JP2009145742A - Method for manufacturing wire grid polarizer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the productivity of a wire grid polarizer, in a method for manufacturing the wire grid polarizer. <P>SOLUTION: The method for manufacturing the wire grid polarizer has a resin stamper forming process of forming a resin stamper 50, by transferring a fine irregular shape of a metal stamper 3; a mold-releasing treatment process of carrying out mold releasing treatment on a surface of the resin stamper 50, a metal film forming process of forming a metal film 7 on a base material film 1a; a resin molding process of applying a UV-curing resin 110a onto the metal film 7, holding the resin stamper 50, subjected to the mold-releasing treatment in a pressurizing state onto the UV-curing resin 110a and curing the UV-curing resin 110a, by irradiation with UV rays 114a from a resin stamper 50 side; and a resin stamper exfoliating process of exfoliating the resin stamper 50 to form a resin grid layer 8, where the fine irregular shape is transferred and an etching process of etching the metal film 7 by using the resin grid layer 8 as a mask. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a method for manufacturing a wire grid polarizer.

In recent years, wire grid polarizers that are excellent in light utilization efficiency and easy to reduce in thickness have attracted attention. Several methods have been proposed as a method for manufacturing a wire grid polarizer.
For example, in the prior art of Patent Document 1, a metal thin film is formed on a glass substrate, a polymer made of a thermosetting material or a UV curable material is applied on the metal thin film, and a fine pattern is formed on the surface. Describes a method of manufacturing a wire grid polarizer in which a fine pattern is transferred to a polymer and the polymer and metal thin film are etched to form a wire grid on a glass substrate. This manufacturing method is a manufacturing method using a so-called thermal nanoimprinting method or optical nanoimprinting method in the step of forming a fine pattern by a mold.
In Patent Document 1, a non-adhesive layer is formed in the region of the lower substrate using the same nanoimprint method, and then a polymer layer and a flexible polymer substrate are formed on the lower substrate, and a metal thin film is formed on the flexible polymer substrate. And forming a metal lattice pattern by etching the metal thin film, dicing the entire wafer, and separating the lower substrate on which the non-adhesive layer is formed from the diced wafer. Is described.
Patent Document 2 discloses a grid manufacturing mold of a wire grid polarizing film (wire grid polarizer) using a mold roller having a fine pattern formed on the surface as a technique for continuously forming a fine pattern on a film. The manufacturing method is described.
JP 2005-316495 A JP 2006-201782 A

However, the conventional method for manufacturing a wire grid polarizer as described above has the following problems.
In the technique described in Patent Document 1, since a resin layer having a fine pattern used as an etching mask is formed by a nanoimprint method, for example, compared to a case where a fine pattern is drawn and patterned by an electron beam (EB) lithography method or the like. Although it can be efficiently manufactured, there is a strong demand for further improving the manufacturing efficiency.
For example, when the optical nanoimprint method is used, at least one of the base material and the stamper needs to transmit irradiation light such as ultraviolet (UV) light in order to photocure the resin. Since it is necessary to form a metal film on the substrate, it is necessary to use a light transmissive stamper. Further, it is necessary to provide a fine uneven shape corresponding to the grating pitch (for example, 200 nm or less) of the metal grid of the wire grid polarizer.
For this reason, as the stamper, a pattern obtained by patterning a fine concavo-convex shape by drawing on the surface of a quartz plate by an EB lithography method or the like is used. Such a fine concavo-convex shape of a quartz plate has a problem that it is very easy to break and requires attention in handling, and has poor durability.
In addition, since the quartz plate is limited in size and shape, there is a problem that it is difficult to manufacture a large area and improve mass productivity. In addition, there is a problem that it is not suitable for a so-called roll-to-roll method in which manufacturing efficiency is improved by conveying a base film passed between rolls and continuously forming the film on a conveyance path.
Further, in the case of using the thermal nanoimprint method, since heating and pressing are repeated with a stamper, it is necessary to ensure the durability of the fine uneven shape, and there is a problem that the manufacturing cost of the stamper increases.
In addition, as a technique related to this, Patent Document 2 discloses a method of manufacturing a wire grid polarizer by providing a grid structure layer on a polymer substrate and depositing a metal film on a part of the surface thereof. Although a technique for continuously forming a grid structure layer (fine concavo-convex shape) on a polymer thin film on a polymer substrate by a mold roller is described, no method for producing such a mold roller is disclosed. . Therefore, for example, it is unclear how a mold roller having optical transparency and durability, or a mold roller that is durable even when heat pressing is repeated, and can be easily applied to the technique of Patent Document 1. It is not a thing.

  This invention is made | formed in view of the above problems, and it aims at providing the manufacturing method of the wire grid polarizer which can improve the productivity of a wire grid polarizer.

In order to solve the above-described problems, a method of manufacturing a wire grid polarizer of the present invention is a method of manufacturing a wire grid polarizer including a fine metal grating on a light-transmitting substrate, and has fine irregularities on the surface. A resin stamper forming step of forming a light transparent resin stamper by transferring the fine uneven shape onto a light transparent resin base material using a metal stamper having a shape, and forming in the resin stamper forming step A mold release treatment step of performing a mold release treatment on the surface of the resin stamper on which the fine irregularities are formed, a metal film formation step of forming a metal film on the substrate, and the metal film formation step A photo-curable resin is applied onto the metal film formed in step (1), and the resin stamper that has been subjected to the release process in the release process is held in a pressed state by the photo-curable resin applied on the metal film. And the light A resin molding step of irradiating the resin with light from the resin stamper side and curing the resin stamper from the photocured resin cured in the resin molding step, on the metal film, A resin stamper peeling step for forming the resin lattice layer to which the fine uneven shape of the resin stamper is transferred, and the metal film on the substrate is etched using the resin lattice layer formed in the resin stamper peeling step as a mask. And an etching step.
According to the present invention, a resin stamper forming step is performed to form a resin stamper to which the fine concavo-convex shape of the metal stamper is transferred, and a mold release process step is performed to perform a mold release process. Then, a photocurable resin is applied to the base material on which the metal film is formed by the metal film forming process, the resin stamper is held in a pressed state, and light is irradiated from the resin stamper side. Then, a resin molding step of curing the photocurable resin is performed. That is, the photocurable resin is molded using the resin stamper as a mold. Next, in the resin stamper peeling step, the resin stamper is peeled to form a resin lattice layer. Then, by performing the etching process, a fine metal lattice can be formed by etching the metal film on the substrate using the resin lattice layer as a mask.
Since the mold release process is provided as described above, the resin material of the resin stamper can be made of the same material or the same kind of material as the photo-curable resin that forms the resin lattice layer. Moreover, since the resin stamper uses the resin stamper newly formed with high accuracy by a metal stamper as a molding die in the next resin molding step, it is possible to prevent deterioration of the resin stamper due to repeated manufacturing.

