JP2009015152A - Connection structure of electronic device and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure of an electronic device improved in connection reliability while maintaining excellent shape processing characteristics and ease of work. <P>SOLUTION: The connection structure of an electronic device 10 includes a conductive layer 12, a substrate 16 arranged to face the conductive layer 12, metal foils 17a and 17b each having the lower face directly touching part of the upper face of the conductive layer 12 and fixed on the upper face of conductive layer 12 in a non-adherent state, and an adhesive film 18 stuck to the upper face of the conductive layer 12, the upper faces of the metal foils 17a and 17b, and the lower face of the substrate 16. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic device connection structure and a method for manufacturing the same.

  Conventionally, a flexible printed wiring board (hereinafter referred to as “panel electrode”) as a take-out means for connecting an electrode (hereinafter referred to as “panel electrode”) provided in a display panel and an external circuit such as a control circuit or a drive circuit in the field of flat panel displays. "FPC") is used. The adhesion between the FPC and the panel electrode is generally by soldering or thermocompression bonding. However, since these bonding temperatures are usually 150 ° C. or higher, it is difficult to employ FPC when the heat resistance of the electronic member around the connection portion is low.

  Furthermore, as described in Patent Document 1, a method of employing a conductive adhesive such as an anisotropic conductive film is also known. However, even when a conductive adhesive is employed, the adhesion temperature is usually 150 ° C. or higher, so that, similarly to FPC, when the heat resistance of the electronic member around the connection portion is low, it is difficult to employ the conductive adhesive.

  Therefore, a clip-like electrode called a clip electrode has been developed as another extraction means. The clip electrode is in a state of being fixed to the display panel by being in contact with the panel electrode while sandwiching a part of the panel. However, since the clip electrode sandwiches a part of the panel due to its spring property, the clip electrode is limited in size and shape.

Therefore, a connection structure described in Patent Document 2 has been proposed as means for solving the above-described problems. This connection structure is a solid electrochromic device in which a metal foil is bonded to the end of the lower transparent conductive layer via a conductive adhesive. According to this connection structure, processing into various shapes is easy, and workability at the time of attachment can be improved.
JP-A-11-7040 International Publication No. 02/39180 Pamphlet

  However, in the connection structure described in Patent Document 2, the metal foil and the lower conductive layer are connected via a conductive adhesive material having a higher resistance than those. Therefore, the electronic device having such a connection structure has room for further improvement in terms of connection reliability.

  Therefore, the present invention has been made in view of the above circumstances, and provides an electronic device connection structure with improved connection reliability while maintaining excellent shape workability and workability, and a method for manufacturing the same. Objective.

  The present invention for achieving the above object has a conductive layer, a substrate disposed opposite to the conductive layer, a lower surface in direct contact with a part of the upper surface of the conductive layer, and on the upper surface of the conductive layer. An electronic device connection structure comprising: a metal foil fixed in a non-adhering state; and an adhesive film bonded to the upper surface of the conductive layer, the upper surface of the metal foil, and the lower surface of the substrate.

  The present invention also includes a step of placing the metal foil on the upper surface of the conductive layer in a non-adhered state so that a part of the upper surface of the conductive layer is in direct contact with the lower surface of the metal foil; And a step of placing the adhesive film on the exposed upper surface of both the metal foil, a step of placing the substrate on the upper surface of the adhesive film, and the conductive layer, the metal foil, the adhesive film, and the substrate in the stacking direction thereof. There is provided a method for manufacturing a connection structure of an electronic device, comprising pressing and fixing a metal foil on an upper surface of a conductive layer with an adhesive film, and simultaneously fixing the substrate to the conductive layer through the adhesive film. .

  According to the present invention, first, the conductive layer and the metal foil are in direct contact without interposing a conductive adhesive material as proposed in Patent Document 2, and thus sufficiently excellent connection reliability is exhibited. In addition, since the metal foil functions as a take-out means used for connection with the external circuit, workability relating to the connection between the external circuit and the conductive layer can be improved. Furthermore, the metal foil is less susceptible to size and shape restrictions than the clip electrode, and can be easily processed into various shapes.

  In addition, since the adhesive film used in the present invention may be capable of being bonded at a temperature lower than 150 ° C., high heat resistance is not required for the electronic members around the connection part, and the range of material selection is widened and produced. Cost can also be reduced. Furthermore, according to the manufacturing method of the connection structure of the electronic device of the present invention, the metal foil is fixed on the upper surface of the conductive layer, and at the same time, the substrate is fixed opposite to the conductive layer through the adhesive film. The manufacturing process can be simplified.

  ADVANTAGE OF THE INVENTION According to this invention, the connection structure of the electronic device which improved connection reliability, and its manufacturing method can be provided, maintaining the outstanding shape workability and workability | operativity.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings as necessary. In the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. Further, the positional relationship such as up, down, left and right is based on the positional relationship shown in the drawings unless otherwise specified. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios.

  FIG. 1 is a cross-sectional view schematically showing a connection structure of an electronic device according to a preferred first embodiment of the present invention. The electronic device shown in FIG. 1 is a solid-type electrochromic (hereinafter simply referred to as “EC”) element. The EC element 10 includes a lower transparent conductive layer 12, a counter glass 16 that is a substrate disposed to face the lower transparent conductive layer 12, and a lower surface in direct contact with a part of the upper surface of the lower transparent conductive layer 12. Metal foils 17a and 17b that are fixed on the upper surface of the lower transparent conductive layer 12 in a non-adhering state, and the upper surfaces of the lower transparent conductive layer 12, the upper surfaces of the metal foils 17a and 17b, and the lower surface of the counter glass 16. It has a connection structure provided with the adhesive film 18 adhered. Hereinafter, the EC element 10 will be described in detail.

