JP2007208284A - Method for vacuum processing in vacuum processor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum processor in which increase in manufacturing cost is suppressed, while coping with increase in a diameter of test piece, without degrading maintainability. <P>SOLUTION: The vacuum processor has one cassette block and a plurality of vacuum processing blocks. The cassette block has a cassette base on which a cassette containing a test piece is laid and a first test piece conveyance means which conveys the test piece. Each of the vacuum processing blocks has a load lock chamber, vacuum processing chamber which processes the test piece under vacuum, and a second test piece conveyance means which conveys the test piece under vacuum. The cassette base is arranged in a front part of the vacuum processor. The first test piece conveyance means conveys the test piece between the cassette and the load lock chambers which each of the vacuum processing blocks has. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a vacuum processing apparatus, and in particular, performs single wafer processing such as etching, CVD (chemical vapor deposition), sputtering, ashing, and rinser (water washing) on a sample which is a semiconductor element substrate such as Si. The present invention relates to a vacuum processing apparatus suitable for the above and a semiconductor manufacturing line for manufacturing a semiconductor device using the same.

  A vacuum processing apparatus for processing a sample is roughly divided into a cassette block and a vacuum processing block. The cassette block has a front extending in a longitudinal direction facing a bay passage of a semiconductor manufacturing line, and is used for a sample. There are two alignment units and atmospheric robots that align the orientation of cassettes and samples. The vacuum processing block is provided with a load side load lock chamber, an unload side load lock chamber, a vacuum processing chamber, a post vacuum processing chamber, a vacuum pump, a vacuum robot, and the like.

  In these vacuum processing apparatuses, the sample taken out from the cassette of the cassette block is transported to the load lock chamber of the vacuum processing block by the atmospheric robot. The sample transferred from the load lock chamber to the processing chamber by the vacuum robot and set on the electrode structure is subjected to processing such as plasma etching. Then, it is conveyed and processed into a post-processing chamber as needed. The processed sample is transported to the cassette block cassette by a vacuum robot and an atmospheric robot.

  Examples of vacuum processing apparatuses that perform plasma etching on a sample include those described in Patent Literature 1, Patent Literature 2, Patent Literature 3, Patent Literature 4, Patent Literature 5, and Patent Literature 6, for example.

Japanese Patent Publication No. 61-8153 JP 63-133532 A Japanese Patent Publication No. 6-30369 JP-A-6-314729 JP-A-6-314730 US Pat. No. 5,314,509

  In the conventional vacuum processing apparatus, the processing chamber and the load lock chamber are arranged concentrically or in a rectangular shape. For example, in the apparatus described in US Pat. No. 5,314,509, a vacuum robot is arranged near the center of a vacuum processing block, and three processing chambers are concentrically arranged around the vacuum robot. Between them, a load side load lock chamber and an unload side load lock chamber are provided. These apparatuses have a problem that the rotation angle of the transfer arm of the atmospheric robot or the vacuum robot is large, so that the required floor area of the entire apparatus is large.

  On the other hand, for processing chambers, vacuum pumps, and other various piping equipment in the vacuum processing block of the vacuum processing apparatus, it is necessary to perform maintenance such as inspection and repair regularly or irregularly. Therefore, in general, a door is provided around the vacuum processing block. By opening this door, inspection and repair of the load lock chamber, unload lock chamber, processing chamber, vacuum robot, and various piping equipment can be performed. It is like that.

  In the conventional vacuum processing apparatus, the diameter d of the sample to be handled is 8 inches (about 200 mm) or less, but the external dimension Cw of the cassette is also about 250 mm, and the size of the floor area is still a big problem. It was. Furthermore, considering the handling of a sample with a large diameter such as a diameter d of 12 inches (about 300 mm), the external dimension Cw of the cassette is as large as about 350 mm, and the width of the cassette block for storing a plurality of cassettes is also large. growing. If the width of the vacuum processing block is determined in accordance with this width, the entire vacuum processing apparatus requires a large space. As an example, when considering a cassette block that accommodates four cassettes, when the sample diameter d is changed from 8 inches to 12 inches, the width of the cassette must be increased by at least about 40 cm.

  On the other hand, in order to perform a large amount of processing while performing various types of processing on a sample, in a general semiconductor manufacturing line, a plurality of vacuum processing apparatuses that perform the same processing are collected in the same bay, and transportation between each bay is automatically or manually performed. Is going. Since such a semiconductor production line requires high cleanliness, the entire semiconductor production line is installed in a large clean room. The increase in the size of the vacuum processing apparatus accompanying the increase in the diameter of the sample is accompanied by an increase in the area occupied by the clean room, which further increases the construction cost of the clean room, which originally has a high construction cost. If a vacuum processing apparatus having a large occupation area is installed in a clean room having the same area, the total number of vacuum processing apparatuses must be reduced, or the interval between the vacuum processing apparatuses must be reduced. A decrease in the number of vacuum processing apparatuses installed in a clean room of the same area inevitably accompanies a decrease in productivity of a semiconductor production line and an increase in semiconductor manufacturing cost. On the other hand, reducing the interval between the vacuum processing apparatuses results in a lack of maintenance space for inspection and repair, and significantly impairs the maintainability of the vacuum processing apparatus.

  An object of the present invention is to provide a vacuum processing apparatus capable of suppressing an increase in manufacturing cost while accommodating an increase in the diameter of a sample.

  Another object of the present invention is to provide a vacuum processing apparatus having excellent maintainability while accommodating a large diameter sample.

  Another object of the present invention is to provide a semiconductor production line that accommodates an increase in the diameter of a sample, secures the necessary number of vacuum processing apparatuses to suppress an increase in manufacturing cost, and does not impair maintainability. It is in.

In order to achieve the above object, the present invention comprises a cassette block and a vacuum processing block, and the cassette block is provided with a cassette table on which a cassette containing a sample is placed. In a vacuum processing apparatus in which a processing chamber for vacuum processing of the sample and a vacuum transfer means for transferring the sample are arranged,
When the planar shape of the cassette block and the vacuum processing block is substantially rectangular, the width of the cassette block is W1, the width of the vacuum processing block is W2, and the width of the cassette is Cw, W1−W2 ≧ Cw It is characterized by that.

  Another feature of the present invention is that the width dimension of the cassette block is made larger than the width dimension of the vacuum processing block, and the planar shape of the vacuum processing apparatus is formed in an L shape or a T shape.

