JP2010276831A - Microscope system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a microscope system that enables highly accurate exposure. <P>SOLUTION: In a microscope system, an exposure illuminating unit 32 has a plurality of second objective lenses in which the correction and adjustment of magnification are performed with respect to each of a plurality of objective lenses mounted on a revolver. Then, in the exposure illuminating unit 32, the second objective lenses 55-1 and 55-2 slide in response to the switching of an objective lens disposed on an optical axis L1, and exposure light modulated by a DMD (Digital Micromirror Device) 54 is made to be incident to the objective lens via the place where the correction and adjustment of magnification are performed with respect to the objective lens 14 disposed on the optical axis L1. The microscope system can be applied to, for example, a microscope system for the production and observation of a MEMS (Micro Electro Mechanical Systems) device. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a microscope system, and more particularly to a microscope system capable of performing exposure with high accuracy.

  Conventionally, a wide variety of MEMS devices have been manufactured at research and development institutions that research and develop technologies related to MEMS (Micro Electro Mechanical Systems), which are micro-mechanical electromechanical systems. In addition, research and development have been carried out using each of a microscope apparatus used for checking a defect of a MEMS device and an exposure apparatus for manufacturing the MEMS device.

  For example, FIG. 1 is a side view showing a conventional microscope apparatus.

  As shown in FIG. 1, the microscope apparatus 11 includes, in order from the bottom, an upper part of a microscope main body 16 to which a stage 13 on which an exposure target 12 is placed and a revolver 15 to which an objective lens 14 is attached are attached. The epi-illumination unit 17, the AF (Auto Focus) unit 18, and the observation barrel 19 are mounted. The epi-illumination unit 17 is provided with a lamp house 20 in which a lamp (not shown) for illuminating the exposure object 12 is housed, and an imaging device 22 is connected to the observation barrel 19 via a camera port 21. It is attached.

  As an exposure apparatus for manufacturing a MEMS device, for example, a so-called maskless exposure apparatus (see Patent Document 1) that projects a pattern formed by spatial light modulation means such as DMD (Digital Micromirror Device) in a reduced scale is used. Can do.

JP 2004-335639 A

  By the way, conventionally, in the research and development in which the work of manufacturing the MEMS device and the work of observing the MEMS device are repeatedly performed, it is required to perform these work efficiently. However, since the microscope apparatus and the exposure apparatus are independent apparatuses, it is necessary to move the MEMS device between these apparatuses, and it is difficult to perform the work efficiently.

  Also, in order to conduct research and development of MEMS, both a microscope apparatus and an exposure apparatus are required, which requires high costs and installation space for two apparatuses.

  For such a problem, for example, if it is possible to manufacture and observe a MEMS device with a single device that can be used by switching a plurality of objective lenses, it is considered that the problem can be solved. In such an apparatus, it is considered difficult to perform exposure with high accuracy.

  The present invention has been made in view of such a situation, and enables exposure with high accuracy.

  The microscope system of the present invention includes a stage for placing an exposure object, a plurality of objective lenses, and switching means for switching the objective lens disposed on the optical axis when exposing the exposure object; An exposure light source that generates exposure light that irradiates the exposure object, a spatial light modulation means that modulates the exposure light emitted from the exposure light source with a pattern according to an exposure area, and a magnification correction for each objective lens A plurality of second objective lenses that have been adjusted and the second objective lens that has been subjected to magnification correction adjustment with respect to the objective lens disposed on the optical axis when the objective lens is switched by the switching means. Selecting means for selecting the second objective lens so that the exposure light modulated by the spatial light modulation means is incident on the objective lens. To.

  In the microscope system of the present invention, when the objective lens is switched by the switching means, the spatial light modulation means passes through the second objective lens in which the magnification correction adjustment is performed on the objective lens disposed on the optical axis. The second objective lens is selected so that the exposure light modulated by the above is incident on the objective lens. Thereby, the exposure object can be exposed with high accuracy.

  According to the microscope system of the present invention, exposure can be performed with high accuracy.

It is a side view which shows the conventional microscope apparatus. It is a side view which shows the structural example of 1st Embodiment of the microscope system to which this invention is applied. It is a figure which shows the internal structure of an exposure illumination unit. It is the fragmentary sectional view which looked at the exposure light source from the side. It is a figure explaining the structure of AF unit. It is a figure which shows the internal structure of the other structural example of an exposure illumination unit. It is a front view which shows the structural example of 2nd Embodiment of a microscope system. It is a figure which shows the internal structure of an exposure illumination unit.

  Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings.

  FIG. 2 is a side view showing a configuration example of the first embodiment of the microscope system to which the present invention is applied. In the present specification, the system represents the entire apparatus constituted by a plurality of apparatuses.

  The microscope system 31 shown in FIG. 2 has a configuration in which an exposure illumination unit 32 is mounted between the AF unit 18 and the observation barrel 19 of the microscope apparatus 11 shown in FIG. That is, the microscope system 31 includes a stage 13, an objective lens 14, a revolver 15, a microscope main body 16, an epi-illumination unit 17 having a lamp house 20, an AF unit 18, an observation barrel 19, and an exposure illumination unit 32. Has been.

  The stage 13 is configured such that the exposure object 12 such as a wafer or a liquid crystal substrate is fixed on the upper surface thereof, and the exposure object 12 can be moved in the horizontal direction and the vertical direction.

  The objective lens 14 determines the magnification at the time of observing or exposing the exposure object 12, and a plurality of objective lenses 14 having a low magnification to a high magnification are mounted on the revolver 15.

  In FIG. 2, the objective lens 14 disposed on the optical axis L1 is rotated by rotating the revolver 15 with the optical axis of the objective lens 14 used for observation or exposure of the exposure object 12 as the optical axis L1. Can be switched. Thus, by switching the objective lens 14 arranged on the optical axis L1, the magnification at the time of observing or exposing the exposure object 12 is changed.

  The microscope body 16 is a base part of the microscope system 31 and fixes the stage 13 and the revolver 15. The microscope body 16 has an epi-illumination unit 17, an AF unit 18, an exposure illumination unit 32, An observation barrel 19 is attached.

  The epi-illumination unit 17 is provided with a lamp house 20 in which a lamp (not shown) is accommodated. Illumination light emitted from the lamp is reflected by the optical path combining mirror 41 in the epi-illumination unit 17 and is reflected on the optical axis L1. Propagated along and illuminates the exposure object 12. Further, as the illumination light, light having a wavelength range in which the exposure object 12 is not exposed and the observation object 12 can be observed with visible light, for example, light in the vicinity of 600 nm is used.

  The AF unit 18 is an apparatus for performing autofocus by a TTL (Through The Lens) method. As will be described later with reference to FIG. 5, an AF light source that irradiates the exposure target 12 with AF light, An image sensor for acquiring an image of the irradiated surface of the exposure object 12 irradiated with AF light is incorporated. Further, as the AF light, light in a wavelength region that does not expose the exposure target 12, for example, light near 800 nm is used.

  As will be described later with reference to FIG. 3, the exposure illumination unit 32 includes an exposure light source that irradiates exposure light for exposing the exposure object 12, and the exposure light emitted from the exposure light source is exposed to the exposure illumination unit. The exposure object 12 is irradiated along the optical axis L1 by the dichroic mirror 43 disposed on the 17 optical axes L1, and the exposure object 12 is exposed. Further, as the exposure light, light in a wavelength range that exposes the exposure object 12, for example, light of 430 nm is used.

  The observation lens barrel 19 includes an imaging optical system that forms an image of the exposure target object 12 when used together with the objective lens 14, and the user uses the eyepiece lens of the observation lens barrel 19 to connect the exposure target object 12. The image can be observed with the naked eye. An imaging device 22 that captures an observation image of the exposure object 12 can be attached via a camera port 21 of the observation barrel 19.

  Here, an optical path combining mirror 41 and dichroic mirrors 42 and 43 are disposed on the optical axis L1 from the objective lens 14 toward the observation barrel 19. The dichroic mirrors 42 and 43 are special mirrors (for example, multiband dichroic mirrors) that reflect only light in different predetermined wavelength ranges and transmit light outside those wavelength ranges.

  The optical path combining mirror 41 is disposed in the epi-illumination unit 17 and reflects a part of the illumination light (for example, light having a wavelength near 600 nm) emitted from the lamp of the lamp house 20 and transmits the rest. . In other words, the optical path synthesis mirror 41 reflects the illumination light incident on the optical path synthesis mirror 41 along the optical axis L2 of the epi-illumination optical path toward the objective lens 14 along the optical axis L1, and passes through the objective lens 14. Illumination light is irradiated to the exposure object 12. On the other hand, the optical path combining mirror 41 can transmit the AF light from the AF unit 18 and the exposure light from the exposure illumination unit 32.