As shown in FIG. 1, the solid EC element 10 is provided with a lower transparent conductive layer 12 made of ITO or the like on the upper surface of a substrate glass 11, and a part of the lower transparent conductive layer 12 is provided. The isolation part 12a is provided by forming the groove 12b. The lower transparent conductive layer 12 is composed of two parts, an isolation part 12a and a main body part 12c, which are isolated by a groove 12b in order to provide two extraction electrodes. The width of the lower transparent conductive layer 12 including the isolation part 12 a and the main body part 12 c is the same as that of the substrate glass 11. An EC layer 13 made of WO ₃ or the like is formed on the upper surface of the lower transparent conductive layer 12, and an upper transparent conductive layer 14 made of ITO or the like is formed on the upper surface of the EC layer 13. .

  Further, metal foils 17a and 17b are respectively attached to the upper surface of the outer end of the main body portion 12c of the lower transparent conductive layer 12 and the upper surface of the outer end of the isolation portion 12a. A part of the lower surface of the metal foils 17 a and b is in contact with a part of the upper surface of the lower transparent conductive layer 12. An adhesive film 18 is provided so as to cover the substrate glass 11, the lower transparent conductive layer 12, the EC layer 13, the upper transparent conductive layer 14, and the metal foils 17a and 17b from above. However, since the width dimension of the adhesive film 18 is the same as that of the substrate glass 11, a part of the outside of the metal foils 17 a and 17 b is exposed without being covered with the adhesive film 18. The metal foils 17 a and 17 b are fixed on the main body portion 12 c and the isolation portion 12 a of the lower transparent conductive layer 12 by the adhesion by the adhesive film 18, respectively. Although the contact between the lower transparent conductive layer 12 and the metal foils 17a and 17b is ensured by direct contact, they are not bonded to each other.

  The constituent material of the metal foils 17a and 17b is not particularly limited as long as it is a metal capable of forming a foil, and examples thereof include copper, aluminum, tin, and stainless steel. Among these, stainless steel is preferable from the viewpoints of corrosion resistance and gloss. Further, the metal foils 17a and 17b may be plated so as to cover the surface of the metal foil. Corrosion resistance can be improved by plating.

  Further, the constituent material of the adhesive film 18 is not particularly limited as long as it is a known material mainly composed of a resin. The resin contained in the adhesive film 18 may be a thermosetting resin or a thermoplastic resin. For example, ethylene vinyl acetate (EVA), polyethylene terephthalate (PET), polyvinyl butyral (PVB), polyvinyl alcohol (PVA).

  Further, a counter glass 16 is provided on the upper surface of the adhesive film 18, and the counter glass 16 is fixed by bonding with the adhesive film 18. The upper transparent conductive layer 14 is in direct contact with the upper surface of the isolation part 12a on the lower surface thereof, and the main body part 12c and the upper transparent conductive layer 14 of the lower transparent conductive layer 12 are formed so as not to short-circuit each other. Furthermore, the electrode of the upper transparent conductive layer 14 can be taken out from the isolation part 12a. That is, the EC layer 13 is also formed in the groove 12b, and the EC layer 13 is formed between the main body portion 12c of the lower transparent conductive layer 12 and the isolation portion 12a of the upper transparent conductive layer 14 and the lower transparent conductive layer 12. It is in a pinched state.

  Further, the width dimension of the upper transparent conductive layer 14 is a dimension that covers most of the EC layer 13 from the center side of the EC element 10 of the isolation part 12a. The width dimension of the counter glass 16 is longer than the width dimension of the lower transparent conductive layer 12 including the isolation part 12a and the main body part 12c (that is, the width dimension of the substrate glass 11). Further, although not shown, the external circuit and the metal foils 17a and 17b are connected to each other through lead wires joined to the metal foils 17a and 17b by spot welding, for example.

  The metal foils 17a and 17b of the solid EC element 10 function as extraction electrodes. When a direct current is applied between the lower transparent conductive layer 12 and the upper transparent conductive layer 14 from the outside, the EC layer 13 is colored. When the reverse voltage is applied, the EC layer 13 is decolored.

  As described above, when the metal foils 17a and 17b serving as extraction electrodes are in direct contact with the lower transparent conductive layer 12, the connection reliability of the solid-state EC element 10 is sufficiently excellent. Further, since the metal foils 17a and 17b function as extraction electrodes used for connection to the external circuit, workability when connecting the external circuit and the lower transparent conductive layer 12 can be improved.

  Furthermore, the metal foils 17a and 17b can save space compared to the clip electrode, and can be easily processed into various shapes as required. That is, when connecting with a clip electrode, the width dimension of the counter glass must be made smaller than that of the substrate glass due to the restriction of its shape. However, in the solid-state EC element 10 of the present embodiment, as is clear from FIG. 1, the width dimension of the counter glass 16 can be made comparable to the substrate glass 11 or larger than the substrate glass 11. can do. Moreover, even if the metal foil 17a, b has a complicated shape, it can be easily processed into various shapes according to the shape, the contact resistance is reduced, and the appearance is made clear. Can do.

