JP2009064810A - Heat exchanger, optical transmitting/receiving device, and optical circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat exchanger that can simply adjust the flow velocity of a magnetic fluid, can obtain the desired flow velocity of the magnetic fluid, and can improve heat exchange efficiency, and to provide an optical transmitting/receiving device and an optical circuit board. <P>SOLUTION: The heat exchanger 1A includes: a heat transfer tube 4, having a heat absorption section 40 for absorbing heat from an electronic component 11 mounted onto a printed circuit board 10 and a heat dissipation section 41 for dissipating heat to a metal tube 2; the magnetic fluid stored in the heat transfer tube 4; a pump 5 for generating pressure for circulating the magnetic fluid in the heat transfer tube 4; and a magnetic field generating device 6 imparting a magnetic field having strength corresponding to desired viscosity to the magnetic fluid flowing in the heat transfer tube 4. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a heat exchange device, an optical transceiver, and an optical circuit board.

  Conventionally, a cooling device that cools an object to be cooled using a magnetic fluid as a refrigerant is known (for example, see Patent Document 1).

  This cooling device includes a heat absorption part that absorbs heat from a cooled object, a circulation path having a heat radiation part that dissipates heat to the heat exchanger, a magnetic fluid accommodated in the circulation path, and a pipe directly connected to the circulation path. And a linear pump that fluctuates the magnetic field around the circulation path and applies a propulsive force to the magnetic fluid. The cooling device supplies the magnetic fluid to the cooled object via the circulation path by the linear pump, and causes the magnetic fluid to absorb the heat of the cooled object. Then, the cooling device sends the magnetic fluid to the heat exchanger via the circulation path, and dissipates the heat absorbed by the magnetic fluid to the heat exchanger.

JP 2001-77571 A

  An object of the present invention is to provide a heat exchange device, an optical transmission / reception device, and an optical circuit that can adjust the flow velocity of a magnetic fluid more easily, obtain a desired flow velocity of the magnetic fluid, and improve heat exchange efficiency. Providing a substrate.

  In order to achieve the above object, an embodiment of the present invention provides the following heat exchange device, optical transceiver, and optical circuit board.

[1] A heat generating part that absorbs heat, a circulation path having a heat radiation part that dissipates heat, a magnetic fluid accommodated in the circulation path, and a pump that generates pressure for circulating the magnetic fluid in the circulation path And a magnetic field applying unit that applies a magnetic field having a strength corresponding to a desired viscosity of the magnetic fluid to the magnetic fluid flowing through the circulation path.

[2] The above [1] further comprising: a temperature detection unit that detects a temperature of the magnetic fluid; and a pump control unit that controls a pressure generated by the pump based on the temperature detected by the temperature detection unit. ] The heat exchange apparatus as described in.

[3] Further, a temperature detection unit that detects the temperature of the magnetic fluid, and a magnetic field that controls the strength of the magnetic field applied to the magnetic fluid by the magnetic field application unit based on the temperature detected by the temperature detection unit. The heat exchange device according to [1], further including a control unit.

[4] Further, the magnetic field applying unit is applied to the magnetic fluid based on the temperature detecting unit that detects the temperature of the heat absorbing unit, the heat radiating unit, or the vicinity thereof, and the temperature detected by the temperature detecting unit. The heat exchange device according to [1], further including a magnetic field control unit that controls strength of a magnetic field to be performed.

[5] The heat exchange device according to [1], wherein the magnetic field application unit is arranged to overlap the heat absorption unit or the heat dissipation unit of the circulation path.

[6] A heat generating part that absorbs heat, a circulation path having a heat radiation part that dissipates heat, a magnetic fluid accommodated in the circulation path, and a pump that generates pressure for circulating the magnetic fluid in the circulation path A magnetic field applying unit that applies a magnetic field having a strength according to a desired viscosity of the magnetic fluid to the magnetic fluid flowing through the circulation path, and an optical signal provided in the heat absorption unit or the heat dissipation unit of the circulation path. An optical transmission / reception apparatus comprising an optical transmission unit or an optical reception unit that transmits or receives an optical signal.

[7] A pump that generates a heat absorption part that absorbs heat, a circulation path having a heat radiation part that dissipates heat, a magnetic fluid accommodated in the circulation path, and a pressure for circulating the magnetic fluid in the circulation path One of the pair of heat exchange devices, and a pair of heat exchange devices having a magnetic field application unit that applies a magnetic field having a strength corresponding to a desired viscosity of the magnetic fluid to the magnetic fluid flowing through the circulation path An optical transmitter that transmits an optical signal, an optical transmission path that transmits an optical signal transmitted from the optical transmitter, and the pair. An optical circuit board comprising: an optical receiving unit that is provided in the heat-absorbing part or the heat-dissipating part of the circulation path of the other heat exchanging apparatus and that receives the optical signal through the optical transmission path .

