JP2007129039A - Fluorine resin printed circuit board and manufacturing method thereof - Google Patents

Fluorine resin printed circuit board and manufacturing method thereof Download PDF

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JP2007129039A
JP2007129039A JP2005319850A JP2005319850A JP2007129039A JP 2007129039 A JP2007129039 A JP 2007129039A JP 2005319850 A JP2005319850 A JP 2005319850A JP 2005319850 A JP2005319850 A JP 2005319850A JP 2007129039 A JP2007129039 A JP 2007129039A
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printed circuit
circuit board
fluororesin
curved
prepreg
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Masamori Akamatsu
正守 赤松
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Nippon Pillar Packing Co Ltd
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Nippon Pillar Packing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a fluorine resin printed circuit board which may be mounted through matching with the curving surface, and also to provide a manufacturing method of the same printed circuit board. <P>SOLUTION: The fluorine resin printed circuit board 1 comprises a prepreg laminated body 3 formed by laminating a plurality of layers of prepreg 2 formed by impregnation of fluorine resin into a glass cloth, and a conductive metal foil 4 laminated to at least single surface of the prepreg laminated body 3. The prepreg laminated body 3 and the metal foil 4 are curved with the press molding at the temperature higher than the melting point of the fluorine resin, under the vacuum condition using a pair of metal dies 7 constituted with a male die 8 including the curved projection 8a and a female die 9 including a curved recess 9a corresponding to the projection 8a. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、情報通信機器等における高周波帯域で用いられるアンテナ部品や、ＩＣパッケージ等の半導体基板として用いられるフッ素樹脂プリント基板及びその製造方法に関する。   The present invention relates to a fluororesin printed circuit board used as an antenna component used in a high frequency band in information communication equipment or the like, a semiconductor substrate such as an IC package, and a manufacturing method thereof.

近年の高度情報化社会の到来に伴い、通信手段の革新が著しく、情報伝達はより高速化、高周波化の傾向にある。特に、衛星放送、衛星通信の時代を迎えて、ＢＳコンバーター、アンテナなどの高周波回路のプリント基板では、より高速度の情報伝達に適した高周波帯域、特にミリメートル波帯域（３０〜３００ＧＨｚ）に対応できることが要望されている一方で、例えばミサイルのような筒状の筐体に取り付けるために、曲率形状を有する（湾曲した）プリント基板の要望もある。
現在、誘電特性の優れたプリント基板には、ガラスクロスにフッ素樹脂を含浸させたプリプレグに配線パターン形成用の金属箔を積層させた平面板状のフッ素樹脂プリント基板が使用されている（例えば、特許文献１参照）。また、曲面に取り付けるプリント基板としては、ポリイミド系のフレキシブル基板が主流である。
特開平７−３２３５０１号公報 With the advent of the advanced information society in recent years, communication means have been renovated significantly, and information transmission tends to be faster and higher in frequency. In particular, in the era of satellite broadcasting and satellite communications, printed circuit boards for high-frequency circuits such as BS converters and antennas should be able to support high-frequency bands suitable for higher-speed information transmission, particularly millimeter wave bands (30 to 300 GHz). On the other hand, there is also a demand for a printed circuit board having a curved shape (curved) for attachment to a cylindrical housing such as a missile.
At present, a flat plate-like fluororesin printed board in which a metal foil for forming a wiring pattern is laminated on a prepreg in which a glass cloth is impregnated with a fluororesin is used as a printed board having excellent dielectric properties (for example, Patent Document 1). Moreover, as a printed circuit board attached to a curved surface, a polyimide-type flexible substrate is mainstream.
JP-A-7-323501

しかしながら、ポリイミド系のフレキシブル基板は高周波帯域では誘電特性が悪いため、高周波帯域で使用することは難しい。一方、一旦平面板状に形成されたフッ素樹脂プリント基板に後から熱を加えて湾曲させる方法は、金属箔が延びないためにプリント基板が割れてしまうので使用することができない。
本発明はこのような事情に鑑みてなされたものであり、曲面に合致させて取り付けることができるフッ素樹脂プリント基板及びその製造方法を提供することを目的としている。 However, since the polyimide-based flexible substrate has poor dielectric properties in the high frequency band, it is difficult to use it in the high frequency band. On the other hand, the method of applying heat to the fluororesin printed circuit board once formed into a flat plate shape to bend cannot be used because the printed circuit board is broken because the metal foil does not extend.
This invention is made | formed in view of such a situation, and it aims at providing the fluororesin printed circuit board which can be attached according to a curved surface, and its manufacturing method.

