JP2010151730A - Pressure sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressure sensor enhancing support strength of a sensor chip and suppressing the noise effect on the sensor chip. <P>SOLUTION: The surface orientation of a first plate surface 51 in a first silicon substrate 41, on which respective strain gauge resistances 45a to 45d are formed, is (110) plane. The strain gauge resistances 45a to 45d are arranged so that their longitudinal directions lie are along the <110> crystal-axis direction. A plurality of sensor chip side grooves 52a along the <110> crystal-axis orientation are formed at a prescribed interval on a second plate surface 52 in a second silicon substrate 42. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a pressure sensor in which a portion including a sensing unit capable of detecting the pressure of a pressure medium in a sensor chip is exposed in a pressure introduction passage.

Conventionally, as a pressure sensor in which a portion including a sensing unit capable of detecting the pressure of a pressure medium in a sensor chip is exposed in a pressure introduction passage, for example, there is a semiconductor pressure sensor disclosed in Patent Document 1 below. The sensor chip of this semiconductor pressure sensor is provided with a silicon substrate on a pedestal glass, and a diaphragm portion that is displaced in accordance with the pressure of the medium to be measured is disposed on a portion of the silicon substrate in contact with the medium to be measured (pressure medium). A sensing unit is formed. The sensor chip and the housing are hermetically sealed with a sealing member made of low-melting glass so that only the part including the sensing portion of the sensor chip is exposed in the medium to be measured.
Japanese Patent No. 2792116

  By the way, in the pressure sensor disclosed in Patent Document 1, since the sensor chip is supported by the housing by the sealing member functioning as an adhesive, the contact area between the sensor chip and the sealing member is small. However, there is a problem that the adhesive strength between the two members is reduced and the support strength of the sensor chip with respect to the housing is reduced.

  On the other hand, by forming a groove or the like on the surface of the sensor chip to increase the contact area between the sensor chip and the sealing member and increase the adhesive strength between the two members, depending on the shape of the groove or the like, The stress acting on the sensor chip may be affected as noise, and in such a case, there is a problem that the pressure detection accuracy of the sensor chip is lowered.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a pressure sensor that can increase the support strength of the sensor chip and suppress the influence of noise on the sensor chip. It is in.

  In order to achieve the above object, in the pressure sensor according to claim 1, a sensor chip having a sensing unit capable of detecting the pressure of the pressure medium and a pressure introduction passage for introducing the pressure medium are provided. A pressure sensor comprising: a case to be formed; and a sealing member interposed between the sensor chip and the case so that the sensing part of the sensor chip is exposed in the pressure introduction passage. The sensing unit is configured to have a plurality of strain gauges capable of outputting a signal corresponding to a displacement of a diaphragm based on a pressure difference between a pressure of the pressure medium and a reference pressure of a pressure reference chamber to be sealed, The surface orientation of one side surface on which each strain gauge is formed is the (110) plane, each strain gauge is arranged along the <110> crystal axis direction, and the surface of the sensor chip is The portion in contact with the sealing member comprising a, wherein the sensor chip side groove along the <110> crystal axis direction is formed with a plurality.

  According to a second aspect of the present invention, in the pressure sensor according to the first aspect, each of the strain gauges is projected onto the other side surface of the surface of the sensor chip that faces the one side surface. It is characterized by being formed so as to exclude each projection part.

  According to a third aspect of the present invention, in the pressure sensor according to the second aspect, each of the sensor chip side grooves is formed so that all of the projections are projected onto one of the portions between adjacent sensor chip side grooves. It is characterized by that.

  According to a fourth aspect of the present invention, in the pressure sensor according to any one of the first to third aspects, the sensor chip includes the sealing so that each of the sensor chip side grooves is orthogonal to the pressure introduction passage. It is supported via a stop member.

  According to a fifth aspect of the present invention, in the pressure sensor according to the fourth aspect, the sensor chip is formed with a connecting groove for connecting a part of each sensor chip side groove.

  7. The pressure sensor according to claim 6, wherein a sensor chip having a sensing part capable of detecting the pressure of the pressure medium, a case in which a pressure introduction passage for introducing the pressure medium is formed, and the sensing part among the sensor chips. And a sealing member interposed between the sensor chip and the case so as to be exposed in the pressure introduction passage, wherein the sensing part is sealed with the pressure of the pressure medium. A plurality of strain gauges capable of outputting a signal corresponding to the displacement of the diaphragm based on a pressure difference from the reference pressure of the pressure reference chamber, and the surface orientation of one side surface on which each strain gauge is formed is ( 110), each strain gauge is arranged along the <110> crystal axis direction, and faces the sensor chip through the sealing member on the inner surface of the case. The site, characterized in that the <110> case-side projections along the crystal axis direction is formed with a plurality.

  8. The pressure sensor according to claim 7, wherein a sensor chip having a sensing part capable of detecting the pressure of the pressure medium, a case in which a pressure introduction passage for introducing the pressure medium is formed, and the sensing part among the sensor chips. And a sealing member interposed between the sensor chip and the case so as to be exposed in the pressure introduction passage, wherein the sensing part is sealed with the pressure of the pressure medium. A plurality of strain gauges capable of outputting a signal corresponding to the displacement of the diaphragm based on a pressure difference from the reference pressure of the pressure reference chamber, and the surface orientation of one side surface on which each strain gauge is formed is ( 100) plane, each strain gauge is arranged along the <110> crystal axis direction, and the portion of the surface of the sensor chip that contacts the sealing member has a lattice. Wherein the groove is formed.

  The invention according to claim 8 is the pressure sensor according to any one of claims 1 to 7, wherein the sensor chip includes a first substrate having a thin portion on which the strain gauges are formed and a recess. A second substrate to be formed, and the sensing unit bonds the first substrate and the second substrate so that the thin portion and the recess are brought close to each other, and the thin portion and The pressure reference chamber is formed by the recess, and a signal corresponding to the displacement of the thin portion functioning as the diaphragm is output from each strain gauge based on the pressure difference between the pressure in the pressure reference chamber and the pressure medium. It is comprised so that it may do.

  A ninth aspect of the present invention is the pressure sensor according to any one of the first to eighth aspects, wherein the case is formed with a fastening portion for fastening the case on an outer peripheral portion thereof. A slit is provided between the fastening portion and a portion facing the sensor chip via the sealing member.

  11. The pressure sensor according to claim 10, wherein a sensor chip having a sensing part capable of detecting the pressure of the pressure medium, a case in which a pressure introduction passage for introducing the pressure medium is formed, and the sensing part among the sensor chips. A pressure sensor comprising a sealing member interposed between the sensor chip and the case so as to be exposed in the pressure introduction passage, wherein the sensing unit is configured on the surface of the sensor chip. The other side facing the one side is a part excluding the sensing part projection area where the sensing part is projected on the other side and close to the sensing part projection area from the counter pressure introduction passage side. A protrusion extending in a direction perpendicular to the pressure introduction direction of the pressure introduction passage is provided.