  According to the heat exchange device of the first aspect, the flow rate of the magnetic fluid can be more easily adjusted, and a desired flow rate of the magnetic fluid can be obtained, thereby improving the heat exchange efficiency.

  According to the heat exchange device of the second aspect, more efficient heat exchange can be performed by feedback control based on the temperature of the magnetic fluid.

  According to the heat exchange device of the third aspect, more efficient heat exchange can be performed by feedback control based on the temperature of the magnetic fluid.

  According to the heat exchange device of the fourth aspect, more efficient heat exchange can be performed by feedback control based on the temperature of the heat absorption unit or the heat radiation unit.

  According to the heat exchange device of the fifth aspect, it is possible to block electromagnetic noise generated by the electronic component in which the magnetic field applying unit is arranged.

  According to the optical transmitter / receiver according to the sixth aspect, heat can be absorbed or radiated to the optical transmitter or the optical receiver.

  According to the optical circuit board of the seventh aspect, it is possible to absorb or dissipate heat with respect to the optical transmitter or the optical receiver.

[First Embodiment]
FIG. 1 is a perspective view showing a schematic configuration example of a heat exchange device according to a first embodiment of the present invention. This heat exchange device 1A includes a heat transfer section (circulation path) 4 having a heat absorption section 40 that absorbs heat from the electronic component 11 mounted on the printed circuit board 10, and a heat radiation section 41 that radiates heat to the metal tube 2. Desirable for the magnetic fluid housed in the heat transfer tube 4, the pump 5 for generating a pressure for circulating the magnetic fluid in the direction of the magnetic fluid flow 3 in the heat transfer tube 4, and the magnetic fluid flowing in the heat transfer tube 4 It is comprised from the magnetic field generator (magnetic field provision part) 6 which provides the magnetic field of the intensity | strength according to the viscosity of this.

  The printed circuit board 10 has a plate shape, and an electronic component 11 is joined to the printed circuit board 10 by solder or the like, and has wiring for connecting the electronic components 11. In FIG. 1, only the electronic component 11 is illustrated on the printed circuit board 10, but other electronic components may be mounted on the printed circuit board 10, and the electronic components are mounted on both surfaces of the printed circuit board 10. May be.

  The electronic component 11 is a component that constitutes an electric circuit, and corresponds to a resistor, a capacitor, an IC (Integrated Circuit) component, and the like, and a resistance component exists inside except for a special case such as superconductivity. When it operates, it generates heat not a little due to Joule heat. In particular, IC components such as MCM (Multi Chip Module) and SiP (System in Package) incorporate a plurality of bare chips in one module, have high functionality and generate a large amount of heat during operation. In addition, the electronic component 11 may cause a decrease in operation speed or malfunction in a high or low temperature environment outside the temperature where the operation is guaranteed.

  The metal tube 2 is made of a material having high thermal conductivity, for example, a metal such as aluminum, has a circular cross-sectional shape, and absorbs heat from the magnetic fluid flowing through the heat transfer tube 4 to dissipate heat. In addition, the cross-sectional shape of the metal tube is not limited to a circle but may be a quadrangle, or is not limited thereto.

  The magnetic fluid is composed of, for example, fine magnetic particles made of magnetite, ferrite, cobalt, etc., and a base liquid made of, for example, water, oil, etc. as a magnetic particle medium, and adheres to the surface of the magnetic particles. And a surfactant that uniformly disperse the magnetic particles. In addition, the magnetic fluid has a characteristic that the viscosity increases as the temperature increases, and the viscosity increases when a stronger magnetic field is applied.

  The heat transfer tube 4 constitutes a circulation path through which the magnetic fluid circulates, and a part of the circulation path is provided close to the electronic component 11 and the metal tube 2. For example, the heat absorption part 40 of the heat transfer tube 4 is arranged in a continuous wave shape on the electronic component 11 so as to widen the contact surface with the electronic component 11. Moreover, the heat radiating part 41 of the heat transfer tube 4 is, for example, arranged around the metal tube 2 so as to widen the contact surface with the metal tube 2. In addition, the cross-sectional shape of the heat transfer tube 4 may be circular, quadrangular, or other shapes.

