JP2006329701A - Thermal shock testing device, and testing method for thermal shock test - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermal shock testing device capable of shortening a time required for executing one cycle of thermal cycle, to the minimum, and capable of carrying out a thermal shock test under a stable condition, irrespective of conditions such as a heat capacity of a sample and a quantity of the sample, and a testing method for the thermal shock test. <P>SOLUTION: This thermal shock testing device 1 has a high temperature testing vessel 2 and a low temperature testing vessel 3, and a rack 4 for mounting the sample is movable between the both. The thermal shock testing device 1 stores a difference time between a time until an ambient temperature in a testing environment detected by an environment temperature detecting sensor 9 reaches a prescribed temperature, and a time until a temperature of the sample W itself reaches the prescribed temperature, in a preliminary test. In the thermal shock testing device 1, the sample W is exposed under the testing environment over a prescribed exposure time counted from a time point with the lapse of the difference time, after the detection temperature by the environment temperature detecting sensor 9 reaches the prescribed set temperature, in an objective test. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a thermal shock test apparatus and a test method for a thermal shock test.

  In recent years, the configuration has become complicated due to the downsizing and high functionality of electronic components and electronic devices. In addition, miniaturized devices such as mobile phones and in-vehicle devices are used in various environments. Temperature stress due to the usage environment of the equipment and repeated operation / stopping may greatly affect the reliability of the equipment. Therefore, reliability evaluation tests for temperature stress are often carried out in the manufacture and development of devices that are concerned about the effects of temperature stress and the components used therefor.

  Conventionally, a thermal shock test is generally performed as a reliability evaluation method against temperature stress. In the thermal shock test, for example, a plurality of test chambers having different ambient temperatures are prepared, housed in one of the test chambers, and the sample is exposed to the ambient temperature for a predetermined exposure time. This is a test for evaluating the resistance of a sample by moving it to a test room and repeating a series of cooling and cycling operations in which the sample is exposed to the ambient temperature of the test room for a predetermined exposure time to give a rapid temperature change to the sample.

  Here, in the thermal shock test that has been generally performed conventionally, the ambient temperature to which the sample is exposed is monitored, and the exposure time is adjusted based on this. More specifically, the conventional thermal shock test employs a method in which the sample is exposed to the test environment for a predetermined exposure time from when the ambient temperature reaches a predetermined temperature after switching the test environment to which the sample is exposed. ing.

JP-A-6-123687 JP 2002-107280 A

  In the above-described conventional thermal shock test, the sample was set even though the ambient temperature of the test environment to which the sample was exposed reached the set temperature depending on the size of the sample and the location of the sample in the test tank. Sometimes the temperature range was not reached. Therefore, in the past, in order to prevent variation in the test conditions of the thermal shock test depending on the sample size, installation location, etc., a large amount of time required for the sample to reach a predetermined temperature is estimated, and that much per cycle Measures such as setting a longer exposure time were taken.

  However, as described above, if the exposure time per cycle is long, there is a problem that the test period becomes long. In general, since the thermal shock test is often performed by repeating a number of cycles such as 300 to 2000 cycles, if the exposure time per cycle is increased as much as possible, the test period becomes longer. There was a problem.

  Further, when performing the thermal shock test, it is assumed that the time required to reach a predetermined temperature of the sample varies depending on the number of samples and the heat capacity. For this reason, as described above, if the exposure time per cycle is long, and if the heat capacity of the sample is large or the number of samples is large, the exposure time must be increased within the set time unless the exposure time is sufficiently long. The low temperature set temperature range may not be reached. In addition, if the sample is exposed to a longer exposure time when a thermal shock test is performed on a sample with a large heat capacity, the sample is used when a sample with a small heat capacity is used for the test or when the number of samples to be tested is small. There is a problem that the time from when the temperature reaches the set temperature until the exposure time is completed is longer than when the heat capacity of the sample is large or the number of samples is large. That is, in the conventional thermal shock test, even if the set temperature and exposure time of the ambient temperature of the test environment are the same, the conditions of the thermal shock test may change depending on the conditions such as the heat capacity of the sample and the number of samples. there were.

  As a method for solving these problems, a method of monitoring the temperature of the sample by attaching a temperature sensor to the sample itself or measuring the resistance value of the sample and controlling the exposure time based on this temperature can be considered. . However, when performing a thermal shock test, a large temperature stress is applied to the sample and the temperature sensor attached to the sample, so that the temperature sensor attached to the sample may come off or break down. In addition, if a crack or the like occurs in the sample due to temperature stress during the thermal shock test, the sample temperature cannot be accurately grasped due to a change in the resistance value of the sample, and the test conditions of the thermal shock test become unstable. There is a high possibility that

  Based on this knowledge, the present invention can minimize the time required to perform one cooling / heating cycle, and can perform a thermal shock test under stable conditions regardless of conditions such as the heat capacity of the sample and the number of samples. An object of the present invention is to provide a thermal shock test apparatus and a test method for a thermal shock test.

  The invention according to claim 1, which is provided to solve the above-described problem, is that the test environment in which the sample is exposed to another constant atmospheric temperature after the sample is exposed to the test environment adjusted to a constant atmospheric temperature. A thermal shock test apparatus capable of repeatedly performing a series of thermal cycle operations for switching to an adjusted test environment, the environmental temperature detection means for detecting the ambient temperature of the test environment to which the sample is exposed, and the sample delay time derivation means The delay time deriving means includes a time until the temperature in the sample storage chamber in which the sample is stored reaches a predetermined temperature when the test environment to which the sample is exposed is switched, and the sample itself is the predetermined value. The time to reach the temperature of the sample is calculated and the test delay time is derived based on the time difference. When the test environment to which the sample is exposed is switched, The thermal shock test is performed by switching the test environment to which the sample is exposed after the test delay time has elapsed and the predetermined exposure time has elapsed after the ambient temperature detected by It is a thermal shock test apparatus characterized by being practicable.

  In the thermal shock test apparatus of the present invention, the time required for the sample to reach a predetermined temperature as the test environment is switched is regarded as the difference time, and the time required for the sample temperature to stabilize when the test environment is switched is determined. It can be grasped as the test delay time. Therefore, the thermal shock test apparatus of the present invention does not need to set the sample exposure time longer than necessary as in the prior art, and minimizes the time required to perform one cycle of the thermal cycle operation. can do.

  Further, the thermal shock test apparatus of the present invention derives the difference time and grasps the test delay time, so that the sample can be exposed for a predetermined exposure time without detecting the temperature of the sample in the subsequent thermal cycle. It can be exposed to a test environment adjusted to a predetermined ambient temperature. Therefore, according to the thermal shock test apparatus, even if the state of the sample or the like changes with the progress of the thermal shock test, the sample can be exposed to a desired test environment, and an accurate test result can be obtained.

  In the present invention and each invention described below, “the test delay time derived based on the difference time” may be the difference time itself, and other factors are added to the difference time. Or may be derived by applying the difference time to a predetermined arithmetic expression.

  In the present invention and each of the inventions described below, the “difference time” was calculated by performing a cycle of a series of cooling and heating cycles for one cycle, and the cooling cycle was performed over many cycles. It may be derived by applying the result to a predetermined arithmetic expression or rule. More specifically, for example, the cooling cycle is performed over many cycles, and the time until the temperature in the sample storage chamber reaches a predetermined temperature for each cycle and the time until the sample itself reaches the predetermined temperature. May be derived and the time difference in each cooling cycle may be substituted into a predetermined arithmetic expression to derive the difference time, or a representative value selected from the time difference in each cooling cycle may be employed as the difference time.

