JP2006324598A - Chip bonding equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To further reduce the load of an Y table in chip bonding equipment. <P>SOLUTION: The die bonding device 10 includes an X table 20 to be driven at a low speed in an X axial direction, a Y table 30 to be driven at a high speed in a Y axial direction on an X table 20, and a Z driving motor for driving a bonding head 42 in a Z axial direction at a high speed. The Z driving motor includes a Z motor magnet 60 installed in an X table 20, and a Z motor driving coil 50 connected to a bonding head 42 so as to be movable to a Z axial direction along a Z rail 32 installed on the Y table 30. Driving currents are supplied to the Z motor driving coil 50 so that a Z axial driving force can be generated at a Z motor driving coil 50 according to the cooperation of the Z motor magnet 60 and the Z motor driving coil 50, and that the bonding head 42 can be moved to an XYZ three-dimensional arbitrary position. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a chip bonding apparatus, and more particularly to a chip bonding apparatus that transports a chip from a chip supply unit to a bonding target position using a bonding head and bonds the chip to the bonding target there.

  Among bonding devices related to semiconductor chips, so-called die bonding devices and wire bonding devices are well known. The former uses a bonding head incorporating a chip collet to transport a chip from a chip supply unit to a bonding target position such as a circuit board, where the chip is bonded to a circuit board to be bonded. This bonding is sometimes referred to as die bonding because the chip may also be referred to as a die. On the other hand, the wire bonding apparatus is used to connect the signal terminals and the like of the chip die-bonded to the circuit board and the like in this way to the circuit board. That is, a tool called a capillary for holding a wire such as a gold thin wire is provided between a chip side connection terminal called a bonding pad arranged on the surface of the chip and a substrate side connection terminal called a bonding lead arranged on a circuit board. The bonding heads are used to connect each other with wires. This bonding is called wire bonding as is well known.

  Whether it is die bonding or wire bonding, the bonding head moves at high speed between any two positions in the three-dimensional space. That is, in any case, the bonding head is movable in the X axis direction, the Y axis direction, and the Z axis direction. As for the XYZ movement mechanism of this bonding head, an X table movable in the X axis direction, a Y table mounted on the X table and movable in the Y axis direction, and mounted on the Y table and movable in the Z axis direction A stacked structure of Z tables can be used. However, in this stacked structure, the lower table requires more driving force to support the mass and inertia mounted on the upper table, and the driving force is the center of gravity of the object to be moved due to the stacked structure. This causes problems such as not necessarily being applied to the.

  For example, in Patent Document 1, in a so-called XY table in which a Y-axis table is provided on an X-axis table, when a heavy bonding head is mounted on the Y table, the X-axis table is an X-axis VCM and the Y-axis table. It is stated that when each is driven by the Y-axis VCM, the driving force does not act on the center of gravity of the movable part. Here, a configuration is disclosed in which the Y table is driven in the XY plane using the X-axis VCM and the Y-axis VCM. In this case, the X-axis VCM stator and the Y-axis VCM stator are fixed to the base, and the X-axis VCM mover and the Y-axis VCM mover are attached to the Y table.

  Patent Document 2 states that in a die bonding apparatus, there is a mechanism for moving the collet up and down and a mechanism for applying a die bonding pressure to the semiconductor die, so that the volume and weight of the apparatus increase. It is done. In this case, a linear motor is used, and a position sensor for detecting the vertical position of the collet is provided, and a mechanism for applying pressure by causing the collet to perform constant velocity motion and uniform acceleration motion on the collet. A configuration that reduces the weight and volume of the die bonding apparatus is disclosed.

JP 2001-148398 A JP-A-6-014416

  In the above Patent Document 2, a weight reduction of the Z-axis drive mechanism is proposed. Therefore, it can be considered that by using this, the driving load of the XY table, particularly the Y table on which the Z drive mechanism is mounted, is reduced to some extent. However, since the Z-axis drive mechanism is mounted on the XY table as it is, there is a limit to further speeding up the movement in the Y-axis direction. For example, as the speed increases, the Y motor becomes overloaded and heat generation becomes excessive, which may hinder the operation of the bonding apparatus itself.

