JP2010047773A - Curable resin composition for packaging of semiconductor, and semiconductor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a curable resin composition for packaging a semiconductor, which excels in molding processability such as transfer moldability, and includes high light fastness and heat resistance. <P>SOLUTION: The resin composition comprising an organic compound having at least two carbon-carbon double bonds which includes reactivity with an SiH group in a molecule, a compound having at least two SiH groups in the molecule, and a hydrosilylating catalyst as indispensable constituents are used for packaging a semiconductor. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a resin composition for a semiconductor package, and more specifically, a resin composition for a semiconductor package, which has good moldability and high light resistance and heat resistance, and is produced using the same. It relates to semiconductors.

Conventionally, semiconductors having various types of packages have been proposed. In particular, among these, the light resistance required for the package is that in which the semiconductor is a light emitting diode.

Conventionally, as a light emitting diode, a surface-mount type using a package is manufactured, but as a material for the package, ceramic, polyamide resin, polyester resin or the like is mainly used.

However, when ceramic is used as a packaging material, the moldability of the ceramic is not good, and industrial applicability is generally narrow. In addition, for the manufacture of light emitting diodes, it is common to fill a package with a sealing agent (mold material) such as an epoxy resin. In that case, the linear expansion coefficient between the ceramic and the sealing agent such as an epoxy resin Therefore, there is also a problem that the reliability of the light emitting diode is lowered due to the occurrence of cracks in the sealant due to thermal stress or the like.

When a polyamide resin is used as a packaging material, there is a problem that the polyamide resin is colored due to light resistance deterioration, and therefore, when used for a long time, there is a problem that the reflectance on the package surface is lowered and the luminance of the light emitting diode is lowered . In addition, there is also a problem that the reliability of the light emitting diode is lowered due to a decrease in adhesiveness with the sealing agent due to light resistance deterioration of the polyamide resin.

When a polyester resin is used as a packaging material, the heat resistance is not sufficient, so that there is a problem that the solder reflow resistance is poor and the industrial applicability is limited.

On the other hand, as a resin excellent in light resistance, an organic compound containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule, a compound containing at least two SiH groups in one molecule, Resin compositions containing a hydrosilylation catalyst as an essential component have been proposed (see Patent Document 1 and Patent Document 2).

However, there is no description about using the resin composition as a light emitting diode package.

JP 2002-80733 A JP 2002-317048 A

Accordingly, an object of the present invention is to provide a curable resin composition for a light emitting diode package having good moldability and high light resistance and heat resistance.

In order to solve such a problem, the present inventors have conducted intensive research, and as a result, organic compounds containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule, at least two in one molecule. The present inventors have found that the above problems can be solved by forming a semiconductor package using a compound containing SiH groups and a resin composition containing a hydrosilylation catalyst as an essential component.

That is, the present invention
(A) an organic compound containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule, (B) a compound containing at least two SiH groups in one molecule, (C) A curable resin composition for a semiconductor package comprising a curable resin composition comprising a hydrosilylation catalyst as an essential component (Claim 1),
The curable resin composition for a package according to claim 1, wherein the semiconductor is a light emitting diode (claim 2),
The curable resin composition for a semiconductor package according to claim 1, further comprising (D) an inorganic filler (Claim 3),
The inorganic filler as component (D) is a curable resin composition for a semiconductor package according to claim 3, wherein the inorganic filler is titanium oxide and / or silica (claim 4).
A curable resin composition for a semiconductor package (Claim 5), wherein the curable resin composition for a semiconductor package according to any one of claims 1 to 4 is B-staged.
A semiconductor package (Claim 6), wherein the semiconductor package curable resin composition according to any one of claims 1 to 5 is molded.
A curable resin composition for a semiconductor package according to any one of claims 1 to 5, which has fluidity at a temperature of 150 ° C or lower and a gelation time at 150 ° C of 60 seconds or less. A semiconductor package (Claim 7), wherein a certain curable resin composition is molded by transfer molding,
A semiconductor package formed by molding the curable resin composition for a semiconductor package according to any one of claims 2 to 5, wherein the semiconductor is a light emitting diode, and the package emits light. A semiconductor package designed to be irradiated with light emitted from a diode (claim 8);
It is the semiconductor (Claim 9) manufactured using the curable resin composition for light emitting diode packages as described in any one of Claims 1 thru | or 3.

Since the resin composition of the present invention has good moldability and high light resistance and heat resistance, when used as a semiconductor package, an industrially highly practical and reliable semiconductor is produced. be able to.

It is an example of the package of a light emitting diode.

Hereinafter, the present invention will be described in detail.
((A) component)
First, the component (A) in the present invention will be described.

The component (A) is not particularly limited as long as it is an organic compound containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule.
(Skeleton of component (A))
Organic compounds do not contain siloxane units (Si-O-Si), such as polysiloxane-organic block copolymers and polysiloxane-organic graft copolymers, and elements other than C, H, N, O, S and halogen A compound containing no element is more preferable. In the case of those containing siloxane units, there is a problem that the adhesiveness between the semiconductor package and the lead frame or the sealing resin tends to be low.

The organic compound (A) can be classified into an organic polymer compound and an organic monomer compound.
(Example when component (A) is a polymer)
As the component (A) of the organic polymer system, for example, polyether-based, polyester-based, polyarylate-based, polycarbonate-based, saturated hydrocarbon-based, unsaturated hydrocarbon-based, polyacrylate ester-based, polyamide-based, phenol-formaldehyde Examples thereof include those having a skeleton of a system (phenolic resin system) or a polyimide system.

Among these, examples of the polyether polymer include polyoxyethylene, polyoxypropylene, polyoxytetramethylene, polyoxyethylene-polyoxypropylene copolymer, and the like. More specific examples:

（式中、Ｒ^１、Ｒ^２は構成元素としてＣ、Ｈ、Ｎ、Ｏ、Ｓ、ハロゲン以外の元素を含まない炭素数１〜６の２価の有機基、ｎ、ｍ、ｌは１〜３００の数を表す。）
等が挙げられる。

(Wherein R ¹ and R ² are C 1 -C 6 divalent organic groups containing no elements other than C, H, N, O, S and halogen as constituent elements, n, m, and l are 1 to 1; Represents a number of 300.)
Etc.

Examples of other polymers include dibasic acids such as adipic acid, phthalic acid, isophthalic acid, terephthalic acid, and hexahydrophthalic acid, and glycols such as ethylene glycol, diethylene glycol, propylene glycol, tetramethylene glycol, and neopentyl glycol. Polyester polymers obtained by condensation or ring-opening polymerization of lactones, ethylene-propylene copolymers, polyisobutylene, copolymers of isobutylene and isoprene, polychloroprene, polyisoprene, isoprene and butadiene, acrylonitrile, styrene Copolymer, polybutadiene, butadiene and styrene, acrylonitrile, etc., polyisoprene, polybutadiene, isoprene or butadiene and acrylonitrile, styrene, etc. Polyolefins obtained by radical polymerization of monomers such as ethyl acrylate and butyl acrylate, and acrylic acid esters such as ethyl acrylate and butyl acrylate, and acetic acid. Acrylate ester copolymer with vinyl, acrylonitrile, methyl methacrylate, styrene, etc., graft polymer obtained by polymerizing vinyl monomer in the organic polymer, polysulfide polymer, ring-opening polymerization of ε-aminocaprolactam Nylon 6 by polycondensation, Nylon 66 by polycondensation of hexamethylenediamine and adipic acid, Nylon 610 by polycondensation of hexamethylenediamine and sebacic acid, Nylon 11 by polycondensation of ε-aminoundecanoic acid, ε-aminolaurolactam Nylon 12 by ring-opening polymerization, a polyamide polymer such as copolymer nylon having two or more components among the above nylons, for example, a polycarbonate polymer produced by polycondensation from bisphenol A and carbonyl chloride, Examples of the diallyl phthalate polymer and the phenol-formaldehyde (phenolic resin) skeleton include novolac type phenolic resin, resol type phenolic resin, ammonia resol type phenolic resin, and benzylic ether type phenolic resin.

An alkenyl group having a carbon-carbon double bond can be introduced into these polymer skeletons to obtain the component (A).

In this case, the alkenyl group having a carbon-carbon double bond may be present anywhere in the molecule, but is preferably present in the side chain or the terminal in terms of reactivity.

Various methods for introducing an alkenyl group into the polymer skeleton can be used. However, the method can be roughly divided into a method for introducing an alkenyl group after polymerization and a method for introducing an alkenyl group during polymerization. Can do.

As a method for introducing an alkenyl group after polymerization, for example, an organic polymer having a functional group such as a hydroxyl group, an alkoxide group, a carboxyl group, or an epoxy group at the terminal, main chain, or side chain is reactive with the functional group. An alkenyl group can be introduced into the terminal, main chain or side chain by reacting an organic compound having both an active group and an alkenyl group. Examples of organic compounds having both an active group and an alkenyl group reactive to the functional group include C3-C20 unsaturated groups such as acrylic acid, methacrylic acid, vinyl acetic acid, acrylic acid chloride, and acrylic acid bromide. fatty acids, acid halides, acid anhydrides or allyl chloroformate _{(CH 2 = CHCH 2 OCOCl)} , allyl bromo formate _{(CH 2} = CHCH ₂ OCOBr) unsaturated aliphatic alcohol-substituted carbonic halide C3~C20 such, Allyl chloride, allyl bromide, vinyl (chloromethyl) benzene, allyl (chloromethyl) benzene, allyl (bromomethyl) benzene, allyl (chloromethyl) ether, allyl (chloromethoxy) benzene, 1-butenyl (chloromethyl) ether, 1 -Hexenyl (chloromethoxy) Benzene, allyloxy (chloromethyl) benzene, allyl isocyanate.

There is also a method of introducing an alkenyl group using a transesterification method. This method is a method of transesterifying an alcohol residue of an ester portion of a polyester resin or an acrylic resin with an alkenyl group-containing alcohol or an alkenyl group-containing phenol derivative using a transesterification catalyst. The alkenyl group-containing alcohol and alkenyl group-containing phenol derivative used for exchange with an alcohol residue may be any alcohol or phenol derivative having at least one alkenyl group and having at least one hydroxyl group. It is preferable to have it. A catalyst may or may not be used, but a titanium-based catalyst and a tin-based catalyst are preferable.

Examples of the above compounds are vinyl alcohol, allyl alcohol, 3-buten-1-ol, 4-penten-1-ol, 5-hexen-1-ol, 6-hepten-1-ol, and 7-octene-1. -Ol, 8-nonen-1-ol, 9-decen-1-ol, 2- (allyloxy) ethanol, neopentyl glycol monoallyl ether, glyceryl diallyl ether, trimethylolpropane triallyl ether, trimethylolethane triallyl ether , Pentaerythritol tetraallyl ether, 1,2,6-hexanetriol triallyl ether, sorbitan triallyl ether,

などが挙げられる。この中でも、入手の容易さから、アリルアルコール、ビニルアルコール、３−ブテン−１−オール、２−（アリルオキシ）エタノール、および

Etc. Among these, allyl alcohol, vinyl alcohol, 3-buten-1-ol, 2- (allyloxy) ethanol, and

が好ましい。

Is preferred.

Furthermore, the ester residue of the above-mentioned alcohol or phenol derivative such as acetate ester and the ester part of the polyester resin or acrylic resin are transesterified using a transesterification catalyst, and the alcohol residue of the ester part of the produced polyester resin or acrylic resin is changed. There is also a method of introducing an alkenyl group by a method of distilling low molecular weight esterified products such as acetates out of the system by vacuum devolatilization or the like.

Moreover, after polymerizing methyl (meth) acrylate etc. by living polymerization, an alkenyl group can also be introduce | transduced into the terminal by the method of stopping a living terminal with the compound which has an alkenyl group.

As a method for introducing an alkenyl group during the polymerization, for example, in the case of producing the organic polymer skeleton of the component (A) used in the present invention by radical polymerization, radical reactivity in the molecule of allyl methacrylate, allyl acrylate, etc. By using a vinyl monomer having a low alkenyl group or a radical chain transfer agent having a low alkenyl group such as allyl mercaptan, an alkenyl group can be introduced into the side chain or terminal of the organic polymer skeleton. .

As the component (A), the molecular weight is not particularly limited, but any of 100 to 100,000 can be suitably used, and an alkenyl group-containing organic polymer is particularly preferably 500 to 20,000. When the molecular weight is 500 or less, characteristics due to the use of an organic polymer such as imparting flexibility are hardly exhibited, and when the molecular weight is 100,000 or more, the effect of crosslinking due to the reaction between the alkenyl group and the SiH group is hardly exhibited.
(Example when component (A) is a monomer)
Examples of the organic monomer-based component (A) include, for example, aromatic hydrocarbons such as phenols, bisphenols, benzene, and naphthalene: aliphatic hydrocarbons such as linear and alicyclic: heterocyclic compounds And mixtures thereof.
(Carbon-carbon double bond of component (A))
The bonding position of the carbon-carbon double bond having reactivity with the SiH group is not particularly limited, and may be present anywhere in the molecule.

(A) Although it does not specifically limit as a carbon-carbon double bond reactive with SiH group of a component, The following general formula (I)

（式中Ｒ^１は水素原子あるいはメチル基を表す。）で示される基が反応性の点から好適である。また、原料の入手の容易さからは、

A group represented by the formula (wherein R ¹ represents a hydrogen atom or a methyl group) is preferred from the viewpoint of reactivity. In addition, from the availability of raw materials,

で示される基が特に好ましい。

Is particularly preferred.

As the carbon-carbon double bond having reactivity with the SiH group of the component (A), the following general formula (II)

（式中Ｒ^２は水素原子あるいはメチル基を表す。）で示される脂環式の基が、硬化物の耐熱性が高いという点から好適である。また、原料の入手の容易さからは、

An alicyclic group represented by the formula (wherein R ² represents a hydrogen atom or a methyl group) is preferred from the viewpoint that the heat resistance of the cured product is high. In addition, from the availability of raw materials,

で示される脂環式の基が特に好ましい。
（（Ａ）成分の炭素−炭素二重結合と骨格の結合基）
ＳｉＨ基と反応性を有する炭素−炭素二重結合は（Ａ）成分の骨格部分に直接結合していてもよく、２価以上の置換基を介して共有結合していても良い。２価以上の置換基としては炭素数０〜１０の置換基であれば特に限定されないが、構成元素としてＣ、Ｈ、Ｎ、Ｏ、Ｓ、およびハロゲン以外の元素を含まないものが好ましい。これらの置換基の例としては、

The alicyclic group represented by is particularly preferable.
((A) Component carbon-carbon double bond and skeleton bond group)
The carbon-carbon double bond having reactivity with the SiH group may be directly bonded to the skeleton portion of the component (A) or may be covalently bonded via a divalent or higher valent substituent. The divalent or higher valent substituent is not particularly limited as long as it is a substituent having 0 to 10 carbon atoms, but preferably does not contain elements other than C, H, N, O, S and halogen as constituent elements. Examples of these substituents include

が挙げられる。また、これらの２価以上の置換基の２つ以上が共有結合によりつながって１つの２価以上の置換基を構成していてもよい。

Is mentioned. Moreover, two or more of these divalent or higher valent substituents may be connected by a covalent bond to constitute one divalent or higher valent substituent.

