JP2009044084A - Surface mount device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface mount device which allows parts to be mounted regardless of whether a substrate is long or short and further has a high mount efficiency of parts. <P>SOLUTION: The surface mount device is provided with a plurality of part-mounting units on a basal table, having: a first part-mounting unit having a work area on a substrate-conveying path L; a second part-mounting unit having a work area at a position apart from the substrate-conveying path L in the Y-axis direction; and a conveying system device made up of a conveying device for conveying a substrate in the X-axis direction, and a slide table which slides the substrate in the Y-axis direction so as to reciprocate the substrate in between the substrate-conveying path L and a second part-mounting unit. When it is intended to mount a part on a long substrate, the long substrate is stopped at least at two substrate stop positions, in which one of the two substrate stop positions overlaps with the work are of the first part-mounting unit straddling the slide table and the other is adapted to receive in the work area a part of the long substrate which has extended off from the work area in the one of the substrate stop positions, and mount processing is performed on the long substrate while stopping the long substrate at each of the substrate stop positions using the part-mounting unit having a work area on a substrate conveying path L. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a surface mounting apparatus.

2. Description of the Related Art Conventionally, surface mounters that mount electronic components such as ICs on a flat substrate using a mounting head are widely known. In this type of apparatus, an attempt is made to increase the mounting efficiency of components and shorten the tact time. For example, in the following Patent Document 1, the mounting stage is a movable stage. Then, these mounting stages are gathered in a line in the center of the base to construct a substrate transport path and transport the substrate (transport in the X direction). On the other hand, when mounting, the adjacent mounting stages are reversed from each other. It is moved in the direction (conveyance in the Y direction). Thereby, interference of each apparatus which mounts components is avoided, and simultaneous operation of each mounting stage is realized.
JP 2002-208797 A

However, long substrates that do not fit on the mounting stage cannot be moved in the Y direction using the mounting stage because the substrate edge interferes with the adjacent mounting stage. It is not possible to perform the mounting work.
The present invention has been completed based on the above-described circumstances, and an object thereof is to provide a surface mounting apparatus capable of mounting components regardless of the length of a substrate and having high component mounting efficiency. To do.

  As means for achieving the above-mentioned object, the present invention comprises a component mounting portion comprising a mounting head for mounting a component on a substrate and a drive device for horizontally moving the mounting head in a work area on a base. A surface mounting apparatus that includes a plurality of components on a base, and that performs a mounting process of components on the substrate while transporting the substrate along a substrate transport path extending in one direction on the base. When the direction perpendicular to the X-axis direction is defined as the Y-axis direction, the first component mounting part having the work area on the board conveyance path and the first component mounting part in the X-axis direction A second component mounting unit having a work area at a position adjacent to and spaced apart from the substrate transport path in the Y-axis direction, an X-axis transport device that transports the substrate along the substrate transport path, and the substrate transport path And the board between the second component mounting part A transport system device comprising a substrate transport stage slidable in the Y-axis direction to reciprocate, a control device for controlling both the component mounting unit and the transport system device, and the control device When mounting components on a substrate, the normal substrate is sent to each component mounting portion in order, and the mounting process is performed in parallel at each component mounting portion, while the total length is the total length of the substrate transfer stage in the X-axis direction. When mounting a component on a longer board, the substrate transfer stage is allowed to stay on the substrate transfer path, and the substrate transfer path overlaps the work area of the first component mounting unit while straddling the substrate transfer stage. A part of the long board that is either at the board stop position and at the front or rear in the X-axis direction with respect to the board stop position and that protrudes from the work area at the board stop position. While stopping the long board at at least two board stop positions with other board stop positions to be included in, using a component mounting part having a work area on the board transport path, each board stop position The feature is that the mounting process is performed on the long substrate.

The following configuration is preferable as an embodiment of the present invention.
The first component mounting portion is disposed upstream of the second component mounting portion in the substrate transport direction, and is on the substrate transport path and in the substrate transport direction with respect to the second component mounting portion. A third component mounting portion is disposed adjacent to the second component mounting portion at a downstream position. If the component mounting portions are arranged in this way, a plurality of component mounting portions can be efficiently arranged on the base without wasting space.

The X-axis transport device is provided corresponding to the first component mounting portion, the second transport conveyor provided on the substrate transport stage, and the third component mounting portion. When the component is mounted on the long substrate, the control device stops the first substrate straddling the second transport conveyor on the substrate transport stage and the first transport conveyor. The long substrate is stopped at a position, and the first component mounting unit performs component mounting processing on a region on the rear side in the transport direction on the long substrate, and then the third transport conveyor and the substrate transport stage. The long board is stopped at the second board stop position straddling the second conveyor, and the component mounting process is performed on the remaining area on the board by the third component mounting unit. In this way, since the mounting work is shared by the two component mounting portions even for the long substrate, the mounting efficiency of the components is increased and the tact time is effectively reduced.

A substrate stopper that stops the long substrate at the first substrate stop position or the second substrate stop position is shared with a substrate stopper that stops the normal substrate on the substrate transport path. Such a configuration is effective in reducing the number of parts.

-Both parts constituting the set of at least one of the set of the first component mounting portion and the second component mounting portion or the set of the second component mounting portion and the third component mounting portion Both component mounting portions are arranged close to each other in the X-axis direction so that the mounting spaces of the mounting portions partially overlap in the X-axis direction. With such an arrangement, the size of the base and thus the surface mount device can be reduced in the X-axis direction.

  According to the present invention, in the case of a normal substrate, the mounting process is performed in parallel by a plurality of component mounting units, so that the component mounting efficiency is good and the tact time is effective.

  In addition, since the long board cannot move in the Y-axis direction, mounting work is performed using the component mounting part located on the board conveyance path. In this case, a part of the board end is a work area of the component mounting part. It will stick out and you will not be able to mount the part on that part.

  In this regard, in the present invention, when mounting on a long board, a plurality of long boards protruding from the work area at one board stop position are included in the work area at another board stop position. The long substrate is stopped at the substrate stop position.

  In this way, even if a part of the long substrate protrudes from the work area at a certain substrate stop position, the part is included in the work area at another substrate stop position. Become. Therefore, components can be mounted on the entire area on the long board.

A first embodiment of the present invention will be described with reference to FIGS.
1. Overall Configuration FIG. 1 is a plan view of a surface mounting apparatus, and FIG. 2 is a perspective view of a base and support legs. As shown in FIGS. 1 and 2, the surface mounting apparatus 10 has various devices such as a transport system and a mounting system arranged on the upper surface of a base 11. Hereinafter, the portion closer to the front (the lower side shown in FIG. 1) in the base 11 is called the base front portion 12, and the portion closer to the rear (the upper side shown in FIG. 1) is called the base rear portion 13. Further, the left-right direction in FIG. 1 is referred to as the X direction, and the Y direction and the Z direction are defined in the directions in FIGS.

  The base front portion 12 has a horizontally long shape extending in the X direction, and a substrate transport path L is provided in the base front portion 12. The substrate transport path L constitutes a path through which the substrate P to be mounted is transported, and extends in the X direction.

  As shown in FIG. 1, a substrate stop position A and a substrate stop position C are set on the left and right sides in the X direction on the substrate transport path L, and are positioned between the substrate stop position A and the substrate stop position C. Thus, the relay position U is set.

  On the other hand, the left and right sides in the X direction of the base back portion 13 are greatly cut out over a predetermined width, and the width of the base back portion 13 (width in the X direction) is considerably larger than the width of the base front portion 12. It is narrow. The base back portion 13 is provided substantially at the center in the X direction corresponding to the relay position U of the base front portion 12, and a substrate stop position B is provided so as to face the relay position U.

  The surface mounting apparatus 10 is configured such that the substrate P can be reciprocated in the Y-axis direction between the relay position U and the substrate stop position B, and when the various devices in the transport system are operated, the substrate length is usually short. If it is the board | substrate P, it has the structure which can be sent to each board | substrate stop position AC in order.

  On the base 11, component mounting portions 30A to 30C are provided corresponding to the board stop positions A to C, respectively. Here, the structure of the support leg which supports each apparatus which comprises the component mounting parts 30A-30C is demonstrated. As shown in FIG. 2, support legs 32, 33, and 34 are disposed on the left and right sides and the center of the base front portion 12 in the X direction. The three support legs 32, 33, and 34 all have a shape extending in the Y direction.

  Of the three support legs, both the support legs 32 and 33 on the right side in the center and the X direction are located on both sides of the substrate stop position A, and a base member 51A is installed between them. The base member 51A has a function of supporting a head unit (not shown in FIG. 2) 60A for performing a mounting operation on the substrate P stopped at the substrate stop position A.

  Similarly, both the support legs 33 and 34 on the left side in the center and the X direction are located on both sides of the board stop position C, and a base member 51C is installed between the both. The base member 51C has a function of supporting a head unit (not shown in FIG. 2) 60C that performs a mounting operation on the substrate P stopped at the substrate stop position C.

  Of these support legs 32 to 34, the center support leg 33 is L-shaped, and the support legs 32 and 34 located on both sides in the X direction have a gate shape surrounding the substrate transport path L. Also open up the internal space. With this configuration, the substrate P can be transported along the substrate transport path L without interfering with the support legs 32, 33, and 34.