  The dichroic mirror 42 is disposed in the AF unit 18 and reflects only AF light (for example, light having a wavelength of about 800 nm) emitted from an AF light source (an AF light source 71 in FIG. 5 described later). Transmits light outside the wavelength range of light.

  That is, the dichroic mirror 42 reflects the AF light incident on the dichroic mirror 42 along the optical axis L3 of the AF optical path toward the objective lens 14 along the optical axis L1, and passes through the objective lens 14 to expose an object to be exposed. 12 is irradiated with AF light. Then, the AF light reflected or diffused by the exposure object 12 enters the dichroic mirror 42 via the objective lens 14, and the dichroic mirror 42 reflects the AF light along the optical axis L 3 of the AF optical path. On the other hand, the dichroic mirror 42 can transmit the exposure light from the exposure illumination unit 32 and the illumination light transmitted through the optical path combining mirror 41.

  The dichroic mirror 43 is disposed in the exposure illumination unit 32 and reflects only exposure light (for example, light having a wavelength of 430 nm) emitted from an exposure light source (exposure light source 51 in FIG. 3 to be described later) for exposure. Transmits light outside the wavelength range of light. That is, the dichroic mirror 43 reflects exposure light incident on the dichroic mirror 43 along the optical axis L4 of the exposure optical path toward the objective lens 14 along the optical axis L1, and passes through the objective lens 14 to expose the object to be exposed. 12 is irradiated with exposure light. On the other hand, the dichroic mirror 43 can transmit the illumination light transmitted through the optical path combining mirror 41.

  In the microscope system 31 configured as described above, the height of the stage 13 is adjusted according to the output from the AF unit 18, and the objective lens 14 is focused on the exposure object 12, and then the exposure illumination unit 32. The exposure object 12 is exposed by the exposure light from. Then, the user can observe the exposure target 12 with the naked eye through the objective lens of the observation barrel 19 or with the image captured by the imaging device 22, for example, check defects.

  Therefore, for example, by using the microscope system 31 for MEMS research and development, in the research and development in which the work of manufacturing the MEMS device and the work of observing the MEMS device are repeatedly performed, the MEMS to be manufactured and observed There is no need to move the device from the stage 13, and these operations can be performed efficiently.

  Further, unlike the conventional case, it is not necessary to prepare separate apparatuses for the microscope apparatus and the exposure apparatus, and it is only necessary to purchase one microscope system 31, which increases the cost for research and development. This can be suppressed. Furthermore, since it is not necessary to arrange two devices, it is possible to save space compared to the prior art.

  Furthermore, a user who already owns the microscope apparatus 11 of FIG. 1 can configure the microscope system 31 that can perform exposure and observation of the exposure object 12 only by purchasing the exposure illumination unit 32.

  Next, FIG. 3 is a diagram showing the internal structure of the exposure illumination unit 32, FIG. 3A shows a plan view of the exposure illumination unit 32, and FIG. 3B shows a view from the arrow A in FIG. 3A. An arrow view of the exposure illumination unit 32 is shown. In addition, the exposure illumination unit 32 in FIG. 3 has a camera port 33 in which an imaging apparatus (not shown) can be mounted instead of the observation barrel 19 in FIG.

  The exposure illumination unit 32 is provided with an exposure light source 51 that irradiates the exposure object 12 with exposure light, and emits exposure light having a wavelength of, for example, 430 nm from the exposure light source 51 along the optical axis L5. It is done. In the exposure light source 51, an LED (Light Emitting Diode) that generates exposure light makes fine adjustments in the XY direction in a plane orthogonal to the optical axis L5, and fine adjustment of the deviation angle θ with respect to the optical axis L5. The XYθ stage is configured to be held, and the optical axis of the exposure light can be adjusted by the XYθ stage.

  The exposure light emitted from the exposure light source 51 along the optical axis L5 is converged by the condenser lens 52 disposed on the optical axis L5 and enters the mirror 53. The mirror 53 reflects the exposure light along the optical axis L6 toward the DMD 54, and the DMD 54 is irradiated with the exposure light.

  The DMD 54 is disposed at a position conjugate with the image plane, and generates a pattern to be exposed on the exposure object 12 placed on the stage 13 according to control of a control device (not shown).