Examples of the group covalently bonded to the skeleton as described above include vinyl group, allyl group, methallyl group, acrylic group, methacryl group, 2-hydroxy-3- (allyloxy) propyl group, 2-allylphenyl group, 3 -Allylphenyl group, 4-allylphenyl group, 2- (allyloxy) phenyl group, 3- (allyloxy) phenyl group, 4- (allyloxy) phenyl group, 2- (allyloxy) ethyl group, 2,2-bis (allyl) Oxymethyl) butyl group, 3-allyloxy-2, 2-bis (allyloxymethyl) propyl group,

が挙げられる。
（（Ａ）成分の具体例）
有機重合体系の（Ａ）成分の具体的な例としては、１，２−ポリブタジエン（１、２比率１０〜１００％のもの、好ましくは１、２比率５０〜１００％のもの）、ノボラックフェノールのアリルエーテル、アリル化ポリフェニレンオキサイド、

Is mentioned.
(Specific examples of component (A))
Specific examples of the component (A) of the organic polymer system include 1,2-polybutadiene (1,2 ratio of 10 to 100%, preferably 1,2 ratio of 50 to 100%), novolak phenol Allyl ether, allylated polyphenylene oxide,

（式中、Ｒ^１はＨまたはＣＨ_３、Ｒ^２、Ｒ^３は構成元素としてＣ、Ｈ、Ｎ、Ｏ、Ｓ、ハロゲン以外の元素を含まない炭素数１〜６の２価の有機基、Ｘ、Ｙは炭素数０〜１０の２価の置換基、ｎ、ｍ、ｌは１〜３００の数を表す。）

(Wherein R ¹ is H or CH ₃ , R ² , R ³ is a C 1 -C 6 divalent organic group containing no elements other than C, H, N, O, S and halogen as constituent elements, X and Y are divalent substituents having 0 to 10 carbon atoms, and n, m, and l are numbers 1 to 300.)

（式中、Ｒ^１はＨまたはＣＨ_３、Ｒ^４、Ｒ^５は炭素数１〜６の２価の有機基、Ｘ、Ｙは炭素数０〜１０の２価の置換基、ｎ、ｍ、ｌは１〜３００の数を表す。）

(In the formula, R ¹ is H or CH ₃ , R ⁴ , R ⁵ is a divalent organic group having 1 to 6 carbon atoms, X and Y are divalent substituents having 0 to 10 carbon atoms, n, m, l represents a number from 1 to 300.)

（式中、Ｒ^１はＨまたはＣＨ_３、Ｒ^６、Ｒ^７は炭素数１〜２０の２価の有機基、Ｘ、Ｙは炭素数０〜１０の２価の置換基、ｎ、ｍ、ｌは１〜３００の数を表す。）

Wherein R ¹ is H or CH ₃ , R ⁶ , R ⁷ is a divalent organic group having 1 to 20 carbon atoms, X and Y are divalent substituents having 0 to 10 carbon atoms, n, m, l represents a number from 1 to 300.)

（式中、Ｒ^１はＨまたはＣＨ_３、Ｒ^８、Ｒ^９は炭素数１〜６の２価の有機基、Ｘ、Ｙは炭素数０〜１０の２価の置換基、ｎ、ｍ、ｌは１〜３００の数を表す。）

Wherein R ¹ is H or CH ₃ , R ⁸ , R ⁹ is a divalent organic group having 1 to 6 carbon atoms, X and Y are divalent substituents having 0 to 10 carbon atoms, n, m, l represents a number from 1 to 300.)

（式中、Ｒ^１はＨまたはＣＨ_３、Ｒ^１０、Ｒ^１１、Ｒ^１２は炭素数１〜６の２価の有機基、Ｘ、Ｙは炭素数０〜１０の２価の置換基、ｎ、ｍ、ｌ、ｐは１〜３００の数を表す。）
等が挙げられる。

(Wherein R ¹ is H or CH ₃ , R ¹⁰ , R ¹¹ , R ¹² is a divalent organic group having 1 to 6 carbon atoms, X and Y are divalent substituents having 0 to 10 carbon atoms, n , M, l, and p represent numbers from 1 to 300.)
Etc.

Specific examples of the organic monomer component (A) include diallyl phthalate, triallyl trimellitate, diethylene glycol bisallyl carbonate, trimethylolpropane diallyl ether, pentaerythritol triallyl ether, 1,1,2,2 , -Tetraallyloxyethane, diarylidenepentaerythritol, triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinylcyclohexane, divinylbenzenes (having a purity of 50 to 100%, preferably a purity of 80 ˜100%), divinylbiphenyl, 1,3-diisopropenylbenzene, 1,4-diisopropenylbenzene, and oligomers thereof,

の他、従来公知のエポキシ樹脂のグルシジル基の一部あるいは全部をアリル基に置き換えたもの等が挙げられる。

In addition, there may be mentioned those in which part or all of the glycidyl group of a conventionally known epoxy resin is replaced with an allyl group.

As the component (A), low molecular weight compounds that are difficult to express separately as described above for the skeleton portion and the alkenyl group can also be used. Specific examples of these low molecular weight compounds include aliphatic chain polyene compound systems such as butadiene, isoprene, octadiene and decadiene, fats such as cyclopentadiene, cyclohexadiene, cyclooctadiene, dicyclopentadiene, tricyclopentadiene and norbornadiene. Examples thereof include aromatic cyclic polyene compound systems and substituted aliphatic cyclic olefin compound systems such as vinylcyclopentene and vinylcyclohexene.
(Preferred requirements for component (A))
The component (A) preferably contains 0.001 mol or more of a carbon-carbon double bond having reactivity with the SiH group per 1 g of the component (A) from the viewpoint of further improving the heat resistance. What contains 0.005 mol or more per is more preferable, and what contains 0.008 mol or more is still more preferable.

The number of carbon-carbon double bonds having reactivity with the SiH group of component (A) should be on average at least two per molecule, but may exceed 2 if it is desired to further improve the mechanical strength. Preferably, it is 3 or more. When the number of carbon-carbon double bonds having reactivity with the SiH group of component (A) is 1 or less per molecule, only a graft structure is formed even if it reacts with component (B). Don't be.

From the viewpoint of good reactivity as the component (A), it is preferable that one or more vinyl groups are contained in one molecule, and two or more vinyl groups are contained in one molecule. Is more preferable. Further, from the viewpoint that the storage stability tends to be good, it is preferable that 6 or less vinyl groups are contained in one molecule, and it is more preferable that 4 or less vinyl groups are contained in one molecule.

The component (A) preferably has a molecular weight of less than 900, preferably less than 700, from the viewpoint of high mechanical heat resistance and from the viewpoint of low formability of the raw material liquid and good moldability and handleability. More preferably, those less than 500 are more preferable.

As the component (A), in order to obtain uniform mixing with other components and good workability, the viscosity is preferably less than 1000 poise at 23 ° C., more preferably less than 300 poise, More preferred is less than 30 poise. The viscosity can be measured with an E-type viscometer.

As the component (A), those having a low content of a compound having a phenolic hydroxyl group and / or a derivative of a phenolic hydroxyl group are preferable from the viewpoint of higher light resistance. A phenolic hydroxyl group and / or a derivative of a phenolic hydroxyl group is preferable. What does not contain the compound which has is preferable. In the present invention, the phenolic hydroxyl group means a hydroxyl group directly bonded to an aromatic hydrocarbon nucleus exemplified by a benzene ring, naphthalene ring, anthracene ring, etc., and a phenolic hydroxyl group derivative means a hydrogen atom of the above-mentioned phenolic hydroxyl group. A group substituted by an alkyl group such as a methyl group or an ethyl group, an alkenyl group such as a vinyl group or an allyl group, an acyl group such as an acetoxy group, or the like.

Further, from the viewpoint of particularly good light resistance, the weight ratio of the component (A) in the aromatic ring is preferably 50% by weight or less, more preferably 40% by weight or less, and more preferably 30% by weight. The following are more preferable. Most preferred are those that do not contain an aromatic hydrocarbon ring.

From the viewpoint that the obtained cured product is less colored and has high light resistance, the component (A) is vinylcyclohexene, dicyclopentadiene, triallyl isocyanurate, diallyl of 2,2-bis (4-hydroxycyclohexyl) propane. Ether and 1,2,4-trivinylcyclohexane are preferable, and triallyl isocyanurate, diallyl ether of 2,2-bis (4-hydroxycyclohexyl) propane, and 1,2,4-trivinylcyclohexane are particularly preferable.
(Preferred structure 1 of component (A))
As the component (A), from the viewpoint of particularly high heat resistance and light resistance, the following general formula (III)

（式中Ｒ^１は炭素数１〜５０の一価の有機基を表し、それぞれのＲ^１は異なっていても同一であってもよい。）で表される化合物が好ましい。

(Wherein R ¹ represents a monovalent organic group having 1 to 50 carbon atoms, and each R ¹ may be different or the same).

As R < ¹ > of the said general formula (III), it is preferable that it is a C1-C20 monovalent organic group from a viewpoint that the heat resistance of the hardened | cured material obtained may become higher, and C1-C1 10 monovalent organic groups are more preferable, and monovalent organic groups having 1 to 4 carbon atoms are more preferable. Examples of these preferable R ¹ are methyl group, ethyl group, propyl group, butyl group, phenyl group, benzyl group, phenethyl group, vinyl group, allyl group, glycidyl group,

等が挙げられる。

Etc.

R ^{1 in the} above general formula (III) includes three R ¹ from the viewpoint that the adhesiveness between the package and the lead frame or the sealant can be improved, or the mechanical strength of the resulting package can be increased. It is preferable that at least one of them is a monovalent organic group having 1 to 50 carbon atoms including one or more epoxy groups,

で表されるエポキシ基を１個以上含む炭素数１〜５０の一価の有機基であることがより好ましい。これらの好ましいＲ^１の例としては、グリシジル基、

It is more preferable that it is a C1-C50 monovalent organic group containing 1 or more of epoxy groups represented by these. Examples of these preferred R ¹ include a glycidyl group,

等が挙げられる。

Etc.

R ^{1 in the} general formula (III) is a carbon containing 2 or less oxygen atoms and containing only C, H, and O as constituent elements from the viewpoint that the heat resistance of the resulting cured product can be improved. A monovalent organic group having 1 to 50 carbon atoms is preferable, and a monovalent hydrocarbon group having 1 to 50 carbon atoms is more preferable. Examples of these preferable R ¹ are methyl group, ethyl group, propyl group, butyl group, phenyl group, benzyl group, phenethyl group, vinyl group, allyl group, glycidyl group,

等が挙げられる。

Etc.

R ^{1 in the} general formula (III) is at least one of three R ¹ from the viewpoint of improving the reactivity.

で表される基を１個以上含む炭素数１〜５０の一価の有機基であることが好ましく、下記一般式（ＩＶ）

It is preferable that it is a C1-C50 monovalent organic group containing 1 or more groups represented by general formula (IV) below.

（式中Ｒ^２は水素原子あるいはメチル基を表す。）で表される基を１個以上含む炭素数１〜５０の一価の有機基であることがより好ましく、
３つのＲ^１のうち少なくとも２つが下記一般式（Ｖ）

(Wherein R ² represents a hydrogen atom or a methyl group) is more preferably a monovalent organic group having 1 to 50 carbon atoms and containing at least one group represented by:
At least two of the three R ¹ are represented by the following general formula (V)

（式中Ｒ^３は直接結合あるいは炭素数１〜４８の二価の有機基を表し、Ｒ^４は水素原子あるいはメチル基を表す。）で表される有機化合物（複数のＲ^３およびＲ^４はそれぞれ異なっていても同一であってもよい。）であることがさらに好ましい。

(Wherein R ³ represents a direct bond or a divalent organic group having 1 to 48 carbon atoms, and R ⁴ represents a hydrogen atom or a methyl group) (a plurality of R ³ and R ⁴ are More preferably, they may be the same or different.

R ^{3 in the} general formula (V) is a direct bond or a divalent organic group having 1 to 48 carbon atoms. From the viewpoint that the heat resistance of the resulting package can be further increased, the direct bond or the carbon number It is preferably a divalent organic group having 1 to 20, more preferably a direct bond or a divalent organic group having 1 to 10 carbon atoms, and a direct bond or a divalent organic group having 1 to 4 carbon atoms. More preferably. Examples of these preferred R ³ include

等が挙げられる。

Etc.

As R ^{3 in the} general formula (V), from the viewpoint that the heat resistance of the resulting package can be improved, only C, H, or O is included as a constituent element including a direct bond or two or less oxygen atoms. A divalent organic group having 1 to 48 carbon atoms is preferable, and a direct bond or a divalent hydrocarbon group having 1 to 48 carbon atoms is more preferable. Examples of these preferred R ³ include

が挙げられる。

Is mentioned.

R ^{4 in the} general formula (V) is a hydrogen atom or a methyl group, and a hydrogen atom is preferable from the viewpoint of good reactivity.

However, in the preferred examples of the organic compound represented by the general formula (III) as described above, it is necessary to contain at least two carbon-carbon double bonds having reactivity with the SiH group in one molecule. is there. From the viewpoint that heat resistance can be further improved, an organic compound containing three or more carbon-carbon double bonds having reactivity with SiH groups in one molecule is more preferable.

Preferable specific examples of the organic compound represented by the general formula (III) as described above include triallyl isocyanurate,

等が挙げられる。
（（Ａ）成分の好ましい構造２）
また、（Ｂ）成分と良好な相溶性を有するという観点、および（Ａ）成分の揮発性が低くなり、得られるパッケージからのアウトガスの問題が生じ難いという観点からは、（Ａ）成分の例として上記したような、ＳｉＨ基と反応性を有する炭素−炭素二重結合を１分子中に少なくとも２個含有する有機化合物から選ばれた１種以上の化合物と、ＳｉＨ基を有する鎖状及び／又は環状オルガノポリシロキサン（β）との反応物も好ましい。
（（β）成分）
（β）成分は、ＳｉＨ基を有する鎖状及び／又は環状のポリオルガノシロキサンである。

Etc.
(Preferred structure 2 of component (A))
In addition, from the viewpoint of having good compatibility with the component (B), and from the viewpoint that the volatility of the component (A) is low and the problem of outgas from the resulting package is less likely to occur, examples of the component (A) As described above, one or more compounds selected from organic compounds containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule, a chain having SiH groups, and / or Alternatively, a reaction product with the cyclic organopolysiloxane (β) is also preferable.
((Β) component)
The (β) component is a linear and / or cyclic polyorganosiloxane having a SiH group.

Specifically, for example

が挙げられる。

Is mentioned.

Here, from the viewpoint that compatibility with an organic compound containing at least two carbon-carbon double bonds having reactivity with the SiH group in one molecule is likely to be improved, the following general formula (VI)

（式中、Ｒ^１は炭素数１〜６の有機基を表し、ｎは３〜１０の数を表す。）で表される、１分子中に少なくとも３個のＳｉＨ基を有する環状ポリオルガノシロキサンが好ましい。

(Wherein R ¹ represents an organic group having 1 to 6 carbon atoms, and n represents a number of 3 to 10). Cyclic polyorganosiloxane having at least 3 SiH groups in one molecule. Is preferred.

The substituent R ¹ in the compound represented by the general formula (VI) preferably contains no constituent elements other than C, H and O, more preferably a hydrocarbon group, and a methyl group. Further preferred.

In view of availability, 1,3,5,7-tetramethylcyclotetrasiloxane is preferable.

Various (β) components as described above can be used alone or in admixture of two or more.
(Reaction of an organic compound containing at least two carbon-carbon double bonds having reactivity with SiH group in one molecule and (β) component)
Next, as component (A) of the present invention, an organic compound containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule and (β) component are obtained by hydrosilylation reaction. The hydrosilylation reaction between an organic compound containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule and the (β) component in the case of using a compound capable of reacting with SiH will be described.

