JP2009205897A - Organic light-emitting device and manufacturing method of the same - Google Patents

Organic light-emitting device and manufacturing method of the same Download PDF

Info

Publication number
JP2009205897A
JP2009205897A JP2008045904A JP2008045904A JP2009205897A JP 2009205897 A JP2009205897 A JP 2009205897A JP 2008045904 A JP2008045904 A JP 2008045904A JP 2008045904 A JP2008045904 A JP 2008045904A JP 2009205897 A JP2009205897 A JP 2009205897A
Authority
JP
Japan
Prior art keywords
organic light
light emitting
emitting device
anode
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008045904A
Other languages
Japanese (ja)
Inventor
Junji Kakigi
淳司 柿木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2008045904A priority Critical patent/JP2009205897A/en
Publication of JP2009205897A publication Critical patent/JP2009205897A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90Assemblies of multiple devices comprising at least one organic light-emitting element
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/8794Arrangements for heating and cooling

Landscapes

  • Electroluminescent Light Sources (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic light-emitting device, improved in generation of light and dark caused by joints between organic light-emitting elements, and its manufacturing method. <P>SOLUTION: The organic light-emitting device 10 comprises: a plurality of organic light-emitting elements 11, in which an organic light-emitting layer 3 sandwiched between an anode 2 and a cathode 4 is arranged on a substrate 1, and the organic light-emitting layer 3 as well as the anode 2 and the cathode 4 are sealed with a sealing plate 7; and a supporting substrate 8 having attachment holes 9 for fixing the organic light-emitting elements 11. Each of the organic light-emitting elements 11 has a plurality of bent end parts 11a, and the organic light-emitting layer 3 is arranged so as to be extended to a region of the bent end parts 11a. The organic light-emitting elements 11 are arranged adjacent to each other by inserting the bent end parts 11a of the organic light-emitting elements 11 in the attachment holes 9. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、複数の有機発光素子を有する有機発光装置及び有機発光装置の製造方法に関し、特に、有機発光素子間のつぎ目による明暗の発生を改善した有機発光装置及び有機発光装置の製造方法に関する。   The present invention relates to an organic light-emitting device having a plurality of organic light-emitting elements and a method for manufacturing the organic light-emitting device. .

近年、有機発光素子として有機EL(EL:Electroluminescence)素子を用いた照明装置が実用化に向けて開発が進められている。従来、有機発光部や電極を保護するために封止ガラス等で封止した有機EL素子が知られている(例えば、特許文献1参照。)。   In recent years, lighting devices using organic EL (EL) elements as organic light-emitting elements have been developed for practical use. 2. Description of the Related Art Conventionally, an organic EL element sealed with sealing glass or the like in order to protect an organic light emitting unit or an electrode is known (for example, see Patent Document 1).

図6に、従来の有機EL素子構造の一例を示す。従来の有機EL素子では、ガラス基板100上に積層して形成された陽極20、発光層30、及び絶縁膜70を介して陽極20と絶縁された陰極40を、ガラスからなる封止板80でシール材50,60によってガラス基板100上に接着封止している。   FIG. 6 shows an example of a conventional organic EL element structure. In the conventional organic EL element, the anode 20 formed by laminating on the glass substrate 100, the light emitting layer 30, and the cathode 40 insulated from the anode 20 through the insulating film 70 are replaced with a sealing plate 80 made of glass. The glass substrate 100 is adhesively sealed with sealing materials 50 and 60.

上述した有機EL素子を用いて、大面積の照明パネルを作製する場合、有機EL素子を複数並べて配置する必要がある。しかしながら、このような照明パネルを点灯した場合、図6に示すように、有機EL素子には発光層30上方の発光領域とシール材50,60上方に非発光領域があるため、発光領域と有機EL素子間のつぎ目における非発光領域により明暗が生じ、暗部が縞状に見えるなど、均一な輝度が得られないといった問題があった。
特開2007−128726号公報
When a large-area lighting panel is manufactured using the organic EL elements described above, it is necessary to arrange a plurality of organic EL elements side by side. However, when such an illumination panel is turned on, as shown in FIG. 6, the organic EL element has a light emitting region above the light emitting layer 30 and a non-light emitting region above the sealing materials 50, 60. There is a problem in that uniform brightness cannot be obtained, for example, brightness and darkness occur due to the non-light-emitting region at the next between the EL elements, and the dark part looks like stripes.
JP 2007-128726 A

本発明の目的は、有機発光素子間のつぎ目による明暗の発生を改善した有機発光装置及び有機発光装置の製造方法を提供することにある。   The objective of this invention is providing the manufacturing method of the organic light-emitting device which improved generation | occurrence | production of the light and dark by the next between organic light emitting elements, and an organic light-emitting device.

上記目的を達成するための本発明の一態様によれば、基板上に陽極及び陰極に挟まれた有機発光層が配置され、前記陽極及び前記陰極と共に前記有機発光層を封止板で封止した、複数の有機発光素子と、前記有機発光素子を固定するための取付け孔を有する支持基板とを備え、前記有機発光素子は、折曲した端部を複数有しており、かつ前記有機発光層が前記折曲した端部の領域に延伸して配置されており、前記有機発光素子の折曲した端部を前記取付け孔に挿入して、互いに隣接して配置されたことを特徴とする有機発光装置が提供される。   According to one aspect of the present invention for achieving the above object, an organic light emitting layer sandwiched between an anode and a cathode is disposed on a substrate, and the organic light emitting layer is sealed with a sealing plate together with the anode and the cathode. The organic light emitting device includes a plurality of organic light emitting devices and a support substrate having a mounting hole for fixing the organic light emitting devices, the organic light emitting devices have a plurality of bent ends, and the organic light emitting devices. A layer is disposed to extend in the region of the bent end portion, and the bent end portion of the organic light emitting device is inserted into the attachment hole and is disposed adjacent to each other. An organic light emitting device is provided.