  The pressure sensor according to claim 11, wherein a sensor chip having a sensing part capable of detecting the pressure of the pressure medium, a case in which a pressure introduction passage for introducing the pressure medium is formed, and the sensing part among the sensor chips. And a sealing member interposed between the sensor chip and the case so as to be exposed in the pressure introduction passage, wherein the case has a pressure introduction direction of the pressure introduction passage. A first abutting portion extending in a direction perpendicular to the sensor chip is formed, and the sensor chip is configured to sense the other side surface of the surface of the sensor chip facing the one side surface on which the sensing unit is configured. At the part excluding the sensing part projection area on which the part is projected and close to the sensing part projection area from the side opposite to the counter pressure introduction passage. So that the, characterized in that it is supported by the case through the sealing member.

  According to a twelfth aspect of the present invention, in the pressure sensor according to the eleventh aspect, the case is disposed on the side of the pressure introduction passage with respect to the first abutting portion and against the other side surface excluding the projection region of the sensing portion. A contactable second contact portion is formed.

  A thirteenth aspect of the present invention is the pressure sensor according to any one of the tenth to twelfth aspects, wherein the sensor chip is formed with a first substrate having a thin portion on which a pressure detecting portion is formed and a concave portion. And the sensing unit is configured to bond the first substrate and the second substrate so that the thin portion and the recess are brought close to each other, and the thin portion and the second substrate A pressure reference chamber formed by a recess, and configured to output a signal corresponding to the displacement of the thin portion based on the pressure difference between the pressure in the pressure reference chamber and the pressure medium from the pressure detection unit. It is characterized by that.

  In the first aspect of the present invention, the plane orientation of one side surface on which a plurality of strain gauges are formed is the (110) plane, and each strain gauge is arranged along the <110> crystal axis direction. A plurality of sensor chip side grooves along the <110> crystal axis direction are formed on the surface of the sensor chip and in contact with the sealing member. Note that a plurality of protrusions along the <110> crystal axis direction may be provided on the surface of the sensor chip, so that the gap between adjacent protrusions may be configured as the sensor chip side groove.

Thereby, since a sealing member enters in each sensor chip side groove | channel, the contact area of a sensor chip and a sealing member becomes large, and the support strength of the sensor chip with respect to a case can be raised. Further, since the stress acting on the sensor chip via the sealing member is generated along the sensor chip side groove, each strain gauge is arranged in a direction different from the <110> crystal axis direction, that is, the direction along the sensor chip side groove. Compared with the case where it is, the influence of the stress from the sealing member with respect to each strain gauge can be reduced.
Therefore, the support strength of the sensor chip with respect to the case can be increased and the influence of noise on the sensor chip can be suppressed.

  According to a second aspect of the present invention, each sensor chip side groove is formed so as to exclude each projection portion on which each strain gauge is projected on the other side surface of the sensor chip facing the one side surface. This makes it difficult for stress from the sealing member to be transmitted to each strain gauge, thereby further suppressing the influence of noise on the sensor chip.

  According to a third aspect of the present invention, each strain gauge is formed such that each projection portion is projected onto one of the portions between adjacent sensor chip side grooves. As a result, compared with the case where each strain gauge is formed so that each projection part is projected to a part between different sensor chip side grooves, the noise of each strain gauge due to the stress from the sealing member is reduced. Variations can be suppressed.

  In the invention of claim 4, the sensor chip is supported via the sealing member so that each sensor chip side groove is orthogonal to the pressure introduction passage. Since the sensor chip is in contact with the sealing member at a site closer to the counter-pressure introduction passage than each strain gauge, when stress from the sealing member is transmitted to each strain gauge, The sensor chips are arranged so that the side grooves of the sensor chips are orthogonal to each other. This makes it difficult for stress from the sealing member to be transmitted to each strain gauge, thereby further suppressing the influence of noise on the sensor chip.

  In the invention of claim 5, the sensor chip is formed with a connecting groove for connecting a part of each sensor chip side groove. Thereby, since a sealing member is smoothly introduce | transduced in each sensor chip side groove | channel via a connection groove | channel, the support strength of the sensor chip with respect to a case can be raised.

  In the invention of claim 6, the plane orientation of one side surface on which a plurality of strain gauges are formed is the (110) plane, and each strain gauge is arranged along the <110> crystal axis direction. A plurality of case-side protrusions along the <110> crystal axis direction are formed on a portion of the inner surface of the case that faces the sensor chip via the sealing member. In addition, you may comprise between the adjacent groove | channels as said case side protrusion by providing the several groove | channel along a <110> crystal-axis direction in the opposing part of a case.

  Thereby, since the contact area of a case and a sealing member becomes large, the support strength of the sealing member with respect to a case, ie, the support strength of the sensor chip with respect to a case, can be raised. In particular, since it is not necessary to provide a groove or the like on the surface of the sensor chip, a part of the manufacturing process can be reduced in the sensor chip that can increase the support strength for the case.

  In the invention of claim 7, the plane orientation of one side surface on which a plurality of strain gauges are formed is the (100) plane, and each strain gauge is arranged along the <110> crystal axis direction. A lattice-like groove is formed on the surface of the sensor chip and in contact with the sealing member.

  Since each strain gauge is formed on the (100) plane, pressure is detected in two directions. Therefore, even if a lattice-like groove is formed on the surface of the sensor chip, the stress from the sealing member due to the groove is formed. Influence is suppressed. In the grid-like groove, the sealing member is smoothly introduced into the groove as compared with the unidirectional groove, so that the support strength of the sensor chip with respect to the case can be further increased.

  In the invention of claim 8, the sensor chip includes a first substrate having a thin portion on which each strain gauge is formed and a second substrate on which a recess is formed. The sensing unit forms a pressure reference chamber by the thin part and the concave part by bonding the first substrate and the second substrate so that the thin part and the concave part are close to each other. A signal corresponding to the displacement of the thin wall portion functioning as a diaphragm is output from each strain gauge based on the pressure difference from the medium pressure.

  Thus, even when a sensor chip in which a sensing part is formed by bonding two substrates is used as a pressure sensor, the support strength of the sensor chip with respect to the case can be increased, and the influence of noise on the sensor chip Can be suppressed.

  In the invention of claim 9, the case is formed with a fastening portion for fastening the case on the outer peripheral portion, and a slit between the fastening portion and a portion facing the sensor chip via the sealing member. Is provided. As a result, when the fastening part is fastened to the measurement site into which the pressure medium is introduced, the stress caused by the fastening is absorbed according to the deformation of the slit, so that the stress caused by the fastening is Transmission to the sensor chip via the sealing member can be suppressed.

  In the invention of claim 10, the other side of the surface of the sensor chip that faces the one side on which the sensing unit is configured is a part excluding the sensing unit projection area where the sensing unit is projected on the other side. A protrusion extending in a direction orthogonal to the pressure introduction direction of the pressure introduction passage is provided at a position close to the sensing portion projection region from the counter pressure introduction passage side.