  On the other hand, two support legs 35 and 36 are provided in the base back portion 13. Both support legs 35 and 36 have a shape extending in the Y direction, and are located on both sides of the substrate stop position B. A base member 51B is installed between the support legs 35 and 36. The base member 51B has a function of supporting a head unit (not shown in FIG. 2) 60B that performs a mounting operation on the substrate P stopped at the substrate stop position B.

  Further, these two support legs 35 and 36 have tips 35F and 36F which are bent inwardly and are L-shaped in plan view as a whole, and a connecting member 37 is passed between the upper surfaces of both the tips 35F and 36F. ing. And the front-end | tip 33F of the support leg 33 located in the center of the base front part 12 is being fixed to the lower surface wall of the connection member 37 which concerns.

  In this embodiment, the lower region of the support leg 33 is a tunnel that communicates with the base back portion 13, and the relay position U set immediately below the support leg 33 and the substrate stop position of the base back portion 13. A substrate passage through which the substrate P enters and exits is formed with B.

2. Structure of Component Mounting Unit Since the basic configuration of the component mounting units 30A to 30C is the same, here, the component mounting unit 30B will be described as a representative.

  As shown in FIG. 1, guide rails 42 extending in the Y direction are installed on the support legs 35 and 36 on the upper surface of the support legs, and the base members are fitted to the left and right guide rails 42 while engaging both ends in the longitudinal direction. 51B is attached.

  Further, Y-axis ball screws 45 and 46 located in the guide rail 42 and extending in the Y direction are mounted on the upper surfaces of the support legs 35 and 36, and ball nuts are mounted on the Y-axis ball screws 45 and 46, respectively. It is screwed. A Y-axis motor 47 is attached to the shaft ends of the Y-axis ball screws 45 and 46, and ball nuts 48 and 49 screwed to the Y-axis ball screws 45 and 46 are in the X direction of the base member 51B. They are fixed to both ends (see FIG. 4).

  From the above, when the Y-axis motor 47 is energized, the left and right Y-axis ball screws 45 and 46 are synchronously rotated. Then, as a result of both ball nuts 48 and 49 moving in the Y direction while maintaining synchronization, the base member 51B moves horizontally in the Y direction along the guide rail 42 (Y-axis servo mechanism).

  As shown in FIG. 3, a head support 52B having a long block shape in the X direction is fixed on the base member 51B. A guide member 53 extending in the X direction is installed on the head support 52 </ b> B, and a head unit 60 </ b> B is attached to the guide member 53 movably along the axis of the guide member 53. An X-axis ball screw 55 extending in the X direction is attached to the head support 52B, and a ball nut is screwed onto the X-axis ball screw 55.

  An X-axis motor 57B is attached to the X-axis ball screw 55. When the motor 57B is energized, the ball nut advances and retreats along the X-axis ball screw 55. As a result, the head unit fixed to the ball nut is fixed. 60B moves in the X direction along the guide member 53 (X-axis servo mechanism).

  Therefore, by controlling the X-axis servo mechanism and the Y-axis servo mechanism in combination, the head unit 60B can be moved in the horizontal direction (XY direction) around the upper region of the base back portion 13. ing. The X-axis motor 57B, the X-axis servo mechanism, the Y-axis motor 47, and the Y-axis servo mechanism correspond to the “drive device” of the present invention.

  The head unit 60B is provided with a Z-axis motor 65 and a valve unit 66 on the upper side, and a suction head provided with a suction nozzle 64 for performing a mounting operation on the lower side (the “mounting head of the present invention”). ) 63 are mounted in a row (see FIGS. 3 and 7).

  The Z-axis motor 65 raises and lowers the suction head 63 with respect to the frame 61 of the head unit 60B. The valve unit 66 supplies negative pressure to each suction nozzle 64 and applies suction force to the tip of the head. It will cause.

  With such a configuration, the tape feeder installed in the component supply unit 80B by moving the suction head 63 up and down while moving the head unit 60B on the component supply unit 80B described below. Parts can be taken out from F.

  Then, after the components are taken out, the suction head 63 is moved above the substrate stop position B, and when the predetermined component mounting position is reached, the suction head 63 is lowered to the height of the upper surface of the substrate. Components can be mounted on the board P stopped at B.

  Note that reference numeral 67 shown in FIG. 3 denotes an R-axis motor that rotates each suction head 63 about its axis. Reference numeral 69 denotes a mounting frame. A camera 68 that captures a side image of the taken-out component is attached to the attachment frame 69 (see FIG. 7).

  And the movement area | region (henceforth a work area | region) of head unit 60A-60C of each component mounting part 30A-30C is one size larger than each board | substrate stop position AC as shown in FIG. The component mounting operation can be performed individually at the stop positions A to C.

3. Component supply part In this embodiment, as shown in FIG. 1, the three component supply parts 80A-80C are provided on the base 11 corresponding to the three component mounting parts 30A-30C. The component supply unit 80A corresponding to the component mounting unit 30A and the component supply unit 80C corresponding to the component mounting unit 30C are both set on the front side in the Y direction of the base front part 12, and the component supply corresponding to the component mounting unit 30B is performed. The part 80 </ b> B is set on the back side in the Y direction of the base back part 13.

  Two carriages 91 and 92 are fixed to each of the component supply units 80A to 80C side by side in the X direction. The carts 91 and 92 are provided with a large number of tape feeders F arranged side by side and have a function as an attachment member that can be detached from the base 11 (the tape feeder is omitted in FIG. 1). By adopting such a configuration, a plurality of feeders F can be exchanged simultaneously at the same time.

  The tape feeder F has a shape that is long in one direction, and is attached to the carriages 91 and 92 with the front part of the feeder in which the component supply position O is set facing the substrate transport path L. The tape feeder F supplies parts to the parts supply position O at regular intervals by feeding the parts supply tape (tapes holding the parts at regular intervals) to the front part of the feeder while taking them from the reel (see FIG. 7).

4. Configuration of Transport System Next, a transport system that transports the substrate P to be mounted will be described. In this embodiment, the X-axis transport apparatus 100 that transports the substrate P in the X direction along the substrate transport path L, and the Y-axis transport that transports the substrate P back and forth in the Y direction between the relay position U and the substrate stop position B. Two types of devices 200 are provided.

(A) X-Axis Transfer Device As shown in FIGS. 4 and 5, on the substrate transfer path L, three transfer conveyors 110, 120, and 130 are arranged in a line. The basic configurations of the conveyors 110 to 130 are the same, and each conveyor includes a pair of support members BM and BF.

  The support members BM and BF of each of the conveyors 110 to 130 have a vertically long shape extending in the X-axis direction and face each other in the Y-axis direction.

  A plurality of conveying rollers 140 are provided in the X-axis direction on the inner walls of the supporting members BM and BF, and the endless conveying belt 150 is stretched between the conveying rollers 140. ing.

  In this embodiment, a conveyor motor (see FIG. 7) 155 is provided for each of the conveyors 110 to 130, and when this is operated, the conveyor belt 150 constituting each of the conveyors 110 to 130 is circulated.

  And as shown in FIG. 5, the conveyance belt 150 of all the conveyance conveyors 110-130 fits the same height, and adjacent things are continuing without a level | step difference.

  Therefore, when two adjacent conveyors are operated, the substrate P can be sequentially transferred from the upstream conveyor to the downstream conveyor.

  As shown in FIG. 4, the conveyors 110 and 130 both protrude from the end of the base front portion 12 outward in the X direction, and are located upstream of the mounting machine (solder printing device, dispenser). Apparatus) or downstream machines (surface mounting apparatus, reflow apparatus, etc.).

  Also, as shown in FIGS. 4 and 5, substrate stoppers 161, 162, and 163 are provided on the respective conveyors 110 to 130. The substrate stoppers 161 to 163 have an air cylinder as a driving source, and are provided with a stopper pin 166 at the tip of the cylinder rod.

  The substrate stoppers 161, 162, and 163 are fixed to the inner wall of the support member BF located on the back side in FIG. 5 with the stopper pin 166 facing upward.

  When the stopper pin 166 is raised by air supply / discharge, the tip of the pin is positioned above the conveyance height of the substrate P (hereinafter, the ascending position) as shown in FIG. Therefore, when the substrate stopper 161 attached to the transport conveyor 110 is operated, the substrate P transported on the conveyor can be stopped at the substrate stop position A as shown in FIG.

  In addition, when the substrate stopper 162R attached to the transfer conveyor 120 is operated, the substrate P transferred on the conveyor can be stopped at the relay position U, and the substrate stopper 163 attached to the transfer conveyor 130 is operated. Then, the substrate P transported on the conveyor can be stopped at the substrate stop position C.

  On the other hand, when the stopper pin 166 is lowered, the tip of the pin is positioned below the conveyance height of the substrate P (hereinafter referred to as a lowered position) as shown in FIG. The board | substrate P can be conveyed by each conveyance conveyor 110-130, without stopping.

  In addition, substrate sensors 171 to 173 for detecting the presence or absence of the substrate P at each position (substrate stop position A, relay position U, substrate stop position C) are in the vicinity (upstream side vicinity) of each of the substrate stoppers 161 to 163. Each is provided.

  Each of the substrate sensors 171 to 173 has a pair of light projecting elements and light receiving elements that form a detection optical axis, which are vertically opposed to each other with a conveyance path of the substrate P interposed therebetween. Briefly explaining the detection operation, if the substrate P is stopped at each position (substrate stop position A, relay position U, substrate stop position C), the detection optical axis is blocked by the substrate P. The outputs of the substrate sensors 171 to 173 are in an “L level” state, for example.

