JP2009190387A5 - - Google Patents

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Publication number
JP2009190387A5
JP2009190387A5 JP2008100486A JP2008100486A JP2009190387A5 JP 2009190387 A5 JP2009190387 A5 JP 2009190387A5 JP 2008100486 A JP2008100486 A JP 2008100486A JP 2008100486 A JP2008100486 A JP 2008100486A JP 2009190387 A5 JP2009190387 A5 JP 2009190387A5
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JP
Japan
Prior art keywords
metal foil
clad laminate
resin
laminate according
resin composition
Prior art date
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Application number
JP2008100486A
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Japanese (ja)
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JP5056553B2 (en
JP2009190387A (en
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Priority to JP2008100486A priority Critical patent/JP5056553B2/en
Priority claimed from JP2008100486A external-priority patent/JP5056553B2/en
Publication of JP2009190387A publication Critical patent/JP2009190387A/en
Publication of JP2009190387A5 publication Critical patent/JP2009190387A5/ja
Application granted granted Critical
Publication of JP5056553B2 publication Critical patent/JP5056553B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (9)

繊維基材に樹脂組成物を含浸した複合樹脂層を二層以上積層してなる基板と、該基板に接して設けられた金属箔とを備える金属箔張り積層板において、
対向する少なくとも二層の前記複合樹脂層が樹脂組成物からなる接着層により互いに接着され、前記複合樹脂層及び前記接着層中の樹脂組成物が硬化されている金属箔張り積層板。 In a metal foil-clad laminate comprising a substrate formed by laminating two or more composite resin layers impregnated with a resin composition on a fiber base material, and a metal foil provided in contact with the substrate,
A metal foil-clad laminate in which at least two opposing composite resin layers are bonded to each other with an adhesive layer made of a resin composition, and the composite resin layer and the resin composition in the adhesive layer are cured. 繊維基材に樹脂組成物を含浸した複合樹脂層を二層以上積層してなる基板と、該基板の両面に接して設けられた金属箔とを備える金属箔張り積層板において、
対向する少なくとも二層の前記複合樹脂層が樹脂組成物からなる接着層により互いに接着され、前記複合樹脂層及び前記接着層中の樹脂組成物が硬化されており、かつ
当該接着層により互いに接着された二層の前記複合樹脂層がそれぞれ有する前記繊維基材同士の面間隔６の合計と、
一方の金属箔と当該金属箔に最も近い繊維基材との面間隔５と、
他方の金属箔と当該金属箔に最も近い繊維基材との面間隔７と、が
（面間隔６の合計）≧（面間隔５）＋（面間隔７）
で表される関係を満たす金属箔張り積層板。 In a metal foil-clad laminate comprising a substrate formed by laminating two or more composite resin layers impregnated with a resin composition on a fiber base material, and a metal foil provided in contact with both surfaces of the substrate,
The at least two opposing composite resin layers are bonded to each other by an adhesive layer made of a resin composition, the composite resin layer and the resin composition in the adhesive layer are cured, and are bonded to each other by the adhesive layer. The total of the inter-surface spacing 6 between the fiber base materials each of the two composite resin layers has,
The surface interval 5 between one metal foil and the fiber substrate closest to the metal foil,
The surface distance 7 between the other metal foil and the fiber substrate closest to the metal foil is (total of surface distances 6) ≧ (surface distance 5) + (surface distance 7)
A metal foil-clad laminate satisfying the relationship represented by 前記繊維基材が、厚み５０μｍ以下のガラスクロスである、請求項１又は２に記載の金属箔張り積層板。   The metal foil-clad laminate according to claim 1 or 2, wherein the fiber base material is a glass cloth having a thickness of 50 µm or less. 前記樹脂組成物が熱硬化性樹脂を含有する、請求項１〜３のいずれか一項に記載の金属箔張り積層板。   The metal foil-clad laminate according to any one of claims 1 to 3, wherein the resin composition contains a thermosetting resin. 前記熱硬化性樹脂が、グリシジル基を含有する、請求項４に記載の金属箔張り積層板。   The metal foil-clad laminate according to claim 4, wherein the thermosetting resin contains a glycidyl group. 前記熱硬化性樹脂が、アミド基を含有する、請求項４又は５に記載の金属箔張り積層板。   The metal foil-clad laminate according to claim 4 or 5, wherein the thermosetting resin contains an amide group. 前記熱硬化性樹脂が、シロキサン結合を有するポリアミドイミド樹脂を含む、請求項４〜６のいずれか一項に記載の金属箔張り積層板。   The metal foil-clad laminate according to any one of claims 4 to 6, wherein the thermosetting resin includes a polyamideimide resin having a siloxane bond. 前記熱硬化性樹脂が、アクリル樹脂を含む、請求項４に記載の金属箔張り積層板。   The metal foil-clad laminate according to claim 4, wherein the thermosetting resin contains an acrylic resin. 請求項１〜８のいずれか一項に記載の金属箔張り積層板を備えるプリント配線板。   A printed wiring board provided with the metal foil-clad laminate according to any one of claims 1 to 8.
JP2008100486A 2007-04-11 2008-04-08 Metal foil-clad laminate and printed wiring board Expired - Fee Related JP5056553B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008100486A JP5056553B2 (en) 2007-04-11 2008-04-08 Metal foil-clad laminate and printed wiring board