A hydrosilylation reaction of an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in one molecule and the (β) component results in a plurality of compounds containing the component (A) of the present invention. However, the curable composition of the present invention can be prepared by using the mixture as it is without separating the component (A).

Carbon-carbon double having reactivity with SiH group when hydrosilylation reaction of organic compound containing at least two carbon-carbon double bonds reactive with SiH group in one molecule and (β) component The mixing ratio of the organic compound containing at least two bonds in one molecule and the (β) component is not particularly limited, but generally is reactive with the SiH group to be mixed in that gelation during the reaction can be suppressed. In the (β) component to be mixed with the total number (X) of carbon-carbon double bonds having reactivity with SiH groups in an organic compound containing at least two carbon-carbon double bonds in one molecule The ratio of the total number of SiH groups (Y) is preferably X / Y ≧ 2, more preferably X / Y ≧ 3. Moreover, it is preferable that it is 10> = X / Y from the point that compatibility with (B) component of (A) component becomes easy, and it is more preferable that it is 5> = X / Y.

In the case of hydrosilylation reaction of an organic compound containing at least two carbon-carbon double bonds having reactivity with SiH group in one molecule and the (β) component, an appropriate catalyst may be used. As the catalyst, for example, the following can be used. Platinum simple substance, alumina, silica, carbon black or the like supported on solid platinum, chloroplatinic acid, a complex of chloroplatinic acid and alcohol, aldehyde, ketone or the like, platinum-olefin complex (for example, Pt (CH _{2 = CH 2) 2 (PPh} 3) 2, Pt (CH 2 = CH 2) 2 Cl 2), platinum - vinylsiloxane complex _{(e.g., Pt (ViMe 2 SiOSiMe 2 Vi} ) n, Pt [(MeViSiO) 4] _m ), a platinum-phosphine complex (eg, Pt (PPh ₃ ) ₄ , Pt (PBu ₃ ) ₄ ), a platinum-phosphite complex (eg, Pt [P (OPh) ₃ ] ₄ , Pt [P (OBu) ₃ ] ₄₎ (in the formula, Me represents a methyl group, Bu a butyl group, Vi is vinyl group, Ph represents a phenyl group, n, m is an integer.), Jikaruboni Dichloroplatinum, Karstedt catalyst, and the platinum-hydrocarbon complexes described in Ashby US Pat. Nos. 3,159,601 and 3,159,622, and Lamoreaux, US Pat. No. 3,220,972. Examples include platinum alcoholate catalysts described in the text. In addition, platinum chloride-olefin complexes described in Modic US Pat. No. 3,516,946 are also useful in the present invention.

Examples of catalysts other than platinum compounds include RhCl (PPh) ₃ , RhCl ₃ , RhAl ₂ O ₃ , RuCl ₃ , IrCl ₃ , FeCl ₃ , AlCl ₃ , PdCl ₂ .2H ₂ O, NiCl ₂ , TiCl _4. , Etc.

Of these, chloroplatinic acid, platinum-olefin complexes, platinum-vinylsiloxane complexes and the like are preferable from the viewpoint of catalytic activity. Moreover, these catalysts may be used independently and may be used together 2 or more types.

The addition amount of the catalyst is not particularly limited, but the lower limit of the preferred addition amount is sufficient with respect to 1 mole of SiH group of the (β) component in order to have sufficient curability and keep the cost of the curable composition relatively low. 10 ^-8 mol, more preferably ^{10 -6} mole, preferable amount of the upper limit is ^{10 -1} moles per mole of the SiH group (beta) component, more preferably ^{10 -2} moles.

In addition, a cocatalyst can be used in combination with the above catalyst. Examples thereof include phosphorus compounds such as triphenylphosphine, 1,2-diester compounds such as dimethyl maleate, 2-hydroxy-2-methyl-1 -Acetylene alcohol compounds such as butyne, sulfur compounds such as simple sulfur, amine compounds such as triethylamine, and the like. The addition amount of the cocatalyst is not particularly limited, but the lower limit of the preferable addition amount relative to 1 mol of the hydrosilylation catalyst is 10 ⁻² mol, more preferably 10 ⁻¹ mol, and the upper limit of the preferable addition amount is 10 ^2. Mol, more preferably 10 mol.

Various methods can be used as a method of mixing the organic compound containing at least two carbon-carbon double bonds reactive with the SiH group in the case of reaction, the (β) component, and the catalyst. However, a method in which a catalyst is mixed with an organic compound containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule and (β) component is mixed. If the catalyst is mixed with a mixture of an organic compound containing at least two carbon-carbon double bonds having reactivity with the SiH group in one molecule and the (β) component, it is difficult to control the reaction. In the case of adopting a method of mixing an organic compound containing at least two carbon-carbon double bonds having reactivity with SiH groups into a mixture of component (β) and a catalyst, in the presence of the catalyst ( Since β) is reactive with moisture mixed therein, it may be altered.

The reaction temperature can be variously set. In this case, the lower limit of the preferable temperature range is 30 ° C., more preferably 50 ° C., and the upper limit of the preferable temperature range is 200 ° C., more preferably 150 ° C. If the reaction temperature is low, the reaction time for sufficiently reacting becomes long, and if the reaction temperature is high, it is not practical. The reaction may be carried out at a constant temperature, but the temperature may be changed in multiple steps or continuously as required.

Various reaction times and pressures during the reaction can be set as required.

A solvent may be used during the hydrosilylation reaction. Solvents that can be used are not particularly limited as long as they do not inhibit the hydrosilylation reaction. Specifically, hydrocarbon solvents such as benzene, toluene, hexane, heptane, tetrahydrofuran, 1,4-dioxane, 1, Ether solvents such as 3-dioxolane and diethyl ether, ketone solvents such as acetone and methyl ethyl ketone, and halogen solvents such as chloroform, methylene chloride and 1,2-dichloroethane can be preferably used. The solvent can also be used as a mixed solvent of two or more types. As the solvent, toluene, tetrahydrofuran, 1,3-dioxolane and chloroform are preferable. The amount of solvent to be used can also be set as appropriate.

In addition, various additives may be used for the purpose of controlling reactivity.

After reacting (β) component with an organic compound containing at least two carbon-carbon double bonds reactive with SiH group in one molecule, it has reactivity with solvent and / or unreacted SiH group Organic compounds containing at least two carbon-carbon double bonds per molecule and / or (β) component can also be removed. By removing these volatile components, the obtained component (A) does not have a volatile component, so that in the case of curing with the component (B), problems of voids and cracks due to the volatilization of the volatile components are less likely to occur. Examples of the removal method include treatment with activated carbon, aluminum silicate, silica gel and the like in addition to vacuum devolatilization. When devolatilizing under reduced pressure, it is preferable to treat at a low temperature. The upper limit of the preferable temperature in this case is 100 ° C, more preferably 60 ° C. When treated at high temperatures, it tends to be accompanied by alterations such as thickening.

Examples of the component (A) which is a reaction product of the organic compound containing at least two carbon-carbon double bonds having reactivity with the SiH group in one molecule and the component (β) are bisphenol. A reaction product of diallyl ether and 1,3,5,7-tetramethylcyclotetrasiloxane, reaction product of vinylcyclohexene and 1,3,5,7-tetramethylcyclotetrasiloxane, divinylbenzene and 1,3,5, Reaction product of 7-tetramethylcyclotetrasiloxane, reaction product of dicyclopentadiene and 1,3,5,7-tetramethylcyclotetrasiloxane, triallyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane Reaction of diallyl monoglycidyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane Applied Physics, etc. can be mentioned.
(Other reactive groups of component (A))
(A) As a component, you may have another reactive group. Examples of the reactive group in this case include an epoxy group, an amino group, a radical polymerizable unsaturated group, a carboxyl group, an isocyanate group, a hydroxyl group, and an alkoxysilyl group. When it has these functional groups, the adhesiveness of the resulting curable composition tends to be high, and the strength of the resulting cured product tends to be high. Of these functional groups, an epoxy group is preferable from the viewpoint that the adhesiveness can be further increased. Moreover, it is preferable to have 1 or more reactive groups in one molecule on average from the point that the heat resistance of the obtained cured product tends to be high.
(Mixing of component (A))
(A) component can be used individually or in mixture of 2 or more types.
(B component)
Next, the compound which has SiH group which is (B) component is demonstrated.

The component (B) of the present invention is a compound containing at least two SiH groups in one molecule.

The component (B) is not particularly limited as long as it is a compound containing at least two SiH groups in one molecule. For example, the compound described in International Publication WO 96/15194 is at least two SiH groups in one molecule. Those having a group can be used.

Among these, from the viewpoint of availability, a chain and / or cyclic organopolysiloxane having at least two SiH groups in one molecule is preferable, and from the viewpoint of good compatibility with the component (A), Furthermore, the following general formula (VI)

（式中、Ｒ^１は炭素数１〜６の有機基を表し、ｎは３〜１０の数を表す。）で表される、１分子中に少なくとも２個のＳｉＨ基を有する環状オルガノポリシロキサンが好ましい。

(Wherein R ¹ represents an organic group having 1 to 6 carbon atoms, and n represents a number of 3 to 10). Cyclic organopolysiloxane having at least two SiH groups in one molecule. Is preferred.

The substituent R ¹ in the compound represented by the general formula (VI) is preferably composed of C, H and O, more preferably a hydrocarbon group, and a methyl group. Further preferred.

From the viewpoint of availability, the compound represented by the general formula (VI) is preferably 1,3,5,7-tetramethylcyclotetrasiloxane.

The molecular weight of the component (B) is not particularly limited and any one can be suitably used, but a low molecular weight is preferably used from the viewpoint of easier expression of fluidity. In this case, the lower limit of the preferred molecular weight is 50, and the upper limit of the preferred molecular weight is 100,000, more preferably 1,000, and still more preferably 700.

Component (B) can be used alone or in combination of two or more.
(Preferred structure of component (B))
From the viewpoint of having good compatibility with the component (A), and from the viewpoint that the problem of outgas from the composition that can reduce the volatility of the component (B) is less likely to occur, the component (B) is a SiH group. An organic compound (α) containing at least one carbon-carbon double bond having reactivity with one molecule, and a linear and / or cyclic polyorganosiloxane having at least two SiH groups in one molecule (Β) is preferably a compound that can be obtained by a hydrosilylation reaction.
((Α) component)
Here, the component (α) is the component (A) described above, and the same component (α1) as the organic compound containing at least two carbon-carbon double bonds reactive with the SiH group in one molecule is used. Can do. When the component (α1) is used, the resulting cured product has a high crosslink density and tends to be a cured product having high mechanical strength.

In addition, an organic compound (α2) containing one carbon-carbon double bond having reactivity with the SiH group in one molecule can also be used. When the (α2) component is used, the obtained cured product tends to have low elasticity.
((Α2) component)
The component (α2) is not particularly limited as long as it is an organic compound containing one carbon-carbon double bond having reactivity with the SiH group in one molecule, but the component (B) is in phase with the component (A). In terms of improved solubility, the compound does not contain a siloxane unit (Si—O—Si) such as a polysiloxane-organic block copolymer or polysiloxane-organic graft copolymer, and C, H, N as constituent elements. , O, S, and halogen are preferred.

The bonding position of the carbon-carbon double bond having reactivity with the SiH group of the (α2) component is not particularly limited and may be present anywhere in the molecule.

The (α2) component compound can be classified into a polymer compound and a monomer compound.

Examples of the polymer compound include polysiloxane, polyether, polyester, polyarylate, polycarbonate, saturated hydrocarbon, unsaturated hydrocarbon, polyacrylate ester, polyamide, phenol-formaldehyde ( Phenol resin type) and polyimide type compounds can be used.

Examples of monomer compounds include aromatic hydrocarbons such as phenols, bisphenols, benzene, and naphthalene: aliphatic hydrocarbons such as straight-chain and alicyclics: heterocyclic compounds, and silicon-based compounds. Examples thereof include compounds and mixtures thereof.

Although it does not specifically limit as a carbon-carbon double bond which has the reactivity with SiH group of ((alpha) 2) component, The following general formula (I)

（式中Ｒ^１は水素原子あるいはメチル基を表す。）で示される基が反応性の点から好適である。また、原料の入手の容易さからは、

A group represented by the formula (wherein R ¹ represents a hydrogen atom or a methyl group) is preferred from the viewpoint of reactivity. In addition, from the availability of raw materials,

で示される基が特に好ましい。

Is particularly preferred.

As the carbon-carbon double bond having reactivity with the SiH group of the component (α2), the following general formula (II)

（式中Ｒ^２は水素原子あるいはメチル基を表す。）で示される脂環式の基が、硬化物の耐熱性が高いという点から好適である。また、原料の入手の容易さからは、

An alicyclic group represented by the formula (wherein R ² represents a hydrogen atom or a methyl group) is preferred from the viewpoint that the heat resistance of the cured product is high. In addition, from the availability of raw materials,

で示される脂環式の基が特に好ましい。

The alicyclic group represented by is particularly preferable.

The carbon-carbon double bond having reactivity with the SiH group may be directly bonded to the skeleton portion of the (α2) component, or may be covalently bonded via a divalent or higher substituent. The divalent or higher valent substituent is not particularly limited as long as it is a substituent having 0 to 10 carbon atoms. However, in terms that the component (B) is easily compatible with the component (A), C, Those containing only H, N, O, S and halogen are preferred. Examples of these substituents include

が挙げられる。また、これらの２価以上の置換基の２つ以上が共有結合によりつながって１つの２価以上の置換基を構成していてもよい。

Is mentioned. Moreover, two or more of these divalent or higher valent substituents may be connected by a covalent bond to constitute one divalent or higher valent substituent.

Examples of the group covalently bonded to the skeleton as described above include vinyl group, allyl group, methallyl group, acrylic group, methacryl group, 2-hydroxy-3- (allyloxy) propyl group, 2-allylphenyl group, 3 -Allylphenyl group, 4-allylphenyl group, 2- (allyloxy) phenyl group, 3- (allyloxy) phenyl group, 4- (allyloxy) phenyl group, 2- (allyloxy) ethyl group, 2,2-bis (allyl) Oxymethyl) butyl group, 3-allyloxy-2, 2-bis (allyloxymethyl) propyl group,

が挙げられる。

Is mentioned.

Specific examples of the component (α2) include propene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene, 1-dodecene, 1-undecene, Idemitsu Petrochemical's linearene, 4,4-dimethyl-1-pentene, 2-methyl-1-hexene, 2,3,3-trimethyl-1-butene, 2,4,4-trimethyl-1-pentene, etc. Chain aliphatic hydrocarbon compounds such as cyclohexene, methylcyclohexene, methylenecyclohexane, norbornylene, ethylidenecyclohexane, vinylcyclohexane, camphene, carene, α-pinene, β-pinene and the like, Styrene, α-methylstyrene, indene, phenylacetylene, 4-ethynyltoluene, allylbenzene, 4- Aromatic hydrocarbon compounds such as phenyl-1-butene, allyl ethers such as alkyl allyl ether and allyl phenyl ether, glycerin monoallyl ether, ethylene glycol monoallyl ether, 4-vinyl-1,3-dioxolane- Substitution of aliphatic compounds such as 2-one, aromatic compounds such as 1,2-dimethoxy-4-allylbenzene, o-allylphenol, monoallyl dibenzyl isocyanurate, monoallyl diglycidyl isocyanurate, etc. Examples include isocyanurates, silicon compounds such as vinyltrimethylsilane, vinyltrimethoxysilane, and vinyltriphenylsilane. Furthermore, polyether resins such as one-end allylated polyethylene oxide and one-end allylated polypropylene oxide, hydrocarbon resins such as one-end allylated polyisobutylene, one-end allylated polybutyl acrylate, one-end allylated polymethyl methacrylate Examples thereof also include polymers or oligomers having a vinyl group at one end, such as acrylic resins.