  The pump 5 includes a blade-like rotating part and a motor that rotates the rotating part, and generates a pressure so that the magnetic fluid circulates and flows in the heat transfer tube 4. The pump 5 may be a linear pump using electromagnetic induction.

  The magnetic field generator 6 includes a coil that generates a magnetic field and a drive circuit that supplies current to the coil, and applies a magnetic field 60 having a strength corresponding to a desired viscosity to the magnetic fluid. The magnetic field generator 6 may change the strength of the magnetic field by changing the value of the current supplied from the drive circuit to the coil, or may supply the current with a constant value of the current supplied to the coil. You may make it turn on and off.

(Operation of the first embodiment)
Next, an example of operation | movement of 1 A of heat exchange apparatuses which concern on the 1st Embodiment of this invention is demonstrated. First, when power is supplied to the electronic component 11, the pump 5, and the magnetic field generator 6 on the printed circuit board 10, the electronic component 11 generates heat, and the pump 5 causes the magnetic fluid to circulate in the heat transfer tube 4. Generate pressure. The pump 5 and the magnetic field generator 6 may supply power after a predetermined time has elapsed after supplying power to the electronic component 11.

  Due to the pressure generated by the pump 5, the magnetic fluid circulates in the heat transfer tube 4 and sequentially passes through the electronic component 11, the magnetic field generator 6, the metal tube 2, and the pump 5.

  When the magnetic fluid passes over the electronic component 11, the heat generated by the electronic component 11 is absorbed by the heat absorbing unit 40, and the electronic component 11 is cooled.

  When the magnetic fluid absorbed by the heat absorbing part 40 reaches the heat radiating part 41 arranged in the metal tube 2, the magnetic fluid radiates heat to the metal tube 2 while flowing along the metal tube 2. The metal tube 2 radiates heat passed from the magnetic fluid to the atmosphere.

  Since the temperature of the radiated magnetic fluid decreases, the viscosity of the magnetic fluid increases and the flow velocity of the magnetic fluid flowing in the heat transfer tube 4 decreases. However, when the magnetic fluid passes near the magnetic field generator 6, the magnetic field Due to the magnetic field 60 generated by the generator 6, the viscosity of the magnetic fluid decreases, and the flow velocity of the magnetic fluid flowing through the heat transfer tube 4 increases.

  As described above, the magnetic fluid circulates in the heat transfer tube 4 at a flow rate adjusted by the magnetic field generator 6, and the heat absorbed from the electronic component 11 by the heat absorbing unit 40 is radiated to the metal tube 2 by the heat radiating unit 41. To do.

[Second Embodiment]
FIG. 2A is a perspective view showing a schematic configuration example of a heat exchange device according to the second embodiment of the present invention. This heat exchanging device 1B differs from the heat exchanging device 1A according to the first embodiment in that a support portion 20 that supports the metal tube 2 and a fan 12 that sends the wind 120 to the metal tube 2 are added. The support portion 20 promotes heat dissipation from the metal tube 2. Since other configurations and basic operations are the same, the description thereof is omitted.

  FIG.2 (b) shows the sectional view on the AA line of Fig.2 (a). The support part 20 is attached to the metal tube 2 at, for example, four places so as to provide a gap between the printed board 10 and the heat transfer tube 4, and fixes the printed board 10 and the metal tube 2. And the fan 12 sends the wind 120 to the metal tube 2, cools the metal tube 2, and promotes heat dissipation from the metal tube 2.

[Third Embodiment]
FIG. 3 is a perspective view showing a schematic configuration example of a heat exchange device according to the third embodiment of the present invention. This heat exchange device 1C is provided with four electronic components 11A to 11D, compared to the heat exchange device 1A according to the first embodiment, and a heat transfer tube wound around the metal tube 2 on the electronic components 11C and 11D. 4 are arranged respectively. Since other configurations and basic operations are the same, the description thereof is omitted.

FIG. 4A is a sectional view taken along line BB in FIG. On the electronic component 11C, the metal tube 2
A heat radiating portion 41A of the heat transfer tube 4 wound around A is provided.

  FIG. 4B is a cross-sectional view taken along the line BB of FIG. 3 showing a modification of the heat absorption structure. Between the electronic component 11C and the heat radiating portion 41A of the heat transfer tube 4 wound around the metal tube 2A, a metal plate 21 made of aluminum or the like that promotes heat dissipation of the electronic component 11C is provided.