  Moreover, since EVA etc. which can be adhere | attached at the temperature lower than 150 degreeC can be employ | adopted as a constituent material of the adhesive film 18, high heat resistance is used for the material which comprises each member of the solid EC element 10 in that case Is not required. Furthermore, although the distance between the upper surface of the lower transparent conductive layer 12 and the lower surface of the counter glass 16 is generally formed to be about several tens of μm, the metal foils 17a and 17b and the adhesive film 18 are easily deformed. By crushing the material, the distance can be followed. Further, by adopting a highly glossy metal as a constituent material of the metal foils 17a and 17b, the metal foils 17a and b themselves can be used as a reflecting surface. Therefore, the effective reflection area of the solid-state EC element 10 is increased as described above. It can be expanded from that described in Patent Document 2.

  Such a solid EC element 10 can be manufactured as follows. First, a structure in which the substrate glass 11, the lower transparent conductive layer 12, the EC layer 13, and the upper transparent conductive layer 14 are configured as shown in FIG. 1 is prepared, and metal foils 17a and 17b shown in FIG. 1 are prepared. Next, the lower surfaces of the metal foils 17a and 17b are in direct contact with the upper surface of the outer end of the main body portion 12c of the lower transparent conductive layer 12 and the upper surface of the outer end of the isolation portion 12a, respectively. 17a and b are mounted. At this time, the upper surfaces of the main body portion 12c and the isolation portion 12a of the lower transparent conductive layer 12 and the lower surfaces of the metal foils 17a and 17b are not bonded. The metal foils 17a and 17b are aligned and temporarily fixed by pinning or the like.

  Next, the adhesive film 18 is placed on the exposed upper surfaces of both the structure and / or the metal foils 17a and 17b. In FIG. 1, since the upper surface of the structure is located higher than the upper surfaces of the metal foils 17a and 17b, the adhesive film 18 is placed on the upper surface of the structure. However, if the upper surfaces of the metal foils 17a, b are higher, they are placed on the upper surfaces of the metal foils 17a, b. Of course, when the adhesive film 18 is placed, the adhesive film 18 may be pressed in the laminating direction to directly contact the lower surface of the adhesive film 18 on the upper surfaces of both the structure and the metal foils 17a and 17b.

  Subsequently, the counter glass 16 is placed on the upper surface of the adhesive film 18. Then, the adhesive film 18 is compressed by pressing in the laminating direction by means such as vacuum pressure bonding, and the metal foils 17a and 17b are fixed on the upper surface of the main body portion 12c and the isolation portion 12a of the lower transparent conductive layer 12. At the same time, the facing glass 16 is fixed to the lower transparent conductive layer 12 through the adhesive film 18. In this way, the solid EC element 10 is obtained.

  According to this method for manufacturing a solid EC element, the metal foils 17a and 17b are fixed on the upper surfaces of the main body portion 12c and the isolation portion 12a of the lower transparent conductive layer 12, and at the same time, the opposing glass 16 is transparently transferred to the lower transparent conductive layer 12 via the adhesive film 18. Since the conductive layer 12 is opposed and fixed, the manufacturing process can be simplified as compared with the conventional method. Moreover, since the opposing glass 16 can be made into a width dimension longer than the substrate glass 11 on both sides (or a width dimension similar to that of the substrate glass 11 although not shown), the opposing glass is pressed to pressure-bond the adhesive film 18. In this case, it is possible to prevent the displacement due to the metal foils 17a and 17b floating.

  Next, with reference to FIG. 2, a mirror device using the solid-state EC element according to the first embodiment will be described. FIG. 2 is a schematic sectional view of a mirror device using the solid EC element 10. In FIG. 2, the solid-state EC element 10 shown in FIG. 1 is shown upside down.

  As shown in FIG. 2, the mirror device 20 includes a substrate glass 11 and a reflection member 22 made of a metal reflection film 21 formed on the upper surface thereof, and a film formed on the upper surface of the metal reflection film 21 and partially provided with a groove. A lower transparent conductive layer (not shown) isolated by providing, an EC layer 13 formed on the upper surface of the lower transparent conductive layer, a part of the isolated lower transparent conductive film, and the EC layer 13 An upper transparent conductive layer (not shown) formed over the upper surface and an opposing glass 16 facing the lower transparent conductive layer, and the main body of the lower transparent conductive layer and the isolated lower transparent conductive layer are isolated The metal foils 17a and 17b are fixed to the upper surface of the end of each part. Therefore, in the mirror device 20 using the solid EC element, a gap is formed between the upper transparent conductive layer and the counter glass 16.

  The metal foils 17a and 17b are attached with one end sandwiched between the opposing glass 16 and the lower transparent conductive layer and bonded to the lower transparent conductive layer with an adhesive film (not shown), and the other end extending to the outside. ing. The width dimension of the metal reflective film 21 is shorter than the width dimension of the substrate glass 11 on both sides. The width dimension of the counter glass 16 is the same as the width dimension of the substrate glass 11. The laminated state of the upper and lower transparent conductive layers, the adhesive film, and the EC layer 13 is the same as that shown in FIG. 1, and detailed illustration and description are omitted here.

  Since this mirror device 20 can easily attach electrodes, workability at the time of attachment is improved. Further, by using the metal foils 17a and 17b, the extraction electrode can be processed and attached in various shapes corresponding to the shapes of the substrate glass 11, the counter glass 16, the metal reflection film 21, and the like. For example, the width dimension of the counter glass 16 can be the same as the width dimension of the substrate glass 11. Furthermore, by using the metal foils 17a and 17b, the shape of the extraction electrode can be adapted to the installation location and use situation of the mirror device 20, and the extraction electrode can be made thin. Such a mirror device 20 is useful as an EC mirror for vehicles such as automobiles.