  The invention described in claim 2 has a sample temperature detecting means for detecting the temperature of the sample, has a sample temperature detecting means for detecting the temperature of the sample, and the temperature of the sample detected by the sample temperature detecting means is It is possible to perform a preliminary test to switch the test environment to which the sample is exposed after the predetermined exposure time has elapsed with respect to the time point when the predetermined temperature is reached, to another test environment. The difference between the time required for the ambient temperature detected by the environmental temperature detection means to reach a predetermined temperature with the switching of the environment and the time required for the sample itself to reach the predetermined temperature is different. 2. The thermal shock test apparatus according to claim 1, wherein the test delay time is calculated based on the difference time and calculated as time.

  In the thermal shock test apparatus of the present invention, the difference time can be calculated by the preliminary test, and the test delay time can be accurately derived. Therefore, during the test, the thermal shock test apparatus of the present invention may cause problems such as the sample temperature detecting means being detached from the sample or being damaged, the sample may be cracked due to thermal shock, or the resistance value of the sample may be changed. Even if there is a change, the sample can be exposed over a predetermined exposure time in a test environment adjusted to a predetermined atmospheric temperature, and an accurate test result can be obtained.

  According to a third aspect of the present invention, the sample temperature detecting means can measure the temperature of the sample at a plurality of measurement points, and the difference time is measured at all the measurement points detected by the sample temperature detecting means. 3. The thermal shock test apparatus according to claim 2, wherein the temperature is calculated based on a time until the temperature reaches a predetermined temperature.

  According to such a configuration, even when the speed at which the sample reaches a predetermined temperature due to the switching of the test environment varies due to the position where the sample is arranged, the entire sample is in the predetermined range. The sample can be exposed to the test environment for a predetermined exposure time after reaching temperature.

  In the present invention, the “difference time” is a time required for the sample temperature to reach a predetermined temperature at all measurement points detected by the sample temperature detection means. It may be derived by applying to an expression or rule.

  In the invention described in claim 4, the sample temperature detecting means can measure the temperature of the sample at a plurality of measurement points, and the difference time is selected from the plurality of measurement points detected by the sample temperature detecting means. 3. The thermal shock test apparatus according to claim 2, wherein the temperature is calculated based on a time until the temperature of the sample at a given measurement point reaches a predetermined temperature.

  According to such a configuration, even when the speed at which the sample reaches a predetermined temperature varies when the test environment is switched due to the location of the sample, the variation is taken into account. It is possible to carry out a thermal shock test without excessive or insufficient exposure time.

  In the present invention, the “difference time” is the time until the temperature of the sample at a given measurement point reaches a predetermined temperature itself, and this time is applied to a predetermined arithmetic expression or rule. It may be derived.

  Here, in the case where the difference time is derived by performing the preliminary test as described above, it is assumed that the accuracy of the difference time greatly affects the test accuracy of the thermal shock test.

  Accordingly, the invention according to claim 5 provided based on such knowledge is characterized in that the preliminary test is performed after the running-in test in which the cooling / heating cycle operation is performed over a predetermined number of cycles is performed. It is a thermal shock test apparatus in any one of 2 thru | or 4.

  In the thermal shock test apparatus of the present invention, since the preliminary test is performed in a state where the break-in test is performed and the test state is stabilized to some extent, the difference time can be set accurately. Therefore, according to the thermal shock test apparatus of the present invention, a highly accurate thermal shock test can be performed.

  The invention according to claim 6 has first and second sample storage chambers for storing the sample, and after exposing the sample to the first sample storage chamber adjusted to have a constant atmospheric temperature, 6. The test environment to which the sample is exposed can be switched by moving the sample to the second sample storage chamber adjusted to another constant atmospheric temperature. It is a thermal shock test apparatus of description.

  Since the thermal shock test apparatus of the present invention is configured to be able to move the sample between the first sample storage chamber and the second sample storage chamber, it is like the sample temperature detection means described above when the sample is moved. There is a possibility that a detection means for detecting the temperature of a sample will come off from the sample or a wiring connected to the detection means etc. may be disconnected. However, as described above, the thermal shock test apparatus of the present invention performs the thermal shock test based on a preset difference time. Therefore, according to the present invention, a thermal shock test apparatus capable of performing a thermal shock test over a predetermined exposure time after the sample reaches a predetermined temperature even when the sample is moved as described above. Can be provided.

  The thermal shock test apparatus according to any one of claims 1 to 5 includes a sample storage chamber for storing a sample, and a test environment to which the sample is exposed by switching an ambient temperature in the sample storage chamber. Switching may be possible (Claim 7).

  The invention according to claim 8 is a series of cooling and heating that switches the test environment to which the sample is exposed to another test environment adjusted to a constant ambient temperature after the sample is exposed to the test environment adjusted to a constant ambient temperature. In the test method of the thermal shock test in which the cycle operation is repeatedly performed, when the test environment to which the sample is exposed is switched, the time until the ambient temperature of the test environment reaches a predetermined temperature and the sample itself are the above or other predetermined values. The difference between the time until the temperature reaches the predetermined temperature is calculated in advance as the difference time, and the test delay time is derived based on the difference time. In the thermal shock test, the ambient temperature of the test environment becomes the predetermined temperature. The test method of the thermal shock test is characterized by switching the temperature of the test environment to which the sample is exposed after the test delay time or more has elapsed.

  In the test method of the thermal shock test of the present invention, the time difference between the time when the ambient temperature reaches the predetermined temperature and the time when the sample reaches the predetermined temperature as the test environment is switched is regarded as the difference time. It is supposed to be configured. Therefore, according to the test method of the present invention, the sample can reach the predetermined temperature by waiting for the difference time to elapse after the ambient temperature of the test environment reaches the predetermined temperature. Therefore, according to the method of performing the thermal shock test of the present invention, it is not necessary to set the sample exposure time longer than necessary as in the prior art, and the time required for the thermal shock test is minimized. Can do.

  The invention according to claim 9 is performed during a preliminary test in which a cooling cycle operation is performed over a predetermined number of cycles after a break-in test in which the cooling cycle operation is performed over a predetermined number of cycles. Test based on the difference between the time required for the ambient temperature of the test environment to reach a predetermined temperature when the test environment is switched and the time required for the sample itself to reach the aforementioned or other predetermined temperature. The test method of the thermal shock test according to claim 8, wherein a delay time is derived.

  According to such a configuration, it is possible to accurately grasp the difference time and accurately set the test delay time, and it is possible to perform a highly accurate thermal shock test.

  Further, in the test method of the thermal shock test according to claim 8 or 9, the ambient temperature of the test environment in which the temperature sensor is attached to the sample to detect the temperature of the sample and the sample is exposed to another temperature sensor at the same time. And the difference time is derived based on the difference between the time required for the ambient temperature to reach a predetermined temperature when the test environment is switched and the time required for the sample itself to reach the aforementioned or other predetermined temperature. (Claim 10).

  According to such a configuration, the difference time can be accurately grasped, for example, a problem such as the temperature sensor attached to the sample being detached after the difference time is derived, the sample cracking due to thermal shock, or the resistance value of the sample Even if a change occurs, the sample can be exposed to a predetermined test environment for a predetermined time after the sample reaches a predetermined temperature. Therefore, according to the test method of the present invention, the sample can be stably exposed to a predetermined test environment, and an accurate test result can be obtained.