上記目的を達成するための本発明の他の態様によれば、基板上に陽極及び有機発光層を形成する工程と、絶縁層及び陰極を形成する工程と、絶縁層及び封止板を形成して有機発光素子を作製する工程と、支持基板に取付け孔を形成する工程と、前記有機発光素子の端部を折曲して、該端部を前記取付け孔に取付ける工程とを有する有機発光装置の製造方法が提供される。   According to another aspect of the present invention for achieving the above object, a step of forming an anode and an organic light emitting layer on a substrate, a step of forming an insulating layer and a cathode, and forming an insulating layer and a sealing plate are formed. An organic light emitting device comprising: a step of fabricating an organic light emitting element; a step of forming a mounting hole in a support substrate; and a step of bending an end portion of the organic light emitting element and mounting the end portion to the mounting hole. A manufacturing method is provided.

本発明の有機発光装置及び有機発光装置の製造方法によれば、有機発光素子間のつぎ目による明暗の発生を改善することができる。   According to the organic light emitting device and the method for manufacturing the organic light emitting device of the present invention, it is possible to improve the occurrence of light and darkness due to the next between the organic light emitting elements.

以下、図面を参照して本発明の実施の形態による有機発光装置を説明する。以下の図面の記載において、同一又は類似の部分には同一又は類似の符号を付している。ただし、図面は模式的なものであり、現実のものとは異なり、また、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれていることに留意すべきである。   Hereinafter, an organic light emitting device according to an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, differ from actual ones, and also include portions having different dimensional relationships and ratios between the drawings.

[第1の実施の形態]
(有機発光装置の構造)
本発明の第1の実施の形態に係る有機発光装置は、図1に示すように、基板1上に陽極2及び陰極4に挟まれた有機発光層3が配置され、陽極2及び陰極4と共に有機発光層3を封止板7で封止した、複数の有機発光素子11と、有機発光素子11を固定するための取付け孔9を有する支持基板8とを備え、有機発光素子11は、折曲した端部11aを複数有しており、かつ有機発光層3が折曲した端部11aの領域に延伸して配置されており、有機発光素子11の折曲した端部11aを取付け孔9に挿入して、互いに隣接して配置される。
[First embodiment]
(Structure of organic light-emitting device)
In the organic light emitting device according to the first embodiment of the present invention, as shown in FIG. 1, an organic light emitting layer 3 sandwiched between an anode 2 and a cathode 4 is disposed on a substrate 1. A plurality of organic light emitting elements 11 in which the organic light emitting layer 3 is sealed with a sealing plate 7 and a support substrate 8 having a mounting hole 9 for fixing the organic light emitting elements 11 are provided. A plurality of bent end portions 11 a are provided, and the organic light emitting layer 3 is extended and arranged in the bent end portion 11 a region. The bent end portion 11 a of the organic light emitting element 11 is attached to the attachment hole 9. And are arranged adjacent to each other.

第1の実施の形態においては、取付け孔9に、一方の有機発光素子11の折曲した端部11aと隣接する他方の有機発光素子11の折曲した端部11aとが挿入されており、挿入された端部11aの表面同士は接触している。  In the first embodiment, the bent end portion 11a of one organic light emitting element 11 and the bent end portion 11a of the other organic light emitting element 11 adjacent to each other are inserted into the mounting hole 9. The surfaces of the inserted end portion 11a are in contact with each other.

有機発光素子11は、基板1上に、陽極2、有機発光層3及び陰極4が順に積層されて形成されている。陽極2と陰極4は絶縁層5,6を介して絶縁されており、陽極2には陽極2が延伸して配置された陽極端子2aが、陰極4には陰極4が延伸して配置された陰極端子4aがそれぞれ形成されている。有機発光層3の陽極2と陰極4とで上下に挟まれた部分が発光領域となる。   The organic light emitting element 11 is formed by laminating an anode 2, an organic light emitting layer 3, and a cathode 4 in this order on a substrate 1. The anode 2 and the cathode 4 are insulated through insulating layers 5 and 6, the anode 2 has an anode terminal 2 a arranged with the anode 2 extended, and the cathode 4 has the cathode 4 arranged with an extension. Cathode terminals 4a are respectively formed. A portion sandwiched between the anode 2 and the cathode 4 of the organic light emitting layer 3 is a light emitting region.

また、有機発光素子11は、封止板7により陽極端子2a及び陰極端子4aを除いて、陰極4側の表面が封止されている。   The organic light emitting element 11 is sealed on the cathode 4 side by the sealing plate 7 except for the anode terminal 2a and the cathode terminal 4a.

有機発光素子11は、図2に示すように、平面視において略四角形を有し、4辺の各方向に延伸して形成された端部11aを有する。端部11aの長さは、少なくとも支持基板8の厚さより長いことが好ましい。有機発光層3は、平面視において略四角形を有し、4辺の各方向に少なくとも折曲した端部11aの領域に延伸して形成されている。   As shown in FIG. 2, the organic light emitting element 11 has a substantially quadrangular shape in a plan view, and has an end portion 11 a formed by extending in each direction of four sides. The length of the end portion 11 a is preferably longer than at least the thickness of the support substrate 8. The organic light emitting layer 3 has a substantially quadrangular shape in plan view, and is formed to extend in the region of the end portion 11a that is bent at least in each direction of the four sides.

有機発光素子11は、可撓性を有することが好ましい。有機発光素子11が可撓性を有することにより、後述するように、有機発光素子11の端部11aを折曲し、支持基板8の取付け孔9に容易に取付けることができる。   The organic light emitting element 11 preferably has flexibility. Since the organic light emitting element 11 has flexibility, the end portion 11a of the organic light emitting element 11 can be bent and easily attached to the attachment hole 9 of the support substrate 8 as described later.