  That is, the DMD 54 is configured by arranging a plurality of minute micromirrors in a matrix, and the reflective surface of each micromirror can be tilted in a predetermined direction under the control of the control device. For example, the DMD 54 controls the inclination of the micromirror corresponding to the area where the exposure object 12 is to be exposed so that the exposure light incident along the optical axis L6 is reflected toward the optical axis L4. Control the inclination of the micromirror corresponding to the region other than the region where the object 12 is to be exposed so that the exposure light incident along the optical axis L6 is reflected in a direction other than the optical axis L4 (for example, the optical axis L4 is Control so that it is perpendicular to the micromirror.

  As described above, in the DMD 54, the pattern of the exposure area is formed by each micromirror, and only the exposure light corresponding to the area where the exposure object 12 is to be exposed is reflected along the optical axis L4 by the micromirror in the exposure area. Is done.

  The exposure light reflected by the DMD 54 along the optical axis L4 is incident on the dichroic mirror 43 via the second objective lens 55-1 disposed between the DMD 54 and the dichroic mirror 43. Then, the light is reflected by the dichroic mirror 43 toward the exposure object 12 along the optical axis L <b> 1, and the exposure surface of the exposure object 12 is exposed via the objective lens 14.

  Here, the exposure illumination unit 32 includes two second objective lenses 55-1 and 55-2, and the second objective lenses 55-1 and 55-2 correspond to the objective lens 14 used for exposure. The magnification correction adjustment has been made.

  Specifically, the second objective lenses 55-1 and 55-2 include a plurality of lens groups and an adjustment mechanism that can adjust the positions of these lens groups in the optical axis direction. In general, a magnification error of ± 5% is allowed for the objective lens 14 for a microscope, and the objective lens 14 varies in magnification. Therefore, the second objective lenses 55-1 and 55-2 are respectively adjusted by the adjustment mechanism finely adjusting the positions of the plurality of lens groups so as to eliminate the error of the objective lens 14 used in combination. The magnification of is finely adjusted.

  For example, the second objective lens 55-1 is adjusted to correct the magnification of the second objective lens 55-1 so that the error generated in the objective lens 14 having a magnification of 10 is zero. In addition, the second objective lens 55-2 is adjusted to correct the magnification of the second objective lens 55-2 itself so that an error generated in the objective lens 14 having a magnification of 100 times becomes zero.

  The second objective lenses 55-1 and 55-2 are fixed to the upper surface of the pedestal 82 so that their optical axes are parallel to each other. The pedestal 82 is slidably attached to two rails 81a and 81b disposed on the bottom surface of the casing of the exposure illumination unit 32, and is guided in a direction perpendicular to the optical axis L4 by the rails 81a and 81b. Is done.

  A motor 83 having a rotation axis parallel to the longitudinal direction of the rails 81a and 81b is disposed on the bottom surface of the casing of the exposure illumination unit 32. The rotation axis of the motor 83 includes, for example, a universal joint. A ball screw shaft 84 is connected via The ball screw nut combined with the screw portion of the ball screw shaft 84 is attached to a connecting member 85 fixed to the pedestal 82, and the pedestal 82 and the ball screw shaft 84 are connected by the connecting member 85.

  That is, the rotational motion of the ball screw shaft 84 by the motor 83 is converted into a linear motion that moves the base 82 in a direction orthogonal to the optical axis L4 by the threaded portion of the ball screw shaft 84 and the ball screw nut of the connecting member 85. That is, when the motor 83 rotates, the second objective lenses 55-1 and 55-2 fixed to the pedestal 82 move in a direction orthogonal to the optical axis L4.

  The motor 83 is driven according to the control of the motor driver board 86. A signal indicating the magnification of the objective lens 14 arranged on the optical axis L1 according to the rotation of the revolver 15 (for example, an address where the objective lens 14 is mounted) is supplied to the motor driver board 86.

  For example, when the motor driver board 86 detects that the objective lens 14 having a magnification of 10 times is arranged on the optical axis L1, the motor 83 is rotated to slide the base 82, and the second objective lens 55-1 is moved. It is inserted and placed on the optical axis L4. On the other hand, when the motor driver board 86 detects that the objective lens 14 having a magnification of 100 times is arranged on the optical axis L1, for example, the motor 83 is rotated to slide the pedestal 82 and the second objective lens 55- 2 is inserted and arranged on the optical axis L4.