  In order to interpose the sealing member between the sensor chip and the case so that the sensing portion of the sensor chip is exposed in the pressure introduction passage, the sensor chip is positioned at a predetermined position with respect to the case with the pressure introduction passage facing upward. For example, a gel-like sealing member is introduced from the pressure introduction passage side in a state where it is supported on. The sensor chip and the case are fixed so that the sealing member is fixed between the surface of the sensor chip on the side opposite to the counter pressure introduction passage and the portion of the case facing the sealing chip, and the sealing member is further introduced onto the fixed sealing member. The sealing member is gradually interposed from the lower side (reverse pressure introduction passage side). In this introduction process, the sealing member may flow out to the sensing unit projection region depending on the amount of the sealing member introduced.

  Therefore, a protrusion extending in a direction perpendicular to the pressure introduction direction of the pressure introduction passage is provided in a portion excluding the sensing portion projection region and in a portion adjacent to the sensing portion projection region from the counter pressure introduction passage side. Thereby, the outflow of the sealing member to the sensing unit projection region is suppressed. Thereby, since the sealing member is not interposed in the sensing unit projection region, the stress from the sealing member is hardly transmitted to the sensing unit, and the influence of noise on the sensor chip can be suppressed.

  In the invention of claim 11, the case is formed with a first contact portion extending in a direction orthogonal to the pressure introduction direction, and the sensor chip is configured as the sensing portion of the surface of the sensor chip. The first contact at a part excluding the sensing part projection area where the sensing part is projected to the other side opposite to the one side face and adjacent to the sensing part projection area from the counter pressure introduction passage side It is supported by the case through a sealing member so as to abut the portion.

  Even if it does in this way, since the outflow of the sealing member to a sensing part projection area is prevented, it becomes difficult to transmit the stress from a sealing member to a sensing part, and it can control the influence of the noise to a sensor chip. it can. In particular, since it is not necessary to provide protrusions or the like on the sensor chip, a part of the manufacturing process of the sensor chip can be reduced.

  According to a twelfth aspect of the present invention, the case is formed with a second contact portion that is on the pressure introduction passage side with respect to the first contact portion and is capable of contacting the other side surface excluding the sensing portion projection region. Thereby, since the pressure introduction passage side of the sensor chip that is not bonded by the sealing member is supported by the second contact portion, it is possible to suppress the influence of noise due to the vibration of the sensing portion.

  In a thirteenth aspect of the present invention, the sensor chip includes a first substrate having a thin portion on which a pressure detection portion is formed and a second substrate on which a recess is formed. The sensing unit includes a pressure reference chamber formed by the thin portion and the concave portion by bonding the first substrate and the second substrate so that the thin portion and the concave portion are close to each other. And a signal corresponding to the displacement of the thin wall portion based on the pressure difference between the pressure medium and the pressure of the pressure medium.

  This prevents the sealing member from flowing into the sensing unit projection area even when a sensor chip in which the sensing unit is formed by bonding two substrates is used as a pressure sensor. This makes it difficult to transmit the stress to the sensing unit, and the influence of noise on the sensor chip can be suppressed.

Embodiments of a pressure sensor according to the present invention will be described below with reference to the drawings.
[First Embodiment]
A first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an overall schematic cross-sectional view of a pressure sensor 10 according to the first embodiment.

  The pressure sensor 10 is mounted on, for example, an automobile, and is used as a pressure sensor that detects a measured pressure of a pressure medium such as fuel pressure, lubricating oil pressure of an engine or drive system, refrigerant pressure of an air conditioner, or exhaust gas pressure. Applicable.

  As shown in FIG. 1, the pressure sensor 10 mainly includes a sensor chip 40 having a sensing unit 40a capable of outputting an electrical signal corresponding to the pressure of the pressure medium, and a lead for extracting a signal from the sensing unit 40a. And a housing 30 in which a sensor chip 40 is supported via an adhesive 60 and a pressure introduction passage 31 for introducing a pressure medium into the sensor chip 40 is formed.

  The connector case 20 is formed in a substantially cylindrical shape by molding a resin such as PPS (polyphenylene sulfide) or PBT (polybutylene terephthalate). At the center of the lower end surface of the one end portion side 20 a of the connector case 20, a recess 21 that forms a storage space for the connector case 20 is formed.

  As shown in FIG. 1, the connector case 20 is provided with a plurality of metal rod-like leads 22 for electrically connecting the sensor chip 40 and an external circuit or the like. One end of each lead 22 is electrically connected to the electrode 47 of the sensor chip 40 via the bonding wire 26, whereby the sensor chip 40 is electrically connected to the outside via each lead 22. Can be connected to. For example, one end of each lead 22 is exposed inside the recess 21 of the connector case 20 and is connected to the bonding wire 26 at this exposed portion.

  Each lead 22 is made of, for example, a material obtained by performing a plating process such as Ni plating on brass, and is formed integrally with the connector case 20 by an insert mold and supported in the connector case 20.

  As shown in FIG. 1, an opening 23 is formed on the other end 20 b of the connector case 20, and the other end of each lead 22 protrudes into the opening 23. Exposed.

  In this way, the other end of each lead 22 exposed in the opening 23 of the connector case 20 is electrically connected to an external circuit (such as an ECU of a vehicle) via an unillustrated external wiring member such as a wire harness. Connected. That is, the other end portion side of the connector case 20 is configured as a connection portion for connecting to the outside, that is, the connector portion 12 together with the other end portion of each lead 22.

  Further, the connector case 20 is provided with a lid portion 24 that blocks the concave portion 21 of the connector case 20 from the outside. The lid portion 24 is attached to the connector case 20 so as to shield the opening that communicates the recess 21 with the outside.

  The lid 24 is not particularly limited in material, but is made of the same resin, metal, ceramic, or the like as the connector case 20, and is joined to the connector case 20 by welding or adhesion.

  Next, the housing 30 will be described. The housing 30 is formed into a hollow cylinder extending in the vertical direction in FIG. 1 by pressing or cutting a metal material such as stainless steel (SUS).

  The pressure introduction passage 31 is configured as a hollow portion of the housing 30. That is, the pressure introduction passage 31 has openings 31 a and 31 b on one end side 30 a and the other end side 30 b of the housing 30, respectively, so that the end portions 30 a and 30 b communicate with each other inside the housing 30. It is provided.

  Further, a screw portion 32 for fixing the pressure sensor 10 to an appropriate position of an object to be detected such as a refrigerant pipe of an air conditioner or a fuel pipe of an automobile is formed on the outer surface of the one end side 30a of the housing 30. Has been.

  A pressure medium is introduced from the detected body through the pressure introduction passage 31. The pressure medium is, for example, the above-described air conditioner refrigerant, engine fuel such as gasoline, engine or drive system lubricating oil, or exhaust gas.

  One end side 20 a of the connector case 20 is connected to the other end side 30 b of the housing 30. Although the connection method of the connector case 20 and the housing 30 is not specifically limited, welding, adhesion | attachment, crimping, etc. are mentioned.

  In the first embodiment, a part 33 on the other end side 30b of the housing 30 is caulked and fixed to the connector case 20 with the one end side 20a of the connector case 20 inserted into the other end side 30b of the housing 30. Has been. Thereby, the connector case 20 and the housing 30 are assembled | attached integrally, and the case 11 of this 1st Embodiment is comprised.