  According to the method for manufacturing a wire grid polarizer of the present invention, a light-transmitting resin stamper formed of a metal stamper is subjected to a mold release treatment, and a resin molding step of a photocurable resin is performed using the resin stamper. There is an effect that the productivity of the grid polarizer can be improved.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
The manufacturing method of the wire grid polarizer which concerns on embodiment of this invention is demonstrated.
FIG. 1 is a schematic partial cross section in a plane perpendicular to the extending direction of a metal grid, showing a schematic configuration of an example of a wire grid polarizer manufactured by a method of manufacturing a wire grid polarizer according to an embodiment of the present invention. FIG.

First, the wire grid polarizer 1 which is an example of the wire grid polarizer manufactured by the manufacturing method of the wire grid polarizer of this embodiment is demonstrated.
As shown in FIG. 1, the wire grid polarizer 1 includes a plurality of metal grids having a substantially rectangular cross section having a width w and a height t _b on one surface of a flexible light-transmitting base film 1a. 1b is a pitch p (although, p> w) parallel formed in, on each metal grid 1b, resin grating 1c thickness t _c, which are respectively formed at substantially the same width. For this reason, the resin lattice 1c of the present embodiment constitutes a lattice pattern composed of parallel line groups having the same pitch p as the metal lattice 1b. The extending direction of the metal lattice 1b and the resin lattice 1c is the depth direction in FIG.

The thickness t _a of the base film 1a, for example, if by stretching between rolls having flexibility and strength that can be conveyed in the rotational direction of the roll, can be employed thickness of appropriate . Although it depends on the material, for example, a thickness of 1 μm to 250 μm is suitable.
The light transmittance of the base film 1a should just have the light transmittance with respect to the wavelength of the light which the wire grid polarizer 1 should permeate | transmit at use conditions.
Examples of the material of the base film 1a include acrylic resin, polyester resin, polyethylene terephthalate (PET) which is a kind of polyester resin, polycarbonate (PC) resin, cyclic olefin polymer (COP), cyclic olefin copolymer (COC), and norbornene. System resin, polyimide resin, etc. can be employed.

The pitch p of the metal grating 1b varies depending on the wavelength region in which the wire grid polarizer 1 is used. For example, when used for wavelengths in the visible light region, 50 nm to 200 nm is preferable.
The thickness t _b of the metal grating 1b is preferably 150 nm to 250 nm, and is preferably 175 nm to 200 nm in order to obtain better optical performance.
As the material of the metal lattice 1b, for example, a metal such as aluminum, silicon, tin, silver, indium, copper, gold, magnesium, or an alloy containing these can be employed. Moreover, it is good also as a structure which laminated | stacked these metals or alloys in the height direction using multiple.
Aluminum is most suitable when estimated from the refractive index of the metal.

Since the resin lattice 1c is provided so as to cover the metal lattice 1b, it has a function of protecting the surface of the metal lattice 1b and preventing oxidation of the metal lattice 1b. However, since the resin lattice 1c and its thickness t _c are not greatly related to the polarization characteristics of the wire grid polarizer 1, the resin lattice 1c may be omitted.

Next, the manufacturing method of the wire grid polarizer of this embodiment which manufactures such a wire grid polarizer 1 is demonstrated.
FIG. 2 is a schematic device configuration diagram illustrating a schematic configuration of a nanoimprint process unit of a wire grid polarizer manufacturing apparatus that performs a method of manufacturing a wire grid polarizer according to an embodiment of the present invention. FIG. 3 is a schematic device configuration diagram illustrating a schematic configuration of an etching process unit of a wire grid polarizer manufacturing apparatus that performs a method of manufacturing a wire grid polarizer according to an embodiment of the present invention.

  The method includes a resin stamper forming step, a mold release processing step, a metal film forming step, a resin molding step, a resin stamper peeling step, and an etching step. By performing these steps in the order described below, a wire grid is formed. This is a method for manufacturing the polarizer 1. In this embodiment, these processes are performed using the wire grid polarizer manufacturing apparatus 100 shown in FIGS.

First, a schematic configuration of the wire grid polarizer manufacturing apparatus 100 will be described.
The wire grid polarizer manufacturing apparatus 100 includes a nanoimprint process unit 100A that performs a resin stamper forming process, a mold release process process, a metal film forming process, a resin molding process, and a resin stamper peeling process, and an etching process unit 100B that performs an etching process. Consists of.

As shown in FIG. 2, the nanoimprint process unit 100 </ b> A extends the long resin film 4 to the main rolls 103 and 109 arranged in the axial direction extending in the illustrated depth direction and spaced apart from each other in parallel. It is hung around and stretched substantially horizontally between them so that it can be continuously conveyed from the main roll 103 toward the main roll 109.
The resin film 4 is unwound from a resin film supply roll (not shown), and is conveyed substantially horizontally from the left side of FIG.
Rollers 102 and 104 and rollers 108 and 111 for winding and transporting the resin film 4 are provided on the outer peripheral portions of the main rolls 103 and 109, respectively. A rotational force is transmitted to the main rolls 103 and 109 and the rollers 102, 104, 108, and 111 from at least a part or all including the main rolls 103 and 109 from the illustrated driving mechanism, and the resin film 4 is It can be rotated and conveyed in the same direction and at the same speed.
Hereinafter, the relative positional relationship of members and the like may be expressed as an upstream side, a downstream side, and the like based on the conveyance direction and the conveyance path of the resin film 4 unless the conveyance path is particularly refused.

  A UV light source 113 that irradiates UV light 113 a from the outside in the radial direction toward the resin film 4 and the main roll 103 is disposed at a portion where the resin film 4 is wound around the outer periphery of the main roll 103. Further, a UV light source 114 that irradiates UV light 114 a toward the resin film 4 and the main roll 109 from the outer side in the radial direction is disposed at a portion where the resin film 4 is wound around the outer periphery of the main roll 109.

On the upstream side of the roller 102, a coating head 101 for applying a UV curable resin 101 a to the resin film 4 on the resin film 4 stretched substantially horizontally between a resin film supply roll (not shown) and the roller 102. Is arranged.
Above the resin film 4 between the rollers 104 and 108, a plasma processing head 105 for irradiating plasma 105a and a coating head 106 for applying a release treatment agent 106a are arranged in this order from the upstream side. .

