JP2009188060A - Liquid immersion system, exposure device, exposure method, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid immersion system capable of suppressing remaining of liquid on a body such as a substrate. <P>SOLUTION: The liquid immersion system is used for liquid immersion exposure wherein the substrate is exposed to exposure light through an optical member and liquid, and the optical path of the exposure light between the optical member and substrate is filled with the liquid. The liquid immersion system has a first surface disposed at a periphery of the optical path of exposure light and a liquid recovery area provided outside the first surface about the optical path of exposure light to suck and collect the liquid on the opposed body. The liquid recovery area includes a first area disposed adjacently to an outer edge of the first surface, a second area disposed outside the first area about the optical path of exposure light, and a third area disposed outside the second area about the optical path of exposure light. Suctional force in the second area is smaller than that in the first area and that in the third area. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an immersion system, an exposure apparatus, an exposure method, and a device manufacturing method.

In an exposure apparatus used in a photolithography process, an immersion exposure apparatus that exposes a substrate with exposure light via a liquid as disclosed in the following patent document is known.
US Patent Application Publication No. 2007/0046910 International Publication No. 2007/055373 Pamphlet

  In the immersion exposure apparatus, when the substrate moves at a high speed or moves a long distance, the optical path of the exposure light between the optical member such as the projection optical system and the substrate can be filled with the liquid in a desired state. It can be difficult. Further, when the substrate moves at a high speed or moves a long distance, there is a possibility that the liquid leaks from the predetermined space or the liquid (film, droplet, etc.) remains on the substrate. As a result, a defective exposure may occur, such as a defect in the pattern formed on the substrate. As a result, a defective device may be manufactured.

  It is an object of the present invention to provide an immersion system that can suppress liquid remaining on an object such as a substrate. It is another object of the present invention to provide an exposure apparatus and an exposure method that can suppress the liquid from remaining on an object such as a substrate and suppress the occurrence of exposure failure. Moreover, an object of this invention is to provide the device manufacturing method which can suppress generation | occurrence | production of a defective device.

  According to the first aspect of the present invention, it is used in immersion exposure in which a substrate is exposed with exposure light through an optical member and a liquid, and the optical path of the exposure light between the optical member and the substrate is filled with the liquid. The immersion system is provided with a first surface arranged around the optical path of the exposure light and an outer side of the first surface with respect to the optical path of the exposure light, and sucks and collects the liquid on the opposing object And a liquid recovery region, the liquid recovery region being disposed adjacent to the outer edge of the first surface, and a second region disposed outside the first region with respect to the optical path of the exposure light And a third region disposed outside the second region with respect to the optical path of the exposure light, wherein the suction force in the second region is smaller than the suction force in the first region and the suction force in the third region. An immersion system is provided.

  According to the second aspect of the present invention, it is used in immersion exposure in which a substrate is exposed with exposure light through an optical member and a liquid, and the optical path of the exposure light between the optical member and the substrate is filled with the liquid. The immersion system is provided with a first surface arranged around the optical path of the exposure light and an outer side of the first surface with respect to the optical path of the exposure light, and sucks and collects the liquid on the opposing object A liquid recovery region including a surface of the porous member that is disposed on the outside of the first region with respect to the optical path of the exposure light, the first region disposed adjacent to the outer edge of the first surface A second area disposed, and a third area disposed outside the second area with respect to the optical path of the exposure light, wherein the aperture ratio in the second area is equal to the aperture ratio in the first area and the third area. An immersion system smaller than the aperture ratio at is provided.

  According to a third aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, the exposure apparatus including the liquid immersion system according to the first and second aspects.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the third aspect and developing the exposed substrate.

  According to a fifth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, and using the immersion system according to the first and second aspects, between the optical member and the substrate. An exposure method is provided that includes filling the optical path of the exposure light with a liquid and irradiating the substrate with the exposure light through the optical member and the liquid.

  According to a sixth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure method according to the fifth aspect and developing the exposed substrate.

  According to the present invention, the optical path of exposure light can be filled with a liquid in a desired state, the occurrence of exposure failure can be suppressed, and the occurrence of defective devices can be suppressed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. To do. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. In FIG. 1, an exposure apparatus EX includes a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, a first drive system 1D that moves the mask stage 1, A second drive system 2D for moving the substrate stage 2, an interferometer system 3 capable of measuring positional information of the mask stage 1 and the substrate stage 2, an illumination system IL for illuminating the mask M with the exposure light EL, and exposure light A projection optical system PL that projects an image of the pattern of the mask M illuminated by EL onto the substrate P, and a control device 4 that controls the operation of the entire exposure apparatus EX are provided.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask in which a predetermined pattern is formed on a transparent plate such as a glass plate using a light shielding film such as chromium. A reflective mask can also be used as the mask M. The substrate P is a substrate for manufacturing a device. The substrate P includes a substrate in which a photosensitive film is formed on a base material such as a semiconductor wafer such as a silicon wafer. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include a film different from the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. The exposure apparatus EX includes a liquid immersion member 6 capable of forming the liquid immersion space LS so that at least a part of the optical path K of the exposure light EL is filled with the liquid LQ. The immersion space LS is a space filled with the liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In the present embodiment, the immersion space LS is such that the optical path K of the exposure light EL emitted from the terminal optical element 5 closest to the image plane of the projection optical system PL is the liquid LQ among the plurality of optical elements of the projection optical system PL. It is formed to be filled with. The last optical element 5 has an exit surface 5U that emits the exposure light EL toward the image plane of the projection optical system PL. The immersion space LS is formed such that the optical path K between the terminal optical element 5 and an object disposed at a position facing the exit surface 5U of the terminal optical element 5 is filled with the liquid LQ. The position facing the emission surface 5U includes the irradiation position of the exposure light EL emitted from the emission surface 5U.