  According to the eleventh aspect of the present invention, the sample temperature is measured at the plurality of measurement points by the sample temperature detecting means, and the sample temperature at all of the plurality of measurement points is based on the time until the temperature reaches a predetermined temperature. The test method of the thermal shock test according to any one of claims 8 to 10, wherein the difference time is calculated.

  According to such a test method, even when the time required for the sample to reach a predetermined temperature due to switching of the test environment varies depending on factors such as the position of the sample, the entire sample is not The sample can be exposed to the test environment for a predetermined exposure time after reaching temperature.

  In the present invention, the “difference time” is calculated by calculating the time from when the test environment is switched until the sample temperature reaches a predetermined temperature at all measurement points detected by the sample temperature detecting means. Alternatively, it may be derived by further applying this time to a predetermined arithmetic expression or rule.

  In the twelfth aspect of the invention, the temperature of the sample is measured at a plurality of measurement points by the sample temperature detection means until the temperature of the sample at an arbitrary measurement point selected from the plurality of measurement points reaches a predetermined temperature. 11. The test method of a thermal shock test according to claim 8, wherein the difference time is calculated based on the time.

  According to such a test method, even when the speed at which the sample reaches a predetermined temperature varies when the test environment is switched, the thermal shock test can be performed in consideration of this variation.

  In the present invention, the “difference time” is calculated by calculating the time until the temperature of the sample at any measurement point described above reaches a predetermined temperature. It may be derived by applying to arithmetic expressions and rules.

  According to the present invention, it is possible to reduce the time required to perform one cooling cycle to a minimum, and to enable the thermal shock test to be performed under a stable condition regardless of the conditions such as the heat capacity of the sample and the number of samples. An impact test apparatus and a test method for a thermal shock test can be provided.

  Hereinafter, a thermal shock test method and a thermal shock test apparatus according to an embodiment of the present invention will be described with reference to the drawings. In FIG. 1, 1 is a thermal shock test apparatus of this embodiment. As shown in FIG. 1, the thermal shock test apparatus 1 includes a high-temperature test tank 2, a low-temperature test tank 3, and a rack 4 that can reciprocate between both test tanks 2 and 3. The thermal shock test apparatus 1 can switch the test environment to which the sample W is exposed by moving the rack 4 up and down to move the sample W to either the high temperature test tank 2 or the low temperature test tank 3. That is, the thermal shock test 1 includes moving means for moving the sample W between temperature environments adjusted to different atmospheric temperatures. The thermal shock test apparatus 1 repeats a thermal cycle in which both a high temperature test in which the sample W is exposed to a high temperature test environment and a low temperature test in which the sample W is exposed to a low temperature test environment, thereby changing the temperature of the sample W as shown in FIG. The sample W can be varied to give thermal stress to the sample W.

  Each of the high-temperature test tank 2 and the low-temperature test tank 3 is configured such that the internal atmospheric temperature can be independently set to an arbitrary temperature within a predetermined temperature range. The high temperature test tank 2 can adjust the internal atmospheric temperature to an arbitrary temperature within a high temperature range such as 60 ° C. to 150 ° C., for example. Similarly, the low-temperature test chamber 3 can adjust the internal atmospheric temperature to an arbitrary temperature within a low temperature range such as 0 ° C. to −55 ° C.

  The high temperature test tank 2 and the low temperature test tank 3 are in a state where they are stacked in the vertical direction as shown in FIG. More specifically, the high temperature test tank 2 is configured to be stacked above the low temperature test tank 3. A boundary portion between the high temperature test tank 2 and the low temperature test tank 3 and an outer peripheral portion of the test tanks 2 and 3 are surrounded by a heat insulating wall 5 and a partition wall 6 having high heat insulating properties. A communication hole 7 is provided in the partition wall 6 that forms the boundary between the high temperature test tank 2 and the low temperature test tank 3.

  The high temperature test tank 2 is provided with high temperature side temperature control means 8 such as a heater capable of adjusting the atmospheric temperature in the tank to a predetermined set temperature. The high-temperature test tank 2 is provided with a blower 11 driven by a motor 10 and a blower duct 12. Similarly, the low-temperature test chamber 3 is provided with a low-temperature side temperature adjusting means 13 for adjusting the atmospheric temperature constituted by a cooler or the like, a blower 16 driven by a motor 15, and a blower duct 17. The high temperature test tank 2 and the low temperature test tank 3 are air whose temperature is adjusted in the high temperature side temperature adjusting means 8 and the low temperature side temperature adjusting means 13 from the air blowing ports 12a and 17a provided on the back side of the test tanks 2 and 3, respectively. Are configured to blow out and circulate. Atmospheric temperature sensors 18 and 20 are provided inside the high temperature test tank 2 and the low temperature test tank 3 so that the atmospheric temperature in each of the test tanks 2 and 3 can be detected.

  The rack 4 is configured to reciprocate in the vertical direction between the high temperature test tank 2 and the low temperature test tank 3 through the communication hole 7 by an elevating mechanism (not shown). In consideration of the shape and size of the sample W, the heat transfer efficiency, etc., the rack 4 has an appropriate shape such as a basket shape or a shelf shape for the body portion 4a on which the sample W is placed, or an appropriate size. Can do. The main body 4 a of the rack 4 has a size that can pass through the communication hole 7 provided in the partition wall 6 that separates the high temperature test tank 2 and the low temperature test tank 3. Heat insulation packings 21 and 22 are attached to the outer periphery of the opening portion on the high temperature test tank 2 side and the opening portion on the low temperature test tank 3 side in the communication hole 7.

  An environmental temperature detection sensor 9 is attached to the main body 4a. The environmental temperature detection sensor 9 is for detecting the temperature of the test environment to which the sample W placed on the rack 4 is exposed.

  On the top surface side and the bottom surface side of the main body portion 4a of the rack 4, heat shield portions 4b and 4c are provided. The heat shield portions 4 b and 4 c have almost the same height as the partition wall 6 and have excellent heat insulating properties like the heat insulating wall 5 and the partition wall 6. A top plate portion 4d is provided above the heat shield portion 4b. A bottom plate portion 4e is provided below the heat shield portion 4c. As shown in FIG. 1, the top plate portion 4 d and the bottom plate portion 4 e protrude outward from the main body portion 4 a and the heat shield portions 4 b and 4 c, respectively, so that they cannot pass through the communication holes 7 when the rack 4 is raised and lowered. It is said. Therefore, by raising and lowering the rack 4 until the top plate portion 4d and the bottom plate portion 4e abut against the partition wall 6, the communication holes 7 are closed by the top plate portion 4d and the bottom plate portion 4e, and the high temperature test tank 2 and the low temperature test tank 3 Can be thermally shut off.

  In addition to the above-described configuration, the thermal shock test apparatus 1 includes a control means 30, a temperature control means 31, a setting means 32, and an output means 33 as shown in the apparatus block diagram of FIG. As shown in FIG. 2, the control means 30 can input data (test condition data) related to the test conditions of the thermal shock test by the setting means 32 and output data related to the test status and test results (test data). It can be output to 33 and displayed. The output means 33 includes, for example, a display device using liquid crystal or the like, an output device such as a plotter or a printer, a digital data memory such as a flash memory, a magnetic disk such as a flexible disk, or an MO disk (Magneto Optical Disk). ) And a device capable of outputting and writing to an optical disk such as a CD-R (Compact Disc-Recordable).