  FIG. 3 schematically shows a connection structure of an electronic device according to a preferred second embodiment of the present invention, where (b) is a schematic plan view thereof, and (a) is II-II of (b). A cross section along the line is schematically shown. The electronic device shown in FIG. 3 is a polymer organic EL element. The polymer organic EL element 30 includes a lower transparent conductive layer 32, a counter substrate 33 disposed to face the lower transparent conductive layer 32, and a lower surface in direct contact with a part of the upper surface of the lower transparent conductive layer 32. And a metal foil 37b fixed in a non-adhesive state on the upper surface of the lower transparent conductive layer 32, and an adhesive film bonded to the upper surface of the lower transparent conductive layer 32, the upper surface of the metal foil 37b, and the lower surface of the counter substrate 33 38b. Hereinafter, the polymer organic EL element 30 will be described in detail.

  As shown in FIG. 3, the polymer organic EL element 30 is provided with a lower transparent conductive layer 32 made of ITO or the like on the upper surface of a substrate glass 31. A light emitting layer 35 is provided on the upper surface of the lower transparent conductive layer 32. The light emitting layer 35 is made of a high molecular organic compound that emits light when a voltage is applied. Such a high molecular weight organic compound is not particularly limited as long as it is a conventionally known one, and examples thereof include polyparaphenylene vinyl (PPV), MEH-PPV, PF-based π-conjugated polymers, polyvinyl carbazole (PVK), Examples thereof include dye-containing polymers such as TPDPES and PVOXD. A counter substrate 33 is provided on the upper surface of the light emitting layer 35. In the counter substrate 33, an upper conductive layer 39 made of Al or the like and a ceramic or glass substrate 36 are sequentially laminated from the light emitting layer 35 side.

  Further, a metal foil 37 b is attached on the upper surface of the outer end of the lower transparent conductive layer 32. An adhesive film 38b is provided on the upper surface of the lower transparent conductive layer 32 closer to the center of the polymer organic EL element 30 than the metal foil 37b, and the metal foil 37b is bonded to the lower transparent conductive layer by bonding with the adhesive film 38b. 32 is fixed. Although the contact between the lower transparent conductive layer 32 and the metal foil 37b is ensured by direct contact, they are not bonded to each other. The metal foil 37b has one end in the width direction sandwiched between the lower transparent conductive layer 32 and the adhesive film 38b, and is attached to the lower transparent conductive layer 32 by the adhesive film 38b, and the other end in the width direction is externally attached. It extends.

  On the other hand, an adhesive film 38a having the same width as the adhesive film 38b is provided on the upper surface of the outer end of the lower transparent conductive layer 32 opposite to the outer end to which the metal foil 37b is attached. Yes. Further, a metal foil 37a is provided so as to be in contact with a part of the outer end side of the upper surface of the adhesive film 38a. The metal foil 37a is fixed by adhesion using an adhesive film 38a. Further, a part of the upper surface of the metal foil 37a is in direct contact with the upper conductive layer 39, and a contact between the upper conductive layer 39 and the metal foil 37a is secured thereby, but they are not bonded to each other. One end in the width direction of the metal foil 37a is sandwiched between the upper conductive layer 39 and the adhesive film 38a and attached to the upper conductive layer 39 with the adhesive film 38a, and the other end in the width direction extends to the outside. Yes.

  The constituent materials of the metal foils 37a and 37b may be the same as those of the metal foils 17a and 17b in the first embodiment. The constituent materials of the adhesive films 38a and 38b may be the same as those of the adhesive film 18 in the first embodiment.

  A counter substrate 33 is provided on the upper surfaces of the adhesive films 38a and 38b, and the counter substrate 33 is fixed by bonding with the adhesive films 38a and 38b. The width dimension of the counter substrate 33 is the same as that of the substrate glass 31. Further, an external circuit (not shown) and the metal foils 37a and 37b are connected to each other via a lead wire 34 joined to the metal foils 37a and 37b by, for example, spot welding.

  In the polymer organic EL element 30, the metal foil 37 b functions as an extraction electrode from the lower transparent conductive layer 32, and the metal foil 37 a functions as an extraction electrode from the upper conductive layer 39. When a voltage is externally applied to the lower transparent conductive layer 32 and the upper conductive layer 39 through the metal foils 37a and 37b, the light emitting layer 35 emits light, and the light is extracted to the outside through the lower transparent conductive layer 32 and the substrate glass 31. .

  As described above, the metal foils 37a and 37b serving as extraction electrodes are in direct contact with the lower transparent conductive layer 32 and the upper conductive layer 39, respectively, so that the connection reliability of the polymer organic EL element 30 is sufficiently excellent. Become. Further, since the metal foils 37a and 37b function as extraction electrodes used for connection to the external circuit, workability when connecting the external circuit to the lower transparent conductive layer 32 and the upper conductive layer 39 can be improved. .

  Furthermore, the metal foils 37a and 37b can save space compared to the clip electrode, or can be easily processed into various shapes as necessary. Moreover, even if the metal foils 37a and 37b have a complicated shape, the metal foils 37a and b can be easily processed into various shapes according to the shape, the contact resistance is reduced, and the appearance is made clear. Can do. Furthermore, since EVA that can be bonded at a temperature lower than 150 ° C. can be adopted as a constituent material of the adhesive films 38a and 38b, in that case, the material constituting each member of the polymer organic EL element 30 is used. High heat resistance is not required. In addition, since the metal foils 37a and 37b and the adhesive films 38a and 38b are easily deformed, by crushing this material, the distance between the upper surface of the lower transparent conductive layer 32 and the lower surface of the counter substrate 33 can be followed. .

