JP2009054759A - Abnormality detecting method and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an abnormality detecting method and device capable of detecting abnormality of lighting and a component due to changes over time, which affects mounting precision even when normal values are unknown in normal production processes. <P>SOLUTION: When the same object (component mark or solder paste) on the same objective article (printed-circuit board) is recognized by a plurality of devices (mounting devices), abnormality of a device is detected based upon differences among recognition results of the devices. When there are three or more devices available, a device which is abnormal can be estimated from a distribution of errors of the recognition results. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an anomaly detection method and apparatus for recognizing the same object of the same object by a plurality of devices, and in particular, an ordinary component suitable for use in an electronic component mounting apparatus for mounting electronic components on a substrate. The present invention relates to an abnormality detection method and apparatus capable of detecting an abnormality of an apparatus even when a normal value is unknown in a substrate production operation.

  As illustrated in FIG. 1, an electronic component is picked up from a component supply device 14 such as a tape feeder by using a head 12 movable in the XYZ directions and mounted on a substrate such as a printed circuit board 6 or a liquid crystal substrate. A component mounting apparatus (also referred to as a mounter) 10 is known.

  In the figure, 16 is a substrate transport device for transporting the substrate 6 in the X direction shown in the figure, 18 is an X axis moving mechanism for moving the head 12 in the X direction, and 20 is the X axis moving mechanism 18. A Y-axis moving mechanism for moving the head 12 in the Y direction.

  In such an electronic component mounting apparatus 10, when mounting an electronic component on the substrate 6, a substrate positioning mark (also referred to as a substrate mark) 6 A formed on the substrate 6 as illustrated in FIG. The posture of the substrate 6 is recognized by recognizing and picking up images with a fixed substrate recognition camera 22 that can move with the head 12, and the component position adsorption camera 24 fixed upward on the apparatus main body can recognize the position of the suction of the mounted component. By recognizing the image, the electronic component is positioned and mounted on the substrate. In FIG. 2, 6B denotes a component mark used for correcting the mounting position of the component, and 6C denotes an electrode pad such as an IC.

  However, due to changes over time, the illumination brightness of the recognition cameras 22 and 24 and the adjustment of machine component parts may be distorted, and the effect that component mounting accuracy deteriorates may appear.

  Patent Document 1 describes that an inspection chip is imaged by a camera and a relative displacement between the suction nozzle and the camera is detected as an apparatus for detecting such an abnormality of the apparatus.

  Japanese Patent Application Laid-Open No. 2004-228561 detects a deviation of a component image from an image capture device from a reference position, determines a non-defective product / warning / defective according to the amount of deviation, and notifies an operator before it becomes defective. Is described.

JP 2001-223500 A JP 2005-228949 A

  However, the technique described in Patent Document 1 requires not only an inspection chip and jig for detecting an abnormality, but also an inspection process different from the production process.

  In each of the techniques described in Patent Documents 1 and 2, the determination of abnormality is performed independently for each device. Therefore, once the board mark is recognized by each device, components are mounted on the basis of the result, so that abnormalities in the device due to changes in the mounting device over time, etc. can be detected in the normal board production process. I couldn't.

  The present invention has been made to solve the above-described conventional problems, and it is an object of the present invention to make it possible to detect an abnormality of an apparatus even when a normal value is unknown in a normal substrate production operation.

  The present invention solves the above problem by detecting an abnormality of a device based on a difference in recognition results between devices when the same object of the same object is recognized by a plurality of devices.

  When there are three or more devices, it is possible to estimate a device having an abnormality from the error distribution of the recognition result.

  The present invention also includes an abnormality detection device comprising means for detecting an abnormality of a device based on a difference in recognition results between devices when the same object of the same object is recognized by a plurality of devices. A device is provided.

  Furthermore, when there are three or more devices, it is possible to provide means for estimating a device having an abnormality from the error distribution of the recognition result.

  According to the present invention, even in a normal production process, even when the normal value is unknown, it is possible to detect an abnormality due to a change with time of a part that affects the mounting accuracy of illumination, mechanism parts, and the like. Further, by stopping the production when an abnormality of the apparatus is detected, it is possible to prevent in advance the occurrence of defective products due to poor mounting accuracy. Furthermore, a history of recognition results can be recorded to track past device abnormalities.

  In particular, when there are three or more devices, it is possible to estimate a device that is highly likely to be abnormal from the error distribution of the recognition result.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  In the first embodiment of the present invention, the present invention is applied to recognition of the component mark 6B on the substrate 6 shown in FIG.

  In the present embodiment, as shown in FIG. 3, for example, in a production line including three mounting apparatuses 10A, 10B, and 10C, as shown in the procedure in FIG. As shown in FIG. 1, the printed circuit board 6 is carried into the mounting apparatus 10 using the substrate transfer device 16, and the printed circuit board 6 is fixed. Next, the substrate recognition camera 22 attached to the head 12 that is relatively movable with respect to the printed circuit board 6 recognizes the substrate mark 6A as shown in FIG. To do.

  Subsequently, the position of the component mark 6B used for correcting the mounting position of the component is calculated from the attitude of the substrate 6 detected earlier, and the actual position of the component mark 6B is determined using the component recognition camera 24. Recognize (step 100 in FIG. 4).

  At this time, an error between the position where the component mark 6B should be originally calculated from the board mark 6A and the position actually recognized and detected by the component recognition camera 24 is stored (step 110).

  Thereafter, electronic components are mounted and normal substrate production is performed (step 120).