  The control unit 30 includes an input unit 35, a control unit 36, a data storage unit 37, a determination unit 38, a delay time deriving unit 39 (delay time deriving unit), and an output unit 40. The input unit 35 is configured to receive data relating to detected temperatures of the ambient temperature sensors 18 and 20 installed in the high temperature test tank 2 and the low temperature test tank 3. The input unit 35 is configured to be able to input data relating to the detected temperature of the sample W itself by electrically connecting the sample temperature sensors 25a, 25b, and 25c attached to the sample W placed on the rack 4. Has been.

  The data storage unit 37, the determination unit 38, and the delay time deriving unit 39 are controlled by the control unit 36, respectively. The data storage unit 37 is a part that records data relating to the detected temperature input to the input unit 35, test condition data, and the like. Further, the determination unit 38 is based on the data related to the detected temperature input to the input unit 35, and the time required for the atmosphere temperature of the high temperature test tank 2 and the low temperature test tank 3 to reach the set temperature (atmosphere temperature arrival time Ta). In addition, the time required for the temperature of the sample W to reach a predetermined set temperature (sample temperature arrival time Tw) is determined. The delay time deriving unit 39 calculates a difference time Td (Td = Tw−Ta) between the ambient temperature arrival time Ta and the sample temperature arrival time Tw, and derives the test delay time D based on this. More specifically, the delay time deriving unit 39 derives a time obtained by adding a predetermined holding time L to the difference time Td as the test delay time D. The data of the difference time Td and the test delay time D are stored in the data storage unit 37. The output unit 40 outputs data such as test environment setting values such as test condition data to the temperature control means 31.

  The temperature control means 31 is based on the data sent from the output unit 40, the high temperature side temperature adjustment means 8, the low temperature side temperature adjustment means 13 provided in the high temperature test tank 2 and the low temperature test tank 3, the fans 11, 16, etc. To control the operation.

  Then, the operation | movement of the thermal shock test apparatus 1 of this embodiment and the implementation method of a thermal shock test are demonstrated. The thermal shock test apparatus 1 repeats a thermal cycle in which the temperature environment to which the sample W is exposed is rapidly changed by moving the rack 4 on which the sample W is placed every predetermined time, thereby applying thermal stress to the sample W. Device. The thermal shock test apparatus 1 is configured such that the thermal shock test can be performed by selecting an arbitrary test mode from the ambient temperature control mode and the sample temperature control mode.

  Here, the atmospheric temperature control mode is a state in which the sample W is exposed after the rack 4 on which the sample W is placed is moved to either the high temperature test tank 2 side or the low temperature test tank 3 side to switch the test environment. This is a test mode in which the rack 4 is moved up and down and the temperature environment to which the sample W is exposed is switched on condition that the predetermined test time elapses from the time when the ambient temperature reaches the predetermined set temperature.

  On the other hand, the sample temperature control mode is a test mode unique to the thermal shock test apparatus 1 of the present embodiment. The sample temperature control mode is a test mode that is performed in consideration of the time required for the sample W itself to reach a predetermined test temperature when the test environment to which the sample W is exposed is switched. When the sample temperature control mode is selected, a test method composed of two stages of the preliminary test and the main test (hereinafter referred to as a two-stage test method as necessary), or a break-in test, a preliminary test, and a main test. Any one of three test methods (hereinafter referred to as a three-step test method if necessary) can be selected and carried out. When the thermal shock test is performed in the sample temperature control mode, when the test environment is switched through the break-in test and / or the preliminary test, the time required for the sample W itself to reach the predetermined test temperature is determined based on this. This test is conducted.

  More specifically, when the sample temperature control mode is selected and the test is performed by the above-described three-stage test method, the thermal cycle is repeated for a predetermined number of cycles in the initial stage after the start of the thermal shock test (acclimation). Test), a preliminary test is performed after the test environment is stabilized. In the preliminary test, after the test environment is switched, the time (difference time Td) required from the time when the test environment temperature reaches the predetermined test temperature until the sample W itself reaches the predetermined test temperature is calculated, and based on this. A test delay time D is determined. Once the preliminary test is complete, the test will begin. In this test, after switching the test environment based on the test delay time D, the timing at which the sample W reaches a predetermined test temperature is determined, and based on this, the cooling cycle is repeated.

  Here, the break-in test and the preliminary test are performed in order to determine the difference time Td and the test delay time D in the initial stage of the thermal shock test in the sample temperature control mode. In the break-in test and the preliminary test, after the sample W is exposed to the test environment for a predetermined exposure time from the latest time when the predetermined temperature is reached among the temperatures of the sample W detected by the sample temperature sensors 25a to 25c. A series of operations for switching the test environment is repeated for a predetermined number of cooling cycles.

  The break-in test is a thermal cycle that is performed for a predetermined number of cycles from the start of the thermal shock test. The number of cycles required for the break-in test is set to a number of cycles suitable for stabilizing the test environment.

  In the case where the thermal shock test is performed by the above-described three-stage test method, the preliminary test is performed after the test environment is stabilized by the break-in test, and the thermal cycle is repeated for a predetermined number of cycles. The delay time deriving unit 39 of the control unit 30 switches the test environment for each cooling cycle performed during the preliminary test, and then the sample W itself is determined from the time when the test environment temperature reaches the predetermined test temperature. The time required to reach the test temperature (difference time Td) is calculated, and a time (Td + L) obtained by adding a predetermined holding time L to this is set as the test delay time D.

  This test is performed after the preliminary test, and the thermal shock test is performed based on the test delay time D set based on the result of the preliminary test. That is, in this test, the temperature of the sample W detected by the sample temperature sensors 25a to 25c is not monitored, but after the test environment is switched, the test environment temperature detected by the ambient temperature sensors 18 and 20 is predetermined. It is considered that the sample W has reached a predetermined test temperature when the test delay time D has elapsed from the time when the test temperature is reached (time when the sample temperature is reached). In this test, the sample W is exposed to an atmosphere at a predetermined test environment temperature for a predetermined substantial exposure time Ts from the time when the test delay time D has elapsed. In other words, when the sample temperature control mode is selected, in this test, when the test environment to which the sample W is exposed is switched, the timing of starting the time measurement of the actual exposure time Ts reaches the predetermined set temperature. The time is delayed from the time point by the test delay time D set based on the result of the preliminary test.

  Next, the operation of the thermal shock test apparatus 1 of the present embodiment will be described in more detail based on the flowcharts shown in FIGS. The thermal shock test apparatus 1 is in a state where test conditions can be input via the setting means 32 when an operation switch (not shown) is turned on. Here, the test conditions that can be input are the exposure time (substantially exposure time Ts) and the ambient temperature (high temperature chamber ambient temperature He, low temperature chamber ambient temperature Ce) when the sample W is exposed in the high temperature test chamber 2 and the low temperature test chamber 3. And the number N of test cycles. Here, when the number of test cycles is set to N, a test cycle in which a series of tests in which the sample W is exposed to both the high temperature test tank 2 and the low temperature test tank 3 is one cycle is performed.