  Such a polymer organic EL device 30 can be manufactured as follows. First, the lower transparent conductive layer 32 is formed on the substrate glass 31 by, for example, vacuum deposition. Next, metal foils 37a and 37b shown in FIG. 3 are prepared, and the metal foil 37b is placed on the upper surface of one outer end of the lower transparent conductive layer 32 so that the lower surface of the metal foil 37b is in direct contact. . At this time, the upper surface of the lower transparent conductive layer 32 and the lower surface of the metal foil 37b are not bonded. The metal foil 37b is aligned by pinning or the like.

  Next, the adhesive film 38b is placed on the exposed upper surfaces of both the lower transparent conductive layer 32 and the metal foil 37b, and the adhesive film 38a is placed on the other outer end upper surface of the lower transparent conductive layer 32. . At this time, the upper surface of the metal foil 37b is in direct contact with the lower surface of the adhesive film 38b, but the upper surface of the lower transparent conductive layer 32 may not be in direct contact with the lower surface of the adhesive film 38b. Of course, when the adhesive films 38a and 38b are placed, the upper surface of the lower transparent conductive layer 32 is brought into direct contact with the lower surface of the adhesive film 38b by pressing in the laminating direction and compressing the portion on the metal foil 37b. Also good.

  Subsequently, the metal foil 37a is placed on the upper surface on the outer end side of the adhesive film 38a. At this time, the metal foil 37a is temporarily fixed by lightly pressing the metal foil 37a against the adhesive film 38a. Next, the counter substrate 33 is placed on the upper surfaces of the adhesive film 38b, the metal foil 37a, and the adhesive film 38a. The counter substrate 33 is prepared by forming an upper conductive layer 39 on a ceramic or glass substrate 36 by, for example, vacuum deposition. Then, the adhesive films 38a and 38b are compressed by pressing them in the lamination direction by means such as pressure bonding, and the metal foil 37b, the upper conductive layer 39 and the adhesive film 38a are compressed between the lower transparent conductive layer 32 and the adhesive film 38b. At the same time as fixing the metal foil 37a therebetween, the counter substrate 33 is fixed to face the lower transparent conductive layer 32 via the adhesive films 38a and 38b. At this time, a space surrounded by the lower transparent conductive layer 32, the adhesive films 38a and 38b, and the counter substrate 33 is formed. The space is filled with a polymer organic material that is a constituent material of the light emitting layer 35 from an injection hole (not shown) penetrating from the outside into the space, and then the light emitting layer 35 is formed by closing the injection hole. The In this way, the polymer organic EL element 30 is obtained.

  According to the method for manufacturing the polymer organic EL element 30, the metal foils 37b and a are fixed between the lower transparent conductive layer 32 and the adhesive film 38b and between the upper conductive layer 39 and the adhesive film 38a, respectively, and at the same time, the adhesive films 38a, Since the counter substrate 33 is fixed to be opposed to the lower transparent conductive layer 32 via b, the manufacturing process can be simplified as compared with the conventional method.

  FIG. 4 is a cross-sectional view schematically showing a connection structure of an electronic device according to a preferred third embodiment of the present invention. The electronic device shown in FIG. 4 is a low molecular organic EL element. The low molecular organic EL element 40 includes a lower transparent conductive layer 42, an upper substrate glass 46 that is a substrate disposed to face the lower transparent conductive layer 42, and a part of the upper surface of the lower transparent conductive layer 42. Metal foils 47a, b having a lower surface in contact and fixed in an unbonded state on the upper surface of the lower transparent conductive layer 42; upper surfaces of the lower transparent conductive layer 42; upper surfaces of the metal foils 47a, b; It has a connection structure including an adhesive film 48 adhered to the lower surface of the glass 46. Hereinafter, the low molecular organic EL element 40 will be described in detail.

  As shown in FIG. 4, the low molecular organic EL element 40 is provided with a lower transparent conductive layer 42 made of ITO or the like on the upper surface of the lower substrate glass 41, and one of the lower transparent conductive layers 42 is provided. The isolation part 42a is provided by forming a groove 42b in the part. The lower transparent conductive layer 42 is composed of two parts, an isolation part 42a and a main body part 42c, which are isolated by a groove 42b in order to provide two extraction electrodes. The width dimension of the lower transparent conductive layer 42 including the isolation part 42 a and the main body part 42 c is the same as that of the lower substrate glass 41. On the upper surface of the lower transparent conductive layer 42, a hole injection layer 43a made of phthalocyanines or the like and a hole transport layer 43b made of arylamines or the like are provided in this order. A light emitting layer 45 is laminated on the upper surface of the hole transport layer 43b, and an electron transport layer 49 such as oxadiazoles is provided on the upper surface (hereinafter referred to as a hole injection layer 43a, a hole transport layer). 43b, the light emitting layer 45, and the electron transport layer 49 are referred to as “EL laminate”). An upper transparent conductive layer 44 made of ITO or the like is formed on the upper surface of the electron transport layer 49.

  The light emitting layer 45 is made of a low molecular organic compound that emits light when a voltage is applied. Such low molecular weight organic compounds are not particularly limited as long as they are conventionally known, and examples thereof include aluminum complexes, anthracenes, rare earth complexes, iridium complexes, and the like. Further, these low molecular organic compounds may be included as a host material, and fluorescent dyes such as perylene and rubrene may be included as a dopant material.