この有機発光装置10では、基板1側から光が取り出されるように構成されているので、基板1は、可撓性を有し、かつ光を透過する透明基板が用いられる。基板1の材質として、例えば、ポリカーボネート、ポリエチレンテレフタレート等の透明な樹脂やガラス等が挙げられる。厚さは、例えば、約50〜500μm程度であるのがよい。   Since the organic light emitting device 10 is configured such that light is extracted from the substrate 1 side, the substrate 1 is a transparent substrate that has flexibility and transmits light. Examples of the material of the substrate 1 include transparent resins such as polycarbonate and polyethylene terephthalate, and glass. The thickness is preferably about 50 to 500 μm, for example.

陽極2は、基板1と同様に、光を透過可能で、厚さは、例えば、約150〜160nm程度のITO(インジウム−スズ酸化物)の透明電極からなる。   As with the substrate 1, the anode 2 can transmit light and has a thickness of, for example, a transparent electrode of ITO (indium-tin oxide) having a thickness of about 150 to 160 nm.

基板1と陽極2の間には、ガスバリア層(略図示)を配置することが好ましい。これにより、有機発光素子11の寿命の劣化の原因となる水蒸気や酸素等の侵入を防止することができる。ガスバリア層としては、例えば、酸化ケイ素や酸化アルミニウム等の金属酸化物又は窒化アルミニウム、窒化珪素等の金属窒化物が挙げられる。   A gas barrier layer (schematically illustrated) is preferably disposed between the substrate 1 and the anode 2. Thereby, invasion of water vapor, oxygen, or the like that causes the deterioration of the lifetime of the organic light emitting element 11 can be prevented. Examples of the gas barrier layer include metal oxides such as silicon oxide and aluminum oxide, or metal nitrides such as aluminum nitride and silicon nitride.

有機発光層3は、基板1側から、正孔輸送層、発光部及び電子輸送層が順に積層されている。   In the organic light emitting layer 3, a hole transport layer, a light emitting portion, and an electron transport layer are sequentially laminated from the substrate 1 side.

正孔輸送層は、陽極2から注入された正孔を円滑に発光部に輸送するためのものであり、厚さは、例えば、約60nm程度のNPB(N,N−ジ(ナフタリル)−N,N−ジフェニル−ベンジデン)からなる。   The hole transport layer is for smoothly transporting holes injected from the anode 2 to the light emitting portion, and has a thickness of, for example, about NPB (N, N-di (naphthalyl) -N of about 60 nm. N-diphenyl-benzylidene).

電子輸送層は、陰極4から注入された電子を円滑に発光部に輸送するためのものであり、厚さは、例えば、約35nm程度のAlq(アルミニウムキノリノール錯体)からなる。 The electron transport layer is for smoothly transporting electrons injected from the cathode 4 to the light emitting portion, and is made of, for example, Alq 3 (aluminum quinolinol complex) having a thickness of about 35 nm.

発光部は、注入された正孔及び電子が再結合して発光するためのものであり、例えば発光種であるクマリン化合物(C545T)が、例えば、約1%程度ドーピングされ、厚さが、例えば、約30nm程度のAlqからなる。 The light emitting portion is for emitting light by recombination of injected holes and electrons. For example, a coumarin compound (C 545 T), which is a luminescent species, is doped with, for example, about 1% and has a thickness of For example, it is made of Alq 3 of about 30 nm.

なお、有機発光層3は、上記した正孔輸送層及び電子輸送層以外の層、例えば、正孔注入層、電子注入層等を用いて構成しても良い。   In addition, you may comprise the organic light emitting layer 3 using layers other than the above-mentioned hole transport layer and electron transport layer, for example, a hole injection layer, an electron injection layer, etc.

陰極4は、厚さが、例えば、約150nm程度のアルミニウムからなる。   The cathode 4 is made of aluminum having a thickness of about 150 nm, for example.

封止板7は、陽極2、陰極4及び有機発光層3を保護し、これらを封止するものであり、可撓性を有する材質からなる。封止板7の材質としては、樹脂やガラス等、或いはステンレススチール(SUS)や銅等の金属等が挙げられる。厚さは、例えば、約50〜500μm程度であるのがよい。   The sealing plate 7 protects the anode 2, the cathode 4 and the organic light emitting layer 3 and seals them, and is made of a flexible material. Examples of the material of the sealing plate 7 include resin, glass, and the like, and metals such as stainless steel (SUS) and copper. The thickness is preferably about 50 to 500 μm, for example.

支持基板8は、複数の有機発光素子11を固定するためのものである。支持基板8は、有機発光素子11を固定するために、有機発光素子11の端部11aを挿入して固定する取付け孔9を有する。取付け孔9の長さは、例えば、約2〜4cm程度、幅は、例えば、約0.1〜1mm程度である。支持基板8は、有機発光素子11で発生した熱を放熱するための放熱板の機能も有する。   The support substrate 8 is for fixing the plurality of organic light emitting elements 11. The support substrate 8 has a mounting hole 9 for inserting and fixing the end portion 11 a of the organic light emitting element 11 in order to fix the organic light emitting element 11. The length of the attachment hole 9 is about 2 to 4 cm, for example, and the width is about 0.1 to 1 mm, for example. The support substrate 8 also has a function of a heat radiating plate for radiating heat generated in the organic light emitting element 11.

支持基板8は、材質としては、例えば熱伝導性が良好であれば、特に限定されない。例えば、金属や樹脂等が挙げられる。好ましくは銅やアルミニウム等である。また、厚さは、例えば、約0.5〜10mm程度である。   The material of the support substrate 8 is not particularly limited as long as, for example, the thermal conductivity is good. For example, a metal, resin, etc. are mentioned. Preferably, copper or aluminum is used. The thickness is, for example, about 0.5 to 10 mm.