  Another feature of the present invention is a semiconductor manufacturing line in which a plurality of bay areas each incorporating a plurality of vacuum processing apparatuses each including a cassette block and a vacuum processing block are arranged in the order of semiconductor manufacturing processes. A cassette stage for mounting a cassette containing a sample is provided, and the vacuum processing block includes a processing chamber for vacuum processing the sample and a vacuum transfer means for transferring the sample. At least one of the vacuum processing apparatuses is configured such that the cassette block can accommodate a plurality of samples having a diameter of 300 mm or more, the width of the cassette block is W1, the width of the vacuum processing block is W2, and the width of the cassette Where Cw is a semiconductor production line where W1−W2 ≧ Cw.

  Another feature of the present invention is a line for a semiconductor manufacturing apparatus having a plurality of vacuum processing apparatuses each including a cassette block for storing a sample having a diameter of 300 mm or more and a vacuum processing block for performing vacuum processing on the sample. In the configuration method, at least one of the vacuum processing apparatuses has a width dimension of the cassette block larger than a width dimension of the vacuum processing block, and a planar shape of the vacuum processing apparatus is formed in an L shape or a T shape. In the line configuration method, a maintenance space is secured between the L-shaped or T-shaped vacuum processing apparatus and the adjacent vacuum processing apparatus.

  According to the present invention, the planar shape of the cassette block and the vacuum processing block is substantially rectangular, and when the width of the cassette block is W1 and the width of the vacuum processing block is W2, the relationship of W1> W2 is established. With this configuration, the planar shape of the entire vacuum processing apparatus becomes a shape such as an L shape or a T shape. When many such vacuum processing apparatuses are arranged, the interval between adjacent vacuum processing apparatuses is reduced. However, a sufficient space is secured between adjacent vacuum processing blocks. For example, when W1 is 1.5 m and W2 is 0.8 m, a maintenance space of 0.7 m can be secured between adjacent vacuum processing apparatuses.

  For this reason, the number of installed vacuum processing apparatuses in a clean room having the same area is not reduced as compared with the conventional case, and the productivity of the semiconductor production line is not lowered, despite the increase in the diameter of the sample. Therefore, it is possible to provide a vacuum processing apparatus that can suppress an increase in manufacturing cost while being compatible with an increase in the diameter of the sample and that is excellent in maintainability.

  In addition, by incorporating the vacuum processing apparatus of the present invention into a semiconductor production line, the required number of vacuum processing apparatuses can be secured to prevent the increase in manufacturing cost while maintaining the large diameter of the sample, and maintenance is also possible. A semiconductor production line that is not impaired can be provided.

  According to the present invention, it is possible to provide a vacuum processing apparatus that can suppress an increase in manufacturing cost while being compatible with an increase in the diameter of a sample and that is excellent in maintainability. In addition, by incorporating the vacuum processing apparatus of the present invention into a semiconductor production line, the required number of vacuum processing apparatuses can be secured to prevent the increase in manufacturing cost while maintaining the large diameter of the sample, and maintenance is also possible. A semiconductor production line that is not impaired can be provided.

  Hereinafter, the configuration of a vacuum processing apparatus according to an embodiment of the present invention will be described with reference to FIGS. As illustrated in FIG. 1, the vacuum processing apparatus 100 includes a rectangular parallelepiped cassette block 1 and a vacuum processing block 2. The planar shapes of the cassette block 1 and the vacuum processing block are each rectangular, and the planar shape as a whole is L-shaped. As will be described later, the cassette block 1 extends in the longitudinal direction facing the bay passage of the semiconductor production line, and on the front side, a cassette base 16 for transferring a cassette 12 storing samples with the bay passage, An operation panel 14 is provided. A vacuum processing block 2 installed on the back surface of the cassette block 1 extends in a direction perpendicular to the cassette block 1 and incorporates various vacuum processing devices and a transport device.

  As shown in FIGS. 2 to 4, the cassette block 1 includes an atmospheric robot 9 for transporting a sample and a cassette 12 for holding a sample. The sample cassette 12 includes product sample cassettes 12A, 12B, and 12C and a dummy sample cassette 12D. If necessary, an orientation alignment of the sample may be provided adjacent to the cassette 12. The sample cassette 12 stores all product samples or product and dummy samples. Samples for checking foreign matter and cleaning are stored in the uppermost and lowermost stages of the cassette.

  The vacuum processing block 2 includes a load side load lock chamber 4, an unload side load lock chamber 5, a vacuum processing chamber 6, a post vacuum processing chamber 7, a vacuum pump 8, and a vacuum robot 10. Reference numeral 13 denotes a discharge means for etching, and reference numeral 14 denotes a discharge means for post-processing (ashing).

  The atmospheric robot 9 is provided in the cassette block 1 so as to be able to run on a rail 92 installed in parallel with the cassette table 16, and the load side load lock chamber 4 and the unload side of the cassette 12 and the vacuum processing block 2. The sample 3 is transported between the load lock chambers 5. The vacuum robot 10 transports the sample 3 from the load side load lock chamber 4 to the vacuum processing chamber 6, and transports the sample 3 between the vacuum processing chamber 6, the unload side load lock chamber 5, and the post vacuum processing chamber 7. The present invention is premised on handling a large-diameter sample having a diameter d of 12 inches (about 300 mm) or more. In the case of a 12-inch sample, the external dimension Cw of the cassette is about 350 mm to 360 mm.

  The vacuum processing chamber 6 is a chamber for processing the samples 3 one by one, for example, plasma etching processing, and is provided in the upper left part of the vacuum processing block 2. The load side load lock chamber 4 and the unload side load lock chamber 5 are provided on the opposite side of the vacuum processing chamber 6 with the vacuum robot 10 interposed therebetween, that is, on the lower side portion of the vacuum processing block 2. The post-vacuum processing chamber 7 is a chamber for post-processing the processed samples 3 one by one, and is provided at an intermediate portion of the vacuum processing block 2 corresponding to the unload side load lock chamber 5.

