JP2007278860A5 - - Google Patents

Description

Electrical connection device

  The present invention relates to an electrical connection device used for an energization test of a flat test object such as an integrated circuit or a display substrate.

  A flat test object such as an integrated circuit or a display substrate is subjected to an energization test using an electrical connection device such as a probe card. During the energization test, the object to be inspected is pressed with the contact of the electrical connection device against the electrode and energized in that state.

  As one of the electrical connection devices of this type, a flexible device in which a contact is soldered to each wiring of a flexible sheet-like member such as an FPC in which a plurality of wirings are formed on a flexible electrically insulating sheet. There is a technology that uses a circuit board (Patent Document 1).

JP 2002-311049 A

  In the prior art, each contact includes a pedestal portion coupled to the wiring at one end, an arm portion extending in the longitudinal direction of the wiring from the other end of the pedestal portion, and a pedestal portion from the tip of the arm portion. And a needle tip portion protruding on the opposite side. The arm portion and the needle tip portion act as a main body portion that substantially elastically deforms in the arm portion when the tip of the needle tip portion, that is, the needle tip is pressed against the electrode of the object to be inspected.

  A circuit board using such a contact is attached to a support board such as a wiring board by an attachment device so that the needle tip can be directed to the object to be inspected, and is assembled into an electrical connection device.

  The mounting device includes a first reinforcing plate (plate-shaped member) disposed on the upper surface of the wiring board, and a ring-shaped member disposed on the stepped portion so as to be positioned on the downward facing stepped portion provided in the center of the wiring substrate. A second reinforcing plate (ring-shaped member), a leaf spring screwed to the lower side of the second reinforcing plate, and a base having at least an attachment surface on the lower side, and the attachment surface protrudes below the support substrate And a table (block) screwed to the lower side of the leaf spring.

  The first reinforcing plate is attached to the wiring substrate by a plurality of mounting screws that pass through the first reinforcing plate and the wiring substrate in the vertical direction and are screwed to the second reinforcing plate. A reinforcing plate is attached to the wiring board.

  The circuit board is bonded to the mounting surface of the base in the contactor area where the contactor is disposed, and a ring-shaped presser plate and a lower surface of the wiring board at the outermost peripheral part of the outer peripheral area around the contactor area It is attached by a plurality of set screws.

  After the electrical connection device as described above is attached to an inspection device such as a prober, the needle tip of the contact is pressed against the electrode of the device under test, and the contact is energized in that state. Thereby, an energization test is performed.

  If the virtual needle tip surface formed by all the needle tips is inclined with respect to the wiring board or the object to be inspected, the leaf spring is elastically deformed by pressing the needle tip against the object to be inspected. As a result, the contact area and the needle tip surface are automatically corrected in parallel with the wiring board or the inspection apparatus.

  However, in a conventional electrical connection device, a stainless steel plate having a large amount of thermal expansion and contraction due to heating and cooling is used as a leaf spring, although this is often used in a burn-in test for heating or cooling an object to be inspected. Used.

  For this reason, in the conventional electrical connection device, the leaf spring irregularly heats and expands as the object to be inspected is heated or cooled, and the position of the tip of the contact with respect to the electrode of the object to be inspected is displaced. As a result, the needle tip is damaged and the electrical contact state of the needle tip with respect to the electrode of the object to be inspected is different.

  An object of the present invention is to prevent displacement of the needle tip position accompanying heating or cooling of an object to be inspected.

  An electrical connection device according to the present invention has an upper surface and a lower surface, a support substrate having a through hole in the center, and is assembled to the support substrate so as to be positioned in the through hole or opposed to the through hole. A leaf spring, a block having an attachment surface directed downward, and a block attached to the lower side of the leaf spring so that at least the attachment surface protrudes downward from the support substrate, and a plurality of contacts Is a flexible circuit board having a contactor region in which the contactor region is disposed and an outer region around the contactor region, wherein at least the contactor region is opposed to the mounting surface of the block. And a circuit board attached to the lower surface of the support substrate. The leaf spring is made of a material having a thermal expansion coefficient smaller than that of stainless steel.

