JP2009229969A - Liquid crystal panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal panel which improves reliability by preventing disconnection of a lead-out wire, and preventing degradation of adhesion of a sealing material and an insulating film. <P>SOLUTION: The liquid crystal panel 1 includes a first substrate 2, which includes a plurality of lead-out wires SL, GL led out of a display area DA to a non display area NDA and covered with an insulating layer, and a terminal region T in which the lead-out wires SL, GL are connected to an external control circuit, and a second substrate 12 formed of a transparent substrate oppositely arranged to the first substrate 2. The sealing material 9 is applied and stuck on a part corresponding to the non display area of one of the first and second substrates 2, 12. The first substrate 2 includes a protection member 11 arranged on a part of the insulating layer corresponding to a cutting line S for cutting the second substrate 12 except for the part with the sealing material 9 formed thereon. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a liquid crystal panel, and more particularly, a liquid crystal panel which prevents disconnection of lead wires drawn from a display area and disposed in a peripheral non-display area and eliminates poor adhesion between a sealing material and an insulating layer. It is about.

The liquid crystal panel has a first substrate provided with pixel electrodes and the like, and a second substrate disposed opposite to the substrate, and seals either one of the first substrate or the second substrate. The material is applied to the periphery of the substrate excluding the portion where the liquid crystal injection port is provided, and bonded together so that a predetermined space is formed between the first and second substrates, and the liquid crystal is injected into the space from the liquid crystal injection port. After the injection, the injection port is manufactured through a process such as sealing with a sealing material.

Since it is not possible to improve the productivity of the liquid crystal panels produced one by one, usually, a plurality of large glass substrates, so-called mother substrates, are used, and a plurality of them are simultaneously divided by bonding them together. It is manufactured. Each liquid crystal panel is manufactured through a step of cutting one substrate and exposing a terminal region to which an external control circuit is connected to the other substrate surface during this step.

However, the exposed terminal region is usually not a flat surface, but has an uneven surface with a height difference. For this reason, if a foreign substance such as glass powder or cullet (debris) generated during cutting of the substrate hits this uneven surface, the insulating film covering the wiring disposed in the terminal area is broken, and the wiring is damaged and disconnected. I might let you.

Therefore, in order to prevent such damage and disconnection, a liquid crystal display device has been proposed in which a resin film is provided on the uppermost layer to protect the wiring (for example, see Patent Document 1 below).

5A is a plan view of a liquid crystal display panel provided in the liquid crystal display device disclosed in Patent Document 1, FIG. 5B is a cross-sectional view taken along the line VB-VB in FIG. 5A, and FIG. 5C is an enlarged cross-sectional view of the VC portion in FIG. FIG. Hereinafter, with reference to FIGS. 5A to 5C, a liquid crystal display device disclosed in Patent Document 1 below will be described.

The liquid crystal display device 20 includes first and second transparent substrates 22, 2 bonded together with a sealing material 24.
3 is provided. The first transparent substrate 22 has a display region 25 surrounded by a sealing material 24 and a terminal region 27 in which wirings 26 are formed on a surface facing the second transparent substrate 23.
have. In the terminal region 27, a resin film 30 having a flat surface is provided on the uppermost layer other than the portion to be externally connected. These first and second transparent substrates 22 and 23 are cut along a scribe line 23a provided on the surface of the second transparent substrate 23 after a sealing material 24 is applied and bonded to one substrate. The first transparent substrate 22 is manufactured so that the terminal region 27 is exposed. Sealing material 24 and resin film 30 at the location where the second transparent substrate 23 is cut.
In general, as shown in FIG. 5C, the wiring 26 and the resin film 3 disposed on the first transparent substrate 22.
An insulating layer such as a gate insulating film 28 and a protective insulating film 29 is interposed between zero and 0.

Therefore, the liquid crystal panel 21 includes a portion to be cut and a sealing material 24 adjacent to the portion.
In the vicinity where the coating is applied, the wiring 26 on the first transparent substrate 22 is, for example, a gate insulating film 28.
The resin film 30 is laminated on an insulating layer made of the protective insulating film 29 and the like, and the second transparent substrate 23 is bonded to the second transparent substrate 23 with the sealing material 24 interposed therebetween on the laminate. A part of is cut off. According to this configuration, since the wiring disposed on the substrate is protected by the resin film 30 at the time of cutting, disconnection of the wiring due to foreign matters such as glass powder and cullet is suppressed.
JP 2007-78931 A (paragraphs [0029], [0030], FIG. 3)

In the liquid crystal display device 20 of Patent Document 1, the wiring 26 disposed on the substrate is protected by being covered with the resin film 30, so that the wiring 26 is damaged by foreign matters such as glass powder and cullet at the time of cutting. Alternatively, disconnection can be prevented.