On the transport path between the coating head 106 and the roller 108, a metal film 51 (described later) that is unwound from a metal film supply roll (not shown) and transported in a substantially horizontal direction is placed on the resin film 4. A conveying roller 107 is provided for reversing and overlapping. For this reason, in the portion where the resin film 4 is wound around the main roll 109, the metal film 51 superimposed on the resin film 4 is conveyed while being sandwiched between the resin film 4 and the main roll 109. It is like that.
In the transport path of the metal film 51, a coating head 110 for applying the UV curable resin 110 a is disposed on the upstream side of the transport roller 107 from above the metal film 51.

In the present embodiment, the resin film 4 and the metal film 51 are separated from each other on the downstream side of the roller 111 and can be transported in different transport directions. At least the peeled resin film 4 is wound around a winding roller (not shown). Here, the peeled metal film 51 is a resin lattice film 52 having a resin lattice layer 8 to be described later on its surface.
And, at the opposite position on the upper side of the roller 111, the superimposed resin film 4 so that the peeling force applied between the resin film 4 and the metal film 51 on the downstream side of the roller 111 is not transmitted to the upstream side, There is provided a roller 112 that holds the metal film 51 between the roller 111 and rotationally supports it.

  As shown in FIG. 3, the etching process unit 100B is a buffer tank in which the vacuum chambers 120 and 122 for evacuating the interior and maintaining the vacuum state are evacuated and maintained in a vacuum state so that the mutual atmosphere is not mixed. 121 are arranged adjacent to each other.

The vacuum chamber 120 is a part that rotates and conveys the resin lattice film 52 formed in the nanoimprint process unit 100A and performs anisotropic dry etching on the resin portion of the resin lattice film 52.
In this embodiment, in order to perform reactive ion etching (RIE) as dry etching, an electrode roll 124 that holds the resin lattice film 52 rotatably and applies a high frequency voltage, and a high frequency to the electrode roll 124. A high-frequency power supply 128 that supplies voltage, conveying rollers 123 and 126 that hold the resin lattice film 52 on the electrode roll 124 and hold it rotatably, and ions of the reactive gas G1 by introducing the reactive gas G1 inside A shower plate 125 that generates a plasma 125a including the above and injects the plasma 125a from a large number of holes toward the electrode roll 124, and a high-frequency power source 127 that applies a high-frequency voltage to the shower plate 125.

The electrode roll 124 is provided with a cooling mechanism (not shown) in order to prevent thermal deformation of the wound resin lattice film 52 during etching, so that the temperature of the resin lattice film 52 can be kept within a certain range. It has become.
Further, a shielding plate 129 for restricting the exposed area of the resin lattice film 52 is provided between the resin lattice film 52 and the shower plate 125 wound on the electrode roll 124. Thus, dry etching is performed only on the resin lattice film 52 that has reached the opening surrounded by the end of the shielding plate 129.

The vacuum chamber 122 is a portion that is unwound in the horizontal direction by the transport roller 126 and rotates and transports the resin lattice film 52 that has passed through the buffer tank 121 to subject the metal film portion of the resin lattice film 52 to anisotropic dry etching. It is.
In this embodiment, in order to perform RIE as dry etching, an electrode roll 131 that holds the resin lattice film 52 rotatably and applies a high-frequency voltage, a high-frequency power source 135 that supplies the electrode roll 131 with a high-frequency voltage, Conveying rollers 130 and 133 that wrap the resin lattice film 52 on a roll 131 and hold the resin lattice film 52 rotatably, and introduce a reactive gas G2 into the interior to generate a plasma 132a containing ions of the reactive gas G2 to generate a large number of holes. A shower plate 132 for injecting the plasma 132a from the unit to the electrode roll 131 side, and a high-frequency power source 134 for applying a high-frequency voltage to the shower plate 132.

The electrode roll 131 is provided with a cooling mechanism (not shown) in order to prevent thermal deformation of the wound resin lattice film 52 during etching, so that the temperature of the resin lattice film 52 can be kept within a certain range. It has become.
Further, a shielding plate 129 for restricting the exposed area of the resin lattice film 52 is provided between the resin lattice film 52 and the shower plate 132 wound on the electrode roll 131. Thus, dry etching is performed only on the resin lattice film 52 that has reached the opening surrounded by the end of the shielding plate 129.
The resin lattice film 52 unwound by the transport roller 133 is discharged out of the vacuum chamber 122 by an unillustrated unloading mechanism.

Next, the wire grid polarizer manufacturing method according to the embodiment of the present invention will be described along with the operation of the wire grid polarizer manufacturing apparatus 100.
4 (a), 4 (b), and 4 (c) are schematic process explanatory views of each manufacturing process of the manufacturing method of the wire grid polarizer according to the embodiment of the present invention. 5D, 5E, and 5F are schematic process explanatory views of each manufacturing process subsequent to FIG. FIGS. 6G and 6H are schematic process explanatory diagrams of the respective manufacturing processes following FIG. Each of these drawings shows a partial cross-sectional view in the plane perpendicular to the extending direction of the metal grid of the wire grid polarizer similar to that in FIG. 1 (the same applies to FIG. 7).

First, a metal stamper forming process is performed. This step is a step of forming the metal stamper 3 having the uneven portion 3a on the surface.
As shown in FIG. 4A, on the surface of the master substrate 2 made of quartz glass, the groove width is w, the groove pitch is p, and the depth corresponding to the width of the fine uneven shape of the wire grid polarizer 1. The h-shaped rectangular cross-sectional groove forms a concavo-convex portion 2a having a linear grating structure extending in the depth direction of the drawing.
The depth h may be larger than the height t _c of the resin lattice 1c, and for example, 30 nm to 200 nm is preferable.
As a method for forming the uneven portion 2a, a well-known EB lithography method can be employed. That is, a mask pattern corresponding to the concavo-convex portion 2a is created by applying a photosensitive agent on quartz glass, EB drawing, and developing. And a master substrate 2 is obtained by forming a groove by dry etching and removing the mask pattern.
Here, in addition to the EB drawing method, for example, a two-beam interference method, an electrospinning method, a surface interference method of a polarized femtosecond laser, or the like may be employed as the mask pattern.