The structure of the (α2) component may be linear or branched, and the molecular weight is not particularly limited, and various types can be used. The molecular weight distribution is not particularly limited, but the molecular weight distribution is preferably 3 or less, more preferably 2 or less, and more preferably 1.5 or less in that the viscosity of the mixture is low and the moldability is likely to be good. More preferably it is.

In the case where the glass transition temperature of the component (α2) is present, there is no particular limitation on this, and various materials are used. However, the glass point transfer temperature is 100 ° C. or lower in that the obtained cured product tends to be tough. Preferably, it is 50 ° C. or lower, and more preferably 0 ° C. or lower. Examples of preferred resins include polybutyl acrylate resins. Conversely, the glass transition temperature is preferably 100 ° C. or higher, more preferably 120 ° C. or higher, further preferably 150 ° C. or higher, in that the heat resistance of the cured product obtained is increased. Most preferably, it is 170 ° C. or higher. The glass transition temperature can be determined as a temperature at which tan δ exhibits a maximum in the dynamic viscoelasticity measurement.

The component (α2) is preferably a hydrocarbon compound in that the heat resistance of the resulting cured product is increased. In this case, the preferable lower limit of the carbon number is 7, and the preferable upper limit of the carbon number is 10.

The component (α2) may have other reactive groups. Examples of the reactive group in this case include an epoxy group, an amino group, a radical polymerizable unsaturated group, a carboxyl group, an isocyanate group, a hydroxyl group, and an alkoxysilyl group. When it has these functional groups, the adhesiveness of the resulting curable composition tends to be high, and the strength of the resulting cured product tends to be high. Of these functional groups, an epoxy group is preferable from the viewpoint that the adhesiveness can be further increased. Moreover, it is preferable to have 1 or more reactive groups in one molecule on average from the point that the heat resistance of the obtained cured product tends to be high. Specific examples include monoallyl diglycidyl isocyanurate, allyl glycidyl ether, allyloxyethyl methacrylate, allyloxyethyl acrylate, vinyltrimethoxysilane, and the like.

As the above (α1) component and / or (α2) component, a single component may be used, or a plurality of components may be used in combination.
((Β) component)
The component (β) is a linear and / or cyclic polyorganosiloxane having at least two SiH groups in one molecule.

Specifically, for example

が挙げられる。

Is mentioned.

Here, from the viewpoint of easy compatibility with the component (α), the following general formula (VI)

（式中、Ｒ^１は炭素数１〜６の有機基を表し、ｎは３〜１０の数を表す。）で表される、１分子中に少なくとも３個のＳｉＨ基を有する環状ポリオルガノシロキサンが好ましい。

(Wherein R ¹ represents an organic group having 1 to 6 carbon atoms, and n represents a number of 3 to 10). Cyclic polyorganosiloxane having at least 3 SiH groups in one molecule. Is preferred.

Substituents R ¹ in the compound represented by the general formula (VI), C, H, is preferably those composed of O, more preferably a hydrocarbon group, a methyl group Further preferred.

In view of availability, 1,3,5,7-tetramethylcyclotetrasiloxane is preferable.

Various (β) components as described above can be used alone or in admixture of two or more.
(Reaction of (α) component and (β) component)
Next, hydrosilylation of (α) component and (β) component in the case of using a compound obtained by hydrosilylation reaction of (α) component and (β) component as component (B) of the present invention The reaction will be described.

In addition, when the (α) component and the (β) component are subjected to a hydrosilylation reaction, a mixture of a plurality of compounds containing the (B) component of the present invention may be obtained, but without separating the (B) component therefrom. The curable composition of the present invention can be prepared using the mixture as it is.

The mixing ratio of the (α) component and the (β) component when the (α) component and the (β) component are subjected to a hydrosilylation reaction is not particularly limited, but the hydrosilylation of the obtained (B) component and (A) component is not limited. In view of the strength of the cured product due to the above, since it is preferable that the component (B) has a larger amount of SiH groups, the total number of carbon-carbon double bonds having reactivity with the SiH groups in the component (α) to be mixed ( The ratio of X) to the total number of SiH groups (Y) in the (β) component to be mixed is preferably Y / X ≧ 2, and more preferably Y / X ≧ 3. Moreover, it is preferable that it is 10> = Y / X from the point that compatibility with the (A) component of (B) component becomes easy, and it is more preferable that it is 5> = Y / X.

When the (α) component and the (β) component are subjected to a hydrosilylation reaction, an appropriate catalyst may be used. As the catalyst, for example, the following can be used. Platinum simple substance, alumina, silica, carbon black or the like supported on solid platinum, chloroplatinic acid, a complex of chloroplatinic acid and alcohol, aldehyde, ketone or the like, platinum-olefin complex (for example, Pt (CH _{2 = CH 2) 2 (PPh} 3) 2, Pt (CH 2 = CH 2) 2 Cl 2), platinum - vinylsiloxane complex _{(e.g., Pt (ViMe 2 SiOSiMe 2 Vi} ) n, Pt [(MeViSiO) 4] _m ), a platinum-phosphine complex (eg, Pt (PPh ₃ ) ₄ , Pt (PBu ₃ ) ₄ ), a platinum-phosphite complex (eg, Pt [P (OPh) ₃ ] ₄ , Pt [P (OBu) ₃ ] ₄₎ (in the formula, Me represents a methyl group, Bu a butyl group, Vi is vinyl group, Ph represents a phenyl group, n, m is an integer.), Jikaruboni Dichloroplatinum, Karstedt catalyst, and the platinum-hydrocarbon complexes described in Ashby US Pat. Nos. 3,159,601 and 3,159,622, and Lamoreaux, US Pat. No. 3,220,972. Examples include platinum alcoholate catalysts described in the text. In addition, platinum chloride-olefin complexes described in Modic US Pat. No. 3,516,946 are also useful in the present invention.

Further, examples of catalysts other than platinum _{compounds, RhCl (PPh) 3, RhCl} 3, RhAl 2 O 3, RuCl 3, IrCl 3, FeCl 3, AlCl 3, PdCl 2 · 2H 2 O, NiCl 2, TiCl 4 , Etc.

Of these, chloroplatinic acid, platinum-olefin complexes, platinum-vinylsiloxane complexes and the like are preferable from the viewpoint of catalytic activity. Moreover, these catalysts may be used independently and may be used together 2 or more types.

The addition amount of the catalyst is not particularly limited, but the lower limit of the preferred addition amount is sufficient with respect to 1 mole of SiH group of the (β) component in order to have sufficient curability and keep the cost of the curable composition relatively low. 10 ^-8 mol, more preferably ^{10 -6} mole, preferable amount of the upper limit is ^{10 -1} moles per mole of the SiH group (beta) component, more preferably ^{10 -2} moles.

In addition, a cocatalyst can be used in combination with the above catalyst. Examples thereof include phosphorus compounds such as triphenylphosphine, 1,2-diester compounds such as dimethyl maleate, 2-hydroxy-2-methyl-1 -Acetylene alcohol compounds such as butyne, sulfur compounds such as simple sulfur, amine compounds such as triethylamine, and the like. The addition amount of the cocatalyst is not particularly limited, but the lower limit of the preferable addition amount relative to 1 mol of the hydrosilylation catalyst is 10 ⁻² mol, more preferably 10 ⁻¹ mol, and the upper limit of the preferable addition amount is 10 ^2. Mol, more preferably 10 mol.

Various methods can be used to mix the (α) component, (β) component, and catalyst in the reaction, but the (α) component mixed with the catalyst is mixed with the (β) component. Is preferred. If the catalyst is mixed with the mixture of the (α) component and the (β) component, it is difficult to control the reaction. When the method of mixing the (β) component with the mixture of the (β) component and the catalyst, the (β) component is reactive in the presence of the catalyst and may be altered due to its reactivity with water. .

The reaction temperature can be variously set. In this case, the lower limit of the preferable temperature range is 30 ° C., more preferably 50 ° C., and the upper limit of the preferable temperature range is 200 ° C., more preferably 150 ° C. If the reaction temperature is low, the reaction time for sufficiently reacting becomes long, and if the reaction temperature is high, it is not practical. The reaction may be carried out at a constant temperature, but the temperature may be changed in multiple steps or continuously as required.

Various reaction times and pressures during the reaction can be set as required.

A solvent may be used during the hydrosilylation reaction. Solvents that can be used are not particularly limited as long as they do not inhibit the hydrosilylation reaction. Specifically, hydrocarbon solvents such as benzene, toluene, hexane, heptane, tetrahydrofuran, 1,4-dioxane, 1, Ether solvents such as 3-dioxolane and diethyl ether, ketone solvents such as acetone and methyl ethyl ketone, and halogen solvents such as chloroform, methylene chloride and 1,2-dichloroethane can be preferably used. The solvent can also be used as a mixed solvent of two or more types. As the solvent, toluene, tetrahydrofuran, 1,3-dioxolane and chloroform are preferable. The amount of solvent to be used can also be set as appropriate.

In addition, various additives may be used for the purpose of controlling reactivity.

After reacting the (α) component and the (β) component, the solvent or / and the unreacted (α) component or / and the (β) component can be removed. By removing these volatile components, the component (B) obtained does not have volatile components, so that the problem of voids and cracks due to volatilization of the volatile components hardly occurs in the case of curing with the component (A). Examples of the removal method include treatment with activated carbon, aluminum silicate, silica gel and the like in addition to vacuum devolatilization. When devolatilizing under reduced pressure, it is preferable to treat at a low temperature. The upper limit of the preferable temperature in this case is 100 ° C, more preferably 60 ° C. When treated at high temperatures, it tends to be accompanied by alterations such as thickening.

Examples of the component (B) that is a reaction product of the component (α) and the component (β) as described above include a reaction product of bisphenol A diallyl ether and 1,3,5,7-tetramethylcyclotetrasiloxane, Reaction product of vinylcyclohexene and 1,3,5,7-tetramethylcyclotetrasiloxane, reaction product of divinylbenzene and 1,3,5,7-tetramethylcyclotetrasiloxane, dicyclopentadiene and 1,3,5, Reaction product of 7-tetramethylcyclotetrasiloxane, reaction product of triallyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane, diallyl monoglycidyl isocyanurate and 1,3,5,7-tetramethylcyclo Reactant of tetrasiloxane, allyl glycidyl ether and 1,3,5,7-tetramethylcyclotetrasilo A reaction product of xane, a reaction product of α-methylstyrene and 1,3,5,7-tetramethylcyclotetrasiloxane, a reaction product of monoallyldiglycidyl isocyanurate and 1,3,5,7-tetramethylcyclotetrasiloxane, Etc.
(Mixing of component (A) and component (B))
Regarding combinations of component (A) and component (B), various combinations of those listed as examples of component (A) and their various mixtures / examples of component (B) and their various mixtures are listed. be able to.

The mixing ratio of the component (A) and the component (B) is not particularly limited as long as the necessary strength is not lost, but the number of SiH groups in the component (B) (Y) is the carbon-carbon in the component (A). In the ratio to the number of double bonds (X), the lower limit of the preferred range is Y / X ≧ 0.3, more preferably Y / X ≧ 0.5, and even more preferably Y / X ≧ 0.7, which is preferable. The upper limit of the range is 3 ≧ Y / X, more preferably 2 ≧ Y / X, and even more preferably 1.5 ≧ Y / X. When it deviates from the preferred range, sufficient strength may not be obtained or thermal deterioration may easily occur.
((C) component)
Next, the hydrosilylation catalyst as component (C) will be described.

The hydrosilylation catalyst is not particularly limited as long as it has a catalytic activity for the hydrosilylation reaction. For example, a platinum simple substance, a support made of alumina, silica, carbon black or the like on which solid platinum is supported, chloroplatinic acid, platinum chloride Complexes of acids with alcohols, aldehydes, ketones, etc., platinum-olefin complexes (eg, Pt (CH ₂ ═CH ₂ ) ₂ (PPh ₃ ) ₂ , Pt (CH ₂ ═CH ₂ ) ₂ Cl ₂ ), platinum-vinyl Siloxane complexes (eg, Pt (ViMe ₂ SiOSiMe ₂ Vi) _n , Pt [(MeViSiO) ₄ ] _m ), platinum-phosphine complexes (eg, Pt (PPh ₃ ) ₄ , Pt (PBu ₃ ) ₄ ), platinum-phos Fight complexes _{(e.g., Pt [P (OPh) 3} ] 4, Pt [P (OBu) 3] 4) ( in the formula, Me represents a methyl group, u represents a butyl group, Vi represents a vinyl group, Ph represents a phenyl group, and n and m represent an integer.), dicarbonyldichloroplatinum, a Karstedt catalyst, and Ashby U.S. Pat. No. 3,159,601. And platinum-hydrocarbon complexes described in US Pat. No. 3,159,662 and platinum alcoholate catalysts described in Lamoreaux US Pat. No. 3,220,972. In addition, platinum chloride-olefin complexes described in Modic US Pat. No. 3,516,946 are also useful in the present invention.

Examples of catalysts other than platinum compounds include RhCl (PPh) ₃ , RhCl ₃ , RhAl ₂ O ₃ , RuCl ₃ , IrCl ₃ , FeCl ₃ , AlCl ₃ , PdCl ₂ .2H ₂ O, NiCl ₂ , TiCl _4. , Etc.

Of these, chloroplatinic acid, platinum-olefin complexes, platinum-vinylsiloxane complexes and the like are preferable from the viewpoint of catalytic activity. Moreover, these catalysts may be used independently and may be used together 2 or more types.

Although the addition amount of the catalyst is not particularly limited, the lower limit of the preferable addition amount is sufficient with respect to 1 mol of SiH groups of the component (B) in order to have sufficient curability and keep the cost of the curable composition relatively low. 10 ^-8 mol, more preferably ^{10 -6} mole, preferable amount of the upper limit is ^{10 -1} moles per mole of the SiH group (beta) component, more preferably ^{10 -2} moles.

In addition, a cocatalyst can be used in combination with the above catalyst. Examples thereof include phosphorus compounds such as triphenylphosphine, 1,2-diester compounds such as dimethyl maleate, 2-hydroxy-2-methyl-1 -Acetylene alcohol compounds such as butyne, sulfur compounds such as simple sulfur, amine compounds such as triethylamine, and the like. The addition amount of the co-catalyst is not particularly limited, the lower limit of the preferable amount of relative hydrosilylation catalyst 1 mole, 10 ^-2 mol, more preferably 10 ^-1 mol, the upper limit of the preferable amount is 10 ² Mol, more preferably 10 mol.
((D) component)
The component (D) of the present invention is an inorganic filler.

Various inorganic fillers are used. For example, silica-based inorganic fillers such as quartz, fumed silica, precipitated silica, silicic anhydride, fused silica, crystalline silica, and ultrafine powder amorphous silica, alumina, zircon , Titanium oxide, silicon nitride, boron nitride, aluminum nitride, silicon carbide, glass fiber, alumina fiber, carbon fiber, mica, graphite, carbon black, graphite, diatomaceous earth, white clay, clay, talc, aluminum hydroxide, calcium carbonate, Inorganic fillers generally used and / or proposed as fillers for conventional sealing materials such as epoxy-based materials, including inorganic fillers such as magnesium carbonate, barium sulfate, potassium titanate, calcium silicate, inorganic balloons, silver powder, etc. Etc. The inorganic filler is preferably low radiation from the viewpoint of hardly damaging the semiconductor element.