However, in the structure of the liquid crystal display device 20 disclosed in Patent Document 1, the sealing material 24 is disposed on the resin film 30 that covers the wiring 26. Conventionally, the resin film 30 and the sealing material 2 are provided.
There is a problem of adhesion between 4 and 4 and adhesion failure may occur. For example, when evacuation is performed at the time of liquid crystal injection or other film formation, the sealing material 24 and the resin film 30 are peeled off at this portion, which may cause poor adhesion. In addition, water may enter the display area 25 from this portion. That is, the resin film 30 is usually formed of an acrylic resin,
On the other hand, as the sealing material 24, an epoxy resin or a phenol resin having a high degree of crosslinking is used.
It is difficult to maintain good adhesion between these materials. In addition, since the resin film 30 is easily infiltrated with moisture, when the panel is placed in a high temperature and high humidity environment for several tens of hours in a test performed during use of the completed liquid crystal panel or in its manufacturing process, for example, a high temperature and high humidity test Moisture may enter the display region through the surface of the resin film or the resin material. When moisture enters the display area, the resistance value of the liquid crystal decreases, resulting in deterioration of display quality, for example, display unevenness.

In addition, when the resin film is provided on the insulating layer as in the liquid crystal display device disclosed in Patent Document 1, the sealing material applied by the thickness of the resin film becomes short. . Therefore, in the bonding process of both substrates during panel manufacturing, after applying a predetermined amount of sealing material to one substrate, this sealing material is pressed with the other substrate, so that it has a predetermined shape, ie, a low height. In order to achieve this, the pressure applied to both substrates must be increased. For this reason, when this pressure is removed after completion of the bonding, a strong repulsive force from the resin material constituting the sealing material acts on both substrates in proportion to the applied pressure. For this reason, since adjustment of the space | interval between both board | substrates, ie, the sealing material also has the function to hold | maintain the gap between both board | substrates uniformly, adjustment of the space | interval of this gap becomes difficult. In addition, the time required for bonding becomes longer, which is an obstacle to improving productivity.

Accordingly, the present invention has been made to solve such problems of the conventional technology, and an object of the present invention is to prevent disconnection of the lead wiring drawn from the display area to the non-display area, and to It is an object of the present invention to provide a liquid crystal panel that is improved in reliability by preventing a decrease in adhesion between a material and an insulating layer.

In order to achieve the above object, the liquid crystal panel of the present invention includes a plurality of lead lines that are drawn from the display area to the non-display area and covered with an insulating layer, and terminals to which these lead lines are connected to an external control circuit. A first substrate having a region, and a second substrate made of a transparent substrate disposed opposite to the first substrate, and the first substrate or the second substrate has the first substrate In a liquid crystal panel in which a sealing material is applied to a portion corresponding to a non-display area and bonded, the first substrate is a cutting line that cuts off the second substrate excluding the portion where the sealing material is provided. A protective member is disposed on the insulating layer at a corresponding location.

According to the liquid crystal panel, the sealing material is bonded to an insulating material made of SiNx or the like that forms an insulating layer that covers the lead wiring, and has better adhesion than those bonded to the resin film as in the prior art. Can be maintained. As a result, unlike the conventional resin film, SiN
Since the insulating material made of x or the like is difficult for moisture to enter, moisture does not enter the display area from the outside, and the display quality is prevented from deteriorating due to moisture penetration, thereby improving the reliability. it can. In addition, since the protective wiring is further laminated on the insulating layer on the lead-out wiring, the thickness of the lead-out wiring is increased by foreign matter such as glass powder or cullet generated when the second substrate is cut in the panel manufacturing process. However, it is possible to prevent the lead wiring from being damaged or disconnected. Furthermore, since this protective member exists only near the cutting line and does not exist at the location where the sealing material is applied, the sealing material is placed between the first and second substrates, and a high pressure is applied during bonding. Can be formed without hanging.

In the liquid crystal panel, it is preferable that the protection member is extended from the vicinity of the seal member or the cutting line to the terminal region.

According to the preferable aspect, since the protective member is extended from the vicinity of the seal member or the cutting line to the terminal area, in these areas, damage to the lead-out wiring, disconnection, and a short circuit between the wirings can be effectively suppressed. .

