the glass lid joining step and the overall stress relaxation step in FIG. 4 will be described. FIG. 6 is a characteristic diagram showing conditions for heat treatment for continuously performing the glass lid joining step and the overall stress relaxation step, with the horizontal axis representing time and the vertical axis representing temperature. First, as a glass lid bonding step, the inorganic material substrate 2 and the glass lid 5 are overlapped, put into an electric furnace in a pressurized state, the temperature of the electric furnace is raised, and at a temperature slightly lower than the welding temperature Ty of the adhesive layer at the point t1. Remain heat. Next, the glass lid is bonded by heating to a point t3 at a bonding temperature Tc (Ty + 30 ° C.) slightly higher than the welding temperature Ty from the point t2.

  Next, the temperature is lowered from the point t3 to the total stress relaxation temperature Ts slightly lower than the welding temperature Ty, and heat treatment is performed for about 100 minutes up to the point t4 at the total stress relaxation temperature Ts. Then, the temperature is lowered from the point t4 at a rate of 5 ° C./min, and a slow cooling treatment is performed for about 50 minutes, and the temperature is returned from the point t5 to room temperature. As described above, by continuously performing the glass lid joining process and the comprehensive stress relaxation process using one electric furnace, the manufacturing cost can be reduced by shortening the process time.

  Next, the manufacturing method of the light-emitting device in 2nd Embodiment of this invention is demonstrated. FIGS. 7 to 10 show a method for manufacturing a light emitting device in the second embodiment, FIG. 7 is a process diagram showing a manufacturing process of the light emitting device, and FIG. 8 is a detailed process diagram of the glass lid manufacturing process shown in FIG. FIG. 9 is a process diagram showing the glass lid processing process, and FIG. 10 is a characteristic diagram showing the heat treatment process conditions in the glass stress relaxation process.

  FIG. 7 is a process diagram showing the manufacturing process of the light emitting device in the second embodiment, and the basic process is the same as the process diagram of the light emitting device 10 in the first embodiment shown in FIG. . That is, the process diagram of FIG. 7 differs from the process diagram of FIG. 2 only in the glass lid manufacturing process. In the process diagram of FIG. 7, the glass stress relaxation process is performed between the glass lid processing process and the welded underlayer forming process. Is added. Therefore, in the glass lid bonding step, the glass lid 5 on which the glass stress relaxation has been performed is bonded to the inorganic material substrate 2 by welding.

  Next, a specific method for manufacturing the glass lid 5 will be described with reference to FIGS. FIG. 8 is a detailed process diagram of the glass lid manufacturing process. After the glass lid processing process, the flattening process is performed, the glass stress relaxation process is performed in the state of the flattening process, and the welding underlayer forming process is further performed. After that, it is supplied to the glass lid joining step. The above process will be described with reference to the process diagram of FIG. FIG. 9 shows a cross section in each step of the glass lid, which is basically the same as the step diagram of FIG. 3a. Accordingly, the same step symbols are assigned to the same steps, and duplicate descriptions are omitted.

9, process A and process B correspond to the glass lid processing process of FIG. 8, and are the same as process A and process B of FIG. 3a. Step C corresponds to the flattening step and the glass stress relaxation step of FIG. 8, and the flat glass 50 subjected to the recess processing is applied with the flat metal or ceramic support substrate 35 facing downward with the recess 5a facing upward. Similarly, a pressure substrate 36 made of a flat metal or ceramic and having a weight several times the weight of the flat glass 50 is placed thereon. The above is the flattening step, and the purpose of the pressure substrate 36 is a weight for performing a flattening process forcing the undulation (unevenness) and warpage of the flat glass 50, and in order to enhance the flattening effect, a certain amount. Weight is required. In addition, the planarization process may use only the support substrate 35 as in the planarization process in the light emitting device 10.
Next, as a glass stress relaxation step, the flat glass 50 is placed in an electric furnace in a flattened state to remove recess working distortion due to heating.