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007103784 2007-04-11
JP2007103784 2007-04-11
JP2008006101 2008-01-15
JP2008006101 2008-01-15
JP2008100486A JP5056553B2 (en) 2007-04-11 2008-04-08 Metal foil-clad laminate and printed wiring board

Publications (3)

Publication Number Publication Date
JP2009190387A JP2009190387A (en) 2009-08-27
JP2009190387A5 true JP2009190387A5 (en) 2011-03-31
JP5056553B2 JP5056553B2 (en) 2012-10-24

Family

ID=39863914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008100486A Expired - Fee Related JP5056553B2 (en) 2007-04-11 2008-04-08 Metal foil-clad laminate and printed wiring board

Country Status (3)

Country Link
JP (1) JP5056553B2 (en)
TW (1) TW200908821A (en)
WO (1) WO2008126817A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568587B (en) * 2011-04-14 2017-02-01 住友電木股份有限公司 Laminated board, circuit board, semiconductor package, and method for manufacturing laminated board
JPWO2014087882A1 (en) * 2012-12-05 2017-01-05 住友ベークライト株式会社 Metal layer with resin layer, laminate, circuit board, and semiconductor device
JP6269506B2 (en) * 2012-12-18 2018-01-31 日立化成株式会社 LAMINATE, LAMINATE, PRINTED WIRING BOARD, LAMINATE MANUFACTURING METHOD, AND LAMINATE MANUFACTURING METHOD
JP6735505B2 (en) * 2016-09-06 2020-08-05 パナソニックＩｐマネジメント株式会社 Printed wiring board, printed circuit board, prepreg
KR20220116436A (en) * 2019-12-17 2022-08-23 미츠비시 가스 가가쿠 가부시키가이샤 Resin sheet and printed wiring board
CN116080157B (en) * 2022-11-16 2023-08-04 广东威世新材料有限公司 Copper foil-coated epoxy glass fiber laminated board for printed circuit

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190347A (en) * 1984-03-10 1985-09-27 松下電工株式会社 Laminated board for electricity
TW224561B (en) * 1991-06-04 1994-06-01 Akocho Co
JPH0818402B2 (en) * 1993-06-03 1996-02-28 日本ピラー工業株式会社 Laminates and mixed films for laminates
JP4455806B2 (en) * 2001-05-24 2010-04-21 日立化成工業株式会社 Prepreg and laminate
JP5241992B2 (en) * 2004-03-05 2013-07-17 日立化成株式会社 Prepreg, and metal foil-clad laminate and printed circuit board obtained using the same
JP4517749B2 (en) * 2004-04-12 2010-08-04 日立化成工業株式会社 Prepreg and metal-clad laminate and printed circuit board using the same
JP4590982B2 (en) * 2004-04-21 2010-12-01 日立化成工業株式会社 Metal foil with resin

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