[Fourth Embodiment]
FIG. 5A is a perspective view showing a schematic configuration example of a heat exchange device according to the fourth embodiment of the present invention. The heat exchange device 1D includes two magnetic field generators 6A and 6B, compared to the heat exchange device 1A according to the first embodiment, and one of the magnetic field generators 6B is provided on the electronic component 11. The heat transfer tube 4 is disposed so as to overlap the heat absorption part 40. Since other configurations are the same, description thereof is omitted.

  FIG.5 (b) is CC sectional view taken on the line of Fig.5 (a). A heat absorbing portion 40 of the heat transfer tube 4 through which the magnetic fluid flows is provided on the electronic component 11, and a magnetic field is applied to the magnetic fluid on the heat absorbing portion 40 so as to shield electromagnetic noise generated by the electronic component 11. A magnetic field generator 6B is provided.

  The magnetic field generators 6A and 6B may apply magnetic fields having different strengths. For example, one magnetic field generator applies a strong magnetic field, and the other magnetic field generator applies a weak magnetic field. Also good.

(Operation of the fourth embodiment)
Next, an example of the operation of the heat exchange device 1D according to the fourth embodiment of the present invention will be described. First, when power is supplied to the electronic component 11, the pump 5, and the magnetic field generators 6A and 6B on the printed circuit board 10, the electronic component 11 generates heat, and the magnetic fluid circulates in the heat transfer tube 4 in the pump 5. To generate pressure.

  Due to the pressure generated by the pump 5, when the magnetic fluid flows through the heat transfer tube 4 and passes over the electronic component 11, the heat generated by the electronic component 11 is absorbed by the heat absorbing portion 40, and the electronic component 11 is cooled. To do.

  On the other hand, the magnetic field generator 6 </ b> B applies a magnetic field to the magnetic fluid by the heat absorption unit 40 and shields electromagnetic noise generated by the electronic component 11 by the magnetic field.

  The magnetic fluid that has absorbed heat by the heat absorption unit 40 passes through the vicinity of the magnetic field generation device 6A, and when the magnetic field 60a generated by the magnetic field generation device 6A is applied, the viscosity of the magnetic fluid decreases and the magnetic fluid flowing in the heat transfer tube 4 flows. Increases fluid flow rate.

  And when a magnetic fluid passes the thermal radiation part 41 arrange | positioned at the metal tube 2, heat is radiated to the metal tube 2, and the heat is radiated from the metal tube 2 to the atmosphere.

[Fifth Embodiment]
FIG. 6 is a perspective view showing a schematic configuration example of a heat exchange device according to the fifth embodiment of the present invention. This heat exchange device 1E is based on the temperature sensor (temperature detection part) 7 which detects the temperature of a magnetic fluid, and the temperature detected by the temperature sensor 7, compared with the heat exchange device 1A according to the first embodiment. And a pump control unit 8 for controlling the pressure generated by the pump 5. Since other configurations are the same, description thereof is omitted.

  In addition to detecting the temperature of the magnetic fluid, the temperature sensor 7 may detect, for example, the temperature of the electronic component 11 or the vicinity thereof, or the temperature inside the storage box that can store the printed circuit board 10.

  The pump control unit 8 controls the pressure generated by the pump 5 based on the temperature of the magnetic fluid detected by the temperature sensor 7. For example, when the temperature of the magnetic fluid detected by the temperature sensor 7 is equal to or higher than a predetermined upper limit temperature, the pump control unit 8 instructs the pump 5 to increase the generated pressure, and is equal to or lower than the predetermined lower limit temperature. If so, the pump 5 is instructed to reduce the generated pressure. The pump control unit 8 may instruct to change the pressure of the pump 5 in a stepwise manner, but is not limited thereto.

(Operation of the fifth embodiment)
Next, an example of operation | movement of the heat exchange apparatus 1E which concerns on the 5th Embodiment of this invention is demonstrated. First, when power is supplied to the electronic component 11, the pump 5, the pump control unit 8, and the magnetic field generators 6A and 6B on the printed circuit board 10, the electronic component 11 generates heat, and the pump 5 uses a magnetic fluid as a heat transfer tube. A pressure is generated so as to circulate in the inside of 4.

  Due to the pressure from the pump 5, the magnetic fluid flows through the heat transfer tube 4, and the heat generated by the electronic component 11 is absorbed by the heat absorbing unit 40.

  When the magnetic fluid absorbed by the heat absorbing unit 40 flows through the heat transfer tube 4 and reaches the temperature sensor 7, the temperature sensor 7 detects the temperature of the magnetic fluid. Then, the temperature sensor 7 sends the detected temperature to the pump control unit 8 as temperature information.