  When the test condition is set in step 1-1 after the operation switch is turned on, the control flow proceeds to step 1-2, and the test mode of the thermal shock test set in step 1-1 is the sample temperature. Check if it is in control mode. Here, when the sample temperature control mode is selected, the control flow proceeds to step 1-3, and when the ambient temperature control mode is selected, the control flow proceeds to step 1-8 described later.

  In step 1-2, when the sample temperature control mode is selected as the test mode of the thermal shock test, the temperature of the sample W itself is changed to a predetermined test temperature (hereinafter referred to as a high temperature sample exposure temperature as necessary) when the test environment is switched. In order to take into account the difference time Td corresponding to the time lag required to reach Hw, the low temperature sample exposure temperature Cw), it is necessary to derive the difference time Td and set the test delay time D. Therefore, when the sample temperature control mode is selected, the control flow proceeds to step 1-3, where the high temperature sample exposure temperature Hw, the low temperature sample exposure temperature Cw, the high temperature reach temperature width Wh, the low temperature reach temperature width Wc, and the holding time A part or all of L can be set via the setting means 32.

  Here, the high temperature reachable temperature width Wh and the low temperature reachable temperature width Wc are deviation widths of the temperature of the sample W allowed in the thermal shock test. That is, the control means 30 has a range in which the ambient temperature of the test environment detected by the environmental temperature detection sensor 9 is within the high temperature reach temperature range Wh and the low temperature reach temperature range Wc with respect to the high temperature sample exposure temperature Hw and the low temperature sample exposure temperature Cw. The ambient temperature of the test environment is considered to have reached the high temperature sample exposure temperature Hw and the low temperature sample exposure temperature Cw. The high temperature reachable temperature range Wh and the low temperature reachable temperature range Wc may be values arbitrarily set by the operator, or may be preset default values.

  The holding time L is the temperature range after the temperature of the sample W itself reaches the high temperature reach temperature range Wh and the low temperature reach temperature range Wc relative to the high temperature sample exposure temperature Hw and the low temperature sample exposure temperature Cw. This is the time for stabilization within Wh and Wc. The holding time L may be a value arbitrarily set by the operator or a preset default value.

  When the high temperature sample exposure temperature Hw, the low temperature sample exposure temperature Cw, etc. are set in step 1-3, the control flow proceeds to step 1-4, and a break-in test is performed. The break-in test is performed over a predetermined number of cycles n1 after the thermal shock test in the sample temperature control mode is started as described above. In the break-in test, after the test environment is switched, a predetermined substantial exposure time from the point when the predetermined test temperature is reached the latest among the temperatures of the sample W detected by the sample temperature sensors 25a to 25c attached to the sample W. The sample W is exposed to the test environment for Ts, and then the operation of switching the test environment is repeated for a predetermined number of cycles n1.

  When the break-in test is completed in step 1-4, the test conditions such as the atmospheric temperature in the high-temperature test tank 2 and the low-temperature test tank 3 become stable, and the test conditions in the high-temperature test tank 2 and the low-temperature test tank 3 are changed when the test environment is switched. It is assumed that the time required for the temperature of the sample W itself to reach the high temperature sample exposure temperature Hw and the low temperature sample exposure temperature Cw after the atmospheric temperature becomes the high temperature chamber atmosphere temperature He or the low temperature chamber atmosphere temperature Ce is also stabilized. . Therefore, when the break-in operation is completed in step 1-4, the control means 30 advances the control flow to step 1-5 to perform a preliminary test, derives the difference time Td, and determines the test delay time D.

  More specifically, when the control flow proceeds to step 1-5, a preliminary test is performed according to the subroutine shown in FIG. That is, when the preliminary test is started, the control flow moves to Step 2-1, and the rack 4 on which the sample W is placed moves to the high-temperature test tank 2 side where the atmospheric temperature is adjusted to the high-temperature tank atmospheric temperature He in advance. The test environment is switched to the high temperature side. At this time, based on the detection signal of the ambient temperature sensor 18, a change in the ambient temperature in the high temperature test tank 2 accompanying the movement of the rack 4 is detected. When the control means 30 confirms that the atmospheric temperature in the high temperature test tank 2 has reached the high temperature tank atmosphere temperature He in step 2-2, the test environment is accompanied with the movement of the rack 4 as shown in FIG. A period from the time when the temperature is switched (environment switching time P1) to the time when the atmosphere temperature in the high temperature test tank 2 reaches the high temperature tank atmosphere temperature He (atmosphere temperature arrival time P2) is grasped as the atmosphere temperature arrival time Ta. .

  Thereafter, the control means 30 individually monitors the detected temperatures of the three sample temperature sensors 25a to 25c attached to the sample W in step 2-3, and determines that the temperature of the sample W reaches the high temperature sample exposure temperature Hw. wait. The control means 30 has the latest detection temperature of the three sample temperature sensors 25a to 25c that has reached the high temperature sample exposure temperature Hw, that is, the detection temperatures of all the sample temperature sensors 25a to 25c have reached the high temperature sample exposure temperature Hw. This time is recognized as the sample temperature reaching time P3. Then, the control means 30 derives a period required from the atmospheric temperature reaching point P2 to the sample temperature reaching point P3 as the high temperature side difference time Thd.

  When the control means 30 confirms that the detected temperature of the sample temperature sensors 25a to 25c has reached the high temperature sample exposure temperature Hw in step 2-3, the control means 30 waits for the holding time L to elapse in step 2-4, Wait for the temperature to stabilize further. Thereafter, the control means 30 exposes the sample W to the temperature environment of the high temperature test tank 2 for the substantial exposure time Ts in step 2-5.

  When a substantial exposure time Ts has elapsed after the control flow moves to step 2-5, in step 2-6, the rack 4 is lowered to the low temperature test tank 3 side, and the test environment of the thermal shock test is switched to the low temperature side. Thereafter, in step 2-7 and subsequent steps, the control similar to the control shown in steps 2-2 to 2-5 described above is performed on the low temperature test tank 3 side, and is performed on the high temperature test tank 2 side described above. Similarly, the environment temperature arrival time and the sample temperature adjustment time are confirmed.

  That is, when the rack 4 is lowered to switch the test environment in Step 2-6, the high temperature test tank 2 and the low temperature test tank 3 are temporarily in communication with each other. When the rack 4 is lowered, the sample W that has been exposed to the high temperature atmosphere until just before enters the low temperature test chamber 3. Therefore, when the test environment is switched in step 2-6, the ambient temperature in the low temperature test tank 3 becomes unstable. Then, the control means 30 waits in step 2-7 until the atmospheric temperature in the low-temperature test tank 3 becomes predetermined low-temperature tank atmospheric temperature Ce.

  When the ambient temperature of the low temperature test chamber 3 becomes the low temperature chamber ambient temperature Ce in step 2-7, as shown in FIG. 8 (b), the control means 30 is the time when the test environment is switched in step 2-6. A period from (environment switching time point P4) to the time point (atmosphere temperature reaching time point P5) when the ambient temperature in the low temperature test chamber 3 reaches the low temperature chamber atmosphere temperature Ce is stored in the data storage unit 37 as the environmental temperature reaching time Tb. Thereafter, in step 2-8, the control means 30 required from the atmospheric temperature arrival time P2 to the time when all of the three sample temperature sensors 25a to 25c reached the low temperature sample exposure temperature Cw (sample temperature arrival time P6). The time is derived as the low temperature side difference time Tcd.