  According to the present invention, since the leaf spring made of a material having a smaller thermal expansion coefficient than that of stainless steel is used, the thermal expansion and contraction of the leaf spring accompanying the heating or cooling of the object to be inspected and the displacement of the needle tip position are small. As a result, damage to the needle tip and poor contact of the needle tip with the electrode of the object to be inspected are prevented.

  The leaf spring may be made of a material selected from the group comprising tungsten, molybdenum, alloys thereof and ceramic.

  The leaf spring may have a thickness dimension of 0.1 mm to 0.25 mm. By doing so, the amount of deflection of the leaf spring due to overdrive becomes an optimum value, and irregular deflection of the leaf spring is prevented.

  When an overdrive is applied to the contact, the leaf spring may have a deflection amount twice as large as that of the contact. By doing so, the deflection amount of the leaf spring and the contact due to overdrive becomes an optimum value, and irregular deflection of the leaf spring and the contact is prevented.

  The leaf spring is integrally formed around a flat central region, a plurality of plate-like regions extending from the central region in the radial direction of the virtual circle at intervals in the circumferential direction of the virtual circle, and the plate-like region. And a ring-shaped peripheral region, and is assembled to the support substrate in the peripheral region, and the block may be attached to the central region. By doing so, the leaf spring is uniformly elastically deformed when the overdrive acts on the contact. As a result, irregular bending of the leaf spring is reliably prevented.

  The block has a downward facing surface of a truncated polygonal pyramid formed by the mounting surface, an intermediate surface that continues around the mounting surface, and a slope that continues around the intermediate surface, and the contact region and A part of the outer region that continues around may be opposed to the attachment surface and the intermediate surface, respectively, and a remaining part of the outer region may be opposed to the slope.

  [Terminology]

  In the present invention, in FIG. 1, the left-right direction is referred to as the X direction or the left-right direction, the front-rear direction is referred to as the front-rear direction or the Y direction, and the up-down direction is referred to as the up-down direction or the Z direction. However, these directions differ depending on the posture in which the inspection object is arranged in the inspection apparatus, that is, the posture of the inspection object arranged in the inspection apparatus.

  Therefore, the above direction is determined so that the X direction and the Y direction are in any one of the horizontal plane, the inclined plane inclined with respect to the horizontal plane, and the vertical plane perpendicular to the horizontal plane according to the actual inspection apparatus. Alternatively, it may be determined to be a combination of these surfaces.

  The electrical connection device 10 is used in the same way as a probe card for an energization test of a rectangular integrated circuit (not shown). The integrated circuit has a plurality of electrodes. In the example shown in FIG. 9, these electrodes are arranged in two rows at intervals in the left-right direction (or front-rear direction).

  Referring to FIGS. 1 to 13, the electrical connection device 10 is arranged on a disk-like support substrate 12, a plate-like member 14 attached to the upper surface of the support substrate 12, and a lower side of the plate-like member 14. The plate-shaped ring-shaped member 16, the plate spring 18 disposed on the lower side of the ring-shaped member 16, a table or block 20 mounted on the lower surface of the plate spring 18, and the lower side of the block 20. A plurality of adjustment screws that pass through the plate-like member 14 in the thickness direction thereof and abut against the ring-like member 16. 26 (see FIGS. 2 and 3).

  The support substrate 12 has a through hole 28 that penetrates the center of the support substrate 12 in the thickness direction (vertical direction), and has a plurality of tester lands 30 (see FIG. 2) connected to the tester at the peripheral edge of the upper surface. A plurality of connection lands 32 (see FIGS. 5 and 13) are provided at intervals in the circumferential direction on the lower surface of the region between the through hole 28 and the outer peripheral edge. The through hole 28 has a circular planar shape.

  The support substrate 12 also has a plurality of wirings (conductive paths) that connect the tester lands 30 and the connection lands 32 in a one-to-one manner. Such a support plate 12 can be a wiring board manufactured from a glass-filled epoxy resin or a ceramic material.