本発明のフッ素樹脂プリント基板は、ガラスクロスにフッ素樹脂が含浸されてなるプリプレグを複数枚積層したプリプレグ積層体と、このプリプレグ積層体の少なくとも片面に積層した導電性の金属箔とを備えるフッ素樹脂プリント基板であって、
前記プリプレグ積層体と金属箔とは、湾曲した凸部を有する雄型とこの凸部に対応する湾曲した凹部を有する雌型とから構成される一対の金型を用いて、真空下で前記フッ素樹脂の融点より高温でプレス成形することによって湾曲されていることを特徴としている。
このフッ素樹脂プリント基板によれば、湾曲した形状を有しているので、その曲率を適宜選択することにより曲率形状を有する取り付け部に合致させて取り付けることができる。 A fluororesin printed circuit board according to the present invention comprises a prepreg laminate in which a plurality of prepregs obtained by impregnating a glass cloth with a fluororesin are laminated, and a conductive metal foil laminated on at least one surface of the prepreg laminate. A printed circuit board,
The prepreg laminate and the metal foil are formed by using a pair of molds composed of a male mold having a curved convex portion and a female mold having a curved concave portion corresponding to the convex portion, and the fluorine under vacuum. It is characterized by being curved by press molding at a temperature higher than the melting point of the resin.
According to this fluororesin printed circuit board, since it has a curved shape, it can be attached in conformity with the attachment portion having the curvature shape by appropriately selecting the curvature.

本発明のフッ素樹脂プリント基板の製造方法は、ガラスクロスにフッ素樹脂が含浸されてなるプリプレグを複数枚重ねて互いに位置決めしたプリプレグ群と、この少なくとも片面に添わせた導電性の金属箔とを、湾曲した凸部を有する雄型とこの凸部に対応する湾曲した凹部を有する雌型とから構成される一対の金型の間に配置し、これらプリプレグ群と金属箔とを前記一対の金型によって、真空下で前記フッ素樹脂の融点より高温でプレス成形して湾曲させると同時に積層一体化させることを特徴としている。
この製造方法を使用すれば、プリプレグ群と金属箔との積層プレス工程と、曲げ成形工程とを同時に行うことができるので、湾曲したフッ素樹脂プリント基板を簡単に製造することができる。また、一対の金型の凸部及び凹部の曲率を取り付け部の曲率に設定することにより、取り付け部の曲率形状と略同一の曲率形状を有するフッ素樹脂プリント基板を製造することができる。 The method for producing a fluororesin printed circuit board according to the present invention comprises a group of prepregs in which a plurality of prepregs formed by impregnating a fluororesin into a glass cloth are positioned with respect to each other, and a conductive metal foil attached to at least one side of the prepreg group. It arrange | positions between a pair of metal mold | die comprised from the male type | mold which has a curved convex part, and the female type | mold which has the curved recessed part corresponding to this convex part, These prepreg group and metal foil are said pair of metal mold | dies. Is characterized in that, under vacuum, it is press-molded at a temperature higher than the melting point of the fluororesin and curved and simultaneously laminated.
If this manufacturing method is used, since the lamination press process of a prepreg group and metal foil and a bending process can be performed simultaneously, the curved fluororesin printed circuit board can be manufactured easily. Moreover, the fluororesin printed circuit board which has a curvature shape substantially the same as the curvature shape of an attachment part can be manufactured by setting the curvature of a convex part and a recessed part of a pair of metal mold | die to the curvature of an attachment part.