Next, as shown in FIG. 4B, a metal stamper 3 having a concavo-convex portion 3a in which the concavo-convex relationship is reversed is produced as a duplicate plate using the concavo-convex portion 2a of the master substrate 2 as an original.
In this embodiment, the metal stamper 3 is produced by a nickel electroforming method. That is, the thin film conductive film layer is formed on the concavo-convex portion 2 a by electroless nickel plating, electrolytic nickel plating is performed thereon, and the plated portion is peeled off from the master substrate 2.
This completes the metal stamper forming step.

  The metal stamper 3 has a mechanical strength that can be peeled off from the master substrate 2 and can be repeatedly used as a mold for UV curable resin molding, and flexible enough to be wound around the main roll 103. If it is, it can be set to an appropriate thickness. For example, a thickness of about 0.1 mm to 0.5 mm is suitable.

  The manufacturing method of the metal stamper 3 is not limited to the nickel electroforming method, and may be an electroforming method using other metals. Moreover, as a method of forming a metal layer on the concavo-convex portion 2a, for example, physical vapor deposition (PVD) such as vacuum deposition or sputtering, chemical vapor deposition (CVD), or the like is used. It may be used.

Next, a resin stamper forming step is performed. This step is a step of forming a light-transmitting resin stamper 50 by transferring the shape of the concavo-convex portion 3 a onto the light-transmitting resin film 4 using the metal stamper 3.
That is, as shown in FIG. 4C, the UV curable resin 101a is applied on the resin film 4 having light permeability to the UV light 113a, and the uneven portion 3a of the metal stamper 3 is pressed against the UV curable resin 101a. In this state, UV light 113a is irradiated from the resin film 4 side. Thereby, UV curable resin molding for curing the UV curable resin 101a is performed, and the metal stamper 3 is peeled off.
As a result, the uneven portion 3a of the metal stamper 3 is transferred to the surface of the resin layer 5, and the uneven portion 5a in which the uneven relationship of the uneven portion 3a is reversed is formed.
That is, in this step, the metal stamper 3 that does not transmit the UV light 113a is used, and the UV light 113a is irradiated from the resin film 4 side that transmits the UV light 113a, so that the shape of the uneven portion 3a of the metal stamper 3 is UV curable resin. An optical nanoimprint method for transferring to 101a is performed.

As a material of the resin film 4, for example, acrylic resin, polyester resin, PET which is a kind of polyester resin, PC resin, COP, COC, norbornene resin, polyimide resin, or the like can be used.
If the adhesiveness between the material of the resin film 4 and the UV curable resin 101a is not good, an easy adhesion treatment is performed on the surface of the resin film 4 in advance.

As the UV curable resin 101a, an acrylic urethane UV curable resin or a fluorine-containing resin can be used. Examples thereof include resins such as a photo-curable resin PAK-01 (trade name; manufactured by Toyo Gosei Co., Ltd.) and a fluorine-containing photosensitive resin NIF-A-1 (trade name; manufactured by Asahi Glass Co., Ltd.) for UV nanoimprint. it can.
The viscosity of the UV curable resin 101a is preferably 10 mPas to 500 mPas. When the viscosity is lower than 10 mPas, the film thickness becomes too thin when imprinted, and the resin film 4 is easily affected by unevenness and particles. When the viscosity is higher than 500 mPas, it becomes difficult for the UV curable resin 101a to be filled in the concavo-convex portion 3a, and the shape of the concavo-convex portion 5a is likely to be reduced.

In this embodiment, as shown in FIG. 2, this process is performed by winding the resin film 4 around the main roll 103 of the nanoimprint process unit 100A and rotating and transporting it.
Therefore, first, the metal stamper 3 is wound around the main roll 103 and fixed so that the extending direction of the concavo-convex portion 3a is the circumferential direction. In FIG. 2, an example in which the metal stamper 3 is partially fixed in the circumferential direction of the main roll 103 is illustrated, but this is an example. In order to further improve manufacturing efficiency, the metal stamper 3 is preferably provided over substantially the entire circumference of the main roll 103. Moreover, you may employ | adopt the form which arrange | positions and fixes the some metal stamper 3 at intervals in the circumferential direction.

  The resin film 4 is unwound from a resin film supply roll (not shown) and is wound around the transport roller 102. In the coating head 101 located upstream of the conveying roller 102, the UV curable resin 101 a is dropped onto the surface of the resin film 4 and applied to a thickness of 1 μm to 20 μm. Then, the applied UV curable resin 101a is pressed against the uneven portion 3a of the metal stamper 3 on the main roll 103, and the shape of the uneven portion 3a is imprinted on the UV curable resin 101a.

  At this time, by setting each rotation linear velocity of the conveyance roller 102 and the main roll 103 to 1 cm / min to 10 m / min, and appropriately setting the distance between the axes and the dropping amount of the UV curable resin 101a in advance. The roller 102 and the main roll 103 adjust the resin film 4 so that it is squeezed at a linear pressure of 9.8 N / cm to 49 N / cm (1 kgf / cm to 5 kgf / cm). As a result, the resin film 4 is satisfactorily adhered to the metal stamper 3 via the UV curable resin 101a, and a laminate structure including the resin film 4, the UV curable resin 101a, and the metal stamper 3 is formed on the main roll 103. The

Here, if the coating amount of the UV curable resin 101a is small, the imprinted resin film thickness becomes too thin, and it is easily affected by irregularities and particles that are fine defects such as scratches and dust on the surface of the resin film 4. Become. If the coating amount is too large, the resin overflows.
Similarly, if the imprinting pressure is too strong, the imprinted resin film thickness becomes too thin and is easily affected by unevenness and particles of the resin film 4, and if too weak, the unevenness 3a of the metal stamper 3 is affected. The entire portion cannot be filled with the UV curable resin 101a, and the shape of the concavo-convex portion 5a is lost.
While the space | interval (thickness of the resin residue part 5c (refer FIG.5 (d)) of the convex part front-end | tip of the uneven | corrugated | grooved part 3a and the resin film 4 improves the adhesiveness of the resin film 4 and UV curable resin 101a, In order not to be affected by unevenness and particles of the resin film 4, it is preferable that the thickness is 0.5 μm or more and 10 μm or less.