  An object of the present invention is to provide a chip bonding apparatus capable of further reducing the load on a Y table when bonding a chip to a bonding object.

  The present invention is focused on the field of chip bonding devices and is not intended for wire bonding devices. The reason is because there is a difference between the moving speeds in the X-axis direction and the Y-axis direction between the two. That is, in a wire bonding apparatus, since bonding is performed between a bonding pad of a chip and a bonding lead of a circuit board with a wire, and a large number of wire bondings are repeated for one chip, how fast this XY movement speed is increased. In this case, the moving speed in the X-axis direction and the moving speed in the Y-axis direction are required to be approximately the same.

  On the other hand, since the chip bonding apparatus moves one chip from the chip supply unit to the position to be bonded, normally either the X-axis direction or the Y-axis direction is much slower than the other. Well, sometimes it doesn't work. In general, the moving speed of the X table may be considerably lower than the moving speeds of other Y tables and Z tables. Therefore, in the chip bonding apparatus, if the load on the Y table can be further reduced by taking advantage of the low speed of the X table, heat generation due to an overload of the Y table can be prevented and the speed can be further increased. Should be.

  The chip bonding apparatus according to the present invention includes an X table that is driven at a low speed in the X axis direction, a Y table that is driven at a high speed in the Y axis direction on the X table, and a Z drive that drives the bonding head portion at a high speed in the Z axis direction. A Z-drive motor, which is connected to a stator portion provided on the X table and a bonding head portion, and moves in the Z-axis direction along a guide provided on the Y table. A movable part, and a driving force in the Z-axis direction is generated in the movable part by cooperation of the stator part and the movable part.

  With the above configuration, the stator portion having a heavy mass and a large inertia among the stator portion and the movable portion constituting the Z drive motor is mounted on the X table. Since the X table is driven at a low speed, even if the load on the stator portion of the Z drive motor is further increased, the influence on the characteristics is small. On the other hand, the load on the Y table can be made lighter because there is no load on the stator portion of the Z drive motor. Therefore, the speed of the chip bonding apparatus can be increased.

  In the chip bonding apparatus according to the present invention, the movable part is connected to the bonding head part and is a flat drive coil part in the YZ plane, and the stator part is provided with a magnetic yoke and a drive coil. It is preferable to have a magnet portion facing each other and covering the entire moving range in the YZ plane of the drive coil.

  Moreover, it is preferable that a stator part is each arrange | positioned on both sides across the YZ plane of a drive coil.

  Further, it is more preferable that the stator portion is disposed on one side with the YZ plane of the drive coil interposed therebetween. With this configuration, the stator portion can be made smaller and thinner. Also, when the stator part is a magnet, compared to the case where the stator part is arranged on both sides of the drive coil, there is no attractive force between the opposing magnets. A low-rigidity configuration is possible, contributing to a reduction in size and weight.

  Further, in the chip bonding apparatus according to the present invention, the mover portion is a plurality of drive coils arranged along the Z-axis direction, and as a whole along the Z-axis direction by cooperative driving of each drive coil. A plurality of drive coils that are driven to form a moving drive magnetic field, and the stator portion is a plurality of stator magnets that are alternately changed in polarity in the Z-axis direction. It is preferable to have a plurality of stator magnets arranged in a polar arrangement relationship that generates a driving force in the Z-axis direction in the mover portion in cooperation with the drive magnetic field formed by.

  With the above configuration, the Z drive motor becomes an AC drive linear motor, and the opposed area of the magnets covering the moving range of the drive coil can be reduced as compared with the case of the DC drive linear motor. Therefore, it contributes to miniaturization and weight reduction.

  In the chip bonding apparatus according to the present invention, it is preferable that the mover portion includes U-phase, V-phase, and W-phase drive coils whose drive phases are different from each other by 120 degrees along the Z-axis direction.

  As described above, according to the chip bonding apparatus according to the present invention, it is possible to further reduce the load on the Y table when bonding the chip to the bonding object.