  When the temperature information from the temperature sensor 7 is received, the pump control unit 8 instructs the pump 5 to increase the pressure generated when the temperature of the magnetic fluid indicated by the temperature information is equal to or higher than a predetermined upper limit temperature. If the temperature is equal to or lower than the predetermined lower limit temperature, the pump 5 is instructed to reduce the generated pressure.

  When receiving an instruction from the pump control unit 8, the pump 5 changes the pressure generated according to the instruction. When the magnetic fluid receiving the pressure from the pump 5 passes near the magnetic field generator 6A, the magnetic fluid 60a generated by the magnetic field generator 6A lowers the viscosity of the magnetic fluid and flows in the heat transfer tube 4. The flow rate becomes faster.

  And when a magnetic fluid passes the thermal radiation part 41 arrange | positioned at the metal tube 2, heat is radiated to the metal tube 2, and the heat is radiated from the metal tube 2 to the atmosphere.

  The heat dissipated magnetic fluid decreases in temperature and increases in viscosity, but when passing through the vicinity of the magnetic field generator 6B, the magnetic fluid decreases in viscosity due to the magnetic field 60b generated by the magnetic field generator 6B and flows in the heat transfer tube 4. The flow rate of the heat is increased, and the heat transfer tube 4 is circulated to be supplied to the heat absorption unit 40 again.

[Sixth Embodiment]
FIG. 7 is a perspective view showing a schematic configuration example of a heat exchange device according to the sixth embodiment of the present invention. This heat exchange device 1F has a magnetic field strength applied to the magnetic fluid by the magnetic field generator 6C based on the temperature detected by the temperature sensor 7, as compared with the heat exchange device 1E according to the fifth embodiment. A magnetic field control unit 9 to be controlled is provided. Since other configurations are the same, description thereof is omitted.

  The magnetic field controller 9 controls the strength of the magnetic field generated by the magnetic field generator 6 </ b> C based on the temperature of the magnetic fluid detected by the temperature sensor 7. For example, when the temperature of the magnetic fluid is equal to or higher than a predetermined upper limit temperature, the magnetic field control unit 9 instructs the magnetic field generator 6C to increase the strength of the magnetic field, and when it is equal to or lower than the predetermined lower limit temperature. The magnetic field generator 6C is instructed to reduce the strength of the magnetic field. The magnetic field controller 9 may instruct to change the strength of the magnetic field generated by the magnetic field generator 6C in a stepwise manner, but is not limited thereto.

(Operation of the sixth embodiment)
Next, an example of operation | movement of the heat exchange apparatus 1F which concerns on the 6th Embodiment of this invention is demonstrated. First, when power is supplied to the electronic component 11, the pump 5, the magnetic field generator 6 </ b> C, and the magnetic field controller 9 on the printed circuit board 10, the electronic component 11 generates heat, and the pump 5 causes the magnetic fluid to flow inside the heat transfer tube 4. Generate pressure to circulate.

  Due to the pressure from the pump 5, the magnetic fluid flows in the heat transfer tube 4 and absorbs the heat generated by the electronic component 11 by the heat absorbing portion 40.

  When the magnetic fluid absorbed by the heat absorbing unit 40 flows through the heat transfer tube 4 and reaches the temperature sensor 7, the temperature sensor 7 detects the temperature of the magnetic fluid, and uses the detected temperature as temperature information to control the magnetic field control unit 9. Send to.

  When receiving the temperature information from the temperature sensor 7, the magnetic field control unit 9 increases the strength of the magnetic field generated for the magnetic field generator 6C if the temperature indicated by the temperature information is equal to or higher than a predetermined upper limit temperature. When the temperature is equal to or lower than the predetermined lower limit temperature, the magnetic field generator 6C is instructed to reduce the strength of the generated magnetic field.

  When receiving the instruction from the magnetic field control unit 9, the magnetic field generator 6C changes the strength of the magnetic field generated according to the instruction, and applies the changed magnetic field to the magnetic fluid passing near the magnetic field generator 6C. And adjust the flow rate of the magnetic fluid.

  When the magnetic fluid whose flow rate is adjusted passes through the heat radiating portion 41 disposed in the metal tube 2, heat is radiated to the metal tube 2, and the heat is radiated from the metal tube 2 to the atmosphere.