  On the other hand, if the substrate P is not in each position (substrate stop position A, relay position U, substrate stop position C), the detection optical axis is in a translucent state, and the outputs of the substrate sensors 171 to 173 are, for example, “H level”. ”State. Therefore, the presence / absence of the substrate at each position (substrate stop position A, relay position U, substrate stop position C) can be detected from the outputs of the substrate sensors 171 to 173.

  The change timing of the outputs of the substrate sensors 171 to 173 is a trigger for the next operation. In this embodiment, the outputs of the substrate sensors 171 to 173 are in the light shielding state from “H level” corresponding to the translucent state. When the predetermined time has elapsed after changing to the “L level” corresponding to, processing for stopping the driving of each of the conveyors 110 to 130 is performed, and then processing for operating the backup device 180 described below is automatically performed. It is configured to be performed.

  For the predetermined time, the error time is added to the time required for the tip of the substrate crossing the detection optical axis of each of the substrate sensors 171 to 173 to reach each of the substrate stoppers 161 to 163. It is preferable to set the set time.

  The backup device 180 supports a table 185 that holds a plurality of backup pins 181 in an upright posture so that the table 185 can be moved up and down (see FIG. 5). It can be done.

  The backup device 180 is provided on each of the conveyors 110 to 130. When the table 185 is raised, the backup pin 181 lifts the lower surface of the substrate P stopped at each substrate stop position A to C from below. Accordingly, the substrate P sandwiched between the substrate pressing pieces 190 provided on the upper portions of the support members BM and BF and stopped at the substrate stop positions A to C can be clamped immovably (hereinafter referred to as a restrained state). ).

  Further, since the lower surface of the clamped substrate P is supported by the backup pins 181, it is possible to resist the pressure applied by the mounting.

  Of the conveyors 110 to 130 configured as described above, the second conveyor 120 located at the center is mounted on a slide table 210 of a Y-axis conveyor 200 described below. It is configured to reciprocate between the relay position U shown and the substrate stop position B shown in FIG.

(B) Y-Axis Transfer Device As shown in FIG. 8, on the base 11, a Y-axis ball screw shaft 260 passes the relay position U and the substrate stop position B while turning the axis in the Y-axis direction. A pair of guide rails 270 are provided on both sides of the Y-axis ball screw shaft 260 in the X direction.

  A motor 265 is connected to the shaft end of the Y-axis ball screw shaft 260 in front of the base via a coupling 261.

  Reference numeral 210 shown in FIG. 9 is a slide table that functions as the substrate transfer stage of the present invention. The slide table 210 has a flat plate shape and is configured to be movable in the Y-axis direction along the guide rail 270, and supports the entire second conveyor 120 including the backup device 180 on the upper surface.

  A ball nut 215 is fixed to the lower surface of the slide table 210 and is screwed to the Y-axis ball screw shaft 260.

  Accordingly, when the motor 265 is energized, the slide table 210 reciprocates linearly along the Y-axis ball screw shaft 260 while receiving the guide action of the guide rail 270.

  From the above, the entire slide table 210 including the second transfer conveyor 120 and the backup device 180 can be reciprocated between the relay position U and the substrate stop position B.

5. Correspondence to Different Substrates Further, in the present embodiment, the following configuration is adopted so that components can be mounted on different types of substrates having different sizes such as width and length. In the following description, the substrate width refers to the dimension of the substrate in the Y-axis direction, and the substrate length refers to the dimension of the substrate in the X-axis direction.

  First, for substrates with different substrate widths, the conveyor width is adjusted to enable conveyance on the base 11 in either the X-axis direction or the Y-axis direction, and the component mounting portions 30A to 30C as usual. The component is to be mounted at

  Referring to FIG. 7, the conveyor width adjusting device 310 provided in the transport conveyor 130 will be described as an example. At a position on the right side of FIG. Is installed. The support block 320 has a shape that is long in the vertical direction, and a ball screw shaft 340 is supported by a bearing member (not shown) while the shaft is directed in the Y-axis direction at a position closer to the lower portion.

  The shaft end of the ball screw shaft 340 and the motor shaft are both inserted into the gear box 350 so that the power on the motor side can be transmitted to the ball screw shaft 340.

  On the other hand, a ball nut 360 is fixed at a position near the lower portion of the support member BM, and this is screwed to the outer periphery of the ball screw shaft 340.

  From the above, when the motor 330 is operated, the position of the ball nut 360 and thus the support member BM along the ball screw shaft 340 is changed in the Y-axis direction, so that the conveyor width of the conveyor 130 can be adjusted.

  By providing each of the conveyors 110 to 130 with such a conveyor width adjusting device 310, the X-axis transport device 100 and the Y-axis transport device 200 can also be used for substrates having different substrate widths (the size of the substrate in the Y-axis direction). Can be used to transport the substrate P to each of the substrate stop positions A to C. Therefore, the mounting operation can be performed by all three component mounting portions 30A to 30C.

  Next, the long substrate PL, in particular, the long substrate PL whose total length is longer than the total length of the movable second transport conveyor 120 and does not fit in the transport conveyor 120, is that the substrate is placed on the second transport conveyor 120. If placed, the substrate end interferes with the front and rear transport conveyors 110 and 130, so the Y-axis transport device 200 cannot be used. Therefore, components can be mounted on the long substrate PL by changing the control pattern.

  Specifically, control is performed to stop the long substrate PL on the substrate transport path L so as to straddle two adjacent transport conveyors.

  As shown in FIG. 16, when the long substrate PL is stopped so as to straddle the transport conveyor 120 and the transport conveyor 110, the rear half of the long substrate on the rear side in the transport direction is the work area of the head unit 60A of the component mounting portion 30A. When the long substrate PL is stopped so as to straddle the transport conveyor 130 and the transport conveyor 120, the front half of the long substrate corresponding to the front side in the transport direction is within the work area of the head unit 60C of the component mounting portion 30C.

  Therefore, when components are mounted on the long substrate PL, among the three component mounting portions 30A to 30C, the component mounting portion 30A located on the substrate transport path L and the component mounting portion 30C are provided on the rear side of the long substrate. By performing the work by sharing the area and the front area, it is possible to mount components in the entire area on the board without any trouble.

  In the present embodiment, as shown in FIGS. 4 and 5, the substrate stoppers 162R and 162F and the substrate sensors 172R and 172F are provided at two positions in the front and rear of the movable transfer conveyor 120 located in the center of the base. Is provided.

  As described above, the plurality of substrate stoppers and substrate sensors are provided on the same transfer conveyor 120. The stop positions of the substrates P and PL on the substrate transfer path L are different according to the length of the substrate as described above. It is necessary to make it.

6. Electrical Configuration of Surface Mount Device Next, an electrical configuration of the surface mount device 10 configured as described above will be described. The electrical configuration of the surface mounting device 10 is as shown in FIG. 10, and a control device 500 that controls and controls the entire mounting device includes a mounting data storage device 510, a mounting program storage device 520, various devices such as a mounting system and a transport system. It is electrically connected.

  The mounting system has three component mounting parts 30A to 30C. The X-axis motor 57, the Y-axis motor 47, the Z-axis motor 65, the valve unit 66, the camera 68, and the feeder F constituting each of the component mounting portions 30A to 30C are electrically connected to the control device 500. .

  There are three transfer conveyors 110 to 130 in the transfer system. For example, in the case of the first transfer conveyor 110, each device such as the conveyor width adjusting device 310, the conveyor motor 155, the substrate stopper 161, and the substrate sensor 171 is controlled. It is electrically connected to the device 500.

  Further, since the second conveyor 120 is movable in the Y-axis direction integrally with the slide table 210, in addition to the electrical configuration provided in the first conveyor 110, the Y-axis conveyor motor 265 is electrically operated. Are connected. In addition, since the second conveyor 120 is provided with substrate stoppers and substrate sensors at two locations on the conveyor, the control device 500 has these two substrate stoppers 162F and 162R and two substrate sensors 172F and 172R. Are electrically connected.

  For the third conveyor 130, as with the first conveyor 110, devices such as a conveyor width adjusting device 310, a conveyor motor 155, a substrate stopper 163, and a substrate sensor 173 are electrically connected to the control device 500. ing.

  In the mounting data storage device 510, in addition to information on the board size such as the board length and board width, data on the parts mounted on the board, that is, the type of the mounted parts, the mounting position, the mounting direction, and the like are stored. .

  The mounting program storage device 520 stores a program for controlling each of the mounting system and the transport system. The program will be briefly described later with reference to FIGS. 17 to 22, but roughly speaking, it includes two control patterns according to the board length (normal board control pattern, long board control pattern). Yes.

7. Series of Operations Subsequently, a component mounting operation performed under the control of the control device 500 will be described. When starting the mounting operation, the control device 500 first performs a process of reading board information relating to a new board (a board newly loaded on the base) to be mounted from the mounting data storage device 510.

  Thereafter, the control device 500 activates each conveyor width adjusting device 310 as necessary based on the read substrate information of the new substrate, and sets the conveyor width of each of the conveyors 110 to 130 according to the substrate width of the new substrate. change.

  When the conveyor width is adjusted to the width of the new board, a control pattern corresponding to the board length is then executed, and the mounting operation proceeds as follows.

(A) In the case of the control pattern of the normal substrate P with a short substrate length In the case of the control pattern of the normal substrate P, the initial position of each substrate stopper is set as follows. That is, for the three substrate stoppers in total, that is, the substrate stopper 161 of the conveyor 110, the substrate stopper 162R of the conveyor 120, and the substrate stopper 163 of the conveyor 130, all of the stopper pins 166 are in the raised position shown in FIG. Is set.