Then, UV light 113 a is irradiated through the resin film 4 from the UV light source 113 disposed opposite to the main roll 103, and the UV curable resin 101 a is cured before the resin film 4 forming the laminate structure reaches the transport roller 104. Terminate. Thereby, the resin layer 5 in which the UV curable resin 101 a is cured is formed between the metal stamper 3 and the resin film 4.
Exposure of UV light source 113, depending on the type of UV curable resins 101a, for ^example, be set in a range of ^{10mJ / cm 2 ~1000mJ / cm 2} .
If the exposure amount of the UV light 113a is too small, the curing of the UV curable resin 101a becomes insufficient, and the shape of the concavo-convex portion 5a may become distorted. Further, the unreacted product (uncured product) of the UV curable resin 101a may be gasified in a subsequent process to inhibit etching.
If the exposure amount of the UV light 113a is too large, the conveyance speed is reduced, which affects the productivity. In addition, the film may be distorted due to the heat generated by the UV light source 113.

When the resin film 4 forming the laminate structure reaches the conveyance roller 104, the resin film 4 is wound around the conveyance roller 104 and conveyed in the horizontal direction as shown in FIG. Thereby, the resin layer 5 is peeled off from the metal stamper 3 and released. As a result, a film-like resin stamper 50 including the resin layer 5 in close contact with the resin film 4 is formed and conveyed to the next step.
The uneven portion 5 a formed in the resin stamper 50 has a shape obtained by inverting the uneven portion 3 a and has the same shape as the uneven portion 2 a of the master substrate 2.
Thus, the resin stamper forming process is completed.

Next, a mold release process is performed. This step is a step of performing a mold release treatment on the surface of the resin stamper formed in the resin stamper forming step on which the fine irregularities are formed.
In this embodiment, in order to apply the mold release treatment agent while the resin stamper 50 is conveyed from the conveyance roller 104 to the conveyance roller 108, the mold release pretreatment and the mold release treatment agent that activate the surface of the concavo-convex portion 5a. Are applied and dried in this order.

In the pre-release treatment of the present embodiment, a plasma treatment is performed by exposing the surface of the concavo-convex portion 5a to the plasma 105a by the plasma treatment head 105 disposed on the resin layer 5 side of the resin stamper 50.
As the plasma treatment, for example, atmospheric plasma treatment using a normal-pressure plasma surface treatment apparatus RD550 (trade name; manufactured by Sekisui Chemical Co., Ltd.) compatible with roll-to-roll can be employed.
Further, when the nanoimprint process unit 100A is installed in a vacuum chamber, a vacuum plasma treatment may be performed. In this case, instead of the plasma processing head 105, a roll transport type plasma processing machine that wraps and transports a high-frequency voltage on an electrode roll on the resin film 4 side and supplies a gas for forming plasma in the vicinity of the uneven portion 5 a. May be used. With such a plasma processing apparatus, for example, a high-frequency voltage is 100 W to 500 W, a gas flow rate is 5 sccm (1013.25 hPa, 25 ° C., 5 cm ^{3 /} min) to 100 sccm (1013.25 hPa, 25 ° C.). , 100 cm ³ / min) and a gas pressure of 1 Pa to 50 Pa, a plasma may be formed and a vacuum plasma treatment may be performed such that the uneven portion 5 a is exposed for 10 seconds to 1 minute.

The release treatment agent is applied evenly by dropping the release treatment agent 106a onto the surface of the concavo-convex portion 5a by the coating head 106 on the downstream side of the plasma processing head 105. The coating amount of the release treatment agent 106a is appropriately set so that the release treatment agent 106a reaches the surface of the concavo-convex portion 5a. The mold release treatment agent 106a is dried by natural drying in the conveyance path from the coating head 106 to the conveyance roller 108, or by placing a blower or the like for supplying warm air on the conveyance path.
As the mold release treatment agent 106a, for example, an agent capable of improving the mold release property with respect to the UV curable resin such as an alcohol-based fluorine coating agent is employed. For example, OPTOOL HD1100 (trade name; manufactured by Harves Co., Ltd.), Novec EGC-1720 (trade name; manufactured by Sumitomo 3M Co., Ltd.), or the like can be employed.
Thus, as shown in FIG.5 (d), the mold release process part 5b is formed on the surface of the uneven | corrugated | grooved part 5a.

The metal film forming step is a step of forming the metal film 7 on the base film 1a.
In the present embodiment, aluminum having a film thickness of 150 nm to 250 nm, preferably 175 nm to 200 nm is formed in advance on the base film 1a by vacuum deposition or sputtering to form the metal film 51.
If good adhesion cannot be obtained between the metal film 7 and the UV curable resin 110a due to the type of metal or the like, before applying the UV curable resin 110a, for example, a silane is formed on the metal film 7. It is preferable to apply an easy adhesion treatment such as applying a coupling agent and drying.

In the resin molding process, the UV curable resin 110a is applied on the metal film 7 of the metal film 51 formed in the metal film forming process, and the resin stamper 50 subjected to the mold release process in the mold release process is applied on the metal film 7. This is a step of holding the UV curable resin 110a applied to the resin in a pressed state and irradiating the UV curable resin 110a with UV light 114a from the resin stamper 50 side.
That is, in this step, the resin stamper 50 that transmits the UV light 114a is used, and the UV light 114a is irradiated from the side of the base film 1a that transmits the UV light 114a, so that the shape of the uneven portion 5a of the resin stamper 50 is UV cured. An optical nanoimprint method for transferring to the resin 110a is performed.
The UV curable resin 110a can be selected from the same materials as the UV curable resin 101a, and may be the same material as the UV curable resin 101a. The conditions for the viscosity are the same as those for the UV curable resin 101a.

In this embodiment, as shown in FIG. 2, the metal film 51 to which the UV curable resin 110 a is applied is wound around the main roll 109 of the nanoimprint process unit 100 </ b> A and rotated and conveyed. This is performed by rotating and transporting the resin stamper 50 against the UV curable resin 110a.
Therefore, above the main roll 109, the metal film 7 is transported with the metal film 7 facing upward, and the UV curing resin 110 a is dropped by the coating head 110 on the transport path, onto the metal film 7. Apply.
Then, the metal film 51 is wound around the conveyance roller 107 so that the UV curable resin 110a faces downward, and is conveyed on the conveyance roller 108 so as to face the upper side of the resin stamper 50.
Thereby, the metal film 51 is wound around the main roll 109, and the resin stamper 50 is pressed against the UV curable resin 110a via the transport roller. As a result, as shown in FIG. 5E, a laminate structure is formed in which the UV curable resin 110a is sandwiched between the uneven portion 5a and the metal film 7, and the shape of the uneven portion 5a is changed to the UV curable resin 110a. Imprinted.