  The control means 30 waits for the holding time L to elapse in step 2-9, and waits for the temperature of the sample W to be further stabilized. Thereafter, the control means 30 exposes the sample W to the temperature environment of the low temperature test tank 3 for the substantial exposure time Ts in Step 2-10.

  When the substantial exposure time Ts elapses in step 2-10, the control means 30 adds up the series of cooling cycles from step 2-1 to step 2-10 described above in step 2-11 after the start of the preliminary test. It is confirmed whether or not n2 cycles (n is a natural number) have been performed. Here, when the cycle number of the cooling cycle has not reached n2, the control means 30 returns the control flow to step 2-1, and repeats a series of cooling cycles. On the other hand, when the number of cooling cycles reaches n2 in step 2-11, the control means 30 determines each high-temperature side difference time Thd derived in n2 cooling cycles and each low-temperature side difference time Tcd. Of these, the time (Thd + L, Tcd + L) obtained by adding the holding time L to the time corresponding to the largest high temperature side difference time Thd and low temperature side difference time Tcd is the test delay time D (hereinafter referred to as necessary). Accordingly, they are stored as a high temperature side test delay time Dh and a low temperature side test delay time Dc). Thereby, the series of preliminary tests shown in FIG. 5 is completed, and the control flow is returned to step 1-6 in FIG.

  In step 1-6, the control means 30 follows the control flow shown in FIG. 6 from the number of test cycles N set in step 1-1, and the number of cycles of the cooling / heating cycle carried out in advance in the break-in test and the preliminary test. The test is repeated for (N-n1-n2) cycles reduced by n1 and n2.

  More specifically, when the control flow proceeds to step 1-6, the process proceeds to step 3-1 of the subroutine shown in FIG. When moving to step 3-1, the control means 30 raises the rack 4 and accommodates the sample W in the high temperature test chamber 2. Thereafter, the operations of the high temperature side temperature adjusting means 8 and the blower 11 are controlled so that the atmospheric temperature in the high temperature test tank 2 becomes a predetermined high temperature side atmospheric temperature He.

  Thereafter, when the atmospheric temperature in the high temperature test chamber 2 becomes the high temperature chamber atmospheric temperature He in step 3-2, the control flow proceeds to step 3-3, and the high temperature stored in the data storage unit 37 in the preliminary test shown in FIG. It waits for elapse of the high temperature side test delay time Dh obtained by adding the holding time L to the side difference time Thd.

  When the high temperature side test delay time Dh elapses in step 3-3, it is assumed that the temperature of the sample W is surely the high temperature sample exposure temperature Hw. Therefore, the control means 30 continues to expose the sample W to the high temperature atmosphere in the high temperature test tank 2 for a period corresponding to the substantial exposure time Ts from the time when the holding time L has passed in Step 3-4.

  When the control means 30 confirms that the substantial exposure time Ts has elapsed in step 3-4, the control means 30 advances the control flow to step 3-5 and switches the test environment to the test environment on the low temperature test tank 3 side. That is, when the control flow moves to step 3-5, the control means 30 lowers the rack 4 to the low temperature test tank 3 side. When the rack 4 completely moves to the low temperature test tank 2 side, the control means 30 performs the same as in Step 3-2 to Step 3-4 described above in Step 3-6 to Step 3-8. Sample W is exposed to a low temperature atmosphere.

  More specifically, when the switching of the test environment is completed in step 3-5, the control means 30 waits for the atmospheric temperature in the low temperature test tank 3 to reach the low temperature tank atmospheric temperature Ce from that time (step 3). -6). Thereafter, the control means 30 starts the low temperature side test delay time Dc determined on the basis of the result of the preliminary test previously performed from the time when the low temperature bath atmosphere temperature Ce is reached in step 3-7, that is, the low temperature side difference time. Wait for the time corresponding to the sum of Tcd and holding time L to elapse. Thereby, it is assumed that the sample W which has moved from the high temperature test tank 2 side to the low temperature test tank 3 is surely at the low temperature sample exposure temperature Cw. Therefore, the control means 30 advances the control flow to step 3-8 when the low temperature side test delay time Dc has elapsed, and puts the sample W in the high temperature atmosphere in the low temperature test chamber 2 over a period corresponding to the substantial exposure time Ts. Continue to expose.

  When a series of control flow from step 3-1 to step 3-8 in FIG. 6 is completed as described above, the cooling cycle for one cycle is completed. When it is confirmed in step 3-8 that the substantial exposure time Ts has elapsed, the control means 30 returns the control flow to step 1-7 of the control flow shown in FIG. In step 1-7, the control means 30 confirms whether or not (N-n1-n2) cycles (N, n1, and n2 are natural numbers) have been implemented through the total number of cooling cycles according to the subroutine shown in FIG. . Here, when the number of cycles in which the cooling cycle is performed is less than (N-n1-n2), the control flow is returned to step 1-6, and a series of cooling cycles in accordance with the subroutine shown in FIG. 6 is continued. Is done. On the other hand, if the number of cycles has reached (N-n1-n2) in step 1-7, the number of cycles N is added to the number of cycles n1 and n2 of the cooling and cooling cycles performed during the break-in test and the preliminary test. The cooling / heating cycle was repeated. Therefore, the control means 30 completes the thermal shock test by a series of control flows.

  On the other hand, in the control flow shown in FIG. 4, when the atmospheric temperature control mode is selected as the method for performing the thermal shock test, that is, when the process proceeds to step 1-8, the control flow is step 4 of the subroutine shown in FIG. -1. In step 4-1, the rack 4 moves to the high temperature test tank 2 side, and the test environment of the sample W is switched to the high temperature side. Then, operation | movement of the high temperature side temperature control means 8 or the air blower 11 is controlled so that the atmospheric temperature in the high temperature test tank 2 becomes the high temperature tank atmospheric temperature He.

  Thereafter, when it is confirmed in step 4-2 that the atmospheric temperature in the high-temperature test chamber 2 has become the high-temperature chamber atmospheric temperature He, the sample W is exposed to the high-temperature atmosphere until the substantial exposure time Ts elapses from this point. It is.

  When the substantial exposure time Ts elapses in step 4-3, the control means 30 moves the rack 4 to the lower low temperature test tank 3 in step 4-4 and switches the test environment to the low temperature side. Thereafter, when it is confirmed that the ambient temperature in the low temperature test chamber 3 has become the low temperature chamber ambient temperature Ce by operating the low temperature side temperature control means 13 or the blower 16, the sample W is substantially exposed from this point over the exposure time Ts. Is exposed to a low temperature atmosphere. When the substantial exposure time Ts has elapsed in step 4-6, the cooling cycle for one cycle is completed, and the control flow is returned to step 1-9.

  When the control flow returns to step 1-9, it is confirmed whether or not the cooling cycle shown in FIG. Here, if the cooling cycle has not reached N cycles, the control flow is returned to step 1-8, and the cooling cycle is continued. On the other hand, if the number of cooling cycles reaches N cycles in step 1-9, a series of control flow is completed.

  As described above, in the thermal shock test apparatus 1, the sample W is exposed to the high temperature sample after the atmosphere temperature reaches the high temperature chamber atmosphere temperature He or the low temperature chamber atmosphere temperature Ce with the switching of the test environment in the preliminary test. The time required to reach the low temperature sample exposure temperature Cw is stored as the high temperature side difference time Thd and the low temperature side difference time Tcd, and based on these, the sample W is exposed to the high temperature sample exposure temperature Hw and the low temperature sample exposure temperature. The time to reach Cw can be predicted. Therefore, in the thermal shock test apparatus 1, it is not necessary to increase the exposure time of the sample W in consideration of the time required for the temperature change of the sample W, and the time required for the thermal shock test can be shortened to the minimum.