  Further, metal foils 47a and 47b are attached to the upper surface of the outer end of the main body portion 42c of the lower transparent conductive layer 42 and the upper surface of the outer end of the isolation portion 42a, respectively. A part of the lower surface of the metal foils 47 a and 47 b is in contact with a part of the upper surface of the lower transparent conductive layer 42. An adhesive film 48 is provided so as to cover the lower substrate glass 41, the lower transparent conductive layer 42, the EL laminate, the upper transparent conductive layer 44, and the metal foils 47a and 47b from above. However, since the adhesive film 48 has the same width as the lower substrate glass 41, a part of the outside of the metal foils 47 a and b is exposed without being covered with the adhesive film 48. The metal foils 47a and 47b are fixed on the main body part 42c and the isolation part 42a of the lower transparent conductive layer 42 by the adhesion by the adhesive film 48, respectively. Although the contact between the lower transparent conductive layer 42 and the metal foils 47a and 47b is ensured by direct contact, they are not bonded to each other.

  The constituent materials of the metal foils 47a, b may be the same as those of the metal foils 17a, b in the first embodiment. The constituent material of the adhesive film 48 may be the same as that of the adhesive film 18 in the first embodiment.

  Further, an upper substrate glass 46 is provided on the upper surface of the adhesive film 48, and the upper substrate glass 46 is fixed by adhesion with the adhesive film 48. The upper transparent conductive layer 44 is in direct contact with the upper surface of the isolation part 42a on the lower surface, and the main body part 42c and the upper transparent conductive layer 44 of the lower transparent conductive layer 42 are formed so as not to short-circuit each other. Furthermore, the electrode of the upper transparent conductive layer 44 can be taken out from the isolation part 42a. That is, the hole injection layer 43a is also formed in the groove 42b, and there is a hole between the main body portion 42c of the lower transparent conductive layer 42 and the isolation portion 42a of the upper transparent conductive layer 44 and the lower transparent conductive layer 42. The injection layer 43a is sandwiched.

  The width of the upper transparent conductive layer 44 is a dimension that covers most of the EL laminate from the center of the low molecular organic EL element 40 of the isolation part 42a. The width dimension of the upper substrate glass 46 is the same as that of the lower substrate glass 41. Further, although not shown, the external circuit and the metal foils 47a and 47b are connected via lead wires joined to the metal foils 47a and 47b by, for example, spot welding.

  The metal foils 47a and 47b of the low molecular organic EL element 40 function as extraction electrodes, and when a voltage is applied between the lower transparent conductive layer 42 and the upper transparent conductive layer 44 from the outside, the light emitting layer 45 emits light. To do.

  Thus, when the metal foils 47a and 47b serving as extraction electrodes are in direct contact with the lower transparent conductive layer 42, the connection reliability of the low molecular organic EL element 40 is sufficiently excellent. Further, since the metal foils 47a and 47b function as extraction electrodes used for connection to the external circuit, workability when connecting the external circuit and the lower transparent conductive layer 42 can be improved.

  Furthermore, even if the metal foils 47a and 47b have a complicated shape, the metal foils 47a and b can be easily processed into various shapes according to the shape, the contact resistance is reduced, and the appearance is made clear. Can do. Moreover, since EVA etc. which can be adhere | attached at the temperature lower than 150 degreeC can be employ | adopted as a constituent material of the adhesive film 48, in that case, it is highly heat-resistant to the material which comprises each member of the low molecular organic EL element 40 Sex is not required. Further, since the metal foils 47a and 47b and the adhesive film 48 are easily deformed, the sealing between the substrate glasses 41 and 46 of the low molecular organic EL element 40 can be improved by crushing this material.

  FIG. 5 is a cross-sectional view schematically showing an electronic device connection structure according to a preferred fourth embodiment of the present invention. The electronic device shown in FIG. 5 is a liquid EC element. The liquid EC element 50 shown in FIG. 5 is in direct contact with the lower transparent conductive layer 52, the counter substrate 53 disposed to face the lower transparent conductive layer 52, and a part of the upper surface of the lower transparent conductive layer 52. A metal foil 57b having a lower surface and fixed in a non-adhering state on the upper surface of the lower transparent conductive layer 52, and bonded to the upper surface of the lower transparent conductive layer 52, the upper surface of the metal foil 57b, and the lower surface of the counter substrate 53 It has a connection structure comprising an adhesive film 58b. Hereinafter, the liquid EC element 50 will be described in detail.

  As shown in FIG. 5, the liquid EC element 50 is provided with a lower transparent conductive layer 52 made of ITO or the like on the upper surface of a substrate glass 51. Further, a metal foil 57 b is attached on the upper surface of the outer end of the lower transparent conductive layer 52. An adhesive film 58b is provided on the upper surface of the lower transparent conductive layer 52 closer to the center of the liquid EC element 50 than the metal foil 57b, and the metal foil 57b is bonded to the lower transparent conductive layer 52 by the adhesion by the adhesive film 58b. It is fixed on the top. Although the contact between the lower transparent conductive layer 52 and the metal foil 57b is ensured by direct contact, they are not bonded to each other. One end in the width direction of the metal foil 57b is sandwiched between the lower transparent conductive layer 52 and the adhesive film 58b and attached to the lower transparent conductive layer 52 by the adhesive film 58b, and the other end in the width direction is externally attached. It extends.