  Further, an O-ring 25 for hermetically sealing between the housing 30 and the connector case 20 is disposed between the other end side 30b of the housing 30 and the one end side 20a of the connector case 20. Yes. The O-ring 25 is made of an elastic material such as silicon rubber, for example.

  Next, the structure of the sensor chip 40 will be described with reference to FIGS. FIG. 2 is a detailed cross-sectional view of the sensor chip 40 of FIG. FIG. 3A is a plan view of the sensor chip 40 as viewed from the second plate surface 52 side, and FIG. 3B is a cross-sectional view taken along the line 3B-3B shown in FIG. FIG.

  As shown in FIG. 2, the sensor chip 40 is obtained by bonding a first silicon substrate 41 and a second silicon substrate 42. Both of these silicon substrates 41 and 42 are made of a silicon semiconductor.

  Here, a plate surface as an outer surface on the first silicon substrate 41 side in the sensor chip 40 is a first plate surface 51, and a plate surface as an outer surface on the second silicon substrate 42 side is a second plate surface 52. . In the first embodiment, as shown in FIG. 3A, in the sensor chip 40, the plane direction of the first plate surface 51 is the (110) plane, and the longitudinal direction of the sensor chip 40 (pressure introduction direction) ) Is parallel to the <100> crystal axis direction.

  A conductive portion 43, an insulating layer 44a, and an adhesive layer 44b are sequentially interposed from the first silicon substrate 41 side to the second silicon substrate 42 side at the bonding interface between the silicon substrates 41 and 42. Here, the conductive portion 43 functions as a wiring that electrically connects a strain gauge 45, a circuit portion 46, and an electrode 47 described later. The conductive portion 43 is made of, for example, aluminum.

The insulating layer 44 a and the adhesive layer 44 b are electrically insulating films made of, for example, a silicon oxide film (SiO ₂ ), and the first silicon substrate 41 and the second silicon substrate 42 are bonded and fixed, and the conductive portion 43. It functions as an insulating bonding layer that bears electrical insulation of the circuit portion 46 and the like. Here, the two silicon substrates 41 and 42 are bonded to each other by two layers of the insulating layer 44a and the adhesive layer 44b, but may be performed by one layer made of a silicon oxide film or the like.

  The first silicon substrate 41 is formed in a thin shape, and a strain gauge 45 formed by impurity implantation / diffusion or the like functions as a pressure detector in the thin portion 48 that is one end portion in the longitudinal direction. It is formed to do. A bridge circuit is formed by the strain gauge 45 so that a change in the resistance value of the bridge circuit due to a distortion of a diaphragm 48 described later can be detected.

  A concave portion 49a formed by etching or the like is formed at one end in the longitudinal direction of the second silicon substrate 42 and at a position corresponding to the strain gauge 45 when the silicon substrates 41 and 42 are bonded together. By bonding the first silicon substrate 41 and the second silicon substrate 42 so that the concave portion 49a and the thin portion 48 are brought close to each other, a pressure reference chamber 49 that is airtightly partitioned is formed. The thin portion 48 that is a part of the peripheral wall of the pressure reference chamber 49 functions as a diaphragm 48 that is displaced so as to be distorted based on the pressure difference between the pressure in the pressure reference chamber 49 and the pressure of the pressure medium.

  Thus, the sensing unit 40a is configured as a semiconductor diaphragm type device that converts the pressure received by the diaphragm 48 into an electric signal by the strain gauge 45 and outputs the electric signal as a sensor signal.

  The first silicon substrate 41 is provided with a circuit unit 46. The circuit unit 46 is constituted by transistor elements and various wirings formed by a semiconductor process or the like, and performs processing of sensor signals and the like.

  Further, as described above, the strain gauge 45 and the circuit portion 46 are electrically connected by the conductive portion 43. The sensor chip 40 is provided with an electrode 47 that is electrically connected to the conductive portion 43. The electrode 47 is connected to the bonding wire 26 to take out a sensor signal from the substrate.

  Here, the electrode 47 is made of aluminum or the like, and is provided on the first plate surface 51 side which is the outer surface of the first silicon substrate 41. Specifically, an opening penetrating from the first plate surface 51 to the conductive portion 43 is provided in the first silicon substrate 41, and an electrode 47 is provided in the opening portion, so that the first plate surface 51 side is provided. The electrode 47 is exposed. Thereby, the electrode 47 and the bonding wire 26 can be connected.

  As described above, the sensor chip 40 of the present embodiment is obtained by integrating the sensing unit 40a that detects the pressure from the pressure medium and the circuit unit 46 that is a sensor signal processing circuit.

  As shown in FIG. 3A, the strain gauge 45 forms the bridge circuit with the four strain gauge resistors 45a to 45d on the first plate surface 51 whose plane orientation is the (110) plane. These strain gauge resistors 45a to 45d are arranged so that the longitudinal direction thereof is along the <110> crystal axis direction. The strain gauge resistors 45b and 45d are arranged so as to be close to the strain gauge resistors 45a and 45c.

  Further, as shown in FIGS. 3A and 3B, the second plate surface 52 is provided with a plurality of sensor chip side grooves 52a along the <110> crystal axis direction at a predetermined interval. Each of the sensor chip side grooves 52a is formed so as to exclude each of the projection parts on which the respective strain gauge resistors 45a to 45d are projected onto the second plate surface 52, and in particular, all of the projection parts are adjacent to the sensor chip. It is formed so as to be projected onto the protrusion 52b between the side grooves 52a. In addition, by providing a plurality of protrusions along the <110> crystal axis direction on the second plate surface 52, the space between adjacent protrusions may be configured as the sensor chip side groove 52a.

  That is, the longitudinal direction of each strain gauge resistor 45a to 45d and the extending direction of each sensor chip side groove 52a are along the <110> crystal axis direction and to the longitudinal direction of the sensor chip 40 (pressure introduction direction). Configured to be orthogonal.

  The sensor chip 40 configured as described above has an opening in the housing 30 such that the sensing portion 40a is exposed in the pressure introduction passage 31 of the housing 30 and each sensor chip side groove 52a is orthogonal to the pressure introduction passage 31. It is supported on the inner peripheral surface of the portion 31b via an adhesive 60 made of low melting point glass or the like. The adhesive 60 functions as a sealing member, and the pressure medium introduced from the opening 31a on the one end side of the housing 30 in the pressure introduction passage 31 does not enter the connector case 20 side.

  Thus, in a state where the adhesive 60 is interposed between the sensor chip 40 and the housing 30, the adhesive 60 enters the sensor chip side grooves 52 a, so that the contact area between the sensor chip 40 and the adhesive 60 is large. Become.

  The strain gauge resistors 45a to 45d are arranged on the first plate surface 51 having a (110) plane orientation so that the longitudinal direction thereof is along the <110> crystal axis direction. And since the stress which acts on the sensor chip 40 via the adhesive agent 60 generate | occur | produces along a sensor chip side groove | channel, the influence of the stress from the adhesive agent 60 with respect to each distortion gauge resistance 45a-45d is suppressed.