上記のフッ素樹脂プリント基板の製造方法において、前記一対の金型の凸部及び凹部に金属薄板を添わせて前記プリプレグ群と金属箔とをプレス成形してもよい。この場合、金属薄板を一対の金型の凸部及び凹部に添わせることにより金型を保護しながらフッ素樹脂プリント基板を成形することができる。   In the above-described method for manufacturing a fluororesin printed board, the prepreg group and the metal foil may be press-molded by attaching a metal thin plate to the convex and concave portions of the pair of molds. In this case, the fluororesin printed board can be molded while protecting the metal mold by attaching the metal thin plate to the convex and concave portions of the pair of metal molds.

本発明のフッ素樹脂プリント基板によれば、湾曲曲率を適宜選択することにより、曲率形状を有する取り付け部に合致させて取り付けることができる。また、本発明のフッ素樹脂プリント基板の製造方法によれば、前記湾曲したフッ素樹脂プリント基板を容易に製造することができる。   According to the fluororesin printed circuit board of the present invention, it is possible to attach it in conformity with the attachment part having the curvature shape by appropriately selecting the curvature of curvature. Moreover, according to the manufacturing method of the fluororesin printed circuit board of this invention, the said curved fluororesin printed circuit board can be manufactured easily.

以下、本発明の実施形態を、添付した図面に基づいて説明する。
図１は、本発明の実施の形態に係るフッ素樹脂プリント基板１を示す斜視図である。フッ素樹脂プリント基板１は、ガラスクロスにフッ素樹脂が含浸されてなるプリプレグ２を４枚積層したプリプレグ積層体３と、このプリプレグ積層体３の両面に積層した導電性の金属箔としての銅箔４とを備えている。そして、プリプレグ積層体３と銅箔４とは、後述する一対の金型７を用いて、真空下で前記フッ素樹脂の融点より高温でプレス成形することによって湾曲されている。なお、上記実施の形態においてはプリプレグ２を４枚積層したものが示されているが、プリプレグ２の枚数はこれに限られず、用途に応じて適宜選択することができる。 Embodiments of the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is a perspective view showing a fluororesin printed circuit board 1 according to an embodiment of the present invention. The fluororesin printed circuit board 1 includes a prepreg laminate 3 in which four prepregs 2 in which a glass cloth is impregnated with a fluororesin is laminated, and a copper foil 4 as a conductive metal foil laminated on both surfaces of the prepreg laminate 3. And. The prepreg laminate 3 and the copper foil 4 are curved by press molding at a temperature higher than the melting point of the fluororesin under vacuum using a pair of molds 7 to be described later. In addition, in the said embodiment, what laminated | stacked four prepregs 2 is shown, However, The number of the prepregs 2 is not restricted to this, It can select suitably according to a use.

ここで、ガラスクロスに含浸させるフッ素樹脂としては、ポリテトラフルオロエチレン（ＰＴＦＥ）が用いられるが、これ以外にも、例えば、テトラフルオロエチレン−パーフルオロアルキルビニルエーテル共重合体（ＰＦＡ）、テトラフルオロエチレン−パーフルオロアルコキシエチレン共重合体（ＰＦＥ）、テトラフルオロエチレン−ヘキサフルオロプロピレン共重合体（ＦＥＰ）、テトラフルオロエチレン−エチレン共重合体（ＥＴＦＥ）を用いることができる。   Here, polytetrafluoroethylene (PTFE) is used as the fluororesin impregnated into the glass cloth, but other than this, for example, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene, and the like. -Perfluoroalkoxyethylene copolymer (PFE), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), and tetrafluoroethylene-ethylene copolymer (ETFE) can be used.