  On the other hand, the substrate stopper 162F of the transport conveyor 120 is always kept at the lowered position during the control in addition to the initial state, and the substrate sensor 172F is not incorporated into the control element.

  When the normal substrate P is unloaded from an upstream machine such as a printing machine, the conveyor 110 is driven under the command of the control device 500. As a result, the first normal substrate P1 is carried into the apparatus from the right side of FIG.

  The control device 500 monitors the output states of the substrate sensor 171 of the transfer conveyor 110, the substrate sensor 172R of the transfer conveyor 120, and the substrate sensor 173 of the transfer conveyor 130 in parallel with the loading of the substrate.

  The first substrate P1 carried into the apparatus is transported to the downstream side in the X-axis direction on the transport conveyor 110, and eventually the substrate tip comes into contact with the stopper pin 166 of the substrate stopper 161 and stops at the substrate stop position A. To do.

  On the other hand, immediately before the first substrate P1 reaches the substrate stop position A, the front end of the substrate crosses the detection optical axis, so that the output of the substrate sensor 171 corresponds to the light shielding state from “H level” corresponding to the translucent state. It changes to “L level”.

  Then, using the output change timing as a trigger, the control device 500 executes a process of temporarily stopping the transfer conveyor 110 after a predetermined time has elapsed, and then executes a process of operating the backup device 180 of the transfer conveyor 110.

  As a result, as a result of the backup pin 181 rising, the substrate P1 stopped at the substrate stop position A is backed up on the lower surface of the substrate and is in a restrained state.

  In this state, the entire normal board P1 stopped at the board stop position A is just located in the work area of the head unit 60A of the component mounting portion 30A.

  Thereafter, under the command of the control device 500, the component mounting unit 30A performs component mounting processing on the board P1.

  When the component mounting process borne by the component mounting unit 30A is completed, the control device 500 operates the backup device 180 again to release the restraint of the board P1. As a result, as a result of the backup pin 181 being lowered, the substrate P1 is released from the restraint, and can be transported on the substrate transport path L.

  In this state, under the instruction of the control device 500, a process of lowering the stopper pin 166 of the substrate stopper 161 is performed, and the conveyors 110 and 120 are driven following the process. As a result, the first substrate P <b> 1 is transported downstream on the substrate transport path L by both transport conveyors 110 and 120.

  After the start of transport, the first substrate P1 moves on the substrate stopper 161 of the transport conveyor 110 while moving downstream in the X-axis direction, and eventually completely passes through the substrate stopper 161 (more specifically, the substrate The rear end passes through the substrate stopper 161).

  Then, the control device 500 performs a process of returning the stopper pin 166 of the substrate stopper 161 in the lowered state to the raised position based on the output of the substrate sensor 171 provided on the transport conveyor 110.

  As described above, in this embodiment, when the substrate P is transported downstream, immediately before the start of the transport operation, the stopper pin 166 of the substrate stopper is once lowered, and the substrate P that has started moving completely moves the substrate stopper. When it passes, control is performed to return the stopper pin 166 in the lowered state to the raised position.

  In order to realize the above operation, in the case of the substrate stopper 161, after the output of the substrate sensor 171 changes from “L level” corresponding to the light shielding state to “H level” corresponding to the light transmitting state, a predetermined time is elapsed. When the time required for adding the error to the time until the rear end of the substrate that has passed the substrate sensor 171 passes the substrate stopper 161 has elapsed, the stopper pin 166 may be returned.

  The substrate P1 that has started to be transported by driving the transport conveyors 110 and 120 eventually comes into contact with the substrate stopper 162R of the transport conveyor 120 and stops at the relay position U.

  Immediately before the first substrate P1 reaches the relay position U, the output of the substrate sensor 172R changes from “H level” corresponding to the light transmitting state to “L level” corresponding to the light shielding state. Then, using the output change timing as a trigger, the control device 500 executes a process of temporarily stopping the transfer conveyor 120 after a predetermined time has elapsed, and then executes a process of operating the backup device 180 of the transfer conveyor 120.

  As a result, as a result of the backup pin 181 rising, the substrate P1 stopped at the relay position U is backed up on the lower surface of the substrate and is in a restrained state.

  In parallel with the transfer of the first substrate P1, the second substrate P2 is carried into the apparatus via the transfer conveyor 110. The second substrate P2 carried into the apparatus is stopped at the substrate stop position A when the tip abuts against the stopper pin 166 of the substrate stopper 161 in the same manner as the first substrate P1.

  Immediately before the second substrate P2 reaches the substrate stop position A, the output of the substrate sensor 171 changes from “H level” corresponding to the light transmitting state to “L level” corresponding to the light shielding state. Then, using the output change timing as a trigger, the control device 500 executes a process of temporarily stopping the transfer conveyor 110 after a predetermined time has elapsed, and then executes a process of operating the backup device 180 of the transfer conveyor 110.

  As a result, the second substrate P2 is backed up and restrained. When both the substrates P1 and P2 are in a restrained state, the Y-axis transport device 200 is driven under the command of the substrate control device 500. As a result, the first substrate P1 at the relay position U is carried from the relay position U to the substrate stop position B of the base back portion 13 (see FIG. 12).

  In this state, the entire normal board P1 stopped at the board stop position B is just located in the work area of the head unit 60B of the component mounting portion 30B.

  Thus, when the boards P1 and P2 are positioned at the board stop positions A and B, the component mounting processes on the boards P1 and P2 are performed in parallel by the component mounting units 30A and 30B under the instruction of the control device 500. And proceed. And when the mounting process which each component mounting part 30A, 30B bears is complete | finished, the Y-axis conveying apparatus 200 will be driven and the 1st board | substrate P1 will be returned to the relay position U on the board | substrate conveyance path L. FIG.

  Thereafter, the control device 500 operates the backup device 180 of the transport conveyor 110 and the backup device 180 of the transport conveyor 120 again to release the substrate restraint.

  As a result, the backup pins 181 of the transport conveyors 110 and 120 are both lowered, so that the substrate P1 and the substrate P2 are released from the restraint and can be transported on the substrate transport path L.

  In the above state, under the instruction of the control device 500, a process of lowering the stopper pin 166 of the board stopper 161 of the conveyor 110 and the stopper pin 166 of the board stopper 162R of the conveyor 120 is performed. The conveyors 110, 120, and 130 are driven. Thus, both the substrates P1 and P2 are transported downstream along the substrate transport path L.

  Thereafter, when the first substrate P1 passes the substrate stopper 162R of the transfer conveyor 120, a process of returning the substrate stopper 162R from the lowered position to the raised position is performed, and the second substrate P2 is the substrate of the transfer conveyor 110. After passing through the stopper 161, a process for returning the substrate stopper 161 from the lowered position to the raised position is performed.

  Then, the first substrate P1 sent downstream through the substrate transport path L is stopped at the substrate stop position C with the front end of the substrate contacting the substrate stopper 163, and the second substrate P is stopped at the front end of the substrate. It abuts on the stopper 162R and stops at the relay position U.

  In parallel with the transfer of the substrates P1 and P2, the third substrate P3 is carried in via the transfer conveyor 110, and the third substrate P3 is stopped at the substrate stop position A by the substrate stopper 161. (See FIG. 13).

  And just before each board | substrate P1-P3 reaches each position (board | substrate stop position C, the relay position U, the board | substrate stop position A), the output of each board | substrate sensor 171-173 is "H level" corresponding to a translucent state. It changes to “L level” corresponding to the light shielding state.

  Then, using the output change timing as a trigger, the control device 500 executes a process of temporarily stopping each of the conveyors 110 to 130 after a predetermined time has elapsed, and then operates the backup device 180 of each of the conveyors 110 to 130. Execute.

  As a result, each of the substrates P1, P2, and P3 is backed up on the lower surface of the substrate and is in a restrained state.

  Thereafter, the Y-axis transport device 200 is driven, and the second substrate P2 at the relay position U is carried to the substrate stop position B (see FIG. 14).

  In this state, the entire normal board P1 stopped at the board stop position C is just located in the work area of the head unit 60C of the component mounting portion 30C. In addition, the entire normal board P2 stopped at the board stop position B is just positioned in the work area of the head unit 60B of the component mounting portion 30B, and further the entire normal board P3 stopped at the board stop position C. Will be in the state where it was just located in the work area of head unit 60A of component mounting part 30A.

  Then, under the instruction of the control device 500, component mounting processing is performed in parallel by the component mounting units 30A to 30C on the respective substrates stopped at the respective substrate stop positions A to C.

  And when the component mounting process which each component mounting part 30A-30C bears is complete | finished, the process which drives the Y-axis conveyance apparatus 200 will be performed under the instruction | command of the control apparatus 500. FIG. As a result, the second substrate P2 is returned to the relay position U, and all three substrates P1 to P3 are arranged in a line on the substrate transport path L (see FIG. 13).

  Thereafter, the control device 500 operates the backup device 180 of the transport conveyor 110, the backup device 180 of the transport conveyor 120, and the backup device 180 of the transport conveyor 130 again to release the restraints of the substrates P1 to P3.

  As a result, the backup pins 181 of the respective conveyors 110, 120, and 130 are all lowered, so that the substrate P1, the substrate P2, and the substrate P3 are released from the restraint, and can be transported on the substrate transport path L.