  In particular, each sensor chip side groove 52a is formed such that all of the projections of each strain gauge resistance 45a to 45d are projected onto the protrusions 52b between adjacent sensor chip side grooves 52a. This makes it difficult to transmit the stress to the strain gauge resistors 45a to 45d, so that the influence of noise on the sensor chip 40 can be suppressed, and noise variation with respect to the strain gauge resistors 45a to 45d can also be suppressed.

  As described above, in the pressure sensor 10 of the first embodiment, the plane orientation of the first plate surface 51 on which the strain gauge resistors 45a to 45d are formed is the (110) plane, and the strain gauge resistors. 45a-45d is arrange | positioned so that the longitudinal direction may follow a <110> crystal axis direction. The second plate surface 52 is formed with a plurality of sensor chip side grooves 52a along the <110> crystal axis direction at a predetermined interval.

As a result, the adhesive 60 enters the sensor chip side grooves 52a, so that the contact area between the sensor chip 40 and the adhesive 60 is increased, and the support strength of the sensor chip 40 with respect to the housing 30 can be increased. Further, since the stress acting on the sensor chip 40 via the adhesive 60 is generated along the sensor chip side groove 52a, each strain gauge resistance 45a to 45d is in the <110> crystal axis direction, that is, the direction along the sensor chip side groove 52a. Compared with the case where it arrange | positions in a different direction, the influence of the stress from the adhesive agent 60 with respect to each strain gauge resistance 45a-45d can be reduced.
Therefore, the support strength of the sensor chip 40 with respect to the housing 30 can be increased and the influence of noise on the sensor chip 40 can be suppressed.

  Further, in the pressure sensor 10 of the first embodiment, each sensor chip side groove 52a excludes each projection unit on which each strain gauge resistance 45a to 45d is projected on the second plate surface 52 of the sensor chip 40. It is formed as follows. This makes it difficult for stress from the adhesive 60 to be transmitted to the strain gauge resistances 45a to 45d, so that the influence of noise on the sensor chip 40 can be further suppressed.

  Furthermore, in the pressure sensor 10 of the first embodiment, the strain gauge resistors 45a to 45d are formed such that all the projections are projected onto the protrusions 52b between the adjacent sensor chip side grooves 52a. Thereby, each distortion resulting from the stress from the adhesive 60 compared with the case where each strain gauge resistance 45a-45d is formed so that each projection part may be projected on the site | part between the sensor chip side grooves 52a which are different, respectively. Noise variations to the gauge resistors 45a to 45d can be suppressed.

  Furthermore, in the pressure sensor 10 of the first embodiment, the sensor chip 40 is supported via the adhesive 60 so that the sensor chip side grooves 52 a are orthogonal to the pressure introduction passage 31. Since the sensor chip 40 is in contact with the adhesive 60 on the side opposite to the pressure introduction passage from the strain gauge resistors 45a to 45d, the stress from the adhesive 60 is transmitted to the strain gauge resistors 45a to 45d. The sensor chips are arranged so that the sensor chip side grooves 52a are orthogonal to the transmission direction. This makes it difficult for stress from the adhesive 60 to be transmitted to the strain gauge resistors 45 a to 45 d, so that the influence of noise on the sensor chip 40 can be further suppressed.

  Further, in the pressure sensor 10 of the first embodiment, the sensor chip 40 includes a first silicon substrate 41 having a thin portion 48 in which the strain gauge resistors 45a to 45d are formed, and a second portion in which a concave portion 49a is formed. And a silicon substrate 42. And the sensing part 40a of the sensor chip 40 is bonded to the first silicon substrate 41 and the second silicon substrate 42 so that the thin part 48 and the concave part 49a are brought close to each other, whereby the pressure reference is made by the thin part 48 and the concave part 49a. A chamber 49 is formed, and a signal corresponding to the displacement of the thin portion 48 functioning as the diaphragm 48 based on the pressure difference between the pressure of the pressure reference chamber 49 and the pressure medium is output from the strain gauge resistors 45a to 45d. It is configured.

  As described above, even when the sensor chip 40 in which the sensing unit 40a is formed is used for the pressure sensor 10 by bonding the two silicon substrates 41 and 42, the support strength of the sensor chip 40 with respect to the housing 30 can be increased. In addition, the influence of noise on the sensor chip 40 can be suppressed.

FIG. 4 is an explanatory view showing a sensor chip 40 according to a first modification of the first embodiment, and FIG. 4A is a plan view of the sensor chip 40 as viewed from the second plate surface 52 side. FIG. 4B is a cross-sectional view taken along the line 4B-4B shown in FIG.
As shown in FIGS. 4A and 4B, as a first modification in the first embodiment, the longitudinal direction of each strain gauge resistor 45a to 45d and the extending direction of each sensor chip side groove 52a are as follows. Further, they may be configured so as to be along the <110> crystal axis direction and parallel to the longitudinal direction (pressure introduction direction) of the sensor chip 40.

  Thereby, although the detection accuracy of the pressure of the pressure medium is inferior to that of the first embodiment, the adhesive 60 is easily introduced into the sensor chip side groove 52a of the sensor chip 40. The support strength of can be reliably increased.

FIG. 5 is an explanatory view showing a sensor chip 40 according to a second modification of the first embodiment, and FIG. 5A is a plan view of the sensor chip 40 viewed from the second plate surface 52 side. FIG. 5B is a cross-sectional view taken along the line 5B-5B shown in FIG.
As shown in FIGS. 5A and 5B, as a second modification of the first embodiment, each sensor chip side groove 52a formed on the second plate surface 52 of the second silicon substrate 42 is provided. A connecting groove 52c to be connected may be provided.

  Specifically, the connecting groove 52c connects the central part of each sensor chip side groove 52a closer to the counter pressure introduction passage than the projecting part 52b, and a part that is separated from each strain gauge resistance 45a to 45d is close to the connecting groove 52c. It is formed to be wider than

  Thereby, since the adhesive 60 is smoothly introduced into each sensor chip side groove 52a via the connection groove 52c, the support strength of the sensor chip 40 with respect to the housing 30 can be increased. In particular, since the connecting groove 52c is not formed on the pressure introduction passage side than the protrusion 52b, the stress from the adhesive 60 is hardly transmitted to the sensor chip 40, and the influence of noise on the sensor chip 40 is suppressed. You can also The connecting groove 52c is not limited to be formed so as to connect the central portion of each sensor chip side groove 52a, and may be formed so as to connect the vicinity of the end of each sensor chip side groove 52a, for example. Further, the connecting groove 52c may be formed so as to become wider as the distance from the strain gauge resistors 45a to 45d increases, or may be formed so that the width dimension thereof is constant.

FIG. 6 is a detailed cross-sectional view showing a sensor chip 40 according to a third modification of the first embodiment.
As shown in FIG. 6, as a third modification of the first embodiment, each sensor chip side groove 52 a is abolished and each case side protrusion 34, which is a protrusion corresponding to each sensor chip side groove 52 a, is disposed on the housing 30. You may provide in the inner surface of the opening part 31b.

