JP2010221572A - Resin material and laser-welding method for resin material - Google Patents
Resin material and laser-welding method for resin material Download PDFInfo
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- JP2010221572A JP2010221572A JP2009072386A JP2009072386A JP2010221572A JP 2010221572 A JP2010221572 A JP 2010221572A JP 2009072386 A JP2009072386 A JP 2009072386A JP 2009072386 A JP2009072386 A JP 2009072386A JP 2010221572 A JP2010221572 A JP 2010221572A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
- B29C66/322—Providing cavities in the joined article to collect the burr
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/114—Single butt joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
- B29C66/24—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
- B29C66/242—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours
- B29C66/2424—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain
- B29C66/24243—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral
- B29C66/24244—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral forming a rectangle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
- B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/65—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles with a relative motion between the article and the welding tool
- B29C66/652—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles with a relative motion between the article and the welding tool moving the welding tool around the fixed article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
- B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/836—Moving relative to and tangentially to the parts to be joined, e.g. transversely to the displacement of the parts to be joined, e.g. using a X-Y table
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Abstract
Description
本発明は、樹脂材および樹脂材のレーザー溶着方法に関するものである。 The present invention relates to a resin material and a laser welding method for the resin material.
従来、レーザー光を吸収する吸収性樹脂材と、レーザー光を透過させる透過性樹脂材とを重ね合わせて加圧し、その接合面に透過性樹脂材側からレーザー光を照射することで、両樹脂材を溶融させて、両樹脂材を溶着して構成される樹脂材および、樹脂材のレーザー溶着方法が提案されている(例えば、特許文献1)。 Conventionally, both resins are obtained by overlaying and pressing an absorbent resin material that absorbs laser light and a transparent resin material that transmits laser light, and irradiating the joint surface with laser light from the side of the transparent resin material. A resin material constituted by melting a material and welding both resin materials and a laser welding method of the resin material have been proposed (for example, Patent Document 1).
図7に示す従来の樹脂材のレーザー溶着方法の概略構成図を用いて、原理を簡単に説明する。以下、図7に対する上下左右方向を基準とする。 The principle will be briefly described with reference to the schematic configuration diagram of the conventional laser welding method for resin materials shown in FIG. Hereinafter, the vertical and horizontal directions with respect to FIG.
図7(a)において、断面が略矩形状の透過性樹脂材701の下面と、断面が略矩形状の吸収性樹脂材702の上面とが当接することで、接合面704を形成している。なお、本従来例は透過性樹脂材701の下面に反り701a、吸収性樹脂材702の上部に気泡が生じている場合として、以下説明する。透過性樹脂材701の下面に反り701bがあるため、接合面704には空間706ができている。
In FIG. 7A, the lower surface of the
そして、押さえ冶具(図示無し)で加圧力P71を加えた状態で、透過性樹脂材701側からレーザー光703を照射すると、レーザー光703は透過性樹脂材701ではほとんど吸収されずに透過して、吸収性樹脂材702の表面付近で吸収される。吸収されたレーザー光703のエネルギーは熱に変換され、吸収性樹脂材702の表面を加熱する。そして、吸収性樹脂材702の表面と接している透過性樹脂材701の表面も、熱伝達によって加熱される。
Then, when the
その結果、図7(b)に示すように、吸収性樹脂材702と透過性樹脂材701の接合面704に溶融樹脂材705が形成され、溶融樹脂材705が冷却して固化することで両樹脂材が溶着される。
As a result, as shown in FIG. 7B, a
また、図8に示すように、レーザー光803を照射して走査することで、例えば矩形箱状のケース800における、吸収性樹脂材で形成されたケース本体802と、透過性樹脂材で形成された蓋801とを溶着して密封することができる。 Further, as shown in FIG. 8, by scanning with irradiation with laser light 803, for example, a case body 802 formed of an absorbent resin material in a rectangular box-shaped case 800 and a transparent resin material are formed. The lid 801 can be welded and sealed.
しかし、本従来例のように、空間706と気泡702aとがある状態でレーザー光703を照射して樹脂材を加熱すると、空間706と気泡702aの空気も加熱されて膨張し、破裂が発生する。図7(c)に示すように、この破裂によって、溶融樹脂材705は接合面704に沿って飛散し、不均一な状態で冷却固化するので、溶着強度が不安定となり、リーク不良が生じる。また、溶融樹脂材705の飛散または流出により、樹脂材本体からはみ出すことで外観を損ねることとなる。
However, as in the conventional example, when the resin material is heated by irradiating the
本発明は、上記事由に鑑みてなされたものであり、その目的は、接合面の空気が膨張して破裂した場合でも、溶融樹脂材が樹脂材本体からはみ出さず、溶着強度が安定した樹脂材および樹脂材のレーザー溶着方法を提供することにある。 The present invention has been made in view of the above reasons, and the purpose thereof is a resin in which the molten resin material does not protrude from the resin material main body even when the air on the joint surface expands and ruptures, and the welding strength is stable. It is in providing the laser welding method of a material and a resin material.