  Further, on the bottom surface of the casing of the exposure illumination unit 32, for example, limit sensors 87a and 87b having a detection unit such as a photodiode are distances between the optical axes of the second objective lenses 55-1 and 55-2. It is arranged at intervals according to. The limit sensors 87a and 87b output a signal indicating whether or not light is detected by the detection unit to the motor driver board 86.

  The light shielding plate 88 fixed to the pedestal 82 shields the light receiving portion of the limit sensor 87a when the second objective lens 55-1 is arranged on the optical axis L4 by sliding the pedestal 82. On the other hand, when the second objective lens 55-2 is disposed on the optical axis L4 by sliding the pedestal 82, the light shielding plate 88 shields the light receiving portion of the limit sensor 87b.

  Therefore, when the motor driver board 86 moves the limit sensors 87a and 87b, one of the second objective lenses 55-1 and 55-2 is arranged on the optical axis L4 according to the output from the limit sensors 87a and 87b. When this is detected, the rotation of the motor 83 is stopped.

  As described above, the exposure illumination unit 32 corrects the magnification of the second objective lens 55-1 in which the magnification correction adjustment is performed on the objective lens 14 having a magnification of 10 times and the objective lens 14 having a magnification of 100 times. The second objective lens 55-2 that has been adjusted is provided, and is arranged on the optical axis L4 in accordance with switching between the objective lens 14 having a magnification of 10 and the objective lens 14 having a magnification of 100 times. Since the second objective lenses 55-1 and 55-2 are switched, the exposure surface of the exposure target 12 can be accurately magnified (magnification as the theoretical value) even when the objective lens 14 disposed on the optical axis L1 is switched. Can be exposed.

  That is, in general, a plurality of objective lenses included in a microscope allow a magnification error of ± 5%, and are used for exposure when one second objective lens is used for a plurality of objective lenses. Each time the objective lens was switched, exposure could not be performed with an accurate magnification due to an error of each objective lens. Therefore, for example, an error occurs with respect to the line width that the user wants to generate when the exposure area is wide and when the exposure area is narrow.

  On the other hand, in the exposure illumination unit 32, for example, when the exposure area is wide, the exposure is performed with the combination of the objective lens 14 having the magnification of 10 times and the second objective lens 55-1, and when the exposure area is narrow, Since the exposure is performed by the combination of the objective lens 14 having the double magnification and the second objective lens 55-2, the exposure surface of the exposure object 12 is exposed with the line width that the user wants to generate for each exposure region. be able to.

  Next, FIG. 4 is a partial sectional view of the exposure light source 51 of FIG.

  As shown in FIG. 4, in the exposure light source 51, an LED 61 that generates exposure light is mounted on a substrate 62 that drives the LED 61, and a collimator lens is located in front of the LED 61 (the direction in which the LED 61 outputs exposure light). 63 and a fly-eye lens 64 are mounted. The exposure light emitted from the LED 61 is corrected to a parallel light beam by the collimator lens 63 and the fly-eye lens 64.

  The LED 61, the substrate 62, the collimator lens 63, and the fly-eye lens 64 are integrally held by the XYθ stage 65, and the XYθ stage 65 causes the optical axis L5 from the exposure light source 51 to the mirror 53 (FIG. 3). So that the optical axis of the exposure light is adjusted.

  Next, the configuration of the AF unit 18 will be described with reference to FIG.

  In the AF unit 18, the AF light source 71 generates AF light in a wavelength range in which the exposure target 12 is not exposed, for example, AF light in a wavelength range near 800 nm. When the AF light emitted from the AF light source 71 passes through the slit 72, unnecessary light that does not enter the condenser lens 73 is cut. The illumination light that has passed through the slit 72 is converged by the condenser lens 73 and enters the half mask 74. The half mask 74 is, for example, a mask that allows light having a semicircular shape to pass through when viewed from the optical axis direction of the illumination light. The light beam of the AF light collected by the condenser lens 73 is formed into a semicircular shape.

  The illumination light that has passed through the half mask 74 passes through the half mirror 75, is relayed by the relay lenses 76a and 76b, and is reflected toward the exposure object 12 along the optical axis L1 by the dichroic mirror 42 in FIG. Is done. Then, an image of the half mask 74 is formed on the pupil of the objective lens 14 on the optical axis L1, and the exposure target surface of the exposure target 12 is irradiated with AF light. At this time, since the slit 72 and the exposure target surface of the exposure target 12 have a conjugate relationship, the image of the slit 72 is irradiated on the exposure target surface of the exposure target 12.