  The liquid immersion member 6 is disposed in the vicinity of the last optical element 5. The liquid immersion member 6 has a lower surface 7. In the present embodiment, an object that can face the emission surface 5U can face the lower surface 7. When the surface of the object is disposed at a position facing the emission surface 5U, at least a part of the lower surface 7 faces the surface of the object. When the exit surface 5U and the surface of the object face each other, the liquid LQ can be held between the exit surface 5U and the object surface. Further, when the lower surface 7 of the liquid immersion member 6 and the surface of the object face each other, the liquid LQ can be held between the lower surface 7 and the surface of the object. An immersion space LS is formed by the liquid LQ held between the injection surface 5U and the lower surface 7 on one side and the surface of the object on the other side.

  In this embodiment, the object that can face the exit surface 5U and the lower surface 7 includes an object that can move on the exit side (image surface side) of the last optical element 5 and moves to a position that faces the exit surface 5U and the lower surface 7. Includes possible objects. In the present embodiment, the object includes at least one of the substrate stage 2 and the substrate P held on the substrate stage 2. In the following description, in order to simplify the description, a description will be given mainly by taking, as an example, a state in which the injection surface 5U and the lower surface 7 on one side face the surface of the other substrate P. However, the same applies to the case where the injection surface 5U and the lower surface 7 on the one side face the surface of the substrate stage 2 on the other side.

  In the present embodiment, the immersion space LS is formed so that a partial region (local region) on the surface of the substrate P disposed at a position facing the emission surface 5U and the lower surface 7 is covered with the liquid LQ. An interface (meniscus, edge) LG of the liquid LQ is formed between the surface of the substrate P and the lower surface 7. That is, in the present embodiment, the exposure apparatus EX sets the immersion space LS so that a part of the area on the substrate P including the projection area PR of the projection optical system PL is covered with the liquid LQ when the substrate P is exposed. Adopt the local immersion method to be formed.

The illumination system IL illuminates a predetermined illumination region IR with exposure light EL having a uniform illuminance distribution. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Vacuum ultraviolet light (VUV light) such as excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 includes a mask holding unit 1H that holds the mask M. The mask holding part 1H can attach and detach the mask M. In the present embodiment, the mask holding unit 1H holds the mask M so that the pattern formation surface (lower surface) of the mask M and the XY plane are substantially parallel. The first drive system 1D includes an actuator such as a linear motor. The mask stage 1 can move in the XY plane while holding the mask M by the operation of the first drive system 1D. In the present embodiment, the mask stage 1 is movable in three directions, ie, the X axis, the Y axis, and the θZ direction, with the mask M held by the mask holder 1H.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The plurality of optical elements of the projection optical system PL are held by a lens barrel PK. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is substantially parallel to the Z axis. Further, the projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 is movable on the guide surface 8G of the base member 8. In the present embodiment, the guide surface 8G is substantially parallel to the XY plane. The substrate stage 2 holds the substrate P and can move in the XY plane along the guide surface 8G.

  The substrate stage 2 has a substrate holding part 2H that holds the substrate P. The substrate holding part 2H can hold the substrate P in a releasable manner. In the present embodiment, the substrate holding unit 2H holds the substrate P so that the exposure surface (front surface) of the substrate P and the XY plane are substantially parallel. The second drive system 2D includes an actuator such as a linear motor. The substrate stage 2 can move in the XY plane while holding the substrate P by the operation of the second drive system 2D. In the present embodiment, the substrate stage 2 is movable in six directions including the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions while holding the substrate P by the substrate holding portion 2H.

  The substrate stage 2 has an upper surface 2T disposed around the substrate holding part 2H. In the present embodiment, the upper surface 2T is flat and substantially parallel to the XY plane. The substrate stage 2 has a recess 2C. The substrate holding part 2H is disposed inside the recess 2C. In the present embodiment, the upper surface 2T and the surface of the substrate P held by the substrate holding part 2H are arranged in substantially the same plane (being flush with each other).

  The interferometer system 3 measures position information of the mask stage 1 and the substrate stage 2 in the XY plane. The interferometer system 3 includes a laser interferometer 3A that measures position information of the mask stage 1 in the XY plane and a laser interferometer 3B that measures position information of the substrate stage 2 in the XY plane. The laser interferometer 3A irradiates measurement light onto the reflection surface 1R disposed on the mask stage 1, and uses the measurement light via the reflection surface 1R to mask the mask stage 1 (X-axis, Y-axis, and θZ directions). The position information of the mask M) is measured. The laser interferometer 3B irradiates the reflection surface 2R disposed on the substrate stage 2 with measurement light, and uses the measurement light via the reflection surface 2R to use the substrate stage 2 (X-axis, Y-axis, and θZ directions). The position information of the substrate P) is measured.

  In the present embodiment, a focus / leveling detection system (not shown) for detecting position information on the surface of the substrate P held on the substrate stage 2 is disposed. The focus / leveling detection system detects position information on the surface of the substrate P in the Z-axis, θX, and θY directions.

  During the exposure of the substrate P, the position information of the mask stage 1 is measured by the laser interferometer 3A, and the position information of the substrate stage 2 is measured by the laser interferometer 3B. The control device 4 operates the first drive system 1D based on the measurement result of the laser interferometer 3A, and executes the position control of the mask M held on the mask stage 1. The control device 4 operates the second drive system 2D based on the measurement result of the laser interferometer 3B and the detection result of the focus / leveling detection system, and controls the position of the substrate P held on the substrate stage 2. Execute.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. When the substrate P is exposed, the control device 4 controls the mask stage 1 and the substrate stage 2 so that the mask M and the substrate P are scanned in the XY plane intersecting the optical path (optical axis AX) of the exposure light EL. Move in the direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 4 moves the substrate P in the Y axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. Thereby, the substrate P is exposed with the exposure light EL, and an image of the pattern of the mask M is projected onto the substrate P.

  Next, the liquid immersion member 6 will be described with reference to FIGS. 2 is a side sectional view showing the vicinity of the liquid immersion member 6, FIG. 3 is a partially cutaway view of a schematic perspective view showing the liquid immersion member 6, and FIG. 4 is a perspective view of the liquid immersion member 6 seen from below. FIGS. 5 and 5 are enlarged side sectional views of a part of the liquid immersion member 6.