  The atmospheric robot 9 has a telescopic arm 91, and the trajectory of the telescopic arm that expands and contracts while moving on the rail 92 moves the loader cassette 12, the load side load lock chamber 4, and the unload side load lock chamber 5. It is configured to include a trajectory. The vacuum robot 10 has an extendable arm 101 and is provided in the vacuum processing block 2 so that the trajectory of the extendable arm is a track including the load side load lock chamber 4 and the vacuum processing chamber 6. Therefore, the telescopic arm 101 of the vacuum robot is provided so that the turning trajectory is a trajectory including the vacuum processing chamber 6, the unload side load lock chamber 5, and the rear vacuum processing chamber 7. The position of the atmospheric robot 9 may be the right part on the cassette block 1.

  Further, a wafer search mechanism is provided around each cassette 12, and when the cassette 12 is set, the wafer search mechanism recognizes a sample in each cassette. Further, each of the load lock chambers 4 and 5, the vacuum processing chamber 6 and the post-vacuum processing chamber 7 is provided with sample lifting mechanisms 14A and 14B, respectively, and the sample 3 is delivered to the telescopic arms 91 and 101 of each robot. It can be configured. Further, the vacuum processing chamber 6 is provided with an electrode of the etching discharge means 13 and a sample mounting table 14C. A sample push-up mechanism 14B is provided inside the etching discharge means 13. Reference numeral 15 denotes a ring-shaped gate valve.

  Next, the processing operation of the sample in the vacuum processing apparatus 100 will be briefly described by taking a plasma etching process as an example. First, the fork (not shown) is loaded by moving the atmospheric robot 9 of the cassette block 1 on the rail 92 to approach the load-side cassette 12A and further extending the telescopic arm 91 toward the cassette 12A. The sample 3 is inserted below the sample 3 in the side cassette, and the sample 3 is transferred onto the fork. Then, the arm 91 of the atmospheric robot 9 is moved to the load side load lock chamber 4 with the lid of the load side load lock chamber 4 opened, and the sample 3 is transported. At this time, the atmospheric robot 9 is moved on the rail 92 as necessary so that the stroke of the telescopic arm 91 reaches the load side load lock chamber 4.

  Thereafter, the sample push-up mechanism 14A is operated to support the sample 3 on the support member of the load side load lock chamber 4. Further, after the load-side load lock chamber 4 is evacuated, the support member is lowered, the sample push-up mechanism 14A is operated again, the sample 3 is delivered to the arm 101 of the vacuum robot 10, and the transport path in the vacuum processing block 2, that is, Then, the vacuum is transferred to the vacuum processing chamber 6. Further, the sample 3 is transported to the unload side cassette position of the cassette block 1 by the reverse operation.

  If post-processing is necessary, the arm 101 of the vacuum robot 10 is transferred via the post-vacuum processing chamber 7. In the post-vacuum processing chamber 7, plasma post-processing such as ashing is performed on the etched sample 3.

  In FIG. 3, the locus of the arm 101 of the vacuum robot 10 is, for example, that the sample 3 is in the load side load lock chamber 4, the vacuum processing chamber 6, and the post vacuum processing chamber 7, and there is no wafer in the unload lock chamber 5. The situation is as follows. That is, the arm 101 of the vacuum robot 10 first moves one sample 3 of the post-vacuum processing chamber 7 to the unload lock chamber 5 and moves the sample 3 of the vacuum processing chamber 6 to the post-vacuum processing chamber 7. Next, the sample 3 in the load-side load lock chamber 4 is transferred to the vacuum processing chamber 6. Further, the sample 3 in the vacuum processing chamber 6 is transferred to the post-vacuum processing chamber 7. The arm 101 repeats the same locus thereafter.

  Further, since the vacuum robot 10 is arranged near the side end of the vacuum processing block 2, the operator can inspect and repair the vacuum robot 10 without taking an unreasonable posture, and the maintenance becomes easy.

  FIG. 5 is a plan view showing an example of a bay area 200 of a semiconductor production line incorporating the vacuum processing apparatus 100 of the present invention. In the figure, a large number of L-shaped vacuum processing apparatuses 100 are arranged across a maintenance space 203 of a gap G1, and a partition 120 divides a high clean room 201A and a low clean room 201B. An automatic transfer device (hereinafter referred to as AGV) 202 for supplying and transporting the sample 3 is provided along the front surface of the cassette block 1 disposed in the room 201A with high cleanliness. On the other hand, a large number of vacuum processing blocks 2 are arranged in the low-clean room 201B, and the interval between them is a maintenance space described later.

  FIG. 6 is a diagram showing a part of the flow of the sample 3 in the semiconductor production line according to the embodiment of the present invention. At the entrance of each bay area 200, an inspection device 206 and a bay stocker 208 are provided. The back of each bay area 200 communicates with the maintenance passage 210, and an air shower 212 is provided at the entrance of the maintenance passage 210. The sample 3 supplied to the bay stocker 208 from the outside is sequentially transferred to the in-bay AGV 202 of the predetermined bay area 200 by the line AGV 204 according to the processing step, as indicated by an arrow. Further, it is transferred from the AGV 202 in the bay to the cassette block 1 of the vacuum processing apparatus 100. In the vacuum processing apparatus 100, the sample 3 is transported between the cassette block 1 and the vacuum processing block 2 by the atmospheric robot 9 and the vacuum robot 10. The sample 3 processed in the vacuum processing block 2 is transferred to the AGV 202 in the bay, further transferred to the line AGV 204, and conveyed to the next bay area 200.

  In the semiconductor manufacturing line having the AGV 202 in the bay, the AGV 202 in the bay supplies a new sample (wafer before processing) from the bay stocker 208 provided for each bay 200 to the cassette block 1 of each vacuum processing apparatus 100. The cassette containing the processed sample is collected from the cassette block 1.

  In-bay AGV 202 receives a cassette containing a new sample (wafer before processing) from bay stocker 208 provided in each bay 200 in response to a request signal issued from each vacuum processing apparatus 100, and vacuum processing apparatus 100. The vehicle travels to the cassette position where the request signal is issued from the cassette block 1 and stops.

  Next, the cassette handling robot incorporated in the AGV 202 in the bay has a three-axis control function of turning operation (θ axis), vertical movement (Z axis), and holding operation (φ axis), and turning operation (θ Axis), vertical movement (Z-axis), gripping movement (φ-axis), and back-and-forth movement (Y-axis) have a 4-axis control function.

  When the cassette 12 that has already been processed is in the designated position of the cassette block 1 according to the request issued from each vacuum processing apparatus 100, the cassette handling robot first moves the cassette 12 from the cassette block 1 into the bay. The new cassette 12 is collected in the empty cassette storage area on the AGV 202, and then transported from the bay stocker 208 to the collected and empty place.