The inorganic filler may be appropriately surface treated. Examples of the surface treatment include alkylation treatment, trimethylsilylation treatment, silicone treatment, treatment with a coupling agent, and the like.

Examples of the coupling agent in this case include a silane coupling agent. The silane coupling agent is not particularly limited as long as it is a compound having at least one functional group reactive with an organic group and one hydrolyzable silicon group in the molecule. The group reactive with the organic group is preferably at least one functional group selected from an epoxy group, a methacryl group, an acrylic group, an isocyanate group, an isocyanurate group, a vinyl group, and a carbamate group from the viewpoint of handling. From the viewpoints of adhesion and adhesiveness, an epoxy group, a methacryl group, and an acrylic group are particularly preferable. As the hydrolyzable silicon group, an alkoxysilyl group is preferable from the viewpoint of handleability, and a methoxysilyl group and an ethoxysilyl group are particularly preferable from the viewpoint of reactivity.

Preferred silane coupling agents include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4- Epoxycyclohexyl) alkoxysilanes having an epoxy functional group such as ethyltriethoxysilane: 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-acryloxypropyl Methacrylic or acrylic groups such as triethoxysilane, methacryloxymethyltrimethoxysilane, methacryloxymethyltriethoxysilane, acryloxymethyltrimethoxysilane, acryloxymethyltriethoxysilane Alkoxysilanes having can be exemplified.

In addition, the method of adding an inorganic filler is mentioned. For example, a hydrolyzable silane monomer or oligomer such as alkoxysilane, acyloxysilane, or halogenated silane, or an alkoxide, acyloxide, or halide of a metal such as titanium or aluminum is added to the composition of the present invention. A method of reacting in a partial reaction product in the composition or in the composition to form an inorganic filler in the composition can also be mentioned.

Of the inorganic fillers as described above, silica-based inorganic fillers are preferable from the viewpoints that the curing reaction is hardly inhibited, the effect of reducing the linear expansion coefficient is large, and the adhesiveness to the lead frame is likely to be high. Furthermore, fused silica is preferable in terms of a good balance of physical properties such as moldability and electrical characteristics, and crystalline silica is preferable in terms of easy package thermal conductivity and high heat dissipation. Alumina is preferable in that heat dissipation tends to be higher. Titanium oxide is preferred in that the light reflectance of the package resin is high and the light extraction efficiency of the resulting light emitting diode tends to be high. In addition, glass fiber, potassium titanate, and calcium silicate are preferable in that the reinforcing effect is high and the strength of the package tends to be high.

As the average particle size and particle size distribution of the inorganic filler, various types are used without particular limitation, including those used or / and proposed as fillers for conventional sealing materials such as epoxy-based materials. The lower limit of the average particle size used is 0.1 μm, preferably 0.5 μm from the viewpoint that the fluidity tends to be good, and the upper limit of the average particle size usually used is 120 μm, the fluidity tends to be good. To preferably 60 μm, more preferably 15 μm.

The specific surface area of the inorganic filler can also be variously set, including those used and / or proposed as fillers for conventional sealing materials such as epoxy-based fillers.

As the shape of the inorganic filler, various types such as a crushed shape, a piece shape, a spherical shape, and a rod shape are used. Various aspect ratios are used. The aspect ratio of 10 or more is preferable in that the strength of the obtained cured product tends to increase. From the viewpoint of isotropic shrinkage of the resin, a powder form is preferable to a fiber form. Or the spherical thing is preferable at the point that the fluidity | liquidity at the time of shaping | molding becomes easy also at the time of high filling.

These inorganic fillers may be used alone or in combination of two or more.

The addition amount of the inorganic filler is not particularly limited, but from the viewpoint that the effect of reducing the linear expansion coefficient is high and the fluidity of the composition at the time of molding is good, the preferred lower limit of the addition amount is in the total composition It is 30% by weight, more preferably 50% by weight, still more preferably 75% by weight, and the upper limit of the preferable addition amount is 95% by weight in the total composition, more preferably 85% by weight.

As the order of mixing the inorganic filler, various methods can be used. However, in the point that the storage stability of the intermediate raw material of the composition is likely to be good, the component (A) is combined with the component (C) and the inorganic filler. A method of mixing the mixture and the component (B) is preferable. When the method of mixing the component (A) into the component (B) mixed with the component (C) or / and the inorganic filler, the component (B) is added in the presence or absence of the component (C). Since it has reactivity with moisture or / and inorganic fillers in the environment, it may be altered during storage. In addition, (A) component, (B) component, (C) in that (A) component, (B) component, and (C) component which are reaction components are well mixed and a stable molded product is easily obtained. It is preferable to mix an inorganic filler with a mixture of components.

As means for mixing these inorganic fillers, various means conventionally used for epoxy resins or / and proposed can be used. Examples thereof include a two-roll or three-roll, a planetary stirring and deaerator, a stirrer such as a homogenizer, a dissolver, and a planetary mixer, and a melt kneader such as a plast mill. Of these, a three-roller and a melt kneader are preferred in that sufficient dispersibility of the inorganic filler is easily obtained even with high filling. The mixing of the inorganic filler may be performed at normal temperature or may be performed by heating. Moreover, you may carry out under a normal pressure and may carry out in a pressure-reduced state. In view that sufficient dispersibility of the inorganic filler is easily obtained even at high filling, it is preferable to mix in a heated state, and it is easy to obtain sufficient dispersibility by improving the wettability of the inorganic filler surface. Is preferably mixed under reduced pressure.
(Additive)
(Curing retarder)
In the composition of the present invention, a curing retarder can be used for the purpose of improving the storage stability or adjusting the reactivity of the hydrosilylation reaction during the production process. Examples of the curing retarder include a compound containing an aliphatic unsaturated bond, an organic phosphorus compound, an organic sulfur compound, a nitrogen-containing compound, a tin-based compound, and an organic peroxide, and these may be used in combination.

Examples of the compound containing an aliphatic unsaturated bond include propargyl alcohols such as 3-hydroxy-3-methyl-1-butyne, 3-hydroxy-3-phenyl-1-butyne and 1-ethynyl-1-cyclohexanol. And maleate esters such as ene-yne compounds and dimethyl malate. Examples of the organophosphorus compound include triorganophosphine, diorganophosphine, organophosphon, and triorganophosphite. Examples of organic sulfur compounds include organomercaptans, diorganosulfides, hydrogen sulfide, benzothiazole, thiazole, benzothiazole disulfide and the like. Examples of the nitrogen-containing compound include ammonia, primary to tertiary alkylamines, arylamines, urea, hydrazine and the like. Examples of tin compounds include stannous halide dihydrate and stannous carboxylate. Examples of the organic peroxide include di-t-butyl peroxide, dicumyl peroxide, benzoyl peroxide, and t-butyl perbenzoate.

Among these curing retarders, from the viewpoint of good retarding activity and good raw material availability, benzothiazole, thiazole, dimethyl malate, 3-hydroxy-3-methyl-1-butyne, 1-ethynyl-1- Cyclohexanol is preferred.

The addition amount of the curing retarder can be selected at various levels, the preferred amount of the lower limit is 10 ^-1 moles with respect to hydrosilylation catalyst 1mol used, more preferably 1 mol, the upper limit of the preferable amount is 10 ³ mol, more preferably Is 50 moles.

Moreover, these hardening retarders may be used independently and may be used together 2 or more types.
(Adhesion improver)
An adhesion improver can also be added to the composition of the present invention. In addition to commonly used adhesives as adhesion improvers, for example, various coupling agents, epoxy compounds, phenol resins, coumarone-indene resins, rosin ester resins, terpene-phenol resins, α-methylstyrene-vinyltoluene A copolymer, polyethylmethylstyrene, aromatic polyisocyanate, etc. can be mentioned.

Examples of coupling agents include silane coupling agents and titanate coupling agents.

The silane coupling agent is not particularly limited as long as it is a compound having at least one functional group reactive with an organic group and / or hydrolyzable silicon group in the molecule. The group reactive with the organic group includes at least one functional group selected from an epoxy group, a methacryl group, an acrylic group, an isocyanate group, an isocyanurate group, a vinyl group, a carbamate group, and a ureido group from the viewpoint of handleability. From the viewpoint of curability and adhesiveness, an epoxy group, a methacryl group, and an acrylic group are particularly preferable. As the hydrolyzable silicon group, an alkoxysilyl group is preferable from the viewpoint of handleability, and a methoxysilyl group and an ethoxysilyl group are particularly preferable from the viewpoint of reactivity.

Preferred silane coupling agents include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4- Epoxycyclohexyl) silanes having an epoxy functional group such as ethyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-acryloxypropyltri A methacrylic or acrylic group such as ethoxysilane, methacryloxymethyltrimethoxysilane, methacryloxymethyltriethoxysilane, acryloxymethyltrimethoxysilane, acryloxymethyltriethoxysilane, etc. Silanes having vinyl groups such as vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, vinyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, γ- Mercaptosilanes such as mercaptopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, γ- [bis (β-hydroxyethyl)] aminopropyltriethoxysilane, N-β- (aminoethyl) -γ-aminopropyltri Methoxysilane, γ- (β-aminoethyl) aminopropyldimethoxymethylsilane, N- (trimethoxysilylpropyl) ethylenediamine, N- (dimethoxymethylsilylisopropyl) ethylenediamine, N-β- (N-vinylbenzylamino) Silanes having amino groups such as ethyl) -γ-aminopropyltrimethoxysilane, silanes such as methyltrimethoxysilane, methyltriethoxysilane, γ-chloropropyltrimethoxysilane, γ-anilinopropyltrimethoxysilane, etc. Is mentioned.

Titanate coupling agents include isopropyl triisostearoyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tri (N-aminoethyl-aminoethyl) titanate, tetraoctyl bis (ditridecyl phosphite) titanate, tetra (2 , 2-diallyloxymethyl-1-butyl) bis (ditridecyl) phosphite titanate, bis (dioctylpyrophosphate) oxyacetate titanate, bis (dioctylpyrophosphate) ethylene titanate, isopropyltrioctanoyl titanate, isopropyldimethacrylisostearoyl titanate , Isopropyltridodecylbenzenesulfonyl titanate, isopropylisostearoyl diacryl titanate DOO, isopropyl tri (dioctyl phosphate) titanate, isopropyl tricumylphenyl titanate, tetraisopropyl bis (dioctyl phosphite) titanate.

The addition amount of the coupling agent can be variously set, but the lower limit of the preferable addition amount relative to 100 parts by weight of [(A) component + (B) component] is 0.1 parts by weight, more preferably 0.5 parts by weight. The upper limit of the preferable addition amount is 50 parts by weight, more preferably 25 parts by weight. When the addition amount is small, the effect of improving the adhesiveness does not appear, and when the addition amount is large, the physical properties of the cured product may be adversely affected.

Examples of the epoxy compound include novolak phenol type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, bisphenol F diglycidyl ether, bisphenol A diglycidyl ether, and 2,2′-bis (4-glycidyloxycyclohexyl). Propane, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, vinyl cyclohexylene dioxide, 2- (3,4-epoxycyclohexyl) -5,5-spiro- (3,4-epoxycyclohexane) -1,3-dioxane, bis (3,4-epoxycyclohexyl) adipate, 1,2-cyclopropanedicarboxylic acid bisglycidyl ester, triglycidyl isocyanurate, monoallyl diglycidyl iso Cyanurate, mention may be made of diallyl monoglycidyl isocyanurate and the like.

Although the addition amount of the epoxy compound can be variously set, the lower limit of the preferable addition amount with respect to 100 parts by weight of [(A) component + (B) component] is preferably 1 part by weight, more preferably 3 parts by weight. The upper limit of the addition amount is 50 parts by weight, more preferably 25 parts by weight. When the addition amount is small, the effect of improving the adhesiveness does not appear, and when the addition amount is large, the physical properties of the cured product may be adversely affected.

These coupling agents, silane coupling agents, epoxy compounds, etc. may be used alone or in combination of two or more.

In the present invention, a silanol condensation catalyst can be further used to enhance the effect of the coupling agent or the epoxy compound, and the adhesion can be improved and / or stabilized. Such a silanol condensation catalyst is not particularly limited, but is preferably a boron compound or / and an aluminum compound or / and a titanium compound. Examples of the aluminum compound used as the silanol condensation catalyst include aluminum alkoxides such as aluminum triisopropoxide, sec-butoxyaluminum diisoflopoxide, aluminum trisec-butoxide, ethyl acetoacetate aluminum diisopropoxide, aluminum tris ( Ethyl acetoacetate), aluminum chelate M (manufactured by Kawaken Fine Chemicals, alkyl acetoacetate aluminum diisopropoxide), aluminum tris (acetylacetonate), aluminum monoacetylacetonate bis (ethylacetoacetate), etc. Aluminum chelates are more preferable from the viewpoint of handleability. Titanium compounds used as silanol condensation catalysts include tetraalkoxy titaniums such as tetraisopropoxy titanium and tetrabutoxy titanium: titanium chelates such as titanium tetraacetylacetonate: general residues having residues such as oxyacetic acid and ethylene glycol And titanate coupling agents.

Examples of the boron compound that serves as a silanol condensation catalyst include boric acid esters. As the borate ester, those represented by the following general formulas (VII) and (VIII) can be preferably used.

（式中Ｒ^１は炭素数１〜４８の有機基を表す。）
ほう酸エステルの具体例として、ほう酸トリ−２−エチルヘキシル、ほう酸ノルマルトリオクタデシル、ほう酸トリノルマルオクチル、ほう酸トリフェニル、トリメチレンボレート、トリス（トリメチルシリル）ボレート、ほう酸トリノルマルブチル、ほう酸トリ−ｓｅｃ−ブチル、ほう酸トリ−ｔｅｒｔ−ブチル、ほう酸トリイソプロピル、ほう酸トリノルマルプロピル、ほう酸トリアリル、ほう酸トリエチル、ほう酸トリメチル、ほう素メトキシエトキサイドを好適に用いることができる。

(In the formula, R ¹ represents an organic group having 1 to 48 carbon atoms.)
Specific examples of boric acid esters include tri-2-ethylhexyl borate, normal trioctadecyl borate, trinormal octyl borate, triphenyl borate, trimethylene borate, tris (trimethylsilyl) borate, trinormal butyl borate, tri-sec-butyl borate, Tri-tert-butyl borate, triisopropyl borate, trinormalpropyl borate, triallyl borate, triethyl borate, trimethyl borate, and boron methoxyethoxide can be preferably used.

These borate esters may be used alone or in combination of two or more. Mixing may be performed in advance or may be performed at the time of producing a cured product.

Of these borate esters, trimethyl borate, triethyl borate, and trinormal butyl borate are preferable, and trimethyl borate is more preferable among them because it is easily available and has high industrial practicality.

From the point of being able to suppress the volatility at the time of curing, normal trioctadecyl borate, trinormal octyl borate, triphenyl borate, trimethylene borate, tris (trimethylsilyl) borate, trinormal butyl borate, tri-sec-butyl borate, boric acid Tri-tert-butyl, triisopropyl borate, tripropylpropyl borate, triallyl borate, and boron methoxyethoxide are preferred. Among these, normal trioctadecyl borate, tri-tert-butyl borate, triphenyl borate, and tributyl normal borate are more preferable. preferable.

From the viewpoint of suppression of volatility and good workability, trinormal butyl borate, triisopropyl borate and trinormal propyl borate are preferable, and trinormal butyl borate is more preferable.

From the viewpoint of low colorability at high temperatures, trimethyl borate and triethyl borate are preferred, and trimethyl borate is more preferred.