  The plate member 14 has a disk shape larger than the through hole 28, and the through hole 28 is formed by a plurality of screw members 34 that pass through the plate member 14 and are screwed to the support substrate 12. It is attached to the upper surface of the support substrate 12 in a closed state, that is, parallel to the support substrate 12.

  The plate-like member 14 is made of a metal material such as stainless steel so as to act as a reinforcing plate for the support substrate 12. For this reason, the plate-like member 14 does not have to be a complete plate. Like a leaf spring 18 described later, the plate-like member 14 has a flat central portion and a virtual center spaced from the central portion in the circumferential direction of the virtual circle. It may have a plate shape by a plurality of extending portions extending in the radial direction of the circle and an outer peripheral portion connected to the tips of these extending portions and extending in the circumferential direction of the virtual circle.

  As shown in FIG. 6, the ring-shaped member 16 is also formed in the shape of a plate-like ring having an outer diameter that is slightly smaller than the diameter of the through hole 28 using a metal material such as stainless steel, particularly a metal material having a low coefficient of thermal expansion. And is located in the through hole of the support substrate 12.

  The ring-shaped member 16 is parallel to the support substrate 12 and the plate-shaped member 14 by a plurality of mounting screws 36 that pass through the plate-shaped member 14 in the thickness direction and are screwed to the ring-shaped member 16. 14 is attached to the lower surface.

  As shown in FIG. 6, the leaf spring 18 includes a flat central region 38, a plurality of plate-like regions 39 extending from the central region 38 in the radial direction of the virtual circle at intervals in the circumferential direction of the virtual circle, And a ring-shaped peripheral region 40 that continues integrally around the region 39.

  The central region 38 and the plate-like region 39 have a star (*) shape. The number of the plate-like regions 39 can be an appropriate value such as 4, 6, 8, or the like. In the illustrated example, the number of the plate-like regions 39 is four. Therefore, the central region 38 and the plate-like region 39 have a cross shape that intersects with the central region 38.

  The leaf spring 18 is made of a material selected from the group including tungsten, molybdenum, their alloys, and ceramic materials that have a thermal expansion coefficient less than that of stainless steel.

  The thickness dimension of the leaf spring 18 can be about 0.1 mm to 0.25 mm. If the thickness dimension of the leaf spring 18 exceeds 0.1 mm, the rigidity of the leaf spring itself becomes too large, and if it is less than 0.25 mm, the spring property of the leaf spring itself becomes too small. As a result, if the thickness dimension of the leaf spring 18 is within the above range, the amount of deflection of the leaf spring 18 due to overdrive described later becomes an optimum value, and irregular deflection of the leaf spring 18 is prevented.

  The leaf spring 18 has a ring-shaped member in the peripheral region 40 by a plurality of spring retainers 42 each having an arc shape and a plurality of screw members 44 that penetrate the spring retainers 42 from below and are screwed to the ring-shaped member 16. 16 is assembled in parallel with the support substrate 12 on the lower surface.

  In the illustrated example, the spring retainers 42 are combined so that they form a similar ring in the peripheral region 40 of the leaf spring 18. However, a single spring presser having a ring shape may be used.

  As shown in FIG. 6, the inner peripheral surfaces of the ring-shaped member 16 and the spring retainer 42 are located at locations corresponding to the boundary between the plate-like region 39 and the outer peripheral region 40 of the plate spring 18 on the outer periphery of the plate spring 18. Planar regions 46 and 48 extending in the tangential direction and the vertical direction are formed.

  As shown in FIG. 7, the block 20 includes a mounting surface 50 to which the circuit board 22 is attached, an intermediate surface 51 that extends around the mounting surface 50, and a plurality of inclined surfaces 52 that extend around the intermediate surface 51. The lower block part 54 which has a pyramid-shaped downward surface, and the prism-shaped upper block part 58 which makes the upper end surface the attachment surface 56 to the leaf | plate spring 18 are provided.