(動作原理)
本発明の第1の実施の形態に係る有機発光装置の動作原理は以下の通りである。
(Operating principle)
The operation principle of the organic light emitting device according to the first embodiment of the present invention is as follows.

まず、外部電極(略図示)から有機発光素子11の陽極端子2a及び陰極端子4aを介して、陽極2及び陰極4の間に一定の電圧が印加される。これにより、陽極2から正孔輸送層を介して発光部に正孔が注入されるとともに、陰極4から電子輸送層を介して発光部に電子が注入される。そして、発光部に注入された正孔と電子とが再結合することによって、光を発光する。発光された光は、基板1を介して外部に出射される。   First, a constant voltage is applied between the anode 2 and the cathode 4 from the external electrode (illustrated) via the anode terminal 2 a and the cathode terminal 4 a of the organic light emitting element 11. As a result, holes are injected from the anode 2 into the light emitting part through the hole transport layer, and electrons are injected from the cathode 4 into the light emitting part through the electron transport layer. Then, the holes and electrons injected into the light emitting portion recombine to emit light. The emitted light is emitted to the outside through the substrate 1.

(製造方法)
図3及び図4は、本発明の第1の実施の形態による有機発光装置の製造方法を説明する図である。
(Production method)
3 and 4 are diagrams illustrating a method for manufacturing the organic light emitting device according to the first embodiment of the present invention.

本発明の第1の実施の形態に係る有機発光装置の製造方法は、基板1上に陽極2及び有機発光層3を形成する工程と、絶縁層5及び陰極4を形成する工程と、絶縁層6及び封止板7を形成して有機発光素子11を作製する工程と、支持基板8に取付け孔9を形成する工程と、有機発光素子11の端部11aを折曲して、端部11aを取付け孔9に取付ける工程とを有する。   The organic light emitting device manufacturing method according to the first embodiment of the present invention includes a step of forming an anode 2 and an organic light emitting layer 3 on a substrate 1, a step of forming an insulating layer 5 and a cathode 4, and an insulating layer. 6 and the sealing plate 7 to form the organic light emitting device 11, the step of forming the attachment hole 9 in the support substrate 8, the end portion 11 a of the organic light emitting device 11 is bent, and the end portion 11 a Attaching to the attachment hole 9.

以下に、製造工程を詳述する。   Below, a manufacturing process is explained in full detail.

(a)まず、図3(a)に示すように、基板1上に陽極2をパターニング、エッチングした後、真空蒸着法等により、酸化ケイ素等からなるガスバリア層(略図示)を形成する。基板1は、図2に示すように、平面視で略四角形を有し、4辺の各方向に延伸した形状に形成したものを用いる。 (A) First, as shown in FIG. 3A, after patterning and etching the anode 2 on the substrate 1, a gas barrier layer (illustrated) made of silicon oxide or the like is formed by vacuum deposition or the like. As shown in FIG. 2, the substrate 1 has a substantially rectangular shape in plan view and is formed in a shape extending in each direction of four sides.

次いで、真空蒸着装置等により、マスク等を用いて、図2に示すように、平面視で略四角形を有し、4辺の各方向に端部11aの領域にまで延伸した形状で、正孔輸送層、発光部、及び電子輸送層を順に成膜して有機発光層3を形成する。   Next, using a mask or the like with a vacuum deposition apparatus or the like, as shown in FIG. 2, the hole has a substantially rectangular shape in plan view and extends in the direction of the end 11a in each of the four sides. The organic light emitting layer 3 is formed by sequentially forming a transport layer, a light emitting portion, and an electron transport layer.

(b)次に、図3(b)に示すように、CVD(Chemical Vapor Deposition)法等によりSiOからなる絶縁層5を形成した後、陰極4をスパッタリング等により成膜する。 (B) Next, as shown in FIG. 3B, after the insulating layer 5 made of SiO 2 is formed by a CVD (Chemical Vapor Deposition) method or the like, the cathode 4 is formed by sputtering or the like.

(c)次に、図3(c)に示すように、CVD法等によりSiOからなる絶縁層6を形成した後、封止板7をスパッタリング等により陽極端子2a及び陰極端子4aを除いて陰極4及び絶縁層5,6の表面に形成する。陽極端子2a及び陰極端子4aは、4つの端部11aのうち対向する一方の1組の端部11aの外縁に対で形成する。4つの端部11aのうち対向する他方の1組の端部11aの外縁に更に対で形成してもよい。 (C) Next, as shown in FIG. 3C, after forming the insulating layer 6 made of SiO 2 by the CVD method or the like, the sealing plate 7 is removed by sputtering or the like except the anode terminal 2a and the cathode terminal 4a. It is formed on the surfaces of the cathode 4 and the insulating layers 5 and 6. The anode terminal 2a and the cathode terminal 4a are formed in pairs on the outer edges of one set of end portions 11a that are opposed to each other among the four end portions 11a. You may form in a pair further on the outer edge of the other one set of edge part 11a which opposes among the four edge parts 11a.

(d)次に、図4(d)に示すように、アルミニウムからなる支持基板8に、フォトリソグラフィ等を用いて、ドライエッチング又はウェットエッチングにより、取付け孔9を形成する。 (D) Next, as shown in FIG. 4D, the attachment holes 9 are formed in the support substrate 8 made of aluminum by dry etching or wet etching using photolithography or the like.