The amount used in the case of using a silanol condensation catalyst can be variously set, but the lower limit of the preferred addition amount with respect to 100 parts by weight of the coupling agent and / or epoxy compound epoxy compound is 0.1 parts by weight, more preferably 1 part by weight. The upper limit of the preferable addition amount is 50 parts by weight, more preferably 30 parts by weight. When the addition amount is small, the effect of improving the adhesiveness does not appear, and when the addition amount is large, the physical properties of the cured product may be adversely affected.

These silanol condensation catalysts may be used alone or in combination of two or more.

In the present invention, a silanol source compound can be further used in order to further enhance the effect of improving adhesiveness, and the adhesiveness can be improved and / or stabilized. Examples of such a silanol source include silanol compounds such as triphenylsilanol and diphenyldihydroxysilane, and alkoxysilanes such as diphenyldimethoxysilane, tetramethoxysilane, and methyltrimethoxysilane.

The amount used in the case of using a silanol source compound can be variously set, but the lower limit of the preferable addition amount with respect to 100 parts by weight of the coupling agent and / or epoxy compound is 0.1 parts by weight, more preferably 1 part by weight. The upper limit of the preferable addition amount is 50 parts by weight, more preferably 30 parts by weight. When the addition amount is small, the effect of improving the adhesiveness does not appear, and when the addition amount is large, the physical properties of the cured product may be adversely affected.

Moreover, these silanol source compounds may be used independently and may be used together 2 or more types.

In the present invention, carboxylic acids and / or acid anhydrides can be used to enhance the effect of the coupling agent or epoxy compound, and adhesion can be improved and / or stabilized. Such carboxylic acids and acid anhydrides are not particularly limited,

２−エチルヘキサン酸、シクロヘキサンカルボン酸、シクロヘキサンジカルボン酸、メチルシクロヘキサンジカルボン酸、テトラヒドロフタル酸、メチルテトラヒドロフタル酸、メチルハイミック酸、ノルボルネンジカルボン酸、水素化メチルナジック酸、マレイン酸、アセチレンジカルボン酸、乳酸、リンゴ酸、クエン酸、酒石酸、安息香酸、ヒドロキシ安息香酸、桂皮酸、フタル酸、トリメリット酸、ピロメリット酸、ナフタレンカルボン酸、ナフタレンジカルボン酸、およびそれらの単独あるいは複合酸無水物が挙げられる。

2-ethylhexanoic acid, cyclohexanecarboxylic acid, cyclohexanedicarboxylic acid, methylcyclohexanedicarboxylic acid, tetrahydrophthalic acid, methyltetrahydrophthalic acid, methylheimic acid, norbornene dicarboxylic acid, hydrogenated methylnadic acid, maleic acid, acetylenedicarboxylic acid, Examples include lactic acid, malic acid, citric acid, tartaric acid, benzoic acid, hydroxybenzoic acid, cinnamic acid, phthalic acid, trimellitic acid, pyromellitic acid, naphthalene carboxylic acid, naphthalene dicarboxylic acid, and single or complex acid anhydrides thereof It is done.

Of these carboxylic acids and / or acid anhydrides, they react with SiH groups in that they have hydrosilylation reactivity and are unlikely to impair the physical properties of the resulting cured product with little possibility of seepage from the cured product. What contains the carbon-carbon double bond which has property is preferable. Preferred carboxylic acids and / or acid anhydrides include, for example,

テトラヒドロフタル酸、メチルテトラヒドロフタル酸およびそれらの単独あるいは複合酸無水物等が挙げられる。

Examples thereof include tetrahydrophthalic acid, methyltetrahydrophthalic acid, and single or complex acid anhydrides thereof.

The amount used in the case of using carboxylic acids or / and acid anhydrides can be variously set, but the lower limit of the preferred addition amount with respect to 100 parts by weight of the coupling agent or / and epoxy compound epoxy compound is 0.1 parts by weight, More preferably, it is 1 part by weight, and the upper limit of the preferable addition amount is 50 parts by weight, more preferably 10 parts by weight. When the addition amount is small, the effect of improving the adhesiveness does not appear, and when the addition amount is large, the physical properties of the cured product may be adversely affected.

Moreover, these carboxylic acids or / and acid anhydrides may be used alone or in combination of two or more.

In the composition of the present invention, the above silane compound can be used. The silane compound contributes to improvement in adhesion to the lead and is effective in preventing moisture from entering from the interface between the package and the lead. Illustrative examples include dimethyldimethoxysilane, dimethyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, methylphenyldimethoxysilane, methylphenyldiethoxysilane, and the like, with dimethyldimethoxysilane being particularly preferred.
(Thermosetting resin)
Various thermosetting resins can be added to the composition of the present invention for the purpose of modifying the properties. Examples of the thermosetting resin include, but are not limited to, epoxy resins, cyanate ester resins, phenol resins, polyimide resins, urethane resins, bismaleimide resins, and the like. Among these, an epoxy resin is preferable from the viewpoint of excellent practical properties such as adhesiveness.

Examples of the epoxy resin include novolak phenol type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, bisphenol F diglycidyl ether, bisphenol A diglycidyl ether, and 2,2′-bis (4-glycidyloxycyclohexyl). Propane, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, vinyl cyclohexylene dioxide, 2- (3,4-epoxycyclohexyl) -5,5-spiro- (3,4-epoxycyclohexane) -1,3-dioxane, bis (3,4-epoxycyclohexyl) adipate, 1,2-cyclopropanedicarboxylic acid bisglycidyl ester, triglycidyl isocyanurate, monoallyl diglycidyl isocyanate Curing epoxy resins such as nurate and diallyl monoglycidyl isocyanurate with aliphatic acid anhydrides such as hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, and hydrogenated methyl nadic anhydride Is mentioned. These epoxy resins or curing agents may be used alone or in combination.

The addition amount of the thermosetting resin is not particularly limited, but the lower limit of the preferable use amount is 5% by weight of the entire curable composition, more preferably 10% by weight, and the upper limit of the preferable use amount is the curable composition. The content is 50% by weight, more preferably 30% by weight. If the addition amount is small, it is difficult to obtain the intended effects such as adhesiveness, and if the addition amount is large, the addition tends to be brittle.

These thermosetting resins may be used alone or in combination.

The thermosetting resin may be a resin raw material and / or a cured product dissolved in the component (A) or / and the component (B) and mixed in a uniform state, or may be pulverized and mixed in a particle state. Alternatively, it may be dispersed by dissolving in a solvent and mixing. In the point that the obtained hardened | cured material tends to become more transparent, it is preferable to melt | dissolve in (A) component or / and (B) component, and to mix as a uniform state. Also in this case, the thermosetting resin may be directly dissolved in the component (A) or / and the component (B), or may be uniformly mixed using a solvent or the like. It is good also as a dispersed state or / and a mixed state.

When the thermosetting resin is dispersed and used, the average particle diameter can be variously set, but the lower limit of the preferable average particle diameter is 10 nm, and the upper limit of the preferable average particle diameter is 10 μm. There may be a distribution of the particle system, which may be monodispersed or have a plurality of peak particle diameters, but from the viewpoint that the viscosity of the curable composition is low and the moldability tends to be good. The coefficient of variation is preferably 10% or less.
(Thermoplastic resin)
Various thermoplastic resins can be added to the composition of the present invention for the purpose of modifying the properties. Various thermoplastic resins can be used. For example, a homopolymer of methyl methacrylate or a polymethyl methacrylate resin such as a random, block or graft polymer of methyl methacrylate and other monomers (for example, Hitachi Chemical) Optretz, etc.), acrylic resins represented by polybutyl acrylate resins such as butyl acrylate homopolymers or random, block or graft polymers of butyl acrylate and other monomers, bisphenol A, 3, A polycarbonate resin such as a polycarbonate resin containing 3,5-trimethylcyclohexylidenebisphenol or the like as a monomer structure (for example, APEC manufactured by Teijin Limited), a norbornene derivative, a vinyl monomer, or the like is copolymerized alone or copolymerized. Cycloolefin resins such as resins obtained by ring-opening metathesis polymerization of fats and norbornene derivatives, or hydrogenated products thereof (for example, APEL manufactured by Mitsui Chemicals, ZEONOR, ZEONEX manufactured by Nippon Zeon, ARTON manufactured by JSR, etc.), ethylene and Olefin-maleimide resins such as maleimide copolymers (eg, TI-PAS manufactured by Tosoh Corporation), bisphenols such as bisphenol A and bis (4- (2-hydroxyethoxy) phenyl) fluorene, and diols such as diethylene glycol Polyester resins such as polyester obtained by polycondensation of phthalic acids and aliphatic dicarboxylic acids such as terephthalic acid and isophthalic acid (for example, O-PET manufactured by Kanebo Co., Ltd.), polyethersulfone resins, polyarylate resins, polyvinyl acetal resins, Polyethylene resin Polypropylene resins, polystyrene resins, polyamide resins, silicone resins, other like fluorine resin, not natural rubber, but the rubber-like resin is exemplified such EPDM is not limited thereto.

As a thermoplastic resin, you may have the carbon-carbon double bond or / and SiH group which have a reactivity with SiH group in a molecule | numerator. In the point that the obtained cured product tends to be tougher, the molecule has one or more carbon-carbon double bonds or / and SiH groups having reactivity with SiH groups in the molecule on average. It is preferable.

The thermoplastic resin may have other crosslinkable groups. Examples of the crosslinkable group in this case include an epoxy group, an amino group, a radical polymerizable unsaturated group, a carboxyl group, an isocyanate group, a hydroxyl group, and an alkoxysilyl group. From the viewpoint that the heat resistance of the obtained cured product tends to be high, it is preferable to have one or more crosslinkable groups in one molecule on average.

The molecular weight of the thermoplastic resin is not particularly limited, but the number average molecular weight is preferably 10,000 or less in that the compatibility with the component (A) or the component (B) tends to be good. The following is more preferable. On the contrary, the number average molecular weight is preferably 10,000 or more, and more preferably 100,000 or more in that the obtained cured product tends to be tough. The molecular weight distribution is not particularly limited, but the molecular weight distribution is preferably 3 or less, more preferably 2 or less, in that the viscosity of the mixture tends to be low and the moldability tends to be good. More preferably, it is as follows.

The blending amount of the thermoplastic resin is not particularly limited, but a preferable lower limit of the amount used is 5% by weight of the entire curable composition, more preferably 10% by weight, and a preferable upper limit of the amount used is in the curable composition. Is 50% by weight, more preferably 30% by weight. When the addition amount is small, the obtained cured product tends to be brittle, and when it is large, the heat resistance (elastic modulus at high temperature) tends to be low.

A single thermoplastic resin may be used, or a plurality of thermoplastic resins may be used in combination.

The thermoplastic resin may be dissolved in the component (A) or / and the component (B) and mixed in a uniform state, pulverized and mixed in a particle state, or dissolved in a solvent and mixed. It may be in a dispersed state. In the point that the obtained hardened | cured material tends to become more transparent, it is preferable to melt | dissolve in (A) component or / and (B) component, and to mix as a uniform state. Also in this case, the thermoplastic resin may be directly dissolved in the component (A) or / and the component (B), or may be mixed uniformly using a solvent or the like, and then the solvent is removed and uniform dispersion is performed. It is good also as a state or / and a mixed state.

When the thermoplastic resin is dispersed and used, the average particle diameter can be variously set, but the lower limit of the preferable average particle diameter is 10 nm, and the upper limit of the preferable average particle diameter is 10 μm. There may be a distribution of the particle system, which may be monodispersed or have a plurality of peak particle diameters, but from the viewpoint that the viscosity of the curable composition is low and the moldability tends to be good. The coefficient of variation is preferably 10% or less.
(Anti-aging agent)
An antioxidant may be added to the composition of the present invention. Examples of the anti-aging agent include citric acid, phosphoric acid, sulfur-based anti-aging agent and the like in addition to the anti-aging agents generally used such as hindered phenol type.

As the hindered phenol-based anti-aging agent, various types such as Irganox 1010 available from Ciba Specialty Chemicals are used.

Sulfur-based antioxidants include mercaptans, mercaptan salts, sulfide carboxylates, sulfides including hindered phenol sulfides, polysulfides, dithiocarboxylates, thioureas, thiophosphates, sulfonium Examples thereof include compounds, thioaldehydes, thioketones, mercaptals, mercaptols, monothioacids, polythioacids, thioamides, and sulfoxides.

Moreover, these anti-aging agents may be used independently and may be used together 2 or more types.
(Radical inhibitor)
A radical inhibitor may be added to the composition of the present invention. Examples of the radical inhibitor include 2,6-di-t-butyl-3-methylphenol (BHT), 2,2′-methylene-bis (4-methyl-6-t-butylphenol), tetrakis (methylene- Phenol radical inhibitors such as 3 (3,5-di-t-butyl-4-hydroxyphenyl) propionate) methane, phenyl-β-naphthylamine, α-naphthylamine, N, N′-secondary butyl-p- Examples include amine radical inhibitors such as phenylenediamine, phenothiazine, N, N′-diphenyl-p-phenylenediamine, and the like.

Moreover, these radical inhibitors may be used alone or in combination of two or more.
(UV absorber)
An ultraviolet absorber may be added to the composition of the present invention. Examples of the ultraviolet absorber include 2 (2′-hydroxy-3 ′, 5′-di-t-butylphenyl) benzotriazole, bis (2,2,6,6-tetramethyl-4-piperidine) sebacate and the like. Can be mentioned.

Moreover, these ultraviolet absorbers may be used independently and may be used together 2 or more types.
(Other additives)
The composition of the present invention includes other colorants, mold release agents, flame retardants, flame retardant aids, surfactants, antifoaming agents, emulsifiers, leveling agents, anti-fogging agents, and ion trapping agents such as antimony-bismuth. , Thixotropic agent, tackifier, storage stability improver, ozone degradation inhibitor, light stabilizer, thickener, plasticizer, reactive diluent, antioxidant, heat stabilizer, conductivity enhancer , Antistatic agents, radiation blocking agents, nucleating agents, phosphorus peroxide decomposing agents, lubricants, pigments, metal deactivators, thermal conductivity imparting agents, physical property modifiers, etc., without detracting from the purpose and effect of the present invention Can be added in a range.
(solvent)
The composition of the present invention can be used by dissolving in a solvent. Solvents that can be used are not particularly limited, and specific examples include hydrocarbon solvents such as benzene, toluene, hexane, heptane, tetrahydrofuran, 1,4-dioxane, 1,3-dioxolane, diethyl ether, and the like. An ether solvent, a ketone solvent such as acetone, methyl ethyl ketone, and methyl isobutyl ketone, and a halogen solvent such as chloroform, methylene chloride, and 1,2-dichloroethane can be preferably used.

As the solvent, toluene, tetrahydrofuran, 1,3-dioxolane and chloroform are preferable.

Although the amount of solvent to be used can be set as appropriate, the lower limit of the preferred amount of use for 1 g of the curable composition to be used is 0.1 mL, and the upper limit of the preferred amount of use is 10 mL. If the amount used is small, it is difficult to obtain the effect of using a solvent such as a low viscosity, and if the amount used is large, the solvent tends to remain in the material, causing problems such as thermal cracks, and also from a cost standpoint. It is disadvantageous and the industrial utility value decreases.