  In the following description, the case where the surface of the substrate P is disposed at a position facing the exit surface 5U of the last optical element 5 and the lower surface 7 of the liquid immersion member 6 will be described as an example. In addition, objects other than the substrate P, such as the upper surface 2T of the substrate stage 2, can be arranged at positions facing the exit surface 5U of the last optical element 5 and the lower surface 7 of the liquid immersion member 6. In the following description, the exit surface 5U of the terminal optical element 5 is appropriately referred to as the lower surface 5U of the terminal optical element 5.

  The liquid immersion member 6 can form the liquid immersion space LS so that the optical path K of the exposure light EL between the last optical element 5 and the substrate P is filled with the liquid LQ. The liquid immersion member 6 is an annular member and is disposed so as to surround the optical path K of the exposure light EL. In the present embodiment, the liquid immersion member 6 includes a side plate portion 12 disposed around the terminal optical element 5, and at least a part between the lower surface 5U of the terminal optical element 5 and the surface of the substrate P in the Z-axis direction. And a lower plate portion 13 disposed on the surface.

  The side plate portion 12 has an inner peripheral surface 15 that faces the outer peripheral surface 14 of the last optical element 5 and is formed along the outer peripheral surface. A predetermined gap is formed between the outer peripheral surface 14 and the inner peripheral surface 15.

  The lower plate portion 13 has an opening 16 at the center. The exposure light EL emitted from the lower surface 5U can pass through the opening 16. For example, during the exposure of the substrate P, the exposure light EL emitted from the lower surface 5U passes through the opening 16 and is irradiated onto the surface of the substrate P through the liquid LQ. In the present embodiment, the cross-sectional shape of the exposure light EL in the opening 16 is a rectangular shape (slit shape) that is long in the X-axis direction. The opening 16 has a shape corresponding to the cross-sectional shape of the exposure light EL. That is, the shape of the opening 16 in the XY plane is a rectangular shape (slit shape). Further, the cross-sectional shape of the exposure light EL in the opening 16 is substantially the same as the shape of the projection region PR of the projection optical system PL on the substrate P.

  Further, the liquid immersion member 6 includes a supply port 31 for supplying the liquid LQ for forming the liquid immersion space LS, and a recovery port 32 for sucking and collecting at least a part of the liquid LQ on the substrate P. Yes.

  In the present embodiment, the lower plate portion 13 of the liquid immersion member 6 is disposed around the optical path of the exposure light EL. The upper surface 33 of the lower plate portion 13 faces the + Z-axis direction, and the upper surface 33 and the lower surface 5U face each other with a predetermined gap. The supply port 31 can supply the liquid LQ to the internal space 34 between the lower surface 5U and the upper surface 33. In the present embodiment, the supply ports 31 are provided on both sides of the optical path K in the Y-axis direction.

  The supply port 31 is connected to the liquid supply device 35 via the flow path 36. The liquid supply device 35 can deliver clean and temperature-adjusted liquid LQ. The flow path 36 includes a supply flow path 36 </ b> A formed inside the liquid immersion member 6 and a flow path 36 </ b> B formed by a supply pipe connecting the supply flow path 36 </ b> A and the liquid supply device 35. The liquid LQ delivered from the liquid supply device 35 is supplied to the supply port 31 via the flow path 36. The supply port 31 supplies the liquid LQ from the liquid supply device 35 to the optical path K.

  The recovery port 32 is connected to the liquid recovery device 37 via the flow path 38. The liquid recovery device 37 includes a vacuum system and can recover the liquid LQ by sucking it. The flow path 38 includes a recovery flow path 38 </ b> A formed inside the liquid immersion member 6 and a flow path 38 </ b> B formed of a recovery pipe that connects the recovery flow path 38 </ b> A and the liquid recovery device 37. By operating the liquid recovery device 37, the liquid LQ recovered from the recovery port 32 is recovered by the liquid recovery device 37 via the flow path 38.

  In the present embodiment, the porous member 24 is disposed in the recovery port 32 of the liquid immersion member 6. At least a part of the liquid LQ between the substrate P is recovered through the recovery port 32 (porous member 24). The lower surface 7 of the liquid immersion member 6 includes a first surface 21 disposed around the optical path K of the exposure light EL, and a liquid recovery region 22 provided outside the first surface 21 with respect to the optical path K of the exposure light EL. Including. In the present embodiment, the liquid recovery region 22 includes the surface (lower surface) of the porous member 24.

  In the following description, the first surface 21 is appropriately referred to as a land surface 21, and the liquid recovery region 22 is appropriately referred to as a recovery surface 22.

  The land surface 21 can hold the liquid LQ with the surface of the substrate P. In the present embodiment, the land surface 21 faces the −Z axis direction and includes the lower surface of the lower plate portion 13. The land surface 21 is disposed around the opening 16. In the present embodiment, the land surface 21 is flat and substantially parallel to the surface (XY plane) of the substrate P. In the present embodiment, the outer shape of the land surface 21 in the XY plane is a rectangular shape, but may be another shape, for example, a circular shape.

  The recovery surface 22 can recover at least a part of the liquid LQ between the lower surface 5U and the lower surface 7 on one side and the surface of the substrate P on the other side. The collection surfaces 22 are disposed on both sides in the Y-axis direction (scanning direction) with respect to the optical path K of the exposure light EL. In the present embodiment, the collection surface 22 is disposed around the optical path K of the exposure light EL. That is, the collection surface 22 is arranged in a rectangular ring around the land surface 21. Moreover, in this embodiment, the land surface 21 and the collection | recovery surface 22 are arrange | positioned in the substantially same plane (it is flush | level).

  The recovery surface 22 includes the surface (lower surface) of the porous member 24, and the liquid LQ that is in contact with the recovery surface 22 is recovered through the holes of the porous member 24.

  6A is an enlarged plan view of the porous member 24 of the present embodiment, and FIG. 6B is a cross-sectional view taken along the line AA in FIG. 6A. As shown in FIG. 6, in this embodiment, the porous member 24 is a thin plate member in which a plurality of small holes 24H are formed. The porous member 24 is a member obtained by processing a thin plate member to form a plurality of holes 24H, and is also called a mesh plate.