  The coating amount of the UV curable resin 110a and the inter-axis distance between the transport roller 108 and the main roll 109 are set between the convex end of the resin layer 5 and the metal film 7 and a residue portion 8b after curing (FIG. 5F). Is set so that a layer of the UV curable resin 110a having a thickness equal to or less than the height of the uneven portion 8a of the resin pattern remains.

Then, the UV light 114 a is irradiated through the resin stamper 50 from the UV light source 114 disposed so as to face the main roll 109, and before the laminated resin stamper 50 and the metal film 51 reach the transport roller 111, the UV curable resin 110 a is used. Finish curing. As a result, the resin lattice layer 8 (see FIG. 5F) having the uneven portions 8a and the residue portions 8b is formed between the metal film 51 and the resin stamper 50.
At this time, the exposure amount of the UV light source 114, depending on the type of UV curable resins 110a, for ^example, be set in a range of ^{10mJ / cm 2 ~1000mJ / cm 2} .
If the exposure amount of the UV light 114a is too small, the curing of the UV curable resin 110a becomes insufficient, and the shape of the concavo-convex portion 8a may become distorted. In addition, the unreacted material (uncured material) of the UV curable resin 110a may be gasified in a later process to inhibit etching.
If the exposure amount of the UV light 114a is too large, the conveyance speed is decreased, which affects the productivity. In addition, the film may be distorted due to the heat generated by the UV light source 114.
Thus, the resin molding process is completed.

Next, a resin stamper peeling process is performed. This step is a step in which the resin stamper 50 is peeled off from the UV curable resin 110a cured in the resin molding step to form the resin lattice layer 8 in which the uneven portions 5a of the resin stamper 50 are transferred onto the metal film 7. is there.
The metal film 51 and the resin stamper 50 conveyed on the main roll 109 in a laminated state are respectively wound around the conveyance rollers 112 and 111 and conveyed separately in different directions. At this time, the surface of the concavo-convex portion 5a is subjected to the mold release process, and the mold release process portion 5b is formed. Therefore, the resin stamper 50 is easily peeled off from the resin lattice layer 8.
As a result, the resin lattice layer 8 remains on the surface of the metal film 7 of the metal film 51, and a resin lattice film 52 as shown in FIG. The shape of the concavo-convex portion 8a is a shape obtained by inverting the concavo-convex portion 5a, and thus has the same shape as the concavo-convex portion 3a. The resin lattice film 52 is conveyed to the etching process part 100B, and the next etching process is performed.
On the other hand, the resin stamper 50 is wound around a take-up reel (not shown) and discarded or recycled after separation.
Thus, the resin stamper peeling step is completed.

Next, an etching process is performed. This step is a step of etching the metal film 7 on the base film 1a using the resin lattice layer 8 formed on the metal film 7 in the resin stamper peeling step as a mask.
In this embodiment, when the resin lattice film 52 is introduced into the vacuum chamber 120 of the etching process unit 100B, the electrode is wound around the transport roller 123 so that the base film 1a side is in close contact with the outer peripheral surface of the electrode roll 124. It is wound around a roll 124 and conveyed.
High frequency voltages of 13.56 MHz and 400 kHz are applied to the shower plate 125 and the electrode roll 124 by high frequency power sources 127 and 128, respectively. Thereby, plasma 125a is generated in the shower plate 125 and sprayed to the electrode roll 124 side. At this time, a reactive gas G1 for RIE of the resin lattice layer 8 is supplied to the shower plate 125.
As the reactive gas G1, a reactive gas such as O ₂ , Cl ₂ , CF ₄ , or SF ₆ , or a gas in which an appropriate amount of an inert gas such as Ar, He, or N ₂ is mixed can be used.

When the resin lattice film 52 reaches the opening of the shielding plate 129, the resin lattice layer 8 on the surface of the resin lattice film 52 is exposed to the plasma 125a and anisotropically etched in the thickness direction. Since the electrode roll 124 is cooled to a certain temperature range by a cooling mechanism (not shown), the temperature rise of the resin lattice film 52 exposed to the plasma 125a can be reduced, and the resin lattice layer 8 and the substrate film can be reduced. Thermal deformation of 1a can be suppressed.
Then, as shown in FIG. 6G, the resin lattice layer 8 is etched in the thickness direction. That is, the residue portion 8b disappears, and only the convex portion of the concavo-convex portion 8a remains on the metal film 7, so that the resin lattice 1c is formed.

When the resin lattice film 52 is transported to the position covered with the light shielding plate 129, the plasma 125a is shielded by the shielding plate 129, so that the progress of etching is stopped. Then, the resin lattice film 52 is wound around the transport roller 126 as it is, and transported by changing the direction in the horizontal direction.
In order to perform favorable anisotropic etching, the degree of vacuum in the vacuum chamber 120 is preferably 1.33 × 10 ² Pa (1 Torr) or less. When the degree of vacuum is greater than 1.33 × 10 ² Pa (1 Torr), the anisotropy of RIE etching becomes weak, and the shape of the concavo-convex portion 8a after etching is lost.

The resin lattice film 52 wound around the transport roller 126 is introduced into the vacuum chamber 122 via the buffer tank 121. And it is wound around the conveyance roller 130, wound around the electrode roll 131 so that the base film 1a side is in close contact with the outer peripheral surface of the electrode roll 131, and is conveyed.
High frequency voltages of 13.56 MHz and 400 kHz are respectively applied to the shower plate 132 and the electrode roll 131 by high frequency power sources 134 and 135, respectively, and plasma 132a is generated in the shower plate 132 and sprayed to the electrode roll 131 side. Is done. At this time, a reactive gas G2 for RIE of the metal film 7 is supplied to the shower plate 131.
For example, in the case of aluminum, Cl ₂ or a mixed gas in which BCl ₃ (boron trichloride) is mixed with Cl ₂ may be employed as the reactive gas G 2, depending on the type of metal of the metal film 7. it can.