In the liquid crystal panel, the protective member is preferably formed of the same process and the same material as an interlayer film provided below the pixel electrode in the display area.

According to the preferable aspect, the protective member is formed of the same process and the same material as the interlayer film provided under the pixel electrode in the display region, and thus can be easily disposed without adding a special process.

In the liquid crystal panel, the protective member is preferably formed of the same process and the same material as the columnar spacers disposed in the display area.

According to the preferable aspect, the protective member is formed of the same process and the same material as the columnar spacers disposed in the display region, and thus can be easily formed without adding a special process.

Hereinafter, the best embodiment of the present invention will be described with reference to the drawings. However, the embodiment described below exemplifies a liquid crystal panel for embodying the technical idea of the present invention, and is not intended to specify the present invention for this liquid crystal panel. Other embodiments within the scope are equally applicable.

FIG. 1 is a plan view illustrating a liquid crystal panel according to an embodiment of the present invention so that the wiring of a TFT array substrate can be seen through a laminated color filter substrate. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 3 is an enlarged plan view of one pixel in the display area of the liquid crystal panel of FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.

As shown in FIGS. 1 and 2, the liquid crystal panel 1 includes a pair of TFT array substrates (hereinafter simply referred to as “array substrates”) made of a substantially rectangular transparent material substrate, such as a glass substrate, which are opposed to each other. 2 and a color filter substrate (hereinafter simply referred to as “CF substrate”) 12. The array substrate 2 and the CF substrate 12 constitute first and second substrates, respectively, and a sealing material 9 is applied to the outer periphery (non-display area) of one of the substrates, and a predetermined size is formed inside. The liquid crystal LC is sealed in this space so as to form a space. After these array substrate 2 and CF substrate 12 are bonded together, C substrate
A terminal region T is exposed on the array substrate 2 by cutting along a scribe line (cutting line) S provided on the F substrate 12, and a liquid crystal driving driver Dr for driving the liquid crystal LC is provided in the terminal region T. . Further, the array substrate 2 and the CF substrate 12 have polarizing plates 18a, 1 on their outer surfaces.
8b is provided. The array substrate 2 and the CF substrate 12 are provided with various electrodes, wirings, color filters, and the like on the opposing surfaces.

The array substrate 2 has a plurality of gate wirings GW _{1 to} GW _n (n = 2, 3,...) (Hereinafter collectively referred to as “gate wiring GW”) and a plurality of source wirings on the surface thereof. SW
_{1 to} SW _n (n = 2, 3,...) (Hereinafter collectively referred to as “source wiring SW”) are arranged in a matrix form with an insulating film therebetween in the display area DA. Yes. The periphery of the display area DA is a non-display area NDA, and a plurality of routing lines GL _{1 to} GL _n and SL _{1 to} SL _n are arranged in the non-display area NDA. One end of each of the routing wirings GL _{1 to} GL _n and SL _{1 to} SL _n is each gate wiring GW ₁ in the display area DA.
To GW _n and source wirings SW _{1 to} SW _n . That is, the routing lines GL _{1 to} GL _n and SL _{1 to} SL _n are connected to the gate lines GW _{1 to} GW _n in the display area DA.
In addition, these are wirings drawn from the source wirings SW _{1 to} SW _n to the non-display area NDA, so-called leading wirings. Further, the other ends of the routing wires GL _{1 to} GL _n and SL _{1 to} SL _n are extended to the driver mounting region T _{1 in} the terminal region T, and the driver for driving the liquid crystal mounted in this region Connected to Dr.

The array substrate 2 is bonded to the CF substrate 12, and a protective member 11 having a predetermined width and thickness is formed at a predetermined position on the array substrate 2. The protective member 11
Will be described later.

Next, a manufacturing process of the liquid crystal panel will be described with reference to FIGS.
The liquid crystal panel 1 is manufactured from a large-sized array and CF mother glass substrate (hereinafter simply referred to as “mother substrate”). That is, using large-sized array and CF mother substrates, forming predetermined electrodes and wiring and color filters on each mother substrate, applying a sealing material to the cell area, A step of bonding the two substrates so that a space of a predetermined size is formed on the substrate, a step of dividing the bonded substrate into individual cells, a step of injecting liquid crystal into the space of the individual cells, and injecting liquid crystal The liquid crystal injection port is manufactured through a process such as a process of sealing the liquid crystal injection port with a sealing material. The individual liquid crystal panels are also manufactured by cutting along the scribe lines S provided on the CF substrate 12 during these steps to expose the terminal regions T on the array substrate 2.