  The porous member 24 has a lower surface 24B facing the surface of the substrate P and an upper surface 24A opposite to the lower surface 24B. The lower surface 24B forms the collection surface 22. The upper surface 24A is in contact with the recovery channel 38A. The hole 24H is formed between the upper surface 24A and the lower surface 24B. That is, the hole 24H is formed so as to penetrate the upper surface 24A and the lower surface 24B. In the present embodiment, the upper surface 24A and the lower surface 24B are substantially parallel. That is, in the present embodiment, the upper surface 24A and the lower surface 24B are substantially parallel to the surface (XY plane) of the substrate P. In the present embodiment, the hole 24H penetrates between the upper surface 24A and the lower surface 24B substantially parallel to the Z-axis direction. The liquid LQ can flow through the hole 24H. The liquid LQ on the substrate P is drawn into the recovery channel 38A through the hole 24H.

  In the present embodiment, the shape of the hole (opening) 24H in the XY plane is a circle. Further, the size of the hole (opening) 24H in the upper surface 24A is substantially equal to the size of the hole (opening) 24H in the lower surface 24B. The shape of the hole 24H in the XY plane may be a shape other than a circle, for example, a polygon such as a pentagon or a hexagon.

  In the present embodiment, the control device 4 operates the liquid recovery device 37 including a vacuum system to generate a pressure difference between the upper surface 24A and the lower surface 24B of the porous member 24, whereby the porous member 24 (recovery) The liquid LQ is recovered from the surface 22). The liquid LQ recovered from the recovery surface 22 is recovered by the liquid recovery device 37 via the flow path 38.

  2 to 5, the collection surface 22 of the present embodiment is disposed outside the first region 51 with respect to the optical path K, with the first region 51 disposed adjacent to the outer edge of the land surface 21. The second region 52, the third region 53 disposed outside the second region 52 with respect to the optical path K, and the fourth region 54 disposed outside the third region 53 with respect to the optical path K. Including. In the present embodiment, the first region 51 is arranged in a rectangular ring around the land surface 21. The second area 52 is arranged in a rectangular ring around the first area 51. The third region 53 is arranged in a rectangular ring around the second region 52. The fourth region 54 is arranged in a rectangular ring around the third region 53.

  In the present embodiment, the aperture ratio in the second region 52 is smaller than the aperture ratio in the first region 51 and the aperture ratio in the third region 53. In the present embodiment, the aperture ratio in the first region 51 and the aperture ratio in the third region 53 are substantially the same. In the present embodiment, the aperture ratio in the fourth region 54 is larger than the aperture ratio in the third region 53.

  In the present embodiment, the aperture ratio is the ratio of holes per unit area of the collection surface 22 of the porous member 24. Specifically, the aperture ratio is a ratio of the total area of the plurality of holes 24H per unit area on the collection surface 22 facing the surface of the substrate P. For example, the aperture ratio can be changed by changing the number of holes 24H per unit area. In other words, the aperture ratio can be changed by changing the density of the holes 24H in the recovery surface 22. Further, the aperture ratio can be changed by changing the size (diameter) of the hole 24H in the collection surface 22. Of course, the aperture ratio may be changed by changing both the number of holes 24H per unit area and the size of the holes 24H.

  If the pressure difference is the same between the upper surface 24A and the lower surface 24B, the suction force of each region of the collection surface 22 varies depending on the aperture ratio. The suction force includes the liquid recovery amount of the recovery surface 22 per unit area and unit time (an amount capable of recovering the liquid LQ). When the aperture ratio increases, the suction force increases. When the aperture ratio decreases, the suction force decreases.

  Therefore, in the present embodiment, the suction force in the second region 52 is smaller than the suction force in the first region 51 and the suction force in the third region 53. In the present embodiment, the suction force in the first region 51 and the suction force in the third region 53 are substantially the same. In the present embodiment, the suction force in the fourth region 54 is larger than the suction force in the third region 53.

  In the present embodiment, the size (width) W2 of the second region 52 is the size (width) W1 of the first region 51 in the radiation direction (for example, the Y-axis direction) with respect to the optical path K (optical axis AX). Greater than. In the present embodiment, the size (width) W2 of the second region 52 is smaller than the size (width) W3 of the third region 53 in the radiation direction with respect to the optical path K. In the present embodiment, in the radiation direction with respect to the optical path K, the size (width) W2 of the second region 52 is substantially the same as the size (width) W4 of the fourth region 54.

  In the present embodiment, as shown in FIG. 3, the liquid immersion member 6 has an exhaust port 40 for communicating the internal space 34 and the external space (atmospheric space) 39. The exhaust port 40 is connected to the opening 42 via the exhaust channel 41. The opening 42 is disposed at a position where it can come into contact with the gas in the external space 39 (ambient environment) around the liquid immersion member 6 (immersion space LS). The internal space 34 is open to the atmosphere via the exhaust passage 41.

  When the substrate P is disposed at a position facing the lower surface 7 of the liquid immersion member 6, the liquid immersion member 6 can hold the liquid LQ between the land surface 21 and the surface of the substrate P. In the present embodiment, the land surface 21 of the liquid immersion member 6 is lyophilic. For example, the contact angle between the land surface 21 and the liquid LQ is 40 degrees or less, preferably 20 degrees or less. The land surface 21 can continue to contact the liquid LQ even when the substrate P moves in the XY direction. The land surface 21 continues to contact the liquid LQ in the immersion space LS at least during the exposure of the substrate P.

  2 and 5 show a state in which a part of the liquid LQ on the substrate P is held between a part of the land surface 21 and the recovery surface 22 and the substrate P. For example, during the exposure of the substrate P, the liquid immersion space LS is formed by holding the liquid LQ between the lower surface 5U on one side and the lower surface 7 of the liquid immersion member 6 and the surface of the substrate P on the other side.