請求項1の発明は、レーザー光を吸収する吸収性樹脂材と、レーザー光を透過させる透過性樹脂材とを重ね合わせて加圧し、その接合面に透過性樹脂材側からレーザー光を照射して走査することで、両樹脂材を溶融させて、両樹脂材を溶着して構成される樹脂材において、一方の樹脂材の接合面における、レーザー光の走査軌跡の両側方のうち少なくとも一方に溝を設けることを特徴とする。 According to the first aspect of the present invention, an absorbent resin material that absorbs laser light and a transparent resin material that transmits laser light are superimposed and pressed, and the joint surface is irradiated with laser light from the transparent resin material side. In the resin material constituted by melting both resin materials and welding both resin materials, scanning at least one of the both sides of the laser beam scanning locus on the joint surface of one resin material. A groove is provided.
この発明によれば、樹脂材において、レーザー光の照射により、膨張または破裂した空気と溶融樹脂材とを接合面に形成された溝に逃がすことができる。そのため、溶融樹脂材は樹脂材本体からはみ出さず、均一な状態で冷却固化することができるので、溶着強度を安定させることができる。 According to the present invention, in the resin material, the expanded or ruptured air and the molten resin material can be released to the groove formed on the joint surface by the laser light irradiation. Therefore, the molten resin material does not protrude from the resin material main body and can be cooled and solidified in a uniform state, so that the welding strength can be stabilized.
請求項2の発明は、請求項1の発明において、前記透過性樹脂材に前記溝を設けることを特徴とする。
The invention of
この発明によれば、溝内部にある空間の温度の上昇を抑制することができる。透過性樹脂材はレーザー光を透過するので、レーザー光により直接加熱されることはないため、吸収性樹脂材よりも温度は低くなる。それにより、透過性樹脂材に溝を設けることで、溝内部の温度の上昇を抑制することができ、溝内部の空気の膨張が抑制されるので、膨張または破裂した空気をより多く溝に逃がすことができる。 According to this invention, the rise in the temperature of the space in the groove can be suppressed. Since the transmissive resin material transmits laser light, it is not directly heated by the laser light, so the temperature is lower than that of the absorbent resin material. Thereby, by providing the groove in the permeable resin material, it is possible to suppress the temperature rise inside the groove, and the expansion of the air inside the groove is suppressed, so that more expanded or ruptured air is released to the groove. be able to.
請求項3の発明は、請求項1または2の発明において、複数の前記溝を設けることを特徴とする。
The invention of claim 3 is characterized in that in the invention of
この発明によれば、複数の溝を設けることによって、膨張または破裂した空気および、溶融樹脂材をより多く逃がすことができる。 According to the present invention, by providing a plurality of grooves, it is possible to release more expanded or ruptured air and molten resin material.
請求項4の発明は、請求項1乃至3のいずれか1項の発明において、前記溝の経路は、レーザー光の走査軌跡に対して平行でない経路を含むことを特徴とする。 According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the path of the groove includes a path that is not parallel to the scanning locus of the laser beam.
この発明によれば、溝の経路を長く構成することで、膨張または破裂した空気および、溶融樹脂材をより多く逃がすことができる。 According to the present invention, it is possible to release a larger amount of the expanded or ruptured air and the molten resin material by configuring the groove path longer.
請求項5の発明は、レーザー光を吸収する吸収性樹脂材と、レーザー光を透過させる透過性樹脂材とを重ね合わせて加圧し、その接合面に透過性樹脂材側からレーザー光を照射して走査することで、両樹脂材を溶融させて、両樹脂材を溶着する樹脂材のレーザー溶着方法において、一方の樹脂材の接合面における、レーザー光の走査軌跡の両側方のうち少なくとも一方に溝を設けることを特徴とする。
In the invention of
この発明によれば、樹脂材のレーザー溶着方法において、レーザー光の照射により、膨張または破裂した空気と溶融樹脂材とを接合面に形成された溝に逃がすことができる。そのため、溶融樹脂材は樹脂材本体からはみ出さず、均一な状態で冷却固化することができるので、溶着強度を安定させることができる。 According to this invention, in the laser welding method of the resin material, the expanded or ruptured air and the molten resin material can be released to the groove formed on the joint surface by the irradiation of the laser beam. Therefore, the molten resin material does not protrude from the resin material main body and can be cooled and solidified in a uniform state, so that the welding strength can be stabilized.