[Seventh Embodiment]
FIG. 8 is a perspective view showing a schematic configuration example of a heat exchange device according to the seventh embodiment of the present invention. While the heat exchange device 1F according to the sixth embodiment detects the temperature of the magnetic fluid by the temperature sensor 7, the heat exchange device 1G detects the temperature of the electronic component 11 or the vicinity thereof by the temperature sensor 7. Then, based on the detected temperature, the magnetic field control unit 9 controls the strength of the magnetic field applied to the magnetic fluid by the magnetic field generator 6C. Since other configurations are the same, description thereof is omitted.

(Operation of the seventh embodiment)
Next, an example of the operation of the heat exchange device 1G according to the seventh embodiment of the present invention will be described. First, when power is supplied to the electronic component 11, the pump 5, the magnetic field generator 6 </ b> C, and the magnetic field controller 9 on the printed circuit board 10, the electronic component 11 generates heat, and the pump 5 causes the magnetic fluid to flow inside the heat transfer tube 4. Generate pressure to circulate.

  Due to the pressure from the pump 5, the magnetic fluid flows through the heat transfer tube 4, and the heat generated by the electronic component 11 is absorbed by the heat absorbing unit 40. The temperature sensor 7 detects the temperature of the electronic component 11 and sends the temperature information to the magnetic field controller 9.

  When receiving the temperature information from the temperature sensor 7, the magnetic field control unit 9 increases the strength of the magnetic field generated for the magnetic field generator 6C if the temperature indicated by the temperature information is equal to or higher than a predetermined upper limit temperature. When the temperature is equal to or lower than the predetermined lower limit temperature, the magnetic field generator 6C is instructed to reduce the strength of the generated magnetic field.

  When receiving the instruction from the magnetic field control unit 9, the magnetic field generator 6C changes the strength of the magnetic field generated according to the instruction, and applies the changed magnetic field to the magnetic fluid passing near the magnetic field generator 6C. And adjust the flow rate of the magnetic fluid.

  When the magnetic fluid whose flow rate is adjusted passes through the heat radiating portion 41 disposed in the metal tube 2, heat is radiated to the metal tube 2, and the heat is radiated from the metal tube 2 to the atmosphere.

[Eighth Embodiment]
FIG. 9 is a perspective view showing a schematic configuration example of the heat exchange device according to the eighth embodiment of the present invention. This optical circuit board 100 includes two heat transfer tubes 4A and 4B through which magnetic fluid flows, two pumps 5A and 5B, and two magnetic field generators 6A and 6B, and a heat radiating portion of the heat transfer tube 4A. The optical transmission unit 13 that transmits the optical signal, the optical waveguide (optical transmission line) 15 that transmits the optical signal transmitted from the optical transmission unit 13, and the heat radiation unit 41 of the heat transfer tube 4B are provided. And an optical receiver 14 for receiving an optical signal via the optical waveguide 15.

  The optical circuit board may constitute an optical transmission device provided with the optical transmission unit 13 or may constitute an optical reception device provided with the optical reception unit 14. In addition, the optical circuit board may have a part of the heat transfer tubes 4A and 4B as a heat radiating part, and a metal tube may be provided in the heat radiating part, or the heat generated by the light transmitting part 13 and the light receiving part 14 You may make it absorb heat with a heat exchanger tube.

  The optical transmission unit 13 includes a light emitting element that outputs an optical signal to the optical waveguide 15, for example, a semiconductor laser and a drive circuit that drives the light emitting element, and the drive circuit outputs the optical signal from the light emitting element. Fever.

  The optical receiver 14 receives the optical signal sent from the optical transmitter 13 through the optical waveguide 15 and converts it into an electrical signal. For example, the optical receiver 14 is a photodiode and amplifies the electrical signal from the photodetector. An amplifying circuit that generates heat when the amplifying circuit amplifies the electrical signal.

  The optical waveguide 15 is formed by covering the core with a clad having a refractive index smaller than the refractive index of the core.

(Operation of the eighth embodiment)
Next, an example of the operation of the optical circuit board 100 according to the eighth embodiment of the present invention will be described. First, power is supplied to the optical transmitter 13, the optical receiver 14, the pumps 5A and 5B, and the magnetic field generators 6A and 6B on the printed circuit board 10. Then, for example, when the optical transmission unit 13 converts data to be transferred from an electric signal to an optical signal and transmits the optical signal, and the optical reception unit 14 receives the optical signal via the optical waveguide 15, the optical transmission unit 13 and While the optical receiver 14 generates heat, the pump 5 generates pressure so that the magnetic fluid circulates in the heat transfer tube 4.