  As a result, the contact area between the housing 30 and the adhesive 60 is increased, so that the support strength of the adhesive 60 with respect to the housing 30, that is, the support strength of the sensor chip 40 with respect to the housing 30 can be increased. In particular, since it is not necessary to provide a groove or the like on the surface of the sensor chip 40, a part of the manufacturing process can be reduced in the sensor chip 40 that can increase the support strength with respect to the housing 30.

FIG. 7 is a schematic cross-sectional view showing a pressure sensor according to a fourth modification of the first embodiment, and FIG. 8 is a schematic cross-section showing a pressure sensor according to the fifth modification of the first embodiment. FIG.
As shown in FIG. 7, as a fourth modification example of the first embodiment, the sensor chip 40 is connected to a part of the other end 30 b of the housing 30 via a screw part 32 and an adhesive 60. A slit 35 parallel to the pressure introducing passage may be formed between the opposing portions. As shown in FIG. 8, as a fifth modification of the first embodiment, a slit 36 orthogonal to the pressure introduction passage may be formed instead of the slit 35.

  Accordingly, when the screw portion 32 is fastened to the measurement site into which the pressure medium is introduced, stress due to the fastening is absorbed according to the deformation of the slit 35 or the slit 36. It is possible to suppress the resulting stress from being transmitted to the sensor chip 40 via the adhesive 60.

[Second Embodiment]
Next, a pressure sensor according to a second embodiment of the present invention will be described with reference to FIG. FIG. 9 is an explanatory view showing the sensor chip 70 according to the second embodiment, and FIG. 9A is a plan view of the sensor chip 70 viewed from the second plate surface 74 side, and FIG. ) Is a cross-sectional view taken along line 9B-9B shown in FIG.

  As shown in FIGS. 9A and 9B, in the second embodiment, the point that the sensor chip 70 is used in place of the sensor chip 40 in the pressure sensor 10 is described in the first embodiment. Mainly different from pressure sensors. Therefore, substantially the same components as those of the pressure sensor of the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 9B, the sensor chip 70 is obtained by bonding a first silicon substrate 71 and a second silicon substrate 72 together. Here, a plate surface as an outer surface on the first silicon substrate 71 side in the sensor chip 70 is a first plate surface 73, and a plate surface as an outer surface on the second silicon substrate 72 side is a second plate surface 74. . In the second embodiment, the sensor chip 70 is formed such that the plane orientation of the first plate surface 73 is the (100) plane.

  As shown in FIG. 9A, the strain gauge 45 formed on the sensor chip 70 is a first plate surface 73 having a (100) plane orientation by four strain gauge resistors 45a to 45d. The bridge circuit is configured. These strain gauge resistors 45a to 45d are arranged so that the longitudinal direction thereof is along the <110> crystal axis direction. Further, the strain gauge resistors 45b and 45d are arranged so as to be separated from each other as compared with the case of the first embodiment.

  The second plate surface 74 is formed with a lattice-like groove (hereinafter referred to as a lattice groove 74a).

  The sensor chip 70 configured as described above is supported via an adhesive 60 on the inner peripheral surface of the opening 31b in the housing 30 so that the sensing unit 70a is exposed in the pressure introduction passage 31 of the housing 30. .

  As described above, in a state where the adhesive 60 is interposed between the sensor chip 70 and the housing 30, the adhesive 60 enters the lattice groove 74a, so that the contact area between the sensor chip 70 and the adhesive 60 is increased.

  As described above, in the pressure sensor 10 according to the second embodiment, the strain gauge resistors 45a to 45d are formed on the (100) plane, so that the pressure is detected in two directions. Even if the lattice groove 74a is formed on the second plate surface 74, the influence of the stress from the adhesive 60 caused by the lattice groove 74a is suppressed.

  In the lattice grooves 74a formed in a lattice shape, the adhesive 60 is smoothly introduced into the lattice grooves 74a as compared with the grooves in one direction, so that the support strength of the sensor chip 70 with respect to the housing 30 is further increased. be able to.

  FIG. 10 is an explanatory view showing a sensor chip 70 according to a first modification of the second embodiment, and FIG. 10A is a plan view of the sensor chip 70 viewed from the second plate surface 74 side. FIG. 10B is a cross-sectional view taken along the line 10B-10B shown in FIG.

  As shown in FIGS. 10A and 10B, as a first modification of the second embodiment, the lattice grooves 74a are eliminated, and the strain gauge resistors 45a to 45d in the second plate surface 74 are eliminated. A cylindrical protrusion 74b may be formed by projecting a portion including a projection part on which is projected. Even in this case, the influence of noise on each of the strain gauge resistors 45 a to 45 d can be suppressed, and the contact area between the sensor chip 70 and the adhesive 60 becomes large, and the support strength of the sensor chip 70 with respect to the housing 30. Can be increased.

  Also in the second embodiment, as in the third modification of the first embodiment, the lattice grooves 74a or the protrusions 74b are eliminated, and the protrusions or grooves corresponding to the lattice grooves 74a or the protrusions 74b are eliminated. May be provided on the inner surface of the opening 31 b of the housing 30.

[Third Embodiment]
Next, a pressure sensor according to a third embodiment of the present invention will be described with reference to FIG. FIG. 11 is a detailed cross-sectional view showing a sensor chip 80 according to the third embodiment.

  As shown in FIG. 11, the third embodiment is mainly different from the pressure sensor described in the first embodiment in that a pressure sensor 10 employs a sensor chip 80 instead of the sensor chip 40. Therefore, substantially the same components as those of the pressure sensor of the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  The sensor chip 80 is obtained by bonding a first silicon substrate 81 and a second silicon substrate 82 together. Here, a plate surface as an outer surface on the first silicon substrate 81 side in the sensor chip 80 is a first plate surface 83, and a plate surface as an outer surface on the second silicon substrate 82 side is a second plate surface 84. .

  In the first silicon substrate 81, the strain gauge resistors 45a to 45d are formed in the thin portion 48, and in the second silicon substrate 82, a recess 49a is formed. The sensing part 80a of the sensor chip 80 is formed by the thin part 48 and the concave part 49a by bonding the first silicon substrate 81 and the second silicon substrate 82 so that the thin part 48 and the concave part 49a are brought close to each other. And a signal corresponding to the displacement of the thin portion 48 functioning as the diaphragm 48 based on the pressure difference between the pressure in the pressure reference chamber 49 and the pressure of the pressure medium is output from the strain gauge resistors 45a to 45d. Is configured to do.

  On the second plate surface 84, a region where the sensing unit 80 a is projected on the second plate surface 84, specifically, a region where each strain gauge resistance 45 a to 45 d and the pressure reference chamber 49 are projected. (Hereinafter referred to as the sensing portion projection region 84a), and extending to a portion adjacent to the sensing portion projection region 84a from the counter pressure introduction passage side in a direction orthogonal to the pressure introduction direction of the pressure introduction passage 31. An existing projection 84b is provided.

  The sensor chip 80 configured as described above is supported on the inner peripheral surface of the opening 31b in the housing 30 via the adhesive 60 so that the sensing unit 80a is exposed in the pressure introduction passage 31 of the housing 30. .