  The thermal shock test apparatus 1 also predicts when the sample W reaches the high temperature sample exposure temperature Hw and the low temperature sample exposure temperature Cw based on the high temperature side difference time Thd and the low temperature side difference time Tcd derived by the preliminary test. The sample W is exposed to a predetermined test environment for a substantial exposure time Ts after waiting for a predetermined holding time L from this point. For this reason, in the thermal shock test apparatus 1, problems such as the sample temperature sensors 25 a to 25 c being detached from the sample W or being damaged during the main test, the sample W cracking due to thermal shock, or the resistance value of the sample W changes. Even if there is such a change, the sample W can be exposed to a predetermined test environment for a substantial exposure time Ts. Therefore, according to the thermal shock test apparatus 1 and the thermal shock test method described above, accurate test results can be obtained.

  As described above, the thermal shock test apparatus 1 is configured so that the temperature of the sample W can be measured by the three sample temperature sensors 25a to 25c. And the above-mentioned thermal shock test apparatus 1 is the time until all the detection temperatures detected by the sample temperature sensors 25a to 25c reach the high temperature sample exposure temperature Hw and the low temperature sample exposure temperature Cw from the switching time of the test environment, The high temperature side difference time Thd based on the difference between the test environment switching time and the time until the ambient temperature of the test environment detected by the environmental temperature detection sensor 9 reaches the high temperature chamber atmosphere temperature He or the low temperature chamber atmosphere temperature Ce The low temperature side difference time Tcd is derived. Therefore, according to the above-described configuration, the speed from when the test environment is switched to when the sample W reaches a predetermined temperature due to the position where the sample W is arranged, the heat capacity, size, etc. of the sample W is high. Even in the case of variation, the sample W can be exposed to the test environment for a predetermined substantial exposure time Ts after the entire sample W reaches the predetermined high temperature sample exposure temperature Hw and the low temperature sample exposure temperature Cw.

  As described above, in the thermal shock test apparatus 1 according to the present embodiment, when the sample temperature control mode is selected, a habituation test is performed from immediately after the start of the thermal shock test (first cycle) to the n1 cycle to perform a high temperature test. Wait for the test conditions such as the ambient temperature of the test tank 2 and the low temperature test tank 3 to stabilize, and then select either the three-stage test method that performs the preliminary test or the two-stage test method that omits the break-in test. It can be implemented. However, the present invention is not limited to this, and only one of the three-stage test method and the two-stage test method may be implemented.

  The thermal shock test apparatus 1 of the above embodiment can be implemented by selecting a test method in the sample temperature control mode from a three-stage test method and a two-stage test method. It may be implemented by arbitrarily selecting one operator, or may be appropriately selected by the control means 30 or the like. More specifically, for example, after the sample temperature control mode is selected by the control means 30 and the thermal shock test is started, the ambient temperature of the sample W, the high temperature test tank 2 and the low temperature test tank 3 over a predetermined number of cycles, and the like. The test conditions may be monitored, and if the test conditions are stable immediately after the start of the test, the two-stage test method is selected, and if the test conditions are unstable, the three-stage test method may be selected.

  In the above embodiment, among the high temperature side difference times Thd and the low temperature side difference times Tcd derived for each cooling cycle in the preliminary test, the time corresponding to the largest high temperature side difference time Thd and the low temperature side difference time Tcd is tested. Although it has been grasped as the time required to stabilize the temperature of the sample W when the environment is switched, the present invention is not limited to this. More specifically, for example, each high temperature side difference time Thd and each low temperature side difference time Tcd are averaged, or a value obtained by substituting into a predetermined arithmetic expression is taken as a time required to stabilize the temperature of the sample W. It is good also as composition to grasp. Moreover, it is good also as a structure grasp | ascertained as time required in order to stabilize the temperature of the sample W by applying each high temperature side difference time Thd and each low temperature side difference time Tcd to a predetermined rule. More specifically, for example, the longest time among the high temperature side difference times Thd and the low temperature side difference times Tcd is selected, or the median value of these difference times Thd and Tcd is selected, and this is determined as the temperature of the sample W. It is good also as a structure grasped | ascertained as time required for to stabilize.

  The thermal shock test apparatus 1 of the said embodiment has the high temperature test tank 2 and the low temperature test tank 3, and switches the test environment to which the sample W is exposed by moving the rack 4 between these. However, the present invention is not limited to this. More specifically, for example, as in the thermal shock test apparatus 50 shown in FIG. 9, a test tank 51 containing the sample W, a heating unit 52 including the high temperature side temperature control means 8, and the low temperature side temperature control means 13. Provided with a cooling unit 53 provided with a configuration in which the temperature in the test chamber 51 can be adjusted by opening one of the dampers 55 and 56 provided between the test chamber 51 and the heating unit 52 or the cooling unit 53. It may be what. Even in the case of such a configuration, it is possible to carry out a thermal shock test similar to the thermal shock test apparatus 1 described above.

  In the thermal shock test apparatus 1 described above, every time the thermal shock test is performed in the sample temperature control mode, a preliminary test is performed to derive the high temperature side difference time Thd and the low temperature side difference time Tcd, and the high temperature side test delay time Dh. Although the low temperature side test delay time Dc is set, the present invention is not limited to this. More specifically, for example, when the thermal shock test is performed on the samples W of the same type, heat capacity, size, etc., the high temperature side difference time Thd and the low temperature side difference time Tcd may hardly change. Therefore, based on such knowledge, the high temperature side difference time Thd and the low temperature side difference time Tcd derived in the preliminary test performed in the previous test may be used in another test. That is, the thermal shock test apparatus 1 stores data related to the high temperature side difference time Thd and the low temperature side difference time Tcd derived in the previous thermal shock test in a state that can be recalled to the data storage unit 37 as necessary. A configuration that can be arbitrarily set by the operator by the setting means 32 and is called from the data storage unit 37 or is set on the high temperature side based on the high temperature side difference time Thd or the low temperature side difference time Tcd set via the setting means 32. The test delay time Dh and the low temperature side test delay time Dc may be set so that the thermal shock test in the sample temperature control mode can be performed.

  The thermal shock test apparatus 1, 50 of the above embodiment generally takes the high temperature test tank 2 and the heating unit 52 above the low temperature test tank 3 and the cooling unit 53 in consideration of the tendency that warm air tends to rise. It is set as the structure arrange | positioned in. Therefore, the above-described thermal shock test apparatus 1, 50 is a mixture of the air present in the high temperature test tank 2 or the heating unit 52 and the air present in the low temperature test tank 3 or the cooling unit 53 when the test environment is switched. Is unlikely to occur. Therefore, according to the above-described configuration, it is possible to smoothly stabilize the atmospheric temperature of each of the test tanks 2, 3, 51 when the test environment is switched. In addition, this invention is not limited to the said embodiment, The high temperature test tank 2, the heating part 52, the low temperature test tank 3, the up-and-down relation of the cooling part 53, or these are substantially on the same plane. It may be a side-by-side configuration.