  The AF light reflected by the exposure target surface of the exposure target 12 enters the half mirror 75 via the objective lens 14, the dichroic mirror 42, and the relay lenses 76 a and 76 b, and is directed toward the mirror 77 by the half mirror 75. Reflected. The AF light reflected by the mirror 77 is condensed by the imaging lens 78, and an image of the exposure target surface of the exposure target 12 is formed on the imaging surface of the CCD 79, and the image is captured by the CCD 79.

  The image captured by the CCD 79 is subjected to image processing by an image processing device (not shown), and the position of the center of gravity of the image by AF light is obtained. Then, according to the output from the image processing, for example, a control device (not shown) controls the position of the stage 13 in the direction of the optical axis L1, and is placed on the stage 13 so that the center of gravity of the image is on the optical axis. The height of the exposure object 12 is adjusted. Thereby, the focus of the objective lens 14 matches the exposure target surface of the exposure target 12.

  In addition, when focus is calculated | required based on the contrast of the image of the slit 72 by irradiating AF light, the half mask 74 of a semicircle shape is unnecessary, and you may comprise the AF unit 18 without using the half mask 74. .

  By the way, in the exposure illumination unit 32 of FIG. 3, the second objective lenses 55-1 and 55-2 slide to switch the second objective lens arranged in the optical path of the exposure light. For example, the second objective lenses 55-1 and 55-2 are attached to a revolver that rotates about a predetermined rotation axis, and the second objective lenses 55-1 and 55-2 are changed according to the switching of the objective lens 14. By rotating, it is possible to switch what is arranged in the optical path of the exposure light. That is, the exposure illumination unit 32 only needs to be configured so that the second objective lenses 55-1 and 55-2 can be switched and inserted into the optical path of the exposure light.

  Further, the second objective lenses 55-1 and 55-2 are slid and rotated, and, for example, the second objective lenses 55-1 and 55-2 are kept fixed and the second objective lens 55 is maintained. The optical path of the exposure light may be switched so that either -1 or 55-2 is selected.

  That is, an exposure illumination unit having a configuration example in which the optical path of exposure light can be switched will be described with reference to FIG.

  In the exposure illumination unit 32 ′ of FIG. 6, the second objective lenses 55-1 and 55-2 are arranged on the bottom surface of the casing of the exposure illumination unit 32 at predetermined intervals so that the optical axes thereof are parallel to each other. Established.

  Further, on the optical axis L4 of the exposure light reflected by the DMD 54, rotating mirrors 91 and 92 for switching the optical path of the exposure light are arranged, and the rotating mirrors 91 and 92 are rotated in synchronization. One of the second objective lenses 55-1 and 55-2 is selected.

  FIG. 6 shows a state where the second objective lens 55-1 is selected, and the exposure light reflected by the rotating mirror 91 is arranged on the optical axis of the second objective lens 55-1. The light is reflected by the mirror 93 and introduced into the second objective lens 55-1. Then, the exposure light that has passed through the second objective lens 55-1 is reflected by the mirror 94 disposed on the optical axis of the second objective lens 55-1 and is disposed on the optical axis L1. 92, the light is reflected toward the exposure object 12 along the optical axis L1.

  Further, the second objective lens 55-2 is selected by turning the turning mirrors 91 and 92.

  That is, in the exposure illumination unit 32 ′, the belt 98a is hung between the cylindrical base on which the rotating mirror 91 is mounted and the pulley 97a rotated by a motor (not shown). The rotating mirror 91 rotates in response to the movement. Similarly, a belt 98b is hung between a cylindrical pedestal on which the rotation mirror 92 is mounted and a pulley 97b rotated by a motor (not shown). The belt 98b rotates according to the rotation of the pulley 97b. The moving mirror 92 rotates.

  The motor for rotating the pulleys 97a and 97b is controlled by a motor driver board (not shown) similar to the motor driver board 86 of FIG. 3, and the motor driver board has the objective lens 14 with a magnification of 100 times as the optical axis. When it is detected that it is arranged on L1, the pulleys 97a and 97b are rotated to rotate the rotating mirrors 91 and 92, respectively.

  Then, the rotating mirror 91 rotates 90 degrees clockwise in FIG. 6A and the rotating mirror 92 rotates 180 degrees, so that the second objective lens 55-2 is selected.