  Embodiments according to the present invention will be described below in detail with reference to the drawings. In the following, a so-called die bonding apparatus will be described as a chip bonding apparatus. However, an apparatus for transporting a chip to the position of a bonding object using a bonding head and bonding the chip to the bonding object there, Any device other than die bonding may be used as long as the device is driven to move at a lower speed than other moving tables. For example, a face down bonding apparatus may be used. Moreover, the apparatus which bonds electronic components other than an LSI chip to bonding objects, such as a circuit board, may be sufficient. Although the bonding object is described as a circuit board, it may be a lead frame or the like in addition to a general wiring resin substrate. In the following, a table driven at a lower speed than the others is referred to as an X table, a table driven in a direction orthogonal thereto is referred to as a Y table, and a table on which a bonding head is mounted is referred to as a Z table. Of course, other names may be used.

  FIG. 1 is a configuration diagram of a die bonding apparatus 10 as a chip bonding apparatus. Here, the structure of the left half when cut along the XZ plane shown in FIG. 1 including the bonding head 42 is shown, and a state in which a part of the Z motor magnet unit 60 is broken is shown. The right half has almost the same configuration. FIGS. 2 to 4 are partial explanatory views of the die bonding apparatus 10, and FIG. 2 is a side view shown in the XZ plane, except that the components of the X table 20 including the Z stator mounting portion 26 are omitted. Yes, FIG. 3 shows the state of the Z table 40 when the Z motor magnet unit 60 is removed from the state of FIG. 2, except that the outer shape of the Z motor drive coil unit 50 is shown by a broken line, FIG. 4 is a bottom view showing the state of FIG. 2 when viewed from the −Z direction.

  The die bonding apparatus 10 is attached to the Z table 40 using an X table 20, a Y table 30, and a Z table 40 which are respectively driven to move in the X axis, Y axis and Z axis directions orthogonal to each other as shown in FIG. This is an apparatus capable of moving a bonding head 42 to be moved to an arbitrary three-dimensional position and performing a die bonding operation. More specifically, the bonding head 42 is used to suck and hold the chip at a chip supply unit (not shown), and from that position, the chip is transported to a predetermined bonding position on a circuit board that is a bonding target (not shown). It is an apparatus having a function of pressing a chip against a circuit board by applying an appropriate bonding load at a predetermined position and bonding the chip to the circuit board under an appropriate heating condition.

  The die bonding apparatus 10 includes an X table 20, a Y table 30, and a Z table 40 that are sequentially arranged on a base 12 that is a fixed base, and a bonding head 42 is attached to the Z table 40, and these elements are controlled. Connected to the unit 70. The control unit 70 controls the bonding of the bonding head 42 through control of the X drive unit 72, the Y drive unit 74, and the Z drive unit 76 that drive the X table 20, the Y table 30, and the Z table 40, respectively. A bonding processing unit 78 for controlling work is included. Here, each element for the sequential arrangement of the X table 20, the Y table 30, and the Z table 40 is configured as follows.

  First, an X rail 14 that extends in the X-axis direction is disposed on a frame 12 that is a fixed portion of the die bonding apparatus 10, and an X table 20 that is guided by the X rail 14 in movement in the X-axis direction is disposed. . Therefore, the X table 20 is movable in the X axis direction within the XY plane. The X table 20 is moved and driven by an X drive motor (not shown) under the control of the control unit 70.

  A Y rail base 22 is fixedly attached to the X table 20, and two parallel Y rails 24 extending in the Y-axis direction are arranged on the Y rail base 22. Further, a Z stator mounting portion 26 for holding a Z motor magnet portion 60 to be described later is provided extending in the X axis direction in an arm shape from the end portion of the Y rail base 22 in the Y axis direction. The Y table 30 is arranged so that the movement in the Y-axis direction is guided by the Y rails 24 and 25. Therefore, the Y table 30 is movable in the Y-axis direction within a plane parallel to the YZ plane.