  In the above state, under the instruction of the control device 500, the stopper pin 166 of the substrate stopper 161 of the conveyor 110, the stopper pin 166 of the substrate stopper 162R of the conveyor 120, and the stopper pin 166 of the substrate stopper 163 of the conveyor 130 are respectively set. A process of lowering is performed, and subsequent to the process, a process of driving all three transport conveyors 110, 120, and 130 constituting the X-axis transport device 100 is performed.

  As a result, all three substrates P1, P2, and P3 are simultaneously conveyed downstream, and one substrate P1 that has completed all the mounting processes (each component mounting process performed by the component mounting units 30A to 30C) is transferred to the conveyor 130. It is carried out through the machine.

  Then, the second substrate P2 is stopped at the substrate stop position C, and the third substrate P3 is stopped at the relay position U. In parallel with the transfer of the substrates P1 to P3, the fourth substrate P4 is carried into the apparatus via the transfer conveyor 110 and stopped at the substrate stop position A.

  Thereafter, the Y-axis transport device 200 is driven, and the third substrate P3 at the relay position U is carried to the substrate stop position B. After that, the mounting process proceeds according to the above procedure while alternately repeating the mounting of the components and the conveyance of the board P.

(B) In the case of the control pattern of the long substrate PL In the case of the control pattern of the long substrate PL, the initial position of each substrate stopper is set as follows. That is, the stopper pins 166 are set at the elevated positions shown in FIG. 6B for the two substrate stoppers 162B of the conveyor 120 and the substrate stopper 163 of the conveyor 130.

  On the other hand, the substrate stopper 161 of the conveyor 110 and the substrate stopper 162R of the conveyor 120 are not only in the initial state, but also during the control, the stopper pin 166 is always kept in the lowered position, and the outputs of the substrate sensor 171 and the substrate sensor 172R are also It is not built into the control element.

  And when a board | substrate is carried out from upstream machines, such as a printing machine, the conveyance conveyors 110 and 120 are driven under the instruction | command of the control apparatus 500. FIG. Thereby, the first long substrate PL1 is carried into the apparatus from the right side of FIG.

  The control device 500 monitors the output states of the substrate sensor 172F of the transfer conveyor 120 and the substrate sensor 173 of the transfer conveyor 130 in parallel with the loading of the substrate.

  The first long substrate PL1 carried into the apparatus is transported to the downstream side in the X-axis direction by the transport conveyors 110 and 120, and eventually the tip of the substrate passes through the transport conveyor 110 and reaches the transport conveyor 120. Thereafter, the front end of the substrate comes into contact with the stopper pin 166 of the substrate stopper 162F of the transfer conveyor 120, and the long substrate PL1 extends across both conveyors of the second transfer conveyor 120 and the first transfer conveyor 110 as shown in FIG. It stops at one straddling position (corresponding to “first substrate stop position (substrate stop position on the substrate transport path that overlaps the work area of the first component mounting portion while straddling the substrate transport stage)” in the present invention).

  In this state, the rear half (the right half in FIG. 15) corresponding to the rear side in the transport direction of the stopped long board PL1 is just located in the work area of the head unit 60A of the component mounting portion 30A.

  In other words, the arrangement of the substrate stopper 162F (position in the X-axis direction) is set in consideration of the substrate length of the long substrate and the position of the work area of the head unit 60A so as to have such a positional relationship.

  On the other hand, immediately before the first long substrate PL1 reaches the first straddling position, the output of the substrate sensor 172F changes from “H level” corresponding to the light transmitting state to “L level” corresponding to the light shielding state.

  Then, using the output change timing as a trigger, the control device 500 executes a process of temporarily stopping both the conveyors 110 and 120 after a predetermined time has elapsed, and then executes a process of operating the backup device 180 of the conveyor 110. .

  As a result, as a result of the backup pin 181 rising, the long substrate PL1 stopped at the first straddling position is backed up on the lower surface of the substrate and is in a restrained state.

  After that, under the instruction of the control device 500, the component mounting process on the long substrate PL1 is performed by the head unit 60A of the component mounting unit 30A. By such component mounting processing, components are mounted in the area of the rear half (the right half in FIG. 15) of the long board PL1.

  Then, when the component mounting process borne by the component mounting unit 30A is completed, the control device 500 operates the backup device 180 of the conveyor 110 again to release the board.

  As a result, the backup pins 181 of the backup device 180 are all lowered, so that the long substrate PL1 is released from the restraint and can be transported on the substrate transport path L.

  In this state, under the instruction of the control device 500, a process of lowering the stopper pin 166 of the board stopper 162F is performed, and the conveyors 110, 120, and 130 are driven following the process. As a result, the first long substrate PL1 is transported downstream on the substrate transport path L by the transport conveyors 110-130.

  After the start of conveyance, the first long substrate PL1 moves on the substrate stopper 162F of the conveyance conveyor 120 while being conveyed downstream in the X-axis direction, and eventually completely passes through the substrate stopper 162F (more specifically, The rear end of the substrate passes through the substrate stopper 162F).

  Then, the control device 500 performs a process of returning the stopper pin 166 of the substrate stopper 162F that has been lowered to the raised position, based on the output of the substrate sensor 172F provided on the transport conveyor 120.

  As described above, in this embodiment, even when the long substrate PL is transported downstream, the stopper pin 166 is once lowered immediately before the transport operation, and the long substrate PL that has started moving completely stops the stopper pin 166. When it passes (more specifically, the rear end of the substrate passes through the stopper pin 166), control is performed to return the lowered stopper pin 166 to the raised position.

  Now, the first long substrate PL1 that has been transported by driving the transport conveyors 110, 120, and 130 eventually comes into contact with the substrate stopper 163 of the transport conveyor 130, and as shown in FIG. The second straddling position straddling both the three transport conveyors 130 and the second transport conveyor 120 (“second substrate stop position of the present invention (part of the long substrate protruding from the work area at the substrate stop position is the work area It stops at a position corresponding to “other substrate stop positions included in the case”).

  In this state, the front half (left half in FIG. 16) corresponding to the front side in the transport direction of the stopped long board PL1 is just located in the head unit 60C working area of the component mounting portion 30C.

  In other words, the arrangement of the substrate stopper 163 (position in the X-axis direction) is set in consideration of the substrate length of the long substrate and the position of the work area of the head unit 60C so as to obtain such a positional relationship. In the present embodiment, the substrate stopper 163 also serves as the substrate stopper for the normal substrate P.

  In parallel with the transfer of the first long substrate PL1, the second long substrate PL2 is carried into the apparatus via the transfer conveyors 110 and 120. The second long substrate PL2 carried into the machine is in the same manner as the first substrate P1, that is, the substrate tip comes into contact with the stopper pin 166 of the substrate stopper 162F of the transfer conveyor 120, and the second transfer conveyor 120 and the second transfer substrate 120 It stops at the first straddling position straddling both conveyors of one conveyor 110.

  Then, immediately before the first long substrate PL1 reaches the second straddling position, the output of the substrate sensor 173 changes from “H level” corresponding to the light transmitting state to “L level” corresponding to the light shielding state, Further, immediately before the second long substrate PL2 reaches the first straddling position, the output of the substrate sensor 172F changes from “H level” corresponding to the light transmitting state to “L level” corresponding to the light shielding state.

  Then, among the change timings at which the outputs of both the board sensors 172F and 173 change from “H level” to “L level”, the control device 500 uses the later change timing as a trigger, and the control device 500 after a predetermined time elapses, ~ 130 are temporarily stopped, and then the backup conveyor 180 of the conveyors 110 and 130 is operated.

  As a result, as a result of the backup pins 181 rising, the long substrate PL1 stopped across both the conveyors 130 and 120 is backed up by the backup device 180 of the conveyor 130 and is in a restrained state.

  Further, the long substrate PL2 stopped across both the conveyors 120 and 110 is backed up by the backup device 180 of the conveyor 110 and is in a restrained state.

  Thereafter, under the instruction of the control device 500, the component mounting process performed by the component mounting unit 30C on the long substrate PL1 and the component mounting process performed by the component mounting unit 30A on the long substrate PL2 are performed in parallel.

  By such component mounting processing, components are mounted in the region of the rear half (the right half in FIG. 16) of the long substrate PL2. In addition, for long substrate PL1, components are mounted in the remaining area where no components are mounted, that is, in the front half (the left half in FIG. 16). Thus, for the long board PL1, components are mounted in the entire area on the board.

  When the component mounting process by both the component mounting units 30A and 30C is completed, the control device 500 operates the backup device 180 of each of the conveyors 110 to 130 again to release the restraint of each long board.

  As a result, the backup pins 181 of the respective backup devices 110 to 130 are all lowered, so that the long substrates PL1 and PL2 are released from the restraint and can be transported on the substrate transport path L.

  Thereafter, under the instruction of the control device 500, a process of lowering the stopper pin 166 of the board stopper 162F of the transfer conveyor 120 and the stopper pin 166 of the board stopper 163 of the transfer conveyor 130 is performed. A process of driving all three conveyors 110, 120, and 130 constituting the conveyor apparatus 100 is performed. Thereby, all the two long substrates PL1 and PL2 are simultaneously conveyed downstream.

  Thus, the first long substrate PL1 that has completed all the mounting steps is carried out of the apparatus via the transfer conveyor 130. After that, the mounting process proceeds according to the above-mentioned procedure while alternately repeating the mounting of components and the conveyance of the long substrate PL.