  That is, in this case, the exposure light reflected by the rotating mirror 91 is reflected by the mirror 95 disposed on the optical axis of the second objective lens 55-2 and introduced into the second objective lens 55-2. The Then, the exposure light that has passed through the second objective lens 55-2 is reflected by the mirror 96 disposed on the optical axis of the second objective lens 55-2 and is disposed on the optical axis L1. 92, the light is reflected toward the exposure object 12 along the optical axis L1.

  With the exposure illumination unit 32 ′ configured as described above, similarly to the exposure illumination unit 32 of FIG. 3, the objective lens 14 having the magnification of 10 times and the second objective lens 55-1 according to switching of the objective lens 14. Since the exposure can be performed with the combination of the objective lens 14 with the magnification of 100 and the second objective lens 55-2, the accurate magnification can be obtained even if the exposure magnification is switched. The exposure surface of the exposure object 12 can be exposed.

  It should be noted that the exposure illumination unit 32 ′ can be switched to one of the fixed second objective lenses 55-1 and 55-2 other than the configuration in which the rotating mirrors 91 and 92 are rotated. Need only be configured. For example, the exposure illumination unit 32 ′ can be configured to switch the optical path to one of the second objective lenses 55-1 and 55-2 by sliding an optical path selection element having a plurality of mirrors.

  The exposure illumination unit 32 has a movable part for sliding the second objective lenses 55-1 and 55-2, and the exposure illumination unit 32 ′ is movable for rotating the rotating mirrors 91 and 92. However, each of the second objective lenses 55-1 and 55-2 has an optical path from the exposure light source 51 to the exposure object 12, thereby not having such a movable part. be able to.

  That is, FIG. 7 is a front view showing a configuration example of the second embodiment of the microscope system.

  The microscope system 100 of FIG. 7 is configured to include two sets of microscope parts and an exposure illumination unit 101 disposed across the microscope parts.

  The two sets of microscope parts are the same as the configuration in which the observation barrel 19 is removed from the microscope apparatus 11 of FIG. 1, that is, stages 13-1 and 13-2, objective lenses 14-1 and 14-2, Revolvers 15-1 and 15-2, microscope main bodies 16-1 and 16-2, epi-illumination units 17-1 and 17-2, and AF units 18-1 and 18-2 are provided.

  Further, for example, the objective lens 14-1 has a magnification of 10 times, and the objective lens 14-2 has a magnification of 100 times. The optical axis L1-1 of the objective lens 14-1 is irradiated with exposure light through the second objective lens 55-1, which has been subjected to magnification correction adjustment with respect to the objective lens 14-1 having a magnification of 10 times. The On the other hand, the optical axis L1-2 of the objective lens 14-2 is irradiated with the exposure light via the second objective lens 55-2 that has been subjected to magnification correction adjustment with respect to the objective lens 14-2 having a magnification of 100 times. The

  Next, FIG. 8 is a view showing the internal structure of the exposure illumination unit 101.

  The exposure illumination unit 101 includes two exposure light sources 51-1 and 51-2, and the exposure light emitted from the exposure light sources 51-1 and 51-2 passes through different optical paths, respectively, along the optical axis L1-. 1 and L1-2.

  That is, on the optical path from the exposure light source 51-1 toward the optical axis L1-1, the shutter 102-1, the condenser lens 52-1, the mirror 53-1, the DMD 54-1, the second objective lens 55-1, and the dichroic. A mirror 43-1 is disposed. Further, on the optical path from the exposure light source 51-2 toward the optical axis L1-2, the shutter 102-2, the condenser lens 52-2, the mirror 53-2, the DMD 54-2, the second objective lens 55-2, and the dichroic are provided. A mirror 43-2 is arranged.

  When exposure is performed with exposure light emitted from the exposure light source 51-1, the shutter 102-1 is opened and the shutter 102-2 is closed, and the exposure placed on the stage 13-1 in FIG. Exposure to the object 12-1 is performed. On the other hand, when exposure is performed with exposure light emitted from the exposure light source 51-2, the shutter 102-2 is opened and the shutter 102-1 is closed, and the exposure placed on the stage 13-2 in FIG. Exposure to the object 12-2 is performed.