  The Y table 30 is moved and driven by a control unit 70 by a Y drive motor composed of a Y motor fixed magnet 34 fixed to the Y rail base 22 and a Y motor drive coil 36 fixed to the Y table 30. Done under the control of The Y motor drive coil 36 is a flat coil in the YZ plane. The Y motor fixed magnets 34 are two flat magnets that are arranged on both sides of the flat shape of the Y motor drive coil 36 and are flat in the YZ plane. The two flat magnets are arranged so that the polarities of the facing surfaces are opposite to each other. Therefore, the Y motor fixed magnet 34 is a two opposing magnets that have a magnetic gap parallel to the YZ plane and generate a magnetic field in the X-axis direction, and the Y motor drive coil 36 is disposed in the magnetic gap. The Here, when a drive current is supplied to the Y motor drive coil 36, the cooperative action of the component parallel to the Z axis direction flowing through the Y motor drive coil 36 and the magnetic field in the X axis direction of the Y motor fixed magnet 34. Therefore, the driving force in the Y-axis direction is generated, and therefore the Y table 30 connected to the Y motor driving coil 36 can be driven to move in the Y-axis direction.

  A Z rail 32 extending in the Z-axis direction is disposed on the Y table 30, and a Z table 40 guided by the Z rail 32 is provided. Therefore, the Z table 40 is movable in the Z-axis direction within the YZ plane. As shown in FIG. 1, the Z table 40 extends in the −Z axis direction, and a bonding head 42 is attached to the tip thereof.

  The movement of the Z table 40 is controlled by a control unit 70 by a Z motor driving coil unit 50 fixedly provided on the Z table 40 and a Z motor magnet unit 60 mounted on a Z stator mounting unit 26 extending from the X table 20. Done under the control of The Z motor drive coil unit 50 and the Z motor magnet unit 60 constitute a Z drive motor which is a three-phase drive linear motor for moving and driving the Z table 40 in the Z-axis direction. The former is a Z motor mover and the latter Corresponds to a Z motor stator. With this configuration, the Z drive motor is not mounted on one table, but the heavy stator is on the X table 20 and the light mover is on the Z table 40 on the Y table 30. Installed separately.

  The Z motor drive coil unit 50 is composed of three flat coils 52 in the YZ plane. These three coils 52 are arranged on a suitable support, molded into a flat plate shape with resin, and the flat plate shape of the flat resin plate is mounted on the Z table 40. The three coils correspond to the U-phase, V-phase, and W-phase drive motor windings of the three-phase drive linear motor, respectively. The coils 52 are arranged in the order of, for example, the U phase, the V phase, and the W phase along the Z-axis direction. Each coil 52 has a winding component along the Y-axis direction and a winding component along the Z-axis direction. However, since the former is a portion that generates the driving force of the Z drive motor, it is more sufficient than the latter. It is set to be long. That is, each coil 52 has a rectangular shape or an oval shape having a longitudinal axis in the Y-axis direction. The two terminals of each coil 52 are connected to the Z drive unit 76 of the control unit 70, respectively. The Z drive unit 76 is configured by a control circuit including a drive circuit.

  The Z motor magnet unit 60 is arranged in parallel to the flat surface of the Z motor drive coil unit 50, that is, in parallel to the YZ plane, and supplies a magnetic field in the X-axis direction to the Z motor drive coil unit 50. Specifically, the plurality of magnets 62 are arranged in a plurality of rows in the Z-axis direction and in a plurality of columns in the Y-axis direction. These magnets are arranged on an appropriate support plate, and a flat plate is attached on the X table 20 via the Z stator attachment portion 26.

The size of the Z motor magnet unit 60 in the YZ plane is set to have an opposing area that covers the entire movement range of the Z motor drive coil unit 50. Specifically, the Y stroke that is the amount of movement of the Y table 30 in the Y direction is measured by S _Y , and the Z stroke that is the amount of movement of the Z table 30 in the Z direction is measured by S _Z , along the Z axis direction of the three coils 52. L _{Y is} the length from one end to the other end, L _{Z is} the length from the end to the end measured along the Y-axis direction of the coil 52, and the winding component is along the Z-axis direction of the coil 52. The winding width in the Y-axis direction is W _Y , and the winding width in the Z-axis direction of the winding component along the Y-axis direction of the coil 52 is W _Z. At this time, it is necessary that the length of the Z motor magnet unit 60 in the Y-axis direction is (S _Y + L _Y + W _Y ), and the length in the Z-axis direction is (S _Z + L _Z + W _Z ) or more.