  On the other hand, an adhesive film 58a having the same width as the adhesive film 58b is provided on the upper surface of the outer end of the lower transparent conductive layer 52 opposite to the outer end to which the metal foil 57b is attached. Yes. Further, a metal foil 57a is provided so as to be in contact with a part of the outer end side of the upper surface of the adhesive film 58a. The metal foil 57a is fixed by adhesion using an adhesive film 58a. Further, the metal foil 57a has a part of its upper surface directly in contact with the upper transparent conductive layer 59 made of ITO or the like, and the contact between the upper transparent conductive layer 59 and the metal foil 57a is secured thereby. They are not adhered to each other. One end in the width direction of the metal foil 57a is sandwiched between the upper transparent conductive layer 59 and the adhesive film 58a and attached to the upper transparent conductive layer 59 by the adhesive film 58a, and the other end in the width direction is externally attached. It extends.

  The constituent materials of the metal foils 57a and 57b may be the same as those of the metal foils 17a and 17b in the first embodiment. The constituent materials of the adhesive films 58a and 58b may be the same as those of the adhesive film 18 in the first embodiment.

  A counter substrate 53 is provided on the upper surfaces of the adhesive films 58a and 58b, and the counter substrate 53 is fixed by bonding with the adhesive films 58a and 58b. In the counter substrate 53, the upper transparent conductive layer 59 and the ceramic or glass substrate 56 are sequentially laminated from the lower side. The width dimension of the counter substrate 53 is the same as that of the substrate glass 51. Further, an external circuit (not shown) and the metal foils 57a and 57b are connected to each other through lead wires joined to the metal foils 57a and 57b by, for example, spot welding.

  A liquid EC material 55 is sealed in a space formed by the lower transparent conductive layer 52, the adhesive films 58a and 58b, and the counter substrate 53. The liquid EC material 55 is obtained by dissolving an electrolyte (ionic organic compound) and a color former (aromatic compound having two carbonyl groups) in a nitrogen-containing polar solvent. The liquid EC material 55 is filled in the space by filling the space from an injection hole (not shown) penetrating into the space from the outside and then closing the injection hole.

  In the liquid EC element 50, the metal foil 57b functions as an extraction electrode from the lower transparent conductive layer 52, and the metal foil 57a functions as an extraction electrode from the upper transparent conductive layer 59. When a voltage is applied from the outside to the lower transparent conductive layer 32 and the upper conductive layer 39 through the metal foils 57a and 57b, the liquid EC material 55 is colored, and when a reverse voltage is applied, the liquid EC material 55 is decolored. .

  As described above, the metal foils 57a and 57b serving as the extraction electrodes are in direct contact with the lower transparent conductive layer 52 and the upper transparent conductive layer 59, respectively, so that the connection reliability of the liquid EC element 50 is sufficiently excellent. Become. Further, since the metal foils 57a and 57b function as take-out electrodes used for connection to the external circuit, workability when connecting the external circuit to the lower transparent conductive layer 52 and the upper transparent conductive layer 59 can be improved. it can. Furthermore, since EVA or the like that can be bonded at a temperature lower than 150 ° C. can be adopted as the constituent material of the adhesive films 58a and 58b, the material constituting each member of the liquid type EC element 50 in that case is highly advanced. Heat resistance is not required. In addition, since the metal foils 57a and 57b and the adhesive films 58a and 58b are easily deformed, by crushing this material, the distance between the upper surface of the lower transparent conductive layer 52 and the lower surface of the counter substrate 53 can be followed. .

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment. The present invention can be variously modified without departing from the gist thereof.

  For example, the electronic device connection structure of the present invention can be applied to a dye-sensitized solar cell. FIG. 6 is a schematic cross-sectional view showing an example of a dye-sensitized solar cell having the electronic device connection structure of the present invention. In the dye-sensitized solar cell 60 shown in FIG. 6, a lower transparent conductive layer 62 made of ITO or the like is provided on the upper surface of a substrate glass 61. Further, a metal foil 67 b is attached on the upper surface of the outer end of the lower transparent conductive layer 62. An adhesive film 68b is provided on the upper surface of the lower transparent conductive layer 62 closer to the center of the dye-sensitized solar cell 60 than the metal foil 67b, and the metal foil 67b is bonded to the lower transparent conductive layer by the adhesive film 68b. Fixed on the layer 62. Although the contact between the lower transparent conductive layer 62 and the metal foil 67b is ensured by direct contact, they are not bonded to each other. One end in the width direction of the metal foil 67b is sandwiched between the lower transparent conductive layer 62 and the adhesive film 68b, and is attached to the lower transparent conductive layer 62 by the adhesive film 68b, and the other end in the width direction is externally attached. It extends.

On the other hand, an adhesive film 68a having a width similar to that of the adhesive film 68b is provided on the upper surface of the outer end of the lower transparent conductive layer 62 opposite to the outer end to which the metal foil 67b is attached. Yes. Further, a metal foil 67a is provided so as to be in contact with a part of the outer end side of the upper surface of the adhesive film 68a. The metal foil 67a is fixed by bonding with an adhesive film 68a. The metal foil 67a has a part of its upper surface directly in contact with the upper transparent conductive layer 69 made of ITO or the like, and the contact between the upper transparent conductive layer 69 and the metal foil 67a is thereby secured. They are not adhered to each other. The metal foil 67a has one end in the width direction sandwiched between the upper transparent conductive layer 69 and the adhesive film 68a, and is attached to the upper transparent conductive layer 69 by the adhesive film 68a. It extends. In addition, a TiO ₂ layer 64 that adsorbs a pigment is laminated between the adhesive films 68 a and 68 b on the lower transparent conductive layer 62.