  When this operation is completed, the recovered cassette 12 is transported to the bay stocker 208, and the operation is stopped and waited until the next request signal is issued from the vacuum processing apparatus 100 in the bay 200.

  If a request signal is issued in a short time from a plurality of vacuum processing apparatuses 100, 100... In the bay 200, this corresponds to the order in which the signals are received, but taking into account the shift in reception time and the positional relationship of the transmitters. Whether to respond in the order of high transport efficiency from the standby position of the AGV 202 in the bay depends on how the system is constructed.

  In addition, in the case of the information on the cassette to be delivered, it corresponds to the order in which the signals are received. Depends on the construction method.

  In addition, the cassette information to be delivered includes numbers and various information peculiar to each cassette used in the management of the entire production line, and is transmitted between the vacuum processing apparatus 100 and the AGV 202 in the bay by, for example, an optical communication system. Considered to manage the cassette.

  The processing flow in the bay area 200 will be further described by paying attention to the sample in each cassette.

  In the atmospheric block 1, 3 to 4 cassettes 11 and 12 are juxtaposed on the same horizontal plane. In each cassette, a predetermined number of samples, in this case, semiconductor element substrates (wafers) having a diameter of 300 mm (12 ″) are stored.

  Among 3 to 4 cassettes, 2 to 3 cassettes 12 contain samples (wafers before processing) to be subjected to predetermined vacuum processing in the vacuum processing unit. In the remaining one cassette 11, dummy wafers are stored.

  The dummy wafer is used at the time of checking the number of foreign matters in the vacuum processing unit 2 or cleaning the vacuum processing chamber constituting the vacuum processing region.

  Here, the cassette 12 in which the sample before processing is stored is referred to as 12A, 12B, and 12C. In this state, for example, the sample storage state of the cassette 12A is checked by wafer check means (not shown). In this case, the cassette 12A has a function of storing samples one by one in the height direction.

  The wafer check means includes a sensor that detects the presence or absence of a sample in contact or non-contact. And it has a means to move this sensor according to the storage position of a sample. In addition, there is also provided means for outputting a signal indicating in what level of the cassette 12A the sample is stored.

  As the wafer check means, one having means for moving the sensor so as to sequentially correspond to the sample storage stage of the cassette 12A, or one provided with a plurality of sensors corresponding to the sample storage stage of the cassette 12A is used. The In this case, means for moving the sensor so as to sequentially correspond to the sample storage stage of the cassette 12A is unnecessary. Alternatively, the sensor of the wafer check means may be fixed and the cassette 12A may be moved instead.

  The wafer check means checks at which position in the height direction of the cassette 12A the pre-processing sample is stored. For example, when the wafer check means has means for moving the sensor so as to sequentially correspond to the sample storage stage of the cassette 12A, the sensor is, for example, upward from the lower position or from the upper position of the cassette 12A. While moving downward, the sample storage stage of the cassette 12A and the presence / absence of a sample before processing in the storage stage are detected.

  The check result is output from the wafer check means, and is input and stored in, for example, a host computer (not shown) for controlling a semiconductor manufacturing line that manages the entire vacuum processing apparatus. Alternatively, the data may be input to a host computer for controlling the apparatus by a personal computer in a console box on the cassette table or through the personal computer.

  Thereafter, in this case, the atmospheric transfer robot 9 starts to operate. One sample before processing in the cassette 12A is taken out of the cassette 12A by the operation of the atmospheric transfer robot.

  For example, the atmospheric transfer robot 9 includes a scoop portion that scoops and holds a surface (back surface) opposite to the surface to be processed of the sample. As the scooping portion, one that adsorbs and holds the back surface of the sample, one that has a groove or a recess for holding the sample, or one that mechanically grasps the peripheral portion of the sample is used. Furthermore, what has a vacuum suction and an electrostatic suction function is used as what hold | maintains the back surface of a sample by suction.

  For example, in the case of scooping and holding a sample having a diameter of 300 mm (12 ") using an object that adsorbs and holds the back surface of the sample, the arrangement and dimensions of the adsorbing portion should be selected so as to minimize the bending of the sample. For example, in consideration of the cassette inner width and the like, when the diameter of the sample is d, the interval between the adsorption portions is set to d / 3 to d / 2 with the center of the sample as the center.

  Depending on the amount of bending of the sample and how it bends, the sample may be displaced during delivery of the sample between the scooping portion and other means, resulting in inconvenience that the orientation is displaced.

  In addition, when using a device that adsorbs and holds the back surface of the sample, an adsorption force that prevents the sample from being detached due to an inertial force that acts on the sample during movement (including movement start and stop) is required. If this is not satisfied, there arises a disadvantage that the sample falls off from the scooping portion during movement or the orientation of the sample is shifted.

  The scoop portion is inserted into the cassette 12A at a position corresponding to the back surface of the pre-processed sample that needs to be taken out. With the scooping portion inserted, the cassette 12A is lowered by a predetermined amount or the scooping portion is raised by a predetermined amount. When the cassette 12A is lowered or the rake portion is raised, the pre-treatment sample is passed to the rake portion while being scooped by the rake portion. In this state, the scoop portion is pulled out of the cassette 12A. Thereby, one pre-processing sample in the cassette 12A is taken out of the cassette 12A.

  As described above, which pre-processing sample in the cassette 12A is taken out by the atmospheric transfer robot 9 is instructed and controlled by, for example, a host computer.

  From which stage in the cassette 12A the sample before processing is taken out is sequentially stored in the host computer every time the sample is taken out.

  The atmospheric transfer robot 9 having one unprocessed sample in the scoop portion is moved to a position where the sample can be loaded into the load lock chamber 4 and stopped.

  The load / lock chamber 4 is cut off from the vacuum atmosphere of the vacuum processing unit 2 and is in an atmospheric state. In the load / lock chamber 4 in this state, the pre-treatment sample held in the scooping portion of the atmospheric transfer robot 9 is carried and passed from the scooping portion to the load / lock chamber 4.

  The atmospheric transfer robot 9 that has passed the unprocessed sample into the load / lock chamber 4 is retracted to a predetermined position in preparation for the next operation.

  The above operation is instructed and controlled by, for example, a host computer.

  From which stage in the cassette 12A the pre-processed sample delivered to the load lock chamber 4 has been taken out is sequentially stored in the host computer.