The liquid crystal panel 1 is manufactured through the above manufacturing process using the large-sized array and CF mother substrates as described above, and the manufacturing process of one liquid crystal panel will be described in detail below for convenience of explanation.

As shown in FIGS. 1 and 4, the array substrate 2 has a plurality of glass substrates 2a extending in the row direction (lateral direction in FIG. 1) at a predetermined interval on the surface of the glass substrate 2a that contacts the liquid crystal LC. and the gate line _GW 1 _{~GW n} of a plurality of auxiliary capacitance electrodes C extending between and in parallel to each other gate lines _GW 1 _{~GW n} of the plurality of the end portion of the gate wiring _GW 1 _{~GW n} Connected gate wirings GL _{1 to} GL _n for the gate wiring are arranged at predetermined positions. These gate lines GW ₁
˜GW _n and auxiliary capacitance electrode C are covered with a gate insulating film 4 made of an inorganic transparent insulating material such as SiO ₂ or SiN _X.

Next, a plurality of source lines SW _{1 to} SW _n are arranged in a matrix on the surface of the gate insulating film 4 so as to be orthogonal to the gate lines GW _{1 to} GW _n and the source lines SW
₁ arranged to SW _n source lead wirings _SL 1 to SL _n for connection to a source wiring on the end portion of the thin film transistor at a position where the these gate wiring GW and the source wire GW crossing (TF
T: Thin Film Transistor) is provided.

In this TFT, a semiconductor layer 6 made of amorphous silicon (a-Si) or the like is formed on a gate electrode G extending from a plurality of gate wirings GW _{1 to} GW _n , and a part of the semiconductor layer 6 overlaps. Thus, the source electrode S and the drain electrode D extending from the source wirings SW _{1 to} SW _n are formed. In addition, SiO ₂ or SiN _X so as to cover this TFT
A protective insulating film (also called a passivation film) 5 made of an inorganic transparent insulating material such as is formed.

The drain electrode D of the TFT overlaps the auxiliary capacitance electrode C through the gate insulating film 4,
Further, it is connected to the pixel electrode 7 through a contact hole CH formed in the protective insulating film 5. Each region surrounded by the gate wirings GW _{1 to} GW _n and the source wirings SW _{1 to} SW _n constitutes one pixel (sub pixel), and the area where these pixels are formed serves as the display region DA. Yes. Further, a columnar spacer 10 is formed at a predetermined position in the display area DA, for example, on the TFT. The display area DA including the columnar spacer 10 is covered with the alignment film 8 (see FIG. 4). The alignment film 8 is rubbed using a rubbing roller or the like.

The periphery of the display area DA is a non-display area NDA. As shown in FIG. 1, the non-display area NDA is formed by a frame-like portion including areas WA ₁ and WA ₂ on both sides of the display area DA and a terminal area T below the scribe line S (see FIG. 1). . In the non-display area NDA, a lead wiring connected to the gate wiring GW and the source wiring SW provided in the display area DA is provided.

Next, the wiring structure of the lead wiring (lead wiring) disposed in the non-display area NDA will be described.
The gate lines GW _{1 to} GW _n and the source lines SW _{1 to} SW _n in the display area DA are drawn from the display area DA to the non-display area NDA and connected to the respective lead lines.
That is, among the gate lines GW _{1 to} GW _n and the source lines SW _{1 to} SW _n , the gate lines GW _{1 to} GW _n are outside the display area DA of the array substrate 2, that is, around both sides of the display area DA. It is led out to the regions WA ₁ and WA ₂ and connected to the respective lead wirings GL _{1 to} GL _n (n = 2, 3,...) For gate wiring provided in the column direction (vertical direction). At this time, the gate wirings in the odd-numbered rows, for example _{GW 1, GW 3, GW 5} ... is drawn in the left area WA ₁ in FIG. 1, each of the lead wirings _{GL 1, GL 3, GL 5} ... GL n _-1 .

On the other hand, even-numbered gate wirings, for example, GW ₂ , GW ₄ , GW ₆ ...
It is pulled out to A ₂ and connected to the routing wires GL ₂ , GL ₄ , GL ₆ ... GL _n , respectively. Distribution of the wiring, i.e. by wiring sorting gate wiring and even rows in one area WA ₁ the gate lines in the odd-numbered rows in the other region WA _2, so can be disposed in good balance on a substrate Become.

