JP2008091558A - Heat dissipator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipator which can well dissipate the heat from heating elements while keeping a sufficient mechanical strength and maintenance easiness. <P>SOLUTION: A heat conductive sheet 3 having an elasticity and a metallic heat dissipation cover 4 are sequentially brought into contact with the top faces of a plurality of heating elements 1 arranged on an installation plate 2 to secure heat dissipation passages not only in the downward direction from the installation position of the heating elements but also in the upward direction. When securing the heat dissipation cover 4 to the installation plate 2 by screws 5, the heat conductive sheet 3 is so held as to be put between the top faces of the heating elements 1 and the heat dissipation cover 4 by tightening the screws 5. The heat dissipation cover 4 can be removed by loosening the screws 5. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heat radiating device, and more particularly to a heat radiating device suitable for an electronic device that is required to have severe environmental resistance, such as for an aircraft.

  Conventionally, heat dissipation methods having various structures have been devised in order to dissipate heat generated from electronic components constituting electronic devices and the like. An example is shown in the cross-sectional view of FIG.

  In the example shown in FIG. 2, for example, a plurality of heating elements 11 (11 a to 11 d) such as semiconductor amplification elements and integrated circuits are attached in contact with the metal attachment plate 12. Heat from these heating elements 11 is mainly conducted from the mounting contact site to the metal mounting plate 12 (downward in FIG. 2) and dissipated, and the mounting plate 12 serves as a machine component of the electronic device. The strength is also maintained. With the higher integration of semiconductor integrated circuits and higher output of semiconductor amplifying elements, the amount of heat generated from these electronic components and elements is also increasing. Therefore, in order to dissipate heat more efficiently, forced air cooling and Techniques such as water cooling are also adopted.

Also, for example, in various portable electronic devices that are miniaturized and mounted with high density, a heat conductive sheet is used to generate heat from the inside of the device without providing a metal heat sink, exhaust fan, ventilation hole, etc. Examples of use and conduction to exterior parts are also disclosed (for example, see Patent Document 1).
Japanese Patent Laying-Open No. 2005-197601 (5th page, FIG. 1)

  By the way, in the case of an electronic device mounted on an aircraft, it is strongly required to reduce the size and weight of the device because it is mounted together with other various equipment in a limited space inside the aircraft. At the same time, mechanical environmental resistance such as vibration resistance and impact resistance must be adequately matched. In recent years, semiconductor elements and the like that have been highly integrated and have high output are often mounted at a higher density to cope with such a reduction in size and weight.

  However, these semiconductor elements and the like consume a large amount of power and generate a large amount of heat because of the high integration and high output. Therefore, it is necessary to provide as many heat conduction paths as possible to dissipate heat from the heating elements, and to provide a heat dissipation structure to ensure an area contributing to heat dissipation in consideration of mechanical environmental resistance. there were.

  In addition, periodic inspection and maintenance are essential for electronic equipment mounted on aircraft, and when installing such a heat dissipation structure, workability when inspecting and maintaining the target electronic equipment has been fully considered. It was desired to be a thing.

  The present invention has been made in consideration of the above-described circumstances, and an object of the present invention is to provide a heat radiating device that dissipates heat from a heat generating element satisfactorily while maintaining sufficient mechanical strength and maintainability. .

  In order to achieve the above object, a heat dissipating device of the present invention includes a heat conductive sheet disposed on a plurality of heat generating elements disposed on a mounting plate in contact with the heat generating elements, and the heat conductive sheet. A heat dissipating cover arranged to cover the upper surface of the heat dissipating member and a screw for fixing the heat dissipating cover to the mounting plate. By tightening the screw, the heat conductive sheet is attached to the plurality of heating elements and the heat dissipating cover. It is mechanically held between the two.

  According to the present invention, it is possible to obtain a heat dissipating device that can dissipate heat from the heating element satisfactorily while maintaining sufficient mechanical strength and maintainability.

  Below, the best form for implementing the thermal radiation apparatus which concerns on this invention is demonstrated with reference to FIG.

  FIG. 1 is a cross-sectional view showing an embodiment of a heat dissipation device according to the present invention. In FIG. 1, a plurality of heating elements 1 (1 a to 1 d) are mounted on a mounting plate 2. These heating elements 1 are, for example, high-power semiconductor amplifying elements or semiconductor integrated circuits, and are different in height from the mounting plate 2. The mounting plate 2 is made of metal, for example.