Here, the conditions of the glass stress relaxation treatment will be described with reference to FIG. FIG. 10 is a characteristic diagram showing conditions for heat treatment in the glass stress relaxation treatment, with the horizontal axis representing time and the vertical axis representing temperature. The flat glass 50 in the flattening process state is put into an electric furnace, the temperature of the electric furnace is increased, and the glass stress relaxation temperature Tg (Th + Δtg) higher by Δtg than the glass strain temperature Th (500 to 600 ° C.) at the point t1. At this temperature Tg, heat treatment is performed for about 30 to 60 minutes up to the point t2. Then, the temperature is lowered at a rate of 5 ° C./min from the point t2, and a slow cooling treatment is performed for about 100 minutes. Further, return to normal temperature from the point t3.
Note that the glass stress relaxation temperature Tg is a stress relaxation that is positively performed by processing at a temperature higher by Δtg than the glass strain temperature Th that can prevent distortion of the glass, and a temperature difference Δtg from the glass strain temperature Th. Is preferably from + 1 ° C to + 30 ° C.
The above is the heat treatment step for the glass stress relaxation treatment, and the internal strain due to the recess processing generated in the glass lid 5 by the glass stress relaxation treatment is alleviated, and further generated in the glass lid 5 by using the flattening treatment together. Undulation (unevenness) and warping can be improved.

  After the completion of the glass stress relaxation process C in FIG. 9, the process becomes the process of FIG. 3b. After the weld base layer 4b is formed in the process X, the next glass lid bonding process is performed by adding the assembly of the process X as necessary. In some cases, the glass lid may be used for supply, or in the case of a single glass lid in step Z.

  Next, the manufacturing method of the light-emitting device in 3rd Embodiment of this invention is demonstrated. FIGS. 11 and 12 show a method for manufacturing a light emitting device according to the third embodiment. FIG. 11 is a detailed process diagram of a glass lid manufacturing process, and FIG. 12 is a process chart showing a glass lid processing process.

  In the glass lid manufacturing process of FIG. 11, the basic process is the same as the detailed process diagram of the glass lid manufacturing process in the second embodiment shown in FIG. 8, and the description overlapping with FIG. 8 is omitted. That is, the process diagram of FIG. 11 differs from the process diagram of FIG. 8 in that an in-recess etching process is added between the glass lid processing process and the planarization process. The details of the glass lid manufacturing process in the third embodiment will be described with reference to FIG.

  The glass lid processing steps of step A and step B are the same as the glass lid processing step in the second embodiment shown in FIG. The process C corresponds to the in-recess etching process of FIG. 11, and the inside of the recess 5 a of the flat glass 50 formed by sandblasting in the process B is performed by a wet etching method of a hydrofluoric acid aqueous solution using the etching mask 16. An in-recess etching process is performed. By performing this in-recess etching process, the rough uneven shape and microcracks of the recess 5a formed by sandblasting with a high cutting speed are corrected to a smooth surface state, and problems such as cracks caused by subsequent processing and glass lids The remaining stress strain is reduced. That is, this in-recess etching process is performed in order to relieve the microcracks and stress distortions that occur as a result of the recesses of the flat glass 50 being sandblasted at a high cutting speed.

  Step D corresponds to the flattening step and the glass stress relaxation step of FIG. 11, and the flattened state in which the upper and lower sides of the flat glass 50 etched in the recesses in Step C are sandwiched between the support substrate 35 and the pressure substrate 36. In FIG. 9, the same glass stress relaxation treatment as in step C of FIG. 9 is performed. After the completion of the glass stress relaxation process D, the process is as shown in FIG. 3b. After the weld base layer 4b is formed in the process X, the next glass lid joining process is performed with a glass lid of the assembly of the process X as necessary. In some cases, it may be supplied by a single glass lid in step Z.

  As described above, in manufacturing a light emitting device in which the inorganic material substrate 2 and the glass lid 5 are overlapped to perform eutectic bonding, deformation such as processing distortion, undulation (unevenness), warpage, or the like is applied to the glass lid subjected to recess processing. When it occurs, there is a problem that the yield of bonding and sealing is significantly reduced. Therefore, the yield reduction can be improved by performing the stress relaxation process and the flattening process in the present invention.

  That is, when eutectic bonding is performed with a glass lid having processing strain or deformation and a flat inorganic material substrate, a large pressure is required to force the deformation amount of the glass lid during eutectic bonding. Due to the large pressure applied during eutectic bonding, a large processing strain remains in the light-emitting device that has undergone eutectic bonding, which not only causes a decrease in reliability due to a decrease in the area of the welded part, but also causes a sealing failure and the like. Yes. Larger pressurization has the problem of making the welding apparatus larger and more expensive and at the same time shortening its life.

  On the other hand, in the present invention, a flat inorganic material is obtained by removing distortion generated in the inside of the glass cover by the stress relaxation process and correcting the deformation of the glass cover by the flattening process for the glass cover that has been subjected to the recess processing. This improves the adhesion to the substrate, increases the reliability of the light emitting device for welding and sealing, and achieves a reduction in the size and life of the welding device.