  The inside of the load lock chamber 4 that has received the sample before processing is cut off from the atmosphere and evacuated. Then, the interruption | blocking with a vacuum processing part is cancelled | released and it connects with the sample before a process so that conveyance is possible.

  The sample is transferred from the load / lock chamber 4 to the vacuum processing area of the vacuum processing unit 2 by the vacuum robot 10 and is subjected to predetermined vacuum processing in the vacuum processing area. The sample (processed sample) for which the vacuum processing has been completed is transferred from the vacuum processing region to the unload / lock chamber 5 by the vacuum robot 101 and is carried into the chamber.

  Here, the vacuum transfer robot includes a scooping portion like the atmospheric transfer robot 9. As the scooping portion, those similar to those used in the atmospheric transfer robot are used except for those having a vacuum suction function.

  After carrying in the processed sample, the inside of the unload lock chamber 5 is shut off from the vacuum processing unit 2 and the internal pressure is adjusted to atmospheric pressure.

  The inside of the unload lock chamber 5 whose internal pressure is atmospheric pressure is released to the atmosphere. In this state, the scoop portion of the atmospheric transfer robot 9 is inserted into the unload / lock chamber 5, and the processed sample is delivered to the scoop portion.

  The scooping portion that has received the processed sample is carried out of the unload lock 5 outside the room. Thereafter, the inside of the unload / lock chamber 5 is cut off from the atmosphere and evacuated in preparation for the next loaded sample.

  On the other hand, the atmospheric transfer robot 9 having the processed sample in the rake portion is moved to a position where the processed sample can be returned into the cassette 12A and stopped.

  Thereafter, the scooping portion having the processed sample is inserted into the cassette 12A in this state. Here, the insertion position is controlled by the host computer so that the processed sample is returned to the originally stored position.

  After completion of the insertion of the scoop portion having the processed sample, the cassette 12A is raised or the scoop portion is lowered.

  Thereby, the processed sample is returned to the position where the sample was originally stored, and stored again in the cassette 12A.

  Such an operation is performed in the same manner for the remaining unprocessed samples in the cassette 12A and the unprocessed samples in the cassettes 12B and 12C.

  That is, the pre-processing samples that are sequentially taken out from each cassette one by one are numbered, for example. For example, it is stored in the upper computer how many samples the pre-processing sample taken from which level of which cassette is.

  With the stored information, the movement of the sample taken out from the cassette, vacuum processed, and returned to the cassette after completion of the vacuum processing is managed and controlled.

  That is, the sample moves from the cassette and moves in the following order until it is returned to the original cassette.

(1) Storage position check in cassette (2) Sample removal from cassette by atmospheric transfer robot (3) Loading into load / lock chamber by atmospheric transfer robot (4) Vacuum treatment from load / lock chamber by vacuum robot (5) Vacuum processing in the vacuum processing area (6) Transport from the vacuum processing area by the vacuum robot to the unload / lock chamber (7) Transport from the unload / lock chamber by the atmospheric transfer robot (8) Storage at the original position in the cassette by the atmospheric transfer robot As described above, each time the sample moves from (1) to (8), the number of samples in each station, the data of the host computer sequentially Update process. The update process is performed for each sample. Thus, each sample, that is, what number sample is in which station is managed.

  For example, the sequential update state processing of the data of the host computer may be sequentially displayed on the CRT screen for vacuum processing system control. In this case, each station on the CRT screen is displayed so that the operator can see at a glance what number sample is currently present.

  In the case where the orientation adjustment of the sample before processing is performed, this step is performed between the above (2) and (3).

  Such management and control of the movement of the sample is also performed when the vacuum processing unit 2 has a plurality of vacuum processing regions.

  For example, it is assumed that the vacuum processing unit 2 has two vacuum processing regions. In this case, the sample is subjected to series processing or parallel processing according to the processing information. Here, the series processing means that the sample is vacuum-processed in one vacuum processing region, and the vacuum-processed sample is continuously vacuum-processed in the remaining vacuum processing region. Vacuum processing is performed in one vacuum processing region, and the other sample is vacuum processed in the remaining vacuum processing region.

  For example, in the case of series processing, samples numbered by the host computer are processed according to their order and returned to their original positions in the cassette.

  In parallel processing, since the host computer manages and controls how the numbered samples are processed in which vacuum processing area, each processed sample is also stored in the cassette in this case. Return to position.

  In the case of parallel processing, the upper computer may manage and control which stage in the cassette is taken out and which vacuum processing area is used depending on which sample.

  In addition, even when series processing and parallel processing are mixed, the host computer controls and controls how the numbered samples are processed in which vacuum processing region. The processed sample is returned to its original position in the cassette.

  As the plurality of vacuum processing regions, for example, a combination of plasma etching regions having the same or different plasma generation methods, a combination of a plasma etching region and a post-processing region such as ashing, an etching region and a film formation region And the like.

  Also, the dummy sample in the cassette of the dummy sample is implemented in the same manner, except that the dummy sample is not subjected to vacuum processing, such as that applied to the sample before processing. The

  On the other hand, the presence / absence of sample detection means is provided in the cassette, the scooping part of the atmospheric transfer robot, the orientation adjustment station, the load / lock chamber station, the scooping part of the vacuum transfer robot, the vacuum processing area station and the unload / lock chamber station Is provided.

  As the sample detection means, a contact or non-contact type sensor is appropriately selected and used.

  The above cassette, scooping part, and each station serve as check points in the sample moving process.

  In such a configuration, for example, when the presence of a sample is detected at the rake portion of the vacuum transfer robot 10 and the sample is not detected at a station in the vacuum processing area, the vacuum transfer robot 10 or the rake of the vacuum transfer robot is used. The sample delivery machine between the part and the station in the vacuum processing area has failed for some reason, and the recovery is performed accurately and in a short time. For this reason, it is possible to suppress a decrease in throughput of the entire apparatus.

  Further, for example, in the configuration in which the sample detecting means is not provided in the scoop portion of each transfer robot 9, for example, the presence of the sample in the load lock indoor station is detected, and the sample in the station in the vacuum processing area is detected. Is not detected, the sample delivery mechanism between the load lock chamber station and the rake part of the vacuum transfer robot, or the vacuum transfer robot, or between the rake part of the vacuum transfer robot and the station in the vacuum processing area The sample delivery mechanism has failed for some reason, and the recovery is performed accurately and in a short time. For this reason, it is possible to suppress a decrease in throughput of the entire apparatus.