  The magnet 62 is arranged in seven rows in the example of FIG. 1, and the length in the Z-axis direction of the magnet 62 that constitutes two rows on both ends in the Z-axis direction of the seven rows constitutes the inner five rows. This is about half the length of the magnet 62 in the Z-axis direction. The reason why the size of the magnets on both ends is made smaller than the magnet on the inner row in this way is to minimize the size of the Z motor magnet portion 60 in the Z direction in consideration of the movement range of the Z motor drive coil portion 50. is there. Therefore, if the dimensions are not taken into consideration, the magnets on both ends may be the same size as the magnets on the inner rows so that the dimensions of the magnets 62 are compatible. The polarities of the seven magnet rows are opposite to each other between adjacent rows. Specifically, N, S, N, S, N, S, and N are sequentially arranged along the Z-axis direction. The number of divisions of the plurality of columns between the same polarities in each row may be appropriately determined depending on the ease of making the magnet 62. For example, it may be divided into two or more. Further, depending on the manufacturing method, each row may be constituted by one magnet without being divided.

  The Z-axis direction pitch between the rows is determined by the relationship with the Z-axis direction pitch of the coil 52 of the Z motor drive coil unit 50 according to the driving method of the three-phase linear motor. In the above example, as shown in FIG. 2, the three pitches of the coils 52 are set to be the four pitches of the magnets 62. In other words, a three-phase coreless linear motor can be obtained by planarly developing the structure of a four-phase stator and three-phase mover three-phase rotary motor. Therefore, using the Z motor driving coil unit 50 and the Z motor magnet unit 60, the so-called U phase, V phase, and W phase shifted by 120 degrees from each other in the Z driving unit 72 of the control unit 70. The Z motor driving coil unit 50 and the Z motor magnet unit 60 cooperate to generate a driving force in the Z direction and drive the Z table to move in the Z direction. can do.

  The operation of the die bonding apparatus 10 having the above configuration will be described below. The die-bonding mechanism between the chip and the circuit board is such that the back surface of the chip is pressed against a circuit board that has been subjected to a surface treatment such as gold plating, and is bonded by heating. In this case, one chip is picked up from the pick-up position of the chip supply unit in which chips such as a chip tray are arranged and arranged, and conveyed to a bonding position where a heater or the like is arranged and the circuit board is held, and bonding is performed there. It will be. In addition to this, ultrasonic energy may be used as a die bonding or chip bonding mechanism. Alternatively, a mechanism may be used in which an adhesive is attached to the back surface of the chip and is arranged and bonded at a predetermined position on the circuit board. In this case, the chip to which the adhesive material is attached is picked up and transported to the position of the circuit board where bonding is performed. In any case, positioning and conveyance from the pick-up position to the bonding position is an essential basic process of die bonding, and the operation will be described below.

  In this positioning and conveyance, first, the bonding head 42 is moved from the initial position to the pickup position. The pickup position is the position of the chip to be picked up next in the chip tray arranged at the predetermined position of the gantry 12 as described above. The coordinates of the position of the next chip to be picked up and the coordinates of the initial position are determined by the function of the bonding processing unit 78 of the control unit 70 based on the bonding operation sequence and the data such as the chip arrangement on the chip tray. Has been.

The movement from the initial position to the pickup position is based on the difference between the XY coordinates of the initial position and the XY coordinates of the pickup position, and the bonding processing unit 78 uses the X table direction movement amount ΔX ₁ of the X table 20 and the Y table 20. Y-axis direction movement amount ΔX ₁ is calculated and given to the X drive unit 72 and the Y drive unit 74 as an X-axis direction movement command and a Y-axis direction movement command, respectively.