  In the illustrated example, the mounting surface 50, the intermediate surface 51, and the mounted surface 56 are parallel surfaces, and the downward surface of the lower block portion 54 has a truncated octagonal pyramid shape.

  The block 20 is configured such that the central region 38 of the leaf spring 18 is sandwiched between the rectangular assembly plate 60 and the upper block portion 58, and the lower block portion 54 protrudes downward from the support substrate 12. The block 58 is assembled to the lower surface of the central region 38 of the leaf spring 18 by a plurality of screw members 62. The mounting surface 50 of the block 20 has a rectangular shape similar to the shape of the integrated circuit to be tested.

  As shown in FIGS. 11 and 12, the attachment surface 50 at the lower end of the lower block portion 54 protrudes slightly below the intermediate surface 51 around it. The lower end portion of the lower block portion 54 is formed with a recess 64 that opens to the attachment surface 50 and a downward groove 66 that extends around the recess 64.

  As shown in FIGS. 8 to 13, the circuit board 22 forms a plurality of strip-shaped wirings, that is, conductive paths 72 inside an electrically insulating sheet 70 such as polyimide, and contacts 74 are formed on the conductive paths 72. Wearing. For this reason, the circuit board 22 has flexibility. The sheet 70 includes three sheet members 70a, 70b, and 70c.

  The circuit board 22 has a rectangular contact region 76 in which the contact 74 is disposed, and an outer region 78 around the contact region 76. The outer region 78 extends in the radial direction of an imaginary circle centered on the needle tip region 76 from the intermediate region 80 with a space around the intermediate region 80 and an intermediate region 80 that continues integrally around the contact region 76. A plurality of extending portions 82.

  Each conductive path 72 extends from the contact region 76 where the contact 74 is disposed to the outer region 78 outward in the radial direction of the virtual circle. Connection bumps 84 (see FIG. 13) that protrude upward through the sheet members 70b and 70c are provided at the outer ends of the respective conductive paths 72. In the illustrated example, each conductive path 72 has a three-layer structure of copper, nickel, and copper.

  As shown in FIGS. 11 and 12, the plate 86 is embedded at a location corresponding to the contact region 76 so as to maintain the flatness of the contact region 76. Accordingly, the contact region 76 protrudes downward from the intermediate surface 51 by an amount corresponding to the sum of the thickness of the plate 86 and the amount of protrusion of the attachment surface 50 with respect to the intermediate surface 51. The plate 86 is made of an appropriate material such as a ceramic plate or a stainless plate.

  The sheet members 70 a and 70 b jointly sandwich the conductive path 72, and the sheet members 70 b and 70 c jointly wrap the plate 86.

  The sheet 70, the conductive path 72, and the plate 86 as described above are formed on the one surface of the sheet member 70a by using a photolithography technique, an electroplating technique, a resin coating technique, an electroforming technique, or the like. Then, the sheet member 70b is formed on the conductive path 72 side of the sheet member 70a, the plate 86 is disposed at a position corresponding to the contact region 76 of the sheet member 70b, and the sheet member 70c is disposed on the plate of the sheet member 70b. It can be manufactured by forming on the side.

  Each contact 74 includes a pedestal portion 88 that is joined to the corresponding conductive path 72 and protrudes downward from the sheet member 70 a, and a main body portion 90 that integrally follows the lower end of the pedestal portion 88.

  The pedestal portion 88 includes a first seat portion 88a formed of a metal material (for example, copper) of the same type as the joint portion of the corresponding conductive path 72, and a second seat portion joined to the lower end of the first seat portion 88a. And a seat 88b.

  The first seat 88a is joined to the corresponding conductive path 72 at the rear end face thereof. The second seat portion 88 b is manufactured integrally with the main body 90 from the same metal material (for example, nickel) as the main body 90.

  The main body 90 includes an arm 90a that extends horizontally from the lower end of the second seat 88b, and a needle tip 90b that protrudes downward from the tip of the arm 90a.