(e)次に、図4(e)に示すように、有機発光素子11の端部11aを折曲し、隣接する有機発光素子11の折曲した端部11aと共に、支持基板8の一方の表面から取付け孔9に挿入して巻き込み、有機発光素子11と支持基板8とを固定する。これにより、図1に示す有機発光装置10が完成する。なお、有機発光素子11は、支持基板8の表面と接着剤等を介して固定してもよい。 (E) Next, as shown in FIG. 4 (e), the end portion 11 a of the organic light emitting element 11 is bent, and together with the bent end portion 11 a of the adjacent organic light emitting element 11, The organic light-emitting element 11 and the support substrate 8 are fixed by inserting into the attachment hole 9 from the surface and winding. Thereby, the organic light emitting device 10 shown in FIG. 1 is completed. The organic light emitting element 11 may be fixed to the surface of the support substrate 8 via an adhesive or the like.

このような有機発光装置10は、有機発光層3が有機発光素子11の端部11aの折曲した領域にも配置されるので、互いに隣接して配置した複数の有機発光素子11間のつぎ目の部分にも発光領域を含むことになる。これにより、つぎ目の部分においても良好な輝度が得られ、全体的に均一な輝度をもった有機発光装置10が得られる。   In such an organic light-emitting device 10, the organic light-emitting layer 3 is also disposed in the bent region of the end 11 a of the organic light-emitting element 11, so that the next is between the plurality of organic light-emitting elements 11 disposed adjacent to each other. This portion also includes a light emitting region. As a result, good luminance is obtained even at the next portion, and the organic light emitting device 10 having uniform luminance as a whole is obtained.

また、支持基板8は、熱伝導性の部材からなるので、有機発光素子11から発生する熱を効率よく除熱することができる。   Further, since the support substrate 8 is made of a heat conductive member, the heat generated from the organic light emitting element 11 can be efficiently removed.

本発明の第1の実施の形態に係る有機発光装置及び有機発光装置の製造方法によれば、有機発光素子11間のつぎ目による明暗の発生を改善することができる。   According to the organic light emitting device and the method for manufacturing the organic light emitting device according to the first embodiment of the present invention, it is possible to improve the occurrence of light and darkness between the organic light emitting elements 11.

[第2の実施の形態]
本発明の第2の実施の形態に係る有機発光装置は、図5に示すように、取付け孔9に、一方の有機発光素子11の折曲した端部11aと隣接する他方の有機発光素子11の折曲した端部11aとが挿入されており、挿入された端部11aの表面間は所定の距離を有する。その他の構成は、第1の実施の形態と同様であるので説明は省略する。
[Second Embodiment]
As shown in FIG. 5, the organic light emitting device according to the second embodiment of the present invention has the other organic light emitting element 11 adjacent to the bent end portion 11 a of one organic light emitting element 11 in the mounting hole 9. The bent end portions 11a are inserted, and there is a predetermined distance between the surfaces of the inserted end portions 11a. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

第2の実施の形態に係る有機発光装置の製造方法は、取付け孔9を形成する方法が第1の実施の形態における製造方法と異なる点であり、他は第1の実施の形態と同様であるので、重複した説明は省略する。   The manufacturing method of the organic light emitting device according to the second embodiment is different from the manufacturing method in the first embodiment in the method of forming the attachment hole 9, and the other is the same as in the first embodiment. Because of this, duplicate explanation is omitted.

第2の実施の形態に係る有機発光装置の製造方法において、取付け孔9の形成の際、取付け孔9の長さを、例えば、約2〜4cm程度、幅を、例えば、約0.3〜2mm程度に形成することにより、有機発光素子11の折曲した端部11aと隣接する有機発光素子11の折曲した端部11aの表面間に、例えば、約0.1〜1mmの距離を有する有機発光装置10Aを製造することができる。   In the method of manufacturing the organic light emitting device according to the second embodiment, when forming the attachment hole 9, the length of the attachment hole 9 is, for example, about 2 to 4 cm, and the width is, for example, about 0.3 to By forming to about 2 mm, for example, a distance of about 0.1 to 1 mm is provided between the surface of the bent end portion 11 a of the organic light emitting element 11 and the bent end portion 11 a of the adjacent organic light emitting element 11. The organic light emitting device 10A can be manufactured.

第2の実施の形態によれば、有機発光素子11の折曲した端部11aと隣接する有機発光素子11の折曲した端部11aの表面間に、所定の距離があるので、有機発光素子11で発生した熱を良好に放熱することができる。   According to the second embodiment, since there is a predetermined distance between the bent end portion 11a of the organic light emitting device 11 and the surface of the bent end portion 11a of the adjacent organic light emitting device 11, the organic light emitting device The heat generated at 11 can be radiated well.

第2の実施の形態によれば、有機発光層3が有機発光素子11の端部11aの折曲した領域にも配置されるので、端部11aの表面間に所定の距離があっても、つぎ目の部分において良好な輝度が得られ、全体的に均一な輝度をもった有機発光装置10Aが得られる。   According to the second embodiment, since the organic light emitting layer 3 is also disposed in the bent region of the end portion 11a of the organic light emitting element 11, even if there is a predetermined distance between the surfaces of the end portions 11a, Good luminance is obtained at the next portion, and the organic light emitting device 10A having uniform luminance as a whole is obtained.

本発明の第2の実施の形態に係る有機発光装置及び有機発光装置の製造方法によれば、有機発光素子11間のつぎ目による明暗の発生を改善することができる。   According to the organic light emitting device and the method for manufacturing the organic light emitting device according to the second embodiment of the present invention, it is possible to improve the occurrence of light and darkness between the organic light emitting elements 11.