以上説明したように、本発明では、接合面の空気が膨張して破裂した場合でも、溶融樹脂材が樹脂材本体からはみ出さず、溶着強度を安定させることができるという効果がある。 As described above, according to the present invention, even when the air on the joint surface expands and ruptures, the molten resin material does not protrude from the resin material body, and there is an effect that the welding strength can be stabilized.
以下、本発明の実施の形態を図面に基づいて説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(実施形態)
図1に本例の概略構成図を示す。以下、図1に対する上下左右方向を基準とする。
(Embodiment)
FIG. 1 shows a schematic configuration diagram of this example. Hereinafter, the vertical and horizontal directions with respect to FIG.
本実施形態の樹脂材および樹脂材のレーザー溶着方法は、レーザー光103を透過させる透過性樹脂材101と、レーザー光103を吸収する吸収性樹脂材102とを重ね合わせて加圧し、レーザー光103を透過性樹脂材101側から照射して、接合面104に溶融樹脂材105を形成して両樹脂材が溶着して構成される樹脂材および樹脂材のレーザー溶着方法である。
In the resin material and the laser welding method of the resin material of the present embodiment, the
図2に本例の樹脂材を用いた成形物の構成図、図3に成形物の上面図を示す。 FIG. 2 is a configuration diagram of a molded product using the resin material of this example, and FIG. 3 is a top view of the molded product.
本発明の樹脂材は、例えば図2に示すようなケース100において、ケース本体を構成する吸収性樹脂材102と、蓋を構成する透過性樹脂材101に用いられ、レーザー光103を照射して走査することで両樹脂材を溶着することができる。
The resin material of the present invention is used for the
吸収性樹脂材102は上面が開口した略矩形箱状、透過性樹脂材101は略矩形板状で形成され、吸収性樹脂材102の上部に透過性樹脂材101が覆設される。そして、吸収性樹脂材102開口周縁と透過性樹脂材101下面とが当接することで形成される接合面104に、透過性樹脂材101上面からレーザー光103が照射して走査することで、略矩形状の走査軌跡103aが形成される。
The
そして、走査軌跡103aの両側方において、走査軌跡103aに平行して沿う経路で、断面が略矩形状をした溝101aが透過性樹脂材101の下面に設けられている。
A
レーザー光103照射前における、接合面104の一部断面図を図4に示す。
A partial cross-sectional view of the
なお、接合面104のレーザー光103が照射される箇所において、透過性樹脂材101の下面に反り101b、吸収性樹脂材102の上部に樹脂成型時に空気が樹脂内に閉じ込められて形成された気泡102aが生じている場合として、以下説明する。
It should be noted that at the portion of the
そして、透過性樹脂材101の下面に反り101bが生じているため、接合面104には空間106ができている。
And since the
接合面104に空間106がある状態または、樹脂材に気泡102aがある状態で、レーザー光103を接合面104に照射すると、樹脂材が加熱されて溶融樹脂材105が形成されると共に、加熱された樹脂材によって空間106と気泡102aの空気も加熱されて膨張する。
When the
しかし、本例では図1に示すように、接合面104を形成する透過性樹脂材101の下面に溝101aを設けているため、接合面104にある空間106の膨張した空気を溝101aに逃がすことができる。
However, in this example, as shown in FIG. 1, since the
また、気泡102aように樹脂内に空気が閉じ込められた場合や、接合面104が密着して溝101aまでの経路が塞がれている場合等には、破裂を起こして溶融樹脂材105が飛散する場合がある。しかし、破裂が起きても、破裂した空気および飛散した溶融樹脂材105を溝101aに逃がすことができるので、溶融樹脂材105を略均一な状態で冷却固化することができるので、安定した溶着強度を保つことが出来る。また、流動性を有する溶融樹脂材105が接合面104に沿って流れる場合があるが、溶融樹脂材105は溝101aに流入するため、樹脂材本体からはみ出すことはない。
Further, when air is confined in the resin like the
このように、接合面104において、レーザー光103の走査軌跡103aの側方に溝101aを設けることによって、溶融樹脂材105が樹脂材本体からはみ出さず、安定した溶着強度で樹脂材を溶着することができる。なお、反り101bや気泡102a以外の条件でも、接合面104に空間がある状態であれば、本発明による上記効果を得ることができる。
As described above, by providing the
また、上述の例では、レーザー光103の走査軌跡103aの両側方に1つずつ溝101aを設けているが、走査軌跡の両側方に複数の溝を設けた例を図5に示す。
In the above example, one
本例では、透過性樹脂材501の下面におけるレーザー光503の走査軌跡の両側方に2つずつ上記同様の溝501aが設けられている。
In this example, two
透過性樹脂材501と吸収性樹脂材502との接合面504に空間がある場合に、空気が膨張または破裂しても、溝501aの数が増えることで、溝501a内の空間の体積が増加しているので、膨張または破裂した空気および溶融樹脂材505を、溝501aにより多く逃がすことができる。そのため、溶融樹脂材505が樹脂材本体からはみ出さず、より安定した溶着強度を保つことができる。
If there is a space on the joint surface 504 between the
なお、本例ではレーザー光503の走査軌跡の両側方で互いに同じ数の溝501aを設けているが、走査軌跡の両側方で互いに異なる数の溝を設けてもよい。
In this example, the same number of
また、レーザー光の走査軌跡の片側方にのみ、溝を設けた場合であっても、溶融樹脂材が少ない場合や、接合面の空間が小さい場合等であれば、上記と同様の効果を得ることができる。 Further, even when the groove is provided only on one side of the scanning locus of the laser beam, the same effect as described above can be obtained if the molten resin material is small or the space of the joint surface is small. be able to.