  The contact 74 as described above uses, for example, a photolithography technique, an electroplating technique, an electroforming technique, and the like to connect the first seat portion 88a, the second seat portion 88b, the arm portion 90a, and the needle tip 90b. , By sequentially forming in that order or in the reverse order.

  The contactor 74 manufactured as described above is joined to the corresponding conductive path 72 at the upper end surface of the first seat 88a by a conductive adhesive after removing a part of the sheet member 70a. Thereby, each contactor 74 is supported by the sheet 70 in a cantilever shape in a state in which the main body 90 is separated downward from the sheet 70.

  However, the sheet 70, the conductive path 72, and the contact 74 may be manufactured consistently using a photolithography technique, an electroplating technique, a resin coating technique, an electroforming technique, or the like. Also by this, each contactor 74 is supported by the sheet 70 in a cantilever shape.

  In the above case, the needle tip 90b, the arm portion 90a, the second seat portion 88b, the sheet member 70a, the first seat portion 88a, the conductive path 72, the sheet 70b, and the sheet member 70c can be manufactured in this order. The plate 86 may be disposed on the sheet member 70b prior to forming the sheet member 70c.

  If the circuit board 22 is manufactured as described above, the conductive path 72 and the first seat 88a, the first seat 88a and the second seat 88b, the second seat 88b and the arm 90a, and the arm The coupling strength between the portion 90a and the needle tip 90b increases.

  If the first seat 88a is made of the same metal material as the joint of the conductive path 72 and the second seat 88b is made of the same metal material as the main body 90, the first seat 88a and the conductive path are formed. 72 and the coupling strength between the second seat 88b and the main body 90 are further increased.

  As shown in FIG. 12, the joint surface of the first and second seats 88a and 88b is within the seat member 70a. Thereby, since the joint surface of both the seat parts 88a and 88b is surrounded by the sheet member 70a, even if a bending moment acts on the pedestal part 88, the first and second seat parts 88a and 88b are caused by the bending moment. Separation is prevented.

  As shown in FIGS. 11 and 12, the circuit board 22 is in a state where the contactor region 76 and the intermediate region 80 are opposed to the mounting surface 50 of the block 20, and a part of the extending portion 82 is opposed to the inclined surface 52. At least in the contact region 76, the adhesive surface 92 is adhered to the attachment surface 50 by the adhesive 92 stored in the recess 64.

  The contactor region 76 and the surrounding intermediate region 80 are pressed against the attachment surface 50 and the surrounding intermediate surface 51 when bonded to the block 20, respectively. As a result, the excess adhesive in the recess 64 is pushed out to the area around the contactor area 76 (at least a part of the intermediate area 80), so that the circuit board 22 has an area around the contactor area 76. In this case, it is adhered to a region around the attachment surface 50 (at least a part of the intermediate surface 51). As a result, as shown in FIG. 12, the circuit board 22 is maintained in a state in which the contact region 76 protrudes downward from the surrounding area.

  As described above, when the contact region 76 and the surrounding region are bonded to the mounting surface 50 and the surrounding region, the contact region 76 and the surrounding region are stably supported by the block 20. The child 74 is stable with respect to the support substrate 12.

  The circuit board 22 also has a plate-like rubber ring 94 having elasticity like silicone rubber and a certain degree of rigidity like stainless steel in a state where the connection bumps 84 are pressed against the connection land 32 as shown in FIG. Are attached to the lower surface of the support substrate 12 by a plate-shaped presser ring 96 having a plurality of screw members 98.

  The positioning of the circuit board 22 with respect to the support board 12 is performed by a plurality of positioning pins 100 extending downward from the support board 12 and projecting downward through the circuit board 22, the rubber ring 94 and the presser ring 96. Each positioning pin 100 is stably supported by the support substrate 12.

  In a state where the circuit board 22 is mounted on the block 20 and the support board 12 as described above, each contact 74 is aligned so that the needle tip 90b faces the corresponding electrode of the device under test. The conductive path 72, the connection bump 84, the connection land 32, the wiring in the support substrate 12 and the like are electrically connected to the tester land 30 of the support substrate 12.