In accordance with the command, the X drive unit 72 drives an X drive motor (not shown) to move the X table 20 by ΔX _{1 in the} X axis direction. Similarly, the Y drive unit 74 gives a predetermined drive current to the Y motor drive coil 36 constituting the Y drive motor, and moves the Y table 30 by ΔY _{1 in the} Y axis direction. Whether or not the commanded movement amount has been moved is detected using a position sensor or the like provided in the X table 20 and the Y table 30, and a difference from the command result position is fed back to the control unit 70.

In this way, when the bonding head 42 comes directly above the pickup position, the bonding processing unit 78 instructs the Z drive unit 76 to start from the height position in the Z direction of the bonding head 42 at the initial position. ΔZ ₁ , which is the height difference up to the tip height position, is calculated and given to the Z drive unit 76 as a Z-axis direction movement command. Note that the X-axis direction movement command, the Y-axis direction movement command, and the Z-axis movement command may be given as a three-dimensional movement locus without being sequentially given in this way.

The Z drive unit 74 generates U-phase, V-phase, and W-phase drive current signals corresponding to the three coils 52 that are shifted by 120 degrees from each other based on the movement drive command of ΔZ ₁ , and outputs these signals. Are supplied to three coils 52, respectively. By supplying these three-phase drive current signals to the Z motor drive coil unit 50, the Z motor drive coil unit 50 is supplied with a magnetic field whose polarities are reversed from each other at a predetermined pitch in the Z-axis direction. Due to the cooperative action, a driving force is generated in the Z-axis direction, and the Z table 40 is driven to move in the Z-axis direction. Whether or not the commanded movement amount has been moved is detected using a position sensor or the like provided in the Z table 40, and the difference from the commanded position is fed back to the control unit 70.

  In this way, when the bonding head 42 is moved and positioned at the pickup position, the bonding processing unit 78 gives an instruction to a suction unit (not shown) so that the bonding head 42 sucks a predetermined chip on the chip tray. And hold. That is, the bonding head 42 is provided with a suction recess and a vacuum suction path, and a vacuum device (not shown) is operated to suck and hold the chip in the tip holding recess at the tip of the bonding head 42.

  Next, the bonding processing unit 78 lifts the bonding head 42 from the pickup position to an appropriate upper position in the Z-axis direction. Then, the bonding head 42 is moved from the pickup position to the bonding position. The bonding position is the position of the circuit board disposed at a predetermined position of the gantry 12 as described above. The coordinates of the bonding position are determined in advance by the function of the bonding processing unit 78 of the control unit 70.

Movement from the pick-up position to the bonding position, the XY coordinates of the pick-up position, based on the difference of the XY coordinates of the bonding position, the bonding section 78, the X table 20 in the X-axis direction movement amount [Delta] X _2, Y table 20 The Y-axis direction movement amount ΔX ₂ is calculated, and the X-axis direction movement command and the Y-axis direction movement command are respectively transmitted to the X driving unit 72 and the Y driving unit 74 in the same manner as the movement from the initial position to the pickup position. give. Thereafter, the bonding head 42 moves to the position just above the bonding position with the same contents as the movement to the pickup position described above, and the movement amount ΔZ ₂ of the bonding head 42 in the Z direction is calculated, and the Z driving unit 76 is calculated. Is given as a Z-axis direction movement command. As described above, the bonding head 42 is lowered onto the circuit board by the driving method of the three-phase linear motor.

  Therefore, the bonding processing unit 78 issues a command to a pressing unit (not shown), presses the chip against the circuit board with a predetermined pressing pressure, and performs bonding between the chip and the circuit board under appropriate heating conditions. When the bonding is completed, the bonding processing unit 78 issues a command to the Z driving unit 76 to raise the bonding head 42 again. Then, the process moves to a bonding operation between the next chip and the circuit board.

  In this manner, the bonding head 42 is moved to an arbitrary position in the XYZ three-dimensional space by combining the movement of the X table 20 in the X axis direction, the movement of the Y table 30 in the Y axis direction, and the movement of the Z table 40 in the Z axis direction. be able to.