  Such an embodiment has the following utility.

  (1) The number of the pre-processing sample in the cassette is checked, the checked pre-processing sample is numbered, and its movement is sequentially managed and controlled. Can be reliably returned to its original position in the cassette.

  (2) Even if the pre-processed sample is processed in series, parallel, or mixed by the processing information, it is checked at which level in the cassette the pre-processed sample is stored. Since the checked samples are numbered and their movements are sequentially managed and controlled, the processed samples in various processing forms can be reliably returned to their original positions in the respective cassettes.

  (3) Since the number of pre-process samples in the cassette is checked, the checked pre-process samples are numbered, and their movements are sequentially managed and controlled. Thus, it is possible to accurately check and manage the processing state of each sample processed one by one.

  For example, if any defect occurs in the processing of the sample, the processing state of each sample, that is, the processing conditions, etc. are managed, so that the defective sample is stored in which cassette in which level. Since the processing state can be grasped depending on whether it has been done, the cause of the failure can be grasped in a short time, and the time required for the countermeasure can be shortened accordingly.

  In the above embodiment, the sample diameter is 300 mm (12 ″). However, the usefulness described above is not limited to the sample diameter.

  Next, maintenance will be described. When performing maintenance of the vacuum processing apparatus 100 of the present invention, since the cassette block 1 faces the line of the AGV 202 in the bay, most of the maintenance of the cassette block 1 can be performed from the front.

  On the other hand, in order to perform maintenance of the vacuum processing block 2, it is necessary for an operator to enter the area where the vacuum processing block 2 is located from the back of each bay area 200 through the maintenance passage 203 or the maintenance passage 210.

  FIG. 7 shows the relationship between the sizes of the vacuum processing block 2 and the cassette block 1. The long side (width) of the cassette block 1 is W1, the short side is B1, and the short side (width) of the vacuum processing block 2 is shown. ) Is W2, long side (depth) is B2, W1> B1, W2 <B2, and when the diameter of the sample 3 is d, the relationship is preferably W1-W2≈d. Is good.

  When the gap between adjacent cassette blocks of the vacuum processing apparatus 100 is G1, and the gap between adjacent vacuum processing blocks is G2 (see FIG. 5), G1 <G2. (W1 + G1) -W2 = MS gives a maintenance space between the adjacent vacuum processing apparatuses 100. MS is a size necessary for an operator to perform maintenance work. In this case, the relationship of (W1 + G1) −W2≈d is desirable. Although the maintenance space 203 serves as an entrance / exit for the operator, this space may not be provided depending on the layout of the bay area 200. Even in such a case, the installation margin G1 between the adjacent vacuum processing apparatuses 100 is at least necessary, but the value is substantially close to zero. In this case, W1-W2 = MS is the maintenance space.

  The side surface of the vacuum processing block 2 of the vacuum processing apparatus 100 of the present invention has an openable door structure as shown in FIG. That is, double doors 214 and 216 are provided on the side and back of the vacuum processing block 2, respectively.

  In order to perform maintenance, (1) there is a space where the operator can check equipment, piping, etc. from the front and back, (2) there is space for taking out various piping equipment, for example, the main chamber of the processing chamber, 3) There must be a space to open the door. Therefore, the maintenance space MS is preferably about 90 to 120 cm.

  According to the vacuum processing apparatus 100 of the present invention, it is easy for an operator to approach the side and back of the vacuum processing block 2. Further, by opening the door 214, the load lock chamber 4, the unload lock chamber 5, the post-processing chamber 7, the vacuum robot 10, and various piping devices can be inspected and repaired. Further, by opening the door 216, the processing chamber 6, the vacuum pump, and various piping devices can be inspected and repaired.

  Since there is a maintenance space MS between the vacuum processing blocks 2, there is no problem for the operator to perform maintenance work by opening and closing the side door 214. In addition, sufficient space is secured between the back surfaces of the vacuum processing blocks 2 to open and close the door 216 and perform maintenance work.

  The vacuum processing apparatus 100 of the present invention has an L-shaped planar shape as described above. On the other hand, as shown in FIG. 9, a conventional vacuum processing apparatus 800 generally has a rectangular shape as a whole including a vacuum processing block and a cassette block. The rectangular shape is selected based on the shapes of various elements arranged in the vacuum processing apparatus and their mutual operation relationships. In the conventional apparatus, when the gap between the adjacent cassette blocks is G1, and the gap between the adjacent vacuum processing blocks is G2, generally G1 ≧ G2.

  The conventional vacuum processing apparatus 800 has the above-described configuration because the diameter d of the sample 3 to be handled is 8 inches or less. However, in an apparatus that handles a large-diameter sample such as the diameter d of 12 inches, the cassette 12 And the width W1 of the cassette block that accommodates the plurality of cassettes 12 is increased. Since the width of the vacuum processing block (W2≈W1) is determined in conjunction with W1, the entire vacuum processing apparatus 800 requires a large space. Further, when the widths W1 and W2 of the cassette block and the vacuum processing block are increased, the doors 214 and 216 must be enlarged, and a large maintenance space MS is required to secure a space for opening and closing the doors 214 and 216. I need it. As an example, if a 12-inch sample is handled by a conventional apparatus, W1 = W2 = 150 cm, G1 = G2 = 90 cm, and MS = 90 cm is a maintenance space between adjacent vacuum processing apparatuses 100. This increases the effective occupation area of the vacuum processing apparatus 800 in each bay area, which is not preferable.

  An example of the interrelation between various elements in the vacuum processing apparatus according to the present invention will be described with reference to FIG. As shown in the drawing, it is shifted to either the left or right of the line LL connecting the intermediate position between the load lock chamber 4 and the unload lock chamber 5 and the center of the processing chamber 6, that is, to the side end side of the vacuum processing section. Thus, the turning center O1 of the arm of the vacuum robot 10 is arranged. A post-processing chamber 7 is disposed on the opposite side of the line segment LL. Therefore, by adopting such a configuration in which the vacuum robot 10 is arranged near the side end of the vacuum processing section with the narrow pivot range of the arm of the vacuum robot 10, the overall planar shape of the vacuum processing apparatus 100 can be reduced to L. It can be shaped like a letter. According to such a configuration, the turning range of the arm of the vacuum robot 10 is about half of the circumference. By setting the swivel range of the arm of the vacuum robot 10 that carries the wafer within approximately a half circle, the load lock chamber 4, the unload lock chamber 5, the processing chamber 6, and the post processing chamber can be moved in a circular motion within approximately one half of one round. 7, one sample 3 can be transported. As described above, since the swivel range of the arm of the vacuum robot 10 is set within approximately a semicircle, the width W2 of the vacuum processing block 2 can be reduced.