  Each reference mark member 24 is a pin member that protrudes downward from the slope 52 of the lower block 54, and is stably supported by the lower block 54 in the upper part. In the illustrated example, three sets of reference mark members 24 are provided. Each set of the reference mark members 24 is opposed to each other with the contactor region 76 and the intermediate region 80 therebetween.

  The lower end surface of each reference mark member 24 is a surface parallel to the mounting surface 50, and the height position of the lower end surface of each reference mark member 24 is retracted upward from the height position of the contact 74.

  A lower portion of each fiducial mark member 24 projects between the adjacent conductive paths 72 in the extending portion 82 of the circuit board 22 and protrudes below the circuit board 22. Accordingly, since the interval between the adjacent conductive paths 72 in the extending portion 82 is wider than that in the intermediate region 80, the reference mark member 24 does not affect the formation position of the conductive paths 72.

  As shown in FIG. 9, each reference mark member 24 has a reference mark 102 on the lower end surface. Each fiducial mark 102 cooperates with the fiducial mark 102 of the fiducial mark member 24 facing each other with the contact region 76 therebetween, and the position of the needle tip 90b located between the fiducial marks 102 in the electrical connecting device 10 is determined. To express.

  The fiducial mark 102 has different optical characteristics from the surroundings. The reference mark 102 is the center of a circle in the illustrated example, but can be a dot, a cross-shaped intersection, or the like.

  For each reference mark 102, a mark layer is formed in advance on the lower surface of the reference mark member 24 by an appropriate method such as electroplating or coating, and the position of the needle tip 90b is determined after the electrical connection device 10 is completed. It can be formed by measuring and removing the corresponding part of the mark layer with laser light according to the measurement result. By doing so, the reference mark 102 can be accurately formed without depending on the assembly accuracy of the electrical connecting device 10.

  The block 20, the reference mark member 24, the spring retainer 42, the assembly plate 60, and the positioning pin 100 are made of an appropriate material, preferably an electrically insulating metal material.

  In the state assembled to the electrical connection device 10 as described above, the parallelism of the contact region 76 with respect to the support substrate 12 is adjusted.

  In this parallelism adjustment, the screwing amount of the adjusting screw 26 to the plate-like member 14 is set so that the contact region 76 is parallel to the support substrate 12 in a state where the screwing amount of the mounting screw 36 to the ring-like member 16 is small. After that, the attachment screw 36 is screwed into the ring-shaped member 16 in a state where the adjustment screw 26 is in contact with the upper surface of the ring-shaped member 16. For this reason, the parallelism of the contact region 76 with respect to the support substrate 12 can be easily adjusted.

  Since the contact region 76 is adhered to the mounting surface 50, the contact region 76 is reliably displaced together with the block 20 with respect to the support substrate 12 when the parallelism is adjusted.

  The electrical connection device 10 is assembled and supported in the inspection apparatus such that the contact area 76 is above the arrangement area of the object to be inspected and the needle tips 90b of the respective contacts 74 are opposed to the electrodes of the object to be inspected. The tester land 30 of the substrate 12 is connected to an electrical circuit for an energization test. Thereby, each contactor 74 is electrically connected to the electric circuit for an electrical test.

  In the state where the electrical connecting device 10 is mounted on the inspection device, the reference mark 102 is measured for positioning the needle tip 90b of the contact 74 with respect to the inspection device.

  In this measurement, since the reference mark 102 is formed on the lower end surface of the reference mark member 24 other than the contact 74, regardless of whether or not foreign matter remains on the needle tip 90b, and in the vicinity of the reference mark 102. The tip position can be accurately and reliably measured without being affected by the optical characteristics.

  The reference mark 102 may be measured by measuring the reference mark 102 of at least one set of the reference mark members 24 whose lower end surfaces are spaced apart from each other with the contactor region 76 therebetween. Thereby, the two-dimensional position of the contact 74 in the coordinates of the inspection apparatus can be accurately measured.