  As described above, in the present embodiment, when mounting a component on the normal substrate P having a short substrate length, the component mounting portion 30B at a position offset in the Y-axis direction from the substrate transport path L is used. While mounting components using all three component mounting portions 30A to 30C, including two component mounting portions 30A positioned on the board conveyance path L, when mounting components on the long substrate PL, Parts are mounted using only 30C.

  That is, one normal substrate P is sequentially mounted at three locations on the base 11, and the surface mounting machine apparatus 10 is simultaneously mounted at three locations on the base 11, and the substrate Is carried out at the same time for three substrates, so that mounting efficiency is good. Then, one long substrate PL is sequentially mounted at two locations on the base 11, and the surface mounting apparatus 10 is simultaneously mounted at two locations on the base 11, and also transports the substrate. Since two substrates are executed simultaneously, the mounting efficiency is good.

8). Control program for executing the above series of operations In the present embodiment, the three conveyors 110 to 130 and the three component mounting portions 30A to 30C are provided on the base 11, and these operate independently and simultaneously in parallel. Therefore, basically three different operation programs are required.

  In the present embodiment, three different operation programs are integrated as an implementation program using three variables “L”, “M”, and “N”, and the three variables of the integrated implementation program are respectively If rewritten in this way, it can be used as an operation program for each mounting unit (see FIG. 17).

  Specifically, when the variable “L” is rewritten to “1”, the variable “M” is rewritten to “1”, and the variable “N” is rewritten to “2”, the first conveyor 110, the component mounting unit 30A, The operation program 1 for the mounting unit 1 consisting of

  When the variable “L” is rewritten to “2”, the variable “M” is rewritten to “2-1”, and the variable “N” is rewritten to “3”, the second conveyor 120 and the component mounting unit 30B are included. The operation program 2 for the mounting unit 2 is obtained.

  When the variable “L” is rewritten to “3”, the variable “M” is rewritten to “3”, and the variable “N” is rewritten to “4”, the mounting composed of the third conveyor 130 and the component mounting unit 30C is implemented. The operation program 3 for the unit 3 is obtained.

  Hereinafter, the operation program 1 for the mounting unit 1 will be briefly described for each program block with reference to FIGS.

  Note that the conveyor 1 described in the program corresponds to the conveyor 110 in FIG. 4, the conveyor 2 corresponds to the conveyor 120 in FIG. 4, and the conveyor 3 corresponds to the conveyor 130 in FIG. ing.

  Also, the substrate sensor 1 is the substrate sensor 171 in FIG. 4, the substrate sensor 2-1 is the substrate sensor 172R in FIG. 4, the substrate sensor 2-2 is the substrate sensor 172F in FIG. 4, and the substrate sensor 3 is the diagram. 4 corresponds to the substrate sensor 173 in FIG.

  Further, the substrate stopper 1 is the substrate stopper 161 in FIG. 4, the substrate stopper 2-1 is the substrate stopper 162R in FIG. 4, the substrate stopper 2-2 is the substrate stopper 162F in FIG. 4 corresponds to the substrate stopper 163 in FIG.

  A program block # 1 shown in FIG. 18 is a process executed when a new board is carried in from the upstream machine (upstream mounting unit in the case of the operation programs 2 and 3) on the base 11. First, a process is performed to check whether the new board and the preceding board that has already been loaded onto the base 11 and the mounting operation is proceeding are the same type of board. The process branches according to the collation result. If the new board is the same type as the preceding board, the program block # 1 is exited, and the process proceeds to B1.

  On the other hand, if the new board is of a different type from the preceding board, each process constituting program block # 1 is executed in sequence, and the process branches again according to the board length. That is, if the normal substrate P has a short substrate length, the program block # 1 is exited, and the process proceeds to A4.

  On the other hand, in the case of the long substrate PL, the remaining processes constituting the program block # 1 are executed in order, and the process of changing the widths of the conveyors 1 and 2 is executed as necessary.

  Next, program block # 2 shown in the upper part of FIG. 19 will be described. Program block # 2 is a process executed when the new board carried in mounting unit 1 is a long board.

  The program block # 2 is a program for executing a process of stopping and backing up the long substrate PL at a predetermined position on the substrate transport path L. By executing each process constituting the program block # 2 in order, the program block # 2 is executed. The long substrate carried on the table can be stopped at the first straddling position shown in FIG.

  Although the variable “M” for identifying the operation program 1 for the mounting unit 1 is set to “1”, when mounting processing is performed on a long board in the mounting unit 1, Thus, the variable “M” is rewritten to “2-2”, and the variable “N” is rewritten to “3”, thereby matching with the program block # 8 described below.

  Next, program block # 3 shown in the middle in FIG. 19 will be described. The program block # 3 is a process executed on the mounting unit 2 side when the new board that has been loaded is a long board. By executing the program block # 3, the mounting unit 2 The operation program 2 on the second side is stopped.

  The reason why such a process is provided is that when components are mounted on the long substrate PL, only the component mounting portion 30A and the component mounting portion 30C are used, and the component mounting portion 30B constituting the mounting unit 2 is not used. Because. In addition, as a result of the same processing, the Y-axis transport device 200 is also stopped, and as a result, the slide table 210 and thus the second transport conveyor 120 remain in the relay position U on the substrate transport path L.

  Next, program block # 4 shown in the lower part of FIG. 19 will be described. Program block # 4 is a process executed when the type of board is switched from a long board to a normal board, and the conveyor width is adjusted as necessary.

  Next, program block # 5 shown in the upper part of FIG. 20 will be described. Program block # 5 is a process executed when a normal-size substrate is loaded as a new substrate. The program block # 5 is a program for executing a process of stopping and backing up the substrate P at a predetermined position on the substrate transport path L. By executing each process constituting the program block # 5 in order, the base block The substrate P loaded thereon can be stopped at the substrate stop position A shown in FIG.

  Next, program block # 6 shown in the lower part of FIG. 20 will be described. In the program block # 6, a mounting operation program is incorporated at the first stage of processing. The mounting operation program (see FIG. 22) is a program for each component mounting unit 30 to execute a mounting operation, and components are mounted on the board by sequentially executing the mounting operation program.

  In addition to the above-described mounting operation program, the program block # 6 includes a flubbing process for recording the mounting unit for which the mounting operation by the mounting operation program has been completed, and various determination processes. Branch. For example, when the new substrate to be mounted is the normal substrate P, the program block # 6 is exited, and the process proceeds to A7.

  On the other hand, when the new substrate to be mounted is the long substrate PL, the subsequent processes constituting the program block # 6 are executed in order. The subsequent processing of the program block # 6 is a program for releasing the restriction and transporting the long substrate PL to the downstream side. By sequentially executing the processing constituting the program block # 6, the backup device 180, the substrate The restraint by the stopper 162F is released, and then the respective conveyors 110 to 130 are driven. Accordingly, the long substrate PL that has been subjected to the mounting process is transported downstream through the substrate transport path L.

  Note that the letter Q in the program block # 6 is a flag for determining whether or not the component mounting process has been completed. If Q (1) → 1, then the mounting unit 1 means that the mounting process is completed. If Q (1) → 0, it means that the mounting process is not completed in mounting unit 1.

  Next, program block # 7 and program block # 8 shown in FIG. 21 will be described. Both program blocks # 7 and # 8 are the same type of processing as the subsequent processing of the program block # 6, and the respective processings constituting the program blocks # 7 and # 8 are advanced in order, so that the substrate that has been subjected to mounting processing ( A normal substrate having a short substrate length) is transported downstream through the substrate transport path L.

  In the operation program 1 for the mounting unit 1, the variable “N” remains “2” when the mounting process is performed on the normal board.

  Therefore, in the determination process of Q (N) = 1 in the program block # 8, if the mounting process is performed for the normal board, the mounting for the mounting unit 2 or 3 on the downstream side is completed. Whether or not it is possible to carry out the board from the mounting unit 1 or 2 is confirmed.

  It should be noted that whether the unloading has been completed is the board sensor M (in the operation program 1 for the mounting unit 1, the variable “M” remains “1” when the mounting process is performed on a normal board, and the long board is This is performed based on the output of “2-2” when the mounting process is performed on the target.

  In the above, the rough processing of each of the program blocks # 1 to # 8 has been briefly described by taking the mounting unit 1 as an example. However, in practice, the control device 500 operates the operation program 1 of the mounting unit 1, The operation program 2 of the mounting unit 2 and the operation program 3 of the mounting unit 3 are simultaneously processed in parallel, and the transport system and the mounting system devices constituting the mounting units 1 to 3 are Control appropriately.

  As a result, different control patterns are executed according to the length / shortness of the board length, and when mounting a component on the normal board P, the component mounting portion at a position offset in the Y-axis direction from the board transport path L Mounting processing is performed by all three component mounting portions 30A to 30C including 30B, and when mounting components on the long substrate PL, the two component mounting portions 30A and 30C positioned on the substrate transport path L are performed. The mounting process is performed only.

  As described above, according to the surface mounting apparatus 10 applied to the present embodiment, the control device 500 uses different control patterns according to the length / shortness of the board length. It is possible to cope with both a long substrate PL having a long length and a normal substrate P having a short substrate length.

  Specifically, in the case of the normal board P, the mounting process is simultaneously performed by the plurality of component mounting units 30A to 30C, so that the component mounting efficiency is high and the tact time is shortened.