  On the upper side of these heat generating elements 1, a heat conductive sheet 3 is disposed so as to be in contact with each element so as to cover the elements. In this embodiment, the heat conductive sheet 3 is made of elastic silicon rubber.

  Further, a metal heat radiation cover 4 is disposed on the heat conductive sheet 3 so as to cover the entire sheet. In the present embodiment, the heat radiation area is enlarged by providing the heat radiation cover 4 with fins 4a. The heat dissipating cover 4 is fastened and fixed to the mounting plate 2 by screws 5 (5a and 5b), and is disposed between the plurality of heat generating elements 1 and the heat dissipating covers 4 by tightening the screws 5. The thermally conductive sheet 3 is mechanically held so as to be sandwiched in contact with both.

  In the structure of FIG. 1 described above, since the plurality of heating elements 1 are attached to the metal mounting plate 2, the heat from these heating elements 1 is attached to the mounting plate 2 from the mounting contact portion with the mounting plate 2. 1 (downward in FIG. 1) and dissipate, and also conduct in the direction (upward in FIG. 1) of the heat conductive sheet 3 placed in contact with the upper side. Then, it is conducted and diffused from the heat conductive sheet 3 to the heat radiating cover 4. Furthermore, since the heat dissipation cover 4 is fixed to the mounting plate 1 with screws 5, a heat conduction path is also formed between the heat dissipation cover 4 and the mounting plate 2.

  As described above, in this embodiment, the heat conductive sheet 3 and the metal heat radiation cover 4 are sequentially placed on the upper side of the plurality of heat generating elements 1 attached to the mounting plate 2, and each heat generating element 1 is arranged. Since the heat dissipation path is secured not only in the lower direction of attachment of the element but also in the upper direction with respect to (1a to 1d), heat from each heating element 1 (1a to 1d) can be dissipated well. Can do.

  Further, the heat dissipation cover 4 is firmly and mechanically fixed integrally with the mounting plate 2 by screws 5. In addition, the heat conductive sheet 3 disposed in contact with the plurality of heat generating elements 1 by tightening the screws 5 when fixing is fixed between the upper surfaces of the plurality of heat generating elements 1 and the heat radiation cover 4. It is held mechanically well so as to be sandwiched. In addition, since the heat conductive sheet 3 has elasticity, there is a case where the heights of the respective heating elements 1 (1a to 1d) from the mounting plate 2 are different from each other, an element mounting error or a dimensional error. Even in this case, the contact between each of the heating elements 1 (1a to 1d) and the heat conductive sheet 3 can be kept good.

  Therefore, a mechanically stable heat dissipation path is ensured even when applied to equipment that requires particularly strict environmental resistance with respect to vibration resistance and impact resistance, such as electronic equipment mounted on aircraft, and good heat dissipation effect Can be obtained.

  Further, normally, the heat dissipation device is fixed to the mounting plate 2 and can be easily handled as an integrated module including a heating element. On the other hand, during inspection and maintenance, the screw 5 is loosened and fixed to the mounting plate 2. By removing the radiating cover 4, the heat generating elements such as a semiconductor integrated circuit and a semiconductor amplifying element and their peripheral parts can be easily accessed directly, and good workability can be ensured.

  Note that the present invention is not limited to the above-described embodiments as they are, and can be embodied by variously modifying the constituent elements without departing from the spirit of the invention in the implementation stage.

Sectional drawing which shows one Example of the thermal radiation apparatus concerning this invention. Sectional drawing which shows an example of the conventional heat dissipation structure.

Explanation of symbols

1 Heating Element 2 Mounting Plate 3 Thermal Conductive Sheet 4 Heat Dissipation Cover 5 Screw

Claims (3)

A heat conductive sheet disposed on and in contact with the heat generating elements on a plurality of heat generating elements disposed on the mounting plate;
A heat dissipation cover arranged to cover the upper surface of the thermally conductive sheet;
A screw for fixing the heat dissipation cover to the mounting plate;
A heat dissipating device characterized in that the heat conductive sheet is mechanically held between the plurality of heat generating elements and the heat dissipating cover by tightening the screw.   The heat dissipation device according to claim 1, wherein the heat conductive sheet has elasticity.   The heat dissipation device according to claim 1, wherein the thermally conductive sheet is made of silicon rubber.

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