  However, if the reference marks 102 of the three sets of reference mark members 24 whose lower end surfaces are spaced apart from each other with the contact region 76 therebetween are measured, the two-dimensional position of the contact 74 in the coordinates of the inspection apparatus can be measured more accurately. Can do.

  During the energization test, the electrical connection device 10 and the object to be inspected are relatively moved in the direction in which they approach each other. Thereby, each contactor 74 presses the needle tip 90b against the corresponding electrode of the device under test, and the overdrive acts on the contactor 74.

  When the needle tip 90b of each contact 74 is pressed against the electrode of the object to be inspected, the cantilever-shaped contact 74 is slightly elastically deformed in an arc shape in the arm portion 90a by overdrive, and the leaf spring 18 is Elastically deforms.

  The electrical connection device 10 has the following technical merit when the overdrive acts on the contact 74.

  A part of the contact region 76, the intermediate region 80, and the extending portion 82 of the circuit board 22 are respectively opposed to a part of the mounting surface 50, the intermediate surface 51, and the inclined surface 52 of the block 20, and Since the height position of the lower end surface of the reference mark member 24 is higher than the height position of the contact 74, when the needle tip 90b is pressed against the electrode of the object to be inspected, the reference mark member 24 is inspected. Do not touch.

  When the contact 74 is pressed against the electrode, the leaf spring 18 acts as a reaction force in the central region, which is the region where the contact 74 is disposed on the circuit board 22. As a result, the leaf spring 18 is slightly elastically deformed by the circuit board 22 and the block 20 to allow the contact region 76 to be displaced upward and parallel by overdrive. Thereby, the pressing force of the contact 74 to the electrode becomes uniform.

  The block 20 reliably transmits the deformation of the contact region 76 of the circuit board 22 to the leaf spring 18, and the through hole 28 allows the leaf spring 18 to be easily elastically deformed toward the ring-shaped member 16. Thereby, the elastic deformation of the leaf spring 18 and the circuit board 22 is stabilized, and each contactor 74 is easily contacted by the electrode.

  The irregular deflection of the leaf spring 18 when the overdrive acts on the contact 74 is due to the fact that the block 20 is attached to the star-shaped or cross-shaped intersection of the leaf spring 18, the ring-shaped member 16 and the spring. Planar regions 46 and 48 in which the inner peripheral surface of the presser 42 extends in the tangential direction and the vertical direction of the outer peripheral surface of the leaf spring 18 are provided at each position corresponding to the boundary portion between the plate-like region 39 and the peripheral region 40 of the leaf spring 18. By doing so, it is reliably prevented and the pressing force of the contact 74 on the electrode becomes more uniform.

  Part of the bending moment acting on the pedestal part 88 since the joint part of both seat parts 88a and 88b is located in the seat 70, that is, the joint part is located in the thickness dimension of the sheet 70. Is received by the sheet 70, and the coupling portion is protected by the sheet 70. As a result, although the coupling force between the conductive path 72 and the pedestal portion 88 is large, separation of the contact from the seat 70 due to overdrive is prevented.

  The pedestal portion 88 greatly separates the main body portion 90, particularly the tip of the contact 74 from the sheet 70. For this reason, due to overdrive, the main body 90 is unlikely to contact the sheet 70, the sheet 70 is difficult to contact the object to be inspected, and as a result, the contact 74 reliably contacts the electrode of the object to be inspected.

  When a leaf spring 18 made of a material having a thermal expansion coefficient smaller than that of stainless steel is used, thermal expansion and contraction of the leaf spring 18 due to heating or cooling of the object to be inspected, and consequently displacement of the needle tip position is small. As a result, damage to the needle tip and poor contact of the needle tip with the electrode of the object to be inspected are prevented.