  On the other hand, when the long board PL is stopped at the first straddling position across both the conveyors 120 and 110, the rear half of the long board PL fits in the work area of the component mounting portion 30A, and the conveyor 130 When the transport belt 120 is stopped at the second straddling position across both conveyors, the front half of the long board PL is accommodated in the work area of the component mounting portion 30C.

  Therefore, if the mounting operation is performed using both the component mounting portions 30A and 30C, it is possible to mount the components without omission in the entire area of the long substrate PL.

  In the present embodiment, the substrate stopper that stops the long substrate PL and the substrate stopper that stops the normal substrate P are partially shared. Specifically, the substrate stopper 163 provided on the transfer conveyor 130 is shared. With such a configuration, it is possible to reduce the number of board stoppers and, in turn, the number of board sensors installed (reduction in the number of parts).

  In this embodiment, a conveyor width adjusting device 310 is provided so that the conveyor widths of the transfer conveyors 110 to 130 can be adjusted. With such a configuration, it is possible to transport the substrate on the base 11 regardless of the substrate width, and to mount components on the substrates P and PL.

  In the first embodiment, one support leg 35 that supports the base member 51B that constitutes the component mounting portion 30B is supported by the both support legs 32 that support the base member 51A that constitutes the component mounting portion 30A located on the upstream side. 33 is located in the middle. Further, the other support leg 36 that supports the base member 51B that constitutes the component mounting portion 30B is also positioned between the support legs 33 and 34 that support the base member 51C that constitutes the downstream component mounting portion 30C. ing.

  Thus, in the present embodiment, the arrangement space (arrangement space in the X-axis direction) of the component mounting portions 30A to 30C is overlapped with the arrangement space (arrangement space in the X-axis direction) of the adjacent component mounting portions 30A to 30C. Yes. With such a configuration, the base 11 and thus the entire surface mount device 10 can be downsized in the X-axis direction.

<Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to FIGS.
In the first embodiment, an example in which three component mounting portions 30A to 30C are arranged side by side in the X-axis direction on the base 11 has been described. On the other hand, in the second embodiment, two component mounting portions 620 and 630 are arranged side by side in the X-axis direction on the base 610. Specifically, the component mounting unit 620 located on the right side (upstream in the board transfer direction) in FIG. 23 has a work area on the board transfer path L, and the left component mount part 630 in FIG. It is in a position away from the substrate transport path L in the Y direction.

  Then, two conveyors 650 and 660 are provided on the base 610 corresponding to the component mounting portions 620 and 630. Of these two transport conveyors 650 and 660, the transport conveyor 650 corresponding to the component mounting portion 620 is a fixed conveyor that is fixedly installed on the board transport path L.

  In contrast, the conveyor 660 corresponding to the component mounting unit 630 is placed and fixed on a slide table (not shown) that is movable in the Y-axis direction (the same type of structure as the slide table of the first embodiment). The board P can be moved between the board transport path L and the component mounting portion 630.

  In this example, as shown in FIG. 23, the normal board P having a short board length is mounted with components by both the component mounting unit 620 and the component mounting unit 630.

  On the other hand, the long substrate PL having a long substrate length is mounted by using only the component mounting portion 620 having a work area on the substrate transport path L. Specifically, when the long board PL is carried onto the base 610, the position shown in the upper part of FIG. 24, that is, the position where the board front end F does not protrude from the work area of the component mounting unit 620, Stopped by a substrate stopper 681 provided on the conveyor 650.

  Then, the component mounting process is performed on the long substrate PL stopped at the same position by the component mounting unit 620 in the front half (left half in FIG. 24) region of the substrate on the front side in the transport direction.

  Thereafter, the long substrate PL that has been mounted on the front half is transported downstream on the substrate transport path L, and this time, as shown in the lower part of FIG. Is stopped by a substrate stopper 682 provided on the substrate. Then, component mounting processing is performed on the remaining half (right half in FIG. 24) by the component mounting unit 620 on the long substrate PL stopped at the same position.

  In the first embodiment, the support leg 35 that supports the base member 51B that constitutes the component mounting portion 30B is provided between the support legs 32 and 33 that support the base member 51A that constitutes the component mounting portion 30A located on the upstream side. The support leg 33 that supports the base member 51A constituting the component mounting portion 30A is positioned between the support legs 35 and 36 that support the base member 51B constituting the downstream component mounting portion 30B. The arrangement space of the support legs of the component mounting portion 30B and the arrangement space of the support legs of the component mounting portion 30A are overlapped in the X-axis direction.

  Although omitted in the drawing, the second embodiment also supports the arrangement space of the support legs that support the component mounting portion 620 located on the upstream side and the component mounting portion 630 located on the downstream side, as in the first embodiment. The space for arranging the supporting legs is overlapped in the X-axis direction.

  As a result, as in the first embodiment, the overall length of the surface mounting device in the X-axis direction can be shortened, and further, a mounting line incorporating one or more surface mounting devices can be made compact. Further, a normal substrate having a short substrate length is sequentially mounted at two locations on the base 610, and as a surface mounting device, a mounting operation is simultaneously performed at two locations on the base 610, and the substrate Is carried out simultaneously on two substrates, so that mounting efficiency is good. A single long board PL can be mounted in two areas on the base 610 in order, and components can be mounted on the entire area of the board.

  In the present embodiment, the substrate stopper that stops the long substrate PL and the substrate stopper that stops the normal substrate P are partially shared. Specifically, a substrate stopper 681 provided on the transfer conveyor 650 is shared. With such a configuration, it is possible to reduce the number of board stoppers and, in turn, the number of board sensors installed (reduction in the number of parts).

  23 and 24, reference numeral 625 denotes a head unit that constitutes the component mounting unit 620, and reference numeral 635 denotes a head unit that constitutes the component mounting unit 630.

  Further, the component mounting portion 620 of this embodiment corresponds to the “first component mounting portion” of the present invention, and the component mounting portion 630 corresponds to the “second component mounting portion” of the present invention. And the stop position of the long board shown in the lower stage in FIG. 24 corresponds to “the board stop position on the board transfer path that overlaps the work area of the first component mounting portion while straddling the board transfer stage” in the present invention. The stop position of the long substrate shown in the upper stage corresponds to “another substrate stop position at which a part of the long substrate is included in the work area” in the present invention.

<Embodiment 3>
Next, Embodiment 3 of the present invention will be described with reference to FIGS.
In the first embodiment, an example in which three component mounting portions 30A to 30C are arranged side by side in the X-axis direction on the base 11 has been described. On the other hand, in the third embodiment, two component mounting portions 720 and 730 are arranged side by side in the X-axis direction on the base 710. Specifically, the component mounting unit 730 located on the left side (downstream in the board conveyance direction) in FIG. 25 has a work area on the board conveyance path L, and the right component mounting part 720 in FIG. It is in a position away from the substrate transport path L in the Y direction.

  Then, two conveyors 750 and 760 are provided on the base 710 corresponding to the component mounting portions 720 and 730, respectively. Of these two transfer conveyors 750 and 760, the transfer conveyor 760 corresponding to the component mounting unit 730 is a fixed conveyor that is fixedly installed in the board transfer path L.

  On the other hand, the transfer conveyor 750 corresponding to the component mounting portion 720 is mounted on a slide table (not shown) that is movable in the Y-axis direction (having the same type of structure as the slide table of the first embodiment). The board P is movable between the board transport path L and the component mounting portion 720.

  In this example, the normal board P having a short board length is mounted by the component mounting parts of both the component mounting part 720 and the component mounting part 730 as shown in FIG.

  On the other hand, the long substrate PL having a long substrate length is mounted by using only the component mounting portion 730 having a work area on the substrate transport path L. Specifically, when the long substrate PL is loaded onto the base 710, the substrate stopper 782 provided on the transport conveyor 760 is positioned at the position shown in the upper part of FIG. 26, that is, the position straddling the transport conveyor 760 and the transport conveyor 750. Stopped. Then, component mounting processing is performed on the long substrate PL stopped at the same position by the component mounting unit 730 in the front half (left half in FIG. 26) region of the substrate on the front side in the transport direction.

  Thereafter, the long substrate PL that has been mounted on the front half is transported downstream through the substrate transport path L, and this time, as shown in the lower part of FIG. It is stopped by 781. Then, component mounting processing is performed on the remaining half (right half in FIG. 26) by the component mounting unit 620 on the long substrate PL stopped at the same position.

  Although not shown in the drawing, the third embodiment also supports the arrangement space of the support legs that support the component mounting portion 720 located on the upstream side and the component mounting portion 730 located on the downstream side, as in the first embodiment. The supporting leg placement space is overlapped in the X-axis direction.

  As a result, as in the first and second embodiments, the overall length of the surface mounting device in the X-axis direction can be shortened, and further, a mounting line incorporating one or more surface mounting devices can be made compact. Further, a normal substrate having a short substrate length is sequentially mounted at two locations on the base 710, and as a surface mounting device, a mounting operation is simultaneously performed at two locations on the base 710. Is carried out simultaneously on two substrates, so that mounting efficiency is good. Then, one long board PL can be mounted in two areas on the base 710, and components can be mounted on the entire area of the board.

  In the present embodiment, the substrate stopper that stops the long substrate PL and the substrate stopper that stops the normal substrate P are partially shared. Specifically, a substrate stopper 782 provided on the transfer conveyor 760 is shared. With such a configuration, it is possible to reduce the number of board stoppers and, in turn, the number of board sensors installed (reduction in the number of parts).