  Next, the combination of the inorganic material substrate 2 and the glass lid 5 will be described. FIG. 13 is a characteristic table showing the characteristics and combinations of the inorganic material substrate 2 and the glass lid 5. Table 1 shows three types of the inorganic material substrate 2, and Table 3 shows three types of the glass lid 5. And the arrow provided between Table 2 has shown the combination. That is, Table 1 shows thermal conductivity and linear expansion coefficient for three kinds of substrate materials of the inorganic material substrate 2: AIN (aluminum nitride), Si (silicon), and Al2O3 (aluminum oxide). As the glass material of the glass lid 5, linear expansion coefficients are shown for three types of borosilicate glass (1), borosilicate glass (2), and borosilicate crown glass.

  Focusing on the linear expansion coefficient in Tables 1 and 2, the substrate material of the inorganic substrate 2 is AIN of 44 [× 10 −7 / ° C.], Si of 30 [× 10 −7 / ° C.], and Al 2 O 3 of 74 [× 10-7 / ° C], whereas borosilicate glass (1), which is a glass material of the glass lid 5, is 47 [× 10-7 / ° C], and borosilicate glass (2) is 33 [× 10-7 / ° C]. [° C.] and borosilicate crown glass is 74 [× 10 −7 / ° C.]. Looking at the relationship between each of these three types of materials, as indicated by the arrows, the AIN, which is the substrate material of the inorganic material substrate 2, is a glass material for the glass lid with respect to a linear expansion coefficient of 44 [× 10−7 / ° C.]. A certain borosilicate glass (1) shows an approximate value of 47 [× 10 −7 / ° C.], and the linear expansion coefficient of the substrate material Si is 30 [× 10 −7 / ° C.], The glass material borosilicate glass (2) approximates to 33 [× 10 −7 / ° C.], and similarly the linear expansion coefficient of the substrate material Al 2 O 3 is 74 [× 10 −7 / ° C.], but the glass material. The linear expansion coefficient of borosilicate crown glass is approximately 74 [× 10 −7 / ° C.].

  As described with reference to FIG. 2, when Au—Sn eutectic bonding is performed between the inorganic material substrate 2 and the glass lid 5, the temperature is high at 300 ° C. Therefore, the linear expansion coefficient between the inorganic material substrate 2 and the glass lid 5 is high. If they are different, troubles such as cracking and chipping occur due to the difference in the linear expansion coefficient. Therefore, it is necessary to select a material that approximates the linear expansion coefficient between the inorganic material substrate 2 and the glass lid 5 as much as possible. In this sense, it can be seen that combinations of materials indicated by arrows as shown in Tables 1 and 2 are desirable. In addition, as a glass material shown in Table 2, commercially available borosilicate glass (1) includes “VIDREX (registered trademark)” (trade name of Beatrex Co., Ltd.), and borosilicate glass (2). "Pyrex (registered trademark)" (a product name of Corning) has this characteristic.

  Next, a manufacturing method of the light emitting device 10 by the collective substrate method in the fourth embodiment of the present invention will be described with reference to FIGS. FIG. 14 is a perspective view of a large flat glass 50 for producing a plurality of glass lids 5 at the same time. The large flat glass 50 has a plurality of concave portions 5a of the glass lid 5 by sandblasting shown in step B of FIG. They are formed in line.

  FIG. 15 is a perspective view of a large-sized substrate 20 for simultaneously producing a plurality of inorganic material substrates 2 shown in FIG. 4. The state shown in Step B of FIG. A plurality of light emitting portions 10a in which the wavelength conversion layer 3 is provided and are mounted in an FC are aligned. The plurality of light emitting portions 10a formed in alignment in FIG. 15 have the same arrangement position and the same number as the concave portions 5a of the glass lid 5 formed in alignment in FIG.

  FIG. 16 is a perspective view showing the flattening process of the large flat glass 50. As shown in the process C of FIG. 9, the flat glass 50 that has been recessed is sandwiched between the support substrate 35 and the pressure substrate 36. The unevenness of the glass 50 is corrected (the figure shows a state before the pressure substrate 36 is placed). FIG. 17 is a cross-sectional view showing the glass stress relaxation process of the flat glass 50. The flat glass 50 sandwiched between the support substrate 35 and the pressure substrate 36 is placed in the electric furnace 40, and the recess working strain is removed by heating.