  When the leaf spring 18 has a thickness of 0.1 mm to 0.25 mm, the amount of deflection of the leaf spring 18 due to overdrive becomes an optimum value, and irregular deflection of the leaf spring 18 is more reliably prevented. Is done.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

It is a disassembled perspective view which shows one Example of the electrical connection apparatus which concerns on this invention. It is a top view of the electrical connection apparatus shown in FIG. It is sectional drawing obtained along the 3-3 line in FIG. It is a bottom view of the electrical connection apparatus shown in FIG. It is a bottom view of the state which removed the circuit board, the rubber ring, and the presser ring in the electrical connection apparatus shown in FIG. It is a disassembled perspective view which shows one Example of a ring-shaped member, a leaf | plate spring, and a spring retainer. It is a perspective view which shows one Example of a block. It is a perspective view which shows the state which attached the circuit board to the block. It is a bottom view which expands and shows the contactor area | region of a circuit board, and its periphery. It is a top view which shows one Example of a circuit board. It is sectional drawing obtained along the 11-11 line in FIG. It is an expanded sectional view of the contact region of a circuit board, and its circumference. It is an expanded sectional view which shows the attachment state of the circuit board to a support substrate.

DESCRIPTION OF SYMBOLS 10 Electrical connection apparatus 12 Support board 14 Plate-shaped member 16 Ring-shaped member 18 Leaf spring 20 Block 22 Circuit board 24 Reference mark member 26 Adjustment screw 28 Through hole 30 Tester land 32 Connection land 34 Screw member 36 Attachment screw 38 Leaf spring Central region 39 Plate-like region of leaf spring 40 Peripheral region of leaf spring 42 Spring retainer 44 Screw member 46, 48 Plane region 50 Block mounting surface 51 Block intermediate surface 52 Block slope 54 Lower block portion 56 Block mounting surface 58 Upper block portion 60 Assembly plate 62 Screw member 64 Block recess 66 Block groove 70 Sheet 70a, 70b, 70c Sheet member 72 Conductive path 74 Contact 76 Circuit board contact area 78 Circuit board outer area 80 Circuit board The intermediate region of 82 circuits Plate extension 84 Connection bump 86 Plate 88 Contact base 88a, 88b First and second seat 90 Contact main body 90a Arm 90b Needle tip 92 Adhesive 94 Rubber ring 96 Press ring 100 Positioning Pin 102 Reference mark

Claims (6)

A support substrate having an upper surface and a lower surface and having a through hole in the center;
A leaf spring assembled to the support substrate so as to be located in the through hole or opposed to the through hole;
A block having a mounting surface directed downward, the block being attached to the lower side of the leaf spring in a state where at least the mounting surface protrudes downward from the support substrate;
A flexible circuit board having a contactor region in which a plurality of contacts are arranged and an outer region around the contactor region, wherein at least the contactor region faces the mounting surface of the block And a circuit board attached to the lower surface of the support substrate in a part of the outer region,
The said leaf | plate spring is an electrical connection apparatus formed with the material whose thermal expansion coefficient is smaller than that of stainless steel.   The electrical connection device of claim 1, wherein the leaf spring is made of a material selected from the group comprising tungsten, molybdenum, alloys thereof and ceramic.   The electrical connection device according to claim 1, wherein the leaf spring has a thickness dimension of 0.1 mm to 0.25 mm.   The electrical connection device according to claim 1, wherein when the overdrive is applied to the contact, the leaf spring has an amount of bending twice that of the contact. The leaf spring is integrally formed around a flat central region, a plurality of plate-like regions extending from the central region in the radial direction of the virtual circle at intervals in the circumferential direction of the virtual circle, and the plate-like region. A ring-shaped peripheral region that follows, and is assembled to the support substrate in the peripheral region;
The electrical connection device according to claim 1, wherein the block is attached to the central region. The block has a downward facing surface of a truncated polygonal pyramid formed by the attachment surface, an intermediate surface that continues around the attachment surface, and a slope that continues around the intermediate surface;
The contactor region and a part of the outer region surrounding the contact region are respectively opposed to the attachment surface and the intermediate surface, and the remaining part of the outer region is opposed to the inclined surface. 5. The electrical connection device according to 5.