図２は、フッ素樹脂プリント基板１の製造方法における一工程を示す概略図である。
フッ素樹脂プリント基板１の製造方法として、まず、プリプレグ２を製造する。すなわち、フッ素樹脂として平均粒径０．２〜０．５μｍのポリテトラフルオロエチレン（ＰＴＦＥ）粒子を用いて濃度６０％のＰＴＦＥ樹脂ディスパージョンを構成し、目付４８ｇ／ｍ２のガラスクロスに上記ＰＴＦＥ樹脂ディスパージョンを含浸させ、１００℃で乾燥して脱水し、さらに３０５℃でベーキングして界面活性剤を除去させることにより未焼結樹脂を上記ガラスクロスに保持させる。このような含浸及び乾燥を繰り返して樹脂含有量が５０〜９３％の範囲内、例えば７０％のプリプレグ２を得る。このプリプレグ２を４枚重ね、両端の適当な位置に形成された貫通孔にピン５を挿入し、このピン５で各プリプレグ２を互いに位置決めしてプリプレグ群６を構成する。 FIG. 2 is a schematic view showing one step in the method for manufacturing the fluororesin printed board 1.
As a manufacturing method of the fluororesin printed circuit board 1, first, the prepreg 2 is manufactured. That is, a polytetrafluoroethylene (PTFE) particle having an average particle diameter of 0.2 to 0.5 μm as a fluororesin is used to constitute a PTFE resin dispersion having a concentration of 60%, and the above PTFE is formed on a glass cloth having a basis weight of 48 g / m 2. The resin dispersion is impregnated, dried at 100 ° C., dehydrated, and baked at 305 ° C. to remove the surfactant, thereby holding the unsintered resin on the glass cloth. Such impregnation and drying are repeated to obtain a prepreg 2 having a resin content of 50 to 93%, for example, 70%. Four prepregs 2 are stacked, pins 5 are inserted into through holes formed at appropriate positions on both ends, and the prepregs 2 are positioned with each other by the pins 5 to constitute a prepreg group 6.

次に、一対の金型７を用いて成形工程を行う。一対の金型７は、湾曲した凸部８ａを有する雄型８とこの凸部８ａに対応する湾曲した凹部９ａを有する雌型９とから構成される。ここで、これら凸部８ａ、凹部９ａはそれぞれ円筒形筐体物等の取り付け部の曲率形状と略同一の曲率形状に設定されている。この成形工程においては、雄型８の凸部８ａと雌型９の凹部９ａとの間に、図２に示すように、下から、例えばステンレス製の金属薄板１０、銅箔４、プリプレグ群６、銅箔４、例えばステンレス製の金属薄板１０の順に配置し、真空熱プレス機で、真空度１０ｈＰａ以下、面圧３０ｋｇｆ／ｃｍ２、ＰＴＦＥの融点（３２７℃）よりも高い温度（３８０℃）で３０分間プレス成形する。ここで、１０ｈＰａ以下の真空下で成形を行うのは、内部空孔残留防止のためであり、金属薄板１０は、金型を保護するために一対の金型７の凸部８ａ及び凹部９ａに添わせている。こうして、プリプレグ群６と銅箔４とを熱融着させて積層一体化し、その後に金属薄板１０を除くと、絶縁層としてのプリプレグ積層体３と導電体層としての銅箔４とを備えたフッ素樹脂プリント基板１が得られる。
その後、フッ素樹脂プリント基板１は導電路のパターン形成等の後工程が施され、所望のパターンの導電路が設けられた状態で使用される。パターン形成は、剥離現像型ホトレジスト、溶解現像型ホトレジスト等を用いて行われる。 Next, a molding process is performed using a pair of molds 7. The pair of molds 7 includes a male mold 8 having a curved convex portion 8a and a female mold 9 having a curved concave portion 9a corresponding to the convex portion 8a. Here, the convex portion 8a and the concave portion 9a are set to have substantially the same curvature shape as the curvature shape of the attachment portion such as the cylindrical housing. In this molding step, as shown in FIG. 2, between the convex portion 8a of the male die 8 and the concave portion 9a of the female die 9, from the bottom, for example, a thin metal plate 10, copper foil 4, and prepreg group 6 made of stainless steel. The copper foil 4 is placed in the order of, for example, a stainless steel thin metal plate 10, and the temperature (380 ° C.) is higher than the melting point (327 ° C.) of PTFE, using a vacuum hot press, with a degree of vacuum of 10 hPa or less, a surface pressure of 30 kgf / cm 2 Press for 30 minutes. Here, the molding is performed under a vacuum of 10 hPa or less in order to prevent the residual internal holes, and the metal thin plate 10 is formed on the convex portions 8a and the concave portions 9a of the pair of molds 7 in order to protect the molds. I'll accompany you. In this way, when the prepreg group 6 and the copper foil 4 were heat-sealed and laminated and integrated, and then the metal thin plate 10 was removed, the prepreg laminate 3 as an insulating layer and the copper foil 4 as a conductor layer were provided. A fluororesin printed circuit board 1 is obtained.
Thereafter, the fluororesin printed circuit board 1 is used in a state in which a conductive path having a desired pattern is provided after a post-process such as pattern formation of a conductive path. The pattern formation is performed using a peeling development type photoresist, a dissolution development type photoresist, or the like.