  As described above, the vacuum processing apparatus 100 of the present invention devised the shapes of the various elements arranged in the vacuum processing apparatus and the mutual relations while making the width W1 of the cassette block 1 correspond to the increase in the diameter of the sample. The maintenance space is secured by reducing the width W2 of the vacuum processing block 2 as much as possible, and the effective occupation area of the vacuum processing apparatus 100 in each bay area is increased.

  Since there is a sufficient maintenance space MS between the vacuum processing blocks 2, there is no problem for the operator to perform the maintenance work by opening and closing the side door 214. In addition, sufficient space is secured between the back surfaces of the vacuum processing blocks 2 to open and close the door 216 and perform maintenance work.

  In the vacuum processing apparatus 100 of the present invention, the positional relationship between the vacuum processing block 2 and the cassette block 1 can be changed along the longitudinal direction of the cassette block. For example, as shown in FIGS. 11 and 12, the entire planar shape may be T-shaped so that the center line in the longitudinal direction of the vacuum processing block 2 intersects at the longitudinal center of the cassette block 1. Even if it is T-shaped, the maintenance space MS is secured between the adjacent vacuum processing blocks 2, so that there is no problem for the operator to perform the maintenance work by opening and closing the side door 214.

  The planar shapes of the cassette block 1 and the vacuum processing block 2 of the present invention are not necessarily strict rectangles as long as the relationship of (W1 + G1) −W2 = MS is substantially secured. A rectangle, in other words, a substantially rectangular shape, is sufficient. Further, the components and the arrangement relationship included in the cassette block 1 and the vacuum processing block 2 may be different from those in the above-described embodiments. For example, in the embodiment shown in FIG. 13, the atmospheric robot 9 of the cassette block 1 is located between the load lock chamber 4 and the unload lock chamber 5 of the vacuum processing block. In this case, the planar shape of the cassette block 1 is strictly convex, the planar shape of the vacuum processing block 2 is strictly concave, and the vacuum processing apparatus 100 as a whole is a combination of two substantially rectangular shapes. It is a shape. In this embodiment, the atmospheric robot 9 of the cassette block 1 is positioned between the load lock chamber 4 and the unload lock chamber 5, and the cassette 12 is movably disposed on the rail 94, so that the atmospheric robot 9 Even without moving upward, the trajectory of the telescopic arm 91 can be configured to include the cassette 12, the load side load lock chamber 4, and the unload side load lock chamber 5. Also in this embodiment, the maintenance space MS is secured between the adjacent vacuum processing blocks 2.

  FIG. 14 shows another embodiment of the vacuum processing apparatus 100 of the present invention. In addition to the cassette block 1, the atmospheric robot 9 and the sample cassette 12, a cassette table 130, sample evaluation and inspection are shown. There is a console box 132 for use.

  FIG. 15 shows another embodiment of the vacuum processing apparatus 100 of the present invention, which is a T-shaped vacuum processing apparatus in which the cassette block 1 is provided with an atmospheric robot 9 and a sample orientation alignment 11.

  FIG. 16 is a plan view of another embodiment of the bay area 200 of the present invention, in which a pair of L-shaped vacuum processing apparatuses 100A and 100B are arranged to face each other, and a console box 132 is provided between each pair. is there. In this example, although there is no gap G1, the maintenance space is (W1 + W3) -W2 = MS when the width of the console box 132 is W3. Since there is no gap G1, in order to perform maintenance of the vacuum processing block 2, the operator needs to enter the area 201B where the vacuum processing block 2 is located from the back of each bay area 200 through the maintenance passage 210. If it is necessary to shorten the access time, a gap G1 may be provided between the console box 132 and the adjacent cassette block 1. At this time, (W1 + W3 + G1) -W2 = MS is the maintenance space.

  Next, FIG. 17 is a plan view of a bay area incorporating a vacuum processing apparatus according to another embodiment of the present invention. In the vacuum processing apparatus 100 of this example, the cassette base 16A of the plurality of cassette blocks 1 is formed as a continuous and integral structure, and a plurality of atmospheric robots 9 travel on a common rail 95 thereon. The AGV in the bay is interposed between the bay stocker and the atmospheric robot 9, and exchanges samples with each vacuum processing block 2. In this case, the cassette block 1 functionally corresponds to each vacuum processing block 2, and it can be considered that a large number of substantially rectangular shapes corresponding to the respective vacuum processing blocks 2 are connected.

  FIG. 18 is a plan view of a configuration example of the production line of the present invention. As is clear from FIG. 18, the vacuum processing apparatus 100 of the present invention has an L-shape or T-shape in plan view, and a sufficient maintenance space is provided between the vacuum processing blocks 2 even when the intervals between the vacuum processing apparatuses 100 are narrow. MS is secured.

  On the other hand, in the conventional rectangular vacuum processing apparatus 800 shown for comparison, an interval between the vacuum processing apparatuses 800 must be increased in order to secure a sufficient maintenance space MS between the respective vacuum processing blocks. . As a result, as in the embodiment, in the same length line, seven vacuum processing apparatuses 100 of the present invention can be arranged, whereas the conventional rectangular vacuum processing apparatus 800 can arrange only five. The difference in the number of the two units is a large number considering the entire semiconductor production line, and is a great difference in securing the number of devices installed in a clean room of a predetermined space and saving the footprint. In addition, when considering transporting a sample from a bay area with an AGV to a bay area in the next process, when the vacuum processing apparatus of the present invention is adopted, the vacuum processing apparatus 7 is connected to one line of one bay area. Whereas the processing for the number of units is possible, the conventional apparatus can only perform the processing for five units. The difference between the two units greatly affects the throughput improvement of the semiconductor production line.

  Depending on the content of the vacuum processing, there may be a case where a rectangular vacuum processing apparatus 800 needs to be used in part. Even in such a case, by arranging the L-shaped or T-shaped vacuum processing apparatus 100 of the present invention adjacent to the rectangular vacuum processing apparatus 800, an appropriate maintenance space MS is secured between the vacuum processing blocks. it can.