  In the above embodiment, it is assumed that the sample temperature has reached a predetermined temperature when the ambient temperature arrival times Ta and Tb have elapsed since the switching of the test environment and the high temperature side difference time Thd or the low temperature side difference time Tcd has elapsed. However, the high-temperature-side test delay time Dh and the low-temperature-side test delay time Dc are set longer than the high-temperature-side difference time Thd and the low-temperature-side difference time Tcd by the holding time L, and after waiting for the temperature of the sample W to stabilize, The sample W was exposed to the test environment over the substantial exposure time Ts. However, the present invention is not limited to this, and the holding time L is not provided, and the sample W is exposed to the test environment for a substantial exposure time Ts from the time when the high temperature side difference time Thd or the low temperature side difference time Tcd has elapsed. It is good also as a structure. That is, the thermal shock test apparatuses 1 and 50 may be configured such that the high temperature side difference time Thd and the low temperature side difference time Tcd are directly used as the high temperature side test delay time Dh and the low temperature side test delay time Dc. Further, the high temperature side test delay time Dh and the low temperature side test delay time Dc are not only the addition of the holding time L to the high temperature side difference time Thd or the low temperature side difference time Tcd, but also the high temperature side difference time Thd or the low temperature side difference time Tcd. May be set to a time obtained by substituting into a predetermined arithmetic expression.

It is sectional drawing which shows notionally the structure of the thermal shock test apparatus which is one Embodiment of this invention. It is a block diagram which shows the apparatus structure of the thermal shock test apparatus shown in FIG. It is a graph which shows notionally the temperature change of the sample in the case of implementing a thermal shock test. It is a flowchart which shows operation | movement of the thermal shock test apparatus shown in FIG. 5 is a flowchart showing a subroutine of the control flow shown in FIG. 6 is a flowchart showing another subroutine of the control flow shown in FIG. 6 is a flowchart showing still another subroutine of the control flow shown in FIG. 4. (A), (b) is a graph which shows notionally transition of the detection temperature detected by the atmospheric temperature of a test environment when a test environment is switched to the high temperature side and the low temperature side, and a sample temperature sensor, respectively. It is sectional drawing which shows notionally the structure of the thermal shock test apparatus which is another embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cold shock test apparatus 2 High temperature test tank 3 Low temperature test tank 4 Rack 8 High temperature side temperature control means 9 Environmental temperature detection sensor 13 Low temperature side temperature control means 25a-25c Sample temperature sensor 30 Control means 50 Cold heat shock test apparatus 51 Test tank 52 Heating part 53 Cooling part

Claims (12)

Thermal shock capable of repeatedly performing a series of thermal cycle operations to switch the test environment to which the sample is exposed to another test environment adjusted to a constant ambient temperature after exposing the sample to a test environment adjusted to a constant ambient temperature A testing device,
An environmental temperature detecting means for detecting the ambient temperature of the test environment to which the sample is exposed, and a sample delay time deriving means,
The delay time deriving means, when switching the test environment to which the sample is exposed, takes a time until the temperature in the sample storage chamber in which the sample is stored reaches a predetermined temperature, and the sample itself reaches the predetermined temperature. The difference time with the time until the calculation is calculated, and the test delay time is derived based on the difference time,
When the test environment to which the sample is exposed is switched, the test is performed after the test delay time has elapsed since the ambient temperature detected by the environmental temperature detection means reaches the predetermined temperature, and after the predetermined exposure time has elapsed. A thermal shock test apparatus capable of performing a thermal shock test by switching the environment to another test environment. Having a sample temperature detecting means for detecting the temperature of the sample;
Preliminary tests can be performed to switch the test environment to which the sample is exposed to another test environment after a predetermined exposure time has elapsed with reference to the time when the temperature of the sample detected by the sample temperature detection means reaches a predetermined temperature. Yes,
The delay time deriving means includes the time required for the ambient temperature detected by the environmental temperature detecting means to reach a predetermined temperature in accordance with the switching of the test environment in the preliminary test, and the sample itself reaches the predetermined temperature. The thermal shock test apparatus according to claim 1, wherein a difference from a time required until the calculation is calculated as a difference time, and a test delay time is derived based on the difference time. The sample temperature detection means can measure the temperature of the sample at a plurality of measurement points,
3. The thermal shock test according to claim 2, wherein the difference time is calculated based on a time until the sample temperature reaches a predetermined temperature at all measurement points detected by the sample temperature detecting means. apparatus. The sample temperature detecting means can measure the temperature of the sample at a plurality of measurement points,
The difference time is calculated based on a time until a sample temperature reaches a predetermined temperature at an arbitrary measurement point selected from a plurality of measurement points detected by the sample temperature detection means. 2. The thermal shock test apparatus according to 2.   The thermal shock test apparatus according to any one of claims 2 to 4, wherein a preliminary test is performed after a break-in test in which the thermal cycle operation is performed for a predetermined number of cycles.   It has first and second sample storage chambers for storing samples, and after the sample is exposed to the first sample storage chamber adjusted to have a constant atmospheric temperature, it is adjusted to another constant atmospheric temperature. 6. The thermal shock test apparatus according to claim 1, wherein the test environment to which the sample is exposed can be switched by moving the sample to the second sample storage chamber.   6. The test environment according to claim 1, further comprising: a sample storage chamber for storing the sample, wherein the test environment to which the sample is exposed can be switched by switching an ambient temperature in the sample storage chamber. Thermal shock test equipment. Thermal shock test in which a sample is exposed to a test environment adjusted to a constant ambient temperature, and then a series of thermal cycle operations are performed to switch the test environment exposed to the sample to another test environment adjusted to a constant ambient temperature In the test method of
The difference between the time until the ambient temperature of the test environment reaches a predetermined temperature and the time until the sample itself reaches the above or other predetermined temperature at the time of switching the test environment to which the sample is exposed is the difference time. Is calculated in advance, and the test delay time is derived based on the difference time,
In the thermal shock test, a test method for the thermal shock test, wherein the temperature of the test environment to which the sample is exposed is switched after the test delay time or more has elapsed after the ambient temperature of the test environment reaches a predetermined temperature.   After a break-in test in which the thermal cycle operation is performed over a predetermined number of cycles, a preliminary test is performed in which the thermal cycle operation is performed over a predetermined number of cycles, and the test environment is switched when the test environment is switched during the preliminary test. A test delay time is derived based on a time required for the ambient temperature to reach a predetermined temperature and a difference time between the time required for the sample itself to reach the above-mentioned or other predetermined temperature. The test method of the thermal shock test of Claim 8.   For the difference time, a temperature sensor is attached to the sample and the temperature of the sample is detected. At the same time, the ambient temperature of the test environment to which the sample is exposed is detected by another temperature sensor. The thermal shock test according to claim 8 or 9, wherein the thermal shock test is derived based on a difference between a time required to reach the temperature and a time required for the sample itself to reach the or other predetermined temperature. Test method.   The temperature of the sample is measured at a plurality of measurement points by the sample temperature detection means, and the difference time is calculated based on the time until the sample temperature reaches a predetermined temperature at all of the plurality of measurement points. The test method of the thermal shock test in any one of Claims 8 thru | or 10.   The sample temperature is measured at multiple measurement points by the sample temperature detection means, and the difference time is calculated based on the time until the sample temperature reaches a predetermined temperature at any measurement point selected from the multiple measurement points. The test method of the thermal shock test according to claim 8, wherein the test method is a thermal shock test.

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