この製造方法を使用すれば、プリプレグ群６と銅箔４との積層プレス工程と、曲げ成形工程とを同時に行うことができるので、湾曲したフッ素樹脂プリント基板１を簡単に製造することができる。また、フッ素樹脂は熱可塑性樹脂であり、その融点よりも高い温度で熱プレスするので、フッ素樹脂プリント基板１の曲率形状が保持され、経時変化等によっても曲率が戻ることはない。   If this manufacturing method is used, since the lamination press process of the prepreg group 6 and the copper foil 4 and the bending process can be performed simultaneously, the curved fluororesin printed circuit board 1 can be manufactured easily. Further, since the fluororesin is a thermoplastic resin and is hot-pressed at a temperature higher than its melting point, the curvature shape of the fluororesin printed board 1 is maintained, and the curvature does not return due to a change with time.

本発明のフッ素樹脂プリント基板１は、取り付け部の曲率形状と略同一の曲率形状を有しているので、図３に示すように、円筒形筐体物１１の曲率に沿って取り付けることができる。さらに、取り付け部の外周面にフッ素樹脂プリント基板１の厚みと等しい深さの凹部を形成すれば、フッ素樹脂プリント基板１が円筒形筐体物１１に隙間なく且つその外周面から突出することなく取り付けることができる。このフッ素樹脂プリント基板１は、例えば、誘導ミサイル用アンテナ、筒状アンテナとして使用することができる。   Since the fluororesin printed circuit board 1 of the present invention has a curvature shape substantially the same as the curvature shape of the attachment portion, it can be attached along the curvature of the cylindrical casing 11 as shown in FIG. . Further, if a concave portion having a depth equal to the thickness of the fluororesin printed board 1 is formed on the outer peripheral surface of the mounting portion, the fluororesin printed board 1 does not protrude from the outer peripheral surface without any gap in the cylindrical housing 11. Can be attached. This fluororesin printed circuit board 1 can be used as, for example, an induction missile antenna or a cylindrical antenna.

本発明において、前述の実施形態に限らず、本発明の範囲内で適宜変更が可能である。
フッ素樹脂プリント基板１において、金属箔をプリプレグ積層体３の両面に配置しているが、少なくとも片面に配置すればよい。また、金属箔として銅箔４を用いているが、アルミニウム、鉄、ステンレス、ニッケル等の金属又はこれらの合金の箔を使用してもかまわない。
前述の製造方法において、各プリプレグ２の位置決めは、ピン５以外のもの、例えば、クリップ、接着剤で行うことも可能である。また、金属薄板１０は必ず使用しなければならないわけではなく、必要により用いればよい。 The present invention is not limited to the above-described embodiment, and can be appropriately changed within the scope of the present invention.
In the fluororesin printed circuit board 1, the metal foil is disposed on both surfaces of the prepreg laminate 3, but may be disposed on at least one surface. Further, although the copper foil 4 is used as the metal foil, a foil of a metal such as aluminum, iron, stainless steel, nickel, or an alloy thereof may be used.
In the manufacturing method described above, the positioning of each prepreg 2 can be performed using a material other than the pin 5, such as a clip or an adhesive. Further, the thin metal plate 10 is not necessarily used, and may be used as necessary.