  Next, as shown in FIG. 3, the same substrate 6 as previously recognized is carried into the second mounting apparatus 10B constituting the production line together with the first mounting apparatus 10A, and the first mounting is performed. As in the case of the apparatus 10A, an error between the position where the original component mark 6B should be and the actual position of the actual component mark 6B calculated from the recognition result of the board mark 6A is recognized (step 130), and the result is stored. (Step 140).

  The error as a result of recognizing the same component mark 6B of the same board 6 obtained in this way is compared between the mounting devices using the communication function between the mounting devices (step 150). A warning is displayed or production is stopped (step 160).

  If production is not stopped, electronic parts are mounted (step 170).

  Similarly, in the third and subsequent units, the position of the component mark 6B is recognized (step 180), stored (step 190), and compared between apparatuses (step 200).

  If three or more sets of data are obtained, it is possible to infer from the error distribution status, for example, a device that is highly likely to be abnormal, such as when there is a device that protrudes and has a large error (step 210). On the other hand, when the error between the three units is small, it is determined that all three units are normal (step 220).

  Furthermore, it is possible to track past abnormalities in the apparatus by referring to the history of past results.

  Next, a second embodiment of the present invention will be described in detail.

  In this embodiment, the present invention is applied to recognition of a solder paste printed on a printed circuit board.

  The solder paste recognition function uses the board recognition camera 22 attached to the head 12 in FIG. 1 after the board mark 6A shown in FIG. 2 is recognized, and the chip mounting position of the printed board 6 as shown in FIG. This is a function of recognizing the solder paste 8 printed on the (electrode pad 6C) and detecting a deviation (printing deviation) d calculated from the board mark 6A from the position where the solder paste 8 should be originally printed.

  As in the case of the first embodiment shown in FIG. 4, first, the printed board 6 on which the solder paste 8 is printed is carried into the first apparatus 10 </ b> A, and the board mark 6 </ b> A is recognized by the board recognition camera 22. From the recognition result of the substrate mark 6A, the positional deviation at the time of substrate clamping is calculated. Based on the calculated displacement amount at the time of clamping, the position of the solder paste 8 on which the chip is mounted is calculated, and the board recognition camera 22 is moved to the recognition coordinates of the solder paste 8. Therefore, the positional deviation d of the solder paste 8 is detected using the solder paste recognition parameter.

  If there is no solder printing deviation, mark recognition error, and mechanical part error, the solder paste 8 recognition error is zero. On the other hand, if there is an error in any of the values, the sum of the errors is detected. As long as the same solder paste 8 is recognized, the printing deviation amount d should be detected at substantially the same value in the other mounting apparatuses 10B and 10C. After this, electronic components are mounted and normal board production is carried out.

  Next, similarly to the first mounting apparatus 10A, the second mounting apparatus 10B carries the board 6 used in the first one, recognizes the board mark 6A, and then recognizes the solder paste 8. Here, communication is performed between the mounting devices, and the recognition results of the same solder paste are compared. If the error is large, it is considered that there is some abnormality in the device, so a message is displayed or production is stopped. .

  Similarly, for the third and subsequent units, the substrate mark 6A is recognized after the substrate is carried in, and the positional deviation d of the solder paste 8 is recognized. Similarly, using the communication function, the recognition results with other mounting apparatuses are compared. When there are three or more mounting apparatuses, it can be estimated that there is a high possibility that the mounting apparatus as a result of the protrusion has an abnormality.

  Further, by referring to the past result history, it is possible to track past abnormalities of the mounting apparatus.

  In the above embodiment, as shown in FIG. 3, the communication is performed directly between the mounting apparatuses. However, as in the modification shown in FIG. 6, the data may be evaluated via the host computer 30. The number of mounting devices is not limited to three, and may be two or four or more.

  In the above embodiment, the component mark 6B and the solder paste 8 are recognized. However, the application target of the present invention is not limited to these, and recognition errors caused by the mounting apparatus other than these are originally generated. An abnormality of the mounting apparatus may be detected using the same recognition target that is not present. The detection target is not limited to the mounting apparatus.

  The error recognition target is not limited to the deviation between the detection position and the original position, and may be a distance between two marks or a relative relationship between three or more marks.

The perspective view which shows the structure of an example of a component mounting apparatus Plan view showing an example of substrate The block diagram which shows the system configuration | structure in embodiment of this invention. The flowchart which shows the process sequence of 1st Embodiment of this invention. The top view which shows the recognition object of 2nd Embodiment of this invention The block diagram which shows the system configuration | structure in the modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 6 ... Printed circuit board 6A ... Board positioning mark 6C ... Electrode pad 8 ... Solder paste 10, 10A, 10B, 10C ... Electronic component mounting apparatus 12 ... Head 14 ... Component supply apparatus 16 ... Board conveyance apparatus 18 ... X-axis moving mechanism 20 ... Y-axis moving mechanism 22 ... Board recognition camera 24 ... Part recognition camera 30 ... Host computer

Claims (4)

When recognizing the same object of the same object with multiple devices,
An abnormality detection method that detects an abnormality of a device based on a difference in recognition results between the devices.   The abnormality detection method according to claim 1, wherein when there are three or more devices, an abnormal device is estimated from the error distribution of the recognition result. When recognizing the same object of the same object with multiple devices,
An abnormality detection device comprising means for detecting an abnormality of a device based on a difference in recognition results between the devices.   The abnormality detection apparatus according to claim 3, further comprising means for estimating an apparatus having an abnormality from an error distribution of recognition results when there are three or more apparatuses.

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