[その他の実施の形態]
以上、上述した第1及び第2の実施の形態によって本発明を詳細に説明したが、当業者にとっては、本発明が本明細書中に説明した第1及び第2の実施の形態に限定されるものではないということは明らかである。本発明は、特許請求の範囲の記載により定まる本発明の趣旨及び範囲を逸脱することなく修正及び変更形態として実施することができる。従って、本明細書の記載は、例示説明を目的とするものであり、本発明に対して何ら制限的な意味を有するものではない。以下、上述した第1及び第2の実施の形態を一部変更した変更形態について説明する。
[Other embodiments]
The present invention has been described in detail with the first and second embodiments described above. However, for those skilled in the art, the present invention is limited to the first and second embodiments described in the present specification. Obviously it is not. The present invention can be implemented as modifications and changes without departing from the spirit and scope of the present invention defined by the description of the scope of claims. Therefore, the description of the present specification is for illustrative purposes and does not have any limiting meaning to the present invention. Hereinafter, a modified embodiment in which the first and second embodiments described above are partially modified will be described.

例えば、各層の厚み等の寸法や構成する材料を変更することは可能である。   For example, it is possible to change dimensions such as the thickness of each layer and the constituent materials.

上述した第1の実施の形態に係る有機発光装置において、有機発光素子11の形状は略四角形を有する説明をしたが、略三角形、略六角形等の形状を有してもよい。   In the organic light emitting device according to the first embodiment described above, the organic light emitting element 11 has been described as having a substantially square shape, but may have a substantially triangular shape, a substantially hexagonal shape, or the like.

また、上述した第1及び第2の実施の形態に係る有機発光装置において、基板1側に陽極2、封止板7側に陰極4を配置した説明をしたが、基板1側に陰極、封止板7側に陽極を配置してもよい。この場合、有機発光層3は、基板1側から、電子輸送層、発光部及び正孔輸送層が順に積層される。   In the organic light emitting devices according to the first and second embodiments described above, the anode 2 is disposed on the substrate 1 side and the cathode 4 is disposed on the sealing plate 7 side. An anode may be disposed on the stop plate 7 side. In this case, in the organic light emitting layer 3, the electron transport layer, the light emitting part, and the hole transport layer are sequentially laminated from the substrate 1 side.

また、上述した第1及び第2の実施の形態に係る有機発光装置においては、光を基板1側から取り出す説明をしたが、光を基板1側から取り出すと共に、封止板7側から取り出してもよい。例えば、第2の実施の形態において、陰極4にITOからなる透明電極を、支持基板8に透明な部材を用いる。そして、例えば、封止板7側から射出される光をつぎ目の部分に反射させる反射板等を設けることにより、つぎ目の部分から基板1側に出る光によって、つぎ目の部分での輝度を高めることができる。   Further, in the organic light emitting devices according to the first and second embodiments described above, the light is extracted from the substrate 1 side. However, the light is extracted from the substrate 1 side and is extracted from the sealing plate 7 side. Also good. For example, in the second embodiment, a transparent electrode made of ITO is used for the cathode 4 and a transparent member is used for the support substrate 8. Then, for example, by providing a reflecting plate or the like that reflects light emitted from the sealing plate 7 side to the next portion, the luminance at the next portion is obtained by the light emitted from the next portion to the substrate 1 side. Can be increased.

本発明の第1の実施の形態に係る有機発光装置の模式的断面構造図。1 is a schematic cross-sectional structure diagram of an organic light-emitting device according to a first embodiment of the present invention. 本発明の第1の実施の形態に係る有機発光素子の基板1と有機発光層3との位置関係を示す模式的展開図。FIG. 2 is a schematic development view showing a positional relationship between the substrate 1 and the organic light emitting layer 3 of the organic light emitting element according to the first embodiment of the present invention. 本発明の第1の実施の形態に係る有機発光装置の製造方法の説明図であって、(a)基板1上に陽極2及び有機発光層3を形成する工程図、(b)絶縁層5及び陰極4を形成する工程図、(c)絶縁層6及び封止板7を形成する工程図。It is explanatory drawing of the manufacturing method of the organic light-emitting device which concerns on the 1st Embodiment of this invention, Comprising: (a) Process drawing which forms the anode 2 and the organic light emitting layer 3 on the board | substrate 1, (b) Insulating layer 5 And (c) a process diagram for forming the insulating layer 6 and the sealing plate 7. 本発明の第1の実施の形態に係る有機発光装置の製造方法の説明図であって、(d)支持基板8に取付け孔9を形成する工程図、(e)有機発光素子11を支持基板8に取付ける工程図。It is explanatory drawing of the manufacturing method of the organic light-emitting device concerning the 1st Embodiment of this invention, Comprising: (d) Process drawing which forms the attachment hole 9 in the support substrate 8, (e) The organic light emitting element 11 is a support substrate. FIG. 本発明の第2の実施の形態に係る有機発光装置の模式的断面構造図。The typical cross-section figure of the organic light-emitting device which concerns on the 2nd Embodiment of this invention. 従来の有機発光装置の模式的断面構造図。The typical cross-section figure of the conventional organic light-emitting device.

符号の説明Explanation of symbols

1・・・基板
2・・・陽極
3・・・有機発光層
4・・・陰極
5,6・絶縁層
7・・・封止板
8・・・支持基板
9・・・取付け孔
10,10A・・有機発光装置
11・・有機発光素子
11a・端部
DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Anode 3 ... Organic light emitting layer 4 ... Cathode 5,6, Insulating layer 7 ... Sealing board 8 ... Support substrate 9 ... Mounting hole 10, 10A ..Organic light emitting device 11 ..Organic light emitting element 11a

Claims (6)