さらに、溝内の空間の体積を増やすために、経路が屈曲線で形成された溝を設けた例を図6に示す。図6は本例の透過性樹脂材の上面図である。 Furthermore, in order to increase the volume of the space in a groove | channel, the example which provided the groove | channel in which the path | route was formed with the bending line is shown in FIG. FIG. 6 is a top view of the transparent resin material of this example.
本例の樹脂材の構成は、上記で説明した略矩形板状の透過性樹脂材101と、略矩形箱状の吸収性樹脂材102と同一の構成である。そして、同様に、レーザー光の走査軌跡603aの両側方に沿う経路で、溝601aが透過性樹脂材601の下面に設けられている。
The configuration of the resin material of this example is the same configuration as the above-described substantially rectangular plate-shaped
しかし、本例では、略矩形状の経路からなる溝601aにおいて、経路を構成する辺の中心が外側へ屈曲する屈曲線で形成されている。このように、溝601aは走査軌跡603aと平行でない経路を含むことによって、走査軌跡603aと平行に溝を形成した時と比較して、溝601aの全長が伸びるので、溝601a内の空間の体積が大きくなる。そのため、膨張または破裂した空気および溶融樹脂材を、溝601aにより多く逃がすことができる。そのため、溶融樹脂材が樹脂材本体からはみ出さず、より安定して溶着強度を保つことができる。
However, in this example, in the
なお、レーザー光の走査軌跡と平行でない経路を含む溝であれば、湾曲線等で形成されていてもよい。 In addition, as long as it is a groove | channel including the path | route which is not parallel to the scanning locus | trajectory of a laser beam, you may form with a curved line etc.
101 透過性樹脂材
101a 溝
102 吸収性樹脂材
103 レーザー光
104 接合面
105 溶融樹脂材
101
Claims (5)
一方の樹脂材の接合面における、レーザー光の走査軌跡の両側方のうち少なくとも一方に溝を設けることを特徴とする樹脂材。 Both the absorbent resin material that absorbs the laser beam and the transparent resin material that transmits the laser beam are overlaid and pressurized, and the joint surface is irradiated with the laser beam from the side of the transparent resin material and scanned. In a resin material configured by melting a resin material and welding both resin materials,
A resin material, characterized in that a groove is provided on at least one of both sides of a scanning locus of laser light on a joint surface of one resin material.
一方の樹脂材の接合面における、レーザー光の走査軌跡の両側方のうち少なくとも一方に溝を設けることを特徴とする樹脂材のレーザー溶着方法。 Both the absorbent resin material that absorbs the laser beam and the transparent resin material that transmits the laser beam are overlaid and pressurized, and the joint surface is irradiated with the laser beam from the side of the transparent resin material and scanned. In the laser welding method of the resin material that melts the resin material and welds both resin materials,
A method of laser welding a resin material, characterized in that a groove is provided in at least one of both sides of a laser beam scanning locus on a joint surface of one resin material.
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2012168031A1 (en) * | 2011-06-07 | 2012-12-13 | Osram Ag | Encapsulation housing and led module with the same |
US9343632B2 (en) | 2011-06-07 | 2016-05-17 | Osram Gmbh | Encapsulation housing and LED module with the same |
JP2013141823A (en) * | 2012-01-12 | 2013-07-22 | Toyota Boshoku Corp | Resin molded article and method for manufacturing the same |
US9964424B2 (en) | 2013-03-25 | 2018-05-08 | Hitachi Automotive Systems, Ltd. | Flow sensor and manufacturing method thereof |
DE112014001104B4 (en) | 2013-03-25 | 2021-12-23 | Hitachi Astemo, Ltd. | Flow sensor and manufacturing process therefor |
WO2022149414A1 (en) | 2021-01-08 | 2022-07-14 | ソニーセミコンダクタソリューションズ株式会社 | Sensor module |
KR20230129226A (en) | 2021-01-08 | 2023-09-07 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | sensor module |
EP4276527A4 (en) * | 2021-01-08 | 2024-07-17 | Sony Semiconductor Solutions Corp | Sensor module |
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