  In this way, two sets of microscope parts are provided, and movable parts are excluded from the optical path from the exposure light source 51-1 to the exposure object 12-1, and from the optical path from the exposure light source 51-2 to the exposure object 12-2. By adopting a configuration that does not use an optical element or the like for switching the optical path, a switching error due to backlash of the movable portion does not occur, and high-accuracy exposure is possible. Further, exposure is performed with a combination of the objective lens 14-1 having a magnification of 10 and the second objective lens 55-1, and the objective lens 14-2 and the second objective lens 55-2 having a magnification of 100 times are used. Therefore, even if the exposure magnification is switched, the exposure surface of the exposure object 12 can be exposed with an accurate magnification.

  It should be noted that the stages 13-1 and 13-2 may be constituted by a single stage. By doing so, the movement of the exposure object 12 placed on the stage, for example, the optical axis L1- 1 and the optical axis L1-2 can be smoothly moved, and work efficiency can be improved.

  Moreover, the microscope system may be configured to include two or more sets of microscope parts, and objective lenses having different magnifications may be used in the respective microscope parts.

  In the microscope system 31, in the epi-illumination illumination unit 17, the AF unit 18, and the exposure illumination unit 32, the connecting portions (for example, round ants) formed in each are made into a common shape, so that the respective order is changed. So that they can be attached to each other.

  The embodiment of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

  DESCRIPTION OF SYMBOLS 11 Microscope apparatus, 12 Exposure object, 13 Stage, 14 Objective lens, 15 Revolver, 16 Microscope main body, 17 Epi-illumination unit, 18 AF unit, 19 Observation barrel, 20 Lamp house, 21 Camera port, 22 Imaging device, 31 Microscope system, 32 exposure illumination unit, 33 camera port, 41 optical path synthesis mirror, 42 and 43 dichroic mirror, 51 exposure light source, 52 condenser lens, 53 mirror, 54 DMD, 55-1 and 55-2 second objective lens, 61 LED, 62 substrate, 63 collimator lens, 64 fly eye lens, 65 XYθ stage, 71 AF light source, 72 slit, 73 condenser lens, 74 half mask, 75 half mirror, 76 a and 76b relay lens, 77 mirror, 78 imaging lens, 79 CCD, 81a and 81b rail, 82 pedestal, 83 motor, 84 ball screw shaft, 85 connecting member, 86 motor driver board, 87a and 87b limit sensor, 88 light shielding plate , 91 and 92 rotating mirror, 93 to 96 mirror, 97a and 97b pulley, 98a and 98b belt, 100 microscope system, 101 exposure illumination unit, 102 shutter

Claims (4)

A stage for placing an exposure object;
A plurality of objective lenses, and switching means for switching the objective lenses arranged on the optical axis when exposing the exposure object;
An exposure light source that generates exposure light irradiated onto the exposure object;
Spatial light modulation means for modulating the exposure light emitted from the exposure light source with a pattern according to an exposure area;
A plurality of second objective lenses that have been subjected to magnification correction adjustment for each objective lens;
When the objective lens is switched by the switching means, modulation is performed by the spatial light modulation means via the second objective lens in which magnification correction adjustment is made to the objective lens arranged on the optical axis. And a selecting means for selecting the second objective lens so that the exposed exposure light is incident on the objective lens. The selecting means inserts the second objective lens that has been subjected to magnification correction adjustment with respect to the objective lens disposed on the optical axis, into the optical path of the exposure light toward the objective lens, The microscope system according to claim 1, wherein the second objective lens is selected. The selection unit switches the optical path of the exposure light so as to pass through the second objective lens in which magnification correction adjustment is performed on the objective lens arranged on the optical axis. The microscope system according to claim 1, wherein an objective lens is selected. A first stage for placing an exposure object;
A first objective lens disposed on an optical axis when exposing the exposure object;
A first exposure light source that generates exposure light irradiated to the exposure object;
First spatial light modulation means for modulating the exposure light emitted from the first exposure light source with a pattern according to an exposure area;
A first microscope apparatus comprising: a first second objective lens that has been subjected to magnification correction adjustment with respect to the first objective lens;
A second stage for placing an exposure object;
A second objective lens disposed on the optical axis when exposing the exposure object and having a magnification different from that of the first objective lens;
A second exposure light source for generating exposure light irradiated on the exposure object;
Second spatial light modulation means for modulating the exposure light emitted from the second exposure light source with a pattern according to an exposure area;
A microscope system comprising: a second microscope device having a second second objective lens that has been subjected to magnification correction adjustment with respect to the second objective lens.

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