  In order to stop the long substrate PL at the lower position in FIG. 26, the long substrate PL is transferred to the lower position beyond the lower position in FIG. 26, and then the driving direction of the conveyor is reversed to transfer the substrate. The substrate may be sent upstream and the rear end of the substrate may be brought into contact with the substrate stopper 781 provided on the transfer conveyor 730. In FIGS. 25 and 26, reference numeral 725 denotes a head unit that constitutes the component mounting unit 720, and reference numeral 735 denotes a head unit that constitutes the component mounting unit 730.

  Further, the component mounting portion 730 of this embodiment corresponds to the “first component mounting portion” of the present invention, and the component mounting portion 720 corresponds to the “second component mounting portion” of the present invention. 26 corresponds to the “substrate stop position on the substrate transfer path that overlaps the work area of the first component mounting unit while straddling the substrate transfer stage” in the present invention, as shown in FIG. The long substrate stop position shown in the lower stage corresponds to “another substrate stop position including a part of the long substrate in the work area” in the present invention.

<Embodiment 4>
In the fourth embodiment, the configuration of the second embodiment is slightly modified, and the transport conveyor 850 located on the right side in FIG. 27 is a movable conveyor that can move in the Y-axis direction.

  In this case, the work area of the component mounting portion 820 located on the right side in FIG. 27 extends in the Y-axis direction, and components can be mounted on the board on the board transport path L. .

  Therefore, by using the component mounting unit 820 having the work area on the board transport path L, the long board PL having a long board length can mount components in the entire area on the board as in the second embodiment. .

  Specifically, when the long board PL is carried onto the base 810, the position shown in the upper part of FIG. 27, that is, the position where the board front end F does not protrude from the work area of the component mounting unit 820, Stopped by a substrate stopper 881 provided on the conveyor 850. Then, component mounting processing is performed on the front half (left half in FIG. 27) of the board on the front side in the transport direction by the component mounting unit 820 with respect to the long board PL stopped at the same position.

  After that, the long substrate PL that has been mounted on the front half is transported downstream on the substrate transport path L, and this time, as shown in the lower part of FIG. 27, the transport conveyor 660 is located at a position across the transport conveyor 660 and the transport conveyor 850. Is stopped by a substrate stopper 882 provided on the substrate. Then, a component mounting process is performed on the rear half (right half in FIG. 27) of the long substrate PL stopped at the same position by the component mounting unit 820.

  Although omitted in the drawing, the fourth embodiment also supports the arrangement space of the support legs that support the component mounting portion 820 located on the upstream side and the component mounting portion 630 located on the downstream side, as in the first embodiment. The supporting leg placement space is overlapped in the X-axis direction.

  As a result, as in the first to third embodiments, the overall length of the surface mounting device in the X-axis direction can be shortened, and further, a mounting line incorporating one or more surface mounting devices can be made compact. Further, a normal board having a short board length is sequentially mounted at two places on the base 810, and as a surface mounting apparatus, a mounting operation is simultaneously performed at two places on the base 810, and the board is mounted. Is carried out simultaneously on two substrates, so that mounting efficiency is good. One long board PL can be mounted in two areas on the base 810 in order, and components can be mounted on the entire area of the board.

  In the present embodiment, the substrate stopper that stops the long substrate PL and the substrate stopper that stops the normal substrate P are partially shared. Specifically, a substrate stopper 881 provided on the transfer conveyor 850 is shared. With such a configuration, it is possible to reduce the number of board stoppers and, in turn, the number of board sensors installed (reduction in the number of parts).

  Further, the component mounting portion 820 of this embodiment corresponds to the “first component mounting portion” of the present invention, and the component mounting portion 630 corresponds to the “second component mounting portion” of the present invention. 27 corresponds to the “substrate stop position on the substrate transfer path that overlaps the work area of the first component mounting unit while straddling the substrate transfer stage” in the present invention, as shown in FIG. The stop position of the long substrate shown in the upper stage corresponds to “another substrate stop position at which a part of the long substrate is included in the work area” in the present invention.

The top view of the surface mounting apparatus in Embodiment 1 Perspective view of base and support legs The figure which shows the support structure of a head unit (the figure which looked at FIG. 1 from the Y direction back side) Diagram showing the configuration of the transport system (showing the slide table moved to the relay position) The perspective view which showed each apparatus which comprises a conveyance system typically Diagram showing the configuration of the board stopper GG sectional view in FIG. Diagram showing the configuration of the transport system (showing a state where the slide table is moved to the substrate stop position B) HH line sectional view in FIG. Block diagram showing electrical configuration of surface mount device Plan view showing the board transfer procedure (for normal boards) Plan view showing substrate transfer procedure Plan view showing substrate transfer procedure Plan view showing substrate transfer procedure Plan view showing the board transfer procedure (for long boards) Plan view showing substrate transfer procedure Diagram showing the program structure of the implementation program Similarly, a diagram showing the program configuration of the implementation program Similarly, a diagram showing the program configuration of the implementation program Similarly, a diagram showing the program configuration of the implementation program Similarly, a diagram showing the program configuration of the implementation program Similarly, a diagram showing the program configuration of the implementation program The top view of the surface mounting apparatus in Embodiment 2 Diagram showing stop position of long board The top view of the surface mounting apparatus in Embodiment 3 Diagram showing stop position of long board The figure which shows the stop position of the long board | substrate in Embodiment 4.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Surface mounting apparatus 11 ... Base 30A ... Component mounting part (equivalent to the "first component mounting part" of this invention)
30B ... Component mounting part (corresponding to "second component mounting part" of the present invention)
30C. Component mounting portion (corresponding to “third component mounting portion” of the present invention)
63A-63C ... Suction head (corresponding to "mounting head" of the present invention)
100 ... X-axis transport device (constitutes the “transport system device” of the present invention)
DESCRIPTION OF SYMBOLS 110 ... 1st conveyance conveyor 120 ... 2nd conveyance conveyor 130 ... 3rd conveyance conveyor 161 ... Substrate stopper 162F ... Substrate stopper 162R ... Substrate stopper 163 ... Substrate stopper 200 ... Y-axis conveyance apparatus 210 ... Slide table ("substrate" of this invention Corresponds to “conveyance stage” and constitutes “conveyance system device” of the present invention)
215 ... Ball nut 260 ... Y-axis ball screw shaft 265 ... Motor 500 ... Control device P ... Normal substrate PL ... Long substrate

Claims (5)

A plurality of component mounting portions each including a mounting head for mounting components on a substrate and a drive device for horizontally moving the mounting head in a work area on the base are provided on the base, and the base is unidirectionally arranged. A surface mounting apparatus that performs mounting processing of components on the substrate while transporting a substrate along an extended substrate transport path, wherein the one direction is an X-axis direction, and a direction orthogonal to the X-axis direction is a Y-axis direction. When defined
A first component mounting part having the work area on the board conveyance path;
A second component mounting portion that has a work area at a position adjacent to the first component mounting portion in the X-axis direction and spaced from the substrate transport path in the Y-axis direction;
An X-axis transport device that transports the substrate along the substrate transport path, and a substrate transport that is slidable in the Y-axis direction to reciprocate the substrate between the substrate transport path and the second component mounting portion. A transfer system device comprising a stage;
Both of these component mounting units and a control device for controlling the transfer system device are provided,
When mounting a component on a normal board, the control device sends the normal board to each component mounting part in order and performs the mounting process in each component mounting part in parallel.
When a component is mounted on a long board whose overall length is longer than the overall length in the X-axis direction of the board transfer stage, the board transfer stage is allowed to remain on the board transfer path,
The board stop position on the board transfer path that overlaps the work area of the first component mounting unit while straddling the board transfer stage, and either at the front or the rear in the X-axis direction with respect to the board stop position, On the substrate transport path, the long substrate is stopped at at least two substrate stop positions with another substrate stop position including a part of the long substrate protruding from the work region at the substrate stop position. A surface mounting apparatus, wherein a mounting process is performed on the long board at each board stop position using a component mounting section having a work area. In the first component mounting portion disposed on the upstream side of the second component mounting portion in the board transport direction,
A third component mounting portion is disposed adjacent to the second component mounting portion at a position on the substrate transport path and downstream of the second component mounting portion in the substrate transport direction. The surface mounting apparatus according to claim 1. The X-axis transport device is provided corresponding to the first transport conveyor provided corresponding to the first component mounting portion, the second transport conveyor provided on the substrate transport stage, and the third component mounting portion. In what consists of a third conveyor,
When mounting a component on the long board, the control device stops the long board at a first board stop position across the second transport conveyor and the first transport conveyor on the board transport stage. With one component mounting part, let the component mounting process be performed for the area on the back side in the transport direction on the long board,
Thereafter, the long substrate is stopped at the second substrate stop position across the third transport conveyor and the second transport conveyor on the substrate transport stage, and the remaining parts on the substrate are targeted by the third component mounting unit. The surface mounting apparatus according to claim 2, wherein a mounting process is performed. 4. The substrate stopper for stopping the long substrate at the first substrate stop position or the second substrate stop position is shared with a substrate stopper for stopping the normal substrate on a substrate transport path. The surface mount apparatus described. Both component mountings constituting at least one of the first component mounting portion and the second component mounting portion, or the second component mounting portion and the third component mounting portion. 5. The surface according to claim 1, wherein both component mounting parts are arranged close to each other in the X-axis direction so that the arrangement spaces of the parts partially overlap in the X-axis direction. Mounting device.

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