These solvents may be used alone or as a mixed solvent of two or more.
(Additive for light emitting diode)
Furthermore, you may add the additive for various light emitting diode characteristic improvement to the composition of this invention as needed. Examples of additives include phosphors such as yttrium, aluminum, and garnet phosphors activated with cerium that absorb light from the light emitting element to emit longer wavelength fluorescence, and blue that absorbs a specific wavelength. Coloring agents such as ing agents, diffusion materials such as titanium oxide, aluminum oxide, melamine resin, CTU guanamine resin, benzoguanamine resin for diffusing light, metal oxides such as aluminosilicate, aluminum nitride, boron nitride, etc. Examples thereof include thermally conductive fillers such as metal nitrides.

The additive for improving the characteristics of the light emitting diode may be contained uniformly, or the content may be added with a gradient.
(Release agent)
Various release agents may be added to the composition of the present invention in order to improve the releasability at the time of molding.

Various conventionally used release agents are used. For example, metal soap, waxes and the like can be mentioned. The metal soap here is generally a combination of long-chain fatty acids and metal ions. The nonpolar or low polarity part based on the fatty acid and the polar part based on the metal binding part are combined in one molecule. Can be used. Examples of the long chain fatty acid include saturated fatty acids having 1 to 18 carbon atoms, unsaturated fatty acids having 3 to 18 carbon atoms, and aliphatic dicarboxylic acids. Among these, saturated fatty acids having 1 to 18 carbon atoms are preferable from the viewpoint of easy availability and high industrial feasibility, and 6 to 18 carbon atoms from the viewpoint of high effect of releasability. The saturated fatty acid is more preferable. Examples of metal ions include zinc, cobalt, aluminum, strontium, and the like in addition to alkali metals and alkaline earth metals. Specific examples of metal soaps include lithium stearate, lithium 12-hydroxystearate, lithium laurate, lithium oleate, lithium 2-ethylhexanoate, sodium stearate, sodium 12-hydroxystearate, lauric acid Sodium, sodium oleate, sodium 2-ethylhexanoate, potassium stearate, potassium 12-hydroxystearate, potassium laurate, potassium oleate, potassium 2-ethylhexanoate, magnesium stearate, magnesium 12-hydroxystearate, Magnesium laurate, magnesium oleate, magnesium 2-ethylhexanoate, calcium stearate, calcium 12-hydroxystearate, calcium laurate , Calcium oleate, calcium 2-ethylhexanoate, barium stearate, barium 12-hydroxystearate, barium laurate, zinc stearate, zinc 12-hydroxystearate, zinc laurate, zinc oleate, 2-ethylhexane Examples include zinc acid, lead stearate, lead 12-hydroxystearate, cobalt stearate, aluminum stearate, manganese oleate, barium ricinoleate, and the like. Among these metal soaps, metal stearates are preferred from the viewpoint of easy availability, safety and industrial feasibility, and calcium stearate, magnesium stearate, stearin are particularly preferred from the viewpoint of economy. Most preferred is one or more selected from the group consisting of zinc acid.

Although there is no restriction | limiting in particular as addition amount of this metal soap, The minimum of a preferable amount is 0.025 with respect to 100 weight part of the whole composition, More preferably, it is 0.05 weight part, The upper limit of a preferable amount is a composition. The amount is 5 parts by weight, more preferably 4 parts by weight based on 100 parts by weight as a whole. When the addition amount is too large, the physical properties of the cured product are deteriorated. When the addition amount is too small, mold releasability may not be obtained.

Examples of waxes include natural wax, synthetic wax, oxidized or non-oxidized polyolefin, and polyethylene wax.

In addition, it is better not to use a release agent when sufficient release properties can be obtained without adding a release agent.
(B stage)
The composition of the present invention may be used as it is as a mixture of each component and additive, or may be used after partially reacting (B-stage) by heating or the like. Viscosity can be adjusted by using B-stage, and transfer moldability can also be adjusted.
(Composition properties)
As described above, various combinations can be used as the composition of the present invention. However, in terms of good moldability by transfer molding, the composition has fluidity at a temperature of 150 ° C. or lower. preferable.

The curability of the composition can be arbitrarily set, but the gelation time at 120 ° C. is preferably within 120 seconds, and more preferably within 60 seconds in that the molding cycle can be shortened. Further, the gelation time at 150 ° C. is preferably within 60 seconds, and more preferably within 30 seconds. Further, the gelation time at 100 ° C. is preferably within 180 seconds, and more preferably within 120 seconds.

The gelation time in this case is examined as follows. An aluminum foil having a thickness of 50 μm is placed on a hot plate adjusted to a preset temperature, and 100 mg of the composition is placed thereon to measure the time until gelation is taken as the gelation time.
(Curing)
The composition of the present invention can be used after being cured by reacting in advance with a carbon-carbon double bond having reactivity with SiH groups in the composition and part or all of SiH groups.

In the case of curing by reacting the composition, the required amount of each component (A), (B), (C) (and (D)) may be mixed and reacted at one time, but partly mixed After reacting, only a part of the functional group in the composition is reacted (B by controlling the reaction conditions after mixing and utilizing the difference in the reactivity of the substituents). It is also possible to take a method of further curing by performing a process such as molding after being staged). According to these methods, viscosity adjustment at the time of molding becomes easy.

As a curing method, the reaction can be performed by simply mixing, or the reaction can be performed by heating. A method of heating and reacting is preferable from the viewpoint that the reaction is fast and generally a material having high heat resistance is easily obtained.

Although the curing temperature can be variously set, the lower limit of the preferable temperature is 30 ° C., more preferably 100 ° C., and the upper limit of the preferable temperature is 300 ° C., more preferably 200 ° C. If the reaction temperature is low, the reaction time for sufficient reaction will be long, and if the reaction temperature is high, molding will tend to be difficult.

Curing may be performed at a constant temperature, but the temperature may be changed in multiple steps or continuously as required. It is preferable to carry out the reaction while raising the temperature in a multistage manner or continuously, as compared with the case where the temperature is constant, in that a uniform cured product without distortion can be easily obtained. Moreover, it is preferable to perform at a constant temperature in that the molding cycle can be shortened.

Although various curing times can be set, it is preferable to react at a relatively low temperature for a long time rather than reacting at a high temperature for a short time because a uniform cured product without distortion can be easily obtained. Conversely, the reaction at a high temperature in a short time is preferable in that the molding cycle can be shortened.

The pressure during the reaction can be variously set as required, and the reaction can be carried out under normal pressure, high pressure, or reduced pressure. In view of easy removal of volatile matter generated in some cases, it is preferable to cure under reduced pressure. In terms of preventing cracks in the molded body, it is preferable to cure under pressure.

In the manufacturing process in which the composition is used, the weight loss during curing is 5% by weight or less from the viewpoint that generation of voids in the composition and process problems due to outgas from the composition hardly occur. Is preferably 3% by weight or less, more preferably 1% or less.

The weight loss during curing is examined as follows. Using a thermogravimetric analyzer, 10 mg of the sealant is heated from room temperature to 150 ° C. at a rate of temperature increase of 10 ° C./min, and can be determined as a ratio of the initial weight of the reduced weight.

In addition, when used as an electronic material or the like, it is preferable that the content of Si atoms in the volatile component in this case is 1% or less in that the problem of silicone contamination hardly occurs.
(Curing property)
From the viewpoint of good heat resistance, a cured product obtained by curing the composition preferably has a Tg of 100 ° C. or higher, more preferably 150 ° C. or higher.

In this case, Tg is examined as follows. Dynamic measurement using a prismatic test piece of 3 mm × 5 mm × 30 mm in a tensile mode, a measurement frequency of 10 Hz, a strain of 0.1%, a static / power ratio of 1.5, and a temperature increase rate of 5 ° C./min. The peak temperature of tan δ in viscoelasticity measurement (using DVA-200 manufactured by IT Measurement Control Co., Ltd.) is defined as Tg.

In addition, in terms of high reliability and less likely to cause problems such as ion migration in the lead frame and the like, the content of ions extracted from the cured product is preferably less than 10 ppm, more preferably less than 5 ppm, More preferably, it is less than 1 ppm.

In this case, the extracted ion content is examined as follows. 1 g of the cut cured product is put in a Teflon (registered trademark) container together with 50 ml of ultrapure water and sealed, and treated under conditions of 121 ° C., 2 atm and 20 hours. The obtained extract was analyzed by ICP mass spectrometry (using HP-4500 manufactured by Yokogawa Analytical Systems), and the obtained Na and K content values were converted to the concentration in the cured product used. Ask. On the other hand, the same extract was analyzed by ion chromatography (using Dionex DX-500, column: AS12-SC), and the resulting Cl and Br content values were converted to the concentration in the cured product used. Ask. The contents of Na, K, Cl, and Br obtained as described above in the cured product are totaled to obtain the extracted ion content.

Various colors are used for the cured product, but white is preferable in that the light extraction efficiency of the light emitting diode tends to be high, and the contrast tends to be high when the light emitting diode is used in a display device. In black, black is preferable.

The linear expansion coefficient of the cured product is not particularly limited, but the linear expansion coefficient may be 50 ppm or less at 100 ° C. in terms of easy adhesion to metals such as lead frames and ceramics. Preferably, it is 30 ppm or less. Further, in terms of easy adhesion to an organic material such as a sealing resin, the linear expansion coefficient is preferably 70 ppm or more at 100 ° C., and more preferably 100 ppm or more. In addition, the temperature of the linear expansion coefficient and the linear expansion coefficient close to that of the sealant is that they are less likely to generate stress between the package and the sealant during the thermal test after curing, and in that the reliability tends to be high It is preferable to have dependency.
(Semiconductor package)
The semiconductor package referred to in the present invention is a member provided for supporting and / or protecting a semiconductor element or / and an external extraction electrode. In this case, various types of semiconductor elements can be mentioned. For example, an integrated circuit such as an IC or LSI, an element such as a transistor, a diode, or a light emitting diode, or a light receiving element such as a CCD can be used. Among these, the effect of the present invention can be more remarkable when the semiconductor is a light emitting diode.

In the case where the semiconductor is a light emitting diode element, it is preferably designed so that light emitted from the light emitting diode element is irradiated, and more preferably, the light emitted from the light emitting diode element is reflected and taken out to the outside. It is designed. There are no particular restrictions on the shape and the like. For example, as shown in FIG. 1, it may have a shape having a recess for mounting a light emitting diode element, or may simply have a flat plate shape. The surface of the light emitting diode package of the present invention may be smooth or may have a non-smooth surface such as embossing.
(Molding method)
Various methods are used as a method for forming a semiconductor package in the present invention. For example, various molding methods generally used for thermosetting resins such as thermoplastic resins and epoxy resins, such as injection molding, transfer molding, RIM molding, casting molding, and press molding, are used. Of these, transfer molding is preferred in that the molding cycle is short and the moldability is good. The molding conditions can be arbitrarily set, for example, the molding temperature is also arbitrary. However, in terms of fast curing and a short molding cycle, the moldability tends to be good, more preferably 100 ° C. or higher, more preferably 120 ° C. or higher. A temperature of 150 ° C. or higher is preferable. After molding by the various methods as described above, post-curing (after-curing) is optional as required. Post-curing tends to increase the heat resistance.
(Light-emitting diode element)
The various light emitting diode elements of the light emitting diode referred to in the present invention are not particularly limited, and the light emitting diode elements used in conventionally known light emitting diodes can be used.

The size and number of the light emitting diode elements can be used without any particular limitation.

Any light emitting output of the light emitting diode element can be used without any particular limitation. However, when a light emitting element of 1 mW or more is used at 20 mA, the effect of the present invention is remarkable, and a light emitting element of 4 mW or more at 20 mA is used. When used, the effect of the present invention is remarkable. When a light emitting element of 5 mW or more is used at 20 mA, the effect of the present invention is further remarkable.

Various light emission wavelengths of the light emitting diode element can be used from the ultraviolet region to the infrared region, but the effect of the present invention is particularly remarkable when the main light emission peak wavelength is 550 nm or less.

One type of light emitting diode element may be used for single color emission, or a plurality of light emitting diode elements may be used for single color or multicolor emission.
(Lead)
The lead terminal used in the semiconductor of the present invention preferably has good adhesion with an electrical connecting member such as a bonding wire, electrical conductivity, etc., and the electrical resistance of the lead terminal is preferably 300 μΩ-cm or less, More preferably, it is 3 μΩ-cm or less. Examples of these lead terminal materials include iron, copper, iron-containing copper, tin-containing copper, and those plated with gold, silver, nickel, palladium, and the like. The glossiness of these lead terminals may be adjusted as appropriate in order to obtain a good light spread.
(Sealing agent)
Various semiconductor sealing agents of the present invention can be used. For example, conventionally used sealing resins such as epoxy resins, silicone resins, acrylic resins, urea resins, and imide resins can be used. Further, aliphatic organic compounds having at least two carbon-carbon double bonds having reactivity with SiH groups as proposed in JP-A Nos. 2002-80733 and 2002-88244, A sealant made of a curable composition containing a compound having at least two SiH groups in the molecule and a hydrosilylation catalyst may be used. Adhesion with the package resin is better when this sealant is used. In view of the fact that the effect is high and the effect of high transparency and high light resistance of the package of the present invention is remarkable.

On the other hand, it is possible to cover with glass or the like and seal with hermetic sealing without using resin sealing.
(Application of light emitting diode)
The semiconductor light emitting diode of the present invention can be used for various known applications. Specifically, for example, backlights such as liquid crystal display devices, illumination, sensor light sources, vehicle instrument light sources, signal lights, display lights, display devices, planar light source, display, decoration, various lights, etc. it can.

Examples and Comparative Examples of the present invention are shown below, but the present invention is not limited to the following.
(Synthesis Example 1)
A stirrer, a dropping funnel, and a condenser tube were set in a 5 L four-necked flask. Into this flask, 1800 g of toluene and 1440 g of 1,3,5,7-tetramethylcyclotetrasiloxane were placed, heated and stirred in an oil bath at 120 ° C. A mixed solution of 200 g of triallyl isocyanurate, 200 g of toluene and 1.44 ml of a xylene solution of platinum vinylsiloxane complex (containing 3 wt% as platinum) was added dropwise over 50 minutes. The resulting solution was heated and stirred as it was for 6 hours, and unreacted 1,3,5,7-tetramethylcyclotetrasiloxane and toluene were distilled off under reduced pressure. ^{By 1} H-NMR, it was found that this was one in which a part of the SiH group of 1,3,5,7-tetramethylcyclotetrasiloxane reacted with triallyl isocyanurate (referred to as reactant A). Further, when the content of SiH groups was determined by ¹ H-NMR using 1,2-dibromomethane as an internal standard, it was found to contain 8.08 mmol / g SiH groups. Although the product is a mixture, it contains as a main component the following component (B) of the present invention. Moreover, the platinum vinylsiloxane complex which is (C) component of this invention is contained.

（実施例１）
本発明の（Ａ）成分としてトリアリルイソシアヌレート２０．００ｇ、本発明の（Ｂ）成分として合成例１で得た生成物２９．７８ｇ、本発明の（Ｃ）成分として白金ビニルシロキサン錯体のキシレン溶液（白金として３ｗｔ％含有）０．０２５１ｇ、１−エチニル−１−シクロヘキサノール０．１４７ｇを混合して硬化性組成物とした。このものに本発明の（Ｄ）成分として酸化チタン（石原産業株式会社製、タイペークＲ８２０）２４．９８ｇ、および溶融シリカ（株式会社龍森製、ヒューズレックスＲＤ−８）２４９．８ｇを添加し、セラミック製の３本ロールを用いて３回混練し、本発明の半導体のパッケージ用硬化性樹脂組成物とした。このものは室温では固いペースト状であるが、少量を１５０℃に加熱した熱板上に置くと一旦低粘度化して流動状態となり４０秒後にゲル化した。

Example 1
20.00 g of triallyl isocyanurate as component (A) of the present invention, 29.78 g of the product obtained in Synthesis Example 1 as component (B) of the present invention, xylene of a platinum vinylsiloxane complex as component (C) of the present invention 0.0251 g of a solution (containing 3 wt% as platinum) and 0.147 g of 1-ethynyl-1-cyclohexanol were mixed to obtain a curable composition. To this, 24.98 g of titanium oxide (Ishihara Sangyo Co., Ltd., Tyco R820) and fused silica (manufactured by Tatsumori Co., Ltd., Furex RD-8) are added as component (D) of the present invention, The mixture was kneaded three times using a ceramic three roll to obtain a curable resin composition for a semiconductor package of the present invention. This was a hard paste at room temperature, but when a small amount was placed on a hot plate heated to 150 ° C., the viscosity once decreased to a fluid state and gelled after 40 seconds.