  FIG. 18 is a perspective view of the large-sized light emitting device 10L, and shows a state in which a large flat glass 50 is inverted and laminated on the upper surface side of the large-sized substrate 20 and integrated by Au—Sn eutectic bonding. Therefore, on the upper surface side of the flat glass 50, the bottom portion of the recess 5a in the glass lid 5, that is, the light emission window portion is indicated by a dotted line. The completed large format light emitting device 10L is cut using a diamond blade or a laser scriber in accordance with the X and Y cutting lines, whereby each light emitting device 10 is completed.

  FIG. 19 is a perspective view of the completed light-emitting device 10, in which a glass lid 5 is bonded and integrated to the inorganic material substrate 2, and the LED 1 passes through the wavelength conversion layer 3 from the light-emitting window portion at the bottom of the recess 5 a in the glass lid 5. Is emitted.

  As described above, in the method of manufacturing a light emitting device using the collective substrate method, a large flat glass 50 is used to form the glass lid 5 and a large number of concave portions need to be formed at a fine pitch. In the large flat glass 50 in which the recesses are processed, deformation due to processing strain and waviness (unevenness) occurs. When the large-sized substrate 20 and the large-sized flat glass 50 as shown in FIG. 18 are laminated by this deformation, gaps are formed in various places and adhesion cannot be obtained. Due to this poor adhesion, the inorganic material substrate 2 and the glass lid 5 are formed. As a result, the eutectic bonding with the light-emitting device 10 is not successful, and the sealing of the light-emitting device 10 is poor.

  In other words, the effect of the stress relaxation treatment and the flattening treatment of the present invention on the glass lid subjected to the recess processing was performed before, but as the area of the large flat glass 50 becomes larger as in the present embodiment, the adhesion due to this deformation is increased. Since the influence of defects is likely to occur, the flattening process and the stress relaxation process for the flat glass 50 subjected to the recess processing are indispensable conditions, particularly in mass production of light emitting devices using the collective substrate method.

  As described above, the light emitting device according to the present invention has been described with respect to the combination of the blue LED and the YAG phosphor in the embodiment, but is not limited thereto, and can be applied to a combination of a near ultraviolet LED and each color phosphor. In addition, the stress relaxation treatment for the combination of the inorganic material substrate and the glass lid formed by the recess processing of the flat glass in the present invention is also effective for sealing elements other than the LED.

1 LED
1a Au bump 2 Inorganic material substrate 2a Wiring pattern 2b Output electrode 2c Through hole 3 Wavelength conversion layer 4 Adhesive layer 4a, 4b Welding underlayer 4c Melting layer
DESCRIPTION OF SYMBOLS 5 Glass cover 5a Recessed part 5b Joint surface 10 Light-emitting device 10a Light-emitting part 10L Large format light-emitting device 15 and 16 Mask 15a Opening part 20 Large format substrate 25 Sand particle 35 Support substrate 36 Pressure substrate 37, 38 Heater substrate 50 Flat glass

Claims (7)

  In the method of manufacturing a light emitting device, an LED element is mounted on an inorganic material substrate, and a glass lid having a recess formed in a flat glass is placed around the LED element mounting region on the inorganic material substrate, and sealed by metal welding. A method for manufacturing a light-emitting device, characterized by performing a heat treatment as a stress relaxation treatment for relieving a stress generated by an assembly process of the device.   The stress relaxation treatment is a comprehensive stress relaxation treatment in which a heat treatment is performed at a temperature lower by 30 to 50 ° C. than the melting temperature of the metal welding material after the inorganic material substrate is covered with a glass lid to perform metal welding. 2. A method for manufacturing a light emitting device according to claim 1.   The said stress relaxation process is a glass stress relaxation process which heat-processes at the temperature 1-30 degreeC higher than the glass distortion temperature of a glass cover with respect to the said glass cover which performed the recessed part process, or characterized by the above-mentioned. 3. A method for producing a light emitting device according to 2.   4. The method of manufacturing a light emitting device according to claim 3, wherein the glass stress relaxation treatment is performed in a planarization treatment state in which a flat metal or ceramic support substrate is applied under the glass lid subjected to the recess processing. .   5. The method of manufacturing a light emitting device according to claim 4, wherein the flattening process is performed by placing a flat metal or ceramic pressure substrate on a glass cover that has been further processed into a recess.   6. The method for manufacturing a light-emitting device according to claim 3, wherein an in-recess etching process is performed in which wet etching is performed in a recess of a glass lid that has been subjected to recess processing prior to the glass stress relaxation process. . 7. The method for manufacturing a light emitting device according to claim 1, wherein the inorganic material substrate and the glass lid use materials having approximate thermal expansion coefficients.

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