図３において、フッ素樹脂プリント基板１は円筒形筐体物１１の外周面の一部に取り付けられているが、同曲率の基板を周方向に沿って複数枚配列することにより、全曲面に取り付けることも可能である。また、取り付け部の曲率が異なる場合、例えば、断面が楕円形状の保持体１２である場合には、金型の凸部と凹部の曲率を変えて、曲率の異なる基板を作製することにより、図４に示すように、全周に取り付けることも可能である。この場合、車載用アンテナ、ポール型アンテナとして使用可能である。
さらに、フッ素樹脂プリント基板１は取り付け部の表面に露出した状態で取り付ける必要はなく、ケーシング１３が電波を通す素材であれば、図５に示すように、ケーシング１３の内部に取り付けて、ロボットの胸内アンテナ、自動車のバンパー、ミラー等に取り付け可能なアンテナ等として使用することができる。この場合、限られた内部スペースを有効利用することができ、ケーシングとの隙間がないのでアンテナ利得が向上する。 In FIG. 3, the fluororesin printed circuit board 1 is attached to a part of the outer peripheral surface of the cylindrical casing 11, but is attached to the entire curved surface by arranging a plurality of substrates having the same curvature along the circumferential direction. It is also possible. In addition, when the curvature of the attachment portion is different, for example, when the cross section is the holding body 12 having an elliptical shape, the curvature of the convex portion and the concave portion of the mold is changed to produce a substrate having different curvatures. As shown in FIG. 4, it can also be attached to the entire circumference. In this case, it can be used as a vehicle-mounted antenna or a pole-type antenna.
Furthermore, the fluororesin printed circuit board 1 does not need to be attached in a state where it is exposed on the surface of the attachment portion. If the casing 13 is a material that allows radio waves to pass through, it is attached to the inside of the casing 13 as shown in FIG. It can be used as an antenna that can be attached to an intrathoracic antenna, an automobile bumper, a mirror, or the like. In this case, the limited internal space can be used effectively, and since there is no gap with the casing, the antenna gain is improved.

本発明の実施の形態に係るフッ素樹脂プリント基板を示す斜視図である。It is a perspective view which shows the fluororesin printed circuit board which concerns on embodiment of this invention. 本発明の実施の形態に係るフッ素樹脂プリント基板の製造方法における一工程を示す概略図である。It is the schematic which shows 1 process in the manufacturing method of the fluororesin printed circuit board which concerns on embodiment of this invention. 本発明の実施の形態に係るフッ素樹脂プリント基板の円筒形筐体物への使用例を示す斜視図である。It is a perspective view which shows the usage example to the cylindrical housing | casing thing of the fluororesin printed circuit board which concerns on embodiment of this invention. 本発明の実施の形態に係るフッ素樹脂プリント基板の別の使用例を示す横断面図である。It is a cross-sectional view which shows another example of use of the fluororesin printed circuit board concerning embodiment of this invention. 本発明の実施の形態に係るフッ素樹脂プリント基板のさらに別の使用例を示す横断面図である。It is a cross-sectional view which shows another example of use of the fluororesin printed circuit board which concerns on embodiment of this invention.

符号の説明Explanation of symbols

１ フッ素樹脂プリント基板
２ プリプレグ
３ プリプレグ積層体
４ 金属箔（銅箔） DESCRIPTION OF SYMBOLS 1 Fluororesin printed circuit board 2 Prepreg 3 Prepreg laminated body 4 Metal foil (copper foil)

Claims (3)