  Next, a method for immersion exposure of the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  In order to form the immersion space LS, the control device 4 supplies the liquid LQ to the optical path K using the supply port 31. When supplying the liquid LQ, the control device 4 arranges an object such as the substrate P (substrate stage 2) at a position facing the lower surface 5U and the lower surface 7. The liquid LQ delivered from the liquid supply device 35 is supplied to the supply port 31 via the flow path 36. The supply port 31 supplies the liquid LQ to the internal space 34. The liquid LQ flows through the internal space 34, flows into the space between the land surface 21 and the surface of the substrate P through the opening 16, and is held between the land surface 21 and the surface of the substrate P. Further, at least a part of the liquid LQ flows into the space between the collection surface 22 and the surface of the substrate P.

  Thus, the immersion space LS is formed so that the optical path K between the lower surface 5U of the last optical element 5 and the surface of the substrate P is filled with the liquid LQ.

  In the present embodiment, the control device 4 performs a liquid recovery operation using the recovery surface 22 (recovery port 32) in parallel with the liquid supply operation using the supply port 31. At least a part of the liquid LQ in contact with the recovery surface 22 is sucked through the porous member 24 that forms the recovery surface 22. The control device 4 performs the liquid supply operation and the liquid recovery operation in parallel, so that the liquid LQ is always in a desired state (temperature, cleanliness, etc.), and the liquid immersion region is locally formed on a part of the surface of the substrate P. Can be formed.

  After the immersion space LS is formed, the control device 4 starts exposure of the substrate P. As described above, the exposure apparatus EX of the present embodiment is a scanning exposure apparatus. The control device 4 moves the surface of the substrate P in the Y-axis direction with respect to the exposure light EL in a state where the immersion space LS is formed, via the projection optical system PL and the liquid LQ on the substrate P. The substrate P is irradiated with exposure light EL. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

  For example, after the exposure of the first shot region on the substrate P is completed, the control device 4 is configured to form the immersion space LS in order to start the exposure of the second shot region. An operation of moving the surface in the X-axis direction (or a direction inclined with respect to the X-axis direction in the XY plane) is executed.

  In the present embodiment, even when the substrate P is moved in the XY direction with the immersion space LS formed between the lower surface 5U and the lower surface 7 and the surface of the substrate P, the land surface 21 and the surface of the substrate P The distance between the land surface 21 and the substrate P, the shape and size of the land surface 21, and the surface state of the land surface 21 are optimized so that the liquid LQ existing between the land surface 21 and the land surface 21 is kept in contact. The surface state of the land surface 21 includes a contact angle of the liquid LQ on the land surface 21 with respect to the liquid LQ.

  In the present embodiment, since the suction force in the second region 52 of the recovery surface 22 is smaller than the suction force in the first region 51 and the suction force in the third region 53, the substrate P is in the immersion space LS. Even when the surface is moved in the XY direction, the size and shape of the immersion space LS can be maintained in a desired state. That is, according to the liquid immersion member 6 of the present embodiment, the position and shape of the interface LG of the liquid LQ can be prevented from changing greatly. Specifically, even when the surface of the substrate P is moved at a high speed with respect to the liquid immersion member 6 or moved over a long distance, expansion (upsizing) of the liquid immersion space LS is suppressed, and the liquid immersion space is reduced. The shape of LS can be stabilized. This suppresses the liquid LQ between the lower surface 7 and the surface of the substrate P from leaking outside the space between the lower surface 7 and the surface of the substrate P. Further, the liquid LQ (liquid LQ film, droplets, etc.) is prevented from remaining on the surface of the substrate P. As described above, the reason why the suction force in the second region 52 is made smaller than the suction force in the first region 51 and the suction force in the third region is based on the knowledge of the inventors as follows.

  FIG. 7 is a partial schematic view showing a liquid immersion member 6J according to a comparative example. The recovery surface 22J of the liquid immersion member 6J shown in FIG. 7 has no distribution of the aperture ratio (suction force). The suction force of the collection surface 22J is substantially the same as the suction force in the third region 53 described above, for example.

  FIG. 7A is a view showing a state in which an immersion space LS is formed between the immersion member 6J and the substrate P. FIG. The liquid immersion area on the substrate P has a predetermined size J0 in the XY plane.

  In the following description, in order to simplify the description, the position LG where the optical axis AX of the projection optical system PL intersects the surface of the substrate P and the interface LG of the liquid LQ in a predetermined direction (here, the Y-axis direction). The distance between the tip of the substrate and the position where the surface of the substrate P intersects is the size of the liquid immersion region in the XY plane.

  From the state of FIG. 7A, when the substrate P is moved at high speed in one direction in the XY plane (here, the −Y direction) with respect to the liquid immersion member 6J, as shown in FIG. A part of the liquid LQ becomes a thin film on the substrate P between the lower surface 7J of the member 6J and the substrate P, and the liquid LQ on the substrate P is outside the recovery surface 22J, specifically, in the moving direction of the substrate P. On the front side (−Y side), leakage may occur outside the collection surface 22J. That is, by moving the substrate P, the size J1 of the immersion space may become very large.

  In this phenomenon, between the lower surface 7J of the liquid immersion member 6J and the surface of the substrate P, the liquid LQ in the vicinity of the lower surface 7J of the liquid immersion member 6J flows upward (+ Z direction) by the suction operation of the recovery surface 22J. Although recovered on the recovery surface 22J, the liquid LQ near the surface of the substrate P is not recovered from the recovery surface 22J due to surface tension with the substrate P or the like, but becomes a thin film on the substrate P. This is caused by being pulled out of the collection surface 22J on the front side in the moving direction of the substrate P. When such a phenomenon occurs, the liquid LQ drawn to the outside of the recovery surface 22J remains as a droplet on the substrate P, for example, and causes a pattern defect or the like. Such a phenomenon is likely to occur when the suction force of the recovery surface 22J on which the interface LG is formed increases. Such a phenomenon is likely to occur when the moving speed of the substrate P is increased.