When the resin lattice film 52 reaches the opening of the shielding plate 129, the metal film 7 exposed on the surface of the resin lattice film 52 is exposed to the plasma 132a and anisotropically etched in the thickness direction. Since the electrode roll 131 is cooled to a certain temperature range by a cooling mechanism (not shown), the temperature rise of the resin lattice film 52 exposed to the plasma 132a can be reduced, and the resin lattice 1c and the base film 1a can be reduced. The thermal deformation of can be suppressed.
Then, as shown in FIG. 6H, the metal film 7 is etched in the thickness direction. That is, the base film 1a is exposed, and the metal film 7 is left with only a linear lattice pattern covered with the resin lattice 1c, thereby forming the metal lattice 1b.
When the resin lattice film 52 is transported to the position covered with the light shielding plate 129, the plasma 131a is shielded by the shielding plate 129, so that the progress of etching is stopped. The resin lattice film 52 is wound around the transport roller 133 as it is, transported in the horizontal direction, and transported out of the vacuum chamber 122.
In order to perform favorable anisotropic etching, the degree of vacuum in the vacuum chamber 124 is preferably 1.33 × 10 ² Pa (1 Torr) or less. When the degree of vacuum is higher than 1.33 × 10 ² Pa (1 Torr), the anisotropy of RIE etching becomes weak, and the shape of the metal lattice 1b is lost.
Thus, the etching process is completed.
By performing the above steps, the wire grid polarizer 1 is manufactured as shown in FIG.

As described above, according to the method of manufacturing the wire grid polarizer of the present embodiment, the resin stamper 50 is repeatedly formed by the metal stamper 3, and the mold is subjected to the mold release treatment, whereby the light transmittance in the optical nanoimprint method is achieved. It can be used as a stamper. Therefore, it is possible to form the resin lattice film 52 having the uneven portion 8a formed of the UV curable resin 110a on the surface. And the wire grid polarizer 1 can be formed by anisotropic etching.
Each of these steps can be performed on a transport path for continuously transporting the base film 1a and the resin film 4 in a roll-to-roll manner as in the wire grid polarizer manufacturing apparatus 100, and the wire grid polarizer 1 is continuously formed. Can be manufactured automatically. Therefore, the productivity of the wire grid polarizer 1 can be improved.

Further, since the metal stamper 3 is wound around the main roll 103 to form a stamper roll, the length of the wire grid polarizer 1 can be freely changed by winding the metal stamper 3 around the entire circumference and continuously forming it. The long wire grid polarizer 1 can be easily manufactured.
Further, since the resin stamper 50 is not repeatedly used as a stamper, a shape error due to deterioration with time such as wear or deformation of the stamper does not occur in the uneven portion 8a.
In addition, a stamper that takes time to manufacture a quartz glass plate or the like and is easily damaged by repeated use may be used only once when forming the metal stamper 3 as the master substrate 2, so that it is inexpensive and efficient to manufacture. be able to.
In addition, the resin stamper 50 can be easily peeled even if it is made of the same material or the same kind of material as the UV curable resin 110a for forming the resin lattice layer 8 by performing a release treatment. Therefore, an inexpensive UV curable resin can be used as the UV curable resin 101a without using a special resin material having releasability with respect to the UV curable resin.

Next, a first modification of the present embodiment will be described.
FIG. 7 is a schematic process explanatory diagram of one manufacturing process of the method for manufacturing the wire grid polarizer according to the first modification of the embodiment of the present invention.

The manufacturing method of the wire grid polarizer of this modification performs a protective layer formation process after the etching process of the said embodiment.
The protective film forming step is a step of forming a protective layer 9 that covers the resin lattice 1c that is the resin lattice layer 8 remaining in the etching step.
In this modified example, as shown in FIG. 7, after the wire grid polarizer 1 is formed, a protective layer 9 made of, for example, SiO ₂ or TiO ₂ that is a transparent dielectric material is formed on the resin lattice 1c side. To do. Thereby, the wire grid polarizer 1A is formed.
As a method for forming the protective layer 9, it is possible to employ a vacuum evaporation method by sputtering such as resistance heating, EB, laser, induction heating, or sputtering. In particular, sputtering is more preferable because it has no directionality in film formation, and optical characteristics of light transmitted through the protective layer 9 are improved.
In order to obtain good polarization characteristics, it is preferable to form the protective layer 9 so as not to fill the space between the metal gratings 1b.
The thickness of the protective layer 9 is preferably in the range of 100 nm to 1 μm.
If the protective layer 9 is thinner than 100 nm, it does not function as a protective film, and if it is thicker than 1 μm, defects such as cracks tend to occur in the protective layer 9.

  Thus, according to this modification, since the wire grid polarizer 1A provided with the protective layer 9 on the surface can be formed, there is no possibility of damaging the resin grid 1c and the metal grid 1b, and the handling becomes easy. For example, even if the continuously formed wire grid polarizer 1A is wound around a reel, the possibility of troubles such as damage to the surface can be reduced.

Next, a second modification of the present embodiment will be described.
The manufacturing method of the wire grid polarizer of the present modification example does not perform the resin stamper peeling process in the nanoimprint process unit 100A in the above-described embodiment, while maintaining the laminated structure of the resin stamper 50 and the metal film 51. Once wound on a take-up reel. Then, after the take-up reel is conveyed into the etching process unit 100B, a resin stamper peeling process is performed, and the etching process is performed on the peeled resin lattice film 52 in the same manner as in the above embodiment. It is a manufacturing method.
According to this modification, since the resin lattice film 52 does not have to be conveyed in a roll-to-roll manner between the nanoimprint process unit 100A and the etching process unit 100B, the nanoimprint process unit 100A and the etching process unit 100B are It is possible to have separate devices that are independent of each other and spaced from each other.
In addition, since the resin stamper 50 functions as a kind of protective layer, it is possible to prevent the uneven portion 8a from being damaged or dust from being attached in the process of transporting to the etching process unit 100B.

In addition, in said description, although the film-like base film 1a and the resin film 4 were used as a base material and a resin base material, and these were conveyed continuously, it demonstrated in the example in the case of manufacturing the wire grid polarizer 1. The base material and the resin base material may be simply formed into a sheet shape or a plate shape appropriately cut into a size. Moreover, you may perform each said process discontinuously separately for every base material or resin base material.
In this case, the metal stamper 3 may form a stamper roll or may be a plate-shaped stamper +.

In the above description, the resin stamper forming step and the resin molding step are described using an optical nanoimprint method using UV light, but the wavelength of irradiation light used for the optical nanoimprint method is light. It can select suitably according to the kind of curable resin.
Further, the resin stamper forming step may be performed by using a known thermal nanoimprint method using the metal stamper 3 as a mold.

In the above description, the example in which the chamber of the nanoimprint process unit 100A is an air atmosphere and the chamber of the etching process unit 100B is a vacuum atmosphere is described. However, the mold release process step is replaced with the above air plasma process. If replaced with the above-described vacuum plasma treatment, the chamber of the nanoimprint process unit 100A can also be in a vacuum atmosphere. In this case, by performing each process of forming the resin lattice film 52 in a vacuum atmosphere, adhesion of foreign matters and the like can be prevented.
Further, a vacuum chamber for performing only the mold release process step may be provided in the nanoimprint process unit 100A, and the atmosphere in the nanoimprint process unit 100A may be changed in one room.