基板上に陽極及び陰極に挟まれた有機発光層が配置され、前記陽極及び前記陰極と共に前記有機発光層を封止板で封止した、複数の有機発光素子と、
前記有機発光素子を固定するための取付け孔を有する支持基板とを備え、
前記有機発光素子は、折曲した端部を複数有しており、かつ前記有機発光層が前記折曲した端部の領域に延伸して配置されており、前記有機発光素子の折曲した端部を前記取付け孔に挿入して、互いに隣接して配置されたことを特徴とする有機発光装置。
A plurality of organic light emitting elements, wherein an organic light emitting layer sandwiched between an anode and a cathode is disposed on a substrate, and the organic light emitting layer is sealed together with the anode and the cathode with a sealing plate;
A support substrate having a mounting hole for fixing the organic light emitting element,
The organic light emitting device has a plurality of bent ends, and the organic light emitting layer is disposed extending in the bent end region, and the organic light emitting device has a bent end. An organic light emitting device characterized in that a portion is inserted into the mounting hole and arranged adjacent to each other.
前記取付け孔に、一方の前記有機発光素子の折曲した端部と隣接する他方の前記有機発光素子の折曲した端部とが挿入されており、該挿入された端部の表面同士が接触していることを特徴とする請求項1に記載の有機発光装置。  A bent end of one of the organic light emitting elements and a bent end of the other adjacent organic light emitting element are inserted into the mounting hole, and the surfaces of the inserted end are in contact with each other The organic light-emitting device according to claim 1, wherein 前記取付け孔に、一方の前記有機発光素子の折曲した端部と隣接する他方の前記有機発光素子の折曲した端部とが挿入されており、該挿入された端部の表面間に所定の距離を有することを特徴とする請求項1に記載の有機発光装置。  A bent end of one of the organic light emitting elements and a bent end of the other organic light emitting element adjacent to each other are inserted into the mounting hole, and a predetermined gap is formed between the surfaces of the inserted end. The organic light-emitting device according to claim 1, wherein 前記有機発光素子は、可撓性を有することを特徴とする請求項1〜3のいずれか1項に記載の有機発光装置。   The organic light-emitting device according to claim 1, wherein the organic light-emitting element has flexibility. 前記支持基板は、伝熱性部材からなることを特徴とする請求項1〜4のいずれか1項に記載の有機発光装置。   The organic light-emitting device according to claim 1, wherein the support substrate is made of a heat conductive member. 基板上に陽極及び有機発光層を形成する工程と、
絶縁層及び陰極を形成する工程と、
絶縁層及び封止板を形成して有機発光素子を作製する工程と、
支持基板に取付け孔を形成する工程と、
前記有機発光素子の端部を折曲して、該端部を前記取付け孔に取付ける工程と
を有する有機発光装置の製造方法。
Forming an anode and an organic light emitting layer on a substrate;
Forming an insulating layer and a cathode;
Forming an insulating layer and a sealing plate to produce an organic light emitting device;
Forming a mounting hole in the support substrate;
Bending the end portion of the organic light emitting element, and attaching the end portion to the attachment hole.
JP2008045904A 2008-02-27 2008-02-27 Organic light-emitting device and manufacturing method of the same Pending JP2009205897A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008045904A JP2009205897A (en) 2008-02-27 2008-02-27 Organic light-emitting device and manufacturing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008045904A JP2009205897A (en) 2008-02-27 2008-02-27 Organic light-emitting device and manufacturing method of the same

Publications (1)

Publication Number Publication Date
JP2009205897A true JP2009205897A (en) 2009-09-10

Family

ID=41147974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008045904A Pending JP2009205897A (en) 2008-02-27 2008-02-27 Organic light-emitting device and manufacturing method of the same

Country Status (1)

Country Link
JP (1) JP2009205897A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012133807A1 (en) * 2011-03-30 2012-10-04 大日本印刷株式会社 Electronic-element laminated substrate, electronic element, organic electroluminescent display device, electronic paper, and method for manufacturing electronic-element laminated substrate
NL2007883C2 (en) * 2011-11-28 2013-05-30 Solinso Interconnecting thin layer photo-electronic devices.
WO2014048902A1 (en) * 2012-09-27 2014-04-03 Osram Opto Semiconductors Gmbh Optoelectronic component, method for producing an optoelectronic component and optoelectronic component device
JP2014132319A (en) * 2013-01-07 2014-07-17 Panasonic Corp Display panel and display device using the same
WO2014175198A1 (en) * 2013-04-24 2014-10-30 Semiconductor Energy Laboratory Co., Ltd. Display device
JP2016100314A (en) * 2014-11-26 2016-05-30 パイオニア株式会社 Light emitting device
JP2017091730A (en) * 2015-11-06 2017-05-25 凸版印刷株式会社 Light emitting panel module, light emitting device and manufacturing method for the same
TWI607596B (en) * 2017-02-14 2017-12-01 元太科技工業股份有限公司 Organic thin film transistor and display device
EP3547366A1 (en) * 2018-03-29 2019-10-02 InnoLux Corporation Tiled electronic device
US10700297B2 (en) 2017-02-14 2020-06-30 E Ink Holdings Inc. Display device and organic thin film transistor including semiconductor layer having L-shaped cross-section
JP2020115240A (en) * 2014-10-24 2020-07-30 株式会社半導体エネルギー研究所 Electronic device
JP2021177253A (en) * 2013-11-15 2021-11-11 株式会社半導体エネルギー研究所 Display panel and electronic device
JP2022023143A (en) * 2017-10-20 2022-02-07 パイオニア株式会社 Light-emitting module

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000148050A (en) * 1998-09-07 2000-05-26 Subaru Engineering Kk Display device and its component
JP2002297066A (en) * 2001-03-30 2002-10-09 Sanyo Electric Co Ltd Electroluminescence display device and manufacturing method therefor
WO2007054947A2 (en) * 2005-11-14 2007-05-18 Irina Kiryuschev Display module and tiled display manufacturing method
WO2008123416A1 (en) * 2007-03-30 2008-10-16 Pioneer Corporation Light emitting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000148050A (en) * 1998-09-07 2000-05-26 Subaru Engineering Kk Display device and its component
JP2002297066A (en) * 2001-03-30 2002-10-09 Sanyo Electric Co Ltd Electroluminescence display device and manufacturing method therefor
WO2007054947A2 (en) * 2005-11-14 2007-05-18 Irina Kiryuschev Display module and tiled display manufacturing method
WO2008123416A1 (en) * 2007-03-30 2008-10-16 Pioneer Corporation Light emitting device