This semiconductor package curable resin composition was subjected to transfer molding using an MF-0 type transfer molding machine manufactured by Maruhichi Iron Works. With 10 × 10 × 3 mm test piece 6-cavity of a mold, a raw material pot temperature: room temperature, mold temperature: 0.99 ° C., molding pressure: 70 kgf / cm ^2, molding time: performing molding at 60 seconds conditions As a result, a good molded body free from burrs, cracks, voids and the like was obtained. Also, using a mold with four test pieces of 44 × 10 × 5 mm, molding was performed under the conditions of raw material pot temperature: room temperature, mold temperature: 140 ° C., molding pressure: 70 kgf / cm ² , molding time: 120 seconds. As a result, a good molded body free from burrs, cracks, voids and the like was obtained. The obtained molded body was post-cured by heating in a hot air circulating oven at 150 ° C. for 1 hour under air to obtain a white cured product.
(Example 2)
Triallyl isocyanurate 10.00 g as the component (A) of the present invention, 32.42 g of FZ3772 (α-methylstyrene-modified polymethylhydrogensiloxane) manufactured by Nippon Unicar Co., Ltd. as the component (B) of the present invention, (C ) As a component, 0.128 g of a platinum vinylsiloxane complex xylene solution (containing 3 wt% as platinum) and 0.127 g of 1-ethynyl-1-cyclohexanol were mixed to obtain a curable composition. To this, 21.34 g of titanium oxide (Ishihara Sangyo Co., Ltd., Tyco R820) and fused silica (manufactured by Tatsumori Co., Ltd., Furex RD-8) are added as component (D) of the present invention, The mixture was kneaded three times using a ceramic three roll to obtain a curable resin composition for a semiconductor package of the present invention. This was a hard paste at room temperature, but when a small amount was placed on a hot plate heated to 150 ° C., the viscosity once decreased to a fluid state and gelled after 35 seconds.

This semiconductor package curable resin composition was heat-treated on a hot plate at 120 ° C. for 3 minutes. During this time, the composition thickened and showed B-stage. This B-staged composition was transfer-molded using a MF-0 type transfer molding machine manufactured by Maruhichi Iron Works. Molding is performed under the conditions of a raw material pot temperature: room temperature, a mold temperature: 140 ° C., a molding pressure: 150 kgf / cm ² , and a molding time: 120 seconds, using a 44 × 10 × 5 mm test piece mold. As a result, a good molded body free from burrs, cracks, voids and the like was obtained. The obtained molded body was post-cured by heating in a hot air circulating oven at 150 ° C. for 1 hour under air to obtain a white cured product.
(Example 3)
10.00 g of triallyl isocyanurate as component (A) of the present invention, 15.00 g of the product obtained in Synthesis Example 1 as component (B) of the present invention, xylene of a platinum vinylsiloxane complex as component (C) of the present invention A curable composition was prepared by mixing 0.0132 g of a solution (containing 3 wt% as platinum) and 0.0752 g of 1-ethynyl-1-cyclohexanol. In this curable composition, 10.01 g, titanium oxide (Ishihara Sangyo Co., Ltd., Tyco R820) 1.00 g as component (D) of the present invention, and fine powder silica (Nippon Aerosil Co., Ltd., Aerosil RX300) 7.65 g Was added and kneaded five times using a ceramic three roll to obtain a curable resin composition for a semiconductor package of the present invention. This was a hard paste at room temperature.

This semiconductor package curable resin composition is sandwiched between two 3 mm thick glass plates and cured by heating in a hot air circulating oven at 150 ° C. for 1 hour under air and then for 1 hour in a hot air circulating oven at 180 ° C. To obtain a white cured product.
Example 4
5.00 g of triallyl isocyanurate as the component (A) of the present invention, 16.20 g of FZ3772 (α-methylstyrene-modified polymethylhydrogensiloxane) manufactured by Nippon Unicar Co., Ltd. as the component (B) of the present invention, (C ) As a component, 0.0617 g of a platinum vinylsiloxane complex xylene solution (containing 3 wt% as platinum) and 0.0645 g of 1-ethynyl-1-cyclohexanol were mixed to obtain a curable composition. In this curable composition 10.00 g, titanium oxide (Ishihara Sangyo Co., Ltd., Tyco R820) 1.00 g and fine powder silica (Nippon Aerosil Co., Ltd., Aerosil RX300) 7.67 g as component (D) of the present invention. Was added and kneaded five times using a ceramic three roll to obtain a curable resin composition for a semiconductor package of the present invention. This was a hard paste at room temperature.

This semiconductor package curable resin composition is sandwiched between two 3 mm thick glass plates and cured by heating in a hot air circulating oven at 150 ° C. for 1 hour under air and then for 1 hour in a hot air circulating oven at 180 ° C. A white cured product was obtained.
(Measurement Example 1)
The cured products obtained in Examples 1 and 2 were sandwiched between two 3 mm-thick glass plates and further heated in a hot air circulating oven at 180 ° C. for 1 hour in the air to be further cured. The linear expansion coefficient was measured for these samples and the cured products obtained in Examples 3 and 4. The measurement was performed using a TMA-50 manufactured by Shimadzu Corporation in the length direction of 5 mm under conditions of a temperature rising rate: 10 ° C./min, an atmosphere: nitrogen, and a sample shape: 5 × 5 × 3 mm. Table 1 shows the linear expansion coefficient in each temperature range.

表１により、種々の線膨張係数を有する成形体を得ることができることが分かる。従って本発明の組成物により用いられる封止剤に近い線膨張係数に調整することができることができることがわかる。
（測定例２）および（比較例１）
実施例１〜４で得た硬化物の耐久性を調べた。また、比較例１として従来半導体のパッケージ用に用いられているソルベイアドバンストポリマーズ株式会社製アモデルＡ−４１２２（ガラス繊維充填ポリアミド樹脂）についても同じ評価を行った。耐熱性試験としては、空気下２６０℃の熱風循環オーブン中で１５分間加熱して変色を調べた。耐光性試験としてはメタリングウェザーメーターで積算照射強度１００ＭＪ（ブラックパネル温度＝１２０℃）の条件で光照射処理して光照射面の変色を調べた。耐光性試験はスガ試験機株式会社製メタリングウェザーメーターＭ６Ｔを用いて行った。さらに、耐湿熱性試験として、１２１℃、１００％ＲＨ（２気圧）、２０時間の条件でＰＣＴ試験に供し変色を調べた。耐湿熱性試験は株式会社島津製作所製ＨＡＳＴチャンバーＥＨＳ−２２１Ｍを用いて行った。

Table 1 shows that the molded object which has a various linear expansion coefficient can be obtained. Therefore, it turns out that it can adjust to the linear expansion coefficient close | similar to the sealing agent used with the composition of this invention.
(Measurement Example 2) and (Comparative Example 1)
The durability of the cured products obtained in Examples 1 to 4 was examined. Moreover, the same evaluation was performed also about Amodel A-4122 (glass fiber filling polyamide resin) by Solvay Advanced Polymers Co., Ltd. conventionally used for the package of a semiconductor as the comparative example 1. FIG. As a heat resistance test, the discoloration was examined by heating for 15 minutes in a hot air circulating oven at 260 ° C. in air. As a light resistance test, the light irradiation surface was examined for discoloration by a light irradiation treatment under the condition of an integrated irradiation intensity of 100 MJ (black panel temperature = 120 ° C.) with a metalling weather meter. The light resistance test was performed using a metering weather meter M6T manufactured by Suga Test Instruments Co., Ltd. Further, as a heat and humidity resistance test, the discoloration was examined by subjecting it to a PCT test under the conditions of 121 ° C., 100% RH (2 atm) and 20 hours. The heat and humidity resistance test was performed using a HAST chamber EHS-221M manufactured by Shimadzu Corporation.

表２より本発明の組成物を硬化させて得た硬化物は優れた耐熱耐光性を有していることが分かる。
（測定例３）および（比較例２）
実施例１、２で得た硬化物を３ｍｍ厚のガラス板２枚に挟みこんで空気下１８０℃の熱風循環オーブン中で１時間加熱してさらに後硬化させた。これらのサンプルおよび実施例３、４で得た硬化物について半導体素子の封止剤との接着性および耐久接着性を測定した。また、比較例２として従来半導体のパッケージ用に用いられているソルベイアドバンストポリマーズ株式会社製アモデルＡ−４１２２（ガラス繊維充填ポリアミド樹脂）についても同じ評価を行った。接着性の評価はダイシェア試験によって実施した。ダイシェア試験用のサンプルは本発明の組成物を硬化させて得た硬化物の表面に半導体素子の封止剤を塗布し、その上にさらにダイを載せ空気下熱風循環オーブン中で６０℃／６時間、７０℃／１時間、８０℃／１時間、１２０℃／１時間、１５０℃／１時間、１８０℃／３０分の条件で段階的に加熱して封止剤を硬化させた。得られた試験片についてダイシェア試験を行った。ダイシェア試験機はデイジ社製万能型ボンドテスター２４００を用いた。５０ｋｇｆのロードセルを用い、試験スピードは８３μｍ／秒で実施した。

It can be seen from Table 2 that the cured product obtained by curing the composition of the present invention has excellent heat and light resistance.
(Measurement Example 3) and (Comparative Example 2)
The cured products obtained in Examples 1 and 2 were sandwiched between two 3 mm-thick glass plates and further heated in a hot air circulating oven at 180 ° C. for 1 hour in the air to be further cured. These samples and the cured products obtained in Examples 3 and 4 were measured for adhesiveness and durable adhesiveness with a semiconductor element sealant. Moreover, the same evaluation was performed also about Amodel A-4122 (glass fiber filling polyamide resin) by Solvay Advanced Polymers Co., Ltd. conventionally used for the package of a semiconductor as the comparative example 2. FIG. Evaluation of adhesiveness was performed by a die shear test. In the sample for die shear test, a sealant for a semiconductor element was applied to the surface of a cured product obtained by curing the composition of the present invention, and a die was further placed thereon, in a hot air circulating oven at 60 ° C./6. The sealant was cured by heating stepwise under the conditions of time, 70 ° C./1 hour, 80 ° C./1 hour, 120 ° C./1 hour, 150 ° C./1 hour, 180 ° C./30 minutes. A die shear test was performed on the obtained test piece. The die shear tester used was a universal bond tester 2400 manufactured by Daisy. A 50 kgf load cell was used, and the test speed was 83 μm / sec.

Moreover, the light resistance test was implemented in the state which made the test piece produced similarly irradiate light to an adhesion surface through die | dye. The light resistance test was performed using a super xenon weather meter manufactured by Suga Test Instruments Co., Ltd., with an irradiance of 0.18 kW / m ² , irradiation for 1 hour and 42 minutes, followed by an 18-minute rainfall cycle test, black panel temperature of 63 ° C., and humidity of 50% The test was conducted for 425 hours under the test conditions. The die shear test was similarly conducted on the obtained samples. These results are shown in Table 3.

表３より本発明の組成物を硬化させて得た硬化物は半導体素子の封止剤と十分な接着性を有しており、また優れた耐久接着性を有していることが分かる。
＜封止剤の作製＞
トリアリルイソシアヌレート１２．０４ｇ、白金ビニルシロキサン錯体のキシレン溶液（白金として３ｗｔ％含有）９０ｍｇ及びほう酸トリメチル１５０ｍｇをあらかじめ混合、攪拌し混合物Ａ液を作製した。また、合成例１の反応物１７．９６ｇ、γ−グリシドキシプロピルトリメトキシシラン７５０ｍｇ及び１−エチニル−１−シクロヘキサノール９０ｍｇをあらかじめ混合、攪拌し混合物Ｂ液を作製した。上記混合物Ａ液と混合物Ｂ液を混合し攪拌・脱泡を行い封止剤とした。
＜ダイシェア試験用のダイの作製＞
上記封止剤をを２枚の３ｍｍ厚のガラス板に３ｍｍ厚みのシリコーンゴムシートをスペーサーとしてはさみこんで作成したセルに流し、空気下に熱風循環オーブン中で６０℃／６時間、７０℃／１時間、８０℃／１時間、１２０℃／１時間、１５０℃／１時間、１８０℃／３０分の条件で加熱し硬化させた。得られた透明な成形体を３×３×１ｍｍの寸法ににダイヤモンドカッターを用いて切削しダイとした。

From Table 3, it can be seen that the cured product obtained by curing the composition of the present invention has sufficient adhesiveness with the semiconductor element sealing agent, and also has excellent durable adhesiveness.
<Preparation of sealant>
12.04 g of triallyl isocyanurate, 90 mg of a platinum vinylsiloxane complex xylene solution (containing 3 wt% as platinum) and 150 mg of trimethyl borate were previously mixed and stirred to prepare a mixture A solution. Further, 17.96 g of the reaction product of Synthesis Example 1, 750 mg of γ-glycidoxypropyltrimethoxysilane and 90 mg of 1-ethynyl-1-cyclohexanol were mixed and stirred in advance to prepare a mixture B solution. The mixture A liquid and the mixture B liquid were mixed and stirred and degassed to obtain a sealant.
<Production of die for die share test>
The sealing agent was poured into a cell formed by sandwiching a 3 mm-thick silicone rubber sheet between two 3 mm-thick glass plates as a spacer, and in a hot air circulating oven under air for 60 ° C./6 hours, 70 ° C. / It was cured by heating for 1 hour, 80 ° C./1 hour, 120 ° C./1 hour, 150 ° C./1 hour, 180 ° C./30 minutes. The obtained transparent molded body was cut to a size of 3 × 3 × 1 mm using a diamond cutter to obtain a die.

DESCRIPTION OF SYMBOLS 1 Light emitting diode package 2 Light emitting diode element 3 Bonding wire 4 Lead

Claims (7)

(A) an organic compound containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule;
(B) a compound containing at least two SiH groups in one molecule;
(C) a hydrosilylation catalyst, and
(D) A curable resin composition for a light emitting diode package, which provides a white or black package comprising a curable resin composition containing titanium oxide and / or silica as an essential component. 2. The curable resin composition for a light-emitting diode package according to claim 1, which has fluidity at a temperature of 150 ° C. or less and has a gelation time at 150 ° C. of 60 seconds or less. A light emitting diode package, wherein the curable resin composition for a light emitting diode package according to claim 1 or 2 is molded. 4. The light emitting diode package according to claim 3, wherein the curable resin composition for a light emitting diode package is formed by transfer molding. The light emitting diode package according to claim 3 or 4, wherein the package is designed to be irradiated with light emitted from the light emitting diode element. The package of the light emitting diode of any one of Claims 3-5 which has a shape which has a recessed part for mounting a light emitting diode element. The light emitting diode manufactured using the curable resin composition for light emitting diode packages of Claim 1 or 2.

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