  The constituent material of the metal foils 67a and 67b may be the same as that of the metal foils 17a and 17b in the first embodiment. The constituent materials of the adhesive films 68a and 68b may be the same as those of the adhesive film 18 in the first embodiment.

  An upper substrate 63 is provided on the upper surfaces of the adhesive films 68a and 68b, and the upper substrate 63 is fixed by bonding with the adhesive films 68a and 68b. The upper transparent conductive layer 69 and the glass substrate 66 are sequentially laminated on the upper substrate 63 from the lower side. The width dimension of the upper substrate 63 is the same as that of the substrate glass 61. Further, the external device (not shown) and the metal foils 67a and 67b are connected to each other through lead wires joined to the metal foils 67a and 67b by, for example, spot welding.

An electrolyte solution 65 such as an iodine solution is enclosed in a space formed by the TiO ₂ layer 64, the adhesive films 68a and 68b, and the upper substrate 63. The electrolyte solution 65 is filled in the space by filling the space from an injection hole (not shown) penetrating into the space from the outside, and then closing the injection hole.

In the dye-sensitized solar cell 60, the metal foil 67b functions as an extraction electrode from the lower transparent conductive layer 62, and the metal foil 67a functions as an extraction electrode from the upper transparent conductive layer 69. When the lower transparent conductive layer 62 is irradiated with sunlight, the dye of the TiO ₂ layer 64 absorbs light and emits electrons, so that the electrons move between the lower transparent conductive layer 62 and the upper transparent conductive layer 69, and Current flows due to the oxidation-reduction reaction of the electrolyte solution. Thus, an external device (not shown) connected between the lower transparent conductive layer 62 and the upper transparent conductive layer 69 is driven.

  Further, the electronic device connection structure of the present invention can be applied to a liquid crystal panel. FIG. 7 is a schematic cross-sectional view showing an example of a liquid crystal panel provided with the electronic device connection structure of the present invention. In the liquid crystal panel 70, a polarizing plate 71a, a TFT array substrate 71b, a glass substrate 71c provided with a bus line, and a TFT dot electrode 72 are sequentially laminated. Further, metal foils 77a and 77b are provided on the upper surface of the outer end on the glass substrate 71c, and these are fixed to the glass substrate 71c by adhesive films 78a and 78b. The adhesive films 78a and 78b also adhere the color filter substrate 79 including the RGB filter 79a, the glass substrate 79b, and the polarizing plate 79c facing the glass substrate 71c to the glass substrate 71c. Further, an Ag paste 82 is provided inside the adhesive films 78a and 78b, and a common electrode 76 is provided below the RGB filter 79a. A polyimide alignment film 73 is formed on the surfaces of the TFT dot electrode 72 and the common electrode 76, and a gap spacer 74 is disposed so as to ensure a gap between them. A liquid crystal material 75 is sealed between the TFT dot electrode 72 and the common electrode 76. The liquid crystal material 75 is injected by being injected from an injection hole provided in the adhesive film 78 b, and then the injection hole is sealed with a sealing material 81.

  Moreover, although the metal foil in each said embodiment is being fixed with the adhesive film, in order to strengthen the fixation further, the outer frame which presses each above-mentioned electronic device to the up-down direction (lamination direction of each member) May be provided. Furthermore, the environmental resistance of the electronic device can be improved by providing the outer frame so that the metal foil and the adhesive film can be shielded from the external environment.

1 is a schematic cross-sectional view showing a solid-state EC element according to a preferred embodiment of the present invention. It is a schematic cross section of the mirror apparatus using the electronic device shown in FIG. 1 is a schematic cross-sectional view showing a polymer organic EL device according to a preferred embodiment of the present invention. It is a schematic cross section which shows the low molecular organic EL element which concerns on suitable embodiment of this invention. 1 is a schematic cross-sectional view showing a liquid EC element according to a preferred embodiment of the present invention. It is a schematic cross section which shows the dye-sensitized solar cell which concerns on embodiment of this invention. It is a schematic cross section which shows the liquid crystal panel which concerns on suitable embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Solid type EC element 11, 31 ... Substrate glass, 12, 32 ... Lower transparent conductive layer, 13 ... EC layer, 14 ... Upper transparent conductive layer, 16 ... Opposite glass, 17a, 17b, 37a, 37b ... Metal foil , 18, 38a, 38b ... adhesive film, 30 ... polymer organic EL element, 33 ... counter substrate, 35 ... light emitting layer, 36 ... glass substrate, 39 ... upper conductive layer.

Claims (2)

A conductive layer;
A substrate disposed opposite the conductive layer;
A metal foil having a lower surface in direct contact with a portion of the upper surface of the conductive layer, and fixed in an unbonded state on the upper surface of the conductive layer;
An adhesive film adhered to the upper surface of the conductive layer, the upper surface of the metal foil, and the lower surface of the substrate;
An electronic device connection structure comprising: Placing the metal foil on the upper surface of the conductive layer in a non-adhered state so that a part of the upper surface of the conductive layer is in direct contact with the lower surface of the metal foil;
Placing an adhesive film on the exposed upper surfaces of both the conductive layer and the metal foil;
Placing the substrate on the top surface of the adhesive film;
The conductive layer, the metal foil, the adhesive film and the substrate are pressed in the laminating direction to fix the metal foil on the upper surface of the conductive layer with the adhesive film, and at the same time through the adhesive film Fixing the substrate to face the conductive layer;
A method for manufacturing a connection structure of an electronic device having

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