  Here, the process of interposing the adhesive 60 between the sensor chip 80 and the housing 30 will be described with reference to FIG. FIG. 12 is a schematic view of the sensor chip 80 according to the third embodiment and the opening 31b of the housing 30 as viewed from the pressure introduction passage 31 side. In FIG. 12, for convenience of explanation, the area occupied by the adhesive 60 is shown by hatching.

  First, the adhesive 60 is configured from the pressure introduction passage side with the sensor chip 80 supported so that the sensing portion 80a is exposed in the pressure introduction passage 31 with respect to the housing 30 with the pressure introduction passage 31 facing upward. For example, a gel-like adhesive material is introduced. Then, an adhesive material is fixed between the surface of the sensor chip 80 on the side opposite to the counter pressure introduction passage and the opening 31b facing the surface, and a gel-like adhesive material is further introduced onto the fixed adhesive material. The adhesive material is gradually interposed between the sensor chip 80 and the opening 31b from the lower side (reverse pressure introduction passage side).

  When the adhesive material is introduced until it comes into contact with the protrusion 84b of the sensor chip 80, the introduction of the adhesive material is stopped. When the adhesive material introduced in this manner is fixed, the adhesive 60 is interposed between the sensor chip 80 and the opening 31b. For this reason, as shown in FIG. 12, for example, even when the introduction amount of the adhesive material is large, the adhesive 60 is only introduced into the vicinity of the sensing unit projection area 84a until it comes into contact with the projection 84b. Outflow is suppressed.

  As described above, in the pressure sensor 10 of the third embodiment, since the protrusion 84b is provided on the second plate surface 84, the outflow of the adhesive 60 to the sensing unit projection region 84a is suppressed. Therefore, the adhesive 60 is not interposed in the sensing unit projection region 84a, and the stress from the adhesive 60 is hardly transmitted to the sensing unit 80a, and the influence of noise on the sensor chip 80 can be suppressed.

  In the pressure sensor 10 of the third embodiment, the sensor chip 80 includes a first silicon substrate 81 having a thin portion 48 in which the strain gauge resistors 45a to 45d are formed, and a second portion in which a concave portion 49a is formed. And a silicon substrate 82. The sensing part 80a of the sensor chip 80 is formed by the thin part 48 and the concave part 49a by bonding the first silicon substrate 81 and the second silicon substrate 82 so that the thin part 48 and the concave part 49a are brought close to each other. And a signal corresponding to the displacement of the thin portion 48 functioning as the diaphragm 48 based on the pressure difference between the pressure in the pressure reference chamber 49 and the pressure of the pressure medium is output from the strain gauge resistors 45a to 45d. Is configured to do.

  As described above, even when the sensor chip 80 in which the sensing unit 80a is formed by bonding the two silicon substrates 81 and 82 is used for the pressure sensor 10, the adhesive 60 flows out to the sensing unit projection region 84a. This prevents the stress from the adhesive 60 from being transmitted to the sensing unit 80a, and the influence of noise on the sensor chip 80 can be suppressed.

FIG. 13 is a cross-sectional view illustrating a pressure sensor 10 according to a first modification example of the third embodiment.
As shown in FIG. 13, as a first modification of the third embodiment, the first abutment that extends in the direction orthogonal to the pressure introduction direction of the pressure introduction passage 31 at the opening 31 b of the housing 30. A portion 37 may be provided. Even if it does in this way, the outflow of the adhesive agent 60 to the sensing part projection area | region 84a can be suppressed similarly to the case where the processus | protrusion 84b is provided in the sensor chip 80. FIG. In particular, since it is not necessary to provide protrusions or the like on the sensor chip 80, a part of the manufacturing process of the sensor chip 80 can be reduced.

  Further, as shown in FIG. 13, the opening 31b of the housing 30 is in contact with the second plate surface 84 on the pressure introduction passage side with respect to the first contact portion 37 and excluding the sensing portion projection region 84a. A possible second abutment 38 is formed. As a result, the pressure introduction passage side of the sensor chip 80 that is not bonded by the adhesive 60 is supported by the second contact portion 38, so that it is possible to suppress the influence of noise caused by the vibration of the sensing portion 80a.

The present invention is not limited to the above embodiments, and may be embodied as follows. Even in this case, the same operations and effects as those of the above embodiments can be obtained.
(1) FIG. 14 is a schematic cross-sectional view of a pressure sensor according to a sixth modification of the first embodiment.
As shown in FIG. 14, in the first embodiment, the sensor chip side groove 51a along the <110> crystal axis direction is also provided at a predetermined interval on the first plate surface 51 of the first silicon substrate 41 of the sensor chip 40. A plurality may be provided. Thereby, the support strength of the sensor chip 40 with respect to the housing 30 can be further increased, and the influence of noise on the sensor chip 40 can be suppressed.

(2) In the first embodiment, the sensor chip side groove 52a may be formed to become wider as the distance from the strain gauge resistors 45a to 45d increases. Further, when the case-side protrusion 34 is provided in the housing 30 instead of the sensor chip-side groove 52a, the case-side protrusion 34 is further away from the pressure introduction passage 31, that is, the further away from the strain gauge resistors 45a to 45d. You may form so that it may become wide. With such a configuration, the support strength of the sensor chip 40 with respect to the housing 30 can be further increased, and the influence of noise on the sensor chip 40 can be suppressed.

(3) In the second embodiment, the lattice groove 74a may be formed so as to become wider as the distance from the strain gauge resistors 45a to 45d increases. Further, in the case where the housing 30 is provided with lattice-like protrusions corresponding to the lattice grooves 74a instead of the lattice grooves 74a, the lattice-like protrusions are separated from the pressure introducing passages 31, that is, from the strain gauge resistors 45a to 45d. You may form so that it may become so wide that it is. With such a configuration, the support strength of the sensor chip 70 with respect to the housing 30 can be further increased, and the influence of noise on the sensor chip 70 can be suppressed.

1 is an overall schematic cross-sectional view of a pressure sensor according to a first embodiment of the present invention. FIG. 2 is a detailed cross-sectional view of the sensor chip in FIG. 1. FIG. 3A is a plan view of the sensor chip viewed from the second plate surface side, and FIG. 3B is a cross-sectional view taken along the line 3B-3B shown in FIG. is there. It is explanatory drawing which shows the sensor chip which concerns on the 1st modification in 1st Embodiment. It is explanatory drawing which shows the sensor chip which concerns on the 2nd modification in 1st Embodiment. It is a detailed sectional view showing a sensor chip concerning the 3rd modification in a 1st embodiment. It is a schematic sectional drawing of the pressure sensor which concerns on the 4th modification in 1st Embodiment. It is a schematic sectional drawing of the pressure sensor which concerns on the 5th modification in 1st Embodiment. It is explanatory drawing which shows the sensor chip which concerns on 2nd Embodiment. It is explanatory drawing which shows the sensor chip which concerns on the 1st modification in 2nd Embodiment. It is a detailed sectional view showing a sensor chip concerning a 3rd embodiment. It is the schematic diagram which looked at the sensor chip which concerns on 3rd Embodiment, and the opening part of the housing from the pressure introduction channel | path side. It is sectional drawing which shows the pressure sensor which concerns on the 1st modification of 3rd Embodiment. It is a schematic sectional drawing of the pressure sensor which concerns on the 6th modification in 1st Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Pressure sensor 11 ... Case 20 ... Connector case 30 ... Housing 31 ... Pressure introduction path 32 ... Screw part 34 ... Case side protrusion 35, 36 ... Slit 37 ... 1st contact part 38 ... 2nd contact part 40, 70 , 80 ... sensor chips 40a, 70a, 80a ... sensing units 41, 71, 81 ... first silicon substrate (first substrate)
42, 72, 82 ... second silicon substrate (second substrate)
45 ... Strain gauge (pressure detector)
45a to 45d: Strain gauge resistance (pressure detector)
48 ... Diaphragm, thin-walled portion 49 ... Pressure reference chamber 49a ... Recessed portion 51, 73, 83 ... First plate surface (one side surface)
52, 74, 84 ... 2nd board surface (other side)
52a ... Sensor chip side groove 52b ... Protrusion 52c ... Connection groove 60 ... Adhesive 74a ... Lattice groove 74b ... Protrusion 84a ... Sensing part projection area 84b ... Protrusion