  Thus, since the die bonding apparatus 10 moves one chip from the chip supply unit to the position to be bonded, the movement command amount of the X table 20 is small, and therefore the movement speed is Y table 30, It may be much slower than the Z table 40 and may not move depending on the movement command. Therefore, even if the heavy Z motor magnet part 60 is attached to the X table 20, it does not become a heavy burden for the X drive motor. On the other hand, since the Z table 40 and the Z motor drive coil unit 50 are mounted on the Y table 30 and the heavy Z motor magnet unit 60 is removed, the load on the Y drive motor is reduced.

In the above, the polarity arrangement of the three-phase linear motor may be a configuration to which the three-phase driving method is applied other than the above-described coil 3 pitch = magnet 4 pitch. Further, the same Z-axis direction dimension may be further refined under the relationship of coil 3 pitch = magnet 4 pitch. For example, the Z motor drive coil unit 50 may have six coils with the same dimension in the Z-axis direction. As described above, by using various driving methods, the pitch dimension of the coil 52 of the Z motor driving coil unit 50 can be made fine while maintaining the driving force in the Z-axis direction. Therefore, W _Z can be made considerably small in the length (S _Z + L _Z + W _Z ) of the Z-axis direction dimension of the Z motor drive coil unit 50, whereby the Z motor drive coil unit is composed of a single coil. Compared with a so-called DC drive motor system, the length of the dimension in the Z-axis direction can be kept small.

  In the above description, the Z motor magnet unit is arranged on one side of the flat surface of the Z motor drive coil unit. However, like the Y drive motor, the Z motor magnet unit is arranged on both sides of the flat surface of the Z motor drive coil unit. It can also be arranged. 5 and 6 are diagrams showing such an example. (A) and (b) in these figures correspond to FIGS. 2 and 3, respectively, and the same elements as those in FIGS. 2 and 3 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In FIG. 5, the Z motor magnet unit 80 is disposed on both sides of the flat surface of the Z motor drive coil unit 82. The Z motor drive coil portion 82 is held in a cantilevered manner by the Z table 84 at its root portion. On the other hand, in FIG. 6, the Z motor magnet unit 90 is disposed on both sides of the flat surface of the Z motor drive coil unit 92. The Z motor drive coil unit 92 is held at both ends in the Z-axis direction by the Z table 94 with both ends supported.

  As shown in FIG. 5 and FIG. 6, when the Z motor magnet unit is arranged on both sides of the flat surface of the Z motor drive coil unit, the polarities of the magnets arranged facing both sides are different from each other. Be placed. For example, in FIG. 5A, the polarities of the surfaces of the seven rows of magnets arranged on the + X side of the Z motor magnet unit 80 toward the Z motor driving coil unit 82 are changed in order from the + Z side to the −Z side. , S, N, S, N, S, N. In this case, the polarities of the surfaces of the seven rows of magnets arranged on the −X side of the Z motor magnet unit 80 toward the Z motor drive coil unit 82 are S, N, S, in order from the + Z side to the −Z side. N, S, N, S.

  Therefore, as shown in FIGS. 5 and 6, when the Z motor magnet unit is arranged on both sides of the flat surface of the Z motor drive coil unit, the magnetic field between the facing magnets is directed from the N pole to the S pole. Compared with the case where the Z motor magnet unit is arranged on one side of the flat surface of the Z motor driving coil unit as shown in FIGS. 1 and 2, the magnetic field strength is greater in the method of FIGS. The driving force of the Z table can be increased. Therefore, in order to obtain the same driving force as that of the configuration of FIGS. 5 and 6, it is desirable to use a stronger magnet, such as a neodymium magnet, for the magnets of FIGS.

  On the other hand, in the configurations of FIGS. 5 and 6, an attractive force acts between the magnets on both sides. Therefore, there is a possibility that the entire Z motor magnet part is distorted, and the magnetic gap between them may be non-uniform. In order to prevent this, an attractive force acts between the magnets on both sides in the configurations of FIGS. Therefore, it is necessary to increase the rigidity of the entire Z motor magnet unit. Therefore, as a result, the mass of the Z motor magnet part increases, the inertia increases, and the thickness in the X direction also increases. On the other hand, in the configuration of FIGS. 1 and 2, such an attractive force does not occur, and the Z motor magnet portion itself can be thinned in the X direction.