  The magnetic fluid flows in the heat transfer tube 4A due to the pressure generated by the pump 5A provided on the optical transmission unit 13 side, and the heat generated by the optical transmission unit 13 is absorbed by the heat absorption unit 40A.

  The magnetic fluid that has absorbed the heat at the heat absorbing portion 40A radiates the heat absorbed from the light transmitting portion 13 to the atmosphere via the heat transfer tube 4A until it is supplied again to the heat absorbing portion 40A due to the pressure from the pump 5A. To do.

  The radiated magnetic fluid has a low temperature and a high viscosity, but when flowing through the heat transfer tube 4A and passing near the magnetic field generator 6A, the magnetic fluid 60a generated by the magnetic field generator 6A causes the viscosity of the magnetic fluid. Decreases, and the flow velocity of the magnetic fluid flowing through the heat transfer tube A increases.

  Similarly, the magnetic fluid flowing in the heat transfer tube 4B provided on the side of the light receiving unit 14 is supplied to the heat absorbing unit 40B by the pressure generated by the pump 5B, and the light receiving unit 14 absorbs the generated heat. .

  The absorbed magnetic fluid releases the heat absorbed from the light receiving unit 14 into the atmosphere until the magnetic fluid 60b is applied with the magnetic field 60b by the magnetic field generator 6B and is supplied again to the heat absorbing unit 40B.

[Ninth Embodiment]
FIG. 10 is a perspective view showing a schematic configuration example of a heat exchange device according to the ninth embodiment of the present invention. While the heat exchange device 1A according to the first embodiment cools the electronic component 11, the heat exchange device 1H is configured so that the electronic component 11 operates normally in a cold region, for example. Is heated to an appropriate temperature.

  That is, the heat exchange device 1 </ b> H is accommodated in the heat transfer tube 4, which includes the heat absorption part 40 that absorbs heat from the heater 16 that generates heat energy, and the heat dissipation part 41 that radiates heat to the electronic component 11. The magnetic fluid, the pump 5 for generating a pressure for circulating the magnetic fluid in the direction of the magnetic fluid flow 3 in the heat transfer tube 4, and the strength corresponding to the desired viscosity of the magnetic fluid flowing through the heat transfer tube 4 It is comprised from the magnetic field generator 6 which provides this magnetic field.

(Operation of the ninth embodiment)
Next, an example of operation | movement of the heat exchange apparatus 1H which concerns on the 9th Embodiment of this invention is demonstrated. First, when power is supplied to the heater 16 and the pump 5, the heater 16 generates heat, and the pump 5 generates pressure so that the magnetic fluid circulates in the heat transfer tube 4.

  Due to the pressure from the pump 5, the magnetic fluid absorbs the heat generated by the heater 16 when it flows through the heat transfer tube 4 and passes through the heat absorbing unit 40.

  When the absorbed magnetic fluid reaches the heat radiating portion 41, it dissipates heat to the electronic component 11. The electronic component 11 is heated to an appropriate temperature by the radiated heat.

  The dissipated magnetic fluid passes in the vicinity of the magnetic field generator 6 and when the magnetic field 60 generated by the magnetic field generator 6 is applied, the viscosity of the magnetic fluid decreases and the flow velocity of the magnetic fluid flowing through the heat transfer tube 4 A Will be faster.

  When a predetermined time elapses after power is supplied to the heater 16 and the pump 5, power is supplied to the electronic component 11 and the electronic component 11 starts its operation. Note that the supply of power to the heater 16 and the pump 5 may be stopped after the electronic component 11 starts its operation.

[Other embodiments]
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. For example, the magnetic fluid flow 3 in each of the above embodiments may flow in the opposite direction.

  In addition, the constituent elements of the above embodiments can be arbitrarily combined without departing from the scope of the present invention. For example, a metal tube, a pump, a magnetic field generation device, a temperature sensor, a pump control unit, and a magnetic field control unit may be configured to form a heat exchange device by arbitrarily changing their arrangement.