Claims (13)

A sensor chip having a sensing unit capable of detecting the pressure of the pressure medium;
A case in which a pressure introduction passage for introducing the pressure medium is formed;
A sealing member interposed between the sensor chip and the case so that the sensing portion of the sensor chip is exposed in the pressure introduction passage;
A pressure sensor comprising:
The sensing unit is configured to have a plurality of strain gauges capable of outputting a signal corresponding to the displacement of the diaphragm based on the pressure difference between the pressure of the pressure medium and the reference pressure of the pressure reference chamber to be sealed,
The surface orientation of one side surface on which each strain gauge is formed is a (110) plane, and each strain gauge is arranged along the <110> crystal axis direction,
A pressure sensor, wherein a plurality of sensor chip side grooves along the <110> crystal axis direction are formed in a portion of the surface of the sensor chip that contacts the sealing member.   Each of the sensor chip side grooves is formed so as to exclude each projection portion on which the respective strain gauges are respectively projected onto the other side surface of the surface of the sensor chip facing the one side surface. Item 2. The pressure sensor according to Item 1.   3. The pressure sensor according to claim 2, wherein each of the sensor chip side grooves is formed such that all the projections are projected on one of the portions between adjacent sensor chip side grooves. 4.   The said sensor chip is supported via the said sealing member so that each said sensor chip side groove may orthogonally cross with respect to the said pressure introduction channel | path, The Claim 1 characterized by the above-mentioned. Pressure sensor.   The pressure sensor according to claim 4, wherein the sensor chip is formed with a connection groove that connects a part of each of the sensor chip side grooves. A sensor chip having a sensing unit capable of detecting the pressure of the pressure medium;
A case in which a pressure introduction passage for introducing the pressure medium is formed;
A sealing member interposed between the sensor chip and the case so that the sensing portion of the sensor chip is exposed in the pressure introduction passage;
A pressure sensor comprising:
The sensing unit is configured to have a plurality of strain gauges capable of outputting a signal corresponding to the displacement of the diaphragm based on the pressure difference between the pressure of the pressure medium and the reference pressure of the pressure reference chamber to be sealed,
The surface orientation of one side surface on which each strain gauge is formed is a (110) plane, and each strain gauge is arranged along the <110> crystal axis direction,
A pressure sensor, wherein a plurality of case-side protrusions along the <110> crystal axis direction are formed on a portion of the inner surface of the case facing the sensor chip via the sealing member. A sensor chip having a sensing unit capable of detecting the pressure of the pressure medium;
A case in which a pressure introduction passage for introducing the pressure medium is formed;
A sealing member interposed between the sensor chip and the case so that the sensing portion of the sensor chip is exposed in the pressure introduction passage;
A pressure sensor comprising:
The sensing unit is configured to have a plurality of strain gauges capable of outputting a signal corresponding to the displacement of the diaphragm based on the pressure difference between the pressure of the pressure medium and the reference pressure of the pressure reference chamber to be sealed,
The plane orientation of one side surface on which each strain gauge is formed is a (100) plane, and each strain gauge is arranged along the <110> crystal axis direction,
A pressure sensor, wherein a lattice-like groove is formed on a portion of the surface of the sensor chip that contacts the sealing member. The sensor chip includes a first substrate having a thin portion on which each strain gauge is formed and a second substrate on which a recess is formed,
In the sensing unit, the pressure reference chamber is formed by the thin portion and the concave portion by bonding the first substrate and the second substrate so that the thin portion and the concave portion are close to each other. The strain gauge is configured to output a signal corresponding to a displacement of the thin portion functioning as the diaphragm based on a pressure difference between a pressure in a reference chamber and a pressure medium. The pressure sensor as described in any one of 1-7.   The case is formed with a fastening portion for fastening the case on an outer peripheral portion thereof, and a slit is provided between the fastening portion and a portion facing the sensor chip via the sealing member. The pressure sensor according to any one of claims 1 to 8. A sensor chip having a sensing unit capable of detecting the pressure of the pressure medium;
A case in which a pressure introduction passage for introducing the pressure medium is formed;
A sealing member interposed between the sensor chip and the case so that the sensing portion of the sensor chip is exposed in the pressure introduction passage;
A pressure sensor comprising:
The other side of the surface of the sensor chip that faces the one side on which the sensing unit is configured is a part excluding the sensing unit projection area where the sensing unit is projected onto the other side, and the sensing unit A pressure sensor characterized in that a projection extending in a direction orthogonal to the pressure introduction direction of the pressure introduction passage is provided at a position close to the projection region from the counter pressure introduction passage side. A sensor chip having a sensing unit capable of detecting the pressure of the pressure medium;
A case in which a pressure introduction passage for introducing the pressure medium is formed;
A sealing member interposed between the sensor chip and the case so that the sensing portion of the sensor chip is exposed in the pressure introduction passage;
A pressure sensor comprising:
The case is formed with a first contact portion extending in a direction orthogonal to the pressure introduction direction of the pressure introduction passage,
The sensor chip is a portion excluding a sensing unit projection area where the sensing unit is projected on the other side of the surface of the sensor chip that faces the one side on which the sensing unit is configured. The pressure sensor is supported by the case via the sealing member so as to abut on the first abutting portion at a site close to the region from the side opposite to the counter pressure introduction passage.   The case is characterized in that a second abutting portion is formed on the pressure introduction passage side with respect to the first abutting portion and capable of abutting on the other side surface excluding the sensing portion projection area. The pressure sensor according to claim 11. The sensor chip includes a first substrate having a thin portion on which a pressure detection unit is formed and a second substrate on which a recess is formed,
The sensing unit includes a pressure reference chamber formed by the thin portion and the concave portion by bonding the first substrate and the second substrate so that the thin portion and the concave portion are close to each other. The structure according to claim 10, wherein a signal corresponding to a displacement of the thin portion based on a pressure difference between a pressure in a pressure reference chamber and a pressure of the pressure medium is output from the pressure detection unit. The pressure sensor as described in any one.

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