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI549200B (en) * 2011-03-30 2016-09-11 大日本印刷股份有限公司 Laminate substrate for electron device, electron device, display apparatus for organic electroluminescence, electronic paper, and manufacturing method for laminate substrate for electron device
WO2012133807A1 (en) * 2011-03-30 2012-10-04 大日本印刷株式会社 Electronic-element laminated substrate, electronic element, organic electroluminescent display device, electronic paper, and method for manufacturing electronic-element laminated substrate
NL2007883C2 (en) * 2011-11-28 2013-05-30 Solinso Interconnecting thin layer photo-electronic devices.
DE102012109138B4 (en) 2012-09-27 2022-05-25 Osram Oled Gmbh Optoelectronic component, method for producing an optoelectronic component and optoelectronic component device
WO2014048902A1 (en) * 2012-09-27 2014-04-03 Osram Opto Semiconductors Gmbh Optoelectronic component, method for producing an optoelectronic component and optoelectronic component device
JP2014132319A (en) * 2013-01-07 2014-07-17 Panasonic Corp Display panel and display device using the same
WO2014175198A1 (en) * 2013-04-24 2014-10-30 Semiconductor Energy Laboratory Co., Ltd. Display device
US9111841B2 (en) 2013-04-24 2015-08-18 Semiconductor Energy Laboratory Co., Ltd. Display device
US9564473B2 (en) 2013-04-24 2017-02-07 Semiconductor Energy Laboratory Co., Ltd. Display device
US9780160B2 (en) 2013-04-24 2017-10-03 Semiconductor Energy Laboratory Co., Ltd. Display device
US11893299B2 (en) 2013-11-15 2024-02-06 Semiconductor Energy Laboratory Co., Ltd. Display panel and electronic device
JP2023058624A (en) * 2013-11-15 2023-04-25 株式会社半導体エネルギー研究所 display panel
JP2021177253A (en) * 2013-11-15 2021-11-11 株式会社半導体エネルギー研究所 Display panel and electronic device
JP2021071731A (en) * 2014-10-24 2021-05-06 株式会社半導体エネルギー研究所 Display device
JP7043582B2 (en) 2014-10-24 2022-03-29 株式会社半導体エネルギー研究所 Display device
US12026011B2 (en) 2014-10-24 2024-07-02 Semiconductor Energy Laboratory Co., Ltd. Electronic device
JP7359930B2 (en) 2014-10-24 2023-10-11 株式会社半導体エネルギー研究所 display device
US11009909B2 (en) 2014-10-24 2021-05-18 Semiconductor Energy Laboratory Co., Ltd. Electronic device
JP2023029962A (en) * 2014-10-24 2023-03-07 株式会社半導体エネルギー研究所 Display device
JP2020115240A (en) * 2014-10-24 2020-07-30 株式会社半導体エネルギー研究所 Electronic device
JP2016100314A (en) * 2014-11-26 2016-05-30 パイオニア株式会社 Light emitting device
JP2017091730A (en) * 2015-11-06 2017-05-25 凸版印刷株式会社 Light emitting panel module, light emitting device and manufacturing method for the same
TWI607596B (en) * 2017-02-14 2017-12-01 元太科技工業股份有限公司 Organic thin film transistor and display device
US10700297B2 (en) 2017-02-14 2020-06-30 E Ink Holdings Inc. Display device and organic thin film transistor including semiconductor layer having L-shaped cross-section
JP2022023143A (en) * 2017-10-20 2022-02-07 パイオニア株式会社 Light-emitting module
US11943950B2 (en) 2017-10-20 2024-03-26 Pioneer Corporation Light-emitting device and light-emitting module
EP3547366A1 (en) * 2018-03-29 2019-10-02 InnoLux Corporation Tiled electronic device
US10950685B2 (en) 2018-03-29 2021-03-16 Innolux Corporation Tiled electronic device

Similar Documents

Publication Publication Date Title
JP2009205897A (en) Organic light-emitting device and manufacturing method of the same
JP4950870B2 (en) Organic light emitting device
JP5706916B2 (en) Planar light emitting device
US6414432B1 (en) Organic EL device and method for manufacturing same
WO2012133716A1 (en) Organic el light emitting device, manufacturing method therefor, and organic el illumination device
JP6108495B2 (en) Organic EL light emitting device, organic EL light emitting device manufacturing method, and organic EL lighting device
JP6366100B2 (en) Organic electroluminescence lighting panel, manufacturing method thereof, and organic electroluminescence lighting device
JP2007043080A (en) Light source using organic light-emitting element
JP5102682B2 (en) Organic electroluminescence device
JP2009211828A (en) Illuminating device and method of manufacturing illuminating device
JP2005276581A (en) Planar light emitting device
JP2005038763A (en) Organic el panel
WO2010110034A1 (en) Organic el element
JP2006156160A (en) Organic el panel
JP5330655B2 (en) Organic EL display device
JP3743005B2 (en) Organic EL panel
JP2008218470A (en) Organic el display
JP5679292B2 (en) Organic EL light emitting device
WO2017029889A1 (en) Organic el panel, illuminating device, and method for manufacturing organic el panel
JP4752457B2 (en) Organic EL device
JP2009246064A (en) Organic el element
WO2014027395A1 (en) Light-emitting device equipped with organic el element
JP6091123B2 (en) Organic EL panel and graphic display method
JP2005276541A (en) Organic el element
JP5741203B2 (en) Manufacturing method of organic EL element

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110223

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120306

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120321

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120515

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120807