Each of the source lines SW _{1 to} SW _n is drawn out of the display area DA of the array substrate 2, that is, in the direction of the terminal area T below the display area DA, and each of the lead lines SL ₁ to SW _n for the source lines.
It is connected to SL _n (n = 2, 3,...).

The array substrate 2 on which various wirings and the like are thus formed is bonded to the CF substrate 12,
In this array substrate 2, a protective member 11 having a predetermined width and thickness is laminated on the lead wiring SL in a predetermined section near the scribe line S for cutting the CF substrate 12,
That is, it is formed on the protective insulating film 5 covering the gate insulating film 4. The protective member 11 is disposed at a position corresponding to the cutting line S that cuts the CF substrate 12 excluding a portion where the sealing material 9 is provided. This protective member 11 is not formed immediately below the sealing material 9.

The protective member 11 is formed of a resin film that covers and flattens the uneven surface of the terminal region T. The protective member 11 is preferably formed by the same process and the same material as the interlayer film 3 provided under the pixel electrode 7 in the display area DA. Moreover, you may form by the same process and the same material as a spacer.

In the terminal region T, as shown in FIG. 2, the lead-out wiring SL is extended from the display area DA to the terminal area T, and the terminal t is connected to the end of the extended wiring SL ′. ing. The terminal t is connected to the lead wiring SL through a contact hole formed in the protective insulating film 5.

Note that the respective lead wirings GL _{1 to} GL _n , SL _{1 to} SL _n and the insulating film covering these lead wirings are wirings and insulating films provided in the display area DA, for example, the gate wiring GW _1.
GW _n , source wirings SW _{1 to} SW _n , gate insulating film 4, protective insulating film 5, interlayer film 3, and the like are used in the same process. Thereby, these routing wirings GL ₁
˜GL _n , SL ₁ ˜SL _n can be formed without increasing the number of special manufacturing processes, and the wiring of the lead wirings GL ₁ ˜GL _n , SL ₁ ˜SL _n is simplified.

On the other hand, as shown in FIG. 4, the CF substrate 12 is first provided with a black matrix 13 in a matrix shape on the glass substrate 12 a in accordance with the pixel region of the array substrate 2. Next, a plurality of colors such as red (R), green (G), and blue (B) are displayed in the area surrounded by the black matrix 13.
These color filters 14 are provided and covered with a planarizing film 15. Next, the planarizing film 1
After the common electrode 16 is provided on 5, it is covered with an alignment film 17. The alignment film 17 is rubbed in a predetermined direction.

After the array substrate 2 and the CF substrate 12 are formed by the above process, both the substrates 2 and 12 are formed.
Paste. In this bonding, a sealing material 9 is applied to the outer periphery of the display area DA of the array substrate 2 and the CF substrate 12 is bonded in a state of facing each other to form a space of a predetermined size between the substrates 2 and 12. Form. By this bonding, the columnar spacer 10 has a CF substrate 1 at the top.
2 is in contact with the surface. Next, liquid crystal LC is sealed between the bonded substrates 2 and 12 from a liquid crystal injection port 9a formed in advance.

Of the two substrates 2 and 12 that are bonded together, the CF substrate 12 is cut from the scribe line S. This excision is performed, for example, by a scribe break method. That is, first, the CF substrate 1
For example, a scribe line S formed by a small groove is put on the outer surface of the portion to be the second cut surface 12b. Then, the end material 12c is broken by hitting the outer surface of the array substrate 2 facing the cut surface 12b.

In the prior art, when the edge 12c is removed, if the corner of the cut surface 12b hits the laminated body 2 ′ (see FIG. 2) made of the protective insulating film 5 or the like, the laminated body 2 ′ is peeled off by the impact and drawn. The wiring SL may be exposed or disconnected, and if a part of the cut surface 12b is cut off and remains on the laminate 2 'as a cullet, the cullet may be sandwiched and routed in a later process, and the wiring SL may be disconnected. there were. However, in the present invention, the surface side of the lead wiring SL is covered with the protruding protective member 11 in addition to the protective insulating film 5, so that in the manufacturing process of the liquid crystal panel 1,
Damage and disconnection of the lead wiring SL are also suppressed by foreign matters such as glass powder and cullet generated when the substrate 12 is cut (see FIG. 2).

After the array substrate 2 and the CF substrate 12 are bonded to each other, the end region 12c of the CF substrate 12 is cut away to expose the terminal region T. In the terminal region T, as shown in FIG. 2, the lead wiring SL is extended from the display region DA to the terminal region T, and the terminal t is connected to the end of the extended lead wiring SL. Yes. This terminal t is connected to the terminal of the liquid crystal drive driver Dr. Here, it is described that the terminal t is connected to the end portion of the routing wiring SL, but the terminal t is also connected to the end portion of the routing wiring GL.