  Further, in the above description, since the fine metal grating 1b of the wire grid polarizer 1 has been described with an example in the case of having a line-and-space pattern extending in parallel, the concavo-convex portion having a fine concavo-convex shape corresponding thereto. 3a, 4a, 5a, and 8a were also composed of a pattern of concave and convex grooves extending in parallel. However, the pattern of the metal lattice 1c is not limited to such a pattern. For example, a discontinuous pattern in which a part in the length direction is divided into a broken line shape or the like may be used. The pattern is not limited to a straight line, and may be a curved pattern that curves with a constant pitch. When the pattern of the metal grid 1b is deformed in this way, the uneven portions 3a, 4a, 5a, and 8a are also formed into fine uneven shapes such as discontinuous grooves and curved grooves.

  In the above description, the example in which the metal stamper forming step is performed has been described. However, when the metal stamper is already formed or when the metal stamper is purchased and manufactured, the resin is used with the metal stamper. The stamper forming process can be started.

  In addition, the constituent elements described in the above embodiments and modifications may be implemented in appropriate combination within the scope of the technical idea of the present invention, if technically possible.

Here, a case will be described where the names of the correspondence relationship between the terminology of the above embodiment and the terminology of the claims are different.
The base film 1a is an embodiment of a light transmissive base material. Each of the uneven portions 3a, 4a, 5a, and 8a is an embodiment of a fine uneven shape. The resin film 4 is an embodiment of a resin base material having optical transparency. Each of the UV curable resins 101a and 110a is an embodiment of a photocurable resin. A metal stamper 3 fixed to the main roll 103 is an embodiment of the stamper roll. Each of the UV light 113a and 114a is an embodiment of light for curing the photocurable resin.

It is a typical fragmentary sectional view in the plane orthogonal to the extending direction of a metal lattice which shows the schematic structure of an example of the wire grid polarizer manufactured with the manufacturing method of the wire grid polarizer concerning the embodiment of the present invention. It is a typical device block diagram explaining the schematic structure of the nanoimprint process part of the wire grid polarizer manufacturing apparatus which performs the manufacturing method of the wire grid polarizer which concerns on embodiment of this invention. It is a typical device block diagram explaining the schematic structure of the etching process part of the wire grid polarizer manufacturing apparatus which performs the manufacturing method of the wire grid polarizer which concerns on embodiment of this invention. It is typical process explanatory drawing of each manufacturing process of the manufacturing method of the wire grid polarizer which concerns on embodiment of this invention. It is typical process explanatory drawing of each manufacturing process following FIG. FIG. 6 is a schematic process explanatory diagram of each manufacturing process subsequent to FIG. 5. It is typical process explanatory drawing of one manufacturing process of the manufacturing method of the wire grid polarizer which concerns on the 1st modification of embodiment of this invention.

Explanation of symbols

1, 1A wire grid polarizer 1a substrate film (light transmissive substrate)
1b Metal lattice 1c Resin lattice 2 Master substrate 2a, 3a, 5a, 8a Uneven portion (fine uneven shape)
3 Metal stamper 4 Resin film (resin base material with light transmission)
5b Release processing part 7 Metal film 8 Resin lattice layer 8c Resin lattice part 9 Protective layer 50 Resin stamper 51 Metal film 52 Resin lattice film 100 Wire grid polarizer manufacturing apparatus 100A Nanoimprint process part 100B Etching process part 101a, 110a UV curing Resin (photo curable resin)
103, 109 Main roll 105 Plasma processing head 105a Plasma 106 Coating head 106a Release treatment agent 113, 114 UV light source 113a, 114a UV light (light)
120, 122 Vacuum chamber 124, 131 Electrode roll 125a, 132a Plasma G1, G2 Reactive gas

Claims (6)

A method of manufacturing a wire grid polarizer comprising a fine metal grid on a light transmissive substrate,
A resin stamper forming step of forming a resin stamper having a light transmission property by transferring the fine uneven shape onto a resin base material having a light transmission property using a metal stamper having a fine unevenness shape on the surface;
A mold release treatment step of performing a mold release treatment on the surface of the resin stamper formed in the resin stamper formation step on which the fine concavo-convex shape is formed;
A metal film forming step of forming a metal film on the substrate;
A photocurable resin in which a photocurable resin is applied onto the metal film formed in the metal film forming step, and the resin stamper that has been subjected to a release treatment in the mold release processing step is applied onto the metal film. A resin molding step in which the photocurable resin is cured by irradiating light from the resin stamper side;
A resin stamper peeling step in which the resin stamper is peeled off from the photo-cured resin cured in the resin molding step to form a resin lattice layer on which the fine irregularities of the resin stamper are transferred on the metal film. When,
And a step of etching the metal film on the substrate using the resin lattice layer formed in the resin stamper peeling step as a mask.   The method for manufacturing a wire grid polarizer according to claim 1, wherein the base material and the resin base material are each made of a resin film. Forming the metal stamper as a rotatable stamper roll,
In the resin stamper forming step, the resin stamper is transferred by transferring the fine concavo-convex shape while rotating the stamper roll in synchronization with the transfer speed of the resin substrate while conveying the resin substrate in one direction. Continuously forming,
The mold release process step performs the mold release process on a transport path of the resin stamper,
In the resin molding step, a base material provided with the metal film formed in the metal film forming step is arranged in the transport direction of the resin stamper in a state where the metal film is opposed to the fine uneven shape of the resin stamper. The method of manufacturing a wire grid polarizer according to claim 2, wherein the wire grid polarizer is continuously carried by being conveyed in a direction along the line.   In the resin stamper forming step, a photocurable resin is applied on the resin substrate, the metal stamper is held in a pressed state by the photocurable resin applied on the resin substrate, and the photocurable resin is The light is irradiated and cured from the resin substrate side, and the resin substrate is peeled off from the metal stamper together with the cured photocurable resin to transfer the fine uneven shape. The manufacturing method of the wire grid polarizer in any one of 1-3.   The wire grid polarizer according to any one of claims 1 to 4, further comprising a protective layer forming step of forming a protective layer that covers the resin lattice layer remaining in the etching step after the etching step. Manufacturing method.   The wire grid polarizer according to any one of claims 1 to 5, wherein the etching step is performed in a vacuum atmosphere, and the resin stamper peeling step is performed in the same chamber as the etching step. Production method.

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