  FIG. 8 is a schematic diagram showing an example of the behavior of the immersion space LS formed between the immersion member 6 and the substrate P according to this embodiment. FIG. 8A is a diagram illustrating an example of a state in which an immersion space LS is formed between the immersion member 6 and the substrate P. In FIG. 8A, the interface LG of the liquid LQ is formed between the second region 52 and the surface of the substrate P.

  FIG. 8B is a diagram showing a state of the immersion space LS when the substrate P is moved at a high speed in the −Y direction with respect to the immersion member 6 from the state of FIG. In the present embodiment, since the suction force in the second region 52 connected to the interface LG is small, the occurrence of the phenomenon that the liquid LQ becomes a thin film as described with reference to FIG. 7B is suppressed. . Further, by moving the substrate P in the −Y direction, the interface LG also tries to move in the −Y direction. In particular, when the substrate P moves a long distance, the interface LG also tends to move in the −Y direction. In the present embodiment, the first region 51 having a larger suction force than the second region 52 is disposed on the + Y side with respect to the second region 52. Therefore, the movement of the liquid LQ by the first region 51 suppresses the large movement of the interface LG in the −Y direction. That is, even when the substrate P moves over a long distance, the liquid LQ recovery operation by the first region 51 suppresses an increase in the size of the immersion space LS and suppresses a significant change in the position of the interface LG. Therefore, the formation of the interface LG between the third region 53 and the surface of the substrate P is suppressed.

  In the present embodiment, since the size W2 of the second region 52 is larger than the size W1 of the first region 51, even when the substrate P moves a long distance in the -Y direction, the interface LG The region 52 and the surface of the substrate P can be continuously disposed at a position connecting them.

  Even if the liquid LQ on the substrate P becomes a film between the second region 52 and the substrate P, the liquid LQ can be recovered in the third region 53. In the present embodiment, since the suction force of the second region 52 is relatively small, even if a part of the liquid LQ on the substrate P becomes a film, the thickness of the film is relatively thick (for example, FIG. 7 It is thicker than the film on the substrate P described in (B)). Therefore, the liquid LQ that has become a film on the substrate P can be collected in the third region 53.

  In the present embodiment, since the size W3 of the third region 53 is larger than the size W2 of the second region 52, even if the liquid LQ becomes a film on the substrate P, the liquid LQ is transferred to the third region 53. It can collect | recover in area | region W3.

  In the present embodiment, the fourth region 54 having a suction force larger than that of the third region 53 is arranged on the −Y side with respect to the third region 53. Therefore, even if the liquid LQ cannot be recovered in the third region 53, the liquid LQ that cannot be recovered can be recovered in the fourth region 54.

  As described above, according to the present embodiment, it is possible to suppress the occurrence of leakage, remaining, etc. of the liquid LQ, and thus it is possible to suppress the occurrence of exposure failure. In addition, the movement speed of the substrate P can be increased while suppressing the occurrence of exposure failure. Therefore, a good device can be manufactured with high productivity.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 9 is a view showing a liquid immersion member 6B according to the second embodiment. In the present embodiment, the aperture ratio of the porous member 24N is substantially uniform. In the present embodiment, as shown in FIG. 9, the recovery flow path 38 </ b> A is divided into a plurality of recovery flow paths 381 to 384 by a plurality of partition members 70. The recovery channel 381 recovers the liquid LQ via the first region 51, the recovery channel 382 recovers the liquid LQ via the second region 52, and the recovery channel 383 passes through the third region 53. The recovered liquid LQ is recovered, and the recovery flow path 384 recovers the liquid LQ via the second region 54. Liquid recovery devices 371 to 374 are connected to the recovery channels 381 to 384, respectively. The control device controls each of the liquid recovery devices 371 to 374 such that each of the first to fourth regions 51 to 54 has the suction force described in the first embodiment, for example. Since the suction force varies depending on the pressure difference between the upper surface 24A and the lower surface 24B of the porous member 24N, the control device 4 allows each of the first to fourth regions 51 to 54 to have a desired suction force, that is, In each of the first to fourth regions 51 to 54, the liquid recovery devices 371 to 374 are controlled so that the upper surface 24A and the lower surface 24B have a desired pressure difference. Also in the present embodiment, leakage, remaining, etc. of the liquid LQ can be suppressed.

  In the first and second embodiments described above, the aperture ratio of the porous member and the porous member are different in order to make the suction forces of two different regions (for example, the first region 51 and the second region 52) of the collection surface 22 different. Both of the pressure differences between the upper surface and the lower surface may be made different.

  In the first and second embodiments described above, the suction force in the first region 51 and the suction force in the third region 53 may be different. For example, the aperture ratio in the first region 51 may be different from the aperture ratio in the third region 53. For example, the suction force in the first region 51 may be larger than the suction force in the third region 53, and the suction force in the first region 51 may be smaller than the suction force in the third region 53.

  In each of the above-described embodiments, the size W2 of the second region 52 may be substantially the same as the size W3 of the third region 53 in the radiation direction with respect to the optical path K.

  In each embodiment described above, the size W4 of the fourth region 54 may be larger than the size W2 of the second region 52 in the radiation direction with respect to the optical path K. Further, the size W4 of the fourth region 54 may be larger than the size W3 of the third region 53 in the radiation direction with respect to the optical path K.

  In each of the above-described embodiments, the suction force in the third region 53 and / or the fourth region 54 may gradually increase in the radial direction with respect to the optical path K (for example, the −Y axis direction in FIG. 8). . For example, the aperture ratio in the third region 53 and / or the fourth region 54 may gradually increase in the radiation direction in the optical path K. For example, in the radiation direction in the optical path K, the density of the holes 24H in the fourth region 54 may be gradually increased. Thereby, the liquid LQ can be collected more reliably.

  In each of the above-described embodiments, the suction force in the first region 51, the suction force in the second region 52, the suction force in the third region 53, and the suction force in the fourth region 54 change stepwise. Alternatively, it may be gradually changed (continuously changed).

  In each of the above-described embodiments, the collection surface 22 may include a fifth region that has a greater suction force than the fourth region 54 outside the fourth region 54 with respect to the optical path K.