ガラスクロスにフッ素樹脂が含浸されてなるプリプレグを複数枚積層したプリプレグ積層体と、このプリプレグ積層体の少なくとも片面に積層した導電性の金属箔とを備えるフッ素樹脂プリント基板であって、
前記プリプレグ積層体と金属箔とは、湾曲した凸部を有する雄型とこの凸部に対応する湾曲した凹部を有する雌型とから構成される一対の金型を用いて、真空下で前記フッ素樹脂の融点より高温でプレス成形することによって湾曲されていることを特徴とするフッ素樹脂プリント基板。 A fluororesin printed circuit board comprising a prepreg laminate in which a plurality of prepregs made of glass cloth impregnated with a fluororesin and a conductive metal foil laminated on at least one surface of the prepreg laminate,
The prepreg laminate and the metal foil are formed by using a pair of molds composed of a male mold having a curved convex portion and a female mold having a curved concave portion corresponding to the convex portion, and the fluorine under vacuum. A fluororesin printed circuit board which is curved by press molding at a temperature higher than the melting point of the resin. 請求項１に記載のフッ素樹脂プリント基板の製造方法であって、
ガラスクロスにフッ素樹脂が含浸されてなるプリプレグを複数枚重ねて互いに位置決めしたプリプレグ群と、この少なくとも片面に添わせた導電性の金属箔とを、湾曲した凸部を有する雄型とこの凸部に対応する湾曲した凹部を有する雌型とから構成される一対の金型の間に配置し、これらプリプレグ群と金属箔とを前記一対の金型によって、真空下で前記フッ素樹脂の融点より高温でプレス成形して湾曲させると同時に積層一体化させることを特徴とするフッ素樹脂プリント基板の製造方法。 It is a manufacturing method of the fluororesin printed circuit board according to claim 1,
A male mold having a curved convex portion and a convex portion of a prepreg group in which a plurality of prepregs each having a glass cloth impregnated with a fluororesin are stacked and positioned with respect to each other, and a conductive metal foil attached to at least one surface thereof. The prepreg group and the metal foil are placed between a pair of molds composed of a female mold having a curved recess corresponding to the above, and the melting point of the fluororesin is higher than that of the fluororesin under vacuum by the pair of molds. A method for producing a fluororesin printed circuit board, characterized in that it is press-molded and curved and simultaneously laminated and integrated. 前記一対の金型の凸部及び凹部に金属薄板を添わせて前記プリプレグ群と金属箔とをプレス成形する請求項２に記載のフッ素樹脂プリント基板の製造方法。   The manufacturing method of the fluororesin printed circuit board of Claim 2 which press-molds the said prepreg group and metal foil by making a metal thin plate attach to the convex part and recessed part of a pair of said metal mold | die.
JP2005319850A 2005-11-02 2005-11-02 Fluorine resin printed circuit board and manufacturing method thereof Pending JP2007129039A (en)

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US8492898B2 (en) 2007-02-19 2013-07-23 Semblant Global Limited Printed circuit boards
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US8492898B2 (en) 2007-02-19 2013-07-23 Semblant Global Limited Printed circuit boards
US9648720B2 (en) 2007-02-19 2017-05-09 Semblant Global Limited Method for manufacturing printed circuit boards
US9055700B2 (en) 2008-08-18 2015-06-09 Semblant Limited Apparatus with a multi-layer coating and method of forming the same
US8247702B2 (en) 2009-02-27 2012-08-21 Denso Corporation Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
US9320141B2 (en) 2009-07-16 2016-04-19 Nec Corporation Wiring structure, cable, and method of manufacturing wiring structure
JP2011125136A (en) * 2009-12-10 2011-06-23 Nippon Pulse Motor Co Ltd Movable element for linear motor
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
JP2012019064A (en) * 2010-07-08 2012-01-26 Mitsubishi Steel Mfg Co Ltd Method for sticking flexible substrate
KR101830247B1 (en) * 2016-02-05 2018-02-20 한솔테크닉스(주) The manufacturing method of curved type board and the circuit board using the same
KR20170104327A (en) * 2016-03-07 2017-09-15 주식회사 케이씨씨 apparatus set for producing warpage of ceramic substrate and method for producing warpage of ceramic substrate using there of
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US11786930B2 (en) 2016-12-13 2023-10-17 Hzo, Inc. Protective coating
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CN114248422A (en) * 2021-12-03 2022-03-29 中国电子科技集团公司第二十九研究所 Bending and shaping tool and method for RT/Duriod plate
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