  Therefore, when the Z motor magnet unit 60 is disposed on one side of the flat surface of the Z motor drive coil unit 50 as in the configuration of FIGS. 1 and 2, the Z motor magnet unit 60 itself can be thinned in the X direction. The position where the driving force of the Z drive motor is applied can be easily adjusted to the center of gravity of the movable part including the Z table 40 and the Z motor drive coil unit 50. Similarly, the position where the driving force of the Y drive motor is applied can be easily adjusted to the center of gravity of the movable part including the Y table 30, the Z table 40, and the Z motor drive coil unit 50.

  In the above description, the Z motor stator is a magnet, and the Z motor mover is a coil. However, depending on the relationship between the mass and inertia of the coil and the magnet, the Z motor stator may be a coil and the Z motor mover may be a magnet. .

It is a block diagram of the die bonding apparatus as a chip bonding apparatus in embodiment which concerns on this invention. Here, the structure of the left half when cut along the XZ plane shown in FIG. 1 including the bonding head 42 is shown, and a state in which a part of the Z motor magnet unit 60 is broken is shown. The right half has almost the same configuration. It is a side view of the die-bonding apparatus in embodiment which concerns on this invention. It is a partial explanatory view showing a mode that a magnet part of a die bonding apparatus in an embodiment concerning the present invention was removed. It is a bottom view of the die-bonding apparatus in embodiment which concerns on this invention. It is a partial explanatory view in other embodiments. It is a partial explanatory view in another embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Die bonding apparatus, 12 mounts, 14 X rail, 20 X table, 22 Y rail stand, 24, 25 Y rail, 26 Stator attachment part, 30 Y table, 32 Z rail, 34 Y motor fixed magnet, 36 Y motor Drive coil, 40, 84, 94 Z table, 42 Bonding head, 50 Motor drive coil, 50, 82, 92 Motor drive coil section, 52 coils, 60, 80, 90 Motor magnet section, 62 magnet, 70 Control section, 72 X driving unit, 74 Y driving unit, 76 Z driving unit, 78 bonding processing unit.

Claims (6)

An X table driven at a low speed in the X-axis direction;
A Y table driven at high speed in the Y-axis direction on the X table;
A Z drive motor that drives the bonding head at high speed in the Z-axis direction;
A chip bonding apparatus comprising:
Z drive motor
A stator portion provided on the X table;
A mover portion connected to the bonding head portion and movable in the Z-axis direction along a guide provided on the Y table;
A chip bonding apparatus characterized in that a driving force in the Z-axis direction is generated in the mover by the cooperation of the stator part and the mover part. The chip bonding apparatus according to claim 1,
The mover is
A driving coil portion connected to the bonding head portion and flat in the YZ plane,
The stator part
Magnetic yoke,
A magnet portion facing the drive coil and having an opposing area that covers the entire moving range in the YZ plane of the drive coil;
A chip bonding apparatus comprising: The chip bonding apparatus according to claim 2,
The stator part
A chip bonding apparatus, wherein the chip bonding apparatus is disposed on both sides of the YZ plane of the drive coil. The chip bonding apparatus according to claim 2,
The stator part
A chip bonding apparatus, wherein the chip bonding apparatus is disposed on one side of a YZ plane of a drive coil. The chip bonding apparatus according to claim 2,
The mover is
A plurality of drive coils arranged along the Z-axis direction, wherein the drive coils are driven so as to form a drive magnetic field that moves along the Z-axis direction as a whole by cooperative driving of the drive coils. Have
The stator part
A plurality of stator magnets arranged with alternating polarities in the Z-axis direction, the polarity generating a driving force in the Z-axis direction in the movable part in cooperation with the driving magnetic field formed by each driving coil A chip bonding apparatus comprising a plurality of stator magnets arranged in an arrangement relationship. In the chip bonding apparatus according to claim 5,
The mover is
A chip bonding apparatus characterized in that U-phase, V-phase, and W-phase drive coils whose drive phases are different from each other by 120 degrees are arranged along the Z-axis direction.

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