  In each of the above-described embodiments, at least a part of the collection surface 22 may be disposed on the + Z side from the land surface 21. In other words, the distance between the surface of the substrate P and at least a part of the recovery surface 22 may be larger than the distance between the surface of the substrate P and the land surface 21. For example, the first region 51 and the second region 52 may be arranged on the + Z side from the third region 53 and the fourth region 54.

  Further, at least a part of the collection surface 22 may be a slope inclined with respect to the land surface 21. For example, at least a part of the first region 51 may be inclined so as to be gradually separated from the surface of the substrate P in the direction away from the optical path K. Alternatively, at least a part of the second region 52 may be inclined so as to gradually approach the surface of the substrate P in a direction away from the optical path K.

  Moreover, the position of each area | region of the collection | recovery surface 22 in the Z direction may differ. That is, the distance between each region of the collection surface and the surface of the substrate P may be different. For example, at least a part of the second region 52 may be formed at a position lower than the first region 51, that is, at a position closer to the surface of the substrate P than the first region 51. In this case, in the radiation direction with respect to the optical path K (for example, the −Y axis direction in FIG. 8), the second region 52 may be inclined downward so as to gradually approach the surface of the substrate P. Further, at least a part of the third region 53 may be formed at a position lower than the second region 52, that is, at a position closer to the surface of the substrate P than the second region 52. In this case, in the radiation direction with respect to the optical path K (for example, the −Y axis direction in FIG. 8), the third region 53 may be inclined downward so as to gradually approach the surface of the substrate P.

  In each of the above embodiments, the fourth region 54 may be omitted. For example, when the liquid LQ that has become a film on the substrate P can be collected in the third region 53, the fourth region 54 can be omitted.

  In each of the above-described embodiments, the size of the hole (opening) 24H in the upper surface 24A of the porous member 24 may be different from the size of the hole (opening) 24H in the lower surface 24B. For example, the size of the hole (opening) 24H in the upper surface 24A may be larger than the size of the hole (opening) 24H in the lower surface 24B. The size of the hole (opening) 24H in the upper surface 24A may be smaller than the size of the hole (opening) 24H in the lower surface 24B.

  In each of the above-described embodiments, the porous member 24 is not limited to a plate member in which a plurality of small holes through which the liquid LQ can flow is formed, and a plurality of members in which a plurality of holes are formed may be combined to form a mesh. It may be a mesh filter that is a porous member in which a large number of small holes are formed in a honeycomb shape or a honeycomb shape. Further, as the porous member 24, a sintered member (for example, sintered metal) in which a large number of pores are formed, a foamed member (for example, foamed metal), or the like may be used.

  In each of the above-described embodiments, the projection optical system PL fills the optical path K on the exit side (image plane side) of the last optical element 5 with a liquid, but is disclosed in International Publication No. 2004/019128. As described above, it is also possible to employ a projection optical system in which the optical path on the incident side (object plane side) of the last optical element 5 is also filled with the liquid LQ.

  In addition, although the liquid LQ of the above-mentioned embodiment is water, liquids other than water may be sufficient. The liquid LQ is preferably a liquid LQ that is transparent to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the projection optical system or a photosensitive material (photoresist) film that forms the surface of the substrate. For example, as the liquid LQ, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, cedar oil, or the like can be used. A liquid LQ having a refractive index of about 1.6 to 1.8 may be used. Furthermore, an optical element (such as a terminal optical element) of the projection optical system PL that is in contact with the liquid LQ may be formed of a material having a refractive index higher than that of quartz and fluorite (for example, 1.6 or more). In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

Further, for example, when the exposure light EL is F ₂ laser light, the F ₂ laser light does not transmit water, so that the liquid LQ can transmit F ₂ laser light, such as perfluorinated polyether (PFPE). ), Fluorine-based fluids such as fluorine-based oils can be used. In this case, the lyophilic treatment is performed by forming a thin film with a substance having a molecular structure having a small polarity including fluorine, for example, at a portion in contact with the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system in a state where the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  In addition, the present invention is disclosed in US Pat. No. 6,341,007, US Pat. No. 6,400,491, US Pat. No. 6,549,269, US Pat. No. 6,590,634, US Pat. The present invention can also be applied to a twin-stage type exposure apparatus having a plurality of substrate stages as disclosed in the specification and the like.

  Furthermore, as disclosed in, for example, US Pat. No. 6,897,963, etc., a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and / or a measurement stage on which various photoelectric sensors are mounted. The present invention can also be applied to other exposure apparatuses. The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages. By arranging the measurement stage at a position facing the exit surface of the terminal optical element and the lower surface of the liquid immersion member, the terminal optical element and the liquid immersion member can form an immersion space with the measurement stage. .

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, the positional information of the mask stage 1 and the substrate stage 2 is measured using the interferometer system 3 including the laser interferometers 3A and 3B. You may use the encoder system which detects the scale (diffraction grating) provided in each stage 1 and 2. FIG. In this case, it is good also as a hybrid system provided with both an interferometer system and an encoder system.

  In each of the above embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as the exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example, but the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX according to the embodiment of the present application maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 10, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate according to the above-described embodiment. The device is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

It is a schematic block diagram which shows the exposure apparatus which concerns on 1st Embodiment. FIG. 3 is a side sectional view showing the vicinity of the liquid immersion member according to the first embodiment. It is a partially broken view of the schematic perspective view which shows the liquid immersion member which concerns on 1st Embodiment. It is the perspective view which looked at the liquid immersion member concerning a 1st embodiment from the lower side. FIG. 3 is an enlarged side sectional view of a part of the liquid immersion member according to the first embodiment. It is a figure for demonstrating an example of the porous member concerning a 1st embodiment. It is a schematic diagram for demonstrating the effect | action of the liquid immersion member which concerns on a comparative example. It is a schematic diagram for demonstrating the effect | action of the liquid immersion member which concerns on 1st Embodiment. FIG. 7 is an enlarged side sectional view of a part of a liquid immersion member according to a second embodiment. It is a flowchart figure which shows an example of the manufacturing process of a microdevice.