FIG. 1 is a perspective view showing a schematic configuration example of a heat exchange device according to a first embodiment of the present invention. Fig.2 (a) is a perspective view which shows the example of a schematic structure of the heat exchange apparatus which concerns on the 2nd Embodiment of this invention, FIG.2 (b) is the AA line | wire of Fig.2 (a). It is sectional drawing. FIG. 3 is a perspective view showing a schematic configuration example of a heat exchange device according to the third embodiment of the present invention. 4A is a cross-sectional view taken along the line BB in FIG. 3, and FIG. 4B is a cross-sectional view taken along the line BB in FIG. 3 showing a modification of the heat absorbing structure. FIG. 5A is a perspective view showing a schematic configuration example of a heat exchange device according to the fourth embodiment of the present invention. FIG.5 (b) is CC sectional view taken on the line of Fig.5 (a). FIG. 6 is a perspective view showing a schematic configuration example of a heat exchange device according to the fifth embodiment of the present invention. FIG. 7 is a perspective view showing a schematic configuration example of a heat exchange device according to the sixth embodiment of the present invention. FIG. 8 is a perspective view showing a schematic configuration example of a heat exchange device according to the seventh embodiment of the present invention. FIG. 9 is a perspective view showing a schematic configuration example of an optical circuit board according to the eighth embodiment of the present invention. FIG. 10 is a perspective view showing a schematic configuration example of a heat exchange device according to the ninth embodiment of the present invention.

Explanation of symbols

1A-1H Heat exchange device 2 Metal tube 3 Magnetic fluid flow 4, 4A, 4B Heat transfer tube 5, 5A, 5B Pump 6, 6A-6C Magnetic field generator 7 Temperature sensor 8 Pump controller 9 Magnetic field controller 10 Printed circuit board 11, 11A to 11D Electronic component 12 Fan 13 Optical transmission unit 14 Optical reception unit 15 Optical waveguide 16 Heater 20 Support unit 21 Metal plates 40, 40A, 40B Heat absorption units 41, 41A, 41B Heat radiation units 60, 60a, 60b Magnetic field 100 Light Circuit board 120 wind

Claims (7)

A heat-absorbing part that absorbs heat, and a circulation path having a heat-dissipating part that dissipates heat;
A magnetic fluid contained in the circulation path;
A pump for generating a pressure for circulating the magnetic fluid in the circulation path;
The heat exchange apparatus provided with the magnetic field provision part which provides the magnetic field of the intensity | strength according to the desired viscosity of the said magnetic fluid to the said magnetic fluid which flows through the said circulation path. Furthermore, a temperature detector that detects the temperature of the magnetic fluid;
The heat exchange apparatus according to claim 1, further comprising: a pump control unit that controls a pressure generated by the pump based on the temperature detected by the temperature detection unit. Furthermore, a temperature detector that detects the temperature of the magnetic fluid;
The heat exchange device according to claim 1, further comprising: a magnetic field control unit that controls the strength of the magnetic field applied to the magnetic fluid by the magnetic field applying unit based on the temperature detected by the temperature detecting unit. Furthermore, a temperature detection unit that detects the temperature of the heat absorption unit, the heat dissipation unit, or the vicinity thereof,
The heat exchange device according to claim 1, further comprising: a magnetic field control unit that controls the strength of the magnetic field applied to the magnetic fluid by the magnetic field applying unit based on the temperature detected by the temperature detecting unit.   The heat exchange device according to claim 1, wherein the magnetic field application unit is disposed so as to overlap the heat absorption unit or the heat radiation unit of the circulation path. A heat-absorbing part that absorbs heat, and a circulation path having a heat-dissipating part that radiates heat;
A magnetic fluid contained in the circulation path;
A pump for generating a pressure for circulating the magnetic fluid in the circulation path;
A magnetic field applying unit that applies a magnetic field having a strength according to a desired viscosity of the magnetic fluid to the magnetic fluid flowing through the circulation path;
An optical transmission / reception apparatus comprising an optical transmission unit or an optical reception unit that is provided in the heat absorption unit or the heat radiation unit of the circulation path and transmits or receives an optical signal. A heat-absorbing part that absorbs heat, and a circulation path having a heat-dissipating part that dissipates heat; a magnetic fluid housed in the circulation path; a pump that generates pressure for circulating the magnetic fluid in the circulation path; A pair of heat exchange devices having a magnetic field applying unit that applies a magnetic field having a strength corresponding to a desired viscosity of the magnetic fluid to the magnetic fluid flowing through the circulation path;
An optical transmission unit that transmits an optical signal provided in the heat absorption unit or the heat dissipation unit of the circulation path of one of the pair of heat exchange devices;
An optical transmission line for transmitting an optical signal transmitted from the optical transmitter;
An optical receiver provided in the heat absorption part or the heat dissipation part of the circulation path of the other heat exchange apparatus of the pair of heat exchange apparatuses, and receiving an optical signal via the optical transmission path Circuit board.

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