  FIG. 19 is another example of the entire configuration diagram of a semiconductor manufacturing line that partially employs the vacuum processing apparatus of the present invention. This apparatus is provided with a line AGV 204, and sample transfer between the bay areas 200A to 200N and the line AGV 204 is a line automation system performed by an operator. There is an effect similar to the example of FIG.

  FIG. 20 is another example of an overall configuration diagram of a semiconductor production line that partially employs the vacuum processing apparatus of the present invention. This apparatus includes a bay AGV 202 and a line AGV 204, and a sample is exchanged in each bay area and between each bay area 200A to 200N and the line AGV 204 without using an operator. In this case as well, the L-shaped or T-shaped vacuum processing apparatuses 100 of the present invention, or the L-shaped or T-shaped vacuum processing apparatus 100 and the rectangular vacuum processing apparatus 800 are arranged adjacent to each other, thereby forming each vacuum. A moderate maintenance space MS can be secured between the processing blocks.

  In the above embodiment, the cassette and the atmospheric transfer robot are described as being arranged in the atmospheric atmosphere, and the atmospheric transfer robot operates in the atmospheric atmosphere. Instead, for example, FIG. 21 and FIG. As shown in FIG. 5, the cassette 12 may be disposed in a vacuum atmosphere and the transfer robot 10 may be operated only in a vacuum atmosphere. The example of FIG. 21 shows the case where there are two cassettes 12, and FIG. 22 shows the case where there are three cassettes 12. In either case, the entire vacuum processing apparatus has a T shape.

  21 and 22, the sample in the cassette 12 is taken out, the taken sample is transported to the vacuum processing region, the sample is transported from the vacuum processing region, and the sample is stored in the base position in the cassette. Are performed by the vacuum transfer robot 10 in a vacuum atmosphere. In this case, as a general rule, the vacuum processing system does not need to be provided with the funnel lock chamber and the unload lock chamber found in the above-described embodiments. The number decreases by this amount.

  In this case, the sample storage state of the cassette is performed in a vacuum atmosphere by the wafer check means. In addition, in the case of having a pre-treatment sample orientation adjusting means, this orientation adjustment is performed in a vacuum atmosphere.

  Further, in the case where an intermediate cassette is provided in a vacuum atmosphere between the cassette and the vacuum processing area, the sample is transferred between the robot that transfers the sample between the cassette and the intermediate cassette and the vacuum processing area. And a robot.

  In the vacuum processing system corresponding to this, the number of elements for the sequential data update of the host computer is increased by this amount due to the installation of the intermediate cassette.

  Further, in the above embodiment, the sample storage state in the cassette, the sample transport state, and the vacuum processing state are all described as being in a horizontal posture with the sample surface to be processed upward, but the sample posture is In other postures, there is no particular problem.

It is an external appearance perspective view of the vacuum processing apparatus which becomes one Example of this invention. It is a principal part longitudinal cross-sectional view of the apparatus of FIG. It is a figure which shows the planar structure of the vacuum processing apparatus along the II-II line | wire of FIG. It is IV-IV sectional drawing of the apparatus of FIG. It is a top view which shows an example of the bay area of the semiconductor manufacturing line incorporating the vacuum processing apparatus of this invention. It is a figure which shows a part of flow of the sample 3 in the semiconductor manufacturing line used as the Example of this invention. It is a figure which shows the relationship of the magnitude | size of the vacuum processing block 2 and the cassette block 1. FIG. It is explanatory drawing of the maintenance of the vacuum processing block of the vacuum processing apparatus of this invention. It is a top view which shows the structural example of the conventional vacuum processing apparatus. It is a figure which shows an example of the mutual relationship of the various elements in a vacuum processing apparatus in this invention. It is a figure which shows the planar structure of the vacuum processing apparatus which becomes the other Example of this invention. It is a perspective view of the vacuum processing apparatus of FIG. It is a figure which shows the planar structure of the vacuum processing apparatus which becomes the other Example of this invention. It is a figure which shows the planar structure of the vacuum processing apparatus which becomes the other Example of this invention. It is a figure which shows the planar structure of the vacuum processing apparatus which becomes the other Example of this invention. It is a top view of other examples of a bay area of the present invention. It is a top view of other examples of a bay area of the present invention. It is a top view of the example of composition of the production line of the present invention. It is a top view of the example of composition of the production line of the present invention. It is a top view of the example of composition of the production line of the present invention. It is a figure which shows the planar structure of the vacuum processing apparatus which becomes the other Example of this invention. It is a figure which shows the planar structure of the vacuum processing apparatus which becomes the other Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Cassette block, 2 ... Vacuum processing block, 3 ... Buffer chamber, 4 ... Load side load lock chamber, 5 ... Unload side load lock chamber, 6 ... Vacuum processing chamber, 7 ... Post vacuum processing chamber, 9 ... Atmospheric robot DESCRIPTION OF SYMBOLS 10 ... Vacuum robot, 100 ... Vacuum processing apparatus.

Claims (2)

A vacuum processing method in a vacuum processing apparatus having a plurality of vacuum processing blocks and a cassette block,
The cassette block has a cassette stage for placing a cassette containing a sample and first sample transport means for transporting the sample,
The vacuum processing block includes a load lock chamber, a vacuum processing chamber for processing the sample under vacuum, and a second sample transporting unit for transporting the sample under vacuum,
The cassette base is disposed at a front portion of the vacuum processing apparatus;
The first sample transport means transports the sample between the cassette and the load lock chamber,
The vacuum processing method in a vacuum processing apparatus, wherein the second sample transporting unit transports the sample under vacuum between the vacuum processing chamber and the load lock chamber. A cassette block having a cassette stage for placing a cassette containing a sample and a first sample transport means for transporting the sample, a load lock chamber, a vacuum processing chamber for processing the sample under vacuum, and under vacuum A vacuum processing method in a vacuum processing apparatus having a plurality of vacuum processing blocks having a second sample transfer means for transferring the sample between the load lock chamber and the vacuum processing chamber,
The cassette base is disposed at the front of the vacuum processing apparatus;
The first sample transport means transports the sample between the cassette and the load lock chamber,
A vacuum processing method in a vacuum processing apparatus, wherein the second sample transport means transports the sample under vacuum between the load lock chamber and the vacuum processing chamber.

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