Explanation of symbols

  2 ... Substrate stage, 5 ... Terminal optical element, 5U ... Ejection surface, 6 ... Immersion member, 7 ... Lower surface, 21 ... Land surface, 22 ... Recovery surface, 24 ... Porous member, 24H ... Hole, 51 ... First region 52 ... second region 53 ... third region 54 ... fourth region EL ... exposure light EX ... exposure device K ... optical path LQ ... liquid liquid LS ... immersion space P ... substrate

Claims (31)

An immersion system used in immersion exposure for exposing a substrate with exposure light through an optical member and a liquid, and filling the optical path of the exposure light between the optical member and the substrate with the liquid. ,
A first surface disposed around the optical path of the exposure light;
A liquid recovery area that is provided outside the first surface with respect to the optical path of the exposure light, and sucks and recovers the liquid on the opposing object;
The liquid recovery region includes a first region disposed adjacent to an outer edge of the first surface, a second region disposed outside the first region with respect to the optical path of the exposure light, and the exposure light. A third region disposed outside the second region with respect to the optical path of
An immersion system in which the suction force in the second region is smaller than the suction force in the first region and the suction force in the third region.   The liquid immersion system according to claim 1, wherein the suction force in the first region and the suction force in the third region are substantially the same.   The liquid immersion system according to claim 1, wherein the suction force in the first region is different from the suction force in the third region. The liquid recovery region includes a fourth region disposed outside the third region with respect to the optical path of the exposure light,
The liquid immersion system according to claim 1, wherein the suction force in the fourth region is larger than the suction force in the third region.   The liquid immersion system according to claim 4, wherein the suction force in the fourth region gradually increases in a radiation direction with respect to the optical path of the exposure light.   The liquid immersion system according to claim 1, wherein the liquid recovery region includes a surface of a porous member.   The liquid immersion system according to claim 6, wherein at least a part of the liquid on the object is collected through the porous member.   The liquid immersion system according to claim 6 or 7, wherein the suction force varies depending on a ratio of holes per unit area of the porous member. The porous member has a first surface facing the object, and a second surface in which the hole is formed between the first surface,
The liquid immersion system according to claim 6 or 7, wherein the suction force changes depending on a pressure difference between the first surface and the second surface. An immersion system used in immersion exposure for exposing a substrate with exposure light through an optical member and a liquid, and filling the optical path of the exposure light between the optical member and the substrate with the liquid. ,
A first surface disposed around the optical path of the exposure light;
A liquid recovery region that is provided outside the first surface with respect to the optical path of the exposure light and includes a surface of a porous member that sucks and recovers the liquid on the opposing object;
The liquid recovery region includes a first region disposed adjacent to an outer edge of the first surface, a second region disposed outside the first region with respect to the optical path of the exposure light, and the exposure light. A third region disposed outside the second region with respect to the optical path of
An immersion system in which the aperture ratio in the second region is smaller than the aperture ratio in the first region and the aperture ratio in the third region.   The immersion system according to claim 10, wherein an aperture ratio in the first region and an aperture ratio in the third region are substantially the same.   The liquid immersion system according to claim 10, wherein an aperture ratio in the first region is different from an aperture ratio in the third region. The liquid recovery region includes a fourth region disposed outside the third region with respect to the optical path of the exposure light,
The liquid immersion system according to any one of claims 10 to 12, wherein an aperture ratio in the fourth region is larger than an aperture ratio in the third region.   The liquid immersion system according to claim 13, wherein an aperture ratio in the fourth region gradually increases in a radiation direction with respect to an optical path of the exposure light.   The liquid immersion system according to claim 10, wherein the aperture ratio is a ratio of holes per unit area of the porous member.   The liquid immersion system according to claim 10, wherein at least a part of the liquid on the object is collected through the porous member.   The immersion system according to any one of claims 1 to 16, wherein a size of the second region is larger than a size of the first region in a radiation direction with respect to an optical path of the exposure light.   The immersion system according to any one of claims 1 to 17, wherein a size of the second region is smaller than a size of the third region in a radiation direction with respect to an optical path of the exposure light.   The immersion system according to any one of claims 1 to 17, wherein a size of the second region is substantially the same as a size of the third region in a radiation direction with respect to an optical path of the exposure light.   The immersion system according to claim 1, wherein a distance between at least a part of the third region and the object is smaller than a distance between at least a part of the second region and the object.   21. The immersion system according to claim 1, wherein at least a part of the second region is inclined downward in a radiation direction with respect to an optical path of the exposure light.   The immersion system according to any one of claims 1 to 21, wherein at least a part of the first surface is substantially parallel to a surface of the object.   The liquid immersion system according to any one of claims 1 to 22, wherein at least a part of the liquid recovery region is substantially parallel to the first surface. The substrate is moved in a predetermined direction with respect to the exposure light;
The liquid immersion system according to any one of claims 1 to 23, wherein the liquid recovery area is disposed on both sides of the predetermined direction with respect to the optical path of the exposure light.   The liquid immersion system according to any one of claims 1 to 24, wherein the liquid recovery region is disposed around an optical path of the exposure light. A liquid immersion member having the first surface and the liquid recovery region;
26. The liquid immersion system according to any one of claims 1 to 25, wherein the liquid immersion member is disposed so as to surround the optical path.   The immersion system according to any one of claims 1 to 26, wherein the object includes the substrate. An exposure apparatus that exposes a substrate with exposure light through a liquid,
An exposure apparatus comprising the immersion system according to any one of claims 1 to 27. Exposing the substrate using the exposure apparatus according to claim 28;
Developing the exposed substrate; and a device manufacturing method. An exposure method for exposing a substrate with exposure light through a liquid,
Filling the optical path of the exposure light between the optical member and the substrate with a liquid using the immersion system according to any one of claims 1 to 27;
Irradiating the substrate with exposure light through the optical member and the liquid. Exposing the substrate using the exposure method of claim 30;
Developing the exposed substrate; and a device manufacturing method.

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