In the liquid crystal panel 1 according to this embodiment, the sealing material 9 has good adhesion to the protective insulating film 5 made of SiNx or the like and is bonded in contact with each other, so that the adhesion is not lowered. Further, since the protective member 11 exists only in a predetermined section and is not directly under the sealant 9, the sealant 9 is located between the array substrate 2 and the CF substrate 12 and is not subjected to high pressure when being bonded. Can be formed high. As a result, it is possible to provide a highly reliable liquid crystal panel 1 that prevents disconnection of the routing wirings GL and SL and prevents a decrease in the adhesion of the sealing material 9.
In addition, by improving the adhesion by improving the adhesion, the sealing material becomes difficult to peel off from the insulating film when the chamber is evacuated at the time of liquid crystal injection or various film formations, which causes defects during the process. It is no longer generated and the product yield can be improved.

In addition, since the interlayer film 3 is easily infiltrated with moisture, it is difficult to infiltrate the moisture even in a liquid crystal panel that has been subjected to a long-term durability test in a high-humidity tank by disposing it inside the sealing material 9. Since the liquid crystal and moisture are prevented from being mixed, display quality can be prevented from deteriorating.

Further, when the protective member 11 is formed in the same process and with the same material as the columnar spacer 10, the cell gap can be uniformly maintained in cooperation with the columnar spacer 10 disposed in the display area DA. That is, there is no gap difference between the array substrate 2 and the CF substrate 12 between the inner side and the outer side of the sealing material 9, and the height from the inner surface of the sealing material 9, that is, the substrate surface in the display area DA to the top of the spacer. Corresponding gaps can also be formed in the outer non-display area NDA.

Although the liquid crystal panel according to the present invention has been described as a liquid crystal panel of an active matrix type, it is not limited to this type of liquid crystal panel and can be applied to other types.

FIG. 3 is a plan view illustrating the liquid crystal panel according to the first embodiment of the present invention so that the wiring of the TFT array substrate can be seen through the laminated color filter substrate. It is sectional drawing of the II-II line of FIG. FIG. 2 is a plan view in which one pixel is enlarged in the display area of FIG. 1. It is sectional drawing of the IV-IV line of FIG. FIG. 5A is a plan view of a liquid crystal display panel, FIG. 5B is a cross-sectional view taken along line VB-VB in FIG. 5A, and FIG. 5C is an enlarged cross-sectional view of a portion VC in FIG.

Explanation of symbols

1: Liquid crystal panel 2: TFT array substrate (first substrate) 2a: Glass substrate 3: Interlayer film 4: Gate insulating film 5: Protective insulating film 6: Semiconductor layer 7: Pixel electrode 8: Alignment film 9:
Sealing material 10: columnar spacer, 11: protective member, 12: color filter substrate (second substrate), 12a: glass substrate 12b: cut surface 12c: end material 13: black matrix 14: color filter 15: flattening film 16 : Common electrode 17: Alignment film 18a, 1
8b: Polarizing plate C: Auxiliary capacitance electrode D: Drain electrode G: Gate electrode GW _{1 to} GW _n
: Gate wiring GL _{1 to} GL _n : Lead wiring (lead wiring) SW _{1 to} SW _n : Source wiring SL _{1 to} SL _n : Lead wiring (lead wiring) S: Scribe line (cutting line)

Claims (4)

A first substrate having a plurality of lead wires drawn from the display region to the non-display region and covered with an insulating layer, and a terminal region to which these lead wires are connected to an external control circuit; and the first substrate And a second substrate made of a transparent substrate disposed oppositely, and a sealing material is applied to one of the first and second substrates and applied to a location corresponding to the non-display area. In the combined liquid crystal panel,
In the first substrate, a protective member is disposed on the insulating layer at a location corresponding to a cutting line that cuts off the second substrate excluding a portion where the sealing material is provided. LCD panel. The liquid crystal panel according to claim 1, wherein the protection member extends from the vicinity of the seal member or the cutting line to the terminal region. The liquid crystal panel according to claim 1, wherein the protective member is formed of the same process and the same material as an interlayer film provided under the pixel electrode in the display region. 3. The liquid crystal panel according to claim 1, wherein the protective member is formed of the same process and the same material as the protruding spacers disposed in the display area.

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